An electronic device including an electronic chip mounted on top of a support substrate

Abstract

Embodiments of the present disclosure relate to an electronic device including an electronic chip mounted on top of a support substrate. The support substrate has a mounting surface having a metal heat transfer layer. A hole is provided to extend at least partially through the metal heat transfer layer. A metal heat transfer element is disposed in the hole of the metal heat transfer layer of the support substrate. The back surface of the electronic integrated circuit (IC) chip is fixed to the mounting surface of the support substrate via an adhesive material layer. The metal heat transfer element disposed in the hole of the metal layer of the support substrate extends to protrude into the adhesive material layer relative to the mounting surface of the support substrate.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the priority benefit of French Patent Application No. 1905858, filed on June 3, 2019, the content of which is incorporated herein by reference in its entirety to the maximum extent permitted by law. Technical Field

[0003] The present invention relates to the field of electronic devices including integrated circuit (IC) chips mounted on a support substrate. Background Art

[0004] In the case where the IC chip generates heat, it is advantageous to transfer a part of the generated heat to the support substrate. Summary of the Invention

[0005] According to one embodiment, an electronic device is proposed. The electronic device includes a support substrate having an opposing mounting surface and an electronic chip, and the back surface of the electronic chip is fixed to the opposing mounting surface of the support substrate via an adhesive material layer (e.g., an adhesive).

[0006] The support substrate includes a metal heat transfer layer on the side where its mounting surface faces the chip and has a plurality of holes.

[0007] The electronic device further includes a plurality of metal heat transfer elements, the plurality of metal heat transfer elements are disposed in the holes of the metal layer of the support substrate, and extend relative to the mounting surface of the support substrate and protrude into the adhesive material layer.

[0008] Thus, the heat transfer between the chip and the support substrate is increased.

[0009] The support substrate and the chip may advantageously not have an electrical connection via the metal heat transfer layer and the metal heat transfer elements.

[0010] The heat transfer element may be at a certain distance from the back surface of the chip.

[0011] The support substrate may include an integrated network of electrical connections, the integrated network of electrical connections having a front electrical connection block on the side surface of the opposing mounting surface of the support substrate, and electrical connection means linking the chip and the front block of the electrical connection network of the support substrate.

[0012] The metal heat transfer layer and the front electrical connection block may be provided in the same metal layer of the support substrate.

[0013] The electrical connection means may include metal wires that link the front block of the support substrate and the front block of the front surface of the chip.

[0014] The device may include a packaging block on top of the opposing surface of the support substrate, and the chip and the electrical connection means are embedded in the packaging block.

[0015] A method for manufacturing an electronic device is also proposed, the method comprising the steps of: obtaining a support substrate having a mounting surface and including a metal heat transfer layer on a side surface of the mounting surface; generating holes in the metal heat transfer layer; placing a metal heat transfer element in the holes of the metal heat transfer layer, the metal heat transfer element protruding and extending relative to the mounting surface of the support substrate; performing a brazing heat treatment on the metal heat transfer element in the holes of the metal heat transfer layer; depositing an adhesive material layer on top of the mounting surface of the support substrate, wherein a protruding portion of the heat transfer element protruding relative to the mounting surface of the support substrate is embedded in the adhesive material layer; and placing an electronic integrated circuit (IC) chip on top of the adhesive material layer to fix the chip on top of the support substrate.

[0016] The method may include the following subsequent steps: placing connection lines between the IC chip and the support substrate.

[0017] The method may include the following subsequent steps: manufacturing a package block on top of the support substrate and embedding the IC chip in the package block. Description of the Drawings

[0018] The electronic device shown in the drawings will now be described by way of non-limiting exemplary embodiments, in which:

[0019] Figure 1 A cross-section of the electronic device is shown;

[0020] Figure 2 Shows Figure 1 the manufacturing steps of the electronic device;

[0021] Figure 3 Shows Figure 1 the subsequent manufacturing steps of the electronic device;

[0022] Figure 4 Shows Figure 1 the subsequent manufacturing steps of the electronic device;

[0023] Figure 5 Shows Figure 1 the subsequent manufacturing steps of the electronic device;

[0024] Figure 6 Shows Figure 1 the subsequent manufacturing steps of the electronic device; and

[0025] Figure 7 Shows Figure 1 the subsequent manufacturing steps of the electronic device. Detailed Description

[0026] Figure 1The electronic device 1 shown includes: a support substrate 2 having a mounting surface 3 and a back surface 4; and an electronic integrated circuit (IC) chip 5 having a back surface 6, the back surface 6 being fixed to the mounting surface 3 of the support substrate via an adhesive material layer 7 (e.g., an adhesive).

[0027] The support substrate 2 is provided with a metal heat transfer layer 8, the metal heat transfer layer 8 being attached to the support substrate 2 on the side of the mounting surface 3 of the support substrate 2 and extending opposite at least a portion of the back surface 6 of the IC chip 5 and may extend beyond at least a portion of the peripheral edge of the IC chip 5. Advantageously, the metal heat transfer layer extends opposite the entire back surface 6 of the IC chip 5 and extends beyond the entire periphery of the IC chip 5.

[0028] The metal layer 8 at the mounting surface of the support substrate 2 has a plurality of holes 9, the plurality of holes 9 being opposite and open to the side of the back surface 6 of the IC chip 5. The holes 9 can be fabricated to extend only partially through the thickness of the metal layer 8 or completely (fully) through the thickness of the metal layer 8.

[0029] The electronic device 1 includes a plurality of substantially spherical metal heat transfer elements 10, the plurality of metal heat transfer elements 10 being fitted into the holes 9 of the metal layer 8 and including portions that project relative to the facing surface 3 of the support substrate 2 such that the projecting portions of the heat transfer elements extend above the upper surface of the metal layer and are embedded in the adhesive material layer 7.

[0030] The heat transfer element 10 includes a portion that at least partially fills the hole 9 and is attached (connected) to the metal layer 8 by soldering. Advantageously, the top surface of the heat transfer element 10 (which presents a dome-shaped surface shape in one embodiment) is spaced a certain distance from the back surface 6 of the IC chip 5.

[0031] The support substrate 2 and the IC chip 5 do not have an electrical connection via the metal heat transfer layer 8 and the metal heat transfer elements 10. The heat transfer elements 10 thus do not have an electrical connection function between the IC chip 5 and the support substrate 2.

[0032] A portion of the heat generated by the IC chip 5 is transferred to the support substrate 2 via the adhesive material layer 7. Due to the presence of the metal heat transfer layer 8 and the metal heat transfer elements 10, the heat flow between the IC chip 5 and the support substrate 2 is significantly increased.

[0033] In one or more regions of the IC chip 5 where the most heat is generated, the holes 9 and thus the metal heat transfer elements 10 can be evenly distributed or can be more dense.

[0034] The support substrate 2 is provided with an electrical connection integrated network 11, the electrical connection integrated network 11 being linked to the IC chip 5 by electrical connection means 12 (e.g., provided in the form of bonding wires).

[0035] On the one hand, the metal heat transfer layer 8 and the metal heat transfer element 10, and on the other hand, the electrical connection integrated network 11 and the electrical connection device 12 are different.

[0036] According to a variant embodiment, the electrical connection integrated network 11 includes a front electrical connection block 13 on the side surface of the opposite surface 3 of the support substrate 2. The front block is formed to extend beyond the peripheral edge of the IC chip 5 and is spaced a certain distance from the peripheral edge of the IC chip 5 and is spaced a certain distance from the metal heat transfer layer 8.

[0037] The electrical connection device 12 includes a wire 14, and the wire 14 links the front electrical connection block 13 with the front electrical connection block 15 on the front surface 16 of the IC chip 5.

[0038] The electrical connection integrated network 11 includes a back electrical connection block 17 on the side surface of the back surface 4 of the support substrate 2 to connect the IC chip 5 to the outside.

[0039] Advantageously, the metal heat transfer layer 8 and the front electrical connection block 13 are formed in the same metal layer of the support substrate 2. In this configuration, the top surfaces of the metal heat transfer layer 8 and the front electrical connection block 13 can be coplanar with the surface 3 of the substrate 2. The metal heat transfer element 10 extends above this coplanar surface.

[0040] As a result, according to the installation of the IC chip 5 on the support substrate 2 and the electrical connection device 12 between the IC chip 5 and the support substrate 2, the metal layer 8 and the element 10 constitute an additional dedicated heat transfer-oriented device.

[0041] The electronic device 1 further includes a packaging block 18 on the top of the opposite surface 3 of the support substrate, and the chip 5 and the wire 14 are embedded in the packaging block 18.

[0042] The electronic device 1 can be manufactured as follows.

[0043] As Figure 2 shown, a support substrate 2 with a metal heat transfer layer 8 and an electrical connection network 11 is obtained.

[0044] In Figure 3 the manufacturing step shown, holes 9 are formed in the metal heat transfer layer 8 by drilling or etching.

[0045] In Figure 4 the subsequent manufacturing step shown, the metal heat transfer element 10 is placed in the holes 9.

[0046] In Figure 5In the subsequent manufacturing steps shown, for example, heat treatment is performed in a baking oven to fix the metal heat transfer element 10 to the metal heat transfer layer 8 by soldering. In response to the heat treatment, the material forming the metal heat transfer element 10 creeps to advantageously provide a portion that fills the holes 9 and another portion that protrudes from the holes.

[0047] In Figure 6 the subsequent manufacturing steps shown, an adhesive material layer 7 (e.g., an adhesive) is deposited, and then the protruding portions of the metal heat transfer element 10 are embedded in the adhesive material layer 7.

[0048] In Figure 7 the subsequent manufacturing steps shown, the IC chip 5 is placed on top of the adhesive material layer 7, and the adhesive material is hardened to fix the IC chip 5 on top of the support substrate 2. The electrical connection lines 14 are placed in position.

[0049] Finally, the encapsulation block 18 is formed.

[0050] Then the electronic device 1 is obtained.

Claims

1. An electronic device, comprising: A support substrate having a mounting surface; An electronic integrated circuit (IC) chip having a back surface fixed to the mounting surface of the support substrate by an adhesive material layer; Wherein the support substrate includes a metal heat transfer layer at the mounting surface, and the metal heat transfer layer includes a plurality of holes; And A plurality of metal heat transfer elements disposed in the plurality of holes of the metal heat transfer layer, and the metal heat transfer elements extend to protrude into the adhesive material layer relative to the mounting surface of the support substrate.

2. The electronic device according to claim 1, wherein the support substrate includes an electrically connected integrated network, and the IC chip is not electrically connected to the electrically connected integrated network via the metal heat transfer layer and the metal heat transfer element.

3. The electronic device according to claim 1, wherein the surface of the metal heat transfer element is spaced apart from the back surface of the IC chip by a certain distance.

4. The electronic device according to claim 1, wherein the support substrate includes an electrically connected integrated network, and the electrically connected integrated network has a front electrical connection block at the mounting surface of the support substrate.

5. The electronic device according to claim 4, wherein the metal heat transfer layer and the front electrical connection block are at the same metal level as the support substrate.

6. The electronic device according to claim 4, further comprising an electrical connection device that links the IC chip and the front electrical connection block.

7. The electronic device according to claim 6, wherein the electrical connection device includes a metal wire that links the front electrical connection block to the front block on the front surface of the IC chip.

8. The electronic device according to claim 6, further comprising a packaging block on top of the mounting surface of the support substrate, and the IC chip and the electrical connection device are embedded in the packaging block.

9. The electronic device according to claim 4, wherein the top surfaces of the front electrical connection block and the metal heat transfer layer are coplanar with the mounting surface of the support substrate.

10. The electronic device according to claim 1, wherein the plurality of holes completely extend through the metal heat transfer layer.

11. The electronic device according to claim 1, wherein the adhesive material is an adhesive.

12. An electronic device, comprising: A support substrate having a front surface with electrical connection pads; A metal heat transfer layer in the support substrate, wherein the metal heat transfer layer has a mounting surface coplanar with the front surface and further includes a plurality of holes extending from the mounting surface through the metal heat transfer layer to the back surface of the metal heat transfer layer; And A plurality of metal heat transfer elements mounted in the plurality of holes of the metal heat transfer layer, each metal heat transfer element including a second part and a first part disposed in the hole, and the second part extends out of the hole to protrude above the mounting surface of the metal heat transfer layer.

13. The electronic device according to claim 12 further includes an electronic integrated circuit IC chip, the back surface of the IC chip being attached to the front surface of the support substrate through an adhesive material layer, wherein the second portion of each metal heat transfer element protrudes into the adhesive material layer.

14. The electronic device according to claim 13, wherein an outer surface of each metal heat transfer element is spaced apart from the back surface of the IC chip by a certain distance, and wherein the adhesive material fills the distance.

15. The electronic device according to claim 13 further includes bonding wires that electrically connect the IC chip to the electrical connection pads at the front surface of the support substrate.

16. The electronic device according to claim 13 further includes a package block on top of the front surface of the support substrate, wherein the package block packages the IC chip.

17. The electronic device according to claim 12, wherein the second portion has an outer surface in a dome shape.

18. A method for manufacturing an electronic device, comprising: Generate a metal heat transfer layer at the mounting surface of the support substrate; Form holes in the metal heat transfer layer; Place metal heat transfer elements in the holes of the metal heat transfer layer, and the metal heat transfer elements extend to protrude above the mounting surface of the support substrate; Perform a brazing heat treatment to fix the metal heat transfer elements in the holes of the metal heat transfer layer; Deposit an adhesive material layer on top of the mounting surface of the support substrate, wherein the protruding portions of the metal heat transfer elements extend to protrude relative to the mounting surface of the support substrate to be embedded in the adhesive material layer; And Place an electronic integrated circuit (IC) chip on top of the adhesive material layer to fix the IC chip on top of the support substrate.

19. The method according to claim 18 further includes placing electrical connection lines to connect the IC chip and the support substrate.

20. The method according to claim 18 further includes generating a package block on top of the support substrate, the IC chip being embedded in the package block.

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