A kind of hydrophobic heat insulation cooling film and preparation method thereof
A thermal insulation and cooling, hydrophobic technology, applied in transportation and packaging, textiles and papermaking, building components, etc., can solve the problems of limiting the wide application of spraying method, efficient dissipation, solar heat entry, etc., to improve spectral performance. and hydrophobic properties, enhance tensile properties, improve the effect of hydrophobic properties
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2021-09-24
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of heat insulation materials, and in particular relates to a hydrophobic heat insulation and cooling film and a preparation method thereof. Background technique
[0002] Under the sun exposure, in order to achieve the purpose of heat insulation and cooling without energy consumption, the surface of the substrate (buildings, tents, parking sheds, cars or other equipment) can be covered with heat insulation and cooling film or directly placed on the substrate. However, almost all similar products currently on the market can only partially block the entry of sunlight energy, but cannot efficiently dissipate internal heat, such as aluminum foil. Existing heat insulation film products often use aluminum foil to reflect sunlight. Although aluminum foil can reflect infrared heat, it cannot radiate infrared heat. The heat enters the interior; the bonding strength between the aluminum foil and the substrate is poor,...
Examples
Embodiment 1
[0055] The invention discloses a hydrophobic heat-insulating and cooling film, which is a polymer porous film, which is formed by stacking polymer porous films.
[0056] In this example, the interior of the hydrophobic heat-insulating and cooling membrane is a sponge-like structure, and the pore diameters of the pores are distributed in a bimodal manner, with a wide distribution of 0.2 μm to 0.6 μm and 2 μm to 4.2 μm, respectively, and the holes pass through the holes on the walls of the holes. The nano-holes are connected.
[0057] In this embodiment, the porosity of the hydrophobic heat insulating and cooling film is 72.03%.
[0058] In this embodiment, the thickness of the hydrophobic heat insulating and cooling film is 1185 μm.
[0059] In this embodiment, the surface of the hydrophobic heat insulation and cooling film has cell-shaped holes, and the cell-shaped holes are connected to each other through nanometer holes on the wall of the holes, and the diameter of the cell...
Embodiment 2
[0073] The invention discloses a hydrophobic heat-insulating and cooling film, which is a polymer porous film, which is formed by stacking polymer porous films.
[0074] In this example, the interior of the hydrophobic heat-insulating and cooling membrane is a sponge-like structure, and the pore size of the pores is distributed in a bimodal manner. The nano-holes are connected.
[0075] In this embodiment, the porosity of the hydrophobic heat insulating and cooling film is 73.36%.
[0076] In this embodiment, the thickness of the hydrophobic heat insulating and cooling film is 1145 μm.
[0077] In this embodiment, the surface of the hydrophobic heat-insulating and cooling film has cell-shaped holes, and the cell-shaped holes are connected to each other through nanometer holes on the walls of the holes, and the diameter of the cell-shaped holes is 1 μm to 10 μm.
[0078] In this embodiment, the polymer porous membrane has a rough surface and is formed by mixing droplet polyme...
Embodiment 3
[0085] The invention discloses a hydrophobic heat-insulating and cooling film, which is a polymer porous film, which is formed by stacking polymer porous films.
[0086] In this example, the interior of the hydrophobic heat-insulating and cooling membrane is a sponge-like structure, and the pore diameters of the pores are distributed in a bimodal manner. The holes are connected.
[0087] In this embodiment, the porosity of the hydrophobic heat insulating and cooling film is 71.93%.
[0088] In this embodiment, the thickness of the hydrophobic heat insulating and cooling film is 1145 μm.
[0089] In this embodiment, the surface of the hydrophobic heat insulation and cooling film has cell-shaped holes, and the cell-shaped holes are connected to each other through nanometer holes on the walls of the holes, and the diameter of the cell-shaped holes is 5 μm to 10 μm.
[0090] In this embodiment, the polymer porous membrane has a rough surface and is formed by mixing droplet polym...