Bone voiceprint sensor and electronic device

Abstract

The present invention discloses a bone voiceprint sensor and an electronic device. The bone voiceprint sensor comprises: a sensor unit, the sensor unit comprises a packaging shell, and a sensor chip arranged in the packaging shell, the packaging shell is provided with a sound hole; and a vibration pickup unit, the vibration pickup unit comprises a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell, and a vibration adjustment member arranged on the elastic membrane, the vibration pickup shell is installed in the packaging shell, and the sound hole connects the vibration pickup shell and the packaging shell; the vibration adjustment member comprises an adjustment base connected to the elastic membrane, and an adjustment protrusion arranged on the surface of the adjustment base, and the adjustment protrusion extends into the sound hole. In this way, the mass of the vibration adjustment member can be increased. This is conducive to improving the sensitivity of the bone voiceprint sensor, so as to enhance the performance of the bone voiceprint sensor.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to a bone voiceprint sensor and electronic equipment. Background Art

[0002] The bone voiceprint sensor uses the slight vibration of the head and neck bones caused by people speaking to collect sound signals and convert them into electrical signals. Because it is different from traditional microphones that collect sound through air conduction, it can transmit sound with high clarity even in a very noisy environment. In many occasions such as fire scenes, firefighters wearing gas masks cannot speak directly into the microphone with their mouths, so bone voiceprint sensors can be used at this time. With the development of electronic products, the application of bone voiceprint sensors is becoming more and more extensive.

[0003] In the related art, a bone voiceprint sensor generally includes a vibration pickup unit and a sensor unit. The vibration pickup unit is used to pick up external bone vibration signals and transmit them to the sensor unit; the sensor unit is used to convert the vibration signals into electrical signals.

[0004] The vibration pickup unit usually includes a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell, and a vibration adjustment member (i.e., a mass block) arranged on the elastic membrane. The size of the vibration adjustment member (i.e., the mass block) will greatly affect the sensitivity of the bone voiceprint sensor. Summary of the invention

[0005] The main purpose of the present invention is to provide a bone voiceprint sensor, aiming to improve the sensitivity of the bone voiceprint sensor.

[0006] To achieve the above object, the present invention provides a bone voiceprint sensor, comprising:

[0007] A sensor unit, the sensor unit comprising a packaging shell and a sensor chip arranged in the packaging shell, wherein the packaging shell is provided with a sound hole; and

[0008] A vibration pickup unit, the vibration pickup unit includes a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell, and a vibration adjustment member arranged on the elastic membrane, the vibration pickup shell is installed on the packaging shell, the sound hole connects the vibration pickup shell and the packaging shell; the vibration adjustment member includes an adjustment base connected to the elastic membrane, and an adjustment protrusion arranged on the surface of the adjustment base, and the adjustment protrusion extends into the sound hole.

[0009] Optionally, the sensor chip is arranged corresponding to the acoustic hole, and the adjusting protrusion extends into the front cavity of the sensor chip.

[0010] Optionally, the periphery of the acoustic hole is flush with the periphery of the front cavity of the sensor chip; or, the periphery of the acoustic hole is arranged outside the periphery of the front cavity of the sensor chip.

[0011] Optionally, the projection of the adjusting protrusion on the elastic membrane has a first area, the projection of the peripheral wall of the front cavity of the sensor chip on the elastic membrane has a second area, and the ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.99.

[0012] Optionally, the distance between the adjusting protrusion and the sensing film of the sensor chip is greater than or equal to 10 micrometers.

[0013] Optionally, the adjustment protrusion is arranged in the middle of the adjustment base.

[0014] Optionally, the packaging shell includes a substrate, the sound hole and the sensor chip are arranged on the substrate; and the vibration pickup shell is installed on the substrate.

[0015] Optionally, the sensor unit further includes an ASIC chip, the ASIC chip is embedded in the substrate, and the ASIC chip is electrically connected to the sensor chip.

[0016] Optionally, the vibration adjusting member is connected to the elastic membrane via a colloid.

[0017] The present invention also provides an electronic device, comprising the bone voiceprint sensor as described above.

[0018] The bone voiceprint sensor of the present invention can improve space utilization by providing the vibration adjustment member with an adjustment protrusion extending into the sound hole, thereby increasing the mass (i.e., weight) of the vibration adjustment member, thereby facilitating improving the sensitivity of the bone voiceprint sensor and improving the performance of the bone voiceprint sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of a bone voiceprint sensor of the present invention;

[0021] Figure 2 FIG. 4 is a schematic diagram of the structure of another embodiment of the bone voiceprint sensor of the present invention.

[0022] Description of Figure Numbers:

[0023] Label name Label name 100 Bone Voiceprint Sensor 211 sound hole 10 Vibration pickup unit 212 Vent Hole 11 Vibration pickup housing 213 substrate 12 Elastic membrane 214 Connecting plate 121 First vent 2141 Electrical connection 13 Vibration adjustment parts 215 Hoarding 131 Adjust the base 22 Sensor Chip 132 Adjustment protrusion 221 Front cavity 133 Adjustment subject 222 Sensing membrane 134 Lateral protrusion 223 Second vent hole 20 Sensor unit 23 Electrical connector 21 Package shell 70 ASIC Chip

[0024] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0027] In addition, the meaning of “and / or” appearing in the full text includes three parallel solutions. Taking “A and / or B” as an example, it includes solution A, or solution B, or a solution in which both A and B are satisfied.

[0028] The present invention provides a bone voiceprint sensor and an electronic device. The bone voiceprint sensor is used in an electronic device, which may be, but is not limited to, a head-mounted device, an earphone, a smart watch, a smart bracelet, a vehicle-mounted noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art.

[0029] In one embodiment of the present invention, Figure 1 As shown, the bone voiceprint sensor 100 includes a vibration pickup unit 10 and a sensor unit 20. The vibration pickup unit 10 is connected to the sensor unit 20, that is, the vibration pickup unit 10 and the sensor unit 20 are combined together. The vibration pickup unit 10 is used to pick up bone vibration signals from the outside world (such as the wearer, or other vibration sources, and the wearer is used as an example for explanation below) to generate a response vibration signal, and transmit the response vibration signal to the sensor unit 20. The sensor unit 20 is used to convert the received vibration signal into an electrical signal. It can be understood that, without loss of generality, a closed vibration transmission airway is formed between the vibration pickup unit 10 and the sensor unit 20, so that the response vibration signal is transmitted to the sensor unit 20 through the closed vibration transmission airway.

[0030] Furthermore, if Figure 1As shown, the vibration pickup unit 10 includes a vibration pickup housing 11 and an elastic membrane 12 disposed in the vibration pickup housing 11 .

[0031] Specifically, the elastic membrane 12 is installed in the vibration pickup housing 11, and the vibration pickup housing 11 can protect the elastic membrane 12. The vibration pickup housing 11 can transmit the bone vibration of the wearer when speaking to the elastic membrane 12, and the elastic membrane 12 is used to pick up the bone vibration of the wearer when speaking and vibrate to form a response vibration signal; wherein, when the elastic membrane 12 vibrates, it drives the gas in the closed vibration transmission airway to vibrate, so as to transmit the response vibration signal to the sensor unit 20 through the closed vibration transmission airway.

[0032] The elastic membrane 12 may be a membrane with elastic deformation capability, including but not limited to a plastic membrane, a paper membrane, a metal membrane, a biological membrane, etc. Moreover, the elastic membrane 12 may be a single-layer structure or a multi-layer composite membrane. The elastic membrane 12 may be made of a single material or a composite of different materials. No further details will be given here.

[0033] Furthermore, if Figure 1 As shown, the vibration pickup unit 10 further includes a vibration adjustment member 13 disposed on the elastic membrane 12 .

[0034] In this way, the vibration adjusting member 13 is used to adjust the vibration of the elastic membrane 12, so that the vibration of the elastic membrane 12 is better matched with the bone vibration signal of the wearer, thereby improving the sensitivity of the bone voiceprint sensor 100. Moreover, the vibration adjusting member 13 vibrates together with the elastic membrane 12, which can increase the mass of the elastic membrane 12 when it vibrates, thereby effectively avoiding interference from external factors (such as sound waves).

[0035] Without loss of generality, Figure 1 As shown, the projection of the vibration adjustment member 13 on the elastic membrane 12 should be smaller than the elastic membrane 12 .

[0036] Optionally, the vibration adjusting member 13 can be bonded to the elastic film 12 by colloid. In this way, the installation of the vibration adjusting member 13 can be simple, convenient and firm.

[0037] Furthermore, if Figure 1 As shown, the sensor unit 20 includes a packaging shell 21, and a sensor chip 22 disposed in the packaging shell 21, the vibration pickup shell 11 is installed in the packaging shell 21, and the packaging shell 21 is provided with a sound hole 211, and the sound hole 211 connects the sensor unit 20 and the vibration pickup unit 10. Specifically, the sound hole 211 connects the packaging shell 21 and the vibration pickup shell 11; it can be understood that the sound hole 211 is used to form a closed vibration transmission airway.

[0038] Specifically, the response vibration signal is transmitted to the packaging shell 21 through the sound hole 211, and is transmitted to the sensor chip 22. The sensor chip 22 is used to convert the received vibration signal into an electrical signal.

[0039] Specifically, Figure 1 As shown, the elastic membrane 12 divides the space in the vibration pickup housing 11 into a first cavity and a second cavity, and the first cavity and the second cavity are respectively located on both sides of the elastic membrane 12 (at Figure 1 In the state shown, the first cavity is located on the upper side of the elastic membrane 12 , and the second cavity is located on the lower side of the elastic membrane 12 ); wherein the second cavity is connected to the sound hole 211 .

[0040] Specifically, the vibration pickup housing 11 is a housing with one end open, the open end of the vibration pickup housing 11 is mounted on the encapsulation housing 21, the encapsulation housing 21 blocks the open end of the vibration pickup housing 11, and the encapsulation housing 21 is connected to the vibration pickup housing 11 through the sound hole 211. In this way, the structure can be simplified. Optionally, the open end of the vibration pickup housing 11 can be bonded to the encapsulation housing 21 by colloid. Of course, the vibration pickup housing 11 can also be set to other structural forms, which need not be described one by one here.

[0041] Furthermore, if Figure 1 As shown, the vibration adjustment member 13 includes an adjustment base 131 connected to the elastic membrane 12, and an adjustment protrusion 132 provided on the surface of the adjustment base 131, and the adjustment protrusion 132 extends into the sound hole 211. In this way, the mass of the vibration adjustment member 13 can be increased without changing or substantially changing the size of the bone voiceprint sensor 100, thereby facilitating the improvement of the sensitivity of the bone voiceprint sensor 100; and at the same time, the space utilization rate can be improved.

[0042] It can be understood that the vibration adjustment member 13 is arranged on the side of the elastic membrane 12 facing the sound hole 211 .

[0043] Specifically, the adjusting protrusion 132 also extends into the packaging shell 21. In this way, the mass of the vibration adjusting member 13 can be further increased.

[0044] Furthermore, if Figure 1 As shown, the sensor chip 22 is arranged corresponding to the acoustic hole 211, and the adjusting protrusion 132 extends into the front cavity 221 of the sensor chip 22. Specifically, the front cavity 221 of the sensor chip 22 is arranged corresponding to the acoustic hole 211 and is connected with the acoustic hole 211; the adjusting protrusion 132 extends into the front cavity 221 of the sensor chip 22 through the acoustic hole 211.

[0045] In this way, the accuracy of the sensor chip 22 can be improved.

[0046] Moreover, it can be understood that in order to further increase the mass of the vibration adjustment member 13, the size of the adjustment protrusion 132 can be increased, so that the sound hole 211 needs to be enlarged. That is to say, by enlarging the sound hole 211, a larger-sized adjustment protrusion 132 can be accommodated, so as to further increase the mass of the vibration adjustment member 13; at the same time, since the sound hole 211 is enlarged, the influence of the front cavity 221 of the sensor chip 22 on the high frequency can be reduced, making the high frequency flatter, thereby improving the reliability of the bone voiceprint sensor 100. In other words, the present invention can enlarge the sound hole 211 to reduce the influence of the front cavity 221 of the sensor chip 22 on the high frequency, making the high frequency flatter, thereby improving the reliability of the bone voiceprint sensor 100.

[0047] Specifically, Figure 1 As shown, the periphery of the sound hole 211 can be flush with the periphery of the front cavity 221 of the sensor chip 22; or, the periphery of the sound hole 211 is arranged outside the periphery of the front cavity 221 of the sensor chip 22. In this way, the sound hole 211 can be prevented from interfering with the adjustment protrusion 132, so as to further increase the size of the adjustment protrusion 132 and increase the mass of the vibration adjustment member 13, thereby reducing the influence of the front cavity 221 of the sensor chip 22 on the high frequency, making the high frequency flatter, so as to improve the reliability of the bone voiceprint sensor 100.

[0048] Furthermore, the projection of the adjusting protrusion 132 on the elastic membrane 12 has a first area, the projection of the peripheral wall of the front cavity 221 of the sensor chip 22 on the elastic membrane 12 has a second area, and the ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.99.

[0049] Optionally, the ratio of the first area to the second area is greater than or equal to 0.5 and less than or equal to 0.9.

[0050] Optionally, the ratio of the first area to the second area is greater than or equal to 0.6 and less than or equal to 0.8.

[0051] Optionally, the ratio of the first area to the second area is greater than or equal to 0.65 and less than or equal to 0.75.

[0052] It can be understood that the specification of the sensor chip 22 is usually certain, so the larger the ratio of the first area to the second area, the more conducive it is to increase the mass of the vibration adjustment member 13; but if the ratio is too large, the adjustment protrusion 132 may interfere with the peripheral wall of the front cavity 221 of the sensor chip 22 during the vibration process, thereby affecting the performance of the bone voiceprint sensor 100. Of course, the size of the ratio will also affect the amount of gas in the front cavity 221 of the sensor chip 22, thereby affecting the performance of the sensor chip 22; therefore, in actual applications, the ratio of the first area to the second area can be designed according to actual conditions.

[0053] Furthermore, the distance between the regulating protrusion 132 and the sensing film 222 of the sensor chip 22 is greater than or equal to 10 micrometers.

[0054] Optionally, the distance between the regulating protrusion 132 and the sensing film 222 of the sensor chip 22 may be 12 micrometers, 15 micrometers, 17 micrometers, 20 micrometers, 23 micrometers, or 25 micrometers, or even larger.

[0055] It can be understood that the specification of the sensor chip 22 is usually certain, so the smaller the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22, the more conducive it is to increase the mass of the vibration adjusting member 13; but if the distance is too small, the adjusting protrusion 132 may interfere with the sensing film 222 of the sensor chip 22 during the vibration process, thereby affecting the performance of the bone voiceprint sensor 100. Of course, the size of the distance will also affect the amount of gas in the front cavity 221 of the sensor chip 22, thereby affecting the performance of the sensor chip 22; therefore, in actual applications, the distance between the adjusting protrusion 132 and the sensing film 222 can be designed according to actual conditions.

[0056] It should be noted that, in practical applications, the ratio of the first area to the second area, and the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 can be designed according to actual conditions, so as to increase the mass of the vibration adjustment member 13 to a large extent, ensure / improve the performance of the sensor chip 22, and avoid interference with the vibration of the adjusting protrusion 132 in the front cavity 221.

[0057] Furthermore, if Figure 2As shown, the adjusting protrusion 132 is arranged in the middle of the adjusting base 131. In this way, the elastic membrane 12 can be subjected to a more uniform force during the vibration process to reduce the risk of rupture; at the same time, the stability of the vibration of the elastic membrane 12 can be improved to improve the performance of the bone voiceprint sensor 100. For example, the adjusting base 131 is cylindrical, the adjusting protrusion 132 is cylindrical, and the projections of the adjusting base 131 and the adjusting protrusion 132 on the elastic membrane 12 are concentrically arranged; or, the adjusting base 131 is an elliptical column, the adjusting protrusion 132 is an elliptical column, and the projections of the adjusting base 131 and the adjusting protrusion 132 on the elastic membrane 12 are concentrically arranged; or, the cross section of the adjusting base 131 is a square, the cross section of the adjusting protrusion 132 is a square, and the projections of the adjusting base 131 and the adjusting protrusion 132 on the elastic membrane 12 are concentrically arranged; and so on.

[0058] In order to further increase the mass of the vibration adjusting member 13, in another embodiment of the present invention, Figure 2 As shown, the vibration adjustment member 13 includes an adjustment base 131 connected to the elastic membrane 12, and an adjustment protrusion 132 provided on the surface of the adjustment base 131; the adjustment base 131 includes an adjustment body 133 connected to the elastic membrane 12, and a lateral protrusion 134 provided on the side of the adjustment body 133, and a clearance gap is formed between the lateral protrusion 134 and the elastic membrane 12; the adjustment protrusion 132 extends from the sound hole 211 into the packaging shell 21. Specifically, the lateral protrusion 134 faces the side of the elastic membrane 12, and forms a clearance gap with the surface of the elastic membrane 12. When the elastic membrane vibrates, the size of the clearance gap will change with the vibration of the elastic membrane.

[0059] In this way, by making the adjustment base 131 include an adjustment body 133 connected to the elastic membrane 12, and a lateral protrusion 134 arranged on the side of the adjustment body 133, the space in the vibration pickup shell 11 can be effectively utilized to increase the mass of the vibration adjustment member 13 without increasing the connection area between the vibration adjustment member 13 and the elastic membrane 12, thereby improving the sensitivity of the bone voiceprint sensor 100 and improving the performance of the bone voiceprint sensor 100; and it is conducive to realizing the miniaturization design of the bone voiceprint sensor 100.

[0060] Furthermore, if Figure 1As shown, the packaging shell 21 and / or the vibration pickup shell 11 are provided with an air vent 212, and the air vent 212 is used to release pressure when assembling the vibration pickup unit 10 and the sensor unit 20. Specifically, the air vent 212 is connected to the external environment. In this way, by providing the air vent 212, when assembling the vibration pickup unit 10 and the sensor unit 20, the failure of the vibration pickup unit 10 or the sensor chip 22 due to the pressure difference between the inner and outer spaces of the packaging shell 21 or the vibration pickup shell 11 can be avoided, thereby reducing the difficulty of assembling the bone voiceprint sensor 100.

[0061] However, when the bone voiceprint sensor 100 is applied, that is, when it is applied to an electronic device, the leak hole 212 needs to be blocked to prevent it from affecting the performance of the bone voiceprint sensor 100. Optionally, the leak hole 212 can be blocked by sealant, adhesive sealing tape, or adding a sealing plug.

[0062] It should be noted that if the air leakage hole 212 is provided in the vibration pickup housing 11, optionally, the air leakage hole 212 is connected to the first cavity, such as the air leakage hole 212 is provided on the top of the vibration pickup housing 11; optionally, the air leakage hole 212 is an annular hole.

[0063] If the air leakage hole 212 is set on the packaging shell 21, it should be pointed out that, compared with setting the air leakage hole 212 on the vibration pickup shell 11, setting the air leakage hole 212 on the packaging shell 21 does not require opening a hole on the vibration pickup shell 11, thereby not reducing the vibration pickup area of ​​the vibration pickup shell 11, which is beneficial to improving the performance of the bone voiceprint sensor 100.

[0064] Furthermore, if Figure 1 As shown, the packaging shell 21 further includes a substrate 213, the sound hole 211 and the sensor chip 22 are arranged on the substrate 213; the vibration pickup shell 11 is installed on the substrate 213. Specifically, the open end of the vibration pickup shell 11 is installed on the substrate 213. In this way, the structure can be simplified.

[0065] Without loss of generality, Figure 1 As shown, the sensor unit 20 further includes an ASIC (Application Specific Integrated Circuit) chip 70 disposed in the packaging shell 21 . The ASIC chip 70 is electrically connected to the sensor chip 22 to process the electrical signal generated by the sensor chip 22 .

[0066] Specifically, the ASIC chip 70 may be disposed on the surface of the substrate 213, or the ASIC chip 70 may be embedded in the substrate 213. It should be noted that embedding the ASIC chip 70 in the substrate 213 may facilitate assembly of the bone voiceprint sensor 100.

[0067] Specifically, the substrate 213 is a circuit board, such as a PCB board, and the ASIC chip 70 is electrically connected to the substrate 213 .

[0068] Furthermore, if Figure 1 As shown, the packaging shell 21 includes a connecting plate 214, and the connecting plate 214 is arranged opposite to the base plate 213. The connecting plate 214 is used to be installed on the main control board of the electronic device.

[0069] Specifically, the electronic device includes an electric control board. When the bone voiceprint sensor 100 is applied to the electronic device, the bone voiceprint sensor 100 can be installed on the electric control board. Specifically, the connecting board 214 of the package shell 21 is installed on the main control board. Optionally, the connecting board 214 is mounted on the surface of the main control board.

[0070] Alternatively, if Figure 1 As shown, the connecting board 214 is provided with an electrical connection portion 2141 for electrically connecting to an external circuit (ie, a circuit of an electronic device), and the electrical connection portion 2141 is electrically connected to the substrate 213 to achieve electrical connection with the ASIC chip 70 and the sensor chip 22 .

[0071] In this way, when the connection board 214 is mounted on the electric control board, the electrical connection portion 2141 can be electrically connected to the electric control board, so that the sensor chip 22 is electrically connected to the external circuit (ie, the circuit of the electronic device).

[0072] Alternatively, if Figure 1 As shown, the packaging shell 21 further includes a surrounding plate 215 disposed on the periphery of the substrate 213 , and the surrounding plate 215 forms an opening at one end away from the substrate 213 , and the connecting plate 214 is connected to the opening.

[0073] Optionally, the sensor unit 20 further includes an electrical connector 23 , wherein the electrical connector 23 electrically connects the substrate 213 and the electrical connection portion 2141 . Optionally, the electrical connector 23 is embedded in the enclosure 215 .

[0074] It should be noted that if the air leakage hole 212 is provided on the packaging shell 21, optionally, the air leakage hole 212 is provided on the connecting plate 214. In this way, by providing the air leakage hole 212 on the connecting plate 214, when the bone voiceprint sensor 100 is installed (such as mounted) on the main control board, the air leakage hole 212 can be blocked by the original process of filling glue, thereby simplifying the on-site application process and reducing the production cost.

[0075] Alternatively, if Figure 1 As shown, the elastic membrane 12 and the vibration adjusting member 13 are provided with a first vent hole 121 .

[0076] Alternatively, if Figure 1As shown, a second vent hole 223 is provided on the sensing film 222 of the sensor chip 22 .

[0077] Optionally, the sensor chip 22 may be a microphone chip or a pressure sensor chip 22. That is, the sensor unit 20 may adopt a MEMS microphone or a MEMS pressure sensor, thus reducing the design difficulty of the bone voiceprint sensor 100.

[0078] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A bone voiceprint sensor, characterized in that: The bone voiceprint sensor comprises: A sensor unit, the sensor unit comprising a packaging shell and a sensor chip arranged in the packaging shell, wherein the packaging shell is provided with a sound hole; and A vibration pickup unit, the vibration pickup unit comprising a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell, and a vibration adjustment member arranged on the elastic membrane, the vibration pickup shell is installed in the packaging shell, the sound hole connects the vibration pickup shell and the packaging shell; the vibration adjustment member comprises an adjustment base connected to the elastic membrane, and an adjustment protrusion arranged on the surface of the adjustment base, the radial dimension of the adjustment base is greater than the radial dimension of the adjustment protrusion, the adjustment base is located in the vibration pickup shell, and the adjustment protrusion extends into the sound hole; The adjusting base is cylindrical, the adjusting protrusion is cylindrical, and the adjusting base and the projection of the adjusting protrusion on the elastic membrane are concentrically arranged; or, the adjusting base is elliptical, the adjusting protrusion is elliptical, and the adjusting base and the projection of the adjusting protrusion on the elastic membrane are concentrically arranged; or, the cross section of the adjusting base is square, the cross section of the adjusting protrusion is square, and the projection of the adjusting base and the projection of the adjusting protrusion on the elastic membrane are concentrically arranged; The adjustment base comprises a lateral protrusion, and a clearance gap is formed between the lateral protrusion and the elastic membrane.

2. The bone voiceprint sensor according to claim 1, characterized in that: The sensor chip is arranged corresponding to the sound hole, and the adjusting protrusion extends into the front cavity of the sensor chip.

3. The bone voiceprint sensor according to claim 2, characterized in that: The periphery of the acoustic hole is flush with the periphery of the front cavity of the sensor chip; or, the periphery of the acoustic hole is arranged outside the periphery of the front cavity of the sensor chip.

4. The bone voiceprint sensor according to claim 2, characterized in that: The projection of the regulating protrusion on the elastic membrane has a first area, the projection of the peripheral wall of the front cavity of the sensor chip on the elastic membrane has a second area, and the ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.

99.

5. The bone voiceprint sensor according to claim 2, characterized in that: The distance between the regulating protrusion and the sensing film of the sensor chip is greater than or equal to 10 micrometers.

6. The bone voiceprint sensor according to any one of claims 1 to 5, characterized in that: The adjusting protrusion is arranged at the middle part of the adjusting base.

7. The bone voiceprint sensor according to any one of claims 1 to 5, characterized in that: The packaging shell includes a substrate, the sound hole and the sensor chip are arranged on the substrate; and the vibration pickup shell is installed on the substrate.

8. The bone voiceprint sensor according to claim 7, characterized in that: The sensor unit further comprises an ASIC chip, wherein the ASIC chip is embedded in the substrate and is electrically connected to the sensor chip.

9. The bone voiceprint sensor according to any one of claims 1 to 5, characterized in that: The vibration adjusting member is connected to the elastic membrane through a colloid.

10. An electronic device, characterized in that: The method comprises the bone voiceprint sensor as claimed in any one of claims 1 to 9.

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