Plate processing line and circuit board processing technology

Abstract

The present invention discloses a sheet processing line and a corresponding circuit board processing process. The sheet processing line includes a transmission device and a chip removal device arranged on the transmission path of the transmission device. The chip removal device includes two electric contact components. The electric contact components include electric contacts made of conductive materials and a first lifting power component for driving the electric contacts to rise and fall. The two electric contacts are respectively electrically connected to two electrodes of a working power supply and are respectively used to abut against the top layer and the bottom layer of the sheet. When the sheet stays on the transmission device or is transmitted on the transmission device, one electric contact abuts against the top layer of the sheet downward, and the other electric contact abuts against the bottom layer of the sheet upward. The first electrode, the top layer, the chips, the bottom layer and the second electrode form an energized circuit. The chips belong to the high resistance link in the electric circuit and generate high heat. The chips are melted and fall off, and the chips between the top layer and the bottom layer of the sheet are eliminated.

Description

Technical Field

[0001] The invention relates to the field of plate processing, and in particular to a plate processing line. Background Art

[0002] In the field of circuit boards, copper clad laminates include a copper layer, an insulating layer and a metal base layer stacked in sequence. The insulating layer is located between the copper layer and the metal base layer. Insulation is required between the copper layer and the metal base layer. The metal base layer is generally made of aluminum or copper.

[0003] In actual production, most manufacturers will first split and cut the copper clad laminate according to the production process size of the circuit board. There will be silk scraps left on the cut edges, which will cause electrical connection between the copper layer and the metal base layer.

[0004] Some manufacturers use the polishing method to deal with silk chips. The cut plates are placed into the polishing wheel in small sections, and the polishing wheel polishes the plates edge by edge. This method of silk chip processing is relatively inefficient. In addition, it is relatively easy to miss a small part of the edge, resulting in the silk chips on this part of the edge not being polished away. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a plate processing line that can quickly remove wire scraps from the edge of the plate, and the wire scraps are removed cleanly so that the plate meets the requirements of the circuit board.

[0006] According to a first aspect of an embodiment of the present invention, a plate processing line includes a transmission device and a chip removal device arranged on a transmission path of the transmission device, the transmission device is used to transmit the plate, the chip removal device includes two electric contact components, the electric contact components include an electric contact made of a conductive material and a first lifting power component for driving the electric contact to rise and fall, the two electric contacts are respectively electrically connected to two electrodes of a working power supply, and are respectively used to abut against the top layer and the bottom layer of the plate.

[0007] A sheet processing line according to an embodiment of the present invention has at least the following beneficial effects: the sheet includes a top layer and a bottom layer, and the top layer and the bottom layer are metal conductive layers, and there is an insulating layer between the top layer and the bottom layer, and the sheet processing line of the present invention is applied to this type of sheet; when the sheet stays on the transmission device or is transmitted on the transmission device, one electric contact abuts downward against the top layer of the sheet to connect the top layer of the sheet to the first electrode of the working power supply, and the other electric contact abuts upward against the bottom layer of the sheet to connect the bottom layer of the sheet to the second electrode of the working power supply, and because there is debris conduction between the top layer and the bottom layer of the sheet, the first electrode, the top layer, the debris, the bottom layer and the second electrode form an energized circuit, the debris belongs to the large resistance link in the electrical circuit, generates high heat, the debris melts off, and the debris between the top layer and the bottom layer of the sheet is eliminated.

[0008] According to some embodiments of the present invention, the transmission device includes a plurality of transmission rollers arranged side by side in the front-to-back direction, the transmission rollers are connected to a transmission power member, and the electric contact for abutting the bottom layer of the plate can pass through the gap between two transmission rollers. The transmission mode of the transmission roller is set, and the electric contact component for abutting the bottom layer of the plate can be hidden under the transmission device, and the electric contact of the electric contact component can pass through the gap between the two transmission rollers and then abut the bottom layer of the plate.

[0009] According to some embodiments of the present invention, a polishing device and a positioning device are further included, and the positioning device and the polishing device are sequentially arranged on the transmission path of the transmission device, and the polishing device includes a polishing roller arranged above the transmission device, and the polishing roller extends in the left-right direction, and the positioning device is used to drive the plate on the transmission device to move left and right. The polishing roller extends in the left-right direction, that is, the axial direction of the polishing roller is in the left-right direction, and the positioning device drives the plate to move left a little, then the left section on the polishing roller is used, and the positioning device drives the plate to move right a little, then the right section on the polishing roller is used, and the left section and the right section on the polishing roller are used alternately, the polishing roller is fully used, and the polishing roller wears evenly.

[0010] According to some embodiments of the present invention, the positioning device includes a push plate higher than the transmission device, a pushing force member connected to the push plate, and a support rod connecting the push plate and the pushing force member, the pushing force member is arranged below the transmission device, and the support rod passes through the transmission device upward. The pushing force member can be arranged in a hidden manner below the transmission device, and the arrangement of the pushing force member will not hinder the operating space above the transmission device.

[0011] According to some embodiments of the present invention, the positioning device further includes a supporting assembly, the supporting assembly including a supporting frame, a third lifting power member for driving the supporting frame to rise and fall, and at least three supporting wheels connected to the upper end of the supporting frame, the third lifting power member can drive the supporting frame to rise and fall, so that the supporting wheels pass through the transmission device and protrude upward. When the supporting frame is lifted, the circuit board on the transmission roller is transferred to the supporting wheel, and when the positioning device pushes the circuit board, the circuit board moves left and right safely and stably.

[0012] According to some embodiments of the present invention, the polishing device includes a protective box, the transmission device passes through the protective box, a polishing chamber and a first dewatering chamber are provided in the protective box, the polishing chamber and the first dewatering chamber are arranged in sequence along the plate transmission direction, the polishing chamber is also provided with a spray assembly, the first dewatering chamber is provided with a dewatering assembly for wiping and dewatering the plate on the transmission device, the dewatering assembly includes a wiping roller, the outer layer of the wiping roller peripheral wall is made of soft water-absorbing material, the outer layer of the transmission roller peripheral wall is made of hard material, the wiping rollers are arranged one by one above the transmission roller, and the outer layer of the wiping roller peripheral wall can abut the outer layer of the transmission roller peripheral wall. Wiping water is removed in the first dewatering chamber; when the circuit board is not entered between the wiping roller and the transmission roller, the soft water-absorbing material on the peripheral wall of the wiping roller can abut against the hard transmission roller, and the wiping roller gradually rotates, and the soft water-absorbing material gradually dehydrates; the circuit board enters between the wiping roller and the transmission roller, and the soft water-absorbing material can wipe the water on the circuit board after dehydration.

[0013] According to some embodiments of the present invention, a platen device is also included, the platen device includes a first platen assembly, a first swing assembly and a second platen assembly, the first platen assembly, the first swing assembly and the second platen assembly are sequentially arranged on the transmission path of the transmission device, the first platen assembly and the second platen assembly include a pressure roller arranged above the transmission device, and the first swing assembly is used to drive the plate on the transmission device to rotate around a vertical axis. In order to make the plate flatter and avoid bending and convexity of the plate, the plate is first rolled horizontally, then the plate is swinging, and then the plate is rolled longitudinally, so that the plate is relatively flat and has a high flatness.

[0014] According to some embodiments of the present invention, a dust removal device is also included on the transmission path of the transmission device, the dust removal device is higher than the transmission device, the dust removal device includes a raw material cylinder, an abutment cylinder and a reel, the tape pulled out of the raw material cylinder bypasses the lower end area of ​​the peripheral wall of the abutment cylinder, and then is reeled on the reel, and the reel is connected to a reeling power member. The fifth lifting power member drives the abutment cylinder to move downward, so that the tape wound on the lower end area of ​​the abutment cylinder can abut the plate on the transmission device, and the tape then sticks to and removes dust on the plate; dust is removed by adhesive, and the dust-sticky part of the tape is rolled up by the reel, and the tape used for dust sticking is continuously updated, and the dust removal device is not easy to cause secondary pollution to the plate, and the plate is relatively tidy.

[0015] According to some embodiments of the present invention, a cache device is further included, which is arranged on the transmission path of the transmission device. The cache device includes a lifting frame and a fourth lifting power component for driving the lifting frame to lift and lower. The lifting frame includes at least two vertical frames arranged in the front-to-back direction, and the vertical frames pass through between the two transmission rollers. At least two supporting rods are arranged on the vertical frames in the up-and-down direction, and the supporting rods of the two vertical frames correspond to each other one by one. A buffer device is arranged between two of the workstations, for example, a buffer device is arranged between the polishing device and the dust removal device, between the dust removal device and the marking device, and between the marking device and the film pasting device; the plate is transmitted on the transmission roller, and when the plate needs to be cached, the lifting frame rises to a certain height, and the plate originally on the transmission roller is lifted and cached by the supporting rod, and the upper and lower distances between the transmission roller and the nearest supporting rod above it form a gap that allows the circuit board to be introduced and passed; when the cached circuit board needs to be released, the lifting frame descends to a certain height, and the plate is placed on the transmission roller, and the transmission roller rolls, so that the plate can be transmitted away; the combined structure of the transmission roller and the lifting frame is flexibly arranged, and the design of one of them will not cause the other to be unable to move, so that the circuit board can be flexibly transmitted and cached between the two processes.

[0016] According to the circuit board processing process of the second embodiment of the present invention, the circuit board is transmitted on the transmission device and passes through the pressing device, the chip removal device, the dust removal device and the film sticking device in sequence. The process includes the following steps:

[0017] The whole board and the circuit board are transferred to the pressing device, and the pressing roller presses the circuit board;

[0018] Chip removal: The circuit board is transferred into the chip removal device, and the top layer and the bottom layer of the circuit board are electrically connected to the first electrode and the second electrode of the working power supply respectively. The electrical circuit is formed, and the wire scraps conducted between the top layer and the bottom layer of the circuit board generate resistance heat, and the wire scraps are melted away by heat;

[0019] Dust removal: the circuit board is passed into the dust removal device, which removes dust from the surface of the circuit board;

[0020] Film pasting: the circuit board is transferred into the film pasting device, and the film pasting device covers the circuit board with a protective film.

[0021] The circuit board processing process according to the embodiment of the present invention has at least the following beneficial effects: the first electrode, the circuit board metal base layer, the debris, the circuit board copper layer and the second electrode form an energized circuit, the debris belongs to the high resistance link in the electrical circuit and generates high heat, the debris melts and falls off, and the hidden danger of debris between the metal base layer and the copper layer is eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 This is a structural schematic diagram of a plate processing line according to an embodiment of the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram showing the structure of a first pressing plate assembly or a second pressing plate assembly of a plate processing line;

[0025] Figure 3 for Figure 1 A schematic diagram showing the structure of a first swing assembly or a second swing assembly of a plate processing line;

[0026] Figure 4 for Figure 1 Schematic diagram showing the structure of the chip removal device and the positioning device of the plate processing line Figure 1 ;

[0027] Figure 5 for Figure 1 Schematic diagram showing the structure of the chip removal device and the positioning device of the plate processing line Figure 2 ;

[0028] Figure 6 for Figure 1 A schematic diagram showing the structure of the support assembly of the plate processing line;

[0029] Figure 7 for Figure 1 A schematic diagram showing the structure of a polishing device for a plate processing line;

[0030] Figure 8 for Figure 7 A schematic diagram showing the structure of a polishing roller and a transmission roller of a polishing device;

[0031] Fig. 9 for Figure 1 A schematic diagram showing the structure of a dust removal device for a plate processing line;

[0032] Fig.10 for Fig. 9 A schematic diagram showing the structure of a raw material cylinder, abutment cylinder and winding cylinder of a dust removal device;

[0033] Fig.11 for Figure 1 A schematic diagram showing the structure of a marking device for a plate processing line;

[0034] Fig.12 for Figure 1 A schematic diagram showing the structure of a buffer device for a plate processing line;

[0035] Fig.13 for Fig.12 An exploded view of a cache device is shown;

[0036] Fig.14 for Fig.12 A schematic diagram showing the structure of two upright frames of a cache device;

[0037] Fig.15 for Figure 1 A schematic structural diagram of a film laminating device of a plate processing line is shown.

[0038] Transmission device 100, transmission roller 110;

[0039] The pressing plate device 200, the first pressing plate assembly 210, the pressing roller 211, the first swinging assembly 220, the second bracket 221, the swinging power member 222, the rotating frame 223, the suction nozzle member 224, the second pressing plate assembly 230, and the second swinging assembly 240;

[0040] Chip removal device 300, electric contact 310, first lifting power member 320, stopper assembly 330;

[0041] The positioning device 400, the push plate 410, the pushing force member 420, the support rod 430, the supporting assembly 440, the supporting frame 441, the third lifting power member 442, and the supporting wheel 443;

[0042] Polishing device 500, protection box 510, polishing chamber 511, first dewatering chamber 512, second dewatering chamber 513, polishing roller 520, spray assembly 530, wiping roller 540, drying assembly 550;

[0043] Dust removal device 600, raw material cylinder 610, abutting cylinder 621, fifth lifting power member 622, winding cylinder 630;

[0044] Marking device 700;

[0045] Buffer device 800, lifting frame 810, stand frame 811, support rod 811a, fourth lifting power member 820;

[0046] Film sticking device 900 , original film cylinder 910 , film sticking cylinder 920 , film cutting assembly 930 , sixth lifting power member 940 , suction hole 921 . DETAILED DESCRIPTION

[0047] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0048] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0049] In the description of the present invention, "several" means one or more, and "more" means more than two. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0050] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0051] The transmission path of the transmission device 100 is the transmission direction of the plate, which can be referred to Figures 2 to 14 The direction from front to back.

[0052] Reference Figure 1 , Figure 4 and Figure 5 A plate processing line according to an embodiment of the first aspect of the present invention includes a transmission device 100 and a chip removal device 300 arranged on the transmission path of the transmission device 100. The transmission device 100 is used to transmit the plate. The chip removal device 300 includes two electric contact components. The electric contact components include an electric contact 310 made of a conductive material and a first lifting power component 320 for driving the electric contact 310 to rise and fall. The two electric contacts 310 are respectively electrically connected to two electrodes of a working power supply and are respectively used to abut the top layer and the bottom layer of the plate.

[0053] The electric contact 310 is generally arranged in a needle shape, a block shape, etc. The first lifting power member 320 can be simply a cylinder, and the electric contact 310 is connected to the cylinder piston rod. The electric contact 310 is a metal conductive material, and the cylinder piston rod is an insulating material, or the electric contact 310 is connected through an insulating material.

[0054] For the circuit board, assuming that the circuit board on the transmission device 100 has a copper layer on the top and a metal base layer on the bottom, then one electric contact 310 abuts the copper layer downward, and the copper layer is connected to the first electrode of the working power supply (such as the positive pole of direct current, the live wire of the AC power supply), and the other electric contact 310 abuts the metal base layer upward, and the metal base layer is connected to the second electrode of the working power supply (such as the negative pole of direct current, the neutral wire of the AC power supply). The first electrode (such as the positive pole of direct current), the copper layer, the debris, the metal base layer and the second electrode (such as the negative pole of direct current) form an electrical circuit. The debris belongs to the high resistance link in the electrical circuit and generates high heat. The debris melts off, and the debris between the top and bottom layers of the circuit board is eliminated.

[0055] A sheet processing line according to an embodiment of the present invention has at least the following beneficial effects: the sheet includes a top layer and a bottom layer, and the top layer and the bottom layer are metal conductive layers, and there is an insulating layer between the top layer and the bottom layer, and the sheet processing line of the present invention is applied to such sheets; when the sheet stays on the transmission device 100 or is transmitted on the transmission device 100, one electric contact 310 abuts downward against the top layer of the sheet to connect the top layer of the sheet to the first electrode of the working power supply, and another electric contact 310 abuts upward against the bottom layer of the sheet to connect the bottom layer of the sheet to the second electrode of the working power supply, and because there is debris conduction between the top layer and the bottom layer of the sheet, the first electrode, the top layer, the debris, the bottom layer and the second electrode form an energized circuit, the debris belongs to the large resistance link in the electrical circuit, generates high heat, the debris melts off, and the debris between the top layer and the bottom layer of the sheet is eliminated.

[0056] It is understandable that the plate processing line is long, so the transmission device is long, and the transmission device is divided into multiple sections. Each section includes multiple transmission rollers and corresponding transmission power parts; or each section includes a corresponding transmission belt and its transmission power parts.

[0057] Reference Figure 3 , Figure 4 , Figure 5 , Figure 7 , Fig. 9 , Fig.11 , Fig.12 and 13In some embodiments of the present invention, the transmission device 100 includes a plurality of transmission rollers 110 arranged side by side in the front-to-back direction, and the transmission rollers 110 are connected to the transmission power member, and the electric contact 310 for contacting the bottom layer of the plate can pass through the gap between two transmission rollers 110. The transmission mode of setting the transmission rollers 110 is that the electric contact component for contacting the bottom layer of the plate can be hidden under the transmission device 100, and the electric contact 310 of the electric contact component can pass through the gap between the two transmission rollers 110 and contact the bottom layer of the plate. In one setting, a driven gear is provided at the end of the transmission roller 110, and a driving gear is provided at the end of the output shaft of the transmission power member, and two adjacent driven gears are meshed, and at least one driven gear is meshed with the driving gear; in another setting, a sprocket is provided at the end of the transmission roller 110, and a sprocket is also provided at the end of the output shaft of the transmission power member, and the chain is wound around these sprockets.

[0058] In some embodiments of the present invention, the transmission device 100 includes a transmission power member, a transmission belt, and a plurality of rollers, the front end and the rear end of the transmission belt are wound around the corresponding rollers; the transmission power member can be a motor, a pneumatic motor, a hydraulic motor, etc., and the roller is connected to the rotating shaft of the transmission power member by transmission. For example, the ends of the roller and the ends of the rotating shaft of the transmission power member are provided with gears, and the gears are meshed for transmission; for another example, the ends of the roller and the ends of the rotating shaft of the transmission power member are provided with sprockets, and chains are wound around the sprockets.

[0059] Reference Figure 4 and Figure 5 In some embodiments of the present invention, the chip removal device 300 further includes a stopper assembly 330. The electric contact assembly and the stopper assembly 330 are sequentially arranged on the transmission path of the transmission device 100. The stopper assembly 330 includes a second lifting power member and a stopper plate connected to the second lifting power member. The second lifting power member is used to drive the stopper plate to rise and fall. When the plate is transferred to the position between the two electric contact assemblies, the stopper assembly 330 stops the plate, and the transmission device 100 cannot drive the plate to be transferred forward. At this time, the chips can be removed by hot melting; or, when the plate is transferred to the position between the two electric contact assemblies, the transmission device 100 is paused, and the stopper assembly 330 stops the plate to prevent the plate from moving forward by inertia.

[0060] Reference Figure 1 , Figure 4 , Figure 5 and Figure 7In some embodiments of the present invention, a polishing device 500 and a positioning device 400 are further included. The positioning device 400 and the polishing device 500 are sequentially arranged on the transmission path of the transmission device 100. The polishing device 500 includes a polishing roller 520 arranged above the transmission device 100 and a polishing power member connected to the polishing roller 520. The polishing roller 520 extends in the left-right direction. The positioning device 400 is used to drive the plate on the transmission device 100 to move left and right. The polishing roller 520 extends in the left-right direction, that is, the axial direction of the polishing roller 520 is in the left-right direction. The positioning device 400 drives the plate to move left a little, then the left section on the polishing roller 520 is used, and the positioning device 400 drives the plate to move right a little, then the right section on the polishing roller 520 is used, the left section and the right section on the polishing roller 520 are used alternately, the polishing roller 520 is fully used, and the polishing roller 520 is evenly worn.

[0061] The polishing power part can be simply an electric motor, a hydraulic motor, a pneumatic motor, etc. The polishing roller 520 is connected to the output shaft of the polishing power part through a gear, a belt or a chain.

[0062] Reference Figure 4 and Figure 5 In some embodiments of the present invention, the positioning device 400 includes a push plate 410 higher than the transmission device 100, a pushing force member 420 connected to the push plate 410, and a support rod 430 connecting the push plate 410 and the pushing force member 420. The pushing force member 420 is arranged below the transmission device 100, and the support rod 430 passes through the transmission device 100 upward. The pushing force member 420 can be arranged below the transmission device 100 in a hidden manner, and the arrangement of the pushing force member 420 will not hinder the operating space above the transmission device 100.

[0063] In some embodiments of the present invention, the positioning device 400 is a method of first sucking the plate and then transferring it. The positioning device 400 includes a material transfer rack, a suction nozzle arranged at the lower end of the material transfer rack, and a material transfer power structure for driving the material transfer rack to move. The material transfer power structure can refer to the XYZ axis structure or the robot method.

[0064] Reference Figures 4 to 6 In some embodiments of the present invention, the positioning device 400 further includes a supporting assembly 440, which includes a supporting frame 441, a third lifting power member 442 for driving the supporting frame 441 to move up and down, and at least three supporting wheels 443 connected to the upper end of the supporting frame 441. The third lifting power member 442 can drive the supporting frame 441 to move up and down, so that the supporting wheels 443 protrude upward through the transmission device 100. When the supporting frame 441 is lifted, the circuit board on the transmission roller 110 is transferred to the supporting wheels 443. When the positioning device 400 pushes the circuit board, the circuit board moves left and right safely and stably.

[0065] Reference Figure 7 and Figure 8 In some embodiments of the present invention, the polishing device 500 includes a protective box 510, and the transmission device 100 passes through the protective box 510. The protective box 510 is provided with a polishing chamber 511 and a first dewatering chamber 512. The polishing chamber 511 and the first dewatering chamber 512 are arranged in sequence along the plate transmission direction. The polishing chamber 511 is also provided with a spray assembly 530. The first dewatering chamber 512 is provided with a dewatering assembly for wiping and dewatering the plate on the transmission device 100. The dewatering assembly includes a wiping roller 540. The outer layer of the peripheral wall of the wiping roller 540 is made of a soft water-absorbing material, and the outer layer of the peripheral wall of the transmission roller 110 is made of a hard material. The wiping rollers 540 are arranged one by one above the transmission roller 110, and the outer layer of the peripheral wall of the wiping roller 540 can abut against the outer layer of the peripheral wall of the transmission roller 110. Wiping dewatering is adopted in the first dewatering chamber 512; refer to Figure 8 When the wiping roller 540 and the transmission roller 110 do not enter the circuit board, the soft water-absorbing material on the peripheral wall of the wiping roller 540 can abut against the hard transmission roller 110, and the wiping roller 540 gradually rotates, and the soft water-absorbing material gradually dehydrates. Figure 8 A; between the wiping roller 540 and the transmission roller 110, the soft water-absorbing material enters the circuit board. After dehydration, the soft water-absorbing material can wipe the water on the circuit board. The spray assembly 530 includes a water pipe and a plurality of nozzles connected to the water pipe. The nozzle sprays liquid toward the plate on the transmission device 100, and the cleaning liquid, clean water, etc. are sprayed onto the plate through the nozzle. A drainage hole is provided at the lower end of the protective box 510.

[0066] The polishing structure is arranged in the protective box 510, and polishing is not likely to cause dust, and the circuit board after polishing is not likely to be polluted by the outside world.

[0067] The soft water-absorbing material can be sponge, paper cotton, cotton fiber and other materials; the outer layer of the transmission roller 110 is a hard material, for example, the transmission roller 110 is a metal part as a whole, an integrally formed iron part, aluminum part, stainless steel part, resin part and the like.

[0068] Reference Figure 7In some embodiments of the present invention, a second dewatering chamber 513 is further provided in the protective box 510, and the polishing chamber 511, the first dewatering chamber 512 and the second dewatering chamber 513 are sequentially arranged along the plate transmission direction, and a drying component 550 and / or an air-drying component is arranged in the second dewatering chamber 513. After polishing and spraying, the circuit board can be quickly dewatered, and most of the water is removed by wiping, and then dried and / or air-dried. The drying component 550 includes a heating element, which can be a heating lamp, a UV lamp, an electric heating wire, etc. The heating element heats up the second dewatering chamber 513; or, the heating element is arranged in the transmission roller 110, directly heats up the transmission roller 110, and the transmission roller 110 directly heats up the circuit board. The air-drying component includes a fan, which blows air toward the plate on the transmission device 100, and an air outlet connected to the second dewatering chamber 513 is arranged on the protective box 510.

[0069] Reference Figure 1 and Figure 2 In some embodiments of the present invention, a platen device 200 is further included. The platen device 200 includes a first platen assembly 210, a first swing assembly 220, a second platen assembly 230, and a second swing assembly 240. The first platen assembly 210, the first swing assembly 220, the second platen assembly 230, and the second swing assembly 240 are sequentially arranged on the transmission path of the transmission device 100. The first platen assembly 210 and the second platen assembly 230 both include a pressure roller 211 arranged above the transmission device 100. The first swing assembly 220 is used to drive the plate on the transmission device 100 to rotate around a vertical axis. In order to make the plate flatter and avoid bending and convexity of the plate, the plate is first rolled horizontally, then the plate is swung, and then the plate is rolled longitudinally. The plate is relatively flat and has a higher flatness. The second swing assembly 240 also drives the plate to rotate, such as resetting.

[0070] The pressure roller 211 may not be connected to the rolling power part, and the transmission device drives the plate to move, and the pressure roller 211 rolls on the plate. The pressure roller 211 may also be connected to the rolling power part through a gear system, a belt, a chain, etc. The rolling power part may be a motor, a hydraulic motor, a pneumatic motor, etc. The pressure plate assembly also includes a first bracket and a height adjustment structure disposed on the first bracket. The pressure roller 211 is connected to the first bracket through the height adjustment structure, and both ends of the pressure roller 211 are movably connected to the first bracket. The height adjustment structure is used to drive the pressure roller 211 to rise and fall on the first bracket.

[0071] Reference Figure 3The second swing assembly 220 and the second swing assembly 240 both include a second bracket 221, a swing power member 222, a rotating frame 223, and a plurality of suction nozzle members 224 arranged at the lower end of the rotating frame 223; the suction nozzle member 224 is connected to a suction power member, such as a negative pressure fan, a negative pressure valve, etc.; the swing power member 222 is connected to the second bracket 221, and the rotating frame 223 is connected to the swing power member 222. The swing power member 222 can be a motor, a pneumatic motor, a hydraulic motor, etc.

[0072] Reference Figure 1 , Fig. 9 and Fig.10 In some embodiments of the present invention, a dust removal device 600 is further included, which is arranged on the transmission path of the transmission device 100. The dust removal device 600 is higher than the transmission device 100. The dust removal device 600 includes a raw material barrel 610, an abutment barrel 621 and a winding barrel 630. The adhesive tape pulled out of the raw material barrel 610 bypasses the lower end area of ​​the peripheral wall of the abutment barrel 621 and is then wound on the winding barrel 630. The abutment barrel 621 is connected to a fifth lifting power member 622, and the winding barrel 630 is connected to a winding power member. Fig.10 In the diagram, the sheet transmission direction is the V direction. The fifth lifting power member 622 drives the abutting cylinder 621 to move downward, and the adhesive tape wound on the lower end area of ​​the abutting cylinder 621 can abut the sheet on the transmission device 100, and the adhesive tape then removes the dust on the sheet; the adhesive tape is used for dust removal, and the dust-adhered part of the adhesive tape is wound up by the winding cylinder 630, and the adhesive tape used for dust removal is continuously updated, so that the dust removal device 600 is not easy to cause secondary pollution to the sheet, and the sheet is relatively clean.

[0073] The winding power part can be simply a motor, a pneumatic motor, or a hydraulic motor. The raw material barrel 610 can be connected to a damping part or a motor; for example, the outer wall of one end of the raw material barrel 610 abuts against a damping plate / brake sleeve, and the damping plate is used to hinder the rotation of the raw material barrel 610. When dust is not required, the winding barrel 630 does not rotate, and the raw material barrel 610 does not pull out new tape; for another example, the raw material barrel 610 is connected to the rotating shaft of the corresponding motor. When dust is required, the motor corresponding to the raw material barrel 610 and the motor corresponding to the winding barrel 630 start to rotate together.

[0074] Reference Figure 1 and Fig.11In some embodiments of the present invention, a marking device 700 is further included, which is arranged on the transmission path of the transmission device 100. The marking device 700 is arranged above the transmission device 100 and is used to engrave images and texts on the plate. The marking device 700 can be a pneumatic marking method, and the marking device 700 includes a pneumatic marking component and a shifting component connected to the pneumatic marking component. The shifting component is used to move the pneumatic marking component. The pneumatic marking component includes a marking needle, a cylinder for driving the marking needle to descend, and an elastic member for driving the marking needle to rise and reset; the shifting component can be an XY biaxial shifting mechanism, or a manipulator. The marking device 700 can also be a laser marking method, and the marking device 700 includes a laser emitter and a shifting component connected to the laser emitter.

[0075] Reference Figure 1 and Fig.15 In some embodiments of the present invention, a film sticking device 900 is further included, which is arranged on the transmission path of the transmission device 100. The film sticking device 900 includes an original film cylinder 910, a film sticking cylinder 920 and a film cutting assembly 930. The film cutting assembly 930, the film sticking cylinder 920 and the original film cylinder 910 are arranged in sequence from front to back. The film sticking cylinder 920 is connected to a sixth lifting power member 940. A suction hole 921 is arranged at the lower end area of ​​the peripheral wall of the film sticking cylinder 920. The suction hole 921 is connected to a suction power member. The film sticking cylinder 920 is also connected to a sixth lifting power member 940.

[0076] In some processes, both the top and bottom surfaces of the plate need to be filmed. In some embodiments of the present invention, the film-applying device 900 includes a first film-applying component, a flipping component, and a second film-applying component, which are sequentially arranged along the transmission path of the transmission device 100. The first film-applying component and the second film-applying component both include an original film cylinder 910, a film-applying cylinder 920, and a film-cutting component 930.

[0077] Reference Figure 1 , Figure 12 to Figure 14In some embodiments of the present invention, a cache device 800 is further included, which is arranged on the transmission path of the transmission device 100. The cache device 800 includes a lifting frame 810 and a fourth lifting power member 820 for driving the lifting frame 810 to rise and fall. The lifting frame 810 includes at least two vertical frames 811 arranged in the front-to-back direction. The vertical frames 811 pass through between two transmission rollers 110. At least two supporting rods 811a are arranged on the vertical frames 811 in the up-down direction, and the supporting rods 811a of the two vertical frames 811 correspond to each other one by one. A buffer device is arranged between two workstations, for example, a buffer device is arranged between the polishing device 500 and the dust removal device 600, between the dust removal device 600 and the marking device 700, and between the marking device and the film-sticking device 900; the plate is transmitted on the transmission roller 110, and when the plate needs to be cached, the lifting frame 810 rises to a certain height, and the plate originally on the transmission roller 110 is lifted and cached by the supporting rod 811a, and the upper and lower spacing between the transmission roller 110 and the nearest supporting rod 811a above it forms a gap that allows the circuit board to be introduced and passed; when the cached circuit board needs to be released, the lifting frame 810 descends to a certain height, and the plate is placed on the transmission roller 110, and the plate can be transmitted by rolling; the combined structure of the transmission roller 110 and the lifting frame 810 is flexibly arranged, and the design of one of them will not cause the other to be unable to move, and the circuit boards can be flexibly transmitted and cached between the two processes.

[0078] Reference Fig.14 At least two supporting rods 811a are arranged in the vertical direction on the frame 811, and the supporting rods 811a of the two frames 811 correspond to each other. A1 rod, A2 rod, A3 rod and A4 rod are arranged in the vertical direction on one frame 811, and B1 rod, B2 rod, B3 rod and B4 rod are arranged in the vertical direction on the other frame 811, A1 rod corresponds to B1 rod, A2 rod corresponds to B2 rod, A3 rod corresponds to B3 rod, and A4 rod corresponds to B4 rod.

[0079] Reference Figure 12 to Figure 13 In some embodiments of the present invention, a guide structure is connected between the lifting frame 810 and the frame, and the lifting frame 810 can be lifted and lowered along the guide structure under the drive of the fourth lifting power member 820. Under the guidance of the guide structure, the lifting frame 810 is stably lifted and lowered and is not easily skewed, and the fourth lifting power member 820 works easily and stably. The guide structure is a guide rod or a guide rail, etc.

[0080] The first lifting power component 320, the second lifting power component, the third lifting power component 442, the fourth lifting power component 820, the fifth lifting power component 622, and the sixth lifting power component 940 can all be simply cylinders, hydraulic cylinders, electric cylinders, etc., and the piston rod of the cylinder body is connected to the corresponding characteristic structure of the driven lifting; it can also be a combination design of a motor and a screw nut pair, or a combination setting of a motor and a belt; of course, it can also be others.

[0081] According to the circuit board processing process of the second embodiment of the present invention, the circuit board is transmitted on the transmission device 100 and passes through the pressing device 200, the chip removal device 300, the dust removal device 600 and the film sticking device 900 in sequence. The process includes the following steps:

[0082] The whole board, the circuit board is transferred into the pressing device 200, and the pressing roller 211 rolls the circuit board;

[0083] Debris removal: the circuit board is introduced into the debris removal device 300, the top layer and the bottom layer of the circuit board are electrically connected to the first electrode and the second electrode of the working power supply respectively, the electrical circuit is formed, and the wire scraps conducted between the top layer and the bottom layer of the circuit board generate resistance heat, and the wire scraps are melted away by heat;

[0084] Dust removal: the circuit board is passed into the dust removal device 600, and the dust removal device 600 removes dust on the surface of the circuit board;

[0085] Film pasting: the circuit board is transferred into the film pasting device 900, and the film pasting device 900 applies a protective film to the circuit board.

[0086] Fig.15 In the diagram, the circuit board transmission direction is the V direction. In the film pasting step, when the head end of the circuit board is transferred to the bottom of the film pasting cylinder 920, the sixth lifting power member 940 drives the film pasting cylinder 920 to descend, the suction hole 921 releases the protective film, and the film pasting cylinder 920 drives the protective film to the circuit board. After the protective film is pasted on the head end of the circuit board, the film pasting cylinder 920 is lifted up, the circuit board continues to move and the circuit board continues to film. After the protective film is pasted on the end of the circuit board (the end of the circuit board just passes over the film pasting cylinder 920), the film pasting cylinder 920 moves down and absorbs the protective film, and then the cutting knife of the film cutting assembly 930 slides in the left and right directions, and the cutting knife cuts the protective film.

[0087] In this process, the chip removal step also includes a detection step, in which two electric pens of the resistance detection device are electrically connected to the top layer and the bottom layer of the circuit board respectively, and the resistance value between the top layer and the bottom layer of the circuit board is detected to determine whether the wire chips between the top layer and the bottom layer are completely melted.

[0088] In this process, a polishing step is also included before the dust removal step. The circuit board is placed in the polishing device 500, the polishing roller 520 rolls and polishes on the circuit board, and the nozzle sprays the cleaning liquid toward the circuit board.

[0089] In this process, a marking step is also included before the film-sticking step. The marking device 700 engraves images and texts for identification on the circuit board, such as trademarks, models, serial numbers, QR codes, bar codes, etc.

[0090] In this process, a buffer device is provided between the polishing device 500 and the dust removal device 600 , between the dust removal device 600 and the marking device 700 , and / or between the marking device and the film sticking device 900 .

[0091] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A sheet processing line, characterized in that: include: A transmission device (100), used for transmitting the plate; A chip removal device (300) disposed on a transmission path of the transmission device (100), comprising two electric contact components, the electric contact components comprising an electric contact (310) made of a conductive material and a first lifting power component (320) for driving the electric contact (310) to rise and fall, the two electric contacts (310) being respectively electrically connected to two electrodes of a working power source and respectively used to abut against a top layer and a bottom layer of the plate; The transmission device (100) comprises a plurality of transmission rollers (110) arranged side by side in a front-to-back direction, the transmission rollers (110) being drivingly connected to a transmission power member, and the electric contact (310) for contacting the bottom layer of the plate can pass through a gap between two of the transmission rollers (110); It also comprises a polishing device (500) and a positioning device (400), the positioning device (400) and the polishing device (500) being arranged in sequence on the transmission path of the transmission device (100), the polishing device (500) comprising a polishing roller (520) arranged above the transmission device (100), the polishing roller (520) extending in the left-right direction, and the positioning device (400) being used to drive the plate on the transmission device (100) to move left-right; The polishing device (500) comprises a protective box (510), the transmission device (100) passes through the protective box (510), the protective box (510) is provided with a polishing chamber (511) and a first dewatering chamber (512), the polishing chamber (511) and the first dewatering chamber (512) are arranged in sequence along the plate transmission direction, the polishing chamber (511) is also provided with a spray assembly (530), the first dewatering chamber (512) is provided with a dewatering assembly for wiping and dewatering the plate on the transmission device (100), the dewatering assembly comprises a wiping roller (540), the outer layer of the peripheral wall of the wiping roller (540) is a soft water-absorbing material The outer layer of the peripheral wall of the transmission roller (110) is made of a hard material, the wiping rollers (540) are arranged one by one above the transmission roller (110), and the outer layer of the peripheral wall of the wiping roller (540) can abut the outer layer of the peripheral wall of the transmission roller (110), the lower end of the protection box (510) is provided with a drainage hole, and the polishing structure is arranged in the protection box (510); the protection box (510) is also provided with a second dewatering chamber (513), the polishing chamber (511), the first dewatering chamber (512) and the second dewatering chamber (513) are arranged in sequence along the plate transmission direction, and the second dewatering chamber (513) is provided with a drying component (550) and / or an air-drying component.

2. The plate processing line according to claim 1, characterized in that: The positioning device (400) comprises a push plate (410) higher than the transmission device (100), a pushing force member (420) connected to the push plate (410), and a support rod (430) connecting the push plate (410) and the pushing force member (420); the pushing force member (420) is arranged below the transmission device (100), and the support rod (430) passes through the transmission device (100) upwards.

3. The plate processing line according to claim 1, characterized in that: The positioning device (400) further comprises a supporting assembly (440), wherein the supporting assembly (440) comprises a supporting frame (441), a third lifting power member (442) for driving the supporting frame (441) to move up and down, and at least three supporting wheels (443) connected to the upper end of the supporting frame (441), wherein the third lifting power member (442) can drive the supporting frame (441) to move up and down, so that the supporting wheels (443) pass through the transmission device (100) and protrude upward.

4. The sheet material processing line according to claim 1, characterized in that: It also includes a pressure plate device (200), the pressure plate device (200) includes a first pressure plate assembly (210), a first swing assembly (220) and a second pressure plate assembly (230), the first pressure plate assembly (210), the first swing assembly (220) and the second pressure plate assembly (230) are arranged in sequence on the transmission path of the transmission device (100), the first pressure plate assembly (210) and the second pressure plate assembly (230) include a pressure roller (211) arranged above the transmission device (100), and the first swing assembly (220) is used to drive the plate on the transmission device (100) to rotate around a vertical axis.

5. The sheet material processing line according to claim 1, characterized in that: It also includes a dust removal device (600) arranged on the transmission path of the transmission device (100), the dust removal device (600) is higher than the transmission device (100), the dust removal device (600) includes a raw material barrel (610), an abutment barrel (621) and a reeling barrel (630), the adhesive tape pulled out of the raw material barrel (610) bypasses the lower end area of ​​the peripheral wall of the abutment barrel (621) and is then reeled onto the reeling barrel (630), and the reeling barrel (630) is connected to a reeling power member.

6. The sheet material processing line according to claim 1, characterized in that: It also includes a buffer device (800) arranged on the transmission path of the transmission device (100), the buffer device (800) including a lifting frame (810) and a fourth lifting power member (820) for driving the lifting frame (810) to rise and fall, the lifting frame (810) including at least two vertical frames (811) arranged in a front-to-back direction, the vertical frames (811) passing through between the two transmission rollers (110), at least two supporting rods (811a) arranged in an up-down direction on the vertical frames (811), and the supporting rods (811a) of the two vertical frames (811) correspond to each other one by one.

7. A circuit board processing process, using a board processing line as claimed in claim 1, characterized in that: The circuit board is transported on the transport device (100) and passes through the pressing device (200), the chip removal device (300), the dust removal device (600) and the film pasting device (900) in sequence. The process includes the following steps: The whole board, the circuit board, is passed into the pressing device (200), and the pressing roller (211) rolls the circuit board; Debris removal: the circuit board is passed into a debris removal device (300), the top layer and the bottom layer of the circuit board are electrically connected to the first electrode and the second electrode of the working power supply respectively, the electrical circuit is formed, and the wire scraps conducted between the top layer and the bottom layer of the circuit board generate resistance heat, and the wire scraps are melted away by the heat; Dust removal: the circuit board is passed into the dust removal device (600), and the dust removal device (600) removes dust on the surface of the circuit board; Film pasting: the circuit board is passed into the film pasting device (900), and the film pasting device (900) covers the circuit board with a protective film.

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