Chuck table and inspection device

Abstract

A chuck table and an inspection device are provided, which can easily observe the workpiece even if the holding portion is composed of a transparent body. The chuck table (1) holds a frame unit to which the workpiece is fixed at the opening of an annular frame by means of a belt. The chuck table (1) includes: a holding portion (3) composed of a transparent body, which has a holding surface (2) for holding the workpiece across the belt; a frame (4) which is vertically arranged around the holding portion (3) and surrounds the holding portion; and a plurality of suction holes (5) which are arranged on the inner circumferential surface (7) of the frame (4). The inner diameter of the frame (4) is less than the inner diameter of the annular frame. When the opening (4-1) of the frame (4) is covered by the belt of the frame unit, suction is transmitted from the suction holes (5), and the air between the belt and the holding surface (2) is discharged, so that the belt is tightly attached to the holding surface (2), and the workpiece of the frame unit is fixed on the holding surface (2).

Description

Technical Field

[0001] The present invention relates to a chuck table and an inspection device for observing a workpiece of a frame unit through a belt. Background Art

[0002] When processing semiconductor device wafers or device wafers such as SiC (silicon carbide), LT (lithium tantalate), and LN (lithium niobate), cutting tools or laser beams are used. To prevent the wafers and other workpieces from becoming scattered after being cut, they are formed into frame units secured to the openings of a ring-shaped frame with a band. The workpiece is then secured to a multi-hole chuck table, etc., via the band, and processed (see, for example, Patent Document 1).

[0003] However, sometimes it is desirable to observe the back side of the workpiece before and after processing. For example, if it is desired to fix the front side of the workpiece, where a component is formed, to a belt and then cut from the back side, there is a separation line (predetermined dividing line) on the front side where the component is formed. Consideration has been given to using an infrared camera to observe from the exposed back side. However, if the exposed back side is coated with a metal film, even with an infrared camera observing from the back side, the separation line on the front side cannot be detected. Therefore, in order to observe the front side of the workpiece through the chuck table, consideration has been given to using a chuck table made of a transparent material such as glass (see, for example, Patent Documents 2 and 3).

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2014-013812

[0005] Patent Document 2: Japanese Patent Application Laid-Open No. 2006-281434

[0006] Patent Document 3: Japanese Patent Application Laid-Open No. 2010-087141

[0007] However, using a chuck table with a holding portion made of a transparent material such as glass presents the following issues: Because glass is typically not breathable, vacuum grooves must be formed on the holding surface. However, these grooves are difficult to focus on, making observation difficult. Alternatively, if the entire transparent holding portion is covered with a tape and vacuumed through suction holes on the outer periphery of the tape, the grooves on the holding surface are unnecessary. However, air may remain between the holding surface and the tape, making observation equally difficult. Summary of the Invention

[0008] Therefore, an object of the present invention is to provide a chuck table and an inspection device that allow easy observation of a workpiece even when the holding portion is formed of a transparent body.

[0009] According to one embodiment of the present invention, a chuck worktable is provided for holding a frame unit to which a workpiece is fixed at an opening of an annular frame by means of a belt, wherein the chuck worktable comprises: a holding portion formed of a transparent body, which has a holding surface for holding the workpiece via the belt; and a frame body, which is uprightly arranged around the holding portion and surrounds the holding portion, and has a plurality of suction holes on the inner circumferential surface, the inner diameter of the frame body is smaller than the inner diameter of the annular frame, and suction is transmitted from the plurality of suction holes in a state where the opening of the frame body is covered by the belt of the frame unit, and the air between the belt and the holding surface is discharged to make the belt tightly adhere to the holding surface, thereby fixing the workpiece of the frame unit to the holding surface.

[0010] It is preferable that the entire holding surface of the holding portion of the chuck table is flat and has no suction grooves formed thereon.

[0011] According to another embodiment of the present invention, an inspection device is provided for inspecting a workpiece, wherein the inspection device comprises: a chuck table, which uses a holding surface to hold a frame unit to which the workpiece is fixed at an opening of an annular frame by means of a belt; a camera unit, which photographs the workpiece held by the chuck table from the holding surface side across the holding surface; and a moving unit, which causes the chuck table and the camera unit to move relative to each other in an X-axis direction parallel to the holding surface or in a Y-axis direction perpendicular to the X-axis direction, wherein the chuck The workbench includes: a holding portion composed of a transparent body, which has a holding surface for holding a workpiece via a belt; and a frame, which is uprightly arranged around the holding portion and surrounds the holding portion, and has a plurality of suction holes on the inner circumferential surface. The inner diameter of the frame is less than the inner diameter of the annular frame. When the opening of the frame is covered with the belt of the frame unit, suction is transmitted from the plurality of suction holes, and the air between the belt and the holding surface is discharged to make the belt tightly attached to the holding surface, thereby fixing the workpiece of the frame unit to the holding surface.

[0012] Preferably, the inspection device is mounted on a processing device having a processing unit that processes the workpiece using a cutting tool or laser light, the processing unit processes the workpiece held by the chuck worktable, and the inspection device photographs and inspects the workpiece processed by the processing unit through the chuck worktable.

[0013] The present invention has the effect that the workpiece can be easily observed even when the holding portion is formed of a transparent body. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view showing a configuration example of a processing device including the chuck table and the inspection device according to the first embodiment.

[0015] Figure 2 Is a Figure 1 The illustrated embodiment is a perspective view of a ring-shaped frame unit of a workpiece to be processed by the processing apparatus.

[0016] Figure 3 It is a perspective view showing a configuration example of the inspection device according to the first embodiment.

[0017] Figure 4 It is a perspective view showing a structural example of the chuck table according to the first embodiment.

[0018] Figure 5 It is a cross-sectional view of a structural example of the chuck table according to the first embodiment.

[0019] Figure 6 Yes Figure 1 The figure is a cross-sectional view showing a state in which the frame of the chuck table and the annular frame pair of the frame unit of the processing device are coaxially positioned.

[0020] Figure 7 It is shown in Figure 6 The figure is a cross-sectional view showing a state in which the annular frame of the frame unit is placed on the upper surface of the frame body of the chuck table of the processing apparatus.

[0021] Figure 8 It is shown in Figure 7 A perspective view showing a state in which a workpiece is sucked and held on the holding surface of the chuck table via a belt of a frame unit.

[0022] Figure 9 yes Figure 8 A cross-sectional view of the chuck table and workpiece is shown.

[0023] Figure 10 The camera unit is used to observe Figure 9 sectional view showing the back side of the workpiece.

[0024] Figure 11 This is a perspective view showing a configuration example in which an inspection device including a chuck table according to a second embodiment is mounted on a processing device.

[0025] Figure 12 It is a perspective view of a frame unit including a chuck table as a first modified example and a workpiece to be inspected by an inspection device.

[0026] Figure 13 It shows that Figure 12 A perspective view showing a state where the frame unit is attracted and held by the chuck table.

[0027] Figure 14 It is a perspective view of a structural example of a processing device equipped with an inspection device according to a second modified example.

[0028] Description of labels

[0029] 1: Chuck worktable (holding worktable); 2: Holding surface; 3: Holding portion; 4: Frame; 4-1: Opening; 5: Suction hole; 7: Inner circumference; 10, 10-2, 10-3: Inspection device; 11: Camera unit; 12: X-axis moving unit (moving unit); 40: Moving unit; 120: Cutting unit (machining unit); 120-3: Laser beam irradiation unit (machining unit); 121: Cutting tool; 121-3: Laser beam; 140-3: Y-axis moving unit (moving unit); 200: Workpiece; 205: Belt; 206: Annular frame; 207: Opening; 210: Frame unit. DETAILED DESCRIPTION

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include contents that can be easily imagined by those skilled in the art, and substantially the same contents. In addition, the structures described below can be appropriately combined. In addition, various omissions, replacements, or changes in the structure can be made within the scope of the present invention.

[0031] [First embodiment]

[0032] A chuck table and an inspection device according to a first embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a perspective view showing a configuration example of a processing device including the chuck table and the inspection device according to the first embodiment. Figure 2 Is a Figure 1 The illustrated diagram is a perspective view of a frame unit of a workpiece to be processed by the processing apparatus. Figure 3 It is a perspective view showing a configuration example of the inspection device according to the first embodiment. Figure 4 It is a perspective view showing a configuration example of the inspection table according to the first embodiment. Figure 5 It is a cross-sectional view of a configuration example of the inspection table according to the first embodiment.

[0033] The chuck table 1 and the inspection device 10 of the first embodiment are configured as follows: Figure 1 The processing device 100 is shown. Figure 1 The processing device 100 shown is a Figure 2 The frame unit 210 shown is a cutting device for cutting (equivalent to processing) a workpiece 200 . Figure 1The workpiece 200 processed by the processing apparatus 100 shown is a disc-shaped semiconductor wafer or optical device wafer, such as a wafer made of a base material such as silicon, sapphire, gallium, SiC (silicon carbide), LT (lithium tantalate), or LN (lithium niobate). On a front surface 201 of the workpiece 200, devices 203 are formed in regions partitioned in a grid pattern by a plurality of predetermined dividing lines 202 formed in a grid pattern.

[0034] In addition, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thin center portion and a thick wall portion formed on the outer periphery. In addition to a wafer, it may also be a rectangular package substrate having a plurality of components sealed with resin, a ceramic substrate, a ferrite substrate, or a substrate containing at least one of nickel and iron. In the first embodiment, the workpiece 200 is formed by attaching the back surface 204 of the back side of the front surface 201 to a belt 205 having an annular frame 206 installed on the outer periphery, and supported by the annular frame 206. Figure 2 The frame unit 210 shown in FIG. That is, the frame unit 210 is formed by fixing the workpiece 200 to the opening 207 of the annular frame 206 via the belt 205 .

[0035] Figure 1 The processing device 100 shown is a device that holds the workpiece 200 using a chuck table 1 and cuts it along the planned dividing line 202 using a cutting tool 121. Figure 1 As shown, the processing device 100 is equipped with the inspection device 10 and includes a cutting unit 120 , a second camera unit 130 , and a control unit 195 . The cutting unit 120 has a cutting tool 121 mounted on a spindle 122 for cutting a workpiece 200 held by the chuck table 1 of the inspection device 10 .

[0036] In the first embodiment, the inspection device 10 is provided in the device body 101 of the processing device 100. Figure 1 and Figure 3 As shown, the inspection device 10 has: a chuck table 1 as a holding table; a camera unit 11 (only in Figure 3 an X-axis moving unit 12 as a moving unit; and a rotating unit 13.

[0037] The chuck table 1 holds the frame unit 210 using the holding surface 2. Figure 3 、 Figure 4 as well as Figure 5 As shown, the chuck table 1 includes: a holding portion 3 formed of a transparent body; a frame 4 erected around the holding portion 3 to surround the holding portion 3; and a plurality of suction holes 5.

[0038] The holding portion 3 is made of a transparent material such as glass (quartz glass in the first embodiment) and is formed into a disk shape. Its upper surface includes a holding surface 2 for holding the workpiece 200 via a belt 205. The holding surface 2 is flat along both the X-axis, which is parallel to the horizontal direction, and the Y-axis, which is perpendicular to the X-axis and parallel to the horizontal direction. Specifically, the holding surface 2 of the transparent holding portion 3 is entirely flat, and no grooves are formed to attract the workpiece 200.

[0039] The frame 4 is made of a metal such as stainless steel. The frame 4 is formed into a cylindrical shape with an inner diameter equal to the outer diameter of the holding portion 3. The upper surface 6 of the frame 4 is positioned above the holding surface 2 and is formed flat along both the X-axis and the Y-axis. The inner diameter of the frame 4 is less than or equal to the inner diameter of the annular frame 206. In the first embodiment, the inner diameter of the frame 4 is smaller than the inner diameter of the annular frame 206. The inner diameter of the frame 4 is larger than the outer diameter of the workpiece 200.

[0040] The plurality of suction holes 5 are provided to open between the holding surface 2 and the upper surface 6 of the inner peripheral surface 7 of the frame 4. In the first embodiment, a plurality of suction holes 5 are provided at intervals in the circumferential direction of the frame 4. Figure 5 As shown, the suction hole 5 is connected to a suction source 9 via an on-off valve 8. The suction source 9 is composed of, for example, a vacuum pump.

[0041] In addition, the chuck table 1 is configured to be movable in the X-axis direction by the X-axis moving unit 12, and is configured to be rotatable around an axis parallel to the Z-axis direction by the rotating unit 13. The chuck table 1 sucks the workpiece 200 placed on the holding surface 2 through the belt 205 by opening the on-off valve 8 and performing suction through the suction source 9. In the first embodiment, the chuck table 1 sucks and holds the back side 204 of the workpiece 200 through the belt 205. In this way, the chuck table 1 transmits the suction force of the suction source 9 from the suction hole 5 while covering the opening 4-1 of the frame body 4 with the belt 205 of the frame unit 210, exhausts the air between the belt 205 and the holding surface 2, and makes the belt 205 tightly adhere to the holding surface 2, thereby fixing the workpiece 200 of the frame unit 210 on the holding surface 2.

[0042] The camera unit 11 captures an image of the workpiece 200 held by the chuck table 1 from the holding surface 2 side across the holding surface 2. In the first embodiment, the chuck table 1 is moved away from the cassette 171 (described later) by the X-axis moving unit 12, and the camera unit 11 is positioned below the holding portion 3 of the chuck table 1, facing the workpiece 200 held by the holding surface 2 in the Z-axis direction across the holding portion 3 and the belt 205.

[0043] The camera unit 11 has a photographing element for photographing a cut groove (not shown) formed by cutting the workpiece 200 held by the chuck table 1. The photographing element is, for example, a CCD (Charge-Coupled Device) photographing element or a CMOS (Complementary MOS) photographing element. The camera unit 11 photographs the cut groove of the workpiece 200 held by the chuck table 1 and outputs the photographed image to the control unit 195. That is, the camera unit 11 photographs the workpiece 200 to be cut by the cutting unit 120 across the chuck table 1. The camera unit 11 is fixed to the Y-axis moving mechanism 21 and can move in the Y-axis direction.

[0044] The X-axis moving unit 12 moves the chuck table 1 and the cutting unit 120 relative to each other in the X-axis direction parallel to the holding surface 2. In the first embodiment, the chuck table 1 is moved in the X-axis direction. The Y-axis moving mechanism 21 moves the chuck table 1 and the camera unit 11 relative to each other in the Y-axis direction parallel to the holding surface 2. Figure 3 As shown, the X-axis moving unit 12 and the Y-axis moving mechanism 21 have: a well-known ball screw 14, which is configured to rotate freely around the axis; a well-known pulse motor 15, which rotates the ball screw 14 around the axis; and a well-known guide rail 16, which supports the chuck worktable 1 so that it can move freely in the X-axis direction.

[0045] The rotating unit 13 rotates the chuck table 1 around an axis parallel to the Z-axis direction perpendicular to both the X-axis direction and the Y-axis direction. The rotating unit 13 rotates the chuck table 1 around the axis within a range of more than 180 degrees and less than 360 degrees. The chuck table 1 and the rotating unit 13 are provided in a housing 17 (at the bottom) that is moved in the X-direction by the X-axis moving unit 12. Figure 3 and Figure 5 (shown in the figure). The rotation unit 13 includes a motor 18 fixed to the side of the housing 17; a pulley 19 connected to the output shaft of the motor 18; and a belt 20 wrapped around the outer circumference of the chuck table 1 and rotated about the axis by the pulley 19. When the rotation unit 13 rotates the motor 18, the pulley 19 and the belt 20 rotate the chuck table 1 about the axis. In the first embodiment, the rotation unit 13 can rotate the chuck table 1 220 degrees in both one direction about the axis and in another direction opposite to the one direction.

[0046] In addition, if Figure 1As shown, the processing device 100 comprises at least: a Y-axis moving unit 140, which moves the chuck table 1 and the cutting unit 120 relative to each other in the Y-axis direction; and a Z-axis moving unit 150, which moves the chuck table 1 and the cutting unit 120 relative to each other in the Z-axis direction. Figure 1 As shown, the processing device 100 is a cutting device having two cutting units 120, that is, a dicing saw with two main spindles, a so-called facing dual-spindle type cutting device.

[0047] The cutting unit 120 is a machining unit that uses a cutting tool 121 to machine a workpiece 200 held by the chuck table 1. The cutting unit 120 is provided so as to be movable in the Y-axis direction relative to the workpiece 200 held by the chuck table 1 by a Y-axis moving unit 140 and in the Z-axis direction by a Z-axis moving unit 150.

[0048] like Figure 1 As shown, one cutting unit 120 is installed on one column 104 of a gate-shaped support frame 103 erected from the device body 101 via a Y-axis moving unit 140, a Z-axis moving unit 150, etc. Figure 1 As shown, the other cutting unit 120 is installed on the other column 105 of the support frame 103 via the Y-axis moving unit 140 and the Z-axis moving unit 150. In addition, the support frame 103 connects the upper ends of the columns 104 and 105 to each other through the horizontal beam 106.

[0049] The cutting unit 120 can position the cutting tool 121 at any position on the holding surface 2 of the chuck table 1 via the Y-axis moving unit 140 and the Z-axis moving unit 150. The cutting unit 120 includes a spindle housing 123, which is movably mounted in the Y-axis and Z-axis directions via the Y-axis moving unit 140 and the Z-axis moving unit 150, and a spindle 122, which is rotatably mounted in the spindle housing 123 about its axis and rotated by a motor, and has the cutting tool 121 mounted at its tip.

[0050] The second camera unit 130 is fixed to the cutting unit 120 so as to move integrally therewith. The second camera unit 130 includes an imaging element for imaging the area to be cut of the workpiece 200 held by the chuck table 1 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary Metal Oxide Semiconductor) imaging element. The second camera unit 130 images the workpiece 200 held by the chuck table 1 to obtain an image used for alignment, i.e., for aligning the workpiece 200 with the cutting tool 121, and outputs the obtained image to the control unit 195.

[0051] The Y-axis moving unit 140 moves the cutting unit 120 in the Y-axis direction, which is the indexing feed direction, thereby performing indexing feed relative to the chuck table 1 and the cutting unit 120 along the Y-axis direction. The Z-axis moving unit 150 moves the cutting unit 120 in the Z-axis direction, which is the plunge feed direction, thereby performing plunge feed relative to the chuck table 1 and the cutting unit 120 along the Z-axis direction.

[0052] The Y-axis moving unit 140 and the Z-axis moving unit 150 include: well-known ball screws 141, 151, which are configured to rotate freely around the axis; well-known pulse motors 142, 152, which cause the ball screws 141, 151 to rotate around the axis; and well-known guide rails 143, 153, which support the cutting unit 120 to move freely in the Y-axis direction or the Z-axis direction.

[0053] The machining apparatus 100 also includes an X-axis position detection unit (not shown) for detecting the X-axis position of the chuck table 1; a Y-axis position detection unit (not shown) for detecting the Y-axis position of the cutting unit 120; and a Z-axis position detection unit for detecting the Z-axis position of the cutting unit 120. The X-axis position detection unit and the Y-axis position detection unit may include a linear scale parallel to the X-axis or Y-axis direction, and a head movable in the X-axis or Y-axis direction by the X-axis moving unit 12 or the Y-axis moving unit 140 to read the scale of the linear scale. The X-axis position detection unit and the Y-axis position detection unit output information indicating the scale of the linear scale read by the head to the control unit 195 as information indicating the X-axis position of the chuck table 1 or the Y-axis position of the cutting unit 120. The Z-axis position detection unit detects the Z-axis position of the cutting unit 120 using the pulse number of the pulse motor 152 that rotates the ball screw 151 around its axis, and outputs information indicating the detected Z-axis position of the cutting unit 120 to the control unit 195 .

[0054] The processing apparatus 100 also includes a cassette elevator 170 that places a cassette 171 on its upper surface, which contains a plurality of workpieces 200 before and after cutting, spaced apart in the Z-axis direction, and moves the cassette 171 up and down in the Z-axis direction; a cleaning unit 180 that cleans the workpieces 200 after cutting; and a transport unit (not shown) that transports a frame unit 210 between the cassette 171, the chuck table 1, and the cleaning unit 180. The transport unit transports the annular frame 206 of the frame unit 210, to which the workpieces 200 before cutting are fixed, to a position coaxial with the frame body 4.

[0055] The control unit 195 is a computer that controls the aforementioned units of the processing device 100 and the inspection device 10, causing them to perform processing operations on the workpiece 200. The control unit 195 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit); a storage device having a memory such as a ROM (read-only memory) or a RAM (random access memory); and an input / output interface device. The arithmetic processing unit of the control unit 195 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the processing device 100 to the aforementioned units of the processing device 100 and the inspection device 10 via the input / output interface device.

[0056] Furthermore, the control unit 195 is connected to a display unit (not shown) that displays the status of the processing operation, images captured by the camera units 11 and 130, and an input unit used by the operator to register processing content information. The display unit is composed of a liquid crystal display device, etc. The input unit is composed of an external input device such as a touch panel or a keyboard provided on the display screen of the display unit.

[0057] Next, this specification describes the processing operation of the processing device 100 having the above-mentioned structure. Figure 6 It shows that Figure 1 The illustrated cross-sectional view shows a state in which the frame body 4 of the chuck table 1 and the annular frame 206 of the frame unit 210 of the processing apparatus are coaxially positioned. Figure 7 It is shown in Figure 6 The illustrated cross-sectional view shows a state in which the annular frame 206 of the frame unit 210 is placed on the upper surface of the frame body 4 of the chuck table 1 of the processing apparatus. Figure 8 It is shown in Figure 7 The illustrated perspective view shows a state in which a workpiece 200 is sucked and held on the holding surface 2 of the chuck table 1 via a belt 205 of a frame unit 210 . Figure 9 yes Figure 8 A cross-sectional view of the chuck table 1 and the workpiece 200 is shown. Figure 10 The camera unit 11 is used to observe Figure 9 1 is a cross-sectional view of the back side of the workpiece 200 shown.

[0058] First, during a machining operation, the operator registers machining content information in the control unit 195, stores the frame unit 210, to which the workpiece 200 before cutting is fixed, in the cassette 171, and sets the cassette 171 on the upper surface of the cassette elevator 170. Then, when the machining apparatus 100 receives a machining start instruction from the operator, the machining operation begins.

[0059] During the machining operation, the machining apparatus 100 uses the transport unit to take out a frame unit 210 having the workpiece 200 before cutting fixed thereto from the cassette 171. Figure 6 After the annular frame 206 of the frame unit 210 and the frame body 4 of the chuck table 1 are aligned coaxially as shown, the annular frame 206 is placed on the upper surface 6 of the frame body 4 via the belt 205. At this time, the belt 205 is spaced apart from the holding surface 2 of the holding portion 3 and covers the opening 4-1 surrounded by the entire surface of the holding surface 2 and the inner peripheral surface 7 of the frame body 4.

[0060] like Figure 7As shown, the processing device 100 opens the on-off valve 8 to transmit the suction force of the suction source 9 to the suction hole 5, and exhausts the air between the holding surface 2 of the holding portion 3 and the belt 205 through the suction hole 5. Figure 8 and Figure 9 As shown, the belt 205 is in close contact with the holding surface 2, sucking and holding the back surface 204 of the workpiece 200 on the holding surface 2 via the belt 205. The processing device 100 moves the chuck table 1 via the X-axis moving unit 12, and uses the second camera unit 130 to capture an image of the workpiece 200 on the chuck table 1. The processing device 100 performs alignment to align the workpiece 200 with the cutting tool 121. While the chuck table 1 and the cutting tool 121 of the cutting unit 120 are relatively moved along the intended dividing line 202, the cutting tool 121 cuts into the intended dividing line 202 until it reaches the belt 205. The processing device 100 uses the cutting unit 120 to cut the workpiece 200 held by the chuck table 1 along the intended dividing line 202, forming a cut groove (not shown) on the intended dividing line 202 of the workpiece 200.

[0061] After the machining device 100 forms a cut groove on all or part of the planned dividing line 202 using the cutting tool 121, the chuck table 1 is moved above the camera unit 11 via the X-axis moving unit 12. The camera unit 11 of the inspection device 10 photographs and inspects the workpiece 200 cut by the cutting unit 120 through the holding portion 3 of the chuck table 1. Specifically, the inspection device 10 uses the camera unit 11 to photograph the cut groove on the back surface 204 of the workpiece 200 cut by the cutting unit 120, and inspects the position of the cut groove and the quality of chipping formed on the edge of the cut groove.

[0062] In the first embodiment, the inspection device 10 determines the workpiece 200 as defective when the center of the cut groove in the width direction deviates from the center of the planned dividing line 202 in the width direction by a predetermined distance or more, and determines the workpiece 200 as acceptable when the deviation is less than the predetermined distance. In the first embodiment, the inspection device 10 determines the workpiece 200 as defective when the distance between the tip of the chip and the edge of the cut groove is greater than a predetermined distance, and determines the workpiece 200 as acceptable when the distance is less than the predetermined distance. Alternatively, the inspection device 10 may inspect the cut groove at a predetermined position on the back surface 204 of the workpiece 200 to determine the quality, or may inspect the cut groove across the entire back surface 204 of the workpiece 200 to determine the quality. In the first embodiment, the inspection device 10 inspects the quality of the cut groove position and the quality of the chip formed at the edge of the cut groove. However, in the present invention, the inspection targets and quality determination methods of the inspection device 10 are not limited to those described in the first embodiment. In the first embodiment, the second camera unit 130 may also be used to capture an image of the cut groove on the front surface 201 and use the image for quality determination.

[0063] After inspecting the workpiece 200, the processing apparatus 100 releases the suction holding of the chuck table 1 and uses the transport unit to transport the frame unit 210, with the workpiece 200 fixed thereto, to the cleaning unit 180. The processing apparatus 100 then uses the cleaning unit 180 to clean the frame unit 210 with the workpiece 200 fixed thereto. The transport unit then transports the frame unit 210 with the workpiece 200 fixed thereto from the cleaning unit 180 to the cassette 171. When the processing apparatus 100 completes cutting of all the workpieces 200 in the cassette 171, the processing operation ends.

[0064] The chuck table 1 of the first embodiment described above includes a frame 4 surrounding a holding portion 3 formed of a transparent body. The upper surface 6 of the frame 4 is located above the holding surface 2, and suction holes 5 are provided on the inner circumferential surface 7 of the frame 4. Furthermore, the opening 4-1 of the frame 4 of the chuck table 1 is covered by the belt 205 of the frame unit 210, and the air between the holding surface 2 covered by the belt 205 and the belt 205 is exhausted through the suction holes 5, causing the belt 205 to adhere tightly to the holding surface 2. As a result, the chuck table 1 can smoothly adhere the belt 205 to the holding surface 2, eliminating any air from remaining between the belt 205 and the holding surface 2, thereby enabling observation of the entire back surface 204 of the workpiece 200. This provides the advantage that even when the chuck table 1 includes a transparent holding portion 3, the workpiece 200 can be easily observed.

[0065] In addition, regarding the chuck worktable 1, the entire holding surface 2 of the holding portion 3 composed of a transparent body is flat and no suction groove is formed, thereby preventing the camera unit 11 from being difficult to focus on the holding surface 2 and preventing the camera unit 11 from being difficult to observe the back side 204 of the workpiece 200.

[0066] The inspection device 10 of the first embodiment includes: the above-mentioned chuck worktable 1; and a camera unit 11, which photographs the workpiece 200 held by the chuck worktable 1 through the holding surface 2, thereby achieving the following effect: even if the holding part 3 of the chuck worktable 1 is composed of a transparent body, the camera unit 11 can easily observe the workpiece 200 held by the holding surface 2.

[0067] Since the inspection apparatus 10 of the first embodiment is mounted on the processing apparatus 100 including the cutting unit 120 , it is possible to suppress difficulty in observing the back surface 204 of the workpiece 200 cut by the cutting unit 120 .

[0068] [Second embodiment]

[0069] A chuck table and an inspection device according to a second embodiment of the present invention will be described with reference to the accompanying drawings. Figure 11 This is a perspective view showing a configuration example in which an inspection device having a chuck table according to a second embodiment is mounted on a processing device. Figure 11 In the present invention, the same parts as those in the first embodiment are denoted by the same reference numerals and their descriptions are omitted.

[0070] The inspection device 10-2 of the second embodiment is housed in an outer shell 30 installed on the outer surface of the device body 101 of the processing device 100-2 and is mounted on the processing device 100-2. The processing device 100-2 equipped with the inspection device 10-2 of the second embodiment has a chuck table 190, which is configured to be movable in the X-axis direction by the X-axis moving unit 12 and rotatable around an axis parallel to the Z-axis direction by a rotation drive source not shown in the figure, and is in the shape of a disk, and a holding surface 191 for holding the workpiece 200 is formed by porous ceramics or the like. The chuck table 190 is separate from the chuck table 1 of the inspection device 10-1. The chuck table 190 is connected to a vacuum suction source not shown in the figure, and is sucked by the vacuum suction source, thereby sucking and holding the back side 204 of the workpiece 200 placed on the holding surface 191 through the belt 205. In addition, as Figure 11 As shown, a plurality of clamping portions 192 for clamping the annular frame 206 are provided around the chuck table 190 .

[0071] The inspection apparatus 10-2 of the second embodiment has the same structure as the inspection apparatus 10 of the first embodiment, except that it includes a moving unit 40 for relatively feeding the chuck table 1 and the camera unit 11 in the Y-axis direction, instead of the X-axis moving unit 12 of the inspection apparatus 10 of the first embodiment. In the second embodiment, the moving unit 40 moves the chuck table 1 in the Y-axis direction.

[0072] The moving unit 40 has: a well-known ball screw 41, which is arranged to rotate freely around the axis; a well-known pulse motor 42, which rotates the ball screw 41 around the axis; and a well-known guide rail 43, which supports the chuck worktable 1 and the rotating unit 13 via the housing 17 so that they can move freely in the Y-axis direction.

[0073] During the machining operation, the machining apparatus 100-2 of the second embodiment, similarly to the first embodiment, uses the transport unit to remove a frame unit 210, to which the workpiece 200 before cutting is fixed, from the cassette 171. After placing the workpiece 200 fixed to the frame unit 210 on the holding surface 191 of the chuck table 190, the workpiece 200 is suctioned and held on the holding surface 191 via the belt 205, and the annular frame 206 is clamped by the clamping unit 192. Similar to the first embodiment, after the cutting grooves are formed on all the planned dividing lines 202 by the cutting tool 121, the machining apparatus 100-2 of the second embodiment releases the suction and holding of the chuck table 190 and the clamping of the clamping unit 192.

[0074] During the processing operation, the processing device 100-2 of the second embodiment transports the frame unit 210 on the chuck worktable 190 to which the workpiece 200 is fixed to the cleaning unit 180 through the transport unit, cleans the frame unit 210 on which the workpiece 200 is fixed through the cleaning unit 180, and transports the frame unit 210 on which the workpiece 200 is fixed from the cleaning unit 180 to the inspection device 10-2 through the transport unit.

[0075] As in the first embodiment, the inspection device 10-2 of the processing apparatus 100-2 suctions and holds the back side 204 of the workpiece 200 of the annular frame 206 of the frame unit 210 on the holding surface 2 of the chuck table 1 via the belt 205. The chuck table 1 is then moved above the camera unit 11 by the moving unit 40. The inspection device 10-2 of the processing apparatus 100-2 uses the camera unit 11 to capture the workpiece 200 cut by the cutting unit 120 through the holding portion 3 of the chuck table 1, performing inspection as in the first embodiment. After inspecting the workpiece 200, the processing apparatus 100-2 releases suction and holds the chuck table 1. The frame unit 210, with the workpiece 200 secured to it, is then transported to the cassette 171 via the transport unit. When the processing apparatus 100-2 completes cutting of all the workpieces 200 within the cassette 171, the processing operation ends.

[0076] The chuck table 1 of the second embodiment includes a frame 4. Figure 3 The chuck table shown similarly surrounds a holding portion 3 formed of a transparent body, with an upper surface 6 located above the holding surface 2, and a plurality of suction holes 5 are provided on the inner peripheral surface 7. As a result, the chuck table 1 can smoothly and tightly contact the belt 205 with the holding surface 2, leaving no air between the belt 205 and the holding surface 2, thereby enabling observation of the entire back side 204 of the workpiece 200. Thus, the chuck table 1 and the inspection device 10-2 achieve the same effect as in the first embodiment: even if the holding portion 3 is formed of a transparent body, the workpiece 200 can be easily observed. The chuck table 1 of the second embodiment can be used to observe and determine whether the workpiece 200 is scratched or whether the device 203 is abnormal before processing.

[0077] [First Modification]

[0078] A chuck table and an inspection device according to a first modification of the first embodiment and the second embodiment of the present invention will be described with reference to the drawings. Figure 12 It is a perspective view of a frame unit including a chuck table as a first modified example and a workpiece to be inspected by an inspection device. Figure 13 It shows Figure 12 The frame unit shown is a perspective view of the state in which it is attracted and held on the chuck table. Figure 12 and Figure 13 In the present invention, the same reference numerals are given to the same parts as those in the first embodiment and the second embodiment, and description thereof is omitted.

[0079] like Figure 12As shown, the workpiece 200 is the processing object of the processing device 100, 100-2 having the chuck worktable 1 of the first variant and the inspection device 10, 10-2, and the workpiece 200 has a metal film 208 formed on the entire back side 204, and the front side 201 on which the device 203 is formed is adhered to the belt 205 to form a frame unit 210.

[0080] The processing apparatus 100, 100-2 including the chuck table 1 and the inspection apparatus 10, 10-2 of the first modification example can, at least when performing alignment (alignment of the workpiece 200 with the cutting tool 121), photograph the workpiece 200 on the chuck table 1 via the holding surface 2 of the holding portion 3 using the camera unit 11. Furthermore, the inspection apparatus 10, 10-2 of the first modification example can inspect the workpiece 200 by photographing the workpiece 200 via the holding surface 2 using the camera unit 11 after cutting the workpiece 200 to form a cut groove, similarly to the first and second embodiments.

[0081] The chuck table 1 of the first modified example includes a frame 4 surrounding a holding portion 3 formed of a transparent body, with an upper surface 6 of the frame 4 positioned above the holding surface 2. The frame 4 also includes a plurality of suction holes 5 on its inner circumferential surface 7. As a result, the chuck table 1 smoothly and tightly adheres the belt 205 to the holding surface 2, preventing air from remaining between the belt 205 and the holding surface 2, thereby enabling observation of the entire back surface 204 of the workpiece 200. Thus, the chuck table 1 and inspection devices 10 and 10-2 achieve the same effect as in the first and second embodiments: even when the holding portion 3 is formed of a transparent body, the workpiece 200 can be easily observed.

[0082] [Second Modification]

[0083] A chuck table and an inspection device according to a second modification of the first embodiment and the second embodiment of the present invention will be described with reference to the drawings. Figure 14 : is a perspective view of a structural example of a processing device equipped with an inspection device according to a second modified example. Figure 14 In the present invention, the same reference numerals are given to the same parts as those in the first embodiment and the second embodiment, and description thereof is omitted.

[0084] The processing device 100-3 including the chuck table 1 and the inspection device 10-3 of the second modified example is a laser processing device including a laser beam irradiation unit 120-3 as a processing unit for processing the workpiece 200 using a laser beam 121-3. Figure 14In the illustrated example, the inspection device 10-3 includes a Y-axis moving unit 140-3 as a moving unit. The Y-axis moving unit 140-3 relatively advances the chuck table 1, the inspection device 10-3, and the camera unit 11 in the Y-axis direction. The Y-axis moving unit 140-3 includes a well-known ball screw 141-3 rotatably disposed about its axis; a well-known pulse motor 142-3 that rotates the ball screw 141-3 about its axis; and a well-known guide rail 143-3 that supports the chuck table 1 and the rotating unit 13 via the housing 17 so that they are movable in the Y-axis direction.

[0085] In addition, Figure 14 In the example shown, the processing device 100-3 mounts the inspection device 10-3 on the device body 101-3 via the X-axis moving unit 12 and the Y-axis moving unit 140-3. However, as in the second embodiment, the chuck table 190 may be provided on the device body 101-3 via the X-axis moving unit 12 and the Y-axis moving unit 140-3, and the inspection device 10-3 may be housed in an outer housing mounted on the outer surface of the device body 101-3 and mounted on the processing device 100-3 as in the second embodiment. Figure 14 In the processing apparatus 100 - 3 shown, the laser beam irradiation unit 120 - 3 and the second camera unit 130 are provided at the front end of a horizontal member 108 whose base end is supported by a column member 107 erected from the apparatus body 101 - 3 .

[0086] The chuck table 1 of the second modified example includes a frame 4 that surrounds a holding portion 3 formed of a transparent body, with an upper surface 6 of the frame 4 positioned above the holding surface 2. The frame 4 also includes a plurality of suction holes 5 on its inner circumferential surface 7. As a result, the chuck table 1 can smoothly and tightly contact the belt 205 with the holding surface 2, eliminating any air trapped between the belt 205 and the holding surface 2. This allows observation of the entire back surface 204 of the workpiece 200. Thus, the chuck table 1 and the inspection device 10-3 achieve the same effect as in the first and second embodiments: even when the holding portion 3 is formed of a transparent body, the workpiece 200 can be easily observed.

[0087] The present invention is not limited to the above-described embodiment and modifications, but can be implemented with various modifications without departing from the spirit of the present invention.

Claims

1. A chuck table that holds a frame unit having a workpiece fixed to an opening of an annular frame by means of a belt, wherein: The chuck table features: a holding portion formed of a transparent body having a holding surface for holding a workpiece via a belt; and a frame body erected around the holding portion and surrounding the holding portion, the frame body having an upper surface above the holding surface, a lower surface opposite to the upper surface, an inner peripheral surface between the upper surface and the lower surface, and a plurality of suction holes defined in the frame body, the plurality of suction holes opening between the holding surface and the upper surface of the inner peripheral surface of the frame body, The inner diameter of the frame is less than the inner diameter of the annular frame. With the opening of the frame covered with the belt of the frame unit, suction is transmitted from the plurality of suction holes to exhaust air between the belt and the holding surface so that the belt and the holding surface are in close contact, thereby fixing the workpiece of the frame unit to the holding surface.

2. The chuck table according to claim 1, wherein: The holding surface of the holding portion is entirely flat and has no suction groove formed thereon.

3. An inspection device for inspecting a workpiece, wherein: The inspection device has: A chuck table that holds a workpiece by means of a retaining surface and a frame unit to which a workpiece is fixed at an opening of an annular frame by means of a belt; a camera unit that images the workpiece held by the chuck table from the holding surface side across the holding surface; and a moving unit that moves the chuck table and the camera unit relative to each other in an X-axis direction parallel to the holding surface or in a Y-axis direction perpendicular to the X-axis direction, The chuck table includes: a holding portion formed of a transparent body having a holding surface for holding a workpiece via a belt; and a frame body erected around the holding portion and surrounding the holding portion, the frame body having an upper surface above the holding surface, a lower surface opposite to the upper surface, an inner peripheral surface between the upper surface and the lower surface, and a plurality of suction holes defined in the frame body, the plurality of suction holes opening between the holding surface and the upper surface of the inner peripheral surface of the frame body, The inner diameter of the frame is less than the inner diameter of the annular frame. When the belt of the frame unit covers the opening of the frame body, suction is transmitted from the plurality of suction holes to discharge air between the belt and the holding surface so that the belt is in close contact with the holding surface, thereby fixing the workpiece of the frame unit on the holding surface.

4. The inspection device according to claim 3, wherein: The inspection device is mounted on a processing device having a processing unit that processes a workpiece using a cutting tool or laser light. The processing unit processes the workpiece held by the chuck table. The inspection device photographs and inspects the workpiece processed by the processing unit through the chuck table.

Images