Terminal equipment, display screens and applications

Abstract

The present invention provides a terminal device and its display screen and application, wherein the terminal device includes a terminal device body, a display screen and a camera module, wherein the display screen has a light hole, wherein the camera module is located below the display screen, and the camera module has a front end, the front end of the camera module is fixedly mounted on the display screen and the camera module is aligned with the light hole of the display screen so that light from the outside of the display screen can be received by the camera module through the light hole.

Description

Technical Field

[0001] The present invention relates to the field of electronic equipment, and in particular to a terminal device with a full screen, a display screen and applications thereof. Background Art

[0002] Current electronic devices usually have camera functions, so existing mobile phone terminals generally have front and rear camera modules, where the front camera module is set on the same side of the display screen to meet the needs of users for selfies, etc. The front camera module occupies a large screen space, which is contrary to the current trend of pursuing full screens.

[0003] The current measure is to design the camera module as a telescopic camera module to hide and use the camera function. When the camera function of the electronic device needs to be used, at least part of the camera module is controlled to extend out of the housing of the electronic device, and when the camera function is finished, at least part of the camera module is controlled to retract into the housing of the electronic device. However, the camera module itself is a relatively precise component, and its service life in high-frequency back-and-forth motion remains to be tested, and the camera module is easily damaged by external force during movement.

[0004] Therefore, how to ensure the front camera function of electronic devices while taking into account the pursuit of full screens is still an urgent problem that needs to be solved. Summary of the invention

[0005] An object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module of the terminal device can collect sufficient light and at the same time the screen-to-body ratio of the terminal device can be improved.

[0006] Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module of the terminal device is configured as an under-screen camera module and can receive sufficient light through the light-transmitting hole of the display screen.

[0007] Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module of the terminal device is configured as an under-screen camera module and can receive sufficient light through a light hole located at the edge of the display screen.

[0008] Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the light passing through the light hole can be guided to the camera module along a preset path to be received by the camera module.

[0009] Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module and the display screen can be assembled together to facilitate maintaining the relative position of the camera module and the display screen.

[0010] Another object of the present invention is to provide a terminal device, its display screen and application, wherein the camera module of the terminal device can be designed to be smaller in size to help reduce the overall height of the display screen and the camera module located below the display screen.

[0011] According to one aspect of the present invention, a display unit is provided for cooperating with a camera module, wherein the display unit comprises a display screen, and a fill light unit and a light hole, wherein the light hole penetrates at least a portion of the display screen in a height direction, the fill light unit is capable of radiating light to the outside of the display screen and when the camera module is in a working state, the fill light unit forms a light hole, and light from the outside of the display screen is received by the camera module after passing through the light hole and the constraint of the light hole.

[0012] According to an embodiment of the present invention, the fill light unit is disposed on the display screen.

[0013] According to an embodiment of the present invention, the fill light unit is disposed inside the display screen.

[0014] According to one embodiment of the present invention, the display screen includes a cover layer, a touch layer, a polarization layer, a packaging layer, a pixel layer and a driving circuit layer, wherein the cover layer is located on the top side, the driving circuit layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to operate, wherein the packaging layer is formed on the top side of the pixel layer, and the fill light unit is located on the driving circuit layer.

[0015] According to one embodiment of the present invention, the display screen includes a cover layer, a touch layer, a polarization layer, a packaging layer, a pixel layer, a driving circuit layer and a backplane layer, wherein the cover layer is located on the top side, the backplane layer is located on the bottom side, the driving circuit layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to operate, wherein the packaging layer is formed on the top side of the pixel layer, and the fill light unit is located on the backplane layer.

[0016] According to an embodiment of the present invention, the fill light unit is held between the display screen and the camera module.

[0017] According to an embodiment of the present invention, the fill light unit is detachably mounted on the display screen.

[0018] According to one embodiment of the present invention, the fill light unit includes an aperture structure and a light-emitting structure, the aperture structure includes an aperture moving part and an aperture driving part, the aperture moving part is drivably connected to the aperture driving part in a manner of forming a light hole of variable size, wherein the light-emitting structure is located in the aperture moving part.

[0019] According to an embodiment of the present invention, the light emitting structure is located on the upper surface of the aperture moving part.

[0020] According to an embodiment of the present invention, when the light emitting structure is located on the upper surface of the aperture moving part, the lower surface of the aperture moving part is configured to be light shielding.

[0021] According to an embodiment of the present invention, the fill light unit further comprises a reflective structure, wherein the reflective structure is located below the light emitting structure to reflect the light of the light emitting structure toward the outside of the display screen.

[0022] According to an embodiment of the present invention, the reflective structure is disposed on the aperture structure in a stretchable and deformable manner, and when the reflective structure is deformed along with the movement of the aperture moving part, the reflectivity of the reflective structure changes.

[0023] According to one embodiment of the present invention, the light-emitting structure includes a light-emitting element, the aperture moving part has a hole and the size of the hole changes to form the light hole of variable size during the process of the aperture moving part being driven by the aperture driving part to move, and the light-emitting element is arranged in the aperture moving part.

[0024] According to an embodiment of the present invention, the light emitting structure includes a plurality of pixels, wherein the aperture moving portion includes a plurality of blades, the blades are drivably connected to the aperture driving portion, and at least one of the pixels is disposed on at least one of the blades.

[0025] According to an embodiment of the present invention, a plurality of the pixels are disposed on one of the blades.

[0026] According to an embodiment of the present invention, the light emitting structure is located inside the aperture moving part.

[0027] According to one embodiment of the present invention, the fill light unit includes an aperture moving part and an aperture driving part, wherein the aperture moving part is connected to the aperture driving part in a manner that it can be driven to form a light hole of variable size, and the aperture moving part itself is configured to be luminous.

[0028] According to another aspect of the present invention, the present invention provides a terminal device, comprising:

[0029] A terminal device body;

[0030] The above-mentioned display unit; and

[0031] A camera module, wherein the camera module is located below the display unit, the camera module has a front end, the front end of the camera module is installed on the display screen of the display unit and the camera module is aligned with the light hole of the display screen so that the light outside the display screen can be received by the camera module through the light hole.

[0032] According to another aspect of the present invention, the present invention provides a working method of a display unit, which comprises the following steps:

[0033] When a display screen with a light hole is working, a supplementary light unit is operated to emit light to supplement the light intensity at the position of the light hole.

[0034] According to an embodiment of the present invention, the working method further comprises the following steps:

[0035] When a camera module located below the display screen and aligned with the light hole is working, an aperture structure of a fill light unit located above the camera module is operated to form a light hole, and light reaches the camera module after passing through the light hole and the constraints of the fill light unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG. 1 is a schematic diagram of a terminal device according to the prior art.

[0037] Figure 2 A schematic diagram of a display screen and a camera module according to the prior art

[0038] FIG. 3 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0039] Figure 4A It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0040] Figure 4B It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0041] Figure 5A It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0042] Figure 5B It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0043] Fig. 6A is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0044] Figure 6BSchematic diagram of the display screen according to the preferred embodiment of the present invention.

[0045] Figure 7 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0046] Figure 8 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0047] Fig. 9 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0048] Fig.10 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0049] Fig.11 It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0050] Fig.12 It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0051] Fig.13 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0052] Fig.14A It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0053] Fig. 14B It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0054] Fig.15 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0055] Fig.16 It is a schematic diagram of manufacturing a display screen according to a preferred embodiment of the present invention.

[0056] Fig.17 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0057] Fig.18A It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0058] Fig.18B It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0059] Fig.19 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0060] Fig. 20 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0061] Fig.21 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0062] Fig. 22 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0063] Fig.23 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0064] Fig.24 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0065] Fig.25 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0066] Fig.26 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0067] Fig. 27 It is a schematic diagram of an application of a display screen according to a preferred embodiment of the present invention.

[0068] Fig.28 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0069] Fig.29 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0070] Fig.30 A specific example of a camera module according to an embodiment of the present application is illustrated.

[0071] Fig.31 Another specific example of a camera module according to an embodiment of the present application is illustrated.

[0072] Fig.32 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0073] Fig.33 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0074] Fig.34 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0075] Fig.35 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0076] Fig.36 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0077] Fig.37 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0078] Fig.38 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0079] Fig.39 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0080] Fig.40 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0081] Fig.41 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0082] Fig.42 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0083] Fig.43 The figure shows a schematic diagram of an existing camera module based on a molding process.

[0084] Fig.44 The figure shows a specific schematic diagram of the photosensitive chip of the camera module

[0085] Fig.45 The figure shows another specific schematic diagram of the photosensitive chip of the camera module.

[0086] Fig.46 The figure shows a specific schematic diagram of the photosensitive layer of the photosensitive chip of the camera module.

[0087] Fig.47 The figure shows another specific schematic diagram of the photosensitive layer of the photosensitive chip of the camera module.

[0088] Fig.48A is a schematic diagram of an assembly system according to a preferred embodiment of the present invention.

[0089] Fig.48B It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0090] Fig.49 It is a schematic diagram of a support platform of the assembly system according to a preferred embodiment of the present invention.

[0091] Fig.50It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0092] Fig.51A It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0093] Fig.51B It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0094] Fig.51C It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0095] Fig.52 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0096] Fig.53 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0097] Fig.54 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0098] Fig.55 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0099] Fig.56 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0100] Fig.57 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0101] Fig.58 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0102] Fig.59 It is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0103] Fig.60A is a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0104] Fig.60B is a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0105] Fig.60C is a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0106] Fig.60D is a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0107] Fig.60Eis a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0108] Fig.61A is a schematic diagram of a terminal device according to a preferred embodiment of the present invention.

[0109] Fig.61B is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0110] Fig.61C It is a partial schematic diagram of another working state of the display unit according to the above preferred embodiment of the present invention.

[0111] Fig.62A It is a partial schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0112] Fig.62B It is a partial schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0113] Fig.62C It is a partial schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0114] Fig.63 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0115] Fig.64 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0116] Fig.65 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0117] Fig.66 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0118] Fig.67 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0119] Fig.68 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0120] Fig.69 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0121] Fig.70 is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0122] Fig.71 is a schematic diagram of a display unit according to a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0123] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0124] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0125] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0126] Although ordinals such as "first," "second," and the like will be used to describe various components, those components are not limited herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component without departing from the teachings of the inventive concept. The term "and / or" as used herein includes any and all combinations of one or more associated listed items.

[0127] The terms used herein are only used for the purpose of describing various embodiments and are not intended to be limiting. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates an exception. In addition, it will be understood that the terms "including" and / or "having" when used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0128] The terms used herein, including technical and scientific terms, have the same meaning as those generally understood by those skilled in the art, unless the terms are defined differently. It should be understood that the terms defined in commonly used dictionaries have the same meaning as those in the prior art.

[0129] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments:

[0130] Application Overview:

[0131] In recent years, a technical solution for an under-screen camera module has been proposed, in which the camera module is kept below the display screen and installed on an electronic device such as a mobile phone's motherboard. Due to manufacturing process limitations, a larger light-transmitting area is reserved for the display screen so that the camera module can normally frame through the light-transmitting area. The size of the light-transmitting area is much larger than a light-receiving area of ​​the camera module, and once the field of view angle θ of the camera module is set larger, the light-transmitting area also needs to be set larger to meet the camera module's framing requirements during the back-and-forth movement. The light-receiving area of ​​the camera module refers to the area of ​​the lens part of the camera module that is used to receive light.

[0132] Please refer to the attached Figure 1A and attached Figure 1B As shown in FIG. 1 , the display screen 20P has a light-transmitting area S, wherein the light-transmitting area S is limited by the previous manufacturing process and is much larger than the light-receiving area P of the camera module 30P, and when the camera module 30P needs to move back and forth relative to the display screen 20P, the light-transmitting area S needs to be made larger.

[0133] Observing from above the display screen 20P, the light-transmitting area S will occupy a larger area of ​​the display screen 20P. Furthermore, in the prior art, the light-transmitting area S cannot be used for display in order to ensure the amount of light entering the module. Therefore, it is not conducive to improving the screen-to-body ratio of the entire display screen 20P.

[0134] The present invention provides a display screen 20P, wherein the display screen 20P can improve the screen-to-body ratio of the display screen 20P as much as possible while satisfying the imaging light required by a camera module 30P disposed below the display screen 20P.

[0135] Reference Figure 2 To Attachment Figure 5B Detailed Description of the Invention FIG. 2 is a schematic diagram of the display screen 20 and its manufacturing method according to some embodiments of the present invention.

[0136] The display screen 20 has a light hole 200, wherein the light hole 200 serves as the light-transmitting area, and the camera module 30 is located below the display screen 20. The camera module 30 forms an image by receiving light passing through the light hole 200.

[0137] It is worth mentioning that the camera module 30 can be fixed to the display screen 20, so that no space needs to be reserved between the camera module 30 and the display screen 20, so that the overall height can be reduced, and because the camera module 30 is closely attached to the display screen 20, the camera module 30 can also reduce the area size of the light-transmitting area S. Of course, the camera module 30 can also be moved relative to the display screen 20, but the light-transmitting area of ​​the display screen 20 can be made smaller.

[0138] The light-transmitting area, that is, the light-through hole 200 can be designed to be smaller, which also puts forward higher requirements on the manufacturing process of the display screen 20 .

[0139] In this example, the display screen 20 is implemented as an OLED display screen 20. The display screen 20 includes: a cover layer 21, a touch layer 22, a polarizing layer 23, an encapsulation layer 24, a pixel layer 25, a driving circuit layer 26 and a backplane layer 27 distributed from top to bottom, wherein the backplane layer 27 is located on the bottom side, the cover layer is located on the top side, the driving circuit layer 26 is formed on the bottom side of the pixel layer 25 and is electrically connected to the pixel layer 25 for driving the pixel layer 25 to work; the encapsulation layer 24 is formed on the top side of the pixel layer 25 for encapsulating the pixel layer 25; and the pixel layer 25 includes pixels distributed in an array, each of which has a gap between them, so that light that sequentially passes through the cover layer 21, the touch layer 22, the polarizing layer 23 and the encapsulation layer 24 can pass through the pixel layer 25 through the gap.

[0140] In particular, the display screen 20 further has the light-through hole 200, wherein the light-through hole 200 passes through the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25 and the drive circuit layer 26. It is worth noting that the light-through hole 200 may pass through the cover layer 21 or may not pass through the cover layer 21. The cover layer 21 is generally made of a material with good light transmittance, such as glass, so the cover layer 21 does not need to be perforated to allow light to pass through efficiently.

[0141] Furthermore, the cover layer 21 is located above the display screen 20. If the cover layer 21 is a complete structure, the cover layer 21 located above each layer of the display screen 20 can protect other layers, such as water or dust and other pollutants entering other layers of the display screen 20. In this example, preferably, the light hole 200 does not pass through the cover layer 21.

[0142] The camera module 30 can be installed below the display screen 20 and receive sufficient light from above the display screen 20 through the light hole 200 .

[0143] Furthermore, the camera module 30 is fixedly mounted on the display screen 20 , and the size of the light hole 200 of the display screen 20 can be designed to be smaller.

[0144] like Figure 3A and attached Figure 3B As shown, in this embodiment, the display screen 20 is implemented as an OLED (Organic Light-emitting Diode) display screen 20. Those skilled in the art should know that the OLED display screen 20 has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, high response speed, full color, etc.

[0145] The cover layer 21 is usually implemented as a glass layer, which is located at the topmost layer of the display screen 20 and is used to protect the layers below the cover layer 21. It should be understood that the glass layer is made of glass material, which is a material with high light transmittance.

[0146] The touch layer 22 is located below the cover layer 21. Usually, the cover layer 21 and the touch layer 22 are connected by an adhesive. It should be known to those skilled in the art that the touch layer 22 is an indispensable configuration for realizing the touch function of the display screen 20.

[0147] The polarization layer 23 is located below the touch layer 22 , wherein the polarization layer 23 is generally implemented as circularly polarized light.

[0148] The encapsulation layer 24 is located below the polarization layer 23, wherein the function of the encapsulation layer 24 is to encapsulate the pixel layer 25 located below the encapsulation layer 24, so that the pixel layer 25 is in a sealed environment, so that the organic material in the pixel layer 25 is not polluted by the outside or volatilized. Specifically, there are two types of encapsulation layers 24, wherein when the display screen 20 is a rigid screen, the encapsulation layer 24 is made of a rigid light-transmitting material, such as glass, plastic, etc.; when the display screen 20 is a flexible screen, the encapsulation layer 24 is made of a flexible light-transmitting material, such as a PI film (Polyimide Film).

[0149] The pixel layer 25 is wrapped by the encapsulation layer 24 and is located below the encapsulation layer 24. For the OLED display screen 20, the pixel units in the pixel layer 25 are implemented as OLED, that is, Organic Light-emitting Diode.

[0150] The driving circuit layer 26 is located below the pixel layer 25 , wherein the driving circuit layer 26 can be electrically connected to the pixel layer 25 to drive the pixel layer 25 to operate.

[0151] The backplane layer 27 is located below the driving circuit layer 26, wherein the backplane layer 27 can enhance the structural strength of the entire display screen 20. The backplane layer 27 is usually made of plastic material.

[0152] For the OLED display screen 20, during the hole opening process, attention should be paid to the avoidance of the pixel layer 25 and the driving circuit layer 26. The driving circuit layer 26 is provided with a circuit structure, and the pixel layer 25 includes a plurality of pixels. Once the light hole 200 destroys the circuit structure of the driving circuit layer 26 or the pixel structure of the pixel layer 25, it is likely to affect the working performance of the OLED display screen 20.

[0153] There are three main ways of opening holes in the OLED display screen 20. One is to uniformly open holes for all layers of the OLED display screen 20 after all layers of the OLED display screen 20 are assembled. One is to open holes for all layers of the OLED display screen 20 layer by layer. Another is to pre-open holes for some layers of the OLED display screen 20, such as the pixel layer 25 and / or the drive circuit layer 26, and then uniformly open holes after other layers are installed to form the OLED display screen 20.

[0154] It is worth noting that the opening here refers not only to an actual small hole, but also to an area having a function similar to a hole formed on the display screen 20. For example, the display screen 20 may be opened first, and then a transparent material may be filled at the opening position so that the area can have a light-transmitting function similar to a hole.

[0155] It is worth mentioning that when the first method is used to obtain the display screen 20 with a light hole 200, an opening area can be reserved during the manufacturing process of the driving circuit layer 26 and the pixel layer 25. The circuit structure of the driving circuit layer 26 and the pixels of the pixel layer 25 are not within the opening area, so as to reduce the impact of the light hole 200 on the working performance of the OLED display screen 20 after the subsequent opening.

[0156] The pixel layer 25 is formed on the driving circuit layer 26 by evaporation. The pixel layer 25 includes an anode layer 251, a light-emitting layer 252, a cathode layer 253 and a protective layer 254, wherein the anode layer 251 is located above the driving circuit layer 26, the light-emitting layer 252 is located between the anode layer 251 and the cathode layer 253, and the cathode layer 253 is located above the light-emitting layer 252 and below the protective layer 254.

[0157] The light through hole 200 penetrates the pixel layer 25. Specifically, the light through hole 200 penetrates the pixel layer 25 and each layer of the display screen 20 in a direction perpendicular to each layer of the pixel layer 25, except the cover layer 21 of the display screen 20.

[0158] The pixel layer 25 may also include other film layers, such as a planarization layer, a passivation layer, etc., which are not limited here. In this example, the light hole 200 can be set in the display area of ​​the display screen 20. Since the diameter of the light hole 200 involved in the present invention is less than or equal to 3.99 mm, preferably less than or equal to 2 mm, and the light hole 200 does not affect the normal display of the display screen 20, the camera module 30 is installed at a preset position below the display screen 20 corresponding to the light hole 200.

[0159] It is worth mentioning that the preset position should be determined based on the diameter of the light hole 200 and the optical path parameters of the camera module 30, that is, the camera module 30 is set at the preset position to receive light through the light hole 200 on the display screen 20 and perform normal imaging. Since the light hole 200 is smaller in size than the existing light holes, the display area is increased, which is conducive to the production of a full screen.

[0160] It is worth noting that the shape of the light-through hole 200 can be triangular, rectangular or circular. In this example, the light-through hole 200 is preferably circular.

[0161] Reference Figure 4A As shown, a specific implementation method of using a single hole opening processing method for the OLED display screen 20 to open holes in the entire OLED display screen 20 is illustrated.

[0162] After the pixel layer 25 is formed on the driving circuit layer 26, at least part of the protective layer 254 of the pixel layer 25 can be removed by etching or direct punching to form a groove, wherein at least part of the marking substance can be filled in the groove, and the marking substance can be used to indicate the opening area. The marking substance can be a transparent material, and the position of the marking substance can be determined based on the difference in light transmittance between the marking substance and the surrounding material.

[0163] The other layers of the OLED display screen 20 are mounted on the driving circuit layer 26 or the pixel layer 25 to obtain the complete OLED display screen 20. Based on the marking substance, the opening area can be determined from the top of the OLED display screen 20, and then the OLED display screen 20 is subjected to the opening process. During the opening process, the range of the light-through hole 200 can be larger than the size of the area occupied by the marking substance, so that after the opening is completed, the marking substance can be completely removed.

[0164] It is understandable that the method of using the marking material to locate the opening area is only an example. Those skilled in the art should understand that the method of opening the OLED display screen 20 and bypassing the circuit structure of the driving circuit layer 26 and / or the pixel structure of the pixel layer 25 is not limited to the above example.

[0165] Reference Figure 4B As shown, a specific implementation method of using multiple openings in the OLED display screen 20 to open holes in the entire OLED display screen 20 is illustrated.

[0166] In this example, the driving circuit layer 26 and the pixel layer 25 are firstly subjected to a hole-opening process, and then other layers of the OLED display screen 20 are subjected to a hole-opening process to obtain the display screen 20 with the light-through hole 200 .

[0167] The area encircled by the dotted line is the position of the light-through hole 200, and the light-through hole 200 penetrates the display screen 20 in a direction perpendicular to the pixel layer 25 and the driving circuit layer 26. Those skilled in the art should know that the structure of the pixel layer 25 in the figure is only for illustration, and each functional layer can be arranged as required, and the specific position where the light-through hole 200 penetrates can be arranged as required and is not limited to the position shown in the figure.

[0168] Furthermore, the driving circuit layer 26 includes a plurality of TFT structures 261 and a base substrate 262, wherein the TFT structures 261 are sequentially arranged on the base substrate 262 to form a TFT array. The base substrate 262 is located below the TFT structures 261, and the TFT structures 261 are located below the pixel layer 25.

[0169] The light through hole 200 penetrates from the pixel layer 25 to the base substrate 262 of the driving circuit layer 26 .

[0170] The pixel layer 25 further includes a planarization layer 255 and a pixel definition layer 256, wherein the planarization layer 255 is located between the TFT structure 261 and the anode layer 251, and the pixel definition layer 256 is located between the anode layer 251 and the light emitting layer 252. The pixel definition layer 256 has at least one pixel groove 2560, wherein at least part of the light emitting layer 252 and at least part of the anode layer 251 are sunken in the pixel groove 2560, so that the pixel definition layer 256 can be used to define the pixel 257.

[0171] In this example, the light through hole 200 is formed between the two TFT structures 261, thereby reducing the circuit impact on the driving circuit layer 26, and the light through hole 200 is covered with at least a portion of the protective layer 254 so that the anode layer 251, the light-emitting layer 252 and the cathode layer 253 near the light through hole 200 are not exposed to the outside, so as to reduce the impact of the outside world on the anode layer 251, the light-emitting layer 252 and the cathode layer 253, such as air and moisture, or dust and other substances.

[0172] The light-through hole 200 may be formed by pre-designing a small hole during the process of manufacturing the driving circuit layer 26, and the location of the small hole may be as far away from the TFT structure 261 as possible to avoid damaging the structure of the driving circuit layer 26. The small hole may be formed in the driving circuit layer 26 by directly laser drilling or etching.

[0173] After the small hole is formed in the driving circuit layer 26, the pixel layer 25 is formed in the driving circuit layer 26. At this time, the small hole located in the driving circuit layer 26 is covered, and then the driving circuit layer 26 and the pixel layer 25 can be opened to align with the position of the small hole in the driving circuit layer 26 so that the driving circuit layer 26 and the pixel layer 25 are connected.

[0174] The encapsulation layer 24 is installed on the driving circuit layer 26 and the pixel layer 25, and holes can be punched in the encapsulation layer 24 aligned with the driving circuit layer 26 and the pixel layer 25. The polarization layer 23, the touch layer 22, the cover layer 21 and the back layer 27 are continuously installed to the driving circuit layer 26 and the pixel layer 25, and holes are punched layer by layer in the polarization layer 23, the touch layer 22 and the back layer 27 to obtain the display screen 20 with the light-through hole 200.

[0175] According to some other embodiments of the present invention, at this time, the small hole located in the driving circuit layer 26 is covered by the pixel layer 25, and then the encapsulation layer 24, the polarization layer 23, the touch layer 22, the cover layer 21 and the back layer 27 are installed. After the complete display screen 20 is obtained, a hole is punched in the thickness direction of the display screen 20 aligned with the small hole, so as to obtain the light-through hole 200 that passes through the display screen 20. It can be understood that each layer of the display screen 20 can be installed first to obtain a complete display screen 20, and then all layers except the cover layer 21 can be punched uniformly. Alternatively, each layer of the display screen 20 except the cover layer 21 can be installed first, and then holes are punched, and finally the cover layer 21 can be installed to obtain a complete display screen 20.

[0176] According to other embodiments of the present invention, it is understandable that the light-through hole 200 can be formed by pre-designing a small hole in the process of manufacturing the driving circuit layer 26, and the position of the small hole can be as far away from the TFT structure 261 as possible to avoid damaging the structure of the driving circuit layer 26, and then the pixel layer 25 is formed on the basis of the driving circuit layer 26. The pixel layer 25 can be punched in alignment with the driving circuit layer 26, and then the encapsulation layer 24, the polarization layer 23, the touch layer 22, the cover layer 21 and the back layer 27 are installed. After the complete display screen 20 is obtained, the small hole is punched in the thickness direction of the display screen 20, so as to obtain the light-through hole 200 that runs through the other layers of the display screen 20 except the cover layer 21. It is understandable that the layers of the display screen 20 can be installed first to obtain a complete display screen 20, and then the layers except the cover layer 21 can be punched uniformly. Alternatively, each layer of the display screen 20 except the cover layer 21 may be installed first, then holes may be punched, and finally the cover layer 21 may be installed to obtain the complete display screen 20 .

[0177] Reference Figure 5A and attached Figure 5BAs shown, a specific implementation method of using multiple openings in the OLED display screen 20 to open holes in the entire OLED display screen 20 is illustrated.

[0178] In this example, the driving circuit layer 26 and the pixel layer 25 are first obtained, and then the driving circuit layer 26 and the pixel layer 25 are simultaneously subjected to a hole opening process.

[0179] Specifically, the anode layer 251 , the light emitting layer 252 and the cathode layer 253 of the pixel layer 25 are formed on the driving circuit layer 26 , and then at least a portion of the cathode layer 253 is removed by etching to form an opening area in the cathode layer 253 .

[0180] At least part of the pixel layer 25 is exposed to the outside through the opening area. Specifically, at least part of the pixel definition layer 256 of the pixel layer 25 is exposed to the outside through the opening area. Preferably, the projection of the opening area in the vertical direction between the pixel layer 25 and the driving circuit layer 26 is located between the adjacent TFT structures 261 to minimize the impact on the circuit of the display screen 20.

[0181] After forming the opening area, continue to form the protective layer 254 on the cathode layer 253 and at least part of the pixel definition layer 256, wherein the protective material of the protective layer 254 fills the opening area and the area around the opening area is also filled with the protective material of the protective layer 254.

[0182] Then, at least part of the light-through hole 200 is formed in the opening area by drilling or cutting. For example, by using a laser cutting process, at least part of the pixel layer 25 and the driving circuit layer 26 are cut off in the opening area along the height direction of the driving circuit layer 26, so that the light above the pixel layer 25 passes through the pixel layer 25 and the driving circuit layer 26 to reach the bottom of the driving circuit layer 26. The specific opening method can be to use a mask with a central opening, and then etch the layers corresponding to the opening area, and cover other parts.

[0183] In this example, what needs to be removed before forming the protective layer 254 is at least a portion of the cathode layer 253. In other embodiments of the present invention, what needs to be removed before forming the protective layer 254 is at least a portion of the cathode layer 253 and at least a portion of the light-emitting layer 252. Specifically, dry etching can be used for removal. For example, the dry etching process can be completed by plasma enhanced chemical vapor deposition etching equipment or inductively coupled plasma etching equipment. The etching gas can be some oxygen-containing gas that can react with the organic matter in the light-emitting layer 252 or the cathode layer 253, such as oxygen, nitrous oxide or carbon dioxide; or, the etching gas is an oxygen-containing gas and an inert gas nitrogen gas used simultaneously.

[0184] It is worth noting that the size of the opening area and the light through hole 200 may be inconsistent. When the opening area is larger than the light through hole 200 and the light through hole 200 is located within the opening area, the cathode layer 253 located around the light through hole 200 can be protected by the protective layer 254 and thus not exposed to the outside. When the size of the opening area and the light through hole 200 is the same or the light through hole 200 is larger than the opening area, the cathode layer 253 around the light through hole 200 will be exposed to the outside.

[0185] After the pixel layer 25 is formed on the driving circuit layer 26 , the light through hole 200 can penetrate the driving circuit layer 26 and the pixel layer 25 .

[0186] Further, the encapsulation layer 24, the polarization layer 23, the touch layer 22 and the cover layer 21 can be installed in a certain order with the pixel layer 25 and the drive circuit layer 26. After the encapsulation layer 24, the polarization layer 23, the touch layer 22 and the cover layer 21 are fixedly installed on the pixel layer 25 and the drive circuit layer 26, respectively, holes are drilled or cut to make the light-through hole 200 pass through all layers of the display screen 20 except the cover layer 21.

[0187] When the display screen 20 includes the backplane layer 27 , the backplane layer 27 is mounted on the driving circuit layer 26 , and the light-through hole 200 penetrates the backplane layer 27 in the height direction of the display screen 20 .

[0188] Of course, it can be understood that the encapsulation layer 24, the polarizing layer 23, the touch layer 22 and the backplane layer 27 can be punched after being fixedly installed on the drive circuit layer 26 and the pixel layer 25, respectively. In other words, when the encapsulation layer 24 is installed on the pixel layer 25, the encapsulation layer 24 can be drilled in alignment with the pixel layer 25. After the polarizing layer 23 is installed on the encapsulation layer 24, the polarizing layer 23 can be drilled. After the touch layer 22 is installed on the polarizing layer 23, the touch layer 22 can be drilled. After the backplane layer 27 is installed on the drive circuit layer 26, the backplane layer 27 can be drilled.

[0189] The timing of opening holes in the display screen 20 other than the driving circuit layer 26 and the pixel layer 25 is not limited to the above-mentioned examples. For example, the encapsulation layer 24, the polarization layer 23 and the touch layer 22 are located on the same side of the pixel layer 25, and can be opened at the same time. The backplane layer 27 is located on the other side of the pixel layer 25, and can be opened alone or together with the encapsulation layer 24, the polarization layer 23 and the touch layer 22.

[0190] It is worth mentioning that before or after the driving circuit layer 26 forms the pixel layer 25, the other layers of the display screen 20 can be drilled or cut layer by layer, and then the relative positions of the layers are adjusted to align the small holes located in the layers so that they can penetrate each other.

[0191] Furthermore, the inner diameters of the light-through hole 200 corresponding to each layer of the display screen 20 may be different. For example, the inner diameter of the light-through hole 200 corresponding to the touch layer 22 located above may be larger than the inner diameter of the light-through hole 200 corresponding to the back plate layer 27 located below. The small holes corresponding to each layer of the display screen 20 may be independently manufactured, so that the inner diameters of the light-through hole 200 corresponding to each layer may be different.

[0192] Further, for each layer of the display screen 20, taking the driving circuit layer 26 as an example, the small hole of the driving circuit layer 26 may be cylindrical, that is, the inner diameter of the small hole at different height positions of the driving circuit layer 26 is the same. The small hole of the driving circuit layer 26 may also be conical, that is, the inner diameter of the small hole at different height positions of the driving circuit layer 26 is different, for example, the inner diameter of the small hole gradually decreases from top to bottom.

[0193] Those skilled in the art should understand that the shape of the small hole is not limited to the above examples.

[0194] Reference Fig. 6A and attached Figure 6B As shown, and refer to the attached Figure 5A and attached Figure 5B , is another specific embodiment of the display screen 20 according to the present invention. In this example, a protective material 2812 is provided near the light through hole 200 of the display screen 20. In particular, near the light through hole 200 corresponding to the pixel layer 25 and the driving circuit layer 26. The protective material 2812 can be made of the same material as the protective layer 254 of the pixel layer 25, or can be made of a different material from the protective layer 254 of the pixel layer 25.

[0195] The protective material 2812 is located near the light-through hole 200, and can protect the exposed internal structures of each layer of the display screen 20. This is especially true for the pixel layer 25 and the drive circuit layer 26. The internal structures of the pixel layer 25 and the drive circuit layer 26 are exposed in the light-through hole 200. When dust, moisture or air enters the light-through hole 200, the pixel layer 25 and the drive circuit layer 26 may be damaged. The protective material 2812 can cover the exposed portions of the pixel layer 25 and the drive circuit layer 26 at the light-through hole 200, thereby protecting the pixel layer 25 and the drive circuit layer 26, so that the pixel layer 25 and the drive circuit layer 26 can be in a relatively stable working environment.

[0196] After obtaining the display screen 20 with the light through hole 200, the protective material 2812 may be poured into the light through hole 200 of the display screen 20, and then the protective material 2812 may be subjected to a hole-opening process to form a new light through hole 200. The protective material 2812 may cover each layer of the display screen 20. Of course, the filling height of the protective material 2812 in the light through hole 200 may be controlled according to user needs, thereby selecting the covering position of the protective material 2812. The protective material 2812 may not completely fill the light through hole 200, for example, the position of the back plate layer 27 corresponding to the light through hole 200 may not be protected by the protective material.

[0197] It is worth noting that in this example, the cover layer 21 is not perforated. The cover layer 21 is generally made of glass and has good light transmittance. Therefore, the cover layer 21 does not need to be perforated, and the cover layer 21 can also be located above to protect the other layers of the display screen 20.

[0198] In this way, the original light hole 200 can be prefabricated to be larger, and then the protective material 2812 can be cut or drilled later to control the light hole 200 so that the light hole 200 reaches the expected size. It is worth noting that the protective material 2812 around the light hole 200 can be the same material as the protective layer 254, or different from the material of the retaining layer.

[0199] Reference Figure 6B As shown, a specific method for manufacturing the display screen 20 is explained.

[0200] In this example, holes are firstly opened in each layer constituting the display screen 20, and then filled with the protective material 2812. The protective material 2812 is a transparent material, that is, the position of the corresponding light hole 200 of the original display screen 20 is filled with the transparent material.

[0201] Specifically, the touch layer 22 , the polarizing layer 23 , the encapsulation layer 24 , the pixel layer 25 , the driving circuit layer 26 and the backplane layer 27 may be respectively subjected to opening processing, and then the protective material 2812 may be filled in the opening positions.

[0202] Then, the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26 and the backplane layer 27 are aligned and installed together to form the display screen 20. At this time, the display screen 20 can be used as a display screen with a "hole". The transparent materials corresponding to the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26 and the backplane layer 27 can play the role of the hole.

[0203] Furthermore, the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26 and the backplane layer 27 can be simultaneously subjected to a hole-opening process, and a portion of the protective material 2812 is left around the light-through hole 200. Then, the cover layer 21 is installed to obtain the attached Fig. 6A The display screen 20 shown in FIG.

[0204] Reference Figure 7 As shown in FIG. 1 , another specific implementation of the display screen 20 according to the present invention is explained.

[0205] In this example, at least part of the protective material 2812 is formed around the light hole 200 of the display screen 20. The protective material 2812 can protect key layers around the light hole 200, such as the cathode layer 253, the pixel definition layer 256, the TFT structure 261, etc.

[0206] The protective material 2812 can be disposed around the light-through hole 200 as required. For example, after obtaining the display screen 20 with the light-through hole 200, the diameter of the light-through hole 200 can be slightly larger than the desired design value, and then the protective material 2812 is filled into the light-through hole 200 until the entire light-through hole 200 is filled, and then the position where the light-through hole 200 is located is cut to obtain the light-through hole 200 of the expected size as required.

[0207] In this example, the driving circuit layer 26 and the pixel layer 25 in the display screen 20 may be protected separately.

[0208] Specifically, the driving circuit layer 26 is first obtained, and the driving circuit layer 26 can be obtained by steps such as film formation on a substrate, photoresist coating, exposure, development, etching, and stripping. After the driving circuit layer 26 is prepared, a small hole penetrating in the height direction can be prepared in the driving circuit layer 26 by etching or drilling. Preferably, the small hole is formed between adjacent TFT structures 261 of the driving circuit layer 26.

[0209] Then, the pixel layer 25 is formed on the driving circuit layer 26 , and the small hole is filled in the process. The materials corresponding to the small hole positions of the pixel layer 25 and the driving circuit layer 26 can be removed to obtain the light-through hole 200 .

[0210] Then, the protective material 2812 is filled toward the light through hole 200 corresponding to the pixel layer 25 and the driving circuit layer 26, and then the protective material 2812 in the light through hole 200 is opened to obtain a hole slightly smaller than the original light through hole 200. At this time, the portions of the pixel layer 25 and the driving circuit layer 26 exposed in the light through hole 200 can be coated by the protective material 2812, so as to be protected by the protective material 2812.

[0211] Then, the other layers of the display screen 20 are mounted on the driving circuit layer 26 and the pixel layer 25. After the mounting is completed, each layer can be drilled or cut so that the light-through hole 200 passes through the display screen 20, or after each layer is mounted, drilling or cutting is performed in alignment with the small hole so that the light-through hole 200 passes through each layer of the display screen 20.

[0212] Reference Figure 8 As shown in the attached Figure 2 To Attachment Figure 5B , another specific implementation of the display screen 20 according to the present invention is explained.

[0213] In this example, at least a portion of the protection material 2812 is filled around the light-through hole 200 of the display screen 20 corresponding to the pixel layer 25 .

[0214] The manufacturing method of the display screen 20 may include the following steps: sequentially forming the TFT structure 261, the anode layer 251, the light emitting layer 252 and the cathode layer 253 on the base substrate 262, and further, forming the planarization layer 255 after forming the TFT structure 261 and before the anode layer 251 on the base substrate 262, removing at least part of the planarization layer 255 in the thickness direction and forming a light hole 200 by a single patterning process. The light hole 200 is formed through the driving circuit layer 26 and the planarization layer 255, and then forming the anode layer 251, the pixel definition layer 256 and the cathode layer 253 on the planarization layer 255.

[0215] An etching process is used to remove at least a portion of the light emitting layer 252 and the cathode layer 253 in the thickness direction corresponding to the opening area. Specifically, an etching process can be used to remove at least a portion of the pixel definition layer 256, the light emitting layer 252, and the cathode layer 253 corresponding to the opening area, so that at least a portion of the planarization layer 255 is exposed.

[0216] The pixel layer 25 is then encapsulated with a protective material 2812, at least a portion of the planarization layer 255 is covered by the protective material 2812, and then the light-through hole 200 is formed in the opening area by cutting or drilling, so that the planarization layer 255 and the pixel definition layer 256 at the edge of the light-through hole 200 can be covered by the protective material 2812.

[0217] In this way, the pixel layer 25 and the driving circuit layer 26 corresponding to the edge of the light hole 200 can be selectively covered with the protective material 2812 as required. The protective material 2812 can not only protect the pixel layer 25, but also control the size of the light hole 200 by controlling the thickness of the protective material 2812 in the radial direction.

[0218] In this example, the position of the light-through hole 200 can be preset, and is preferably set between adjacent TFT structures 261 or between adjacent pixels to avoid affecting the performance of the entire display screen 20 when setting the light-through hole 200 .

[0219] Furthermore, after the pixel layer 25 and the driving circuit layer 26 with the light-through hole 200 are manufactured, the encapsulation layer 24, the polarization layer 23, the touch layer 22, and the cover layer 21 or the back layer 27 can be installed on the pixel layer 25 and the driving circuit layer 26 based on the needs. The encapsulation layer 24, the polarization layer 23, the touch layer 22, and the back layer 27 can be pre-made with holes, or they can be opened after being installed on the pixel layer 25 and the driving circuit layer 26, or they can be opened uniformly after the entire display screen 20 is installed.

[0220] It is worth noting that the cover layer 21 is not perforated. After the layers of the display screen 20 are installed together, holes can be uniformly opened in the layers of the display screen 20 except the cover layer 21 from the side of the back layer 27 of the display screen 20.

[0221] Furthermore, the cover layer 21 may be partially perforated. Specifically, at least a portion of the cover layer 21 in the thickness direction may be perforated. For example, when the display screen 20 is perforated from the back layer 27 toward the cover layer 21 from the back layer 27 side of the display screen 20, at least a portion of the cover layer 21 in the thickness direction may also be removed. However, when observing from the cover layer 21 side of the display screen 20 inward, the cover layer 21 still completely covers the touch layer 22. The cover layer 21 can still protect the other layers of the display screen 20.

[0222] Reference Fig. 9 As shown, a specific implementation of the display screen 20 with the camera module 30 according to the present invention is illustrated.

[0223] The camera module 30 is fixedly mounted on the display screen 20 , and the camera module 30 is aligned with the light hole 200 .

[0224] Specifically, the display screen 20 has a mounting channel 201, wherein at least part of the camera module 30 can be accommodated in the mounting channel 201. The display screen 20 with the back plate layer 27 is taken as an example for description. The mounting channel 201 is formed in the back plate layer 27.

[0225] The mounting channel 201 is located at the position of the light through hole 200, the mounting channel 201 is connected to the light through hole 200, and the mounting channel 201 and the light through hole 200 are located in the height direction of the display screen 20. Preferably, the inner diameter of the mounting channel 201 is greater than the inner diameter of other positions of the light through hole 200, and in this case, the cross-sectional size of the light through hole 200 of the display screen 20 is non-constant.

[0226] When the camera module 30 is installed on the display screen 20 and is partially accommodated in the installation channel 201, the overall height of the camera module 30 and the display screen 20 can be reduced, which is beneficial to reducing the height dimension of the mobile terminal.

[0227] The installation channel 201 is slightly larger than the camera module 30 , and the portion of the installation channel 201 not filled by the camera module 30 may be filled with colloid so that the camera module 30 can be more firmly fixed to the display screen 20 .

[0228] For example, the side surface of the camera module 30 can be bonded to the back plate layer 27 by glue, so that the camera module 30 is fixed to the installation channel 201. The top surface of the camera module 30 can also be fixed to a back surface of the driving circuit layer 26 by glue or other adhesive materials, so that the camera module 30 is firmly held in the installation channel 201.

[0229] At least part of the camera module 30 extends into the light hole 200 of the display screen 20. When the camera module 30 extends into the light hole 200, the size of the light hole 200 corresponding to each layer of the display screen 20 can control the depth of the camera module 30 entering the light hole 200.

[0230] In this example, at least part of the camera module 30 is accommodated in the portion of the light hole 200 corresponding to the backplane layer 27, and the portions of the light hole 200 corresponding to the layers above the backplane layer 27, such as the driving circuit layer 26 and the pixel layer 25, can be smaller than the portion of the light hole 200 corresponding to the backplane layer 27, so that when viewed from the front side of the display screen 20, the light hole 200 occupies a smaller area of ​​the display screen 20. Here, the front side of the display screen 20 refers to the side facing the user during normal use.

[0231] In other embodiments of the present invention, the front end of the camera module 30 may extend to the driving circuit layer 26, or even to the portion of the light hole 200 corresponding to a portion of the pixel layer 25. By controlling the size of the light hole 200 corresponding to each layer, the depth of the camera module 30 extending into the display screen 20 can be controlled, thereby controlling the overall size of the camera module 30 and the display screen 20, especially the height size of the camera module 30 and the display screen 20, by designing the size of the light hole 200 corresponding to each layer of the display screen 20.

[0232] Reference Fig.10 As shown, a display screen 20A with a light hole 200A according to a preferred embodiment of the present invention is illustrated.

[0233] In this example, the display screen 20A is implemented as an LCD display screen 20A. The display screen 20A includes: a cover layer 21A, a touch layer 22A, a polarizing layer 23A, an encapsulation layer 24A, a pixel layer 25A, a driving circuit layer 26A, and a backplane layer 27A, wherein the driving circuit layer 26A is formed on the bottom side of the pixel layer 25A and is electrically connected to the pixel layer 25A for driving the pixel layer 25A to work; the encapsulation layer 24A is formed on the top side of the pixel layer 25A for encapsulating the pixel layer 25A; and the pixel layer 25A includes pixels distributed in an array, each of which has a gap between them, so that light that sequentially passes through the cover layer 21A, the touch layer 22A, the polarizing layer 23A, and the encapsulation layer 24A can pass through the pixel layer 25A through the gap.

[0234] For the LCD display screen 20A, the liquid crystals in the pixel layer 25A are arranged in an orderly manner when powered on.

[0235] In particular, the display screen 20A further comprises the light through hole 200A, wherein the light through hole 200A passes through the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A and the driving circuit layer 26A.

[0236] The polarization layers 23A may be located at both sides of the pixel layer 25A, and may be implemented as a first polarizer and a second polarizer.

[0237] The pixel layer 25A includes a filter layer 251A (CF) and a liquid crystal 252A, and the liquid crystal 252A is located between the filter layer 251A and the driving circuit layer 26A. Taking TFT-LCD as an example, the driving circuit layer 26A may include a plurality of TFT structures and the substrate, and the TFT structure is formed on the substrate through steps such as thin film, yellow light, etching, and film stripping.

[0238] The light-through hole 200A is formed in each layer of the display screen 20A except the cover layer 21A, and penetrates each layer of the display screen 20A except the cover layer 21A in the height direction of the display screen 20A.

[0239] The light from above the display screen 20A or outside the display screen 20A can pass through the light hole 200A to be received by the camera module 30 located below the display screen 20A or inside the display screen 20A.

[0240] The light through hole 200A is surrounded by a sealing material to prevent the liquid crystal 252A from flowing into the light through hole 200A, thereby avoiding affecting the working performance of the camera module 30 or the display performance of the display screen 20A.

[0241] Furthermore, the LCD display screen 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A and the driving circuit layer 26A.

[0242] There are three main methods for manufacturing the LCD display screen 20A with the light-through hole 200A. The first is to make a unified hole in each layer of the LCD display screen 20A after the layers of the LCD display screen 20A are assembled together. The second is to make a separate hole in the liquid crystal layer 28A of the LCD display screen 20A, and then install the other layers of the LCD display screen 20A on the liquid crystal layer 28A, and then make a unified hole in the other layers of the LCD display screen 20A. The third is to make a separate hole in the liquid crystal layer 28A of the LCD display screen 20A, and then install the other layers of the LCD display screen 20A on the liquid crystal layer 28A layer by layer, and make holes in each layer of the LCD display screen 20A layer by layer.

[0243] Those skilled in the art should know that the above is only an example, and the method for manufacturing the LCD display screen 20A with the light-through hole 200A is not limited to the above example.

[0244] Reference Fig.11 As shown, a specific method for manufacturing the LCD display screen 20A with the light-through hole 200A according to the present invention is explained.

[0245] In this example, the LCD display screen 20A with the light-through hole 200A can be obtained by a single opening.

[0246] Specifically, during the manufacturing process of the liquid crystal layer 28A, a sealing region 281A is formed between the driving circuit layer 26A and the filter layer 251A of the liquid crystal layer 28A, wherein the sealing region 281A may be formed by surrounding a sealing material 2811A. The liquid crystal 252A of the liquid crystal layer 28A is mainly disposed outside the sealing region 281A.

[0247] Then, the layers of the LCD display screen 20A are assembled into a complete LCD display screen 20A. The LCD display screen 20A is subjected to a hole opening process based on the sealing area 281A.

[0248] The LCD display screen 20A has an opening area 282A, wherein the opening area 282A overlaps the sealing area 281A and is not larger than the sealing area 281A. After the opening process is performed on the LCD display screen 20A, at least part of the sealing area 281A is removed, and the liquid crystal 252A located between the sealing areas 281A cannot pass through the sealing material 2811A due to the blocking effect of the sealing material 2811A, so that the liquid crystal 252A cannot overflow to the position of the light-through hole 200A.

[0249] In this way, the LCD display screen 20A can obtain the light-through hole 200A through a single hole-opening operation.

[0250] More specifically, the sealing material 2811A may be disposed at a preset position of the driving circuit layer 26A of the liquid crystal layer 28A to form the sealing region 281A, and the shape of the sealing region 281A may be a circle, a triangle, or a rectangle. Then, the liquid crystal 252A is filled in a position outside the sealing region 281A of the driving circuit layer 26A.

[0251] After the liquid crystal 252A is filled, the filter layer 251A can be installed on the driving circuit layer 26A. The liquid crystal 252A is located between the driving circuit layer 26A and the filter layer 251A and is confined to a fixed area.

[0252] After the opening process is performed on the liquid crystal layer 28A, the opening area 282A is smaller than the sealing area 281A, and at least part of the sealing material 2811A can be retained between the driving circuit layer 26A and the filter layer 251A, so that the liquid crystal 252A will not overflow from the position of the sealing material 2811A. The liquid crystal 252A can still be confined in the original fixed area.

[0253] In this way, the opening process of the liquid crystal layer 28A can be completed while keeping the liquid crystal 252A in the liquid crystal layer 28A from overflowing.

[0254] It is worth noting that after the display screen 20A is installed, if a hole can be opened outside the display screen 20A aligned with the sealing area 281A, then the hole opening process can be performed directly, for example, when the sealing area 281A can be observed outside the display screen 20A.

[0255] If the sealing material 2811A is an opaque material and the position of the sealing area 281A cannot be determined outside the display screen 20A, a mark may be provided in the sealing area 281A so that the position of the sealing area 281A can be determined outside the display screen 20A.

[0256] It is worth noting that the position of the sealing material 2811A can be set to avoid the circuit part corresponding to the driving circuit layer 26A in the height direction to reduce the impact on the circuit of the driving circuit layer 26A.

[0257] Reference Fig.12 As shown, a specific method for manufacturing the LCD display screen 20A with the light-through hole 200A according to the present invention is explained.

[0258] In this example, the liquid crystal layer 28A is firstly opened, and then the other layers of the display screen 20A are opened.

[0259] Specifically, a sealing area 281A is provided in a preset area of ​​the driving circuit layer 26A to prevent the liquid crystal 252A outside the sealing area 281A from flowing into the sealing area 281A during the subsequent filling of the liquid crystal 252A. After the sealing area 281A is provided, the driving circuit layer 26A may be subjected to an opening process along an opening area 282A. The opening area 282A is located within the sealing area 281A. After the filter layer 251A is installed on the driving circuit layer 26A, the driving circuit layer 26A and the filter layer 251A may also be subjected to an opening process along the opening area 282A at the same time.

[0260] According to some embodiments of the present invention, the order of opening the liquid crystal layer 28A may be to open the driving circuit layer 26A first and then open the filter layer 251A.

[0261] For example, based on the sealing area 281A, the driving circuit layer 26A within the sealing area 281A is first subjected to a hole opening process, and then the liquid crystal 252A is filled in a preset area of ​​the driving circuit layer 26A, and then the filter layer 251A is installed on the driving circuit layer 26A, and then the filter layer 251A is subjected to a hole opening process.

[0262] Furthermore, after the driving circuit layer 26A is opened in the sealing area 281A, the area outside the sealing area 281A of the driving circuit layer 26A needs to be filled with liquid crystal 252A so that the display screen 20A can work normally in subsequent steps.

[0263] Further, according to some other embodiments of the present invention, an opening area 282A of the driving circuit layer 26A may be opened, and then a sealing material 2811A may be disposed around the opening area 282A to form the sealing area 281A. The liquid crystal 252A is filled outside the sealing area 281A and cannot flow into the sealing area 281A through the sealing material 2811A due to the obstruction of the sealing material 2811A. In other words, after the opening, the liquid crystal 252A cannot flow to the position of the light-through hole 200A, so as to facilitate the lighting effect of the light-through hole 200A in the subsequent steps.

[0264] Then the filter layer 251A is mounted on the driving circuit layer 26A, and a hole is opened in alignment with the opening area 282A of the driving circuit layer 26A. At this time, the liquid crystal 252A between the filter layer 251A and the driving circuit layer 26A is still kept outside the sealing area 281A and will not flow to the position of the light through hole 200A.

[0265] Then, the other layers of the display screen 20A, such as the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover layer 21A, can be installed to the liquid crystal layer 28A in a certain order. The hole opening process can be performed on each layer layer by layer during the installation of each functional layer, or the hole opening process can be performed on each layer at the same time after the other layers are installed.

[0266] Preferably, in this example, the cover plate layer 21A of the display screen 20A is not subjected to a hole-perforating process, and the display screen 20A with the light-through hole 200A can be obtained by first installing each layer of the display screen 20A to obtain a complete display screen 20A, and then punching each layer except the cover plate layer 21A. Alternatively, each layer of the display screen 20A except the cover plate layer 21A can be first installed, and then holes are punched, and finally the cover plate layer 21A is installed to obtain a complete display screen 20A.

[0267] It is worth noting that the cover layer 21A of the display screen 20A may be subjected to a hole opening process, and then the cover layer 21A may be filled with a transparent material, so that pollutants such as dust or moisture may enter into other layers of the display screen 20A through the portion of the light-through hole 200A corresponding to the outermost cover layer 21A.

[0268] It is worth noting that before all layers are installed and then the holes are drilled uniformly, or before drilling each layer one by one, the drilling area 282A can be located in various ways to facilitate the subsequent accurate drilling. For example, the drilling area 282A can be located by mechanical recognition, and then the drilling process can be performed on other layers at the same position based on this data.

[0269] It is worth noting that the sealing material 2811A for separating the light through hole 200A and the liquid crystal 252A can be set in the driving circuit layer 26A, can be set in the filter layer 251A, or can be set in the driving circuit layer 26A and the filter layer 251A respectively.

[0270] According to some other embodiments of the present invention, for example, the sealing material 2811A is disposed on the filter layer 251A. After the driving circuit layer 26A is filled with the liquid crystal 252A, the filter layer 251A provided with the sealing material 2811A is covered on the driving circuit layer 26A, and the liquid crystal 252A is separated inside and outside the sealing area 281A by means of the sealing material 2811A. The sealing material 2811A disposed on the filter layer 251A is closely attached to the driving circuit layer 26A, and the liquid crystal 252A outside the sealing area 281A cannot pass through the sealing material 2811A to the inside of the sealing area 281A. Then, the driving circuit layer 26A and the filter layer 251A are subjected to a hole opening process in the sealing area 281A to obtain the light-through hole 200A penetrating the driving circuit layer 26A and the filter layer 251A.

[0271] According to some other embodiments of the present invention, the order of opening the liquid crystal layer 28A may be to open the filter layer 251A first and then open the drive circuit layer 26A.

[0272] For example, an opening area 282A of the filter layer 251A may be opened first, and then a sealing material 2811A may be disposed around the opening area 282A to form the sealing area 281A. The liquid crystal 252A is filled outside the sealing area 281A and cannot flow into the sealing area 281A through the sealing material 2811A due to the obstruction of the sealing material 2811A. In other words, after the opening, the liquid crystal 252A cannot flow to the position of the light-through hole 200A, so as to ensure the lighting effect of the light-through hole 200A in the subsequent steps.

[0273] After the filter layer 251A is opened, the filter layer 251A is installed on the driving circuit layer 26A, and the sealing material 2811A disposed on the filter layer 251A is tightly attached to the driving circuit layer 26A, and the sealing material 2811A forms the sealing area 281A.

[0274] Then, the driving circuit layer 26A is subjected to a hole-opening process aligned with the hole-opening area 282A of the filter layer 251A. After the hole-opening of the driving circuit layer 26A is performed, the liquid crystal 252A located in the sealing area 281A can flow to the outside.

[0275] Furthermore, after installing other layers of the display screen 20A, such as the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A and the back panel layer 27A, the entire display screen 20A can be opened to allow the light-through hole 200A of the filter layer 251A to pass through all layers of the entire display screen 20A except the cover layer 21A.

[0276] Alternatively, during the process of installing other layers of the display screen 20A, the layers that have been aligned for installation may be subjected to a hole-opening process. For example, after installing the polarizing layer 23A and the touch layer 22A, the polarizing layer 23A and the touch layer 22A may be subjected to a hole-opening process so that the light-through hole 200A of the filter layer 251A passes through all layers of the display screen 20A except the cover layer 21A. Then, the cover layer 21A may be installed to obtain a complete display screen 20A.

[0277] According to some other embodiments of the present invention, the order of opening the holes in the liquid crystal layer 28A may be to open the holes in the filter layer 251A and the drive circuit layer 26A at the same time.

[0278] For example, the sealing material 2811A is disposed between the filter layer 251A and the driving circuit layer 26A. The sealing material 2811A can be disposed on the filter layer 251A or the driving circuit layer 26A or both the filter layer 251A and the driving circuit layer 26A.

[0279] The opening area 282A is formed in the sealing area 281A. After the liquid crystal layer 28A is opened, at least part of the sealing material 2811A remains between the filter layer 251A and the driving circuit layer 26A to prevent the liquid crystal 252A between the filter layer 251A and the driving circuit layer 26A from flowing out.

[0280] The process of opening the holes in the liquid crystal layer 28A may be to first place the sealing material 2811A on the driving circuit layer 26A, and then fill the driving circuit layer 26A with liquid crystal 252A. The liquid crystal 252A is located outside the sealing area 281A formed by the sealing material 2811A.

[0281] It is understandable that the sealing material 2811A may be transparent or have high light transmittance, which is beneficial to the propagation of light at the position of the light hole 200A corresponding to the liquid crystal layer 28A. The sealing material 2811A may also be a light shielding material to reduce the influence of stray light near the position of the light hole 200A corresponding to the liquid crystal layer 28A on the light transmission effect of the light hole 200A. In other words, the type of the sealing material 2811A can be selectively set according to needs.

[0282] Then, the filter layer 251A is installed on the driving circuit layer 26A. A sealing area 281A is formed between the sealing material 2811A, the driving circuit layer 26A and the filter layer 251A. For the sealing area 281A, the liquid crystal 252A outside the sealing area 281A cannot flow into the sealing area 281A.

[0283] After the filter layer 251A and the driving circuit layer 26A are installed together to form the liquid crystal layer 28A, the liquid crystal layer 28A may be subjected to a hole-opening process. Alternatively, after the entire display screen 20A is installed, the entire display screen 20A may be subjected to a hole-opening process aligned with the sealing area 281A.

[0284] Further, it can be understood that after the liquid crystal layer 28A is subjected to the hole-opening process, the hole-opening order of the other layers of the display screen 20A can be selected according to the requirements. The encapsulation layer 24A can be installed on the liquid crystal layer 28A, and then the encapsulation layer 24A is subjected to the hole-opening process aligned with the liquid crystal layer 28A. Then, the touch layer 22A is installed on the encapsulation layer 24A, and then the touch layer 22A is subjected to the hole-opening process aligned with the liquid crystal layer 28A and the encapsulation layer 24A.

[0285] Alternatively, after the installation of the layers above the liquid crystal layer 28A is completed, the layers above the liquid crystal layer 28A are uniformly subjected to the hole-opening process. Then, after the installation of the layers below the liquid crystal layer 28A is completed, the layers below the liquid crystal layer 28A are uniformly subjected to the hole-opening process.

[0286] The layers of the display screen 20A may also be pre-drilled with holes and then aligned with the liquid crystal layer 28A for installation.

[0287] Furthermore, if it is necessary to perform a hole-opening process on the entire LCD display screen 20A, that is, the cover layer 21A is also subjected to a hole-opening process, when the entire LCD display screen 20A is subjected to a hole-opening process, the polarizing layer 23A is made of an opaque material, and the cover layer 21A and the touch layer 22A can be made of a translucent material. The opaque material prevents the sealed area 281A of the liquid crystal layer 28A from being observed from the outside of the display screen 20A, which is not conducive to aligning the hole-opening process with the sealed area 281A. Therefore, the polarizing layer 23A can be subjected to a hole-opening process, and then the cover layer 21A can be subjected to a hole-opening process, so that the cover layer 21A can be subjected to a hole-opening process based on the light-through hole 200A portion of the polarizing layer 23A when the hole-opening process is performed, so that the light-through hole 200A portions of each layer can be aligned with each other.

[0288] Reference Fig.13 FIG. 2 is a diagram showing a specific implementation of the LCD display screen 20A of the present invention. In the above embodiment, the inner diameters of the light-through holes 200A corresponding to the layers of the LCD display screen 20A are the same.

[0289] In this embodiment, the inner diameters of the light-through holes 200A corresponding to the layers of the LCD display screen 20A are different.

[0290] After the liquid crystal layer 28A is formed, the encapsulation layer 24A, the polarizing layer 23A, the touch layer 22A and the cover layer 21A may be installed above the liquid crystal layer 28A, and another polarizing layer 23A and the backplane layer 27A may be installed below the liquid crystal layer 28A. The backplane layer 27A of the LCD display screen 20A is indispensable, and the backplane layer 27A can emit light when powered.

[0291] The liquid crystal layer 28A may be pre-perforated, and then the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A and the cover layer 21A may be installed, wherein the encapsulation layer 24A, the polarization layer 23A and the touch layer 22A may be pre-perforated, or they may be uniformly perforated after being installed together. The other polarization layer 23A installed below the liquid crystal layer 28A may also be pre-perforated, or it may be perforated after being installed on the liquid crystal layer 28A. The cover layer 21A may be installed on the touch layer 22A after the other layers of the display screen 20A are perforated, or after the layers including the cover layer 21A are installed together, the layers of the display screen 20A except the cover layer 21A may be perforated.

[0292] The inner diameter of the portion of the liquid crystal layer 28A corresponding to the light hole 200A may be different from the inner diameters of other layers of the display screen 20A. For example, in this example, the inner diameter of the portion of the liquid crystal layer 28A corresponding to the light hole 200A is slightly smaller than the encapsulation layer 24A, the polarization layer 23A and the touch layer 22A.

[0293] In other embodiments of the present invention, the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A and the liquid crystal layer 28A of the LCD display screen 20A from top to bottom can obtain the light hole 200A with a uniform inner diameter through laser cutting, drilling and other processes.

[0294] For the backplane layer 27A located below the liquid crystal layer 28A, the backplane layer 27A can be opened separately, and the inner diameter of the light-through hole 200A corresponding to the backplane layer 27A can be different from the inner diameter of the light-through hole 200A corresponding to the liquid crystal layer 28A, the touch layer 22A and the polarization layer 23A.

[0295] In this example, the inner diameter of the light hole 200A portion corresponding to the back plate layer 27A is larger than the inner diameter of the light hole 200A portion corresponding to the liquid crystal layer 28A. The light hole 200A portion corresponding to the back plate layer 27A penetrates the light hole 200A portion corresponding to the liquid crystal layer 28A.

[0296] The display screen 20A has a mounting channel 201A, wherein the mounting channel 201A is formed on the back panel layer 27A and is connected to the light-through hole 200A.

[0297] Optionally, the light hole 200A corresponding to the back plate layer 27A is larger than the sealing area 281A. At least part of the camera module 30 can be accommodated in the back plate layer 27A, which is conducive to reducing the height of the camera module 30 and the display screen 20A.

[0298] For further information, please refer to the attached Fig. 9 , one mounting end of the camera module 30 includes a part of a lens and a lens barrel, and the light hole 200A portion of the back plate layer 27A can be designed to be large enough to accommodate the lens and the lens barrel portion, and for the liquid crystal layer 28A and the layers above the liquid crystal layer 28A corresponding to the light hole 200A portion, the aperture size of the light hole 200A can meet the light intake requirement of the camera module 30. In other words, when the camera module 30 extends into the LCD display screen 20A, so that the camera module 30 is installed in the LCD display screen 20A, thereby reducing the installation height of the camera module 30 and the LCD display screen 20A, the light hole 200A located above can still be designed to be small enough so that the light hole 200A is not easily observed from the outside of the display screen 20A, and at the same time, the light hole 200A can provide sufficient installation space for the camera module 30.

[0299] It can be understood that the camera module 30 can not only be accommodated in the part of the light hole 200A corresponding to the back panel layer 27A, but the camera module 30 can also go deeper into the LCD display screen 20A. For example, the camera module 30 can also be accommodated in the part of the light hole 200A corresponding to the driving circuit layer 26A.

[0300] Reference Fig.14A As shown, a specific implementation of the LCD display screen 20A of the present invention is illustrated.

[0301] In this embodiment, the cover layer 21A of the display screen 20A is not subjected to hole opening processing. The touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the drive circuit layer 26 and the backplane layer 27 are subjected to hole opening processing respectively, and then the protective material 2812 is filled in the hole positions.

[0302] The light quality of the camera module 30 is affected by the light hole 200A. Specifically, the layers of material of the LCD display screen 20A around the light hole 200A will reflect and refract the light entering the light hole 200A, so that the light entering the camera module 30 is affected by the material around the light hole 200A.

[0303] Due to the different materials of each layer and the different positions of the light through hole 200A, it is difficult to achieve the same level of material around each light through hole 200A on the production line. In other words, it is difficult to maintain consistent light quality through the light through hole 200A and requires debugging and processing at a later stage.

[0304] In this example, after obtaining the LCD display screen 20A with the light through hole 200A, a certain protective material 2812A can be injected into the light through hole 200A, wherein the protective material 2812A can protect the layers around the light through hole 200A, for example, the driving circuit layer 26A, so as to reduce the possible corrosion of the driving circuit layer 26A by water and oxygen.

[0305] After the light through hole 200A is filled with the protective material 2812A, at least a portion of the protective material 2812A may be removed by drilling or laser cutting, so that at least a portion of the area around the light through hole 200A is filled with the protective material 2812A.

[0306] The protective material 2812A may be a light-transmitting material, through which light can pass. The protective material 2812A may be an opaque material, so that stray light from around the light hole 200A cannot pass through the protective material 2812A and be received by the camera module 30. The material of the protective material 2812A may be selected based on demand, so as to control the quality of light entering the light hole 200A by controlling the protective material 2812A in the light hole 200A.

[0307] It is worth mentioning that when the light through hole 200A corresponding to each layer has certain deviations due to the processing technology or the installation technology, the protective material 2812A can be used to make certain compensation.

[0308] Attached Fig. 14B It is another embodiment of the LCD display screen 20A of the present invention. Fig.14A The difference between the display screen 20A shown in FIG. 2 is that in this embodiment, each layer of the display screen 20A is individually opened and then filled with a protective material 2812A.

[0309] Specifically, the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A and the backplane layer 27A may be respectively subjected to opening processing, and then the protective material 2812A may be filled in the opening positions.

[0310] Then the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A and the backplane layer 27A are aligned and installed together to form the display screen 20A. At this time, the display screen 20A can be used as a display screen with a "hole". The transparent materials corresponding to the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A and the backplane layer 27A can play the role of the hole.

[0311] Furthermore, the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A and the backplane layer 27A can be simultaneously subjected to a hole-opening process, and a portion of the protective material 2812A is left around the light-through hole 200A. Then, the cover layer 21A is installed to obtain the display screen 20A.

[0312] Reference Fig.15 and attached Fig.16 As shown, a specific implementation of the LCD display screen 20A of the present invention is illustrated.

[0313] The portion of the light-through hole 200A corresponding to the liquid crystal layer 28A, the portion of the light-through hole 200A corresponding to the polarization layer 23A, and the portion of the light-through hole 200A corresponding to the cover layer 21A are not aligned. This may be caused by various factors, such as the control of the hole position accuracy during the hole opening process, the alignment accuracy during the installation process, or the deviation during fixation during the installation process.

[0314] The protective material 2812A is poured into the light hole 200A to fill the light hole 200A, and then at least a portion of the protective material 2812A is removed according to a certain opening area 282A to re-form the light hole 200A. At this time, the inner diameter of the light hole 200A can be kept consistent.

[0315] Of course, it is understandable that in this example, the light hole 200A is reprocessed after the entire LCD display screen 20A is installed. In other embodiments of the present invention, the light hole 200A can be adjusted after some functional layers of the LCD display screen 20A are installed together.

[0316] For example, when the liquid crystal layer 28A, the polarizing layer 23A and the touch layer 22A are assembled together, but there is a certain deviation between the portions of the light-through hole 200A corresponding to the liquid crystal layer 28A, the polarizing layer 23A and the touch layer 22A, the protective material 2812A can be filled in the portions of the light-through hole 200A corresponding to the liquid crystal layer 28A, the polarizing layer 23A and the touch layer 22A, and then the light-through hole 200A is formed again. Then, another polarizing layer 23A and the backlight plate are installed on the liquid crystal layer 28A.

[0317] The protective material 2812A may not cover the portion of the light-through hole 200A corresponding to the polarizing layer 23A and the backplane layer 27A. Fig.15 shown.

[0318] In this way, the protective material 2812A can be selectively covered on each layer of the LCD display 20A.

[0319] Reference Fig.17 As shown, a specific implementation of the LCD display screen 20A of the present invention is illustrated.

[0320] The LCD display screen 20A has a light hole 200A, and a light guide component 50A is disposed in the light hole 200A. The light guide component 50A has a light guide channel 500A, and light can pass through the LCD display screen 20A along the light guide channel 500A.

[0321] Specifically, the LCD display screen 20A includes a cover layer 21A, a touch layer 22A, a polarizing layer 23A, a packaging layer 24A, a pixel layer 25A, a driving circuit layer 26A and a backplane layer 27A, wherein the polarizing layer 23A is located on opposite sides of the pixel layer 25A.

[0322] The cover layer 21A is located at the top of the LCD display screen 20A, the touch layer 22A can transmit signals when being touched, the encapsulation layer 24A is used for encapsulation, the pixel layer 25A includes a filter layer 251A (CF) and a liquid crystal 252A, and the liquid crystal 252A is located between the filter layer 251A and the drive circuit layer 26A. The drive circuit layer 26A includes a plurality of TFT structures and the substrate, and the TFT structure is formed on the substrate through the steps of thin film, yellow light, etching, film stripping, etc. The backplane layer 27A is used to emit light.

[0323] The LCD display screen 20A further includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the pixel layer 25A and the driving circuit layer 26A. The liquid crystal 252A is located between the filter layer 251A and the driving circuit layer 26A.

[0324] The light through hole 200A passes through various layers of the LCD display screen 20A, and the light guide component 50A is accommodated in the light through hole 200A.

[0325] The light-through hole 200A may be formed by opening holes in each layer of the LCD display screen 20A, or by opening holes in the liquid crystal layer 28A of the LCD display screen 20A, sealing the liquid crystal layer 28A to prevent the liquid crystal 252A in the liquid crystal layer 28A from leaking to the outside, and then opening holes in other layers of the LCD display screen 20A.

[0326] For the former method, specifically, the liquid crystal layer 28A is processed in advance during the manufacturing process to form a sealing area 281A, wherein the sealing area 281A is not filled with the liquid crystal 252A, and the liquid crystal 252A is located outside the sealing area 281A. For example, a sealing material 2811A can be provided between the filter layer 251A and the driving circuit layer 26A to form the sealing area 281A.

[0327] For the latter method, specifically, the liquid crystal layer 28A is processed in advance during the manufacturing process to form a sealing area 281A, wherein the sealing area 281A is not filled with the liquid crystal 252A, and the liquid crystal 252A is located outside the sealing area 281A. For example, a sealing material 2811A can be provided between the filter layer 251A and the driving circuit layer 26A to form the sealing area 281A.

[0328] Then, the liquid crystal layer 28A is subjected to a hole-opening process based on the sealing area 281A, and the other layers of the LCD display screen 20A are aligned with the liquid crystal layer 28A to perform a hole-opening process.

[0329] In this example, the inner diameter of the light hole 200A can be set slightly larger to accommodate the light guide component 50A. It is worth noting that when the light hole 200A portions corresponding to the layers of the LCD display screen 20A are slightly deviated, the light guide component 50A can compensate for the deviation between the layers of the LCD display screen 20A caused during the installation process to a certain extent.

[0330] Specifically, when the portions of the light through hole 200A corresponding to the layers of the LCD display screen 20A are slightly deviated, at least part of the light entering the light through hole 200A will be lost when passing through the light through hole 200A. When the light guide component 50A is disposed in the light through hole 200A, most of the light can be directly transmitted along the light guide channel 500A of the light guide component 50A, thereby reducing the loss of light in the LCD display screen 20A due to the installation deviation between the layers.

[0331] The light guiding performance of the light guiding component 50A can be set based on the requirements. When the light guiding efficiency of the light guiding component 50A is required to be high, the light guiding component 50A can be set to a transparent material, and when it is necessary to reduce the influence of external stray light on the light in the light guiding channel 500A, the outer wall of the light guiding component 50A can be coated with a light shielding material.

[0332] Reference Fig.18A and attached Fig.18B As shown, an implementation of the terminal device 1 based on the present invention is explained.

[0333] The terminal device 1 includes a terminal device body 10, a display screen 20 and a camera module 30, wherein the display screen 20 and the camera module 30 are respectively arranged on the terminal device body 10. The display screen 20 is used to display images, and the camera module 30 is held below the display screen 20, so that the display screen 20 is designed as a full screen.

[0334] The terminal device 1 further includes a shell 40 and a light guide channel 500, wherein the display screen 20 is installed in the shell 40, and the shell 40 is located around the display screen 20, which supports the display screen 20 on the one hand and protects the display screen 20 on the other hand.

[0335] The light guide channel 500 is formed between the display screen 20 and the housing 40 , and the light guide channel 500 connects the outside world and the camera module 30 , so that the outside light is transmitted to the camera module 30 through the light guide channel 500 .

[0336] In this way, the camera module 30 can be disposed below the display screen 20 and does not occupy the display area of ​​the display screen 20 , so that the display screen 20 can achieve a full-screen effect.

[0337] Specifically, the terminal device 1 has at least one light guide channel 500, wherein at least part of the light guide channel 500 is formed between the display screen 20 and the housing 40, and at least part of the light guide channel 500 is formed in the display screen 20 to transmit light to the camera module 30 located below the display screen 20. Some light guide elements may be arranged in the light guide channel 500 so that the propagation direction of the light propagating in a straight line can be changed, and the light is transmitted from the outside of the display screen 20 to the camera module 30 located inside the display screen 20 through the light guide channel 500. The light guide element may be a reflective film or a reflector.

[0338] In other embodiments of the present invention, at least a portion of the light guide channel 500 is located between the display screen 20 and the housing 40, and at least the remaining portion may be located below the display screen 20. In other words, the light guide channel 500 goes from the side of the display screen 20 to the bottom of the display screen 20, and then guides the light to the camera module 30.

[0339] In this example, taking the OLED display screen 20 as an example, the light guide channel 500 can be selectively formed in each layer of the OLED display screen 20, such as the pixel layer 25, the drive circuit layer 26 or the backplane layer 27. Preferably, when the light guide channel 500 passes through the pixel layer 25, the light guide channel 500 is arranged between adjacent pixels to reduce the impact on the imaging effect. Preferably, when the light guide channel 500 passes through the drive circuit layer 26, the light guide channel 500 is arranged in the non-circuit part of the drive circuit layer 26 to reduce the impact on the working performance of the drive circuit layer 26.

[0340] In this example, the light guide channel 500 passes through the back panel layer 27 , and then transmits the light to the camera module 30 located below the display screen 20 through the light guide channel 500 .

[0341] The light guide channel 500 includes a first portion of the light guide channel 501, a second portion of the light guide channel 502, and a third portion of the light guide channel 503, wherein the first portion of the light guide channel 501 is located between the display screen 20 and the housing 40. It is worth noting that when the display screen 20 is installed in the housing 40, there is a natural gap between the display screen 20 and the housing 40, and the desired first portion of the light guide channel 501 can be obtained by designing the edge of the display screen 20 or the edge of the housing 40.

[0342] The second light guide channel 502 is located in the display screen 20, and the third light guide channel 503 is located in the display screen 20. The second light guide channel 502 is used to transmit light from the outside through the first light guide channel 501 to the display screen 20. The third light guide channel 503 is used to transmit the light in the display screen 20 to the camera module 30.

[0343] The second portion of the light guiding channel 502 can guide light along the length and width direction of the display screen 20 , and the third portion of the light guiding channel 503 can guide light along the height direction of the display screen 20 .

[0344] Furthermore, the first light guiding channel 501 of the light guiding channel 500 can converge light, so that more light can enter the second light guiding channel 502 after passing through the first light guiding channel 501. The second light guiding channel 502 can transmit light.

[0345] In this example, the camera module 30 is installed on the display screen 20 and is located below the display screen 20. The camera module 30 forms an image based on the light of the light guide channel 500. The third part of the light guide channel 503 can be configured to diffuse the light so that the diffused light matches the light receiving area of ​​the camera module 30.

[0346] The first light-guiding channel 501 may be provided with a micro convex lens to converge the light. The second light-guiding channel 502 may be provided with at least one reflector or other modulation device to transmit the light along the second light-guiding channel 502 to the third light-guiding channel 503. The third light-guiding channel 503 may be provided with a micro concave lens to diffuse the light.

[0347] Furthermore, the camera module 30 includes an optical unit 31A and a photosensitive unit 32A, wherein the optical unit 31A collects light, the photosensitive unit 32A receives the light collected by the optical unit 31A, and converts the light signal into an electrical signal based on photoelectric conversion for subsequent imaging. The optical unit 31A may include a converging element 311A, a modulating element 312A, and a diffusing element 313A. The converging element 311A ​​can converge the light, the modulating element 312A can modulate the light, such as filtering, dispersion, collimation, etc., and the diffusing element 313A can diffuse the light.

[0348] The optical unit 31A may be disposed in the light guide channel 500, for example, the first partial light guide channel 501, the second partial light guide channel 502, and the third partial light guide channel 503. The photosensitive unit 32A is directly disposed on the display screen 20 and is located below the display screen 20. After the optical unit 31A collects the light, the photosensitive unit 32A converts the light signal into an electrical signal.

[0349] Specifically, the convergence member 311A ​​may be disposed in the first partial light guide channel 501, and is used to converge the light entering the light guide channel 500 from the outside, so that the inner diameter of the second partial light guide channel 502 can be designed to be smaller while transmitting more light. The modulation member 312A may be disposed in the second light guide channel 500. The diffusion member 313A may be disposed in the third partial light guide channel 503, so as to diffuse the light to a photosensitive area corresponding to the photosensitive unit 32A of the camera module 30.

[0350] In this way, the size of the light guide channel 500 in the display screen 20 can be set smaller to reduce the influence of the light guide channel 500 on the imaging of the display screen 20. The manufacture and formation of the light guide channel 500 in the display screen 20 can refer to the above.

[0351] The optical unit 31A may include but is not limited to optical components such as the concave lens and the convex lens.

[0352] Furthermore, in some other embodiments of the present invention, the concave lens located in the third partial light guide channel 503 may be disposed on the display screen 20, for example, taking the encapsulation layer 24 as an example, the diffuser 313A is disposed on the encapsulation layer 24. Light from the outside is diffused after passing through the diffuser 313A of the encapsulation layer 24, and then transmitted to the photosensitive unit 32A of the camera module 30 through the third partial light guide channel 503, thereby being converted into an electrical signal.

[0353] The diffusion member 313A may be integrally formed on the packaging layer 24 , wherein the packaging layer 24 is generally made of glass. According to some embodiments of the present invention, the diffusion member 313A may be integrally formed on the top surface of the packaging layer 24 in a concave manner.

[0354] Reference Fig.19 As shown, please refer to the attached Fig.18A , another specific implementation of the terminal device 1 according to the present invention is explained.

[0355] In this example, the terminal device 1 includes a terminal device body 10, a display screen 20 and a camera module 30, wherein the display screen 20 and the camera module 30 are respectively arranged on the terminal device body 10. The display screen 20 is used to display images, and the camera module 30 is held below the display screen 20, so that the display screen 20 is designed as a full screen.

[0356] The terminal device 1 further includes a shell 40 and a light guide channel 500, wherein the display screen 20 is installed in the shell 40, and the shell 40 is located around the display screen 20, which supports the display screen 20 on the one hand and protects the display screen 20 on the other hand.

[0357] At least a portion of the light guide channel 500 is located between the display screen 20 and the housing 40 and extends to the display screen 20. Light from the outside reaches the display screen 20 after passing through the gap between the display screen 20 and the housing 40, and is then received by the camera module 30 located below the display screen 20.

[0358] The terminal device 1 further includes an optical unit 31A, wherein the optical unit 31A is disposed in the light guiding channel 500. The optical unit 31A can converge, diffuse or collimate the light.

[0359] The camera module 30 includes an optical mechanism 31A' and a photosensitive unit 32A, wherein the optical mechanism 31A' is held in the photosensitive path of the photosensitive unit 32A. The photosensitive unit 32A can convert light signals into electrical signals based on photoelectric conversion. The optical mechanism 31A' may include components such as optical lenses.

[0360] In this example, the camera module 30 is a separate complete camera module 30. Under the premise that the optical unit 31A is not provided in the light guide channel 500, the camera module 30 can still form an image based on the light passing through the light guide channel 500.

[0361] Some light guide elements may be arranged in the light guide channel 500 so that the propagation direction of the straight-line propagating light can be changed and the light is transmitted from the outside of the display screen 20 to the camera module 30 located inside the display screen 20 through the light guide channel 500. The light guide element may be a reflective film or a reflective mirror.

[0362] The light guide channel 500 may include a first partial light guide channel 501, a second partial light guide channel 502 and a third partial light guide channel 503, wherein the first partial light guide channel 501 is located between the shell 40 and the display screen 20, the second partial light guide channel 502 guides the light of the first partial light guide channel 501 into the display screen 20, and the third partial light guide channel 503 guides the light of the second partial light guide channel 502 to leave the display screen 20 to be received by the camera module 30.

[0363] The optical unit 31A may be disposed in the first partial light guiding channel 501 , the second partial light guiding channel 502 , and the third partial light guiding channel 503 .

[0364] It can be understood that the type and setting position of the optical unit 31A can be selected according to needs, so that when the light passes through the light guide channel 500 of the light guide assembly 50, it can be adjusted to meet the light input requirements of the camera module 30 under the action of the optical unit 31A.

[0365] Reference Fig. 20 As shown, please refer to the attached Fig.18A , another preferred embodiment of the terminal device 1 according to the present invention is explained.

[0366] In this example, the terminal device 1 includes a terminal device body 10, a display screen 20, a camera module 30, a housing 40, and a light guide component 50, wherein the display screen 20 is mounted on the terminal device body 10, the display screen 20 and the terminal device body 10 are mounted on the housing 40, and the camera module 30 is mounted on the display screen 20 and is held below the display screen 20. The light guide component 50 is used to transmit light from the outside to the camera module 30 below the display screen 20.

[0367] Specifically, the terminal device 1 has a light guiding channel 500 , wherein at least a portion of the light guiding channel 500 is formed in the light guiding component 50 .

[0368] At least a portion of the light guide channel 500 is located between the display screen 20 and the housing 40 and extends to the display screen 20. Light from the outside reaches the display screen 20 after passing through the gap between the display screen 20 and the housing 40, and is then received by the camera module 30 located below the display screen 20.

[0369] The light guide assembly 50 includes a light guide pipe, wherein the light guide pipe has a certain shape and size. The light guide pipe can extend from outside the display screen 20 to between the display screen 20 and the housing 40 toward the display screen 20 .

[0370] The entire light guide pipe can be light-transmissive or light-impermeable. The light guide pipe can be made of light-transmissive material, and then in order to prevent the stray light around the light guide pipe from entering the light guide channel 500, the light guide pipe can be coated with a light-shielding material to reduce the influence of the surrounding stray light.

[0371] Preferably, when the light guide component 50 needs to pass through the pixel layer 25 , the light guide component 50 is disposed between two adjacent pixels of the pixel layer 25 .

[0372] For the same display screen 20 , there may be multiple light guide components 50 , and there may be multiple corresponding light guide channels 500 , and at least parts of the multiple light guide channels 500 overlap with each other.

[0373] The light guide assembly 50 can conduct light to multiple locations inside and outside the display screen 20, such as the front of the display screen 20, the left side of the display screen 20, or the right side of the display screen 20. The light guide channel 500 of the light guide assembly 50 can conduct light passing through the gap between the display screen 20 and the housing 40 to the camera module 30.

[0374] When there are multiple light guide channels 500, the amount of light entering the camera module 30 can be increased.

[0375] Reference Fig.21 As shown, please refer to the attached Fig.18A , a further embodiment of the terminal device 1 according to the present invention is explained.

[0376] The terminal device 1 includes a terminal device body 10, a display screen 20, a camera module 30, a housing 40, and a light guide assembly 50, wherein the display screen 20 is mounted on the terminal device body 10, the display screen 20 and the terminal device body 10 are mounted on the housing 40, and the camera module 30 is mounted on the display screen 20 and is held below the display screen 20. The light guide assembly 50 is used to transmit light from the outside to the camera module 30 below the display screen 20.

[0377] The terminal device 1 has at least one light guide channel 500 and a light through hole 200, wherein the light through hole 200 penetrates the display screen 20 of the terminal device 1 from top to bottom, and the light guide channel 500 is formed in the light guide component 50. The light guide channel 500 extends downward from the gap between the display screen 20 of the terminal device 1 and the housing 40 to the display screen 20.

[0378] Both the light guide channel 500 and the light through hole 200 can be used to conduct light. The light through hole 200 passes through the display screen 20, and the camera module 30 aligned with the light through hole 200 of the display screen 20 can receive light from the outside of the display screen 20 through the light through hole 200. The camera module 30 aligned with the light guide channel 500 can receive light from the outside of the display screen 20 through the light guide channel 500.

[0379] It is worth noting that the light guide channel 500 and the light through hole 200 can be independent of each other, and the light guide channel 500 and the light through hole 200 can be respectively aligned with different camera modules 30. In other words, multiple camera modules 30 can be installed on the display screen 20 and located below the display screen 20.

[0380] In this example, the light guiding channel 500 and the light through hole 200 at least partially overlap with each other, so that the light received by the light guiding channel 500 and the light through hole 200 can enter the same camera module 30 and be received by the same photosensitive unit 32A, thereby forming an image.

[0381] Specifically, at least a portion of the light guiding channel 500 is located between the display screen 20 and the housing 40 , and at least a portion of the light guiding channel 500 is located inside the display screen 20 .

[0382] The light guiding channel 500 may include a first partial light guiding channel 501, a second partial light guiding channel 502 and a third partial light guiding channel 503, wherein the first partial light guiding channel 501 is located between the display screen 20 and the shell 40, and the second partial light guiding channel 502 and the third partial light guiding channel 503 are respectively located within the display screen 20.

[0383] The light guiding channel 500 is connected to the light through hole 200 , and the third portion of the light guiding channel 503 overlaps with the light through hole 200 .

[0384] The first light guiding channel 501 is located at one side of the display screen 20 , the second light guiding channel 502 extends inward from the side of the display screen 20 , and the third light guiding channel 503 extends from the inside of the display screen 20 toward the back side of the display screen 20 .

[0385] The terminal device 1 further includes an optical unit 31A, and the optical unit 31A is arranged in the light guide channel 500. The optical unit 31A may include a convergent member 311A, a modulator 312A and a diffuser 313A, wherein the convergent member 311A ​​may be arranged in the first partial light guide channel 501 for converging light from the outside, wherein the modulator 312A may be arranged in the second partial light guide channel 502 for modulating light from the first partial light guide channel 501, wherein the diffuser 313A may be arranged in the third partial light guide channel 503 for diffusing the light and transmitting it to the camera module 30.

[0386] It is worth noting that, since the paths of the light rays entering the camera module 30 through the light guide channel 500 and the light hole 200 are different, the light rays of different paths have an optical path difference when reaching the camera module 30, and the light beams reaching a photosensitive chip of the camera module 30 have different phases, which may eventually present different images. In order to avoid this problem, the light path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the camera module 30 can present a consistent image.

[0387] In this example, the camera module 30 includes an optical mechanism 31A' and a photosensitive unit 32A, wherein the optical mechanism 31A' is aligned with the light hole 200 and the light guiding channel 500 and the optical mechanism 31A' is maintained in the light sensitive path of the photosensitive unit 32A, wherein at least parts of the light hole 200 and the light guiding channel 500 are shared with each other.

[0388] In some other embodiments of the present invention, the camera module 30 includes the optical unit 31A and a photosensitive unit 32A, wherein the optical unit 31A is disposed in the light guiding channel 500 , and the photosensitive unit 32A is installed on the back side of the display screen 20 .

[0389] In the case where the light guide channel 500 and the light through hole 200 coexist, since the camera module 30 can receive light through the light guide channel 500, the size of the light through hole 200 can be designed to be smaller.

[0390] The light guide channel 500 cannot be observed from the outside of the display screen 20. For example, when the second portion of the light guide channel 502 is located in the packaging layer 24 of the display screen 20, the light guide channel 500 cannot be observed from the outside of the display screen 20 due to the polarizing layer located above the packaging layer 24. Therefore, the inner diameter of at least part of the light guide channel 500 can be designed to be slightly larger than the inner diameter of the light through hole 200, so that some optical elements can be placed in the light guide channel 500.

[0391] When the size of the light hole 200 is designed to be smaller, it is more difficult to observe the light hole 200 from the outside of the display screen 20 , which is beneficial to improving the screen-to-body ratio of the display screen 20 .

[0392] Further, for the light through hole 200, the inner diameter of the light through hole 200 may be set to gradually increase from top to bottom. Some optical elements of the optical unit 31A may be set in the light through hole 200, such as the diffuser 313A.

[0393] For example, when the light-transmitting area provided by the light hole 200 is smaller than the light-receiving area of ​​the photosensitive unit 32A of the camera module 30, a diffuser 313A may be disposed at the light hole 200, and the diffuser 313A may diffuse the light in the light hole 200 so that the light-transmitting area provided by the light hole 200 matches the light-receiving area of ​​the photosensitive unit 32A.

[0394] Reference Fig. 22 As shown, please refer to the attached Fig.18A , an embodiment of a display screen assembly according to the present invention is explained.

[0395] In this embodiment, the present invention provides a display screen assembly, wherein the display screen assembly includes the display screen 20 and the light guide assembly 50. The display screen 20 has a light hole 200 extending from top to bottom, and the light guide assembly 50 is partially accommodated in the light hole 200.

[0396] The light guide component 50 provides a light guide channel 500. The desired light guide channel 500 can be obtained by designing the shape and structure of the light guide component 50.

[0397] The light guide assembly 50 includes two light guide pipes, one of which is accommodated in the light through hole 200, and the other light guide pipe extends from the gap between the display screen 20 and the housing 40 to the position of the light through hole 200. In other words, one of the light guide pipes can guide the light above the display screen 20 to pass through the display screen 20 from top to bottom and then reach the camera module 30. The other light guide pipe can guide the light between the display screen 20 and the housing 40 to reach the camera module 30. The manufacturing method of the light through hole 200 can refer to the above description.

[0398] The light guide pipe may be cylindrical, triangular prism-shaped, or quadrangular prism-shaped. The inner diameters corresponding to various positions of the light guide pipe may be different.

[0399] The light guide pipe may be made of a light-transmitting material so that the light guide pipe is difficult to be observed from the outside of the display screen 20. At the same time, in order to reduce the influence of stray light, such as the influence of light from the pixel layer 25 of the display screen 20, the light guide pipe may be coated with a light-shielding material.

[0400] Further, the light guide assembly 50 includes an optical unit 31A, wherein the optical unit 31A is held in the light path of the light hole 200. The optical element may be a filter, a diffuser 313A or a modulator 312A. The optical unit 31A may pre-process the light so that the light entering the camera module 30 meets expectations.

[0401] It is worth noting that, since the paths of the light rays entering the camera module 30 through different light guide channels 500 are different, the light rays of different paths have an optical path difference when reaching the camera module 30, and the light beams reaching a photosensitive chip of the camera module 30 have different phases, which may eventually present different images. In order to avoid this problem, the light path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the camera module 30 can present a consistent image.

[0402] Reference Fig.23 As shown, please refer to the attached Fig.18A and attached Fig.10 , another embodiment of the display screen assembly according to the present invention is illustrated.

[0403] In this example, the display screen 20 is implemented as an LCD display screen 20A. The LCD display screen 20A has a light guide channel 500, wherein the light guide channel 500 can guide the light outside the LCD display screen 20A to the inside of the LCD display screen 20A or to the inner side of the LCD display screen 20A.

[0404] Specifically, at least a portion of the light-guiding channel 500 is located between the LCD display screen 20A and the housing 40 , and at least a portion of the light-guiding channel 500 is located inside the LCD display screen 20A.

[0405] The light guiding channel 500 portion located between the LCD display screen 20A and the shell 40 can guide external light from the outside of the LCD display screen 20A to one side of the LCD display screen 20A, and then guide the light into the interior of the LCD display screen 20A through other portions of the light guiding channel 500. After the light passes through the interior of the LCD display screen 20A, it reaches the camera module 30, so that the camera module 30 located below the display screen 20A can receive the light from above the display screen 20A, so that the camera module 30 located below the display screen 20A can use the light to form an image, and, further, the camera module 30 located below the display screen 20A can obtain sufficient light for imaging through the light guiding channel 500.

[0406] More specifically, the light guiding channel 500 includes a first partial light guiding channel 501, a second partial light guiding channel 502 and a third partial light guiding channel 503, wherein the first partial light guiding channel 501 is located between the LCD display screen 20A and the shell 40, the second partial light guiding channel 502 is located inside the LCD display screen 20A and guides the light from the first partial light guiding channel 501 to the inside of the LCD display screen 20A, and the third partial light guiding channel 503 is located inside the LCD display screen 20A and guides the light from the second partial light guiding channel 502 to the outside of the LCD display screen 20A.

[0407] The LCD display screen 20A further includes at least one optical unit 31A, wherein the optical unit 31A can be disposed in the light guide channel 500 so that the light can propagate in the light guide channel 500 as expected by the user. The optical unit 31A can include a converging element 311A, a modulating element 312A, and a diffusing element 313A. The converging element 311A ​​can converge the light, the modulating element 312A can modulate the light, such as filtering, dispersion, collimation, etc., and the diffusing element 313A can diffuse the light.

[0408] The converging member 311A ​​can be arranged in the first part of the light-guiding channel 501 of the light-guiding channel 500, for example, a light inlet of the light-guiding channel 500, wherein the converging member 311A ​​is located at the light inlet. The modulating member 312A can be arranged in the second part of the light-guiding channel 502 of the light-guiding channel 500 to modulate the light passing through the second part of the light-guiding channel 502. The diffusing member 313A can be arranged in the third part of the light-guiding channel 503 of the light-guiding channel 500, for example, a light outlet of the light-guiding channel 500, wherein the diffusing member 313A located at the light outlet can diffuse the light so that it can adapt to a photosensitive surface of the camera module 30, so that when the photosensitive surface of the camera module 30 is large, the light can be diffused by the diffusing member 313A to increase the photosensitive area of ​​the entire photosensitive surface, so as to improve the working efficiency of the camera module 30.

[0409] The camera module 30 has a light inlet and includes a photosensitive unit 32A. The size of the light inlet corresponds to the photosensitive area of ​​the photosensitive unit 32A, so that the photosensitive area of ​​the photosensitive unit 32A receives light as much as possible and the photosensitive area of ​​the photosensitive unit 32A can be used as much as possible.

[0410] Furthermore, the LCD display screen 20A includes the cover layer 21A, the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A and the backplane layer 27A. The polarizing layers 23A are respectively disposed on both sides of the pixel layer 25A.

[0411] The LCD display screen 20A has a side surface, a front surface, and a back surface, wherein the front surface of the LCD display screen 20A faces the user, the back surface of the LCD display screen 20A faces away from the user, and the side surfaces are connected to the front surface and the back surface, respectively. The light guide channel 500 extends from the gap between the LCD display screen 20A and the housing 40 to the side surface of the LCD display screen 20A, and then extends to the back surface of the LCD display screen 20A. Light can pass through the light guide channel 500 from the side surface of the LCD display screen 20A through the LCD display screen 20A to the back surface of the LCD display screen 20A.

[0412] The LCD display screen 20A is a multi-layer structure, and the light guide channel 500 can penetrate one or more of the cover layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A and the back layer 27A.

[0413] The light guide channel 500 may pass through the cover layer 21A and the back layer 27A, for example, from top to bottom, it passes through the cover layer 21A, the touch layer 22A, a polarizer of the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A, another polarizer of the polarizing layer 23A, and the back layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A described here is only for illustration and does not limit the present invention.

[0414] The light guide channel 500 may pass through the touch layer 22A and the back layer 27A. For example, from top to bottom, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A, the polarizing layer 23A, and the back layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0415] The light guide channel 500 may pass through the polarizing layer 23A and the backplane layer 27A. For example, from top to bottom, the light guide channel 500 may pass through the gap between the display screen 20A and the housing 40, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A, the polarizing layer 23A, and the backplane layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0416] The light guide channel 500 may pass through the encapsulation layer 24A and the backplane layer 27A. For example, from top to bottom, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A, the polarization layer 23A, and the backplane layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0417] The light guide channel 500 may extend from the pixel layer 25A to the backplane layer 27A. For example, the light guide channel 500 may pass through the gap between the display screen 20A and the housing 40, the pixel layer 25A, the drive circuit layer 26A, the polarization layer 23A, and the backplane layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0418] The light guide channel 500 may extend from the driving circuit layer 26A to the backplane layer 27A. For example, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the driving circuit layer 26A, the polarizing layer 23A, and the backplane layer 27A in sequence. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0419] The light-guiding channel 500 may extend from the polarizing layer 23A below the pixel layer 25A to the backplane layer 27A. For example, the light-guiding channel 500 passes through the polarizing layer 23A and the backplane layer 27A in sequence from below the pixel layer 25A.

[0420] The light-guiding channel 500 may pass through the backplane layer 27A. For example, the light-guiding channel 500 extends from the gap between the backplane layer 27A and the polarizing layer 23A or the connecting medium to the backplane layer 27A and penetrates the backplane layer 27A.

[0421] The light guide channel 500 passing through the pixel layer 25A is used as an example for description. The pixel layer 25A includes the filter layer 251A and the liquid crystal 252A. The LCD display screen 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A and the drive circuit layer 26A.

[0422] The liquid crystal 252A is held between the filter layer 251A and the driving circuit layer 26A. The light guide channel 500 passes through the liquid crystal layer 28A and the liquid crystal 252A is prevented from leaking into the light guide channel 500 .

[0423] The liquid crystal layer 28A with holes can be manufactured first, wherein the holes are at least a part of the light guide channel 500 , and then holes are opened at corresponding positions of each layer of the LCD display screen 20A to form at least a part of the light guide channel 500 .

[0424] The hole of the liquid crystal layer 28A may be located in the height direction of the liquid crystal layer 28A, and the hole may also be formed in the liquid crystal layer 28A at a certain tilt angle to meet the setting requirements of the light guide channel 500 .

[0425] Specifically, a sealing material 2811A is disposed on the driving circuit layer 26A or the filter layer 251A of the liquid crystal layer 28A, so that when the driving circuit layer 26A and the filter layer 251A are attached to each other, the sealing material 2811A forms a sealing area 281A, and the liquid crystal 252A cannot enter the sealing area 281A. In subsequent steps, as long as a hole is opened in the liquid crystal layer 28A within the sealing area 281A, the liquid crystal 252A of the liquid crystal layer 28A will not leak outward.

[0426] Each layer installed on the liquid crystal layer 28A of the LCD display screen 20A can be respectively opened to form the light-through hole 200 extending from the side of the LCD display screen 20A toward the back of the LCD display screen 20A. In this way, the LCD display screen 20A can be provided with the hole that passes through the side of the LCD display screen 20A and the back of the LCD display screen 20A.

[0427] Furthermore, part of the light guide channel 500 is located between the display screen 20A and the shell 40, and part of the light guide channel 500 is arranged inside the LCD display screen 20A, so that the light guide channel 500 cannot be observed from the front side of the LCD display screen 20A, which is conducive to achieving a full screen.

[0428] Furthermore, after a portion of the light guiding channel 500 is formed in the LCD display screen 20A, the optical unit 31A may be installed in the light guiding channel 500 .

[0429] It is understandable that the optical element can be installed in the light guide channel 500 after the entire LCD display screen 20A is manufactured, or the optical unit 31A can be installed at the preset position of each layer of the LCD display screen 20A during the layer-by-layer installation of the LCD display screen 20A or during the partial formation of the light guide channel 500 corresponding to each layer of the LCD display screen 20A, and then the functional layers are assembled to form the complete LCD display screen 20A, or at least a part of the optical unit 31A is formed during the manufacturing process of the LCD display screen 20A.

[0430] For example, a microlens layer is firstly formed integrally on the encapsulation layer 24A, and then the encapsulation layer 24A is disposed above the pixel layer 25A, wherein the microlens layer corresponds to the light-through hole 200 of the pixel layer 25A, and a driving circuit layer 26A is disposed on the bottom side of the pixel layer 25A, and the driving circuit layer 26A is electrically connected to the pixel layer 25A to drive the pixel layer 25A to work. The polarization layer 23A, the touch layer 22A and the cover layer 21A are sequentially disposed on the encapsulation layer 24A.

[0431] The light guide channel 500 is formed between the cover layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A and the driving circuit layer 26A. The microlens layer is held in the light guide channel 500 .

[0432] The optical unit 31A may be disposed inside the LCD display screen 20A or formed in various layers of the LCD display screen 20A in other ways. Those skilled in the art should understand that the above-mentioned method for making the optical unit 31A is only an example and is not limited to the above-mentioned example.

[0433] Reference Fig.24 FIG. 2 is a diagram illustrating another embodiment of the LCD display screen 20A according to the present invention.

[0434] In this example, the camera module 30 includes the photosensitive unit 32A, and the photosensitive unit 32A directly receives the light from the light guide channel 500. The light can be received by the photosensitive unit 32A after being processed by the optical unit 31A located in the light guide channel 500.

[0435] In this way, the optical structure 31A' of the camera module 30 can be arranged in the light guiding channel 500, or the optical unit 31A located in the light guiding channel 500 acts as the optical structure 31A' of the camera module 30, thereby reducing the height dimension of the camera module 30, which is beneficial to reduce the height dimension of the LCD display 20A and the camera module 30.

[0436] Reference Fig.25 FIG. 2 is a diagram illustrating another embodiment of the LCD display screen 20A according to the present invention.

[0437] In this example, the LCD display screen 20A has at least one light guide channel 500 and the LCD display screen 20A further includes at least one light guide component 50 , wherein the light guide channel 500 is formed in the light guide component 50 .

[0438] The LCD display screen 20A provides another light through hole 200A, and the light through hole 200A is used to install the light guide component 50.

[0439] The LCD display screen 20A is a multi-layer structure, and the light hole 200A can penetrate one or more of the cover layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A and the back layer 27A.

[0440] The light hole 200 may pass through the cover layer 21A and the back layer 27A, for example, from top to bottom, it passes through the cover layer 21A, the touch layer 22A, a polarizer of the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A, another polarizer of the polarizing layer 23A, and the back layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A described here is only for illustration and does not limit the present invention.

[0441] The light hole 200A may pass through the touch layer 22A and the back layer 27A. For example, from top to bottom, the light hole 200A passes through the touch layer 22A, a polarizer of the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, another polarizer of the polarizing layer 23A, and the back layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0442] The light hole 200A may pass through the polarizing layer 23A and the backplane layer 27A. For example, from top to bottom, the light hole 200A passes through a polarizer of the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, another polarizer of the polarizing layer 23A, and the backplane layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0443] The light hole 200A may pass through the encapsulation layer 24A and the backplane layer 27A. For example, the light hole 200A passes through the encapsulation layer 24A, the pixel layer 25A, the drive circuit layer 26A, the polarization layer 23A and the backplane layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0444] The light hole 200A may extend from the pixel layer 25A to the backplane layer 27A. For example, the light hole 200A passes through the pixel layer 25A, the driving circuit layer 26A, the polarizing layer 23A and the backplane layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0445] The light hole 200A may extend from the driving circuit layer 26A to the back plate layer 27A. For example, the light hole 200A passes through the driving circuit layer 26A, the polarizing layer 23A and the back plate layer 27A in sequence from bottom to top. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display screen 20A is only for illustration and does not limit the present invention.

[0446] The light through hole 200A may extend from the polarization layer 23A located below the pixel layer 25A to the backplane layer 27A. For example, the light through hole 200A passes through the polarization layer 23A and the backplane layer 27A in sequence from below the pixel layer 25A.

[0447] The light-through hole 200A may pass through the backplane layer 27A. For example, the light-through hole 200A extends from the gap between the backplane layer 27A and the polarizing layer 23A or the connecting medium to the backplane layer 27A and penetrates the backplane layer 27A.

[0448] The light hole 200A passing through the pixel layer 25A is used as an example for description. The pixel layer 25A includes the liquid crystal 252A and the filter layer 251A. The LCD display screen 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A and the drive circuit layer 26A.

[0449] The liquid crystal 252A is held between the filter layer 251A and the driving circuit layer 26A. The light-through hole 200 passes through the liquid crystal layer 28A and the liquid crystal 252A is prevented from leaking into the light-through hole 200 .

[0450] The liquid crystal layer 28A having the light-through holes 200 may be manufactured first, and then holes are opened at corresponding positions of each layer of the LCD display screen 20A to form at least a portion of the light-through holes 200 .

[0451] The light-through hole 200 of the liquid crystal layer 28A may be located in the height direction of the liquid crystal layer 28A, and the light-through hole 200A may also be formed in the liquid crystal layer 28A at a certain tilt angle to meet the setting requirements of the light-through hole 200A.

[0452] Specifically, a sealing material 2811 is disposed on the driving circuit layer 26A or the filter layer 251A of the liquid crystal layer 28A, so that when the driving circuit layer 26A and the filter layer 251A are attached to each other, the sealing material 2811A forms a sealing area 281A, and the liquid crystal 252A cannot enter the sealing area 281A. In subsequent steps, as long as a hole is opened in the liquid crystal layer 28A within the sealing area 281A, the liquid crystal 252A of the liquid crystal layer 28A will not leak outward.

[0453] Each layer above the liquid crystal layer 28A of the LCD display screen 20A may be respectively opened to form the light-through hole 200 from the side of the LCD display screen 20A toward the liquid crystal layer 28A of the LCD display screen 20A. In this way, the LCD display screen 20A may be provided with the light-through hole 200A penetrating the side of the LCD display screen 20A and the back of the LCD display screen 20A.

[0454] Part of the light guide assembly 50 is installed between the LCD display screen 20A and the housing 40 , and part of the light guide assembly 50 is installed in the light hole 200A of the LCD display screen 20A.

[0455] The light guide assembly 50 may include at least one light guide pipe. The number of the light guide pipes may be multiple to adapt to the light through hole 200A of different shapes. The light through hole 200A may be linear or curved.

[0456] When there are multiple light guide pipes, the light guide pipes can be installed in the light through hole 200A one by one in a certain order, or the light guide pipes can be installed in the LCD display screen 20A one by one in a certain order. For example, when installing the liquid crystal layer 28A on the polarizing layer 23A, one light guide pipe can be installed in the light through hole 200 portion corresponding to the liquid crystal layer 28A and the polarizing layer 23A, and then when installing the back panel layer 27A on the liquid crystal layer 28A, another light guide pipe can be installed in the light through hole 200A portion corresponding to the back panel layer 27A.

[0457] The shape and position of the entire light hole 200A can be set on the LCD display screen 20A according to the needs of the user. The shape and position of the light guide component 50 can be designed according to the expected needs of the light guide channel 500.

[0458] The external light propagates along the light guide channel 500 to the camera module 30 located at the back side of the LCD display screen 20A. In this process, the light can be reflected, diffused or collimated in the light guide channel 500 of the light guide component 50.

[0459] Further, the optical unit 31A may be disposed in the light guide channel 500 of the light guide assembly 50. The optical unit 31A may be integrally formed with the light guide assembly 50, or the optical unit 31A may be disposed in the light guide channel 500 of the light guide assembly 50.

[0460] The light guide component 50 may be transparent, such as glass or resin. The light guide component 50 may also be opaque, such as the outer wall of the light guide component 50 may be coated with a layer of opaque material to reduce the influence of light outside the light guide component 50 on the light in the light guide channel 500 of the light guide component 50.

[0461] Reference Fig.26 As shown, please refer to the attached Fig.18A and attached Fig.10 , another embodiment of the LCD display screen 20A according to the present invention is illustrated.

[0462] In this example, the LCD display screen 20A has a light hole 200 and a light guide channel 500, wherein the light hole 200 penetrates the display screen 20A of the terminal device 1 from top to bottom. The light guide channel 500 extends downward from the gap between the display screen 20A of the terminal device 1 and the housing 40 to the display screen 20A. It can be understood that the number of the light holes 200 can be multiple, and the light holes 200 can penetrate the display screen 20A from top to bottom, and the light holes 200 can also pass through the inside of the display screen 20A from the side of the display screen 20A to the bottom surface of the display screen 20A.

[0463] Both the light guide channel 500 and the light through hole 200 can be used to conduct light. The light through hole 200 passes through the display screen 20A, and the camera module 30 aligned with the light through hole 200 of the display screen 20A can receive light from the outside of the display screen 20A through the light through hole 200. The camera module 30 aligned with the light guide channel 500 can receive light from the outside of the display screen 20A through the light through hole 200.

[0464] It is worth noting that the light guide channel 500 and the light through hole 200 can be independent of each other, and the light guide channel 500 and the light through hole 200 can be respectively aligned with different camera modules 30. In other words, multiple camera modules 30 can be installed on the display screen 20A and located below the display screen 20A.

[0465] In this example, the light guiding channel 500 and the light through hole 200 at least partially overlap with each other, so that the light received by the light guiding channel 500 and the light through hole 200 can enter the same camera module 30 and be received by the same photosensitive unit 32A, thereby forming an image.

[0466] Specifically, at least a portion of the light-guiding channel 500 is located between the display screen 20A and the housing 40 , and at least a portion of the light-guiding channel 500 is located inside the display screen 20A.

[0467] The light guiding channel 500 may include a first partial light guiding channel 501, a second partial light guiding channel 502 and a third partial light guiding channel 503, wherein the first partial light guiding channel 501 is located between the display screen 20A and the shell 40, and the second partial light guiding channel 502 and the third partial light guiding channel 503 are respectively located within the display screen 20A.

[0468] The light guiding channel 500 is connected to the light through hole 200 , and the third portion of the light guiding channel 503 overlaps with the light through hole 200 .

[0469] The first portion of the light guiding channel 501 is located at a side of the display screen 20A, the second portion of the light guiding channel 502 extends inward from the side of the display screen 20A, and the third portion of the light guiding channel 503 extends downward from the inside of the display screen 20A.

[0470] The terminal device 1 further includes an optical unit 31A, and the optical unit 31A is arranged in the light guide channel 500. The optical unit 31A may include a convergent member 311A, a modulator 312A and a diffuser 313A, wherein the convergent member 311A ​​may be arranged in the first partial light guide channel 501 for converging light from the outside, wherein the modulator 312A may be arranged in the second partial light guide channel 502 for modulating light from the first partial light guide channel 501, wherein the diffuser 313A may be arranged in the third partial light guide channel 503 for diffusing the light and transmitting it to the camera module 30.

[0471] It is worth noting that, since the paths of the light rays entering the camera module 30 through the light guide channel 500 and the light hole 200 are different, the light rays of different paths have an optical path difference when reaching the camera module 30, and the light beams reaching a photosensitive chip of the camera module 30 have different phases, which may eventually present different images. In order to avoid this problem, the light path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the camera module 30 can present a consistent image.

[0472] In some other embodiments of the present invention, the camera module 30 includes an optical mechanism 31A' and a photosensitive unit 32A, wherein the optical mechanism 31A' is aligned with the light hole 200 and the light guide channel 500 and the optical mechanism 31A' is maintained in the light sensing path of the photosensitive unit 32A. The light hole 200 and the light guide channel 500 are at least partially shared.

[0473] In this example, the camera module 30 includes the optical unit 31A and a photosensitive unit 32A, wherein the optical unit 31A is disposed in the light guide channel 500, and the photosensitive unit 32A is installed on the back side of the display screen 20A.

[0474] In the case where the light guide channel 500 and the light through hole 200 coexist, since the camera module 30 can receive light through the light guide channel 500, the size of the light through hole 200 can be designed to be smaller.

[0475] The light guiding channel 500 cannot be observed from the outside of the display screen 20A. For example, when the second portion of the light guiding channel 502 is located in the packaging layer 24A of the display screen 20A, the light guiding channel 500 cannot be observed from the outside of the display screen 20A due to the polarizing layer located above the packaging layer 24A. Therefore, the inner diameter of at least part of the light guiding channel 500 can be designed to be slightly larger than the inner diameter of the light through hole 200, so that some optical elements can be placed in the light guiding channel 500.

[0476] When the size of the light hole 200 is designed to be smaller, it is more difficult to observe the light hole 200 from the outside of the display screen 20A, which is beneficial to improve the screen-to-body ratio of the display screen 20A.

[0477] Further, for the light through hole 200, the inner diameter of the light through hole 200 may be set to gradually increase from top to bottom. Some optical elements of the optical unit 31A may be set in the light through hole 200, such as the diffuser 313A.

[0478] For example, when the light-transmitting area provided by the light hole 200 is smaller than the light-receiving area of ​​the photosensitive unit 32A of the camera module 30, a diffuser 313A may be disposed at the light hole 200, and the diffuser 313A may diffuse the light in the light hole 200 so that the light-transmitting area provided by the light hole 200 matches the light-receiving area of ​​the photosensitive unit 32A.

[0479] Reference Fig. 27 As shown, please refer to the attached Fig.18A , another embodiment of the LCD display screen 20A according to the present invention is illustrated.

[0480] In this example, the LCD display screen 20A has a light hole 200 , wherein the light hole 200 passes through the LCD display screen 20A in the height direction. At least a portion of the light guide component 50 is disposed in the light hole 200 .

[0481] The light guide component 50 provides a light guide channel 500. The desired light guide channel 500 can be obtained by designing the shape and structure of the light guide component 50.

[0482] The light guide assembly 50 includes two light guide pipes, one of which is accommodated in the light through hole 200, and the other light guide pipe extends from the gap between the display screen 20A and the housing 40 to the position of the light through hole 200. In other words, one of the light guide pipes can guide the light above the display screen 20A to pass through the display screen 20A from top to bottom and then reach the camera module 30. The other light guide pipe can guide the light between the display screen 20A and the housing 40 to reach the camera module 30. The manufacturing method of the light through hole 200 can refer to the above description.

[0483] The light guide pipe may be cylindrical, triangular prism-shaped, or quadrangular prism-shaped. The inner diameters corresponding to various positions of the light guide pipe may be different.

[0484] The light guide pipe can be made of a light-transmitting material so that the light guide pipe is difficult to be observed from the outside of the display screen 20A. At the same time, in order to reduce the influence of stray light, such as the influence of light from the pixel layer 25A of the display screen 20A, the light guide pipe can be coated with a light-shielding material.

[0485] Furthermore, the LCD display screen 20A includes an optical unit 31A, wherein the optical unit 31A is held in the light guide channel 500 of the light guide assembly 50, and the optical unit 31A can be a filter, a diffuser 313A or a modulator 312A. The optical unit 31A can pre-process the light so that the light entering the camera module 30 meets expectations.

[0486] It is worth noting that, since the paths of the light rays entering the camera module 30 through different light guide channels 500 are different, the light rays of different paths have an optical path difference when reaching the camera module 30, and the light beams reaching a photosensitive chip of the camera module 30 have different phases, which may eventually present different images. In order to avoid this problem, the light path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the camera module 30 can present a consistent image.

[0487] In order to further reduce the overall height of the terminal device 1, preferably, in the present invention, a camera module 30 with a lower height is used.

[0488] Fig.28 A specific example of the camera module 30 according to the present invention is shown in the figure. The camera module 30 includes an optical mechanism 31A' and a photosensitive unit 32A, wherein the camera module 30 may also include an aperture 33A, wherein the aperture 33A is located at the light hole 200, and the optical mechanism 31A' is maintained in the light sensing path of the photosensitive unit 32A.

[0489] The aperture 33A can restrict the light passing through the optical mechanism 31A'. Specifically, the amount of light entering the optical mechanism 31A' can be controlled by controlling the size of the aperture of the aperture 33A.

[0490] The aperture 33A may be circular, triangular or rectangular, and the size of the aperture 33A may limit the light that passes through the aperture 33A and enters the optical mechanism 31A'.

[0491] In this example, the display screen 20 has the light hole 200, and the camera module 30 is installed below the display screen 20. The light hole 200 allows light to pass through the display screen 20 and then reach the camera module 30.

[0492] The light hole 200 can play the role of the aperture 33A of the camera module 30, so that for the camera module 30 itself, the camera module 30 does not need to set the aperture 33A separately, and the amount of light entering the camera module 30 can be controlled by controlling the size of the light hole 200 of the display screen 20. The light hole 200 plays the role of the aperture 33A.

[0493] In this way, the height dimension of the camera module 30 can be reduced, so that the height dimension of the display screen 20 and the camera module 30 can also be reduced, so as to facilitate the slimming of the terminal device 1.

[0494] Furthermore, before the camera module 30 is installed on the display screen 20, the optical path design of the camera module 30 is fixed, and the parameters such as the amount of light entering and the exposure time required by the camera module 30 can be determined. Based on these parameters, the size of the aperture 33A can be determined. Therefore, during the process of manufacturing the light hole 200 of the display screen 20, the light hole 200 that meets the requirements can be manufactured according to the requirements of the camera module 30. With reference to the manufacturing method of the light hole 200 described above, the aperture size and position of the light hole 200 can be designed according to the requirements.

[0495] Furthermore, the distance between the camera module 30 and the aperture 33A on the photosensitive path of the photosensitive unit 32A is determined based on the optical requirements of the camera module 30 and the optical path design. When assembling the camera module 30 on the display screen 20, the relative position of the camera module 30 and the display screen 20 can be adjusted as needed, thereby adjusting the distance between the camera module 30 and the aperture 33A to meet the optical path requirements of the camera module 30.

[0496] Fig.29 A specific embodiment of the camera module 30 according to the present invention is illustrated.

[0497] The camera module 30 includes an optical mechanism 31A', a photosensitive unit 32A and an aperture 33A', wherein the aperture 33A' is arranged on the optical mechanism 31A', and the optical mechanism 31A' is maintained in the photosensitive path of the photosensitive unit 32A. By controlling the size of the aperture 33A', the amount of light passing through the optical mechanism 31A' can be controlled.

[0498] When the camera module 30 is mounted on the display screen 20, the light hole 200 of the display screen 20 allows light to pass through the light hole 200 from the outside of the display screen 20 and then reach the camera module 30. The light hole 200 can affect the imaging result of the camera module 30.

[0499] The light hole 200 plays a role similar to that of an aperture, and the imaging light beam can be controlled by controlling the aperture of the light hole 200. The light hole 200 of the display screen 20 can constrain the imaging light beam of the camera module 30, and the aperture 33A' of the camera module 30 also constrains the imaging light beam. The light hole 200 of the display screen 20 and the aperture 33A' of the camera module 30 can work together.

[0500] When the camera module 30 is installed before the display screen 20, the optical path design of the camera module 30 can be roughly determined, so that the size of the light hole 200 of the display screen 20 can be set based on the needs of the camera module 30. After the camera module 30 is installed on the display screen 20, the size of the light hole 200 is fixed, the relative position between the camera module 30 and the light hole 200 can be fixed, and the imaging beam can be further controlled by controlling the aperture 33A' of the camera module 30.

[0501] Furthermore, the light hole 200 of the display screen 20 can constrain the imaging light beam, and the aperture 33A' of the camera module 30 can constrain the imaging light beam, or can be set as an aperture that can eliminate stray light, so as to eliminate stray light for the light beam after passing through the light hole 200. In other words, the light hole 200 of the display screen 20 and the aperture 33A' of the camera module 30 can cooperate with each other to limit the imaging light beam. The light hole 200 of the display screen 20 and the aperture 33A' of the camera module 30 can also play different roles and be specially set according to the optical path requirements of the camera module 30.

[0502] It is worth noting that the diaphragm 33A' of the camera module 30 can be a variable diaphragm, and the aperture of the diaphragm 33A' can be adjusted, so that the amount of light passing through the camera module 30 can be controlled by adjusting its aperture.

[0503] Fig.30 FIG. 3 shows a specific example of the camera module 30 according to the present invention. Fig.30As shown, in this specific implementation, the camera module 30 includes a circuit board 31, a photosensitive chip 32 and a light-transmitting component 33, wherein the circuit board 31 has a groove 310, the photosensitive chip 32 is disposed in the groove 310 and electrically connected to the circuit board 31, and the light-transmitting component 33 is located on the light-sensing path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the light-transmitting component 33, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0504] Those skilled in the art should know that in the existing camera module based on COB technology, the circuit board has a flat surface, and the photosensitive chip is directly attached and electrically connected to the flat surface of the circuit board. Since each camera module has a preset optical back focus requirement, the installation reference height of the photosensitive chip directly determines the overall height dimension of the camera module 30.

[0505] Accordingly, compared to the existing camera module based on COB process, in this specific example, the circuit board 31 is provided with the groove 310, so as to reduce the installation reference height of the photosensitive chip 32 through the groove 310. In other words, in the present invention, the top surface of the circuit board 31 is a non-flat surface, wherein the area of ​​the circuit board 31 for installing the photosensitive chip 32 is recessed downward, so that the installation reference height of the photosensitive chip 32 can be reduced. It should be understood that, under the premise that the optical back focus requirement remains unchanged, the installation height of the optical lens 332 relative to the circuit board 31 can be reduced, so that the overall height dimension of the camera module 30 can be reduced.

[0506] Preferably, in this specific example, the size of the groove 310 is consistent with the size of the photosensitive chip 32, so that the groove 310 itself can be used to position and limit the photosensitive chip 32. Specifically, in the process of installing the photosensitive chip 32 in the groove 310, the photosensitive chip 32 can be directly and fittingly embedded in the groove 310, without the need to constantly calibrate and locate the installation position of the photosensitive chip on the circuit board as in the existing COB process-based camera module. Furthermore, after the photosensitive chip 32 is installed in the groove 310 and electrically connected to the circuit board 31, the photosensitive chip 32 is "confined" in the groove 310 to prevent the photosensitive chip 32 from detaching from the groove 310 or being offset.

[0507] Furthermore, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is attached to the groove 310 of the circuit board 31, the electrical connection between the photosensitive chip 32 and the circuit board 31 is realized through the leads 34. Since the distance between the upper surface of the photosensitive chip 32 and the upper surface of the circuit board 31 is reduced, the arc height of the gold wire connecting the photosensitive chip 32 and the pad of the circuit board 31 is also reduced, thereby reducing the difficulty of wire bonding.

[0508] Specifically, each of the leads 34 extends in a curved manner between the photosensitive chip 32 and the circuit board 31 to connect the photosensitive chip 32 to the circuit board 31 through the leads 34, so that the circuit board 31 can power the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signals according to the leads 34.

[0509] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 by a "gold wire" process to achieve electrical connection between the two.

[0510] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the circuit board 31, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the photosensitive chip 32, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the upward protrusion height of the lead 34 formed by the "reverse gold wire punching" process is smaller than the upward protrusion height of the lead 34 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the lead 34 is formed by the "reverse gold wire punching" process.

[0511] Furthermore, the camera module 30 further includes a base 35, which is disposed on the circuit board 31 to support the light-transmitting component 33. The light-transmitting component 33 includes a color filter element 331 and an optical lens 332, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light-sensing path of the photosensitive chip 32. It is worth noting that if the arc height of the lead 34 is reduced, the inner cavity height of the base 35 can also be appropriately reduced, and then the height of the base 35 will also be reduced, and further, the overall height of the camera module 30 will also be appropriately reduced.

[0512] Specifically, in this specific example, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the circuit board 31; or, the base 35 can be implemented as a molded base, which can be integrally molded on the corresponding position of the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) and MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process refers to integrally molding the molded base on the circuit board 31 through a molding process, wherein the molded base after molding integrally covers the circuit board 31, the electronic components 312 located on the circuit board 31, and the leads 34. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, wherein the molded base after molding not only covers the circuit board 31 and the electronic components 312 located on the circuit board 31, but also covers at least a portion of the lead 34, or covers the lead 34 and at least a portion of the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive area of ​​the photosensitive chip 32).

[0513] In this specific example, the color filter element 331 is disposed between the optical lens 332 and the photosensitive element, so that the light entering the interior of the camera module 30 from the optical lens 332 can be received and photoelectrically converted by the photosensitive chip 32 only after being filtered by the color filter element 331, so as to improve the imaging quality of the camera module 30. For example, the color filter element 331 can be used to filter the infrared part of the light entering the interior of the camera module 30 from the optical lens 332.

[0514] Those skilled in the art should know that the color filter element 331 can be implemented as different types, including but not limited to the color filter element 331 can be implemented as an infrared cutoff filter, a full spectrum filter and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 32. In this way, when the camera module 30 is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 32, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object entering the camera module 30. Moreover, when the camera module 30 is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 32 to allow the infrared rays in the light reflected by the object entering the camera module 30 to be partially transmitted.

[0515] It is worth mentioning that the color filter element 331 can also be arranged at other positions on the photosensitive path of the photosensitive chip 32. For example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc., which is not limited to this application.

[0516] In addition, it is worth mentioning that in this specific example, the camera module 30 can be implemented as a fixed focus module or a dynamic focus module, wherein, when the camera module 30 is a dynamic focus module, the camera module 30 further includes a driver 36 connected to the circuit board 31, and the driver 36 is used to controllably drive the lens to move to achieve auto-focus (Auto-Focus).

[0517] Fig.31 Another specific example of the camera module 30 according to the present invention is shown in the figure, wherein: Fig.31 The camera module 30 shown is Fig.30 A modified implementation of the camera module 30 is shown.

[0518] Specifically, if Fig.31As shown, in this specific example, the camera module 30 includes a circuit board 31, a photosensitive chip 32, a light-transmitting component 33 and a reinforcing plate 37, wherein the circuit board 31 has an opening 310A formed through the circuit board 31, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the photosensitive chip 32 is arranged at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the photosensitive chip 32 can be conductively connected to the circuit board 31, and the light-transmitting component 33 is arranged on the light-sensing path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the light-transmitting component 33, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0519] The reinforcing plate 37 can be implemented as a steel plate, which has a smoother surface than the circuit board 31. When the photosensitive chip 32 is attached thereto, it is smoother and has a better imaging effect. In addition, metal has better thermal conductivity, and the steel plate can play a role in heat dissipation.

[0520] In other words, compared to Fig.30 In the camera module 30 shown in the figure, in this specific example, the circuit board 31 has the opening 310A, which is formed through the circuit board 31, so as to reduce the installation reference height of the photosensitive chip 32 through the opening 310A. In other words, in the present invention, the top surface of the circuit board 31 is a non-flat surface, wherein the area of ​​the circuit board 31 for installing the photosensitive chip 32 is recessed downward and penetrates the circuit board 31, so that the installation reference height of the photosensitive chip 32 can be further reduced. It should be understood that each camera module has a preset optical back focus requirement, so that under the premise of keeping the optical back focus requirement unchanged, the installation height of the optical lens 332 relative to the circuit board 31 can be further reduced, so that the overall height dimension of the camera module 30 can be further reduced.

[0521] like Fig.31 As shown, it should be particularly noted that in this specific example, the bottom surface of the photosensitive chip 32 is flush with the bottom surface of the circuit board 31, that is, the installation reference height of the photosensitive chip 32 is the height of the bottom surface of the circuit board 31. Therefore, under the premise of ensuring the preset optical back focus, the installation position of the photosensitive chip 32 can be further lowered, so that the overall height dimension of the camera module 30 can be further reduced.

[0522] Preferably, in this specific example, the size of the opening 310A is consistent with the size of the photosensitive chip 32, so that the opening 310A itself can be used to position and limit the photosensitive chip 32. Specifically, in the process of installing the photosensitive chip 32 in the opening 310A, the photosensitive chip 32 can be directly embedded in the opening 310A and finally attached to the reinforcement plate 37, without the need to constantly calibrate and locate the installation position of the photosensitive chip 32 on the circuit board 31 as in the existing COB process-based camera module. Furthermore, after the photosensitive chip 32 is installed in the opening 310A and electrically connected to the circuit board 31, the photosensitive chip 32 is "confined" in the opening 310A to prevent the photosensitive chip 32 from detaching from or deviating from the opening 310A.

[0523] Furthermore, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is installed in the opening 310A of the circuit board 31, the electrical connection between the photosensitive chip 32 and the circuit board 31 is realized through the leads 34. Specifically, each of the leads 34 extends between the photosensitive chip 32 and the circuit board 31 in a curved manner, so as to connect the photosensitive chip 32 to the circuit board 31 through the leads 34, so that the circuit board 31 can supply power to the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signals according to the leads 34.

[0524] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 by a "gold wire" process to achieve electrical connection between the two.

[0525] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the circuit board 31, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the photosensitive chip 32, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the upward protrusion height of the lead 34 formed by the "reverse gold wire punching" process is smaller than the upward protrusion height of the lead 34 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the lead 34 is formed by the "reverse gold wire punching" process.

[0526] Furthermore, the camera module 30 further includes a base 35, which is disposed on the circuit board 31 to support the light-transmitting component 33. The light-transmitting component 33 includes a color filter element 331 and an optical lens 332, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light-sensing path of the photosensitive chip 32.

[0527] Specifically, in this specific example, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the circuit board 31; or, the base 35 can be implemented as a molded base, which can be integrally molded on the corresponding position of the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) and MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process refers to integrally molding the molded base on the circuit board 31 through a molding process, wherein the molded base after molding integrally covers the circuit board 31, the electronic components 312 located on the circuit board 31, and the leads 34. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, wherein the molded base after molding not only covers the circuit board 31 and the electronic components 312 located on the circuit board 31, but also covers at least a portion of the lead 34, or covers the lead 34 and at least a portion of the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive area of ​​the photosensitive chip 32).

[0528] In this specific example, the color filter element 331 is disposed between the optical lens 332 and the photosensitive element, so that the light entering the interior of the camera module 30 from the optical lens 332 can be received and photoelectrically converted by the photosensitive chip 32 only after being filtered by the color filter element 331, so as to improve the imaging quality of the camera module 30. For example, the color filter element 331 can be used to filter the infrared part of the light entering the interior of the camera module 30 from the optical lens 332.

[0529] Those skilled in the art should know that the color filter element 331 can be implemented as different types, including but not limited to the color filter element 331 can be implemented as an infrared cutoff filter, a full spectrum filter and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 32. In this way, when the camera module 30 is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 32, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object entering the camera module 30. Moreover, when the camera module 30 is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 32 to allow the infrared rays in the light reflected by the object entering the camera module 30 to be partially transmitted.

[0530] It is worth mentioning that the color filter element 331 can also be arranged at other positions on the photosensitive path of the photosensitive chip 32. For example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc., which is not limited to this application.

[0531] It is also worth mentioning that, in this specific example, the camera module 30 can be implemented as a fixed-focus camera module or a dynamic-focus camera module, wherein, when the camera module 30 is a dynamic-focus camera module, the camera module 30 further includes a driver 36 electrically connected to the circuit board 31, and the driver 36 is used to controllably drive the lens to move to achieve auto-focus (Auto-Focus).

[0532] Fig.32 The figure shows another specific schematic diagram of the camera module 30 according to the present invention, wherein: Fig.32 The camera module 30 shown is Fig.31 A modified implementation of the camera module 30 is shown.

[0533] Specifically, compared to Fig.31 In the camera module 30 shown in the embodiment, the base 35 is directly mounted on the reinforcing plate 37. In other words, in the embodiment, the mounting reference height of the base 35 is reduced, so that the mounting reference height of the optical lens 332 mounted on the base 35 is reduced, so that the overall height of the camera module 30 can be reduced.

[0534] Accordingly, in this specific embodiment, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the reinforcing plate 37; or, the base 35 can be implemented as a molded base, which can be integrally molded at the corresponding positions of the reinforcing plate 37, the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) and MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process refers to integrally molding the molded base on the circuit board 31 through a molding process, wherein the molded base after molding integrally covers the reinforcing plate 37, the circuit board 31, the electronic components 312 located on the circuit board 31, and the leads 34. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, wherein the molded base after molding not only covers the reinforcing plate 37, the circuit board 31 and the electronic components 312 located on the circuit board 31, but also covers at least a portion of the lead 34, or covers the lead 34 and at least a portion of the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive area of ​​the photosensitive chip 32).

[0535] Fig.33 Another specific example of the camera module 30 according to the present invention is shown in the figure, wherein: Fig.33 The camera module 30 shown is Fig.31 Another variant implementation of the camera module 30 is shown.

[0536] Specifically, compared to Fig.31 In the camera module 30 shown in the figure, in this specific example, the base 35 has at least two positioning columns 351 extending downward, the circuit board 31 has at least two openings 311, and the positioning columns 351 pass through the openings 311 and are arranged on the reinforcement plate 37. In this way, the installation reference height of the base 35 can be reduced, so that the overall height of the camera module 30 can be reduced.

[0537] Fig.34 and Fig.35 Another specific example of the camera module 30 according to the present invention is shown in the figure, wherein: Fig.34 and Fig.35 The camera module 30 shown is Fig.31 Another variant implementation of the camera module 30 is shown.

[0538] like Fig.34 and Fig.35As shown, in this specific example, the reinforcing plate 37 has a boss 371A or a groove 371 at the opening 310A of the circuit board 31, so as to adjust the installation reference height of the photosensitive chip 32 through the boss 371A or the groove 371. In other words, in this specific example, the bottom surface of the photosensitive chip 32 is not flush with the bottom surface of the circuit board 31.

[0539] Specifically, if Fig.34 As shown, when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the installation reference height of the photosensitive chip 32 is further reduced, so that the overall height dimension of the camera module 30 can be further reduced while meeting the design requirements of the preset optical back focus. It should be noted that when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the photosensitive chip 32 is mounted on the reinforcing plate 37, and at that time, the bottom surface of the photosensitive chip 32 is lower than the bottom surface of the circuit board 31.

[0540] Specifically, if Fig.35 As shown, when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, the installation reference height of the photosensitive chip 32 is reduced compared to the existing camera module based on the COB process, so that the overall height dimension of the camera module 30 is reduced while meeting the design requirements of the preset optical back focus. It should be noted that when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, the photosensitive chip 32 is mounted on the reinforcing plate 37, and then the bottom surface of the photosensitive chip 32 is higher than the bottom surface of the circuit board 31 but lower than the top surface of the circuit board 31.

[0541] Fig.36 Another specific example of the camera module 30 according to the present invention is shown in the figure, wherein: Fig.36 The camera module 30 shown is Fig.33 A modified implementation of the camera module 30 is shown.

[0542] Specifically, if Fig.36As shown, in this specific example, the camera module 30 includes a circuit board 31, a photosensitive chip 32, a base 35, an optical lens 332, a color filter element 331 and a reinforcing plate 37, wherein the circuit board 31 has an opening 310A formed through the circuit board 31, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the photosensitive chip 32 is arranged at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the photosensitive chip 32 can be conductively connected to the circuit board 31, and the color filter element 331 and the optical lens 332 are sequentially arranged on the photosensitive path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0543] In particular, in this specific implementation, the optical lens 332 and the base 35 have an integrated structure, that is, the optical lens 332 and the base 35 have been assembled into a whole before participating in the assembly of the camera module 30. In other words, in this specific example, the optical lens 332 is an integrated lens 333, which is assembled with the base 35 to form a component unit. Further, in this specific example, the base 35 has at least two positioning columns extending downward, and the circuit board 31 has at least two openings. The positioning columns are arranged on the reinforcement plate 37 through the openings. In this way, the integrated lens 333 and the photosensitive chip 32 have the same installation reference surface (that is, the top surface of the reinforcement plate 37). In this way, the overall height dimension of the camera module 30 is reduced while meeting the design requirements of the preset optical back focus.

[0544] It is worth mentioning that in this specific example of application, the integrated lens 333 may further include the color filter element 331, that is, in this specific implementation, the optical lens 332, the base 35 and the color filter element 331 have an integrated structure, that is, the optical lens 332, the base 35 and the color filter element 331 have been assembled into a whole before participating in the assembly of the camera module 30. In this way, the assembly method of the camera module 30 can be made more compact, so that the overall height size of the camera module 30 can be reduced.

[0545] Fig.37 FIG. 2 shows another specific example of the camera module 30 according to the present invention. Fig.37As shown, in this specific example, the camera module 30 includes an optical lens 332, a base 35, a color filter element 331, a photosensitive chip 32 and a circuit board 31, wherein the photosensitive chip 32 is conductively arranged on the circuit board 31, the base 35 is arranged on the circuit board 31, the lens and the color filter element 331 are sequentially arranged on the photosensitive path of the photosensitive chip 32, wherein the base 35 is used to support the color filter element 331. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0546] Furthermore, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is attached to the circuit board, the electrical connection between the photosensitive chip 32 and the circuit board 31 is realized through the leads 34. Specifically, each of the leads 34 extends between the photosensitive chip 32 and the circuit board 31 in a curved manner, so as to connect the photosensitive chip 32 to the circuit board 31 through the leads 34, so that the circuit board 31 can supply power to the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signal according to the leads 34.

[0547] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 by a "gold wire" process to achieve electrical connection between the two.

[0548] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the circuit board 31, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the photosensitive chip 32, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the upward protrusion height of the lead 34 formed by the "reverse gold wire punching" process is smaller than the upward protrusion height of the lead 34 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the lead 34 is formed by the "reverse gold wire punching" process.

[0549] A group of electronic components 312 is also provided on the circuit board 31, wherein each of the electronic components 312 can be mounted on the edge area of ​​the circuit board 31 (compared to the mounting position of the photosensitive chip 32) at intervals from each other through processes such as SMT (Surface Mount Technology). The electronic components 312 include but are not limited to resistors, capacitors, inductors, etc. It is worth mentioning that the photosensitive chip 32 and each of the electronic components 312 can be located on the same side or opposite sides of the circuit board 31. For example, the photosensitive chip 32 and each of the electronic components 312 can be located on the same side of the circuit board 31, and each of the electronic components 312 is mounted on the edge area of ​​the circuit board 31 at intervals from each other.

[0550] In particular, if Fig.37 As shown, in this specific example, the base 35 is supported on the top surface of the circuit board 31, and the base 35 includes a main body 352 and a side wall 353 extending downward along the main body 352, and the main body 352 and the side wall 353 define a receiving cavity 354. When the base 35 is set on the circuit board 31, the side wall 353 is supported on the circuit board 31, and the bottom surface of the base 35, the upper surface of the circuit board 31 and the side wall 353 together define the receiving cavity 354, wherein the electronic components 312 set on the circuit board 31 are received in the receiving cavity 354. Preferably, the height dimension of the receiving cavity 354 is less than 0.2 mm, for example, 0.1 mm.

[0551] Furthermore, if Fig.37 As shown, in this specific example, the base 35 also has at least one accommodating hole 355, and the accommodating hole 355 is arranged through the base 35 to connect the accommodating cavity 354 with the external environment. It is worth understanding that in this specific embodiment, the height of the accommodating cavity 354 is lower than the electronic components 312 with higher sizes, such as capacitors. Therefore, when the base 35 is set on the circuit board 31, since the height from the bottom surface of the main body 352 of the base 35 to the top surface of the circuit board 31 is less than the electronic components 312 with higher sizes such as capacitors, if the accommodating hole 355 is not provided, the above-mentioned electronic components 312 cannot be accommodated. In other words, the role of the accommodating hole 355 is to avoid the high-sized electronic components 312, so that when the height of the base 35 is reduced, the electronic components 312 can also be accommodated in the base 35. In other words, by providing the accommodating hole 355 on the base 35, the overall design height of the base 35 can be reduced, so that the overall height size of the camera module 30 can be reduced.

[0552] For example, but not limited to, for example, the height of the capacitor in the electronic component 312 is 0.38 mm, the height of the accommodating cavity 354 is 0.1 mm, and the thickness of the main body 352 of the base 35 is set to 0.4 mm, that is, the height of the accommodating hole 355 is 0.4 mm. In this way, when the base 35 is set on the circuit board 31, the capacitor in the electronic component 312 cannot be completely accommodated in the accommodating cavity 354, and accordingly, the upper end of the capacitor in the electronic component 312 extends into the accommodating hole 355 and is accommodated in the accommodating hole 355. It should be understood that in the present invention, the accommodating hole 355 should match the setting of the electronic component 312 of the circuit board 31, and the horizontal size of the electronic component 312 determines the size of the accommodating hole 355, that is, the electronic component 312 should be ensured to be accommodated in the accommodating hole 355.

[0553] Furthermore, if Fig.37As shown, in this specific example, the base 35 further has a light hole 356, which is formed in the main body 352 of the base 35 and corresponds to the photosensitive chip 32, wherein the light hole 356 is used to place the color filter element 331. Correspondingly, the main body 352 of the base 35 also has a cantilever 357, which extends integrally from the main body 352 and defines the size of the light hole 356, wherein the color filter element 331 is placed on the cantilever 357 and filters the light received by the module. It is particularly noted that in this specific example, when the base 35 is set on the circuit board 31, and then the color filter element 331 is placed on the cantilever 357 of the main body 352, and the upper end of at least one of the electronic components 312 is accommodated in the accommodation hole 355, it can be observed that the top surface of part of the electronic component 312 is higher than the bottom surface of the color filter element 331.

[0554] It is worth mentioning that, in this specific example, the color filter element 331 can be implemented as different types, including but not limited to the color filter element 331 can be implemented as an infrared cutoff filter, a full spectrum filter and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 32. In this way, when the camera module 30 is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 32, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object entering the camera module 30. Moreover, when the camera module 30 is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 32 to allow the infrared rays in the light reflected by the object entering the camera module 30 to be partially transmitted.

[0555] Of course, the color filter element 331 can also be arranged at other positions on the photosensitive path of the photosensitive chip 32, for example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc., which is not limited to this application.

[0556] In particular, if Fig.37As shown, in this specific example, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the circuit board 31; or, the base 35 can be implemented as a molded base, which can be integrally formed by an injection molding process and attached to the top surface of the circuit board 31. However, due to the limitation of the molding process of the base 35, the receiving hole 355 is set as a light-through hole, that is, the receiving hole 355 is connected to the receiving cavity 354 and the external environment. It should be conceivable that when assembling the camera module 30, dirt can easily enter through the receiving hole 355, causing stains on the photosensitive chip 32.

[0557] Therefore, if Fig.37 As shown, in this specific example, the camera module 30 further includes a protective member 38, which extends downward from the main body 352 as a whole. When the base 35 is set on the circuit board 31, the protective member 38 surrounds the photosensitive chip 32. The protective member 38, the main body 352 of the base 35 and the color filter element 331 set on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32.

[0558] In a specific implementation, the protective member 38 can be implemented as a part of the main body 352 of the base 35, which extends downward from the main body 352 as a whole, wherein when the base 35 is set on the circuit board 31, the protective member 38 surrounds the photosensitive chip 32, and the protective member 38, the main body 352 of the base 35 and the color filter element 331 set on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32. Alternatively, the protective member 38 and the base 35 are set separately, such as Fig.38 As shown, for example, the protective member 38 is attached to the base 35 by bonding or other processes, thereby reducing the difficulty of molding the base 35 .

[0559] Preferably, the upper end of the receiving hole 355 can be sealed by a film or glue, so as to prevent the electronic components 312 from being damaged on the one hand, and further enhance the sealing effect on the other hand to prevent dirt from entering the photosensitive chip 32.

[0560] It is worth mentioning that in this specific example, the camera module 30 can be implemented as a fixed focus module or a dynamic focus module, wherein, when the camera module 30 is a dynamic focus module, the camera module 30 further includes a driver 36 electrically connected to the circuit board 31 (for example but not limited to, the driver can be implemented as a motor, etc.), and the driver 36 is used to controllably drive the lens to move to achieve auto-focus (Auto-Focus), such as Fig.39 shown.

[0561] In particular, if Fig.39 As shown, the driver 36 includes at least one positioning column 361, which extends from the lower end of the driver 36, and at least one positioning column 361 is formed at a position on the driver 36 corresponding to at least one receiving hole 355, so that when the driver 36 is installed on the base 35, the positioning column is engaged with the receiving hole 355 in a latching manner. In this way, the installation accuracy of the driver can be improved through the cooperation between the positioning column 361 and the receiving hole 355, and the cooperation between the positioning column and the receiving hole 355 can also improve the reliability of the driver 36.

[0562] Fig.40 Another specific example of the camera module 30 according to the present invention is shown in the figure, wherein: Fig.40 The camera module 30 shown is Fig.37 A modified implementation of the camera module 30 is shown.

[0563] Specifically, if Fig.40 As shown, in this specific example, the protective member 38 is implemented as a protective film, and the protective film is attached to the upper end of the receiving hole 355 (the top surface of the main body 352), so that when the base 35 is set on the circuit board 31, the protective film ensures that the receiving hole 355 and the receiving cavity 354 are a closed space, so that dirt can also be prevented from entering the photosensitive chip 32, and the protective film can also protect the electronic components 312. For example, the protective film can be implemented as a film, or the protective film can be formed on the upper end of the receiving hole 355 by a process such as glue filling to seal the receiving hole 355.

[0564] Fig.41 Another specific example of the camera module 30 according to the present invention is shown in the figure, wherein: Fig.41 The camera module 30 shown is Fig.37 The camera module 30 shown is a modified implementation.

[0565] Specifically, if Fig.41 As shown, in this specific example, the electronic components 312 disposed on the circuit board 31 are disposed on both sides of the circuit board 31, that is, the photosensitive chip 32 is disposed on the circuit board 31, and the electronic components 312 are located on both sides of the photosensitive chip 32. Those skilled in the art should know that in the existing camera module, most of the electronic components 312 located on the circuit board 31 are arranged around (or on four sides of) the circuit board 31.

[0566] Furthermore, if Fig.41As shown, in this specific example, the protection member 38 is integrally formed with the main body 352 and extends downward from the main body 352. Preferably, the protection member 38 extends downward from the main body 352 in parallel with the side wall 353 to form a receiving cavity 358 between the side wall 353 and the protection member 38, and the receiving hole 355 is formed between the side wall 353 and the protection member 38 and communicates with the receiving cavity 358.

[0567] In particular, if Fig.41 As shown, in this specific example, the electronic component 312 is arranged at a position on the circuit board 31 so that when the base 35 is attached to the top surface of the circuit board 31, the electronic component 312 is accommodated in the accommodating cavity 358, and the portion of the electronic component 312 that is higher than the height of the accommodating cavity 358 can be accommodated in the accommodating hole 355.

[0568] It should be understood that in this specific example, the positions of the side wall 353 and the protective member 38 should be determined by the arrangement of the electronic components 312 on the circuit board 31. For example, when the electronic components 312 are arranged in a matrix on both sides of the circuit board 31, the protective member 38 extends downward from the main body 352 in parallel with the side wall 353 and is formed between the electronic components 312 and the photosensitive chip 32, so as to isolate the photosensitive chip 32 and prevent dirt from entering the photosensitive chip 32 through the receiving hole 355.

[0569] It is worth pointing out that in this specific example, the protective member 38 only needs to be formed between the photosensitive chip 32 and the electronic component 312 to isolate the photosensitive chip 32, that is, the protective member 38 does not need to be arranged around the photosensitive chip 32, but only needs to be formed on both sides of the photosensitive chip 32. In other words, in this specific example, the camera module 30 has an extremely narrow side, wherein the extremely narrow side is formed on the side of the circuit board 31 where the electronic component 312 is not arranged, and the installation positions of the photosensitive chip 32 and the optical lens 332 are close to the edge of the circuit board 31. In particular, the extremely narrow side allows the camera module 30 to be set at the edge of the smartphone.

[0570] Fig.42 FIG. 2 shows another specific example of the camera module 30 according to the present invention. Fig.42As shown, in this specific example, the camera module 30 includes an optical lens 332, a base 35, a color filter element 331, a photosensitive chip 32 and a circuit board 31, wherein the photosensitive chip 32 is conductively arranged on the circuit board 31, the base 35 is integrally formed on the circuit board 31 through a molding process, the optical lens 332 and the color filter element 331 are sequentially arranged on the photosensitive path of the photosensitive chip 32, wherein the base 35 is used to support the color filter element 331. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0571] In particular, this specific example is an optimization solution for the existing camera module based on the molding process. Those skilled in the art should know that in the existing camera module based on the molding process, the photosensitive chip and electronic components are usually mounted on the circuit board first, and then a molding base is formed on the circuit board through the molding process. Then, after the filter is mounted on the lens holder, the lens is mounted on the filter assembly so that the lens is kept on the photosensitive path of the chip. Fig.42 However, this assembly method of the prior art has a great limitation on the height of the camera module.

[0572] In detail, although the lateral size and height of the camera module can be reduced by replacing the traditional lens mount with a molded base, the mold used in the molding process needs to avoid electronic components such as capacitors and resistors on the circuit board (especially capacitors with larger sizes, the current smallest capacitor has a height of 0.38mm), and a certain safety distance must be reserved between the mold and various electronic components. Therefore, the height of the molded base must be at least greater than 0.4mm; on the other hand, the filter is usually combined with a support to form a filter assembly, and then the filter assembly is mounted on the molded base. Since the support is usually made by injection molding, the thickness of the part of the support used to support the filter is required to be basically greater than 0.15mm, and the thickness of the filter itself is usually above 0.21mm. Therefore, the thickness of the filter assembly must be at least greater than 0.36mm.

[0573] That is to say, the distance between the lens and the circuit board 31 is equal to the sum of the height of the molded base and the thickness of the filter assembly (at least greater than 0.76 mm). However, due to the limitations of all the above factors, the distance between the lens and the circuit board 31 of the camera module of the prior art cannot be further reduced. In other words, the height of the camera module of the prior art cannot be further reduced, thereby failing to meet the market demand for thinner and smaller camera modules.

[0574] Accordingly, if Fig.43As shown, in this specific example, the mold base has a sunken step portion for mounting the color filter element 331 thereon. That is to say, compared with the existing camera module based on the molding process, in this specific example, the top surface of the mold base is a non-flat surface, which has a sunken step portion. Accordingly, by mounting the color filter element 331 on the sunken step portion of the mold base, the color filter element support can be eliminated, and the distance between the color filter element 331 and the circuit board 31 can be reduced, thereby achieving the effect of reducing the height of the module.

[0575] Specifically, if Fig.43 As shown, in this specific example, the mold base has a stepped peripheral groove 350, wherein the color filter element 331 of the light-transmitting component 33 is disposed in the stepped peripheral groove 350 of the mold base. In this way, the distance between the optical lens 332 and the circuit board 31 is no longer limited by the thickness of the color filter element 331 itself, that is, the distance between the optical lens 332 and the circuit board 31 can be reduced to be less than the sum of the thickness of the color filter element 331 and the height of the mold base, so as to reduce the overall height dimension of the camera module 30.

[0576] Fig.44 FIG. 3 shows another specific implementation of the photosensitive chip 32B according to the present invention. Fig.44 As shown, in this specific example, the structure of the photosensitive chip itself is optimized to reduce the overall height of the camera module 30. In other words, in this specific implementation, the camera module 30 can be implemented as follows: Figure 39 to Figure 43 Any of the camera modules described above and its variations.

[0577] Specifically, in this specific example, the camera module 30 uses a quantum dot film photosensitive chip 32A to replace the traditional CMOS / CCD photosensitive chip. Compared with the traditional CMOS / CCD photosensitive chip, the quantum dot film photosensitive chip 32B has the dual advantages of plane size and height size.

[0578] First, the use of the quantum dot film photosensitive chip 32B can reduce the size of the photosensitive chip in the Z-axis direction. Fig.44As shown, the quantum dot film photosensitive chip 32B includes a color filter 321B, a top electrode 322B, a quantum dot film 323B, a bottom electrode 324B and a pixel circuit 325B from top to bottom, wherein the top electrode 322B, the quantum dot film 323B and the bottom electrode 324B constitute the photosensitive layer of the quantum dot film photosensitive chip 32B, the quantum dot film 323B is electrically connected to two electrodes, and the current and / or voltage between the two electrodes is related to the intensity of the light received by the quantum dot film 323B; the pixel circuit 325B includes a charge storage and reading circuit. In particular, the color filter can be implemented as a Bayer filter or a Mono filter, which is not limited by the present application.

[0579] During operation, the light passing through the color filter 321B is irradiated onto the photosensitive layer. The photosensitive layer generates charges between the top electrode and the bottom electrode under a given bias voltage, so that the voltage is accumulated in the charge storage during the integration period. The pixel circuit 325B reads the electrical signal and transmits it to the chip. The electrical signal reflects the signal of the light intensity absorbed by the photosensitive layer during the integration period. The electrical signal is the light intensity generated by the light passing through the color filter 321B. Therefore, the electrical signal can correspond to the light passed by the color filter 321B. That is, if the color filter 321B is red, indicating that only red light can pass through, then the electrical signal generated by the photosensitive layer corresponding to the color filter 321B represents the intensity of red light in the light at that position.

[0580] Compared with the existing CMOS or CCD chips, the quantum dot thin film photosensitive chip 32B has a relatively small thickness.

[0581] Fig.45 The figure shows another specific schematic diagram of the photosensitive chip 32B of the camera module 30 according to the present invention, wherein: Fig.45 The photosensitive chip 32B shown is Fig.44 A variant implementation of the photosensitive chip is shown.

[0582] Specifically, if Fig.45 As shown, in this specific example, the quantum dot film 323B of the photosensitive layer is configured to respond to light of a selected color or color group. For example, a photoconductive material and a wavelength selective absorption material (such as a material forming a color filter 321B array) can be combined to form a color-sensitive pixel to achieve the sensitivity of the color. Accordingly, the quantum dot film 323B can be configured to be sensitive to the three colors of red (R), green (G), and blue (B), respectively, so that the color filter 321B in the photosensitive chip can be directly eliminated.

[0583] During operation, when light passes through the color-sensitive pixel, the color-sensitive pixel absorbs the corresponding light, converts the light intensity of the wavelength or band into an electrical signal, transmits it to the chip through the pixel circuit 325B, processes the image, and the rest of the light continues to propagate forward without affecting the photoelectric conversion of the pixel. Accordingly, this technical solution can not only reduce the Z-direction size of the photosensitive chip, but also, because there is no color filter 321B to filter the light, the photosensitive chip can receive more light, and the imaging of the photosensitive chip is clearer.

[0584] Furthermore, the use of the quantum dot film photosensitive chip 32B can reduce the size of the photosensitive chip in the XY axis direction. Specifically, due to the high light transmittance of the quantum dot film 323B, after being configured as a material that is sensitive to a certain wavelength or waveband, the quantum dot film 323B can only absorb the corresponding light, while other light will pass through the film and continue to propagate forward. Therefore, multiple quantum dot films 323B that are sensitive to a certain wavelength or waveband can be arranged vertically.

[0585] In other words, the light intensity information of multiple wavelengths or bands can be obtained at the same time at a pixel position. For example, the three quantum dot films 323B of red color-sensitive pixels, green color-sensitive pixels, and blue color-sensitive pixels are arranged vertically. When the light passes through the red color-sensitive pixel, the red light is absorbed and converted into an electrical signal, and the remaining light continues to propagate forward. After passing through the green color-sensitive pixel, the green light is absorbed and converted into an electrical signal. The remaining light continues to propagate forward. After reaching the blue color-sensitive pixel, the blue light is also absorbed and converted into an electrical signal. Therefore, the light intensity information of multiple wavelengths or bands of light can be obtained at the same time at a point the size of a pixel.

[0586] It is worth mentioning that the three RGB colors introduced in this specific example of the present application are not limiting. Each layer of quantum dot film 323B can absorb and convert any required light. It is only necessary to configure the quantum dot film 323B to be sensitive to the required light.

[0587] Moreover, in this specific example, since the traditional color filter 321B is not used, not only a stronger light intensity can be obtained, but also a higher resolution can be obtained for a photosensitive chip of the same specification. In other words, at the same resolution, the method adopted in this solution can reduce the XY dimensions of the photosensitive chip, thereby further reducing the planar dimensions of the camera module 30.

[0588] Furthermore, the quantum dot film 323B in the quantum dot film 323B chip involved in the present application can be prepared by the following process.

[0589] In one formation method, the quantum dot material can be processed by melt pool casting to form the quantum dot film 323B. Melt pool casting can include depositing a measured quantum dot material onto a substrate and allowing the solution to evaporate, and the resulting film may or may not be cleaved.

[0590] In one formation method, the quantum dot material may be processed by electrodeposition to form the quantum dot film 323B.

[0591] In one formation method, the quantum dot film 323B may be formed by vapor deposition of quantum dot materials.

[0592] In one formation mode, the quantum dot film 323B can be formed by spraying the quantum dot material. Spraying can include processing from a gas. Spraying can include entrainment in a solvent.

[0593] In one formation mode, the quantum dot material can be processed by growth from a solution to form the quantum dot film 323B. The growth of the film from the solution can include cross-linking. A cross-linking agent can be attached to at least a portion of the substrate to cross-link the quantum dots. When the substrate with the attached cross-linking agent is immersed in the quantum dot solution, the quantum dots can become cross-linked and grow at the position where the cross-linking agent is attached on the substrate, and the growth process can be similar to the process of seed growth. Since the growth occurs at the position where the cross-linking agent has been attached, the formation of a patterned film on the substrate can be achieved by depositing the cross-linking agent along the substrate with the pattern.

[0594] In one formation mode, the quantum dot material can be treated with a hydrophobic system to form a film. The hydrophobic system can enable the deposition of a single layer of quantum dot film 323B, which can be deposited in a pattern.

[0595] In one formation method, the quantum dot film 323B may be formed by accelerating or evaporating a quantum dot material in a gas phase.

[0596] In one formation method, the quantum dot film 323B can be formed by processing the quantum dot material through a photolithography method.

[0597] In one forming method, the quantum dot film 323B may be formed by processing the quantum dot material through an inkjet printing method.

[0598] In summary, the camera module 30 disposed below the display screen can adopt but is not limited to the technical solutions listed above and their variations, so that the size of the camera module 30 in its height direction can be reduced to meet the demand for thin smartphones.

[0599] Reference Fig.46 A specific schematic diagram of the photosensitive layer of the above-mentioned photosensitive chip 32B is shown. The photosensitive layer includes the top electrode 322B, the quantum dot film 323B and the bottom electrode 324B.

[0600] In this example, the top electrode 322B and the bottom electrode 324B of the photosensitive layer are arranged to be horizontally distributed, thereby reducing the influence on the propagation of light.

[0601] Specifically, the photosensitive layer further includes a nanocrystal film 326B and a substrate 327B, wherein the nanocrystal film 326B is located above the top electrode 322B and the bottom electrode 324B, the nanocrystal film 326B is a transparent material, and the substrate 327B is located at the lowest end of the photosensitive layer.

[0602] The top electrode 322B and the bottom electrode 324B are located between the nanocrystal film 326B and the substrate 327B, and at least a portion of the nanocrystal film 326B extends to the substrate 327B.

[0603] The entire photosensitive layer can be a lateral stacking structure, the top electrode 322B of the photosensitive layer is located between the nanocrystal film 326B and the substrate 327B, the bottom electrode 324B of the photosensitive layer is located between the nanocrystal film 326B and the substrate 327B, and the bottom electrode 324B and the top electrode 322B are supported on the substrate 327B respectively. The top electrode 322B and the bottom electrode 324B do not overlap in the height direction. The top electrode 322B and the bottom electrode 324B are horizontally arranged between the nanocrystal film 326B and the substrate 327B. The substrate 327B can be a glass substrate 327B, the top electrode 322B can be a metal contact, and the bottom electrode 324B can be a metal contact.

[0604] The quantum dot film 323B covers the top of the substrate 327B and the bottom electrode 324B is located on the top of the quantum dot film 323B.

[0605] Reference Fig.47 A specific schematic diagram of the photosensitive layer of the above-mentioned photosensitive chip 32B is shown. The photosensitive layer includes the top electrode 322B, the quantum dot film 323B, and the bottom electrode 324B.

[0606] The top electrode 322B and the bottom electrode 324B at least partially overlap in the height direction.

[0607] In this example, the top electrode 322B is located on the top of the photosensitive layer, and the bottom electrode 324B is located below the top electrode 322B.

[0608] The photosensitive layer further includes a nanocrystal film 326B and a substrate 327B, wherein the nanocrystal film 326B is located between the top electrode 322B and the bottom electrode 324B, and the substrate 327B is located below the bottom electrode 324B.

[0609] The top electrode 322B is configured to be a transparent material, thereby reducing the influence on light passing through the top electrode 322B.

[0610] Furthermore, the quantum dot film 323B is located between the substrate 327B and the bottom electrode 324B.

[0611] Reference Fig.48A To Attachment Fig.51C As shown, an assembly method of the camera module 30 and the display screen 20 with the light through hole 200 according to the present invention is explained. It can be understood that the display screen 20 can also be provided with the light guide channel 500 and / or the light through hole 200. Here, the light through hole 200 that penetrates in the height direction is taken as an example for illustration.

[0612] The present invention provides an assembly system 60, wherein the assembly system 60 includes a clamping device 61, a testing unit 62 and a supporting platform 63, wherein the clamping device 61 is located above the supporting platform 63 and is used to clamp the camera module 30, and the display screen 20 is supported on the supporting platform 63.

[0613] The clamping device 61 can clamp the camera module 30 to drive the camera module 30 to move, thereby changing the relative position of the camera module 30 and the display screen 20 supported on the supporting platform 63, so as to obtain the imaging effect of the camera module 30 when the camera module 30 and the display screen 20 are in various positions through the testing unit 62, and then determine the installation position of the camera module 30 and the display screen 20.

[0614] The assembly system 60 further includes a loading unit 64, wherein after the relative positions of the camera module 30 and the display screen 20 are determined based on the testing unit 62, the loading unit 64 can load the camera module 30 and / or the display screen 20 so that the camera module 30 and the display screen 20 can be fixed in a confirmed suitable installation position.

[0615] Further, the test unit 62 includes a light source 621, a target plate 622, and a sensing device 623, wherein the light source 621 is disposed near a light entrance position of the camera module 30, and the target plate 622 may be located in front of the light source 621, that is, the light source 621 is located between the target plate 622 and the camera module 30. The target plate 622 may also be located behind the light source 621, that is, the target plate 622 is located between the light source 621 and the camera module 30. The light source 621 may also be located on the target plate 622, and may provide uniform light to the target plate 622.

[0616] The light source 621 emits light when working, and the sensing device 623 obtains a real-time working image of the target plate 622 from the camera module 30, and adjusts the position of the camera module 30 based on the working image until the imaging effect of the camera module 30 reaches the expected value.

[0617] Specifically, the assembly method of the display screen 20 may be, first, adjusting the distance between the camera module 30 and the display screen 20 to a suitable value, and then adjusting the optical axis of the camera module 30 and the center of the light hole 200 of the display screen 20 to make them coincide. The latter adjustment may be:

[0618] When the camera module 30 is located at a position relative to the display screen 20, the sensing device 623 can sense the optimality of the positions of the two, especially the overlap of the optical axes, and then use one of them as a reference (for example, the display screen 20 as a reference) to calculate the other relative adjustment amount (the adjustment amount of the camera module 30 relative to the display screen 20), and make corresponding adjustments based on the adjustment amount. After the adjustment, the optical axis conditions of the two are calculated again. If the detection result meets the expectations, the module is assembled at this position. Otherwise, the adjustment continues until the positions of the two reach the optimal state, that is, the shooting of the camera module 30 is in the optimal state, and at the same time, the assembly of the camera module 30 and the display screen 20 does not affect the installation and operation of other components. Of course, the adjustment of the position of the camera module 30 relative to the display screen 20 is also adjusted within the range allowed for the installation of the camera module 30.

[0619] Further, in this example, the camera module 30 is located above the display screen 20, and the camera module 30 is located above the support platform 63. The light source 621 and the target plate 622 are located below the display screen 20. In other words, the display screen 20 is supported on the support platform 63 with its back side facing upward. The camera module 30 is installed on the back side of the display screen 20 in a subsequent step.

[0620] The clamping device 61 and the loading unit 64 operate above the support platform 63, so that the relative positions of the camera module 30 and the display screen 20 can be observed in time above the support platform 63, thereby facilitating operation, especially in the case of manual operation. Of course, it can be understood by those skilled in the art that the assembly process of the camera module 30 and the display screen 20 can be completed with the aid of a complete set of automated equipment.

[0621] In some other embodiments of the present invention, the camera module 30 is located below the display screen 20, the light source 621 and the target plate 622 are located above the display screen 20, and the camera module 30 receives light from top to bottom to perform photoelectric conversion. At this time, if the relative position of the camera module 30 and the display screen 20 needs to be observed, it is necessary to observe from below the support platform 63.

[0622] Further, preferably, the display screen 20 is located in a horizontal position, and based on the different orientations of the back side of the display screen 20 , the camera module 30 can be located above the display screen 20 or below the display screen 20 .

[0623] Of course, it is understandable that the display screen 20 can be located in an inclined position, for example, the support platform 63 is inclined, and the position of the camera module 30 can be adjusted relative to the position of the display screen 20 through the clamping device 61. The display screen 20 can also be located in a vertical position, for example, the support platform 63 is located in a vertical position, and the camera module 30 and the display screen 20 are relatively adjusted in the vertical position.

[0624] Furthermore, the support platform 63 has an installation space 630 , wherein the installation space 630 is located on the support platform 63 , and the display screen 20 can be fixedly accommodated in the installation space 630 .

[0625] The support platform 63 has a test hole 6300, wherein the installation space 630 is connected to the test hole 6300. When the display screen 20 is fixed to the installation space 630, the test hole 6300 corresponds to the light hole 200 of the display screen 20, so that light can enter the light hole 200 of the display screen 20 through the test hole 6300, and then reach the camera module 30 through the light hole 200.

[0626] The test hole 6300 passes through the support platform 63 , so that light on one side of the support platform 63 can pass through the test hole 6300 to reach the other side of the support platform 63 .

[0627] The test hole 6300 can be set to a certain shape according to the test requirements. For example, in this example, the test hole 6300 is conical. The closer to the display screen 20, the smaller the inner diameter of the test hole 6300, and the farther away from the display screen 20, the larger the inner diameter of the test hole 6300.

[0628] The testing hole 6300 can play the role of converging light.

[0629] The supporting platform 63 includes a platform body 631 and a fixing component 632 , wherein the fixing component 632 is disposed on the platform body 631 , and the fixing component 632 is used to fix the display screen 20 .

[0630] In this example, the fixing component 632 is integrally formed with the platform body 631 , the installation space 630 is formed in the platform body 631 , and the fixing component 632 is disposed on the platform body 631 and accommodated in the installation space 630 .

[0631] The display screen 20 can be installed on the fixing component 632. With the assistance of the fixing component 632, the relative positions of the display screen 20 and the platform body 631 are fixed, so that only the position of the camera module 30 is needed to adjust the relative positions of the display screen 20 and the camera module 30, so as to find a position of the camera module 30 with better imaging effect relative to the display screen 20.

[0632] In other embodiments of the present invention, the fixing component 632 is detachably mounted on the platform body 631. The size of the fixing component 632 can be adjusted to suit the size of the display screen 20. For example, if the installation space 630 provides a 7-inch area, the fixing component 632 can provide an area of ​​about 6 inches for installing the display screen 20. If it is necessary to assemble a 5-inch display screen 20, the fixing component 632 can be replaced with a fixing component 632 that can provide an area of ​​about 5 inches to adapt to the adjustment of the size of the display screen 20.

[0633] Furthermore, in some other embodiments of the present invention, the clamping device 61 clamps the camera module 30 and the display screen 20 respectively, and then finds a suitable assembly position by changing the relative positions of the camera module 30 and the display screen 20.

[0634] In other embodiments of the present invention, the supporting platform 63 supports the camera module 30, the clamping device 61 clamps the display screen 20, and then the clamping device 61 drives the display screen 20 to move to change the position of the display screen 20, thereby changing the relative positions of the camera module 30 and the display screen 20 while keeping the camera module 30 fixed until a satisfactory imaging effect is obtained.

[0635] Furthermore, in this example, the assembly system 60 includes a limiting mechanism 65 , wherein the limiting mechanism 65 is disposed on the display screen 20 and is located near the light-through hole 200 of the display screen 20 .

[0636] The limiting mechanism 65 is used to limit the position of the camera module 30 to improve the alignment accuracy between the camera module 30 and the display screen 20 .

[0637] Specifically, when the relative position of the camera module 30 and the display screen 20 is changed to test the imaging effect, the limiting mechanism 65 can limit the position change of the camera module 30 so that the position adjustment of the camera module 30 is controlled within a certain range, avoiding excessive adjustment of the position of the camera module 30 at a single time, thereby helping to improve the alignment accuracy of the camera module 30 and the display screen 20.

[0638] The limiting mechanism 65 is disposed on the back side of the display screen 20 and is aligned with the light hole 200 of the display screen 20 , so that when the camera module 30 is installed on the limiting mechanism 65 , the camera module 30 can be aligned with the light hole 200 of the display screen 20 .

[0639] Then the camera module 30 is installed on the limiting mechanism 65. After being installed on the limiting mechanism 65, the camera module 30 is aligned with the light hole 200 of the display screen 20 and the relative position of the camera module 30 and the limiting mechanism 65 can be fine-tuned.

[0640] Then, the image formed by the camera module 30 is acquired by the test device, and the camera module 30 and the position limiting mechanism 65 are adjusted based on the imaging effect of the camera module 30, so as to change the relative position of the camera module 30 and the display screen 20. The adjustment space provided by the position limiting mechanism 65 is limited, and the relative position adjustment of the camera module 30 and the display screen 20 can only be adjusted within a small range, so that the position of the camera module 30 will not be greatly offset during this adjustment process, so as to improve the alignment accuracy of the camera module 30 and the display screen 20.

[0641] After determining the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, the relative position of the camera module 30 and the limiting mechanism 65 is fixed, thereby fixing the relative position of the camera module 30 and the display screen 20. The camera module 30 is assembled on the display screen 20, and the camera module 30 can obtain sufficient light through the light hole 200 of the display screen 20 and obtain the expected imaging effect.

[0642] Further, in some other embodiments of the present invention, the limiting mechanism 65 is provided on the camera module 30. Specifically, the limiting mechanism 65 and the camera module 30 are first mounted on each other, and then the limiting mechanism 65 is fixed to the display screen 20, so that the camera module 30 located on the limiting mechanism 65 can correspond to the light hole 200 of the display screen 20.

[0643] The limiting mechanism 65 provides a certain adjustment space for the camera module 30 installed on the limiting mechanism 65 .

[0644] After the limiting mechanism 65 is installed on the display screen 20 , the relative position of the camera module 30 and the limiting mechanism 65 can be adjusted based on the imaging effect of the camera module 30 , so as to confirm the relative position of the camera module 30 and the display screen 20 .

[0645] It is worth mentioning that when the limiting mechanism 65 is installed on the display screen 20, the camera module 30 has been installed on the limiting mechanism 65, so the relative position of the limiting mechanism 65 and the display screen can be determined based on the imaging effect of the camera module 30, and then the limiting mechanism 65 is positioned on the display screen 20. The fixing method between the limiting mechanism 65 and the display screen 20 can be gluing or welding.

[0646] In other words, before the camera module 30 is installed on the display screen 20, the limiting mechanism 65 can be installed on the camera module 30 or the display screen 20. Then, based on the imaging effect of the camera module 30, the relative position of the camera module 30 and the limiting mechanism 65 is adjusted within the adjustable range of the limiting mechanism 65, thereby adjusting the relative position of the camera module 30 and the display screen 20.

[0647] Furthermore, the limiting mechanism 65 has a limiting channel 650 , and the lens assembly of the camera module 30 can be at least partially accommodated in the limiting channel 650 .

[0648] When the limiting mechanism 65 is located on the display screen 20 , the limiting channel 650 of the limiting mechanism 65 is aligned with the light-through hole 200 of the display screen 20 .

[0649] The limiting mechanism 65 and the camera module 30 cooperate with each other so that when the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 can play a limiting role for the camera module 30, and at the same time, the camera module 30 can make adjustments within a certain range in the limiting channel 650 provided by the limiting mechanism 65 to change the relative positions of the camera module 30 and the display screen 20.

[0650] Specifically, the limiting mechanism 65 may include a sleeve 651 and a limiting assembly 652, wherein the sleeve 651 surrounds the limiting channel 650. The limiting assembly 652 includes a first limiting member 6521 and a second limiting member 6522, wherein the first limiting member 6521 is disposed on the inner wall of the sleeve 651, and the second limiting member 6522 is disposed on the outer wall of the lens assembly of the camera module 30.

[0651] When the camera module 30 is installed on the limiting mechanism 65 , the first limiting member 6521 and the second limiting member 6522 cooperate with each other to limit the position of the camera module 30 .

[0652] The first limiting member 6521 may be a directional groove, and the second limiting member 6522 may be a protrusion. When the camera module 30 is installed on the limiting mechanism 65 , the second limiting member 6522 extends into the first limiting member 6521 .

[0653] The first limiting member 6521 may be a protrusion, and the second limiting member 6522 may be a groove. When the camera module 30 is installed on the limiting mechanism 65 , the first limiting member 6521 extends into the second limiting member 6522 .

[0654] It is worth noting that when the camera module 30 is installed on the limiting mechanism 65, the first limiting member 6521 and the second limiting member 6522 are not completely fixed together, and a certain amount of movable space is left between the first limiting member 6521 and the second limiting member 6522, so that the position of the camera module 30 relative to the sleeve 651 can be further adjusted while being limited by the limiting assembly 652.

[0655] Furthermore, the inner wall of the sleeve 651 can be set to a threaded structure, and the outer wall of the upper part of the camera module 30, that is, the outer wall of the lens barrel of the lens assembly can be at least partially set to a threaded structure.

[0656] When the camera module 30 is installed on the limiting mechanism 65, not only the relative positions of the camera module 30 and the limiting mechanism 65, especially the axis of the camera module 30 and the center of the light hole 200 of the display screen 20 can be relatively adjusted, but also the distance between the camera module 30 and the display screen 20 can be adjusted.

[0657] Of course, it is understandable that if the limiting mechanism 65 needs to be installed on the display screen 20, the distance between the camera module 30 and the display screen 20 can be adjusted by controlling the distance between the limiting mechanism 65 and the display screen 20 during the process of the limiting mechanism 65 being installed on the display screen 20.

[0658] Preferably, the center of the sleeve 651 of the limiting mechanism 65 is aligned with the center of the light hole 200 of the display screen 20. Further, preferably, the center of the sleeve 651 of the limiting mechanism 65 is aligned with the center of the test hole 6300 of the supporting platform 63.

[0659] Reference Figures 51A to 51C As shown, a specific implementation of the limiting mechanism 65 according to the present invention is illustrated. In this example, the limiting mechanism 65 needs to be installed on the display screen 20. That is to say, the limiting mechanism 65 and the display screen 20 are originally independent of each other.

[0660] The assembly method of the camera module 30 includes the following steps: installing the limiting mechanism 65 on the display screen 20, installing the camera module 30 on the limiting mechanism 65, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the display screen 20 at the adjusted position by fixing the camera module 30 on the limiting mechanism 65.

[0661] It is worth noting that the limiting mechanism 65 can be installed on the display screen 20 by aligning the limiting mechanism 65 with the light-through hole 200 of the display screen 20 .

[0662] It is understandable that, in the process of installing the limiting mechanism 65 on the display screen 20, the limiting mechanism 65 can be fixed to the display screen 20 based on the alignment degree between the limiting channel 650 of the limiting mechanism 65 and the light hole 200 of the display screen 20. In this way, in the subsequent adjustment process, the relative position between the camera module 30 and the display screen 20 can be adjusted by only adjusting the relative position between the camera module 30 and the limiting mechanism 65.

[0663] The assembly method of the camera module 30 can also be implemented as the following steps: installing the camera module 30 on the limiting mechanism 65, installing the limiting mechanism 65 on the display screen 20, adjusting the position of the camera module 30 relative to the limiting mechanism 65 to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the adjusted position of the display screen 20 by fixing the camera module 30 on the limiting mechanism 65.

[0664] It is understandable that, in the process of installing the limiting mechanism 65 on the display screen 20 , the limiting mechanism 65 can be installed on the display screen 20 based on the imaging effect of the camera module 30 .

[0665] The assembly method of the camera module 30 can also be implemented as the following steps: adjusting the relative position of the camera module 30 and the display screen 20 to a more satisfactory position, wherein the limiting mechanism 65 is installed on the display screen 20, and then adjusting the relative position of the camera module 30 and the limiting mechanism 65 within the adjustment range of the limiting mechanism 65 available for the camera module 30, thereby adjusting the relative position of the camera module 30 and the display screen 20.

[0666] It is understandable that after the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 can be fixed to the display screen 20, so that the camera module 30 can be adjusted in a relatively small range through the limiting mechanism 65, so as to improve the adjustment accuracy of the camera module 30 and the limiting mechanism 65. Alternatively, after the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 is temporarily not fixed to the display screen 20, and the relative position of the camera module 30 and the display screen 20 is continuously changed until a more satisfactory imaging effect is obtained, and then the limiting mechanism 65 is fixed to the display screen 20.

[0667] Further, in this example, the back side of the display screen 20 is implemented as a planar structure, that is, the back plate of the display screen 20 is a planar structure, and the limiting mechanism 65 is installed on the back plate of the display screen 20. When the relative position between the limiting mechanism 65 and the display screen 20 needs to be adjusted, the limiting mechanism 65 is freely adjusted on the display screen 20 until the limiting channel 650 of the limiting mechanism 65 is aligned with the light hole 200 of the display screen 20, or the camera module 30 installed on the limiting mechanism 65 obtains the expected imaging effect.

[0668] Of course, it is understandable that the relative position of the camera module 30 and the display screen 20 can also be directly adjusted. When the relative position between the camera module 30 and the display screen 20 is determined, the camera module 30 can be directly fixed to the display screen 20 by gluing or welding, and the positions of the two are maintained at the adjusted positions.

[0669] Furthermore, after the relative position of the limiting mechanism 65 and the camera module 30 is confirmed based on the imaging effect of the camera module 30, the limiting mechanism 65 and the camera module 30 can be fixed by gluing or welding.

[0670] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0671] When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, the space of the limiting channel 650 of the limiting mechanism 65 not occupied by the camera module 30 can be filled with colloid to fix the relative position of the camera module 30 and the limiting mechanism 65.

[0672] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0673] When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, an insert can be inserted between the camera module 30 and the sleeve 651 of the limiting mechanism 65 to fix the relative position between the camera module 30 and the limiting mechanism 65. The insert limits the displacement of the camera module 30 relative to the limiting mechanism 65.

[0674] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0675] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, a welding pad can be set on the outer side of the lens barrel of the camera module 30 or on the inner wall of the sleeve 651 of the limiting mechanism 65, and then the camera module 30 and the limiting mechanism 65 are fixed by welding.

[0676] It can be understood that the colloid used to fix the camera module 30 and the limiting mechanism 65 can be a thermoplastic fluid. After the thermoplastic fluid fills the gap between the camera module 30 and the limiting mechanism 65, the thermoplastic fluid of the camera module 30 and the limiting mechanism 65 can be cured by heating.

[0677] Furthermore, the sleeve 651 of the limiting mechanism 65 is configured to be made of an opaque material to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. In particular, when the display screen 20 is an LCD display screen 20, the back plate layer 27 can actively emit light, and the opaque limiting mechanism 65 can reduce the influence of the luminous back plate layer 27 on the camera module 30.

[0678] Reference Fig.52 FIG. 6 is a diagram showing a specific implementation of the position limiting mechanism 65 according to the present invention. In this example, the position limiting mechanism 65 further includes a connecting portion 653 , and the connecting portion 653 is used to connect the sleeve 651 to the display screen 20 .

[0679] Specifically, the sleeve 651 has a free end 6511 and a connecting end 6512 , wherein the free end 6511 and the connecting end 6512 are located at two ends respectively, and the connecting portion 653 is located at the connecting end 6512 of the sleeve 651 .

[0680] The connection portion 653 may be configured to extend outward from the connection end 6512 of the sleeve 651. When the limiting mechanism 65 and the display screen 20 are installed, the connection portion 653 of the limiting mechanism 65 can be connected to the display screen 20. At the same time, the connection portion 653 increases the area of ​​the limiting mechanism 65 that can be connected to the display screen 20, so as to facilitate the stable connection between the limiting mechanism 65 and the display screen 20, thereby facilitating the stable installation of the camera module 30 on the display screen 20 through the limiting mechanism 65.

[0681] Reference Fig.53 , a specific embodiment of the position limiting mechanism 65 according to the present invention is illustrated. In this example, the relative position of the position limiting mechanism 65 and the display screen 20 is fixed in advance, and only the relative position of the camera module 30 and the position limiting mechanism 65 needs to be adjusted.

[0682] The limiting mechanism 65 is combined with the display screen 20 to enhance the combination strength between the limiting mechanism 65 and the display screen 20 .

[0683] In this example, the limiting mechanism 65 is embedded in the display screen 20 .

[0684] For example, when the display screen 20 is an OLED display screen 20, the display screen 20 includes the cover layer 21, the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the drive circuit layer 26 and the back layer 27, and reference may be made to the above-mentioned drawings. The back side of the display screen 20 is a planar structure, that is, the back layer 27 is a planar structure, and the display screen 20 has the light-through hole 200 that penetrates at least part of the display screen, for example, the light-through hole 200 penetrates all layers except the cover layer 21 in the height direction. Of course, the light-through hole 200 may also completely penetrate all layers of the display screen 20 in the height direction.

[0685] At least a portion of the limiting mechanism 65 is embedded in the driving circuit layer 26 and the back plate layer 27 .

[0686] The limiting mechanism 65 further includes at least one connecting leg 654, wherein the connecting leg 654 extends from the connecting end 6512 of the sleeve 651 along the length direction of the sleeve 651. Preferably, the number of the connecting legs 654 can be multiple.

[0687] The display screen 20 has at least one embedding channel 203 , wherein the embedding channel 203 is located around the light-through hole 200 of the display screen 20 , and the embedding channel 203 matches the connecting pin 654 of the limiting mechanism 65 .

[0688] The embedding channel 203 extends from the back plate layer 27 to the driving circuit layer 26. Preferably, the embedding channel 203 is arranged to avoid the circuit structure of the driving circuit layer 26 to reduce the impact on the working performance of the display screen 20.

[0689] When the limiting mechanism 65 is installed on the display screen 20, the connecting pin 654 of the limiting mechanism 65 extends into the fitting channel 203 of the display screen 20. Alternatively, the connecting pin 654 is fitted into the fitting channel 203. Alternatively, the fitting channel 203 is slightly larger than the connecting pin 654, and when the connecting pin 654 extends into the fitting channel 203, there is still a gap in the fitting channel 203, and at this time, a colloid can be filled inwardly, so that the connecting pin 654 of the limiting mechanism 65 can be fixed to the fitting channel 203 of the display screen 20, thereby facilitating the limiting mechanism 65 to be stably installed on the display screen 20.

[0690] Furthermore, the embedding channel 203 can be formed in the backplane layer 27 and the driving circuit layer 26 of the display screen 20 by drilling holes, for example, drilling holes from the backplane layer 27 of the display screen 20 toward the driving circuit layer 26 .

[0691] Those skilled in the art should understand that the formation method of the embedding channel 203 or the position of the embedding channel 203 is not limited to the above examples.

[0692] Furthermore, according to some other embodiments of the present invention, the engaging channel 203 may be formed on the sleeve 651 , and the connecting pin 654 may be formed on the display screen 20 .

[0693] When the limiting mechanism 65 is installed on the display screen 20 , the connecting pin 654 located on the display screen 20 extends into the fitting channel 203 of the sleeve 651 , thereby facilitating the fixation between the limiting mechanism 65 and the display screen 20 .

[0694] The connecting pin 654 can be formed on the display screen 20 by deposition, evaporation, etc. The connecting pin 654 can be integrally formed on the display screen 20.

[0695] Furthermore, according to some other embodiments of the present invention, the fitting channel 203 may be formed in the sleeve 651 and the display screen 20, respectively, and the connecting pin 654 may be fitted in the sleeve 651 and the display screen 20, respectively. For example, one end of the connecting pin 654 extends into the fitting channel 203 of the display screen 20, and then the other end of the connecting pin 654 extends into the fitting channel 203 of the sleeve 651, respectively fixing the connecting pin 654 and the display screen 20 and the connecting pin 654 and the sleeve 651, thereby fixing the sleeve 651 to the display screen 20.

[0696] Reference Fig.54 FIG. 2 shows another specific embodiment of the limiting mechanism 65 according to the present invention.

[0697] In this example, the display screen 20 has a mounting channel 201, wherein the mounting channel 201 is penetrated by the light-through hole 200. The light-through hole 200 penetrates all layers of the display screen 20 except the cover layer 21 in the height direction, and the mounting channel 201 is exposed on the back side of the display screen 20.

[0698] The inner diameter of the installation channel 201 is greater than the inner diameter of the light-through hole 200. At least a portion of the limiting mechanism 65 can be accommodated in the installation channel 201.

[0699] For example, the installation channel 201 is formed on the back panel layer 27 of the display screen 20 for description.

[0700] The mounting channel 201 passes through the back plate layer 27 and the inner diameter of the mounting channel 201 is larger than the inner diameter of the light-through hole 200. The mounting channel 201 passes through the light-through hole 200 of the back plate layer 27 in the height direction. Light from the outside of the display screen 20 passes through the light-through hole 200 and the mounting channel 201, and then is received by the camera module 30.

[0701] The installation channel 201 has a certain size, and the limiting mechanism 65 has a certain size. The size of the installation channel 201 is larger than the size of the limiting mechanism 65 so that at least a part of the limiting mechanism 65 can be accommodated in the installation channel 201.

[0702] In this example, the limiting mechanism 65 needs to be installed on the display screen 20. That is to say, the limiting mechanism 65 and the display screen 20 are originally independent of each other.

[0703] The assembly method of the camera module 30 includes the following steps: installing the limiting mechanism 65 on the installation channel 201 of the display screen 20, installing the camera module 30 on the limiting mechanism 65, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the adjusted position of the camera module 30 and the display screen 20 by fixing the camera module 30 on the limiting mechanism 65.

[0704] By controlling the size of the installation channel 201 of the display screen 20 , a certain limiting effect can be exerted on the limiting mechanism 65 , so as to help provide positioning accuracy of the limiting mechanism 65 and the display screen 20 .

[0705] It is understandable that, in the process of installing the limiting mechanism 65 in the installation channel 201 of the display screen 20, the limiting mechanism 65 can be fixed to the display screen 20 based on the alignment degree between the limiting channel 650 of the limiting mechanism 65 and the light hole 200 of the display screen 20. In this way, in the subsequent adjustment process, the relative position between the camera module 30 and the display screen 20 can be adjusted by only adjusting the relative position between the camera module 30 and the limiting mechanism 65.

[0706] The assembly method of the camera module 30 can also be implemented as the following steps: installing the camera module 30 on the limiting mechanism 65, installing the limiting mechanism 65 on the installation channel 201 of the display screen 20, adjusting the position of the camera module 30 relative to the limiting mechanism 65 to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the adjusted position of the display screen 20 by fixing the camera module 30 on the limiting mechanism 65.

[0707] By controlling the size of the installation channel 201 of the display screen 20 , a certain limiting effect can be exerted on the limiting mechanism 65 , so as to help provide positioning accuracy of the limiting mechanism 65 and the display screen 20 .

[0708] It is understandable that, in the process of installing the limiting mechanism 65 on the display screen 20 , the limiting mechanism 65 can be installed on the display screen 20 based on the imaging effect of the camera module 30 .

[0709] The assembly method of the camera module 30 can also be implemented as the following steps: adjusting the relative position of the camera module 30 and the display screen 20 to a more satisfactory position, installing the camera module 30 on the limiting mechanism 65 so that the camera module 30 can be fixed at this position, wherein the limiting mechanism 65 is installed in the installation channel 201 of the display screen 20, and then adjusting the relative position of the camera module 30 and the limiting mechanism 65 within the adjustment range of the limiting mechanism 65 available for the camera module 30, thereby adjusting the relative position of the camera module 30 and the display screen 20 mechanism.

[0710] It is understandable that after the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 can be fixed to the display screen 20, so that the camera module 30 can be adjusted in a relatively small range through the limiting mechanism 65, so as to improve the adjustment accuracy of the camera module 30 and the limiting mechanism 65. Alternatively, after the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 is temporarily not fixed to the display screen 20, and the relative position of the camera module 30 and the display screen 20 is continuously changed until a more satisfactory imaging effect is obtained, and then the limiting mechanism 65 is fixed to the display screen 20.

[0711] Further, in this example, the back side of the display screen 20 is implemented as a planar structure, that is, the driving circuit layer 26 of the display screen 20 is a planar structure, and the limiting mechanism 65 is installed on the driving circuit layer 26 of the display screen 20. When the relative position between the limiting mechanism 65 and the display screen 20 needs to be adjusted, the adjustment of the position of the limiting mechanism 65 on the display screen 20 is limited by the installation channel 201 of the display screen 20.

[0712] Of course, it is understandable that the relative position of the camera module 30 and the display screen 20 can also be directly adjusted. When the relative position between the camera module 30 and the display screen 20 is determined, the camera module 30 can be directly fixed to the display screen 20 by gluing or welding, and the positions of the two are maintained at the adjusted positions.

[0713] Furthermore, after the relative position of the limiting mechanism 65 and the camera module 30 is confirmed based on the imaging effect of the camera module 30, the limiting mechanism 65 and the camera module 30 can be fixed by gluing or welding.

[0714] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0715] When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, the space of the limiting channel 650 of the limiting mechanism 65 not occupied by the camera module 30 can be filled with colloid to fix the relative position of the camera module 30 and the limiting mechanism 65.

[0716] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0717] When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, an insert can be inserted between the camera module 30 and the sleeve 651 of the limiting mechanism 65 to fix the relative position between the camera module 30 and the limiting mechanism 65. The insert limits the displacement of the camera module 30 relative to the limiting mechanism 65.

[0718] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0719] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, a welding pad can be set on the outer side of the lens barrel of the camera module 30 or on the inner wall of the sleeve 651 of the limiting mechanism 65, and then the camera module 30 and the limiting mechanism 65 are fixed by welding.

[0720] It can be understood that the colloid used to fix the camera module 30 and the limiting mechanism 65 can be a thermoplastic fluid. After the thermoplastic fluid fills the gap between the camera module 30 and the limiting mechanism 65, the thermoplastic fluid of the camera module 30 and the limiting mechanism 65 can be cured by heating.

[0721] Furthermore, the sleeve 651 of the limiting mechanism 65 is configured to be made of an opaque material to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. In particular, when the display screen 20 is an LCD display screen 20, the back plate layer 27 can actively emit light, and the opaque limiting mechanism 65 can reduce the influence of the luminous back plate layer 27 on the camera module 30.

[0722] The limiting mechanism 65 can be fixed to the driving circuit layer 26 by gluing or welding.

[0723] Reference Fig.55 FIG. 6 is a diagram showing a specific implementation of the position limiting mechanism 65 according to the present invention. In this example, the position limiting mechanism 65 further includes a connecting portion 653 , and the connecting portion 653 is used to connect the sleeve 651 to the display screen 20 .

[0724] Specifically, the sleeve 651 has a free end 6511 and a connecting end 6512 , wherein the free end 6511 and the connecting end 6512 are located at two ends respectively, and the connecting portion 653 is located at the connecting end 6512 of the sleeve 651 .

[0725] The connection portion 653 may be configured to extend outward from the connection end 6512 of the sleeve 651. When the limiting mechanism 65 and the display screen 20 are installed, the connection portion 653 of the limiting mechanism 65 can be connected to the display screen 20. At the same time, the connection portion 653 increases the area of ​​the limiting mechanism 65 that can be connected to the display screen 20, so as to facilitate the stable connection between the limiting mechanism 65 and the display screen 20, thereby facilitating the stable installation of the camera module 30 on the display screen 20 through the limiting mechanism 65.

[0726] More specifically, taking the installation channel 201 formed on the back plate layer 27 as an example, at least the driving circuit layer 26 is exposed. The connection portion 653 of the limiting mechanism 65 extends horizontally along the surface of the driving circuit layer 26, and the limiting mechanism 65 and the display screen 20 can be fixed by fixing the connection portion 653 and the driving circuit layer 26 of the display screen 20.

[0727] The mounting channel 201 may be designed to be slightly larger to accommodate the connecting portion 653 .

[0728] It is worth mentioning that, in this way, the height dimensions of the display screen 20 and the camera module 30 can be reduced, so as to help reduce the thickness dimensions of the terminal device.

[0729] Reference Fig.56 , a specific embodiment of the position limiting mechanism 65 according to the present invention is illustrated. In this example, the relative position of the position limiting mechanism 65 and the display screen 20 is fixed in advance, and only the relative position of the camera module 30 and the position limiting mechanism 65 needs to be adjusted.

[0730] The limiting mechanism 65 is combined with the display screen 20 to enhance the combination strength between the limiting mechanism 65 and the display screen 20 .

[0731] In this example, the display screen 20 has a mounting channel 201, wherein the mounting channel 201 is penetrated by the light-through hole 200. The light-through hole 200 penetrates each layer of the display screen 20 in the height direction, and the mounting channel 201 is exposed at the back side of the display screen 20.

[0732] The inner diameter of the installation channel 201 is greater than the inner diameter of the light-through hole 200. At least a portion of the limiting mechanism 65 can be accommodated in the installation channel 201.

[0733] In this example, the limiting mechanism 65 is embedded in the display screen 20 .

[0734] For example, when the display screen 20 is an OLED display screen 20, the display screen 20 includes the cover layer 21, the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27. For example, the mounting channel 201 is formed on the backplane layer 27 and at least a portion of the driving circuit layer 26 is exposed to the mounting channel 201.

[0735] At least a portion of the limiting mechanism 65 passes through the installation channel 201 and is embedded in the driving circuit layer 26 .

[0736] The limiting mechanism 65 further includes at least one connecting leg 654, wherein the connecting leg 654 extends from the connecting end 6512 of the sleeve 651 along the length direction of the sleeve 651. Preferably, the number of the connecting legs 654 can be multiple.

[0737] The display screen 20 has at least one embedding channel 203 , wherein the embedding channel 203 is located around the light-through hole 200 of the display screen 20 , and the embedding channel 203 matches the connecting pin 654 of the limiting mechanism 65 .

[0738] The embedding channel 203 extends to the driving circuit layer 26. Preferably, the embedding channel 203 is arranged to avoid the circuit structure of the driving circuit layer 26 to reduce the influence on the working performance of the display screen 20.

[0739] Of course, those skilled in the art will appreciate that the embedding channel 203 may continue to extend upward from the driving circuit layer 26 to other layers of the display screen 20 .

[0740] When the limiting mechanism 65 is installed on the display screen 20, the connecting pin 654 of the limiting mechanism 65 extends into the fitting channel 203 of the display screen 20. Alternatively, the connecting pin 654 is fitted into the fitting channel 203. Alternatively, the fitting channel 203 is slightly larger than the connecting pin 654, and when the connecting pin 654 extends into the fitting channel 203, there is still a gap in the fitting channel 203, and at this time, a colloid can be filled inwardly, so that the connecting pin 654 of the limiting mechanism 65 can be fixed to the fitting channel 203 of the display screen 20, thereby facilitating the limiting mechanism 65 to be stably installed on the display screen 20.

[0741] Further, when the installation channel 201 of the display screen 20 is slightly larger than the sleeve 651 of the limiting mechanism 65, the limiting mechanism 65 can be fixed to the portion of the display screen 20 corresponding to the installation channel 201, such as the back plate layer 27, by filling the installation channel 201 with colloid or installing inserts or welding. In this way, the combination of the limiting mechanism 65 and the display screen 20 can be more firmly established, which is conducive to the stable combination between the limiting mechanism 65 and the camera module 30.

[0742] Furthermore, the embedding channel 203 can be formed in the driving circuit layer 26 of the display screen 20 by drilling a hole, for example, drilling a hole in the driving circuit layer 26 of the display screen 20 in the installation channel 201. The embedding channel 203 can also be formed by etching.

[0743] Those skilled in the art should understand that the formation method of the embedding channel 203 or the position of the embedding channel 203 is not limited to the above examples.

[0744] Furthermore, according to some other embodiments of the present invention, the engaging channel 203 may be formed on the sleeve 651 , and the connecting pin 654 may be formed on the display screen 20 .

[0745] When the limiting mechanism 65 is installed on the display screen 20 , the connecting pin 654 located on the display screen 20 extends into the fitting channel 203 of the sleeve 651 , thereby facilitating the fixation between the limiting mechanism 65 and the display screen 20 .

[0746] The connecting pin 654 can be formed on the display screen 20 by deposition, evaporation, etc. The connecting pin 654 can be integrally formed on the display screen 20. The connecting pin 654 can be formed on a portion of the driving circuit layer 26 of the display screen 20 that is exposed to the mounting channel 201.

[0747] Furthermore, according to some other embodiments of the present invention, the fitting channel 203 may be formed in the sleeve 651 and the display screen 20, respectively, and the connecting pin 654 may be fitted in the sleeve 651 and the display screen 20, respectively. For example, one end of the connecting pin 654 extends into the fitting channel 203 of the display screen 20, and then the other end of the connecting pin 654 extends into the fitting channel 203 of the sleeve 651, respectively fixing the connecting pin 654 and the display screen 20 and the connecting pin 654 and the sleeve 651, thereby fixing the sleeve 651 to the display screen 20.

[0748] Reference Fig.57 As shown in FIG. 1 , another specific implementation of the limiting mechanism 65 according to the present invention is explained.

[0749] The mobile terminal includes a substrate 70 , wherein the substrate 70 is used to install the camera module 30 , and the camera module 30 is located between the substrate 70 and the display screen 20 .

[0750] The positions between the substrate 70 and the display screen 20 can be relatively fixed, for example, by the housing 40 of the mobile terminal. The substrate 70 can be installed on the mobile terminal after the camera module 30 is installed on the mobile terminal, and then the housing 40 is installed on the mobile terminal, and when the camera module 30 is installed, the mobile terminal can provide sufficient operating space.

[0751] The limiting mechanism 65 is located on the substrate 70 , thereby limiting the relative displacement between the camera module 30 and the substrate 70 , and further limiting the relative displacement between the camera module 30 and the display screen 20 .

[0752] In this example, the limiting mechanism 65 needs to be installed on the display screen 20. That is to say, the limiting mechanism 65 and the substrate 70 are originally independent of each other.

[0753] The assembly method of the camera module 30 includes the following steps: installing the limiting mechanism 65 on the substrate 70, installing the camera module 30 on the limiting mechanism 65, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to adjust the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 to the adjusted position of the display screen 20 by fixing the camera module 30 on the limiting mechanism 65. It can be understood that in the process of installing the limiting mechanism 65 on the substrate 70, the limiting mechanism 65 can be fixed to the substrate 70 based on the alignment degree of the limiting channel 650 of the limiting mechanism 65 and the light hole 200 of the display screen 20. That is, the installation position of the limiting mechanism 65 on the substrate 70 is determined based on the alignment state of the limiting channel 650 of the limiting mechanism 65 and the light hole 200 of the display screen 20. In this way, in the subsequent adjustment process, the relative position between the camera module 30 and the display screen 20 only needs to be adjusted by adjusting the relative position between the camera module 30 and the limiting mechanism 65.

[0754] The assembly method of the camera module 30 can also be implemented as the following steps: installing the camera module 30 on the limiting mechanism 65, installing the limiting mechanism 65 on the substrate 70, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the display screen 20 at the adjusted position by fixing the camera module 30 to the limiting mechanism 65.

[0755] It is understandable that, in the process of installing the limiting mechanism 65 on the substrate 70 , the limiting mechanism 65 can be installed on the substrate 70 based on the imaging effect of the camera module 30 .

[0756] The assembly method of the camera module 30 can also be implemented as the following steps: adjusting the relative position of the camera module 30 and the display screen 20 to a more satisfactory position, installing the camera module 30 on the limiting mechanism 65 so that the camera module 30 can be fixed at this position, wherein the limiting mechanism 65 is installed on the substrate 70, and then adjusting the relative position of the camera module 30 and the limiting mechanism 65 within the adjustment range of the limiting mechanism 65 available for the camera module 30, thereby adjusting the relative position of the camera module 30 and the display screen 20.

[0757] It is understandable that after the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 can be fixed to the substrate 70, so that the camera module 30 can be adjusted in a relatively small range through the limiting mechanism 65, so as to improve the adjustment accuracy of the camera module 30 and the limiting mechanism 65. Alternatively, after the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 is temporarily not fixed to the substrate 70, and the relative position of the camera module 30 and the display screen 20 is continuously changed until a more satisfactory imaging effect is obtained, and then the limiting mechanism 65 is fixed to the substrate 70.

[0758] Further, in this example, one side of the substrate 70 is implemented as a planar structure, and the limiting mechanism 65 is installed on the side of the substrate 70. When the relative position between the limiting mechanism 65 and the display screen 20 needs to be adjusted, the limiting mechanism 65 is freely adjusted on the substrate 70 until the limiting channel 650 of the limiting mechanism 65 is aligned with the light hole 200 of the display screen 20, or the camera module 30 installed on the limiting mechanism 65 obtains the expected imaging effect.

[0759] Of course, it is understandable that the relative position of the camera module 30 and the display screen 20 can also be directly adjusted. When the relative position between the camera module 30 and the display screen 20 is determined, the camera module 30 can be directly fixed to the display screen 20 by gluing or welding, and the positions of the two are maintained at the adjusted positions.

[0760] Furthermore, after the relative position of the limiting mechanism 65 and the camera module 30 is confirmed based on the imaging effect of the camera module 30, the limiting mechanism 65 and the camera module 30 can be fixed by gluing or welding.

[0761] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0762] When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, the space of the limiting channel 650 of the limiting mechanism 65 not occupied by the camera module 30 can be filled with colloid to fix the relative position of the camera module 30 and the limiting mechanism 65.

[0763] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0764] When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, an insert can be inserted between the camera module 30 and the sleeve 651 of the limiting mechanism 65 to fix the relative position between the camera module 30 and the limiting mechanism 65. The insert limits the displacement of the camera module 30 relative to the limiting mechanism 65.

[0765] For example, when the camera module 30 is installed on the limiting mechanism 65, when the relative position of the camera module 30 and the limiting mechanism 65 is adjusted, there is a gap in the limiting channel 650 of the limiting mechanism 65 to allow fine adjustment between the camera module 30 and the limiting mechanism 65.

[0766] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, a welding pad can be set on the outer side of the lens barrel of the camera module 30 or on the inner wall of the sleeve 651 of the limiting mechanism 65, and then the camera module 30 and the limiting mechanism 65 are fixed by welding.

[0767] It can be understood that the colloid used to fix the camera module 30 and the limiting mechanism 65 can be a thermoplastic fluid. After the thermoplastic fluid fills the gap between the camera module 30 and the limiting mechanism 65, the thermoplastic fluid of the camera module 30 and the limiting mechanism 65 can be cured by heating.

[0768] Furthermore, the sleeve 651 of the limiting mechanism 65 is configured to be made of an opaque material to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. In particular, when the display screen 20 is an LCD display screen 20, the back plate layer can actively emit light, and the opaque limiting mechanism 65 can reduce the influence of the luminous back plate layer on the camera module 30.

[0769] It is worth noting that the camera module 30 has a high end and a low end. When the limiting mechanism 65 is located on the display screen 20, the high end of the camera module 30 is installed on the limiting mechanism 65. The high end of the camera module 30 is the light incident position of the camera module 30, and the low end of the camera module 30 is the light sensing position of the camera module 30. When the limiting mechanism 65 is located on the substrate 70, the bottom end of the camera module 30 is installed on the limiting mechanism 65.

[0770] In this embodiment, the lower end of the camera module 30 is installed on the limiting mechanism 65. When the relative position of the camera module 30 and the limiting mechanism 65 is determined, that is, the relative position of the camera module 30 and the display screen 20 is determined, the high end of the camera module 30 can be installed on the display screen 20.

[0771] Reference Fig.58 FIG. 6 is a diagram showing a specific implementation of the position limiting mechanism 65 according to the present invention. In this example, the position limiting mechanism 65 further includes a connecti...

Claims

1. A display unit, used in conjunction with a camera module, characterized in that: The device comprises a display screen, a fill light unit and a light hole, wherein the light hole penetrates at least a part of the display screen in the height direction, the fill light unit can radiate light to the outside of the display screen and when the camera module is in working state, the fill light unit forms a light hole, and the light from the outside of the display screen passes through the light hole and the light hole and is received by the camera module; The fill light unit comprises an aperture structure and a light emitting structure, the aperture structure comprises an aperture moving part and an aperture driving part, the aperture moving part is drivably connected to the aperture driving part in a manner of forming a light hole with a variable size, and the light emitting structure is located in the aperture moving part; When the camera module is working, the aperture moving part can be moved under the drive of the aperture driving part to form the light hole or expand the light hole; when the camera module is not working, the aperture moving part is driven by the aperture driving part to make at least part of the light-emitting structure correspond to the light-through hole. 2 . The display unit according to claim 1 , wherein the fill light unit is arranged on the display screen. The display unit according to claim 2 , wherein the fill light unit is disposed inside the display screen.

4. The display unit according to claim 3, wherein the display screen comprises a cover layer, a touch layer, a polarization layer, a packaging layer, a pixel layer and a driving circuit layer, wherein the cover layer is located on the top side, the driving circuit layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to operate, wherein the packaging layer is formed on the top side of the pixel layer, and wherein the fill light unit is located on the driving circuit layer.

5. The display unit according to claim 3, wherein the display screen comprises a cover layer, a touch layer, a polarization layer, a packaging layer, a pixel layer, a driving circuit layer and a backplane layer, wherein the cover layer is located on the top side, the backplane layer is located on the bottom side, the driving circuit layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to operate, wherein the packaging layer is formed on the top side of the pixel layer, and wherein the fill light unit is located on the backplane layer. 6 . The display unit according to claim 1 , wherein the fill light unit is held between the display screen and the camera module. 7 . The display unit according to claim 1 , wherein the fill light unit is detachably mounted on the display screen. The display unit according to claim 1 , wherein the light emitting structure is located on an upper surface of the aperture moving portion. 9 . The display unit according to claim 8 , wherein when the light emitting structure is located on an upper surface of the aperture moving portion, a lower surface of the aperture moving portion is configured to be light shielding. 10 . The display unit according to claim 8 , wherein the fill light unit further comprises a reflective structure, wherein the reflective structure is located below the light emitting structure to reflect the light of the light emitting structure toward the outside of the display screen.

11. The display unit according to claim 10, wherein the reflective structure is arranged on the aperture structure in a stretchable and deformable manner, and when the reflective structure is deformed as the aperture moving part moves, the reflectivity of the reflective structure changes.

12. A display unit according to claim 1, wherein the light-emitting structure includes a light-emitting element, the aperture moving part has a hole and the size of the hole changes to form the light hole of variable size during the process of the aperture moving part being driven by the aperture driving part to move, and the light-emitting element is arranged in the aperture moving part.

13. The display unit according to claim 12, wherein the light emitting structure includes a plurality of pixels, wherein the aperture moving portion includes a plurality of blades, the blades are drivably connected to the aperture driving portion, and at least one of the pixels is disposed on at least one of the blades. The display unit according to claim 13 , wherein a plurality of the pixels are provided on one blade. 15 . The display unit according to claim 1 , wherein the light emitting structure is located inside the aperture moving portion. 16 . The display unit according to claim 1 , wherein the aperture moving part itself is configured as a light emitting structure capable of emitting light.

17. A terminal device, characterized in that: include: A terminal device body; A display unit according to any one of claims 1 to 16; as well as A camera module, wherein the camera module is located below the display unit, the camera module has a front end, the front end of the camera module is installed on the display screen of the display unit and the camera module is aligned with the light hole of the display screen so that the light outside the display screen can be received by the camera module through the light hole.

18. A method for operating a display unit, characterized in that: Using the display unit according to any one of claims 1 to 16 comprises the following steps: When the display screen with the light-through hole is working, the fill light unit is operated to emit light to supplement the light intensity at the position of the light-through hole.

19. The working method according to claim 18 further comprises the following steps: When a camera module located below the display screen and aligned with the light hole is working, the aperture structure of the fill light unit located above the camera module is operated to form a light hole, and light reaches the camera module after passing through the light hole and the constraints of the fill light unit.

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