Integrated circuit substrate for accommodating liquid adhesive exudation

Abstract

An integrated circuit substrate having features for accommodating a liquid adhesive and a method for manufacturing such a substrate are provided. A device includes a first substrate layer (220) and a second substrate layer (210) adhered to the first substrate layer (220) such that: a portion of the top surface of the first substrate layer (220) is exposed to define the bottom of a cavity (230), and an edge of the second substrate layer (210) adjacent to the exposed top surface of the first substrate layer (220) defines the edge of the cavity (230). The device includes an integrated circuit die (240) adhered to the exposed top surface of the first substrate layer (220) by a liquid adhesive. The first substrate layer (220) is capable of defining trenches (260a, 260b) in the bottom of the cavity (230) between the region of the integrated circuit die (240) and the edge of the cavity (230) such that the trenches (260a, 260b) can receive liquid adhesive that oozes out from between the integrated circuit die (240) and the top surface of the first substrate layer (220).

Description

[0001] Cross - reference to related applications

[0002] This application is a continuation of U.S. Patent Application No. 16 / 358,203, filed on Mar. 19, 2019, which claims the benefit of U.S. Provisional Patent Application No. 62 / 776,681, filed on Dec. 7, 2018, the entire content of which is incorporated herein by reference. Background of the Invention

[0003] Certain integrated devices can be manufactured by incorporating an integrated circuit within a cavity of a substrate. The cavity can be formed by bonding two substrate layers with an adhesive and then cutting away a portion of one layer. In some cases, additional components can be bonded across the top surface of the substrate and the top surface of the integrated circuit. Summary of the Invention

[0004] At least one aspect is directed to a device that includes a first substrate layer having a top surface and a bottom surface. The device includes a second substrate layer having a bottom surface adhered to a first portion of the top surface of the first substrate layer such that: a second portion of the top surface of the first substrate layer is exposed to define the bottom of a cavity, and an edge of the second substrate layer adjacent to the exposed top surface of the first substrate layer defines an edge of the cavity. The device includes an integrated circuit die adhered to the exposed top surface of the first substrate layer by a liquid adhesive. The first substrate layer defines a trench in the bottom of the cavity between the region of the integrated circuit die and the edge of the cavity such that the trench can receive liquid adhesive that oozes out from between the integrated circuit die and the top surface of the first substrate layer.

[0005] At least one aspect is directed to a method of manufacturing a device. The method includes providing a first substrate layer having a top surface and a bottom surface. The method includes adhering a bottom surface of a second substrate layer to the top surface of the first substrate layer. The method includes removing a portion of the second substrate layer to expose a portion of the top surface of the first substrate layer. The method includes cutting a trench in the exposed portion of the top surface of the first substrate layer. The method includes adhering an integrated circuit die to the exposed top surface of the first substrate layer by a liquid adhesive such that the trench receives liquid adhesive that oozes out from between the integrated circuit die and the top surface of the first substrate layer.

[0006] These and other aspects and embodiments are discussed in detail below. The foregoing information and the following detailed description include illustrative examples of various aspects and embodiments and provide an overview or framework for understanding the nature and characteristics of the claimed aspects and embodiments. The drawings provide examples and further understanding of the various aspects and embodiments and are incorporated into and constitute a part of this specification. Brief Description of the Drawings

[0007] The drawings are not to be drawn to scale. In the various drawings, like reference numerals and designations indicate like elements. For clarity, not every component may be labeled in each drawing. In the figures:

[0008] Figure 1 An integrated device is shown having an integrated circuit die mounted in a cavity of a substrate, the substrate having burrs and areas of liquid adhesive overflow;

[0009] Figure 2 A first exemplary integrated device is shown having an integrated circuit die mounted in a cavity of a substrate, the substrate having a trench for receiving liquid adhesive exudate outside the perimeter of the integrated circuit;

[0010] Figure 3 A second exemplary integrated device is shown having an integrated circuit die mounted in a cavity of a substrate, the substrate having a trench for receiving liquid adhesive exudate aligned with the perimeter of the integrated circuit die, and the second exemplary integrated device further having a bridge die mounted above the integrated circuit die and the substrate;

[0011] Figure 4 A third exemplary integrated device is shown having an integrated circuit die mounted in a cavity of a substrate, the substrate having a trench for receiving liquid adhesive exudate slightly cut into from the perimeter of the integrated circuit die;

[0012] Figure 5 A fourth exemplary integrated device is shown having a first integrated circuit die mounted in a cavity of a substrate and an optional second integrated circuit die mounted adjacent to the first integrated circuit die, the substrate having a trench for receiving liquid adhesive exudate spanning the perimeter of the first integrated circuit die; and

[0013] Figure 6 is a flow chart of an exemplary method of manufacturing an integrated device having means for receiving liquid adhesive exudate according to an exemplary embodiment. DETAILED DESCRIPTION

[0014] The present disclosure generally relates to an integrated circuit substrate for accommodating liquid adhesive exudation and a method of manufacturing the same. Some integrated devices can be manufactured by bonding an integrated circuit in a cavity of a substrate. The cavity can be formed by bonding two substrate layers with an adhesive and then cutting off a portion of the second layer. The cutting can be performed by a laser. During the cutting, the laser can char or otherwise degrade the adhesive, which is typically an organic compound. The charred adhesive may form burrs. These burrs may interfere with the placement of the integrated circuit die in the cavity. The burrs may get stuck under the die, thus preventing proper placement of the die. The die may be tilted and thus contact the cavity surface unevenly. In extreme cases, burrs may form a gap between the die and the substrate. Due to dust in the air circulating near the integrated device, this gap may be vulnerable to particulate contamination.

[0015] An epoxy resin or other liquid adhesive can be used to bond the die to the substrate. In high-volume production, it may be difficult to control the amount of liquid adhesive for bonding the die to the substrate. Too little liquid adhesive may result in a poorly bonded device that is vulnerable to mechanical failure. However, too much liquid adhesive may contaminate the surface of the die and / or the substrate that needs to be kept clean after the bonding step. Too much liquid adhesive may also form larger rounded corners, which may interfere with the placement of other components in the cavity or near the die.

[0016] The following disclosure presents a solution to one or both of the dual problems of burrs and liquid adhesive exudation. One or more grooves can be machined, etched, or otherwise cut into the bottom of the cavity, i.e., into the surface of the first substrate layer. The one or more grooves can be formed in an area outside the perimeter of the die, within the perimeter of the die, or across the perimeter of the die. After forming the cavity, the grooves can be formed in the first substrate layer. In some cases, the cutting of the grooves themselves can remove any burrs that may interfere with the placement and bonding of the die. In some embodiments, any burrs remaining after the groove cutting step can be pushed into the grooves, thereby preventing interference with the placement of the die. Additionally, the one or more grooves can provide an overflow area for excess liquid adhesive. The one or more grooves can transfer and collect excess liquid adhesive and prevent the excess liquid adhesive from soiling or otherwise covering the surface of the die or the substrate that needs to be kept clean after the die bonding step. The one or more grooves can also prevent rounded corners from extending too far from the perimeter of the die and blocking components that need to be placed adjacent to the die. In this way, two dies can be placed closer together while still allowing for the typical liquid adhesive volume tolerance variations in a high-volume process compared to a situation where there may not be groove features previously.

[0017] Figure 1Integrated device 100 is shown, which has an integrated circuit die 140 mounted in cavity 130 of substrates 110 and 120, and substrates 110 and 120 have burrs and liquid adhesive overflow areas. The finished substrate shown in device 110 includes a first substrate layer 120 and a second substrate layer 110. The second substrate layer 110 is adhered to the first substrate layer 120 by an adhesive. Typically, the adhesive is an organic compound. A portion of the second substrate layer 110 is absent or removed to expose a portion of the top surface of the first substrate layer 120 and define cavity 130. In a typical process, the portion of the second substrate layer 110 is removed by cutting through the second substrate layer with a laser. During the cutting process, the laser can char, burn, or otherwise affect the adhesive, such that debris in the form of burrs is produced. In some cases, the burrs can interfere with subsequent manufacturing steps, such as adhering the integrated circuit die 140 to the substrate. For example, the burrs may get stuck under the integrated circuit die 140 and prevent it from being properly positioned; that is, cause the integrated circuit die 140 to be mounted at an angle. This angle may cause problems in mounting additional components to the integrated circuit die 140, the additional components including components that may be mounted in a manner that straddles the integrated circuit die 140 and the top surface of the second substrate layer 110. This angle may also cause a gap between the integrated circuit die 140 and the substrate. This gap may be contaminated during a later manufacturing process or after deployment of device 110. For example, the gap may be filled with dust or other contaminants in a manner that detrimentally affects the operation of device 100, such as reducing performance or causing intermittent or early irreparable failures.

[0018] Typically, the integrated circuit die 140 is adhered to the exposed top surface of the first substrate layer 120 by a liquid adhesive, which may be an epoxy resin. In a mass production or high-volume production environment, the amount of the liquid adhesive will vary within tolerances. A rated amount of the liquid adhesive can be set to ensure that the liquid adhesive is sufficient to produce adequate bonding even at the low end of the tolerance range. However, at the high end of the tolerance range, device 110 may experience seepage or overflow of the liquid adhesive from under the integrated circuit die 140. This seepage may cause various problems, such as soiling or covering areas of device 100 that need to remain exposed during subsequent manufacturing steps and / or after deployment. Additionally, once the seepage hardens, it can prevent other components from being placed adjacent to the integrated circuit die 140. For example, in some devices, a second integrated circuit die may be placed close to the first integrated circuit die 140 such that the two can be connected. The nature of the connection between the two dies or the nature of the shared function may require them to be very close, and this very close proximity may be prevented by rounded corners or clumps of hardened / cured liquid adhesive that extend too far away from the first integrated circuit die 140.

[0019] Accordingly, the present disclosure describes creating trench features in the exposed top surface of the first substrate layer 120. The trenches can accommodate burrs caused by cutting the second substrate layer 110, and in some cases, the act of cutting the trenches can itself remove the burrs before they interfere with subsequent manufacturing steps. The trenches can also receive liquid adhesive exudate and prevent excess exudate from contaminating the device 110 or obstructing the placement of additional components.

[0020] Figure 2 A first exemplary integrated device 200 is shown that has an integrated circuit die 240 mounted in a cavity 230 of substrates 210 and 220 that have trenches 260a and 260b (collectively "trenches 260") for accommodating liquid adhesive exudate outside the perimeter of the integrated circuit die. The device 200 includes a first substrate layer 220 and a second substrate layer 210. A portion of the second substrate layer 210 has been removed to expose a portion of the top surface of the first substrate layer 220 and define the cavity 230. The trenches 260a and trench 260b (collectively "trenches 260") have been cut, etched, machined, or otherwise defined into the top surface of the first substrate layer 220 in an area proximate the intended location of the integrated circuit die 240. The trenches 260 can be configured to receive any burrs or other debris left from the process of cutting the second substrate layer 210. In some cases, the process of cutting the trenches 260 can actively remove the debris. Additionally, the trenches 260 can be configured to receive any exudate of liquid adhesive that is used to adhere the integrated circuit die 240 to the exposed top surface of the first substrate layer 220.

[0021] In Figure 2 the device 200 shown, the trenches 260 are shown as being outside the perimeter of the integrated circuit die 240. In some embodiments, the trenches 260 can be defined such that the trenches 260 are aligned with, extend across, or are entirely within the perimeter of the integrated circuit die 240.

[0022] Figure 3Shows a second exemplary integrated device 300 having an integrated circuit die 240 mounted in a cavity 230 of substrates 220 and 210, the substrates 220 and 210 having grooves 360a and 360b (collectively "grooves 360") aligned with the periphery of the integrated circuit die 240 for accommodating the exudation of liquid adhesive, and the second exemplary integrated device 300 further having a bridging die 350 mounted above the integrated circuit die 240 and substrates 220 and 210. The first substrate layer 220, the second substrate layer 210, the cavity 230, and the integrated circuit die 240 may be similar to the corresponding features of the previously described device 200. In device 300, the grooves 360a and 360b (collectively "grooves 360") are aligned with the periphery of the integrated circuit die 240. Device 300 further has a bridging die 350 mounted across the first substrate layer and the integrated circuit die 240. The bridging die 350 may have solder balls 370 for electromechanically coupling the bridging die 350 to the second substrate layer and the integrated circuit die 240. In device 300, the grooves 360 may prevent burrs from interfering with the proper placement of the integrated circuit die 240, which may cause tilting and thus may prevent the proper positioning of the bridging die 350. The grooves 360 may further prevent the exudation of liquid adhesive from contaminating the area between the edge of the integrated circuit die 240 and the second adhesive layer 210 in a manner that may interfere with the placement of the bridging die 350.

[0023] Figure 4 Shows a third exemplary integrated device 400 having an integrated circuit die 440 mounted in a cavity 430 of substrates 420 and 410, the substrates 420 and 410 having grooves 460 for accommodating the exudation of liquid adhesive that are slightly cut into from the periphery of the integrated circuit die 440. The first substrate layer 420, the second substrate layer 410, the cavity 430, the integrated circuit die 440, and the bridging die 450 may be similar to the first substrate layer 220, the second substrate layer 210, the cavity 230, the integrated circuit die 240, and the bridging die 350 of the previously described device 300, respectively. In device 400, the grooves 460 extend across the periphery of the integrated circuit die 440, i.e., the grooves 460 are slightly cut into from the edge of the integrated circuit die 440. The slightly cut grooves may further reduce the extent of the rounded corners of the liquid adhesive exuding from the sides of the integrated circuit device 440 and avoid any interference with other components that need to be positioned adjacent to the integrated circuit device 440. As described below Figure 5 Shows the placement of such adjacent components.

[0024] Figure 5Shows a fourth exemplary integrated device 500 having an integrated circuit die 540 mounted in a cavity 530 of substrates 520 and 510, the substrates 520 and 510 having trenches 560 that straddle the perimeter of the integrated circuit die 540 for containing the exudation of liquid adhesive. The first substrate layer 520, the second substrate layer 510, the cavity 530, the integrated circuit die 540, and the bridging die 550 may be respectively similar to the first substrate layer 220, the second substrate layer 210, the cavity 230, the integrated circuit die 240, and the bridging die 350 of the previously described device 300. In device 500, the trench 560 extends across the perimeter of the integrated circuit die 540, i.e., the trench 460 straddles the edge of the integrated circuit die 440. The position of the trench 560 relative to the edge of the integrated circuit die 540 may reduce the extent of the rounded corner of the liquid adhesive exuding from the side of the integrated circuit device 540 and prevent interference with other components (such as a second integrated circuit die 545) that need to be positioned adjacent to the integrated circuit device 540. In device 550, the trench 560 may be placed such that the trench 560 straddles the perimeters of the integrated circuit dies 540 and 545. Thus, the trench 560 may receive any liquid adhesive exuding from one or both of the integrated circuit dies 540 and 545. Thereby, the trench 560 may prevent excess liquid adhesive from soiling the area between (or in some cases above) the integrated circuit dies 540 and 545. Thus, excess liquid adhesive may be prevented from interfering with any interconnections or interfering with other components that may need to be positioned across or between the integrated circuit dies 540 and 545.

[0025] Figure 6It is a flowchart of an exemplary method 600 for manufacturing an integrated device having a device for accommodating liquid adhesive seepage according to an exemplary embodiment. The method 600 is suitable for manufacturing an integrated device similar to the devices 200, 300, 400, or 500 described previously. The method 600 includes providing a first substrate layer (step 610). The method 600 includes adhering a second substrate layer to the top surface of the first substrate layer (step 620). The method 600 includes removing a portion of the second substrate layer to expose a portion of the top surface of the first substrate layer (step 630). The method 600 includes cutting a trench in the exposed portion of the top surface of the first substrate layer (step 640). The method 600 includes adhering an integrated circuit die to the exposed top surface of the first substrate layer (step 650). In some embodiments, the method 600 may optionally include cutting a second trench in the exposed portion of the top surface of the first substrate layer (step 660), and adhering a second integrated circuit die adjacent to the first integrated circuit die (step 670). In some embodiments, the method 600 may optionally include mounting a bridging die above a portion of the second substrate layer and a portion of the integrated circuit die (step 680).

[0026] The method 600 is suitable for manufacturing an integrated device similar to the devices 200, 300, 400, or 500 described previously. The method 600 includes providing a first substrate layer (step 610). The first substrate layer may be similar to the first substrate layers 220, 420, or 520 described previously.

[0027] The method 600 includes adhering a second substrate layer to the top surface of the first substrate layer (step 620). The second substrate layer may be similar to the second substrate layers 210, 410, or 510 described previously. The bottom surface of the second substrate layer may be adhered to the top surface of the first substrate layer using an adhesive. In some embodiments, the adhesive may include an organic compound.

[0028] The method 600 includes removing a portion of the second substrate layer to expose a portion of the top surface of the first substrate layer (step 630). A portion of the second substrate layer may be cut and removed to expose a portion of the top surface of the first substrate layer. Cutting may be performed using a laser, blade, drill, mill, or chemical process. Removing a portion of the second substrate layer may form a cavity that is bounded laterally by the edge of the second substrate layer exposed by the cutting and bounded at the bottom by the exposed top surface of the first substrate layer. The cavity may be similar to the cavities 230, 430, or 530 described previously. In some cases, especially during high-volume manufacturing processes, the cutting process may leave residues or debris of the substrate material or adhesive. The debris may be in the form of burrs composed of burned or charred material. If not removed, the burrs may interfere with subsequent manufacturing steps, such as placing an integrated circuit die or other components in the cavity.

[0029] Method 600 includes cutting a trench in an exposed portion of the top surface of the first substrate layer (step 640). The trench can be similar to the previously described trenches 260, 360, 460, or 560. A laser, blade, drill, mill, or chemical process can be used to cut the trench. The process of cutting the trench can be similar to the process of cutting the second substrate layer to create the cavity. In some cases, the cutting process can remove any burrs or other debris remaining from the cutting process of the second substrate layer. In some cases, the trench can receive any burrs or debris remaining from the cutting process of the second substrate layer and prevent them from mechanically interfering with the placement of components in the cavity during subsequent manufacturing steps.

[0030] Method 600 includes adhering an integrated circuit die to the exposed top surface of the first substrate layer (step 650). The integrated circuit die can be similar to the previously described integrated circuit dies 240, 440, or 540. The integrated circuit die is adhered by a liquid adhesive such as epoxy resin. In some cases, especially during high-volume manufacturing processes, an excess amount of liquid adhesive may be applied. The excess liquid adhesive may be extruded from the area between the integrated circuit die and the exposed top surface of the first substrate layer. The liquid adhesive may form rounded corners, bumps, or bubbles near the integrated circuit die. However, the presence of the trench can provide space for the excess liquid adhesive extruded from beneath the integrated circuit die and prevent it from soiling the integrated circuit die or the substrate layer, or prevent it from extending too far away from the integrated circuit die and interfering with components that need to be placed adjacent to the integrated circuit die. Additionally, any burrs remaining on the exposed top surface of the first substrate layer can be pushed into the trench by the integrated circuit die and / or the liquid adhesive extruded from beneath the integrated circuit die. Thus, the trench can prevent the burrs from interfering with the proper positioning of the integrated circuit die.

[0031] In some embodiments, method 600 can optionally include cutting a second trench in an exposed portion of the top surface of the first substrate layer (step 660) and adhering a second integrated circuit die adjacent to the first integrated circuit die (step 670). In some cases, additional trenches can be cut in the first substrate layer to prevent the excess liquid adhesive beneath the integrated circuit die from interfering with the placement of the second integrated circuit die. In some embodiments, the second trench can be at least partially located between the first integrated circuit die and the second integrated circuit die. In some embodiments, the trench can span or straddle one or both of the perimeters of the integrated circuit die.

[0032] In some embodiments, method 600 may optionally include mounting a bridging die over a portion of the second substrate layer and a portion of the integrated circuit die (step 680). The bridging die may be similar to bridging dies 350, 450, or 550. The bridging die may include solder balls for electrically coupling the bridging die to the second substrate layer and the integrated circuit die, and trenches may prevent burrs and / or the exudation of liquid adhesive from interfering with the position of the integrated circuit die and / or the bridging die, or prevent burrs and / or the exudation of liquid adhesive from soiling the surfaces required for contact or junction between the bridging die and the second substrate or the integrated circuit die.

[0033] Those skilled in the art will understand that the steps of method 600 may be performed in a different order without departing from the scope of the invention. Additionally, method 600 may include more or fewer steps without departing from the scope of the invention.

[0034] Although this specification contains many specific implementation details, these should not be construed as limitations on the scope of any invention or of what is claimed, but rather as descriptions of features specific to particular embodiments of a particular invention. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented separately or in any suitable sub-combination in multiple embodiments. Moreover, although features may have been described above as acting in certain combinations and even initially claimed as such, one or more features from the claimed combination can in some cases be deleted from the combination, and the claimed combination can be directed to a sub-combination or variant of a sub-combination.

[0035] References to "or" may be construed as inclusive, such that any terms described using "or" may indicate any of the single, more than one, and all of the terms. The labels "first," "second," "third," etc. are not necessarily intended to indicate order and are generally only used to distinguish between the same or similar items or elements.

[0036] Various variations of the embodiments described in this disclosure may be apparent to those skilled in the art, and without departing from the spirit or scope of this disclosure, the general principles defined herein may be applied to other embodiments. Accordingly, the claims are not intended to be limited to the embodiments shown herein, but rather should be accorded the broadest scope consistent with this disclosure, the principles, and the novel features disclosed herein. The following are the claims.

Claims

1. An integrated device, comprising: A first substrate layer having a top surface and a bottom surface; A second substrate layer having a bottom surface, the bottom surface being adhesively attached to a first portion of the top surface of the first substrate layer, wherein a portion of the second substrate layer that is adhesively attached to a second portion of the top surface of the first substrate layer is removed by laser cutting the second substrate layer such that: The second portion of the top surface of the first substrate layer is exposed to define the bottom of a cavity, and The edge of the second substrate layer adjacent to the exposed top surface of the first substrate layer defines the edge of the cavity; And An integrated circuit die adhesively attached to the exposed top surface of the first substrate layer by a liquid adhesive, wherein the first substrate layer defines a trench in the bottom of the cavity between the region of the integrated circuit die and the edge of the cavity such that the trench can receive the liquid adhesive that oozes out between the integrated circuit die and the top surface of the first substrate layer, and wherein the trench is formed after the second portion of the top surface of the first substrate layer is exposed and before the integrated circuit die is adhesively attached to the exposed top surface.

2. The integrated device according to claim 1, wherein The trench is defined between the edge of the cavity and the perimeter of the integrated circuit die.

3. The integrated device according to claim 1, wherein, The trench is defined between the edge of the cavity and a region under the integrated circuit die.

4. The integrated device according to claim 1, wherein, The trench is a first trench defined between the edge of the cavity and a first side of the integrated circuit die, and the device comprises: A second trench adjacent to a second side of the integrated circuit die.

5. The integrated device according to claim 4, wherein The second trench extends from a region under the integrated circuit die to a region outside the perimeter of the integrated circuit die.

6. The integrated device according to claim 4, wherein, The integrated circuit die is a first integrated circuit die, and the device comprises: A second integrated circuit positioned adjacent to the first integrated circuit die such that the second trench is at least partially positioned between the first integrated circuit die and the second integrated circuit die.

7. The integrated device according to claim 6, wherein, The second trench extends from a region under the first integrated circuit die and a region of the second integrated circuit die.

8. The integrated device according to claim 1, comprising: A bridging die positioned above a portion of the second substrate layer and a portion of the integrated circuit die, and the bridging die has at least a first solder ball that electrically and mechanically couples the bridging die to the top surface of the second substrate layer and at least a second solder ball that electrically and mechanically couples the bridging die to the top surface of the integrated circuit die.

9. The integrated device according to claim 1, wherein, The liquid adhesive is an epoxy resin.

10. A method of manufacturing an integrated device, the method comprising: Providing a first substrate layer having a top surface and a bottom surface; Adhesively attaching the bottom surface of a second substrate layer to the top surface of the first substrate layer; Laser cut the second substrate layer and remove a part of the first part of the second substrate layer that is adhered to the top surface of the first substrate layer by an adhesive, so as to expose a second part of the top surface of the first substrate layer; Cut a trench in the second part of the top surface of the first substrate layer; Adhere an integrated circuit die to the exposed top surface of the first substrate layer through a liquid adhesive, so that the trench receives the liquid adhesive that oozes out between the integrated circuit die and the top surface of the first substrate layer.

11. The method according to claim 10, wherein The second part of the top surface of the first substrate layer is exposed to define the bottom of the cavity, and the trench is defined between the edge of the cavity and the periphery of the integrated circuit die.

12. The method according to claim 10, wherein, The second part of the top surface of the first substrate layer is exposed to define the bottom of the cavity, and the trench is defined between the edge of the cavity and the area under the integrated circuit die.

13. The method according to claim 10, wherein, The second part of the top surface of the first substrate layer is exposed to define the bottom of the cavity, and the trench is a first trench defined between the edge of the cavity and the first side of the integrated circuit die. The method includes: Cut a second trench in the second part of the top surface of the first substrate layer adjacent to the second side of the integrated circuit die.

14. The method according to claim 13, wherein, The second trench extends from the area under the integrated circuit die to the area outside the periphery of the integrated circuit die.

15. The method according to claim 13, wherein, The integrated circuit die is a first integrated circuit die. The method includes: Adhere a second integrated circuit adjacent to the first integrated circuit die to the second part of the top surface of the first substrate layer, so that the second trench is at least partially located between the first integrated circuit die and the second integrated circuit die.

16. The method according to claim 15, wherein, The second trench extends from the area under the first integrated circuit die and the area of the second integrated circuit die.

17. The method according to claim 10, includes: Mount a bridge die above a part of the second substrate layer and a part of the integrated circuit die, wherein at least a first solder ball of the bridge die electrically couples the bridge die to the top surface of the second substrate layer, and at least a second solder ball of the bridge die electrically couples the bridge die to the top surface of the integrated circuit die.

18. The method according to claim 10, wherein The liquid adhesive is epoxy resin.

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