Microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe and its manufacturing method

Abstract

The present invention belongs to the technical field of enhanced heat transfer for electronic chip cooling, and discloses a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe and a manufacturing method thereof, which includes a pipe body. One end of the pipe body is an evaporation end, and the other end is set as a condensation end. The pipe body includes a first heat-conducting silicon wafer and a second heat-conducting silicon wafer bonded to each other, and a nanoporous thin film is arranged between the first heat-conducting silicon wafer and the second heat-conducting silicon wafer. A microchannel array is arranged on the first heat-conducting silicon wafer, a steam channel is arranged on the second heat-conducting silicon wafer, and the nanoporous thin film is arranged between the microchannel array and the steam channel. A working medium for cooling is circulated and arranged in the steam channel and the microchannel array. The structure of the present invention is compact and has high precision, enabling the working medium to circulate without external power, improving the heat dissipation capacity of capillary evaporation, capable of quickly cooling the chip, and the heat dissipation amount can be automatically adjusted according to the heat load of the chip, having the advantage of improving the temperature uniformity.

Description

Technical Field

[0001] The present invention belongs to the technical field of enhanced heat transfer for electronic chip cooling, and particularly relates to a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe and a manufacturing method thereof. Background Art

[0002] With the accelerating pace of the update of portable electronic devices, the requirements for product performance, size, weight, and appearance have reached an unprecedented level. However, the problem of heat accumulation caused by miniaturization of size and improvement of performance has brought severe challenges to the heat dissipation of electronic devices. Especially, the internal electronic chips, as the main heat-generating components, controlling the electronic chips at a reasonable temperature has become a key factor in improving the performance of electronic devices. There is an urgent need to develop new heat dissipation principles and corresponding device designs.

[0003] Traditional air cooling and single-phase liquid convection cooling are limited by the large size of the equipment and the low heat transfer coefficient. Therefore, the technical advantages of phase change heat transfer are gradually emerging. As a passive two-phase heat transfer element, the ultra-thin heat pipe has the advantages of small size, low thermal resistance, long heat transfer distance, and flexible layout, and has been widely used in mobile phones, laptop computers, and smart watches. However, the metal ultra-thin heat pipes manufactured by the current mainstream flattening process face many problems and challenges in heat transfer performance and hardware assembly. With the decrease of the thickness, the steam flow generated at the evaporation end of the heat pipe has a large resistance, and the wick also has a reduced pumping capacity due to the thinning of the thickness, thereby reducing the working efficiency of the heat pipe. On the other hand, the metal outer wall of the heat pipe and the semiconductor silicon material have different thermal expansion coefficients, resulting in a large thermal stress on the chip. With the increasing heat dissipation requirements of future electronic device chips, the existing metal ultra-thin heat pipes face new heat dissipation bottlenecks. Therefore, it is necessary to improve the structure and material design of the ultra-thin heat pipe and the corresponding process technology, break through the performance limitations of traditional ultra-thin heat pipes, which is of great significance to the thermal management technology of new electronic devices.

[0004] Therefore, the present invention designs a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe and a manufacturing method thereof to solve the above technical problems. Summary of the Invention

[0005] To solve the above technical problems, the present invention proposes a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe and a manufacturing method thereof.

[0006] To achieve the above object, the present invention provides a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe, including a pipe body bonded to the surface of the chip. One end of the pipe body is set as the evaporation end and is bonded to the outer wall of the chip, and the other end of the pipe body is set as the condensation end and extends out of the chip range;

[0007] The tube body includes a first heat-conducting silicon wafer and a second heat-conducting silicon wafer that are bonded to each other, and a nano-porous film is disposed between the first heat-conducting silicon wafer and the second heat-conducting silicon wafer;

[0008] A micro-channel array is disposed on the first heat-conducting silicon wafer, and a steam channel corresponding to and communicating with the micro-channel array is disposed on the second heat-conducting silicon wafer. The nano-porous film is disposed between the micro-channel array and the steam channel;

[0009] A working fluid for cooling is circulated and flowed in the steam channel and the micro-channel array.

[0010] Preferably, the micro-channel array is opened on the side of the first heat-conducting silicon wafer facing the second heat-conducting silicon wafer, and the micro-channel array is arranged from the condensation end to the evaporation end.

[0011] Preferably, the steam channel is opened on the side of the second heat-conducting silicon wafer facing the first heat-conducting silicon wafer, and the steam channel is arranged from the condensation end to the evaporation end.

[0012] Preferably, the micro-channel array includes a plurality of parallel micro-channels, and the plurality of micro-channels are arranged at equal intervals. The nano-porous film is covered and bonded to the top of the micro-channels.

[0013] Preferably, the cross-section of the micro-channel is set to be rectangular.

[0014] Preferably, the evaporation end of the first heat-conducting silicon wafer is bonded and fixed to the outer wall of the chip, and the condensation end of the first heat-conducting silicon wafer extends out of the chip.

[0015] Preferably, the working fluid in the liquid state moves along the micro-channel array from the condensation end to the evaporation end, and enters the nano-pores of the nano-porous film under capillary action; the working fluid in the liquid state in the nano-pores absorbs heat and evaporates into a vapor state at the evaporation end, enters the steam channel and flows along the evaporation end of the steam channel to the condensation end, and condenses through the nano-porous film at the condensation end and enters the micro-channel array to complete a cycle.

[0016] A manufacturing method for a micro-channel-nano-porous film composite core silicon-based ultra-thin heat pipe includes the following steps:

[0017] Select a first heat-conducting silicon wafer and a second heat-conducting silicon wafer that meet the size requirements, and polish the contact surfaces of the two to be smooth and flat;

[0018] Machine a micro-channel array on the side of the first heat-conducting silicon wafer, and machine a steam channel corresponding to the micro-channel array on the second heat-conducting silicon wafer;

[0019] Select silicon-on-insulator that is adapted to the size of the first thermally conductive silicon wafer, and process a number of nanopores on one side of the silicon-on-insulator;

[0020] Bond and fix the side of the silicon-on-insulator with nanopores to the side of the first thermally conductive silicon wafer with a microchannel array;

[0021] Remove the excess material on the silicon-on-insulator to make the nanopores communicate with the outside world, forming a nanoporous thin film;

[0022] Bond and fix the side of the second thermally conductive silicon wafer with a vapor channel on the nanoporous thin film to obtain a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe.

[0023] Preferably, a buried oxide layer is provided in the silicon-on-insulator, and the processing depth of the nanopores ends with the buried oxide layer; after the silicon-on-insulator with nanopores is bonded to the first thermally conductive silicon wafer, remove the excess silicon material and the buried oxide layer on the silicon-on-insulator.

[0024] Preferably, the fixing method of the first thermally conductive silicon wafer and the silicon-on-insulator includes silicon-silicon bonding, and the fixing method of the second thermally conductive silicon wafer and the nanoporous thin film includes silicon-silicon bonding.

[0025] Compared with the prior art, the present invention has the following advantages and technical effects: The present invention discloses a microchannel-nanoporous membrane composite core silicon-based ultra-thin heat pipe and its manufacturing method. The pipe body made of the same silicon-based material as the chip is fixed on the chip. On the one hand, it can effectively avoid the thermal stress caused by the thermal expansion coefficients of different materials. On the other hand, it can effectively reduce the interfacial thermal resistance and improve the heat transfer efficiency. A microchannel array, a nanoporous thin film, and a vapor channel are arranged inside the pipe body. The core idea is to use the dual capillary forces of the microchannel array and the nanoporous thin film to drive the working fluid to flow from the condensation end to the evaporation end, and realize evaporation inside the nanopores of the nanoporous thin film at the evaporation end to achieve the purpose of dissipating heat from the chip. On the one hand, the strong capillary force of the nanoporous thin film can promote the timely replenishment of the condensed fluid and increase the upper limit of the heat load of capillary evaporation. On the other hand, capillary evaporation can effectively adapt to the distribution of non-uniform heat flux density and improve the temperature distribution on the surface of the electronic device chip. At the same time, the flow of the working fluid in the microchannel array is completely driven by the capillary forces of the microchannel array and the nanopores, without consuming pump power, and the evaporation amount in the nanopores can be automatically adjusted according to the heat load of the chip, which has the function of improving the temperature uniformity. The pipe body is made by bonding and fixing a first heat-conducting silicon wafer and a second heat-conducting silicon wafer, which can facilitate the processing of the microchannel array, the nanoporous thin film, and the vapor channel, reduce the processing difficulty, improve the processing accuracy, and realize the micro-scale processing technology, greatly reducing the size of the ultra-thin heat pipe, providing convenience for the portable development of electronic devices, enabling the sizes of the microchannel array and the nanoporous thin film to be precisely controlled, avoiding the extrusion of the wick by the thinning of the heat pipe thickness, and overcoming the contradiction between the capillary force and the wick thickness.

[0026] The structure of the present invention is compact and has high precision, enabling the working fluid to circulate without external power, improving the heat dissipation ability of capillary evaporation, realizing rapid cooling of the chip, and the heat dissipation amount can be automatically adjusted according to the heat load of the chip, improving the temperature distribution of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings constituting a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application. In the drawings:

[0028] Figure 1 is the heat dissipation principle diagram of the microchannel-nanoporous membrane composite core silicon-based ultra-thin heat pipe of the present invention;

[0029] Figure 2 is the structural schematic diagram of the pipe body of the present invention;

[0030] Figure 3 For the present invention Figure 2 is the partial enlarged view of A in

[0031] Figure 4Top view of the microchannel array of the present invention;

[0032] Figure 5 Top view of the nanoporous film of the present invention;

[0033] Figure 6 Top view of the vapor channel of the present invention;

[0034] Figure 7 Flow chart for fabricating the microchannel-nanoporous membrane composite core silicon-based ultra-thin heat pipe of the present invention;

[0035] In the figure: 1, tube body; 2, first thermal conductive silicon wafer; 3, second thermal conductive silicon wafer; 4, nanoporous film; 5, microchannel array; 6, vapor channel; 7, working fluid; 8, microchannel; 9, chip; 10, silicon on insulator; 11, buried oxide layer. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0038] Refer to Figures 1-7 As shown, this embodiment provides a microchannel-nanoporous film composite core silicon-based ultra-thin heat pipe, including a tube body 1 bonded to the surface of a chip 9. One end of the tube body 1 is set as an evaporation end and is bonded to the outer wall of the chip 9, and the other end of the tube body 1 is set as a condensation end and extends beyond the range of the chip 9;

[0039] The tube body 1 includes a first thermal conductive silicon wafer 2 and a second thermal conductive silicon wafer 3 bonded to each other, and a nanoporous film 4 is arranged between the first thermal conductive silicon wafer 2 and the second thermal conductive silicon wafer 3;

[0040] A microchannel array 5 is arranged on the first thermal conductive silicon wafer 2, a vapor channel 6 corresponding to and communicating with the microchannel array 5 is arranged on the second thermal conductive silicon wafer 3, and the nanoporous film 4 is arranged between the microchannel array 5 and the vapor channel 6;

[0041] A working fluid 7 for cooling is circulated and arranged in the vapor channel 6 and the microchannel array 5.

[0042] The present invention discloses a silicon-based ultra-thin heat pipe with a microchannel-nanoporous membrane composite core and a manufacturing method thereof. A tube body 1 made of the same silicon-based material as the chip 9 is fixed on the chip 9. On the one hand, it can effectively avoid the thermal stress caused by the thermal expansion coefficients of different materials. On the other hand, it can effectively reduce the interfacial thermal resistance and improve the heat transfer efficiency. A microchannel array 5, a nanoporous thin film 4, and a vapor channel 6 are arranged in the tube body 1. The core idea is to use the dual capillary forces of the microchannel array 5 and the nanoporous thin film 4 to drive the working fluid 7 to flow from the condensation end to the evaporation end, and evaporation is realized in the nanopores of the nanoporous thin film 4 at the evaporation end to achieve the purpose of dissipating heat from the chip 9. On the one hand, the strong capillary force of the nanoporous thin film 4 can promote the timely replenishment of the condensed fluid and increase the upper limit of the heat load of capillary evaporation. On the other hand, capillary evaporation can effectively adapt to the distribution of non-uniform heat flux density and improve the temperature distribution on the surface of the chip 9 of the electronic device. At the same time, the flow of the working fluid 7 in the microchannel array 5 is completely driven by the capillary forces of the microchannel array 5 and the nanopores, without consuming pump power, and the evaporation amount in the nanopores can be automatically adjusted according to the heat load of the chip 9, which has the function of improving the temperature uniformity. The tube body 1 is made by bonding and fixing a first heat-conducting silicon wafer 2 and a second heat-conducting silicon wafer 3, which can facilitate the processing of the microchannel array 5, the nanoporous thin film 4, and the vapor channel 6, reduce the processing difficulty, improve the processing accuracy, and realize the micro-scale processing technology, greatly reducing the size of the ultra-thin heat pipe and providing convenience for the portable development of electronic devices. The sizes of the microchannel array 5 and the nanoporous thin film 4 can be precisely controlled, avoiding the extrusion of the wick by the thinning of the heat pipe thickness and overcoming the contradiction between the capillary force and the wick thickness. The structure of the present invention is compact and has high precision, enabling the working fluid 7 to circulate without external power, improving the heat dissipation capacity of capillary evaporation, realizing the rapid cooling of the chip 9, and the heat dissipation amount can be automatically adjusted according to the heat load of the chip 9, improving the temperature distribution on the chip surface.

[0043] In a further optimized solution, the microchannel array 5 is opened on the side of the first heat-conducting silicon wafer 2 facing the second heat-conducting silicon wafer 3, and the microchannel array 5 is arranged from the condensation end to the evaporation end; the vapor channel 6 is opened on the side of the second heat-conducting silicon wafer 3 facing the first heat-conducting silicon wafer 2, and the vapor channel 6 is arranged from the condensation end to the evaporation end. The microchannel array 5 and the vapor channel 6 are respectively opened on the opposite surfaces of the first heat-conducting silicon wafer 2 and the second heat-conducting silicon wafer 3, and both are arranged from the evaporation end to the condensation end, so that the working fluid 7 can circulate between the evaporation end and the condensation end to achieve heat dissipation.

[0044] In a further optimized solution, the microchannel array 5 includes a plurality of parallel microchannels 8, and the plurality of microchannels 8 are arranged at equal intervals. The nanoporous thin film 4 is covered and bonded to the top of the microchannels 8; the cross-section of the microchannels 8 is set to be rectangular, and the plurality of microchannels 8 form capillaries, so that the liquid working fluid 7 can move without external force under the action of the capillary force formed by the microchannels 8 to realize circulation.

[0045] For a further optimized solution, the evaporation end of the first heat-conducting silicon wafer 2 is bonded and fixed to the outer wall of the chip 9. After the condensation end of the first heat-conducting silicon wafer 2 extends beyond the range of the chip 9, the first heat-conducting silicon wafer 2 and the chip 9 are fixed in the form of silicon-silicon bonding, enabling the heat of the chip 9 to be quickly transferred to the first heat-conducting silicon wafer 2, and allowing the heat of the chip 9 to dissipate rapidly. The working fluid 7 at the evaporation end evaporates and vaporizes under the action of the heat of the chip 9, enters the steam channel 6, absorbs the heat of the chip 9, and realizes temperature reduction. The vapor of the working fluid 7 in the steam channel 6 moves towards the condensation end, realizing the circulation of the working fluid 7.

[0046] For a further optimized solution, the working fluid 7 in liquid state moves from the condensation end to the evaporation end along the microchannel array 5 and enters the nanopores of the nanoporous thin film 4 under capillary action. The liquid working fluid 7 in the nanopores absorbs heat and evaporates into a vapor state at the evaporation end, enters the steam channel 6 and flows along the evaporation end of the steam channel 6 towards the condensation end, and condenses along the microchannel array 5 through the nanoporous thin film 4 at the condensation end, completing one cycle. The microchannel array 5 and the nanoporous thin film 4 are combined to form a composite wick structure, which can provide a strong capillary force. The heat generated by the chip 9 is transferred to the evaporation end, and the working fluid 7 flows from the condensation end to the evaporation end under the dual capillary forces of the microchannel 8 and the nanoporous thin film 4. Under the action of the capillary force of the nanopores at the evaporation end, the working fluid 7 enters the nanopores. As the heat load of the chip 9 increases, the liquid working fluid 7 evaporates in the nanopores, changing from the liquid state working fluid 7 to the vapor state working fluid 7. The vapor state working fluid 7 spontaneously flows from the evaporation end to the condensation end along the steam channel 6, enters the microchannel 8 through the nanoporous thin film 4 at the condensation end, and the vapor state working fluid 7 condenses into the liquid state working fluid 7 in the microchannel 8, completing one cycle.

[0047] Furthermore, in this embodiment, the flow of the working fluid 7 in the microchannel is completely driven by the capillary forces of the microchannel and the nanopores, without consuming pump work, and the evaporation amount in the nanopores can be automatically adjusted according to the heat load of the chip 9, having the advantage of improving the temperature uniformity.

[0048] Furthermore, in this embodiment, the microchannel 8 and the nanoporous thin film 4 have good hydrophilicity, can provide a large capillary force, can continuously transport the liquid at the condensation end to the nanopores at the evaporation end, ensuring the smooth progress of the evaporation process while increasing the upper limit of the heat load of capillary evaporation.

[0049] A manufacturing method for a microchannel-nanoporous thin film composite core silicon-based ultra-thin heat pipe includes the following steps:

[0050] Select the first heat-conducting silicon wafer 2 and the second heat-conducting silicon wafer 3 that meet the size requirements, and polish the contact surfaces between the two to be smooth and flat.

[0051] A microchannel array 5 is machined on the side surface of the first heat-conducting silicon wafer 2, and a steam channel 6 corresponding to the microchannel array 5 is machined on the second heat-conducting silicon wafer 3; the microchannel array 5 is machined on one side surface of the first heat-conducting silicon wafer 2 by photolithography, and the steam channel 6 is machined on one side surface of the second heat-conducting silicon wafer 3 by photolithography;

[0052] Select silicon-on-insulator 10 that is dimensionally adapted to the first heat-conducting silicon wafer 2, and machine a number of nanopores on one side of the silicon-on-insulator 10; the preparation of the nanoporous thin film 4 is completed on the device layer of the silicon-on-insulator 10, and the buried oxide layer 11 of the insulating silicon wafer is the etching end point; in the processing of the nanoporous thin film 4, its steps include:

[0053] Etch the nanopore array by interference lithography; deposit 50 nm thick SiO2 on the device layer of the silicon-on-insulator 10 as a hard mask layer, then spin-coat and bake the anti-corrosion coating to obtain a 170 nm thick stack, then use a 20 nm thick second layer of SiO2 electron beam to cover the wafer as an intermediate layer, and finally spin-coat the anti-corrosion coating and photoresist on the SiO2 and bake to a thickness of 200 nm to obtain the silicon-on-insulator 10 exposure stack;

[0054] Mount the wafer with the stack on the etching table and expose it to the expanded beams of two monochromatic coherent lasers to generate a grid for etching holes by double exposure; after exposure, bake and develop the photoresist to remove the unexposed areas;

[0055] In a capacitive coupling system, use CF4 to transfer the hole array pattern to the SiO2 intermediate layer, use O2 to transfer the hole array pattern to the anti-corrosion coating, use CF4 to transfer the hole array pattern of the anti-corrosion coating to the SiO2 hard mask, and finally, use HBr and O2 in the etching machine to etch nanopores in the wafer device layer;

[0056] Bond and fix the side of the silicon-on-insulator 10 with nanopores to the side of the first heat-conducting silicon wafer 2 with the microchannel array; remove the excess material on the silicon-on-insulator 10 to make the nanopores communicate with the outside world to form the nanoporous thin film 4; bond the side surface of the silicon-on-insulator 10 with nanopores to the side surface of the microchannel array on the first heat-conducting silicon wafer 2, and use SF6 and CHF3 gases to etch and remove the excess silicon material and the buried oxide layer 11 in the silicon-on-insulator 10 to obtain a composite wick structure in which the nanoporous thin film 4 is combined with the microchannel array on the first heat-conducting silicon wafer 2;

[0057] Bond the side of the second heat-conducting silicon wafer 3 with steam channels 6 fixed thereon to the nanoporous film 4 to obtain a microchannel-nanoporous film composite core silicon-based ultra-thin heat pipe; bond the obtained composite wick structure to the surface of the second heat-conducting silicon wafer 3 with steam channels 6 through silicon-silicon bonding to obtain a microchannel-nanoporous film 4 composite core silicon-based ultra-thin heat pipe.

[0058] In a further optimized solution, a buried oxide layer 11 is provided in the silicon-on-insulator 10, and the processing depth of the nanopores ends with the buried oxide layer 11; after the silicon-on-insulator 10 with nanopores is bonded to the first heat-conducting silicon wafer 2, the excess silicon material and the buried oxide layer 11 on the silicon-on-insulator 10 are removed.

[0059] In a further optimized solution, the fixing method of the first heat-conducting silicon wafer 2 and the silicon-on-insulator 10 includes silicon-silicon bonding, and the fixing method of the second heat-conducting silicon wafer 3 and the nanoporous film includes silicon-silicon bonding; in the present invention, the microchannel array 5 and the nanoporous film 4 are bonded by silicon-silicon bonding, which can tightly bond the nanoporous film 4 to the microchannel array 5, avoid the rupture of the film, reduce the interface thermal resistance, and improve the heat transfer efficiency.

[0060] Furthermore, the silicon-silicon bonding process can adopt the existing technology and will not be elaborated here.

[0061] In the present invention, the microchannels 8 and the nanoporous film 4 are processed by photolithography. This method has a mature processing technology and a short cycle, improving the practicability and popularization of the technical solution.

[0062] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0063] The embodiments described above are only for describing the preferred mode of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solution of the present invention should fall within the protection scope determined by the claims of the present invention.

Claims

1. A micro-channel-nanoporous film composite core silicon-based ultra-thin heat pipe, characterized in that: It comprises a tube body (1) bonded to the surface of a chip (9), one end of the tube body (1) being arranged as an evaporation end and bonded to the outer wall of the chip (9), and the other end of the tube body (1) being arranged as a condensation end and extending beyond the range of the chip (9); The tube body (1) comprises a first heat-conducting silicon wafer (2) and a second heat-conducting silicon wafer (3) which are bonded to each other, and a nanoporous film (4) is arranged between the first heat-conducting silicon wafer (2) and the second heat-conducting silicon wafer (3); The first heat-conducting silicon wafer (2) is provided with a micro-channel array (5), the second heat-conducting silicon wafer (3) is provided with a steam channel (6) corresponding to and connected to the micro-channel array (5), and the nanoporous film (4) is provided between the micro-channel array (5) and the steam channel (6); A working medium (7) for cooling is arranged to circulate in the steam channel (6) and the microchannel array (5); The micro-channel array (5) is provided on the side of the first heat-conducting silicon wafer (2) facing the second heat-conducting silicon wafer (3), and the micro-channel array (5) is arranged from the condensation end toward the evaporation end; The steam channel (6) is opened on the side of the second heat-conducting silicon wafer (3) facing the first heat-conducting silicon wafer (2), and the steam channel (6) is arranged from the condensation end toward the evaporation end; The microchannel array (5) comprises a plurality of microchannels (8) arranged in parallel in an array, the plurality of microchannels (8) being arranged at equal intervals, the nanoporous film (4) covering and bonding the top ends of the microchannels (8); and the cross section of the microchannels (8) is arranged to be rectangular.

2. The micro-channel-nanoporous film composite core silicon-based ultra-thin heat pipe according to claim 1, characterized in that: The evaporation end of the first heat-conducting silicon wafer (2) is bonded and fixed to the outer wall of the chip (9), and the condensation end of the first heat-conducting silicon wafer (2) extends out of the range of the chip (9).

3. The micro-channel-nanoporous film composite core silicon-based ultra-thin heat pipe according to claim 1, characterized in that: The working medium (7) in a liquid state moves along the microchannel array (5) from the condensation end to the evaporation end and enters the nanopores of the nanoporous film (4) under the action of capillary action; the working medium (7) in a liquid state in the nanopores absorbs heat at the evaporation end and evaporates into a steam state, enters the steam channel (6) and flows along the evaporation end to the condensation end of the steam channel (6), and at the condensation end, passes through the nanoporous film (4) and enters the microchannel array (5) to condense, completing a cycle.

4. A method for manufacturing a micro-groove-nanoporous film composite core silicon-based ultra-thin heat pipe, according to any one of claims 1 to 3, characterized in that The following steps are involved: Selecting a first heat-conducting silicon wafer (2) and a second heat-conducting silicon wafer (3) that meet the size requirements, and polishing the contact surfaces between the two to make them smooth and flat; A micro-groove array (5) is machined on the side of the first heat-conducting silicon wafer (2), and a steam groove (6) corresponding to the micro-groove array (5) is machined on the second heat-conducting silicon wafer (3); Selecting a silicon-on-insulator (10) having a size matching that of the first heat-conducting silicon wafer (2), and processing a plurality of nano-holes on one side of the silicon-on-insulator (10); Bonding and fixing the side of the silicon on insulator (10) processed with nanoholes to the side of the first heat-conducting silicon wafer (2) processed with a micro-groove array; Removing excess material on the silicon on insulator (10) to connect the nanopores to the outside world and form a nanoporous film (4); The side of the second heat-conducting silicon wafer (3) processed with the steam channel (6) is bonded and fixed on the nanoporous film (4) to obtain a micro-channel-nanoporous film composite core silicon-based ultra-thin heat pipe.

5. The method for manufacturing a silicon-based ultra-thin heat pipe with a micro-groove-nanoporous film composite core according to claim 4, characterized in that: A buried oxide layer (11) is provided in the silicon-on-insulator (10), and the processing depth of the nanohole takes the buried oxide layer (11) as an end point; after the silicon-on-insulator (10) with the nanohole is bonded to the first thermally conductive silicon wafer (2), excess silicon material and the buried oxide layer (11) on the silicon-on-insulator (10) are removed.

6. The method for manufacturing a silicon-based ultra-thin heat pipe with a micro-groove-nanoporous film composite core according to claim 4, characterized in that: The fixing method of the first heat-conducting silicon wafer (2) and the silicon-on-insulator (10) comprises silicon-silicon bonding, and the fixing method of the second heat-conducting silicon wafer (3) and the nanoporous film comprises silicon-silicon bonding.

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