Display Devices

Abstract

A display device includes: a first substrate; a second substrate facing the first substrate; a connecting pad arranged on the first substrate; a first spacer arranged on the connecting pad and exposing a portion of the connecting pad; and a connecting pad arranged on side surfaces of the first substrate and the second substrate, the connecting pad contacting the connecting pad.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0027840, filed on Mar. 12, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to display devices. Background Art

[0004] With the development of multimedia, the importance of display devices has greatly increased. Therefore, various display devices such as liquid crystal display (LCD) devices and organic light emitting diode (OLED) display devices have been developed.

[0005] In these various display devices, there is an area where a driving integrated circuit (IC) or a printed circuit board is mounted on the outside of a glass substrate of the display device, and this area is a non-display area in which an image is not displayed and may be referred to as a frame. In the case of a spliced ​​display device obtained by arranging a plurality of display devices in a grid form to realize a large screen, the plurality of display devices are connected to each other. Therefore, the frame of the plurality of display devices appears twice in the area where the plurality of display devices are connected to each other, and as a result, the user's immersion in the image displayed by the spliced ​​display device may be disturbed.

[0006] The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore, this Background section may contain information that does not constitute prior art. Summary of the invention

[0007] Exemplary embodiments of the present invention provide a display device capable of reducing a bezel size of the display device and preventing a contact defect between a flexible circuit board and a connection pad.

[0008] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] An embodiment of a display device includes: a first substrate; a second substrate facing the first substrate; a connecting pad arranged on the first substrate; a first spacer arranged on the connecting pad and exposing a portion of the connecting pad; and a connecting pad arranged on side surfaces of the first substrate and the second substrate, the connecting pad being in contact with the connecting pad.

[0010] An embodiment of a display device includes: a first substrate; a second substrate facing the first substrate; a spacer disposed along edge regions of the first substrate and the second substrate; and a concave portion disposed between a side surface of the first substrate and a side surface of the second substrate. The side surface of the first substrate and the side surface of the second substrate are aligned with each other in a first direction perpendicular to a top surface of the first substrate and a top surface of the second substrate, and the first spacer is spaced apart from the side surface of the first substrate and the side surface of the second substrate by a first distance in a direction toward the inner sides of the first substrate and the second substrate.

[0011] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the inventive concept.

[0013] Figure 1 It is a schematic diagram of a splicing display device.

[0014] Figure 2 is a perspective view of a display device according to an exemplary embodiment of the present invention.

[0015] Figure 3 It is a graphic Figure 1 An exploded perspective view of a portion of a display device.

[0016] Figure 4 This is a diagram used to explain the concave part. Figure 2 A schematic diagram of a portion of a display device.

[0017] Figure 5 is along Figure 2 The line A-A' intercepts Figure 2 A cross-sectional view of a display device.

[0018] Figure 6 It is used for explaining Figure 2 A cross-sectional view of each connection pad of the display device.

[0019] Figure 7 How to Figure 2 A perspective view of arranging each connection pad provided on a first substrate relative to a first spacer in a display device of FIG.

[0020] Figure 8 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'.

[0021] Fig. 9 It is used for explaining Figure 8 A cross-sectional view of each connection pad of the display device.

[0022] Fig.10 How to Figure 8 A perspective view of arranging each connection pad provided on a first substrate relative to a first spacer in a display device of FIG.

[0023] Fig.11 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'.

[0024] Fig.12 It is used for explaining Fig.11 A cross-sectional view of each connection pad of the display device.

[0025] Fig.13 How to Fig.11 A perspective view of an arrangement of elements disposed on a first substrate relative to elements disposed on a second substrate in a display device of FIG.

[0026] Fig.14 is a display device according to another exemplary embodiment of the present invention. Figure 2 A cross-sectional view of the display device taken along line AA'.

[0027] Fig.15 It is used for explaining Fig.14 A cross-sectional view of each connection pad of the display device.

[0028] Fig.16 How to Fig.14 A perspective view of an arrangement of elements disposed on a first substrate relative to elements disposed on a second substrate in a display device of FIG.

[0029] Fig.17 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'.

[0030] Fig.18 It is used for explaining Fig.17 A cross-sectional view of each connection pad of the display device.

[0031] Fig.19 How to Fig.17 A perspective view of an arrangement of elements disposed on a first substrate relative to elements disposed on a second substrate in a display device of FIG. DETAILED DESCRIPTION

[0032] In the following description, for the purpose of explanation, many specific details are set forth in order to provide a thorough understanding of various example embodiments of the present invention. As used herein, an "embodiment" is a non-limiting example of a device or method using one or more inventive concepts disclosed herein. However, it is apparent that various example embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other examples, known structures and devices are shown in block diagram form to avoid unnecessarily obscuring various example embodiments. Further, various example embodiments may be different, but need not be exclusive. For example, without departing from the present invention, the specific shape, configuration and characteristics of the example embodiment may be used or implemented in another example embodiment.

[0033] Unless otherwise specified, the illustrated example embodiments should be understood as providing exemplary features of the details of variations of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter individually or collectively referred to as "elements") of the various embodiments may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0034] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless specified, the presence or absence of cross hatching or shading will not convey or indicate any preference or requirement for the specific material, material properties, size, ratio, commonality between the illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the example embodiments can be implemented differently, the specific processing sequence may be performed differently from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals refer to the same elements.

[0035] When an element such as a layer is referred to as being "on", "connected to" or "coupled to" another element or layer, the element may be directly on, directly connected to or coupled to, another element or layer, or there may be an intermediate element or layer. However, when an element or layer is referred to as being "directly" on, "directly connected to" or "directly coupled to" another element or layer, there are no intermediate elements or layers. For this purpose, the term "connected" may refer to a physical, electrical and / or fluid connection with or without intermediate elements. Further, the D1 axis, the D2 axis, and the D3 axis are not limited to the three axes of a rectangular coordinate system, such as the x-axis, the y-axis, and the z-axis, and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis, and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0036] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0037] For descriptive purposes, spatially relative terms such as "below," "below," "under," "down," "above," "up," "above," "higher," and "side" (e.g., such as "sidewall") may be used herein, and thereby describe the relationship of one (or more) element relative to another (or other) element as illustrated in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "below" other elements or features will be oriented "above" the other elements or features. Thus, the term "below" can cover both above and below orientations. In addition, the device can be oriented in other ways (e.g., rotated 90 degrees or oriented in other orientations), and therefore, the spatially relative descriptors used herein are interpreted accordingly.

[0038] The term used herein is used to describe the purpose of a particular embodiment, and is not intended to limit. As used herein, unless the context clearly indicates otherwise, the singular "one" and "the" are intended to also include plural forms. In addition, when used in this specification, the term "includes" and / or "comprising" specifies the existence of stated features, integral bodies, steps, operations, elements, parts and / or its groups, but does not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or its groups. It should also be noted that, as used herein, the term "substantially", "about" and other similar terms are used as approximate terms rather than degree terms, and are therefore utilized to consider the inherent deviation of the value recognized by those of ordinary skill in the art, calculated and / or provided.

[0039] Various example embodiments are described herein with reference to cross-sectional illustrations and / or exploded illustrations that are schematic illustrations of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances, may be expected. Therefore, the example embodiments disclosed herein should not be construed as limited to the shapes of the particular illustrations of the regions, but rather should include deviations in shape resulting from, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device and are therefore not necessarily intended to be limiting.

[0040] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense unless specifically defined as such herein.

[0041] Figure 1 is a schematic diagram of a spliced ​​display device; Figure 2 is a perspective view of a display device according to an exemplary embodiment of the present invention; Figure 3 It is a graphic Figure 1 an exploded perspective view of a portion of a display device; Figure 4 This is a diagram used to explain the concave part. Figure 2 A schematic diagram of a portion of a display device; Figure 5 is along Figure 2 The line A-A' intercepts Figure 2 A cross-sectional view of a display device; Figure 6 It is used for explaining Figure 2 a cross-sectional view of each connection pad of a display device; and Figure 7 How to Figure 2A perspective view of arranging each connection pad provided on a first substrate relative to a first spacer in a display device of FIG.

[0042] As used herein, the terms “upper”, “top” and “top surface” refer to one side of the display device 1 or a side of the display device 1 in the third direction DR3, and as used herein, the terms “lower”, “bottom” and “bottom surface” refer to a side opposite to the display surface of the display device 1 or a side of the display device 1 in a direction opposite to the third direction DR3. In addition, as used herein, the terms “above” (or “on”), “below”, “left” and “right” refer to their respective directions when viewed from above the display surface of the display device 1. For example, the term “left” refers to the opposite direction of the second direction DR2, the term “right” refers to the second direction DR2, the term “above” refers to the opposite direction of the first direction DR1, and the term “below” refers to the first direction DR1.

[0043] The display device 1 may be a self-luminous display device, such as an organic light-emitting diode (OLED) display device, a quantum dot light-emitting diode (QLED) display device, a micro light-emitting diode (mLED) display device, or a nano light-emitting diode (nLED) display device. Alternatively, the display device 1 may be a non-self-luminous display device, such as an electrophoretic display device or an electrowetting display device. For convenience, the display device 1 is described below as a liquid crystal display (LCD) device including, for example, a liquid crystal layer.

[0044] In some embodiments, the display device 1 can be applied not only to large electronic devices such as televisions (TVs) or outdoor billboards, but also to medium-sized electronic devices or small electronic devices such as personal computers (PCs), notebook computers, car navigation units, or cameras. In addition, the display device 1 can be applied to tablet PCs, personal digital assistants (PDAs), portable multimedia players (PMs), game consoles, or wristwatch-type electronic devices. Obviously, the display device 1 can also be applied to various electronic devices other than those described herein.

[0045] refer to Figure 1 , the splicing type display device TDD may include a plurality of display devices 1. For example, the plurality of display devices 1 may be arranged in a grid form, but the inventive concept is not limited thereto. Alternatively, the plurality of display devices 1 may be connected in the first direction DR1 or in the second direction DR2, or the plurality of display devices 1 may be connected to form a specific shape. The plurality of display devices 1 may have the same size, but the inventive concept is not limited thereto. Still alternatively, the plurality of display devices 1 may have different sizes.

[0046] For example, the spliced ​​display device TDD may have a rectangular shape including long sides and short sides of each of the plurality of display devices 1, and the plurality of display devices 1 may be arranged in a manner in which the long sides and short sides of each of the plurality of display devices 1 are connected. Some of the plurality of display devices 1 may form one side of the spliced ​​display device TDD, some of the plurality of display devices 1 may be disposed at a corner of the spliced ​​display device TDD to form pairs of adjacent sides of the spliced ​​display device TDD, and some of the plurality of display devices 1 may be disposed on the inner side of the spliced ​​display device TDD to be surrounded by other display devices 1.

[0047] Each of the plurality of display devices 1 may include a display area DA and a non-display area NDA. The display area DA is an area in which an image is displayed, and the non-display area NDA may be an area constituting a frame of each of the plurality of display devices 1 and in which an image is not displayed, and may be disposed at the periphery of the display area DA. However, the inventive concept is not limited thereto. The shape of the non-display area NDA may differ from one display device 1 to another, or may be uniform for all of the plurality of display devices 1.

[0048] The splicing display device TDD may have a flat shape as a whole, but the present disclosure is not limited thereto. Alternatively, the splicing display device TDD may have a three-dimensional (3D) shape to provide a 3D effect. For example, the splicing display device 1 may have a curved shape, or a plurality of display devices 1 may have a generally flat shape, but may be connected to each other at a predetermined angle in such a way that the splicing display device TDD can have a 3D shape.

[0049] The plurality of display devices 1 may be connected in such a manner that the frames of the plurality of display devices 1 defined as the non-display area NDA can be adjacent to each other. The plurality of display devices 1 may be connected by a connecting member (not shown). Since the plurality of display devices 1 are connected to form a spliced ​​display device TDD, each of the plurality of display devices 1 needs to have a thin frame. To this end, a contact pad on a flexible circuit board may be connected to one side of each of the plurality of display devices 1, and this will be described later.

[0050] An example of a display device 1 that can be adopted as a unit display device in a splicing type display device TDD or can be used alone will be described hereinafter.

[0051] refer to Figures 2 to 7 , the display device 1 may include a first substrate 100, a liquid crystal layer 200, and a second substrate 300. For example, the display device 1 may further include a flexible circuit board SFPC1, a gate driver circuit board GFPC1, a source driver circuit board SPCB1, and a backlight unit BLU.

[0052] Each of the first substrate 100, the second substrate 300, and the backlight unit BLU may have a rectangular shape having long sides extending in the first direction DR1 and short sides extending in the second direction DR2, but the inventive concept is not limited thereto. In some embodiments, each of the first substrate 100, the second substrate 300, and the backlight unit BLU may have a curved portion in some areas thereof.

[0053] The backlight unit BLU may generate light, and may provide the generated light to the first substrate 100, the liquid crystal layer 200, and the second substrate 300. The display panel including the first substrate 100, the liquid crystal layer 200, and the second substrate 300 may generate an image using the light provided by the backlight unit BLU, and may provide the generated image. However, the inventive concept is not limited thereto. Alternatively, the display device 1 may be implemented as an OLED display device, in which case an organic electroluminescent (EL) layer and / or a thin film encapsulation layer (TFEL) may be disposed between the first substrate 100 and the second substrate 300. For example, the organic EL layer may include a pixel and a pixel defining film defining the pixel, and each pixel in the pixel may include a first electrode, an emission layer, and a second electrode. The emission layer may be an organic emission layer including an organic material, in which case the emission layer may include a hole transport layer, an organic light emitting layer, and an electron transport layer. In response to a predetermined voltage being applied to the first electrode via a thin film transistor (TFT) and a cathode voltage being applied to the second electrode, holes and electrons move from the hole transport layer and the electron transport layer to the organic light emitting layer, respectively, and may be combined in the organic light emitting layer to emit light.

[0054] The TFEL prevents oxygen or moisture from penetrating into the organic EL layer. To this end, the TFEL may include at least one inorganic film. The inorganic film may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but the inventive concept is not limited thereto. The TFEL may protect the organic EL layer from foreign matter such as dust. To this end, the TFEL may include at least one organic film. The organic film may be an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, but the inventive concept is not limited thereto.

[0055] In the case where the organic EL layer and / or the TFEL are disposed between the first substrate 100 and the second substrate 300 , the backlight unit BLU may not be disposed.

[0056] The display panel may include a display area DA in which an image is displayed and a non-display area NDA in which an image is not displayed. The display area DA and the non-display area NDA of the display panel may correspond to the display area DA and the non-display area NDA of the display device 1, respectively. Although not specifically shown, the display device 1 may further include a window member covering the display panel and through which the image is transmitted, and the window member may be provided on the second substrate 300.

[0057] The backlight unit BLU may be, for example, an edge type backlight unit or a direct type backlight unit, but the inventive concept is not limited thereto.

[0058] The first substrate 100 may include a plurality of pixels SPX. For example, the pixels SPX may be arranged in a matrix, but the inventive concept is not limited thereto. A plurality of gate lines SGL1 to SGLm (where m is a natural number) and a plurality of data lines SDL1 to SDLn (where n is a natural number) may be provided along the boundaries of the pixels SPX. Here, the gate lines SGL1 to SGLm may be used as selection lines for selecting the pixels SPX.

[0059] For convenience, Figure 3 Only one pixel SPX is shown, but a plurality of pixels SPX may be defined on the first substrate 100. In each of the plurality of pixels SPX, a pixel electrode may be provided.

[0060] The gate lines SGL1 to SGLm may be disposed to cross the data lines SDL1 to SDLn. The gate lines SGL1 to SGLm may extend in a first direction DR1 and may be electrically connected to the gate driver SGD. The data lines SDL1 to SDLn may extend in a second direction DR2 and may be connected to the data driver SDD.

[0061] The pixels SPX may be disposed to be electrically connected to the gate lines SGL1 to SGLm and the data lines SDL1 to SDLn. The pixels SPX may be arranged in, for example, a matrix, but the inventive concept is not limited thereto.

[0062] The gate driver SGD may include one or more gate driver chips GDIC1. The gate driver SGD may include only one gate driver chip GDIC1, or may include a plurality of gate driver chips GDIC1. The gate driver SGD is shown as including four gate driver chips GDIC1, but the number of gate driver chips GDIC1 provided in the gate driver SGD is not subject to specific restrictions. The gate driver chip GDIC1 may be mounted on a gate driver circuit board GFPC1, and the gate driver circuit board GFPC1 may be attached to one side of the display device 1 along the second direction DR2 in a tape carrier package (TCP) manner. Alternatively, the gate driver chip GDIC1 may be mounted on the first substrate 100 in a chip on glass (COG) manner. However, the inventive concept is not specifically limited to these examples. In some embodiments, the gate driver SGD may be disposed in a predetermined area adjacent to at least one of the short sides of the first substrate 100.

[0063] The gate driver SGD may be formed during the manufacture of transistors for driving the pixels SPX, and may be mounted on the first substrate 100 as an amorphous silicon TFT gate driver circuit (ASG) or an oxide silicon TFT gate driver circuit (OSG).

[0064] The data driver SDD may include one or more source driver chips SDIC 1. The data driver SDD is illustrated as including five source driver chips SDIC 1, but the number of source driver chips SDIC 1 provided in the data driver SDD is not particularly limited.

[0065] The source driver circuit board SPCB1 may include, for example, a timing controller (not shown). The timing controller may be mounted on the source driver circuit board SPCB1 in the form of an IC and may be electrically connected to the gate driver SGD and the data driver SDD. The timing controller may output a gate control signal, a data control signal, and image data.

[0066] The gate driver SGD may receive a gate control signal from the timing controller. The gate driver SGD may generate a gate signal in response to the gate control signal, and may sequentially output the gate signal. The gate signal may be provided to the pixel SPX in a row unit via the gate lines SGL1 to SGLm. As a result, the pixel SPX may be driven in a row unit.

[0067] The data driver SDD may receive image data and a data control signal from the timing controller. The data driver SDD may generate and output a data voltage, which is an analog signal corresponding to the image data, in response to the data control signal. The data voltage may be provided to the pixel SPX via the data lines SDL1 to SDLn.

[0068] The pixels SPX may receive data voltages through the data lines SDL1 to SDLn in response to gate signals supplied to the pixels SPX through the gate lines SGL1 to SGLm. The pixels SPX may display grayscales corresponding to the data voltages, thereby controlling transmittance of a region where the pixels SPX are disposed.

[0069] The flexible circuit board SFPC1 is illustrated as being connected to the first substrate 100 and the second substrate 300 along one of the long sides of each of the first substrate 100 and the second substrate 300, but the inventive concept is not limited thereto. The position at which the flexible circuit board SFPC1 is connected to the first substrate 100 and the second substrate 300 may be changed as needed. Alternatively, the flexible circuit board SFPC1 may be disposed adjacent to one of the short sides of each of the first substrate 100 and the second substrate 300. Still alternatively, the flexible circuit board SFPC1 may be disposed adjacent to the two long sides of each of the first substrate 100 and the second substrate 300. Still alternatively, the flexible circuit board SFPC1 may be disposed adjacent to the two short sides of each of the first substrate 100 and the second substrate 300, or may be disposed adjacent to the two long sides and the two short sides of each of the first substrate 100 and the second substrate 300.

[0070] refer to Figure 4 , the connection lines 115 may be disposed on the first substrate 100. The first ends of the first connection lines 115a, 115b, 115c, 115d, and 115e may be electrically connected to the data lines SDL(r+4), SDL(r+3), SDL(r+2), SDL(r+1), and SDLr (where r is a natural number), respectively. The second ends of the first connection lines 115a, 115b, 115c, 115d, and 115e may be connected to the connection pads PD. Therefore, the connection pads PD may be electrically connected to the data lines SDLr to SDL(r+4).

[0071] The gate line SGLr may be disposed to cross the data lines SDLr to SDL(r+4). The pixels SPXr to SPX(r+4) may be electrically connected to the gate line SGLr.

[0072] For convenience, in Figure 4 Only five first connection lines 115a, 115b, 115c, 115d, and 115e are illustrated in FIG. 1 , but the number of connection lines 115 electrically connected to the data lines SDLr to SDL(r+4) is not particularly limited.

[0073] The connection line 115 has been described above as being electrically connected to the data lines SDLr to SDL(r+4), but the present disclosure is not limited thereto. Alternatively, the connection line 115 and the connection pad PD may be electrically connected to the data lines SDLr to SDL(r+4). Figure 3The connection lines 115 are electrically connected to the gate lines SGL1 to SGLm or other lines on the first substrate 100. Hereinafter, the connection lines 115 will be described as being electrically connected to the data lines SDLr to SDL(r+4).

[0074] The connection line 115 may include, for example, copper (Cu), but the material of the connection line 115 is not particularly limited.

[0075] refer to Figure 5 , the source driver chip SDIC1 mounted on the flexible circuit board SFPC1 may generate data voltages for driving the pixels SPXr to SPX(r+4) electrically connected via the connection pads 130. The generated data voltages may be transmitted to the data lines SDLr to SDL(r+4) via the connection pads 130 and the connection pads PD.

[0076] The flexible circuit board SFPC1 may include a contact pad CP1. The source driver chip SDIC1 may be electrically connected to the contact pad CP1 of the flexible circuit board SFPC1. The contact pad CP1 of the flexible circuit board SFPC1 may be electrically connected to the connection pad 130 disposed on one side of each of the first substrate 100 and the second substrate 300 via the adhesive film 400.

[0077] The connection pads 130 may be attached to the flexible circuit board SFPC1 via the adhesive film 400. For example, the connection pads 130 may be electrically connected to the contact pads CP1 of the flexible circuit board SFPC1 via the adhesive film 400 in an outer wire bonding (OLB) manner.

[0078] For example, the adhesive film 400 may be disposed to cover the entire connection pad 130 , but the inventive concept is not limited thereto. Alternatively, the adhesive film 400 may be disposed to cover a portion of the connection pad 130 and expose a portion of the connection pad 130 .

[0079] In some embodiments, the adhesive film 400 may include an anisotropic conductive film (ACF). In the case where the adhesive film 400 is the ACF, the adhesive film 400 may have conductivity only in the region where the connection pad 130 and the contact pad CP1 of the flexible circuit board SFPC1 contact each other, and the connection pad 130 and the contact pad CP1 of the flexible circuit board SFPC1 may be electrically connected, but the inventive concept is not limited thereto. In some embodiments, the adhesive film 400 may not be provided. For example, the connection pad 130 and the contact pad CP1 may be directly in contact with each other and electrically connected, in which case the connection pad 130 and the contact pad CP1 may be directly connected to each other by ultrasonic bonding or welding.

[0080] The source driver circuit board SPCB1 may be electrically connected to the flexible circuit board SFPC1. Specifically, the contact pads CP2 of the flexible circuit board SFPC1 and the contact pads CP3 of the source driver circuit board SPCB1 may be electrically connected to each other, and as a result, the flexible circuit board SFPC1 and the source driver circuit board SPCB1 may be electrically connected to each other.

[0081] Therefore, the source driver chip SDIC1 may be electrically connected to the source driver circuit board SPCB1.

[0082] In some embodiments, the flexible circuit board SFPC1 may be provided as a flexible printed circuit board (FPCB). Specifically, the flexible circuit board SFPC1 may be provided as a chip on film (COF). Figure 2 As shown by the dotted line of , the data driver SDD may be connected to the first substrate 100 and the second substrate 300 and the source driver circuit board SPCB1 in a tape carrier package (TCP) manner, and may be bent toward the rear surface of the backlight unit BLU to be disposed at the rear surface of the backlight unit BLU. In this case, the source driver chip SDIC1 may be disposed between the backlight unit BLU and the flexible circuit board SFPC1, but the inventive concept is not limited thereto. Alternatively, the source driver chip SDIC1 may be disposed on a surface of the flexible circuit board SFPC1 that does not face the backlight unit BLU.

[0083] The connection pad 130 may be electrically connected to the connection pad PD provided on the first substrate 100. As described above, the connection pad PD may be electrically connected to the connection line 115, and the connection line 115 may extend in a direction from the connection pad PD to the inner side of the first substrate 100 (eg, in the second direction DR2) to be electrically connected to the pixel SPX.

[0084] refer to Figure 6 , the display device 1 may include a first substrate 100 and a second substrate 300 facing the first substrate 100 at one side of the first substrate 100 .

[0085] The first substrate 100 and the second substrate 300 may be rigid substrates formed of glass, quartz, etc., or may be flexible substrates formed of polyimide or another polymer resin. In the case where a polyimide substrate is used as the first substrate 100 and the second substrate 300, the display device 1 can become bendable, foldable, or rollable, and thus can be implemented in various shapes.

[0086] The connection line 115 may be disposed on the first substrate 100, and the insulating layer 117 and the connection pad PD may be disposed on the connection line 115. The connection line 115 may be electrically connected to the Figure 2One of the data lines SDLr to SDL(r+4) and one of the gate lines SGL1 to SGLm.

[0087] The insulating layer 117 may include a contact hole CTH disposed adjacent to one side of the first substrate 100 and exposing the connection line 115. The insulating layer 117 may include an insulating material. For example, the insulating material may be an inorganic insulating material or an organic insulating material. The inorganic insulating material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic insulating material may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0088] The connection pad PD may be provided in the contact hole CTH of the insulating layer 117 and on a portion of the insulating layer 117 near the contact hole CTH. The connection pad PD may contact the connection line 115 through the contact hole CTH of the insulating layer 117. Thus, the connection pad PD may be electrically connected to the connection line 115. However, the configuration of the connection pad PD is not particularly limited. Alternatively, the connection pad PD may be provided only in the contact hole CTH of the insulating layer 117, or may be formed in one piece with the connection line 115.

[0089] A black matrix BM disposed on the second substrate 300 and an overcoat layer OC covering the black matrix BM may be disposed on the second substrate 300 .

[0090] In a plan view, the black matrix BM may be arranged in a grid pattern. The black matrix BM can prevent colors from being mixed due to light penetration between adjacent pixels SPX, and can also prevent light from being output to the side of the display device 1. The black matrix BM may be formed of an organic material or a metal material including chromium (Cr), but the present disclosure is not limited thereto. Although not specifically shown, a color filter pattern may be further arranged on the second substrate 300. The color filter pattern can improve the quality of the image output by the display device 1.

[0091] An overcoat layer OC may be disposed on the black matrix BM. The overcoat layer OC may include an insulating material and may planarize a height difference caused by the presence of the black matrix BM and the color filter pattern.

[0092] The liquid crystal layer 200 , the spacer CS, and the sealant SL may be disposed between the first substrate 100 and the second substrate 300 .

[0093] The sealant SL may be disposed outside the display area DA along the edge of each of the first substrate 100 and the second substrate 300 to prevent leakage of the liquid crystal layer 200 filled between the first substrate 100 and the second substrate 300. For example, the sealant SL and the display area DA may be spaced apart from each other, but the present inventive concept is not limited thereto.

[0094] The spacer CS maintains a cell thickness between the first substrate 100 and the second substrate 300 by being deformed when the first substrate 100 and the second substrate 300 are assembled together after dropping liquid crystal molecules.

[0095] The spacer CS may include a first spacer CS1 and a second spacer CS2. In some embodiments, a width D2 of the first spacer CS1 in the second direction DR2 may be smaller than a width D4 of the second spacer CS2 in the second direction DR2. For example, a width D2 of the first spacer CS1 in the second direction DR2 may be 100 μm to 150 μm, and a width D4 of the second spacer CS2 in the second direction DR2 may be 153 μm to 180 μm. However, the inventive concept is not limited thereto. Alternatively, a width D2 of the first spacer CS1 in the second direction DR2 may be the same as a width D4 of the second spacer CS2 in the second direction DR2. Still alternatively, a width D2 of the first spacer CS1 in the second direction DR2 may be greater than a width D4 of the second spacer CS2 in the second direction DR2.

[0096] The width D2 of the first spacer CS1 and the width D4 of the second spacer CS2 in the second direction DR2 may each be smaller than the width D6 of the sealant SL in the second direction DR2. For example, the width D6 of the sealant SL in the second direction DR2 may be 200 μm to 400 μm.

[0097] The first spacer CS1 may include a blue colorant. For example, the first spacer CS1 may be formed of a blue photoresist material, but the present disclosure is not limited thereto. In the case where the first spacer CS1 includes a blue colorant, side light leakage can be further effectively prevented. The structure of the spacer CS is not particularly limited. Alternatively, both the first spacer CS1 and the second spacer CS2 may include a blue colorant.

[0098] The first spacer CS1 may be disposed on the first substrate 100, and the second spacer CS2 may be disposed on the second substrate 300. Specifically, the first spacer CS1 may be formed on the connection pad PD and the insulating layer 117 disposed on the first substrate 100, and the second spacer CS2 may be formed on the protective layer OC disposed on the second substrate 300. The first spacer CS1 and the second spacer CS2 formed on the first substrate 100 and the second substrate 300, respectively, may be placed in contact with each other during the assembly of the first substrate 100 and the second substrate 300, and thus the spacer CS may be formed, but the present disclosure is not limited thereto. Alternatively, both the first spacer CS1 and the second spacer CS2 may be disposed on the second substrate 300. Still alternatively, both the first spacer CS1 and the second spacer CS2 may be disposed on the first substrate 100.

[0099] Both the first spacer CS1 and the second spacer CS2 may be spaced apart from the sealant SL. For example, both the first spacer CS1 and the second spacer CS2 may be spaced apart from the sealant SL in the second direction DR2. The distance D3 between the first spacer CS1 and the sealant SL may be different from the distance D5 between the second spacer CS2 and the sealant SL. For example, the distance D3 between the first spacer CS1 and the sealant SL may be 40 μm to 60 μm, and the distance D5 between the second spacer CS2 and the sealant SL may be 20 μm to 39 μm. However, the inventive concept is not limited thereto. Alternatively, in the case where the distance D2 of the first spacer CS1 in the second direction DR2 is the same as the distance D4 of the second spacer CS2 in the second direction DR2, the distance D3 between the first spacer CS1 and the sealant SL may be the same as the distance D5 between the second spacer CS2 and the sealant SL. Still alternatively, the distance D3 between the first spacer CS1 and the sealant SL may be greater than the distance D5 between the second spacer CS2 and the sealant SL.

[0100] For example, a common electrode that applies an electric field to the liquid crystal layer 200 may be disposed on the second substrate 300 together with the pixel electrode of the first substrate 100 , but the inventive concept is not limited thereto. Alternatively, both the pixel electrode and the common electrode may be disposed on the first substrate 100 .

[0101] Although not specifically illustrated, an optical sheet including a polarizing sheet may be provided between the backlight unit BLU and the first substrate 100. The optical sheet can control the characteristics of light provided by the backlight unit BLU to control the transmittance of the display panel. In addition, although not specifically illustrated, the display device 1 may further include a storage member (not shown) for accommodating the backlight unit BLU and the display panel therein.

[0102] The concave portion TA may be provided on at least one side surface of the display device 1 on which the connection pad 130 is provided. For example, the concave portion TA may be provided on one of the side surfaces of the display device 1 corresponding to the long sides of the display device 1, but the present disclosure is not limited thereto. Alternatively, the concave portion TA may be provided on one of the side surfaces of the display device 1 corresponding to the short sides of the display device 1. Still alternatively, the concave portion TA may be provided on both one of the side surfaces of the display device 1 corresponding to the long sides of the display device 1 and one of the side surfaces of the display device 1 corresponding to the short sides of the display device 1.

[0103] The concave portion TA may be formed in a direction from one side surface to the center of the display device 1 , for example, in the second direction DR2 .

[0104] The concave portion TA may be formed by the second substrate 300 disposed above the first substrate 100 and the spacer CS disposed between the first substrate 100 and the second substrate 300. For example, the spacer CS may be disposed at the inner side IS of a reference line RL defined as a line extending from one side surface of the first substrate 100 in the third direction DR3. Specifically, the concave portion TA may be formed by aligning the side surfaces of the first substrate 100 and the second substrate 300 with the reference line RL and moving the spacer CS away from the reference line RL in the second direction DR2, but the inventive concept is not limited thereto. Alternatively, the concave portion TA may be formed by reducing the width of the spacer CS in the second direction DR2.

[0105] The distance D1 that moves the spacer CS away from the reference line RL in the second direction DR2 may be 1 μm to 153 μm, but the inventive concept is not limited thereto. The distance D1 may vary according to the width and thickness of the spacer CS and the connection pad PD. In some embodiments, the distance D1 may be less than the width of the first spacer CS1.

[0106] Due to the presence of the concave portion TA, the top surface of the connection pad PD, the side surface of the spacer CS, and the bottom surface of the protective layer OC can be exposed. Specifically, in the case where the concave portion TA is not provided, the side surface of the connection pad PD can be exposed. On the other hand, Figure 7 As shown, when the concave portion TA is provided, not only the side surface of the connection pad PD can be exposed, but also a portion of the top surface of the connection pad PD can be exposed. As a result, the connection pad 130 can be connected not only to the side surface of the connection pad PD, but also to a portion of the top surface of the connection pad PD, and connection defects can be effectively prevented.

[0107] Except for the portion exposed by the recessed portion TA, the entire connection pad PD may be covered by the first spacer CS1 and may overlap with the first spacer CS1 and the second spacer CS2 in the third direction DR3. For example, a portion of the connection pad PD may be exposed by the recessed portion TA and the remaining portion of the connection pad PD may overlap with the first spacer CS1 and the second spacer CS2 in the thickness direction (i.e., in the third direction DR3).

[0108] Figure 7 Only the first spacer CS1 is illustrated to explain the arrangement of the first spacer CS1 with respect to each connection pad PD. Figure 7 , the width of the top surface of each connection pad PD being exposed may be the same as the distance D1 by which the first spacer CS1 is moved away from the reference line RL in the second direction DR2, but the inventive concept is not limited thereto. In some embodiments, in the case where each connection pad PD does not extend to the reference line RL but is disposed on the inner side IS of the reference line RL, the width of the top surface of each connection pad PD being exposed may be smaller than the distance D1 by which the first spacer CS1 is moved away from the reference line RL in the second direction DR2. In some embodiments, each connection pad PD may be disposed on the outer side OS of the reference line RL, in which case the width of the top surface of each connection pad PD being exposed may be greater than the distance D1 by which the first spacer CS1 is moved away from the reference line RL in the second direction DR2.

[0109] Figure 7 The first spacer CS1 is illustrated as being retracted in the second direction DR2 in both the region where each connection pad PD is provided and the region where each connection pad PD is not provided, but the inventive concept is not limited thereto. Alternatively, the first spacer CS1 may be selectively retracted only in the region where each connection pad PD is provided, and not retracted in the region where each connection pad PD is not provided. Although not specifically illustrated, the second spacer CS2 may have the same arrangement as the first spacer CS1.

[0110] In the cross-sectional view, the concave portion TA may have a rectangle formed by the top surface of each connection pad PD, the side surface of the spacer CS and the bottom surface of the protective layer OC, with one side open, but the present disclosure is not limited thereto. The shape of the concave portion TA is not particularly limited. Alternatively, the concave portion TA may have a semicircular shape or a triangular shape with one side open.

[0111] In a plan view, the concave portion TA may have a stripe shape exposing each connection pad PD, but the inventive concept is not limited thereto. Alternatively, in a plan view, the concave portion TA may have a shape in which a plurality of semicircles, triangles, or rectangles are arranged in a row in the first direction DR1.

[0112] refer to Figure 5 and Figure 6 The connection pad 130 may be disposed to fill the concave portion TA. For example, the connection pad 130 may include a first portion 130a disposed on the outer side OS of the reference line RL and a second portion 130b disposed on the inner side IS of the reference line RL and disposed in the concave portion TA.

[0113] The first portion 130a of the connection pad 130 may be disposed between the adhesive film 400 and the second portion 130b of the connection pad 130, and the second portion 130b of the connection pad 130 may be electrically connected to the adhesive film 400. One surface of the first portion 130a may be in contact with the side surface of the first substrate 100, the side surface of the connection line 115, the side surface of the connection pad PD, the second portion 130b, the side surface of the protective layer OC, the side surface of the black matrix BM, and the side surface of the second substrate 300, but the present disclosure is not limited thereto. Alternatively, the first portion 130a may not be in contact with some of the side surfaces of the first substrate 100, the side surfaces of the connection line 115, the side surfaces of the connection pad PD, the second portion 130b, the side surface of the protective layer OC, the side surface of the black matrix BM, and the side surface of the second substrate 300. For example, when the overcoat layer OC and the black matrix BM do not extend to the reference line RL, the first portion 130a of the connection pad 130 may not contact the overcoat layer OC and the black matrix BM. Since the first portion 130a of the connection pad 130 contacts the side surfaces of the first substrate 100 and the second substrate 300, the connection pad 130 can be stably fixed to the display device 1.

[0114] The second part 130b of the connection pad 130 may contact the top surface of the connection pad PD, the side surface of the spacer CS, and the bottom surface of the protective layer OC, and may be arranged along the surface profile of the concave portion TA. However, the inventive concept is not limited thereto. Which elements contact the second part 130b may vary depending on the material of the connection pad 130 and how the connection pad 130 is manufactured. For example, the second part 130b of the connection pad 130 may contact the top surface of the connection pad PD, but not the side surface of the spacer CS and the bottom surface of the protective layer OC. Alternatively, the second part 130b of the connection pad 130 may contact the top surface of the connection pad PD and the side surface of the spacer CS, but not the bottom surface of the protective layer OC. In short, the second part 130b of the connection pad 130 may contact the connection pad PD, and as a result, the second part 130b of the connection pad 130 and the connection pad PD may be electrically connected to each other.

[0115] The connection pad 130 may be formed of aluminum (Al) or silver (Ag), but the inventive concept is not limited thereto.

[0116] The adhesive film 400 may be disposed on the outer side of the connection pad 130. The adhesive film 400 may electrically connect the connection pad 130 and the contact pad CP1 of the flexible circuit board SFPC1. The length of the first portion 130a of the connection pad 130 in the third direction DR3 and the length of the adhesive film 400 in the third direction DR3 may be the same, but the inventive concept is not limited thereto. Alternatively, the length of the first portion 130a of the connection pad 130 in the third direction DR3 and the length of the adhesive film 400 in the third direction DR3 may be different from each other. For example, the length of the first portion 130a of the connection pad 130 in the third direction DR3 may be greater than the length of the adhesive film 400 in the third direction DR3. Alternatively, the length of the first portion 130a of the connection pad 130 in the third direction DR3 may be less than the length of the adhesive film 400 in the third direction DR3. In this way, the connection pad 130 and the contact pad CP1 may be electrically connected to each other through the adhesive film 400.

[0117] In some embodiments, the adhesive film 400 may not be provided, and instead, the connection pad 130 and the contact pad CP1 may be directly in contact with each other and electrically connected. For example, the connection pad 130 and the contact pad CP1 may be directly coupled to each other by ultrasonic bonding or welding. Figure 5 The electrical connection between the flexible circuit board SFPC1 and the source driver circuit board SPCB1 is described, and thus, a detailed description thereof will be omitted.

[0118] In short, the connection pad 130 may be provided on the side surfaces of the first substrate 100 and the second substrate 300 for electrical connection with the flexible circuit board SFPC1. Since the connection pad 130 is provided on at least one side surface of the display device 1, the size of the non-display area NDA can be minimized. In addition, since the spacer CS is provided on the inner side IS of the reference line RL without additional processing, the concave portion TA can be formed on at least one side surface of the display device 1. In addition, due to the presence of the concave portion TA, the top surface of the connection pad PD can be exposed, and the connection pad 130 can contact the side surface and the top surface of the connection pad PD. Thus, the contact area between the connection pad 130 and the connection pad PD can be expanded, and the contact defect that may occur between the connection pad 130 and the connection pad PD can be effectively prevented.

[0119] Figure 8 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'; Fig. 9 It is used for explaining Figure 8 a cross-sectional view of each connection pad of a display device; and Fig.10 It shows how to Figure 8 A perspective view of arranging each connection pad provided on a first substrate relative to a first spacer in a display device of FIG.

[0120] Figures 8 to 10 Example embodiments of Figures 5 to 7 The difference of the exemplary embodiment is that a tail portion TD is formed in each connection pad PD_1. Figures 8 to 10 The example embodiments focus on Figures 5 to 7 This and other differences of the exemplary embodiments of the present invention are described herein.

[0121] refer to Figures 8 to 10 , the connection line 115 may be disposed on the first substrate 100 , and the insulating layer 117 and the connection pad PD_1 may be disposed on the connection line 115 .

[0122] The insulating layer 117 may include a contact hole CTH disposed adjacent to one side of the first substrate 100 and exposing the connection line 115 , and the connection pad PD_1 may be disposed in the contact hole CTH of the insulating layer 117 and on a portion of the insulating layer 117 close to the contact hole CTH.

[0123] The connection pad PD_1 may include a body portion BD disposed in the contact hole CTH of the insulating layer 117 and on a portion of the insulating layer 117 close to the contact hole CTH, and a tail portion TD protruding from the body portion BD in the third direction DR3 close to the reference line RL.

[0124] The concave portion TA_1 may be formed in a direction from one side surface to the center of the display device 1 (eg, in the second direction DR2 ).

[0125] Due to the presence of the recessed portion TA_1, the top surface of the tail TD of the connecting pad PD_1, the side surface of the spacer CS, and the bottom surface of the protective layer OC can be exposed. Specifically, the top surface of the tail TD of the connecting pad PD_1 can be exposed by the recessed portion TA_1, a portion of the top surface of the main body portion BD of the connecting pad PD_1 can overlap with the tail TD of the connecting pad PD_1 in the third direction DR3, and the rest of the top surface of the main body portion BD can overlap with the spacer CS in the third direction DR3. When the tail TD is provided, the side surface of the connecting pad PD_1 can be widened, and as a result, the contact area of ​​the connecting pad PD_1 and the connecting pad 130_1 can be further expanded. The tail TD of the connecting pad PD_1 can be formed by polishing the connecting pad PD_1 at an inclination angle, but the inventive concept is not limited thereto. Alternatively, the tail TD of the connecting pad PD_1 can be formed by another deposition process.

[0126] The width of the tail TD of the connection pad PD_1 in the second direction DR2 may be the same as the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2, but the inventive concept is not limited thereto. Alternatively, the width of the tail TD of the connection pad PD_1 in the second direction DR2 may be different from the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2. For example, the width of the tail TD of the connection pad PD_1 in the second direction DR2 may be less than the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2.

[0127] In the case where the width of the tail TD of the connection pad PD_1 in the second direction DR2 is less than the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2, one end of the tail TD may not contact the first spacer CS1, and the other end of the tail TD may be aligned with the reference line RL. However, the inventive concept is not limited thereto. Alternatively, one end of the tail TD may contact the first spacer CS1, and the other end of the tail TD may be disposed on the inner side IS of the reference line RL. Still alternatively, one end of the tail TD may not contact the first spacer CS1, and the other end of the tail TD may be disposed on the inner side IS of the reference line RL.

[0128] The height of the tail TD of the connection pad PD_1 in the third direction DR3 may be greater than the height of the main body BD of the connection pad PD_1 in the third direction DR3, but the inventive concept is not limited thereto. Alternatively, the height of the tail TD of the connection pad PD_1 in the third direction DR3 may be less than the height of the main body BD of the connection pad PD_1 in the third direction DR3. Still alternatively, the height of the tail TD of the connection pad PD_1 in the third direction DR3 may be the same as the height of the main body BD of the connection pad PD_1 in the third direction DR3.

[0129] Fig.10 The diagram shows that the first spacer CS1 is retracted in the second direction DR2 in both the region where the tail TD of each connection pad PD_1 is provided and the region where the tail TD of each connection pad PD_1 is not provided, but the present disclosure is not limited thereto. Alternatively, the first spacer CS1 may be selectively retracted in the region where the tail TD of each connection pad PD_1 is provided. Although not specifically illustrated, the second spacer CS2 may have the same arrangement as the first spacer CS1.

[0130] Figures 8 to 10 The tail portion TD is shown to have a rectangular shape in the cross-sectional view, but the inventive concept is not limited thereto. That is, in the cross-sectional view, the tail portion TD may have various shapes other than the rectangular shape, such as a semicircular shape, a polygonal shape, or an irregular shape.

[0131] In a plan view, the tail TD may be a bar shape disposed on the body portion BD and extending in the first direction DR1, but the inventive concept is not limited thereto. Alternatively, in a plan view, the tail TD may have a shape in which a plurality of semicircles, a plurality of triangles, or a plurality of rectangles are arranged in a row in the first direction DR1.

[0132] The concave portion TA_1 may have a height difference between a region where the tail TD of each connection pad PD_1 is provided and a region where the tail TD of each connection pad PD_1 is not provided. For example, the concave portion TA_1 may be formed to be deeper in the region where the tail TD of each connection pad PD_1 is not provided than in the region where the tail TD of each connection pad PD_1 is provided in the third direction DR3.

[0133] refer to Figure 8 and Fig. 9 For example, the connection pad 130_1 may include a first portion 130a disposed on the outer side OS of the reference line RL and a second portion 130b_1 disposed on the inner side IS of the reference line RL and in the concave portion TA_1.

[0134] The second portion 130b_1 of the connection pad 130_1 may be in contact with the top surface of the tail TD of the connection pad PD_1, the side surface of the spacer CS, and the bottom surface of the protective layer OC, and may be disposed along the surface profile of the recessed portion TA_1. However, the inventive concept is not limited thereto. Alternatively, in a case where the width of the tail TD of the connection pad PD_1 in the second direction DR2 is less than the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2, the second portion 130b_1 of the connection pad 130_1 may be in contact with the top surface and the side surface of the tail TD of the connection pad PD_1 and a portion of the top surface of the main portion BD of the connection pad PD_1.

[0135] When the connection pad PD_1 is formed to include the tail portion TD, the side surface of the connection pad PD_1 can be widened, and as a result, the contact area between the connection pad PD_1 and the connection pad 130_1 can be further expanded. Thus, a contact defect that may occur between the connection pad 130_1 and the connection pad PD_1 can be effectively prevented.

[0136] Fig.11 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'; Fig.12 It is used for explaining Fig.11a cross-sectional view of each connection pad of a display device; and Fig.13 How to Fig.11 A perspective view of an arrangement of elements disposed on a first substrate relative to elements disposed on a second substrate in a display device of FIG.

[0137] Figures 11 to 13 Example embodiments of Figures 5 to 7 The difference of the exemplary embodiment is that both the second substrate 300_1 and the spacer CS are retracted to the inner side IS of the reference line RL. Figures 11 to 13 The example embodiments focus on Figures 5 to 7 This and other differences of the exemplary embodiments of the present invention are described herein.

[0138] refer to Figures 11 to 13 , the display device 1 may include a first substrate 100 and a second substrate 300_1 facing the first substrate 100 at a side of the first substrate 100 .

[0139] The second substrate 300_1 may be disposed at an inner side IS of a reference line RL defined as a line extending in the third direction DR3 from one side surface of the first substrate 100. Specifically, the side surfaces of the first substrate 100, the connection line 115, and the connection pad PD may be aligned with the reference line RL in the third direction DR3, and the second substrate 300_1, the black matrix BM_1, the protection layer OC_1, and the spacer CS may be moved away from the reference line RL in the second direction DR2.

[0140] An opening portion OA may be disposed above the connection pad PD. The opening portion OA may be formed by moving the second substrate 300_1, the black matrix BM_1, the overcoat layer OC_1, and the spacer CS away from the reference line RL in the second direction DR2.

[0141] The side surfaces of the second substrate 300_1, the black matrix BM_1, the protective layer OC_1, and the spacer CS may be aligned with each other in the third direction DR3. In this case, the distance D7 that the second substrate 300_1 moves away from the reference line RL in the second direction DR2 may be the same as the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2, but the inventive concept is not limited thereto. Alternatively, the side surfaces of the second substrate 300_1, the black matrix BM_1, the protective layer OC_1, and the spacer CS may not be aligned with each other in the third direction DR3. For example, in some embodiments, the spacer CS may move farther toward the inner side IS of the reference line RL than the second substrate 300_1, in which case the distance D1 that the spacer CS moves away from the reference line RL in the second direction DR2 may be greater than the distance D7 that the second substrate 300_1 moves away from the reference line RL in the second direction DR2.

[0142] The opening portion OA may be formed in a direction from one side surface to the center of the first substrate 100 (eg, in the second direction DR2 ).

[0143] Due to the presence of the opening portion OA, the top surface of the connection pad PD, the side surface of the spacer CS, the side surface of the protection layer OC_1, the side surface of the black matrix BM_1, and the side surface of the second substrate 300_1 may be exposed. Specifically, a portion of the top surface of the connection pad PD may be exposed by the opening portion OA, and the remaining portion of the top surface of the connection pad PD may be covered by the first spacer CS1 and may overlap with the first spacer CS1 and the second spacer CS2 in the third direction DR3.

[0144] The width of the connection pad PD exposed by the opening portion OA in the second direction DR2 may be the same as the distance D1 by which the spacer CS is moved away from the reference line RL in the second direction DR2 , but the inventive concept is not limited thereto.

[0145] refer to Fig.11 and Fig.12 , the connection pad 130_2 may be provided to fill the opening portion OA. For example, the connection pad 130_2 may include a first portion 130a provided on the outer side OS of the reference line RL and a second portion 130b_2 provided on the inner side IS of the reference line RL and in the opening portion OA.

[0146] The second portion 130b_2 of the connection pad 130_2 may contact the top surface of the connection pad PD, the side surface of the spacer CS, the side surface of the overcoat layer OC_1, the side surface of the black matrix BM_1, and the side surface of the second substrate 300_1.

[0147] In the case where the second substrate 300_1, the black matrix BM_1, the protection layer OC_1, and the spacer CS are moved away from the reference line RL in the second direction DR2 to form the opening portion OA, the top surface of the connection pad PD can be exposed, and as a result, the contact area between the connection pad PD and the connection pad 130_2 can be enlarged. Thus, a contact defect that may occur between the connection pad 130_2 and the connection pad PD can be effectively prevented.

[0148] In addition, since the second portion 130 b_2 of the connection pad 130_2 is in contact with the spacer CS, the protective layer OC_1 , the black matrix BM_1 , and the side surface of the second substrate 300_1 , the connection pad 130_2 can be more stably fixed to the display device 1 .

[0149] Fig.14 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'; Fig.15 It is used for explaining Fig.14 a cross-sectional view of each connection pad of a display device; and Fig.16 It shows how to Fig.14 A perspective view of an arrangement of elements disposed on a first substrate relative to elements disposed on a second substrate in a display device of FIG.

[0150] Figures 14 to 16 Example embodiments of Figures 5 to 7 The difference of the exemplary embodiment is that the first spacer CS1 is retracted to the inner side IS of the reference line RL, and the second spacer CS2_1 is aligned with the reference line RL. Figures 14 to 16 The example embodiments focus on Figures 5 to 7 This and other differences of the exemplary embodiments of the present invention are described herein.

[0151] refer to Figures 14 to 16 , the display device 1 may include a first substrate 100 and a second substrate 300 facing the first substrate 100 at a side of the first substrate 100 .

[0152] The first spacer CS1 may be disposed at an inner side IS of a reference line RL defined as a line extending in the third direction DR3 from one side surface of the first substrate 100. Specifically, the first substrate 100, the connection line 115, the connection pad PD, the second substrate 300, the black matrix BM, the overcoat layer OC, and the side surface of the second spacer CS2_1 may be aligned with the reference line RL in the third direction, and the first spacer CS1 may be moved away from the reference line RL in the second direction DR2.

[0153] The concave portion TA_2 may be formed in a direction from one side surface to the center of the display device 1 (eg, in the second direction DR2 ).

[0154] Due to the presence of the recessed portion TA_2, the top surface of the connection pad PD, the side surface of the first spacer CS1, and the bottom surface of the second spacer CS2_1 may be exposed. Specifically, a portion of the top surface of the connection pad PD may be exposed by the recessed portion TA_2, and the remaining portion of the top surface of the connection pad PD may be covered by the first spacer CS1 and may overlap with the first spacer CS1 in the third direction DR3.

[0155] The width of the connection pad PD exposed by the concave portion TA_2 in the second direction DR2 may be the same as the distance D1 by which the first spacer CS1 is moved away from the reference line RL in the second direction DR2.

[0156] Fig.16The first spacer CS1 is shown to be retracted in the second direction DR2 in both the region where each connection pad PD is provided and the region where each connection pad PD is not provided, but the inventive concept is not limited thereto. Alternatively, the first spacer CS1 may be selectively retracted only in the region where each connection pad PD is provided, and not retracted in the region where each connection pad PD is not provided.

[0157] The width D4 of the second spacer CS2_1 in the second direction DR2 may be greater than the width D2 of the first spacer CS1 in the second direction DR2. One side surface of the second spacer CS2_1 may protrude beyond the first spacer CS1 in the opposite direction of the second direction DR2, and the other side surface of the second spacer CS2_1 may protrude beyond the first spacer CS1 in the second direction DR2. However, the inventive concept is not limited thereto. Alternatively, one side surface of the second spacer CS2_1 may protrude beyond the first spacer CS1 in the opposite direction of the second direction DR2, but the other side surface of the second spacer CS2_1 may be aligned with the first spacer CS1 in the third direction DR3. Still alternatively, one side surface of the second spacer CS2_1 may protrude beyond the first spacer CS1 in the opposite direction of the second direction DR2, but the first spacer CS1 may protrude beyond the other side surface of the second spacer CS2_1 in the second direction DR2.

[0158] refer to Fig.14 and Fig.15 For example, the connection pad 130_3 may include a first portion 130a disposed on the outer side OS of the reference line RL and a second portion 130b_3 disposed on the inner side IS of the reference line RL and in the concave portion TA_2.

[0159] The second portion 130b_3 of the connection pad 130_3 may contact the top surface of the connection pad PD, the side surface of the first spacer CS1, and the bottom surface of the second spacer CS2_1, and may be arranged along the surface profile of the recessed portion TA_2. However, the inventive concept is not limited thereto. Alternatively, the second portion 130b_3 of the connection pad 130_3 may contact the top surface of the connection pad PD, but not the side surface of the first spacer CS1 and the bottom surface of the second spacer CS2_1. Still alternatively, the second portion 130b_3 of the connection pad 130_3 may contact the top surface of the connection pad PD and the side surface of the first spacer CS1, but not the bottom surface of the second spacer CS2_1.

[0160] In a case where a recessed portion TA_2 exposing a portion of the top surface of the connecting pad PD is formed by moving the first spacer CS1 away from the reference line RL in the second direction DR2, the connecting pad 130_3 is able to contact the side surface and the top surface of the connecting pad PD, and as a result, contact defects that may occur between the connecting pad 130_3 and the connecting pad PD can be effectively prevented.

[0161] In addition, since the recessed portion TA_2 is formed by only moving the first spacer CS1 away from the reference line RL in the second direction DR2, the height of the recessed portion TA_2 in the third direction DR3 can be reduced, and as a result, during the formation of the connecting pad 130_3, the second portion 130b_3 of the connecting pad 130_3 can be more stably formed in the recessed portion TA_2.

[0162] Fig.17 According to another exemplary embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line AA'; Fig.18 It is used for explaining Fig.17 a cross-sectional view of each connection pad of a display device; and Fig.19 How to Fig.17 A perspective view of an arrangement of elements disposed on a first substrate relative to elements disposed on a second substrate in a display device of FIG.

[0163] Figures 17 to 19 Example embodiments of Figures 14 to 16 The difference of the exemplary embodiment is that the first spacer CS1 and the second spacer CS2_2 are retracted to the inner side IS of the reference line RL and are not aligned with each other in the third direction DR3. Figures 17 to 19 The example embodiments focus on Figures 14 to 16 This and other differences of the exemplary embodiments of the present invention are described herein.

[0164] refer to Figures 17 to 19 , the display device 1 may include a first substrate 100 and a second substrate 300 facing the first substrate 100 at one side of the first substrate 100 .

[0165] The first spacer CS1 may be disposed at an inner side IS of a reference line RL, which is defined as a line extending from one side surface of the first substrate 100 in the third direction DR3. Specifically, the side surfaces of the first substrate 100, the connection line 115, the connection pad PD, the second substrate 300, the black matrix BM, and the overcoat layer OC may be aligned with the reference line RL in the third direction DR3, and the first spacer CS1 and the second spacer CS2_2 may be moved away from the reference line RL in the second direction DR2. The distance that the second spacer CS2_2 is moved away from the reference line RL in the second direction DR2 may be less than the distance D1 that the first spacer CS1 is moved away from the reference line RL in the second direction DR2.

[0166] The concave portion TA_3 may be formed in a direction from one side surface to the center of the display device 1 (eg, in the second direction DR2 ).

[0167] Due to the presence of the concave portion TA_3, the top surface of the connection pad PD, the side surface of the first spacer CS1, the bottom surface and the side surface of the second spacer CS2_2, and the bottom surface of the protective layer OC may be exposed. Specifically, a portion of the top surface of the connection pad PD may be exposed by the concave portion TA_3, and the remaining portion of the top surface of the connection pad PD may be covered by the first spacer CS1 and may overlap with the first spacer CS1 in the third direction DR3. The first spacer CS1 and the second spacer CS2_2 may be moved away from the reference line RL in the second direction DR2, and the distance that the second spacer CS2_2 moves away from the reference line RL in the second direction DR2 may be less than the distance D1 that the first spacer CS1 moves away from the reference line RL in the second direction DR2. Therefore, the protective layer OC and each of the first spacer CS1 and the second spacer CS2_2 may have a height difference. Thus, the storage capacity of the connection pad 130_4 can be further increased.

[0168] The connection pad 130_4 may be disposed to fill the concave portion TA_3. For example, the connection pad 130_4 may include a first portion 130a disposed on the outer side OS of the reference line RL and a second portion 130b_4 disposed on the inner side IS of the reference line RL and disposed in the concave portion TA_3.

[0169] The second portion 130b_4 of the connection pad 130_4 may contact the top surface of the connection pad PD, the side surface of the first spacer CS1, the bottom and side surfaces of the second spacer CS2_2, and the bottom surface of the protective layer OC, and may be disposed along a surface contour of the concave portion TA_3.

[0170] In a case where a recessed portion TA_3 exposing a portion of the top surface of the connecting pad PD is formed by moving the first spacer CS1 and the second spacer CS2_2 away from the reference line RL in the second direction DR2, the connecting pad 130_4 is able to contact the side surface and the top surface of the connecting pad PD, and as a result, a contact defect that may occur between the connecting pad 130_4 and the connecting pad PD can be effectively prevented.

[0171] Also, since the first and second spacers CS1 and CS2_2 are not aligned with each other in the third direction DR3, the protective layer OC and each of the first and second spacers CS1 and CS2_2 can have a height difference. Thus, the storage capacity of the connection pad 130_4 can be increased, and as a result, the connection pad 130_4 can be stably arranged.

[0172] According to the foregoing and other embodiments of the present invention, the bezel size of a display device can be effectively reduced, and contact defects between a flexible circuit board and a connection pad can be prevented.

[0173] Although certain embodiments have been described herein, other embodiments and modifications will be apparent from this specification. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: a first substrate; a second substrate, facing the first substrate; A connecting pad is arranged on the first substrate; a first spacer disposed on the connection pad and exposing a portion of the connection pad; A connection pad is provided on the side surface of the first substrate and the second substrate, and the connection pad is in contact with the connection pad; a second spacer, disposed directly on the first spacer; A connecting wire, arranged between the first substrate and the connecting pad; and an insulating layer, disposed between the connecting wire and the connecting pad, in, The connection pad includes a first surface facing the first substrate, a second surface opposite to the first surface, a first side surface between the first surface and the second surface, and a second side surface opposite to the first side surface; The first side surface of the connection pad is disposed below the first spacer and overlaps the first spacer; The second side surface of the connecting pad directly contacts the connecting pad; The first spacer and the second spacer both directly contact the connection pad; The insulating layer includes a contact hole exposing the connection line; and The connection pad contacts the connection line through the contact hole.

2. The display device according to claim 1, wherein: The side surfaces of the first substrate and the second substrate are aligned with each other in a first direction perpendicular to the top surface of the first substrate and the top surface of the second substrate; and The first spacer is spaced apart from the side surfaces of the first substrate and the second substrate by a first distance in a direction toward the inner sides of the first substrate and the second substrate.

3. The display device according to claim 2, wherein: A first portion of the second surface of the connection pad is in contact with the first spacer; and The second portion of the second surface of the connection pad is in contact with the connection pad.

4. The display device according to claim 3, wherein: The second side surfaces of the connection pads are aligned with the side surfaces of the first substrate and the second substrate in the first direction.

5. The display device according to claim 2, wherein: The first distance is 1 μm to 153 μm.

6. The display device according to claim 2, wherein: The first distance is smaller than a width of the first spacer.

7. The display device according to claim 2, wherein: The first spacer includes a blue colorant.

8. The display device according to claim 2, in, Side surfaces of the second spacer are aligned with the side surfaces of the first substrate and the second substrate in the first direction.

9. The display device according to claim 2, further comprising: a black matrix, disposed between the second spacer and the second substrate; and a protective layer, disposed between the black matrix and the second spacer, Wherein, side surfaces of the black matrix and the protection layer are aligned with the side surfaces of the first substrate and the second substrate in the first direction.

10. The display device according to claim 2, wherein: The connecting pad includes a main body portion and a tail portion protruding from the main body portion; The main body portion is in contact with the first spacer; and The tail portion contacts the connection pad.

11. The display device according to claim 10, wherein: The width of the tail portion is the same as the first distance.

12. The display device according to claim 1, wherein: The side surface of the second substrate and the side surface of the first spacer are aligned with each other in a first direction perpendicular to the top surface of the first substrate and the top surface of the second substrate; and The side surface of the first substrate and the second side surface of the connecting pad are aligned with each other in the first direction, and the side surface of the first substrate and the second side surface of the connecting pad are separated from the side surface of the second substrate and the side surface of the first spacer by a first distance in a direction toward the outer side of the second substrate and the first spacer.

13. The display device according to claim 12, wherein: The connection pad is in contact with the side surface of the first substrate, the second side surface of the connection pad, the second surface of the connection pad, the side surface of the first spacer, and the side surface of the second substrate.

14. A display device comprising: a first substrate; a second substrate, facing the first substrate; A first spacer is disposed along edge regions of the first substrate and the second substrate; a concave portion disposed between a side surface of the first substrate and a side surface of the second substrate; a second spacer, disposed directly on the first spacer; a connecting pad disposed on the first substrate and exposed by the concave portion; a connection pad in contact with the connection pad in the recessed portion; A connecting wire, arranged between the first substrate and the connecting pad; and An insulating layer, disposed between the connecting wire and the connecting pad; in: The side surface of the first substrate and the side surface of the second substrate are aligned with each other in a first direction perpendicular to the top surface of the first substrate and the top surface of the second substrate; The spacer is spaced apart from the side surface of the first substrate and the side surface of the second substrate by a first distance in a direction toward the inner sides of the first substrate and the second substrate; The connection pad includes a first surface facing the first substrate, a second surface opposite to the first surface, a first side surface between the first surface and the second surface, and a second side surface opposite to the first side surface; The first side surface of the connection pad is disposed below the first spacer and overlaps the first spacer; The second side surface of the connecting pad directly contacts the connecting pad; The first spacer and the second spacer both directly contact the connection pad; The insulating layer includes a contact hole exposing the connection line; and The connection pad contacts the connection line through the contact hole.

15. The display device according to claim 14, in, The width of the concave portion is the same as the first distance.

16. The display device according to claim 15, wherein: The connecting pad includes a first portion that contacts the second side surface of the connecting pad, the side surface of the first substrate and the side surface of the second substrate, and a second portion that is arranged in the recessed portion and contacts the second surface of the connecting pad and each of the side surfaces of the spacer.

17. The display device according to claim 16, wherein: The second spacer is disposed between the first spacer and the second substrate; and The second spacer includes a blue colorant.

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