A wafer hot plate structure

Abstract

The present invention discloses a wafer hot plate structure, and its structure includes a main body, a top cover, a handle, an adjusting mechanism, a power cord, an industrial control module, a heating plate body, a heating wire and a temperature controller. By arranging the adjusting mechanism at the left end inside the main body, the lead screw can be rotated to drive the first connecting rod to rotate. The first connecting rod drives the top plate to move upward through the second connecting rod, and the top plate drives the support rod to move upward, so that the bottom of the wafer is separated from the heating plate body, facilitating the transfer of the wafer and improving the transfer rate, saving time, reducing the contact with the surface of the wafer, and having simple operation and saving labor.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor thin film deposition applications and manufacturing, and particularly to a wafer hot plate structure. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor integrated circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. Currently, domestic wafer production lines are mainly 8 inches and 12 inches. At present, China's semiconductor manufacturing industry is a major strategic support industry of the country, a high-end technology manufacturing industry, and the core competitiveness of the country. It is particularly crucial to develop wafer production equipment independently developed in China. Controlling the wafer temperature during the wafer manufacturing process is an important step in the wafer etching and physical deposition processes.

[0003] The wafer can be placed on a hot plate for heating. After the wafer is heated, it is necessary to take out the wafer from the end of the hot plate body. The wafer is relatively flat as a whole, and the bottom of the wafer is in relatively complete contact with the hot plate. When taking out the wafer, it takes a lot of time and is likely to cause contact with the surface of the wafer. Summary of the Invention

[0004] (1) Technical Problems to be Solved

[0005] In order to overcome the deficiencies of the prior art, a wafer hot plate structure is proposed. It solves the problems that the wafer can be placed on a hot plate for heating, and after the wafer is heated, it is necessary to take out the wafer from the end of the hot plate body. The wafer is relatively flat as a whole, and the bottom of the wafer is in relatively complete contact with the hot plate. When taking out the wafer, it takes a lot of time and is likely to cause contact with the surface of the wafer.

[0006] (2) Technical Solutions

[0007] The present invention is realized through the following technical solutions: The present invention provides a wafer hot plate structure, which includes a main body, a top cover, a handle, an adjustment mechanism, a power cord, an industrial control module, a hot plate body, a heating wire, and a temperature controller. The top of the main body is hinged to the top cover through a hinge. A handle is fixedly connected to the top of the main body. A power cord is connected to the inner end of the main body. An industrial control module is provided on the right side of the main body. A hot plate body is provided at the left end inside the main body. A heating wire is fixedly connected inside the hot plate body. A temperature controller is provided at the right end of the main body. The power cord, the hot plate body, the heating wire, and the temperature controller are all electrically connected to the industrial control module. The adjustment mechanism is fixedly installed at the lower end inside the hot plate body.

[0008] Further, the adjusting mechanism includes a rotating rod, a lead screw, a bottom plate, a first connecting rod, a second connecting rod, a top plate and a supporting mechanism. The right end of the rotating rod is rotatably connected to the heating plate body. The right end of the rotating rod rotates coaxially with the lead screw. The bottom plate is fixedly installed at the inner bottom end of the heating plate body. The lower end of the first connecting rod is rotatably connected to the bottom plate and is threadedly connected to the lead screw. The middle end of the second connecting rod is rotatably connected to the first connecting rod. The bottom end of the top plate is rotatably connected to the first connecting rod. The supporting mechanism is fixedly installed at the top end of the top plate.

[0009] Further, the supporting mechanism includes a support rod, a spring and a contact plate. The bottom of the support rod is fixedly connected to the top plate. One end of the spring is fixedly connected to the support rod. The contact plate is fixedly connected to the other end of the spring.

[0010] Further, an installation groove is provided at the lower end of the heating plate body, and an auxiliary hole is connected to the left end of the heating plate body.

[0011] Further, when there is no external force forcing the lead screw, the top surface of the support rod is flush with the top surface of the heating plate body.

[0012] Further, the top plate is perpendicularly connected to the support rod, and the upper end of the top plate is in a cylindrical structure.

[0013] Further, when there is no external force forcing the spring, the side surface of the contact plate is in contact with the heating plate body, and the upper and lower ends of the contact plate are tightly connected to the support rod.

[0014] Further, the support rods are equidistantly installed on the top of the top plate, and the distance between the support rod and the inner side surface of the heating plate body is 0.1 CM.

[0015] Further, the springs are symmetrically installed at the upper and lower ends of the contact plate, and the contact plate is fixedly installed at the left and right ends of the support rod.

[0016] Further, the support rod has shoulders, and the contact plate is fixedly installed at the left and right ends of the shoulders of the support rod.

[0017] Further, the material of the spring is piano wire.

[0018] Further, the material of the first connecting rod is aluminum alloy.

[0019] (III) Beneficial Effects

[0020] The present invention has the following beneficial effects compared with the prior art:

[0021] 1) In the wafer hot plate structure of the present invention, by providing an adjustment mechanism inside the main body, the bottom of the wafer is separated from the heating plate body, facilitating the transfer of the wafer and increasing the transfer rate, saving time, reducing contact with the wafer surface, and having simple operation and labor saving.

[0022] 2) In the corresponding structure of the adjustment mechanism, rotating the screw rod can drive the first connecting rod to rotate. The first connecting rod drives the top plate to move upward through the second connecting rod, and the top plate drives the support rod to move upward, better separating the bottom of the wafer from the heating plate body, making it more convenient to transfer the wafer and increasing the transfer rate, further saving time and simplifying the operation.

[0023] 3) In the wafer hot plate structure of the present invention, by providing a support mechanism on the top of the top plate, the support rod is placed inside the heating plate body, and the spring can drive the contact plate to approach the heating plate body, increasing the relative area between the support rod and the inside of the heating plate body, and further assisting in heating the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Other features, objects, and advantages of the present invention will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0025] Figure 1 It is a schematic structural diagram of the present invention;

[0026] Figure 2 It is a schematic diagram of the internal structure of the main body of the present invention;

[0027] Figure 3 It is a schematic diagram of the structure of the adjustment mechanism of the present invention;

[0028] Figure 4 For the present invention Figure 2 The enlarged schematic diagram of the structure at A in it;

[0029] Figure 5 It is the top view of the internal part of the main body of the present invention.

[0030] In the figure: main body - 1, top cover - 2, handle - 3, adjustment mechanism - 4, power cord - 5, industrial control module - 6, heating plate body - 7, heating wire - 8, temperature controller - 9, rotating rod - 41, screw rod - 42, bottom plate - 43, first connecting rod - 44, second connecting rod - 45, top plate - 46, support mechanism - 47, support rod - 471, spring - 472, contact plate - 473. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0032] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 , the present invention provides a wafer hot plate structure, which includes a main body 1, a top cover 2, a handle 3, an adjusting mechanism 4, a power cord 5, an industrial control module 6, a heating plate body 7, a heating wire 8 and a temperature controller 9. The top of the main body 1 is hinged to the top cover 2 through a hinge (not shown in the figure). A handle 3 is fixedly connected to the top of the main body 1. A power cord 5 is connected to the main body 1 (inner end). An industrial control module 6 is provided on the right side of the main body 1 (the industrial control module 6 can be a built-in component). A heating plate body 7 is provided at the left end inside the main body 1. A heating wire 8 is fixedly connected inside the heating plate body 7. A temperature controller 9 is provided at the right end of the main body 1. The power cord 5, the heating plate body 7, the heating wire 8 and the temperature controller 9 are all electrically connected to the industrial control module 6. The adjusting mechanism 4 is fixedly installed at the lower end inside the heating plate body 7.

[0033] As Figure 3 , the adjusting mechanism 4 includes a rotating rod 41, a lead screw 42, a bottom plate 43, a first connecting rod 44, a second connecting rod 45, a top plate 46 and a supporting mechanism 47. The right end of the rotating rod 41 is rotatably connected to the heating plate body 7 (the rotating rod 41 is rotatably connected to the heating plate body 7 through other structures of the adjusting mechanism 4 itself). The right end of the rotating rod 41 rotates coaxially with the lead screw 42. The bottom plate 43 is fixedly installed at the bottom end inside the heating plate body 7 (in combination with reference to Figure 2 ), the lower end of the first connecting rod 44 is rotatably connected to the bottom plate 43, and the lower end of the first connecting rod 44 is threadedly connected to the lead screw 42, which can provide power for the rotation of the first connecting rod 44. The middle end of the second connecting rod 45 is rotatably connected to the middle end of the first connecting rod 44. The bottom end of the top plate 46 is rotatably connected to the first connecting rod 44. The supporting mechanism 47 is fixedly installed at the top end of the top plate 46. The top plate 46 can drive the supporting rod 471 to move.

[0034] Among them, the supporting mechanism 47 includes a supporting rod 471, a spring 472 and a contact plate 473. The bottom of the supporting rod 471 is fixedly connected to the top plate 46. One end of the spring 472 is fixedly connected to the supporting rod 471. The contact plate 473 is fixedly connected to the other end of the spring 472.

[0035] Among them, an installation groove (not marked, used for installing the adjusting mechanism 4) is provided at the lower end of the heating plate body 7, and an auxiliary hole (not marked, used for installing the rotating rod 41 of the adjusting mechanism 4) is connected to the left end of the heating plate body 7. Please refer to Figure 2 and Figure 3 ) in combination.

[0036] Among them, when there is no external force forcing the lead screw 42, the top surface of the supporting rod 471 is flush with the top surface of the heating plate body 7, which improves the heating effect of the wafer. Please refer to Figure 2 andFigure 5 .

[0037] Among them, the top plate 46 is vertically connected to the support rod 471, and the top plate 46 has a cylindrical structure at the upper end, improving the movement effect of the support rod 471.

[0038] Among them, when there is no external force forcing the spring 472, the side surface of the contact plate 473 is in contact with the heating disk body 7, and the upper and lower ends of the contact plate 473 are tightly connected to the support rod 471.

[0039] Among them, the support rods 471 are equidistantly installed on the top of the top plate 46, and the interval between the support rods 471 and the inner side surface of the heating disk body 7 is 0.1 CM, facilitating the movement of the support rods 471.

[0040] Among them, the springs 472 are symmetrically installed at the upper and lower ends of the contact plate 473, and the contact plate 473 is fixedly installed at the left and right ends of the support rod 471, improving the heat receiving effect of the support rod 471. Specifically, the support rod 471 has shoulders (not marked), so that its cross-sectional structure is an inverted T shape, as Figure 4 shown, the contact plate 473 is fixedly installed at the left and right ends of the shoulders of the support rod 471.

[0041] Among them, the material of the spring 472 is piano wire, which has high strength, good elasticity, fatigue resistance, creep resistance and toughness.

[0042] Among them, the material of the first connecting rod 44 is aluminum alloy, which has the characteristics of low density, high strength and good corrosion resistance.

[0043] The spring 472 described in this patent is made of piano wire. Piano wire is cold drawn after patenting in a lead bath and has very high ultimate strength and elastic limit. It is a widely used small spring material. The quality and performance requirements of the wire are strict. In addition to tensile tests, torsion, corrosion, decarburization and other tests are also required.

[0044] The present invention provides a wafer hot plate structure through improvement, and its working principle is as follows;

[0045] First, when using this device, first place this device in the working area, and then connect the device to an external power supply to provide the electric energy required for the operation of this device;

[0046] Second, the top cover 2 can be opened through the handle 3, place the wafer to be heated on the top of the support rod 471, then cover the top cover 2, heat the heating disk body 7 through the heating wire 8, and heat the wafer accordingly. The temperature controller 9 can control the heating temperature of the heating disk body 7;

[0047] Third, after the wafer heating is completed, the rotating rod 41 can be rotated. The rotating rod 41 drives the lead screw 42 to rotate. The lead screw 42 drives the first connecting rod 44 to move on the bottom plate 43, and thereby drives the second connecting rod 45 to move. The second connecting rod 45 drives the top plate 46 to move, and thereby drives the support rod 471 to move upward;

[0048] Fourth, when the support rod 471 moves, it drives the bottom of the wafer to separate from the heating plate body 7, facilitating the transfer of the wafer. The spring 472 can drive the contact plate 473 to approach the inner side of the heating plate body 7, and thereby improve the heat transfer effect between the support rod 471 and the heating plate body 7;

[0049] Fifth, the hot plate structure can ensure the even heating of the wafer during soft baking and hard baking in the closed state.

[0050] The standard parts used in the present invention can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machines, parts, and equipment all adopt conventional models in the prior art. In addition, the circuit connection adopts the conventional connection method in the prior art, which will not be elaborated here.

[0051] This specification is described according to the embodiments, but not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art. The protection scope of the present invention is defined by the claims.

Claims

1. A wafer hot plate structure, comprising a main body (1) and a temperature controller (9). The main body (1) is hinged to a top cover (2) through a hinge. A handle (3) is fixedly connected to the top of the main body (1). The main body (1) is connected to a power cord (5). An industrial control module (6) is provided on the right side of the main body (1). A heating plate body (7) is provided inside the main body (1). A heating wire (8) is fixedly connected inside the heating plate body (7). The temperature controller (9) is provided inside the main body (1). The power cord (5), the heating plate body (7), the heating wire (8), and the temperature controller (9) are all electrically connected to the industrial control module (6); Characterized in that: It further includes an adjusting mechanism (4). The adjusting mechanism (4) is located inside the main body (1), and the adjusting mechanism (4) is fixedly installed at the lower end of the heating plate body (7); The adjusting mechanism (4) includes a rotating rod (41), a lead screw (42), a bottom plate (43), a first connecting rod (44), a second connecting rod (45), a top plate (46), and a supporting mechanism (47). The right end of the rotating rod (41) is rotatably connected to the heating plate body (7). The right end of the rotating rod (41) rotates coaxially with the lead screw (42). The bottom plate (43) is fixedly installed at the inner bottom end of the heating plate body (7). The lower end of the first connecting rod (44) is rotatably connected to the bottom plate (43), and the lower end of the first connecting rod (44) is threadedly connected to the lead screw (42). The middle end of the second connecting rod (45) is rotatably connected to the first connecting rod (44). The bottom end of the top plate (46) is rotatably connected to the first connecting rod (44). The supporting mechanism (47) is fixedly installed at the top end of the top plate (46); The supporting mechanism (47) includes a support rod (471), a spring (472), and a contact plate (473). The bottom of the support rod (471) is fixedly connected to the top plate (46). One end of the spring (472) is fixedly connected to the support rod (471). The contact plate (473) is fixedly connected to the other end of the spring (472); An installation groove is provided at the lower end of the heating plate body (7), and an auxiliary hole is connected to the left end of the heating plate body (7); When there is no external force forcing the spring (472), the side surface of the contact plate (473) is in contact with the heating plate body (7), and the upper and lower ends of the contact plate (473) are closely connected to the support rod (471).

2. A wafer hot plate structure according to claim 1, Characterized in that: When there is no external force forcing the lead screw (42), the top surface of the support rod (471) is flush with the top surface of the heating plate body (7).

3. A wafer hot plate structure according to claim 2, Characterized in that: The top plate (46) is perpendicularly connected to the support rod (471), and the upper end of the top plate (46) is in a cylindrical structure.

4. A wafer hot plate structure according to claim 3, Characterized in that: The support rods (471) are equidistantly installed on the top of the top plate (46), and the distance between the support rods (471) and the inner side surface of the heating disc body (7) is 0.1 cm.

5. A wafer hot plate structure according to claim 3, characterized in that: The springs (472) are symmetrically installed at the upper and lower ends of the contact plate (473), and the contact plate (473) is fixedly installed at the left and right ends of the support rods (471).

6. A wafer hot plate structure according to claim 5, characterized in that: The support rods (471) have shoulders, and the contact plate (473) is fixedly installed at the left and right ends of the shoulders of the support rods (471).

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