Processing methods

Abstract

A machining method is provided for shortening machining time of a workpiece. The workpiece, having a holding table for holding the workpiece and a spray nozzle for spraying machining fluid, is machined using a machining device having a holding table for holding the workpiece and a spray nozzle for spraying machining fluid. The machining method comprises the following steps: a first positioning step of aligning the first direction of the workpiece with a machining feed direction and positioning the spray nozzle at one end of the first machining line; a first machining step of machining the workpiece along the first machining line using the machining fluid; and a second positioning step of rotating the holding table so that the second direction of the workpiece is aligned with the machining feed direction and positioning the spray nozzle at one end of the second machining line. In the second positioning step, the holding table and the spray nozzle are relatively moved so that the machining fluid is continuously sprayed onto the workpiece as the holding table rotates.

Description

Technical Field

[0001] The present invention relates to a processing method for processing a workpiece by spraying pressurized liquid. Background Art

[0002] Typical plate-shaped workpieces include package substrates, where multiple device chips arranged on a substrate are encapsulated with a resin-based sealing material (molding resin), or semiconductor wafers with multiple devices formed thereon. When this plate-shaped workpiece is divided for each device, individual chips are obtained. For example, the workpiece is defined with a first processing line along a first direction and a second processing line along a second direction intersecting the first direction. To form individual chips, the workpiece is divided along each processing line.

[0003] In addition, the workpiece is sometimes machined along each planned machining line to form a groove of a predetermined depth (called a half-cut groove) on the front surface of the workpiece. For example, a cutting device having an annular cutting tool is used to divide or machine the workpiece.

[0004] The grooves are formed by rotating the cutting tool and cutting into the workpiece from the front to a predetermined depth along each predetermined processing line. After the workpiece is plated or processed, the bottom surface of the groove is further cut by the cutting tool to separate the workpiece into individual chips.

[0005] Alternatively, the outer periphery of the workpiece is sometimes attached to the adhesive tape attached to the annular frame. The workpiece, adhesive tape, and annular frame are combined into a single unit, for example, called a frame unit. When the workpiece is in the form of a frame unit, it is easier to transport the workpiece, and the adhesive tape can be used to support the chips formed by dividing the workpiece.

[0006] When a highly ductile metal component, such as one located along a predetermined machining line, is cut into the workpiece by a cutting tool to form a groove, the component may come into contact with the cutting tool and be stretched, resulting in whisker-like protrusions called burrs. If burrs remain on the resulting chips, the burrs can cause short circuits or cause mounting defects by causing the burrs to fall from the chip when it is mounted on the intended mounting surface.

[0007] Therefore, in order to remove burrs, a machining device has been developed that can spray a pressurized machining fluid such as water along a groove formed on the front surface of a workpiece by cutting (see, for example, Patent Document 1). This machining device is called a water jet machining device. This machining device performs a process such as removing burrs from the workpiece by spraying a pressurized machining fluid toward the groove of the workpiece.

[0008] The machining device comprises a holding table, the upper surface of which serves as a holding surface, and a spray nozzle for spraying a machining fluid onto a workpiece held by the holding table. The machining device is capable of relatively moving the holding table and the spray nozzle along a machining feed direction and an indexing feed direction perpendicular to the machining feed direction.

[0009] When removing burrs from a workpiece, the workpiece, which has been cut to produce burrs, is moved onto a holding surface of a holding table, which holds the workpiece. Furthermore, the holding table is rotated about an axis perpendicular to the holding surface so that the first direction of the workpiece is aligned with the machining feed direction of the machining device.

[0010] Then, while the machining fluid is sprayed from the spray nozzle, the holding table and the spray nozzle are relatively moved in the machining feed direction, and the workpiece is machined along the first planned machining line. Then, after the holding table and the spray nozzle are relatively moved in the indexing feed direction, the holding table and the spray nozzle are relatively moved in the machining feed direction again, and the workpiece is machined along another first planned machining line.

[0011] After the workpiece has been machined along all of the first planned machining lines, the holding table is rotated so that the second planned machining line of the workpiece is aligned with the machining feed direction of the machining apparatus. Furthermore, the workpiece is machined along the second planned machining line while the holding table and the spray nozzle are relatively moved in the machining feed direction.

[0012] Patent Document 1: Japanese Patent Application Laid-Open No. 2018-186133

[0013] When machining fluid is sprayed onto the adhesive tape attached to the annular frame while a workpiece is attached to it, the tape may break. Furthermore, when machining fluid is sprayed onto the holding surface of the holding table, the holding table may break. Therefore, after machining the workpiece along the first planned machining line and before machining the workpiece along the second planned machining line, the machining fluid spray from the spray nozzle is stopped when the holding table is rotated to prevent the machining fluid from accidentally spraying onto objects other than the workpiece.

[0014] However, when the jetting of machining fluid from the jet nozzle is resumed after the rotation of the holding table is completed, machining of the workpiece must be suspended until the machining fluid can be stably jetted from the jet nozzle again according to the prescribed jetting conditions. Therefore, in order to reduce the machining time of the workpiece, it is desirable to shorten the waiting time during which machining of the workpiece is not being performed. Summary of the Invention

[0015] The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing method that can prevent damage to an adhesive tape, a holding table, etc. and can shorten the processing time of a workpiece.

[0016] 20. The machine tool of claim 19, wherein the tool is adapted to move the workpiece relative to the holding table and the workpiece is moved relative to the holding table. The tool is adapted to move the workpiece relative to the holding table and the workpiece is moved relative to the holding table. The tool is adapted to move the workpiece relative to the holding table and the workpiece is moved relative to the holding table. one end of a predetermined line; a first processing step, after implementing the first positioning step, starting to spray processing fluid from the jet nozzle, and then moving the holding worktable and the jet nozzle relatively along the processing feed direction, so that the workpiece is processed along the first processing predetermined line with the processing fluid; a second positioning step, after implementing the first processing step, rotating the holding worktable by the rotating unit so that the second direction of the workpiece is consistent with the processing feed direction, and positioning the jet nozzle at one end of the second processing predetermined line; and a second processing step, after implementing the second positioning step, moving the holding worktable and the jet nozzle relatively along the processing feed direction, processing the workpiece along the second processing predetermined line with the processing fluid jetted from the jet nozzle, in the second positioning step, the holding worktable and the jet nozzle are relatively moved in such a manner that the processing fluid is continuously sprayed to the workpiece during the rotation of the holding worktable.

[0017] Preferably, a plurality of the first predetermined processing lines and a plurality of the second predetermined processing lines are set on the front surface of the workpiece, and the workpiece has a device area on the front surface in which devices are respectively arranged in each area divided by the first predetermined processing lines and the second predetermined processing lines, and a peripheral remaining area surrounding the device area. In the second positioning step, the processing fluid is continuously sprayed onto the peripheral remaining area of ​​the workpiece during the rotation of the holding worktable.

[0018] Alternatively, it is preferred that a first groove along the first predetermined processing line and a second groove along the second predetermined processing line are formed on the front surface of the workpiece, and in the second positioning step, the processing fluid is continuously sprayed to either the first groove or the second groove of the workpiece during the rotation of the holding worktable.

[0019] In a machining method according to one embodiment of the present invention, while the holding table is rotated in the second positioning step, the holding table and the spray nozzle are relatively moved so that the machining fluid continues to be sprayed onto the workpiece. In this case, even if the spraying of the machining fluid from the spray nozzle is not stopped while the holding table is rotated, the machining fluid will not be directly sprayed onto objects other than the workpiece. In other words, it is not necessary to stop the spraying of the machining fluid from the spray nozzle while the holding table is rotated.

[0020] If the injection of the machining fluid is not stopped, the machining fluid is continuously and stably injected from the injection nozzle according to the predetermined injection conditions. Therefore, after the second positioning step is performed, there is no need to wait for the second machining step to be performed. This can shorten the machining time of the workpiece.

[0021] Therefore, the present invention can provide a processing method that can prevent damage to the adhesive tape, the holding table, etc. and shorten the processing time of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a perspective view schematically showing a processing device.

[0023] Figure 2 (A) is a cross-sectional view schematically showing a holding step, Figure 2 (B) is a top view schematically showing a frame unit held by the holding table.

[0024] Figure 3 It is a plan view schematically showing an enlarged view of the upper surface of the workpiece.

[0025] Figure 4 (A) is a cross-sectional view schematically showing the first processing step, Figure 4 (B) is a cross-sectional view schematically showing the second processing step.

[0026] Figure 5 (A) is a top view schematically showing the position of the injection nozzle at the end of the first processing step, Figure 5 (B) is a top view schematically showing the second positioning step, Figure 5 (C) is a plan view schematically showing the position of the injection nozzle at the start of the second processing step.

[0027] Label Description

[0028] 1: Workpiece; 1a: Substrate; 1b: Resin layer; 1c, 1d: Direction; 3a, 3b: Predetermined processing line; 5: Device; 5a: Electrode; 5b: Device area; 5c: Peripheral remaining area; 7: Adhesive tape; 9: Annular frame; 11: Frame unit; 13a, 13b: Groove; 2: Processing device; 4: Base; 4a, 4b, 4c: Opening; 6: Cassette support; 8: Cassette; 10: X-axis moving mechanism; 12: Workbench cover; 12a: Processing feed direction; 14: Dust and drip proof cover; 16: Temporary placement mechanism; 16a, 16b: Guide rails; 18: Hold work Table; 18a: Holding surface; 20: Clamp; 22: Cutting unit; 24: Injection unit; 24a: Supply source; 24b: Switching valve; 24c: Injection nozzle; 24d: Supply path; 24e: Cover; 24f: Pipe; 24g: Track; 26: Support structure; 28a, 28b: Moving unit; 30, 38a, 38b: Guide rail; 32a, 32b, 40a, 40b: Moving plate; 34a, 34b, 42a, 42b: Ball screw; 36, 44a, 44b: Y-axis pulse motor; 46a, 46b: Shooting unit; 48: Cleaning unit. DETAILED DESCRIPTION

[0029] Hereinafter, this embodiment will be described with reference to the drawings. Figure 1 The processing apparatus 2 is a perspective view showing a processing apparatus 2 used when implementing the processing method of this embodiment. The processing apparatus 2 can cut a workpiece with a cutting tool and can process the workpiece by spraying a pressurized liquid (hereinafter referred to as processing fluid) onto the workpiece.

[0030] The processing device 2 has a base 4 that supports the various components that constitute the processing device 2. An opening 4a is formed at the front corner of the base 4, and a box support 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4a. A box 8 that stores a plurality of workpieces 1 is mounted on the upper surface of the box support 6. Figure 1 In the figure, for the sake of convenience, only the outline of the box 8 is shown.

[0031] The workpiece 1 is housed in the box 8 while being supported by the annular frame 9. The adhesive tape 7 is attached to the annular frame 9 so as to seal the opening of the annular frame 9, and the workpiece 1 is attached to the adhesive tape 7 in the opening of the annular frame 9. Figure 1 1 is a perspective view of a frame unit 11 in which the workpiece 1, the adhesive tape 7, and the annular frame 9 are integrated.

[0032] However, the workpiece 1 processed in the processing apparatus 2 is not limited to being in the frame unit 11. In the processing method of this embodiment, the workpiece 1 can be processed simply by loading it into the processing apparatus 2. The following description takes as an example the case where the workpiece 1 is processed in the processing apparatus 2 in the frame unit 11 state.

[0033] The workpiece 1 is a package substrate, and includes a rectangular plate-shaped substrate 1a (see Figure 2 (A)); and a plurality of devices 5 arranged on the substrate 1a (refer to Figure 2 (B), etc.) A resin layer (molding resin) 1b is formed on the substrate 1a to seal the plurality of devices 5. However, the workpiece 1 is not limited to a package substrate. For example, the workpiece 1 may be a wafer having a device such as an IC (Integrated Circuit) formed on the front surface.

[0034] A circular adhesive tape 7 having a diameter sufficient to cover the entire substrate 1a is attached to the resin layer 1b side of the workpiece 1. The resin layer 1b of the workpiece 1 is attached to the center of the adhesive tape 7, thereby supporting the workpiece 1 on the annular frame 9 with the substrate 1a exposed upward. However, the substrate 1a may be attached to the adhesive tape 7 with the resin layer 1b side of the workpiece 1 exposed upward.

[0035] exist Figure 2 (B) includes a schematic top view showing the side of the substrate 1a of the workpiece 1 exposed upwards in an enlarged manner. The workpiece 1 has a first predetermined processing line 3a along a first direction 1c and a second predetermined processing line 3b along a second direction 1d intersecting the first direction 1c set on the front surface. Figure 2 In (B) and the like, the first direction 1c and the second direction 1d are shown to be perpendicular to each other, but the workpiece 1 is not limited thereto. That is, the first direction 1c and the second direction 1d may not be perpendicular to each other.

[0036] like Figure 2 As shown in FIG. 1B and the like, a plurality of first planned processing lines 3a and a plurality of second planned processing lines 3b can be set on the front surface of the workpiece 1. Devices 5 are respectively arranged in each area of ​​the workpiece 1 divided by the first planned processing lines 3a and the second planned processing lines 3b. Furthermore, when the workpiece 1 is divided along the first planned processing lines 3a and the second planned processing lines 3b and singulated, a plurality of packaged devices, each containing a device chip, are obtained.

[0037] The area on the front surface of the workpiece 1 where the plurality of devices 5 are arranged is called a device area 5b, and the area surrounding the device area 5b is called a peripheral surplus area 5c. No devices 5 are formed in the peripheral surplus area 5c of the workpiece 1.

[0038] Inside the resin layer 1b, metal (wiring) connected to the device chip covered by the resin layer 1b is disposed. Furthermore, on the upper surface of the workpiece 1 (substrate 1a side), the resin layer 1b is exposed so as to surround the device 5 when viewed from above. This metal is exposed from the resin layer 1b along the first and second planned processing lines 3a, 3b. Furthermore, when a groove, known as a half-cut groove, is formed in the workpiece 1 along the first and second planned processing lines 3a, 3b, this metal is also exposed on the sidewalls of the groove.

[0039] Figure 3 This is a schematic, enlarged top view of the top surface of a workpiece 1 having a first groove 13a formed along a first planned processing line 3a. When the workpiece 1 is divided into a plurality of packaged components and each packaged component is mounted on a predetermined mounting object, the metal exposed on the top surface of the workpiece 1 and the sidewalls of the first groove 13a functions as a connection electrode 5a for connection to a terminal formed on the mounting object.

[0040] exist Figure 1 In the illustrated processing apparatus 2, a rectangular opening 4b is formed on the upper surface of the base 4, lateral to the cartridge support 6, with its longitudinal direction extending along the X-axis direction (the processing feed direction). Within the opening 4b are located a ball screw-type X-axis moving mechanism 10, along with a table cover 12 and a dust and drip proof cover 14 covering the upper portion of the X-axis moving mechanism 10. The X-axis moving mechanism 10 includes an X-axis moving table (not shown) covered by the table cover 12, which moves the X-axis moving table in the X-axis direction.

[0041] A temporary placement mechanism 16 is provided near the side of the cassette support table 6 for temporarily placing the workpiece 1. The temporary placement mechanism 16 includes, for example, a pair of guide rails 16a and 16b that move toward and away from each other while maintaining a parallel position with the Y-axis direction (indexing feed direction). The pair of guide rails 16a and 16b hold the workpiece 1 pulled out of the cassette 8 in the X-axis direction and align it at a predetermined position.

[0042] A holding table 18 for suction-holding the workpiece 1 is provided on the upper surface of the X-axis movable table, exposed from the table cover 12. The upper surface of the holding table 18 serves as a holding surface 18a for suction-holding the workpiece 1. The holding surface 18a is formed substantially parallel to the X-axis and Y-axis directions and is connected to a suction source (not shown) such as an ejector via a suction passage (not shown) provided within the holding table 18.

[0043] Four clamps 20 are provided around the holding table 18 to fix the annular frame 9 supporting the workpiece 1 from four sides. A transport unit (not shown) for transporting the workpiece 1 to the holding table 18 is provided in the area adjacent to the opening 4b.

[0044] The holding table 18 is connected to a rotating unit (not shown), such as a motor. This rotating unit rotates the holding table 18 about an axis generally parallel to the Z-axis direction, which is perpendicular to the holding surface 18a. Furthermore, the holding table 18 is moved in the X-axis direction by the X-axis moving mechanism 10, along with the X-axis moving table and the table cover 12.

[0045] A cutting unit 22 for cutting the workpiece 1 using an annular cutting tool and a spray unit 24 for spraying pressurized liquid (machining fluid) onto the workpiece 1 are provided above the holding table 18. Furthermore, a gate-shaped support structure 26 for supporting the cutting unit 22 and the spray unit 24 is provided on the upper surface of the base 4 so as to span the opening 4b.

[0046] A moving unit 28 a that moves the cutting unit 22 in the Y-axis direction and the Z-axis direction and a moving unit 28 b that moves the spraying unit 24 in the Y-axis direction and the Z-axis direction are provided on the upper front surface of the support structure 26 .

[0047] The moving unit 28a includes a Y-axis moving plate 32a, and the moving unit 28b includes a Y-axis moving plate 32b. The Y-axis moving plates 32a and 32b are slidably mounted on a pair of Y-axis guide rails 30 arranged on the front surface of the support structure 26 along the Y-axis direction.

[0048] A nut portion (not shown) is provided on the back side (rear surface side) of the Y-axis moving plate 32a, and a Y-axis ball screw 34a is screwed onto the nut portion so as to be substantially parallel to the Y-axis guide rail 30. Furthermore, a nut portion (not shown) is provided on the back side (rear surface side) of the Y-axis moving plate 32b, and a Y-axis ball screw 34b is screwed onto the nut portion so as to be substantially parallel to the Y-axis guide rail 30.

[0049] A Y-axis pulse motor 36 is connected to one end of each of the Y-axis ball screws 34a and 34b. The Y-axis pulse motor 36 connected to the Y-axis ball screw 34a rotates the Y-axis ball screw 34a, thereby moving the Y-axis moving plate 32a in the Y-axis direction along the Y-axis guide rail 30. Furthermore, the Y-axis pulse motor 36 connected to the Y-axis ball screw 34b rotates the Y-axis ball screw 34b, thereby moving the Y-axis moving plate 32b in the Y-axis direction along the Y-axis guide rail 30.

[0050] A pair of Z-axis guide rails 38a are provided along the Z-axis direction on the front side (front surface) of the Y-axis moving plate 32a, and a pair of Z-axis guide rails 38b are provided along the Z-axis direction on the front side (front surface) of the Y-axis moving plate 32b. Furthermore, a Z-axis moving plate 40a is slidably mounted on the pair of Z-axis guide rails 38a, and a Z-axis moving plate 40b is slidably mounted on the pair of Z-axis guide rails 38b.

[0051] A nut portion (not shown) is provided on the back side (rear surface) of the Z-axis moving plate 40a. A Z-axis ball screw 42a is screwed onto the nut portion so as to be arranged in a direction substantially parallel to the Z-axis guide rail 38a. A Z-axis pulse motor 44a is connected to one end of the Z-axis ball screw 42a. The Z-axis pulse motor 44a rotates the Z-axis ball screw 42a, thereby moving the Z-axis moving plate 40a in the Z-axis direction along the Z-axis guide rail 38a.

[0052] A nut portion (not shown) is provided on the back side (rear surface) of the Z-axis moving plate 40b. A Z-axis ball screw 42b is threadedly engaged with the nut portion, which is arranged in a direction substantially parallel to the Z-axis guide rail 38b. A Z-axis pulse motor 44b is connected to one end of the Z-axis ball screw 42b. The Z-axis pulse motor 44b rotates the Z-axis ball screw 42b, thereby moving the Z-axis moving plate 40b in the Z-axis direction along the Z-axis guide rail 38b.

[0053] A cutting unit 22 is provided below the Z-axis moving plate 40a. Adjacent to the cutting unit 22, an imaging unit (camera) 46a is provided for imaging the workpiece 1 and the like held by suction on the holding table 18. Furthermore, a spray unit 24 is provided below the Z-axis moving plate 40b. Adjacent to the spray unit 24, an imaging unit (camera) 46b is provided for imaging the workpiece 1 and the like held by suction on the holding table 18.

[0054] The positions of the cutting unit 22 and the imaging unit 46a in the Y-axis and Z-axis directions are controlled by the moving unit 28a, while the positions of the spraying unit 24 and the imaging unit 46b in the Y-axis and Z-axis directions are controlled by the moving unit 28b. In other words, the positions of the cutting unit 22 and the spraying unit 24 are independently controlled.

[0055] An opening 4c is formed at a position opposite to the opening 4a relative to the opening 4b. A cleaning unit 48 for cleaning the workpiece 1 is arranged in the opening 4c. The workpiece 1 subjected to a predetermined process on the holding table 18 is cleaned by the cleaning unit 48.

[0056] The workpiece 1 can be cut by rotating an annular cutting tool (not shown) mounted on the cutting unit 22 to cut into the workpiece 1. The cutting unit 22 includes a spindle having an axis approximately parallel to the holding surface 18a of the holding table 18, and an annular cutting tool mounted on the front end of the spindle. The cutting tool is formed, for example, by an electroformed grinding tool in which diamond abrasive grains are fixed by nickel plating.

[0057] The spindle is connected to a rotational drive source such as an electric motor, and the cutting tool mounted on the spindle is rotated by the force transmitted from the rotational drive source. The cutting tool rotates and cuts into the workpiece 1 held by the holding table 18. The holding table 18 and the cutting tool are moved relative to each other along the X-axis direction (the machining feed direction), thereby cutting the workpiece 1.

[0058] Furthermore, by ejecting pressurized liquid (machining fluid) such as water from the ejection unit 24 toward the workpiece 1, it is possible to perform processing such as removing a portion of the workpiece 1 or removing burrs formed on the metal of the workpiece 1. The removal of burrs using the ejection unit 24 will be described later.

[0059] The spray unit 24 is equipped with a spray nozzle 24c that sprays machining fluid onto the workpiece 1 held by the holding table 18. The spray nozzle 24c is connected to a machining fluid supply source 24a via a supply path 24d. When machining the workpiece 1, a switching valve 24b provided in the supply path 24d is opened, and machining fluid is supplied from the supply source 24a to the spray nozzle 24c. The machining fluid is then sprayed from the spray port of the spray nozzle 24c toward the workpiece 1.

[0060] In addition, the spray unit 24 has a cover 24e that covers the lower part of the spray nozzle 24c. The interior of the cover 24e is formed into a hollow hemispherical shape (bowl shape). The spray nozzle 24c is inserted into the cover 24e, and the cover 24e is installed on the spray nozzle 24c in such a way that the annular edge of the lower part is opposite to the holding surface 18a of the holding table 18. The cover 24e prevents the scattering of mist or processing chips generated by processing. In addition, for the convenience of explanation, in Figure 1 In the figures other than FIG, the cover 24e is omitted.

[0061] In addition, an opening is formed in the side wall of the cover 24e. The opening is connected to one end of a tube 24f provided outside the cover 24e. The other end of the tube 24f is connected to a suction source (not shown). Mist and processing debris generated inside the cover 24e during processing of the workpiece 1 are suctioned and removed through the tube 24f.

[0062] The position of the spray nozzle 24c can be controlled by the moving unit 28b. By controlling the moving unit 28b, the holding table 18 and the spray nozzle 24c can be moved relative to each other.

[0063] The supply source 24a includes a pump (not shown) for pressurizing a liquid to supply it as a machining fluid. The pump pressurizes a liquid such as water. The supply source 24a includes a control mechanism for controlling the flow rate and pressure of the machining fluid ejected from the jet nozzle 24c. The jet unit 24 supplies the machining fluid at a predetermined pressure (e.g., 0 MPa to 70 MPa) and a predetermined flow rate to the workpiece 1 held by the holding table 18, thereby machining the workpiece 1.

[0064] The processing device 2 may process the workpiece 1 using only the jet unit 24 or using both the cutting unit 22 and the jet unit 24. Furthermore, the processing device 2 may not include the cutting unit 22 and may be a water jet processing device that supplies high-pressure water to the workpiece 1.

[0065] Next, the steps of the processing method of this embodiment will be described. While the following description will focus on a case where the workpiece 1 is loaded into the processing apparatus 2 while being attached to the frame unit 11 and processed, the processing method of this embodiment is not limited thereto. The workpiece 1 does not need to be integrated with the annular frame 9 and the adhesive tape 7.

[0066] In this processing method, first, a holding step is performed, in which the workpiece 1 is held by the holding table 18 . Figure 2 (A) is a cross-sectional view schematically illustrating the holding step. The workpiece 1 is placed on the holding surface 18a of the holding table 18 via the adhesive tape 7, and the annular frame 9 is secured by the clamp 20. The suction source is then activated to apply negative pressure to the workpiece 1, causing the workpiece 1 to be sucked and held by the holding table 18 via the adhesive tape 7.

[0067] In the machining method of this embodiment, the workpiece 1 machined by the spray unit 24 has first grooves 13a of a predetermined depth along the first planned machining line 3a and second grooves 13b of a predetermined depth along the second planned machining line 3b formed in advance.

[0068] For example, the groove forming step of forming the grooves 13a and 13b in the workpiece 1 may be performed before the holding step. For example, the groove forming step may be performed in advance in another processing device or the like before the workpiece is stored in the cassette 8. Alternatively, the groove forming step may be performed by the cutting unit 22 of the processing device 2 after the holding step.

[0069] When the groove forming step is performed in the processing device 2, the holding table 18 is first rotated by a rotating unit for rotating the holding table 18 so that the first direction 1c of the workpiece 1 is aligned with the processing feed direction 12a (X-axis direction) of the processing device 2. Then, the cutting tool of the cutting unit 22 is positioned above the extension of the first planned processing line 3a on the outside of the workpiece 1.

[0070] The cutting tool then begins rotating, lowering the cutting unit 22 to a predetermined height. Furthermore, the holding table 18 and the cutting unit 22 are moved relative to each other along the machining feed direction 12a. In this state, the rotating cutting tool contacts the workpiece 1 and cuts the workpiece 1 along the first planned machining line 3a, forming a first groove 13a in the workpiece 1 along the first planned machining line 3a.

[0071] After the workpiece 1 is cut along one first planned machining line 3a to form the first groove 13a, the holding table 18 and the cutting unit 22 are relatively moved in the indexing feed direction (Y-axis direction) to cut the workpiece 1 along other first planned machining lines 3a. The workpiece 1 is cut along all first planned machining lines 3a, and the first groove 13a is formed along each first planned machining line 3a.

[0072] Then, the holding table 18 is rotated by the rotation unit so that the second direction 1d of the workpiece 1 is aligned with the machining feed direction 12a of the machining device 2. Similarly, the workpiece 1 is cut along the second planned machining line 3b, forming a second groove 13b along the second planned machining line 3b in the workpiece 1. Here, the first groove 13a and the second groove 13b are referred to as half-cut grooves.

[0073] Furthermore, although the second groove 13b is formed after the first groove 13a is formed, the groove forming procedure is not limited thereto. For example, the first groove 13a may be formed after the second groove 13b is formed.

[0074] Here, metal serving as electrodes is present on the first planned machining line 3a and the second planned machining line 3b of the workpiece 1. When the metal is cut by a cutting tool, the metal contacts the cutting tool and is stretched, forming whisker-like projections called burrs in the grooves 13a and 13b.

[0075] If this burr remains inside the grooves 13a and 13b, it will become an obstacle when the workpiece 1 is divided to form a packaged device and the packaged device is mounted on a predetermined mounting object. Therefore, in the machining method of this embodiment, the machining fluid is sprayed from the spray nozzle 24c of the spray unit 24 along the grooves 13a and 13b to remove the burr.

[0076] In the processing method of this embodiment, after the holding step is performed, the first positioning step is performed. In the first positioning step, the holding table 18 is rotated by the rotating unit so that the first direction 1c of the workpiece 1 is aligned with the processing feed direction 12a of the processing device 2, and the injection nozzle 24c is positioned at one end of the first processing predetermined line 3a. Figure 2 (B) shows a plan view schematically showing the workpiece 1 and the jet nozzle 24c when the first positioning step is completed.

[0077] In the first positioning step, the imaging unit 46b captures an image of the workpiece 1. For example, the first direction 1c is detected by detecting an alignment mark (not shown) provided on the workpiece 1 corresponding to the first planned processing line 3a or the first planned processing line 3a. If the first direction 1c does not coincide with the processing feed direction 12a of the processing device 2, the holding table 18 is rotated to align the first direction 1c of the workpiece 1 with the processing feed direction 12a.

[0078] Furthermore, in cases where the groove forming step is performed before the first positioning step, the imaging unit 46b may capture an image of the workpiece 1, and it may be determined that the first direction 1c coincides with the machining feed direction 12a before the holding table 18 is rotated. Thus, the first positioning step also includes cases where it is determined that the holding table 18 does not need to be rotated. In other words, the first positioning step also includes cases where the rotation unit rotates the holding table 18 by 0 degrees.

[0079] After the first positioning step is performed, the first processing step is performed, in which the processing fluid is sprayed from the spray nozzle 24 c to process the workpiece 1 along the first planned processing line 3 a. Figure 4 (A) is a cross-sectional view schematically showing the first processing step.

[0080] In the first machining step, the machining fluid is first sprayed from the spray nozzle 24c. To uniformly machine the entire machining area of ​​the workpiece 1, the machining fluid is allowed to spray stably from the spray nozzle 24c according to the specified spraying conditions. The holding table 18 and the spray nozzle 24c are then moved relative to each other along the machining feed direction 12a, allowing the machining fluid to machine the workpiece 1 along the first planned machining line 3a.

[0081] When the machining fluid is sprayed onto the workpiece 1 along the first planned machining line 3a, the metal burrs existing along the first groove 13a are removed. Furthermore, when machining of the workpiece 1 along the initial first planned machining line 3a is completed, the relative movement between the holding table 18 and the jet nozzle 24c is stopped before the jet nozzle 24c leaves the area overlapping the workpiece 1.

[0082] When the spray nozzle 24c moves away from this area, the machining fluid will be directly sprayed onto the adhesive tape 7 or the holding surface 18a of the holding table 18, thereby damaging the adhesive tape 7 or the holding table 18. Therefore, for example, when the spray nozzle 24c is arranged in the peripheral remaining area 5c of the workpiece 1 (see Figure 2 During the period above (B), the relative movement of the holding table 18 and the spray nozzle 24c is stopped.

[0083] Then, the holding table 18 and the spray nozzle 24c are moved in the indexing feed direction (Y-axis direction) perpendicular to the machining feed direction 12a, positioning the spray nozzle 24c above another first planned machining line 3a. The holding table 18 and the spray nozzle 24c are then moved again along the machining feed direction 12a, thereby machining the workpiece 1 along this other first planned machining line 3a. Machining is continued until the workpiece 1 is machined along all first planned machining lines 3a, completing the first machining step.

[0084] In addition, in the first processing step, when the workpiece 1 is processed along the first planned processing line 3a, the workpiece 1 can be processed by spraying the processing fluid on one area and the other area separated by the first groove 13a. The trajectory of the spray nozzle 24c in this case will be described. Figure 3 The plan view of the workpiece 1 shown shows a trajectory 24 g of the jet nozzle 24 c relative to the workpiece 1 .

[0085] like Figure 3 As shown, after the workpiece 1 is machined by relatively moving the jet nozzle 24c along one sidewall of the first groove 13a, the workpiece 1 is further machined by relatively moving the jet nozzle 24c along the other sidewall of the first groove 13a. In this case, the machining fluid can be sprayed separately onto the metal burrs on the one sidewall of the first groove 13a and the metal burrs on the other sidewall, thereby more reliably removing the respective burrs. However, the machining method of this embodiment is not limited to this.

[0086] In preparation for machining the workpiece 1 along the second planned machining line 3b, a second positioning step is performed after the first machining step. In the second positioning step, the holding table 18 is rotated by the rotation unit so that the second direction 1d of the workpiece 1 aligns with the machining feed direction 12a of the machining device 2, and the jet nozzle 24c is positioned at one end of the second planned machining line 3b. The second positioning step will be described in detail later.

[0087] After the second positioning step is performed, the second processing step is performed to process the workpiece 1 along the second planned processing line 3 b. Figure 4 (B) is a cross-sectional view schematically showing the second processing step. In the second processing step, the holding table 18 and the spray nozzle 24c are relatively moved along the processing feed direction 12a, and the processing fluid sprayed from the spray nozzle 24c is used to process the workpiece 1 along the second planned processing line 3b.

[0088] In the second processing step, similar to the first processing step, the holding table 18 and the spray nozzle 24c are repeatedly moved in the processing feed direction 12a and in the indexing feed direction. The workpiece 1 is then processed along all of the second planned processing lines 3b, completing the second processing step. The spraying of the processing fluid from the spray nozzle 24c, which has been ongoing since the start of the first processing step, is then stopped.

[0089] During the first and second processing steps, the metal burrs formed in the grooves 13a and 13b can be removed. Therefore, when the packaged device formed by dividing the workpiece 1 is subsequently mounted on a predetermined mounting object, the metal burrs do not hinder proper mounting.

[0090] However, conventionally, after machining the workpiece 1 along the first planned machining line 3a, the spraying of machining fluid from the spray nozzle 24c is temporarily stopped while the holding table 18 is rotated by the rotation unit. This is because, as the holding table 18 rotates, the workpiece 1 moves away from the area directly below the spray nozzle 24c. In this case, if the machining fluid continues to be sprayed while the holding table 18 is rotating, the machining fluid could directly spray onto the adhesive tape 7 or the holding surface 18a of the holding table 18, causing damage to the adhesive tape 7 and other components.

[0091] However, when the spraying of the machining fluid is stopped once, after rotating the holding table 18 and positioning the spray nozzle 24c at one end of the second planned machining line 3b, it is necessary to wait a predetermined time before restarting the spraying of the machining fluid from the spray nozzle 24c. This is because, in order to stably machine the workpiece 1 along the second planned machining line 3b under predetermined conditions, machining must begin after the machining fluid has been stably sprayed from the spray nozzle 24c under predetermined spraying conditions.

[0092] For example, the total machining time required to machine a single workpiece 1 is approximately 70 seconds. Of this, the waiting time between the resumption of machining fluid spraying and the stabilization of the machining fluid spraying state is, for example, approximately 20 to 30 seconds. This waiting time accounts for a significant portion of the machining time, and it is desirable to reduce this waiting time.

[0093] Therefore, in the machining method of this embodiment, the spraying of the machining fluid from the spray nozzle 24c is not stopped during the second positioning step in which the holding table 18 is rotated. That is, in the second positioning step, the holding table 18 and the spray nozzle 24c are relatively moved so that the machining fluid continues to be sprayed onto the workpiece 1 while the holding table 18 rotates.

[0094] For example, the positions of the jet nozzle 24c at the start and end of the first processing step of the workpiece 1, as well as the positions of the jet nozzle 24c at the start and end of the second processing step, are pre-registered in the processing apparatus 2. Furthermore, the processing start and end positions of the first planned processing line 3a and the second planned processing line 3b are pre-registered. Furthermore, the trajectory of the jet nozzle 24c from the position at the end of the first processing step to the position at the start of the second processing step is pre-calculated.

[0095] Furthermore, during the second positioning step, the holding table 18 is rotated, and the holding table 18 and the spray nozzle 24c are relatively moved in the X-axis and Y-axis directions according to this trajectory. In this case, there is no need to stop the spraying of the machining fluid from the spray nozzle 24c to prevent the workpiece 1 from shifting from the area directly below the spray nozzle 24c. Since the machining fluid is continuously and stably sprayed from the spray nozzle 24c according to the prescribed conditions, the second machining step can be started immediately after the second positioning step is completed.

[0096] Therefore, in the processing method of this embodiment, the waiting time before starting the second processing step can be shortened, and the time required for processing the workpiece 1 can be shortened.

[0097] Furthermore, in the processing method of this embodiment, a registration step may be performed before the second positioning step is performed, and a plan related to the relative movement of the holding table 18 and the jet nozzle 24c in the second positioning step may be registered in the processing device 2. Furthermore, when a plurality of workpieces 1 of the same type are processed continuously, by registering a plan related to the relative movement of the holding table 18 and the jet nozzle 24c once, the second processing step can be performed on all of the workpieces 1 using the plan.

[0098] Furthermore, during the second positioning step, for example, the holding table 18 and the spray nozzle 24c may be relatively moved so that the machining fluid is continuously sprayed onto the peripheral remaining area 5c of the workpiece 1 as the holding table 18 rotates. If the machining fluid is continuously sprayed onto the device area 5b of the workpiece 1 during the second positioning step, this may damage the device 5 formed in the device area 5b. Therefore, it is preferable to utilize the peripheral remaining area 5c of the workpiece 1 to continuously receive the machining fluid sprayed while the holding table 18 rotates.

[0099] Alternatively, in the second positioning step, the holding table 18 and the spray nozzle 24c may be relatively moved so that the machining fluid is continuously sprayed to either the first groove 13a or the second groove 13b of the workpiece 1 while the holding table 18 rotates. Figure 5 (A) Figure 5 (B) and Figure 5 (C) is used for explanation.

[0100] Figure 5 (A) is a top view schematically showing the position of the injection nozzle at the end of the first processing step. Figure 5 (A) shows the position of the injection nozzle 24c at the end of the first processing step or the start of the second positioning step. Figure 5 As shown in FIG. 2(A) , at this moment, the jet nozzle 24 c is positioned in the outer peripheral remaining area 5 c and above the first groove 13 a formed along the first planned processing line 3 a .

[0101] Figure 5 (B) is a schematic top view showing the second positioning step. In the second positioning step, the holding table 18 and the spray nozzle 24c are moved relative to each other while the holding table 18 is rotated. Figure 5 As shown in FIG. 2(B) , the holding table 18 and the spray nozzle 24 c are relatively moved so that the spray nozzle 24 c is continuously positioned above the first groove 13 a of the workpiece 1 .

[0102] Then, when the second direction 1d of the workpiece 1 coincides with the machining feed direction 12a of the machining device 2, the rotation of the holding table 18 is stopped. Next, the holding table 18 and the spray nozzle 24c are relatively moved, and the spray nozzle 24c, which was positioned above the first groove 13a, is positioned above the second groove 13b along the second planned machining line 3b, completing the second positioning step. Then, the second machining step begins. Figure 5 (C) is a plan view schematically showing the position of the injection nozzle at the start of the second processing step.

[0103] In the second positioning step, the processing fluid is continuously sprayed onto the first groove 13a of the workpiece 1 while the holding table 18 rotates. However, the processing fluid may also be continuously sprayed onto the second groove 13b while the holding table 18 rotates. In this case, before the rotation of the holding table 18 begins, the spray nozzle 24c positioned above the first groove 13a is positioned above the second groove 13b. Then, the rotation of the holding table 18 begins.

[0104] Furthermore, while the holding table 18 is rotating in the second positioning step, it is not necessary to continuously spray the machining fluid onto the same portion of the workpiece 1. For example, the portion of the workpiece 1's peripheral remaining area 5c that receives the machining fluid may be changed while the holding table 18 is rotating. Furthermore, the spray nozzle 24c may be positioned above the second groove 13b simultaneously with the completion of the rotation of the holding table 18.

[0105] In this case, after the first processing step is performed, the rotation of the holding table 18 can be started immediately. In addition, after the rotation of the holding table 18 is completed, the second processing step can be started immediately. Therefore, the time required for the second positioning step can be minimized.

[0106] The present invention is not limited to the above-described embodiments and can be implemented with various modifications. For example, in the above-described embodiments, the workpiece 1 is processed to remove metal burrs, but one embodiment of the present invention is not limited to this. For example, in the processing method of one embodiment of the present invention, the workpiece 1 can be processed for purposes other than removing metal burrs.

[0107] Furthermore, while the example in which the workpiece 1 is processed along the first planned processing line 3a and then along the second planned processing line 3b has been described, the processing method of one embodiment of the present invention is not limited to this. Specifically, the workpiece 1 may be processed along the first planned processing line 3a after being processed along the second planned processing line 3b. Furthermore, the first direction 1c is not limited to a direction along the long side of the workpiece 1, and the second direction 1d is not limited to a direction along the short side of the workpiece 1.

[0108] In addition, the structure, method, etc. of the above-mentioned embodiment can be appropriately modified and implemented without departing from the scope of the purpose of the present invention.

Claims

1. A processing method, using a processing device to process a workpiece, The processing device has: A holding table having a holding surface for holding the workpiece; a spray nozzle for spraying a machining fluid onto the workpiece held by the holding table; a processing feed unit that relatively moves the holding table and the spray nozzle along a processing feed direction; and a rotating unit that rotates the holding table around an axis in a direction perpendicular to the holding surface, The workpiece has a first planned processing line along a first direction and a second planned processing line along a second direction intersecting the first direction set on the front surface. It is characterized by: The processing method has the following steps: A holding step, using the holding worktable to hold the workpiece; a first positioning step of rotating the holding table by the rotating unit after the holding step so that the first direction of the workpiece is aligned with the processing feed direction, and positioning the jet nozzle at one end of the first predetermined processing line; A first processing step includes starting to spray the processing fluid from the spray nozzle after the first positioning step is performed, and then relatively moving the holding table and the spray nozzle along the processing feed direction to process the workpiece along the first predetermined processing line using the processing fluid. a second positioning step of rotating the holding table by the rotating unit after the first processing step so that the second direction of the workpiece is aligned with the processing feed direction, and positioning the jet nozzle at one end of the second processing predetermined line; and The second processing step comprises: after the second positioning step is performed, the holding table and the spray nozzle are relatively moved along the processing feed direction, and the processing fluid sprayed from the spray nozzle is used to process the workpiece along the second processing predetermined line. The workpiece is attached to the adhesive tape in the opening of the ring frame whose opening is sealed by the adhesive tape. In the second positioning step, the holding table and the spray nozzle are relatively moved so that the machining fluid is continuously sprayed onto the workpiece while the holding table rotates and is not directly sprayed onto an object other than the workpiece.

2. The processing method according to claim 1, characterized in that: A plurality of the first predetermined processing lines and a plurality of the second predetermined processing lines are set on the front surface of the workpiece, The workpiece has, on the front surface, a device region in which devices are respectively arranged in each region divided by the first planned processing line and the second planned processing line, and a peripheral remaining region surrounding the device region. In the second positioning step, the machining fluid is continuously sprayed onto the remaining area of ​​the outer periphery of the workpiece while the holding table is rotating.

3. The processing method according to claim 1, characterized in that: A first groove along the first predetermined processing line and a second groove along the second predetermined processing line are formed on the front surface of the workpiece. In the second positioning step, the machining fluid is continuously sprayed onto either the first groove or the second groove of the workpiece while the holding table is rotating.

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