A rectifier bridge circuit module with a post-mounted TVS protection diode

Abstract

The invention relates to a rectifier bridge circuit module with a post-mounted TVS protection diode, belonging to the field of semiconductor electronic devices, and characterized in that the module comprises a welding pad, a TVS tube chip and at least two high-voltage rectifier diode chip groups, wherein the high-voltage rectifier diode chip group and the TVS tube chip are integrated in a plastic package with a plurality of pins, the TVS tube chip is arranged at the output end of the high-voltage rectifier diode chip group, the high-voltage rectifier diode chip group is connected to relevant pins of the plastic package through relevant welding pads, and the TVS tube chip is connected to relevant pins of the plastic package through relevant welding pads; the high-voltage rectifier diode chip group comprises an N-type substrate high-voltage rectifier diode chip and a P-type substrate high-voltage rectifier diode chip, and a first chip and a second chip in the same high-voltage rectifier diode chip group share a welding pad; while the integrated package is packaged, the clamping capability of the pulse wave is increased, so as to fully protect the subsequent circuit.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor electronic devices, and in particular relates to a rectifier bridge circuit module with a post-mounted TVS protection diode. Background Art

[0002] In the application of charger or LED green lighting circuit, firstly, high voltage AC (my country standard: 220V / 50Hz; Japan and US standard: 120V / 60Hz; or others) needs to be rectified by diodes into DC. As the requirements of EU and other countries for reliability become higher and higher, the circuits in the application are required to meet a series of electromagnetic interferences such as lightning strikes, vibration waves, and combination waves. The common practice now is to add a transient suppression diode (TVS) or varistor at the front end of the rectifier bridge to suppress electromagnetic interference in an embedded manner to protect the subsequent circuit from damage, and to meet EU standards such as lightning strikes, vibration waves, and combination waves.

[0003] With the development of integrated circuit production technology, electronic products have higher and higher requirements for miniaturization, integration, reliability and green environmental protection. The existing method of adding external protection TVS tubes or varistors not only complicates the circuit but also greatly increases the cost, which will inevitably cause the volume and cost of the circuit board to be unable to be well controlled, affecting the competitiveness and wide application of the entire product. The low degree of integration affects the miniaturization of the circuit.

[0004] There are related records in the prior art of adding TVS to the front end of the rectifier bridge to achieve module integration. However, this solution still has the following problems: the TVS added to the front end of the rectifier bridge, because the function of the rectifier bridge is to convert AC into DC, adding TVS to the front end of the rectifier bridge means that the TVS must be connected to the AC power, so its front end must use a bidirectional structure TVS chip, and the ability to suppress pulse waves is weak, which also affects the application of the product. Summary of the invention

[0005] The technical problem to be solved by the present invention is to address the deficiencies of the existing design and provide a rectifier bridge circuit module with a post-TVS protection diode, which adds a unidirectional TVS at the output terminal of the rectifier bridge and adopts N-type substrate and P-type substrate high-voltage diode rectifier chips for packaging. The transient suppression diode chip is integrated inside the rectifier bridge to form a planar assembly structure, while increasing the clamping capability of the pulse wave and fully protecting the subsequent circuit.

[0006] The technical solution of the present invention to solve the above technical problems is as follows: a rectifier bridge circuit module with a post-TVS protection diode, characterized in that it includes multiple pads, at least one TVS tube chip and at least two high-voltage rectifier diode chip groups, the high-voltage rectifier diode chip group and the TVS tube chip are integrated in a plastic package with multiple pins, the TVS tube chip is arranged at the output end of the high-voltage rectifier diode chip group, the high-voltage rectifier diode chip group is connected to the relevant pins of the plastic package through relevant pads, and the TVS tube chip is connected to the relevant pins of the plastic package through relevant pads; the high-voltage rectifier diode chip group includes a first chip and a second chip, the first chip adopts an N-type substrate high-voltage rectifier diode chip, the second chip adopts a P-type substrate high-voltage rectifier diode chip, and the first chip and the second chip in the same high-voltage rectifier diode chip group adopt the same pad.

[0007] Furthermore, the top surface of the first chip is connected to the negative DC output terminal of the plastic package, and the top surface of the second chip is connected to the positive DC output terminal of the plastic package.

[0008] Furthermore, two of the high-voltage rectifier diode chip groups are provided in the plastic package; specifically, two first chips and two second chips are provided in the plastic package.

[0009] Furthermore, each high-voltage rectifier diode chip group is connected to the AC input terminal of the plastic package through a related pad, and the TVS tube chip is connected to the DC output terminal of the plastic package through a related pad.

[0010] Furthermore, the number of TVS tube chips is one or two, and

[0011] When the number of TVS tube chips is one, the TVS tube chip adopts a P-type substrate TVS tube chip;

[0012] When the number of TVS tube chips is two, the TVS tube chips are connected in series using an N-type substrate TVS tube chip and a P-type substrate TVS tube chip.

[0013] Furthermore, the plastic package body is provided with bonding pads in addition to the base island pads for carrying the first chip, the second chip, and the TVS tube chip respectively; and

[0014] When the number of TVS tube chips is one, the number of effective bonding pads is two, and the two independently serve as detection terminals of the rectifier diode chip and the TVS tube chip, and together serve as the positive DC output terminal of the plastic package, and one of the bonding pads is connected to the top surface of the TVS tube chip through a wire, and the other bonding pad is connected to the top surface of the second chip through a wire;

[0015] When the number of TVS tube chips is two, the number of effective bonding pads is one, the P-type substrate TVS tube chip is connected to the negative DC output terminal of the plastic package through the base island pad, the N-type substrate TVS tube chip is arranged on another base island pad, and the base island pad and the bonding pad are independent of each other as detection terminals of the rectifier diode chip and the TVS tube chip, and together serve as the positive DC output terminal of the plastic package, the top surface of the P-type substrate TVS tube chip is connected to the top surface of the N-type substrate TVS tube chip through a wire, and the bonding pad is connected to the top surface of the second chip through a wire.

[0016] Furthermore, the plastic package body is packaged in SOP5.

[0017] Furthermore, the TVS tube chip adopts a unidirectional TVS tube chip

[0018] The beneficial effects of the present invention are:

[0019] 1. By placing TVS tube chips at the rear end of the rectifier bridge and using N-type substrate and P-type substrate high-voltage diode rectifier chips, the rectifier bridge circuit module with built-in TVS protection diode can be met, and the transient suppression diode chip is integrated inside the rectifier bridge to form a planar assembly structure; at the same time, the TVS is placed at the rear end of the rectifier chip. When in use, the TVS is connected to the DC end, which can increase the clamping ability of the pulse wave and meet the EU's requirements for shock wave tests and combination waves without adding other protection devices. The subsequent circuit is fully protected. The rectifier diode chips in the module group form a full-wave rectification function, and the TVS provides an embedded protection function;

[0020] 2. TVS is placed at the rear end of the rectifier chip. Since the protection voltage of the TVS tube is much lower than that of the rectifier diode, if the circuit module is directly connected to the DC output terminal, for the rectifier diode, the protection of the TVS cannot realize the high-voltage online test, which will cause great risks in use. The independent detection terminal further provided in the present invention can realize 100% full reliability testing of each rectifier diode chip in production, including the TVS tube, to improve the reliability and safety of product application. Moreover, in the module application, the compatibility of the output terminal (+ end) and the SOP4 pin package is realized through a simple common pad design, which has broad market prospects in small chargers, LED lights and communication power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0022] Figure 2 yes Figure 1 Circuit schematic diagram of the package;

[0023] Figure 3is a schematic structural diagram of another embodiment of the present invention;

[0024] Figure 4 yes Figure 3 Circuit schematic diagram of the package;

[0025] In the figure: 1, 3. First chip, 2, 4. Second chip, 5. P-type substrate TVS tube chip, 6. N-type substrate TVS tube chip, 7, 8. AC input terminals, 9, 10. Detection terminals, 11. DC output terminal, 12. Wire, 13. Plastic package. DETAILED DESCRIPTION

[0026] The principles and features of the present invention are comprehensively described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0027] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine the different embodiments or examples and the features of the different embodiments or examples described in this specification without contradiction.

[0028] Combine and combination.

[0029] Example 1

[0030] The rectifier bridge circuit module of the post-TVS protection diode of this embodiment is as follows: Figure 1 As shown, there are 5 output terminals, which are composed of 4 high-voltage rectifier diode chips and one TVS tube chip:

[0031] Among them, two are N-type substrate high-voltage rectifier diode chips, namely the first chips 1 and 3, and two are P-type substrate high-voltage rectifier diode chips, namely the second chips 2 and 4, wherein one N-type substrate and one P-type substrate high-voltage rectifier diode chip are a group and are welded together to a base island pad, and the two base island pads are respectively led out as AC input terminals 7 and 8 of the plastic package 13;

[0032] The TVS tube chip 5 is a unidirectional TVS tube chip of a P-type substrate, which is welded to a base island pad and leads to a negative DC output terminal 11 of the plastic package 13. The plastic package 13 is also provided with two effective bonding pads, which are independent of each other and lead to detection terminals 9 and 10 as the rectifier diode chip and the TVS tube chip respectively, and the two together serve as the positive DC output terminal of the plastic package 13;

[0033] One of the bonding pads is connected to the top surface of the TVS tube chip 5 through a wire 12, and the other bonding pad is connected to the top surfaces of the two second chips 2 and 4 through wires 12 respectively. The top surfaces of the two first chips 1 and 3 are respectively connected to the pads where the TVS tube chip is located through wires 12, that is, connected to the negative DC output terminal of the plastic package 13.

[0034] The corresponding circuit diagram is as follows Figure 2 shown.

[0035] Example 2

[0036] The rectifier bridge circuit module of the post-TVS protection diode of this embodiment is as follows: Figure 3 As shown, there are 5 output terminals, which are composed of 4 high-voltage rectifier diode chips and two TVS tube chips:

[0037] Among them, two are N-type substrate high-voltage rectifier diode chips, namely the first chips 1 and 3, and two are P-type substrate high-voltage rectifier diode chips, namely the second chips 2 and 4, wherein one N-type substrate and one P-type substrate high-voltage rectifier diode chip are a group and are welded together to a base island pad, and the two base island pads are respectively led out as AC input terminals 7 and 8 of the plastic package 13;

[0038] The TVS tube chip is connected in series with an N-type substrate TVS tube chip and a P-type substrate TVS tube chip, and both are unidirectional TVS tube chips; wherein the P-type substrate TVS tube chip is welded to a base island pad, and is led out as a negative direct output terminal 11 of the plastic package, and the N-type substrate TVS tube chip is arranged on another base island pad, and an effective bonding pad is also arranged in the plastic package 13, which is independent of the base island pad where the N-type substrate TVS tube chip is located and is led out as detection terminals 9 and 10 respectively, for independent detection of the rectifier diode chip or the TVS tube chip without affecting each other, and the two are jointly used as the positive DC output terminal of the plastic package 13;

[0039] The top surface of the P-type substrate TVS tube chip is connected to the top surface of the N-type substrate TVS tube chip through a wire, and the bonding pad is connected to the top surfaces of the two second chips 2 and 4 respectively through a wire 12. The top surfaces of the two first chips 1 and 3 are respectively connected to the pads where the P-type substrate TVS tube chip is located through a wire 12, that is, connected to the negative DC output end of the plastic package 13.

[0040] The corresponding circuit diagram is as follows Figure 4 shown.

[0041] In the above embodiment, the wire is a metal wire, and the material is compatible with silicon aluminum wire, thick aluminum wire, gold wire and copper wire, and the lead process is ultrasonic bonding, gold wire ball welding and laser welding;

[0042] The module is encapsulated with epoxy resin and has a 5-pin package structure. It adopts the SOP5 package form. When installed on the PCB board, the detection terminals 9 and 10 are used as a pin as a whole and used as the positive output terminal of the plastic package. It can achieve compatibility with the SOP4 pin package and expand its application range.

[0043] The rectifier bridge circuit module of the embodiment of the present invention adopts a single or two TVS tube chips design. Furthermore, the two TVS tube chips also adopt a combination of P-type and N-type substrates to realize a planar assembly structure to achieve more adequate protection capabilities.

Claims

1. A rectifier bridge circuit module with a post-mounted TVS protection diode, characterized in that: It comprises a plurality of pads, at least one TVS tube chip and at least two high-voltage rectifier diode chip groups, wherein the high-voltage rectifier diode chip group and the TVS tube chip are integrated in a plastic package having a plurality of pins, the TVS tube chip is arranged at the output end of the high-voltage rectifier diode chip group, the high-voltage rectifier diode chip group is connected to the relevant pins of the plastic package through the relevant pads, and the TVS tube chip is connected to the relevant pins of the plastic package through the relevant pads; the high-voltage rectifier diode chip group comprises a first chip and a second chip, the first chip adopts an N-type substrate high-voltage rectifier diode chip, the second chip adopts a P-type substrate high-voltage rectifier diode chip, and the first chip and the second chip in the same high-voltage rectifier diode chip group adopt the same pad; The number of the TVS tube chips is two, and the TVS tube chips are an N-type substrate TVS tube chip and a P-type substrate TVS tube chip connected in series; In addition to base island pads for carrying the first chip, the second chip and the TVS tube chip respectively, the plastic package body is also provided with a bonding pad; the number of effective bonding pads is one, the P-type substrate TVS tube chip is connected to the negative DC output terminal of the plastic package body through the base island pad, the N-type substrate TVS tube chip is arranged on another base island pad, and the base island pad and the bonding pad are independently used as detection terminals of the rectifier diode chip and the TVS tube chip, and are jointly used as the positive DC output terminal of the plastic package body, the top surface of the P-type substrate TVS tube chip is connected to the top surface of the N-type substrate TVS tube chip through a wire, and the bonding pad is connected to the top surface of the second chip through a wire.

2. The rectifier bridge circuit module with a post-TVS protection diode according to claim 1, characterized in that: The top surface of the first chip is connected to the negative DC output terminal of the plastic package, and the top surface of the second chip is connected to the positive DC output terminal of the plastic package.

3. The rectifier bridge circuit module with a post-TVS protection diode according to claim 1, characterized in that: Two high-voltage rectifier diode chip groups are arranged in the plastic package.

4. The rectifier bridge circuit module with a post-TVS protection diode according to claim 1 or 3, characterized in that: Each high-voltage rectifier diode chip group is connected to the AC input terminal of the plastic package through a related pad, and the TVS tube chip is connected to the DC output terminal of the plastic package through a related pad.

5. The rectifier bridge circuit module with a post-TVS protection diode according to claim 1, characterized in that: The plastic package body adopts SOP5 packaging.

6. The rectifier bridge circuit module with a post-TVS protection diode according to claim 1, characterized in that: The TVS tube chip adopts a unidirectional TVS tube chip.

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