Chip luminescence performance testing equipment, its feeding mechanism and chip fixing device

Abstract

The present invention discloses a chip luminescence performance test device, a loading mechanism and a chip fixing device, the latter comprising: a chip carrier, a mounting surface of which is provided with a plurality of chip placement positions, the chips to be tested are placed one by one in the chip placement positions and are electrically connected to the chip carrier respectively; a cooling structure is fixedly installed on the side of the chip carrier away from the mounting surface and is used to cool the chip carrier; a carrier connector is laterally installed on the cooling structure and can push the cooling structure to move linearly in a preset direction; a carrier fixing plate is fixedly installed on the side of the chip carrier away from the cooling structure, and a plurality of through holes are provided on the carrier fixing plate, each of which corresponds one by one to the chip placement position. Through the design of the chip fixing device, the chip can be reliably and stably clamped during the chip luminescence performance test.

Description

Technical Field

[0001] The present invention relates to the technical field of chip performance testing equipment, and in particular to a chip fixing device for a loading mechanism of a chip luminescence performance testing device. The present invention also relates to a loading mechanism including the chip fixing device, and a chip luminescence performance testing device including the loading mechanism. Background Art

[0002] Currently, the application market for semiconductor laser chips is becoming increasingly widespread, but at the same time, their operating conditions are becoming increasingly demanding, and reliability requirements are also increasing. Among the many parameters of laser chips, the chip's luminescence performance is undoubtedly the most important. If the luminescence performance does not meet optical requirements, it will cause product performance to degrade or even fail. Therefore, it is necessary to use chip luminescence performance testing equipment to accurately and effectively test the chip. During the chip luminescence performance testing process, how to reliably clamp the chip and meet the requirements of position adjustment and cooling during the test has become a problem that technicians in this field need to solve urgently. Summary of the Invention

[0003] The purpose of the present invention is to solve at least one of the above problems, and this purpose is achieved through the following technical solutions.

[0004] The present invention provides a chip fixing device for a loading mechanism of a chip luminescence performance testing device, comprising:

[0005] A chip carrier board, wherein a plurality of chip placement positions are provided on a mounting surface of the chip carrier board, and chips to be tested are placed in the chip placement positions one by one and are electrically connected to the chip carrier board respectively;

[0006] a cooling structure, the cooling structure being fixedly mounted on a side of the chip carrier away from the mounting surface and being used to cool the chip carrier;

[0007] A carrier connector, which is laterally mounted on the cooling structure and is capable of pushing the cooling structure to move linearly in a preset direction;

[0008] The carrier fixing plate is fixedly mounted on a side of the chip carrier away from the cooling structure. The carrier fixing plate is provided with a plurality of through holes, each of the through holes corresponding to a chip placement position one by one.

[0009] During operation, the chip to be tested is placed on a chip carrier, the cooling structure is arranged below the chip carrier, and the carrier fixing plate is arranged above the chip carrier. From top to bottom, the carrier fixing plate, the chip carrier, and the cooling structure are stacked and fixedly connected. The carrier connector is arranged on the side of the cooling structure and can push the cooling structure to move linearly in a preset direction, thereby pushing the chip carrier and the chip on the chip carrier to move synchronously, so as to drive the chip to be tested to the appropriate test position. In this way, through the design of the chip fixing device, the chip can be reliably and stably clamped during the chip luminescence performance test, and through the setting of the cooling structure and the carrier connector, the chip's requirements for position adjustment and cooling during the test can be met, providing a guarantee and foundation for the chip luminescence performance test.

[0010] Furthermore, a plurality of slots are provided on the mounting surface of the chip carrier, and the slots form the chip placement positions, and the chips to be tested are placed in the slots in a one-to-one correspondence.

[0011] Furthermore, the cooling structure is a water-cooling block, a cooling pipeline is provided in the water-cooling block, and a water inlet and a water outlet of the cooling pipeline are both opened on the side wall of the water-cooling block.

[0012] Furthermore, a fixing pile is provided on the surface of the water cooling block facing the chip carrier, and a mounting hole is opened on the surface of the chip carrier facing the water cooling block, and the fixing pile is inserted into the mounting hole.

[0013] Furthermore, there are multiple fixing piles and multiple mounting holes, and each fixing pile is fixedly connected to each mounting hole in a one-to-one correspondence.

[0014] Furthermore, the carrier connector includes a driving member, a guide rod and a push plate, and a through hole is opened on the side wall of the cooling structure;

[0015] The guide rod is slidably mounted in the through hole, and one end of the guide rod located outside the through hole is fixedly connected to the push plate;

[0016] The push plate moves toward or away from the cooling structure under the driving of the driving member, so as to push the cooling structure to move along the guide rod.

[0017] Furthermore, the guide rod includes a first guide rod and a second guide rod, the first guide rod is located on one side of the push plate, and the second guide rod is located on the other side of the push plate.

[0018] Furthermore, the driving member is installed on the first guide rod and / or the second guide rod, and the driving member is an adjusting nut threadedly connected to the first guide rod and / or the second guide rod, and the guide rail without the driving member is a linear bearing.

[0019] The present invention further provides a loading mechanism, comprising a base and a chip fixing device mounted on the base, wherein the chip fixing device is the chip fixing device described above.

[0020] The present invention also provides a chip luminescence performance testing device, comprising the above-mentioned loading mechanism, or comprising the above-mentioned chip fixing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0022] Figure 1 This is a structural schematic diagram of a specific embodiment of the chip fixing device provided by the present invention.

[0023] Description of Reference Numerals

[0024] 1-Chip carrier 2-Water cooling block 3-Carrier connector 4-Carrier fixing plate

[0025] 11-Slot

[0026] 21-Fixed pile

[0027] 31-driving member 32-first guide rod 33-second guide rod 34-push plate

[0028] 41-Through hole DETAILED DESCRIPTION

[0029] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0030] Please refer to Figure 1 , Figure 1 This is a structural schematic diagram of a specific embodiment of the chip fixing device provided by the present invention.

[0031] In a specific embodiment, the chip fixing device provided by the present invention is used for the loading mechanism of the chip luminescence performance testing equipment, and is particularly suitable for the luminescence performance testing equipment of the VCSEL laser chip (chip in the 3D sensing field). The testing equipment is mainly used to test the optical properties of the VCSEL laser chip such as the laser light intensity, power, and divergence angle.

[0032] The chip fixing device includes a chip carrier 1, a cooling structure, a carrier connector 3 and a carrier fixing plate 4. Among them, a number of chip placement positions are provided on the mounting surface of the chip carrier 1, and the chips to be tested are placed one by one in the chip placement positions and are electrically connected to the chip carrier 1 respectively. Specifically, the chip is attached to the chip carrier 1 through silver glue. Each chip carrier 1 is generally provided with about 40 chip placement positions, and then a wire bonding machine is used to fix the conductive electrodes of the chip to the electrodes of the carrier using silver wire to achieve electrical connection between the chip and the chip carrier 1. The number and arrangement of the above-mentioned chip placement positions can be determined according to actual requirements, and are not limited to 40 placement positions, nor are they limited to Figure 1 The rectangular arrangement shown.

[0033] The cooling structure is fixedly mounted on the side of the chip carrier 1 away from the mounting surface and is used to cool the chip carrier 1. In this embodiment, the mounting surface of the chip carrier 1 where the chip mounting position is located faces upward, and the cooling structure is located below the chip carrier 1.

[0034] The carrier connector 3 is installed laterally on the cooling structure and can push the cooling structure to move linearly in a preset direction. The lateral direction of the cooling structure refers to a direction that is connected to and perpendicular to the above-mentioned installation surface.

[0035] The carrier fixing plate 4 is fixedly mounted on the side of the chip carrier 1 away from the cooling structure, that is, covering the mounting surface of the chip carrier 1. Obviously, a plurality of through holes 41 should be provided on the carrier fixing plate 4. These through holes 41 correspond one-to-one to the chip placement positions on the chip carrier 1 and are used to expose the chip placement positions and the chips to be tested placed thereon.

[0036] During operation, the chip to be tested is placed on the chip carrier 1, the cooling structure is arranged below the chip carrier 1, and the carrier fixing plate 4 is arranged above the chip carrier 1. From top to bottom, the carrier fixing plate 4, the chip carrier 1 and the cooling structure are stacked and fixedly connected; the carrier connector 3 is arranged on the side of the cooling structure, and can push the cooling structure to move linearly along a preset direction, thereby pushing the chip carrier 1 and the chip on the chip carrier 1 to move synchronously, so as to drive the chip to be tested to an appropriate test position. In this way, through the design of the chip fixing device, the chip can be reliably and stably clamped during the chip luminescence performance test, and through the setting of the cooling structure and the carrier connector 3, the position adjustment and cooling requirements of the chip during the test can be met, providing a guarantee and foundation for the chip luminescence performance test.

[0037] When the chip to be tested is placed on the chip carrier, in order to ensure position stability, a number of grooves 11 can be opened on the mounting surface of the chip carrier 1. The grooves 11 form the chip placement positions, and the chips to be tested are placed in the grooves 11 one by one, so that the chips to be tested are limited by the grooves 11.

[0038] Theoretically, the slot 11 should be slightly larger than the chip size. When a chip fixing plate is provided, the slot 11 can be formed by the through holes 41 on the chip fixing plate and the mounting surface of the chip carrier 1 .

[0039] Specifically, the above-mentioned cooling structure is a water-cooling block 2, and a cooling pipeline is provided in the water-cooling block 2. The water inlet and water outlet of the cooling pipeline are both opened on the side wall of the water-cooling block 2. During operation, the water inlet of the cooling pipeline is connected to the cooling water source, and its water outlet is connected to the heat exchanger or recoverer to realize the cooling cycle.

[0040] The above-mentioned cooling pipeline can be in the form of a serpentine tube to ensure that the entire surface area of ​​the water-cooling block 2 can be cooled; the cooling pipeline can also be replaced by a cooling cavity, that is, the interior of the entire water-cooling block 2 is the cooling cavity, and a water inlet and a water outlet connected to the cooling cavity are opened on the side wall of the water-cooling block 2.

[0041] In addition to water cooling, other medium cooling or air cooling such as compressor cooling may also be used. Considering the cost and installation space, water cooling and the corresponding water cooling block 2 are preferably used.

[0042] To ensure reliable installation and structural stability between the water-cooling block 2 and the chip carrier 1, fixing pegs 21 can be provided on the surface of the water-cooling block 2 facing the chip carrier 1. Mounting holes are provided on the surface of the chip carrier 1 facing the water-cooling block 2, and the fixing pegs 21 are inserted into the mounting holes. Specifically, there can be multiple fixing pegs 21 and multiple mounting holes, with each fixing peg 21 being fixedly connected to each mounting hole in a one-to-one correspondence.

[0043] Obviously, the water-cooling block 2 and the chip carrier 1 may also be fixedly connected by other structures, such as screw connection or slide block connection.

[0044] Furthermore, the carrier connector 3 includes a drive member 31, a guide rod, and a push plate 34. A through hole 41 is formed in the side wall of the cooling structure. The guide rod is slidably mounted in the through hole 41, and one end of the guide rod located outside the through hole 41 is fixedly connected to the push plate 34. Driven by the drive member 31, the push plate 34 moves toward or away from the cooling structure to push the cooling structure along the guide rod. During operation, when the chip position needs to be adjusted, a driving force is applied to the push plate 34 through the drive member 31, causing the push plate 34 to move toward the cooling structure and push the cooling structure, thereby driving the chip carrier 1 fixedly connected to the cooling structure and the chip on the chip carrier 1 to move synchronously.

[0045] The above-mentioned guide rod includes a first guide rod 32 and a second guide rod 33, the first guide rod 32 is located on one side of the push plate 34, and the second guide rod 33 is located on the other side of the push plate 34, and the driving member 31 is installed on the first guide rod 32 and / or the second guide rod 33, and the driving member 31 is an adjusting nut threadedly connected to the first guide rod 32 and / or the second guide rod 33, and the guide rail without the driving member 31 is a linear bearing.

[0046] In this embodiment, the first guide rod 32 can slide through the cooling structure, and the second guide rod 33 is a linear bearing, which can slide through the cooling structure and is provided with an adjusting nut at the end. When position adjustment is required, the adjusting nut is rotated to move the position of the adjusting nut on the second guide rod 33, thereby pushing the push plate 34 to move, thereby realizing the driving of the push plate 34.

[0047] Theoretically, the driving member 31 only needs to provide the push plate 34 with a force to slide along the guide rail. For example, it can also be a telescopic cylinder or other structure. The preset direction of movement of the push plate 34 is the extension direction of the guide rod.

[0048] In addition to the above-mentioned chip fixing device, the present invention also provides a loading mechanism including the chip fixing device, and a chip luminescence performance testing device including the loading mechanism. The other structural parts of the loading mechanism and the other structural parts of the chip luminescence performance testing device have no influence on the technical effect of the present invention, so they will not be elaborated on.

[0049] It should be understood that although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order.

[0050] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A chip fixing device, used for a loading mechanism of a chip luminescence performance testing device, characterized in that: include: A chip carrier (1), wherein a plurality of chip placement positions are provided on the mounting surface of the chip carrier (1), wherein the chips to be tested are placed one by one in the chip placement positions and are electrically connected to the chip carrier (1) respectively, and the conductive electrodes of the chips to be tested are connected to the electrodes of the chip carrier (1) via silver wires; a cooling structure, wherein the cooling structure is fixedly mounted on a side of the chip carrier (1) away from the mounting surface and is used to cool the chip carrier (1); a carrier connector (3), wherein the carrier connector (3) is laterally mounted on the cooling structure and is capable of pushing the cooling structure to move linearly in a preset direction; a carrier fixing plate (4), wherein the carrier fixing plate (4) is fixedly mounted on a side of the chip carrier (1) away from the cooling structure, wherein a plurality of through holes (41) are provided on the carrier fixing plate (4), wherein each through hole (41) corresponds one by one to the chip placement position; The carrier connector (3) comprises a driving member (31), a guide rod and a push plate (34); a through hole is provided on a side wall of the cooling structure; the guide rod is slidably mounted on the through hole, and one end of the guide rod located outside the through hole is fixedly connected to the push plate (34); the push plate (34) moves towards or away from the cooling structure under the drive of the driving member (31) to push the cooling structure to move along the guide rod; The guide rod comprises a first guide rod (32) and a second guide rod (33), wherein the first guide rod (32) is located on one side of the push plate (34), and the second guide rod (33) is located on the other side of the push plate (34); The driving member (31) is installed on the first guide rod (32) and / or the second guide rod (33); the driving member (31) is an adjusting nut threadedly connected to the first guide rod (32) and / or the second guide rod (33); and the guide rail on which the driving member (31) is not installed is a linear bearing.

2. The chip fixing device according to claim 1, characterized in that: A plurality of slots (11) are provided on the mounting surface of the chip carrier (1), the slots (11) forming the chip placement positions, and the chips to be tested are placed in the slots (11) in a one-to-one correspondence.

3. The chip fixing device according to claim 1, characterized in that: The cooling structure is a water-cooling block (2), a cooling pipeline is arranged in the water-cooling block (2), and a water inlet and a water outlet of the cooling pipeline are both opened on the side wall of the water-cooling block (2).

4. The chip fixing device according to claim 3, characterized in that: A fixing pile (21) is provided on the surface of the water cooling block (2) facing the chip carrier (1), and a mounting hole is provided on the surface of the chip carrier (1) facing the water cooling block (2), and the fixing pile (21) is inserted into the mounting hole.

5. The chip fixing device according to claim 4, characterized in that: The number of the fixing piles (21) and the number of the mounting holes are both multiple, and each of the fixing piles (21) is fixedly connected in each of the mounting holes in a one-to-one correspondence.

6. A feeding mechanism, characterized in that: It comprises a base and a chip fixing device installed on the base, and the chip fixing device is the chip fixing device according to any one of claims 1 to 5.

7. A chip luminescence performance testing device, characterized in that: It comprises the loading mechanism as claimed in claim 6, or comprises the chip fixing device as claimed in any one of claims 1-5.

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