Substrate Support Device and Control Method Thereof

Abstract

The present invention provides, as an example, a substrate support device and method for mounting a substrate and / or removing a substrate. As one form, the substrate support device includes: a plurality of support portions (10) that abut against a peripheral portion of the substrate (W) to rotate the substrate (W); a pair of driven portions (30) provided with the plurality of support portions (10); a connecting portion (20) that connects one driven portion (31) and the other driven portion (32); and a driving portion (40) that moves at least a part of the connecting portion (20) to linearly approach or separate each of the driven portions (30) in a first direction. A plurality of other forms are also provided.

Description

Technical Field

[0001] The present invention relates to a substrate support device for rotatably supporting a substrate and a control method for the substrate support device.

[0002] This application claims priority to Japanese Patent Application JP 2019-070492 filed on April 2, 2019, and incorporates its entire content by reference. Background Art

[0003] Conventionally, a rotary chuck for supporting a substrate such as a wafer has been known. Japanese Patent Application Laid-Open No. JP 2005-19456 discloses a rotary chuck having a rotary shaft and a plurality of clamping members that clamp a wafer and can release such clamping. In a configuration having four support portions, conventionally, two support portions on one side are fixed so as not to move in the in-plane direction of the substrate to form a fixed-side clamping mechanism, and two support portions on the other side form a drive-side clamping mechanism that moves in the in-plane direction of the substrate.

[0004] The support portion constituted by a spindle or the like is worn out due to use. For example, in the case of using a wafer as an example of a substrate, the support portion is worn out due to contact with the edge of the wafer. In this way, if the support portion is worn out, when the wafer is supported (held) by the support portion, the wafer moves by an amount corresponding to the wear amount on the fixed-side clamping mechanism side. In this way, there is a problem that the position of the supported substrate is shifted due to wear of the support portion, and further, the cleaning position of the substrate is shifted.

[0005] In addition, generally, when the substrate support device is shipped or delivered to a customer, a load sensor jig is used to adjust the pressure (clamping pressure) for supporting the substrate. However, as described above, if the support portion is worn out, the actual pressure applied to the substrate shifts from the initially adjusted pressure. It is possible to regularly use a load cell jig for pressure adjustment, but sometimes pressure shifts also occur during the process of repeated use, and the substrate is supported by a pressure different from the allowable pressure during the period until the pressure adjustment is performed, and processes such as cleaning are performed. Summary of the Invention

[0006] The present invention provides a substrate support device and the like that can support a substrate in the same form as at the beginning even if the support portion is worn out.

[0007] [Concept 1]

[0008] The substrate support device of the present invention may include:

[0009] a plurality of support portions that abut against the peripheral portion of the substrate and are used to rotate the substrate;

[0010] a pair of driven portions provided with a plurality of support portions;

[0011] A connecting part movably connected to one driven part and movably connected to the other driven part; and

[0012] A driving part for transmitting force in such a manner that the connecting part moves linearly in the second direction,

[0013] The connecting part is configured to convert the linear force along the second direction into a force that increases or decreases the distance between a pair of driven parts.

[0014] [Concept 2]

[0015] In the substrate support device according to Concept 1 of the present invention, it can be configured that

[0016] It further includes:

[0017] A first guiding member provided on one driven part for linearly moving the one driven part in the first direction;

[0018] A second guiding member provided on the other driven part for linearly moving the other driven part in the first direction;

[0019] A first guide for guiding the first guiding member in the first direction; and

[0020] A second guide for guiding the second guiding member in the first direction.

[0021] [Concept 3]

[0022] The substrate support device according to Concept 2 of the present invention may further include a base provided with the first guide and the second guide,

[0023] A long hole extending in the first direction for the support part to pass through is provided in the base.

[0024] [Concept 4]

[0025] In the substrate support device according to any one of Concepts 1 to 3 of the present invention, it can be configured that

[0026] A plurality of support parts and a plurality of first guiding members for linearly moving the one driven part in the first direction are provided on one driven part,

[0027] A plurality of support parts and a plurality of second guiding members for linearly moving the other driven part in the first direction are provided on the other driven part,

[0028] A plurality of first guiding members are provided between the support parts provided on one driven part,

[0029] A plurality of second guided members are provided between support portions provided on the other driven portion.

[0030] [Concept 5]

[0031] In the substrate support device according to any one of Concepts 1 to 4 of the present invention, it can be configured that

[0032] the connecting portion has a base end portion capable of moving in the in-plane direction of the substrate and along a second direction orthogonal to the first direction,

[0033] and the pair of arm portions are opened and closed by moving the base end portion along the second direction.

[0034] [Concept 6]

[0035] In the substrate support device according to any one of Concepts 1 to 5 of the present invention, it can be configured that

[0036] It further includes:

[0037] a first detection portion that detects a force applied from the driving portion to the connecting portion or a force applied from the driving portion to the driven portion via the connecting portion; and

[0038] a control portion that controls the driving portion so that the force detected by the first detection portion is set to a value within a first range.

[0039] [Concept 7]

[0040] In the substrate support device according to any one of Concepts 1 to 6 of the present invention, it can be configured that

[0041] the connecting portion has a pair of arm portions that open and close,

[0042] a plurality of support portions are provided on one driven portion, and each of the support portions provided on the one driven portion can swing in the in-plane direction of the substrate with respect to the one arm portion,

[0043] a plurality of support portions are provided on the other driven portion, and each of the support portions provided on the other driven portion can swing in the in-plane direction of the substrate with respect to the other arm portion.

[0044] [Concept 8]

[0045] In the substrate support device according to any one of Concepts 1 to 7 of the present invention, it can be configured that

[0046] the driving portion is a motor,

[0047] the substrate support device further includes:

[0048] a second detection portion that detects the torque of the motor; and

[0049] A control unit that controls the motor such that the torque detected by the second detection unit is set to a value within a second range.

[0050] [Concept 9]

[0051] In the substrate support device according to any one of Concepts 1 to 8 of the present invention, it can be configured that

[0052] A part of the connecting portion extends along the second direction.

[0053] The connecting portion has a pair of arm portions and a hub connecting the pair of arm portions.

[0054] The first direction and the second direction are orthogonal to each other.

[0055] The hub is moved along the second direction so as to increase or decrease the distance between the pair of driven portions.

[0056] [Concept 10]

[0057] The substrate processing apparatus of the present invention may include the substrate support device according to any one of Concepts 1 to 9 of the present invention.

[0058] [Concept 11]

[0059] A control method for a substrate support device of the present invention is a control method for a substrate support device for controlling the substrate support device according to any one of Concepts 1 to 8 of the present invention, and the control method may include:

[0060] A step of increasing the distance between the driven portions by linearly moving at least a part of the connecting portion along the first direction;

[0061] A step of placing the substrate between a plurality of support portions;

[0062] A step of reducing the distance between the driven portions by linearly moving at least a part of the connecting portion along the first direction and supporting a peripheral portion of the substrate by the support portions; and

[0063] A step of rotating the substrate by rotating the support portions.

[0064] Advantages of the Invention

[0065] In a form of the present invention, a connecting portion that connects one driven portion and the other driven portion is provided, and at least a part of the connecting portion is moved by a driving portion, so that the driven portions approach or separate linearly along the first direction. In this case, by moving the one driven portion and the other driven portion at the same timing, it is possible to less likely cause a deviation in the position (clamping position) of the substrate supported by the support portion. Moreover, even when the support portion is continuously used until it is worn out beyond a preset wear amount that would have been replaced in the past, it is possible to suppress the deviation in the position of the supported substrate. Therefore, compared with the past, the durable service time of the support portion can be made longer. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 is a bottom view of the substrate support device that can be used in the first embodiment of the present invention, viewed from the lower side.

[0067] Figure 2 is a side view of the substrate support device that can be used in the first embodiment of the present invention, viewed along the second direction, and is a diagram schematically showing a cleaning member and a cleaning liquid supply portion.

[0068] Figure 3 is a side view of the substrate support device that can be used in the first embodiment of the present invention, viewed along the first direction.

[0069] Figure 4 is a top view of the substrate support device that can be used in the first embodiment of the present invention, viewed from the upper side.

[0070] Figure 5 is a top view showing the relationship between the long hole and the support portion that can be used in the first embodiment of the present invention.

[0071] Figure 6 is a diagram showing the relationship between the first detection portion, the second detection portion, and the control portion that can be used in the first embodiment of the present invention.

[0072] Figure 7 is a bottom view of another form of the substrate support device that can be used in the first embodiment of the present invention, viewed from the lower side.

[0073] Figure 8 is a schematic top view showing the overall configuration of the substrate processing device including the substrate cleaning device in the first embodiment of the present invention.

[0074] Figure 9 is a bottom view of the substrate support device that can be used in the second embodiment of the present invention, viewed from the lower side.

[0075] Figure 10 is a side view of the substrate support device that can be used in the second embodiment of the present invention, viewed along the second direction.

[0076] 10 Support portion, 20 Connection portion, 21 Base end portion, 25 Pair of arm portions, 30 Driven portion, 31 One driven portion, 32 The other driven portion, 40 Driving portion, 50 Control portion, 61 First detection portion, 62 Second detection portion, 81 First guiding member, 82 Second guiding member, 91 Long hole, W Substrate Detailed implementation mode

[0077] First implementation mode

[0078] 《Configuration》

[0079] A first implementation mode of a substrate processing apparatus including a substrate cleaning apparatus and the like will be described.

[0080] As Figure 8 shown, the substrate processing apparatus of the present implementation mode has a substantially rectangular housing 310 and a loading port 312 on which a substrate cassette storing a plurality of substrates W is placed. The loading port 312 is disposed adjacent to the housing 310. An open wafer cassette, a SMIF (Standard Mechanical Interface) wafer cassette, or a FOUP (Front Opening Unified Pod) can be loaded on the loading port 312. The SMIF wafer cassette and the FOUP house a substrate cassette inside and are covered with a partition, whereby they become sealed containers capable of ensuring an environment independent of the external space. Examples of the substrate W include semiconductor wafers and the like.

[0081] Inside the housing 310 is housed (in Figure 8In the illustrated form (four in number), there are a plurality of polishing units 314a to 314d, a first cleaning unit 316 for cleaning the polished substrate W, a second cleaning unit 318, and a drying unit 320 for drying the cleaned substrate W. The polishing units 314a to 314d are arranged along the long side direction of the substrate processing apparatus, and the cleaning units 316, 318, and the drying unit 320 are also arranged along the long side direction of the substrate processing apparatus. According to the substrate processing apparatus of the present embodiment, in the manufacturing process of semiconductor wafers with a diameter of 300 mm or 450 mm, flat plates, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) or CCD (Charge Coupled Device), and magnetic thin films in MRAM (Magnetoresistive Random Access Memory), various substrates W can be polished. In addition, as a substrate processing apparatus of another embodiment, it may also be an apparatus that performs cleaning processing and drying processing of the substrate W without providing a polishing unit for polishing the substrate W in the housing 310.

[0082] A first transfer robot 322 is arranged in the area surrounded by the loading port 312, the polishing unit 314a on the loading port 312 side, and the drying unit 320. In addition, a transfer unit 324 is arranged in parallel with the polishing units 314a to 314d, the cleaning units 316, 318, and the drying unit 320. The first transfer robot 322 receives the substrate W before polishing from the loading port 312 and transfers it to the transfer unit 324, or receives the dried substrate W from the drying unit 320.

[0083] A second transfer robot 326 for transferring the substrate W between the first cleaning unit 316 and the second cleaning unit 318 is arranged between the first cleaning unit 316 and the second cleaning unit 318, and a third transfer robot 328 for transferring the substrate W between the second cleaning unit 318 and the drying unit 320 is arranged between the second cleaning unit 318 and the drying unit 320. Moreover, a control unit 50 for controlling the dynamics of each device of the substrate processing apparatus is arranged inside the housing 310. In the present embodiment, a form in which the control unit 50 is arranged inside the housing 310 is described, but it is not limited thereto. The control unit 50 may be arranged outside the housing 310, or the control unit 50 may be remotely provided. In the case where the control unit 50 is remotely provided, each device of the substrate processing apparatus is remotely controlled.

[0084] As the first cleaning unit 316, a roll cleaning device can be used. In the presence of a cleaning liquid, the roll cleaning device contacts a roll cleaning member that extends linearly over almost the entire length of the diameter of the substrate W, and while rotating about a central axis parallel to the substrate W, frictionally cleans the surface of the substrate W. For example, the substrate W can be held and rotated in a horizontal direction, a vertical direction, or a direction inclined with respect to the horizontal direction, while the roll cleaning member is brought into contact with the substrate W for cleaning. Additionally, as the second cleaning unit 318, a pencil cleaning device can be used. In the presence of a cleaning liquid, the pencil cleaning device brings the contact surface of a cylindrical pencil cleaning member that extends in the vertical direction into contact, and while rotating the pencil cleaning member, moves it in one direction to frictionally clean the surface of the substrate W. Further, as the drying unit 320, a rotary drying unit can be used. The rotary drying unit sprays IPA vapor from a moving spray nozzle onto the substrate W that is held and rotated horizontally to dry the substrate W, and also rotates the substrate W at a high speed to dry the substrate W by centrifugal force.

[0085] In addition, instead of using a roll cleaning device as the first cleaning unit 316, a pencil cleaning device similar to the second cleaning unit 318 can be used, or a two-fluid jet cleaning device that cleans the surface of the substrate W by two-fluid jetting can be used. Also, instead of using a pencil cleaning device as the second cleaning unit 318, a roll cleaning device similar to the first cleaning unit 316 can be used, or a two-fluid jet cleaning device that cleans the surface of the substrate W by two-fluid jetting can be used.

[0086] In the cleaning liquid of the present embodiment, there are included rinsing liquids such as pure water (DIW), ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid with water added, hydrofluoric acid, and other chemical liquids. In the present embodiment, unless otherwise specifically limited, the cleaning liquid includes the meaning of either a rinsing liquid, a chemical liquid, or both a rinsing liquid and a chemical liquid.

[0087] As Figure 2 shown, the substrate cleaning device of the present embodiment can include: a substrate support device 100 composed of a spindle device that rotatably supports the substrate W, etc.; one or more cleaning members 200 for cleaning the substrate W; and one or more cleaning liquid supply parts 250 for supplying a cleaning liquid to the substrate W. In the present embodiment, a form of supporting the substrate W such that the in-plane direction of the substrate W is in the horizontal direction is used for explanation, but it is not limited thereto, and the in-plane direction of the substrate W can also be in the vertical direction or in a direction inclined from the horizontal direction. Additionally, Figure 2 a roll cleaning member is shown as an example of the cleaning member 200.

[0088] AsFigures 1 to 4 As shown, the substrate support device 100 may include: a plurality of support portions 10 that abut against the peripheral portion of the substrate W to rotate the substrate W; a pair of driven portions 30 provided with the plurality of support portions 10; a connecting portion 20 that connects one driven portion 31 and the other driven portion 32; and a driving portion 40 that moves the connecting portion 20 to move the pair of driven portions 30 closer to or away from each other in a first direction. The support portion 10 is a member for supporting while rotating the substrate W, such as a spindle. The pair of driven portions 30 may approach or separate linearly in the first direction. In the present embodiment, a form with four support portions 10 is used for illustration, but it is not limited thereto, and three or five or more support portions 10 may be provided, for example, six support portions 10. In the present embodiment, Figure 1 the left-right direction is referred to as the "first direction", Figure 1 the up-down direction is referred to as the "second direction", Figure 1 the normal direction of the paper surface of ( Figure 2 the up-down direction) is referred to as the "third direction". The support portion 10 of the present embodiment not only has the function of supporting the peripheral portion of the substrate W, but also has the function of holding or gripping, and also functions as a holding portion.

[0089] In the present embodiment, two support portions 10 are provided on one driven portion 31 and two support portions 10 are provided on the other driven portion 32, but it is not limited thereto. For example, in a form with six support portions 10, three support portions 10 may be provided on one driven portion 31 and three support portions 10 may be provided on the other driven portion 32. The material of the support portion 10 may be, for example, polyurethane or the like.

[0090] A support driving portion (not shown), such as a motor, for rotating the support portion 10 is provided on one support portion 10 provided on one driven portion 31, and a transmission belt (not shown) may be wound around the support portion 10 and the other (one) support portion 10 provided on one driven portion 31. In this case, the support portion 10 provided with the support driving portion becomes the driving side, and the support portion 10 wound with the transmission belt together with the support portion 10 becomes the driven side. Similarly, a support driving portion (not shown) for rotating the support portion 10 is provided on one support portion 10 provided on the other driven portion 32, and a transmission belt (not shown) may be wound around the support portion 10 and the other (one) support portion 10 provided on the other driven portion 32. In this case, the support portion 10 provided with the support driving portion also becomes the driving side, and the support portion 10 wound with the transmission belt together with the support portion 10 becomes the driven side.

[0091] As Figure 1As shown, a first guiding member 81 such as a sliding core for linearly moving the one driven part 31 in the first direction may be provided on the one driven part 31. A second guiding member 82 such as a sliding core for linearly moving the other driven part 32 in the first direction may be provided on the other driven part 32. A first guide 71 constituted by a guide rail or the like for guiding the first guiding member 81 may be provided on the base 90 (refer to Figure 2 ). Further, a second guide 72 constituted by a guide rail or the like for guiding the second guiding member 82 may be provided on the base 90.

[0092] As Figure 5 shown, a long hole 91 linearly extending in the first direction capable of realizing the movement of each of the support parts 10 may be provided on the base 90. However, it is not limited to this form, and holes of any shape may be provided in such a manner that the support parts 10 do not interfere with the base 90.

[0093] As Figure 1 shown, one arm part 26 may be provided at the central part in the long side direction of the one driven part 31, and the other arm part 27 may be provided at the central part in the long side direction of the other driven part 32. However, it is not limited to this. As Figure 7 shown, one arm part 26 may be provided at the end part in the long side direction of the one driven part 31, and the other arm part 27 may be provided at the end part in the long side direction of the other driven part 32. The central part in the long side direction of the driven parts 31, 32 refers to the region at the central position (the third region) when equally divided into five parts along the long side direction, and the end parts in the long side direction of the driven parts 31, 32 refer to the end regions (the first region from the end) when equally divided into five parts along the long side direction. Further, by providing the arm parts 26, 27 at the central parts in the long side direction of the driven parts 31, 32, the linear movement in the first direction along the driven parts 31, 32 can be smoothly performed, and furthermore, the accuracy of the support position of the support part 10 with respect to the substrate W can be improved.

[0094] As Figure 1 shown, the connecting part 20 may have a base end part 21 capable of linearly moving in a second direction orthogonal to the first direction in the in-plane direction of the substrate W. The pair of arm parts 25 may be opened and closed by linearly moving the base end part 21 in the second direction. The connecting part 20 may also have a hub 29 connected to the end parts of the pair of arm parts 25. Further, instead of providing the base end part 21, the hub 29 may be directly connected to the driving part 40.

[0095] A plurality of (in Figure 1In the middle are two first guided members 81. A plurality of (two in Figure 1 the case of) second guided members 82 for linearly moving the other driven part 32 in the first direction may be provided on the other driven part 32.

[0096] A plurality of first guided members 81 may be provided between the support parts 10 provided on one driven part 31, and the support parts 10 may be provided on both side parts of the first guided member 81 when viewed in the first direction. In addition, a plurality of second guided members 82 may be provided between the support parts 10 provided on the other driven part 32, and the support parts 10 may be provided on both side parts of the second guided member 82 when viewed in the first direction.

[0097] As Figure 1 shown, the connecting part 20 may have a pair of openable and closable arm parts 25. The support part 10 provided on one driven part 31 may also be configured to be able to swing (be able to oscillate) in the in-plane direction of the substrate W relative to one arm part (first arm part) 26. The support part 10 provided on the other driven part 32 may also be configured to be able to swing (be able to oscillate) in the in-plane direction of the substrate W relative to the other arm part (second arm part) 27. In this case, for example, as Figure 2 shown, the mechanism in the lower region of Figure 2 can be used to move the support part 10 in the first direction, and the mechanism in the upper region of Figure 2 can be used to swing (be able to oscillate) the support part 10.

[0098] As Figure 6 shown, a first detection part 61 for detecting the force applied from the drive part 40 to the connecting part 20 may also be provided. The first detection part 61 can communicate with the control part 50, and the drive part 40 can be controlled by the control part 50 so that the force detected by the first detection part 61 becomes a value within a first range. The correlation between the force detected by the first detection part 61 and the force actually applied to the substrate W can be measured in advance and stored in the storage part 55. In this case, for example, the control part 50 can be used to estimate the force actually applied to the substrate W based on the force detected by the first detection part 61.

[0099] The driving unit 40 may also be a motor. A second detection unit 62 for detecting the torque of the motor may also be provided. The control unit 50 may control the driving unit 40, i.e., the motor, in such a way that the torque detected by the second detection unit 62 is set to a value within a second range. The driving unit 40 may be a cylinder such as an air cylinder. In this case, it may also be configured to detect the pressure of a gas such as air applied from the cylinder by the second detection unit 62. In addition, when the torque of the motor is detected by the second detection unit 62, the first detection unit 61 for detecting the force applied to the connecting portion 20 may not be provided. However, by further providing the first detection unit 61 on the basis of the second detection unit 62, high-precision control can be achieved with less susceptibility to external interference.

[0100] The correlation between the torque and other information detected by the second detection unit 62 and the actual force applied to the substrate W can be measured in advance and stored in the storage unit 55. In this case, the actual force applied to the substrate W can be estimated, for example, by the control unit 50 based on the torque and other information detected by the second detection unit 62.

[0101] If the base end portion 21 of the connecting portion 20 is moved by the driving unit 40 to Figure 1 and Figure 7 below, the interval between the support portions 10 becomes narrower, and the substrate W is held by the support portions 10. Conversely, if the base end portion 21 of the connecting portion 20 is moved by the driving unit 40 to Figure 1 and Figure 7 above, the interval between the support portions 10 becomes wider, and the substrate W is released (loosened) from the support portions 10.

[0102] 《Method》

[0103] An example of a substrate cleaning method using the substrate support device 100 of the present embodiment is described below. In addition, since it repeats the above, only a simple description is given, but all the forms described above in "Configuration" can be applied in the "Method". Conversely, all the forms described in the "Method" can be applied in the "Configuration". In addition, a program for implementing the method of the present embodiment can be recorded on a recording medium, and by a computer reading this recording medium, the method of the present embodiment can be implemented by a substrate processing device.

[0104] First, by moving the connecting portion 20 by the driving unit 40 to Figure 1 and Figure 7 above, the pair of driven units 30 are linearly separated in the first direction (the distance between the pair of driven units 30 is increased) so as to be able to receive the substrate W. In addition, when the substrate W is already held by the support portions 10, in this way, by moving the connecting portion 20 by the driving unit 40 to Figure 1 and Figure 7Above it, the processed substrate W can be removed by the transfer unit 324 or the transfer robots 326, 328.

[0105] Next, the transfer unit 324 or the transfer robots 326, 328 are used to position the next substrate W to be cleaned between the support portions 10.

[0106] Then, by moving the connecting portion 20 to Figure 1 and Figure 7 below by the driving unit 40, a pair of driven portions 30 linearly approach in the first direction (reduce the distance between the pair of driven portions 30), and the peripheral portion of the substrate W is supported (held) by the support portions 10.

[0107] In this way, when the substrate W is supported (held) by the support portions 10, the substrate W rotates through the support portions 10.

[0108] Then, in this way, while supplying a cleaning liquid to the surface of the rotating substrate W, a cleaning member 200 such as a roller cleaning member or a pen-shaped cleaning member is pressed, whereby the surface of the substrate W is cleaned.

[0109] When the cleaning process of the substrate W is completed, the driving unit 40 moves the connecting portion 20 to Figure 1 and Figure 7 above, whereby a pair of driven portions 30 linearly separate in the first direction, and the processed substrate W can be removed by the transfer unit 324 or the transfer robots 326, 328.

[0110] "Effect"

[0111] Next, the effects of the present embodiment configured as described above and the parts not yet described will be mainly described. Even when not described in the "Configuration", all configurations described in the "Effect" can be adopted in the present invention.

[0112] A connecting portion 20 that connects one driven portion 31 and the other driven portion 32 is provided, and the connecting portion 20 is moved by the driving unit 40. Thus, in the case of adopting a form in which a pair of driven portions 30 linearly approach or separate in the first direction, the one driven portion 31 and the other driven portion 32 can be moved at the same timing, and the deviation of the position (clamping position) where the substrate W is supported by the support portions 10 is less likely to occur.

[0113] A substrate guide member 15 for restricting the in-plane movement of the substrate W when the substrate W is transferred to the peripheral portion of the support portion 10 may be provided (refer to Figure 4)。As in the past, two support portions on one side are fixed in such a way that they do not move in the in-plane direction of the substrate W to form a fixed-side clamping mechanism, and the two support portions on the other side form a driving-side clamping mechanism that moves in the in-plane direction of the substrate W. In this configuration, when the substrate guide member 15 is employed, if the support portions are worn, the substrate rotates at the position where it contacts the substrate guide member 15, and the substrate guide member 15 may also be worn. In contrast, by using the configuration of the present embodiment, even if the support portions 10 are worn, the position of the substrate W is not changed significantly, so that the situation where the substrate guide member 15 is worn can be prevented. In addition, by providing such a substrate guide member 15, it is possible to prevent the substrate W after processing such as cleaning from falling into the support portions 10 and moving in the in-plane direction together with the support portions 10.

[0114] It is also conceivable to clamp the substrate W with the support portions 10 by rotating and moving (rocking) both the one driven portion 31 and the other driven portion 32 connected to the connecting portion 20 at the same timing. However, in this case, compared with the moving distance of the connecting portion 20, the moving distance of the substrate W relative to the support portions 10 is shorter, and when the support portions 10 are worn, the deviation in the timing of contact between the support portions 10 and the peripheral portion of the substrate W may become larger. In addition, sometimes the deviation in the timing of contact between the support portions 10 and the peripheral portion of the substrate W becomes larger due to the influence of the friction of the rotation axis (rocking axis). In contrast, as described above, by linearly moving the one driven portion 31 and the other driven portion 32, the moving distance of the support portions 10 relative to the connecting portion 20 can be increased, and even when the support portions 10 are worn, the deviation in the timing of contact between the support portions 10 and the peripheral portion of the substrate W can be reduced. In addition, when the one driven portion 31 and the other driven portion 32 move linearly, it is not easily affected by the friction between members such as the friction between the guided member and the guide. As a result, the deviation of the support position of the substrate W can be prevented, and furthermore, the cleaning efficiency of the substrate W can be improved.

[0115] In addition, as in the present embodiment, by adopting the configuration in which all the support portions 10 move linearly along the same first direction, all the support portions 10 perform the same simple linear movement, so that the timing of contact between the support portions 10 and the periphery of the substrate W can be matched with high precision, and furthermore, the deviation of the support position of the substrate W can be prevented.

[0116] The linear movement distance of the one driven part 31 and the other driven part 32 in the first direction can be 5 mm or less, or can be 2 mm to 3 mm. In the case of adopting this form, the movement distance of about 10 mm in the form with the conventional fixed-side clamping mechanism and the driving-side clamping mechanism can be set to such a short movement distance. By adopting such a short movement distance, even if the support part 10 moves, the substrate W can be maintained on the top surface of the support part 10. Even if the aforementioned substrate guiding member 15 is not provided, it is possible to prevent the substrate W after processing such as cleaning from falling from the top surface of the support part 10. In addition, by adopting a motor as the driving part 40, such a short movement distance can be realized more reliably. This is because, usually, when using a cylinder such as an air cylinder, the movement distance becomes larger, but by using a motor, a short movement distance can be easily realized.

[0117] A form in which the movement distance of the one driven part 31 and the movement distance of the other driven part 32 are substantially the same or the same can be adopted. In this case, it is possible to make the timing of the one driven part 31 and the other driven part 32 coming into contact with the peripheral part of the substrate W more consistent, and it is possible to make it difficult for the position of the substrate W supported by the support part 10 to shift. In addition, the movement distances being substantially the same means that the difference between the linear movement distance L1 of the one driven part 31 in the first direction and the linear movement distance L2 of the other driven part 32 in the first direction is within 5% of the longer movement distance. When L1 ≥ L2, L1 - L2 ≤ 0.05 × L1 holds, and when L1 < L2, L2 - L1 ≤ 0.05 × L2 holds.

[0118] In the case where a first guiding member 81 for linearly moving the one driven part 31 in the first direction is provided on the one driven part 31 and a second guiding member 82 for linearly moving the other driven part 32 in the first direction is provided on the other driven part 32, linear movement in the first direction can be realized with a simple configuration.

[0119] As Figure 5 shown, in the case of adopting a form in which a long hole 91 along the first direction capable of realizing the movement of each support part 10 is provided in the base 90, the support part 10 can be moved along the long hole 91, that is, along the first direction. A space can be provided between the support part 10 and the long hole 91 in the second direction so that the support part 10 and the base 90 do not contact in the second direction. In the case of adopting this form, since no frictional force is generated between the support part 10 and the base 90 in the second direction, it is possible to prevent the timing of the support part 10 coming into contact with the peripheral part of the substrate W from shifting due to the influence of the friction between the support part 10 and the base 90. In addition, by adopting the long hole 91, the area of the hole provided in the base 90 can be extremely reduced.

[0120] In the case of adopting a configuration in which a plurality of first guided members 81 are provided between the support portions 10 provided on one driven portion 31 and a plurality of second guided members 82 are provided between the support portions 10 provided on the other driven portion 32, without increasing the size along the second direction, the movement of the one driven portion 31 and the other driven portion 32 along the first direction can be more reliably achieved by the plurality of guides 71, 72 and the guided members 81, 82. That is to say, although it is also possible to consider providing the support portion 10 between the plurality of guides 71, 72, in this case, the size along the second direction will become larger. On the other hand, by adopting this configuration, an increase in the size along the second direction can be prevented. In addition, by providing the plurality of guides 71, 72 and the guided members 81, 82, compared with the configuration in which one guide 71, 72 and the guided members 81, 82 are provided, the linear movement along the first direction can be performed more reliably.

[0121] In the case of adopting a configuration in which the pair of arm portions 25 are opened and closed by linearly moving the base end portion 21 of the connecting portion 20 in a second direction orthogonal to the first direction, the one arm portion 26 and the other arm portion 27 can be opened and closed at the same timing by using such a simple driving configuration of linearly moving the base end portion 21.

[0122] In the case where the first detection portion 61 for detecting the force applied from the driving portion 40 to the connecting portion 20 is provided, by detecting the force applied from the driving portion 40 to the connecting portion 20, the force (clamping force) with which the support portion 10 supports the substrate W can also be detected. Moreover, by adopting a configuration in which the control portion 50 controls the driving portion 40 so that the force detected by the first detection portion 61 is set to a value within a first range, the supporting force of the support portion 10 for the substrate W can always be set to a value within a desired range.

[0123] In the case of adopting a configuration (swing mechanism) in which a plurality of support portions 10 provided on one driven portion 31 can swing in the in-plane direction of the substrate W with respect to one arm portion 26, the support portions 10 provided on the one driven portion 31 can be brought into contact with the peripheral portion of the substrate W respectively. Further, in the case of adopting a configuration (swing mechanism) in which a plurality of support portions 10 provided on the other driven portion 32 can swing in the in-plane direction of the substrate W with respect to the other arm portion 27, the support portions 10 provided on the other driven portion 32 can be brought into contact with the peripheral portion of the substrate W respectively. Therefore, in the case of a configuration in which there are four or more support portions 10, the peripheral portion of the substrate W can be supported by four or more support portions 10. In addition, the above swing mechanism may be provided only on one of the one driven portion 31 and the other driven portion 32. However, in the case where swing mechanisms are provided on both the one driven portion 31 and the other driven portion 32, it is beneficial in that the support portions 10 can follow the substrate W that is not perfectly circular with higher accuracy.

[0124] In the case of adopting a configuration in which the drive portion 40 is constituted by a motor, the torque of the motor is detected by the second detection portion 62, and the control portion 50 controls the motor in such a manner that the torque detected by the second detection portion 62 is set to a value within a second range, the support force of the substrate W by the support portions 10 can always be set to a value within a desired range. Since the motor has a high resolution and high control performance, by adopting such a motor, the movement of the driven portion 30 can be controlled with higher accuracy. Therefore, the timing at which the support portions 10 come into contact with the peripheral portion of the substrate W can be made consistent with higher accuracy, or the support force (holding force) of the substrate W by the support portions 10 can be controlled with higher accuracy.

[0125] As described above, by using both the first detection portion 61 and the second detection portion 62, it is possible to be less affected by external disturbances. In the case where the drive portion 40 is constituted by a motor, the first detection portion 61 can be used for primary detection, and the second detection portion 62 can be used for secondary detailed detection. In this case, after the control portion 50 confirms that the force applied to the connecting portion 20 from the drive portion 40 is within a certain range by using the first detection portion 61, the control portion 50 can start the second detection portion 62 and control it in such a manner that the torque of the motor detected by the second detection portion 62 is within a certain range.

[0126] Second Embodiment

[0127] Next, a second embodiment of the present invention will be described.

[0128] In the present embodiment, as Figure 9As shown, one arm portion 26 and the other arm portion 27 are linearly connected via the base end portion 21 provided with the drive portion 40. Moreover, by moving the one arm portion 26 and the other arm portion 27, which form a part of the connecting portion 20, linearly along the first direction by the drive portion 40, the pair of driven portions 31 and 32 can approach and separate linearly along the first direction at the same time. In addition, it can also be configured such that the one driven portion 31 and the other driven portion 32 move simultaneously and only by the same or substantially the same distance. For other configurations, the same as in the first embodiment, all the forms described in the first embodiment can be adopted. The components described in the first embodiment are denoted by the same reference numerals. The base end portion 21 of the present embodiment may also be constituted by a gripper or the like that holds the one arm portion 26 and the other arm portion 27.

[0129] In the case of adopting a configuration in which the one arm portion 26 and the other arm portion 27, which form a part of the connecting portion 20, are moved simultaneously and only by the same or substantially the same distance by the drive portion 40, and the pair of driven portions 30 approach or separate linearly along the first direction, the one driven portion 31 and the other driven portion 32 can be moved only by the same or substantially the same distance at the same timing, and it is possible to prevent the position (clamping position) of the substrate W supported by the support portion 10 from shifting.

[0130] As Figure 9 and Figure 10 shown, a first detection portion 61' may also be provided to detect the force applied from the drive portion 40 to the one driven portion 31 and / or the other driven portion 32 via the one arm portion 26 and / or the other arm portion 27 of the connecting portion 20. In addition, in Figure 9 and Figure 10 , a configuration is adopted in which the first detection portion 61' is provided between the one arm portion 26 and the one driven portion 31, but it is not limited to this configuration, and the first detection portion 61' may also be provided both between the one arm portion 26 and the one driven portion 31 and between the other arm portion 27 and the other driven portion 32.

[0131] In Figure 9 and Figure 10In the illustrated form, one arm portion 26, the other arm portion 27, one first guide member 71, and one second guide member 72 are arranged linearly in the first direction. That is, when viewed along the third direction, the one arm portion 26, the other arm portion 27, one first guide member 71, and one second guide member 72 are respectively arranged on the same straight line along the first direction. Therefore, by moving the one arm portion 26 and the other arm portion 27, the first guided member 81 can be efficiently linearly moved in the first direction along the one first guide member 71, and the second guided member 82 can be efficiently linearly moved in the first direction along the one second guide member 72.

[0132] The descriptions of the above embodiments and the disclosures of the drawings are merely examples for explaining the invention described in the patent protection scope, and do not limit the invention described in the patent protection scope by the descriptions of the above embodiments or the disclosures of the drawings. In addition, the claims initially recited in the application are merely examples, and can also be appropriately changed based on the descriptions of the specification, drawings, etc. according to the claims. The substrate support device 100 of the present embodiment can adopt various components such as IPA components, PEN components, two-fluid jet components, etc. In addition, an oblique angle cleaning device or a rotation detection mechanism of the substrate W can also be provided together with the substrate support device. The above description only discloses exemplary embodiments of the present invention. Changes to the above devices and methods included within the scope of the present invention are easy and obvious to those skilled in the art. The present invention is disclosed in connection with its exemplary embodiments, and it can be understood that other embodiments are included within the scope of the present invention defined by the claims.

Claims

1. A substrate support device, comprising: A plurality of support portions that abut against the peripheral portion of the substrate and are used to rotate the substrate; A pair of driven portions provided with a plurality of support portions; A connecting portion that is movably connected to one driven portion and is movably connected to the other driven portion; A driving portion that causes each of the driven portions to linearly approach or separate along a first direction orthogonal to the second direction by moving at least a part of the connecting portion in the second direction; A first guiding member provided on one driven portion and used to linearly move the one driven portion in the first direction; A second guiding member provided on the other driven portion and used to linearly move the other driven portion in the first direction; A first guide that guides the first guiding member in the first direction; A second guide that guides the second guiding member in the first direction; and A base provided with the first guide and the second guide, A plurality of long holes through which the support portions pass are provided in the base, and the plurality of long holes extend in the same direction along the first direction, Rotate the substrate in a state where the driven portions are close to each other.

2. A substrate support device, comprising: A plurality of support portions that abut against the peripheral portion of the substrate and are used to rotate the substrate; A pair of driven portions provided with a plurality of support portions; A connecting portion that is movably connected to one driven portion and is movably connected to the other driven portion; and A driving portion that causes each of the driven portions to linearly approach or separate along a first direction by moving at least a part of the connecting portion, The connecting portion has a base end portion capable of moving in the in-plane direction of the substrate and along a second direction orthogonal to the first direction, By moving the base end portion in the second direction, a pair of arm portions are opened and closed, and each of the driven portions linearly approaches or separates along the first direction, Rotate the substrate in a state where the driven portions are close to each other.

3. The substrate support device according to claim 1 or 2, wherein A plurality of support portions and a plurality of first guiding members for linearly moving the one driven portion in the first direction are provided on one driven portion, A plurality of support portions and a plurality of second guiding members for linearly moving the other driven portion in the first direction are provided on the other driven portion, A plurality of first guiding members are provided between the support portions provided on one driven portion, A plurality of second guiding members are provided between the support portions provided on the other driven portion.

4. The substrate support device according to claim 1 or 2, wherein It further comprises: A first detection portion that detects the force applied to the connecting portion by the driving portion or the force applied to the driven portion by the driving portion via the connecting portion; And A control portion that controls the driving portion so that the force detected by the first detection portion is set to a value within a first range.

5. The substrate support device according to claim 1, wherein The connecting portion has a pair of arm portions that open and close, A plurality of support portions are provided on one driven portion, and each of the support portions provided on the one driven portion can rock relative to the one arm portion in the in-plane direction of the substrate. A plurality of support portions are provided on the other driven portion, and each of the support portions provided on the other driven portion can rock relative to the other arm portion in the in-plane direction of the substrate.

6. The substrate support device according to claim 1 or 2, wherein the drive portion is a motor, the substrate support device further includes: a second detection portion that detects the torque of the motor; and a control portion that controls the motor such that the torque detected by the second detection portion is set to a value within a second range.

7. A control method for a substrate support device that controls the substrate support device according to claim 1 or 2, the control method for the substrate support device including: a step of increasing the distance between the driven portions by linearly moving at least a part of the connecting portion along the first direction; a step of placing the substrate between the plurality of support portions; a step of reducing the distance between the driven portions by linearly moving at least a part of the connecting portion along the first direction and supporting a peripheral portion of the substrate by the support portions; and a step of rotating the substrate by rotating the support portions.

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