A radiator

Abstract

The present invention provides a radiator, which relates to the technical field of electronic devices. The radiator includes a heat conduction layer, a heat dissipation body, and multiple rows of first heat dissipation modules. The bottom end of the first heat dissipation module is connected to the heat dissipation body through the heat conduction layer. The first heat dissipation module includes multiple columns of fins that are sequentially engaged; the heat conduction layer is mainly prepared from copper powder and a thermally conductive adhesive, and the volume ratio of the copper powder to the thermally conductive adhesive is 0.5-1.5:1.5-2.5. The radiator provided by the present invention, by setting the heat conduction layer, not only enables the heat of the heat dissipation body to be quickly dissipated after being heated, but also makes the connection between the bottom of the first heat dissipation module and the heat dissipation body closer, eliminating the installation steps between the fins and the heat dissipation body, simplifying the installation process. At the same time, the heat conduction layer can also quickly transfer heat to the fins around the heat dissipation module and release the heat, further enhancing the heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and more particularly, to a heat sink. Background Art

[0002] Existing electronic heat sinks are generally prepared by several techniques such as extrusion molding, insert molding, and shovel molding. However, heat sinks prepared by these techniques have certain defects, which are as follows:

[0003] For profile heat sinks, due to the limitation of the extrusion die strength, the fin density is low, and the ratio of the fin height to the spacing between fins can only reach a maximum of 1:15. Beyond this ratio, the die is prone to damage and cannot be extruded normally. Moreover, it is bulky and has an unsatisfactory heat dissipation effect.

[0004] Insert heat sinks: Although the fin density can be increased, due to the influence of the riveting die strength, the riveting pressure is limited. At the same time, the pressing force received by each fin is uneven, so the fins often loosen and detach. Moreover, the thermal resistance is relatively high, affecting the heat dissipation effect.

[0005] Shovel heat sinks can achieve a certain fin density, but have extremely high requirements for materials, resulting in a large amount of material waste. The shoveled fins are prone to bending and deformation, causing uneven fin spacing, which not only affects ventilation and heat dissipation but also looks unsightly. Moreover, the production efficiency is very low, and the heat cannot reach the best heat dissipation effect.

[0006] The above three types of heat sinks cover almost all existing electronic heat sinks. Due to the limitation of processing conditions, existing heat sinks cannot be mass-produced standardized, and various components that help power components dissipate heat quickly cannot be designed inside. They can only rely on their own structure to dissipate heat naturally. In addition, existing electronic heat sinks have a high preparation cost and poor heat dissipation performance.

[0007] In addition, in the case of the same volume, the heat dissipation effect of the above three heat sinks is not only far inferior to that of modular heat sinks. At the same time, due to the large variety of heat sink specifications on the market and large volume, a large amount of material will be wasted when making heat sinks. Moreover, molds or materials need to be separately developed for each variety and specification of heat sink to produce, and standardized operation cannot be implemented. Designers cannot design heat sinks according to certain standards, so it wastes time, materials, mold costs, and resources, while increasing the burden on enterprises.

[0008] Therefore, there is an urgent need to develop a heat sink that can solve the above defects. Summary of the Invention

[0009] The purpose of the present invention is to provide a heat sink, which is internally provided with a heat conduction layer and can dissipate heat quickly.

[0010] Embodiments of the present invention are implemented as follows:

[0011] An embodiment of the present application provides a radiator, including a heat dissipation body and multiple rows of first heat dissipation modules. Each row of the first heat dissipation modules includes multiple columns of fins that are successively engaged with each other. The first heat dissipation modules are arranged on the heat dissipation body. Since the first heat dissipation module includes multiple columns of engaged fins, the first heat dissipation module of the radiator can be designed in a modular manner, reducing the design workload. At the same time, the modular radiator facilitates the addition of various heat dissipation mechanisms inside it, enhancing its heat dissipation effect. The modular heat dissipation structure can also adapt to various installation requirements.

[0012] In some embodiments of the present invention, the above-mentioned radiator includes a heat conduction layer, a heat dissipation body, and multiple rows of first heat dissipation modules. The bottom end of the first heat dissipation module and the heat dissipation body are connected through the heat conduction layer. The first heat dissipation module includes multiple columns of fins that are successively engaged with each other. The heat conduction layer is mainly prepared from copper powder and a thermally conductive adhesive. The volume ratio of copper powder to the thermally conductive adhesive is 0.5 - 1.5:1.5 - 2.5. The radiator provided by the present invention is different from ordinary radiators on the market. Due to size and technical limitations, ordinary radiators on the market do not have enough space to add various heat dissipation mechanisms. However, since the first heat dissipation module is composed of multiple fins, the radiator provided by the present invention can leave space for setting the heat conduction layer inside, enabling the heat accumulated on the heat dissipation body to be dissipated through the heat conduction layer, enhancing the heat dissipation effect. At the same time, the heat dissipation effect of copper powder itself is far superior to that of heat conduction layers made of other materials. Mixing copper powder and a thermally conductive adhesive to prepare the heat conduction layer can also make the heat conduction layer tightly connect the bottom plate of the fins in the first heat dissipation module and the heat dissipation body. Due to their tight connection, after the heat dissipation body is heated, the heat can be quickly conducted to the fins of the first heat dissipation module and dissipated through the first module. In addition, after the heat dissipation body is heated, its heat is not only conducted to the first heat dissipation module at the heated place, but also can be quickly dissipated along the heat conduction layer itself and conducted to the first heat dissipation modules at other positions for heat dissipation. Therefore, the heat dissipation effect of this radiator is far superior to that of existing radiators on the market. It should be noted that the copper powder used in this radiator is pure copper powder.

[0013] In some embodiments of the present invention, for the above-mentioned radiator, the volume ratio of copper powder to the thermally conductive adhesive is 1:2. The heat conduction layer prepared according to the volume ratio of 1:2 can not only firmly bond the heat dissipation body and the bottom wall of the first heat dissipation module, but also make the heat conduction speed faster.

[0014] In some embodiments of the present invention, for the above-mentioned radiator, the thermally conductive adhesive is prepared from A transparent thermally conductive adhesive and B transparent thermally conductive adhesive according to a volume ratio of 8 - 11:0.5 - 1.5. The thermally conductive adhesive prepared using this volume ratio can be quickly cured.

[0015] In some embodiments of the present invention, for the above radiator, the thermal conductive adhesive is prepared from A transparent thermal conductive adhesive and B transparent thermal conductive adhesive in a volume ratio of 10:1. The thermal conductive adhesive prepared using the volume ratio can be quickly cured, reducing the fixing link between the heat dissipation body and the fins, thereby increasing the degree of freedom of the radiator shape.

[0016] In some embodiments of the present invention, for the above radiator, the particle size of the copper powder is 600 mesh to 1000 mesh. The heat conduction layer prepared with copper powder of this particle size has moderate pores, sufficiently reducing the thermal resistance value and greatly increasing the thermal conduction power.

[0017] In some embodiments of the present invention, for the above radiator, the thickness of the heat conduction layer is 0.1 mm to 0.5 mm. The heat conduction layer prepared under the foregoing conditions preferably has a thickness of 0.1 mm to 0.5 mm. The heat conduction layer of this thickness has the lowest thermal resistance value reduction and the maximum thermal conduction power.

[0018] In some embodiments of the present invention, for the above radiator, the ratio of the fin thickness to the fin pitch in the first heat dissipation module or the second heat dissipation module is 1:2 to 1:8, and the ratio of the fin pitch to the fin height is 1:10 to 1:40. In addition to dissipating heat through the heat conduction layer, the radiator has also been processed in terms of the fin structure. A reasonable fin thickness and fin pitch, as well as the ratio of fin pitch to fin height, can make the air flow in the fin channels larger and the heat conduction efficiency higher.

[0019] In some embodiments of the present invention, for the above radiator, it further includes multiple layers and / or multiple rows of second heat dissipation modules. Each row of second heat dissipation modules includes multiple columns of fins that are sequentially engaged. The bottom of the second heat dissipation module is engaged with the top end of the first heat dissipation module or the second heat dissipation module, and the upper end of the second heat dissipation module is engaged with the lower end of the second heat dissipation module in the adjacent layer. By adding second heat dissipation modules that can be engaged with the first heat dissipation module, the radiator can not only arbitrarily add or delete heat dissipation modules on the horizontal plane, but also arbitrarily add or delete heat dissipation modules in the vertical direction, effectively adjusting the shape and heat dissipation area of the radiator according to actual needs.

[0020] In some embodiments of the present invention, for the above radiator, in the extending direction of the same level, each fin includes a first end and a second segment that are oppositely arranged. On any two adjacent fins, the first end of one fin is provided with a first bending portion, and the first end of the other fin is provided with a second bending portion. The first bending portion and the second bending portion form an air duct commutation mechanism in the first heat dissipation module and / or the second heat dissipation module. Since both the first heat dissipation module and the second heat dissipation module are combined types, by bending the end faces of adjacent fins, a mechanism for changing the wind direction is formed inside the radiator, changing the wind direction in the channels between the fins and adjusting the speed of heat conduction, making the heat dissipation effect of the radiator reach the best, which cannot be achieved by existing radiators on the market.

[0021] In some embodiments of the present invention, for the above radiator, a plurality of ventilation holes are provided on the bottom wall of the fins of the second heat dissipation module. On the basis of setting the air direction changing mechanism, a plurality of ventilation holes are further provided on the bottom wall of each row of fins of the second heat dissipation module. The air duct commutation mechanism can only change the air direction in a two-dimensional plane. The setting of the ventilation holes enables three-dimensional air duct transformation in the radiator, resulting in better heat dissipation effect. At the same time, it can also increase the ventilation and heat dissipation channels and enhance the heat dissipation effect. It should be noted that the shape of the ventilation holes is preferably rectangular to adapt to the fin structure.

[0022] In some embodiments of the present invention, for the above radiator, a left and right fin mounting groove is provided on one side wall of the fin, and a left and right fin mounting protrusion adapted to the left and right fin mounting groove is provided on the other side wall. By providing the mutually adapted left and right fin mounting grooves and left and right fin mounting protrusions, individual fins can be connected to each other, facilitating the user to install using the fins.

[0023] In some embodiments of the present invention, for the above radiator, a first mounting groove is provided on the side wall of the left and right fin mounting groove, and a first mounting protrusion adapted to the first mounting groove is provided on the side wall of the left and right fin mounting protrusion; a left and right fin mounting protrusion is further provided on one side wall of the fin, and a left and right fin mounting groove is further provided on the other side wall of the fin. By further providing the mutually adapted first mounting groove and first mounting protrusion in the left and right fin mounting groove and left and right fin mounting protrusion respectively, the installation between adjacent fins is more stable.

[0024] In some embodiments of the present invention, for the above radiator, it further includes a base. A fin mounting groove and a fin mounting protrusion are provided on the side wall of the base. The fin mounting groove is clamped with the left and right fin mounting protrusion, and the fin mounting protrusion is clamped with the left and right fin mounting groove; a third mounting groove adapted to the first mounting protrusion is provided on the side wall of the fin mounting groove, and a third mounting protrusion adapted to the first mounting groove is provided on the fin mounting protrusion; a base mounting groove adapted to the bottom of the base is provided on the heat dissipation body. By providing the fin mounting groove and the fin mounting protrusion, the connection between the base and the fins is more stable. By providing the base mounting groove, the base can also be stably connected to the heat dissipation body.

[0025] In some embodiments of the present invention, for the above radiator, upper and lower fin mounting grooves are provided at the bottom ends of the fins of the second heat dissipation module, and upper and lower fin mounting protrusions adapted to the upper and lower fin mounting grooves are provided at the top ends of the fins of the first heat dissipation module and the second heat dissipation module; second mounting grooves are provided on the side walls of the upper and lower fin mounting grooves, and second mounting protrusions adapted to the second mounting grooves are provided on the side walls of the upper and lower fin mounting protrusions. By providing the mutually adapted upper and lower fin mounting grooves and upper and lower fin mounting protrusions, the fins can be mounted into sheets not only in the horizontal direction but also in the vertical direction, facilitating subsequent installation and forming.

[0026] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0027] The present invention provides a radiator. By providing a heat conduction layer, not only can the heat of the heat dissipation body be quickly dissipated after being heated, but also the connection between the bottom of the first heat dissipation module and the heat dissipation body can be made closer, eliminating the installation steps between the fins and the heat dissipation body, simplifying the installation process. At the same time, the heat conduction layer can also quickly transfer heat to the fins around the heat dissipation module and release the heat, further enhancing the heat dissipation effect.

[0028] Under the condition of the same volume, the heat dissipation effects of three common radiators on the market are far inferior to that of the modular radiator provided by the present invention. The radiator provided by the present invention is modular and can be spliced to form radiators of various specifications and shapes, with a very wide application range, a fast heat dissipation speed, and the heat dissipation area can be adjusted according to actual needs at any time. At the same time, since the radiator is modular, standardized operations can be carried out during production, which can greatly save materials and reduce the burden on enterprises. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 It is the front view of the radiator of the present invention;

[0031] Figure 2 It is the top view of the radiator of the present invention;

[0032] Figure 3 It is the left view of the radiator of the present invention;

[0033] Figure 4Schematic diagram of the fins of the first heat dissipation module, the second heat dissipation module and the base of the present invention;

[0034] Figure 5 Schematic diagram of the first heat dissipation module of the present invention;

[0035] Figure 6 Schematic diagram of the connection between the first heat dissipation module and the second heat dissipation module of the present invention;

[0036] Figure 7 is Figure 1 Cross-sectional view in the A-A direction;

[0037] Figure 8 is Figure 7 Cross-sectional view in the B-B direction;

[0038] Figure 9 Schematic diagram of the process of step (1) in Example 3;

[0039] Figure 10 Schematic diagram of the process of step (2) in Example 3;

[0040] Figure 11 Schematic diagram of the process of step (3) in Example 3;

[0041] Figure 12 Schematic diagram of the shape of the radiator of the present invention Figure 1 ;

[0042] Figure 13 Schematic diagram of the shape of the radiator of the present invention Figure 2 ;

[0043] Figure 14 Schematic diagram of the shape of the radiator of the present invention Figure 3 ;

[0044] Figure 15 Schematic diagram of the structure of the water-cooled radiator prepared using the radiator of the present invention;

[0045] Figure 16 Schematic diagram of the structure of the refrigerant radiator prepared using the radiator of the present invention;

[0046] Figure 17 Schematic diagram of the structure of the heat pipe radiator prepared using the radiator of the present invention;

[0047] Figure 18 Schematic diagram of the structure of the electric heating radiator prepared using the radiator of the present invention;

[0048] Figure 19 Schematic diagram of the structures of the first heat dissipation module and the second heat dissipation module of the radiator of the present invention.

[0049] Icons: 1 - fin; 11 - left and right fin mounting grooves; 111 - first mounting groove; 12 - left and right fin mounting protrusions; 121 - first mounting protrusion; 13 - upper and lower fin mounting grooves; 131 - second mounting groove; 14 - upper and lower fin mounting protrusions; 141 - second mounting protrusion; 2 - base; 21 - fin mounting groove; 211 - third mounting groove; 22 - fin mounting protrusion; 221 - third mounting protrusion; 3 - conduction layer; 4 - heat dissipation body; 5 - ventilation hole; 6 - first heat dissipation module; 7 - second heat dissipation module; 81 - first mold; 811 - pressing column; 812 - first pressing groove; 82 - second mold; 821 - second pressing groove; 10 - air duct commutation mechanism; 101 - first bending part; 102 - second bending part. Detailed implementation manners

[0050] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and illustrated herein generally may be arranged and designed in a variety of different configurations.

[0051] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0052] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0053] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0054] In addition, terms such as "horizontal", "vertical", "overhanging", etc. do not require the components to be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0055] In the description of the embodiments of the present invention, "a plurality of" represents at least two.

[0056] In the description of the embodiments of the present invention, it should also be noted that unless otherwise clearly specified and limited, if terms such as "arranged", "installed", "connected", "coupled" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0057] Embodiment 1

[0058] Please refer to Figure 4 , Figure 4 wherein the structural schematic diagrams of two kinds of fins and the base of the present invention are shown as Figures A, B, and C in sequence.

[0059] This embodiment provides a fin 1, and the fins 1 can be engaged with each other, that is, the connection between the fins 1 and the fins 1 is realized through a snap engagement method. This embodiment provides an engagement method, which is specifically as follows:

[0060] As Figure 4 shown in Figures A and B in, on two opposite side walls of the fin 1, there are provided mutually adapted left and right fin mounting grooves 11 and left and right fin mounting protrusions 12. When connecting, the left and right fin mounting grooves 11 and the left and right fin mounting protrusions 12 of one fin 1 are respectively engaged with the left and right fin mounting protrusions 12 and the left and right fin mounting grooves 11 of another fin 1. In order to further reinforce the fin 1 in the horizontal direction, on the side wall of the left and right fin mounting grooves 11, there is provided a first mounting groove 111, and on the side wall of the left and right fin mounting protrusions 12, there is provided a first mounting protrusion 121 that is engaged with the first mounting groove 111. When installing, as the left and right fin mounting protrusions 12 are engaged with the left and right fin mounting grooves 11, the first mounting protrusion 121 is also engaged with the first mounting groove 111.

[0061] As Figure 4As shown in FIGS. A and B, in order to achieve the connection in the vertical direction, the bottom end of the fin 1 can also be provided with upper and lower fin mounting grooves 13, and the top end of the fin 1 body is provided with upper and lower fin mounting protrusions 14 adapted to the upper and lower fin mounting grooves 13. To further stabilize the fins 1 in the up and down direction, a second mounting groove 131 is provided on the side wall of the upper and lower fin mounting grooves 13, and a second mounting protrusion 141 adapted to the second mounting groove 131 is provided on the side wall of the upper and lower fin mounting protrusions 14. During installation, when the upper and lower fin mounting protrusions 14 are engaged with the upper and lower fin mounting grooves 13, the second mounting protrusions 141 are also engaged with the second mounting grooves 131.

[0062] In addition to the buckle engagement method mentioned in this embodiment, the fins 1 can also be engaged by other existing buckle engagement methods, not limited to the engagement method mentioned in this embodiment. At the same time, since the fins 1 are made into a modular structure by the buckle engagement method, the modular fins 1 can be connected to various forms of heat dissipation bodies 4 to make various forms of radiators. Compared with the existing profile radiators, inserted fin radiators and shovel fin radiators, if the fins 1 are used to make radiators, the form of the radiators can be diversified, the heat dissipation area can be increased, the versatility can be wider, and the production becomes simpler, and the heat dissipation effect is significantly increased. Furthermore, a multi-purpose modular radiator is formed, which is applicable to various aspects.

[0063] Embodiment 2

[0064] Please refer to Figures 1 - 8 and Figures 12 - 14 , Figures 1 - 8 The front view, top view, left view of the radiator of the present invention and the structure diagram between various components are shown in sequence, Figures 12 - 14 These are various shape diagrams of the modular radiator of the present utility model.

[0065] This embodiment provides a radiator, including a base 2, a heat conduction layer 3, a heat dissipation body 4, multiple rows of first heat dissipation modules 6 and a second heat dissipation module 7. The first heat dissipation modules 6 and the second heat dissipation module 7 are parallel to each other, and the first heat dissipation modules 6 and the second heat dissipation module 7 are not limited to the shapes shown in the figure. The first heat dissipation module 6 is formed by connecting fins 1 without upper and lower fin mounting grooves 13 in multiple columns in Embodiment 1 ( Figure 4 as shown in FIG. B), and the first heat dissipation module 6 is arranged on the heat dissipation body 4. The bottom wall of the fins 1 of each row of the first heat dissipation module 6 is connected to the heat dissipation body 4 through the heat conduction layer 3. The second heat dissipation module 7 is formed by connecting fins 1 with upper and lower fin mounting grooves 13 in multiple columns in Embodiment 1 ( Figure 4 as shown in FIG. A), and the second heat dissipation module 7 is arranged on the first heat dissipation module 6. The buckle engagement method between the first heat dissipation module 6 and the second heat dissipation module 7 is not limited to the method mentioned above, and other existing buckle engagement methods can also be used.

[0066] The first heat dissipation module 6 and the second heat dissipation module 7 can be arranged in parallel in 1 to 20 rows along the heat dissipation body 4, and the second heat dissipation module 7 can be arranged in 1 to 5 layers in the vertical direction. The preferred size is 20 mm to 150 mm in height, 60 mm to 800 mm in length, and 50 mm to 800 mm in width. According to actual use requirements, the radiator can be combined into Figures 12 - 14 Various shapes shown, such as plane shape (Figures A and B in Figure 12), L shape ( Figure 12 Figures C and D), square ( Figure 12 Figure E and Figure F), vertical shape ( Figure 12 Middle G), U-shaped ( Figure 13 Figure A and Figure B), trapezoid ( Figure 13 Figures E, F, and G), triangle ( Figure 13 Figures C and D), I-shaped ( Figure 14 Middle G), hexagon ( Figure 14 Figure A, Figure 14 Figure B is a schematic diagram of the first heat dissipation module 6 in Figure A), polygon ( Figure 14 Figure E, Figure 14 Figure F is a schematic diagram of the first heat dissipation module 6 in Figure E) and a circular ( Figure 14 Figure C, Figure 14 Figure D is a schematic diagram of the first heat dissipation module 6 in Figure C). In addition to the aforementioned shapes, other arbitrary shapes can also be combined to meet different usage requirements. The connection between the main body and the main body can be connected by crimping or welding.

[0067] In order to stabilize the first heat dissipation module 6, Figure 4 As shown in Figure C, the side wall of the base 2 is provided with a fin mounting groove 21 and a fin mounting protrusion 22, the fin mounting groove 21 is engaged with the left and right fin mounting protrusions 12, and the fin mounting protrusion 22 is engaged with the left and right fin mounting grooves 11; the side wall of the fin mounting groove 21 is provided with a third mounting groove 211 engaged with the first mounting protrusion 121, and the fin mounting protrusion 22 is provided with a third mounting protrusion 221 engaged with the first mounting groove 111; the heat dissipation body 4 is provided with a base 2 mounting groove 41 adapted to the bottom of the base 2. The schematic diagram of the connection between the base 2 and the first heat dissipation module 6 is shown in FIG. Figure 5 shown.

[0068] Since the first heat dissipation module 6 and the second heat dissipation module 7 are both connected by locking and biting between the fins 1, the first heat dissipation module 6 and the second heat dissipation module 7 can also be connected by locking and biting, such as Figure 6 As shown, Figure 6 Figure A is a schematic diagram of the first heat dissipation module 6 and the second heat dissipation module 7 before they are engaged. Figure 6Figure B shows a schematic diagram of the first heat dissipation module 6 and the second heat dissipation module 7 after being engaged. This connection method changes the internal structure of the traditional radiator. Therefore, the radiator can increase the heat dissipation effect in the following aspects:

[0069] 1. First, adjust the internal structure of the radiator. As Figure 19 shown, the thickness a of the fin 1 is 0.8 mm to 3 mm, the ratio of the thickness a of the fin 1 to the distance b between the fins 1 is 1:2 to 1:8, the ratio of the distance b between the fins 1 to the height c of the fin 1 is 1:10 to 1:40. The shapes of the fins include corrugated fins 1 and smooth fins 1. The thickness d at the bottom of the fin 1 is 2 mm to 20 mm, and the width dimension E of the fin is 20 mm to 350 mm.

[0070] 2. Second, add an air duct commutation mechanism 10 for changing the wind direction inside the channel, that is, change the wind direction between each row of fins 1. As Figure 2 、 3 、7 and 8 shown, the end face of the fin 1A in a certain row in the first heat dissipation module 6 or the second heat dissipation module 7 bends to the left or right to form a first bending part 101. At the same time, in the horizontal direction, the end face (the end face far from the bent end face of the fin 1A) of another fin 1B in the same row bends to the right or left to form a second bending part 102. The bending angle of the formed first bending part 101 or second bending part 102 is 30 degrees - 60 degrees. The first bending part 101 and the second bending part 102 form the air duct commutation mechanism 10 for changing the wind direction inside the channel, making each row of heat dissipation channels transform into an S-shaped curved surface air duct, increasing the speed of the air flow on the surface of the fin 1 and improving the heat dissipation effect. The number of the air duct commutation mechanisms 10 can be multiple to further increase the heat dissipation effect. During actual use, the cold air entering from the outside of the radiator enters from above the second heat dissipation module 7 and runs along the channels between each row of fins 1. When encountering the air duct commutation mechanism 10, it can change the wind direction in the horizontal or vertical direction.

[0071] 3. Third, in order to increase heat dissipation and cooperate with the S-shaped curved surface air duct, a plurality of ventilation holes 5 can be provided on the bottom plate between each row of fins 1 in each group of the second heat dissipation modules 7. As Figure 7 and 8 shown, where the arrow indicates the wind direction inside the radiator. When the wind direction dissipates heat from top to bottom, the ventilation holes 5 form heat dissipation channels communicating with the second heat dissipation module 7. The shape of the ventilation hole 5 is preferably a rectangle with a length of 20 mm and a width of 1.5 mm. During actual use, the cold air entering from above the second heat dissipation module 7 can not only diffuse or change the wind direction in the horizontal or vertical direction, but also flow in both the horizontal and vertical directions at the same time.

[0072] 4. Again, in addition to the mechanism for changing the wind direction and the ventilation holes 5 described above, the heat conduction layer 3 added to the radiator in this embodiment also has excellent heat dissipation effect. The heat conduction layer 3 is prepared with pure copper powder as the base material and is mixed with a heat-conducting adhesive. The volume ratio of the copper powder to the heat-conducting adhesive is 0.5 - 1.5:1.5 - 2.5, preferably 1:2. The thickness of the heat conduction layer 3 is 0.1mm - 0.5mm, the particle size of the pure copper powder therein is 600 mesh - 1000 mesh, and the heat-conducting adhesive is prepared from A transparent heat-conducting adhesive and B transparent heat-conducting adhesive in a volume ratio of 8 - 11:0.5 - 1.5, preferably 10:1. In addition, the heat conduction layer 3 not only enables the heat of the heat dissipation body 4 to be quickly dissipated after being heated, but also makes the connection between the bottom of the first heat dissipation module 6 and the heat dissipation body 4 closer. The heat conduction layer 3 can also quickly transfer heat to the fins 1 around the heat dissipation module and release the heat, further enhancing the heat dissipation effect. Heat conduction layers 3 are provided between the first heat dissipation module 6, the second heat dissipation module 7, and between the two layers of the second heat dissipation module 7.

[0073] 5. Finally, due to the change in the fin 1 structure, the first heat dissipation module 6, the second heat dissipation module 7, and the heat dissipation body 4 can be made of aluminum material, resulting in better heat dissipation effect. The first heat dissipation module 6 and the second heat dissipation module 7 are formed by extrusion molding and are integrally formed with each other by extrusion. The heat dissipation body 4 is processed by sheet cutting or extrusion.

[0074] Embodiment 3

[0075] This embodiment provides a preparation process for a radiator. Three types of pressing molds are required in this process, including the first pressing mold 81 and the second pressing mold 82. The structure of the first pressing mold 81 includes a plurality of first pressing grooves 812 and pressing columns 811 arranged at intervals. The first pressing grooves 812 are adapted to the fins 1, and the channels between the fins 1 and the fins 1 are adapted to the pressing columns 811. The second pressing mold 82 is provided with a second pressing groove 821, and the second pressing groove 821 is adapted to the width of the first heat dissipation module 6.

[0076] Using the aforementioned two pressing molds, the radiator can be quickly prepared, and the specific steps are as follows:

[0077] As Figure 9 shown, Figure 9 in Figure A shows the connection method between the first heat dissipation module 6 and the body 4 before the first pressing mold 81 presses. The bottom of the base 2 is clamped into the base installation groove 41 on the heat dissipation body 4, and then the first pressing mold 81 is pressed towards the heat dissipation body 4 by an external force, pressing the first heat dissipation module 6 towards the heat dissipation body 4, so that the bottom of the first heat dissipation module 6 is tightly connected to the heat dissipation body 4. The pressing result is as shown in Figure B in Figure 9 ;

[0078] As Figure 10 shown,Figure 10 Figure A shows the connection between the first heat dissipation module 6 and the body 4 before the second die 82 presses. At this time, after being pressed by the first die 81, the bottom of the first heat dissipation module 6 and the body 4 are already tightly connected, and the bottom of the base 2 has been snapped into the base installation groove 41. However, there is still a gap between the side wall of the base 2 and the side wall of the base installation groove 41, as shown in Figure 10 the enlarged view of the circled part in Figure A. Then, by continuously extruding the first heat dissipation module 6 with the second die 82, the side wall of the base 2 is tightly connected and formed with the side wall of the base installation groove 41, as shown in Figure 10 Figure B and the enlarged view of the circled part in Figure B;

[0079] As Figure 11 shown, after connecting the second layer, continue to use the first die 81 to install the second heat dissipation modules 7 of the first layer to the Nth layer. Figure 11 Figure A and the enlarged view of the circled part in Figure A show the connection between the first heat dissipation module 6 and the second heat dissipation module 7 of the first layer before the first die 81 presses. Figure 11 Figure B and the enlarged view of the circled part in Figure B show the connection between the first heat dissipation module 6 and the second heat dissipation module 7 of the first layer after the first die 81 presses. The specific process is as follows: snap the upper and lower fin installation protrusions 14 of the first heat dissipation module 6 into the upper and lower fin installation grooves 13 of the second heat dissipation module 7 of the first layer, and the second installation protrusion 141 also engages with the second installation groove 131. Then, continue to extrude the second heat dissipation module 7 towards the first heat dissipation module 6 with the first die 81 to form the first heat dissipation module 6 and the second heat dissipation module 7;

[0080] According to needs, snap the upper and lower fin installation protrusions 14 of the second heat dissipation module 7 of the first layer into the upper and lower fin installation grooves 13 of the second heat dissipation module 7 of the second layer, and continue to extrude the second heat dissipation module 7 of the second layer towards the first heat dissipation module 6 with the first die 81 to connect and form the second heat dissipation module 7 of the first layer and the second heat dissipation module 7 of the second layer; if multiple layers of the second heat dissipation module 7 are needed, continue to install to obtain the required radiator.

[0081] Due to the use of die extrusion forming, the radiator provided by the present invention can achieve standardized production processes, save production materials, and make the performance of the produced radiators more stable.

[0082] Embodiment 4

[0083] This embodiment provides several usage methods of the radiator.

[0084] The radiator provided in Embodiment 2 can not only be processed into modular air-cooled radiators with various styles and various structural uses. At the same time, it can also be processed into radiators with various styles and various structural uses, such as water-cooled radiators (the connection structure is as Figure 15As shown), refrigerant radiator (connection structure as shown Figure 16 As shown), heat pipe radiator (connection structure as shown Figure 17 as shown) and electric heating radiator (connection structure as shown Figure 18 shown).

[0085] like Figure 15 As shown, Figure 18 The middle left picture is the front view of the water-cooled radiator, the upper picture is the bottom view, the upper two pictures are the left view, the upper three pictures are the cross-sectional view of the upper two pictures in the AA direction, and the lower picture is the left view. The first heat dissipation module 6 (i.e., II shown in the figure) is installed on the heat dissipation body 4 (i.e., IV shown in the figure), and the second heat dissipation module 7 (i.e., I shown in the figure) is installed on the first heat dissipation module 6, and then the water pipe is inserted and set in the heat dissipation body 4 to achieve heat dissipation. The joint diagram of the metal water pipe and the radiator is shown in the following two figures.

[0086] like Figure 16 As shown, Figure 18 The upper left picture in the middle is the main view of the refrigerant radiator, the upper right picture is a top view, and the lower picture is a side view. The first heat dissipation module 6 (i.e., II shown in the figure) is installed on the heat dissipation body 4 (i.e., IV shown in the figure), and then the second heat dissipation module 7 (i.e., I shown in the figure) is installed on the first heat dissipation module 6, and the copper tube part is embedded in the heat dissipation body 4 to achieve heat dissipation.

[0087] like Figure 17 As shown, Figure 17 The left picture in the middle is the main view of the heat pipe radiator, and the right picture is a cross-sectional view of the main view in the AA direction. The first heat dissipation module 6 (i.e., II shown in the figure) is installed on the heat dissipation body 4 (i.e., IV shown in the figure), and then the second heat dissipation module 7 (i.e., I shown in the figure) is installed on the first heat dissipation module 6. One section of the heat pipe is connected to the side of the second heat dissipation module 7, and the other section is embedded in the heat dissipation body 4 to achieve heat dissipation.

[0088] like Figure 18 As shown, Figure 18 The left picture in the middle is the main view of the electric heating radiator, and the right picture is a sectional view of the main view in the AA direction. The first heat dissipation module 6 (i.e., II shown in the figure) is installed on the heat dissipation body 4 (i.e., IV shown in the figure), and a heating element is installed in the heat dissipation body 4. A wiring terminal is set at the end of the heating element, and heat dissipation can be achieved by powering on.

[0089] In summary, the heat sink provided by the embodiment of the present invention has the following advantages:

[0090] (1) The fins can be connected by locking means to form a modular first heat dissipation module 6 and a second heat dissipation module 7. People can prepare the first heat dissipation module 6 and the second heat dissipation module 7 of appropriate width as needed;

[0091] (2) Since the first heat dissipation module 6 and the second heat dissipation module 7 are modular, they can be connected by a snap-fastening method. This module splicing method cannot be achieved by conventional radiators at present. By using the first heat dissipation module 6 and the second heat dissipation module 7, radiators of various shapes and forms can be designed. The heat dissipation area and the volume of the radiator can be increased or decreased at any time according to actual needs. Not only can a radiator with an ultra-large area be set to reduce the heat of high-power electronic components, but it can also be used as a radiator for electric heating to increase the indoor temperature. The designed radiator has the characteristics of small volume, light weight, beautiful appearance, and obvious heat dissipation effect, and is a multi-purpose modular electronic radiator or electric heating radiator;

[0092] (3) The first heat dissipation module 6, the second heat dissipation module 7, and the body are integrally formed by extrusion connection, and the heat dissipation speed is fast;

[0093] (4) The snap-fastening connection method between the fins 1, between the heat dissipation module and the body standardizes the heat dissipation module, standardizes the design of the radiator, and standardizes the material specifications of the fins 1. At the same time, the modular heat dissipation modules are integrally formed by extrusion, making the production process also standardized, greatly saving production time, material costs, and mold opening costs, and reducing the production burden of enterprises.

[0094] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A radiator, characterized in that, It includes a heat conduction layer, a heat dissipation body, multiple rows of first heat dissipation modules and second heat dissipation modules. The bottom end of the first heat dissipation module is connected to the heat dissipation body through the heat conduction layer. The first heat dissipation module includes multiple columns of fins that are sequentially engaged; the heat conduction layer is mainly prepared from copper powder and a thermally conductive adhesive. The volume ratio of the copper powder to the thermally conductive adhesive is 0.5 - 1.5:1.5 - 2.5; the thickness of the heat conduction layer 3 is 0.1 mm - 0.5 mm, and the particle size of the pure copper powder therein is 600 mesh - 1000 mesh.

2. The radiator according to claim 1, characterized in that, The volume ratio of the copper powder to the thermally conductive adhesive is 1:

2.

3. The radiator according to claim 1 or 2, characterized in that, The thermally conductive adhesive is prepared from A transparent thermally conductive adhesive and B transparent thermally conductive adhesive according to a volume ratio of 8 - 11:0.5 - 1.

5.

4. The radiator according to claim 3, wherein, The thermally conductive adhesive is prepared from A transparent thermally conductive adhesive and B transparent thermally conductive adhesive according to a volume ratio of 10:

1.

5. The radiator according to claim 1 or 2, characterized in that, In the first heat dissipation module or the second heat dissipation module, the ratio of the fin thickness to the fin pitch is 1:2 - 1:8, and the ratio of the fin pitch to the fin height is 1:10 - 1:

40.

6. The radiator according to claim 5, wherein, It further includes multiple rows and / or multiple layers of second heat dissipation modules. The second heat dissipation module includes multiple columns of fins that are sequentially engaged. The top end of the first heat dissipation module and the bottom end of the second heat dissipation module are mutually engaged.

7. The radiator according to claim 6, characterized in that, In the extending direction at the same level, each fin includes a relatively arranged first end and a second segment. On any two adjacent fins, a first bending portion is provided at the first end of one fin, and a second bending portion is provided at the first end of the other fin.

8. The radiator according to claim 5, wherein Multiple ventilation holes are provided on the bottom wall of the fins of the second heat dissipation module.

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