Floor heating system

The floor heating system, constructed using a fully dry method, utilizes the heat-conducting connection between metal honeycomb panels and floor heating pipes, combined with thermal insulation pads and heat-conducting pipe clamps, to solve the problems of high energy consumption, slow heat transfer, and easy scaling of traditional floor heating systems, achieving instant heating, low energy consumption, and efficient construction.

CN111794465BActive Publication Date: 2025-09-16SHANGHAI XINGYE MATERIALS TECH CO LTD
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Patent Information

Application Number
CN202010776255.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-08-05
Publication Date
2025-09-16
Estimated Expiration
2040-08-05

AI Technical Summary

Technical Problem

Traditional floor heating systems have problems such as high energy consumption, slow heat transfer rate, easy scaling, complex construction and limitations on floor materials.

Method used

The floor heating system adopts a fully dry construction method, using metal honeycomb panels to connect with the floor heating pipes for thermal conductivity, combined with insulation pads and heat pipe clamps to achieve rapid heat transfer and reduce the temperature of the floor heating pipes. The floor panels are connected into a whole through floor buckles and are suitable for a variety of floor materials.

Benefits of technology

It can achieve instant heating, low energy consumption, no scaling, high construction efficiency, and is suitable for a variety of floor materials, thus improving the energy utilization rate and service life of the floor heating system.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a low-energy-consuming, instant-heating, fully dry-constructed, and scale-free low-temperature floor heating system, which includes a floor heating pipe for carrying hot water and a plurality of floor blocks located above the floor heating pipe. Each floor block is composed of a metal honeycomb panel, a panel fixed to a panel on the metal honeycomb panel, and a floor buckle fixedly connected to a side position of the metal honeycomb panel. The metal honeycomb panel is laid above the floor heating pipe and is heat-conductingly connected to the floor heating pipe. The plurality of floor blocks are connected by the floor buckles that cooperate with each other.
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Description

Technical Field

[0001] The present application relates to the field of floor heating. Background Art

[0002] Floor heating, short for radiant floor heating, uses the entire floor as a radiator. Heat is evenly heated by the heat medium in the floor's radiant layer, providing comfortable heating to the interior through radiation and convection. Floor heating systems are categorized by the heat transfer medium: water-based and electric.

[0003] Water floor heating refers to a heating method that heats water to a certain temperature, transports it to a water pipe heat dissipation network under the floor, and achieves heating purposes by generating heat through the floor.

[0004] Electric floor heating uses a translucent polyester film that generates heat when powered. It's made by processing a special conductive ink and a metal current-carrying strip, then hot-pressing it between insulating polyester films. The carbon-based ink acts as a heating element, radiating heat into the space and providing warmth.

[0005] However, both traditional water and electric floor heating systems suffer from slow heat transfer rates and long startup wait times. Water floor heating systems require the water temperature to be maintained at 50-60°C for users to feel warm, but heating low-temperature water to 50-60°C in cold weather consumes a lot of energy. Furthermore, the heat loss rate of high-temperature water at 50-60°C in cold weather is high, further increasing the energy consumption of the floor heating system. Furthermore, the water temperature in the floor heating pipes is maintained at 50-60°C for a long time, making it very prone to scaling. Traditional electric floor heating systems also suffer from slow heat transfer rates and high energy consumption due to structural defects.

[0006] Floor heating systems can be divided into dry floor heating and wet floor heating according to different paving structures.

[0007] Dry floor heating is also known as ultra-thin floor heating. It is named dry floor heating because it does not require backfilling compared to ordinary floor heating. It is also called ultra-thin floor heating because it does not require a backfill layer and reduces the floor height compared to ordinary floor heating.

[0008] However, traditional dry floor heating is more expensive than wet floor heating and cannot be installed under floor coverings like tiles and marble, as these materials must be secured with cement during installation. Dry floor heating also lacks a pebble backfill layer, making the heating coils susceptible to damage, reducing their lifespan and potentially causing maintenance issues like leaks.

[0009] Wet floor heating is the most mature installation method for water-based floor heating and is also widely used in electric floor heating. Relatively inexpensive, wet floor heating is the dominant method in the domestic floor heating market. Wet floor heating involves encasing the floor heating pipes in concrete, then laying flooring, tiles, and other flooring materials on top of the concrete layer. This concrete layer not only protects and secures the water heating pipes but also serves as the primary channel for heat transfer. The concrete layer evenly distributes heat, reducing the risk of overheating or overcooling.

[0010] However, wet floor heating requires a concrete layer of sand and gravel, resulting in a heavy average weight, placing approximately eight times more load on the building than radiators. Wet floor heating begins with laying insulation on a concrete surface, followed by piping. Finally, pebble-cement is poured to level the surface, followed by a floor covering typically 8 cm in height. Furthermore, wet floor heating takes a long time to install and requires a high level of professional expertise. If buried pipes or heating membranes are damaged, the concrete filling layer must be removed, a complex process. Summary of the Invention

[0011] The technical problem to be solved by this application is: in response to the above problems, a low-temperature floor heating system is proposed, which has low energy consumption, heats up immediately after turning on, adopts a fully dry construction method and does not form scale.

[0012] The technical solution of this application is:

[0013] A floor heating system includes a floor heating pipe for carrying hot water and a plurality of floor blocks located above the floor heating pipe, each of the floor blocks being composed of a metal honeycomb panel, a panel fixed to the upper panel of the metal honeycomb panel, and a floor buckle fixedly connected to the side of the metal honeycomb panel. The metal honeycomb panel is laid above the floor heating pipe and is thermally connected to the floor heating pipe. The plurality of floor blocks are connected by the floor buckles that cooperate with each other.

[0014] Based on the above technical solutions, this application also includes the following preferred solutions:

[0015] The metal honeycomb panel comprises:

[0016] upper plate body,

[0017] a lower plate body arranged parallel to and below the upper plate body, and

[0018] A honeycomb core layer fixedly connected between the upper plate body and the lower plate body;

[0019] A clip installation gap is formed between the upper plate body and the lower plate body around the honeycomb core layer, and the floor clip is embedded in the clip installation gap and is welded or bonded to the upper plate body and / or the lower plate body.

[0020] The upper plate body and the lower plate body are steel plates or aluminum plates, and the honeycomb core layer is a steel honeycomb or an aluminum honeycomb.

[0021] The honeycomb holes of the honeycomb core layer are all vertically connected.

[0022] The floor heating system further comprises a heat insulating pad laid on the ground, and the floor heating pipe is laid on the heat insulating pad.

[0023] The thermal insulation pad is made of foam plastic.

[0024] A downwardly concave pipe groove is provided on the upper surface of the thermal insulation pad, and the floor heating pipe is embedded in the pipe groove.

[0025] The upper surface of the thermal insulation pad is covered with a heat-conducting film, a portion of which is sandwiched between the outer pipe wall of the floor heating pipe and the groove wall of the pipe groove, and the metal honeycomb panel is arranged against the upper surface of the heat-conducting film.

[0026] A heat-conducting pipe clamp is clamped on the floor heating pipe, and the heat-conducting pipe clamp has a heat-conducting top surface located at the notch of the pipe groove, and the heat-conducting top surface of the heat-conducting pipe clamp is vertically abutted against the lower surface of the lower plate body.

[0027] The heat-conducting top surface is formed with a downwardly concave glue groove, and the glue groove is provided with heat-conducting glue for bonding the lower plate body and the heat-conducting pipe clamp.

[0028] This application can achieve the following beneficial effects:

[0029] 1. The floor blocks of this floor heating system are directly laid on top of the floor heating pipes, and are connected to each other into a whole with the help of the floor buckles that come with the floor blocks. There is no need to pour sand and gravel concrete. It is a fully dry construction method with high installation efficiency. The floor blocks can be easily dismantled and reused.

[0030] 2. Metal honeycomb panels have excellent compressive and bending resistance, which is exactly adapted to the use environment of floor tiles laid flat on the ground and just meets the use requirements of floor tiles. Based on this, the upper panel can be made as thin as a few millimeters, greatly saving the use of wood and stone, especially precious wood and stone. At the same time, the metal honeycomb panel has a high thermal conductivity rate, which can quickly guide the heat from the floor heating pipe below to the thin panel, and then dissipate it into the room from the thin panel, quickly raising the indoor temperature. This makes the floor heating system heat up immediately after it is turned on, and the water temperature in the floor heating pipe does not need to be high. For normal use, it only needs to be maintained at a low temperature of around 30°C. Not only is the energy consumption extremely low, but it also does not form scale.

[0031] 3. Metal honeycomb panels not only have excellent compressive and bending resistance, but also use less material, are light in weight, and have low cost. The new floor blocks formed by combining with panels are affordable and easy to transport, and have broad market prospects.

[0032] 4. All honeycomb holes of the honeycomb core layer of the metal honeycomb panel are vertically penetrated to further enhance the ability of the floor block to withstand vertical loads and vertical impacts, which is exactly in line with the application environment of the floor.

[0033] 5. A layer of insulation pad is laid between the ground and the floor heating pipe. The insulation pad blocks the downward heat transfer path of the floor heating pipe, ensuring that most of the heat is transferred upward to the floor blocks, thereby improving the energy utilization rate of the floor heating system.

[0034] 6. The insulation pad is made of foam plastic, which has a certain degree of flexibility and thus has protective properties for the floor heating pipes. In addition, the foam plastic is lightweight, environmentally friendly, and has excellent sound insulation properties.

[0035] 7. The thermal insulation pad is made of polystyrene resin foam board, which also has good fire resistance.

[0036] 8. Many concave pipe grooves are opened on the upper surface of the insulation pad, and the floor heating pipes are embedded in the aforementioned pipe grooves. This not only solves the problem of unstable position and easy movement of the floor heating pipes, but also prevents the floor heating pipes from being deformed and flattened due to pressure.

[0037] 9. A heat-conducting pipe clamp with a heat-conducting top surface is clamped on the floor heating pipe. The heat-conducting top surface of the heat-conducting pipe clamp is vertically abutted against the lower plate of the metal honeycomb panel, and a heat-conducting glue is arranged between the two, thereby improving the heat conduction efficiency of the floor heating pipe and the metal honeycomb panel.

[0038] 10. When the panel is a fragile structure such as marble or ceramic tile, the transportation and handling of the floor blocks is more convenient with the support of the metal corrugated substrate underneath, which greatly reduces the damage rate of marble and ceramic tile floor blocks during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below only relate to some embodiments of the present application, and are not limitations to the present application.

[0040] Figure 1 It is a schematic cross-sectional structural diagram of one of the floor panels of the floor heating system according to the first embodiment of the present application.

[0041] Figure 2 It is a structural diagram of a metal honeycomb panel according to Example 1 of the present application.

[0042] Figure 3 It is a schematic diagram of the three-dimensional structure of a certain floor block part of the floor heating system in Example 1 of the present application.

[0043] Figure 4 yes Figure 3 Exploded view with the floor clips removed.

[0044] Figure 5 It is a schematic diagram of the cross-sectional structure of two adjacent floor panels of the floor heating system according to an embodiment of the present application.

[0045] Figure 6 This is a schematic diagram of the decomposed structure of one of the floor panels of the floor heating system according to the second embodiment of the present application.

[0046] Figure 7 It is a schematic cross-sectional structure diagram of one of the floor panels of the floor heating system according to the third embodiment of the present application.

[0047] Figure 8 It is a schematic diagram of the three-dimensional structure of the metal honeycomb panel in Example 4 of the present application.

[0048] Figure 9 It is a structural schematic diagram of the upper plate body of the metal honeycomb panel in Example 4 of the present application when it is in a separated state.

[0049] Figure 10 yes Figure 9 An enlarged view of the X1 part.

[0050] Figure 11 It is a structural schematic diagram of the lower plate body of the metal honeycomb panel in Example 4 of the present application when it is in a separated state.

[0051] Figure 12 yes Figure 11 Enlarged view of the X2 part.

[0052] Figure 13 This is a structural diagram of the upper plate of the metal honeycomb panel in Example 5 of the present application when it is in a separated state.

[0053] Figure 14 This is a structural diagram of the lower plate body of the metal honeycomb panel in Example 5 of the present application when it is in a separated state.

[0054] Among them: 1- floor heating pipe, 2- floor block, 3- thermal insulation pad, 4- thermal pipe clamp, 5- thermal adhesive, 6- floor, 7- thermal film;

[0055] 201-metal honeycomb panel, 202-panel, 203-floor buckle, 201a-upper panel, 201b-lower panel, 201c-honeycomb core layer, 201d-floor buckle installation gap, 203a-male buckle, 203b-female buckle, 301-pipe groove, 401-glue groove;

[0056] 201c1-metal sheet, 201c2-stamping protrusion, 201c1a-upper surface of the metal sheet, 201c2a-lower surface of the stamping protrusion, 201c21-cylindrical groove, 201c22-annular column groove, 201c23-inner hole of the cylindrical stamping protrusion, 201c21a-top groove wall of the cylindrical groove, 201c22a-bottom groove wall of the annular column groove. DETAILED DESCRIPTION

[0057] To make the purpose, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the described embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0058] Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meanings understood by persons having ordinary skills in the field to which this application belongs. The words "a" or "an" and the like used in the patent application specification and claims of this application do not indicate a limitation on quantity, but rather indicate the presence of at least one.

[0059] In the description of the specification and claims of this application, the terms "upper", "lower", "horizontal", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting this application.

[0060] Now, embodiments of the present application are described with reference to the accompanying drawings.

[0061] Example 1:

[0062] Figures 1 to 4 A preferred embodiment of the floor heating system of the present application is shown, which includes a floor heating pipe 1 for carrying hot water and a plurality of floor blocks 2 located above the floor heating pipe.

[0063] The key improvement of this embodiment lies in that each floorboard 2 is composed of a metal honeycomb panel 201, a panel 202 fixed to the upper surface of the metal honeycomb panel, and floor clips 203 fixed to the side edges of the metal honeycomb panel. The metal honeycomb panel 201 is laid above the floor heating pipe 1 and is thermally connected to it. The individual floorboards 2 are connected by cooperating floor clips 203.

[0064] As can be seen, the individual floor panels 2 of this floor heating system are installed directly on top of the floor heating pipes 1 and connected together using the floor clips 203 provided by the floor panels 2. This eliminates the need for pouring sandstone concrete, allowing for a fully dry installation method that is highly efficient. The floor panels can also be easily removed and reused. Furthermore, the metal honeycomb panels have a high thermal conductivity, quickly directing heat from the floor heating pipes 1 below to the panels 202, which then dissipate it into the room, rapidly raising the indoor temperature.

[0065] Panel 202 (the upper surface) is exposed to the environment and is accessible to people. Panel 202 is typically a marble slab, a ceramic tile slab, a wooden board, or a plastic board. The aforementioned plastic board includes relatively soft rubber boards and plastic boards. In this embodiment, panel 202 is a wooden board bonded to the upper surface of the metal honeycomb panel, and the thickness of the board is only a few millimeters.

[0066] The above-mentioned panel can also be a wear-resistant coating applied on the upper surface of the metal honeycomb panel. The wear-resistant coating has a certain thickness and is in a fixed state. It is "plate-shaped" in appearance and is also an optional panel structure.

[0067] Similar to traditional honeycomb panels, the metal honeycomb panel 201 of this embodiment also includes: an upper panel 201a, a lower panel 201b arranged parallel to and below the upper panel, and a honeycomb core layer 201c fixedly connected between the upper and lower panels.

[0068] Furthermore, the upper plate 201a is bonded to the upper surface of the honeycomb core layer 201c by means of an adhesive (hot melt adhesive film), and the lower plate 201b is bonded to the lower surface of the honeycomb core layer 201c by means of an adhesive (hot melt adhesive film). Of course, the upper and lower plates can also be welded to the honeycomb core layer.

[0069] The panel 202 is bonded to the upper surface of the upper plate 201a with an adhesive, thereby achieving a bond between the panel 202 and the metal honeycomb panel. To enhance the vertical compression and impact resistance of the panel 202 and prevent it from breaking when subjected to vertical loads or vertical impacts (especially when the panel is a marble or ceramic tile panel), the adhesive used to bond the panel 202 to the upper plate 201a is preferably continuous and dense, thereby forming a continuous and dense adhesive layer (not shown) between the panel 202 and the upper plate 201a.

[0070] The above-mentioned "continuous and dense adhesive layer" can be achieved by increasing the amount of adhesive used, or by sandwiching a hot melt adhesive film between the panel 202 and the upper plate body 201a, and first allowing the aforementioned hot melt adhesive film to melt at a high temperature, and then allowing the molten hot melt adhesive film to solidify at a low temperature.

[0071] Unlike conventional honeycomb panels, the honeycomb core layer 201c in this embodiment is smaller in area than the upper and lower panels 201a, 201b. Furthermore, each side of the honeycomb core layer 201c lies inboard of the corresponding side of the upper and lower panels 201a, 201b. This creates a floor clip mounting gap 201d around the honeycomb core layer 201c between the upper and lower panels 201a, 201b. The floor clip 203 is embedded in this gap 201d, and the portion of the floor clip embedded in this gap 201d is welded to the upper and lower panels 201a, 201b.

[0072] It should be noted that the floor clip 203 can also be welded to only one of the upper plate 201a or the lower plate 201b. This design has the advantage of improving the assembly efficiency of the floor clip and the metal honeycomb panel. However, it has the disadvantage of slightly weaker connection strength between the floor clip and the metal honeycomb panel.

[0073] In addition, adhesive may be applied to the floor buckle 203, and the floor buckle portion embedded in the floor buckle installation gap 201d may be bonded and fixed to the upper plate 201a and / or the lower plate 201b using the adhesive.

[0074] In this embodiment, the metal honeycomb panel is an aluminum honeycomb panel, with both the upper panel 201a and the lower panel 201b being aluminum panels, and the central honeycomb core 201c being an aluminum honeycomb. Each floor clip is a one-piece molded piece made of aluminum profiles. Of course, the floor clips can also be made of other materials, such as one-piece plastic.

[0075] The upper plate 201a, lower plate 201b and honeycomb core layer 201c of the above metal honeycomb panel can also be made of other materials. For example, the upper plate 201a and lower plate 201b can also be made of steel plates, and the middle honeycomb core layer 201c can also be made of stainless steel honeycomb. This embodiment uses honeycomb aluminum panels as the base of the floor panels, mainly based on the following two considerations:

[0076] 1. The production process of honeycomb aluminum is mature, with low cost and light weight.

[0077] 2. The thermal conductivity of honeycomb aluminum panels is extremely high.

[0078] During use, the floor panels are mainly subjected to vertical loads from above. In order to improve the ability of the floor panels to withstand vertical loads and vertical impacts, in this embodiment, all honeycomb holes of the honeycomb core layer 201c of the metal honeycomb panel 201 are vertically penetrated. Figure 2 .

[0079] If the above-mentioned floor heating pipe 1 is directly laid on the ground 6 (generally the indoor floor, including the floor surface) and is in direct contact with the ground 6, then a large part of the heat of the hot water in the floor heating pipe 1 will be transferred downward to the ground 6 and lost. Based on this, this embodiment also lays a layer of insulation pad 3 on the ground 6, and the above-mentioned floor heating pipe 1 is laid on the aforementioned insulation pad 3. The insulation pad 3 blocks the downward heat transfer path of the floor heating pipe 1, ensuring that most of the heat is transferred upward to the floor block 2.

[0080] The above-mentioned thermal insulation pad 3 is preferably made of foam plastic with a certain degree of flexibility so as to have protective properties for the floor heating pipe 1. In addition, the foam plastic is lightweight, environmentally friendly, and has excellent sound insulation performance.

[0081] Furthermore, the thermal insulation pad 3 is preferably made of polystyrene resin (also a foam plastic) with fireproof properties.

[0082] If the floor heating pipes 1 are placed directly on the flat surface of the insulation mat, they will easily move and become unstable, and will also be easily deformed and flattened under the vertical pressure of the floor panels above. To address this, this embodiment has multiple downwardly concave pipe grooves 301 formed on the upper surface of the insulation mat 3, and the floor heating pipes 1 are embedded in these grooves 301.

[0083] If the floor heating pipe 1 were in direct contact with the metal honeycomb panel 201, the two would be in linear contact, resulting in a small heat transfer area. Furthermore, the plastic floor heating pipe 1 is easily bent and deformed, resulting in poor contact with the upper floorboards, and thus poor heat transfer efficiency. To address this issue, this embodiment clamps multiple thermally conductive pipe clips 4 onto the floor heating pipe 1. These clips 4 have a thermally conductive top surface located at the notch of the pipe groove 301. The thermally conductive top surface of the clips 4 vertically abuts the lower surface of the metal honeycomb panel lower plate 201b. The thermally conductive pipe clips 4 provide an indirect thermal connection between the floor heating pipe 1 and the floorboards 2.

[0084] Furthermore, in this embodiment, a downwardly recessed glue groove 401 is formed on the heat-conducting top surface of the heat-conducting pipe clamp 4, and a thermally conductive glue 5 for bonding the lower plate body 201b and the heat-conducting pipe clamp 4 is provided in the glue groove 401, further ensuring good thermal conductivity between the heat-conducting pipe clamp 4 and the metal honeycomb panel 201.

[0085] In order to allow adjacent floor panels to be connected very conveniently with the help of the floor buckles 203 thereon, this embodiment provides a floor buckle 203 on each side of the rectangular metal honeycomb panel 201, so that each floor panel has four floor buckles 203. In addition, two of the floor buckles 203 are male buckles 203a, and the other two floor buckles 203 are female buckles 203b. Figure 3 During assembly, the male buckles 203a and female buckles 203b of two adjacent floor panels are fastened together, as shown in FIG. Figure 5 .

[0086] It should be noted that the two male buckles 203a and the two female buckles 203b on the floorboards can have different structures. For example, the floorboard disclosed in Chinese invention patent publication number CN101910528B has male and female buckles on its two long sides that engage with each other in an angular flipping manner, while its two short sides have male and female buckles of another structure that engage with each other in a vertical displacement manner. Clearly, the claims of this application do not exclude this possibility.

[0087] Example 2:

[0088] Figure 6 A second preferred embodiment of the floor heating system of the present application is shown. The structure of the floor heating system is basically the same as that of the first embodiment, except that the length of the heat conducting pipe clamp 4 in this embodiment is basically equal to the length of the floor heating pipe 1.

[0089] Example 3:

[0090] Figure 7 The third preferred embodiment of the floor heating system of the present application is shown. This floor heating system has a structure basically the same as that of the first embodiment, with the difference that: this embodiment does not have a heat-conducting pipe clamp. Instead, a layer of heat-conducting film 7 is applied to the upper surface of the thermal insulation pad 3. A portion of the heat-conducting film 7 is sandwiched between the outer wall of the floor heating pipe 1 and the groove wall of the pipe groove 301. The metal honeycomb panel 201 (specifically, the lower panel 201b) is arranged in contact with the upper surface of the heat-conducting film 7. In this way, the heat-conducting film 7 has a large contact area with the floor heating pipe 1 and the metal honeycomb panel 201, thereby quickly transferring heat from the floor heating pipe 1 to the metal honeycomb panel 201.

[0091] The thermally conductive film 7 is preferably aluminum foil.

[0092] Example 4:

[0093] Reference Figures 8 to 12 As shown, the structure of the floor heating system of this embodiment is basically the same as that of the first embodiment. The main difference is that the honeycomb core layer 201c of the metal honeycomb panel 201 of this embodiment adopts another structure, thereby increasing the bonding area and bonding strength of the honeycomb core layer 201c with the upper plate 201a and the lower plate 201b, and reducing the possibility of the upper and lower plates being separated from the honeycomb core layer. The details are as follows:

[0094] The honeycomb core layer 201c is composed of a very thin metal sheet 201c1 and a plurality of downwardly extending stamped protrusions 201c2 integrally formed on the metal sheet by stamping. The upper surface 201c1a of the metal sheet 201c1 is abutted and bonded to (the lower surface of) the upper plate 201a, while the lower surface 201c2a of the stamped protrusions 201c2 is abutted and bonded to (the upper surface of) the lower plate 201b.

[0095] Considering that the upper surface of the lower plate body 201b is a planar structure, in order to increase the contact and bonding area between each stamping protrusion 201c2 and the lower plate body 201b, this embodiment sets the lower surface 201c2a of each stamping protrusion 201c2 as a planar structure, and the lower surface 201c2a of each stamping protrusion 201c2 is arranged in the same plane.

[0096] Considering that the lower surface of the upper plate 201a is also a planar structure, and the lower surface of the upper plate 201a is parallel to the upper surface of the lower plate 201b, in order to increase the contact and bonding area between the metal sheet 201c1 and the upper plate 201a, this embodiment further sets the upper surface 201c1a of the metal sheet 201c1 to a planar structure parallel to the lower surface 201c2a of the stamped protrusion 201c2.

[0097] Moreover, the sum of the areas of the lower surfaces 201c2a of the above-mentioned stamped protrusions 201c2 is equal to the area of ​​the upper surface 201c1a of the metal sheet 201c1, so that the sum of the bonding areas of all the stamped protrusions 201c2 and the lower plate body 201b is equal to the bonding area of ​​the metal sheet 201c1 and the upper plate body 201a, and the total bonding area of ​​the honeycomb core layer is evenly distributed, thereby making the connection force between the honeycomb core layer 201c and the upper plate body 201a equal to the connection force between the honeycomb core layer 201c and the lower plate body 201b, thereby avoiding the bonding force between one side plate body and the honeycomb core layer 201c being significantly smaller than the bonding force between the other side plate body and the honeycomb core layer 201c.

[0098] In this embodiment, the aforementioned stamped protrusions 201c2 are evenly distributed in a matrix. Furthermore, each stamped protrusion 201c2 is annular and cylindrical, forming a cylindrical groove 201c21 with an open bottom and a closed top, and an annular column groove 201c22 with an open top and a closed bottom, surrounding the cylindrical groove. The top wall 201c21a of the cylindrical groove 201c21 abuts against and is bonded to the upper plate 201a, while the bottom surface 201c2a of the stamped protrusion 201c2 is formed on the bottom wall 201c22a of the annular column groove 201c22.

[0099] In order to improve the bonding area and bonding strength between the top groove wall 201c21a of the cylindrical groove and the upper plate body 201a, in this embodiment, the top groove wall 201c21a of the cylindrical groove 201c21 is set to a planar structure, and the upper surface of the top groove wall 201c21a of the cylindrical groove 201c21 is arranged flush with the upper surface of the metal sheet 201c1 - the upper surface of the top groove wall 201c21a of the cylindrical groove can be regarded as part of the upper surface of the metal sheet 201c1.

[0100] The following is a brief introduction to the manufacturing method of the metal honeycomb panel: first, (using a circular cylindrical punch head) a plurality of stamped protrusions 201c2 extending in the same direction along the thickness direction of the metal sheet are punched out on the metal sheet 201c1, and then the upper surface 201c1a of the metal sheet 201c1 is abutted and bonded to the upper plate body 201a, and the lower surface 201c2a of each stamped protrusion 201c2 is abutted and bonded to the lower plate body 201b.

[0101] In this embodiment, the annular column groove 201c22 has a radial width that gradually decreases from the groove mouth to the groove bottom to facilitate demolding of the stamping die.

[0102] The metal sheet 201c1 is preferably an aluminum sheet with good ductility, and its thickness is generally selected to be 0.02 to 1 mm.

[0103] Reference Figure 13 and Figure 14 As shown, the floor heating system of this embodiment has a structure substantially the same as that of the fourth embodiment, with the main difference being that the outer contour of each stamped protrusion 201c2 in the honeycomb core layer is cylindrical.

[0104] Obviously, the stamping protrusion 201c2 may also be in other shapes, such as a polygonal column shape.

[0105] However, it is better to set the stamping protrusion 201c2 to the circular column shape of the fourth embodiment, so that the number of vertical support arms between the upper and lower plates can be increased, thereby improving the pressure-bearing strength of the honeycomb panel.

[0106] The above are merely exemplary embodiments of the present application and are not intended to limit the scope of protection of the present application. The scope of protection of the present application is determined by the appended claims.

Claims

1. A floor heating system, comprising a floor heating pipe (1) for conveying hot water and a plurality of floor blocks (2) located above the floor heating pipe, characterized in that: Each of the floor blocks (2) is composed of a metal honeycomb panel (201), a panel (202) fixed to the upper surface of the metal honeycomb panel, and a floor buckle (203) fixedly connected to the side of the metal honeycomb panel. The metal honeycomb panel (201) is laid above the floor heating pipe (1) and is heat-conductingly connected to the floor heating pipe (1). The multiple floor blocks (2) are connected via the floor buckles (203) that cooperate with each other. The metal honeycomb panel (201) comprises: Upper plate body (201a), a lower plate (201b) arranged parallel to and below the upper plate, and A honeycomb core layer (201c) fixedly connected between the upper plate body and the lower plate body; The floor heating system further comprises a heat insulating pad (3) laid on the ground (6), and the floor heating pipe (1) is laid on the heat insulating pad (3); The upper surface of the thermal insulation pad (3) is provided with a downwardly recessed pipe groove (301), and the floor heating pipe (1) is embedded in the pipe groove (301); A heat-conducting pipe clamp (4) is clamped onto the floor heating pipe (1), and the heat-conducting pipe clamp (4) has a heat-conducting top surface located at the notch position of the pipe groove (301), and the heat-conducting top surface of the heat-conducting pipe clamp (4) is vertically abutted against the lower surface of the lower plate (201b); The heat-conducting top surface is provided with a downwardly recessed glue groove (401), and the glue groove (401) is provided with a heat-conducting glue (5) for bonding the lower plate body (201b) and the heat-conducting pipe clamp (4).

2. The floor heating system according to claim 1, characterized in that: A floor buckle embedding gap (201d) is formed between the upper plate body (201a) and the lower plate body (201b) and is located around the honeycomb core layer (201c); the floor buckle (203) is embedded in the floor buckle embedding gap (201d) and is welded or bonded to the upper plate body (201a) and / or the lower plate body (201b); The honeycomb core layer (201c) is a steel honeycomb or an aluminum honeycomb.

3. The floor heating system according to claim 2, characterized in that: The upper plate body (201a) and the lower plate body (201b) are steel plates or aluminum plates.

4. The floor heating system according to claim 2, characterized in that: Each honeycomb hole of the honeycomb core layer (201c) is vertically connected.

5. The floor heating system according to claim 1, characterized in that: The thermal insulation pad (3) is foam plastic.

6. The floor heating system according to claim 1, characterized in that: The upper surface of the thermal insulation pad (3) is covered with a thermally conductive film (7), a portion of which is sandwiched between the outer tube wall of the floor heating pipe (1) and the groove wall of the tube groove (301), and the metal honeycomb panel (201) is arranged in contact with the upper surface of the thermally conductive film (7).

Citation Information

Patent Citations

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