Double-end turnover transfer mechanism

Abstract

The application discloses a double-head turnover conveying mechanism, which comprises a base installed on a module and capable of sliding along the module, a shell fixedly connected with the base, a rotating shaft (5) installed in the shell, a turnover motor connected with an input end of the rotating shaft (5), and a double-head IC adsorption assembly connected with an output end of the rotating shaft (5), wherein two adsorption heads of the double-head IC adsorption assembly are separated by 180 degrees. According to the technical scheme provided by the embodiment of the application, the number of times of single IC conveying and handover is 2, the number of times of handover is reduced, the risk of IC quality problems caused by electrostatic discharge during handover and extrusion and friction of IC chips during the handover process is reduced, meanwhile, the double-head IC adsorption assembly is provided with two groups of IC adsorption heads, two ICs are conveyed at a time, on the basis of ensuring the quality, the equipment beat is also accelerated, the conveying process is fast and stable, and the high requirements of the panel industry on production capacity and product quality are met.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip conveying, in particular to a double-head flip conveying mechanism. BACKGROUND

[0002] IC: commonly known as chip, the abbreviation of Integrated Circuit Chip, IC chip is to form an integrated circuit of a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic base to make a chip. IC chip includes wafer chip and packaged chip, and the corresponding IC chip production line consists of wafer production line and packaging production line.

[0003] COP process is to bind IC to flexible screen, and the original IC chip is in the IC quenching tray, which needs to be flipped and conveyed to the pressure head after camera alignment. Due to the high requirements of panel industry on production capacity and product quality, the conveying process needs to be fast and stable.

[0004] At present, the following two conveying forms are basically used in the industry:

[0005] As shown in Figure 1 , the first conveying form consists of a taking mechanism a taking material from the IC quenching tray b, a flip mechanism c, and a conveying mechanism d delivering to the pressure head e.

[0006] The specific conveying process is: the taking mechanism a takes material from the IC quenching tray b, and conveys the IC chip 8 to the flip mechanism c; the flip mechanism c flips the IC chip 8, and conveys the IC chip 8 to the conveying mechanism d; the conveying mechanism d aligns the IC chip 8 with the camera, and delivers the IC chip 8 to the pressure head e.

[0007] This form increases the conveying mechanism to speed up the equipment beat, but the conveying delivery times need 4 times, and the static electricity release during delivery and the extrusion and friction during the delivery process may cause IC damage. The more the conveying times, the greater the impact on IC quality.

[0008] As shown in Figure 2 , the second conveying form consists of a flip conveying mechanism A.

[0009] The specific conveying process is: the flip conveying mechanism A takes material from the IC quenching tray b, flips the IC chip 8, aligns the IC chip 8 with the camera, and delivers the IC chip 8 to the pressure head e.

[0010] This form only has a conveying flip mechanism directly delivering to the pressure head, and the conveying delivery times need 2 times, but the mechanism beat is long and the equipment capacity is low.

[0011] The prior art accelerates the device beat by increasing the conveying mechanism, or directly transfers to the press head by only one conveying and turning mechanism, but the mechanism beat is long, so there is no mechanism with less transfer times and fast beat, therefore, an urgent need arises for a mechanism to solve the contradiction between device capacity and chip quality.

[0012] In summary, how to effectively solve the contradiction between device capacity and chip quality and other problems is a problem that technicians in the field urgently need to solve at present. SUMMARY

[0013] The purpose of the present application is to provide a double-head turning conveying mechanism which effectively solves the contradiction between device capacity and chip quality and makes the chip conveying process fast and stable.

[0014] To solve the above technical problems, the present application provides the following technical solutions:

[0015] A double-head turning conveying mechanism, comprising a base mounted on a module and capable of sliding along the module, a shell fixedly connected with the base, a rotating shaft mounted in the shell, a turning motor connected with the input end of the rotating shaft, and a double-head IC suction assembly connected with the output end of the rotating shaft, the two suction heads of the double-head IC suction assembly being separated by 180°.

[0016] Preferably, the double-head IC suction assembly comprises two sliding blocks respectively connected with the two sides of the output end of the rotating shaft, two L-shaped connectors respectively connected with the side surfaces of the two sliding blocks, and a first IC suction head and a second IC suction head respectively fixed on the horizontal plates of the two L-shaped connectors.

[0017] Preferably, the sliding block comprises a fixed block fixedly connected with the output end of the rotating shaft, a sliding block having a groove on the inner side and capable of moving up and down along the fixed block with the groove clamped in the fixed block, and two L-shaped connectors respectively fixed on the side surfaces of the two sliding blocks, and a compression spring arranged between the horizontal plate of the L-shaped connector and the end surface of the output end of the rotating shaft.

[0018] Preferably, the output end of the rotating shaft is provided with a counterbore, and the compression spring is mounted in the counterbore.

[0019] Preferably, the sizes of the first IC suction head and the second IC suction head are both larger than the size of the IC chip.

[0020] Preferably, the materials of the first IC suction head and the second IC suction head are both anti-static materials.

[0021] Preferably, the surfaces of the first IC suction head and the second IC suction head are both relatively parallel to the surface of the press head.

[0022] Preferably, a communicating vacuum pipeline is arranged in the shell and the rotating shaft, an air inlet of the vacuum pipeline is connected with the vacuum device, and air outlets of the vacuum pipeline are connected with the channel outlets of the two L-shaped connectors, and the channel inlets of the two L-shaped connectors are communicated with the vacuum adsorption holes of the first and second IC adsorption heads respectively.

[0023] Preferably, the vacuum pipeline comprises a first vacuum pipeline and a second vacuum pipeline, air inlets of the first and second vacuum pipelines are connected with the channel outlets of the two L-shaped connectors respectively, air outlets of the first and second vacuum pipelines are connected with the two connecting ports of the vacuum device through the first and second pipelines respectively, and the first and second pipelines are respectively provided with the first and second electromagnetic valves.

[0024] Preferably, a first connector and a second connector are connected with the first and second vacuum pipelines respectively on the rotating shaft, a third connector and a fourth connector are arranged at the channel outlets of the two L-shaped connectors respectively, the first connector and the third connector are connected through a hose, and the second connector and the fourth connector are connected through a hose.

[0025] The double-head flip conveying mechanism comprises a base, a shell, a rotating shaft, a flip motor and a double-head IC adsorption assembly. The base is installed on a module, and the base is connected with a linear motor. The linear motor can drive the base to slide along the module, that is, to move in a linear direction from an IC quenching disc to a camera and a pressing head. The shell is installed on the base and is fixedly connected with the base. The rotating shaft is installed in the shell. An output shaft of the flip motor is connected with an input end of the rotating shaft. The flip motor can drive the rotating shaft to rotate. The double-head IC adsorption assembly is connected with an output end of the rotating shaft. The double-head IC adsorption assembly rotates along with the rotation of the rotating shaft. Both ends of the double-head IC adsorption assembly are provided with adsorption heads. The two adsorption heads are separated by 180 degrees. In the initial position, one adsorption head is located at the upper end, and the other adsorption head is located at the lower end. The rotating shaft can switch the positions of the two adsorption heads by rotating 180 degrees.

[0026] By using the technical scheme provided in the embodiments of the present application, the double-head flip conveying mechanism can directly take IC chips from an IC quenching disc, and has the function of flipping the IC chips. After being flipped, the IC chips can be directly delivered to the pressing head. The number of conveying and delivering of a single IC chip is 2, which reduces the number of conveying and delivering during delivery, reduces the risk of electrostatic discharge during delivery and the risk of IC quality problems caused by extrusion and friction of the IC chips during the delivery process. Meanwhile, the double-head flip conveying mechanism has two groups of IC adsorption heads, and can convey two IC chips at a time. On the basis of ensuring the quality, the equipment cycle is also accelerated, the conveying process is fast and stable, and the high requirements of the panel industry on production capacity and product quality are met. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the accompanying drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0028] Figure 1 A schematic diagram of the working principle of a typical conveying mode in the prior art;

[0029] Figure 2 A schematic diagram of the working principle of another typical flip conveying mode in the prior art;

[0030] Figure 3 A schematic diagram of the working principle of a double-head flip conveying mechanism provided in a specific embodiment of the present application;

[0031] Figure 4 A schematic diagram of the structure of an IC quenching tray;

[0032] Figure 5 A schematic diagram of the structure of a pressing head;

[0033] Figure 6 A schematic diagram of the structure of a double-head flip conveying mechanism;

[0034] Figure 7 A partial schematic diagram of a double-head flip conveying mechanism;

[0035] Figure 8 Another view of Figure 7 ;

[0036] Figure 9 A schematic diagram of a double-head IC suction assembly;

[0037] Figure 10 A schematic diagram of the air path of a double-head flip conveying mechanism.

[0038] The reference signs in the drawings are as follows:

[0039] First IC suction head 1, L-shaped connecting piece 2, sliding block 3, first joint 4, rotating shaft 5, compression spring 6, second IC suction head 7, IC chip 8, vacuum pipeline 9, fixed block 31, sliding block 32. DETAILED DESCRIPTION

[0040] The core of the present application is to provide a double-head flip conveying mechanism, which effectively solves the contradiction between equipment productivity and chip quality, and makes the chip conveying process fast and stable.

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0042] Please refer to Figures 3 to 10 , Figure 3 is a schematic diagram of the working principle of a double-head flip conveying mechanism provided in a specific embodiment of the present application; Figure 4 is a schematic diagram of the structure of an IC quenching tray; Figure 5 is a schematic diagram of the structure of a pressing head; Figure 6 is a schematic diagram of the structure of a double-head flip conveying mechanism; Figure 7 is a partial schematic diagram of a double-head flip conveying mechanism; Figure 8 is Figure 7 another view; Figure 9 is a schematic diagram of a double-head IC suction assembly; Figure 10 is a schematic diagram of the air path of a double-head flip conveying mechanism.

[0043] In a specific embodiment, the double-head flip conveying mechanism provided by the present application comprises a base installed on a module and capable of sliding along the module, a shell fixedly connected with the base, a rotating shaft 5 installed in the shell, a flip motor connected with the input end of the rotating shaft 5, and a double-head IC suction assembly connected with the output end of the rotating shaft 5, the two suction heads of the double-head IC suction assembly being separated by 180°.

[0044] In the above structure, the double-head flip conveying mechanism comprises the base, the shell, the rotating shaft 5, the flip motor, and the double-head IC suction assembly, the base is installed on the module, the base is connected with a linear motor, and the linear motor can drive the base to slide along the module, that is, drive the double-head flip conveying mechanism to move in a linear direction from the IC quenching tray to the camera and the pressing head.

[0045] The shell is installed on the top of the base and is fixedly connected with the base. The rotating shaft 5 is installed in the shell, the output shaft of the flip motor is connected with the input end of the rotating shaft 5, and the flip motor can drive the rotating shaft 5 to rotate.

[0046] The double-head IC suction assembly is connected with the output end of the rotating shaft 5, and the double-head IC suction assembly rotates following the rotation of the rotating shaft 5. The double-head IC suction assembly has suction heads at both ends, the two suction heads are separated by 180°, the initial position is that one suction head is located at the upper end and the other suction head is located at the lower end, and the rotating shaft 5 can switch the positions of the two suction heads by rotating 180°.

[0047] The conveying form of the present application is composed of a double-head flip conveying mechanism A.

[0048] The specific carrying process is as follows: the double-end turnover conveying mechanism A reaches above the IC quenching tray, the double-end IC suction assembly takes the material from the IC quenching tray, the suction head at the lower end first sucks an IC chip 8, then the rotation shaft 5 driven by the turnover motor drives the double-end IC suction assembly to turn over 180°, the two suction heads of the double-end IC suction assembly exchange directions, the suction head at the upper end rotates to the lower end and sucks an IC chip 8 from the IC quenching tray, so that the two suction heads of the double-end IC suction assembly both complete the material taking.

[0049] The linear motor drives the double-end turnover conveying mechanism A to move linearly to reach the first camera alignment, the IC chip 8 at the upper end is aligned with the first camera alignment, and the IC chip 8 at the upper end is handed over to the first pressing head e1, and the IC chip 8 at the upper end completes the carrying.

[0050] The rotation shaft 5 driven by the turnover motor drives the double-end IC suction assembly to turn over 180°, turns over the IC chip 8 at the lower end to the upper end, and drives the double-end turnover conveying mechanism A to move linearly to reach the second camera alignment, the second IC chip 8 is aligned with the second camera alignment, and the second IC chip 8 is handed over to the second pressing head e2, and the second IC chip 8 completes the carrying. Then the double-end turnover conveying mechanism A returns to the initial position to wait for the next instruction.

[0051] The technical scheme provided by the embodiment of the application can realize the following effects. Figure 3 As shown in the figure, the double-end turnover conveying mechanism can realize the direct taking of the IC chip 8 from the IC quenching tray, and also has the function of turning over the IC chip 8, and after turning over, the IC chip 8 can be directly handed over to the pressing head, the single IC conveying and handing over is 2 times, which reduces the handing over times during the handing over, reduces the risk of electrostatic discharge during the handing over and the extrusion and friction of the IC chip 8 during the handing over process causing the IC quality problem; at the same time, there are two groups of IC suction heads, and two ICs are carried at a time, which not only ensures the quality, but also speeds up the equipment beat, realizes fast and stable carrying process, and meets the high requirements of the panel industry on production capacity and product quality.

[0052] On the basis of the above various specific embodiments, the double-end IC suction assembly includes two sliders 3 connected to the two sides of the output end of the rotation shaft 5 respectively, two L-shaped connecting pieces 2 connected to the side surfaces of the two sliders 3 respectively, a first IC suction head 1 and a second IC suction head 7 fixed on the horizontal plates of the two L-shaped connecting pieces 2 respectively.

[0053] In the structure, the double-head IC adsorption assembly comprises two sliders 3, two L-shaped connecting pieces 2, a first IC adsorption head 1 and a second IC adsorption head 7, the two sliders 3 are connected with the output end of the rotating shaft 5, and the rotating shaft 5 can drive the sliders 3 to rotate. The cross section of the slider 3 is rectangular, the L-shaped connecting piece 2 comprises a horizontal plate and a vertical plate, the two L-shaped connecting pieces 2 are connected with the two sliders 3 respectively, that is, the side surface of one L-shaped connecting piece 2 is connected with the side surface of one slider 3, the horizontal plate of the L-shaped connecting piece 2 extends to the upper surface of the output end of the rotating shaft 5, and the side surface of the other L-shaped connecting piece 2 is connected with the side surface of the other slider 3, and the horizontal plate of the L-shaped connecting piece 2 extends to the lower surface of the output end of the rotating shaft 5.

[0054] The first IC adsorption head 1 is fixed on the horizontal plate of one L-shaped connecting piece 2, and the second IC adsorption head 7 is fixed on the horizontal plate of the other L-shaped connecting piece 2, that is, the first IC adsorption head 1 and the second IC adsorption head 7 are separated by 180°, one is located at the upper end, and the other is located at the lower end. The overall structure of the double-head IC adsorption assembly is simple, easy to connect, convenient to disassemble and easy to control the orientation conversion of the first IC adsorption head 1 and the second IC adsorption head 7.

[0055] The double-head flipping conveying mechanism provided by the application should not be limited to this case, and in the case that other components are not changed, the slider 3 comprises a fixed block 31 fixedly connected with the output end of the rotating shaft 5, a sliding block 32 provided with a groove in the inner side and capable of moving up and down along the fixed block 31, the two L-shaped connecting pieces 2 are respectively fixed to the side surfaces of the two sliding blocks 32, and a compression spring 6 is arranged between the horizontal plate of the L-shaped connecting piece 2 and the end surface of the output end of the rotating shaft 5.

[0056] In the structure, the slider 3 comprises a fixed block 31 and a sliding block 32, the fixed block 31 is fixedly connected with the output end of the rotating shaft 5, the inner side of the sliding block 32 is provided with a groove, the groove is clamped on the fixed block 31, and the sliding block 32 can move up and down along the fixed block 31, that is, the sliding block 32 can move up and down relative to the output end of the rotating shaft 5.

[0057] The two L-shaped connecting pieces 2 are respectively fixed to the side surfaces of the two sliding blocks 32, and can be fixed by bolts, so that the L-shaped connecting piece 2 can move up and down relative to the output end of the rotating shaft 5.

[0058] The compression spring 6 is arranged between the horizontal plate of the L-shaped connecting piece 2 and the end surface of the output end of the rotating shaft 5, the IC adsorption head can float during the transfer process, the L-shaped connecting piece 2 is pressed on the compression spring 6, the compression spring 6 plays a buffering role, and the pressure in the transfer process is avoided to be too large.

[0059] Further optimization of the above technical solutions, the output end of the rotating shaft 5 is provided with a counterbore, the compression spring 6 is installed in the counterbore, and the compression spring 6 has a better positioning effect, preventing the compression spring 6 from falling. Of course, the output end of the rotating shaft 5 is provided with a counterbore, and the compression spring 6 is installed in the counterbore, which is only one preferred embodiment and is not the only one. It can also be that the end face of the output end of the rotating shaft 5 has a guide column, and the compression spring 6 is sleeved on the guide column. The guide column not only can better fix the compression spring 6, but also has a guiding effect, preventing the compression spring 6 from deflecting.

[0060] On the basis of the above various specific embodiments, the size of the first IC adsorption head 1 and the second IC adsorption head 7 is larger than the size of the IC chip 8, slightly larger, for example, 5mm, preventing the edge of the IC adsorption head from scratching the IC chip 8, and facilitating the protection of the IC chip 8; ensuring that the entire surface of the IC chip 8 is adsorbed by the IC adsorption head, preventing the IC chip 8 from falling when the IC adsorption head and the IC chip 8 are not completely centered.

[0061] On the basis of the above various specific embodiments, the material of the first IC adsorption head 1 and the second IC adsorption head 7 is an anti-static material, which refers to a material that generates the smallest amount of electric charge when the same material or other similar materials rub against each other or separate, such as a special engineering plastic such as polyether ether ketone, preventing static damage to the IC chip 8 during handover, and protecting the IC chip 8.

[0062] On the basis of the above various specific embodiments, the surface of the first IC adsorption head 1 and the second IC adsorption head 7 is relatively parallel to the surface of the pressure head. During the handover process, the parallel movement of the IC adsorption head ensures that the pressure head is relatively parallel to the IC adsorption head, the control of the IC adsorption head is more convenient, and the rotating shaft 5 can be driven by a servo motor to ensure accuracy; the handover process is more accurate and fast.

[0063] In another more reliable embodiment, on the basis of any one of the above embodiments, a communication vacuum pipeline 9 is formed in the shell and the rotating shaft 5, such as a vertical pipeline formed in the shell and a horizontal pipeline formed in the rotating shaft 5, which are in communication to form the vacuum pipeline 9.

[0064] The air outlet of the vacuum pipeline 9 is connected with the vacuumizing device, and the opening of the vertical pipeline is the air inlet from which the gas is extracted.

[0065] The air inlet of the vacuum pipeline 9 is the opening of the rotating shaft 5, and the inside of each L-shaped connecting piece 2 has a channel, and the air inlet of the vacuum pipeline 9 is connected with the channel outlet of the two L-shaped connecting pieces 2.

[0066] The IC suction head has multiple vacuum suction holes, and the channel inlets of the two L-shaped connectors 2 are respectively connected with the vacuum suction holes of the first IC suction head 1 and the second IC suction head 7, and the IC suction heads are sucked into vacuum, so that the IC chip 8 can be adsorbed.

[0067] In this structure, the gas flow direction when the IC suction head is adsorbed, a special rotating shaft 5 is adopted, the vacuum suction gas path is arranged inside the shell, the rotating shaft 5 and the L-shaped connector 2, without external connecting pipeline, the vacuum pipeline 9 is inside the rotating shaft 5, which will not swing like the traditional air pipe when rotating, affecting the transfer precision, making the transfer more stable, and simplifying the structure.

[0068] Further optimization of the above technical scheme, the vacuum pipeline 9 includes a first vacuum pipeline 9 and a second vacuum pipeline 9, the gas inlets of the first vacuum pipeline 9 and the second vacuum pipeline 9 are respectively connected with the channel outlets of the two L-shaped connectors 2, the gas outlets of the first vacuum pipeline 9 and the second vacuum pipeline 9 are respectively connected with the two connection ports of the vacuum suction device through the first pipeline and the second pipeline, and the first electromagnetic valve and the second electromagnetic valve are respectively arranged on the first pipeline and the second pipeline.

[0069] In this structure, the state when the double-head transfer and overturning mechanism is transferred with the pressure head, the pressure head and the IC suction head have vacuum suction holes, the gas paths of the two IC suction heads are independent gas paths and are not related to each other, and are controlled by different electromagnetic valves, the vacuum of the IC suction head and the vacuum breaking do not affect each other, and the control is more convenient and accurate.

[0070] For the double-head transfer and overturning mechanism in each of the above embodiments, when the L-shaped connector 2 and the output end of the rotating shaft 5 have a compression spring 6, the L-shaped connector 2 and the rotating shaft 5 have a gap, and the vacuum pipeline 9 and the channel of the L-shaped connector 2 can only be connected by an external small hose. Specifically, the rotating shaft 5 is connected with a first joint 4 and a second joint which are respectively connected with the first vacuum pipeline 9 and the second vacuum pipeline 9, and the channel outlets of the two L-shaped connectors 2 are respectively provided with a third joint and a fourth joint, the first joint 4 and the third joint are connected by a hose, and the second joint and the fourth joint are connected by a hose, not only can the vacuum pipeline 9 and the channel of the L-shaped connector 2 be connected, but also the vacuum pipeline 9 inside the rotating shaft 5 will not swing like the traditional air pipe when rotating, affecting the transfer precision, making the transfer more stable.

[0071] Preferably, the channel outlet of the L-shaped connector 2 is arranged on the vertical plate of the L-shaped connector 2, which is easy for the vacuum pipeline 9 and the channel of the L-shaped connector 2 to be connected by a hose, and shortens the length of the hose.

[0072] Various embodiments are described herein with reference to a sequence of acts, and each of the acts with reference to a respective figure. It will be understood that the order of the acts of the embodiments can be altered and / or two or more acts can be performed concurrently, unless otherwise indicated or unless the context clearly dictates otherwise.

[0073] The double-end turnover conveying mechanism provided by the present application is described in detail above. The principles and implementation manners of the present application are described by applying specific examples in this paper, and the above description of the embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application. Therefore, the present application will not be limited to the embodiments shown in this paper, but will be consistent with the widest range of principles and novel features disclosed in this paper.

Claims

1. A conveying method using a double-headed flipping conveying mechanism, characterized in that, The dual-head flipping conveying mechanism includes a base mounted on the module and capable of sliding along the module, a housing fixedly connected to the base, a rotating shaft (5) mounted inside the housing, a flipping motor connected to the input end of the rotating shaft (5), and a dual-head IC adsorption assembly connected to the output end of the rotating shaft (5). The two adsorption heads of the dual-head IC adsorption assembly are 180° apart, and the position of the two adsorption heads can be switched by rotating the rotating shaft (5) 180°. The dual-head IC adsorption assembly includes two sliders (3) respectively connected to both sides of the output end of the rotating shaft (5), two L-shaped connectors (2) respectively connected to the sides of the two sliders (3), and a first IC adsorption head (1) and a second IC adsorption head (7) respectively fixed to the horizontal plates of the two L-shaped connectors (2). The slider (3) includes a fixing block (31) fixedly connected to the output end of the rotating shaft (5), with a groove on the inner side and the groove being engaged with the fixing block. (31) and a sliding block (32) that can move up and down along the fixed block (31), two L-shaped connectors (2) are fixed to the sides of the two sliding blocks (32) respectively, and a compression spring (6) is provided between the horizontal plate of the L-shaped connector (2) and the end face of the output end of the rotating shaft (5). During the handover process, the IC adsorption head can float, the L-shaped connector (2) is pressed on the compression spring (6), and the compression spring (6) plays a buffering role. The output end of the rotating shaft (5) is provided with a countersunk hole, and the compression spring (6) is installed in the countersunk hole. A vacuum pipe (9) is opened in the housing and the rotating shaft (5). The air extraction port of the vacuum pipe (9) is connected to the vacuum pumping device. The air inlet of the vacuum pipe (9) is connected to the channel outlet of the two L-shaped connectors (2). The channel inlets of the two L-shaped connectors (2) are respectively connected to the vacuum adsorption holes of the first IC adsorption head (1) and the second IC adsorption head (7). The conveying method includes: The double-head flip conveyor reaches the top of the IC quenching tray. The double-head IC adsorption assembly picks up the IC quenching tray. The adsorption head at the lower end first adsorbs an IC chip (8). Then, the flip motor drives the rotating shaft (5) to rotate the double-head IC adsorption assembly 180°. The two adsorption heads of the double-head IC adsorption assembly exchange directions. The upper adsorption head rotates to the lower end and adsorbs an IC chip (8) from the IC quenching tray. In this way, both adsorption heads of the double-head IC adsorption assembly complete the picking up of the IC chip. The linear motor drives the double-head flipping conveyor to move linearly to the first camera alignment, aligns the upper IC chip (8) with the first camera alignment, and transfers the upper IC chip (8) to the first pressure head (e1), thus completing the transport of the upper IC chip (8). The rotating shaft (5) driven by the flip motor rotates the double-headed IC adsorption assembly 180°, flips the IC chip (8) at the bottom to the top, and drives the double-headed flip conveying mechanism to move linearly to the second camera alignment, aligns the second IC chip with the second camera, and hands the second IC chip over to the second pressure head (e2), thus completing the transport of the second IC chip. The double-headed flipping conveyor then returns to its initial position to await the next instruction.

2. The conveying method according to claim 1, characterized in that, The size of the first IC adsorption head (1) and the second IC adsorption head (7) is larger than the size of the IC chip (8).

3. The conveying method according to claim 1, characterized in that, The first IC adsorption head (1) and the second IC adsorption head (7) are both made of antistatic materials.

4. The conveying method according to claim 1, characterized in that, The surfaces of the first IC adsorption head (1) and the second IC adsorption head (7) are both parallel to the surface of the pressure head.

5. The conveying method according to claim 1, characterized in that, The vacuum pipe (9) includes a first vacuum pipe and a second vacuum pipe. The air inlets of the first vacuum pipe and the second vacuum pipe are respectively connected to the channel outlets of two L-shaped connectors (2). The air extraction ports of the first vacuum pipe and the second vacuum pipe are respectively connected to the two connection ports of the vacuum pumping device through the first pipeline and the second pipeline. The first pipeline and the second pipeline are respectively equipped with a first solenoid valve and a second solenoid valve.

6. The conveying method according to claim 5, characterized in that, A first connector (4) and a second connector are connected to the rotating shaft (5) respectively, which are connected to the first vacuum pipe and the second vacuum pipe. A third connector and a fourth connector are respectively provided at the channel outlet of the two L-shaped connectors (2). The first connector (4) and the third connector are connected by a hose, and the second connector and the fourth connector are connected by a hose.

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