Thermoelectric modules

Abstract

According to the embodiment, the thermoelectric module includes: a first metal substrate including a first through hole; a first insulating layer provided on the first metal substrate; a first electrode portion provided on the first insulating layer and including a plurality of first electrodes; a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms provided on the first electrode portion; a second electrode portion provided on the plurality of P-type thermoelectric arms and the plurality of N-type thermoelectric arms and including a plurality of second electrodes; a second insulating layer provided on the second electrode portion; a second metal substrate provided on the second insulating layer and including a second through hole, wherein the first metal substrate includes an effective area provided with the first electrode portion and a peripheral area formed outside the effective area, the second metal substrate includes an effective area provided with the second electrode portion and a peripheral area formed outside the effective area, the first through hole occupies a portion of the effective area of ​​the first metal substrate, the second through hole occupies a portion of the effective area of ​​the second metal substrate, and the first through hole and the second through hole are formed at positions corresponding to each other.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 2019-0016245, filed on February 12, 2019, Korean Patent Application No. 2020-0007448, filed on January 20, 2020, and Korean Patent Application No. 2020-0015059, filed on February 7, 2020, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates to a thermoelectric module, and more particularly, to a coupling structure of a thermoelectric module. Background Art

[0004] The thermoelectric effect is a phenomenon that occurs due to the movement of electrons and holes in a material and refers to direct energy conversion between heat and electricity.

[0005] The thermoelectric element is generally referred to as an element utilizing the thermoelectric effect, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.

[0006] Thermoelectric elements can be divided into elements that utilize resistance changes according to temperature changes, elements that utilize the Seebeck effect (i.e., the phenomenon of generating electromotive force due to temperature difference), elements that utilize the Peltier effect (i.e., the phenomenon of heat absorption or heat release due to current), etc.

[0007] Thermoelectric elements have been variously applied to home appliances, electronic components, communication components, etc. For example, thermoelectric elements can be applied to cooling devices, heating devices, power generation devices, etc. Therefore, the demand for thermoelectric performance of thermoelectric elements is gradually increasing.

[0008] The thermoelectric element includes a substrate, electrodes, and thermoelectric legs. Multiple thermoelectric legs are arranged in an array between an upper substrate and a lower substrate. Multiple upper electrodes are arranged between the thermoelectric legs and the upper substrate. Multiple lower electrodes are arranged between the thermoelectric legs and the lower substrate.

[0009] One of the upper and lower substrates of a thermoelectric element becomes a high-temperature portion, while the other becomes a low-temperature portion. In this case, a temperature difference between the high-temperature and low-temperature substrates can cause thermal deformation in the high-temperature substrate, leading to stress concentration at the substrate bonding interface. As a result, delamination and cracking can occur at the bonding interface, potentially reducing product quality.

[0010] In particular, the edge of the high-temperature portion of the substrate is a portion where thermal deformation is greater than that of the central portion of the substrate. When the edge of the high-temperature portion of the substrate and the edge of the low-temperature portion of the substrate are coupled, stress concentration may increase at the bonding interface due to thermal deformation. Summary of the Invention

[0011] The present invention aims to provide a coupling structure of a thermoelectric module.

[0012] One aspect of the present invention provides a thermoelectric module, which includes: a first metal substrate including a first through hole; a first insulating layer arranged on the first metal substrate; a first electrode portion arranged on the first insulating layer and including a plurality of first electrodes; a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms arranged on the first electrode portion; a second electrode portion arranged on the plurality of P-type thermoelectric arms and the plurality of N-type thermoelectric arms and including a plurality of second electrodes; a second insulating layer arranged on the second electrode portion; and a second metal substrate arranged on the second insulating layer and including a second through hole, wherein the first metal substrate includes an effective area where the first electrode portion is provided and a peripheral area formed outside the effective area, the second metal substrate includes an effective area where the second electrode portion is provided and a peripheral area formed outside the effective area, the first through hole is provided in the effective area of ​​the first metal substrate, the second through hole is provided in the effective area of ​​the second metal substrate, and the first through hole and the second through hole are formed at positions corresponding to each other.

[0013] The thermoelectric module may further include a coupling member passing through the first through hole and the second through hole and fixing the first metal substrate and the second metal substrate.

[0014] The second metal substrate may be provided as a plurality of second metal substrates spaced apart from each other, and each of the second metal substrates may include at least one second through hole.

[0015] An insulating member may be provided between the plurality of second metal substrates spaced apart from each other.

[0016] The thickness of the insulating member may be smaller than that of the plurality of second metal substrates.

[0017] The length direction of some of the multiple first electrodes arranged on the first metal substrate can be different from the length direction of the remaining first electrodes, and the length direction of some of the multiple second electrodes arranged on the second metal substrate can be different from the length direction of the remaining second electrodes, wherein each length direction is the long width direction of each electrode.

[0018] Except for the first electrode in the edge region of the first electrode portion, at least two of the plurality of first electrodes may be arranged so that their length directions point in a second direction perpendicular to the first direction, and the remaining first electrodes may be arranged so that their length directions point in the first direction. Except for the second electrode in the edge region of the second electrode portion, at least two of the plurality of second electrodes may be arranged so that their length directions point in the second direction perpendicular to the first direction, and the remaining second electrodes may be arranged so that their length directions point in the first direction.

[0019] In addition to the first electrodes in the edge region, among the multiple first electrodes, the number of first electrodes arranged so that their length directions point to the second direction can be a multiple of two, and in addition to the second electrodes in the edge region, among the multiple second electrodes, the number of second electrodes arranged so that their length directions point to the second direction can be a multiple of two.

[0020] Among the plurality of second electrodes, at least part of the second electrodes arranged in two columns or two rows opposite to each other in the edge region may be arranged such that their length directions point in the second direction.

[0021] The first metal substrate may include a first hole arrangement area, the first hole arrangement area is a space formed by a virtual line connecting the surfaces of the first electrode closest to the first through hole and arranged adjacent to each other, the second metal substrate may include a second hole arrangement area, the second hole arrangement area is a space formed by a virtual line connecting the surfaces of the second electrode closest to the second through hole and arranged adjacent to each other, at least one first electrode adjacent to the first hole arrangement area may be arranged so that its length direction points to the second direction, and at least one second electrode adjacent to the second hole arrangement area may be arranged so that its length direction points to the second direction.

[0022] The first metal substrate may include a first hole arrangement area, the first hole arrangement area is a space formed by a virtual line connecting the surfaces of the first electrode closest to the first through hole and arranged adjacent to each other, the second metal substrate may include a second hole arrangement area, the second hole arrangement area is a space formed by a virtual line connecting the surfaces of the second electrode closest to the second through hole and arranged adjacent to each other, at least two of the multiple first electrodes can be arranged so that at least a portion thereof overlaps with a virtual space formed by an extension line extending from the virtual line defining the first hole arrangement area, and at least two of the multiple second electrodes can be arranged so that at least a portion thereof overlaps with a virtual space formed by an extension line extending from the virtual line defining the second hole arrangement area.

[0023] The first through hole may be provided as a plurality of first through holes, a first hole arrangement region may be formed around each of the plurality of first through holes, the second through hole may be provided as a plurality of second through holes, and a second hole arrangement region may be formed around each of the plurality of second through holes.

[0024] The plurality of first through holes and the plurality of second through holes may be formed at positions corresponding to each other.

[0025] The thermoelectric module may further include a third through hole formed in a peripheral region of the first metal substrate.

[0026] A ratio of an area of ​​the second metal substrate to an area of ​​the first metal substrate may be in a range of 0.5 to 0.95.

[0027] The thermoelectric module may further include an insulating insert member disposed adjacent to the coupling member.

[0028] The diameter of the first through hole may be different from the diameter of the second through hole.

[0029] The diameter of the second through hole may be 1.1 to 2.0 times the diameter of the first through hole.

[0030] A portion of the insulating insert member may be disposed in the second through hole.

[0031] The thermoelectric module may further include a third insulating layer disposed between the first metal substrate and the first insulating layer.

[0032] Another aspect of the present invention provides a power generation device, which includes a thermoelectric module and a cooling unit arranged on the surface of the thermoelectric module, wherein the thermoelectric module includes: a first metal substrate including a first through hole; a first insulating layer arranged on the first metal substrate; a first electrode portion arranged on the first insulating layer and including a plurality of first electrodes; a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms arranged on the first electrode portion; a second electrode portion arranged on the plurality of P-type thermoelectric arms and the plurality of N-type thermoelectric arms and including a plurality of second electrodes; a second insulating layer arranged on the second electrode portion; and a second metal substrate arranged on the second insulating layer and including a second through hole, wherein , the first metal substrate includes an effective area in which a first electrode portion is provided and a peripheral area formed outside the effective area, the second metal substrate includes an effective area in which a second electrode portion is provided and a peripheral area formed outside the effective area, the first through hole is provided in the effective area of ​​the first metal substrate, the second through hole is provided in the effective area of ​​the second metal substrate, and the first through hole and the second through hole are formed at positions corresponding to each other, wherein the thermoelectric module further includes a coupling member, the coupling member passes through the first through hole and the second through hole and fixes the first metal substrate and the second metal substrate, wherein the cooling unit is coupled to the first metal substrate, wherein a portion of the coupling member is provided in the cooling unit.

[0033] The temperature of the region associated with the first metal substrate may be lower than the temperature of the region associated with the second metal substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other objects, features and advantages of the present invention will become more apparent to those skilled in the art by describing in detail exemplary embodiments of the present invention with reference to the accompanying drawings, in which:

[0035] Figure 1 is a side view of a thermoelectric module according to a first exemplary embodiment of the present invention;

[0036] Figure 2 is a perspective view of a thermoelectric module according to a first exemplary embodiment of the present invention;

[0037] Figure 3 is an exploded perspective view of a thermoelectric module according to a first exemplary embodiment of the present invention;

[0038] Figure 4 is a side view showing a state in which a thermoelectric module according to a first exemplary embodiment of the present invention is installed in a cooling unit;

[0039] Figure 5 is a perspective view of a thermoelectric module according to a second exemplary embodiment of the present invention;

[0040] Figure 6 is a side view showing a state in which a thermoelectric module according to a second exemplary embodiment of the present invention is installed in a cooling unit;

[0041] Figure 7 is a view showing a first example of a method of arranging first and second electrodes on first and second metal substrates;

[0042] Figure 8 It shows Figure 7 A view showing a state in which a plurality of first electrodes and a plurality of second electrodes are overlapped with each other;

[0043] Figures 9 to 12 is a view illustrating a method of arranging first and second electrodes on first and second metal substrates according to various exemplary embodiments; and

[0044] Figure 13 is a set of views illustrating a coupling structure of thermoelectric elements according to an exemplary embodiment. DETAILED DESCRIPTION

[0045] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0046] However, the technical spirit of the present invention is not limited to some exemplary embodiments disclosed below, but can be implemented in various forms. Without departing from the technical spirit of the present invention, one or more components can be selectively combined and replaced between exemplary embodiments for use.

[0047] In addition, unless otherwise defined, the terms (including technical and scientific terms) used herein may be interpreted as having the same meaning as that commonly understood by those skilled in the art to which the present invention belongs. General terms such as those defined in dictionaries may be interpreted in light of the contextual meaning of the relevant technology.

[0048] Furthermore, the terms used herein are intended to describe exemplary embodiments but are not intended to limit the present invention.

[0049] In this specification, unless otherwise specified, singular terms may include plural forms. When "at least one (or one or more) of A, B, and C" is expressed, it may include one or more of all possible combinations of A, B, and C.

[0050] Additionally, terms such as “first,” “second,” “A,” “B,” “(a),” and “(b)” may be used herein to describe components of exemplary embodiments of the present invention.

[0051] Each term is not used to define the nature, order, or sequence of the corresponding components but is used only to distinguish the corresponding component from other components.

[0052] Where one component is described as being “connected,” “coupled,” or “coupled” to another component, such description includes the case where one component is directly “connected,” “coupled,” and “coupled” to another component and the case where one component is “connected,” “coupled,” and “coupled” to another component with another component disposed between the one and the other component.

[0053] When any component is described as being formed or disposed “on (or under)” another component, such description includes both a case where the two components are formed in direct contact with each other and a case where the two components are in indirect contact with each other with one or more other components interposed therebetween. In addition, when a component is described as being formed “on (or under)” another component, such description may include one component being formed at the upper side or the lower side relative to the other component.

[0054] Figure 1 is a side view of a thermoelectric module according to a first exemplary embodiment of the present invention, Figure 2 is a perspective view of a thermoelectric module according to a first exemplary embodiment of the present invention, Figure 3 is an exploded perspective view of a thermoelectric module according to a first exemplary embodiment of the present invention. Figure 4 is a side view illustrating a state in which a thermoelectric module according to a first exemplary embodiment of the present invention is installed in a cooling unit.

[0055] Reference Figures 1 to 4 The thermoelectric module includes a first metal substrate 110, a first resin layer 120, a plurality of first electrodes 130, a plurality of P-type thermoelectric arms 140, a plurality of N-type thermoelectric arms 150, a plurality of second electrodes 160, a second resin layer 170, a second metal substrate 180, a coupling member 190, and a thermal insulation material 200. The first metal substrate 110 and the second metal substrate 180 may include at least one through-hole for the coupling member 190 to pass through.

[0056] According to another exemplary embodiment of the present invention, a thermoelectric module includes a first metal substrate 110 and a plurality of second metal substrates 180, and includes a first resin layer 120, a plurality of first electrodes 130, a plurality of P-type thermoelectric arms 140, a plurality of N-type thermoelectric arms 150, a plurality of second electrodes 160, and a second resin layer 170 disposed between the first metal substrate 110 and the plurality of metal substrates 180. The first metal substrate 110 and the second metal substrate 180 may have at least one through-hole through which a coupling member 190 passes.

[0057] The first metal substrate 110 is formed to have a plate shape. In addition, the first metal substrate 110 can be fixed to the cooling unit C or the heating unit (not shown). An exemplary embodiment according to the present invention will be described as an example in which the first metal substrate 110 is fixed to the cooling unit C. In this case, a hole 20h is formed at a position corresponding to the first through hole 111 formed in the first metal substrate 110 formed in the cooling unit C, and the coupling member 190 to be described below can pass through the first through hole 111 and be inserted into the hole 20h. As shown in Figures 9 to 11 In an exemplary embodiment, a third through hole 113 may be further formed even in the peripheral area of ​​the first metal substrate 110 (i.e., an area where the plurality of P-type thermoelectric arms 140 and the plurality of N-type thermoelectric arms 150 are not provided). In this case, the coupling member 190 may be inserted into the third through hole 113 and the hole 20h of the cooling unit C formed at a position corresponding to the third through hole 113. A heat sink pad H may be further provided between the first metal substrate 110 and the cooling unit C.

[0058] First metal substrate 110 may include at least one selected from aluminum, an aluminum alloy, copper, and a copper alloy. In this case, when voltage is applied to the thermoelectric module, first metal substrate 110 absorbs heat to serve as the low-temperature portion, and second metal substrate 180 releases heat to serve as the high-temperature portion due to the Peltier effect. Simultaneously, when different temperatures are applied to first metal substrate 110 and second metal substrate 180, electrons migrate from the high-temperature region to the low-temperature region due to the temperature difference, generating a thermoelectromotive force. This is known as the Seebeck effect, and the thermoelectromotive force generated by the Seebeck effect generates electricity within the thermoelectric element's circuit.

[0059] The first metal substrate 110 includes at least one first through-hole 111. The first through-hole 111 is formed at a position corresponding to a second through-hole 181 formed in the second metal substrate 180, which will be described below. The first through-hole 111 may be formed to be spaced a certain distance from the outer portion of the first metal substrate 110. In this case, when the coupling member 190 passes through the first through-hole 111 and the second through-hole 181, the first metal substrate 110 and the second metal substrate 180 may be fixed by the coupling member 190. Here, the diameter of the first through-hole 111 formed in the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 may be the same as the diameter of the second through-hole 181 formed in the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160. However, depending on the arrangement form, position, etc. of the insulating insertion member described below, the diameter of the first through hole 111 formed in the first surface of the first metal substrate 110 in contact with the multiple first electrodes 130 may be different from the diameter of the second through hole 181 formed in the first surface of the second metal substrate 180 in contact with the multiple second electrodes 160.

[0060] The first resin layer 120 is applied on the first metal substrate 110 , and the plurality of first electrodes 130 are provided on the first resin layer 120 .

[0061] Here, the first metal substrate 110 can be in direct contact with the first resin layer 120. To this end, surface roughness can be formed on all or part of the surface on which the first resin layer 120 is provided, of the two surfaces of the first metal substrate 110 (i.e., all or part of the surface of the first metal substrate 110 facing the first resin layer 120). This can prevent the first resin layer 120 from peeling off when the first metal substrate 110 and the first resin layer 120 are thermocompression bonded. In this specification, surface roughness can refer to unevenness and can be used interchangeably with surface roughness.

[0062] The first resin layer 120 and the second resin layer 170 may be made of a resin composition including a resin and an inorganic filler, and the resin may be an epoxy resin or a silicone resin. Here, the content of the inorganic filler may be 68 vol% to 88 vol% of the resin composition. When the content of the inorganic filler is less than 68 vol%, the thermal conductivity may be low. When the content of the inorganic filler exceeds 88 vol%, the adhesion between the resin layer and the metal substrate may be reduced, and the resin layer may be easily broken.

[0063] The epoxy resin may include an epoxy compound and a curing agent. In this case, 1 to 10 parts by volume of the epoxy compound may be included. Here, the epoxy compound may include at least one selected from a crystalline epoxy compound, an amorphous epoxy compound, and a silicone epoxy compound. The crystalline epoxy compound may include a mesogen structure. The mesogen is the basic unit of liquid crystal and includes a rigid structure. The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule, for example, a glycidyl ether compound derived from bisphenol A or bisphenol F. Here, the curing agent may include at least one selected from an amine-based curing agent, a phenol-based curing agent, an anhydride-based curing agent, a polymercaptan-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent, and a blocked isocyanate-based curing agent, and a mixture of two or more curing agents may be used.

[0064] The inorganic filler may include aluminum oxide and nitride, and the nitride may be included in an amount ranging from 55 wt% to 95 wt%, and more preferably, from 60 wt% to 80 wt%. When the nitride is included within this numerical range, thermal conductivity and bonding strength may be increased. The nitride may include at least one selected from boron nitride and aluminum nitride. The boron nitride may be a boron nitride agglomerate formed by agglomerating plate-like boron nitride.

[0065] In this case, the particle size (D50) of the boron nitride agglomerates may be in the range of 250 μm to 350 μm, and the particle size (D50) of the aluminum oxide may be in the range of 10 μm to 30 μm. When the particle size (D50) of the boron nitride agglomerates and the particle size (D50) of the aluminum oxide are within such numerical ranges, the boron nitride agglomerates and the aluminum oxide may be uniformly dispersed in the epoxy resin composition, thereby uniformly providing thermal conductivity and adhesive properties throughout the resin layer.

[0066] According to an exemplary embodiment of the present invention, at least one of the first metal substrate 110 and the second metal substrate 180 may include a plurality of resin layers. For example, a third resin layer (not shown) may be further provided between the first resin layer 120 and the plurality of first electrodes 130. Alternatively, a fourth resin layer (not shown) may be further provided between the plurality of second electrodes 160 and the second resin layer 170. In this case, the first resin layer 120 and the third resin layer (not shown) may differ in at least one of composition, Young's modulus, thermal expansion coefficient, and thickness. The second resin layer 170 and the fourth resin layer (not shown) may differ in at least one of composition, Young's modulus, thermal expansion coefficient, and thickness. For example, when one of the first resin layer 120 and the third resin layer (not shown) includes a resin composition, the other of them may include a resin composition, an aluminum oxide layer, or a composite comprising silicon and aluminum, at least one of which is different from the first resin layer 120 and the third resin layer in composition, Young's modulus, thermal expansion coefficient, and thickness. Here, the composite may be at least one selected from oxides, carbides, and nitrides comprising silicon and aluminum. For example, the composite can include at least one of an Al-Si bond, an Al-oxygen (O)-Si bond, a Si-O bond, an Al-Si-O bond, and an Al-O bond. As described above, a composite comprising at least one of an Al-Si bond, an Al-O-Si bond, a Si-O bond, an Al-Si-O bond, and an Al-O bond can have excellent insulating properties, thereby obtaining high withstand voltage performance. Alternatively, the composite can be an oxide, carbide, or nitride comprising titanium, zirconium, boron, and zinc in addition to silicon and aluminum. To this end, the composite can be obtained by mixing aluminum with at least one of an inorganic binder and an organic-inorganic hybrid binder and then heat-treating the resulting mixture. For example, the inorganic binder can include at least one selected from silicon dioxide (SiO 2 ), a metal alkoxide, boron oxide (BO 3 ) and zinc oxide (ZnO 2 ). The inorganic binder can include inorganic particles and can be sol- or gel-formed when in contact with water to serve as an adhesive. In this case, at least one selected from silicon dioxide (SiO2), metal alkoxides, and boron oxide (BO3) may be used to increase adhesion to the metal, and zinc oxide (ZnO2) may be used to increase the strength of the resin layer and increase thermal conductivity. In this specification, the term "voltage resistance" may refer to the property of maintaining insulation breakdown for a certain period of time under a certain voltage and a certain current. For example, when the property is maintained for 10 seconds without insulation breakdown under an alternating current (AC) voltage of 2.5 kV and a current of 1 mA, the voltage resistance may be 2.5 kV.Alternatively, when one of the second resin layer 170 and the fourth resin layer (not shown) includes a resin composition, the other may include a resin composition, an aluminum oxide layer, or a composite containing silicon and aluminum, and at least one of the composition, Young's modulus, thermal expansion coefficient, and thickness of the other is different from at least one of the composition, Young's modulus, thermal expansion coefficient, and thickness of the second resin layer 170 and the fourth resin layer. Here, each resin layer can be used interchangeably with the insulating layer.

[0067] A plurality of first electrodes 130 are disposed on the first resin layer 120. A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are disposed on the first electrodes 130. In this case, the first electrodes 130 are electrically connected to the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150. Here, the first electrodes 130 may include at least one selected from copper (Cu), aluminum (Al), silver (Ag), and nickel (Ni).

[0068] A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are disposed on the first electrode 130. In this case, the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150 may be joined to the first electrode 130 by welding.

[0069] Here, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be bismuth fluoride (Bi-Te)-based thermoelectric legs including bismuth (Bi) and tellurium (Te) as primary raw materials. The P-type thermoelectric leg 140 may include, relative to 100 wt%, 99 wt% to 99.999 wt% of the bismuth fluoride (Bi-Te)-based primary raw material, and 0.001 wt% to 1 wt% of a mixture including Bi or Te. The bismuth fluoride (Bi-Te)-based primary raw material includes at least one selected from antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type thermoelectric leg 140 may include Bi-Se-Te as the primary raw material and may further include Bi or Te in an amount ranging from 0.001 wt% to 1 wt% relative to the total weight. The N-type thermoelectric leg 150 may include, relative to 100 wt%, 99 wt% to 99.999 wt% of a bismuth fluoride (Bi-Te)-based main raw material, including at least one selected from selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In), and 0.001 wt% to 1 wt% of a mixture including Bi or Te. For example, the N-type thermoelectric leg 150 may include Bi-Sb-Te as a main raw material and may further include Bi or Te in an amount of 0.001 wt% to 1 wt% relative to the total weight.

[0070] The P-type thermoelectric arm 140 and the N-type thermoelectric arm 150 can be formed in a bulk type or a stacked type. Generally, the bulk P-type thermoelectric arm 140 or the bulk N-type thermoelectric arm 150 can be obtained by heat-treating the thermoelectric material to form an ingot, crushing and screening the ingot to obtain thermoelectric arm powder, sintering the thermoelectric arm powder, and then cutting the sintered body. The stacked P-type thermoelectric arm 140 or the stacked N-type thermoelectric arm 150 can be obtained by applying a paste including the thermoelectric material to a sheet substrate to form a unit component, and then stacking and cutting the unit component.

[0071] In this case, the pair of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 may have the same shape and volume or may have different shapes and volumes. For example, since the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150 have different conductive properties, the height or cross-sectional area of ​​the N-type thermoelectric legs 150 may be different from the height or cross-sectional area of ​​the P-type thermoelectric legs 140.

[0072] The performance of a thermoelectric element according to an exemplary embodiment of the present invention may be represented by a thermoelectric performance index. The thermoelectric performance index (ZT) may be represented by Equation 1.

[0073] [Equation 1]

[0074] ZT=α 2 ·σ·T / k

[0075] In Equation 1, α is the Seebeck coefficient [V / K], σ is the conductivity [S / m], and α 2 σ is the power factor [W / mK 2 ]. T is temperature, k is thermal conductivity [W / mK]. k can be expressed by a·cp·ρ. Here, a is thermal diffusivity [cm 2 / S], cp is the specific heat [J / gK], ρ is the density [g / cm 3 ].

[0076] In order to obtain the thermoelectric performance index of the thermoelectric element, a Z value (V / K) may be measured using a Z meter, and a Seebeck index (ZT) may be calculated using the measured Z value.

[0077] The P-type thermoelectric arm 140 or the N-type thermoelectric arm 150 can have a cylindrical shape, a polygonal column shape, an elliptical column shape, or the like. Alternatively, the P-type thermoelectric arm 140 or the N-type thermoelectric arm 150 can have a stacked structure. For example, the P-type thermoelectric arm or the N-type thermoelectric arm can be formed by stacking multiple structures coated with semiconductor material on a sheet substrate and then cutting the substrate. As a result, material loss can be prevented and conductive properties can be improved.

[0078] The plurality of second electrodes 160 are disposed on the plurality of P-type thermoelectric arms 140 and the plurality of N-type thermoelectric arms 150. In this case, the plurality of P-type thermoelectric arms 140 and the plurality of N-type thermoelectric arms 150 may be bonded to the second electrodes 160 by welding. Here, the second electrodes 160 may include at least one selected from copper (Cu), aluminum (Al), silver (Ag), and nickel (Ni).

[0079] The second resin layer 170 is disposed on the plurality of second electrodes 160. The plurality of second metal substrates 180 are disposed on the second resin layer 170.

[0080] The second metal substrate 180 is disposed on the second resin layer 170 to face one of the first metal substrates 110. The second metal substrate 180 may be made of aluminum, an aluminum alloy, copper, or a copper alloy.

[0081] The first metal substrate 110 and the second metal substrate 180 may have the same area, and as described above, when the third through hole 113 is formed in the first metal substrate 110, the area of ​​the first metal substrate 110 may be larger than the area of ​​the second metal substrate 180. In this case, the ratio of the area of ​​the second metal substrate 180 to the area of ​​the first metal substrate 110 may be in the range of 0.50 to 0.95, preferably in the range of 0.60 to 0.90, and more preferably in the range of 0.70 to 0.85.

[0082] In another exemplary embodiment, when the second metal substrate 180 is used in an application requiring a relatively large area, or when the effects of thermal deformation need to be further minimized, the second metal substrate 180 may be configured to be divided into multiple pieces relative to the first metal substrate 110. In this case, the ratio of the area of ​​the second metal substrate 180 to the area of ​​the first metal substrate 110 may be in a range of 0.10 to 0.50, preferably in a range of 0.15 to 0.45, and more preferably in a range of 0.2 to 0.40. For example, two second metal substrates 180 may be provided on a single first metal substrate 110. Here, the second metal substrates 180 may be spaced apart from each other. For example, the first metal substrate 110 may have an area of ​​100 mm x 100 mm, and the second metal substrates 180 may each have an area of ​​45 mm x 100 mm, with the spacing between the spaced-apart second metal substrates 180 being approximately 10 mm.

[0083] As another example, four second metal substrates 180 may be provided on one first metal substrate 110. In this case, the second metal substrates 180 may be provided spaced apart from each other. For example, the first metal substrate 110 may have an area of ​​100 mm x 100 mm, the second metal substrates 180 may each have an area of ​​45 mm x 45 mm, and the interval between the spaced-apart second metal substrates 180 may be approximately 10 mm.

[0084] As another example, the spacing between the plurality of second metal substrates 180 may be less than 5 mm. For example, the first metal substrate 110 may have an area of ​​100 mm x 100 mm, the second metal substrates 180 may each have an area of ​​49.5 mm x 49.5 mm, and the spacing between the plurality of second metal substrates may be approximately 10 mm. The connecting member 230 connecting the plurality of second metal substrates 180 may be formed to have a width of 2 mm.

[0085] In this case, the thickness of the first metal substrate 110 may be in the range of 0.1 mm to 2 mm. Furthermore, the thickness of the second metal substrate 180 may be greater than or equal to the thickness of the first metal substrate 110. When the thickness of the second metal substrate 180 is greater than the thickness of the first metal substrate 110, the thickness of the second metal substrate 180 may be 1.1 to 2.0 times the thickness of the first metal substrate 110. Since the second metal substrate 180 is likely to be bent by the coupling member 190, the second metal substrate 180 may be formed thicker than the first metal substrate 110.

[0086] At least one through-hole 181 is formed in the second metal substrate 180. In this case, the second through-hole 181 can be formed to occupy a portion of the active area B1, which is the area within the peripheral area B2 of each second metal substrate 180. Here, the active area can be defined as the area in which the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 that can substantially achieve the Peltier effect or the Seebeck effect are arranged. Terminal electrodes can be arranged in the active area. The terminal electrodes can extend from the active area to connect to external terminals or wires and can be electrically connected to at least one or more first electrodes 130 and at least one of the plurality of second electrodes 160 in the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150. Each of the plurality of first electrodes 130 and each of the plurality of second electrodes 160 can vertically overlap each other in the active area. The second through-holes 181 formed in the second metal substrate 180 can be formed to be spaced a certain distance from the outer portion of the second metal substrate 180. When a plurality of second through-holes 181 are formed, the second through-holes 181 can be spaced the same distance from the outer portion of the second metal substrate 180. The second through-holes 181 can be formed to overlap with the first through-holes 111, and the coupling member 190 can pass through the corresponding first and second through-holes 111 and 181. As described above, the coupling member 190 can secure the first and second metal substrates 110 and 180 so as to occupy a portion of the effective areas A1 and B1 of the first and second metal substrates 110 and 180, thereby reducing thermal deformation and preventing stress concentration at the joint portion.

[0087] Although not shown, when portions of the peripheral areas A2 and B2 of the substrates (i.e., the edge areas of the substrates) are coupled so as not to affect the effective areas A1 and B1 of the first metal substrate 110 and the second metal substrate 180, the fixing force between the substrates can be relatively high. However, in applications utilizing the Seebeck effect where the thermoelectric module is exposed to a high temperature environment above 100°C, or in applications utilizing the Peltier effect where heat above 100°C is generated, the difference in heat received by the low-temperature portion and the high-temperature portion may cause damage to the thermoelectric module. For example, in the case of a thermoelectric module using the Seebeck effect, the substrate in the high-temperature portion expands due to heat, while the substrate in the low-temperature portion contracts due to a separate cooling member, so that thermal stress is concentrated in the edge area of ​​the substrate. In this case, the generated thermal stress may be transmitted to the electrodes, thermoelectric arms, and resin layer disposed between the substrates, and thus, delamination and cracking may occur due to weak interfaces. As a result, the thermoelectric efficiency may decrease rapidly due to damage to the thermoelectric module. Although not shown, a sealing member may be further provided between the first metal substrate 110 and the second metal substrate 180. A sealing member may be provided on the side surfaces of the first electrode 130, the P-type thermoelectric arms 140, the N-type thermoelectric arms 150, and the second electrode 160 between the first metal substrate 110 and the plurality of second metal substrates 180. Thus, the first electrode 130, the P-type thermoelectric arms 140, the N-type thermoelectric arms 150, and the second electrode 160 can be sealed from external moisture, heat, and contamination. Here, the sealing member may include: a sealing housing disposed a certain distance from the outermost side surfaces of the plurality of first electrodes 130, the outermost side surfaces of the plurality of P-type thermoelectric arms 140 and the plurality of N-type thermoelectric arms 150, and the outermost side surfaces of the plurality of second electrodes 160; a sealing material provided between the sealing housing and the first metal substrate 110; and a sealing material provided between the sealing housing and the second metal substrate 180. As described above, the sealing housing may be in contact with the first metal substrate 110 and the second metal substrate 180 via the sealing material. Therefore, when the sealed housing is in direct contact with the first metal substrate 110 and the second metal substrate 180, heat conduction can occur through the sealed housing, thereby preventing the temperature difference between the first metal substrate 110 and the second metal substrate 180 from decreasing. Here, the sealing material may include at least one selected from epoxy resin and silicone resin, or may include a tape with both surfaces coated with at least one selected from epoxy resin and silicone resin. The sealing material can be used to seal the gap between the sealed housing and the first metal substrate 110 and the gap between the sealed housing and the second metal substrate 180, and can increase the sealing effect relative to the first electrode 130, the P-type thermoelectric arm 140, the N-type thermoelectric arm 150, and the second electrode 160, and can be used interchangeably with decorative materials, decorative layers, waterproof materials, waterproof layers, etc.Here, the sealing material for sealing the gap between the sealing housing and the first metal substrate 110 can be provided on the upper surface of the first metal substrate 110, and the sealing material for sealing the gap between the sealing housing and the second metal substrate 180 can be provided on the side surface of the second metal substrate 180. For this purpose, the area of ​​the first metal substrate 110 can be greater than the total area of ​​the second metal substrate 180. At the same time, the sealing housing can have a guide groove for leading out the lead wires connected to the electrodes. For this purpose, the sealing housing can be an injection molded part made of plastic or the like and can be used interchangeably with the sealing cover. However, the above description of the sealing member is merely exemplary and the sealing member can be modified in various forms. Although not shown, a thermal insulation material can be further provided to surround the sealing member. Alternatively, the sealing member can include an insulating component.

[0088] Reference Figure 7 , a first hole arrangement area 112 is formed in the first metal substrate 110 adjacent to the first through-hole 111. The first hole arrangement area 112 may be adjacent to the first through-hole 111 and may be defined as a space formed by virtual lines 201, 202, 203, and 204 connecting the surfaces of adjacent electrodes. The first hole arrangement area 112 may be formed to have a polygonal shape, and preferably, may be formed to have a quadrilateral shape. In this case, the plurality of first electrodes 130 may not be provided in the first hole arrangement area 112. In addition, a second hole arrangement area 182 is formed in the surface of the second metal substrate 180 facing the first metal substrate 110, adjacent to the second through-hole 181. The second hole arrangement area 182 may be adjacent to the second through-hole 181 and may be defined as a space formed by virtual lines 211, 212, 213, and 214 connecting the surfaces of adjacent electrodes. The second hole arrangement area 182 may be formed to have a polygonal shape, and preferably, may be formed to have a quadrilateral shape. In this case, the plurality of second electrodes 160 may not be provided in the second hole arrangement region 182 .

[0089] The coupling member 190 fixes the first metal substrate 110 and the at least one second metal substrate 180. In this case, a portion of the coupling member 190 passes through the second through-hole 181 and the first through-hole 111, and an end thereof is insertedly coupled to the hole 20h of the cooling unit C.

[0090] Reference Figure 4, the coupling member 190 may include a first member 191 and a second member 192. The first member 191 passes through the second through hole 181 and the first through hole 111, and one end thereof is embedded and fixed in the cooling unit C. In this case, a thread may be formed on the outer circumference of the first member 191. The diameter of the first member 191 may be smaller than or equal to the diameter of the second through hole 181 and the first through hole 111.

[0091] The second member 192 may extend from the other end portion of the first member 191 to have a diameter greater than that of the second through-hole 181. The second member 192 prevents the second metal substrate 180 from being separated from the first metal substrate 110.

[0092] When a plurality of second metal substrates 180 are provided, the insulation material 200 may be provided in the separation spaces between the plurality of second metal substrates 180. Here, the insulation material 200 may include at least one selected from epoxy resin, silicone resin, and ceramic wool, and the insulation material 200 may be used interchangeably with the sealing member described above and the connection member 230 described later.

[0093] The heat sink 220 may be provided on the second metal substrate 180. For example, the heat sink 220 may be provided on one of the two surfaces of the second metal substrate 180, the surface opposite to the surface provided with the second resin layer 170. In this case, the second metal substrate 180 and the heat sink 220 may be integrally formed. Although not shown, the heat sink may be formed on the first metal substrate 110. The heat sink 220 may have a structure in which a plurality of flat substrates 221, each in a plate shape, are arranged in parallel, and air passages are formed in the spaces between the flat substrates 221. In this case, the intervals between the flat substrates 221 may be less than 10 mm.

[0094] In the following, reference will be made to Figure 5 and Figure 6 A thermoelectric module 20 according to another exemplary embodiment of the thermoelectric module is described.

[0095] Figure 5 is a perspective view of a thermoelectric module according to a second exemplary embodiment of the present invention, Figure 6 is a side view illustrating a state in which a thermoelectric module according to a second exemplary embodiment of the present invention is installed in a cooling unit.

[0096] Reference Figure 5 and Figure 6 The thermoelectric module 20 may further include a connection member 230 connecting the plurality of second metal substrates 180 .

[0097] The connection member 230 may be glue for bonding the plurality of second metal substrates 180. In this case, in the thermoelectric module 20, the insulation treatment of the separation space between the plurality of second metal substrates 180 may be omitted, but as described above, the insulation material 200 may be provided between the first metal substrate 110 and the second metal substrate 180.

[0098] Although not shown, in the thermoelectric module, the connection member 230 may be omitted, and the plurality of second metal substrates 180 may be connected by an extending member extending from a portion of each of the plurality of second metal substrates 180 .

[0099] In this case, the extension member may be formed to have a thickness smaller than that of the second metal substrate 180. For example, the thickness of the second metal substrate 180 may be in the range of 0.2 mm to 4 mm, and the thickness of the extension member may be in the range of 0.1 mm to 2 mm. Here, the ratio of the thickness of the plurality of second metal substrates to the thickness of the extension member may be in the range of 1 to 2.

[0100] Compared to one surface of the second metal substrate 180, one surface of the connecting member 230 may be further recessed to form a groove 241. In this case, the connecting member 230 may be formed to have a cross shape. For example, when the first metal substrate 110 has an area of ​​100mm×100mm and the second metal substrate 180 has an area of ​​45mm×45mm and a thickness in the range of 0.2mm to 4mm, the connecting member 230 may have a width of 10mm and a thickness in the range of 0.1mm to 2mm, and the groove formed by the connecting member 230 may have a depth in the range of 0.1mm to 2mm. As described above, since the groove is formed due to the thickness difference between the connecting member 230 and the second metal substrate 180, the thickness of the central portion of the second metal substrate 180 can be reduced, and thermal deformation of the second metal substrate 180 can be reduced.

[0101] In this specification, the insulating material 200 , the connecting member 230 , and the extending member disposed between the plurality of second metal substrates 180 spaced apart from each other to connect the plurality of second metal substrates 180 may be collectively referred to as a connecting member, and the connecting member may be an insulating member including an insulating material.

[0102] In the following, reference will be made to Figures 7 to 11 A method of arranging the plurality of first electrodes 130 and the plurality of second electrodes 160 according to various exemplary embodiments is described.

[0103] Figure 71 and 2 are views illustrating a method of arranging first and second electrodes on the first and second metal substrates 110 and 180 according to an exemplary embodiment. Figure 8 It shows Figure 7 FIG. 1 is a diagram showing a state in which a plurality of first electrodes and a plurality of second electrodes overlap each other. Figures 9 to 11 1 and 2 are views illustrating a method of arranging first and second electrodes on the first and second metal substrates 110 and 180 according to various exemplary embodiments.

[0104] Reference Figures 7 to 11 , a plurality of first electrodes 130 are provided on one surface of the first metal substrate 110 facing the second metal substrate 180, and a plurality of second electrodes 160 are provided on one surface of the second metal substrate 180 facing the first metal substrate 110. In this case, the plurality of first electrodes 130 may be provided on the first metal substrate 110 except for the first hole arrangement region 112, and the plurality of second electrodes may be provided on the second metal substrate 180 except for the second hole arrangement region 182. The position of the first hole arrangement region 112 corresponds to the position of the second hole arrangement region 182.

[0105] Here, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 is formed to have a rectangular shape, and its long width W1 and short width W2 are distinguished from each other. In this case, the ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 can vary according to the shape of the arm (leg) to be set. Preferably, the ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 can be in the range of 2.05 to 4.50. In this specification, the direction of the long width can be referred to as the length direction.

[0106] Although not shown, when through-holes 111 and 181 are not formed in the active regions of first and second metal substrates 110 and 180, all of the plurality of first electrodes 130 may be arranged so that their length directions point in the first direction Y. In this case, at least some of the electrodes, arranged in two columns or rows opposite each other in the edge region of the active region, among the plurality of second electrodes 160 may be arranged in a second direction X perpendicular to the first direction Y, and the remaining electrodes may be shifted from the plurality of first electrodes 130 by the short width W2 of the electrodes so that at least a portion thereof may overlap with each other. Thus, the plurality of P-type thermoelectric arms and the plurality of N-type thermoelectric arms between first and second metal substrates 110 and 180 may all be connected in series.

[0107] When at least one through hole 111 or 181 is formed in the effective area of ​​the first metal substrate 110 or the second metal substrate 180 according to an exemplary embodiment of the present invention, among the first electrode 130 and the plurality of second electrodes 160, the electrodes other than the electrodes in the edge area can be arranged so that their length directions are mixed in the first direction Y and the second direction X perpendicular to the first direction Y.

[0108] In this case, among the plurality of first electrodes 130 or the plurality of second electrodes 160 , except for the electrodes in the edge region, at least two electrodes may be arranged in the second direction X perpendicular to the first direction Y, and the remaining electrodes may be arranged in the first direction Y perpendicular to the second direction X.

[0109] At least one electrode adjacent to the first hole arrangement area 112 or the second hole arrangement area 182 may be arranged so that its length direction points to the second direction X, and another electrode adjacent to the at least one electrode may also be arranged so that its length direction points to the second direction X. In this case, the at least two first electrodes 130 and the at least two second electrodes 160 may not overlap with each other, or at least a portion thereof may overlap with each other.

[0110] Specifically, at least two first electrodes 130 a and 130 b adjacent to the first hole arrangement region 112 among the plurality of first electrodes 130 may be disposed such that their length directions point to the second direction X. The remaining first electrodes 130 may be disposed such that their length directions point to the first direction Y.

[0111] In this case, at least two second electrodes 160a and 160b adjacent to the second hole arrangement area 182 among the plurality of second electrodes 160 can be arranged in the second direction X. In addition, two opposite rows of the plurality of second electrodes 160c arranged at the edge of the active area can be arranged so that their length directions point to the second direction X. The remaining second electrodes 160 can be arranged so that their length directions point to the first direction Y. In this case, the first electrodes 130a and 130b arranged along the second direction X and the second electrodes 160a and 160b arranged along the second direction may not overlap with each other or may be arranged so that at least a portion thereof overlaps with each other. Here, the arrangement forms of the plurality of first electrodes 130 and the plurality of second electrodes 160 can be applied interchangeably with each other.

[0112] More specifically, if Figure 8As shown, in addition to the first electrode 130 in the edge region, at least two of the plurality of first electrodes 130 can be arranged in the second direction X so that at least a portion thereof overlaps with a virtual space H1 or H2 formed by extending lines from virtual lines 201, 202, 203, and 204 defining the first hole arrangement region 112. In addition to the second electrode 160 in the edge region, at least two of the plurality of second electrodes 160 can be arranged in the second direction X so that at least a portion thereof overlaps with a virtual space H3 or H4 formed by extending lines from virtual lines 211, 212, 213, and 214 defining the second hole arrangement region 182. Thus, the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs can be optimally arranged within the limited space in which each hole arrangement region is formed. The number of electrodes arranged in the second direction X can be increased based on the number, position, and shape of the first hole arrangement region 112 and the second hole arrangement region 182. In this case, the number of electrodes disposed in the second direction X may be a multiple of two, and at least two electrodes disposed in the second direction X may be disposed such that at least a portion thereof overlaps with the space H1 or H4 .

[0113] In this specification, the electrode arrangement forms of the plurality of first electrodes 130 and the plurality of second electrodes 160 may be applied interchangeably with each other, and the first direction Y and the second direction X are not limited thereto.

[0114] Reference Figure 9 Among the plurality of first electrodes 130, the two first electrodes 130d and 130f adjacent to the first hole arrangement region 112 may be arranged such that their length directions point in the second direction X, and the two first electrodes 130c and 130e adjacent to the two first electrodes 130d and 130f may also be arranged in the second direction X such that their length directions are the same. The remaining first electrodes 130 may be arranged such that their length directions point in the first direction Y.

[0115] In this case, among the plurality of second electrodes 160, two second electrodes 160d and 160e adjacent to the second hole arrangement region 182 can be arranged so that their length directions point in the second direction X, and the other two second electrodes 160f and 160g adjacent to the second hole arrangement region 182 can also be arranged in the second direction X so that their length directions are the same. In addition, the second electrodes 160h arranged in two rows opposite to each other in the edge region are arranged so that their length directions point in the second direction. The remaining second electrodes 160 can be arranged so that their length directions point in the first direction Y.

[0116] Reference Figure 10, a plurality of first through-holes 111 and a plurality of second through-holes 181 may be formed in the first metal substrate 110 and the second metal substrate 180. Consequently, a plurality of first hole arrangement regions 112 and a plurality of second hole arrangement regions 182 may also be formed. In this case, among the plurality of first electrodes 130, the two first electrodes 130g and 130h adjacent to the first hole arrangement region 112 may be arranged so that their length directions point in the second direction X, and the two first electrodes 130g and 130j adjacent to the two first electrodes 130g and 130h may also be arranged in the second direction X so that their length directions are the same. In this case, a plurality of first hole arrangement regions 112 may be formed, and a multiple of two of the plurality of first electrodes 130 may be arranged so as to face the second direction X. More specifically, at least eight of the plurality of first electrodes 130g to 130n may be arranged so as to face the second direction X. Furthermore, the remaining first electrodes 130 may be arranged so that their length directions point in the first direction Y.

[0117] In this case, among the multiple second electrodes 160, two second electrodes 160i and 160j adjacent to the second hole arrangement area 182 in the first direction Y can be arranged so that their length directions point to the second direction X, and the other two second electrodes 160k and 160l adjacent to the second hole arrangement area 182 can also be arranged in the second direction X so that their length directions are the same.

[0118] Here, a plurality of second hole arrangement regions 182 may be formed, and a multiple of two of the plurality of second electrodes 160 may be arranged such that their length directions point in the second direction X. More specifically, at least eight second electrodes 160i to 160p of the plurality of second electrodes 160 may be arranged such that their length directions point in the second direction X. In addition, the second electrodes 160g arranged in two rows opposite to each other in the edge region may also be arranged such that their length directions point in the second direction X. Furthermore, the remaining second electrodes 160 may be arranged such that their length directions point in the first direction Y.

[0119] Reference Figure 11, a plurality of first hole arrangement regions 112 may be formed, and four first electrodes 130o to 130r, spaced apart from one first hole arrangement region 112, among the plurality of first electrodes 130, may be arranged such that their length directions point in the second direction X. Here, the plurality of electrodes may be arranged between the first hole arrangement region 112 and the first electrodes 130o to 130r. On the other hand, the first electrodes 130o to 130r may be arranged in the second direction X such that at least a portion thereof overlaps with a virtual space formed by an extension line extending from a virtual line defining the first hole arrangement region 112. In addition, four first electrodes 130s to 130v, among the plurality of first electrodes 130, adjacent to another first hole arrangement region 112 in the first direction, may be arranged in the second direction X.

[0120] In this case, the four second electrodes 160 r to 160 u and the four second electrodes 160 v to 160 y adjacent to the second hole arrangement region 182 among the second electrodes 160 may be disposed such that the length directions thereof are directed in the second direction X.

[0121] Reference Figure 12 , a plurality of first through holes 111 and a plurality of second through holes 181 may be formed in the first metal substrate 110 and the second metal substrate 180. Therefore, a plurality of first hole arrangement regions 112 and a plurality of second hole arrangement regions 182 may also be formed. For example, the first metal substrate 110 may include four first through holes 111 and four first hole arrangement regions 112, and the second metal substrate 180 may include four second through holes 181 and four second hole arrangement regions 182.

[0122] In this case, among the plurality of first electrodes 130, the two first electrodes 130-1 and 130-2 adjacent to each first hole arrangement region 112 can be arranged so that their length directions point to the second direction X. Furthermore, the other two first electrodes 130-3 and 130-4 adjacent to each first hole arrangement region 112 can also be arranged so that their length directions point to the second direction X. Thus, a multiple of two of the plurality of first electrodes 130 can be arranged so as to face the second direction X. More specifically, at least 16 of the plurality of first electrodes 130 1 to 130-4 can be arranged so as to face the second direction X. Furthermore, the remaining first electrodes 130 can be arranged so that their length directions point to the first direction Y.

[0123] In addition, the 2n first electrodes 130-2n adjacent to at least one of the four first electrodes 130-1 to 130-4 disposed adjacent to any one of the first hole arrangement regions 112 so as to face the second direction X may also be disposed such that their length directions point in the second direction X (where n is an integer greater than or equal to 1). Here, the positions where the 2n first electrodes 130-2n are disposed may be variously changed depending on the arrangement structure of the plurality of second electrodes 160.

[0124] In addition, a plurality of electrodes may be provided between the first hole arrangement region 112 and the 2n first electrodes 130-2n. Alternatively, the 2n first electrodes 130-2n may be provided in the second direction X such that at least a portion thereof overlaps with a virtual space formed by an extension line extending from a virtual line defining the first hole arrangement region 112.

[0125] exist Figure 12 , the 2n first electrodes 130 - 2n are shown as being arranged along the second direction X, but the present invention is not limited thereto, and the 2n second electrodes may be arranged along the first direction Y.

[0126] Only in Figure 12 1 and 2 show a first resin layer 120 disposed between the first metal substrate 110 and the plurality of first electrodes 130 and a second resin layer 170 disposed between the second metal substrate 180 and the plurality of second electrodes 160, but the present invention is not limited thereto. Figures 7 to 11 The first resin layer 120 and the second resin layer 170 are omitted in the exemplary embodiment of the present invention, and the first resin layer 120 and the second resin layer 170 having the same or similar structure may also be applied to the present invention. Figures 7 to 11 In an exemplary embodiment of .

[0127] Similarly, only in Figure 12 The terminal electrode 500 is shown in FIG, but the present invention is not limited thereto. The terminal electrode 500 having the same or similar structure can also be applied to Figures 7 to 11 In an exemplary embodiment of .

[0128] like Figures 7 to 12 As shown, two rows disposed opposite to each other in the edge region in the second direction X may be included in the first electrode 130 disposed on the first metal substrate 110 or may be included in the second electrode 160 disposed on the second metal substrate 180 .

[0129] In this case, the diameter d1 of the first through-holes 111 formed in the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 may be the same as the diameter d2 of the second through-holes 181 formed in the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160. However, the diameter d1 of the first through-holes 111 formed in the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 may be different from the diameter d2 of the second through-holes 181 formed in the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 depending on the arrangement form, position, etc. of the insulating insertion member described below.

[0130] At the same time, if Figures 7 to 12 As shown, the area of ​​the first hole arrangement region 112 can be at least four times the area of ​​a first electrode 130, preferably at least six times, and more preferably at least eight times. If the area of ​​the first hole arrangement region 112 is less than four times the area of ​​a first electrode 130, current may flow through the first through-hole 111 to the first metal substrate 110 at a high AC voltage of 1 kV or more, potentially causing electrical breakdown of the first metal substrate 110. Therefore, in high-voltage applications, it is important to ensure sufficient insulation distance to prevent electrical breakdown of the thermoelectric module. When the area of ​​the first hole arrangement region 112 is at least eight times the area of ​​a first electrode 130, electrical breakdown does not occur even at high AC voltages of 2.5 kV or more. Similarly, the area of ​​the second hole arrangement region 182 formed in the second metal substrate 180 can be at least four times the area of ​​a second electrode 160, preferably at least six times, and more preferably at least eight times.

[0131] In addition, if Figures 7 to 12As shown, among the plurality of first electrodes 130, all electrodes disposed closest to the first edge (not shown) of the first metal substrate 110 can be periodically arranged and arranged such that the path between the start and end points of a virtual line connecting the surfaces of the electrodes disposed closest to the first edge of the first metal substrate 110 is a straight line without a curved region. This means that, among the surfaces of the four electrodes closest to the first edge of the first metal substrate 110 among all the first electrodes 130, the surfaces of the electrodes closest to the first edge of the first metal substrate 110 are arranged without a detent region and are spaced uniformly from the first edge of the first metal substrate 110 in one direction. For example, this can mean that, when the path between the start and end points of a virtual line connecting the surfaces of the electrodes disposed closest to the first edge of the first metal substrate 110 is a straight line, all electrodes in the first column (not shown) of the plurality of first electrodes 130 are periodically arranged. Therefore, when the plurality of first electrodes 130 are disposed on the first metal substrate 110, process complexity can be reduced, and the arrangement structure of the second electrode 160 disposed on the second metal substrate 180 and the thermoelectric legs disposed between the second electrode 160 and the first electrode 130 can be simplified. In addition, since the shortest distance between the edge of the first metal substrate 110 and the first electrode 130 disposed closest to the edge of the first metal substrate 110 can be kept constant, the first electrode 130 disposed closest to the edge of the first metal substrate 110 can have uniform electrical characteristics.

[0132] When the path between the starting point and the end point of the virtual line connecting the surface of the first edge of the electrode closest to the first metal substrate 110 includes a curved area, this may mean that part of the electrodes in the first column of the plurality of first electrodes 130 are removed or include a recessed area, and thus lose the periodicity of the arrangement. The surface of the electrode closest to the first edge of the first metal substrate 110 in the curved area may be a surface of the electrode in a second column (not shown) arranged after the first column. Here, the second column may be a column further away from the first edge of the first metal substrate 110 than the first column, and may not be the outermost column. The first electrode 130 may be arranged to include a curved area so that a through hole is additionally arranged. However, in this case, as described above, in the application field at high voltage, sufficient insulation distance may not be ensured, thereby causing electrical breakdown of the thermoelectric module, or the effective area of ​​the first electrode portion may be reduced, resulting in reduced efficiency of the thermoelectric module.

[0133] Similarly, all electrodes (in the Nth column) closest to the second edge (not shown) facing the first edge of the first metal substrate 110 among the plurality of first electrodes 130, the electrodes (in the first row) closest to the third edge (not shown) between the first and second edges of the first metal substrate 110 among the plurality of first electrodes 130, and the electrodes (in the Mth row) closest to the fourth edge (not shown) facing the third edge of the first metal substrate 110 among the plurality of first electrodes 130 can be arranged so that the path between the start point and the end point of the virtual line connecting the surface closest to each edge of the electrode is a straight line without a curved area. However, only any one of the outermost columns or outermost rows (for example, only any one of the first column, the Nth column, the first row, and the Mth row) can have an exceptional path according to the design such as the terminal electrode arrangement. For example, the terminal electrode may be connected to the first electrode 130 provided in any one of the first column, the Nth column, the first row, and the Mth row, which are the outermost columns or the outermost rows, or may extend from the first electrode 130 provided in any one of the first column, the Nth column, the first row, and the Mth row. Therefore, among the outermost columns and the outermost rows, except for one column or row in which the terminal electrode is provided, the remaining columns or rows may be provided to be spaced apart from the corresponding edges of the first metal substrate 110 by a certain interval.

[0134] Figure 13 A coupling structure of thermoelectric elements according to an exemplary embodiment of the present invention is shown.

[0135] Reference Figure 13 , the thermoelectric element 100 can be coupled using a plurality of coupling members 400. The plurality of coupling members 400 can connect the heat sink 220 and the second metal substrate 180, connect the heat sink 220, the second metal substrate 180 and the first metal substrate (not shown), connect the heat sink 220, the second metal substrate 180, the first metal substrate (not shown) and the cooling unit (not shown), connect the second metal substrate 180, the first metal substrate (not shown) and the cooling unit (not shown), or connect the second metal substrate 180 and the first metal substrate (not shown).

[0136] To this end, a through hole S through which the coupling member 400 passes can be formed in the heat sink 220, the second metal substrate 180, the first metal substrate (not shown), and the cooling unit (not shown). Here, the through hole S may include the second through hole 181 and the first through hole 111. Here, a separate insulating insert member 410 may be further provided between the second through hole 181 and the coupling member 400. The separate insulating insert member 410 may be an insulating insert member surrounding the outer circumference of the coupling member 400 or an insulating insert member surrounding the wall surface of the through hole S. As a result, the insulation distance of the thermoelectric element can be increased.

[0137] Meanwhile, the shape of the insulating insert member 410 may be different from Figure 13 The shapes shown in A and 13B are the same. Figure 13 As shown in FIG. 1A , a stepped portion may be formed in a region of the through hole S formed in the second metal substrate 180 so that the insulating insert member 410 may be disposed to surround a portion of the wall surface of the through hole S. Alternatively, a stepped portion may be formed in a region of the through hole S formed in the second metal substrate 180 so that the insulating insert member 410 may be disposed to extend along the wall surface of the through hole S to the first surface of the second metal substrate 18 where the second electrode (not shown) is disposed.

[0138] Reference Figure 13 A, the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180 in contact with the second electrode can be the same as the diameter of the through-hole formed in the first surface of the first metal substrate in contact with the first electrode. In this case, the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180 can be different from the diameter d2 of the through-hole S formed in the second surface (which is the surface opposite to the first surface) depending on the shape of the insulating insert member 410. Although not shown, when no stepped portion is formed in the region of the through-hole S and the insulating insert member 410 is provided only on a portion of the upper surface of the second metal substrate 180 or is provided so as to extend from the upper surface of the second metal substrate 180 to a portion or the entire surface of the wall surface of the through-hole S, the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180 can be the same as the diameter d2 of the through-hole S formed in the second surface (which is the surface opposite to the first surface).

[0139] Reference Figure 13B. Due to the shape of the insulating insert member 410, the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180, which contacts the second electrode, can be larger than the diameter of the through-hole formed in the first surface of the first metal substrate, which contacts the first electrode. In this case, the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180 can be 1.1 to 2.0 times the diameter of the through-hole formed in the first surface of the first metal substrate. When the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180 is less than 1.1 times the diameter of the through-hole formed in the first surface of the first metal substrate, the insulating effect of the insulating insert member 410 may be negligible, which may lead to insulation breakdown of the thermoelectric element. When the diameter d2' of the through-hole S formed in the first surface of the second metal substrate 180 exceeds 2.0 times the diameter of the through-hole formed in the first surface of the first metal substrate, the size of the area occupied by the through-hole S may increase, which may reduce the effective area of ​​the second metal substrate 180 and reduce the efficiency of the thermoelectric element.

[0140] Due to the shape of the insulating insert member 410, the diameter d2′ of the through-hole S formed in the first surface of the second metal substrate 180 may be different from the diameter of the through-hole S formed in the second surface (which is the surface opposite to the first surface). As described above, when no step portion is formed in the region of the through-hole S of the second metal substrate 180, the diameter d2′ of the through-hole S formed in the first surface of the second metal substrate 180 may be the same as the diameter d2 of the through-hole S formed in the second surface (which is the surface opposite to the first surface).

[0141] According to an exemplary embodiment of the present invention, in the first electrode 130 or the second electrode 160, even when the electrode is spaced apart from the first hole arrangement area 112 or the second hole arrangement area 182, at least two electrodes can be arranged in the second direction X so that at least a portion thereof overlaps with a virtual space formed by an extension line extending from a virtual line defining each hole arrangement area, and, in a limited space where each hole arrangement area is formed, a plurality of P-type thermoelectric arms and a plurality of N-type thermoelectric arms can be optimally arranged without wasting space.

[0142] Thermoelectric elements according to exemplary embodiments of the present invention can be applied to power generation equipment, cooling equipment, heating equipment, etc. Specifically, thermoelectric elements according to exemplary embodiments of the present invention can be mainly applied to optical communication modules, sensors, medical instruments, measuring instruments, the aerospace industry, refrigerators, coolers, automotive ventilators, cup holders, washing machines, dryers, wine cellars, water purifiers, sensor power supplies, thermopiles, etc.

[0143] Here, as an example of applying the thermoelectric element according to an exemplary embodiment of the present invention to medical instruments, there is a polymerase chain reaction (PCR) instrument. A PCR instrument is a device in which deoxyribonucleic acid (DNA) is amplified to determine the DNA sequence, which requires precise temperature control and thermal cycling. To this end, a Peltier-based thermoelectric element can be applied thereto.

[0144] As another example of applying the thermoelectric element according to an exemplary embodiment of the present invention to a medical instrument, there is a photodetector. Here, the photodetector includes an infrared / ultraviolet detector, a charge-coupled device (CCD) sensor, an X-ray detector, and a thermoelectric thermal reference source (TTRS). Peltier-based thermoelectric elements can be used to cool the photodetector. Therefore, wavelength changes caused by temperature increases in the photodetector and reductions in output power and resolution can be prevented.

[0145] As another example of applying the thermoelectric element according to the exemplary embodiment of the present invention to medical instruments, there are immunoassay fields, in vitro diagnostic fields, temperature control and cooling systems, physical therapy fields, liquid cooler systems, blood / plasma temperature control fields, etc. Therefore, the temperature can be precisely controlled.

[0146] As another example of applying the thermoelectric element according to the exemplary embodiment of the present invention to medical equipment, there is an artificial heart. Therefore, power can be supplied to the artificial heart.

[0147] Examples of applications of the thermoelectric element according to an exemplary embodiment of the present invention in the aerospace industry include star tracking systems, thermal imaging cameras, infrared / ultraviolet detectors, CCD sensors, the Hubble Space Telescope, and TTRS. Therefore, the temperature of the image sensor can be maintained.

[0148] As another example of applying the thermoelectric element according to the exemplary embodiment of the present invention to the field of aerospace industry, there are cooling equipment, heaters, power generation devices, and the like.

[0149] In addition, the thermoelectric element according to the exemplary embodiment of the present invention may be applied to other industrial fields for power generation, cooling, and heating.

[0150] According to an exemplary embodiment of the present invention, since the substrate of the high-temperature portion and the substrate of the low-temperature portion are coupled so that portions of their effective areas are coupled to each other, thermal deformation of the substrate of the high-temperature portion can be reduced and stress concentration in the joining portion can be prevented, thereby improving the reliability and durability of the thermoelectric module.

[0151] According to exemplary embodiments of the present invention, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs may be optimally arranged in a limited space forming respective hole arrangement areas without wasting space, thereby maintaining power generation performance of the thermoelectric module.

[0152] While the present invention has been shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention as defined by the following claims.

Claims

1. A thermoelectric module comprising: a first metal substrate, the first metal substrate comprising a first through hole; a first insulating layer, the first insulating layer being disposed on the first metal substrate; a first electrode portion provided on the first insulating layer and including a terminal electrode and a plurality of first electrodes; a plurality of thermoelectric arms, wherein the plurality of thermoelectric arms are arranged on the first electrode portion; a second electrode portion, the second electrode portion being disposed on the plurality of thermoelectric arms and comprising a plurality of second electrodes; a second insulating layer, the second insulating layer being disposed on the second electrode portion; as well as a second metal substrate disposed on the second insulating layer and comprising a second through hole, The first metal substrate includes a first active area provided with the first electrode portion and a first peripheral area surrounding the first active area. The second metal substrate includes a second active area provided with the second electrode portion and a second peripheral area surrounding the outside of the second active area. The total area of ​​the first peripheral region is greater than the total area of ​​the second peripheral region, The first through hole is provided in the first effective area of ​​the first metal substrate, The first through hole and the second through hole are formed at positions corresponding to each other, The first metal substrate includes a first hole arrangement region formed by a virtual line connecting a surface closest to the first through hole among surfaces of the first electrode closest to the first through hole and disposed adjacent to each other. The second metal substrate includes a second hole arrangement area formed by a virtual line connecting a surface closest to the second through hole among surfaces of the second electrode closest to the second through hole and disposed adjacent to each other, The shortest distance between the first through hole and the first electrode in the first hole arrangement area is greater than the shortest distance between the second through hole and the second electrode in the second hole arrangement area. The area of ​​the first hole arrangement region is four times or more the area of ​​one first electrode among the plurality of first electrodes, and The thermoelectric module has a withstand voltage performance of more than 1 kV.

2. The thermoelectric module according to claim 1, wherein The first through hole and the second through hole facing each other have different diameters from each other. 3 . The thermoelectric module according to claim 2 , further comprising an insulating insertion member provided in a peripheral area of ​​the second through hole.

4. The thermoelectric module according to claim 3, wherein A diameter of the first through hole is smaller than a diameter of the second through hole. 5 . The thermoelectric module according to claim 4 , further comprising a coupling member provided between the first through-hole, the second through-hole, and the insulating insertion member. The thermoelectric module according to claim 5 , wherein: The first insulating layer includes resin and inorganic filler.

7. The thermoelectric module according to claim 6, wherein: The resin includes at least one of an epoxy resin and a silicone resin, and The inorganic filler includes at least one compound of aluminum, silicon, and boron.

8. The thermoelectric module according to claim 7, wherein There are multiple first hole arrangement areas.

9. The thermoelectric module according to claim 1, wherein The area of ​​the first hole arrangement region is more than 8 times the area of ​​one of the plurality of first electrodes, and The thermoelectric module has a withstand voltage performance of 2.5 kV or more.

10. The thermoelectric module according to claim 5, wherein The diameter of the second through hole is 1.1 to 2.0 times the diameter of the first through hole.

11. The thermoelectric module according to claim 1, wherein The size of the first metal substrate is different from the size of the second metal substrate. 12 . The thermoelectric module according to claim 11 , further comprising a third through hole formed in a peripheral region of the first metal substrate.

13. The thermoelectric module according to claim 12, wherein The size of the second metal substrate is smaller than the size of the first metal substrate.

14. The thermoelectric module according to claim 12, wherein A ratio of an area of ​​the second metal substrate to an area of ​​the first metal substrate is 0.5 to 0.

95.

15. The thermoelectric module according to claim 13, wherein There are multiple second metal substrates.

16. The thermoelectric module according to claim 8, wherein The first hole arrangement region and the second hole arrangement region are formed at positions corresponding to each other. 17 . The thermoelectric module according to claim 1 , further comprising a third insulating layer disposed between the first metal substrate and the first insulating layer and comprising a resin and an inorganic filler.

18. The thermoelectric module according to claim 17, wherein The first insulating layer and the second insulating layer include the same material.

19. The thermoelectric module according to claim 1, wherein The withstand voltage performance is a property of maintaining no insulation breakdown within 10 seconds under an AC voltage of 1 kV and a current of 1 mA.

20. A power generation device comprising: The thermoelectric module according to claim 1; as well as a cooling unit connected to the first metal substrate of the thermoelectric module and including a through hole, wherein the through hole of the cooling unit and the first through hole are formed at positions corresponding to each other, and Wherein, the coupling member is provided between the through hole of the cooling unit and the first through hole.

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