Heat dissipation device for power devices

Abstract

The present invention discloses a heat dissipation device for power devices. The heat dissipation device includes a first heat conducting element and a first heat dissipation element. The first heat conducting element is in a U-shaped shape with an opening, and the first heat conducting element has a first heat conducting part, a second heat conducting part and a third heat conducting part. The first heat conducting part and the second heat conducting part are arranged facing each other, and the first heat conducting part and the second heat conducting part are connected through the third heat conducting part. The side of the third heat conducting part away from the opening is used to place the power device; the first heat dissipation element is located below the first heat conducting element, and the power device is placed above the first heat dissipation element. The heat dissipation device in the present invention can conduct and dissipate heat in more directions, thereby improving the heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device for power devices. Background Art

[0002] At present, the output power requirements for electronic components (especially power amplifiers) are getting higher and higher, which is accompanied by more and more serious energy consumption and heat generation of electronic components. Therefore, the heat dissipation problem has become a difficulty in the corresponding field.

[0003] The known heat dissipation device adopts liquid cooling technology to solve the heat dissipation problem, and the liquid cooling system usually includes a water cooling plate, a circulating liquid, a water pump, a circulating pipe and a heat exchange device. Since the liquid cooling system contains many components, its use occasions are limited. For example, occasions such as airborne or vehicle-mounted are not suitable for using the liquid cooling system described above. Furthermore, the liquid cooling system contains many components. Once one of the components fails, the entire system will be unusable.

[0004] In view of the above problems, patent document CN106879230A proposes a heat dissipation system for a three-dimensional power amplifier, which includes two C-type heat sinks that are symmetrically arranged and arranged around the periphery of the three-dimensional power amplifier, and a plurality of first heat pipes are embedded on the outer surface of the C-type heat sink. With the help of this heat dissipation system, the heat of the three-dimensional power amplifier will be conducted to the bottom of the C-type heat sink through the first heat pipe along the outer surface of its cylinder, and the heat at the bottom of the C-type heat sink will be dissipated through the heat dissipation plane. However, the heat dissipation effect of the above heat dissipation system still needs to be further improved. Summary of the invention

[0005] The main purpose of the present invention is to provide a heat dissipation device for a power device, which improves the heat dissipation effect.

[0006] An embodiment of the present invention provides a heat dissipation device for a power device. The heat dissipation device comprises:

[0007] a first heat-conducting element, the first heat-conducting element is in a U-shaped shape with an opening, the first heat-conducting element has a first heat-conducting portion, a second heat-conducting portion and a third heat-conducting portion, the first heat-conducting portion and the second heat-conducting portion are arranged facing each other, the first heat-conducting portion and the second heat-conducting portion are connected through the third heat-conducting portion, and the side of the third heat-conducting portion away from the opening is used for placing the power device; and

[0008] A first heat dissipation element is located below the first heat conducting element, and the power device is placed above the first heat dissipation element.

[0009] The heat dissipation element is located below the power device, so that the heat can be conducted and dissipated downward. On this basis, the first heat-conducting element is placed on one side of the power device in the left-right direction or the front-back direction, so that the heat can also be conducted in one direction of the left-right direction or the front-back direction. As a result, the heat of the power device can not only be dissipated in the downward direction, but also conducted in a direction perpendicular to the downward direction, and the heat dissipation effect is improved.

[0010] In some specific embodiments, the number of the first heat-conducting elements is two, and the openings of the two first heat-conducting elements are away from each other.

[0011] The two first heat-conducting elements are arranged in opposition to each other, so that the heat of the power device can be released and diffused outwards in at least opposite directions, thereby further improving the heat dissipation effect.

[0012] In some specific embodiments, the heat dissipation device further includes a second heat-conducting element, the second heat-conducting element is in a U-shape with an opening, and the openings of the second heat-conducting element and the first heat-conducting element are opposite to each other.

[0013] In the case where the power device is a non-hexahedral structure such as a cylindrical shape, the heat is conducted from the outer surface of the non-hexahedral structure such as a cylindrical shape to the first heat dissipation element and the first heat conduction element through the U-shaped second heat conduction element, so that the heat can be dissipated on two mutually perpendicular planes. The dissipation area is increased, and thus the heat dissipation effect is improved.

[0014] In some specific embodiments, the number of the second heat-conducting elements is two, and the two second heat-conducting elements are arranged facing each other in the left-right direction or the front-back direction.

[0015] The two second heat-conducting elements are arranged facing each other, and the heat of the power device can be conducted outwards in at least opposite directions, thereby further improving the heat dissipation effect.

[0016] In some specific embodiments, the number of the first heat dissipation elements is two, and the two first heat dissipation elements are arranged in the up and down directions, and the power device is placed between the two first heat dissipation elements.

[0017] The two first heat dissipation elements are arranged in the up-and-down directions, and the heat of the power device can be dissipated in both the up-and-down directions, thereby further improving the heat dissipation effect.

[0018] In some specific embodiments, the heat dissipation device further includes a first fan assembly, and an impeller of the first fan assembly faces the first heat dissipation element.

[0019] Air cooling can be used in more situations (including onboard or in-vehicle situations). Liquid cooling is limited to certain situations.

[0020] In some specific embodiments, the first heat-conducting element is made of copper or aluminum, and a heat pipe is further disposed on the surface of the first heat-conducting element.

[0021] The function of the heat pipe is to transfer the heat of the concentrated heat generating area of ​​the power device to more areas of the first heat conducting element, so as to facilitate the heat dissipation of the first heat dissipating element and the second heat dissipating element.

[0022] In some specific embodiments, the first heat conducting element is made of a temperature averaging plate. As mentioned above, the temperature averaging plate has a better effect on heat diffusion.

[0023] In some specific embodiments, a first connection hole for fixed connection is provided on the third heat conducting portion.

[0024] The third heat conducting part is provided with a first connecting hole, so as to facilitate the assembly and disassembly of the entire heat dissipation device.

[0025] In some specific embodiments, the first heat-conducting element has a fourth heat-conducting portion, a fifth heat-conducting portion and a sixth heat-conducting portion, the fourth heat-conducting portion and the fifth heat-conducting portion are arranged opposite to each other, the fourth heat-conducting portion and the fifth heat-conducting portion are connected through the sixth heat-conducting portion, and a second connecting hole is provided on the sixth heat-conducting portion, and the second connecting hole is aligned with the first connecting hole.

[0026] By providing two connection holes aligned with each other on the sixth heat conducting part and the third heat conducting part, it is convenient to fix the first heat conducting element and the second heat conducting element, and it is also more convenient to assemble and disassemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of a heat dissipation device for a power device in some embodiments of the present invention.

[0028] Figure 2 for Figure 1 A schematic structural diagram of the second heat conducting element in FIG.

[0029] Figure 3 Schematic diagram of the structure of a heat dissipation device for a power device in some other embodiments of the present invention.

[0030] In the figure, 10-heat dissipation device; 100-first heat-conducting element, 110-first heat-conducting part, 120-second heat-conducting part, 130-third heat-conducting part, 131-first connecting hole; 200-first heat dissipation element; 300-second heat dissipation element; 400-first fan assembly; 500-second fan assembly; 600-second heat-conducting element, 640-fourth heat-conducting part, 650-fifth heat-conducting part, 660-sixth heat-conducting part; 20-power amplifier. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection and a movable connection, a detachable connection and a non-detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication. "Fixed connection" includes detachable connection, non-detachable connection, and integral connection, etc.

[0034] In the present invention, terms such as "first" or "second" are used for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0035] The technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0036] It should be noted that although the following description takes a power amplifier as an example, the heat dissipation device in the present application is not limited to be applied only to power amplifiers, and the heat dissipation of other power devices can also adopt the heat dissipation device in the embodiment of the present application.

[0037] The following text will describe the heat dissipation devices in some embodiments with reference to the accompanying drawings.

[0038] like Figure 1 as well as Figure 3 As shown, an embodiment of the present invention provides a heat dissipation device 10 for a power amplifier 20. The heat dissipation device 10 includes a first heat conducting element 100 and a first heat dissipation element 200.

[0039] The first heat conducting element 100 is in a U-shape with an opening, and comprises a first heat conducting portion 110, a second heat conducting portion 120 and a third heat conducting portion 130. The first heat conducting portion 110 and the second heat conducting portion 120 are arranged facing each other, and the first heat conducting portion 110 and the second heat conducting portion 120 are connected via the third heat conducting portion 130. The side of the third heat conducting portion 130 away from the opening is used for placing the power device 20.

[0040] Specifically, Figure 1 as well as Figure 3 As shown, the first heat conducting part 110 and the second heat conducting part 120 extend along a horizontal surface, while the third heat conducting part 130 extends along a vertical plane. The third heat conducting part 130 connects the first heat conducting part 110 and the second heat conducting part 120.

[0041] The first heat dissipation element 200 is located below the first heat conducting element 100 , and the power device 20 is placed above the first heat dissipation element 200 . The first heat dissipation element 200 is disposed below the power device 20 .

[0042] Specifically, the first heat dissipation element 200 is a finned heat sink. The finned heat sink is provided with fins on the base tube to achieve the purpose of enhancing heat transfer. The base tube can be a steel tube, a stainless steel tube, a copper tube, etc. The fins can be a steel belt, a stainless steel belt, a copper belt, or an aluminum belt, etc.

[0043] The first heat conducting part 110 is used to transfer heat to the first heat dissipating element 200, and the second heat conducting part 120 is used to transfer heat to the second heat dissipating element 300. It is understood that the first heat dissipating element 200 can be in direct contact with the first heat conducting part 110 or in indirect contact with the first heat conducting part 110; similarly, the second heat dissipating element 300 can also be in direct contact with the second heat conducting part 120 or in indirect contact with the second heat dissipating element 300.

[0044] By means of the U-shaped first heat conducting element, the heat of the power amplifier with a small volume distributed in space is converted into heat distributed on three surfaces, namely, the first heat conducting part, the second heat conducting part and the third heat conducting part, without having to surround the power amplifier with the heat dissipating element. In this embodiment, the heat dissipating element is arranged corresponding to the first heat conducting part, thereby facilitating the installation and arrangement of the heat dissipating element. Furthermore, such an arrangement also reduces the distribution area of ​​the heat dissipating element, making the entire heat dissipating device miniaturized, so that the heat dissipating device in this embodiment can also be used in occasions such as airborne or vehicle-mounted. The entire heat dissipating device has a simple structure and uses fewer components, so it works reliably.

[0045] The heat dissipation element is located below the power device, so that the heat can be conducted and dissipated downward. On this basis, the first heat-conducting element is placed on one side of the power device in the left-right direction or the front-back direction, so that the heat can also be conducted in one direction of the left-right direction or the front-back direction. As a result, the heat of the power device can not only be dissipated downward, but also conducted in a direction perpendicular to the downward direction, and the heat dissipation effect is improved.

[0046] It is noted that the first heat-conducting element is an open U-shaped structure, rather than a complete hexahedron. Therefore, compared with a complete hexahedron, the first heat-conducting element improves the heat dissipation effect while also achieving a certain degree of weight reduction.

[0047] Please continue reading Figure 1 as well as Figure 3 In some specific embodiments, the number of the first heat-conducting elements is two, and the openings of the two first heat-conducting elements are away from each other. Figure 1 The arrangement is symmetrical in the left and right directions as shown.

[0048] The two first heat-conducting elements are arranged in opposition to each other, so that the heat of the power device can be released and diffused outwards in at least opposite directions, thereby further improving the heat dissipation effect.

[0049] In some specific embodiments, the heat dissipation device 10 further includes a second heat-conducting element 600 . The second heat-conducting element 600 is in a U-shape with an opening. The openings of the second heat-conducting element 600 and the first heat-conducting element 100 are opposite to each other.

[0050] It should be noted that the shape corresponding to this embodiment is Figure 1 as well as Figure 2 shown. Figure 3 The illustrated embodiment does not have the second heat conducting element 600 .

[0051] In the case of a non-hexahedral structure such as a cylindrical power device (such as Figure 1 As shown in FIG. 1 , the heat is transferred from the outer surface of the non-hexahedral structure such as a cylindrical shape to the first heat dissipation element and the first heat conduction element through the U-shaped second heat conduction element, so that the heat can be dissipated on two mutually perpendicular planes. The dissipation area is increased, and thus the heat dissipation effect is improved. In the case where the power device itself is a regular hexahedron (such as Figure 3 As shown, the power device is in a rectangular shape), and there is no need to set a second heat conducting element.

[0052] For further information, see Figure 1 as well as Figure 2In some specific embodiments, the number of the second heat-conducting elements 600 is two, and the two second heat-conducting elements 600 are arranged facing each other in the left-right direction or the front-back direction. In the case where the power device is a non-hexahedral structure such as a cylindrical shape, the two second heat-conducting elements are arranged facing each other, and the heat of the power device can at least be conducted outward in opposite directions, thereby further improving the heat dissipation effect.

[0053] Specifically, the two second heat-conducting elements 600 are symmetrically arranged in the left-right direction, and the two second heat-conducting elements 600 have the same shape; the two first heat-conducting elements 100 also have the same shape; the shape of the second heat-conducting element 600 is similar to or the same as the shape of the first heat-conducting element 100. The two first heat-conducting elements 100 are also symmetrically arranged in the left-right direction, and the two second heat-conducting elements 600 are located between the two first heat-conducting elements 100. The openings of the two second heat-conducting elements 600 are arranged facing each other, and the second heat-conducting elements 600 and the adjacent first heat-conducting elements 100 are arranged back to back and the two are in contact. The two second heat-conducting elements 600 are symmetrically arranged, and after being assembled, they can cover at least four surfaces of the power amplifier 20 (for example, four surfaces such as the top surface, the bottom surface, the left side surface and the right side surface), so that the heat of the power amplifier 20 can be conducted outward from at least its own four surfaces.

[0054] See also Figure 1 as well as Figure 3 In some specific embodiments, the number of the first heat dissipation elements 200 is two, and the two first heat dissipation elements 200 are arranged in the up-down direction, and the power device 20 is placed between the two first heat dissipation elements 200. Specifically, the two first heat dissipation elements 200 have the same structure, and the two are symmetrically arranged in the up-down direction about the center plane of the power device 20.

[0055] The two first heat dissipation elements are arranged in the up-down direction, and the heat of the power device can be dissipated in the up-down direction, thereby further improving the heat dissipation effect. The heat dissipation elements are arranged in the up-down direction, which is more convenient for the installation and fixation of the heat dissipation elements, and also helps to make the entire heat dissipation device compact. It can be understood that, according to needs, it can also be arranged that the first heat conduction part and the second heat conduction part are arranged opposite to each other in the left-right direction or in the front-back direction.

[0056] In some specific embodiments, see Figure 1 as well as Figure 3 The heat dissipation device 10 further includes a first fan assembly 400 , and an impeller of the first fan assembly 400 faces the first heat dissipation element 200 .

[0057] Liquid cooling is only suitable for some occasions because it requires many components and has high requirements for sealing. Air cooling can be used in more occasions (including airborne or vehicle-mounted occasions). The fan component can remove the heat from the cooling component as quickly as possible.

[0058] Specifically, there are two first fan assemblies 400 , the two first fan assemblies 400 have the same structure and are symmetrically arranged in the up-down direction about the center plane of the power device 20 .

[0059] In some embodiments, the heat dissipation device 10 further includes a third heat conducting element, which is located between the first heat conducting portion 110 and the first heat dissipation element 200. Two opposite surfaces of the third heat conducting element are respectively in contact with the first heat conducting portion 110 and the first heat dissipation element 200. Further, the number of the third heat conducting elements is two, and the two third heat conducting elements are symmetrically arranged in the up-down direction with respect to the center plane of the power device.

[0060] By providing the transition of the intermediate heat-conducting element, it is helpful to transfer the heat from the periphery of the power amplifier to a wider range of space, thereby facilitating sufficient heat dissipation.

[0061] In some specific embodiments, the first heat dissipation element 200 is provided with an air duct plate on a side away from the first heat conducting element 100. Specifically, the lower side of the first heat dissipation element 200 located below the power device 20 is the side away from the first heat conducting element 100, and the air duct plate is provided below the first heat dissipation element 200; the upper side of the first heat dissipation element 200 located above the power device 20 is also the side away from the first heat conducting element 100, and the air duct plate is also provided above the first heat dissipation element 200.

[0062] The air duct plate can prevent the wind from the fan assembly from blowing to the area outside the heat dissipation element, so that the wind blows to the heat dissipation element as much as possible. The air duct plate is used to make the wind blow to the first heat dissipation element 200 below the air duct plate as much as possible, or to make the wind blow to the first heat dissipation element 200 above the air duct plate as much as possible.

[0063] In some specific embodiments, the third heat conducting element is a temperature vapor chamber.

[0064] The temperature spreader can transfer heat as quickly as possible to avoid heat concentration on the heat source, so the temperature spreader is equivalent to a heat diffuser. Specifically, the inner wall surface of the temperature spreader has a closed vacuum cavity with a microstructure. When the heat flow is conducted from the heat source to the evaporation zone of the temperature spreader, the working fluid inside the cavity of the temperature spreader will produce liquid phase vaporization at a certain temperature under vacuum conditions, so that the working fluid absorbs heat energy and evaporates quickly. The vapor phase will fill the entire cavity, and heat conduction on a two-dimensional surface is achieved through the flow of the capillary structure in the liquid state and the latent heat during evaporation.

[0065] Compared with the one-dimensional linear heat conduction of the heat pipe, the heat in the temperature dispersion plate is conducted on a two-dimensional surface, so the heat conduction efficiency is higher.

[0066] In some specific embodiments, the first heat-conducting element 100 is made of copper or aluminum, and a heat pipe is further disposed on the surface of the first heat-conducting element 100. Copper or aluminum has excellent thermal conductivity.

[0067] Compared with traditional air cooling or water cooling, the heat conduction speed of the heat pipe has obvious advantages. The heat pipe can transfer the heat of the concentrated heating area of ​​the power amplifier 20 to more areas of the first heat conducting element as quickly as possible, which is convenient for the first heat dissipation element to dissipate heat.

[0068] In some specific embodiments, the first heat conducting element 100 is made of a temperature evaporating plate. As mentioned above, the temperature evaporating plate has a better effect on heat diffusion.

[0069] In some specific embodiments, see Figure 1 as well as Figure 3 The third heat conducting part 130 is provided with a first connection hole 131 for fixed connection. The third heat conducting part is provided with the first connection hole to facilitate the assembly and disassembly of the entire heat dissipation device.

[0070] Specifically, the first connection holes 131 are screw holes, and the number of the first connection holes 131 being screw holes is more than two. When the number of the screw holes is more than three, the screw holes are distributed at equal intervals. It is understandable that other fixed connection methods can also be used as needed.

[0071] In some specific embodiments, see Figure 3 The second heat-conducting element 600 has a fourth heat-conducting part 640, a fifth heat-conducting part 650 and a sixth heat-conducting part 660. The fourth heat-conducting part 640 and the fifth heat-conducting part 650 are arranged opposite to each other. The fourth heat-conducting part 640 and the fifth heat-conducting part 650 are connected with each other through the sixth heat-conducting part 660. The sixth heat-conducting part is provided with a second connecting hole (not shown in the figure), and the second connecting hole is aligned with the first connecting hole 131.

[0072] By providing two connection holes aligned with each other on the sixth heat conducting part and the third heat conducting part, it is convenient to fix the first heat conducting element and the second heat conducting element, and it is more convenient to disassemble and assemble. It is not difficult to see that compared with the technical solution of patent document CN106879230A, the fixed connection elements of the present application are reduced, so that the assembly and disassembly of the heat dissipation device is more convenient.

[0073] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat dissipation device for a power device, characterized in that: include: A first heat-conducting element, the first heat-conducting element is in a U-shaped shape with an opening, the first heat-conducting element has a first heat-conducting portion, a second heat-conducting portion and a third heat-conducting portion, the first heat-conducting portion and the second heat-conducting portion are arranged facing each other, the first heat-conducting portion and the second heat-conducting portion are connected through the third heat-conducting portion, and a side of the third heat-conducting portion away from the opening is used for placing the power device; as well as A first heat dissipation element, wherein the first heat dissipation element is located below the first heat conducting element, and the power device is placed above the first heat dissipation element; The number of the first heat-conducting elements is two, and the openings of the two first heat-conducting elements are away from each other; The heat dissipation device further comprises a second heat-conducting element, the second heat-conducting element is in a U-shaped shape with an opening, and the openings of the second heat-conducting element and the first heat-conducting element are opposite to each other; The number of the second heat-conducting elements is two, and the two second heat-conducting elements are arranged facing each other in the left-right direction or the front-back direction.

2. The heat dissipation device for power devices according to claim 1, characterized in that: The number of the first heat dissipation elements is two, and the two first heat dissipation elements are arranged in the up and down directions, and the power device is placed between the two first heat dissipation elements.

3. The heat dissipation device for power devices according to claim 1, characterized in that: The heat dissipation device further comprises a first fan assembly, wherein an impeller of the first fan assembly faces the first heat dissipation element.

4. The heat dissipation device for power devices according to claim 1, characterized in that: The first heat-conducting element is made of copper or aluminum, and a heat pipe is disposed on the surface of the first heat-conducting element.

5. The heat dissipation device for power devices according to claim 1, characterized in that: The first heat conducting element is made of a temperature averaging plate.

6. The heat dissipation device for power devices according to claim 1, characterized in that: The third heat conducting part is provided with a first connection hole for fixed connection.

7. The heat dissipation device for power devices according to claim 6, characterized in that: The second heat-conducting element has a fourth heat-conducting portion, a fifth heat-conducting portion and a sixth heat-conducting portion, the fourth heat-conducting portion and the fifth heat-conducting portion are arranged opposite to each other, the fourth heat-conducting portion and the fifth heat-conducting portion are connected through the sixth heat-conducting portion, a second connecting hole is provided on the sixth heat-conducting portion, and the second connecting hole is aligned with the first connecting hole.

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