Semiconductor packaging equipment

Abstract

The present invention discloses a semiconductor packaging device, comprising a packaging box, a mounting cabinet fixedly mounted on the lower surface of the packaging box, a packaging upper mold movably mounted inside the packaging box, a No. 2 hydraulic pump fixedly mounted on the upper surface of the inner portion of the packaging box, a heated packaging lower mold fixedly mounted on the lower surface of the packaging box, an injection molding machine fixedly mounted on one side of the heated packaging lower mold inside the packaging box, and a filter box fixedly mounted on the upper surface of the packaging box. The semiconductor packaging device described in the present invention can reduce the need for further de-burdening, making the entire packaging device more functional and improving work efficiency. It can also allow airflow to carry away the temperature on the surface of the heated packaging lower mold and the packaging upper mold through the heat dissipation fins, thereby quickly achieving the cooling and solidification effect, and can filter and remove odorous gases generated when the plastic is heated inside the packaging box.

Description

Technical Field

[0001] The present invention relates to the field of packaging equipment, and in particular to semiconductor packaging equipment. Background Art

[0002] Semiconductor chip packaging refers to the process of using film technology and microfabrication techniques to lay out, affix, and connect chips and other elements on a frame or substrate, leading out terminal blocks and encapsulating and fixing them with a plastic insulating medium to form an overall three-dimensional structure. This concept is a narrow definition of packaging. The broader definition of packaging refers to the packaging engineering process of connecting and fixing the package body to the substrate to assemble a complete system or electronic device and ensure the overall performance of the entire system. Combining the previous two definitions constitutes the broad concept of packaging. The purpose and function of semiconductor packaging is to protect, support, connect, and ensure its reliability. The connection function is to connect the chip's electrodes to the external circuit. The pins are used to connect to the external circuit, and gold wire connects the pins to the chip's circuit. The wafer stage is used to support the chip, and the epoxy resin adhesive is used to affix the chip to the wafer stage. The pins support the entire device, and the plastic package plays a role in fixing and protecting it. It has good practical effects and low packaging costs.

[0003] However, existing semiconductor packaging equipment has certain drawbacks when in use. During packaging, there is a lot of overflow between the pins of the packaged molded product, which often needs to be removed by soaking in weak acid or washing with high-pressure water. This operation is very time-consuming and labor-intensive, and wastes resources. In addition, the semiconductor packaging structure formed after processing cools down slowly, and the odorous gas generated inside is very unpleasant and can easily cause physical and mental health problems for personnel. Summary of the Invention

[0004] The main purpose of the present invention is to provide a semiconductor packaging device that can effectively solve the problems in the background technology.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] A semiconductor packaging device includes a packaging box, a mounting cabinet fixedly mounted on the lower surface of the packaging box, a packaging upper mold movably mounted inside the packaging box, a No. 2 hydraulic pump fixedly mounted on the upper surface of the interior of the packaging box, a heated packaging lower mold fixedly mounted on the lower surface of the packaging box, an injection molding machine fixedly mounted on one side of the heated packaging lower mold inside the packaging box, and a filter box fixedly mounted on the upper surface of the packaging box.

[0007] Preferably, an operation port is provided on the front surface of the packaging box, a sealed box door is movably installed on the edge of the front surface of the packaging box on one side of the operation port, a fixing card is fixedly installed on the other side of the sealed box door, a fixed pin is movably installed on the front surface of the packaging box on the other side of the operation port, and a control panel is fixedly installed on the side of the front surface of the packaging box on the side of the fixing pin away from the operation port.

[0008] Preferably, the sealed box door is movably connected to the packaging box body through a hinge, a tempered glass is fixedly embedded in the middle of the sealed box door, and the sealed box door is fixed to the packaging box body by a fixing pin clamped on a fixing card.

[0009] Preferably, a No. 1 hydraulic pump is connected and installed near the two side surfaces of the upper surface of the packaging upper mold, an upper mold groove is provided on the lower surface of the packaging upper mold, pin grooves are provided on the four sides of the lower surface of the packaging upper mold, and a shear port is provided on the surface of the packaging upper mold between the pin grooves.

[0010] Preferably, the number of the pin grooves is set according to the number of semiconductor pins, and the No. 1 hydraulic pump is fixedly mounted on the upper surface inside the packaging box.

[0011] Preferably, the output end of the No. 2 hydraulic pump is fixedly connected to a mounting panel, and a shearing structure is fixedly mounted on the lower surface of the mounting panel, and the shearing structure is arranged corresponding to the shearing port in the packaging upper mold.

[0012] Preferably, an injection channel is provided inside the heating package lower mold, an injection port is provided on the surface of the heating package lower mold at the port of the injection channel, a lower mold groove is provided on the upper surface of the heating package lower mold, the injection channel is connected with the lower mold groove through a vertical channel, the packaging upper mold is matched with the heating package lower mold, the number of the upper mold groove and the lower mold groove is three in total, and the upper mold groove and the lower mold groove are matched.

[0013] Preferably, an embedded slide is fixedly installed on the inner surface of the filter box, an activated carbon filter is fixedly embedded and installed inside the filter box, a HEPA high-efficiency particulate filter is fixedly embedded and installed below the activated carbon filter, an ultra-high-efficiency glass fiber filter is fixedly embedded and installed below the HEPA high-efficiency particulate filter, the outer surface edges of the activated carbon filter, the HEPA high-efficiency particulate filter and the ultra-high-efficiency glass fiber filter are fixedly installed with mounting frames, an air duct is fixedly connected and installed on the upper surface of the filter box, the other end of the air duct is fixedly connected and installed with a smoke extractor, and a pull-out handle is fixedly installed on the outer surface of the mounting frame

[0014] Preferably, the lower port of the filter box is connected to the packaging box, and sealing rings are fixedly installed near the edge of the upper and lower surfaces of the mounting frame. The mounting frame forms a sealing structure with the inner side of the packaging box through the sealing ring and the embedded slide. The upper surface of the filter box is connected to the smoke extractor through the air duct, and the exhaust port of the smoke extractor is fixedly connected to the exhaust pipe. The surfaces of the heating packaging lower mold and the packaging upper mold are fixedly installed with heat dissipation fins.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] In the present invention, by providing a No. 2 hydraulic pump, after the injection-molded plastic cools, the worker can start the No. 2 hydraulic pump, so that the output rod of the No. 2 hydraulic pump pushes the mounting panel downward, thereby pushing the connected shear structure to be quickly inserted into the shear port, so that the overflow between the pins can be cut off. This can reduce the need for the subsequent overflow removal process, making the entire packaging equipment more functional and improving work efficiency.

[0017] Through the filter box and the smoke extractor on its connecting structure, when cooling and exhausting, start the smoke extractor and open the sealed box door a little bit. At this time, the external cooling gas is sucked in, so that the airflow passes through the heat dissipation fins to take away the temperature of the surface of the heated packaging lower mold and the packaging upper mold, so that the cooling and solidification effect can be achieved quickly. The gas taken away from the box will pass through the ultra-high efficiency glass fiber filter, HEPA high efficiency particulate filter and activated carbon filter inside the filter box in turn, so that the odor gas generated when the plastic is heated inside the packaging box can be filtered and removed. The removed gas will go through the smoke extractor along the air duct and be discharged to the outside, which can play a certain purification role on the gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor packaging device according to the present invention;

[0019] Figure 2 A partial cross-sectional view of an upper packaging mold and a heated packaging lower mold of a semiconductor packaging device of the present invention;

[0020] Figure 3 A partial view of an upper package mold of a semiconductor packaging device according to the present invention;

[0021] Figure 4 A partial cross-sectional view of a semiconductor packaging device of the present invention showing an upper packaging die, a heated packaging lower die, and a shear structure;

[0022] Figure 5 This is a partial cross-sectional view of a filter box of a semiconductor packaging device according to the present invention.

[0023] In the figure: 1. Packaging box body; 101. Sealing box door; 102. Control panel; 103. Fixing card; 104. Fixing pin; 2. Installing cabinet body; 3. Packaging upper mold; 301. Hydraulic pump No. 1; 302. Upper mold groove; 303. Pin groove; 304. Shear port; 4. Hydraulic pump No. 2; 401. Installing panel; 402. Shearing structure; 5. Heating packaging lower mold; 501. Injection channel; 502. Injection port; 503. Lower mold groove; 6. Injection molding machine; 7. Filter box body; 701. Embedded slide; 702. Activated carbon filter; 703. HEPA high-efficiency particulate filter; 704. Ultra-high-efficiency glass fiber filter; 705. Installing frame; 706. Air duct; 707. Smoke exhaust fan; 708. Pull-out handle. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a communication between the internal parts of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] like Figure 1-5 As shown, a semiconductor packaging device includes a packaging box 1, a mounting cabinet 2 is fixedly mounted on the lower surface of the packaging box 1, a packaging upper mold 3 is movably mounted inside the packaging box 1, a second hydraulic pump 4 is fixedly mounted on the upper surface of the interior of the packaging box 1, a heated packaging lower mold 5 is fixedly mounted on the lower surface of the packaging box 1, an injection molding machine 6 is fixedly mounted on one side of the heated packaging lower mold 5 inside the packaging box 1, and a filter box 7 is fixedly mounted on the upper surface of the packaging box 1;

[0027] An operation port is provided on the front surface of the packaging box body 1. A sealed box door 101 is movably installed on the edge of one side of the operation port on the front surface of the packaging box body 1. A fixed card 103 is fixedly installed on the other side of the sealed box door 101. A fixed card pin 104 is movably installed on the front surface of the packaging box body 1 on the other side of the operation port. A control panel 102 is fixedly installed on the front surface of the packaging box body 1 on the side of the fixed card pin 104 away from the operation port; the sealed box door 101 is movably connected to the packaging box body 1 through a hinge, and a tempered glass is fixedly embedded in the middle of the sealed box door 101. The sealed box door 101 is fixed to the packaging box body 1 by the fixed card pin 104. A No. 1 hydraulic Pump 301, the lower surface of the package upper mold 3 is provided with an upper mold groove 302, the lower surface of the package upper mold 3 is provided with pin grooves 303 around the upper mold groove 302, and the surface of the package upper mold 3 is provided with a shear port 304 between the pin grooves 303; the number of pin grooves 303 is set according to the number of semiconductor pins, and the No. 1 hydraulic pump 301 is fixedly installed on the upper surface inside the package box 1; the output end of the No. 2 hydraulic pump 4 is fixedly connected and installed with a mounting panel 401, and the lower surface of the mounting panel 401 is fixedly installed with a shear structure 402, and the shear structure 402 is corresponding to the shear port 304 in the package upper mold 3. After the injection molded plastic cools down, the staff can start the No. 2 hydraulic pump 4, so that the output rod of the No. 2 hydraulic pump 4 pushes down The installation panel 401 is sent to push the shear structure 402 to be quickly inserted into the shear port 304, so that the overflow between the pins can be cut off, which can reduce the process of continuing to remove the overflow, making the entire packaging equipment more functional and improving work efficiency; the interior of the heating packaging lower mold 5 is provided with an injection channel 501, and the surface of the heating packaging lower mold 5 is provided with an injection port 502 at the end of the injection channel 501, and the upper surface of the heating packaging lower mold 5 is provided with a lower mold groove 503, and the injection channel 501 is connected with the lower mold groove 503 through a vertical channel, and the packaging upper mold 3 is matched with the heating packaging lower mold 5, and the number of the upper mold groove 302 and the lower mold groove 503 is three in total, and the upper mold groove 302 and the lower mold groove 503 are matched; the inner surface of the filter box 7 is solid An embedded slide 701 is fixedly installed, an activated carbon filter 702 is fixedly embedded in the interior of the filter box 7, a HEPA high-efficiency particulate filter 703 is fixedly embedded and installed below the activated carbon filter 702 in the interior of the filter box 7, and an ultra-high-efficiency glass fiber filter 704 is fixedly embedded and installed below the HEPA high-efficiency particulate filter 703 in the interior of the filter box 7. The outer edges of the activated carbon filter 702, the HEPA high-efficiency particulate filter 703, and the ultra-high-efficiency glass fiber filter 704 are fixedly installed with a mounting frame 705. An air duct 706 is fixedly connected to the upper surface of the filter box 7, and a smoke extractor 707 is fixedly connected to the other end of the air duct 706. A pull-out handle 708 is fixedly installed on the outer surface of the mounting frame 705.The lower port of the filter box 7 is connected to the packaging box 1, and the upper surface and lower surface of the mounting frame 705 are fixedly installed with sealing rings near the edge. The mounting frame 705 forms a sealing structure with the inner side of the packaging box 1 through the sealing ring and the embedded slide 701. The upper surface of the filter box 7 is connected to the smoke exhaust machine 707 through the air guide pipe 706. The exhaust port of the smoke exhaust machine 707 is fixedly connected and installed with a smoke exhaust pipe. The surfaces of the heating packaging lower mold 5 and the packaging upper mold 3 are fixedly installed with heat dissipation fins. When cooling and discharging waste, start the smoke exhaust machine 707 and open the sealed box door 101 a little bit. The gaps open, and external cooling air is drawn in. The airflow passes through the heat sink fins, removing the heat from the heated surfaces of the lower and upper packaging molds 5 and 3, thereby rapidly achieving cooling and solidification. The air carried away from the box then passes sequentially through the ultra-efficient glass fiber filter 704, HEPA high-efficiency particulate filter 703, and activated carbon filter 702 inside the filter box 7, filtering and removing the odorous gases generated when the plastic is heated inside the packaging box 1. The removed gases are then discharged outdoors through the air duct 706 and the smoke extractor 707, thus achieving a certain degree of purification.

[0028] It should be noted that the present invention is a semiconductor packaging equipment. When in use, the staff first needs to place the semi-finished semiconductor structure frame into the lower mold groove 503 on the heated packaging lower mold 5, and at the same time, its pins will be placed in the corresponding pin grooves 303, and then close the sealing box door 101 and fix it by the fixing card 103 and the fixing pin 104, and then control the control panel 102 to make the No. 1 hydraulic pump 301 extend the hydraulic rod to match the lower surface of the packaging upper mold 3 with the heated packaging lower mold 5, so as to achieve the mold closing state. At this time, the heated packaging lower mold 5 and the injection molding machine 6 will start heating at the same time, so that the temperature rises to the temperature of the plastic melting state. After melting, the injection molding machine 6 can squeeze the molten plastic into the injection channel 501 at high pressure, and then the injection channel 501 will be injected into the space formed by the lower mold groove 503 and the upper mold groove 302 through the vertical channels to encapsulate the semiconductor structure. After injection, the heating power supply of the heated packaging lower mold 5 is turned off, the smoke exhaust machine 707 is started, and the sealing The sealing box door 101 is opened a little, and the external cooling gas is sucked in at this time, so that the airflow takes away the temperature of the surface of the heated packaging lower mold 5 and the packaging upper mold 3 through the heat dissipation fins, so that the cooling and solidification effect can be achieved quickly. The gas taken away from the box will pass through the ultra-high efficiency glass fiber filter 704, HEPA high efficiency particulate filter 703 and activated carbon filter 702 inside the filter box 7 in turn, so that the odor gas generated when the plastic is heated inside the packaging box 1 can be filtered and removed, and the removed gas will follow the air duct 706 through the smoke exhaust fan 707 and be discharged to the outside, so that the gas can be purified to a certain extent, making it more environmentally friendly. After cooling, the staff can start the No. 2 hydraulic pump 4, so that the output rod of the No. 2 hydraulic pump 4 pushes the installation panel 401 downward, thereby pushing the shear structure 402 to be quickly inserted into the shear port 304, so that the overflow between the pins can be cut off, which can reduce the process of continuing to remove the overflow, making the entire packaging equipment more functional and improving work efficiency.

[0029] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging device, characterized in that: The invention comprises a packaging box (1), a mounting cabinet (2) is fixedly mounted on the lower surface of the packaging box (1), a packaging upper mold (3) is movably mounted inside the packaging box (1), a No. 2 hydraulic pump (4) is fixedly mounted on the upper surface of the packaging box (1), a heating packaging lower mold (5) is fixedly mounted on the lower surface of the packaging box (1), an injection molding machine (6) is fixedly mounted on one side of the heating packaging lower mold (5) inside the packaging box (1), and a filter box (7) is fixedly mounted on the upper surface of the packaging box (1); An operation port is provided on the front surface of the packaging box (1); a sealed box door (101) is movably mounted on an edge of one side of the operation port on the front surface of the packaging box (1); a fixed card (103) is fixedly mounted on the other side of the sealed box door (101); a fixed card pin (104) is movably mounted on the other side of the operation port on the front surface of the packaging box (1); and a control panel (102) is fixedly mounted on the side of the fixed card pin (104) away from the operation port on the front surface of the packaging box (1); The sealed box door (101) is movably connected to the packaging box body (1) via a hinge, a tempered glass is fixedly embedded in the middle of the sealed box door (101), and the sealed box door (101) is fixed to the packaging box body (1) by a fixing pin (104) being fixed on a fixing clamp (103); The inner surface of the filter box (7) is fixedly installed with an embedded slideway (701), the inner surface of the filter box (7) is fixedly installed with an activated carbon filter (702), the inner surface of the filter box (7) is fixedly installed with a HEPA high-efficiency particulate filter (703), the inner surface of the filter box (7) is fixedly installed with an ultra-high-efficiency glass fiber filter (704), the outer surface edges of the activated carbon filter (702), the HEPA high-efficiency particulate filter (703) and the ultra-high-efficiency glass fiber filter (704) are fixedly installed with a mounting frame (705), the upper surface of the filter box (7) is fixedly connected with an air duct (706), the other end of the air duct (706) is fixedly connected with a smoke extractor (707), and the outer surface of the mounting frame (705) is fixedly installed with a pull-out handle (708); The lower port of the filter box (7) is connected to the packaging box (1), and sealing rings are fixedly installed on the upper surface and lower surface of the installation frame (705) near the edge. The installation frame (705) forms a sealing structure with the inner side surface of the packaging box (1) through the sealing ring and the embedded slide (701). The upper surface of the filter box (7) is connected to the smoke exhaust machine (707) through the air guide pipe (706), and the exhaust port of the smoke exhaust machine (707) is fixedly connected and installed with a smoke exhaust pipe. The surfaces of the heating packaging lower mold (5) and the packaging upper mold (3) are fixedly installed with heat dissipation fins.

2. The semiconductor packaging device according to claim 1, wherein: A hydraulic pump (301) is connected and installed near both side surfaces of the upper surface of the packaging upper mold (3), an upper mold groove (302) is provided on the lower surface of the packaging upper mold (3), pin grooves (303) are provided on the lower surface of the packaging upper mold (3) around the upper mold groove (302), and a shear port (304) is provided on the surface of the packaging upper mold (3) between the pin grooves (303).

3. The semiconductor packaging device according to claim 2, wherein: The number of the pin grooves (303) is set according to the number of semiconductor pins, and the first hydraulic pump (301) is fixedly mounted on the upper surface inside the packaging box (1).

4. The semiconductor packaging device according to claim 2, wherein: The output end of the second hydraulic pump (4) is fixedly connected to a mounting panel (401), and a shearing structure (402) is fixedly mounted on the lower surface of the mounting panel (401). The shearing structure (402) is arranged corresponding to the shearing port (304) in the packaging upper mold (3).

5. The semiconductor packaging device according to claim 2, wherein: An injection channel (501) is provided inside the heating package lower mold (5), an injection port (502) is provided on the surface of the heating package lower mold (5) at the port of the injection channel (501), a lower mold groove (503) is provided on the upper surface of the heating package lower mold (5), the injection channel (501) is connected to the lower mold groove (503) through a vertical channel, the packaging upper mold (3) matches the heating package lower mold (5), the number of the upper mold groove (302) and the lower mold groove (503) is three in total, and the upper mold groove (302) matches the lower mold groove (503).

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