Coil assembly

Abstract

The present disclosure provides a coil component, the coil component comprising: a main body having one surface and another surface facing away from each other, and one side surface and another side surface respectively connecting the one surface and the other surface to each other and facing away from each other in one direction; a winding coil embedded in the main body; a lead portion extending from an end of the winding coil to the one surface of the main body and disposed on the one surface of the main body; an insulating layer covering the one surface of the main body and having an opening that exposes part of the lead portion and extends along the one direction; and an external electrode disposed in the opening and connected to the lead portion. The insulating layer includes finishing portions respectively disposed on opposite sides of the opening in the one direction.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0044183 filed on April 16, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] As an example of a coil component, there is provided a wound coil component using a magnetic molded body and a wound coil.

[0004] In the case of a wound coil component, an insulating layer is formed on a surface of the component to prevent a short circuit, and openings are formed in the insulating layer so that an external electrode and both ends of the wound coil can be connected to each other.

[0005] On the other hand, such an opening is formed by mechanically polishing the portion of the insulating layer formed on the surface of the component. Because the entire width direction of the insulating layer of the component is polished due to the mechanical polishing characteristics, and the surface of the component is polished together, the insulating characteristics of the component are reduced. Summary of the invention

[0006] An aspect of the present disclosure is to provide a coil component having improved insulation characteristics of a body.

[0007] According to one aspect of the present disclosure, a coil component includes: a main body having one surface and another surface facing away from each other, and one side surface and another side surface respectively connecting the one surface and the other surface to each other and facing away from each other in one direction; a winding coil embedded in the main body; a lead portion extending from an end of the winding coil to the one surface of the main body and arranged on the one surface of the main body; an insulating layer covering the one surface of the main body and having an opening that exposes part of the lead portion and extends along the one direction; and an external electrode arranged in the opening and connected to the lead portion. The insulating layer includes finishing portions respectively arranged on opposite sides of the opening in the one direction.

[0008] According to one aspect of the present disclosure, a coil component includes: a molding part having one surface and another surface facing away from each other; a winding coil disposed on the other surface of the molding part; a covering part disposed on the other surface of the molding part to cover the winding coil; a lead part connected to the winding coil and exposed from the one surface of the molding part; and an insulating layer disposed on the one surface of the molding part and having an opening extending along the width direction of the molding part to expose part of the lead part. The insulating layer includes a finishing part disposed on opposite sides of the opening in the width direction of the molding part.

[0009] According to one aspect of the present disclosure, a coil component includes: a body; a winding coil embedded in the body; a lead portion extending from an end of the winding coil and exposed from one surface of the body; an insulating layer covering the one surface of the body and having an opening that partially exposes the lead portion; and an external electrode disposed in the opening and connected to the lead portion. The body includes magnetic metal powder particles covered by an insulating film, and the insulating film separating the magnetic metal powder particles from the external electrode is in direct contact with the external electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a perspective view schematically showing a coil component according to an embodiment of the present disclosure;

[0012] Figure 2 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0013] Figure 3 is a bottom plan view schematically showing a coil component according to an embodiment of the present disclosure;

[0014] Figure 4 It is shown from Figure 3 A diagram of a structure in which part of the structure is omitted;

[0015] Figure 5 It is along Figure 4 A partial enlarged cross-sectional view taken along line II-II';

[0016] Figure 6 Schematically shows Figure 1 A molded portion; and

[0017] Figure 7 2 is a schematic diagram showing a modified example of the coil component according to the embodiment of the present disclosure. DETAILED DESCRIPTION

[0018] The following detailed description is provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, various variations, modifications and equivalents of the methods, devices and / or systems described herein will be apparent to those of ordinary skill in the art. The order of operations described herein is merely exemplary and is not limited to the order set forth herein, but changes may be made that will be apparent to those of ordinary skill in the art, except for operations that must occur in a particular order. In addition, descriptions of functions and configurations that are well known to those of ordinary skill in the art may be omitted for clarity and brevity.

[0019] The terms used herein are only used to describe specific embodiments, and the present disclosure is not limited thereto. As used herein, unless the context clearly states otherwise, the singular form is also intended to include the plural form. It will be further understood that the terms "comprise", "include" and / or "have" (when used in the specification) list the existence of stated features, integers, steps, operations, components, elements and / or their groups, but do not exclude the existence or addition of one or more other features, integers, steps, operations, components, elements and / or their groups.

[0020] Throughout the specification, it will be understood that when an element (such as a layer, region, or wafer (substrate)) is referred to as being "on", "connected to", or "bonded to" another element, the element may be directly "on", "connected to", or "bonded to" another element, or there may be other elements between them. In contrast, when an element is referred to as being "directly on", "directly connected to", or "directly bonded to" another element, there may be no elements or layers between them. Similar references always refer to similar elements. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0021] In addition, the term "combination" is used not only for the case of direct physical contact between corresponding constituent elements in the contact relationship between constituent elements, but also for the case where other constituent elements are inserted between the constituent elements so that they are respectively in contact with each other, and the term "combination" is used as a comprehensive concept.

[0022] The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.

[0023] In the drawings, the L direction may be defined as a first direction or a length direction, the W direction as a second direction or a width direction, and the T direction as a third direction or a thickness direction.

[0024] Hereinafter, a coil component according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions thereof will be omitted.

[0025] Various types of electronic components are used in electronic devices. Various types of coil components can be appropriately used between these electronic components to remove noise, etc.

[0026] For example, a power inductor, a high frequency inductor (HF Inductor), a common magnetic bead, a high frequency magnetic bead (GHz Bead), a common mode filter, etc. can be used as a coil component in an electronic device.

[0027] Figure 1 is a perspective view schematically showing a coil component according to an embodiment. Figure 2 It is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 3 is a bottom plan view schematically showing a coil component according to an embodiment. Figure 4 It is shown from Figure 3 An illustration of a structure in which part of the structure is omitted. Figure 5 It is along Figure 4 A partially enlarged cross-sectional view taken along line II-II'. Figure 6 Schematically shows Figure 1 The molding part. Figure 7 : is a schematic diagram showing a modified example of the coil component according to the embodiment.

[0028] Reference Figures 1 to 7 The coil component 1000 according to the embodiment includes a body B, a wound coil 300, lead parts 410 and 420, an insulating layer 500, openings O and O', and external electrodes 600 and 700. The body B includes a molding part 100 and a covering part 200. The molding part 100 may include a core 110.

[0029] The body B forms an exterior shape of the coil component 1000 according to the embodiment, and the wound coil 300 is embedded in the body B.

[0030] The body B may be formed in an overall hexahedral shape.

[0031] Reference Figure 1, the body B has a first surface 101 and a second surface 102 facing each other in the length direction L, a third surface 103 and a fourth surface 104 facing each other in the width direction W, and a fifth surface 105 and a sixth surface 106 facing each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body B corresponds to a wall surface of the body B that connects the fifth surface 105 and the sixth surface 106 of the body B. The two end surfaces of the body B may refer to the first surface 101 and the second surface 102 of the body B, the two side surfaces of the body B may refer to the third surface 103 and the fourth surface 104 of the body B, and one surface and the other surface of the body B may refer to the sixth surface 106 and the fifth surface 105 of the body B, respectively.

[0032] The body B may be formed in such a manner that the coil component 1000 including the external electrodes 600 and 700 to be described later according to the embodiment has a length of 2.0 mm or less, a width of 1.2 mm or less, and a thickness of 0.80 mm or less, but the embodiment is not limited thereto.

[0033] The body B includes a molding portion 100 and a covering portion 200. Figure 1 and Figure 2 , the cover part 200 is disposed on the upper portion of the mold part 100 and surrounds all surfaces of the mold part 100 except the lower surface of the mold part 100. Therefore, the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, and the fifth surface 105 of the body B are formed by the cover part 200, and the sixth surface 106 of the body B is formed by the mold part 100 and the cover part 200.

[0034] The molded part 100 has one surface and another surface facing each other. The molded part 100 supports the winding coil 300 which will be described later and is arranged on the other surface. The molded part 100 includes a core 110. The core 110 is arranged at the central part of the other surface of the molded part 100 in such a manner as to penetrate the winding coil 300. One surface of the molded part 100 constitutes a part of the sixth surface 106 of the body B.

[0035] The covering part 200 covers the molding part 100 and the winding coil 300 to be described later. The covering part 200 may be disposed on the molding part 100 and the winding coil 300 and then pressed to be coupled to the molding part 100.

[0036] At least one of the molded part 100 and the covering part 200 includes a magnetic material. In this embodiment, both the molded part 100 and the covering part 200 include a magnetic material. As an example, the molded part 100 can be formed by filling a mold for forming the molded part 100 with a magnetic material. As another example, the molded part 100 can be formed by filling a mold with a composite material containing a magnetic material and an insulating resin. A molding process in which high temperature and high pressure are applied to the magnetic material or composite material in the mold can be performed in addition, but embodiments thereof are not limited thereto. The molded part 100 and the core 110 can be formed integrally by a mold and there may be no boundary between them. The covering part 200 can be formed by dispersing a magnetic composite sheet in an insulating resin with a magnetic material on the molded part 100 and the winding coil 300, and then by heating and pressurizing.

[0037] The magnetic material may be ferrite or magnetic metal powder particles 10 .

[0038] Ferrite powder can be formed using one or more of the following ferrites: spinel ferrites such as Mg-Zn ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Cu-Zn ferrite, Mg-Mn-Sr ferrite, Ni-Zn ferrite, etc., hexagonal ferrites such as Ba-Zn ferrite, Ba-Mg ferrite, Ba-Ni ferrite, Ba-Co ferrite, Ba-Ni-Co ferrite, etc., garnet ferrites such as Y-type ferrite, and Li-based ferrite.

[0039] The magnetic metal powder particles 10 may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic metal powder particles 10 may be one or more of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, and Fe-Cr-Al alloy powder.

[0040] In the following description, a case where the magnetic metal powder particles 10 are magnetic metal powder is described, but embodiments thereof are not limited thereto.

[0041] The magnetic metal powder particles 10 may be amorphous or crystalline. For example, the magnetic metal powder particles 10 may be Fe-Si-B-Cr amorphous alloy powder, but are not limited thereto.

[0042] The magnetic metal powder particles 10 may have an average diameter of about 0.1 μm to 30 μm, but the particle size thereof is not limited thereto.

[0043] The insulating film 11 is formed on the surface of the magnetic metal powder particle 10. The magnetic metal powder particle 10 has conductivity, and the insulating film 11 surrounds the surface of the magnetic metal powder particle 10 to prevent the short circuit of the magnetic metal powder particle 10. The insulating film 11 may include, but is not limited to, epoxy resin, polyimide, liquid crystal polymer, etc. alone or in combination. For example, as long as the insulating film 11 can be formed on the surface of the magnetic metal powder particle 10 using an electrically insulating material, its material and formation method may be variously changed.

[0044] Each of the molding part 100 and the covering part 200 may include two or more kinds of magnetic materials. In this case, the term "different kinds of magnetic materials" means that the magnetic materials are distinguishable from each other by any one of average diameter, composition, crystallinity, and shape.

[0045] The insulating resin may include, alone or in combination, but is not limited to, epoxy resin, polyimide, liquid crystal polymer, and the like.

[0046] The wound coil 300 is embedded in the body B to demonstrate the characteristics of the coil component. For example, when the coil component 1000 according to the embodiment is used as a power inductor, the wound coil 300 can be used to stabilize the power supply of the electronic device by storing the electric field as a magnetic field to maintain the output voltage.

[0047] The winding coil 300 is disposed on the other surface of the molded portion 100. In detail, the winding coil 300 is disposed on the other surface of the molded portion 100 in a form of being wound around the core 110.

[0048] The winding coil 300 is an air core coil and can be formed using a wire having a rectangular cross section. The winding coil 300 can be formed by spirally winding a metal wire such as a copper wire whose surface is covered with an insulating film IF. As a result, the winding coil 300 in turns is covered with the insulating film IF.

[0049] The winding coil 300 may include multiple layers. Each layer of the winding coil 300 is formed in a planar spiral shape and has multiple turns. For example, the winding coil 300 forms the innermost turn, at least one middle turn, and the outermost turn from the center of the other surface of the molded part 100.

[0050] Lead portions 410 and 420 extend from one end of the winding coil 300 to one surface 106 of the main body B, and are arranged on one surface 106 of the main body B in a direction W. In detail, the first lead portion 410 extends from one end of the winding coil 300 to the sixth surface 106 of the main body B. The second lead portion 420 extends from the other end of the winding coil 300 to the sixth surface 106 of the main body B. The first lead portion 410 and the second lead portion 420 have a form extending along the width direction W of the main body B on the sixth surface 106 of the main body B, respectively, and are spaced apart from each other on the sixth surface 106 of the main body B in the length direction L of the main body B. The first lead portion 410 and the second lead portion 420 may be the remaining portion remaining after the winding coil 300 is formed using a metal wire such as a copper wire whose surface is coated with an insulating film IF. As a result, no boundary is formed between the first lead portion 410 and the winding coil 300 and between the second lead portion 420 and the winding coil 300. In addition, similar to the winding coil 300, an insulating film IF is formed on the surface of the first lead portion 410 and the second lead portion 420. A portion of the insulating film IF of the first lead portion 410 and the second lead portion 420 may be removed for connection between the first lead portion 410 and the second lead portion 420 and the external electrodes 600 and 700.

[0051] The first lead portion 410 and the second lead portion 420 are exposed to the sixth surface 106 of the body B. Figure 2 and Figure 6As shown in , as an example, the molded part 100 is provided with grooves R and R' formed along the side surface and one surface of the molded part 100, and the first lead part 410 and the second lead part 420 may be respectively disposed in the grooves R and R'. The first lead part 410 and the second lead part 420 extend outward from the winding coil 300 toward one of the third surface 103 and the fourth surface 104, respectively, and pass through the grooves R and R' so that the end of the first lead part 410 and the end of the second lead part 420 are exposed from the sixth surface 106. Since the covering part 200 fills the portion of the grooves R and R' to cover the portion of the first lead part 410 disposed in the groove R and the portion of the second lead part 420 disposed in the groove R', the first lead part 410 and the second lead part 420 are spaced apart from the third surface 103 and the fourth surface 104. Although the embodiment shows that the grooves R and R' are disposed on the same side of the molded part 100 (for example, both adjacent to the third surface 103), the present disclosure is not limited thereto. For example, the grooves R and R' may be formed on opposite sides of the molded portion 100, one adjacent to the third surface 103 and the other adjacent to the fourth surface 104. In this case, the first lead portion 410 and the second lead portion 420 may extend outward from the winding coil 300 toward the third surface 103 and the fourth surface 104, respectively, and pass through the grooves R and R'. As another example, the grooves R and R' may have the form of a through-hole structure penetrating the molded portion 100, so that the first lead portion 410 and the second lead portion 420 may penetrate the molded portion 100 to be exposed through one surface of the molded portion 100. The grooves R and R' may be formed in a process of forming the molded portion 100 using a mold, or may be formed in the molded portion 100 in a process of pressing the covering portion 200. In the latter case, the grooves R and R' are formed to have a shape corresponding to the shape of the lead portions 410 and 420.

[0052] The insulating layer 500 covers one surface 106 of the body B. In addition, the insulating layer 500 may also be disposed on the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, and the fifth surface 105 of the body B. The insulating layer 500 disposed on the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, and the fifth surface 105 of the body B and the insulating layer 500 disposed on the sixth surface 106 of the body B may be formed in the same process and using the same material, and therefore, there may be no distinguishable boundary between them, but the embodiment is not limited thereto. For example, the insulating layer 500 formed on the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body B and the insulating layer 500 formed on the sixth surface 106 of the body B may be formed in different processes so that a boundary is formed between them.

[0053] The openings O and O' are provided in the insulating layer 500 so that the portions of the lead portions 410 and 420 on the sixth surface 106 are exposed and extend in the width direction W. The external electrodes 600 and 700, which will be described later, are formed in the openings O and O', and the external electrodes 600 and 700 and the lead portions 410 and 420 are connected to each other. The openings O and O' may be formed by removing a portion of the insulating layer 500 so that the portion of each of the lead portions 410 and 420 provided on the sixth surface 106 of the body B is exposed. The openings O and O' do not extend to both ends of the insulating layer 500 in the width direction W to expose a portion of each of the lead portions 410 and 420. As a result, in the case of this embodiment, the insulating layer 500 includes a central portion 510 provided between the external electrodes 600 and 700, which will be described later, and finishing portions 520 provided on the outer sides of the two ends of the openings O and O' which are opposite to each other in the width direction W. The external electrodes 600 and 700 do not extend to edge regions between the sixth surface 106 and the third and fourth surfaces 103 and 104 of the body B. That is, edge regions between the sixth surface 106 and the third and fourth surfaces 103 and 104 of the body B are spaced apart from the external electrodes 600 and 700 .

[0054] The openings O and O' may be formed in the insulating layer 500 by a process such as laser, sandblasting, etc. In the case of mechanical polishing in the related art, a portion of the insulating layer 500 located between both ends of the insulating layer 500 in the width direction W may not be selectively removed. In the case of the above-mentioned laser or sandblasting, a portion of the insulating layer 500 located between both ends of the insulating layer 500 in the width direction W may be selectively removed.

[0055] Reference Figure 5In this embodiment, the insulating film 11 remains on the surface of the magnetic metal powder particles 10 exposed on the sixth surface 106 of the body B. When the opening is formed by mechanical polishing, the portion of each of the magnetic metal powder particles 10 and the insulating film 11 exposed on the sixth surface 106 of the body B is removed together with the portion of the insulating layer 500. In this case, the breakdown voltage (BFD) of the body B is reduced, which may reduce the reliability of the component. However, in this embodiment as described above, since the openings O and O' are formed in the insulating layer 500 using laser or sandblasting, only the insulating layer 500 can be selectively removed. As a result, the magnetic metal powder particles 10 exposed on the sixth surface 106 of the body B and the insulating film 11 on the surface of the magnetic metal powder particles 10 are not deformed, so that the reliability of the component can be improved. This insulating film 11 is different from the insulating layer of the magnetic metal powder particles 10 that is formed separately to cover the insulating film 11 of the magnetic metal powder particles 10 that is exposed to the outside after the mechanical polishing of the related art removes the magnetic metal powder particles 10. As an example, as described above, since such an insulating layer is defined by the insulating film 11 , the insulating layer and the insulating film 11 may be distinguishable from each other.

[0056] The external electrodes 600 and 700 are disposed in the openings O and O' to be connected to the lead portions 410 and 420, respectively. In this case, the external electrodes 600 and 700 filling the openings O and O' are in contact with the insulating film 11 of the magnetic metal powder particles 10. Since the insulating film 11 located on the magnetic metal powder particles 10 is retained after the insulating layer 500 is selectively removed by laser or sandblasting, the insulating film 11 is in direct contact with the portions of the external electrodes 600 and 700 disposed on the insulating film 11. In detail, the first external electrode 600 is disposed in the opening O to be connected to the first lead portion 410, and the second external electrode 700 is disposed in the opening O' to be connected to the second lead portion 420. The first external electrode 600 and the second external electrode 700 are spaced apart from each other on the sixth surface 106 of the body B.

[0057] The first and second external electrodes 600 and 700 may be formed using a material selected from the group consisting of conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), alloys thereof, etc., but the materials are not limited thereto.

[0058] The first external electrode 600 and the second external electrode 700 may have a single-layer or multi-layer structure. For example, the first external electrode 600 may include a first layer including copper (Cu), a second layer disposed on the first layer and including nickel (Ni), and a third layer disposed on the second layer and including tin (Sn). Each of the first to third layers may be formed by electroplating, but embodiments are not limited thereto. Each of the first external electrode 600 and the second external electrode 700 may include a conductive resin layer and an electroplating layer. The conductive resin layer may be formed by applying and curing a conductive paste containing an insulating resin such as an epoxy resin and a conductive powder containing silver (Ag) and / or copper (Cu).

[0059] At least portions of the external electrodes 600 and 700 may extend onto the insulating layer 500. As an example, in the case where the external electrodes 600 and 700 include a conductive resin layer and a plating layer, after the conductive resin layer is formed to fill at least portions of the openings O and O', the plating layer may be formed on the insulating layer 500. In this case, the plating layer fills the remaining volume of the openings O and O' and then extends onto the insulating layer 500 due to plating diffusion. When at least portions of the external electrodes 600 and 700 extend onto the insulating layer 500, the exposed area of ​​the external electrodes 600 and 700 increases, and thus the bonding force with solder or the like during mounting may be increased.

[0060] Reference Figure 7 , each of the external electrodes 600 and 700 may be formed as a plurality of external electrodes spaced apart from each other in the width direction W of the body B. In detail, in this modified example, in the insulating layer 500, each of the openings O and O' may be formed as a plurality of openings spaced apart from each other in the width direction W. In this case, the external electrodes 600 and 700 may be formed in the plurality of openings O and O', respectively, so that each of the external electrodes 600 and 700 is provided as a plurality of external electrodes 600 and 700 spaced apart from each other in the width direction W of the body B. In this case, the finishing portion 520 of the insulating layer 500 is provided not only on the outer side of the outermost openings O and O' in the width direction W, but also between the plurality of openings O and O'. In this modified example, the actual area of ​​the exposed surface of the external electrodes 600 and 700 may be reduced while maintaining the effective area of ​​the exposed surface of the external electrodes 600 and 700. Therefore, in the case of mounting on a mounting substrate, the total volume of the solder may be reduced while maintaining the mounting reliability between the substrates.

[0061] As described above, according to the embodiment, the insulation property of the body can be improved.

[0062] Although the present disclosure includes specific examples, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered as descriptive only and not for limiting purposes. The description of the features or aspects in each example will be considered to be applicable to similar features or aspects in other examples. Appropriate results may be obtained if the described techniques are performed in a different order, and / or if the components in the described systems, architectures, devices, or circuits are combined in different ways and / or replaced or supplemented with other components or their equivalents in the described systems, architectures, devices, or circuits. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents will be interpreted as being included in the present disclosure.

Claims

1. A coil assembly, comprising: a main body having one surface and another surface facing away from each other, and one side surface and another side surface respectively connecting the one surface and the other surface to each other and facing away from each other in one direction; a winding coil embedded in the body; a lead portion extending from an end of the wound coil to the one surface of the body and disposed on the one surface of the body; an insulating layer covering the one surface of the body and having an opening exposing a portion of the lead portion and extending along the one direction; as well as an external electrode disposed in the opening and connected to the lead portion, wherein the insulating layer includes first finishing portions respectively disposed on opposite sides of the opening in the one direction, and Part of the first finishing portion is in contact with the lead portion.

2. The coil assembly according to claim 1, wherein: The openings include a first opening and a second opening that respectively expose ends of the lead parts.

3. The coil assembly according to claim 2, wherein: The insulating layer further includes a second finishing portion disposed between the first opening and the second opening.

4. The coil assembly according to claim 2, wherein: The external electrodes include first and second external electrodes disposed in the first and second openings, respectively.

5. The coil assembly according to claim 1, wherein: The body comprises magnetic metal powder particles, and An insulating film is provided on exposed surfaces of the magnetic metal powder particles in a region exposed to the one surface of the body, the region corresponding to the opening.

6. The coil assembly according to claim 5, wherein: The insulating film surrounds the surfaces of the magnetic metal powder particles.

7. The coil assembly according to claim 1, wherein: The body includes magnetic metal powder particles covered by an insulating film separating the magnetic metal powder particles from the insulating layer.

8. The coil assembly according to claim 7, wherein: The insulating film separating the magnetic metal powder particles from the insulating layer is in direct contact with the insulating layer.

9. The coil assembly according to claim 1, wherein: The body includes magnetic metal powder particles covered by an insulating film, the insulating film being exposed through the opening.

10. The coil assembly according to claim 9, wherein: The insulating film separates the magnetic metal powder particles from the external electrode, and the insulating film is in direct contact with the external electrode.

11. The coil assembly according to claim 1, wherein: At least a portion of the external electrode extends onto the insulating layer.

12. The coil assembly according to claim 1, wherein: A groove corresponding to the lead portion is provided on the one surface of the body.

13. The coil assembly according to claim 1, wherein: The body includes a molded portion and a covering portion provided on the molded portion, and The winding coil is disposed between the molding portion and the covering portion.

14. The coil assembly according to claim 1, wherein: The insulating layer also covers the one side surface and the other side surface, the other surface, and an end surface connecting the one side surface and the other side surface to each other.

15. A coil assembly, comprising: a molded portion having one surface and another surface facing away from each other; a winding coil disposed on the other surface of the molded portion; a covering portion disposed on the other surface of the molding portion to cover the wound coil; a lead portion connected to the wound coil and exposed from the one surface of the molded portion; as well as an insulating layer disposed on the one surface of the molding portion and having an opening extending along a width direction of the molding portion to expose a portion of the lead portion, wherein the insulating layer includes finishing portions provided on opposite sides of the opening in the width direction of the molding portion, and Part of the finishing portion is in contact with the lead portion.

16. The coil assembly according to claim 15, wherein: The molded portion has a groove in which the lead portion is disposed, and The covering portion fills a portion of the groove to cover the lead portion.

17. A coil assembly, comprising: A main body, comprising a molding portion and a covering portion disposed on the molding portion; a winding coil embedded in the body and disposed between the molding portion and the covering portion; a lead portion extending from an end of the wound coil and exposed from one surface of the body; an insulating layer covering the one surface of the body and having an opening exposing a portion of the lead portion; as well as an external electrode disposed in the opening and connected to the lead portion, the external electrode also contacting both the mold portion and the cover portion, wherein the main body comprises magnetic metal powder particles covered by an insulating film, and The insulating film is retained on the surface of the magnetic metal powder particles exposed on the one surface of the main body, and wherein the magnetic metal powder particles exposed through the opening are separated from the external electrode by the insulating film, and the remaining magnetic metal powder particles exposed on the one surface of the main body are separated from the insulating layer by the insulating film.

18. The coil assembly according to claim 17, wherein: At least a portion of the external electrode extends onto the insulating layer.

19. The coil assembly according to claim 17, wherein: The insulating layer covers each of all other surfaces of the body except the one surface.

20. The coil assembly according to claim 17, wherein: The outer electrodes are spaced apart from opposing surfaces of the coil component in a width direction of the coil component.

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