Dual-mode automated guided vehicle

Abstract

In some examples, a dual-mode automatic guided vehicle (AGV) for docking a module in a manufacturing chamber is provided. An exemplary AGV may include: a chassis for supporting the module on the AGV; a drive device for transporting the AGV to a designated location in the manufacturing chamber in a module transport mode under automatic guidance; a Cartesian x-y moving stage for moving the module to a specific docking position in an x- or y-docking direction under automatic guidance in a module docking mode; and a z-direction lifting mechanism for moving the module in a z-docking direction during the module docking mode.

Description

[0001] Priority claim

[0002] This application claims the benefit of priority to U.S. Provisional Application No. 62 / 655,026, filed on April 9, 2018 by Burkhart et al., entitled “AUTONOMOUS GUIDED VEHICLE FOR SEMICONDUCTOR EQUIPMENT TRANSPORTATION AND DOCKING,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to dual-mode automated guided vehicles (AGVs), and more particularly to AGVs for semiconductor facility transport and docking in semiconductor manufacturing bays. In one example, an AGV for moving and docking facility modules is provided. Background Art

[0004] Conventionally, in semiconductor manufacturing, the movement of wafer fabrication or processing modules within a fabrication area (also referred to as a "fabrication chamber") is accomplished manually. Since these modules often need to be very precisely aligned with each other, manual manipulation and their precise alignment can be very challenging, especially under the time pressures of modern manufacturing schedules.

[0005] For example, in the case of a vacuum cluster tool such as a deposition or etch process tool, a vacuum wafer transfer module (VTM) is typically placed in position prior to installation of the process modules. As each process module is moved into the fabrication chamber, it typically needs to be positioned very carefully and precisely relative to the other module using x, y, and z coordinates as well as a theta (rotational) component so that the ports on the process module and the VTM are precisely aligned. Typically, once certain alignment pins and mating holes on the ports are aligned, the process module can be pushed into full contact with the VTM chamber and secured thereto, thereby making a vacuum seal between the two modules. Although casters, air cushions, cranes, hoists, etc. can be used to simplify this movement and alignment work, the movement and final alignment operations can still be very repetitive and costly in time and money, especially considering the degree of docking accuracy required.

[0006] The inventors have attempted to address these shortcomings.It should be noted that the information described in this section will provide those skilled in the art with some background to the following disclosed subject matter and should not be considered as admitted prior art. Summary of the invention

[0007] In some examples, a dual-mode automatic guided vehicle (AGV) for docking a module in a manufacturing chamber is provided. An exemplary AGV may include: a chassis for supporting the module on the AGV; a drive device for transporting the AGV to a designated location in the manufacturing chamber in a module transport mode under automatic guidance; a Cartesian xy moving stage for moving the module to a specific docking position in an x- or y-docking direction under automatic guidance in a module docking mode; and a z-direction lifting mechanism for moving the module in a z-docking direction during the module docking mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Some embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings:

[0009] Figure 1 is a conceptual front view schematic diagram of a semiconductor facility transport and docking vehicle according to an example embodiment.

[0010] Figure 2 is a block diagram illustrating an example of a machine or controller for guiding an AGV according to various embodiments, or a block diagram on which one or more exemplary methods may be implemented or controlled. DETAILED DESCRIPTION

[0011] The following description includes systems, methods, techniques, instruction sequences, and computing machine program products that implement exemplary embodiments of the present disclosure. In the following description, for the purpose of explanation, many specific details are provided to provide a thorough understanding of the exemplary embodiments. However, it is apparent to those skilled in the art that the present disclosure may be practiced without these specific details.

[0012] A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by any person of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all copyright rights whatsoever. The following statement applies to any data as described below and in the accompanying drawings that form a part of this document: Copyright Lam Research Corporation, 2018-2019, All Rights Reserved.

[0013] As described above, in semiconductor manufacturing facilities (fabrication rooms), operators typically manually transport processing modules and other wafer processing or inspection modules from one site to another (e.g., from a manufacturing plant's dump to a designated facility room). Modules are typically very heavy items. Once the modules are roughly placed in the room, operators typically maneuver the modules by hand to precisely specified positions for docking operations. For example, for a processing module to be docked on a transport module, this precise step requires skilled and careful handling and adjustment of the module's position in the x, y, z, and θ (rotation) directions. The need for careful positioning can present significant production challenges and inject delays into the production schedule.

[0014] exist Figure 1 , a front view schematic diagram of a dual-mode automated guided vehicle 100 according to the present disclosure is provided. The vehicle is also referred to as an automated guided vehicle and will be referred to as AGV100 in this article.

[0015] AGVs are typically configured to work in constrained spaces. The space immediately adjacent to the AGV may be very limited in use. In some examples, the AGV is narrow relative to its length and is configured to fit within the contours of the manufacturing room in which it is intended to be used. The narrow configuration of the AGV allows various other process modules (PMs) to be placed on either side of the process module installed by the AGV 100. In addition, for reasons of stability or limited overhead space, the PM may need to be very close to the manufacturing plant floor when installed. The AGV is configured to provide this functionality.

[0016] exist Figure 1 In the exemplary AGV 100 shown, Figure 1 As shown, the AGV load (e.g., PM 114) is supported directly above the AGV 100. In other examples, the AGV 100 can have an overall construction similar to a forklift, so that the load positioning mechanism is not placed directly under the AGV load, but is supported on the side of the AGV, which is supported by a counterweight (including, for example, a battery) positioned on the opposite end of the AGV. The AGV 100 shown can move automatically on the floor 102 of the manufacturing room without human power or control. The AGV 100 has a chassis 104 supported and powered by wheels or tracks 106. In this case, the wheels 106 provide propulsion and allow rotation at one or both ends of the AGV 100 (i.e., dual-head steering and / or all-wheel drive). In the example AGV 100 shown, the shaft 108 extends between the two wheels 106 shown. A steering wheel 106 is provided at each end of the shaft 108. The steering wheel 106 can be powered by one or more electric or hydraulic motors to provide linear and rotational motion. Other power and steering arrangements (eg, steered shafts) are also possible.

[0017] The chassis 104 includes a platform 110 that supports a Cartesian xy mobile stage 112. In an exemplary embodiment, the Cartesian xy mobile stage 112 has fine motor control to impart precise motion to an object supported by the platform 110. Such controlled, precise motion can be employed when docking semiconductor modules such as a semiconductor manufacturing module 114 carried by the AGV 100. For example, the semiconductor manufacturing module 114 can be docked to a transport module by the AGV 100 in a "module docking" mode or phase. The module docking mode can include fine, precise motion imparted by the Cartesian xy mobile stage 112, and can include active operation in an entire module installation sequence, which includes, for example, module transport and module docking phases. During these phases, the AGV can employ corresponding module transport and module docking modes.

[0018] In some examples, a Cartesian xy mobile stage 112 may rotate on the AGV 100. The mobile stage 112 is controllably rotated by an indexing motor (not shown) that is capable of imparting fine rotational motion increments to the stage 112. For example, during module docking or module transport phases, motion in the theta direction (i.e., rotation and counter-rotation) may be imparted to the Cartesian table. In other arrangements, one or servo motors may be used.

[0019] In some examples, the z-direction component of the module docking phase or mode can be provided by a lift (or tilt) mechanism 116 positioned between the Cartesian xy translation stage 112 and the loading bed 118. Other arrangements are possible. The loading bed 118 carries the semiconductor manufacturing module 114 and is secured thereto by module retaining clips or bolts 120. For convenience, some of the module retaining bolts may pass through holes or channels in the loading bed 118. Effective operation in the module docking phase can be supplemented simultaneously or sequentially by very fine precision motions imparted in the z-direction by the lift mechanism 116. Under the action of the controller or machine 200 described further below, the x, y, z, and θ motions imparted by the components just described can occur independently of each other, simultaneously or sequentially.

[0020] AGV 100 has two (or dual) operation modes. In the AGV "transport" mode in the module transport stage, for example, the semiconductor manufacturing module 114 can be placed in the manufacturing chamber using the (relatively) rough planar motion applied by the power wheel 106 and the axle 108, and is usually located in a designated site in the manufacturing chamber. Once driven to a designated site in the chamber, such as a neighboring VTM chamber, the wheels 106 of the AGV 100 are locked, and the AGV 100 provides a stable foundation for the start of the above-mentioned "module docking" stage. In the "module docking" mode, the (relatively) fine motion in the x, y, z and θ directions is given to the module 114 by a rotatable Cartesian xy mobile stage 112 and a lifting mechanism 116 to automatically move the module 114 to a specific docking position. At this specific docking site, the module 114 can be firmly docked to the VTM chamber. As discussed above, automatically moving to a designated site in the manufacturing chamber and a specific docking site can reduce the significant risk of causing personal injury as discussed above.

[0021] In some examples, to guide such fine movements, sensors or cameras 122 on the AGV 100 monitor reference or positioning features on the VTM chamber and provide observation data, which is used by the controller 200 to instruct the stage 112 and the lifting mechanism 116 and guide the semiconductor manufacturing module 114 to the desired precise docking position. In one example, a deployable tool driver is assembled to the AGV 100. Once the semiconductor manufacturing module 114 is docked, one or more tool drivers operate to install and twist the mounting bolts in a predetermined manner and to achieve the desired torque value. Other fasteners or clamps can be used. The mounting bolts, fasteners or clamps can be installed manually or automatically.

[0022] In one example, the AGV 100 or controller 200 is taught by machine learning a path from one site to another (e.g., from a trash area to a specific room). In some examples, after the semiconductor manufacturing module 114 has been delivered and docked, the AGV 100 returns to the trash area by itself by following the learned path in reverse.

[0023] In other examples, the path of the AGV 100 from its initial loading point to the interior of the semiconductor tool room (fabrication room) can be defined by lines (e.g., tape), targets, or other references applied to the carrier, the floor is defined by general loading and / or installation procedures, or by tool facility templates that define floor cutouts within the tool room area. In some examples, a separate set of lines, targets, or other references can be used to navigate the forward and reverse direction of the AGV 100 so that the wheels 106 avoid all floor cutouts and present the cargo (e.g., PM) in an approximate orientation required for docking.

[0024] In some examples, the AGV 100 is configured for the type and / or unit number of the cargo (e.g., PM) loaded thereon. The details of the loaded cargo may be manually entered into the processor by an operator or may be automatically determined using onboard sensors so that once the AGV 100 arrives in the vicinity of the semiconductor tool room, the AGV 100 follows the appropriate line, target, or other reference for the grouping of the particular cargo.

[0025] In some examples, the AGV 100 is equipped with cameras and sensors to provide obstacle and personnel avoidance capabilities, as well as accelerometers to help optimize transport speeds and accelerations for fast but safe transport. For example, such optimizations can reduce the risk of tipping over and reduce potentially damaging accelerations when floor thresholds and seams are exceeded. For example, some exemplary AGVs 100 can sense and avoid missing floor tiles, overhead and side obstacles, and manufacturing personnel.

[0026] In some examples, an unloaded AGV 100 may be collapsed or folded in length, width, and / or height for transport purposes, or in some cases such that a folded AGV 100 is moved around loaded AGVs 100 positioned in a narrow manufacturing plant corridor, e.g., where more than one AGV 100 is in operation.

[0027] Therefore, in some examples, a dual-mode automatic guided vehicle (AGV) for docking a module in a manufacturing chamber is provided, the AGV comprising: a chassis for supporting the module on the AGV; a drive device for transporting the AGV to a designated location in the manufacturing chamber in a module transport mode under automatic guidance; a Cartesian xy moving table for moving the module to a specific docking position along an x- or y-docking direction under automatic guidance in a module docking mode; and a z-direction lifting mechanism for moving the module along the z-docking direction during the module docking mode.

[0028] In some examples, the Cartesian xy translation stage can be operated independently of the drive device.

[0029] In some examples, the z-direction lift mechanism is operable independently of the drive device and the Cartesian xy translation stage.

[0030] In some examples, in the module docking mode, the Cartesian xy translation stage restricts movement of the module out of a docking zone.

[0031] In some examples, the designated location of the AGV in the manufacturing room and the specific docking position are both within the docking area.

[0032] In some examples, the designated location of the AGV in the manufacturing room is outside the docking area, and wherein the specific docking position is within the docking area, and wherein the Cartesian xy movement stage is configured to automatically move the module into the docking area and to the specific docking position.

[0033] In some examples, the Cartesian xy translation stage can rotate on the AGV to impart rotational motion to the module in the module transport mode and the module docking mode.

[0034] In some examples, the AGV further includes an indexing motor to rotate the Cartesian xy stage in specified rotational increments.

[0035] In some examples, the AGV further includes a tilt device for moving a surface of the module out of an xy plane initially defined by the Cartesian xy table.

[0036] In some examples, the drive device, the Cartesian xy translation stage, the indexing motor, the lifting mechanism, and the tilting device can be operated simultaneously and independently of each other in the module transport mode and the module docking mode.

[0037] In some examples, the AGV further comprises at least one AGV sensor to detect or communicate with external references or site features of the manufacturing room. In some examples, the at least one AGV sensor collects observation data in the module transport mode and the module docking mode and transmits the observation data to an external controller.

[0038] In some examples, the AGV receives navigation commands from the external controller based on the observation data to automatically guide the AGV in the module transport mode and the module docking mode.

[0039] In some examples, the external controller is machine trained based on the observation data to configure module transport and module docking paths to guide the module to the specific docking location.

[0040] In some examples, the AGV further includes a tool driver tool to dock the module with other facilities at the specific docking position.

[0041] Figure 2is a block diagram showing an example of a controller or machine 200, by which the AGV 100 and one or more of the example methods described herein may be controlled. In alternative embodiments, the machine 200 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 200 may operate in the capacity of a server machine, a client machine, or both a server machine and a client machine in a server-client network environment. In one example, the machine 200 may act as a peer machine in a point-to-point (P2P) (or other distributed) network environment. In addition, although only a single machine 200 is described, the term "machine" should also be considered to include a collection of any machines that individually or collectively execute a set (or multiple sets) of instructions to perform any one or more of the methods discussed herein, such as via cloud computing, software as a service (SaaS), or other computer cluster configurations.

[0042] Examples as described herein may include logic, multiple components or mechanisms, or may be operated by logic, multiple components or mechanisms. A circuit system is a collection of circuits implemented in a tangible entity, including hardware (e.g., simple circuits, gates, logic, etc.). Circuit system qualifications may be flexible over time and with potential hardware variability. A circuit system includes components that can perform specified operations individually or in combination when operating. In one example, the hardware of the circuit system may be designed to perform specific operations (e.g., hardwired) invariably. In one example, the hardware of the circuit system may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.), which include computer-readable media modified by physical properties (e.g., magnetism, electrical properties, movable placement of unchanged cluster particles, etc.) to encode instructions for specific operations. In terms of connecting physical components, the potential electrical properties of hardware components are changed (e.g., from insulators to conductors, or vice versa). Instructions enable embedded hardware (e.g., execution units or loading mechanisms) to establish components of the circuit system in hardware via variable connections to perform partial specific operations when operating. Thus, when the device is operating, the computer readable medium is communicatively coupled to other components of the circuit system. In one example, any of the physical components can be used in more than one component of more than one circuit system. For example, in an operational state, an execution unit can be used in a first circuit of a first circuit system at one point in time and reused by a second circuit in the first circuit system, or by a third circuit in the second circuit system at a different time.

[0043] The machine (e.g., computer system) 200 may include a hardware processor 202 (e.g., a central processing unit (CPU), a hardware processor core, or any combination thereof), a graphics processing unit (GPU) 203, a main memory 204, and a static memory 206, some or all of which may communicate with each other via an interconnection link (e.g., a bus) 208. The machine 200 may also include a display device 210, an alphanumeric input device 212 (e.g., a keyboard), and a user interface (UI) navigation device 214 (e.g., a mouse). In one example, the display device 210, the alphanumeric input device 212, and the UI navigation device 214 may be a touch screen display. The machine 200 may additionally include a mass storage device (e.g., a drive unit) 216, a signal generating device 218 (e.g., a speaker), a network interface device 220, and one or more sensors 221 (such as a global positioning system (GPS) sensor, a compass, an accelerometer, or another sensor). The machine 200 may include an output controller 228, such as a serial (e.g., universal serial bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, to communicate with or control one or more peripheral devices (e.g., a printer, a card reader, etc.).

[0044] The mass storage device 216 may include a machine-readable medium 222 on which is stored one or more sets of data structures or instructions 224 (e.g., software) embodied or utilized by any one or more of the techniques or functionality described herein. The instructions 224 may also reside, completely or at least partially, within the main memory 204, within the static memory 206, within the hardware processor 202, or within the GPU 203 during execution thereof by the machine 200. In an example, one or any combination of the hardware processor 202, the GPU 203, the main memory 204, the static memory 206, or the mass storage device 216 may constitute the machine-readable medium 222.

[0045] Although the machine-readable medium 222 is illustrated as a single medium, the term “machine-readable medium” may include a single medium or multiple media (eg, a centralized or distributed database, and / or associated caches and servers) configured to store one or more instructions 224 .

[0046] The term "machine-readable medium" may include any medium that can store, encode, or carry instructions 224 for execution by the machine 200 and cause the machine 200 to perform any one or more of the techniques of the present disclosure, or that can store, encode, or carry data structures used by or associated with the instructions 224. Non-limiting examples of machine-readable media may include solid-state memory, and optical and magnetic media. In one example, the clustered machine-readable medium includes a machine-readable medium 222 having a plurality of particles, the particles having a constant (e.g., stationary) mass. Therefore, the clustered machine-readable medium is not a transient propagating signal. Specific examples of the clustered machine-readable medium may include non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks. The instructions 224 may also be transmitted or received over the communication network 226 via the network interface device 220 using a transmission medium. .

[0047] Although the embodiments have been described with reference to specific exemplary embodiments, it is obvious that various modifications and changes can be made to these embodiments without departing from the broader spirit and scope of the present invention. Therefore, the description and the drawings should be regarded as illustrative rather than restrictive. The drawings forming a part of this article show specific embodiments by way of illustration and not limitation, in which the subject matter can be implemented. The illustrated embodiments are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments can be used and derived therefrom, so that structural and logical substitutions and changes can be made without departing from the scope of the present disclosure. Therefore, the specific implementation should not be regarded as having a limiting meaning, and the scope of the various embodiments is limited only by the attached claims and the complete scope of the equivalent schemes given with these claims.

[0048] Such embodiments of the subject matter of the present invention may be referred to herein individually and / or collectively by the term "invention" for convenience only, and if more than one invention or inventive concept is in fact disclosed, it is not intended to automatically limit the scope of the present application to any single invention or inventive concept. Therefore, although specific embodiments have been illustrated and described herein, it should be understood that any configuration calculated to achieve the same purpose may replace the specific embodiments shown. The present disclosure is intended to cover any and all adaptations or variations of the various embodiments. Upon reviewing the above description, the combination of the above embodiments with other embodiments not specifically described herein will be apparent to those skilled in the art.

Claims

1. A dual-mode automated guided vehicle (AGV) for docking a module in a manufacturing chamber, the AGV comprising: a chassis for supporting the module on the AGV; A driving device, which is used to transport the AGV to a designated place in the manufacturing room in a module transport mode under automatic guidance; a Cartesian xy translation stage for moving the module in a module docking mode under automatic guidance along an x- or y-docking direction to a specific docking position, wherein in the module docking mode, the Cartesian xy translation stage restricts movement of the module out of the docking area; and A z-direction lifting mechanism is used to move the module along a z-docking direction during the module docking mode.

2. The AGV according to claim 1, wherein: The Cartesian xy translation stage can be operated independently of the drive means.

3. The AGV according to claim 1, wherein: The z-direction lifting mechanism is operable independently of the drive device and the Cartesian xy translation stage.

4. The AGV according to claim 1, wherein: The designated location and the specific docking position of the AGV in the manufacturing room are both within the docking area.

5. The AGV according to claim 1, wherein: The designated location of the AGV in the manufacturing room is outside the docking area, and wherein the specific docking position is within the docking area, and wherein the Cartesian xy movement stage is configured to automatically move the module into the docking area and to the specific docking position.

6. The AGV according to claim 1, wherein: The Cartesian xy translation stage is rotatable on the AGV to impart rotational motion to the module in the module transport mode and the module docking mode.

7. The AGV of claim 6, further comprising an indexing motor to rotate the Cartesian xy translation stage in specified rotational increments.

8. The AGV of claim 7, further comprising a tilt device for moving a surface of the module out of an xy plane initially defined by the Cartesian xy table.

9. The AGV according to claim 8, wherein: In the module transport mode and the module docking mode, the drive means, the Cartesian xy translation stage, the indexing motor, the lifting mechanism and the tilting device can be operated simultaneously and independently of each other.

10. The AGV of claim 1 further comprising at least one AGV sensor to detect or communicate with external references or site features of the fabrication cell.

11. The AGV according to claim 10, wherein: The at least one AGV sensor collects observation data in the module transport mode and the module docking mode and transmits the observation data to an external controller.

12. The AGV according to claim 11, wherein: The AGV receives navigation commands from the external controller based on the observation data to automatically guide the AGV in the module transport mode and the module docking mode.

13. The AGV according to claim 12, wherein: The external controller is machine trained based on the observation data to construct a module transport and module docking path to guide the module to the specific docking position.

14. The AGV of claim 1, further comprising a tool driver tool to dock the module with other facilities at the specific docking position.

15. A dual-mode automated guided vehicle (AGV) for docking a module in a manufacturing chamber, the AGV comprising: a chassis for supporting the module on the AGV; A driving device, which is used to transport the AGV to a designated place in the manufacturing room in a module transport mode under automatic guidance; a Cartesian xy moving stage for moving the module in a module docking mode under automatic guidance along an x- or y-docking direction to a specific docking position; a z-direction lifting mechanism for moving the module in a z-docking direction during the module docking mode; as well as A tilting device is provided for moving a surface of the module out of an xy plane initially defined by the Cartesian xy table.

16. The AGV of claim 15, wherein: The Cartesian xy translation stage can be operated independently of the drive means.

17. The AGV of claim 15, wherein: The z-direction lifting mechanism is operable independently of the drive device and the Cartesian xy translation stage.

18. The AGV of claim 15, wherein: In the module docking mode, the Cartesian xy translation stage restricts movement of the module out of the docking area.

19. The AGV of claim 18, wherein: The designated location and the specific docking position of the AGV in the manufacturing room are both within the docking area.

20. The AGV of claim 18, wherein: The designated location of the AGV in the manufacturing room is outside the docking area, and wherein the specific docking position is within the docking area, and wherein the Cartesian xy movement stage is configured to automatically move the module into the docking area and to the specific docking position.

21. The AGV of claim 15, wherein: The Cartesian xy translation stage is rotatable on the AGV to impart rotational motion to the module in the module transport mode and the module docking mode.

22. The AGV of claim 21 further comprising an indexing motor to rotate the Cartesian xy translation stage in specified rotational increments.

23. The AGV of claim 22, wherein: In the module transport mode and the module docking mode, the drive means, the Cartesian xy translation stage, the indexing motor, the lifting mechanism and the tilting device can be operated simultaneously and independently of each other.

24. The AGV of claim 15, further comprising at least one AGV sensor to detect or communicate with external references or site features of the fabrication cell.

25. The AGV of claim 24, wherein: The at least one AGV sensor collects observation data in the module transport mode and the module docking mode and transmits the observation data to an external controller.

26. The AGV of claim 25, wherein: The AGV receives navigation commands from the external controller based on the observation data to automatically guide the AGV in the module transport mode and the module docking mode.

27. The AGV of claim 26, wherein: The external controller is machine trained based on the observation data to construct a module transport and module docking path to guide the module to the specific docking position.

28. The AGV of claim 15, further comprising a tool driver tool to dock the module with other facilities at the specific docking position.

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