Display Devices

Abstract

The display device includes: a display panel including a first substrate and a light emitting element layer disposed on the first substrate; and a sound generator disposed on one surface of the first substrate, wherein the sound generator vibrates the display panel to output sound. The sound generator includes: a first vibration generator that vibrates the display panel by generating a magnetic force using a first voice coil therein; and a second vibration generator including a vibration layer that contracts and expands based on a voltage applied thereto to vibrate the display panel, wherein the first vibration generator and the second vibration generator overlap each other in a thickness direction of the display panel.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] With the development of the information society, the demand for display devices for displaying images has increased in various forms. For example, display devices are used in various electronic products such as smart phones, tablet personal computers ("PCs"), digital cameras, notebook computers, navigators, and televisions. The display device may be a flat panel display device such as a liquid crystal display device, a field emission display device, or an organic light emitting display device. Summary of the invention

[0003] The display device may include a display panel for displaying an image and a speaker for providing sound. In such a display device, due to the space limitation of the display device, the speaker may be located on the lower surface or one side of the display panel. In this case, it is desired that the sound output from the speaker is output in the front direction of the display device. However, in a conventional display device, as described above, the speaker may be located on the lower surface or one side of the display panel, so that the sound may be output in the rear direction of the display device or in the side direction of the display device, thereby deteriorating the sound quality.

[0004] Embodiments of the present invention provide a display device capable of improving sound quality by vibrating a display panel using a sound generator and thus outputting sound in a front direction of the display device.

[0005] According to an embodiment of the present disclosure, a display device includes: a display panel including a first substrate and a light-emitting element layer disposed on the first substrate; and a sound generator disposed on one surface of the first substrate, wherein the sound generator vibrates the display panel to output sound. In such an embodiment, the sound generator includes: a first vibration generator that vibrates the display panel by generating a magnetic force using a first voice coil therein; and a second vibration generator including a vibration layer that contracts and expands based on a voltage applied thereto to vibrate the display panel, wherein the first vibration generator and the second vibration generator overlap each other in a thickness direction of the display panel.

[0006] In an embodiment, the first vibration generator may include: a bobbin disposed on one surface of the first substrate; a first voice coil surrounding the bobbin; and a first magnet disposed on the bobbin and spaced apart from the bobbin.

[0007] In an implementation, the second vibration generator may be disposed on one surface of the first substrate and may be surrounded by a bobbin.

[0008] In an implementation, the second vibration generator may overlap the first magnet in a thickness direction of the display panel.

[0009] In an implementation, the second vibration generator may be disposed on one surface of the first substrate, and the bobbin may be disposed on the second vibration generator.

[0010] In an embodiment, the second vibration generator may further include: a first electrode to which a first driving voltage is applied; and a second electrode to which a second driving voltage is applied, wherein the vibration layer may be disposed between the first electrode and the second electrode and may contract and expand based on the first driving voltage applied to the first electrode and the second driving voltage applied to the second electrode.

[0011] In an embodiment, the vibration layer may include a piezoelectric element.

[0012] In an embodiment, the sound generator may further include a third vibration generator that vibrates the display panel by generating a magnetic force using the second voice coil therein.

[0013] In an implementation, the second vibration generator and the third vibration generator may be surrounded by a bobbin.

[0014] In an implementation, the third vibration generator may overlap the first vibration generator and the second vibration generator in a thickness direction of the display panel.

[0015] In an implementation, the second vibration generator may be disposed on one surface of the first substrate, and the third vibration generator may be disposed on the second vibration generator.

[0016] In an implementation, the third vibration generator may overlap the first magnet of the first vibration generator in a thickness direction of the display panel.

[0017] In an implementation, one side surface of the second vibration generator and one side surface of the third vibration generator may be disposed adjacent to each other.

[0018] In an implementation, one side surface of the second vibration generator and one side surface of the third vibration generator may contact each other.

[0019] In an embodiment, the third vibration generator may include: a lower chassis and an upper chassis facing each other; a flexible circuit board disposed on one surface of the lower chassis facing the upper chassis; a second magnet including a voice coil groove accommodating a second voice coil; and a spring disposed between the upper chassis and the second magnet, wherein the second voice coil may be disposed on one surface of the flexible circuit board facing the upper chassis and may be electrically connected to the flexible circuit board.

[0020] In an implementation, the display device may further include a sound circuit board electrically connected to the first electrode and the second electrode of the second vibration generator.

[0021] In an embodiment, the sound circuit board may be disposed between one surface of the first substrate and the bobbin.

[0022] In an embodiment, the sound circuit board may be in contact with the bobbin.

[0023] In an embodiment, the display device may further include a heat radiation film disposed between one surface of the first substrate and the sound generator, wherein the heat radiation film may include an accommodating groove, and the sound circuit board is disposed in the accommodating groove.

[0024] In an implementation, the bobbin may overlap the receiving groove in a thickness direction of the display panel.

[0025] In an embodiment, the display device may further include a lower cover disposed on the heat radiation film; and a circuit board disposed on the lower cover.

[0026] In an embodiment, the radio wave blocking member may be provided on the sound circuit board.

[0027] In an embodiment, the first vibration generator may further include a lower plate disposed on the first magnet and fixed to the lower cover or the circuit board by a fixing member. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other features of the present invention will become more apparent by describing in detail exemplary embodiments of the present invention with reference to the accompanying drawings, in which:

[0029] Figure 1A and Figure 1B is a perspective view of a display device according to an embodiment;

[0030] Figure 2 is an exploded perspective view of a display device according to an embodiment;

[0031] Figure 3 is a bottom view showing an embodiment of a display device;

[0032] Figure 4 is shown in the omitted Figure 3 A bottom view of an embodiment of a display device in a state where a lower cover and a control circuit board are removed;

[0033] Figure 5 is a bottom view showing an embodiment of the arrangement of a radio wave blocking member and a sound generator;

[0034] Fig. 6A is along Figures 3 to 5 A cross-sectional view taken along II′;

[0035] Figure 6B yes Fig. 6A an enlarged view of the surrounding portion;

[0036] Figure 7 is along Figures 3 to 5 A sectional view taken along II-II′;

[0037] Figure 8 According to an optional embodiment, Figures 3 to 5 Another cross-sectional view taken from II′;

[0038] Fig. 9 is a cross-sectional view showing an embodiment of a display area of ​​a display panel;

[0039] Fig.10 is a cross-sectional view showing an embodiment of a first vibration generator;

[0040] Fig.11A and Fig. 11B The display panel is shown by Fig.10 A view of an embodiment of the vibration of the first vibration generator shown in;

[0041] Fig.12 is a perspective view showing an embodiment of a second vibration generator;

[0042] Fig.13 is along Fig.12 A cross-sectional view taken along III-III′;

[0043] Fig.14A is a schematic diagram illustrating a method of vibrating a vibration layer disposed between a first branch electrode and a second branch electrode of a second vibration generator;

[0044] Fig. 14B and Fig. 14C The display panel is shown by Fig.12 A side view of the vibration of the second vibration generator shown in ;

[0045] Fig.15 is a bottom view showing an alternative embodiment of a display device;

[0046] Fig.16 is shown in the omitted Fig.15 A bottom view of an embodiment of a display device in a state where a lower cover and a control circuit board are removed;

[0047] Fig.17 is along Fig.15 and Fig.16 A cross-sectional view taken along line IV-IV′;

[0048] Fig.18 is a bottom view showing another alternative embodiment of the display device;

[0049] Fig.19 is shown in the omitted Fig.18A bottom view of an example of a display device in a state where a lower cover and a control circuit board are removed;

[0050] Fig. 20 is along Fig.18 and Fig.19 A cross-sectional view taken along VV′;

[0051] Fig.21 is a bottom view showing another alternative embodiment of the display device;

[0052] Fig. 22 is shown in the omitted Fig.21 A bottom view of an embodiment of a display device in a state where a lower cover and a control circuit board are removed;

[0053] Fig.23 is along Fig.21 and Fig. 22 A cross-sectional view taken along line VII-VII′;

[0054] Fig.24 is an exploded perspective view specifically showing a third vibration generator;

[0055] Fig.25 is a bottom view showing another alternative embodiment of the display device;

[0056] Fig.26 is shown in the omitted Fig.25 A bottom view of an embodiment of a display device in a state where a lower cover and a control circuit board are removed; and

[0057] Fig. 27 is along Fig.25 and Fig.26 A cross-sectional view taken along IX-IX'. DETAILED DESCRIPTION

[0058] The present invention will be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and the scope of the present invention will be fully conveyed to those skilled in the art. The same reference numerals represent the same elements throughout.

[0059] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.

[0060] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, the "first element", "first component", "first region", "first layer" or "first section" discussed below may be referred to as a second element, second component, second region, second layer or second section without departing from the teachings herein.

[0061] The terms used herein are used only for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one". "Or" refers to "and / or". "At least one of A and B" refers to "A and / or B". As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. It will be further understood that the terms "comprises" and / or "comprising" or "includes" and / or "including" when used in this specification specify the presence of stated features, regions, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components and / or combinations thereof.

[0062] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientations depicted in the figures. For example, if the device in one of the figures is turned over, the elements described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" can include both "lower" and "upper" orientations depending on the specific orientation of the figures. Similarly, if the device in one of the figures is turned over, the elements described as being "below" or "below" the other elements will be oriented as being "above" the other elements. Therefore, the exemplary terms "below" or "below" can include both "upper" and "lower" orientations.

[0063] As used herein, "about" or "approximately" includes the stated value and the mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and errors associated with measurement of the particular quantity (ie, limitations of the measurement system).

[0064] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present disclosure, and will not be interpreted in an idealized or overly formalized meaning unless explicitly defined as such in this article.

[0065] Exemplary embodiments are described herein with reference to cross-sectional views as schematic diagrams of idealized embodiments. Therefore, deviations from the illustrated shapes, for example, due to manufacturing techniques and / or tolerances, should be expected. Therefore, the embodiments described herein should not be interpreted as being limited to specific regional shapes as shown herein, but should include deviations in shapes, for example, due to manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, the sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, and are not intended to limit the scope of the current claims.

[0066] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0067] Herein, for the convenience of description, an embodiment of the display device 10 is described, wherein the display device 10 is an organic light-emitting display device using an organic light-emitting element as a light-emitting element, but the present invention is not limited thereto. In an alternative embodiment, for example, the display device 10 may be an inorganic light-emitting display device using a micro light-emitting diode or an inorganic semiconductor (inorganic light-emitting diode) as a light-emitting element.

[0068] Figure 1A and Figure 1B is a perspective view of a display device according to an embodiment, and Figure 2 is an exploded perspective view of a display device according to an embodiment.

[0069] Reference Figure 1A , Figure 1B and Figure 2 The embodiment of the display device 10 includes a cover, a support member 103, a display panel 110, a source driving circuit 121, a flexible film 122, a heat radiation film 130 (in Figure 4 ), a source circuit board 140, a cable 150, a control circuit board 160, a timing control circuit 170 and a lower cover 180.

[0070] Herein, “on,” “above,” “top,” “upper side,” or “upper surface” refers to the direction in which the second substrate 112 is disposed relative to the first substrate 111 of the display panel 110, i.e., the Z-axis direction, and “under,” “below,” “under,” “bottom,” “lower side,” or “lower surface” refers to the direction in which the thermal radiation film 130 is disposed relative to the first substrate 111 of the display panel 110, i.e., the direction opposite to the Z-axis direction. In addition, “left,” “right,” “upper,” and “lower” refer to directions when the display panel 110 is observed from a plan view (e.g., a top view or a plan view in the thickness direction of the display device 10). Herein, “left” may refer to the X-axis direction, “right” may refer to the direction opposite to the X-axis direction, “up” may refer to the Y-axis direction, and “down” may refer to the direction opposite to the Y-axis direction.

[0071] The set cover may be disposed around an edge or outer edge of the display panel 110. The set cover may cover a non-display area of ​​the display panel 110 and expose a display area of ​​the display panel 110. Figure 2 As shown in , the set cover may include an upper set cover 101 and a lower set cover 102. The upper set cover 101 may cover the edge of the upper surface of the display panel 110, and the lower set cover 102 may cover the lower surface and side surfaces of the display panel 110. The upper set cover 101 and the lower set cover 102 may be attached to each other by a fixing member such as a screw or an adhesive member such as a double-sided tape or an adhesive. The upper set cover 101 and the lower set cover 102 may include plastic or metal, or a combination thereof.

[0072] The machine support 103 may be provided on the lower surface of the lower cover 102 to support the display device 10 so that the display device 10 is elevated. The machine support 103 may include a speaker 103a for a woofer that outputs a sound of a low frequency band. Since the speaker 103a for a woofer can allow the display device 10 to provide not only a sound of a mid-frequency band but also a sound of a low frequency band, the user can hear high-quality sound.

[0073] The display panel 110 may have a rectangular shape in a plan view. Figure 2 As shown in , the display panel 110 may have a rectangular shape having a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction). A corner where the long side in the first direction (X-axis direction) meets the short side in the second direction (Y-axis direction) may have a right angle shape or a circular shape with a predetermined curvature. The shape of the display panel 110 in a plan view is not limited to a rectangular shape, and various modifications may be made to have another polygonal shape, a circular shape, or an elliptical shape.

[0074] In an embodiment, if Figure 3 As shown in , the display panel 110 may be flat, but the present invention is not limited thereto. The display panel 110 may be curved or may be bendable with a predetermined curvature.

[0075] The display panel 110 may include a first substrate 111 and a second substrate 112. The first substrate 111 and the second substrate 112 may be rigid or flexible. The first substrate 111 may include or be formed of glass or plastic. The second substrate 112 may include or be formed of glass, plastic, an encapsulation film or a barrier film. The plastic may be polyethersulfone ("PES"), polyacrylate ("PA"), polyarylate ("PAR"), polyetherimide ("PEI"), polyethylene naphthalate ("PEN"), polyethylene terephthalate ("PET"), polyphenylene sulfide ("PPS"), polyallyl ester, polyimide ("PI"), polycarbonate ("PC"), cellulose triacetate ("CAT"), cellulose acetate propionate ("CAP"), or a combination thereof. The encapsulation film or barrier film may be a film in which a plurality of inorganic films are stacked on each other.

[0076] In an embodiment, if Fig. 9 As shown in , the display panel 110 may include a thin film transistor layer TFTL, a light emitting element layer EML, a filler FL, an optical wavelength conversion layer QDL, and a color filter layer CFL disposed between a first substrate 111 and a second substrate 112. In such an embodiment, the first substrate 111 may be a thin film transistor substrate on which the thin film transistor layer TFTL, the light emitting element layer EML, and the encapsulation layer 345 are disposed, the second substrate 112 may be a color filter substrate on which the optical wavelength conversion layer QDL and the color filter layer CFL are disposed, and the filler FL may be disposed between the encapsulation layer 345 of the first substrate 111 and the optical wavelength conversion layer QDL of the second substrate 112. Reference will be made later Fig. 9 The thin film transistor layer TFTL, the light emitting element layer EML, the filler FL, the optical wavelength conversion layer QDL, and the color filter layer CFL of the display panel 110 are described in more detail.

[0077] In an embodiment, returning reference Figure 2, one surface of each of the flexible films 122 may be attached to one surface of the first substrate 111 of the display panel 110, and the other surface thereof may be attached to one surface of the source circuit board 140. Herein, "one surface" or "first surface" refers to one of the surfaces parallel to the plane defined by the X-axis and the Y-axis, and "the other surface" or "second surface" refers to the other of the surfaces parallel to the plane defined by the X-axis and the Y-axis. In an embodiment, the size of the first substrate 111 is larger than that of the second substrate 112, so that one side of the first substrate 111 may be exposed without being covered by the second substrate 112. The flexible film 122 may be attached to the exposed side of the first substrate 111 without being covered by the second substrate 112. Each of the flexible films 122 may be attached to one surface of the first substrate 111 and one surface of the source circuit board 140 using an anisotropic conductive film.

[0078] Each of the flexible films 122 may be a tape carrier package or a chip on film. Each of the flexible films 122 may be bendable or in a bent state. In an embodiment, the flexible film 122 may be bent to a lower portion of the first substrate 111, such as Figure 4 6 . In such an embodiment, the source circuit board 140 , the cable 150 , and the control circuit board 160 may be disposed on the lower surface of the heat radiation film 130 .

[0079] In an embodiment, if Figure 2 As shown in FIG. 1 , eight flexible films 122 may be attached to the first substrate 111 of the display panel 110 , but the number of the flexible films 122 is not limited thereto.

[0080] The source driving circuit 121 may be disposed on one surface of each of the flexible films 122. The source driving circuit 121 may be in the form of an integrated circuit ("IC"). Each of the source driving circuits 121 converts digital video data into an analog data voltage based on a source control signal of the timing control circuit 170, and supplies the analog data voltage to a data line of the display panel 110.

[0081] Each of the source circuit boards 140 may be connected to the control circuit board 160 through a cable 150. In an embodiment, each of the source circuit boards 140 may include a first first connector 151a for connection with the cable 150. Each of the source circuit boards 140 may be a flexible printed circuit board or a printed circuit board. The cable 150 may be a flexible cable.

[0082] The control circuit board 160 may be connected to the source circuit board 140 through the cable 150. In an embodiment, the control circuit board 160 may include a second connector 152 for connection with the cable 150. The control circuit board 160 may be a flexible printed circuit board or a printed circuit board.

[0083] In an embodiment, if Figure 2 As shown in FIG. 1 , four cables 150 connect the source circuit board 140 and the control circuit board 160, but the number of cables 150 is not limited thereto. Figure 2 As shown in FIG. 1 , two source circuit boards 140 are provided, but the number of the source circuit boards 140 in this specification is not limited thereto.

[0084] In an embodiment where the number of flexible films 122 is small, the source circuit board 140 may be omitted, and the flexible films 122 may be directly connected to the control circuit board 160 .

[0085] The timing control circuit 170 may be disposed on one surface of the control circuit board 160. The timing control circuit 170 may be in the form of an integrated circuit. The timing control circuit 170 may receive digital video data and a timing signal from a system-on-chip of a system circuit board, and may generate a source control signal for controlling the timing of the source driving circuit 121 according to the timing signal.

[0086] The system on chip may be arranged or mounted on a system circuit board connected to the control circuit board 160 by another flexible cable, and may be in the form of an integrated circuit. The system on chip may be a processor of a smart TV ("TV"), a central processing unit ("CPU"), or a graphics card of a personal computer ("PC") or a notebook, or an application processor of a smart phone or a tablet PC. The system circuit board may be a flexible printed circuit board or a printed circuit board.

[0087] The power supply circuit may be additionally attached to one surface of the control circuit board 160. The power supply circuit may generate a voltage for driving the display panel 110 from a main power supply applied by the system circuit board, and may supply the voltage to the display panel 110. In one embodiment, for example, the power supply circuit may generate a high potential voltage, a low potential voltage, and an initialization voltage for driving an organic light emitting element, and may supply the generated voltage to the display panel 110. In an embodiment, the power supply circuit may generate and supply a driving voltage for driving a source driving circuit 121, a timing control circuit 170, and the like. The power supply circuit may be in the form of an integrated circuit. Alternatively, the power supply circuit may be provided on another power supply circuit board provided separately from the control circuit board 160. The power supply circuit board may be a flexible printed circuit board or a printed circuit board.

[0088] The thermal radiation film 130 may be disposed on one surface of the first substrate 111 that does not face the second substrate 112, that is, on the lower surface of the first substrate 111. In an embodiment, the sound generator 200 may be disposed on one surface of the thermal radiation film 130 that does not face the first substrate 111, that is, on the lower surface of the thermal radiation film 130. The thermal radiation film 130 is used to radiate heat generated by the sound generator 200. In an embodiment, the thermal radiation film 130 may include a graphite layer or a metal layer having high thermal conductivity, such as a silver (Ag) layer, a copper (Cu) layer, or an aluminum (Al) layer.

[0089] In an embodiment, the heat radiation film 130 may include a plurality of graphite layers or a plurality of metal layers, each layer being on a plane defined by a first direction (X-axis direction) and a second direction (Y-axis direction). In such an embodiment, since the heat generated by the sound generator 200 can be diffused in the first direction (X-axis direction) and the second direction (Y-axis direction), the heat can be discharged more effectively. In this article, the first direction (X-axis direction) may be the width direction (or horizontal direction) of the display panel 110, the second direction (Y-axis direction) may be the height direction (or vertical direction) of the display panel 110, and the third direction (Z-axis direction) may be the thickness direction of the display panel 110. Therefore, due to the heat radiation film 130, the influence of the heat generated by the sound generator 200 on the display panel 110 can be minimized.

[0090] In an implementation, a thickness D1 of the heat radiation film 130 may be thicker than a thickness D2 of the first substrate 111 and a thickness D3 of the second substrate 112 to prevent heat generated by the sound generator 200 from affecting the display panel 110 .

[0091] The size of the heat radiation film 130 may be smaller than that of the first substrate 111 , and thus an edge portion of one surface of the first substrate 111 may be exposed without being covered by the heat radiation film 130 .

[0092] In an embodiment, the sound generator 200 may be a vibration generator capable of vibrating the display panel 110 in the third direction (Z-axis direction). In such an embodiment, the display panel 110 may function as a diaphragm for outputting sound.

[0093] In an embodiment, the sound generator 200 may include a first vibration generator 210 and a second vibration generator 220, wherein the first vibration generator 210 may function as an exciter for vibrating the display panel 110 by generating a magnetic force using a first voice coil, such as Fig.10 , Fig.11A and Fig. 11B As shown, the second vibration generator 220 has a piezoelectric element that contracts and expands according to a voltage applied thereto to vibrate the display panel 110, as shown in FIG. Fig.12 , Fig.13 as well as FIG. 14A to FIG. 14C as shown in .

[0094] In one embodiment, the first vibration generator 210 may be used as an intermediate sound generator for outputting a sound in a mid-frequency band, and the second vibration generator 220 may be used as a high-frequency generator for outputting a sound in a high-frequency band. In such an embodiment, the display device 10 may provide a sound in a high-frequency band that may not be effectively provided by the first vibration generator 210 by using the second vibration generator 220, and may provide a sound in a mid-frequency band that may not be effectively provided by the second vibration generator 220 by using the first vibration generator 210. Therefore, the display device 10 provides the sound in the mid-frequency band and the high-frequency band through the sound generator 200 including the first vibration generator 210 and the second vibration generator 220, and provides the sound in the low-frequency band through the speaker 103a for the woofer, thereby allowing the user to hear high-quality sound.

[0095] In an embodiment, if Figure 2 As shown in FIG. 1 , the display device 10 may include a single sound generator 200, but the number of the sound generator 200 is not limited thereto. Alternatively, a plurality of sound generators 200 may be provided, and thereby the display device 10 may provide stereo sound.

[0096] The lower cover 180 may be disposed on one surface of the heat radiation film 130. The lower cover 180 may be attached to an edge of one surface of the first substrate 111 of the display panel 110 by a first adhesive member 115. The first adhesive member 115 may be a double-sided tape including a buffer layer such as foam. The lower cover 180 may include or be made of metal or reinforced glass.

[0097] As described above, in the embodiment of the display device 10, as shown in FIG. 1 and FIG. Figure 2 As shown in , the sound generator 200 can output sound by using the display panel 110 as a diaphragm, and thus can output sound in the front direction of the display device 10, thereby improving the sound quality. In such an embodiment, by including the sound generator 200, a separate speaker provided on the lower surface or one side of a conventional display panel can be omitted.

[0098] In an embodiment, as shown in FIG. 1 and Figure 2As shown in , the display device 10 may be a medium or large display device including a plurality of source drive circuits 121, but the present invention is not limited thereto. Alternatively, the display device 10 may be a small display device including a single source drive circuit 121. In such an embodiment, the flexible film 122, the source circuit board 140, and the cable 150 may be omitted. In such an embodiment, the source drive circuit 121 and the timing control circuit 170 may be integrated into a single integrated circuit to be attached to a single flexible circuit board, or may be attached to the first substrate 111 of the display panel 110. In an embodiment in which the display device 10 is a medium and large display device, the display device 10 may be, for example, a monitor or a TV. In an embodiment in which the display device 10 is a small display device, the display device 10 may be, for example, a smart phone or a desktop PC.

[0099] Figure 3 is a bottom view showing an embodiment of a display device, Figure 4 It shows that Figure 3 A bottom view of an embodiment of a display device in which a lower cover and a control circuit board are omitted, Figure 5 is a bottom view showing an embodiment of the arrangement of a radio wave blocking member and a sound generator, Fig. 6A is along Figures 3 to 5 II′, Figure 6B yes Fig. 6A an enlarged view of the encircled portion of Figure 7 is along Figures 3 to 5 A cross-sectional view taken along line II-II′.

[0100] For ease of explanation, Figure 5 Only the first substrate 111 of the display panel 110, the first adhesive member 115, the heat radiation film 130, the radio wave blocking member 190, and the first and second vibration generators 210 and 220 are shown. Figure 5 In the embodiment, for convenience of explanation, the source driving circuit 121, the flexible film 122, the source circuit board 140, the cable 150, the control circuit board 160, the timing control circuit 170 and the lower cover 180 are omitted.

[0101] Reference Figures 3 to 7 , the flexible film 122 is bent to the lower side of the heat radiation film 130 , and thus the source circuit board 140 may be disposed on one surface of the heat radiation film 130 .

[0102] The control circuit board 160 is disposed on one surface of the lower cover 180, and the source circuit board 140 is disposed on one surface of the heat radiation film 130. In an embodiment, the source circuit board 140 is disposed between one surface of the heat radiation film 130 and the other surface of the lower cover 180. The cable 150 connected to the first first connector 151a of the source circuit board 140 may be connected to the second connector 152 of the control circuit board 160 through the first cable hole CH1 defined by passing through the lower cover 180. The first cable hole CH1 may be disposed between the control circuit board 160 and the source circuit board 140 when viewed from a plan view.

[0103] In an embodiment, if Fig. 6A and Figure 7 As shown in , the first vibration generator 210 may include a first magnet 211, a bobbin 212, a first voice coil 213, and a lower plate 215. The bobbin 212 may be attached to one surface of the thermal radiation film 130 by an adhesive member such as a double-sided tape. The first voice coil 213 may be wound (or coiled) on the outer circumferential surface of the bobbin 212. Since the bobbin 212 is formed to have a cylindrical shape, the central protrusion of the first magnet 211 is disposed inside the bobbin 212, and the side wall of the first magnet 211 may be disposed outside the bobbin 212. The lower plate 215 may be disposed on the lower surface of the first magnet 211. Therefore, the lower plate 215 may be attached to the heat radiation film 130 by a fixing member 216 (such as a screw) such as a screw. Fig.10 ) is fixed to one surface of the control circuit board 160.

[0104] In an embodiment, the first magnet 211 may be disposed in a hole formed or defined in the control circuit board 160 and a hole formed or defined in the lower cover 180. Since the control circuit board 160 is fixed to one surface of the lower cover 180 by a fixing member 216 such as a screw, the hole of the control circuit board 160 may be smaller than the hole of the lower cover 180.

[0105] The bobbin 212 of the first vibration generator 210 is fixed to one surface of the heat radiation film 130, and the first magnet 211 is fixed to the control circuit board 160. In such an embodiment, the control circuit board 160 is provided with a hole that is smaller than the lower plate 215 but larger than the first magnet 211. Therefore, the bobbin 212 wound with the first voice coil 213 can reciprocate in the third direction (Z-axis direction) according to the magnetic field generated around the first voice coil 213. Fig.10 , Fig.11A and Fig. 11B The first vibration generator 210 is described in more detail.

[0106] The second vibration generator 220 may be attached to one surface of the heat radiation film 130 by an adhesive member such as a double-sided tape. The second vibration generator 220 may be connected to the second first connector 151b of the source circuit board 140 by the sound circuit board 250. The first pad and the second pad connected to the first electrode and the second electrode provided on one surface of the second vibration generator 220 may be provided on one side of the second vibration generator 220. The connection portion of the second first connector 151b for connecting to the source circuit board 140 may be provided on the other side of the sound circuit board 250. In such an embodiment, the second vibration generator 220 may be electrically connected to the source circuit board 140 by the sound circuit board 250. The sound circuit board 250 may be a flexible printed circuit board or a flexible cable.

[0107] In an embodiment, the first vibration generator 210 and the second vibration generator 220 of the sound generator 200 are arranged to overlap each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), so that the first vibration generator 210 and the second vibration generator 220 simultaneously vibrate the display panel 110 to output sound. In such an embodiment, the first vibration generator 210 and the second vibration generator 220 simultaneously vibrate the same vibration surface to output sound. In such an embodiment, the first vibration generator 210 and the second vibration generator 220 can vibrate the display panel 110 by allocating the sound bandwidth. The first vibration generator 210 can vibrate the display panel 110 to output high-frequency sound, and the second vibration generator 220 can vibrate the display panel 110 to output intermediate frequency sound. Therefore, the sound generator 200 can provide high-quality sound with intermediate frequency band and high frequency band.

[0108] In an embodiment, the bobbin 212 of the first vibration generator 210 may be cylindrical in shape, and the second vibration generator 220 may be disposed inside the bobbin 212 to be surrounded by the bobbin 212. In such an embodiment, Fig. 6A As shown in , the sound circuit board 250 may be disposed between the heat radiation film 130 and the bobbin 212 of the first vibration generator 210 to allow the sound circuit board 250 to be electrically connected to the second vibration generator 220. In such an embodiment, the bobbin 212 may be disposed on the sound circuit board 250, and the bobbin 212 may be in contact with one surface of the sound circuit board 250.

[0109] Alternatively, if Figure 8 As shown in , the sound circuit board 250 may be disposed in a receiving groove AG formed or defined in the heat radiation film 130. The receiving groove AG of the heat radiation film 130 may be a groove formed by removing a portion of one surface of the heat radiation film 130. The height of the receiving groove AG of the heat radiation film 130 may be greater than the thickness of the sound circuit board 250. Figure 4 As shown in , the accommodating groove AG of the heat radiation film 130 may overlap a portion of the bobbin 212 of the first vibration generator 210. Therefore, the adhesive force between the bobbin 212 of the first vibration generator 210 and one surface of the heat radiation film 130 may not be substantially reduced, and the sound circuit board 250 may not be pressed by the bobbin 212, so that the sound circuit board 250 may be stably electrically connected to the first vibration generator 210.

[0110] like Figure 3 As shown in FIG. 1 , the control circuit board 160 may be provided with not only a timing control circuit 170 but also a sound driving circuit 171. The sound driving circuit 171 may receive a sound control signal as a digital signal from the system circuit board. The sound driving circuit 171 may be in the form of an integrated circuit and provided on the control circuit board 160 or the system board.

[0111] The sound driving circuit 171 may include: a digital signal processor (DSP) for processing a sound control signal as a digital signal; a digital-to-analog converter (DAC) for converting a digital signal processed by the DSP into an analog driving voltage as an analog signal; and an amplifier (AMP) for amplifying and outputting the analog driving voltage converted from the DAC. The analog driving voltage may include a positive driving voltage and a negative driving voltage.

[0112] The sound driving circuit 171 may generate a first sound signal including first and second first signals for driving the first vibration generator 210 based on the sound control signal, and may generate a second sound signal including first and second second signals for driving the second vibration generator 220 based on the sound control signal.

[0113] The first vibration generator 210 may receive a first sound signal including a first first driving voltage and a second first driving voltage from the sound driving circuit 171. The first vibration generator 210 may output sound by vibrating the display panel 110 according to the first first driving voltage and the second first driving voltage. Fig. 6A and Figure 7 As shown in , when the sound driving circuit 171 and the lower plate 215 of the first vibration generator 210 are disposed on the control circuit board 160 , the sound driving circuit 171 and the first voice coil 213 of the first vibration generator 210 may be electrically connected via a metal wire of the control circuit board 160 .

[0114] The second vibration generator 220 may receive a second sound signal including the first second driving voltage and the second second driving voltage from the sound driving circuit 171. The second vibration generator 220 may output sound by vibrating the display panel 110 based on the first second driving voltage and the second second driving voltage.

[0115] In an embodiment, if Figure 3 As shown in , the sound driving circuit 171 may be disposed on the control circuit board 160, and the second vibration generator 220 may be disposed on one surface of the heat radiation film 130. In such an embodiment, the second sound signal of the sound driving circuit 171 may be transmitted to the second vibration generator 220 through the cable 150, the source circuit board 140, and the sound circuit board 250.

[0116] In an embodiment, if Figure 5 As shown in , the size of the thermal radiation film 130 may be smaller than that of the first substrate 111 , and thus four edges of one surface of the first substrate 111 may be exposed without being covered by the thermal radiation film 130 .

[0117] The first adhesive member 115 may be disposed on four exposed edges of one surface of the first substrate 111 without being covered by the heat radiation film 130. Figure 5 As shown in , the first adhesive member 115 may attach one surface of the first substrate 111 to the other surface of the lower cover 180. The first adhesive member 115 may be a double-sided tape including a buffer layer such as foam.

[0118] The radio wave blocking member 190 may be disposed on four edges of the heat radiation film 130. Fig. 6A and Figure 7 As shown, the radio wave blocking member 190 may be attached to one surface of the heat radiation film 130 and the other surface of the lower cover 180 .

[0119] In an embodiment, the radio wave blocking member 190 may be disposed on the sound circuit board 250, and in such an embodiment, one surface of the sound circuit board 250 may be attached to the other surface of the lower cover 180. In an embodiment, the radio wave blocking member 190 may be disposed on the flexible film 122, and in such an embodiment, one surface of the flexible film 122 may be attached to the other surface of the lower cover 180. Since the radio wave blocking member 190 includes Figure 6B The buffer layer 192 shown in FIG. Fig. 6AAs shown in , the thickness (or height in the Z-axis direction) of the radio wave blocking member 190 may be different according to the thickness of the sound circuit board 250 and the thickness of the flexible film 122. In one embodiment, for example, since the thickness of the sound circuit board 250 is thinner than the thickness of the flexible film 122, the thickness of the radio wave blocking member 190 disposed on the sound circuit board 250 may be thicker than the thickness of the radio wave blocking member 190 disposed on the flexible film 122. In such an embodiment, the thickness of the radio wave blocking member 190 attached to one surface of the heat radiation film 130 and the other surface of the lower cover 180 may be thicker than the thickness of the radio wave blocking member 190 disposed on the sound circuit board 250.

[0120] In an embodiment, if Figure 6B As shown in , the radio wave blocking member 190 may include a base film 191 , a buffer layer 192 , a sacrificial layer 193 , a first adhesive layer 194 , and a second adhesive layer 195 .

[0121] The base film 191 may include or be formed of plastic. In one embodiment, for example, the base film 191 may include or be formed of PET, but the material thereof is not limited thereto.

[0122] The buffer layer 192 may be disposed on one surface of the base film 191. The buffer layer 192 may include or be formed of a foam having elasticity. In one embodiment, for example, the buffer layer 192 may include or be formed of polyurethane, silicone, rubber, or aerogel, but the material thereof is not limited thereto.

[0123] The sacrificial layer 193 may be provided on one surface of the buffer layer 192. When the radio wave blocking member 190 is attached by mistake, the sacrificial layer 193 may be used as a layer to be separated in the case where it is desired to disassemble the radio wave blocking member 190. In such an embodiment, a portion of the first adhesive layer 194 and a portion of the sacrificial layer 193 may remain on the other surface of the lower cover 180. The sacrificial layer 193 may include a material having low elasticity or be formed of a material having low elasticity. In one embodiment, for example, the sacrificial layer 193 may include polyurethane or be formed of polyurethane, but its material is not limited thereto. Alternatively, the sacrificial layer 193 may be omitted.

[0124] The first adhesive layer 194 may be disposed on one surface of the sacrificial layer 193. The first adhesive layer 194 may be attached to the other surface of the lower cover 180. The second adhesive layer 195 may be disposed on the other surface of the base film 191. The second adhesive layer 195 may be attached to one surface of the thermal radiation film 130. The first adhesive layer 194 and the second adhesive layer 195 may be an acrylic adhesive or a silicone adhesive, but are not limited thereto.

[0125] In an embodiment, if Figure 5 As shown in FIG, one surface of the heat radiation film 130 may be divided into a first area A1 and a second area A2 by the radio wave blocking member 190 .

[0126] In such an embodiment, the first area A1, which is an area where the sound generator 200 is provided, may be defined by the radio wave blocking member 190 provided to surround the sound generator 200. The second area A2, which is an area where the source circuit board 140 is arranged, may be defined by the radio wave blocking member 190 provided to surround the source circuit board 140. In such an embodiment, in the case where the second area A2 is defined as described above, the source circuit board 140, the source driving circuit 121, and the flexible film 122 may be effectively prevented from being affected by the vibration of the sound generator 200 of the first area A1, or the influence caused by the vibration of the sound generator 200 of the first area A1 may be significantly reduced.

[0127] According to the implementation mode, Figures 3 to 7 As shown in , the first vibration generator 210 and the second vibration generator 220 of the sound generator 200 are arranged to overlap each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), and thus the first vibration generator 210 and the second vibration generator 220 can simultaneously vibrate the display panel 110 to output sound. Therefore, the first vibration generator 210 and the second vibration generator 220 can vibrate the display panel 110 by allocating the sound bandwidth, and thus the sound generator 200 can provide high-quality sound with both the middle frequency band and the high frequency band.

[0128] In an embodiment, the sound circuit board 250 may be disposed between the heat radiation film 130 and the bobbin 212 of the first vibration generator 210, or may be disposed in the receiving groove AG of the heat radiation film 130. Therefore, even when the second vibration generator 220 is surrounded by the bobbin 212 of the first vibration generator 210, the sound circuit board 250 may electrically connect the second vibration generator 220 and the source circuit board 140.

[0129] In an embodiment, since the second vibration generator 220 and the source circuit board 140 are connected via the sound circuit board 250, and the cable 150 connected to the source circuit board 140 is connected to the control circuit board 160 via the first cable hole CH1 defined by passing through the lower cover 180, even when the second vibration generator 220 is disposed on one surface of the heat radiation film 130 and the control circuit board 160 is disposed on one surface of the lower cover 180, the control circuit board 160 and the second vibration generator 220 can be easily electrically connected.

[0130] In such an embodiment, since the sound generator 200 is surrounded by the radio wave blocking member 190 , the vibration of the display panel 110 generated by the sound generator 200 is effectively prevented from affecting the source circuit board 140 .

[0131] Fig. 9 is a cross-sectional view showing an embodiment of a display region of a display panel.

[0132] Reference Fig. 9 The display panel 110 may include a first substrate 111, a second substrate 112, a thin film transistor layer TFTL, a light emitting element layer EML, a filler FL, an optical wavelength conversion layer QDL, and a color filter layer CFL. In an embodiment, the layers between the first substrate 111 and the second substrate 112, such as the thin film transistor layer TFTL, the light emitting element layer EML, the filler FL, the optical wavelength conversion layer QDL, and the color filter layer CFL, may define Fig. 6A , Figure 7 and Figure 8 The layer indicated by reference numeral 113 in FIG. Fig. 6A , Figure 7 and Figure 8 In the embodiment, the layer indicated by reference numeral 114 may be a panel or layer, such as a touch sensing panel or layer, on the display panel 110. Alternatively, the layer indicated by reference numeral 114 may be a polarizing film including a linear polarizer and a phase delay film such as a quarter wave plate.

[0133] In such an embodiment, the buffer film 302 may be disposed on one surface of the first substrate 111 facing the second substrate 112. The buffer film 302 may be disposed on the first substrate 111 to protect the thin film transistor 335 and the light emitting element from moisture entering the first substrate 111 that is susceptible to moisture penetration. The buffer film 302 may include or be formed of a plurality of alternately stacked inorganic films. In one embodiment, for example, the buffer film 302 may be a multilayer film in which silicon oxide films (SiO x ), silicon nitride film (SiN x ) and one or more inorganic films of SiON film. Optionally, the buffer film 302 may be omitted.

[0134] The thin film transistor layer TFTL is provided on the buffer film 302. The thin film transistor layer TFTL includes a thin film transistor 335, a gate insulating film 336, an interlayer insulating film 337, a protective film 338, and a planarizing film 339.

[0135] The thin film transistor 335 is disposed on the buffer film 302. The thin film transistor 335 includes an active layer 331, a gate electrode 332, a source electrode 333, and a drain electrode 334. Fig. 9As shown in , the thin film transistor 335 can be formed in a top gate manner, wherein the gate electrode 332 is located above the active layer 331, but the present invention is not limited thereto. Alternatively, the thin film transistor 335 can be formed in a bottom gate manner, wherein the gate electrode 332 is located below the active layer 331, or in a double gate manner, wherein the gate electrode 332 is located both above and below the active layer 331.

[0136] The active layer 331 is disposed on the buffer film 302. The active layer 331 may include or be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer for blocking external light incident on the active layer 331 may be disposed between the buffer film 302 and the active layer 331.

[0137] The gate insulating film 336 may be disposed on the active layer 331. The gate insulating film 336 may include or be formed of an inorganic film, such as a silicon oxide film (SiO x ), silicon nitride film (SiN x ) or multilayer films thereof.

[0138] The gate electrode 332 and the gate line may be disposed on the gate insulating film 336. The gate electrode 332 and the gate line may include or be formed of a single layer or multiple layers, each layer including at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0139] The interlayer insulating film 337 may be disposed on the gate electrode 332 and the gate line. The interlayer insulating film 337 may include or be formed of an inorganic film, such as a silicon oxide film (SiO x ), silicon nitride film (SiN x ) or multilayer films thereof.

[0140] The source electrode 333, the drain electrode 334, and the data line may be disposed on the interlayer insulating film 337. Each of the source electrode 333 and the drain electrode 334 may be connected to the active layer 331 through a contact hole defined by passing through the gate insulating film 336 and the interlayer insulating film 337. The source electrode 333, the drain electrode 334, and the data line may include or be formed of a single layer or multiple layers, each layer including at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0141] A protective film 338 for insulating the thin film transistor 335 may be provided on the source electrode 333, the drain electrode 334, and the data line. The protective film 338 may include or be formed of an inorganic film, such as a silicon oxide film (SiOx ), silicon nitride film (SiN x ) or multilayer films thereof.

[0142] The planarization film 339 may be disposed on the protection film 338 to planarize a step caused by the thin film transistor 335. The planarization film 339 may include or be formed of an organic film including acrylic resin, epoxy resin, phenol resin, polyamide resin, or polyimide resin.

[0143] The light emitting element layer EML is disposed on the thin film transistor layer TFTL and includes a light emitting element and a pixel defining film 344 .

[0144] The light emitting element and the pixel defining film 344 are disposed on the planarization film 339 . The light emitting element may be an organic light emitting element. In an embodiment, the light emitting element may include an anode electrode 341 , a light emitting layer 342 , and a cathode electrode 343 .

[0145] The anode electrode 341 may be disposed on the planarization film 339. The anode electrode 341 may be connected to the drain electrode 334 of the thin film transistor 335 through a contact hole defined through the protection film 338 and the planarization film 339.

[0146] A pixel defining film 344 defining a pixel may be disposed on the planarization film 339 to cover an edge of the anode electrode 341. In an embodiment, the pixel defining film 344 is used to define sub-pixels PX1, PX2, and PX3. Each of the sub-pixels PX1, PX2, and PX3 has a structure in which an anode electrode 341, a light emitting layer 342, and a cathode electrode 343 are sequentially stacked, and thus holes from the anode electrode 341 and electrons from the cathode electrode 343 are combined with each other in the light emitting layer 342 to emit light.

[0147] The light emitting layer 342 is disposed on the anode electrode 341 and the pixel defining film 344. The light emitting layer 342 may be an organic light emitting layer. The light emitting layer 342 may emit light having a short wavelength, such as blue light or ultraviolet light. The peak wavelength range of the blue light may be approximately 450 nanometers (nm) to 490 nm, and the peak wavelength range of the ultraviolet light may be less than 450 nm. In an embodiment, the light emitting layer 342 may be a common layer formed jointly for the sub-pixels PX1, PX2, and PX3. In such an embodiment, the display panel 110 may include an optical wavelength conversion layer QDL for converting short wavelength light such as blue light or ultraviolet light emitted from the light emitting layer 342 into red light, green light, and blue light, and a color filter layer CFL for transmitting red light, green light, and blue light.

[0148] The light emitting layer 342 may include a hole transport layer, a light emitting layer, and an electron transport layer. In an embodiment, the light emitting layer 342 may be formed in a series structure of two or more stacks, and in such an embodiment, a charge generation layer may be disposed between the stacks.

[0149] The cathode electrode 343 is disposed on the light emitting layer 342. The cathode electrode 343 may be disposed to cover the light emitting layer 342. The cathode electrode 343 may be a common layer commonly disposed in all pixels.

[0150] The light emitting element layer EML is formed by a top emission method, in which light is emitted in a direction toward the second substrate 112, that is, in an upward direction. In an embodiment, the anode electrode 341 may include a high-reflectivity metal material or be formed of a high-reflectivity metal material, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide ("ITO") (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy may be an alloy of silver (Ag), palladium (Pd) and copper (Cu). The cathode electrode 343 may include a light-transmitting transparent conductive material ("TCO") or a semi-transmitting conductive material or be formed of a light-transmitting transparent conductive material ("TCO") or a semi-transmitting conductive material, such as ITO or indium zinc oxide ("IZO"), and a semi-transmitting conductive material such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). In an embodiment in which the cathode electrode 343 includes or is formed of a semi-transmissive conductive material, light emission efficiency may be improved through a microcavity effect.

[0151] The encapsulation layer 345 is disposed on the light emitting element layer EML. In an embodiment, the encapsulation layer 345 is used to prevent oxygen or moisture from penetrating the light emitting layer 342 and the cathode electrode 343. In such an embodiment, the encapsulation layer 345 may include at least one inorganic film. The inorganic film may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide or titanium oxide or may be formed by silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide or titanium oxide. The encapsulation layer 345 may also include at least one organic film. The organic film may be formed to have a sufficient thickness to prevent foreign matter (particles) from entering the encapsulation layer 345 and entering the light emitting layer 342 and the cathode electrode 343. The organic film may include at least one of epoxy resin, acrylate and polyurethane acrylate.

[0152] The color filter layer CFL is disposed on one surface of the second substrate 112 facing the first substrate 111. The color filter layer CFL may include a black matrix 360 and a color filter 370.

[0153] The black matrix 360 may be disposed on one surface of the second substrate 112. The black matrix 360 may be disposed not to overlap the sub-pixels PX1, PX2, and PX3 but to overlap the pixel defining film 344. The black matrix 360 may include a black dye that blocks light but does not transmit light, or may include an opaque metal material.

[0154] In an embodiment, the color filter 370 may be arranged to overlap the sub-pixels PX1, PX2, and PX3. The first color filter 371 may be arranged to overlap the first sub-pixel PX1, the second color filter 372 may be arranged to overlap the second sub-pixel PX2, and the third color filter 373 may be arranged to overlap the third sub-pixel PX3. In such an embodiment, the first color filter 371 may be a light-transmitting color filter of a first color that transmits light of a first color, the second color filter 372 may be a light-transmitting color filter of a second color that transmits light of a second color, and the third color filter 373 may be a light-transmitting color filter of a third color that transmits light of a third color. In one embodiment, for example, the first color may be red, the second color may be green, and the third color may be blue, but the present invention is not limited thereto. In an embodiment, the peak wavelength range of red light transmitted through the first color filter 371 may be in the range of approximately 620nm to 750nm, the peak wavelength range of green light transmitted through the second color filter 372 may be in the range of approximately 500nm to 570nm, and the peak wavelength range of blue light transmitted through the third color filter 373 may be in the range of approximately 450nm to 490nm.

[0155] Edges of two color filters 370 adjacent to each other may overlap the black matrix 360. Therefore, the black matrix 360 may effectively prevent color mixing that occurs when light emitted from the light emitting layer 342 of a sub-pixel moves to the color filter 370 of a sub-pixel adjacent thereto.

[0156] An overcoat layer may be disposed on the color filter 370 to planarize a step caused by the color filter 370 and the black matrix 360. Alternatively, the overcoat layer may be omitted.

[0157] The optical wavelength conversion layer QDL is disposed on the color filter layer CFL and may include a first capping layer 351 , a first wavelength conversion layer 352 , a second wavelength conversion layer 353 , a third wavelength conversion layer 354 , a second capping layer 355 , an interlayer organic film 356 , and a third capping layer 357 .

[0158] The first cover layer 351 may be disposed on the color filter layer CFL. The first cover layer 351 is used to prevent external moisture or oxygen from entering the first wavelength conversion layer 352, the second wavelength conversion layer 353, and the third wavelength conversion layer 354 through the color filter layer CFL. The first cover layer 351 may include or be formed of an inorganic film including silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

[0159] The first wavelength conversion layer 352 , the second wavelength conversion layer 353 , and the third wavelength conversion layer 354 may be disposed on the first cover layer 351 .

[0160] The first wavelength conversion layer 352 may be disposed to overlap the first sub-pixel PX1. The first wavelength conversion layer 352 may convert short-wavelength light (such as blue light or ultraviolet light) emitted from the light emitting layer 342 of the first sub-pixel PX1 into light of a first color. In such an embodiment, the first wavelength conversion layer 352 may include a first base resin, a first wavelength converter, and a first scatterer.

[0161] In an embodiment, the first base resin is a material having high light transmittance and high scattering properties for the first wavelength converter and the first scatterer. In an embodiment, for example, the first base resin may include an organic material such as epoxy resin, acrylic resin, cardo-based resin, or imide resin.

[0162] The first wavelength converter can convert or transform the wavelength range of the incident light or the light incident thereon. The first wavelength converter can be a quantum dot, a quantum rod or a phosphor. In an embodiment where the first wavelength converter is a quantum dot, the first wavelength converter can have a specific band gap according to its composition and size as a semiconductor nanocrystal material. Therefore, the first wavelength converter can absorb the incident light and then emit light with a specific wavelength. In an embodiment, the first wavelength converter can have a core-shell structure, which includes a core containing nanocrystals and a shell surrounding the core. In such an embodiment, the nanocrystals constituting the core can include IV group nanocrystals, II-VI group compound nanocrystals, III-V group compound nanocrystals, IV-VI group compound nanocrystals and combinations thereof. The shell can be used as a protective layer for preventing chemical denaturation of the core to maintain semiconductor properties and / or as a charging layer for imparting electrophoretic properties to the quantum dots. The shell can be a single layer or multiple layers, and the shell can include, for example, metal or non-metal oxides, semiconductor compounds or combinations thereof.

[0163] The first scatterer may have a different refractive index than the first base resin and may form an optical interface with the first base resin. In one embodiment, for example, the first scatterer may be light scattering particles. In one embodiment, for example, the first scatterer may be metal oxide particles, such as titanium oxide (TiO 2 ) particles, silicon oxide (SiO 2 ) particles, zirconium oxide (ZrO 2 ) particles, aluminum oxide (Al 2 O 3 ) particles, indium oxide (In 2 O 3 ) particles or zinc oxide (ZnO) particles. Optionally, the first scatterer may be organic particles, such as acrylic resin particles or polyurethane resin particles.

[0164] The first scatterer may scatter incident light in any direction without substantially changing the wavelength of light passing through the first wavelength conversion layer 352. Therefore, the length of the path of light passing through the first wavelength conversion layer 352 may be increased, thereby increasing the color conversion efficiency of the first wavelength converter.

[0165] In one embodiment, the first wavelength conversion layer 352 may overlap the first color filter 371. Therefore, a portion of the short wavelength light (such as blue light or ultraviolet light) provided by the first subpixel PX1 may not be converted into the light of the first color by the first wavelength converter, but may be transmitted through the first wavelength conversion layer 352 without wavelength conversion. However, the short wavelength light (such as blue light or ultraviolet light) that is not converted by the first wavelength conversion layer 352 and is incident on the first color filter 371 may not be transmitted through the first color filter 371. In such an embodiment, the light of the first color converted by the first wavelength conversion layer 352 may be transmitted through the first color filter 371 and emitted toward the second substrate 112.

[0166] The second wavelength conversion layer 353 may be disposed to overlap with the second sub-pixel PX2. The second wavelength conversion layer 353 may convert short wavelength light (such as blue light or ultraviolet light) emitted from the light emitting layer 342 of the second sub-pixel PX2 into light of a second color. In such an embodiment, the second wavelength conversion layer 353 may include a second base resin, a second wavelength converter, and a second scatterer. Since the second base resin, the second wavelength converter, and the second scatterer of the second wavelength conversion layer 353 are substantially the same as those already described in the first wavelength conversion layer 352, any repeated detailed description thereof will be omitted. In an embodiment in which the first wavelength converter and the second wavelength converter are quantum dots, the diameter of the second wavelength converter may be smaller than the diameter of the first wavelength converter.

[0167] In an embodiment, the second wavelength conversion layer 353 may overlap with the second color filter 372. Therefore, a portion of the short wavelength light (such as blue light or ultraviolet light) provided by the second subpixel PX2 may not be converted into the light of the second color by the second wavelength converter, but may be directly transmitted through the second wavelength conversion layer 353. However, the short wavelength light (such as blue light or ultraviolet light) that is not converted by the second wavelength conversion layer 353 and incident on the second color filter 372 may not be transmitted through the second color filter 372. In such an embodiment, the light of the second color converted by the second wavelength conversion layer 353 may be transmitted through the second color filter 372 and emitted toward the second substrate 112.

[0168] The third wavelength conversion layer 354 may be disposed to overlap with the third sub-pixel PX3. The third wavelength conversion layer 354 may convert short-wavelength light (such as blue light or ultraviolet light) emitted from the light-emitting layer 342 of the third sub-pixel PX3 into light of a third color. In such an embodiment, the third wavelength conversion layer 354 may include a third base resin and a third scatterer. Since the third base resin and the third scatterer of the third wavelength conversion layer 354 are substantially the same as those already described in the first wavelength conversion layer 352, any repeated detailed description thereof will be omitted.

[0169] In an embodiment, the third wavelength conversion layer 354 may overlap the third color filter 373. Therefore, short wavelength light (such as blue light or ultraviolet light) provided from the third subpixel PX3 may be directly transmitted through the third wavelength conversion layer 354, and light having passed through the third wavelength conversion layer 354 may be transmitted through the third color filter 373 and emitted toward the second substrate 112.

[0170] The second cover layer 355 may be disposed on the first wavelength conversion layer 352, the second wavelength conversion layer 353, the third wavelength conversion layer 354, and the first cover layer 351 exposed without being covered by the first wavelength conversion layer 352, the second wavelength conversion layer 353, and the third wavelength conversion layer 354. The second cover layer 355 serves to prevent external moisture or oxygen from entering the first wavelength conversion layer 352, the second wavelength conversion layer 353, and the third wavelength conversion layer 354. The second cover layer 355 may include or be formed of an inorganic film including silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

[0171] The interlayer organic film 356 may be disposed on the second cover layer 355. The interlayer organic film 356 may be a planarization layer for planarizing a step caused by the first wavelength conversion layer 352, the second wavelength conversion layer 353, and the third wavelength conversion layer 354. The interlayer organic film 356 may be an organic film such as an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, or a polyimide resin film.

[0172] The third capping layer 357 may be disposed on the interlayer organic film 356. The third capping layer 357 may include or be formed of an inorganic film including silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

[0173] The filler FL may be disposed between the encapsulation layer 345 disposed on the first substrate 111 and the third cover layer 357 disposed on the second substrate 112. The filler FL may include or be made of a material having a buffering function. In one embodiment, for example, the filler FL may be an organic film such as an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, or a polyimide resin film.

[0174] In an implementation, a sealing material for attaching the first substrate 111 to the second substrate 112 may be provided in the non-display region of the display panel 110, and the filler FL may be surrounded by the sealing material when viewed on a plane. The sealing material may be a glass frit or a sealant.

[0175] According to the implementation mode, Fig. 9 As shown in , the first subpixel PX1, the second subpixel PX2, and the third subpixel PX3 emit short wavelength light, such as blue light or ultraviolet light. In such an embodiment, the light of the first subpixel PX1 can be converted into light of a first color by the first wavelength conversion layer 352 and then output through the first color filter 371, the light of the second subpixel PX2 can be converted into light of a second color by the second wavelength conversion layer 353 and then output through the second color filter 372, and the light of the third subpixel PX3 can be output through the third wavelength conversion layer 354 and the third color filter 373, so that white light can be output.

[0176] In an embodiment, if Fig. 9 As shown in the figure, sub-pixels PX1, PX2 and PX3 are formed in a top emission manner, in which light is emitted toward the second substrate 112, that is, in an upward direction, so that a thermal radiation film 130 including an opaque material such as graphite or aluminum can be set on one surface of the first substrate 111.

[0177] Fig.10 is a cross-sectional view showing an embodiment of a first vibration generator, and Fig.11A and Fig. 11B The display panel is shown by Fig.10 A view of an embodiment of the vibration of the first vibration generator shown in FIG. Fig.10 , Fig.11A and Fig. 11B Shown corresponding to Fig. 6A Magnified view of area A in FIG.

[0178] Reference Fig.10 , Fig.11A and Fig. 11B The first vibration generator 210 may be an exciter for vibrating the display panel 110 by generating a magnetic force using the first voice coil 213. In an implementation, a hole may be defined or formed in a region of the control circuit board 160 where the first vibration generator 210 is disposed.

[0179] The first vibration generator 210 may include a first magnet 211 , a bobbin 212 , a first voice coil 213 , a damper 214 , and a lower plate 215 .

[0180] The first magnet 211 may be a permanent magnet, and a sintered magnet such as barium ferrite may be used as the first magnet 211. The first magnet 211 may be ferrosoferric oxide (Fe 2 O 3 ) magnet, barium carbonate (BaCO 3 ) magnet, neodymium magnet, or alloy casting magnet of strontium ferrite, aluminum (Al), nickel (Ni) or cobalt (Co) with improved magnetic properties, but not limited thereto. The material of the neodymium magnet may be, for example, neodymium iron boron (Nd-Fe-B).

[0181] The first magnet 211 may include a plate 211a, a central protrusion portion 211b protruding from the center of the plate 211a, and a side wall portion 211c protruding from the edge of the plate 211a. The central protrusion portion 211b and the side wall portion 211c may be spaced a predetermined distance from each other, and thus a predetermined space may be formed between the central protrusion portion 211b and the side wall portion 211c. In an embodiment in which the first magnet 211 has a cylindrical shape, a circular space may be formed at the bottom surface of the cylindrical shape.

[0182] The central protrusion portion 211b of the first magnet 211 may have N-pole magnetism, and the plate 211a and the side wall portion 211c may have S-pole magnetism, thereby generating an external magnetic field between the central protrusion portion 211b of the first magnet 211 and the plate 211a and between the central protrusion portion 211b of the first magnet 211 and the side wall portion 211c.

[0183] The bobbin 212 may be cylindrical in shape. The central protrusion 211b of the first magnet 211 may be disposed inside the bobbin 212. In an embodiment, the bobbin 212 may be disposed around the central protrusion 211b of the first magnet 211. In such an embodiment, the side wall portion 211c of the first magnet 211 may be disposed outside the bobbin 212. In such an embodiment, the side wall portion 211c of the first magnet 211 may be disposed around the bobbin 212. A space may be formed between the bobbin 212 and the central protrusion 211b of the first magnet 211 and between the bobbin 212 and the side wall portion 211c of the first magnet 211.

[0184] The bobbin 212 may include or be formed of: pulp or paper processing material; aluminum, magnesium or their alloys; synthetic resins such as polypropylene; or polyamide-based fibers. One end of the bobbin 212 may be bonded to the thermal radiation film 130 by an adhesive member. The adhesive member may be a double-sided tape.

[0185] The first voice coil 213 is wound (or coiled) on the outer circumferential surface of the bobbin 212. One end of the first voice coil 213 adjacent to one end of the bobbin 212 may receive a first first driving voltage, and the other end of the first voice coil 213 adjacent to the other end of the bobbin 212 may receive a second first driving voltage. Therefore, a current may flow through the first voice coil 213 according to the first first driving voltage and the second first driving voltage. An applied magnetic field may be generated around the first voice coil 213 according to the current flowing through the first voice coil 213. In such an embodiment, the direction of the current flowing through the first voice coil 213 when the first first driving voltage is a positive polarity voltage and the second first driving voltage is a negative polarity voltage is opposite to the direction of the current flowing through the first voice coil 213 when the first first driving voltage is a negative polarity voltage and the second first driving voltage is a positive polarity voltage. Therefore, the N pole and the S pole of the applied magnetic field formed around the first voice coil 213 are changed according to the alternating current ("AC") driving of the first first driving voltage and the second first driving voltage, and thereby the attractive force and the repulsive force are alternately applied to the first magnet 211 and the first voice coil 213. Fig.11A and Fig. 11B As shown in FIG. 1 , the bobbin 212 around which the first voice coil 213 is wound may reciprocate in the third direction (Z-axis direction). Therefore, the display panel 110 and the heat radiation film 130 vibrate in the third direction (Z-axis direction), and thus, sound may be output.

[0186] The damper 214 is disposed between a portion of the upper side of the bobbin 212 and the side wall portion 211c of the first magnet 211. The damper 214 adjusts the vertical vibration of the bobbin 212 while contracting and relaxing according to the vertical movement of the bobbin 212. In such an embodiment, since the damper 214 is connected to the bobbin 212 and the side wall portion 211c of the first magnet 211, the vertical movement of the bobbin 212 can be limited by the restoring force of the damper 214. In one embodiment, for example, when the bobbin 212 vibrates at a predetermined height or higher, or at a predetermined height or lower, the bobbin 212 can be restored to its original position by the restoring force of the damper 214.

[0187] The lower plate 215 may be disposed on a lower surface of the first magnet 211. The lower plate 215 may be integrally formed with the first magnet 211 as a single unitary unit, or may be formed independently of the first magnet 211. In an embodiment, in the case where the lower plate 215 is formed independently of the first magnet 211, the first magnet 211 may be attached to the lower plate 215 by an adhesive member such as a double-sided tape.

[0188] The lower plate 215 may be fixed to the control circuit board 160 by a fixing member 216 such as a screw. Therefore, the first magnet 211 of the first vibration generator 210 may be fixed to the control circuit board 160 .

[0189] In an embodiment, the first magnet 211 and the lower plate 215 of the first vibration generator 210 may be fixed to the control circuit board 160, but the embodiments of the present invention are not limited thereto. Optionally, the first magnet 211 and the lower plate 215 of the first vibration generator 210 may be fixed to a system circuit board, a power circuit board, or a virtual circuit board, instead of being fixed to the control circuit board 160. A virtual circuit board refers to a circuit board to which the first vibration generator 210 is fixed and in which no other circuits are provided. The virtual circuit board may be a flexible printed circuit board or a printed circuit board. Optionally, the first magnet 211 and the lower plate 215 of the first vibration generator 210 may be fixed to the lower cover 180 instead of being fixed to the control circuit board 160.

[0190] Fig.12 is a perspective view showing an embodiment of a second vibration generator, Fig.13 It is along Fig.12 A cross-sectional view taken along III-III′ of FIG. Fig.14A is a schematic diagram illustrating a method of vibrating a vibration layer disposed between a first branch electrode and a second branch electrode of a second vibration generator, and Fig. 14B and Fig. 14C The display panel is shown by Fig.12 A side view of the vibration of the second vibration generator shown in FIG.

[0191] Reference Fig.12 and Fig.13 , the second vibration generator 220 may include a piezoelectric element that vibrates the display panel 110 by contracting and expanding according to an applied voltage or a voltage applied thereto. In one embodiment, for example, the second vibration generator 220 may include a vibration layer 511 , a first electrode 512 , and a second electrode 513 .

[0192] The first electrode 512 may include a first dry electrode 5121 and a first branch electrode 5122. The first dry electrode 5121 may be disposed only on one side surface of the vibration layer 511, or may be disposed on a first electrode 5122. Fig.12 . The first dry electrode 5121 may be disposed on a plurality of side surfaces of the vibration layer 511 as shown in . The first dry electrode 5121 may be disposed on an upper surface of the vibration layer 511. The first branch electrodes 5122 may branch from the first dry electrode 5121. The first branch electrodes 5122 may be arranged in parallel with each other.

[0193] The second electrode 513 may include a second dry electrode 5131 and a second branch electrode 5132. The second dry electrode 5131 may be disposed on the other side surface of the vibration layer 511, or may be disposed on the Fig.12 On multiple side surfaces of the vibration layer 511 shown in FIG. Fig.13 As shown in , the second dry electrode 5131 may be disposed on any one of the plurality of side surfaces on which the first dry electrode 5121 is not disposed. The second dry electrode 5131 may be disposed on the upper surface of the vibration layer 511. The first dry electrode 5121 and the second dry electrode 5131 may not overlap each other. The second branch electrode 5132 may branch from the second dry electrode 5131. The second branch electrodes 5132 may be arranged in parallel with each other.

[0194] The first branch electrode 5122 and the second branch electrode 5132 may be arranged parallel to each other in the horizontal direction (X-axis direction or Y-axis direction). In an embodiment, the first branch electrode 5122 and the second branch electrode 5132 may be alternately arranged in the vertical direction (Z-axis direction). In such an embodiment, the first branch electrode 5122 and the second branch electrode 5132 may be repeatedly arranged in the vertical direction (Z-axis direction) in the order of the first branch electrode 5122, the second branch electrode 5132, the first branch electrode 5122 and the second branch electrode 5132.

[0195] The first electrode 512 and the second electrode 513 may be connected to a metal wire or pad electrode of the sound circuit board 250 .

[0196] The vibration layer 511 may be a piezoelectric element that is deformed based on a first driving voltage applied to the first electrode 512 and a second driving voltage applied to the second electrode 513. In an embodiment, the vibration layer 511 may be at least one of a polyvinylidene fluoride ("PVDF") film, a piezoelectric body of lead zirconate titanate ("PZT"), and an electroactive polymer.

[0197] Since the manufacturing temperature of the vibration layer 511 is high, each of the first electrode 512 and the second electrode 513 may include silver (Ag) or an alloy of silver (Ag) and palladium (Pd) having a high melting point, or be formed of silver (Ag) or an alloy of silver (Ag) and palladium (Pd) having a high melting point. In an embodiment in which each of the first electrode 512 and the second electrode 513 includes an alloy of silver (Ag) and palladium (Pd) or is formed of an alloy of silver (Ag) and palladium (Pd) to increase the melting point of each of the first electrode 512 and the second electrode 513, the content of silver (Ag) may be higher than the content of palladium (Pd).

[0198] The vibration layer 511 may be disposed between the first branch electrode 5122 and the second branch electrode 5132. The vibration layer 511 contracts and expands according to a difference between a first driving voltage applied to the first branch electrode 5122 and a second driving voltage applied to the second branch electrode 5132.

[0199] In an embodiment, if Fig.13 As shown in , when the polarity direction of the vibration layer 511 disposed between the first branch electrode 5122 and the second branch electrode 5132 disposed below the first branch electrode 5122 is an upward direction (↑), the vibration layer 511 has a positive polarity in an upper region adjacent to the first branch electrode 5122, and has a negative polarity in a lower region adjacent to the second branch electrode 5132. In such an embodiment, as Fig.13 As shown in , when the polarity direction of the vibration layer 511 disposed between the second branch electrode 5132 and the first branch electrode 5122 disposed below the second branch electrode 5132 is a downward direction (↓), the vibration layer 511 has a negative polarity in an upper region adjacent to the second branch electrode 5132, and has a positive polarity in a lower region adjacent to the first branch electrode 5122. The polarity direction of the vibration layer 511 may be determined by a polarization process in which an electric field is applied to the vibration layer 511 using the first branch electrode 5122 and the second branch electrode 5132.

[0200] In an embodiment, if Fig.14AAs shown in , in the case where the polarity direction of the vibration layer 511 disposed between the first branch electrode 5122 and the second branch electrode 5132 disposed below the first branch electrode 5122 is an upward direction (↑), when the first second driving voltage of positive polarity is applied to the first branch electrode 5122 and the second second driving voltage of negative polarity is applied to the second branch electrode 5132, the vibration layer 511 may be contracted by the first force F1. The first force F1 may be a contraction force. In such an embodiment, when the first second driving voltage of negative polarity is applied to the first branch electrode 5122 and the second second driving voltage of positive polarity is applied to the second branch electrode 5132, the vibration layer 511 may be expanded by the second force F2. The second force F2 may be an extension force.

[0201] In such an embodiment, when the polarity direction of the vibration layer 511 disposed between the second branch electrode 5132 and the first branch electrode 5122 disposed below the second branch electrode 5132 is a downward direction (↓), when the first second driving voltage of positive polarity is applied to the second branch electrode 5132 and the second second driving voltage of negative polarity is applied to the first branch electrode 5122, the vibration layer 511 may expand by an extension force. In such an embodiment, when the first second driving voltage of negative polarity is applied to the second branch electrode 5132 and the second second driving voltage of positive polarity is applied to the first branch electrode 5122, the vibration layer 511 may contract by a contraction force. The second force F2 may be a contraction force.

[0202] According to the implementation mode, Fig.12 and Fig.13 As shown in FIG. 2 , when the second driving voltage applied to the first electrode 512 and the second driving voltage applied to the second electrode 513 are repeated alternately with positive polarity and negative polarity, the vibration layer 511 repeatedly contracts and expands. Therefore, the second vibration generator 220 vibrates.

[0203] like Fig. 14B and Fig. 14C As shown, in an embodiment where the second vibration generator 220 is disposed on one surface of the heat radiation film 130, when the vibration layer 511 of the second vibration generator 220 contracts and expands, the display panel 110 vibrates downward and upward by stress. In such an embodiment, since the display panel 110 can be vibrated by the second vibration generator 220, the display device 10 can output sound.

[0204] Fig.15 is a bottom view showing an alternative embodiment of a display device, Fig.16 Is shown in the omitted Fig.15 A bottom view of an embodiment of a display device with a lower cover and a control circuit board in the state, and Fig.17 is along Fig.15and Fig.16 A cross-sectional view taken along line IV-IV′.

[0205] In addition to the flexible film 122 being bent toward the lower portion of the lower cover 180 and the source circuit board 140 being disposed on one surface of the lower cover 180, Figures 15 to 17 The embodiment shown in Figure 3 , Figure 4 Same as the embodiment shown in FIG. 6 . Figures 15 to 17 The same or similar elements shown in FIG. 1 have been used to describe Figure 3 , Figure 4 6, and any repeated detailed description thereof will be omitted or simplified below, and the detailed description will be the same as that of FIG. Figure 3 , Figure 4 The difference from the embodiment shown in FIG. 6 .

[0206] Reference Figures 15 to 17 In an embodiment, the flexible film 122 may be bent toward the lower portion of the lower cover 180, and thus the source circuit board 140 is disposed on one surface of the lower cover 180. Therefore, the cable 150 connecting the source circuit board 140 and the control circuit board 160 may be directly connected without being disposed through the first cable hole CH1 defined through the lower cover 180.

[0207] In such an embodiment, the sound circuit board 250 connected to the second vibration generator 220 can be connected to the second second connector 152b of the control circuit board 160 through the second cable hole CH2 defined through the lower cover 180. In such an embodiment, the second vibration generator 220 can be electrically connected to the control circuit board 160 through the sound circuit board 250. Therefore, the second sound signal of the sound driving circuit 171 can be transmitted to the second vibration generator 220 through the sound circuit board 250. The second cable hole CH2 can be disposed adjacent to a side of the control circuit board 160 adjacent to the sound driving circuit 171. In one embodiment, for example, the second cable hole CH2 can be disposed adjacent to the right side of the control circuit board 160.

[0208] According to the implementation mode, Figures 15 to 17 As shown in the figure, the sound circuit board 250 connected to the second vibration generator 220 is connected to the control circuit board 160 through the second cable hole CH2 defined through the lower cover 180, so that even when the second vibration generator 220 is set on one surface of the heat radiation film 130 and the control circuit board 160 is set on one surface of the lower cover 180, the control circuit board 160 and the second vibration generator 220 can be easily electrically connected to each other.

[0209] Fig.18 is a bottom view showing another alternative embodiment of the display device, Fig.19 is shown in the omitted Fig.18 A bottom view of an embodiment of a display device with a lower cover and a control circuit board in the state, and Fig. 20 is along Fig.18 and Fig.19 A cross-sectional view taken along line VV′.

[0210] In addition to the bobbin 212 of the first vibration generator 210 being disposed on the second vibration generator 220, Figures 18 to 20 The embodiment shown in Figure 3 , Figure 4 Same as the embodiment shown in FIG. 6 . Figures 18 to 20 The same or similar elements shown in FIG. 1 have been used to describe Figure 3 , Figure 4 6, and any repeated detailed description thereof will be omitted or simplified hereinafter. Fig.18 and Fig.19 The cross-sectional view taken along the line VI-VI′ shown in FIG. Figure 7 The cross-sectional views shown in FIG. 1 are the same, and any repeated detailed description thereof will be omitted.

[0211] Reference Figures 18 to 20 In an embodiment, the second vibration generator 220 may be attached to one surface of the heat radiation film 130 by an adhesive member such as a double-sided tape. The bobbin 212 of the first vibration generator 210 may be attached to one surface of the second vibration generator 220 by an adhesive member such as a double-sided tape.

[0212] like Fig. 20 As shown in , the sound circuit board 250 may be disposed on one surface of the second vibration generator 220 without overlapping the bobbin 212 of the first vibration generator 210. Alternatively, the bobbin 212 of the first vibration generator 210 may be disposed on the sound circuit board 250. The sound circuit board 250 disposed on one surface of the second vibration generator 220 may overlap with the side wall portion 211c of the first magnet 211 in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction).

[0213] According to the implementation mode, Figures 18 to 20As shown in , since the first vibration generator 210 and the second vibration generator 220 of the sound generator 200 are arranged to overlap each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), the first vibration generator 210 and the second vibration generator 220 can vibrate at the same position of the display panel 110 to output sound. In such an embodiment, the first vibration generator 210 and the second vibration generator 220 can vibrate the same vibration plane at the same time to output sound. In this case, the first vibration generator 210 and the second vibration generator 220 can vibrate the display panel 110 by allocating the sound bandwidth. In one embodiment, for example, the first vibration generator 210 can vibrate the display panel 110 to output the sound of the high frequency band, and the second vibration generator 220 can vibrate the display panel 110 to output the sound of the mid-frequency band. Therefore, in such an embodiment, the sound generator 200 can provide high-quality sound with both the mid-frequency band and the high frequency band.

[0214] Fig.21 is a bottom view showing another alternative embodiment of the display device, Fig. 22 is shown in the omitted Fig.21 A bottom view of an example of a display device in a state where a lower cover and a control circuit board are removed, and Fig.23 is along Fig.21 and Fig. 22 A cross-sectional view taken along line VII-VII′.

[0215] In addition to the sound generator 200, the third vibration generator 230 is also included. Figures 21 to 23 The embodiment shown in Figure 3 , Figure 4 Same as the embodiment shown in FIG. 6 . Figure 21 to Figure 23 The same or similar elements shown in FIG. 1 have been used to describe Figure 3 , Figure 4 6, and any repeated detailed description thereof will be omitted or simplified hereinafter. Fig.21 and Fig. 22 The cross-sectional view taken along the line VIII-VIII′ shown in FIG. Figure 7 The cross-sectional views shown in FIG. 1 are the same, and any repeated detailed description thereof will also be omitted.

[0216] Reference Figure 21 to Figure 23 In an embodiment, the sound generator 200 includes a first vibration generator 210, a second vibration generator 220 and a third vibration generator 230. In such an embodiment, as described above with reference to Fig.10 , Fig.11A and Fig. 11BAs described above, the first vibration generator 210 may be an exciter for vibrating the display panel 110 by generating a magnetic force using the first voice coil 213. In such an embodiment, as described above with reference to Fig.12 , Fig.13 , FIG. 14A to FIG. 14C As described above, the second vibration generator 220 may include a piezoelectric element that contracts and expands according to an applied voltage to vibrate the display panel 110. The third vibration generator 230 may be a linear resonant actuator ("LRA") or an eccentric rotating mass ("ERM") actuator that vibrates the display panel 110D by generating a magnetic force using a second voice coil.

[0217] The third vibration generator 230 is as Fig.24 In the embodiment of the linear resonant actuator LRA shown in , the third vibration generator 230 may include a lower chassis 611, a flexible circuit board 612, a second voice coil 613, a second magnet 614, a spring 615, and an upper chassis 616. The lower chassis 611 and the upper chassis 616 may include or be formed of a metal material. The flexible circuit board 612 is disposed on one surface of the lower chassis 611 facing the upper chassis 616 and is connected to the first sound line WL1 and the second sound line WL2. The second voice coil 613 may be connected to one surface of the flexible circuit board 612 facing the upper chassis 616. Therefore, one end of the second voice coil 613 may be electrically connected to the first sound line WL1, and the other end thereof may be electrically connected to the second sound line WL2. The second magnet 614 may be a permanent magnet, and a voice coil groove 614a for accommodating the second voice coil 613 may be disposed on one surface of the second magnet 614 facing the second voice coil 613. The spring 615 is disposed between the second magnet 614 and the upper chassis 616 .

[0218] The direction of the current flowing through the second voice coil 613 of the third vibration generator 230 can be controlled according to the first third driving voltage applied to the first sound line WL1 and the second third driving voltage applied to the second sound line WL2. According to the current flowing through the second voice coil 613, an applied magnetic field can be formed around the second voice coil 613. In such an embodiment, the direction of the current flowing through the second voice coil 613 when the first third driving voltage is a positive polarity voltage and the second third driving voltage is a negative polarity voltage is opposite to the direction of the current flowing through the second voice coil 613 when the second third driving voltage is a positive polarity voltage and the first third driving voltage is a negative polarity voltage. According to the AC drive of the first third driving voltage and the second third driving voltage, the attraction and repulsion forces are alternately applied to the second magnet 614 and the second voice coil 613. Therefore, the second magnet 614 can reciprocate between the second voice coil 613 and the upper chassis 616 through the spring 615, and thus the vibration surface provided on the upper chassis 616, that is, the display panel 110 can vibrate, thereby outputting sound. The upper chassis 616 may be a surface disposed closest to the display panel 110 .

[0219] The first vibration generator 210 may act as a mid-range generator for outputting a sound of a mid-range band. The second vibration generator 220 may act as a high-range generator for outputting a sound of a high-frequency band higher than the mid-range band of the first vibration generator 210. The third vibration generator 230 may act as a bass generator for outputting a sound of a low-frequency band. In such an embodiment, the display device 10 may provide a sound of a high-frequency band that may not be effectively provided by the first vibration generator 210 and the third vibration generator 230 by using the second vibration generator 220. In such an embodiment, the display device 10 may provide a sound of a mid-range band that may not be effectively provided by the second vibration generator 220 and the third vibration generator 230 by using the first vibration generator 210. In such an embodiment, the display device 10 may provide a sound of a low-frequency band that may not be effectively provided by the first vibration generator 210 and the second vibration generator 220 by using the third vibration generator 230.

[0220] In an embodiment, the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 of the sound generator 200 are arranged to overlap each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), so that the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 simultaneously vibrate the display panel 110 to output sound. In such an embodiment, the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 simultaneously vibrate the same vibration surface to output sound. In such an embodiment, the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 can vibrate the display panel 110 by allocating the sound bandwidth. The first vibration generator 210 can vibrate the display panel 110 to output high-frequency sound, the second vibration generator 220 can vibrate the display panel 110 to output medium-frequency sound, and the third vibration generator 230 can vibrate the display panel 110 to output low-frequency sound. Therefore, the sound generator 200 can provide high-quality sound with low frequency band, middle frequency band and high frequency band. Therefore, the user can hear high-quality sound, and in such an embodiment, the speaker 103a of the woofer speaker for the machine support 103 can be omitted, thereby reducing the manufacturing cost of the machine support 103.

[0221] The bobbin 212 of the first vibration generator 210 may be in a cylindrical shape, and the second vibration generator 220 and the third vibration generator 230 may be disposed inside the bobbin 212 to be surrounded by the bobbin 212. The third vibration generator 230 may be disposed on one surface of the second vibration generator 220.

[0222] In an embodiment, the sound circuit board 250 may be connected not only to the second vibration generator 220 but also to the third vibration generator 230. In such an embodiment, the sound circuit board 250 may include a first pad and a second pad connected to the first electrode 512 and the second electrode 513 of the second vibration generator 220. The sound circuit board 250 may also include a third pad and a fourth pad connected to the first sound line WL1 and the second sound line WL2 of the third vibration generator 230. The first second driving voltage and the second second driving voltage of the second sound signal of the sound driving circuit 171 may be applied to the first pad and the second pad. The first third driving voltage and the second third driving voltage of the third sound signal of the sound driving circuit 171 may be applied to the third pad and the fourth pad.

[0223] The sound circuit board 250 and the third vibration generator 230 may be disposed on the second vibration generator 220. Fig.23As shown in FIG. 2 , the third vibration generator 230 covers the sound circuit board 250 provided on the second vibration generator 220. Alternatively, the third vibration generator 230 may be provided only on the second vibration generator 220 on which the sound circuit board 250 is not provided.

[0224] The sound driving circuit 171 can generate a first sound signal including a first first driving voltage and a second first driving voltage for driving the first vibration generator 210 according to the sound control signal, can generate a second sound signal including a first second driving voltage and a second second driving voltage for driving the second vibration generator 220 according to the sound control signal, and can generate a third sound signal including a first third driving voltage and a second third driving voltage for driving the third vibration generator 230 according to the sound control signal.

[0225] The first vibration generator 210 may receive a first sound signal including a first first driving voltage and a second first driving voltage from the sound driving circuit 171. The first vibration generator 210 may output sound by vibrating the display panel 110 according to the first first driving voltage and the second first driving voltage. In such an embodiment where the sound driving circuit 171 and the lower plate 215 of the first vibration generator 210 are disposed on the control circuit board 160, the sound driving circuit 171 may be electrically connected to the first voice coil 213 of the first vibration generator 210 through a metal wire of the control circuit board 160.

[0226] The second vibration generator 220 may receive a second sound signal including the first second driving voltage and the second second driving voltage from the sound driving circuit 171. The second vibration generator 220 may output sound by vibrating the display panel 110 according to the first second driving voltage and the second second driving voltage.

[0227] The third vibration generator 230 may receive a third sound signal including the first third driving voltage and the second third driving voltage from the sound driving circuit 171. The third vibration generator 230 may output sound by vibrating the display panel 110 according to the first third driving voltage and the second third driving voltage.

[0228] In an embodiment, if Figure 21 to Figure 23 As shown in , the sound driving circuit 171 may be disposed on the control circuit board 160, the second vibration generator 220 may be disposed on one surface of the heat radiation film 130, and the third vibration generator 230 may be disposed on one surface of the second vibration generator 220. In such an embodiment, the second sound signal and the third sound signal of the sound driving circuit 171 may be transmitted to the second vibration generator 220 and the third vibration generator 230 through the cable 150, the source circuit board 140, and the sound circuit board 250.

[0229] According to the implementation mode, Figure 21 to Figure 23 As shown in , since the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 of the sound generator 200 are arranged to overlap each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 can simultaneously vibrate the display panel 110 to output sound. Therefore, since the first vibration generator 210, the second vibration generator 220, and the third vibration generator 230 can vibrate the display panel 110 by allocating the sound bandwidth, the sound generator 200 can provide high-quality sound with low frequency bands, middle frequency bands, and high frequency bands.

[0230] Fig.25 is a bottom view showing another alternative embodiment of the display device, Fig.26 Is shown omitted Fig.25 A bottom view of an embodiment of a display device including a lower cover and a control circuit board, and Fig. 27 is along Fig.25 and Fig.26 A cross-sectional view taken along line IX-IX′.

[0231] In addition to the second vibration generator 220 and the third vibration generator 230 being arranged parallel to each other on a plane and not overlapping each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), Figure 25 to Figure 27 The embodiment shown in Figure 21 to Figure 23 The embodiment shown in is the same. Figure 25 to Figure 27 The same or similar elements shown in FIG. 1 have been used to describe Figure 21 to Figure 23 The same reference numerals as those of the embodiments of the present invention are used to mark the same reference numerals as those of the embodiments of the present invention, and any repeated detailed description thereof will be omitted or simplified hereinafter. In addition to the second vibration generator 220 and the third vibration generator 230 being arranged parallel to each other on a plane inside the bobbin 212, along Fig.25 and Fig.26 The cross-sectional view taken along the line XX′ in FIG. Figure 7 The cross-sectional views in the illustrated embodiments are the same, and any repeated detailed description thereof will be omitted.

[0232] Reference Figure 25 to Figure 27 In an embodiment, the second vibration generator 220 and the third vibration generator 230 may be arranged adjacent to each other in one direction, for example, in the second direction (Y-axis direction). In such an embodiment, one side surface of the second vibration generator 220 and one side surface of the third vibration generator 230 may be disposed adjacent to each other. Figure 25 to Figure 27As shown in FIG. 1 , there is a gap between one side of the second vibration generator 220 and one side of the third vibration generator 230 adjacent to each other, but the present invention is not limited thereto. Alternatively, one side of the second vibration generator 220 and one side of the third vibration generator 230 adjacent to each other may contact each other. The second vibration generator 220 and the third vibration generator 230 may be elongated in another direction, for example, in the first direction (X-axis direction). One direction and the other direction may be directions intersecting each other.

[0233] The second vibration generator 220 and the third vibration generator 230 may be disposed inside the bobbin 212 of the first vibration generator 210 to be surrounded by the bobbin 212. Each of the second vibration generator 220 and the third vibration generator 230 may overlap the first vibration generator 210. In an embodiment, each of the second vibration generator 220 and the third vibration generator 230 may overlap the first magnet 211 of the first vibration generator 210.

[0234] The sound circuit board 250 may be connected to the first electrode 512 and the second electrode 513 located on one surface of the second vibration generator 220, and may be connected to the first sound line WL1 and the second sound line WL2 located on one surface of the third vibration generator 230. Since the second vibration generator 220 and the third vibration generator 230 are arranged adjacent to each other in parallel in one direction, one end of the sound circuit board 250 may be divided into a first connection portion 250a and a second connection portion 250b. The first connection portion 250a may include a first pad and a second pad connected to the first electrode 512 and the second electrode 513 of the second vibration generator 220. The second connection portion 250b may include a third pad and a fourth pad connected to the first sound line WL1 and the second sound line WL2 of the third vibration generator 230. The first and second driving voltages and the second second driving voltages of the second sound signal of the sound driving circuit 171 can be applied to the first and second pads of the first connecting part 250a, and the first and third driving voltages and the second third driving voltages of the third sound signal of the sound driving circuit 171 can be applied to the third and fourth pads of the second connecting part 250b.

[0235] In an embodiment, if Fig.26 As shown in FIG. 1 , the first connection portion 250a and the second connection portion 250b are separated (or branched) from the sound circuit board 250 outside the bobbin 212 of the first vibration generator 210, but the present invention is not limited thereto. Alternatively, the first connection portion 250a and the second connection portion 250b may be separated from the sound circuit board 250 inside the bobbin 212 of the first vibration generator 210.

[0236] According to the implementation mode, Figure 25 to Figure 27As shown in FIG. 1 , the first vibration generator 210 and the second vibration generator 220 of the sound generator 200 and the first vibration generator 210 and the third vibration generator 230 of the sound generator 200 are respectively arranged to overlap each other in the thickness direction of the display panel 110, that is, in the third direction (Z-axis direction), so that the first vibration generator 210, the second vibration generator 220 and the third vibration generator 230 can simultaneously vibrate the display panel 110 to output sound. Therefore, since the first vibration generator 210, the second vibration generator 220 and the third vibration generator 230 can vibrate the display panel 110 by allocating the sound bandwidth, the sound generator 200 can provide high-quality sound with low frequency bands, medium frequency bands and high frequency bands.

[0237] As described above, according to an embodiment of the display device, the sound generator outputs sound by using the display panel as a vibration plate, and thus the sound can be output in the front direction of the display device, thereby improving the sound quality. In such an embodiment, by including the sound generator, a separate speaker provided on the lower surface or one side of a conventional display panel can be omitted.

[0238] According to an embodiment of the display device, the first vibration generator and the second vibration generator of the sound generator are arranged to overlap each other in the thickness direction of the display panel, and thus the first vibration generator and the second vibration generator can simultaneously vibrate the display panel to output sound. Therefore, the first vibration generator and the second vibration generator can vibrate the display panel by allocating the sound bandwidth, and thus the sound generator can provide high-quality sound with both a mid-frequency band and a high-frequency band.

[0239] In an embodiment, the first vibration generator, the second vibration generator, and the third vibration generator are arranged to overlap each other in the thickness direction of the display panel, and thus the first vibration generator, the second vibration generator, and the third vibration generator can simultaneously vibrate the display panel to output sound. Therefore, the first vibration generator, the second vibration generator, and the third vibration generator can vibrate the display panel by allocating the sound bandwidth, and thus the sound generator can provide high-quality sound with low frequency bands, medium frequency bands, and high frequency bands.

[0240] In an embodiment, the sound circuit board connected to the second vibration generator may be disposed between the heat radiation film and the bobbin of the first vibration generator, or may be disposed in the receiving groove of the heat radiation film. Therefore, even when the second vibration generator is surrounded by the bobbin of the first vibration generator, the sound circuit board may electrically connect the second vibration generator and the source circuit board.

[0241] The present invention should not be interpreted as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0242] While the invention has been particularly shown and described with reference to certain embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims.

Claims

1. A display device, comprising: The display panel comprises a first substrate and a light emitting element layer arranged on the first substrate; as well as a sound generator disposed on one surface of the first substrate, wherein the sound generator vibrates the display panel to output sound, Wherein, the sound generator comprises: a first vibration generator for vibrating the display panel by generating a magnetic force using a first voice coil in the first vibration generator; and a second vibration generator including a vibration layer that contracts and expands based on a voltage applied thereto to vibrate the display panel, wherein the first vibration generator and the second vibration generator overlap each other in a thickness direction of the display panel, and Wherein, the first vibration generator comprises: a bobbin disposed on the one surface of the first substrate; The first voice coil surrounds the bobbin; and A first magnet is disposed on the bobbin and spaced apart from the bobbin, and wherein the second vibration generator is disposed on the one surface of the first substrate and is surrounded by the bobbin.

2. The display device according to claim 1, wherein: The second vibration generator overlaps the first magnet in the thickness direction of the display panel.

3. The display device according to claim 1, wherein: The second vibration generator also includes: The first electrode is applied with a first driving voltage; and The second electrode is applied with a second driving voltage, The vibration layer is disposed between the first electrode and the second electrode, and contracts and expands based on the first driving voltage applied to the first electrode and the second driving voltage applied to the second electrode.

4. The display device according to claim 3, wherein: The vibration layer includes a piezoelectric element.

5. The display device according to claim 1, wherein: The sound generator further includes a third vibration generator that vibrates the display panel by generating a magnetic force using a second voice coil in the third vibration generator.

6. The display device according to claim 5, wherein: The second vibration generator and the third vibration generator are surrounded by the bobbin.

7. The display device according to claim 5, wherein: The third vibration generator overlaps the first vibration generator and the second vibration generator in the thickness direction of the display panel.

8. The display device according to claim 6, wherein: The second vibration generator is disposed on the one surface of the first substrate, and The third vibration generator is disposed on the second vibration generator.

9. The display device according to claim 7, wherein: The third vibration generator overlaps the first magnet of the first vibration generator in the thickness direction of the display panel.

10. The display device according to claim 5, wherein: The third vibration generator overlaps the first magnet of the first vibration generator in the thickness direction of the display panel.

11. The display device according to claim 5, wherein: One side surface of the second vibration generator and one side surface of the third vibration generator are disposed adjacent to each other.

12. The display device according to claim 5, wherein: One side surface of the second vibration generator and one side surface of the third vibration generator contact each other.

13. The display device according to claim 5, wherein: The third vibration generator comprises: A lower chassis and an upper chassis facing each other; A flexible circuit board is arranged on a surface of the lower chassis facing the upper chassis; a second magnet including a voice coil groove for accommodating the second voice coil; and a spring, disposed between the upper chassis and the second magnet, Wherein, the second voice coil is arranged on a surface of the flexible circuit board facing the upper chassis and is electrically connected to the flexible circuit board.

14. The display device according to claim 3, further comprising: The sound circuit board is electrically connected to the first electrode and the second electrode of the second vibration generator.

15. The display device according to claim 14, wherein: The sound circuit board is disposed between the one surface of the first substrate and the bobbin.

16. The display device according to claim 15, wherein: The sound circuit board is in contact with the bobbin.

17. The display device according to claim 15, further comprising: a heat radiation film disposed between the one surface of the first substrate and the sound generator, Wherein, the thermal radiation film comprises a receiving groove, and the sound circuit board is arranged in the receiving groove.

18. The display device according to claim 17, wherein: The bobbin overlaps the receiving groove in the thickness direction of the display panel.

19. The display device according to claim 17, further comprising: A lower cover, arranged on the thermal radiation film; as well as The circuit board is arranged on the lower cover.

20. The display device according to claim 19, wherein A radio wave blocking member is provided on the sound circuit board.

21. The display device according to claim 19, wherein: The first vibration generator also includes: A lower plate is disposed on the first magnet and fixed to the lower cover or the circuit board through a fixing member.

22. A display device comprising: The display panel comprises a first substrate and a light emitting element layer arranged on the first substrate; as well as a sound generator disposed on one surface of the first substrate, wherein the sound generator vibrates the display panel to output sound, Wherein, the sound generator comprises: a first vibration generator for vibrating the display panel by generating a magnetic force using a first voice coil in the first vibration generator; and a second vibration generator including a vibration layer that contracts and expands based on a voltage applied thereto to vibrate the display panel, wherein the first vibration generator and the second vibration generator overlap each other in a thickness direction of the display panel, and Wherein, the first vibration generator comprises: a bobbin disposed on the one surface of the first substrate; The first voice coil surrounds the bobbin; and a first magnet disposed on the bobbin and spaced apart from the bobbin, and wherein the second vibration generator is disposed on the one surface of the first substrate, and The bobbin is disposed on the second vibration generator.

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