Floor board and method for manufacturing the same

Abstract

This application relates to a floor board and a manufacturing method thereof. The floor board includes: a honeycomb base board, and a panel adhesively fixed to the upper surface of the honeycomb base board. The honeycomb base board includes: a honeycomb core layer, an upper plate body adhesively fixed to the upper surface of the honeycomb core layer by a thermosetting adhesive, and a lower plate body adhesively fixed to the lower surface of the honeycomb core layer by a thermosetting adhesive. The panel is adhesively fixed to the upper surface of the upper plate body by a thermosetting or hot-melt adhesive. In this application, the floor board truly combines the wear resistance and aesthetics of the upper panel and the compressive and impact resistance of the lower honeycomb base board, and improves the manufacturing efficiency of the floor board, enabling the floor board to be mass-produced industrially on a large scale.

Description

Technical Field

[0001] This application relates to the field of floors, and particularly to a floorboard and a manufacturing method thereof. Background Art

[0002] A Chinese utility model patent with the patent number CN200420108932.X discloses a floorboard composed of a honeycomb base plate and a stone panel. This composite-structured floorboard combines the wear resistance and aesthetics of stone and the compressive and impact resistance of the honeycomb board. However, the patent document only records that the stone panel on the upper layer of the composite floorboard is adhesively fixed on the upper surface of the lower honeycomb board by means of a special adhesive, without specifying what kind of adhesive the special adhesive is, let alone specifically describing the bonding process between the stone panel and the honeycomb base plate.

[0003] If the stone panel and the honeycomb base plate in the above patent document are bonded using conventional adhesives and conventional methods, the following problems will occur:

[0004] 1. The adhesive layer formed after the conventional adhesive applied between the stone panel and the honeycomb base plate cures usually has more or less grooves and holes, and the adhesive layer is neither continuous nor dense. There is a hollow structure between many parts of the upper stone panel and the lower honeycomb base plate. When this part of the upper stone panel is subjected to a downward impact force, it is easily damaged and cannot achieve the "impact resistance" performance claimed in the patent specification.

[0005] 2. The conventional adhesive needs to be exposed to the environment over a large area to cure quickly. If the bonding strength between the stone panel and the honeycomb base plate is to be ensured, the adhesive must be applied between the stone panel and the honeycomb base plate before curing. However, the stone panel and the honeycomb base plate have poor air permeability, which results in a very long curing time for the adhesive, and thus the production efficiency of this composite floorboard is very low and it is not suitable for large-scale industrial production.

[0006] In view of the above-mentioned disadvantages of the composite floorboard in the patent document mentioned in the background art, the applicant initially thought of using a thermosetting or hot-melt adhesive with a fast curing speed and strong controllability to bond its stone panel and honeycomb base plate (this idea was not publicly disclosed before the filing of this application). However, the bonding process using a thermosetting or hot-melt adhesive requires high temperature, and the various structural layers in the existing honeycomb board are bonded together by a hot-melt adhesive (hot-melt adhesive film) that cannot withstand high temperature. If a thermosetting or hot-melt adhesive is used to bond its stone panel and honeycomb base plate, the honeycomb base plate will disintegrate at high temperature. Summary of the Invention

[0007] The technical problem to be solved by this application is: to provide a floor board and its manufacturing method, so that the floor board truly combines the wear resistance and aesthetics of the upper panel and the compressive and impact resistance of the lower honeycomb substrate, and improves the manufacturing efficiency of the floor board, enabling the floor board to be mass-produced industrially.

[0008] The technical solution of this application is:

[0009] A floor board, comprising:

[0010] A honeycomb substrate, and

[0011] A panel adhesively fixed to the upper surface of the honeycomb substrate;

[0012] The honeycomb substrate includes:

[0013] A honeycomb core layer,

[0014] An upper plate body adhesively fixed to the upper surface of the honeycomb core layer through a thermosetting adhesive, and

[0015] A lower plate body adhesively fixed to the lower surface of the honeycomb core layer through a thermosetting adhesive;

[0016] The panel is adhesively fixed to the upper surface of the upper plate body through a thermosetting or hot-melt adhesive.

[0017] Based on the above technical solution, this application further includes the following preferred solutions:

[0018] For the floor board, the adhesive used to bond the panel and the honeycomb substrate forms a continuous and dense adhesive layer between the panel and the honeycomb substrate.

[0019] The honeycomb core layer is a metal honeycomb, and the upper plate body and the lower plate body are metal plates.

[0020] The honeycomb core layer is an aluminum honeycomb or a steel honeycomb, and the upper plate body and the lower plate body are aluminum plates or steel plates.

[0021] The honeycomb core layer is a high-temperature resistant plastic.

[0022] The panel is a marble plate, a ceramic tile plate, a wood board or a plastic board.

[0023] A snap-in mounting gap is formed between the upper plate body and the lower plate body around the honeycomb core layer, and a floor buckle welded or adhesively fixed to the upper plate body or / and the lower plate body is installed in the snap-in mounting gap.

[0024] The floor buckle is provided with a panel positioning protrusion that is higher than the upper surface of the upper plate body and abuts against the side of the panel in the horizontal direction.

[0025] The first manufacturing method of the floor board includes:

[0026] Coat a liquid thermosetting adhesive on the upper surface of the lower plate body and the lower surface of the upper plate body, arrange a honeycomb core layer between the lower plate body and the upper plate body, apply a clamping force to the lower plate body and the upper plate body to approach each other so as to squeeze the honeycomb core layer, and apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body, the upper plate body and the honeycomb core layer;

[0027] Coat a thermosetting adhesive on the lower surface of the panel or / and the upper surface of the upper plate body, arrange the panel against the upper surface of the upper plate body, and apply a downward pressure to the panel;

[0028] Arrange a heating plate against the lower surface of the lower plate body, and the heat generated by the heating plate is sequentially transmitted through the lower plate body, the honeycomb core layer and the upper plate body to the thermosetting adhesive between the panel and the upper plate body, and the thermosetting adhesive between the panel and the upper plate body cures at high temperature, fixedly connecting the panel and the upper plate body.

[0029] The second manufacturing method of the floor board includes:

[0030] Coat a liquid thermosetting adhesive on the upper surface of the lower plate body and the lower surface of the upper plate body, arrange a honeycomb core layer between the lower plate body and the upper plate body, apply a clamping force to the lower plate body and the upper plate body to approach each other so as to squeeze the honeycomb core layer, and apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body, the upper plate body and the honeycomb core layer;

[0031] Clamp a hot melt adhesive film between the panel and the upper plate body, arrange a heating plate against the lower surface of the lower plate body, and the heat generated by the heating plate is sequentially transmitted through the lower plate body, the honeycomb core layer and the upper plate body to the hot melt adhesive film, the hot melt adhesive film melts at high temperature, remove the heat of the heating plate, and the melted hot melt adhesive film cures at low temperature, thereby fixedly connecting the panel and the upper plate body.

[0032] The present application can achieve the following beneficial effects:

[0033] 1. The present application combines the panel for people to step on and walk with the honeycomb board with high structural strength and bending and compression resistance to manufacture the floor board, which not only retains the wear resistance and beauty of the common wooden, marble or ceramic tile panel, but also makes up for the defect of the low structural strength of the common wooden, marble or ceramic tile panel.

[0034] 2. This application uses a thermosetting adhesive instead of a traditional hot-melt adhesive to bond and fix the various structural layers of the honeycomb substrate, and provides a practical bonding method. Furthermore, the upper panel can be bonded to the upper surface of the honeycomb substrate by means of another thermosetting or hot-melt adhesive with a fast curing speed and strong controllability, which improves the manufacturing efficiency of the floorboard.

[0035] 3. When the honeycomb substrate is made of a metal material with rapid heat conduction, the heating plate that provides heat is arranged in contact with the side of the honeycomb substrate facing away from the panel. With the help of the metal honeycomb substrate, the heat is quickly guided to the thermosetting or hot-melt adhesive between the panel and the honeycomb substrate, completing the bonding and fixing of the panel and the honeycomb substrate. During the manufacturing process, the panel does not withstand high temperatures, which allows the upper panel to be made of various temperature-resistant or non-temperature-resistant materials, which is very ingenious. Moreover, the metal honeycomb board has excellent compressive and bending resistance, which exactly suits the usage environment of the floorboard laid flat on the ground and just meets the usage requirements of the floorboard. Based on this, the upper panel can be made as thin as a few millimeters, greatly saving the use of wood and stone, especially precious wood and stone. Further, when this floorboard is used as a floor heating floor, the metal honeycomb substrate can quickly guide the heat from the lower heat source to the panel, and then the panel emits it into the room, quickly raising the room temperature. As a result, the floor heating system equipped with this floorboard can be heated immediately, and the temperature of the lower heat source does not need to be too high, and only needs to be maintained at a low temperature of about 30°C during normal use, with extremely low energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below only relate to some embodiments of the present application and do not limit the present application.

[0037] Figure 1 It is a schematic cross-sectional structure diagram of the floorboard along the width direction in Embodiment 1 of the present application.

[0038] Figure 2 It is a schematic cross-sectional structure diagram of the floorboard along the length direction in Embodiment 1 of the present application.

[0039] Figure 3 It is a schematic connection structure diagram of two adjacent floorboards in Embodiment 1 of the present application.

[0040] Figure 4 It is a schematic structure diagram of the honeycomb substrate in Embodiment 1 of the present application.

[0041] Figure 5 It is a demonstration diagram of the manufacturing method of the floorboard in Embodiment 1 of the present application.

[0042] Figure 6 It is a demonstration diagram of the manufacturing method of the floorboard in Embodiment 2 of the present application.

[0043] Figure 7 It is a schematic structural diagram after the floor board in the second embodiment of the present application is manufactured.

[0044] Figure 8 It is a three-dimensional structural schematic diagram of the honeycomb substrate in the third embodiment of the present application.

[0045] Figure 9 It is a schematic structural diagram when the upper plate body of the honeycomb substrate in the third embodiment of the present application is in a separated state.

[0046] Figure 10 is Figure 9 an enlarged view of part X1.

[0047] Figure 11 It is a schematic structural diagram when the lower plate body of the honeycomb substrate in the third embodiment of the present application is in a separated state.

[0048] Figure 12 Figure 11 an enlarged view of part X2.

[0049] Figure 13 It is a schematic structural diagram when the upper plate body of the honeycomb substrate in the fourth embodiment of the present application is in a separated state.

[0050] Figure 14 It is a schematic structural diagram when the lower plate body of the honeycomb substrate in the fourth embodiment of the present application is in a separated state.

[0051] Wherein: 1 - honeycomb substrate, 2 - panel, 3 - floor buckle, 4 - adhesive layer, 5 - heating plate, 6 - hot melt adhesive film;

[0052] 101 - upper plate body, 102 - lower plate body, 103 - honeycomb core layer, 1a - floor buckle installation gap, 1031 - metal sheet, 1032 - stamping protrusion, 1031a - upper surface of the metal sheet, 1032a - lower surface of the stamping protrusion, 10321 - cylindrical groove, 10322 - circular cylindrical groove, 10323 - inner hole of the cylindrical stamping protrusion, 10321a - top groove wall of the cylindrical groove, 10322a - bottom groove wall of the circular cylindrical groove, 301 - panel positioning protrusion. Detailed implementation manners

[0053] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0054] Unless otherwise defined, technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art to which this application pertains. The words such as "a" or "an" used in the description of the patent application specification and claims of this application do not indicate a limitation in quantity, but rather indicate the existence of at least one.

[0055] In the description of the specification and claims of this application, the orientation or positional relationship indicated by terms such as "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to this application.

[0056] Now, embodiments of this application will be described with reference to the drawings. Embodiment 1:

[0057] Figures 1 to 5 A preferred embodiment of the floorboard of this application is shown. Similar to the floorboard structure mentioned in the background art, this floorboard also includes a honeycomb substrate 1 and a panel 2 that abuts against and is fixed to the upper surface of the honeycomb substrate.

[0058] Different from the traditional honeycomb board:

[0059] In this embodiment, the honeycomb substrate 1 includes: a honeycomb core layer 103, an upper plate body 101 adhesively fixed to the upper surface of the honeycomb core layer by a thermosetting adhesive (instead of a hot-melt adhesive), and a lower plate body 102 adhesively fixed to the lower surface of the honeycomb core layer by a thermosetting adhesive (instead of a hot-melt adhesive). The panel 2 is adhesively fixed to the upper surface of the upper plate body 101 by a thermosetting adhesive.

[0060] When manufacturing this floorboard:

[0061] First, apply a liquid thermosetting adhesive to the upper surface of the lower plate body 102 and the lower surface of the upper plate body 101. Arrange the honeycomb core layer 103 between the lower plate body 102 and the upper plate body 101. Apply a clamping force to the lower plate body 102 and the upper plate body 101 to squeeze the intermediate honeycomb core layer 103 towards each other, and apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body 102, the upper plate body 101, and the honeycomb core layer 103 to complete the production of the honeycomb substrate 1 first. The coating thickness of the aforementioned liquid thermosetting adhesive, especially the liquid thermosetting adhesive on the lower surface of the upper plate body, should be well controlled. If the coating is too little, the bonding strength between the upper and lower plate bodies and the honeycomb core layer is low. If the coating is too much, the adhesive on the lower surface of the upper plate body is likely to drip downward.

[0062] After that, additional thermosetting adhesive is coated on the lower surface of the panel 2 and / or the upper surface of the upper plate body 101. The panel 2 is arranged against the upper surface of the upper plate body 101, and a downward pressure is applied to the panel 2, so that the thermosetting adhesive between the panel 2 and the upper plate body 101 spreads evenly under the action of the aforementioned pressure. A heating plate 5 is arranged against the lower surface of the lower plate body 102. The heat generated by the heating plate 5 is transmitted to the thermosetting adhesive between the panel 2 and the upper plate body 101 through the lower plate body 102, the honeycomb core layer 103, and the upper plate body 101 in sequence. The thermosetting adhesive cures at high temperature to fixedly connect the panel 2 and the upper plate body 101.

[0063] Since the thermosetting adhesive between the panel 2 and the upper plate body 101 spreads evenly under the action of pressure during the manufacturing process, after the manufacturing is completed, the cured thermosetting adhesive will form a continuous and dense adhesive layer 4 between the panel 2 and the upper plate body 101 of the honeycomb substrate. There will be no holes or grooves between the panel 2 and the honeycomb substrate 1, so that the floor board can bear a large vertical load and vertical impact force.

[0064] In order to accelerate the transmission rate of the heat on the heating plate 5 to the thermosetting adhesive between the panel 2 and the upper plate body 101, and thus improve the manufacturing efficiency of the floor board, in this embodiment, the honeycomb substrate is a metal honeycomb board with rapid heat conduction and strong heat resistance. Specifically, the upper plate body 101 and the lower plate body 102 of the honeycomb substrate 1 are both aluminum plates, and the middle honeycomb core layer 103 is an aluminum honeycomb. Of course, if the upper plate body 101 and the lower plate body 102 are made of steel plates and the middle honeycomb core layer 103 is made of steel honeycomb, it also has a very high heat transfer rate.

[0065] In some other embodiments of the present application, the honeycomb core layer 103 can also be made of other heat-resistant materials, such as heat-resistant plastics.

[0066] The panel 2 in this embodiment is a wooden board. Of course, it can also be a marble board, a ceramic tile board, or a plastic board, or even a wear-resistant coating applied on the upper surface of the honeycomb substrate.

[0067] In this embodiment, floor fasteners 3 are fixedly connected to the four sides of the honeycomb substrate 1, so that each floor board can be docked with each other by means of the floor fasteners 3 on the sides to form a large-area floor system laid on the ground.

[0068] The above floor buckle 3 is connected to the side position of the honeycomb substrate 1 in the following way: the area of the honeycomb core layer 103 in the honeycomb substrate is smaller than the areas of the upper plate body 101 and the lower plate body 102, and each side of the honeycomb core layer 103 is located inside the corresponding sides of the upper plate body 101 and the lower plate body 102, so that a floor buckle embedding gap 1a surrounding the honeycomb core layer 103 is formed between the upper plate body 101 and the lower plate body 102. The floor buckle 3 is embedded in the aforementioned floor buckle embedding gap 1a. Moreover, the part of the floor buckle embedded in the aforementioned floor buckle embedding gap 1a is adhesively fixed to the upper plate body 101 and the lower plate body 102.

[0069] It should be noted that the above floor buckle 3 can also be welded to only one of the upper plate body 101 or the lower plate body 102. The advantage of such a design is that: the assembly efficiency of the floor buckle 3 and the honeycomb substrate 1 is improved. However, the defect is that: the connection strength between the floor buckle 3 and the honeycomb substrate 1 is slightly poor.

[0070] The adhesive used to bond the floor buckle 3 and the honeycomb substrate 1 can be a heat-resistant thermosetting adhesive. In this way, after the assembly of the floor buckle 3 and the honeycomb substrate 1 is completed, the above process can be used to bond the upper panel 2.

[0071] When manufacturing this floor board, first complete the assembly of the floor buckle 3 and the honeycomb substrate 1, and then cover the panel 2 on the upper surface of the honeycomb substrate 1. If a structure for positioning the installation position of the panel 2 is not provided on the honeycomb substrate 1 or the floor buckle 3, it will result in inconsistent relative positions between the panel 2 and the honeycomb substrate 1 on each floor board. Furthermore, after the floor boards are connected together, the gap sizes between adjacent floor boards are different, affecting the appearance. Seriously, it may even cause the floor boards to be unable to be assembled together.

[0072] For the above reasons, in this embodiment, a panel positioning protrusion 301 that protrudes upward and is higher than the upper surface of the honeycomb substrate 1 is provided on each floor buckle 3, and after the assembly is completed, the side of the panel 2 abuts against the panel positioning protrusion 301 in the horizontal direction.

[0073] During assembly, after the connection between the floor buckle 3 and the honeycomb substrate 1 is completed, the panel positioning protrusion 301 on the floor buckle 3 protrudes above the upper surface of the honeycomb substrate 1, thus providing pre-positioning for the installation of the panel 2. Then, under the positioning action of the panel positioning protrusion 301, the bonding and assembly of the panel 2 are completed.

[0074] Of course, it is also possible to install the floor buckle 3 after the assembly of the honeycomb substrate 1 and the panel 2 is completed, or even not configure the floor buckle 3.

[0075] During the use of the floor board, it mainly bears the vertical load from above. In order to improve the ability of this floor board to bear the vertical load and vertical impact, in this embodiment, all the honeycomb holes of the honeycomb core layer of its honeycomb substrate are vertically penetrated.

[0076] As used in the description and claims of this application, the "thermosetting adhesive" includes both adhesives that can only be cured by heating and adhesives whose curing speed can be accelerated by heating. Example Two:

[0077] Figure 6 and Figure 7 Another preferred embodiment of the floorboard of this application is shown. The structure of this floorboard is basically the same as that of Example One, and the main difference is only that:

[0078] The panel 2 is adhesively fixed to the upper surface of the upper plate body 101 by a hot-melt adhesive (instead of the thermosetting adhesive in Example One).

[0079] Furthermore, the panel 2 and the upper plate body 101 of the honeycomb substrate 1 are adhesively fixed through a hot-melt adhesive film 6 clamped between the two.

[0080] Referring to Figure 6 as shown, when manufacturing this floorboard:

[0081] First, a liquid thermosetting adhesive is coated on the upper surface of the lower plate body 102 and the lower surface of the upper plate body 101. A honeycomb core layer 103 is arranged between the lower plate body 102 and the upper plate body 101. A clamping force is applied to the lower plate body 102 and the upper plate body 101 to squeeze the intermediate honeycomb core layer 103, and high temperature is applied to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body 102, the upper plate body 101, and the honeycomb core layer 103, and first completing the manufacture of the honeycomb substrate 1.

[0082] After that, the assembly of the floor buckle 3 and the honeycomb substrate 1 is completed.

[0083] Then, the panel 2 is provided, and a hot-melt adhesive film 6 is clamped between the panel 2 and the upper plate body 101. A heating plate 5 is arranged in abutting contact with the lower surface of the lower plate body 102. The heat generated by the heating plate 5 is transmitted to the hot-melt adhesive film 6 through the lower plate body 102, the honeycomb core layer 103, and the upper plate body 101 in sequence. The hot-melt adhesive film 6 melts at high temperature. The heat of the heating plate 5 is removed, and the melted hot-melt adhesive film cures at low temperature, thereby fixedly connecting the panel 2 and the upper plate body 101.

[0084] The above-mentioned "removing the heat of the heating plate 5" includes two methods: One is to withdraw the heating plate from the lower surface of the lower plate body 102; the other is to disconnect or reduce the heating current of the heating plate 5 to lower the temperature of the heating plate 5. The above-mentioned "high temperature" and "low temperature" are relative and there is no fixed temperature value, and those skilled in the art generally understand the meanings of the above-mentioned "high temperature" and "low temperature".

[0085] After production, the melted and solidified hot melt adhesive film 6 also forms a continuous and dense adhesive layer between the panel 2 and the upper plate body 101 of the honeycomb substrate, and there will be no holes or grooves between the panel 2 and the upper plate body 101 of the honeycomb substrate. Embodiment Three:

[0086] Refer to Figures 8 to 12 As shown, the floor board of this embodiment is basically the same as that of Embodiment One. The main difference is that in this embodiment, the honeycomb core layer of the honeycomb substrate adopts another structure, thereby improving the bonding area and bonding strength between the honeycomb core layer 103 and the upper plate body 101 and the lower plate body 102, and reducing the possibility of the upper and lower plate bodies detaching from the honeycomb core layer. Specifically as follows:

[0087] The honeycomb core layer 103 is composed of a very thin metal sheet 1031 and a plurality of downward-extending stamping protrusions 1032 integrally formed on the metal sheet by stamping the metal sheet. The upper surface 1031a of the metal sheet 1031 abuts against and is adhesively fixed to the lower surface of the upper plate body 101, and the lower surface 1032a of the stamping protrusion 1032 abuts against and is adhesively fixed to the upper surface of the lower plate body 102.

[0088] Considering that the upper surface of the lower plate body 102 is a planar structure, in order to increase the abutting and bonding area between each stamping protrusion 1032 and the lower plate body 102, in this embodiment, the lower surface 1032a of each stamping protrusion 1032 is set as a planar structure, and the lower surfaces 1032a of each stamping protrusion 1032 are arranged in the same plane.

[0089] Considering that the lower surface of the upper plate body 101 is also a planar structure, and the lower surface of the upper plate body 101 is parallel to the upper surface of the lower plate body 102, in order to increase the abutting and bonding area between the metal sheet 1031 and the upper plate body 101, in this embodiment, the upper surface 1031a of the metal sheet 1031 is further set as a planar structure parallel to the lower surface 1032a of the stamping protrusion 1032.

[0090] And, the sum of the areas of the lower surfaces 1032a of the above-mentioned respective stamping protrusions 1032 = the area of the upper surface 1031a of the metal sheet 1031, so that the total abutting and bonding area between all the stamping protrusions 1032 and the lower plate body 102 = the abutting and bonding area between the metal sheet 1031 and the upper plate body 101, evenly distributing the total bonding area of the honeycomb core layer, and further making the connection force between the honeycomb core layer 103 and the upper plate body 101 = the connection force between the honeycomb core layer 103 and the lower plate body 102, avoiding the bonding force between one side plate body and the honeycomb core layer 103 being significantly less than the bonding force between the other side plate body and the honeycomb core layer 103.

[0091] In this embodiment, the above-mentioned stamping protrusions 1032 are evenly distributed in a matrix. Moreover, each stamping protrusion 1032 is in the shape of an annular cylinder, and in the annular-cylindrical stamping protrusion 1032, there is formed: a cylindrical groove 10321 with an open bottom and a closed top, and an annular-cylindrical groove 10322 with an open top and a closed bottom and surrounding the periphery of the aforementioned cylindrical groove. The upper surface of the top groove wall 10321a of the cylindrical groove 10321 abuts against and is adhesively fixed to the upper plate body 101, and the lower surface 1032a of the stamping protrusion 1032 is formed on the bottom groove wall 10322a of the annular-cylindrical groove 10322.

[0092] In order to increase the bonding area and bonding strength between the top groove wall 10321a of the cylindrical groove and the upper plate body 101, in this embodiment, the top groove wall 10321a of the cylindrical groove 10321 is set to a planar structure, and the upper surface of the top groove wall 10321a of the cylindrical groove 10321 is arranged flush with the upper surface of the metal sheet 1031 - the upper surface of the top groove wall 10321a of the cylindrical groove can be regarded as a part of the upper surface of the metal sheet 1031.

[0093] Now briefly introduce the manufacturing method of this honeycomb substrate: First, (using an annular-cylindrical stamping head) punch out a plurality of stamping protrusions 1032 extending in the same direction along the thickness direction of the metal sheet 1031 on the metal sheet 1031, then abut and adhesively fix the upper surface 1031a of the metal sheet 1031 to the upper plate body 101, and abut and adhesively fix the lower surface 1032a of each stamping protrusion 1032 to the lower plate body 102.

[0094] In this embodiment, the annular-cylindrical groove 10322 has a radial width that gradually decreases from the groove opening to the groove bottom to facilitate the demolding of the stamping die.

[0095] The above-mentioned metal sheet 1031 is preferably an aluminum sheet with good ductility, and its thickness is generally selected to be 0.02 - 1 mm. Embodiment 4:

[0096] Refer to Figure 13 and Figure 14 As shown, the floor board of this embodiment is basically the same in structure as that of Embodiment 3, and the main difference lies in that: the outer contour of each stamping protrusion 1032 in the honeycomb core layer is cylindrical.

[0097] Obviously, the above-mentioned stamping protrusions 1032 can also be other shapes, such as a prism shape.

[0098] However, it is preferable to set the stamping protrusions 1032 to the annular-cylindrical shape of Embodiment 3, so that the number of vertical support arms between the upper and lower plate bodies can be increased, and thus the bearing strength of the honeycomb substrate can be improved.

[0099] The above are only exemplary embodiments of the present application and are not intended to limit the scope of protection of the present application. The scope of protection of the present application is determined by the appended claims.

Claims

1. A floorboard, comprising: a honeycomb substrate (1), and a panel (2) adhesively fixed to the upper surface of the honeycomb substrate; It is characterized in that the honeycomb substrate (1) comprises: a honeycomb core layer (103), an upper plate body (101) adhesively fixed to the upper surface of the honeycomb core layer by a thermosetting adhesive, and a lower plate body (102) adhesively fixed to the lower surface of the honeycomb core layer by a thermosetting adhesive; The panel (2) is adhesively fixed to the upper surface of the upper plate body (101) by a thermosetting or hot-melt adhesive; A snap-in mounting gap (1a) is formed between the upper plate body (101) and the lower plate body (102) around the honeycomb core layer (103), and a floor buckle (3) welded or adhesively fixed to the upper plate body (101) or / and the lower plate body (102) is embedded in the snap-in mounting gap (1a); The floor buckle (3) is provided with a panel positioning protrusion (301) that is higher than the upper surface of the upper plate body (101) and abuts against the side of the panel (2) in the horizontal direction; The adhesive for bonding the panel (2) and the honeycomb substrate (1) forms a continuous and dense adhesive layer (4) between the panel (2) and the honeycomb substrate (1).

2. The floor board according to claim 1, characterized in that, The honeycomb core layer (103) is a metal honeycomb, and the upper plate body (101) and the lower plate body (102) are metal plates.

3. The floorboard according to claim 2, wherein, The honeycomb core layer (103) is an aluminum honeycomb or a steel honeycomb, and the upper plate body (101) and the lower plate body (102) are aluminum plates or steel plates.

4. The floorboard according to claim 1, wherein The honeycomb core layer (103) is a high-temperature resistant plastic.

5. The floorboard according to claim 1, characterized in that, The panel (2) is a marble plate, a ceramic tile plate, a wood plate or a plastic plate.

6. The floor board according to claim 1, wherein All the honeycomb holes of the honeycomb core layer (103) are vertically through.

7. A manufacturing method of the floor board according to any one of claims 1 to 6, characterized in that, Comprising: Coating a liquid thermosetting adhesive on the upper surface of the lower plate body (102) and the lower surface of the upper plate body (101), arranging the honeycomb core layer (103) between the lower plate body (102) and the upper plate body (101), applying a clamping force to the lower plate body (102) and the upper plate body (101) to squeeze the honeycomb core layer (103), and applying high temperature to cure the thermosetting adhesive, so as to fixedly connect the lower plate body (102), the upper plate body (101) and the honeycomb core layer (103); Coating a thermosetting adhesive on the lower surface of the panel (2) or / and the upper surface of the upper plate body (101), arranging the panel (2) against the upper surface of the upper plate body (101), and applying a downward pressure to the panel (2); Arranging a heating plate (5) against the lower surface of the lower plate body (102), and the heat generated by the heating plate (5) is transmitted to the thermosetting adhesive between the panel (2) and the upper plate body (101) through the lower plate body (102), the honeycomb core layer (103) and the upper plate body (101) in sequence, and the thermosetting adhesive between the panel (2) and the upper plate body (101) is cured at high temperature to fixedly connect the panel (2) and the upper plate body (101).

8. A manufacturing method of the floor board according to any one of claims 1 to 6, characterized in that, Comprising: Apply a liquid thermosetting adhesive on the upper surface of the lower plate body (102) and the lower surface of the upper plate body (101). Arrange a honeycomb core layer (103) between the lower plate body (102) and the upper plate body (101). Apply a clamping force to the lower plate body (102) and the upper plate body (101) to squeeze the honeycomb core layer (103) by moving them closer to each other. Apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body (102), the upper plate body (101) and the honeycomb core layer (103); Interpose a hot melt adhesive film (6) between the panel (2) and the upper plate body (101). Arrange a heating plate (5) against the lower surface of the lower plate body (102). The heat generated by the heating plate (5) is transmitted to the hot melt adhesive film (6) successively through the lower plate body (102), the honeycomb core layer (103) and the upper plate body (101). The hot melt adhesive film (6) melts at high temperature. Remove the heat of the heating plate (5), and the melted hot melt adhesive film (6) cures at low temperature, thereby fixedly connecting the panel (2) and the upper plate body (101).

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