Heat sink assembly of an electrical connector

Abstract

A heat sink assembly (200) includes: an upper heat sink element (202) having an upper plate (210), each upper plate having a side between a front end and a rear end (240, 242) and having an inner end and an outer end (216, 218); and a lower heat sink element (204) having a lower plate (250), each lower plate having a side (254) between a front end and a rear end and having an inner end and an outer end (256, 258). The lower plate includes a lower spacer plate (262) and a lower interface plate (260), the outer end of which is thermally coupled to the pluggable module (106). The lower interface plate includes interface fins (270) that butt against the upper plate. The heat sink assembly includes a spring element (206) having an upper spring member (450) that engages the inner end of the upper plate to bias the upper plate away from the lower plate in a first biasing direction, and a lower spring member (452) that engages the inner end of the lower plate to bias the lower plate away from the upper plate in a second biasing direction.

Description

Technical Field

[0001] The subject matter of the present disclosure generally relates to electrical connector assemblies. Background Art

[0002] It may be desirable to transfer thermal energy (or heat) away from a designated component of a system or device. For example, an electrical connector may be used to transfer data and / or power to and from different systems or devices. One type of electrical connector assembly uses a pluggable module received within a receptacle assembly. Data signals may be transmitted through one or more communication cables in the form of optical signals and / or electrical signals.

[0003] A common challenge faced by developers of electrical systems is thermal management. Thermal energy generated by electronic devices within a system can degrade performance and even damage components of the system. To dissipate thermal energy, the system includes a thermal component, such as a thermal bridge, that engages a heat source, absorbs thermal energy from the heat source, and transfers the thermal energy away. The thermal bridge is typically thermally coupled to another thermal component at another thermal interface. Components lose efficiency at each thermal interface. Additionally, due to variations in surfaces, such as due to surface flatness of the interface surfaces, it is difficult to achieve efficient thermal coupling at the interfaces.

[0004] Accordingly, there is a need for a heat transfer assembly that transfers thermal energy away from a component, such as internal electronics of an electrical connector, and has reduced thermal resistance. Summary of the Invention

[0005] According to the present invention, there is provided a heat sink assembly. The heat sink includes an upper heat sink element. The upper heat sink element includes a plurality of upper plates arranged as an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has a side surface between the front end and the rear end. Each upper plate has an inner end and an outer end. The heat sink includes a lower heat sink element. The lower heat sink element includes a plurality of lower plates arranged as a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has a side surface between the front end and the rear end. Each lower plate has an inner end and an outer end. The lower plates include a lower spacer plate and a lower interface plate. The outer end of the lower spacer plate and the outer end of the lower interface plate are configured to face and be thermally coupled to an electronic module. The lower interface plate includes interface fins that extend above the inner end of the lower spacer plate to interface with the upper plates. The heat sink assembly includes a spring element disposed between the upper heat sink element and the lower heat sink element. The spring element includes an upper spring member that engages the inner end of the upper plate. The upper spring member biases the upper plate generally away from the lower plate in a first biasing direction. The spring element includes a lower spring member that engages the inner end of the lower plate. The lower spring element biases the lower plate generally away from the upper plate in a second biasing direction. Brief Description of the Drawings

[0006] Figure 1 is a front perspective view of an electrical connector assembly having a heat sink assembly formed in accordance with an exemplary embodiment.

[0007] Figure 2 is a rear perspective view of a pluggable module for an electrical connector assembly according to an exemplary embodiment.

[0008] Figure 3 is a cross-sectional view of a heat sink assembly according to an exemplary embodiment.

[0009] Figure 4 is a front perspective view of a spring element of a heat sink assembly according to an exemplary embodiment.

[0010] Figure 5 is a cross-sectional view of a portion of a socket assembly according to an exemplary embodiment, showing the heat sink assembly.

[0011] Figure 6 is a cross-sectional view of a portion of a socket assembly according to an exemplary embodiment, showing the heat sink assembly. Detailed Description

[0012] Figure 1 is a front perspective view of an electrical connector assembly 100 formed according to an exemplary embodiment. The electrical connector assembly 100 includes a main circuit board 102 and a socket assembly 104 mounted to the circuit board 102. A pluggable module 106 is configured to be electrically connected to the socket assembly 104. The pluggable module 106 is electrically connected to the circuit board 102 through the socket assembly 104.

[0013] In an exemplary embodiment, the socket assembly 104 includes a socket cage 110 and a communication connector 112 (shown in dashed lines) adjacent to the socket cage 110. For example, in the illustrated embodiment, the communication connector 112 is received within the socket cage 110. In various other embodiments, the communication connector 112 may be located behind the socket cage 110. In various embodiments, the socket cage 110 is enclosed and provides electrical shielding for the communication connector 112. The pluggable module 106 is configured to be loaded into the socket cage 110 and surrounded by the socket cage 110. The socket cage 110 includes a plurality of cage walls 114 that define one or more module channels for receiving corresponding pluggable modules 106. The cage walls 114 may be walls defined by solid sheets, perforated walls that allow air flow therethrough, walls having cutouts (e.g., for allowing a heat sink or radiator to pass therethrough), or walls defined by tracks or beams having relatively large openings (e.g., for allowing air flow therethrough). In an exemplary embodiment, the socket cage 110 is a shielded, stamped cage member, where the cage walls 114 are shielding walls.

[0014] In the illustrated embodiment, the socket cage 110 constitutes a stacked cage member having an upper module channel 116 and a lower module channel 118. The socket assembly 104 is configured to mate with the pluggable module 106 in two stacked module channels 116, 118. The socket cage 110 has module ports leading to the module channels 116, 118 respectively, which receive corresponding upper and lower pluggable modules 106. Any number of module channels may be provided in various embodiments. In the illustrated embodiment, the socket cage 110 includes an upper module channel 116 and a lower module channel 118 arranged in a single column; however, in alternative embodiments, the socket cage 110 may include multiple columns of grouped module channels 116, 118 (e.g., 2X2, 3X2, 4X2, 4X3, etc.). Optionally, a plurality of communication connectors 112 may be arranged within the socket cage 110, such as when multiple columns of module channels 116 and / or 118 are provided. In various other embodiments, the socket cage 110 may include a single module channel 116 or a single row of module channels 116 instead of a stacked socket cage.

[0015] In an exemplary embodiment, the cage wall 114 of the socket cage 110 includes a top wall 130, a bottom wall 132, side walls 134, and a rear wall 136. The bottom wall 132 may rest on the main circuit board 102. However, in alternative embodiments, the socket cage 110 may not have a bottom wall 132. The socket cage 110 extends between a front end 138 and a rear end 139. A plurality of ports are provided at the front end 138 and receive the pluggable module 106 through the front end 138. The cage wall 114 defines a cavity 140. For example, the cavity 140 may be defined by the top wall 130, the bottom wall 132, the side walls 134, 136, and the rear wall 136. Other cage walls 114 may separate or divide the cavity 140 into respective module channels 116, 118. For example, the cage wall 114 may include a port spacer 142 between the upper module channel 116 and the lower module channel 118. The port spacer 142 forms a space between the upper module channel 116 and the lower module channel 118, such as for air flow or for routing optical tubes. In various other embodiments, the cage wall 114 may include vertical partition panels (not shown) between grouped module channels 116 and / or 118, such as parallel to the side wall 134.

[0016] The socket assembly 104 includes a heat sink assembly 200 for dissipating heat from the pluggable module 106, such as the upper pluggable module 106 in the upper module channel 116. In an exemplary embodiment, the heat sink assembly 200 includes an upper heat sink element 202, a lower heat sink element 204, and a spring element 206 between the upper heat sink element 202 and the lower heat sink element 204 (as Figure 4As shown). The lower heat sink element 204 is configured to thermally engage and receive the upper pluggable module 106 in the upper module channel 116. The upper heat sink element 202 is configured to dissipate heat to the external environment outside the socket cage 110 (e.g., above the socket cage 110). The upper heat sink element 202 is in thermal communication with the lower heat sink element 204 and dissipates heat from the lower heat sink element 204 to cool the pluggable module 106. In the illustrated embodiment, the upper heat sink element 202 is a finned heat sink having fins extending upward to transfer heat to the passing air flow. In various other embodiments, the upper heat sink element 202 can be a heat sink, a heat bridge, a cold plate, etc. The upper heat sink element 202 can be thermally coupled to another heat component, such as a heat sink, to dissipate heat from the heat sink assembly 200.

[0017] In an exemplary embodiment, the heat sink assembly 200 is coupled to the frame 300. The frame 300 extends from the socket cage 110, e.g., from the top wall 130. The lower heat transfer element 204 can extend through an opening in the frame 300 to directly engage the pluggable module 106.

[0018] The frame 300 includes a front rail 302, a rear rail 304, and side walls 306, 308 extending between the front rail 302 and the rear rail 304. The upper heat sink element 202 and the lower heat sink element 204 are contained between the side walls 306. In an exemplary embodiment, the upper heat sink element 202 is coupled to the front rail 302, and the rear rail 304 and the lower heat sink element 204 are coupled to the front rail 302 and the rear rail 304. In an exemplary embodiment, the spring element 206 presses the upper heat sink element 202 outwardly against the front rail 302 and the rear rail 304 in a first biasing direction (e.g., upward), and the spring element 206 presses the lower heat sink element 204 outwardly against the front rail 302 and the rear rail 304 in a second biasing direction (e.g., downward). The upper heat sink element 202 and the lower heat sink element 204 can be held within the frame 300. Alternatively, the frame 300 can allow a limited amount of floating movement of the upper heat sink element 202 and the lower heat sink element 204 within the frame 300, such as lateral and / or front-to-back.

[0019] The communication connector 112 is coupled to the circuit board 102. The socket cage 110 is mounted to the circuit board 102 above the communication connector 112. In an exemplary embodiment, the communication connector 112 is received within the cavity 140, such as near the rear wall 136. However, in an alternative embodiment, the communication connector 112 may be located behind the rear wall 136 outside of the socket cage 110 and extend into the cavity 140 to mate with the (plurality of) pluggable modules 106. For example, the rear wall 136 may include an opening through which a component is received. In an exemplary embodiment, a single communication connector 112 is used to electrically connect to a pair of stacked pluggable modules 106 in the upper module channel 116 and the lower module channel 118. In an alternative embodiment, the electrical connector assembly 100 may include discrete, stacked communication connectors 112 (e.g., an upper communication connector and a lower communication connector) for mating with corresponding pluggable modules 106.

[0020] In an exemplary embodiment, the pluggable module 106 is loaded into the socket cage 110 through the front end 138 to mate with the communication connector 112. The shield cage wall 114 of the socket cage 110 provides electrical shielding around the communication connector 112 and the pluggable module 106, such as around the mating interface between the communication connector 112 and the pluggable module 106.

[0021] Figure 2 is a rear perspective view of the pluggable module 106 according to an exemplary embodiment. The pluggable module 106 has a pluggable body 180, which may be defined by one or more housings. The pluggable body 180 includes sides, a top, and a bottom. The pluggable body 180 may be thermally conductive and / or may be electrically conductive to provide EMI shielding for the pluggable module 106. The pluggable body 180 includes a mating end 182 and an opposite front end 184. The front end 184 may be a cable end that has a cable extending therefrom to another component within the system. The mating end 182 is configured to be inserted into the corresponding module channel 116 or 118 (as Figure 1 shown).

[0022] The pluggable module 106 includes a module circuit board 188, which is configured to communicatively couple to the communication connector 112 (as Figure 1 shown). The module circuit board 188 may be accessed at the mating end 182. The module circuit board 188 may include components, circuitry, etc. for operating and / or using the pluggable module 106. For example, the module circuit board 188 may have conductors, traces, pads, electronics, sensors, controllers, switches, inputs, outputs, etc. associated with the module circuit board 188, which may be mounted to the module circuit board 188 to form various circuits.

[0023] In an exemplary embodiment, the pluggable body 180 provides heat transfer for the modular circuit board 188, such as for the electronic components on the modular circuit board 188. For example, the modular circuit board 188 is in thermal communication with the pluggable body 180, and the pluggable body 180 transfers heat from the modular circuit board 188. In an exemplary embodiment, the pluggable body 180 includes a thermal interface along the top for docking with a heat sink assembly 200 (such as Figure 1 as shown).

[0024] Figure 3 is a cross-sectional view of a heat sink assembly 200 according to an exemplary embodiment. The heat sink assembly 200 includes an upper heat sink element 202 and a lower heat sink element 204. A spring element 206 is located between the upper heat sink element 202 and the lower heat sink element 204 at the interface region 208 of the heat sink assembly 200. A frame 300 holds the upper heat sink element 202 and the lower heat sink element 204. In an exemplary embodiment, the upper heat sink element 202 is movable relative to the lower heat sink element 204. For example, the spring element 206 forces the upper heat sink element 202 and the lower heat sink element 204 apart from each other. The spring element 206 forces the upper heat sink element 202, for example, upward in a first biasing direction and forces the lower heat sink element 204, for example, downward in a second biasing direction. In an exemplary embodiment, the spring element 206 is separate and discrete from the upper heat sink element 202 and the lower heat sink element 204. The spring element 206 can be a stamping. The spring element 206 is made of a thin metal material such that the spring element 206 is flexible.

[0025] In an exemplary embodiment, each of the heat sink elements 202, 204 includes a plurality of plates that are arranged together to form a stack of plates. The plates are interleaved to provide thermal communication between the upper heat sink element 202 and the lower heat sink element 204. Each plate is movable relative to the others such that the plates can be individually hinged to conform to the upper surface of the pluggable module 106 (such as Figure 2 as shown) to improve the contact and / or proximity between the heat sink assembly 200 and the pluggable module 106. A gap or space can be provided between the plates of the heat sink elements 202, 204 to allow for the compressible movement of the spring element 206 between the heat sink elements 202, 204.

[0026] In an exemplary embodiment, the upper heat sink element 202 includes a plurality of upper plates 210 arranged as an upper plate stack 212. Each upper plate 210 has a side surface 214 extending between an inner end 216 and an outer end 218 of the upper plate 210. The inner end 216 faces the lower heat sink element 204. The outer end 218 is located outside the frame 300, for example, above the top frame, for example, for air cooling or for connection to another heat component, such as a radiator. Optionally, the respective upper plates 210 may have different heights between the inner end 216 and the outer end 218. For example, some upper plates 210 may be taller to form heat dissipation fins for the heat sink assembly 200 for air flow cooling of the upper heat sink element 202.

[0027] In an exemplary embodiment, the upper plate 210 includes an upper fin plate 220, an upper spacer plate 222, and an upper interface plate 224. The upper fin plate 220 is taller than the spacer plate 222 and extends further outward than the upper spacer plate 222 and the upper interface plate 224. For example, the outer end 218 of the upper fin plate 220 is positioned further away from the lower heat sink element 204 than the outer end 218 of the upper spacer plate 222 and the outer end 218 of the upper interface plate 224. Each upper fin plate 220 includes a base 230 at the inner end 216 and heat dissipation fins 232 at the outer end 218. The upper fin plates 220 are arranged relative to each other at spaced positions within the upper plate stack 212 such that air flow channels 234 are formed between the heat dissipation fins 232. The air flow channels 234 are located outside the frame 300 to allow air flow to pass along the side surface 214 of the upper fin plates 220 through the upper heat sink element 202 for convective cooling of the upper heat sink element 202. The inner end 216 of the upper interface plate 224 extends into the interface region 208 to dock with the lower heat sink element 204. The upper interface plate 224 includes interface fins 236 that extend into the interface region 208 to thermally couple to the lower heat sink element 204. The upper interface plate 224 includes a base 238 at the outer end 218. The base 238 docks with the upper fin plate 220 and the upper spacer plate 222.

[0028] In an exemplary embodiment, the lower heat sink element 204 includes a plurality of lower plates 250 arranged as a lower plate stack 252. Each lower plate 250 has a side surface 254 extending between an inner end 256 and an outer end 258 of the lower plate 250. The inner end 256 faces the upper heat sink element 202. The outer end 258 may be located outside the frame 300, for example, below the bottom of the frame 300, for example, for thermal coupling to the pluggable module 106 (or another heat component, such as a radiator). Optionally, the respective lower plates 250 may have different heights between the inner end 256 and the outer end 258. For example, some lower plates 250 may be taller to form interface fins that span the gap between the heat sink elements 202, 204 to dock with the upper heat sink element 202.

[0029] In an exemplary embodiment, the lower plate 250 includes a lower interface plate 260 and a lower spacer plate 262. In the illustrated embodiment, the lower plate stack 252 has a plate arrangement of alternating lower interface plates 260 and lower spacer plates 262; however, in alternative embodiments, other arrangements are possible. The outer ends 258 of the lower spacer plate 262 and the outer ends 258 of the lower interface plate 260 are configured to face and be thermally coupled to the pluggable module 106. Optionally, the outer ends 258 of the lower spacer plate 262 and the outer ends 258 of the lower interface plate 260 may be substantially coplanar at the bottom of the heat sink assembly 200. The lower interface plate 260 is taller than the lower spacer plate 262 and extends further upward than the lower spacer plate 222. For example, the inner end 216 of the lower interface plate 260 is positioned further from the bottom of the heat sink assembly 200 than the inner end 216 of the lower spacer plate 262. The inner end 256 of the lower interface plate 260 extends into the interface region 208 to dock with the upper interface plate 224. The lower interface plate 260 includes interface fins 270 that extend into the interface region 208 to be thermally coupled to the upper plate stack 212 of the upper heat sink element 202. The interface fins 270 are thermally coupled to the corresponding upper interface plate 224 of the upper fin plate 220. For example, the side surface 254 of the interface fin 270 faces the side surface 214 of the upper interface plate 224 for thermal coupling therebetween. The side surface 254 may directly engage the corresponding side surface 214. In various other embodiments, the side surface 254 may be physically associated closely enough with the side surface 214 to allow efficient thermal coupling between the lower plate 250 and the upper plate 210.

[0030] In the illustrated embodiment, the upper plate stack 212 has the following plate arrangement: an upper fin plate 220, an upper interface plate 224, an upper spacer plate 222, and another upper interface plate 224 in a repeating pattern. In the illustrated embodiment, the lower plate stack 252 has the following plate arrangement: alternating lower interface plates 260 and lower spacer plates 262 in a repeating pattern. At the interface region 208, the heat sink assembly 200 has a plate arrangement of alternating upper interface plates 224 and lower interface plates 260. An air gap 290 is provided between the lower interface plate 260 and the upper fin plate 220 or the upper spacer plate 222. For example, the air gap 290 is located between the inner end 256 of the lower interface plate 260 and the inner end 216 of the upper fin plate 220 or the upper spacer plate 222. An air gap 292 is provided between the upper interface plate 224 and the lower spacer plate 262. For example, the air gap 292 is located between the inner end 216 of the upper interface plate 224 and the inner end 256 of the lower spacer plate 262. The lower interface plate 260 is thermally coupled to the adjacent upper interface plate 224. The sides 214, 254 overlap with a sufficient overlap distance to allow efficient heat transfer between the lower plate 250 and the upper plate 210. The sides 214, 254 can slide relative to each other to allow movement between the upper plate 210 and the lower plate 250 and to change the overlap distance. For example, when the upper stack 212 and the lower plate stack 252 are compressed, such as when the lower plate stack 252 mates with a pluggable module, the lower interface plate 260 can move into the upper air gap 290, and the upper interface plate 224 can move into the lower air gap 292. In alternative embodiments, other arrangements are possible, including embodiments that do not include the upper fin plate 220 or embodiments that do not include the upper spacer plate 222. In various other embodiments, the upper interface plate 224 and the upper fin plate 220 can be combined in the same plate. For example, the combined plate can extend above and below the spacer plate 222. Although the upper plate 210 and the lower plate 250 are shown as flat rectangular plates, it should be appreciated that the plates 210, 250 can have other dimensions and shapes in alternative embodiments.

[0031] The frame 300 includes a base 310 that can be used to mount the frame 300 to the top wall 130 (as Figure 1 shown) of the socket cage 110 (as Figure 1 shown). Side walls 306, 308 extend from the base 310. In an exemplary embodiment, each side wall 306, 308 includes a support wall 312. An opening 314 is defined between the support walls 312. The heat sink elements 202, 204 are received in the opening 314 between the support walls 312. A spring element 206 can be coupled to the side walls 306, 308. For example, the spring element 206 laterally spans the opening 314 between the side walls 306, 308.

[0032] The support wall 312 faces the upper plate 210 and the lower plate 250 of the heat sink elements 202, 204, and may engage the upper plate 210 and / or the lower plate 250 to position the upper plate stack 212 and the lower plate stack 252 between the support walls 312. Optionally, the support wall 312 may compress or squeeze the upper plate stack 212 and the lower plate stack 252 to press the upper plate 210 and the lower plate 250 together in thermal contact with each other within the upper plate stack 212 and the lower plate stack 252. For example, the support wall 312 may be compressible or deflectable when the plate stacks 212, 252 are received in the opening 314. Optionally, the support wall 312 may provide a light spring force against the upper plate 210 and the lower plate 250 to prevent the plates 210, 250 from bonding within the opening 314. Thus, the upper plate 210 and the lower plate 250 may move relative to each other within the opening 314, for example, allowing the upper plate 210 and the lower plate 250 to hinge within the plate stacks 212, 252 respectively.

[0033] Figure 4 is a front perspective view of the spring element 206 according to an exemplary embodiment. The spring element 206 includes an upper spring member 450 and a lower spring member 452. A connecting portion 454 extends between the upper spring member 450 and the lower spring member 452. The connecting portion 454 may be curved, for example, C-shaped. The connecting portion is flexible and configured to extend the upper spring member 450 and the lower spring member 452 when the connecting portion is bent or compressed. The upper spring member 450 is configured to engage the inner end 216 of the upper plate 210 (as Figure 3 shown), and is configured to spring bias the upper plate 210 away from the lower plate 250 in a first biasing direction (e.g., generally upward). The lower spring member 452 is configured to engage the inner end 256 of the lower plate 250 (as Figure 3 shown), and is configured to spring bias the lower plate 250 away from the upper plate 210 in a second biasing direction (e.g., generally downward).

[0034] In an exemplary embodiment, the upper spring member 450 is segmented to include a plurality of upper spring tabs 460 separated by an upper gap 462. The upper spring tabs 460 are configured to engage the corresponding upper plate 210. The upper spring tabs 460 may move independently of each other, for example, providing independent spring pressure to the corresponding upper plate 210. Optionally, the upper spring tabs 460 may flare outwardly away from the lower spring member 452, for example, at an angle.

[0035] In an exemplary embodiment, the lower spring member 452 is segmented to include a plurality of lower spring tabs 470 separated by a lower gap (not shown, but similar to the upper gap 462). The lower spring tabs 470 are configured to engage corresponding lower plates 250. The lower spring tabs 470 can move independently of each other, for example, to provide independent spring pressure to the corresponding lower plates 250. Optionally, the lower spring tabs 470 can flare outwards away from the upper spring member 450, for example, at an angle.

[0036] Figure 5 FIG. 4 is a cross-sectional view of a portion of the socket assembly 104, showing a heat sink assembly 200 according to an exemplary embodiment coupled to a pluggable module 106. The frame 300 holds the upper heat sink element 202 and the lower heat sink element 204, and the spring element 206 is located between the upper heat sink element 202 and the lower heat sink element 204. In the illustrated embodiment, the heat sink assembly 200 includes two spring elements 206, such as a front spring element near the front of the heat sink assembly 200 and a rear spring element near the rear of the heat sink assembly 200; however, in alternative embodiments, the heat sink assembly 200 can include more or fewer spring elements 206. The spring elements 206 are on the inner sides of the front and rear of the heat sink elements 202, 204. The spring elements 206 are arranged to be away from the front end and the rear end. In various embodiments, the spring elements 206 can be located at an insertion distance on the inner side of the front end or the rear end, and the insertion distance is between approximately 10% and 25% of the length of the heat sink assembly 200. The spring elements 206 bias the upper heat sink element 202 and the lower heat sink element 204 in opposite directions.

[0037] The spring element 206 forces the upper heat sink element 202 and the lower heat sink element 204 to separate from each other. The upper spring member 450 is configured to engage the inner end 216 of the upper plate 210 (e.g., the inner end 216 of the upper fin plate 220 and / or the inner end 216 of the upper spacer plate 222 and / or the inner end 216 of the upper interface plate 224). The upper spring tabs 460 of the segmented upper spring member 450 allow independent movement or articulation of individual upper plates 210 or groups of upper plates 210, thereby allowing certain upper plates 210 to move independently of other upper plates 210. The lower spring member 452 is configured to engage the inner end 256 of the lower plate 250 (e.g., the inner end 256 of the lower interface plate 260 and the inner end 216 of the lower spacer plate 262). The lower spring tabs 470 of the segmented lower spring member 452 allow independent movement or articulation of individual lower plates 250 or groups of lower plates 250, thereby allowing certain lower plates 250 to move independently of other lower plates 250. The lower spring member 452 urges the lower plate 250 to conform to the upper surface of the pluggable module 106 to reduce the thermal resistance at the interface.

[0038] In an exemplary embodiment, the frame 300 captures the upper plate 210 and the lower plate 250 within the front track 302 and the rear track 304. For example, the front track 302 includes an upper ledge 320 and a lower ledge 322. The upper plate 210 may engage the upper ledge 320 and the lower plate 250 may engage the lower ledge 322. The heat sink elements 202, 204 are captured between the upper ledge 320 and the lower ledge 322. The rear track 304 includes an upper ledge 330 and a lower ledge 332. The upper plate 210 may engage the upper ledge 330 and the lower plate 250 may engage the lower ledge 332. The heat sink elements 202, 204 are captured between the upper ledge 330 and the lower ledge 332. The upper and lower plates 250 may float between the upper and lower ledges 320, 322, 330, 332.

[0039] In an exemplary embodiment, each upper plate 210 extends between a front end 240 and a rear end 242. The upper plate 210 includes a front mounting projection 244 at the front end 240 and a rear mounting projection 246 at the rear end 242. The front mounting projection 244 is configured to engage the upper ledge 320 of the front track 302, and the rear mounting projection 246 is configured to engage the upper ledge 330 of the rear track 304. The upper spring member 450 of the spring element 206 biases the upper plate 210 in a first biasing direction to push the mounting projections 244, 246 toward the upper ledges 320, 330. The mounting projections 244, 246 may engage the upper ledges 320, 330.

[0040] In an exemplary embodiment, each lower plate 250 extends between a front end 280 and a rear end 282. The lower plate 250 includes a front mounting projection 284 at the front end 280 and a rear mounting projection 286 at the rear end 282. The front mounting projection 284 is configured to engage the lower ledge 322 of the front track 302, and the rear mounting projection 286 is configured to engage the lower ledge 332 of the rear track 304. The lower spring member 452 of the spring element 206 biases the lower plate 250 in a first biasing direction to push the mounting projections 284, 286 toward the lower ledges 322, 332. The mounting projections 284, 286 may engage the lower ledges 322, 332.

[0041] Figure 6 is a cross-sectional view of a portion of the socket assembly 104 according to an exemplary embodiment, showing the heat sink assembly 200. In the illustrated embodiment, the heat sink assembly 200 is used to thermally couple the pluggable module 106 to a heat component 108 such as a heat sink. Figure 6 The illustrated lower heat sink element 204 is the same as Figure 3 the illustrated lower heat sink element 204. Figure 6 The illustrated upper heat sink element 202 is different from Figure 3 the illustrated upper heat sink element 202.

[0042] In the illustrated embodiment, the upper heat sink element 202 does not include an upper fin plate 220, but instead includes spacer plates 222 that are staggered with an upper interface plate 224. The upper heat sink element 202 has a generally flat top, and outer ends 218 of the spacer plates 222 are disposed on the top of the upper heat sink element 202. In the illustrated embodiment, the outer ends 218 of the upper interface plate 224 are generally coplanar with the outer ends 218 of the spacer plates 222 on the top of the upper heat sink element 202. The outer ends 218 of the spacer plates 222 and the upper interface plate 224 define a thermal interface that is configured to be thermally coupled to the bottom surface of the thermal component 108. The thermal component 108 dissipates heat from the spacer plates 222 and the upper interface plate 224.

Claims

1. A heat sink assembly (200), comprising: An upper heat sink element (202) including a plurality of upper plates (210) arranged as an upper plate stack (212), each upper plate having a front end (240) and a rear end (242), each upper plate having a side surface (214) between the front end and the rear end, each upper plate having an inner end (216) and an outer end (218); A lower heat sink element (204) including a plurality of lower plates (250) arranged as a lower plate stack (252), each lower plate having a front end (280) and a rear end (282), each lower plate having a side surface (254) between the front end and the rear end, each lower plate having an inner end (256) and an outer end (258), the lower plates including a lower spacer plate (262) and a lower interface plate (260), an outer end of the lower spacer plate and an outer end of the lower interface plate being configured to face and thermally couple to a pluggable module (106), the lower interface plate including interface fins (270) extending above an inner end of the lower spacer plate to dock with the upper plates; and A spring element (206) disposed between the upper heat sink element and the lower heat sink element, the spring element including an upper spring member (450) engaging the inner end of the upper plate to bias the upper plate away from the lower plate in a first biasing direction, the spring element including a lower spring member (452) engaging the inner end of the lower plate to bias the lower plate away from the upper plate in a second biasing direction, the upper spring member being aligned with the lower spring member such that the upper spring member is between the upper plate and the lower spring member and the lower spring member is between the lower plate and the upper spring member, the spring element including a connection portion extending between the upper spring member and the lower spring member, the connection portion being flexible to spread the upper spring member and the lower spring member apart from each other, wherein at least one of the upper spring member or the lower spring member is segmented to include spring tabs that are movable independently of each other.

2. The heat sink assembly (200) according to claim 1, wherein adjacent upper plates (210) in the upper plate stack (212) have different heights between the inner end (216) and the outer end (218) of the upper plates, and wherein adjacent lower plates (250) in the lower plate stack (252) have different heights between the inner end (256) and the outer end (258) of the lower plates.

3. The heat sink assembly (200) according to claim 1, wherein the upper plate (210) includes an upper fin plate (220), each upper fin plate including a base (230) at the inner end (216) and heat dissipation fins (232) at the outer end (218), the interface fins (270) of the lower interface plate (260) extending into the upper plate stack (212) to thermally couple to corresponding bases of the upper fin plates.

4. The heat sink assembly (200) as claimed in claim 3, wherein the upper plate (210) includes upper spacer plates (222) between corresponding upper fin plates (220) and is aligned with the interface fins (270) of the corresponding lower interface plate (260).

5. The heat sink assembly (200) as claimed in claim 1, wherein the upper plate (210) includes an upper interface plate (224), an outer end (218) of the upper interface plate being configured to face and be thermally coupled to a heat component (108), and the upper heat sink element (202) and the lower heat sink element (204) thermally couple the pluggable module (106) and the heat component.

6. The heat sink assembly (200) as claimed in claim 1, wherein the upper plates (210) are movable relative to each other, and the lower plates (250) are movable relative to each other and relative to the upper plates.

7. The heat sink assembly (200) as claimed in claim 1, wherein the upper spring member (450) is segmented to include a plurality of upper spring tabs (460) separated by an upper gap (462), the upper spring tabs engaging corresponding upper plates (210) to bias the upper plates away from the lower plate (250) in the first biasing direction, and the lower spring member (452) is segmented to include a plurality of lower spring tabs (470) separated by a lower gap, the lower spring tabs engaging corresponding lower plates to bias the lower plates away from the upper plate in the second biasing direction.

8. The heat sink assembly (200) as claimed in claim 7, wherein the upper spring member (450) is segmented to include a plurality of upper spring tabs (460) separated by an upper gap (462), the upper spring tabs engaging corresponding upper plates (210).

9. The heat sink assembly (200) as claimed in claim 1, wherein the spring element (206) is a front spring element disposed near a front end (240) of the upper plate (210) and a front end (280) of the lower plate (250), and the heat sink assembly further includes a rear spring element (206) disposed near a rear end (242) of the upper plate and a rear end (282) of the lower plate.

10. The heat sink assembly (200) as claimed in claim 1, further comprising a frame (300) holding the upper heat sink element (202), the lower heat sink element (204), and the spring element (206), the frame including side walls (306, 308), and the upper plate stack (212) and the lower plate stack (252) being disposed between the side walls of the frame.

11. The heat sink assembly (200) according to claim 1 further includes a frame (300) for holding the upper heat sink element (202), the lower heat sink element (204), and the spring element (206). The frame includes a front track (302) and a rear track (304). The upper plate includes a front mounting protrusion (244) at the front end and a rear mounting protrusion (246) at the rear end. The lower plate includes a front mounting protrusion (284) at the front end and a rear mounting protrusion (286) at the rear end. The front mounting protrusions of the upper plate and the lower plate are captured by the front track (302), and the rear mounting protrusions of the upper plate and the lower plate are captured by the rear track (304).

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