A heat-shrinkable solder ring

Abstract

The present invention relates to a heat-shrinkable solder ring, which comprises a heat-shrinkable tube, two rubber rings respectively sleeved at two ends inside the heat-shrinkable tube, and a solder ring sleeved inside the heat-shrinkable tube and located between the two rubber rings. A heat-shrinkable spacer ring is provided between the solder ring and the rubber ring. The complete dissolution temperature of the solder ring, the complete dissolution temperature of the rubber ring, and the complete shrinkage temperature of the heat-shrinkable tube are all higher than the complete shrinkage temperature of the spacer ring. It separates the rubber ring and the solder ring, reduces the phenomenon that the hot melt adhesive and the solder come into contact and mix after the rubber ring and the solder ring melt, and improves the connection strength of the heat-shrinkable solder ring to two electric wires.

Description

Technical Field

[0001] The present invention relates to the technical field of cable connection, and in particular to a heat-shrinkable solder ring. Background Art

[0002] In life, it is often necessary to connect two wires together. The common method is to strip the outer skin of one end of the two wires and then twist the wire cores together, and then use a heat-shrinkable tube or insulating tape to cover the connection of the wire cores. This method is likely to cause the connection of the wire cores to be corroded by water and air, and the connection strength is not high.

[0003] The heat-shrinkable solder tube is composed of a low-melting-point alloy and a heat-shrinkable tube combined and used. While connecting two wires together, it can also protect the joint from air oxidation and other corrosive gases, and has good waterproof performance. It is widely used in the fields of railway, ship, aerospace, electric power, electronics, etc.

[0004] At present, the patent document with the patent publication number CN205752562U discloses a heat-shrinkable solder ring, which includes a heat-shrinkable single-wall tube, a solder ring, a large rubber ring and a small rubber ring. The solder ring, the large rubber ring and the small rubber ring are installed in the heat-shrinkable single-wall tube. The large rubber ring and the small rubber ring are respectively located on both sides of the solder ring. The production process of the heat-shrinkable solder ring is as follows: the large rubber ring, the solder ring and the small rubber ring are sleeved on the mold of the heat-shrinkable single-wall tube in sequence, and then conveyed through a kiln furnace. The heat-shrinkable single-wall tube is heated to shrink and wrap the large rubber ring, the solder ring and the small rubber ring, and the solder ring tube is prepared. When using this heat-shrinkable solder ring to connect two wires, the wire cores of the two wires are inserted into the space between the solder rings from the openings at both ends of the heat-shrinkable single-arm tube. Subsequently, a hot air gun or other heating device is used to heat the heat-shrinkable solder ring. The solder ring is melted by the temperature and the wire cores of the two wires are welded together. At the same time, the heat-shrinkable single-arm tube shrinks and wraps on the two wires, and the large rubber ring and the small rubber ring melt and bond the heat-shrinkable single-arm tube to the wires together, making the connection of the two cables firm and not easily corroded or oxidized by water or air.

[0005] The above-mentioned existing technical solutions have the following defects: during use, if the operation is improper and the heat-shrinkable single-arm tube tilts when heated, the hot melt adhesive after the melting of the large rubber ring or the small rubber ring will flow towards the melted solder due to the gravity factor, resulting in the contact and mixing of the hot melt adhesive and the solder, which affects both the welding effect of the solder and the bonding effect of the hot melt adhesive. Summary of the Invention

[0006] Aiming at the deficiencies of the existing technology, the purpose of the present invention is to provide a heat-shrinkable solder ring, which separates the rubber ring and the solder ring, reduces the phenomenon of contact and mixing of the hot melt adhesive and the solder after melting of the rubber ring and the solder ring, and improves the connection strength of the heat-shrinkable solder ring to two wires.

[0007] The above-mentioned object of the present invention is achieved by the following technical solutions:

[0008] A heat-shrinkable solder ring, comprising a heat-shrinkable tube, two rubber rings respectively sleeved at both ends inside the heat-shrinkable tube, and a solder ring sleeved inside the heat-shrinkable tube and located between the two rubber rings. A heat-shrinkable spacer ring is provided between the solder ring and the rubber ring. The complete dissolution temperature of the solder ring, the complete dissolution temperature of the rubber ring, and the complete shrinkage temperature of the heat-shrinkable tube are all higher than the complete shrinkage temperature of the spacer ring.

[0009] By adopting the above technical solution, when using the heat-shrinkable solder ring to connect two wires, first strip the insulating outer skin at one end of the two wires to expose the wire cores; then, bring the cores of the two wires into contact and twist them together, and slip the heat-shrinkable solder ring onto the other end of one of the wires, move the heat-shrinkable tube, and move the heat-shrinkable tube to the connection of the two wires so that the joint of the two cores is located inside the solder ring; finally, use a hot air gun or other tools to heat the heat-shrinkable solder ring. As the temperature gradually rises, the two spacer rings first shrink and tightly fit on the insulating outer skin of the wires. Continuing to increase the temperature, the heat-shrinkable tube begins to shrink, and at the same time the rubber rings and the solder ring begin to melt. After the solder ring melts, it forms liquid solder, and the solder coats the cores of the two wires in contact, welding the two wires together. The rubber rings are melted into hot melt adhesives and adhere to the insulating outer skin of the wires until the heat-shrinkable tube is completely shrunk and tightly coats the connection of the two wires, and both ends of the heat-shrinkable tube are adhesively bonded to the two wires respectively through the hot melt adhesives. Among them, due to the low complete shrinkage temperature of the spacer ring, the spacer ring will first shrink onto the insulating outer skin of the wires, separating the rubber rings and the solder ring. After the rubber rings are melted into hot melt adhesives and the solder melted from the solder ring are not easily contacted and mixed under the action of the spacer ring, the connection strength of the heat-shrinkable solder ring to the two wires is improved.

[0010] In a preferred example of the present invention, it can be further configured that: the complete melting temperature of the rubber ring is higher than the complete melting temperature of the solder ring.

[0011] By adopting the above technical solution, after the solder ring is completely melted and the cores of the two wires are welded together, the rubber ring is completely melted to bond the heat-shrinkable tube and the wires together, ensuring that the solder ring is completely melted after the rubber ring bonds the heat-shrinkable tube and the wires together, and improving the welding strength of the welding ring to the two wires.

[0012] In a preferred example of the present invention, it can be further configured that: the complete melting temperature of the rubber ring and the complete melting temperature of the solder ring are both lower than the complete shrinkage temperature of the heat-shrinkable tube.

[0013] By adopting the above technical solution, it is convenient for the heat-shrinkable tube to completely coat the wires after the solder ring and the rubber ring are completely melted, improving the connection strength of the two wires and the sealing performance between the heat-shrinkable tube and the wires.

[0014] In a preferred embodiment, the present invention can be further configured such that: the heat-shrinkable tube is a transparent heat-shrinkable tube.

[0015] By adopting the above technical solution, it is convenient to penetrate the internal rubber ring, solder ring and spacer ring.

[0016] In a preferred embodiment, the present invention can be further configured such that: the inner diameter of the spacer ring is larger than the inner diameter of the solder ring.

[0017] By adopting the above technical solution, it is convenient to pass the wire through the spacer ring and extend it into the solder ring.

[0018] In a preferred embodiment, the present invention can be further configured such that: the initial shrinkage temperature of the heat-shrinkable tube is lower than the initial shrinkage temperature of the spacer ring, and the melting temperatures of the rubber ring and the solder ring are both higher than the initial shrinkage temperature of the heat-shrinkable tube.

[0019] By adopting the above technical solution, when manufacturing the heat-shrinkable solder ring, first arrange the rubber ring, spacer ring and solder ring in sequence and sleeved on the processing mold; then sleeve the heat-shrinkable tube with an inner diameter larger than the outer diameters of the rubber ring, spacer ring and solder ring and not shrunk on the outside of the rubber ring, spacer ring and solder ring; then heat the heat-shrinkable tube to make it start to shrink until the heat-shrinkable tube is coated on the rubber ring, spacer ring and solder ring on the processing mold. Since the initial shrinkage temperature of the spacer ring is higher than the initial shrinkage temperature of the heat-shrinkable ring, after the heat-shrinkable tube shrinks and coats on the spacer ring, the spacer ring will not shrink due to heat, and the rubber ring and the solder ring will not melt either, completing the manufacturing of the heat-shrinkable solder ring and improving the practicability of the heat-shrinkable solder ring.

[0020] In a preferred embodiment, the present invention can be further configured such that: the heat-shrinkable tube is made of modified polyvinylidene fluoride, and the spacer ring is made of polyolefin.

[0021] By adopting the above technical solution, modified polyvinylidene fluoride has both transparent and flame-retardant thermal properties and can be used at high temperatures for a long time, and the spacer ring made of polyolefin also has the characteristics of flame retardancy and wear resistance, ensuring the stability of the connection between the two wires.

[0022] In a preferred embodiment, the present invention can be further configured such that: the initial shrinkage temperature of the heat-shrinkable tube is 90 °C and the complete shrinkage temperature is 150 °C;

[0023] The initial shrinkage temperature of the spacer ring is 100 °C and the complete shrinkage temperature is 120 °C;

[0024] The initial melting temperature of the rubber ring is 115 °C and the complete melting temperature is 140 °C;

[0025] The initial melting temperature of the solder ring is 110 °C and the complete melting temperature is 130 °C.

[0026] By adopting the above technical solution, when manufacturing the heat-shrinkable solder ring, after putting the rubber ring, the solder ring and the spacer ring into the heat-shrinkable tube, applying a temperature of 90 °C to the heat-shrinkable tube causes the heat-shrinkable tube to start shrinking, and gradually increasing the applied temperature to the heat-shrinkable tube to below 100 °C causes the heat-shrinkable tube to wrap around the rubber ring, the solder ring and the spacer ring, completing the installation of the heat-shrinkable solder ring. When using the heat-shrinkable solder ring to connect two wires, directly use a hot air blower or other heating equipment to apply a temperature of 100 °C to the heat-shrinkable solder ring and gradually increase it to 150 °C. During the heating process, the spacer ring shrinks first, and the rubber ring and the solder ring melt after the spacer ring shrinks, and the heat-shrinkable tube will shrink accordingly, thereby connecting the two wires together, which is simple and convenient to use.

[0027] In summary, the present invention includes at least one of the following beneficial technical effects:

[0028] 1. A spacer ring is provided between the rubber ring and the solder ring in the heat-shrinkable tube, and the complete shrinkage temperature of the spacer ring is lower than the complete shrinkage temperature of the heat-shrinkable tube, the complete melting temperature of the rubber ring, and the complete melting temperature of the solder ring. The spacer ring tightly sleeves on the insulating outer skin of the wire before the rubber ring and the solder ring are completely melted, separating the rubber ring and the solder ring, reducing the phenomenon of the melted liquid hot melt adhesive contacting and mixing with the hot solder, and ensuring the stability of the wire connection;

[0029] 2. The complete melting temperature of the rubber ring and the complete melting temperature of the solder ring are both lower than the complete shrinkage temperature of the heat-shrinkable tube. After the rubber ring and the solder ring are completely melted, the heat-shrinkable tube completely shrinks and wraps around the connection of the two wires, making the connection between the heat-shrinkable tube and the wires tighter and improving the connection strength of the two wires;

[0030] 3. The processing and manufacturing of the heat-shrinkable solder ring are simple and convenient, without affecting the states of the rubber ring, the solder ring, and the spacer ring. The heat-shrinkable tube is set as a transparent tube, which is convenient for observing the changes of the rubber ring, the solder ring, and the spacer ring in real time, improving the practicability of the heat-shrinkable solder ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a cross-sectional view showing the internal structure of the heat-shrinkable solder ring in this embodiment.

[0032] In the figure, 1, heat-shrinkable tube; 2, rubber ring; 3, solder ring; 4, spacer ring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following further describes the present invention in detail with reference to the accompanying drawings.

[0034] Refer to Figure 1, A heat-shrinkable solder ring disclosed by the present invention includes a heat-shrinkable tube 1. The heat-shrinkable tube 1 is arranged as a sleeve with both ends open and a hollow interior. Two glue rings 2 are provided inside the heat-shrinkable tube 1. The glue rings 2 are tensioned inside the heat-shrinkable tube 1, and the glue rings 2 are located on both sides of the heat-shrinkable tube 1 along its axial direction. A solder ring 3 is provided inside the heat-shrinkable tube 1. The solder ring 3 is tensioned inside the heat-shrinkable tube 1, and the solder ring 3 is located at the middle part of the heat-shrinkable tube 1 along its axial direction, that is, the solder ring 3 is located between the two glue rings 2. A spacer ring 4 is provided between the solder ring 3 and the glue rings 2, that is, the number of spacer rings 4 is two. The two spacer rings 4 are respectively located on both sides of the solder ring 3, and the two spacer rings 4 are located between the two glue rings 2.

[0035] Both the spacer ring 4 and the heat-shrinkable tube 1 will shrink when heated, and the initial shrinkage temperature of the heat-shrinkable tube 1 is lower than the initial shrinkage temperature of the spacer ring 4, and the complete shrinkage temperature of the heat-shrinkable tube 1 is higher than the complete shrinkage temperature of the spacer ring 4.

[0036] Among them, the heat-shrinkable tube 1 is made of modified polyvinylidene fluoride (PVDF), and the heat-shrinkable tube 1 is arranged in a transparent shape. The initial shrinkage temperature of the heat-shrinkable tube 1 is 90 °C, and the complete shrinkage temperature is 150 °C. The spacer ring 4 is made of polyolefin (PE), the cross-section of the spacer ring 4 is rectangular, and the inner diameter of the spacer ring 4 is larger than the inner diameter of the solder ring 3. The initial shrinkage temperature of the spacer ring 4 is 100 °C, and the complete shrinkage temperature is 120 °C.

[0037] The glue ring 2 is made of hot melt adhesive, and the glue ring 2 melts into liquid hot melt adhesive when heated; the solder ring 3 is made of solder, and the solder ring 3 melts into liquid solder when heated. The initial melting temperature of the glue ring 2 is 115 °C, and the complete melting temperature is 140 °C. The initial melting temperature of the solder ring 3 is 110 °C, and the complete melting temperature is 130 °C. That is, the complete melting temperature of the glue ring 2 is higher than the complete melting temperature of the solder ring 3, and the complete melting temperatures of the glue ring 2 and the solder ring 3 are higher than the complete shrinkage temperature of the spacer ring 4 and lower than the complete shrinkage temperature of the heat-shrinkable tube 1.

[0038] When connecting two wires using the heat-shrinkable solder ring in this embodiment, first strip the insulating outer skin at one end of the two wires to expose the wire cores; then, bring the cores of the two wires into contact and twist them together, and slip the heat-shrinkable solder ring onto the other end of one of the wires. Move the heat-shrinkable tube 1 to the connection of the two wires so that the joint of the two cores is located inside the solder ring 3; finally, use a hot air gun or other tools to heat the heat-shrinkable solder ring. As the temperature gradually rises, the two spacer rings 4 first shrink and tightly fit on the insulating outer skin of the wire. Continue to increase the temperature, and the heat-shrinkable tube 1 begins to shrink. At the same time, the glue ring 2 and the solder ring 3 begin to melt. After the solder ring 3 melts, it forms liquid solder, which coats the cores where the two wires are in contact and welds the two wires together. The glue ring 2 is heated and melted into hot melt adhesive, which adheres to the insulating outer skin of the wire until the heat-shrinkable tube 1 completely shrinks and tightly wraps around the connection of the two wires, and both ends of the heat-shrinkable tube 1 are bonded to the two wires respectively through the hot melt adhesive, thus firmly connecting the two wires and making the two wires less vulnerable to corrosion and oxidation by water or air.

[0039] Moreover, since the spacer ring 4 first shrinks on the outer peripheral surface of the wire, it separates the melted hot melt adhesive and the solder, reducing the occurrence of the phenomenon that the hot melt adhesive and the solder come into contact and mix, ensuring the stability of the connection of the two wires. Also, because the heat-shrinkable tube 1 is transparent, it is convenient to observe the change of the internal state of the heat-shrinkable tube 1, making the use of the heat-shrinkable solder ring more convenient.

[0040] When manufacturing the heat-shrinkable solder ring in this embodiment, first arrange the glue ring 2, the spacer ring 4, and the solder ring 3 in sequence and slip them onto the processing mold; then slip the heat-shrinkable tube 1 with an inner diameter larger than the outer diameters of the glue ring 2, the spacer ring 4, and the solder ring 3 and that has not shrunk onto the outside of the glue ring 2, the spacer ring 4, and the solder ring 3; then heat the heat-shrinkable tube 1 to between 90°C and 100°C. At this time, the heat-shrinkable tube 1 begins to shrink, while the spacer ring 4 does not shrink, and the glue ring 2 and the solder ring 3 do not melt either, until the heat-shrinkable tube 1 tightly fits on the glue ring 2, the spacer ring 4, and the solder ring 3, completing the processing of the heat-shrinkable solder ring. The processing process is simple and convenient, improving the practicability of the heat-shrinkable solder ring.

[0041] The embodiments of this specific implementation manner are all preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A heat-shrinkable solder ring, comprising a heat-shrinkable tube (1), two rubber rings (2) respectively sleeved at two ends inside the heat-shrinkable tube (1), and a solder ring (3) sleeved inside the heat-shrinkable tube (1) and located between the two rubber rings (2). Characterized in that: A heat-shrinkable spacer ring (4) is provided between the solder ring (3) and the rubber ring (2), and the complete melting temperature of the solder ring (3), the complete melting temperature of the rubber ring (2), and the complete shrinkage temperature of the heat-shrinkable tube (1) are all higher than the complete shrinkage temperature of the spacer ring (4); The complete melting temperature of the rubber ring (2) is higher than the complete melting temperature of the solder ring (3); the complete melting temperature of the rubber ring (2) and the complete melting temperature of the solder ring (3) are both lower than the complete shrinkage temperature of the heat-shrinkable tube (1); the inner diameter of the spacer ring (4) is larger than the inner diameter of the solder ring (3); the initial shrinkage temperature of the heat-shrinkable tube (1) is lower than the initial shrinkage temperature of the spacer ring (4), and the initial melting temperature and the complete melting temperature of the rubber ring (2), and the initial melting temperature and the complete melting temperature of the solder ring (3) are all higher than the initial shrinkage temperature of the heat-shrinkable tube (1).

2. A heat-shrinkable solder ring according to claim 1, Characterized in that: The heat-shrinkable tube (1) is a heat-shrinkable tube (1) provided in a transparent shape.

3. A heat-shrinkable solder ring according to claim 1, Characterized in that: The heat-shrinkable tube (1) is a heat-shrinkable tube (1) made of modified polyvinylidene fluoride, and the spacer ring (4) is a spacer ring (4) made of polyolefin.

4. A heat-shrinkable solder ring according to claim 3, Characterized in that: The initial shrinkage temperature of the heat-shrinkable tube (1) is 90 °C, and the complete shrinkage temperature is 150 °C; The initial shrinkage temperature of the spacer ring (4) is 100 °C, and the complete shrinkage temperature is 120 °C; The initial melting temperature of the rubber ring (2) is 115 °C, and the complete melting temperature is 140 °C; The initial melting temperature of the solder ring (3) is 110 °C, and the complete melting temperature is 130 °C.

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