High-density integrated multi-beam tile components

Abstract

The present invention provides a high-density integrated multi-beam tile-type component, which belongs to the field of antenna technology, and includes a printed adapter board and a multi-channel multi-beam functional module chip; in the multi-channel multi-beam functional module chip, the signal amplification function layer is used to amplify the amplitude of the component communication information, and simulate the phase shift attenuation layer to the phase change and amplitude attenuation of the component communication information; in the printed adapter board, the multi-beam synthesis network is used to branch or combine the radio frequency channel signals connected to the network; the beam control circuit is used to send control signals to the amplitude and phase of each channel in the multi-beam component according to the system instruction, so as to realize the amplitude and phase change of each channel of the component. The high-density integrated multi-beam tile-type component provided by the present invention can realize the functional requirements of multi-channel multi-beam, realize the miniaturization, low profile, simplification of design and high integration of the multi-beam TR component, and can adjust the scale of the TR component according to actual needs to meet the system size, weight and versatility requirements.

Description

Technical Field

[0001] The present invention belongs to the field of antenna technology, and more specifically, relates to a high-density integrated multi-beam tile-type component. Background Art

[0002] The transceiver component (TR component) of the active phased array antenna is located between the antenna and the signal synthesis / decomposition network. Its main function is to amplify, phase shift and attenuate the microwave signal according to the external control signal. It is the core of the active phased array antenna system. In the multi-beam phased array antenna system, the TR component needs to be equipped with an independent amplitude and phase modulation and feeding unit for each beam signal. The more beam signals there are, the more amplitude and phase control devices and feeding networks are required. At the same time, the TR component has more RF interfaces, control interfaces and power supply interfaces interconnected with external components. Therefore, the traditional multi-beam phased array antenna has a complex design, low scalability, large size and weight, high assembly difficulty and high cost, which has caused many obstacles to practical applications and greatly limited the widespread application of multi-beam phased arrays. Summary of the invention

[0003] The purpose of the present invention is to provide a high-density integrated multi-beam tile-type component, aiming to solve the technical problems existing in the prior art of low integration, large volume and weight, high assembly difficulty and high application cost of TR components of multi-beam phased arrays.

[0004] To achieve the above object, the technical solution adopted by the present invention is: to provide a high-density integrated multi-beam tile component, comprising:

[0005] Printed interposer boards; and

[0006] There are multiple multi-channel multi-beam functional module chips, and the multiple multi-channel multi-beam functional module chips are surface-mounted on the printed transfer board;

[0007] The multi-channel multi-beam functional module chip includes:

[0008] A signal amplification functional layer, electrically connected to the printed transfer board, and used to amplify the amplitude of component communication information;

[0009] Simulating phase shift attenuation layers for component communication information phase change and amplitude attenuation; and

[0010] A connection layer is provided between the signal amplification function layer and the analog phase shift attenuation layer, and is electrically connected to the signal amplification function layer and the analog phase shift attenuation layer respectively, and is used for signal transmission, power supply and control between the signal amplification function layer and the analog phase shift attenuation layer;

[0011] The printed transfer board comprises:

[0012] substrate;

[0013] A multi-beam synthesis network, arranged on the substrate, comprising a plurality of independent beam networks, each beam network being electrically connected to the signal amplification functional layer and used for branching or combining radio frequency channel signals connected to the network;

[0014] A beam control circuit is disposed on the substrate, the beam control circuit is electrically connected to the signal amplification functional layer, and is used to send a control signal to the amplitude and phase of each channel in the multi-beam component according to a system instruction to achieve changes in the amplitude and phase of each channel of the component; and

[0015] The power supply circuit is arranged on the substrate and is used for power supply connection.

[0016] As another embodiment of the present application, a pad for electrically connecting to the printed transfer board is attached to the non-chip surface of the signal amplification functional layer.

[0017] As another embodiment of the present application, the connection layer is a square matrix solder joint structure.

[0018] As another embodiment of the present application, a first metal shielding cover plate is welded on the signal amplification functional layer, a second metal shielding cover plate is welded on the analog phase shift attenuation layer, and a low-loss sealing medium is filled between the signal amplification functional layer and the analog phase shift attenuation layer.

[0019] As another embodiment of the present application, the multi-beam synthesis network is arranged inside the substrate, the beam control circuit is surface-mounted on the substrate, and the power supply circuit is surface-mounted on the substrate.

[0020] As another embodiment of the present application, a radio frequency connector is also provided on the substrate. The radio frequency connector is distributed around the periphery of the multi-channel multi-beam functional module chip. The radio frequency connector is electrically connected to the signal amplification functional layer and is used to connect to a signal transceiver module to complete the input and output of radio frequency signals of the high-density integrated multi-beam tile-type component.

[0021] As another embodiment of the present application, the RF connectors are distributed in a rectangular array around the periphery of the multi-channel multi-beam functional module chip.

[0022] As another embodiment of the present application, the RF connector includes an ultra-small push-in RF coaxial connector.

[0023] As another embodiment of the present application, a plurality of the multi-channel multi-beam functional module chips are arranged on the printed transfer board in a rectangular array.

[0024] As another embodiment of the present application, the signal amplification functional layer and the analog phase shift attenuation layer are both multi-layer ceramic dielectric substrate structures.

[0025] The beneficial effect of the high-density integrated multi-beam tile-type component provided by the present invention is that compared with the prior art, the multi-channel multi-beam functional module chip in the high-density integrated multi-beam tile-type component of the present invention is a three-dimensional stacked structure, each multi-channel multi-beam functional module chip has a structure for amplifying the amplitude of the component communication information and a structure for phase change and amplitude attenuation of the component communication information, and a printed adapter board is provided with a circuit structure for branching or combining the RF channel signal of the network connection, a circuit structure for realizing the change of amplitude and phase of each channel of the component, and a circuit structure for power supply. The chip is surface-mounted on the printed adapter board, and then matched with the printed adapter board, so that the high-density integrated multi-beam tile-type component is fully functional and can achieve the functional requirements of multi-channel multi-beam, and can realize the miniaturization, low profile, simplification of design and high integration of the multi-beam TR component. Due to the use of the surface mounting process, the assembly is simple, and the scale of the TR component can be adjusted according to actual needs to meet the requirements of system size, weight and versatility, so that the high-density integrated multi-beam tile-type component of the present invention is more widely used. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 An exploded view of a high-density integrated multi-beam tile assembly provided by an embodiment of the present invention;

[0028] Figure 2 An exploded view of a multi-channel multi-beam functional module chip used in an embodiment of the present invention;

[0029] Figure 3 An exploded view of the assembly structure of the signal amplification functional layer and the first metal shielding cover plate used in an embodiment of the present invention;

[0030] Figure 4 for Figure 2 A schematic diagram of the structure of the middle signal amplification functional layer viewed from above;

[0031] Figure 5 An exploded view of the assembly structure of the simulated phase-shift attenuation layer and the second metal shielding cover plate used in an embodiment of the present invention;

[0032] Figure 6A schematic diagram of the three-dimensional structure of the connection layer used in an embodiment of the present invention;

[0033] Figure 7 A schematic diagram of a top view of a high-density integrated multi-beam tile assembly provided in an embodiment of the present invention;

[0034] Figure 8 A schematic diagram of the bottom-up structure of a high-density integrated multi-beam tile assembly provided in an embodiment of the present invention.

[0035] In the figure: 1. printed transfer board; 101. substrate; 2. multi-channel multi-beam functional module chip; 201. signal amplification functional layer; 202. analog phase shift attenuation layer; 203. connection layer; 3. pad; 4. first metal shielding cover plate; 5. second metal shielding cover plate; 6. RF connector DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] Please also read Figure 1 , Figure 2 , Figure 7 and Figure 8 The high-density integrated multi-beam tile-type component provided by the present invention is now described. The high-density integrated multi-beam tile-type component comprises a printed adapter board 1 and a multi-channel multi-beam functional module chip 2; the multi-channel multi-beam functional module chip 2 is provided with a plurality of multi-channel multi-beam functional module chips 2, and the plurality of multi-channel multi-beam functional module chips 2 are surface-mounted on the printed adapter board 1.

[0038] The multi-channel multi-beam functional module chip 2 includes a signal amplification functional layer 201, an analog phase shift attenuation layer 202 and a connection layer 203; the signal amplification functional layer 201 is electrically connected to the printed adapter board 1 and is used to amplify the amplitude of the component communication information; the analog phase shift attenuation layer 202 is used for the phase change and amplitude attenuation of the component communication information; the connection layer 203 is arranged between the signal amplification functional layer 201 and the analog phase shift attenuation layer 202, and is electrically connected to the signal amplification functional layer 201 and the analog phase shift attenuation layer 202 respectively, and is used for signal transmission, power supply and control between the signal amplification functional layer 201 and the analog phase shift attenuation layer 202;

[0039] The printed adapter board 1 includes a substrate 101, a multi-beam synthesis network, a beam control circuit and a power supply circuit; the multi-beam synthesis network is arranged on the substrate 101, including a plurality of independent beam networks, each beam network is electrically connected to the signal amplification function layer 201, and is used to branch or combine the radio frequency channel signal connected to the network; the beam control circuit is arranged on the substrate 101, the beam control circuit is electrically connected to the signal amplification function layer 201, and is used to send control signals to the amplitude and phase of each channel in the multi-beam component according to system instructions, so as to realize the change of the amplitude and phase of each channel of the component; the power supply circuit is arranged on the substrate 101, and is used for power supply connection.

[0040] Compared with the prior art, the high-density integrated multi-beam tile-type component provided by the present invention has a multi-channel multi-beam functional module chip 2 that is a three-dimensional stacked structure. Each multi-channel multi-beam functional module chip 2 has a structure for amplifying the amplitude of component communication information and a structure for phase change and amplitude attenuation of component communication information. The printed adapter board 1 is provided with a circuit structure for branching or combining the RF channel signal of the network connection, a circuit structure for realizing the change of amplitude and phase of each channel of the component, and a circuit structure for power supply. The chip is surface-mounted on the printed adapter board 1, and then combined with the printed adapter board 1, so that the high-density integrated multi-beam tile-type component is fully functional and can achieve the functional requirements of multi-channel multi-beam, and can achieve miniaturization, low profile, simplified design and high integration of the multi-beam TR component. Due to the use of the surface mounting process, the assembly is simple, and the scale of the TR component can be adjusted according to actual needs to meet the requirements of system size, weight and versatility, so that the high-density integrated multi-beam tile-type component of the present invention is more widely used.

[0041] Specifically, the multi-channel multi-beam functional module chip 2 in this embodiment can be a surface-mount module chip with four-channel multi-beam functions.

[0042] Specifically, the power supply circuit serves as the connection between the component and the external system power supply, that is, it is connected to the system power supply and the power supply terminal of the chip inside the component to provide the chip inside the component with the required voltage and current.

[0043] Specifically, the beam control circuit is electrically connected to the broadcast control circuit of the system and the control terminal of the RF channel amplitude and phase chip in the multi-channel multi-beam functional module chip 2 respectively.

[0044] As a specific implementation of the high-density integrated multi-beam tile assembly provided by the present invention, please refer to Figure 2 and Figure 4The non-chip surface of the signal amplification function layer 201 is provided with a pad 3 for electrical connection with the printed adapter board 1. The pad 3 is the circuit lead-out terminal of the multi-channel multi-beam function module chip 2. The multi-channel multi-beam function module chip 2 is integrally soldered to the printed adapter board 1 through the pad 3 to realize the surface mounting of the module chip, making the chip assembly simple and convenient, the assembly structure occupies a small space, and the assembly efficiency is improved, which is conducive to the miniaturization and simplification of the overall component.

[0045] As a specific implementation of the embodiment of the present invention, please refer to Figure 2 and Figure 6 , the connection layer 203 is a square solder joint structure. The electrical connection between the signal amplification function layer 201 and the analog phase shift attenuation layer 202 is realized by the square solder joint process, and the three-dimensional stacking of the multi-channel multi-beam function module chip 2 in the form of SIP is realized, so that the volume of the multi-channel multi-beam function module chip 2 is greatly reduced, and more multi-channel multi-beam function module chips 2 can be arranged on a printed adapter board 1, which is conducive to further improving the overall integration of the component, and then conducive to further miniaturization of the overall component.

[0046] As a specific implementation of the embodiment of the present invention, refer to Figure 2 , Figure 3 and Figure 5 A first metal shielding cover plate 4 is welded on the signal amplification function layer 201, a second metal shielding cover plate 5 is welded on the analog phase shift attenuation layer 202, and a low-loss sealing medium is filled between the signal amplification function layer 201 and the analog phase shift attenuation layer 202. A recessed structure is provided on the signal amplification function layer 201, and the chip component is arranged in the recessed structure. The first metal shielding cover plate 4 is used to achieve the shielding of the chip structure; the analog phase shift attenuation layer 202 is provided with a recessed structure, and the chip component is arranged in the recessed structure. The second metal shielding cover plate 5 is used to achieve the shielding of the chip structure. The above-mentioned metal cover plate structure occupies a small space and has a good shielding effect. In combination with the low-loss sealing medium, an airtight packaging structure is formed to ensure airtightness, so that the performance is stable and reliable.

[0047] As a specific implementation of an embodiment of the present invention, in order to fully utilize the substrate space, improve integration, and simplify the assembly process, the multi-beam synthesis network is arranged inside the substrate 101, the beam control circuit is surface-mounted on the substrate 101, and the power supply circuit is surface-mounted on the substrate 101.

[0048] Specifically, the beam control circuit is mounted on the back of the substrate 101. Figure 8 face shown.

[0049] As a specific implementation of the embodiment of the present invention, please refer to Figure 7In order to realize the connection between the component and other modules and make full use of the space on the printed adapter board 1, a radio frequency connector 6 is also provided on the substrate 101. The radio frequency connector 6 is distributed on the periphery of the multi-channel multi-beam functional module chip 2. The radio frequency connector 6 is electrically connected to the signal amplification functional layer 201 and is used to connect to the signal transceiver module (such as an antenna) to complete the input and output of the radio frequency signal of the high-density integrated multi-beam tile-type component.

[0050] As a specific implementation of the embodiment of the present invention, please refer to Figure 7 The RF connectors 6 are distributed in a rectangular array around the periphery of the multi-channel multi-beam functional module chip 2, which is beneficial to improving the flexibility and scalability of component design.

[0051] As a specific implementation of the present invention, the RF connector 6 comprises a subminiature push-in RF coaxial connector (SMP connector), which is small in size, light in weight, wide in bandwidth, and reliable in connection, and is conducive to miniaturization and high-integration design of components.

[0052] As a specific implementation of the embodiment of the present invention, please refer to Figure 1 and Figure 7 A plurality of multi-channel multi-beam functional module chips 2 are arranged on the printed adapter board 1 in a rectangular array, which is conducive to the expansion of components.

[0053] As a specific implementation of an embodiment of the present invention, the beam control circuit includes a field programmable gate array chip (FPGA chip), a memory chip, a crystal oscillator, and a voltage regulator chip. The field programmable gate array chip is electrically interconnected with the memory chip, the crystal oscillator, and the voltage regulator chip. The voltage regulator chip provides an operating voltage for the field programmable gate array chip, the crystal oscillator provides a clock reference for the field programmable gate array chip, and the memory chip provides data storage for the field programmable gate array chip. The field programmable gate array chip is also electrically connected to a multi-channel multi-beam function module chip to send the system's amplitude and phase control commands for each channel of the beam control.

[0054] As a specific implementation of the embodiment of the present invention, the signal amplification function layer 201 and the analog phase shift attenuation layer 202 are both multi-layer ceramic dielectric substrate structures. The multi-layer ceramic dielectric substrate structure enables the multi-channel multi-beam functional module chip 2 to integrate multiple amplifiers and analog amplitude and phase multi-channel chips. In order to improve the integration density, the multi-layer ceramic substrate structure is applied to perform a three-dimensional packaging circuit design on the chip to achieve a high isolation design between chips.

[0055] The high-density integrated multi-beam tile-type component of the present invention can be widely used in the field of microwave and millimeter-wave phased array satellite communications, and has very broad application value and applicable technical effects.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. High-density integrated multi-beam tile assembly, characterized in that: include: Printed adapter board; as well as There are multiple multi-channel multi-beam functional module chips, and the multiple multi-channel multi-beam functional module chips are surface-mounted on the printed transfer board; The multi-channel multi-beam functional module chip includes: A signal amplification functional layer, electrically connected to the printed transfer board, and used to amplify the amplitude of component communication information; Simulating phase shift attenuation layers for component communication information phase change and amplitude attenuation; and A connection layer is provided between the signal amplification function layer and the analog phase shift attenuation layer, and is electrically connected to the signal amplification function layer and the analog phase shift attenuation layer respectively, and is used for signal transmission, power supply and control between the signal amplification function layer and the analog phase shift attenuation layer; The printed transfer board comprises: substrate; A multi-beam synthesis network, arranged on the substrate, comprising a plurality of independent beam networks, each beam network being electrically connected to the signal amplification functional layer and used for branching or combining radio frequency channel signals connected to the network; A beam control circuit is disposed on the substrate, the beam control circuit is electrically connected to the signal amplification functional layer, and is used to send a control signal to the amplitude and phase of each channel in the multi-beam component according to a system instruction to achieve changes in the amplitude and phase of each channel of the component; and A power supply circuit, provided on the substrate, for power supply connection; A pad for electrical connection with the printed transfer board is attached to the non-chip surface of the signal amplification functional layer; The connecting layer is a square-array solder joint structure; A first metal shielding cover plate is welded on the signal amplifying functional layer, a second metal shielding cover plate is welded on the analog phase shift attenuation layer, and a low-loss sealing medium is filled between the signal amplifying functional layer and the analog phase shift attenuation layer.

2. The high-density integrated multi-beam tile assembly according to claim 1, characterized in that: The multi-beam synthesis network is arranged inside the substrate, the beam control circuit is surface-mounted on the substrate, and the power supply circuit is surface-mounted on the substrate.

3. The high-density integrated multi-beam tile assembly according to claim 1, characterized in that: A radio frequency connector is also provided on the substrate, and the radio frequency connector is distributed around the periphery of the multi-channel multi-beam functional module chip. The radio frequency connector is electrically connected to the signal amplification functional layer, and is used to connect to the signal transceiver module to complete the input and output of the radio frequency signal of the high-density integrated multi-beam tile-type component.

4. The high-density integrated multi-beam tile assembly as claimed in claim 3, characterized in that: The radio frequency connectors are distributed in a rectangular array around the periphery of the multi-channel multi-beam functional module chip.

5. The high-density integrated multi-beam tile assembly as claimed in claim 3, characterized in that: The radio frequency connector comprises an ultra-small push-in radio frequency coaxial connector.

6. The high-density integrated multi-beam tile assembly according to any one of claims 1 to 5, characterized in that: A plurality of the multi-channel multi-beam functional module chips are arranged on the printed transfer board in a rectangular array.

7. The high-density integrated multi-beam tile assembly according to any one of claims 1 to 5, characterized in that: The signal amplification function layer and the analog phase shift attenuation layer are both multi-layer ceramic dielectric substrate structures.

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