Display panel and method of manufacturing the same

Abstract

Systems and methods are described for display panels and methods of manufacturing the same. The systems and methods can provide: a substrate having a first surface and a second surface facing each other; a display unit including an organic light-emitting diode disposed on the first surface of the substrate; and a thin film encapsulation layer disposed on the display unit to shield the display unit, wherein an edge of the first surface or an edge of the second surface is inclined relative to the first surface or the second surface. The inclined surface is designed to prevent damage to the display panel due to fine cracks during the manufacturing process when the display panel is cut or cut out from a single base member. Display panels with improved strength characteristics can also be manufactured.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0028259 filed on March 12, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] One or more embodiments relate to apparatuses and methods, and more particularly, to a display panel and a method of manufacturing the display panel. Background Art

[0003] With tablet computers and mobile phones being widely used in daily life, mobile electronic devices have become widely used around the world. These mobile electronic devices support various functions such as making calls, emails, navigation, music or games, but are not limited thereto.

[0004] To support these functions, mobile electronic devices include display panels for providing visual information such as images or videos to users. Recently, as the components used to drive such display panels have become smaller and smaller, the occupancy rate of display panels in electronic devices has gradually increased. In addition, structures that have been designed to be curved (i.e., at a predetermined angle to a flat state) have been developed. This type of design poses new manufacturing challenges that should be addressed.

[0005] Typically, when manufacturing display panels, multiple display panels are formed on a single base member. The base member is then cut into multiple sections. This can cause fine cracks in the cutout sections of the base member, which can reduce the rigidity of the resulting display panel. Summary of the Invention

[0006] One or more embodiments include a display panel having increased rigidity after being manufactured and a method of manufacturing the display panel.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0008] According to one or more embodiments, a display panel includes: a substrate having a first surface and a second surface facing each other; a display unit including an organic light emitting diode arranged on the first surface of the substrate; and a thin film encapsulation layer arranged on the display unit to shield the display unit, wherein an edge of the first surface or an edge of the second surface is inclined relative to the first surface or the second surface.

[0009] The distance from the inclined edge of the first surface or the inclined edge of the second surface to the surface of the substrate may be 5 μm or more.

[0010] The display panel may further include a protection unit disposed on the thin film encapsulation layer to shield the thin film encapsulation layer.

[0011] The substrate may include: a first region shielded by a protective unit; and a second region not overlapping the first region and having at least one of an adhesive, cerium oxide (CeO2), diamond, silicon carbide (SiC), and an ionic component of a surfactant arranged on the second region.

[0012] The protection unit may include an adhesive disposed on the thin film encapsulation layer and a protection film disposed on the adhesive.

[0013] According to one or more embodiments, a method for manufacturing a display panel includes: manufacturing a display panel comprising a substrate having a first surface and a second surface, a display unit arranged on the first surface of the substrate and comprising an organic light emitting diode, and a thin film encapsulation layer configured to shield the display unit; removing a portion of the substrate on which the thin film encapsulation layer is not arranged; and forming an inclined surface inclined relative to the first surface or the second surface by grinding an edge of the first surface or an edge of the second surface, the portion of the substrate having been removed from the first surface or the second surface.

[0014] The method may further include disposing a protection unit on the thin film encapsulation layer.

[0015] The method may further include removing a portion of the protection unit.

[0016] The protection unit may include an adhesive disposed on the thin film encapsulation layer and a protection film disposed on the adhesive.

[0017] A soft pad or a hard pad may be used to grind the edge of the first surface or the edge of the second surface.

[0018] A distance from the inclined corner portion of the first surface or the inclined corner portion of the second surface to an end portion of the substrate may be 5 μm or more.

[0019] According to one or more embodiments, a method for manufacturing a display panel includes: manufacturing a display panel, which includes a substrate having a first surface and a second surface, a display unit arranged on the first surface of the substrate and including an organic light emitting diode, and a thin film encapsulation layer configured to shield the display unit; arranging a protective unit on the thin film encapsulation layer; removing a portion of the protective unit on which the thin film encapsulation layer is not arranged; dividing the substrate into a first area in which the protective unit shields the first surface and a second area not overlapping with the first area by removing a portion of the substrate from which the protective unit has been removed; and forming an inclined surface inclined relative to the first surface or the second surface by grinding an edge of the first surface or an edge of the second surface from which the portion of the substrate has been removed.

[0020] The method may further include removing foreign matter on the second area.

[0021] The foreign matter on the second area can be cleaned and removed by using a surfactant.

[0022] Foreign matter on the second region may be treated and removed using oxygen plasma.

[0023] At least one of an adhesive, ceria (CeO 2 ), diamond, silicon carbide (SiC), and an ionic component of a surfactant may be disposed on the second region.

[0024] A distance from the inclined corner portion of the first surface or the inclined corner portion of the second surface to an end portion of the substrate may be 5 μm or more.

[0025] The protection unit may include an adhesive disposed on the thin film encapsulation layer and a protection film disposed on the adhesive.

[0026] The adhesive may comprise polyurethane.

[0027] A soft pad or a hard pad may be used to grind the edge of the first surface or the edge of the second surface.

[0028] These and other aspects will become more apparent and easier to understand from the following description of embodiments with reference to the accompanying drawings.

[0029] These general and specific embodiments may be implemented through the use of a system, a method, a computer program, or a combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] These and other aspects will become more apparent and easier to understand through the following description of the embodiments with reference to the accompanying drawings, in which:

[0031] Figure 1 is a plan view of a portion of a display panel according to an embodiment;

[0032] Figure 2 It is along Figure 1 A sectional view taken along line AA;

[0033] Figure 3 It is along Figure 1 A sectional view taken along line BB;

[0034] Figures 4 to 10 is a cross-sectional view of a method of manufacturing a display panel according to an embodiment; and

[0035] Figures 11 to 17 is a cross-sectional view illustrating a method of manufacturing a display panel according to another embodiment. DETAILED DESCRIPTION

[0036] Manufacturing methods and processes for producing display devices often use a single substrate that is cut into multiple pieces. In some cases, small cracks may appear on the edges of displays where the substrate has been cut. This can compromise the strength or integrity of the display device. For example, a fine crack can expand and become a larger crack.

[0037] Therefore, the present disclosure provides systems and methods for preventing damage caused by hairline cracks that occur during the manufacturing process. For example, one or more surfaces of a substrate may be provided with chamfered edges. The chamfered edges can reduce stress on the edge of the surface and prevent the formation or growth of hairline cracks or other damage. Embodiments of the present disclosure provide a process for producing an inclined edge that is inclined relative to a surface by grinding or removing a portion of the edge of a substrate.

[0038] Since the present disclosure allows for various changes and many embodiments, specific embodiments will be shown in the drawings and described in detail in the written description. Hereinafter, with reference to the drawings in which embodiments of the present disclosure are shown, the effects and features of the present disclosure and the methods for achieving them will be more fully described. However, the present disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0039] One or more embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Those components that are the same or correspond to each other are given the same reference numerals regardless of the figure numbers, and redundant descriptions are omitted.

[0040] It will be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0041] As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0042] It will also be understood that the term "comprise" or variations thereof used herein specify the presence of stated features or components, but does not preclude the presence or addition of one or more other features or components.

[0043] It will be understood that when a layer, region, or component is referred to as being “formed on” another layer, region, or component, the layer, region, or component may be directly or indirectly formed on the other layer, region, or component. For example, intervening layers, regions, or components may be present.

[0044] For the convenience of explanation, the sizes of the elements in the drawings may be exaggerated. Since the sizes and thicknesses of the components in the drawings are arbitrarily shown for the convenience of explanation, the following embodiments are not limited thereto.

[0045] In the following examples, the X-axis, Y-axis, and Z-axis are not limited to the three axes of the rectangular coordinate system, but can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0046] When a certain embodiment can be implemented differently, a specific process order can be performed in a different order than described. For example, two consecutively described processes can be performed substantially simultaneously or in a reverse order to the described order.

[0047] Figure 1 is a plan view of a portion of the display panel 1 according to the embodiment. Figure 2 It is along Figure 1 A cross-sectional view taken along line AA. Figure 3 It is along Figure 1 A cross-sectional view taken along line BB.

[0048] Reference Figures 1 to 3 The display panel 1 may include a panel unit 20 and a protection unit 10. In the panel unit 20, a display area DA and a non-display area NDA surrounding the display area DA may be defined on a substrate 21. The display unit D may be arranged in the display area DA, and power wiring (not shown), for example, may be arranged in the non-display area NDA. A pad unit (also called a pad unit) C may be arranged in the non-display area NDA.

[0049] The panel unit 20 may include a substrate 21 , a display unit D, and a thin film encapsulation layer E. The display unit D may include a thin film transistor (TFT), a passivation layer 27 , and an organic light emitting diode (OLED) 28 .

[0050] The substrate 21 may include glass or plastic material, or may include a metal material such as stainless steel (SUS) or titanium (Ti). In one embodiment, the substrate 21 is formed of glass, but the present disclosure is not limited thereto.

[0051] The substrate 21 may include a first surface 21-1 and a second surface 21-2. The display unit D may be disposed on the first surface 21-1 or the second surface 21-2. For ease of description, the case where the display unit D is disposed on the first surface 21-1 will now be described in detail.

[0052] At least one of the edges of the first surface 21-1 or at least one of the edges of the second surface 21-2 can be tapered, beveled, or chamfered. In one example, the taper or chamfer can have an angle of about 45 degrees relative to the surface or edge. In another embodiment, the angle with the surface of the substrate 21 is between 30 and 60 degrees.

[0053] In other embodiments, the taper or chamfer may include multiple angles, or may include rounded edges. Thus, by including tapered or chamfered edges, the substrate 21 may have improved strength or integrity compared to a substrate 21 that does not have tapered or chamfered edges. As a result, the substrate 21 is less likely to develop cracks or other damage during or after the manufacturing process. As used herein, the term "sloped surface" may refer to a tapered, chamfered, multiple chamfers, or rounded surface. Figure 3 In the embodiment shown in , the inclined surfaces S1 and S2 form chamfered edges on the substrate 21 .

[0054] For example, according to an embodiment, the first inclined surface S1 may be arranged on a short edge among the edges of the first surface 21-1, or the second inclined surface S2 may be arranged on a short edge among the edges of the second surface 21-2. According to another embodiment, the first inclined surface S1 may be arranged on a short edge among the edges of the first surface 21-1, and the second inclined surface S2 may be arranged on a short edge among the edges of the second surface 21-2.

[0055] According to another embodiment, the first inclined surface S1 may be arranged on a long edge among the edges of the first surface 21-1, or the second inclined surface S2 may be arranged on a long edge among the edges of the second surface 21-2. According to another embodiment, the first inclined surface S1 may be arranged on a long edge among the edges of the first surface 21-1, and the second inclined surface S2 may be arranged on a long edge among the edges of the second surface 21-2.

[0056] According to another embodiment, the first inclined surface S1 may be arranged on a short edge among the edges of the first surface 21-1, and the second inclined surface S2 may be arranged on a long edge among the edges of the second surface 21-2. According to another embodiment, the first inclined surface S1 may be arranged on a long edge among the edges of the first surface 21-1, and the second inclined surface S2 may be arranged on a short edge among the edges of the second surface 21-2.

[0057] For convenience of explanation, a case where the first inclined surface S1 is arranged on a short edge among edges of the first surface 21 - 1 and the second inclined surface S2 is arranged on a short edge among edges of the second surface 21 - 2 will now be described in detail.

[0058] The first inclined surface S1 and the second inclined surface S2 may be arranged on both edges of one short side surface Ed among the short side surfaces (i.e., the side surfaces where the short sides are located) of the substrate 21. According to another embodiment, the first inclined surface S1 and the second inclined surface S2 may be arranged on the edges of different short side surfaces among the short side surfaces of the substrate 21. For ease of explanation, the case where the first inclined surface S1 and the second inclined surface S2 are arranged on both edges of the same short side surface among the short side surfaces (hereinafter also referred to as "short sides") of the substrate 21 will now be described in detail.

[0059] The first inclined surface S1 and the second inclined surface S2 may be arranged to face each other. The first inclined surface S1 and the second inclined surface S2 may be symmetrical with each other about any straight line (or plane) parallel to the first surface 21-1 or the second surface 21-2 and passing through the center of the substrate 21. In this case, the first inclined surface S1 and the second inclined surface S2 may have the same shape. For example, the angle of the first inclined surface S1 relative to the first surface 21-1 may be the same as the angle of the second inclined surface S2 relative to the second surface 21-2. The first distance W from the edge shared by the first inclined surface S1 and the first surface 21-1 to the short face Ed of the substrate 21 may be the same as the second distance from the edge shared by the second inclined surface S2 and the second surface 21-2 to the short face Ed of the substrate 21. The first distance W may be 5 μm or greater. Specifically, when the first distance W is 5 μm or greater, fine cracks generated during the removal of a portion of the substrate 21 can be removed, and even when an external impact is applied to the first inclined surface S1, stress concentration on the first inclined surface S1 can be prevented.

[0060] In this case, the first inclined surface S1 can extend from the first surface 21-1 toward the second surface 21-2 and can reach the short face Ed of the substrate 21. The edges shared by the first inclined surface S1 and the first surface 21-1, and the edges shared by the first inclined surface S1 and the short face Ed of the substrate 21 can be rounded edges so that stress does not concentrate on these two edges. The second inclined surface S2 can extend from the second surface 21-2 toward the first surface 21-1 and can reach the short face Ed of the substrate 21. The edges shared by the second inclined surface S2 and the second surface 21-2, and the edges shared by the second inclined surface S2 and the short face Ed of the substrate 21 can be rounded edges so that stress does not concentrate on these two edges.

[0061] The substrate 21 described above may include a first region AR1 in which the protective unit 10 is disposed, and a second region AR2 in which little or no protective unit 10 is disposed. In the first region AR1, the display unit D, the thin film encapsulation layer E, and the protective unit 10 may be disposed. Since little or no protective unit 10 is disposed in the second region AR2, the second region AR2 may be exposed. In this case, particles T may be disposed in the second region AR2. The particles T may include at least one of an ionic component of a binder 12, a protective film 11, ceria (CeO2), diamond, silicon carbide (SiC), and a surfactant.

[0062] A thin film transistor TFT may be formed on the substrate 21 , a passivation layer 27 may be formed to cover the thin film transistor TFT, and an OLED 28 may be formed on the passivation layer 27 .

[0063] A buffer layer 22 formed of an organic compound or an inorganic compound is also formed on the upper surface of the substrate 21. The buffer layer 22 may be made of silicon oxide (SiO x )(x≥1) or silicon nitride (SiN x )(x≥1) is formed, but is not limited thereto.

[0064] An active layer 23 arranged in a predetermined pattern is formed on the buffer layer 22 and then buried by the gate insulating layer 24. The active layer 23 includes a source region 23A and a drain region 23C, and further includes a channel region 23B between the source region 23A and the drain region 23C.

[0065] The active layer 23 may include various materials. For example, the active layer 23 may include an inorganic semiconductor material (such as amorphous silicon or crystalline silicon), an oxide semiconductor, an organic semiconductor material, etc. However, for ease of description, the case where the active layer 23 may be formed of amorphous silicon will now be described in detail.

[0066] The active layer 23 may be formed by forming an amorphous silicon layer on the buffer layer 22, crystallizing the amorphous silicon layer into a polysilicon layer, and patterning the polysilicon layer. The source region 23A and the drain region 23C of the active layer 23 are doped with impurities according to the type of TFT (such as a driving TFT (not shown), a switching TFT, etc.).

[0067] A gate electrode 25 facing the active layer 23 and an interlayer insulating layer 26 burying the gate electrode 25 are formed on an upper surface of the gate insulating layer 24 .

[0068] Contact hole H1 is formed in interlayer insulating layer 26 and gate insulating layer 24 , and then source electrode 27A and drain electrode 27B are formed on interlayer insulating layer 26 such that source electrode 27A and drain electrode 27B contact source region 23A and drain region 23C, respectively.

[0069] A passivation layer 27 is formed on the thin film transistor TFT formed as described above, and a pixel electrode 28A of the OLED 28 is formed on the passivation layer 27. The pixel electrode 28A contacts the source electrode 27A of the thin film transistor TFT through a via H2 formed in the passivation layer 27. The passivation layer 27 can be formed as a single layer or multiple layers of an inorganic material or an organic material, but is not limited thereto. The passivation layer 27 can be formed as a planarization layer so that its upper surface is flat, regardless of the unevenness of the lower layer below the passivation layer 27. Alternatively, the passivation layer 27 can be formed to be uneven according to the unevenness of the lower layer. The passivation layer 27 can be formed of a transparent insulator, thereby achieving a resonance effect.

[0070] After forming pixel electrode 28A on passivation layer 27, pixel defining layer 29 is formed of an organic material or an inorganic material so that pixel defining layer 29 covers pixel electrode 28A and passivation layer 27. Pixel defining layer 29 has an opening through which pixel electrode 28A is exposed.

[0071] The intermediate layer 28B and the counter electrode 28C are formed at least on the pixel electrode 28A. According to another embodiment, the counter electrode 28C may be formed on the entire surface of the substrate 21. In this case, the counter electrode 28C may be formed on the intermediate layer 28B and the pixel-defining layer 29. For ease of description, the case where the counter electrode 28C is formed on the intermediate layer 28B and the pixel-defining layer 29 will now be described in detail.

[0072] The pixel electrode 28A functions as an anode, and the counter electrode 28C functions as a cathode. Alternatively, the pixel electrode 28A may function as a cathode, and the counter electrode 28C may function as an anode.

[0073] The pixel electrode 28A and the counter electrode 28C are insulated from each other by the intermediate layer 28B, and voltages of opposite polarities are applied to the intermediate layer 28B to induce light emission in the organic emission layer.

[0074] The intermediate layer 28B may include an organic emission layer. For example, the intermediate layer 28B includes an organic emission layer. However, the intermediate layer 28B may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). The present embodiment is not limited thereto, and in addition to the organic emission layer, the intermediate layer 28B may further include various other functional layers (not shown).

[0075] A plurality of intermediate layers 28B as described above may be included and formed in the display area DA. The plurality of intermediate layers 28B may be spaced apart from each other within the display area DA.

[0076] A unit pixel includes multiple sub-pixels, and the multiple sub-pixels can emit light of various colors. For example, a unit pixel can include multiple sub-pixels that emit red light, green light, and blue light, or multiple sub-pixels that emit red light, green light, blue light, and white light, respectively.

[0077] Although not shown in the drawings, a capping layer (not shown) may be disposed on the counter electrode 28C. The capping layer may have a lower refractive index than the counter electrode 28C. This can improve luminous efficiency by increasing the percentage of light generated by the intermediate layer 28B including the organic emission layer that is reflected and emitted to the outside.

[0078] For example, the capping layer may include an organic material such as poly(3,4-ethylenedioxythiophene) (PEDOT), 4,4′-bis[N-(3-methylphenyl)-N-phenylamino]biphenyl (TPD), 4,4′,4″-tris[(3-methylphenyl)phenylamino]triphenylamine (m-MTDATA), 1,3,5-tris[N,N-bis(2-methylphenyl)-amino]-benzene (o-MTDAB), 1,3,5-tris[N,N-bis(3-methylphenyl)-amino]-benzene (m-MTDAT ...DATA), 1,3,5-tris[N,N-bis(2-methylphenyl)-amino]-benzene (m-MTDAT), 1,3,5-tris[N,N-bis(3-methylphenyl)-amino]-benzene (m-MTDATA), 1,3,5-tris[N,N-bis(3-methylphenyl)-amino]-benzene (m-MTDAT), 1,3,5-tris[N,N- Bis(4-methylphenyl)-amino]-benzene (p-MTDAB), 4,4'-bis[N,N-bis(3-methylphenyl)-amino]-diphenylmethane (BPPM), 4,4'-dicarbazolyl-1,1'-biphenyl (CBP), 4,4',4"-tris(N-carbazolyl)triphenylamine (TCTA), 2,2',2"-(1,3,5-phenylmethylphenyl)tris-[1-phenyl-1H-benzimidazole] (TPBI) and 3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole (TAZ), but are not limited thereto.

[0079] Alternatively, the cover layer may include an inorganic material such as zinc oxide, titanium oxide, zirconium oxide, silicon nitride, niobium oxide, tantalum oxide, tin oxide, nickel oxide, indium nitride, and gallium nitride. The material of the cover layer is not limited thereto, and various other materials may be used.

[0080] A capping layer (not shown) may be disposed on the cover layer. The capping layer protects the OLED 28 from damage that may occur during subsequent processes using plasma, etc. The capping layer may include lithium fluoride (LiF).

[0081] The thin film encapsulation layer E may include a plurality of inorganic layers or may include an inorganic layer and an organic layer.

[0082] The organic layer of the thin film encapsulation layer E may include a polymer material. Examples of the polymer material may include acrylic resin, epoxy resin, polyimide, polyethylene, and the like.

[0083] For example, the organic layer may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (eg, polymethyl methacrylate or polyacrylic acid), or any combination thereof.

[0084] The inorganic layer of the thin film encapsulation layer E may include at least one inorganic insulating material, such as aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, silicon oxynitride, and the like.

[0085] The uppermost layer exposed to the outside among the thin film encapsulation layer E may include an inorganic layer to prevent moisture from penetrating to the OLED 28 .

[0086] The thin film encapsulation layer E may include at least one sandwich structure in which at least one organic layer is between at least two inorganic layers. Alternatively, the thin film encapsulation layer E may include at least one sandwich structure in which at least one inorganic layer is between at least two organic layers. Alternatively, the thin film encapsulation layer E may include a sandwich structure in which at least one organic layer is between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is between at least two organic layers.

[0087] The thin film encapsulation layer E may include a first inorganic layer, a first organic layer, and a second inorganic layer sequentially formed from an upper portion of the OLED 28 .

[0088] Alternatively, the thin film encapsulation layer E may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer sequentially formed from the upper portion of the OLED 28 .

[0089] Alternatively, the thin film encapsulation layer E may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, a third inorganic layer, a third organic layer, and a fourth inorganic layer sequentially formed from the upper portion of the OLED 28 .

[0090] The first organic layer may have a smaller area than the second inorganic layer, and the second organic layer may also have a smaller area than the third inorganic layer.

[0091] When a plurality of inorganic layers are included as described above, the plurality of inorganic layers may be deposited to directly contact each other at the edge region of the display unit D, and the organic layer may not be exposed.

[0092] The protective unit 10 may include a protective film 11 and an adhesive 12. The protective film 11 may include a synthetic resin. The adhesive 12 may include an optically clear adhesive (OCR). According to another embodiment, the adhesive 12 may include polyurethane.

[0093] In this case, the protection unit 10 can shield the thin film encapsulation layer E to protect the panel unit 20 from external impact. Since the protection unit 10 is formed to have an area larger than the plane area of ​​the thin film encapsulation layer E, the protection unit 10 can completely shield the thin film encapsulation layer E. The protection unit 10 can be attached to or detached from the panel unit 20 as selected.

[0094] Therefore, the display panel 1 can prevent cracks and the like from being generated at the end portion thereof due to external impact.

[0095] Since fine cracks that may be generated when processing the display panel 1 are removed, damage to the display panel 1 due to the fine cracks may be prevented.

[0096] Figures 4 to 10 is a cross-sectional view of a method of manufacturing the display panel 1 according to an embodiment.

[0097] Reference Figures 4 to 10 , a base member 2 can be prepared to manufacture the display panel 1. The base member 2 can be used as a single substrate 21, or can be cut and used as a plurality of substrates 21. For ease of description, the case where the base member 2 is divided and used as a plurality of substrates 21 will now be described in detail.

[0098] The base member 2 may be formed of the same material as the substrate 21. Before the display unit D is arranged on the base member 2, foreign matter may be removed by, for example, cleaning liquid spraying or plasma treatment.

[0099] A plurality of display units D may be arranged on the base member 2 so as to be spaced apart from each other. Figures 1 to 3 The display unit D described is the same, so its detailed description is omitted here.

[0100] After forming a plurality of display units D on the base member 2, a thin film encapsulation layer E may be formed to correspond to each of the plurality of display units D. The thin film encapsulation layer E is similar to the above-mentioned Figures 1 to 3 The thin film encapsulation layer E is described, so its detailed description is omitted here.

[0101] Before forming the thin film encapsulation layer E on the display unit D, the thin film encapsulation layer E may be formed as described above. Figures 1 to 3 A cover layer or the like is formed between each of the thin film encapsulation layers E and each of the display units D.

[0102] After the display unit D and the thin film encapsulation layer E are arranged on the base member 2 as described above, a protective unit 10 may be arranged on the thin film encapsulation layer E. A plurality of protective units 10 may be included to shield at least one area of ​​the base member 2. According to another embodiment, one protective unit 10 may be included to shield the entire area of ​​the base member 2. For ease of description, the case where one protective unit 10 is included to shield the entire area of ​​the base member 2 will now be described in detail.

[0103] like Figure 6 As shown in , after the protection unit 10 is arranged as described above, each of the protection unit 10 and the base member 2 can be cut into multiple parts. For example, after forming cutting lines or cutting grooves in the protection unit 10 and the base member 2 by using the cutting unit CU, each of the protection unit 10 and the base member 2 can be cut into multiple parts. According to another embodiment, the base member 2 can be cut into multiple parts by completely removing a portion of the protection unit 10 and a portion of the base member 2 using the cutting unit CU, so that a plurality of substrates 21 can be formed. In this case, the base member 2 can be cut in one of the first direction and the second direction. The first direction can be the direction of one of the long edge and the short edge of the single display panel 1, and the second direction can be the direction of the other of the long edge and the short edge of the single display panel 1. The cutting unit CU may include a cutting wheel CU1 or a laser generator CU2. For ease of description, the case where the cutting unit CU includes a cutting wheel will now be described in detail.

[0104] A portion of the protective unit 10 may be removed from a single display panel 1 manufactured by cutting the base member 2 into a plurality of parts. For example, a portion (not shown) of the protective unit 10 that is present on the removal area AR3 of the substrate 21 may be removed. When a cutting line is formed on the protective unit 10 by using a cutting wheel, a cutter, or the like, the portion of the protective unit 10 on the removal area AR3 may be removed based on the cutting line.

[0105] In this case, a portion of the protective unit 10 may remain in the removal area AR3. For example, a portion of the adhesive 12 included in the protective unit 10 or a portion of the protective film 11 may remain in the removal area AR3.

[0106] When a portion of the protection unit 10 is removed from the removal area AR3, a portion of the removal area AR3 may be removed. For example, the second area AR2 may be formed by removing the dummy area DU as a portion of an end portion of the removal area AR3 from the removal area AR3.

[0107] Specifically, after forming, for example, cutting grooves or cutting lines in the first surface 21-1 or the second surface 21-2 of the removal area AR3, as in the case where the base member 2 is cut into a plurality of parts, the cutting unit CU can cut out the dummy area DU from the substrate 21. In this case, the cutting unit CU can cut out the dummy area DU from the substrate 21 by completely cutting the substrate 21 in the thickness direction of the substrate 21 or by removing a portion of the substrate 21 in the thickness direction of the substrate 21 and then applying an impact to the dummy area DU. As described above, fine cracks may exist at the edge of the short surface Ed of the substrate 21 from which the dummy area DU has been removed.

[0108] Therefore, if Figure 9 As shown in FIG, the edge of the short face Ed of the second region AR2 can be ground using a polishing pad PA. In this case, the polishing pad PA can have any of various shapes. For example, the polishing pad PA may include a soft polishing pad. The soft polishing pad may include cerium dioxide (CeO2). As another example, the polishing pad PA may include a hard polishing pad. The hard polishing pad may include at least one of diamond and silicon carbide (SiC).

[0109] result, Figure 10 The first inclined surface S1 and the second inclined surface S2 are formed on the edge of the short face Ed in the second area AR2 by grinding the edge of the short face Ed using the polishing pad PA as described above. For ease of description, the case where both the first inclined surface S1 and the second inclined surface S2 are formed at the edge of the second area AR2 will now be described in detail. However, other variations may also be used. For example, in some embodiments, only one inclined surface is formed at one edge of the substrate 21.

[0110] The first inclined surface S1 and the second inclined surface S2 can be formed sequentially or simultaneously. According to an embodiment, when the first inclined surface S1 and the second inclined surface S2 are formed sequentially, one of the first inclined surface S1 and the second inclined surface S2 can be formed, and then the substrate 21 can be rotated upside down or the polishing pad PA can be linearly moved or rotated upside down, so that the other of the first inclined surface S1 and the second inclined surface S2 can be formed. According to another embodiment, when the first inclined surface S1 and the second inclined surface S2 are formed simultaneously, a plurality of polishing pads PA can be included, and the first inclined surface S1 and the second inclined surface S2 can be formed separately by using a plurality of polishing pads PA. For the sake of convenience of description, the case of forming one of the first inclined surface S1 and the second inclined surface S2 and then forming the other will now be described in detail.

[0111] When the first and second inclined surfaces S1 and S2 are formed as described above and the polishing pad PA comprises a soft polishing pad, the first and second inclined surfaces S1 and S2 may comprise at least two layers. For example, a reaction layer may form on the first and second inclined surfaces S1 and S2 due to a chemical reaction between the polishing pad PA and the substrate 21 caused by heat generated during operation of the polishing pad PA. The substrate 21 may be disposed on the lower surface of the reaction layer. On the other hand, when the polishing pad PA comprises a hard polishing pad, the first and second inclined surfaces S1 and S2 may be formed from the same material as the substrate 21.

[0112] When the polishing pad PA forms the first inclined surface S1 and the second inclined surface S2 as described above, a portion of the polishing pad PA may be positioned on a portion of the first surface 21-1 in the second area AR2. In this case, when the polishing pad PA comprises a soft polishing pad as described above, at least one of ceria, a reactant between ceria and glass similar to the reaction layer described above, the adhesive 12, and the protective film 11 may be positioned on at least a portion of the first surface 21-1 of the second area AR2. On the other hand, when the polishing pad PA comprises a hard polishing pad, at least one of diamond, silicon carbide, the adhesive 12, and the protective film 11 may be positioned on at least a portion of the first surface 21-1 of the second area AR2. Specifically, in this case, components of the polishing pad PA may separate from the polishing pad PA during the formation of each inclined surface and may be absorbed into the second area AR2 by the adhesive 12 remaining on the first surface 21-1 of the second area AR2.

[0113] When the first and second inclined surfaces S1 and S2 are formed as described above, fine cracks generated at the short surface Ed of the substrate 21 during the removal of the dummy region DU can be removed. When the dummy region DU is removed, fine cracks may be concentrated on the portion where the substrate 21 and the dummy region DU are initially separated.

[0114] However, when the first inclined surface S1 and the second inclined surface S2 are formed on the substrate 21 as described above, the portion of the substrate 21 including the fine cracks can be removed, and thus, when an external impact is applied to the substrate 21, damage to the substrate 21 can be prevented. When the display panel 1 is dropped, even when it falls on the ground at the edge of the short face Ed of the substrate 21, the contact area between the edge and the ground can be increased, and the pressure can be effectively dispersed.

[0115] In this case, as mentioned above Figures 1 to 3 As described above, a distance from an edge of one surface of the substrate 21 where each of the first and second inclined surfaces S1 and S2 starts to an end surface (ie, the short face Ed) of the substrate 21 may be 5 μm to 200 μm.

[0116] When the first inclined surface S1 and the second inclined surface S2 are formed using the polishing pad PA as described above, particles T may accumulate on the first surface 21-1 of the second area AR2, and thus the thickness of the second area AR2 may be slightly greater than the thickness of other portions of the substrate 21. In this case, the strength of the second area AR2 is enhanced, and therefore, even when an external force is applied to the second area AR2, the second area AR2 is not damaged, thereby preventing damage to the substrate 21.

[0117] Therefore, in the method of manufacturing the display panel 1, a portion of the display panel 1 on which stress may be concentrated is removed, and fine cracks generated during the manufacture of the display panel 1 are also completely removed, thereby preventing damage to the display panel 1 due to external force applied to the end of the substrate 21, etc.

[0118] Furthermore, in the method of manufacturing the display panel 1 , the display panel 1 having improved strength may be manufactured, and a failure rate after the display panel 1 is manufactured may be minimized.

[0119] Figures 11 to 17 is a cross-sectional view illustrating a method of manufacturing a display panel 1 ′ according to another embodiment.

[0120] Reference Figures 11 to 17 , the display panel 1 ′ can be manufactured via the base member 2 ′.

[0121] In detail, a plurality of display units D' may be arranged on the base member 2' to be spaced apart from each other. The description of each of the plurality of display units D' may be the same as that of the reference Figures 1 to 3The description of the display unit D given is the same. A thin film encapsulation layer E' may be arranged on each of the multiple display units D'. The multiple thin film encapsulation layers E' may be spaced apart from each other to correspond to the multiple display units D', respectively. According to another embodiment, a single thin film encapsulation layer E' may be formed on the entire surface of the base member 2'. According to another embodiment, a single thin film encapsulation layer E' may be formed on the entire surface of the base member 2', and then the portion of the thin film encapsulation layer E' between adjacent display units D' may be removed, and thus, the thin film encapsulation layers E' respectively on the display units D' may be spaced apart from each other. For the convenience of description, the case where the thin film encapsulation layers E' are spaced apart from each other will now be described in detail.

[0122] After forming the display unit D' and the thin film encapsulation layer E' on the base member 2' as described above, a protective unit 10' can be arranged on the thin film encapsulation layer E'. According to an embodiment, the protective unit 10' can be arranged to cover the entire surface of the base member 2'. According to another embodiment, multiple protective units 10' can be arranged to correspond to multiple display units D', respectively, and can be spaced apart from each other. For ease of description, the case where a single protective unit 10' is arranged on the entire surface of the base member 2' will now be described in detail.

[0123] When the protective unit 10' is arranged on the entire surface of the base member 2' as described above, a portion of the protective unit 10' may be removed to expose the base member 2'. At this time, the portion 10-1' of the protective unit 10' between the adjacent display units D' may be removed in the first direction or the second direction. The first direction may be Figure 13 One of the X direction and the Y direction, the second direction may be Figure 13 The other of the X direction and the Y direction.

[0124] When a portion of the protection unit 10' is removed as described above, the removal area AR3' may be exposed. The cutting line or cutting groove may be formed by spraying an etchant onto the removal area AR3', irradiating a laser onto the removal area AR3', or using a cutter or the like.

[0125] Afterwards, if Figure 14 As shown in , the cutting unit CU' can be arranged to correspond to the cutting line or cutting groove. Then, the base member 2' can be completely cut in the thickness direction of the base member 2' using the cutting unit CU', or the base member 2' can be cut into multiple parts by cutting a portion of the base member 2' and applying force. In this case, each of the multiple base members 2' obtained by cutting can form a single substrate 21'. Thereafter, the cutting line or cutting groove is formed in the removal area AR3' of the single substrate 21' using the same method or a similar method as the above method, and the dummy area DU' can then be removed using the cutting unit CU'.

[0126] When the dummy area DU' is removed as described above, fine cracks may remain at the edge in the second area AR2' connected to the first area AR1'. To remove these fine cracks, a first inclined surface S1' or a second inclined surface S2' may be formed using a polishing pad PA'.

[0127] like Figure 16 As shown in FIG, during or after forming the first inclined surface S1' or the second inclined surface S2' using the polishing pad PA' as described above, the cleaning unit CL' can be used to clean the first surface 21-1' of the second area AR2'. For ease of description, the case where the cleaning unit CL' cleans the first surface 21-1' while the first inclined surface S1' or the second inclined surface S2' is being formed will now be described in detail. Specifically, the following will focus on and describe the case where the cleaning unit CL' cleans the first surface 21-1' of the second area AR2'.

[0128] In this case, according to an embodiment, the cleaning unit CL' may spray the surfactant onto the first surface 21-1' of the second area AR2'. According to another embodiment, the cleaning unit CL' may spray oxygen plasma onto the first surface 21-1' of the second area AR2'. For ease of description, the case where the cleaning unit CL' sprays the surfactant onto the first surface 21-1' of the second area AR2' will now be described in detail.

[0129] When the surfactant is sprayed onto the first surface 21-1' of the second area AR2' as described above, at least a portion of at least one of the components of the polishing pad PA', the adhesive 12', and the protective film 11' disposed on the first surface 21-1' of the second area AR2' can be cleaned and removed. A portion of the surfactant may remain on the first surface 21-1' of the second area AR2'. In this case, ionic components of the surfactant may remain on the first surface 21-1' of the second area AR2'.

[0130] In this case, at least one of the adhesive 12 ′, ceria (CeO 2 ), diamond, silicon carbide (SiC), and an ionic component of a surfactant may be disposed on the first surface 21 - 1 ′ of the second area AR2 ′.

[0131] When the process is completed, the manufactured display panel 1 ′ may be shipped outside or may be provided to another device.

[0132] Therefore, in the method of manufacturing the display panel 1', portions of the display panel 1' where stress may be concentrated are removed. Fine cracks generated during the manufacture of the display panel 1' are also completely removed. Removal of fine cracks can prevent damage to the display panel 1' due to external forces applied to the ends of the substrate 21', etc.

[0133] Furthermore, the method of manufacturing the display panel 1 ′ may allow the display panel 1 ′ to have improved strength characteristics and may minimize a failure rate after the display panel 1 ′ is manufactured.

[0134] By preventing the generation of cracks, the display panel according to the embodiment can be prevented from being damaged by external impact. In the method of manufacturing a display panel, according to the inventive concept, a display panel with improved strength characteristics can be manufactured. In addition, in the method of manufacturing a display panel, according to the inventive concept, the generation of faults during the manufacture of the display panel can be minimized.

[0135] While the inventive concept has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the claims.

[0136] In the present disclosure, the term "or" should be interpreted as meaning an inclusive or. That is, "A or B" means either A, or B, or both A and B.

Claims

1. A display panel, comprising: a substrate having a first surface and a second surface facing each other; a display unit comprising an organic light emitting diode arranged on the first surface of the substrate; as well as a thin film encapsulation layer, arranged on the display unit to shield the display unit, wherein the edge of the first surface or the edge of the second surface is inclined relative to the first surface or the second surface, wherein the substrate includes a first region on which the display unit and the thin film encapsulation layer are arranged and a second region including the edge of the first surface and the edge of the second surface, and The display unit and the thin film encapsulation layer are not arranged on the second area.

2. The display panel according to claim 1, wherein A distance from the inclined edge of the first surface or the inclined edge of the second surface to the surface of the substrate is 5 μm or more.

3. The display panel according to claim 1 , further comprising: A protection unit is arranged on the thin film encapsulation layer to shield the thin film encapsulation layer.

4. The display panel according to claim 3, wherein: The first area is shielded by the protection unit; and The second region does not overlap the first region, and at least one of a binder, ceria, diamond, silicon carbide, and an ionic component of a surfactant is disposed on the second region.

5. The display panel according to claim 3, wherein: The protection unit includes: an adhesive disposed on the thin film encapsulation layer; and A protective film is disposed on the adhesive.

6. A method for manufacturing a display panel, the method comprising: Manufacturing a display panel including a substrate, a display unit, and a thin film encapsulation layer, wherein the substrate has a first surface and a second surface, the display unit is arranged on a first area of ​​the substrate on the first surface of the substrate and includes an organic light emitting diode, and the thin film encapsulation layer is configured on the first area of ​​the substrate to shield the display unit; removing a portion of the substrate on which the thin film encapsulation layer is not disposed on the second region of the substrate; as well as An inclined surface inclined relative to the first surface or the second surface from which the portion of the substrate has been removed is formed by grinding an edge of the first surface or the second surface in the second region of the substrate. The method according to claim 6 , further comprising disposing a protection unit on the thin film encapsulation layer. The method according to claim 7 , further comprising removing a portion of the protection unit.

9. The method according to claim 7, wherein: The protection unit includes: an adhesive disposed on the thin film encapsulation layer; and A protective film is disposed on the adhesive.

10. The method according to claim 6, wherein: The edge of the first surface or the edge of the second surface is ground using a soft pad or a hard pad.

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