Air-cooled equipment heat dissipation test system

Abstract

The present invention discloses a heat dissipation test system for air-cooled equipment, which solves the problem of verifying the performance of equipment in a chassis under various temperature environments. The present invention includes an air heat dissipation circuit composed of a temperature test box and a return pipe, wherein the temperature test box includes a temperature test box B, wherein the temperature test box B includes a through hole for connecting the return pipe, and further includes a rack, wherein the rack in the temperature test box B is provided with a test object device and two heat dissipation interference simulation devices arranged on both sides of the test object device. The temperature test box B of the present invention simulates the actual environment of an ARINC 600 chassis in an aircraft electronic compartment rack, thereby increasing the reliability of the test results, the heat dissipation interference simulation device simulates the influence of convective heat transfer of adjacent heat-generating equipment, and the electronic equipment rack simulator makes the air outlet flow field of the chassis conform to the actual situation.

Description

Technical Field

[0001] The invention relates to a heat dissipation test system, in particular to a heat dissipation test system for air-cooling equipment. Background Art

[0002] With the development of aviation airborne systems, the types and quantities of electronic equipment in civil airliners are increasing. Due to the complexity of aircraft flight conditions, in order to ensure the normal operation of various airborne equipment under typical environmental conditions, relevant specifications have determined the test requirements for performance testing of airborne equipment under different environmental conditions.

[0003] Temperature is one of the key environmental conditions that affect the performance of airborne equipment. If the temperature is too high or the air flow is poor, the heat of the equipment cannot be dissipated in time, affecting the stability and reliability of the equipment. Currently, airborne equipment usually uses air cooling to reduce the temperature of the equipment and the environment to ensure equipment performance.

[0004] However, the current air-cooled heat dissipation test equipment for airborne equipment has the following shortcomings:

[0005] The forced ventilation air volume cannot be adjusted. Most existing forced ventilation test equipment supplies air through fans, and the air supply volume cannot be accurately adjusted. However, the air volume provided to electronic equipment under different operating conditions of the aircraft is different. In order to simulate the performance of electronic equipment under different air supply conditions, the test equipment must meet the requirements of adjustable air supply volume.

[0006] The air supply temperature cannot be adjusted. The air supply temperature of common forced ventilation test equipment is room temperature. In actual operation, the air supply temperature of airborne equipment changes with the operating status of the aircraft. The existing test equipment cannot meet the requirements of adjustable and measurable forced air supply temperature.

[0007] Lack of interference heat dissipation simulation. The load devices fixed on the racks in the aircraft electronic compartment are usually arranged in parallel. Adjacent heat-generating devices will affect the natural heat dissipation performance of the outer surface of the equipment, and the existing ventilation test equipment does not take this influence into account. Summary of the invention

[0008] The technical problem to be solved by the present invention is to verify the performance of equipment in a chassis under various temperature environments. The present invention provides a heat dissipation test system for air-cooled equipment to solve the above problem.

[0009] The present invention is achieved through the following technical solutions:

[0010] The air-cooled equipment heat dissipation test system comprises an air heat dissipation circuit composed of a temperature test chamber and a return pipe, wherein the temperature test chamber comprises a temperature test chamber B, wherein the temperature test chamber B comprises a through hole connected to the return pipe, and further comprises a rack, wherein the rack in the temperature test chamber B is provided with a test object device and two heat dissipation hindering simulation devices arranged on both sides of the test object device;

[0011] The external lower end of the test object equipment passes through the storage rack and is connected to the air heat dissipation circuit through the return pipe. The external upper end of the test object equipment is connected to the ventilation pipe passing through the internal upper end of the temperature test box B. The ventilation pipe is connected to the air heat dissipation circuit outside the temperature test box B.

[0012] The temperature test chamber also includes a temperature test chamber A. An air pump is arranged in the middle of the return pipe between the temperature test chamber A and the temperature test chamber B. The air pump has the function of adjusting the wind speed and air volume. The temperature test chamber A is provided with a temperature control module. The temperature test chamber A displays and controls the temperature of the air flow output by the air pump. Considering the temperature change, cold air and hot air can be generated in time in the test chamber, and the smaller volume of the temperature test chamber A is adopted. The two heat dissipation hindrance simulation devices are fixed on both sides of the test object device, and there is a gas channel between the two heat dissipation simulation devices and the test object device, that is, there is a gap between the three. The heat dissipation hindrance simulation device is a temperature-controllable heating copper plate to achieve uniform heat dissipation distribution. In order to reduce heat energy loss, the outer surface of the return pipe is wrapped with insulation material.

[0013] The heat dissipation simulation device is made of a solid copper plate with a smooth surface. A coating is applied on the surface of the heat dissipation simulation device, and the coating is made of black paint. The reflectivity of the heat dissipation simulation device is greater than 0.85.

[0014] The ventilation duct has holes on part of the tube wall in the temperature test box B, and the part of the ventilation duct passing through the temperature test box B performs gas heat exchange with the air in the temperature test box B. The storage rack is made of wood material, and the non-working surface is wrapped with wood material to insulate, thereby reducing the heat transfer between the heat dissipation sample and the ambient air of the test box. The temperature test box B also includes a top air outlet, and the temperature test box B performs gas exchange with the storage rack and the ventilation duct. According to relevant specifications, the cooling air temperature and duration are divided into four conditions to simulate the performance of the test piece in different operating environments, and also include an electronic equipment rack simulator, which is set on the test object equipment, and the electronic equipment rack simulator is used to adjust the gas flow field of the top air outlet of the temperature test box B to make it more in line with the actual situation.

[0015] The temperature test box A is used to quickly change the air supply temperature.

[0016] Aiming at the deficiencies in the existing technology, an adjustable air pump is used to provide cooling air for the equipment, and a flow meter is installed at the air pump outlet to monitor the air supply flow in real time to ensure that the air supply volume meets the specification requirements under different operating conditions of the aircraft. A rapid temperature change test chamber, namely, a temperature test chamber A, is designed to generate controllable temperature supply air, and sensors are installed in the air supply duct, namely, the return duct, the temperature test chamber B, and the air inlet of the test object equipment to ensure that the air supply entering the equipment meets the established specification requirements. In addition, the cooling air temperature box, namely, the temperature test chamber A, where the supply air is returned after the test, reduces the cooling and heating requirements of the rapid temperature change test chamber. Controllable temperature heating copper plates are added on both sides of the test object equipment to simulate the adjacent equipment that hinders heat dissipation in the actual environment, so as to establish the real heat dissipation environment of ARINC 600 standard air-cooled equipment on the aircraft.

[0017] The present invention has the following advantages and beneficial effects:

[0018] The temperature test box of the present invention can simulate the actual environment of the ARINC 600 chassis in the aircraft electronic compartment rack, increase the reliability of the test result, prevent the heat dissipation simulation equipment from simulating the influence of convective heat transfer of adjacent heating equipment, and the electronic equipment rack simulation object makes the chassis air outlet flow field conform to the actual situation.

[0019] The present invention realizes that the air volume and air temperature of the air supply to the ARINC600 chassis can be adjusted and detected, and the temperature test box A can realize that the air supply temperature meets the air supply temperature requirements under different operating conditions of the aircraft, and the temperature sensors installed at the entrance of the air supply duct, i.e., the return pipe, and the chassis, i.e., the temperature test box B, can further ensure the temperature monitoring of the air supply entering the ARINC600 chassis. At the same time, the air pump and the flow meter ensure that the air supply flow rate can be adjusted and measured. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0021] Figure 1 It is the front view of the present invention.

[0022] Figure 2 It is the front view of the sensor layout of the present invention.

[0023] Figure 3 It is a side view of the sensor layout of the present invention.

[0024] Marks and corresponding parts names in the attached drawings:

[0025] 1. Reflux pipe; 2. Temperature test chamber A; 3. Air pump; 4. Heat dissipation simulation equipment; 5. Storage rack; 6. Test object equipment; 7. Temperature test chamber B; 8. Ventilation pipe; 11. Electronic equipment rack simulation object. DETAILED DESCRIPTION

[0026] Before any embodiment of the present invention is described in detail, it should be understood that the application of the present invention is not limited to the details of the structure shown in the following description or the accompanying drawings. The present invention may adopt other embodiments and may be implemented or executed in various ways. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative improvements are within the scope of protection of the present invention.

[0027] Embodiment 1:

[0028] Air-cooled equipment heat dissipation test system, such as Figure 1 As shown, it includes an air heat dissipation circuit composed of a temperature test box and a return pipe 1, the temperature test box includes a temperature test box B7, the temperature test box B7 includes a through hole connected to the return pipe 1, and also includes a rack 5, on which a test object device 6 and two heat dissipation hindering simulation devices 4 arranged on both sides of the test object device 6 are arranged;

[0029] The external lower end of the test object equipment 6 passes through the storage rack 5 and is connected to the air heat dissipation circuit via the return pipe 1. The external upper end of the test object equipment 6 is connected to the ventilation pipe 8 passing through the internal upper end of the temperature test box B7. The ventilation pipe 8 is connected to the air heat dissipation circuit outside the temperature test box B7.

[0030] The temperature test chamber also includes a temperature test chamber A2, an air pump 3 is arranged in the middle of the return pipe 1 between the temperature test chamber A2 and the temperature test chamber B7, the air pump 3 has a wind speed and air volume adjustment function, the temperature test chamber A2 is provided with a temperature control module, and the temperature test chamber A2 displays and controls the air flow temperature output by the air pump 3. Two heat dissipation simulating devices 4 are fixed on both sides of the test object device 6, the heat dissipation simulating devices 4 are temperature-controllable heating copper plates, and the outer surface of the return pipe 1 is wrapped with insulation material.

[0031] The heat dissipation simulation device 4 is made of a solid copper plate with a smooth surface. A coating is applied on the surface of the heat dissipation simulation device 4. The coating is made of black paint. The reflectivity of the heat dissipation simulation device 4 is greater than 0.85.

[0032] The ventilation pipe 8 has holes on a part of the pipe wall in the temperature test box B7, and the ventilation pipe 8 passes through the part of the temperature test box B7 to perform gas heat exchange with the air in the temperature test box B7. The storage rack 5 is made of wood.

[0033] Embodiment 2: The present invention also includes four sensors, such as Figure 2 , 3, including a temperature sensor, an air pressure sensor, a humidity sensor and a flow sensor, wherein the air pressure sensor includes a differential air pressure sensor;

[0034] The temperature sensors include eight temperature sensors, T1-T8, and the placement of the temperature sensors is as follows:

[0035] The T1 temperature sensor is placed outside the temperature test box B7. The T1 temperature sensor is used to measure the laboratory environment temperature. The entire system is set up in the laboratory;

[0036] The T2 temperature sensor is placed at the place where the cooling air enters the temperature test box B7, and the T2 temperature sensor is used to measure the temperature of the cooling air entering the temperature test box B7;

[0037] The T3 temperature sensor is placed at the place where the cooling air enters the test object device 6, and the T3 temperature sensor is used to measure the temperature of the cooling air entering the test object device 6;

[0038] The T4 temperature sensor is placed in the temperature test box B7 and is 76 mm in front of the test object device 6. The T4 temperature sensor is used to measure the ambient temperature of the temperature test box B7;

[0039] The T5 temperature sensor is placed on the front, back and side of the treatment surface of the test object device 6. The T5 temperature sensor is used to measure the average temperature, maximum temperature and minimum temperature of the outer surface of the test object device 6;

[0040] The T6 temperature sensor is disposed on the surface of the heat dissipation simulating device 4, and the T6 temperature sensor is used to measure the surface temperature of the heat dissipation simulating device 4;

[0041] The T7 temperature sensor is placed in the temperature test box B7, and the T7 temperature sensor is used to measure the cooling air temperature at the air outlet of the temperature test box B7;

[0042] The T8 temperature sensor is disposed inside the test object device 6, and the T8 temperature sensor is used to measure the temperature of key components inside the test object device 6;

[0043] The air pressure sensor includes three air pressure sensors P1-P3, and the placement of the air pressure sensors is as follows:

[0044] The P1 air pressure sensor is arranged outside the temperature test box B7, and the P1 air pressure sensor is used to measure the ambient air pressure of the laboratory;

[0045] The P2 air pressure sensor is arranged outside the test object device 6 and inside the temperature test box B7, and the P2 air pressure sensor is used to measure the internal air pressure of the temperature test box B7;

[0046] The P3 air pressure sensor is a differential air pressure sensor, which is disposed at the air inlet and outlet of the test object device 6, and is used to measure the differential air pressure between the cooling air inlet and outlet of the test object device 6;

[0047] The flow sensor includes an M1 flow sensor, which is disposed at the ventilation pipe 8 and is used to measure the gas flow rate from the ventilation pipe 8 into the test object device 6;

[0048] The humidity sensor includes an H1 humidity sensor, which is disposed at the ventilation pipe 8 and is used to measure the relative humidity of the air entering the test object device 6 through the ventilation pipe 8 .

[0049] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation test system for air-cooled equipment, comprising an air heat dissipation circuit consisting of a temperature test chamber and a return pipe (1), characterized in that: The temperature test box comprises a temperature test box B (7), the temperature test box B (7) comprises a through hole connected to a return pipe (1), and also comprises a rack (5), on which a test object device (6) and two heat dissipation interference simulation devices (4) arranged on both sides of the test object device (6) are arranged in the rack (5) in the temperature test box B (7); The external lower end of the test object device (6) passes through the storage rack (5) and is connected to the air heat dissipation circuit via the return pipe (1); the external upper end of the test object device (6) is connected to the ventilation pipe (8) passing through the internal upper end of the temperature test box B (7); and the ventilation pipe (8) is connected to the air heat dissipation circuit outside the temperature test box B (7); The temperature test chamber further comprises a temperature test chamber A (2), an air pump (3) is arranged in the middle of the return pipe (1) between the temperature test chamber A (2) and the temperature test chamber B (7), the air pump (3) has a wind speed and air volume adjustment function, the temperature test chamber A (2) is provided with a temperature control module, and the temperature test chamber A (2) displays and controls the air flow temperature output by the air pump (3); The two heat dissipation simulating devices (4) are fixed on both sides of the test object device (6), and the heat dissipation simulating devices (4) are temperature-controllable heating copper plates.

2. The air-cooling equipment heat dissipation test system according to claim 1, characterized in that: The outer surface of the reflux pipe (1) is wrapped with thermal insulation material.

3. The air-cooling equipment heat dissipation test system according to claim 1, characterized in that: The heat dissipation simulation device (4) is made of a solid copper plate with a smooth surface. A coating is applied on the surface of the heat dissipation simulation device (4), and the coating is made of black paint. The reflectivity of the heat dissipation simulation device (4) is greater than 0.

85.

4. The air-cooling equipment heat dissipation test system according to claim 2, characterized in that: The ventilation pipe (8) has holes on a portion of the pipe wall in the temperature test box B (7), and the ventilation pipe (8) passes through the portion of the temperature test box B (7) to perform gas heat exchange with the air in the temperature test box B (7).

5. The air-cooling equipment heat dissipation test system according to claim 2, characterized in that: The storage rack (5) is made of wood.

6. The air-cooling equipment heat dissipation test system according to claim 2, characterized in that: The temperature test box B (7) also includes a top air outlet, and the temperature test box B (7) exchanges gas with the storage rack (5) and the ventilation pipe (8).

7. The air-cooling equipment heat dissipation test system according to claim 6, characterized in that: The temperature test box B (7) further comprises an electronic equipment rack simulation (11), wherein the electronic equipment rack simulation (11) is used to adjust the gas flow field of the top air outlet of the temperature test box B (7).

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