Method and apparatus for manufacturing an interconnect

Abstract

The application discloses a manufacturing method and a manufacturing device of an interconnection, relates to the photovoltaic technology field, and aims to manufacture the interconnection with stress buffering function, so as to inhibit the deformation degree of the back contact cell during series welding. The manufacturing method comprises the following steps: providing a welding strip, performing a forming treatment on the welding strip, and obtaining a plurality of structure welding strips; providing a flexible insulating base material, and combining the structure welding strips on the flexible insulating base material, so as to obtain the interconnection; each structure welding strip has two welding parts and a connecting part between the two welding parts, and the connecting part is connected with the two welding parts respectively; at least part of the connecting part is located on the flexible insulating base material, and the two welding parts extend out of the flexible insulating base material. The manufacturing device comprises a punching forming device for forming the structure welding strip, a material combining device for combining the flexible insulating base material and the plurality of structure welding strips, and the like. The interconnection manufactured by the manufacturing method of the interconnection provided by the application is used for interconnecting the cell pieces.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photovoltaic technology, in particular to a manufacturing method and manufacturing equipment of an interconnection. BACKGROUND

[0002] The back contact cell is a kind of cell with positive and negative electrodes on the back surface of the solar cell, which can realize interconnection by using a solder strip. It not only completely eliminates the shading loss of the front grid electrode, improves the cell efficiency, but also makes the cell more beautiful.

[0003] However, since the positive and negative electrodes of the back contact cell are located on the back surface of the back contact cell, the difference in the thermal expansion coefficient between the solder strip and the cell sheet is relatively large. Therefore, when the solder strip is welded on the solder pad of the back contact cell, the heat released during welding causes the solder strip to expand, and after the welding is completed, the solder strip shrinks due to the temperature drop, which causes the back contact cell to be severely deformed, thereby affecting the stability of the string welding and increasing the risk of fragmentation and hidden cracks in the module process. Therefore, it is urgent to find an alternative interconnection for the back contact cell to reduce the degree of deformation of the back contact cell during string welding.

[0004] In the prior art, the stress deformation interconnection structure can be considered to eliminate the deformation caused by stress during welding, but the stress phase change material in the stress deformation interconnection structure is difficult to manufacture, which becomes a problem for the application of the stress deformation interconnection structure in the welding process. SUMMARY

[0005] The present application aims to provide a manufacturing method and manufacturing equipment of an interconnection to manufacture an interconnection with stress buffering function, thereby inhibiting the degree of deformation of the back contact cell during string welding.

[0006] In a first aspect, the present application provides a manufacturing method of an interconnection, comprising:

[0007] providing a solder strip, and performing a forming process on the solder strip to obtain a plurality of structural solder strips; each of the structural solder strips has two welding portions and a connecting portion located between the two welding portions, and the connecting portion is connected to the two welding portions, respectively;

[0008] providing a flexible insulating substrate, and spacing and combining the plurality of structural solder strips on the flexible insulating substrate to obtain an interconnection; at least part of the connecting portion is located on the flexible insulating substrate, and the two welding portions extend out of the flexible insulating substrate.

[0009] When using the above technical solution, after the welding ribbon is formed, multiple structural welding ribbons are laminated onto the flexible insulating substrate at intervals to form an interconnect, so that at least part of the connection portion of each structural welding ribbon is located on the flexible insulating substrate. When the structural welding ribbon is subjected to stress due to the welding process, the lamination process, and the high and low temperature differences outdoors, the connection portion contained in the structural welding ribbon can transfer the stress to the flexible insulating substrate, and release it through the flexible insulating substrate, thereby reducing the degree of bending deformation of the back-contact battery and improving welding stability and long-term use stability. At the same time, the flexible insulating substrate plays a role in fixing and dustproofing the multiple structural welding ribbons during the welding process, preventing the relative position of the structural welding ribbons and the welding pad from shifting during welding, and preventing particulate matter generated by welding from migrating to the front of the battery cell, thereby improving welding accuracy.

[0010] In addition, when the interconnection member manufactured by the manufacturing method of the interconnection member provided by the present invention is used for interconnection between back-contact batteries, the interconnection member can not only serve as a vertical conductive channel to realize interconnection between back-contact batteries, but also can provide electrical isolation for the areas other than the pads of two adjacent back-contact batteries with the help of a flexible insulating substrate, thereby reducing the possibility of leakage and improving battery efficiency.

[0011] In one possible implementation, the connection portion of each structural solder ribbon has a hollow structure for stress relief. When the structural solder ribbon experiences stress due to welding, lamination, and outdoor high and low temperature variations, the connection portion not only transfers the stress to the flexible insulating substrate, but the hollow structure also partially relieves the stress, further reducing the degree of bending deformation of the back-contact battery and improving welding stability and long-term stability.

[0012] In one possible implementation, the hollow structure includes at least one through-hole. Each through-hole has a closed pattern. Here, the closed pattern refers to a closed outline of the hollow structure. In this case, the edge contour of the connecting portion is complete, ensuring good strength of the structural welding ribbon.

[0013] The pattern of each through hole is a polygonal pattern, a circular pattern, an elliptical pattern or a special-shaped pattern. The polygonal pattern can be a triangle, a rectangle, a square, etc.

[0014] In one possible implementation, the hollow structure includes m rows of through holes, where m is an integer greater than or equal to 1. Each row of through holes includes at least one through hole. The first row of through holes and the mth row of through holes are formed in the connecting portion along any direction parallel to the first forming portion.

[0015] In one possible implementation, m is an integer greater than or equal to 2, and two adjacent rows of through holes are staggered. In this case, the m rows of through holes in the connecting portion can more evenly release the stress generated by the structural welding ribbon, thereby further reducing the degree of deformation of the back contact battery.

[0016] In one possible implementation, when the above-mentioned through hole is a slit-type through hole or a rectangular through hole, if the length direction of the through hole is the distribution direction from the two welding parts, then the spacing between the two rows of through holes can be adjusted so that the current of one welding part is transmitted to the other welding part through the connecting part in a straight line as much as possible, thereby reducing current loss.

[0017] In one possible implementation, m is an integer greater than or equal to 3. The number of through-holes included in the first row of through-holes and the m-th row of through-holes is greater than or equal to 2. In this case, along the distribution direction from the first row of through-holes to the m-th row of through-holes, the number of through-holes included in each row of through-holes first decreases and then increases.

[0018] When using the above technical solution, if the length of each row of through-holes first decreases and then increases along the distribution direction of through-holes from the first row to the mth row, the structural strength of the connection first increases and then decreases, and the stress in the connection first gradually decreases and then gradually increases. Based on this, the distribution of through-holes in the connection can be used to adjust the strength and stress-relieving capacity of each area of ​​the connection, so that the strength and stress-relieving capacity of the connection are coordinated.

[0019] In one possible implementation, when m is an integer greater than or equal to 3, the number of through holes included in the first row of through holes and the mth row of through holes is greater than or equal to 1; along the distribution direction from the first row of through holes to the mth row of through holes, the number of through holes included in each row of through holes first increases and then decreases.

[0020] When using the above technical solution, if the length of each row of through-holes first decreases and then increases along the distribution direction of through-holes from the first row to the mth row, the structural strength of the connection first decreases and then increases, and the stress in the connection first gradually increases and then gradually decreases. Based on this, the distribution of through-holes in the connection can be used to adjust the strength and stress release capacity of each area of ​​the connection, so that the strength and stress release capacity of the connection are coordinated.

[0021] In one possible implementation, the central axes of the two welding parts are collinear. In this case, the current flowing from one welding part to the other welding part can be conducted as close to a straight line as possible.

[0022] In one possible implementation, the width of each weld is smaller than the maximum width of the connecting portion. Each weld is connected to the connecting portion using an arc transition. When this arc transition is used, stress concentration is less likely to occur at the arc transition, further reducing stress in the structural weld band due to temperature changes.

[0023] In one possible implementation, the flexible insulating substrate is a light-shielding flexible insulating substrate. When the interconnector interconnects two adjacent back-contact solar cells, if the flexible insulating substrate is partially or completely located in the gap between the two adjacent back-contact solar cells, the flexible insulating substrate can serve as a visual shielding structure. This prevents the structural welding ribbon on the back of the solar cell module from being visible when viewed from the front, thereby improving the aesthetics of the solar cell module.

[0024] In a possible implementation, the material of the flexible insulating substrate may be an insulating polymer material, which includes polymer materials such as polyvinyl butyral (PVB), polyolefin (POE), or ethylene vinyl acetate copolymer (EVA).

[0025] In a possible implementation, at least one surface of the flexible insulating substrate is partially or entirely provided with a shielding coating. The effect of the shielding coating is described in detail in the description of the light-shielding flexible insulating substrate and is not described in detail here.

[0026] In a possible implementation, the flexible insulating substrate may be a single-sided tape or a double-sided tape.

[0027] Using this technical solution, the flexible insulating substrate can be bonded to the back-contact cell, effectively positioning the structured solder ribbon. Furthermore, when the interconnect is used for back-contact cell interconnection, if the flexible insulating substrate is positioned between two adjacent back-contact cells, the release layer of the single-sided or double-sided tape can serve as a visual barrier, enhancing the aesthetics of the solar cell module while also reducing particulate matter contamination.

[0028] In a possible implementation, the above-mentioned forming process is performed by mechanical stamping, chemical etching or laser cutting.

[0029] In one possible implementation, the composite method is bonding. When each structural welding ribbon is bonded to the flexible insulating substrate, the adhesive may be a synthetic polymer adhesive, including but not limited to one or more of polyvinyl acetate, polyvinyl acetal, acrylate, polystyrene, epoxy resin, acrylic resin, polyurethane resin, unsaturated polyester, butyl rubber, nitrile rubber, phenolic-polyvinyl acetal, and epoxy-polyamide.

[0030] In a possible implementation, the composite manner is a hot-pressing manner. The temperature of the hot-pressing manner can be ensured not to damage the flexible insulating material. For example, the hot-pressing temperature of the hot-pressing manner is 50-120°C, and the hot-pressing time is 5-30 seconds.

[0031] In a possible implementation, each structural solder strip has a connecting portion exposed from the surface of the flexible insulating substrate. At this time, the flexible insulating substrate can be used to press the structural solder strips together.

[0032] In a possible implementation, when the connecting portion of each structural solder strip is embedded in the flexible insulating substrate, the connecting portion of each structural solder strip is at least partially wrapped in the flexible insulating substrate. At this time, the interconnection is a sandwich structure, and the flexible insulating substrate can be used to further fix the structural solder strips. This not only further reduces or eliminates the displacement of the structural solder strips during welding, but also eliminates the possibility of disconnection between the structural solder strips and the flexible insulating substrate in the case of warping of one of the welding portions of the structural solder strips under stress, thereby ensuring the stability of the connection between the structural solder strips and the flexible insulating substrate.

[0033] In a possible implementation, the flexible insulating substrate has a strip structure. The plurality of structural solder strips are distributed along the strip extension direction of the flexible insulating substrate.

[0034] In a possible implementation, the flexible insulating substrate has a conductive layer, and the connecting portion of each structural solder strip is electrically connected through the conductive layer. The conductive layer can be a conductive strip or a conductive particle layer composed of mutually contacting metal particles.

[0035] In the case of using the above technical solution, the conductive layer can electrically connect the conductive layers contained in each structural solder strip together, so that the conductive layer can be used as a transverse conductive channel. When one of the structural solder strips contains a welding portion that does not weld well with the corresponding polar pad, the structural solder strip as a local failure of the vertical conductive channel, but the structural solder strip can still use the conductive layer to conduct current to other structural solder strips with good welding, avoiding the problem of reduced battery efficiency when the vertical conductive channel is locally failed, thereby improving the connection reliability of the interconnection.

[0036] In a possible implementation, the solder strip is subjected to a forming process to obtain at least one structural solder strip, including:

[0037] The solder strip is subjected to mechanical stamping along the length direction of the solder strip to form a plurality of structural solder strips connected together; and the plurality of structural solder strips connected together are separated by cutting.

[0038] In a possible implementation, laminating a plurality of structural welding strips at intervals on a flexible insulating substrate to obtain an interconnection component includes: pressing a plurality of structural welding strips at intervals on a flexible insulating substrate to obtain an interconnection component.

[0039] In a second aspect, the present invention further provides an interconnect manufacturing device comprising: a ribbon unwinding device, a substrate unwinding device, a stamping and forming device, a material laminating device, and a winding device. The ribbon unwinding device is used to provide the ribbon to the stamping and forming device; the material laminating device is used to provide the flexible insulating substrate to the material laminating device; the stamping and forming device is used to form the ribbon to obtain multiple structural ribbons; the material laminating device is used to laminarly laminate the multiple structural ribbons onto the flexible insulating substrate to obtain the interconnect; and the winding device is used to wind the interconnect.

[0040] The connection portion of each of the structural welding strips included in the interconnection element is at least partially located within the flexible insulating substrate, and the two welding portions extend out of the flexible insulating substrate.

[0041] The stamping and forming device includes a forming die, which includes an upper die and a lower die. Each of the upper die and the lower die has a first forming portion for forming a connecting portion and two second forming portions for forming a welding portion. The first forming portion is located between the two second forming portions, and the first forming portions are connected to the second forming portions respectively.

[0042] When using the above technical solution, a ribbon unwinding device can be used to supply the ribbon to the stamping and forming device, enabling automated feeding of the stamping and forming device, allowing the stamping and forming device to continuously stamp the ribbon. Because the upper and lower dies included in the forming mold each have a first forming portion for forming the connecting portion and two second forming portions for forming the welding portions. Since the first forming portion is located between the two second forming portions, and two first forming portions are connected to the second forming portions, when the ribbon is stamped using the stamping and forming device, multiple structural ribbons can be stamped onto the ribbon. In this case, each structural ribbon includes a connecting portion corresponding to the first forming portion and two welding portions corresponding to the two second forming portions, with the connecting portion located between and connected to the two welding portions. Furthermore, a substrate unwinding device can supply a flexible insulating substrate to the material laminating device. Therefore, while the stamping and forming device can continuously stamp the structural ribbons, the material laminating device can achieve automated feeding of the flexible insulating substrate, allowing the material laminating device to continuously laminate multiple structural ribbons onto the flexible insulating substrate at intervals, thereby forming an interconnect. Furthermore, because the connection portion of each structural welding ribbon can be at least partially located on the flexible insulating substrate, the resulting interconnect has excellent flexibility. Therefore, the material laminating device can continuously laminate multiple structural welding ribbons onto the flexible insulating substrate at intervals, and the winding device can wind up the interconnect to achieve roll packaging of the interconnect. Thus, the interconnect manufacturing equipment provided by the present invention can achieve continuous batch production of interconnects, which is conducive to the mass production of interconnects.

[0043] More importantly, because each structural welding ribbon's connection portion can be at least partially located on the flexible insulating substrate, the stress generated by the structural welding ribbon during the welding process, lamination process, and outdoor high and low temperature fluctuations can be transferred to the flexible insulating substrate by the connection portion, and then released through the flexible insulating substrate. Therefore, the interconnection device provided by the present invention can reduce the degree of bending deformation of back-contact solar cells, improving welding stability and long-term stability. Furthermore, the flexible insulating substrate secures the multiple structural welding ribbons and provides dust protection during the welding process, preventing the relative position of the structural welding ribbons and the welding pads from shifting, and preventing particulate matter generated by welding from migrating to the front of the solar cell, thereby improving welding accuracy.

[0044] In addition, when the interconnection parts manufactured by the manufacturing equipment of the interconnection parts provided by the present invention are used for interconnection between back-contact batteries, the interconnection parts can not only serve as vertical conductive channels to realize interconnection between back-contact batteries, but also can provide electrical isolation for the areas other than the pads of two adjacent back-contact batteries with the help of a flexible insulating substrate, thereby reducing the possibility of leakage and improving battery efficiency.

[0045] In one possible implementation, the central axes of the two second forming portions are collinear. When the welding strip is punched using a punching device, the central axes of the two welding portions of the formed structural welding strip are collinear, and the effect thereof is described above.

[0046] In one possible implementation, the width of each second formed portion is smaller than the width of the first formed portion, and each second formed portion is connected to the first formed portion using an arc transition. When the welding ribbon is stamped using a stamping device, the first welding portion and the second welding portion of the resulting structural welding ribbon are both connected to the connecting portion using an arc transition, and the effect thereof is described above.

[0047] In one possible implementation, both the upper and lower dies further include a third forming portion located within the first forming portion. This third forming portion is used to form a hollow structure in the connection portion for stress relief. When the welding ribbon is stamped using the stamping device, the resulting structural welding ribbon includes a hollow structure in the connection portion. The beneficial effects thereof are described above.

[0048] In one possible implementation, the third forming portion includes at least one hole-forming portion. Each hole-forming portion has a closed pattern, and the beneficial effects thereof are described above. For example, each hole-forming portion may have a polygonal pattern, a circular pattern forming portion, an elliptical pattern forming portion, or a special-shaped pattern forming portion. The effects here refer to the description of the hollow structure pattern described above.

[0049] In one possible implementation, the third forming portion includes m rows of hole forming portions, where m is an integer greater than or equal to 1. Each row of the hole forming portions includes at least one hole forming portion, and the first row of hole forming portions and the mth row of hole forming portions are formed in the first forming portion along any direction parallel to the connecting portion.

[0050] In a possible implementation, when m is an integer greater than or equal to 2, two adjacent rows of hole forming portions are staggered, and the effect thereof is as described above.

[0051] In one possible implementation, when m is an integer greater than or equal to 3, the number of hole-forming sections included in the first and mth rows of hole-forming sections is greater than or equal to 2. In this case, along the distribution direction from the first to the mth row of hole-forming sections, the number of hole-forming sections included in each row of hole-forming sections first decreases and then increases. For the effects here, refer to the relevant description above.

[0052] In one possible implementation, when the first row of hole forming parts and the mth row of hole forming parts are formed in the first forming part along the distribution direction of the two second forming parts, along the distribution direction from the first row of hole forming parts to the mth row of hole forming parts, the number of hole forming parts included in each row of hole forming parts first decreases and then increases, and the distances between the head and tail ends of each row of hole forming parts and the edge of the first forming part first decrease and then increase.

[0053] In one possible implementation, when m is an integer greater than or equal to 3, the number of hole forming parts included in the first row of hole forming parts and the mth row of hole forming parts is greater than or equal to 1; along the distribution direction from the first row of hole forming parts to the mth row of hole forming parts, the number of hole forming parts included in each row of hole forming parts first increases and then decreases.

[0054] In one possible implementation, the stamping forming device further includes a stamping machine. The upper die is provided on the stamping machine. The stamping machine is used to control the upper die and the lower die to close and open the die.

[0055] In one possible implementation, the stamping and forming device further includes a ribbon straightening roller and a ribbon pulling roller. The forming die is located between the ribbon straightening roller and the ribbon pulling roller. When the stamping machine controls the upper die to open the die, the ribbon straightening roller is used to adjust the position of the ribbon, while the ribbon pulling roller is used to pull the ribbon, ensuring that the portion of the ribbon to be stamped falls accurately between the upper and lower dies, thereby ensuring that the stamping and forming device can properly stamp the ribbon.

[0056] In one possible implementation, when multiple structural welding ribbons are connected together, the interconnect manufacturing apparatus further includes: a first industrial robot and a cutting mechanism located between the stamping and forming device and the material combining device. The first industrial robot is configured to pull the connected multiple structural welding ribbons to a cutting station of the cutting mechanism when the upper and lower dies are opened. The cutting mechanism is configured to separate the connected multiple structural welding ribbons at the cutting station to form multiple structural welding ribbons.

[0057] When adopting the above technical solution, after the cutting mechanism completes the separation of the structural welding strips once, the first industrial robot can pull the remaining connected structural welding strips to the cutting station of the cutting mechanism, so that the process of cutting the structural welding strips is automated.

[0058] In one possible implementation, the interconnect manufacturing apparatus further includes an image sensor and a controller communicating with the image sensor and a cutting mechanism. The image sensor is configured to capture an image of the connected plurality of structural welding ribbons at a cutting station of the cutting mechanism. The controller is configured to control the cutting mechanism to separate the connected plurality of structural welding ribbons based on the image of the connected plurality of structural welding ribbons.

[0059] In the technical scheme, the image sensor and the cutting mechanism are in communication with the controller, so that the controller can receive the image of the plurality of structural solder strips connected together collected by the image sensor and perform image recognition. When the controller identifies a gap between two adjacent structural solder strips in the plurality of structural solder strips connected together in the image, the controller controls the cutting mechanism to cut the gap according to the image of the plurality of structural solder strips connected together, so that one structural solder strip is separated from the plurality of structural solder strips connected together. Therefore, the manufacturing equipment for the interconnect provided by the present application can control the cutting mechanism to accurately cut the plurality of structural solder strips connected together with the assistance of the image sensor and the controller, avoid damage to the structural solder strips caused by inaccurate cutting, and improve the cutting yield.

[0060] In a possible implementation, the manufacturing equipment for the interconnect further includes a second industrial robot and a speed sensor in communication with the controller. The second industrial robot is configured to intermittently feed the structural solder strip to the flexible insulating substrate. The speed sensor is configured to collect the feeding speed of the flexible insulating substrate. The controller is further configured to control the time interval of feeding the structural solder strip by the second industrial robot according to the feeding speed of the flexible insulating substrate and the distribution interval of the structural solder strip on the flexible insulating substrate.

[0061] In the technical scheme, the speed sensor and the second industrial robot are in communication with the controller, so that the controller can receive the feeding speed of the flexible insulating substrate collected by the speed sensor and control the time interval of feeding the structural solder strip by the second industrial robot, thereby improving the automation degree of the structural solder strip on the flexible insulating substrate.

[0062] In a possible implementation, the solder strip unwinding device includes a first unwinding roller and a conveying roller, and the conveying roller is located between the first unwinding roller and the stamping forming device.

[0063] In the technical scheme, the conveying roller is located between the first unwinding roller and the stamping forming device, so that the conveying roller can continuously convey the solder strip released by the first unwinding roller, thereby realizing continuous stamping of the structural solder strip and making batch production of the interconnect possible. At the same time, since the structural solder strips are distributed on the flexible insulating substrate, the manufactured interconnect can be packaged and stored in the form of a roll, and therefore, the interconnect can be partially automatically packaged by using the winding device to wind the interconnect.

[0064] In a possible implementation, the substrate unwinding device includes at least one second unwinding roller.

[0065] When the number of the second unwinding rollers is one, the structural solder strip is exposed away from the surface of the flexible insulating substrate.

[0066] When the number of the second unwinding rollers is two, the plurality of structural welding ribbons may be placed between the first insulating substrate and the second flexible insulating substrate, so that the connection portions of the plurality of structural welding ribbons may be wrapped by the two flexible insulating substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0068] Figures 1A to 1C Schematic diagram of the various stages of the method for manufacturing an interconnection element provided by an embodiment of the present invention;

[0069] Figure 2A and Figure 2B Schematic diagrams of two structures of structural welding strips in an embodiment of the present invention;

[0070] Figures 3A to 5A Schematic diagrams of three distributions of multiple rows of through holes distributed along a first direction in an embodiment of the present invention;

[0071] Figures 3B to 5B Schematic diagrams of three distributions of multiple rows of through holes distributed along the second direction in an embodiment of the present invention;

[0072] Figure 6 A schematic diagram of the back structure of a cell to which the interconnection element manufactured according to an embodiment of the present invention is applicable;

[0073] Figures 7A to 7C The interconnection device manufactured by the embodiment of the present invention Figure 6 Schematic diagram of three application scenarios of the battery cell shown;

[0074] Figure 8 A schematic structural diagram of a flexible insulating substrate provided by an embodiment of the present invention;

[0075] Figure 9A is a schematic diagram of an exemplary interconnection structure in an embodiment of the present invention;

[0076] Figure 9B is a schematic diagram of another exemplary interconnection structure according to an embodiment of the present invention;

[0077] Figure 10A is a schematic diagram of another exemplary interconnection structure according to an embodiment of the present invention;

[0078] Figure 10B for Figure 10A A cross-sectional view of the interconnection member shown in the AA direction;

[0079] Figure 10C for Figure 10AAnother cross-sectional view of the interconnection member shown in the AA direction;

[0080] Figure 11 A schematic structural diagram of an interconnect manufacturing device is provided for an embodiment of the present invention;

[0081] Figure 12A and Figure 12B This is a schematic structural diagram of a stamping die in an embodiment of the present invention;

[0082] Figure 13A and Figure 13B A schematic structural diagram of another stamping die in an embodiment of the present invention;

[0083] Figures 14A to 16A Schematic diagrams of three distributions of multi-row hole forming portions distributed along a first direction in an embodiment of the present invention;

[0084] Figures 14B to 16B Schematic diagrams of three distributions of multi-row hole forming portions distributed along the second direction in an embodiment of the present invention;

[0085] Figure 17 This is an example diagram of the automation principle of the manufacturing equipment for interconnected components provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0086] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0087] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0088] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more, unless otherwise specifically defined.

[0089] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0090] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0091] The manufacturing method of the interconnection provided by the embodiment of the present application can be applied to the interconnection of the back contact battery piece, but is not limited thereto. As for the type of the back contact battery piece, it can be the type of the battery piece 100, can be the type of the interdigitated back contact (abbreviated as IBC cell), the metallization wrap-through (abbreviated as MWT) silicon solar cell, the emitter-wrap-through (abbreviated as EWT) silicon solar cell, etc., but is not limited thereto.

[0092] Figures 1A to 1C The manufacturing method of the interconnection provided by the embodiment of the present application is exemplified in the state schematic diagram of each stage. As shown in Figures 1A to 1C The manufacturing method of the interconnection provided by the embodiment of the present application includes:

[0093] As shown in Figure 1A A solder strip 100A is provided. Due to the flexible characteristics of the solder strip 100A, a pay-off roller, a conveying roller and the like mechanism can be used to pay off the solder strip 100A, so as to realize the feeding of the solder strip 100A. The thickness of the solder strip 100A can be 0.02mm-0.3mm, and the width can be 3mm-7mm. As for the type of the solder strip 100A, it can be selected according to the actual situation, for example: the solder strip 100A is a copper-based material such as oxygen-free copper or T2 red copper, and the copper content is ≥99.99wt%, and the electrical conductivity is ≥98%. The solder strip 100A is double-sided coated, the coating material is Sn63Pb37, the coating thickness is 0.02mm-0.1mm, and the coating melting point is about 183℃. The tensile strength of the solder strip 100A is ≥150N / mm 2, elongation at break ≥ 20%, yield strength ≤ 65MPa.

[0094] right Figure 1A The solder strip 100A shown is formed to obtain a plurality of Figure 1B The structural welding strip 200 shown in FIG. The forming process is performed by mechanical stamping, chemical etching or laser cutting. Figure 1A and Figure 1B As shown, when mechanical stamping is used for forming, the welding strip 100A is formed to obtain multiple structural welding strips 200, including: mechanically stamping the welding strip 100A along the length direction of the welding strip 100A to form multiple structural welding strips 100B connected together; and separating the multiple structural welding strips 100B connected together by cutting.

[0095] like Figure 1C As shown, a flexible insulating substrate 300 is provided. The flexible insulating substrate 300 generally has a strip-like structure, such as a rectangular structure, or may have an overall strip-like structure but an irregular profile, such as a wavy flexible insulating substrate. Given the flexibility of the flexible insulating substrate 300, a mechanism such as an unwinding roller or a conveyor roller can be used to unwind the flexible insulating substrate 300, thereby achieving feeding of the flexible insulating substrate 300.

[0096] like Figure 1C As shown, multiple structural welding ribbons 200 are laminated on a flexible insulating substrate 300 at intervals to obtain an interconnection component. The lamination method can be bonding or hot pressing, so that the structural welding ribbons 200 and the flexible insulating substrate 300 form an integrated interconnection component.

[0097] When the composite method is a bonding method, when each structural welding strip is bonded to the flexible insulating substrate, the adhesive can be a synthetic polymer adhesive, including but not limited to one or more of polyvinyl acetate, polyvinyl acetal, acrylate, polystyrene, epoxy resin, acrylic resin, polyurethane resin, unsaturated polyester, butyl rubber, nitrile rubber, phenolic-polyvinyl acetal, and epoxy-polyamide.

[0098] When hot pressing is used for lamination, the temperature of the hot pressing process only needs to ensure that it does not damage the flexible insulating material. For example, the hot pressing temperature of this hot pressing method is 50°C to 120°C, and the hot pressing time is 5 seconds to 30 seconds. For example, the hot pressing temperature is 50°C and the hot pressing time is 30 seconds. Another example is the hot pressing temperature is 120°C and the hot pressing time is 5 seconds. Another example is the hot pressing temperature is 75°C and the hot pressing time is 18 seconds.

[0099] Figure 2A and Figure 2B Two structural schematic diagrams of the structural welding strip in the embodiment of the present invention are illustrated. Figure 2Aand Figure 2B As shown in the figure, each structural solder strip 200 has a connecting portion 210 and two soldering portions (hereinafter referred to as a first soldering portion 221 and a second soldering portion 222). The connecting portion 210 is located between and connected with the first soldering portion 221 and the second soldering portion 222. The connecting portion 210 is at least partially located on the flexible insulating substrate 300, and the first soldering portion 221 and the second soldering portion 222 extend out of the flexible insulating substrate 300. For example, the flexible insulating substrate 300 can have a strip structure, so that a plurality of structural solder strips 200 are distributed along the strip extension direction of the flexible insulating substrate 300. The first soldering portion 221 and the second soldering portion 222 can each be a solid plane, which can extend out of the flexible insulating substrate 300 in opposite directions.

[0100] In an example, when each structural solder strip is formed on the flexible insulating substrate by hot pressing, the thickness of the flexible insulating substrate is as thin as possible, for example, the thickness of the flexible insulating substrate is less than 0.02 mm, which can reduce Figure 2A and Figure 2B The bending degree of the first soldering portion 221 and the second soldering portion 222 shown in the figure is such that the first soldering portion 221 and the second soldering portion 222 are as horizontally soldered as possible, thereby improving the soldering reliability. In addition, the thickness of the structural solder strip can be less than or equal to 1 / 3 of the thickness of the flexible insulating substrate, so as to avoid the problem that the hot pressing pressure is too large to cut off the flexible insulating substrate during hot pressing. Based on this, Figure 1A The thickness of the solder strip shown in the figure can be 0.12 mm, and the width is preferably 5 mm.

[0101] When the interconnection provided by the manufacturing method of the interconnection provided by the embodiment of the present application is applied to the current conduction of the back contact battery piece, the number of structural solder strips possessed by the interconnection is related to the number of same polarity pads on the battery piece related to the conducted current. For example, if the number of same polarity pads of the battery piece is 9, then the number of structural solder strips 200 provided on the flexible insulating substrate 300 can be 9, of course, it can be less than 9, or more than 9, to meet the needs of different circuit designs.

[0102] In practical applications, when the interconnect connects battery cells, each structural welding ribbon included in the interconnect has one welding portion welded to the positive electrode pad of the battery cell, and another welding portion welded to the negative electrode pad or busbar of another battery cell. The welding method can be electromagnetic or infrared welding, but is not limited to these. Furthermore, if thermal stress is generated at the weld during welding, lamination, or subsequent use, the thermal stress can be transferred to the flexible insulating substrate through the connecting portion. The flexible insulating substrate's flexibility relieves the thermal stress, thereby reducing the degree of bending deformation of the back-contact battery and improving welding stability and long-term stability. For example, when the pad and interconnect are welded by electromagnetic welding, the welding temperature is 180°C-380°C, and the welding time is 1000ms-4000ms. For example, the welding temperature is 180°C and the hot pressing time is 4000ms. Another example is the hot pressing temperature is 380°C and the hot pressing time is 1000ms. Another example is the hot pressing temperature is 250°C and the hot pressing time is 2500ms.

[0103] From the perspective of suppressing cell deformation, compared to traditional interconnecting solder ribbons, multiple structural solder ribbons are spaced apart and laminated onto a flexible insulating substrate. This reduces the amount of solder ribbon material used, not only lowering manufacturing costs but also reducing the contact area between the structural solder ribbons contained in the interconnect and the back of the cell, reducing the impact of thermal stress during interconnection and improving the reliability of the solar cell module. More importantly, when multiple structural solder ribbons can be spaced apart on a flexible insulating substrate, the resulting interconnect has excellent flexibility. Therefore, the structural solder ribbons can release thermal stress generated by high and low temperature differences (for example, during the welding process, lamination process, and outdoor environmental changes) through the flexible insulating substrate, thereby reducing the degree of bending deformation of the back-contact cell and improving welding stability and long-term stability. Furthermore, when the interconnecting component manufactured by the manufacturing method provided by the embodiments of the present invention is used to interconnect back-contact cells, the flexible insulating substrate included in the interconnecting component can provide electrical isolation between the areas of two adjacent back-contact cells other than the solder pads, thereby reducing the possibility of leakage and improving cell efficiency. In other words, the flexible insulating substrate can prevent the structural solder ribbons from forming shunt paths with areas of the cell that do not need to be interconnected, thereby improving cell conversion efficiency.

[0104] In one example, Figure 2A and Figure 2B As shown, the width of the first welding portion 221 and the width of the second welding portion 222 can be smaller than the maximum width of the connecting portion 210. The width direction of the connecting portion is the same as the width direction of the two welding portions. Figure 2A and Figure 2BFor example, when the first welding portion 221, the second welding portion 222 and the connecting portion 210 are all rectangular structures, the size of the first welding portion 221 and the second welding portion 222 can be 6mm*1mm, and the size of the connecting portion 210 can be 6mm*3mm. At this time, the width of the first welding portion 221 and the second welding portion 222 is 1mm, and the width of the connecting portion 210 is 3mm.

[0105] As shown in Figure 2A and Figure 2B , the first welding portion 221 and the second welding portion 222 and the connecting portion 210 can all adopt a right-angle transition mode or an arc transition mode. When the arc transition mode is adopted, stress concentration is not easy to occur at the arc transition, thereby further reducing the stress of the structural solder strip 200 due to temperature changes (welding temperature changes or external environmental temperature changes).

[0106] In an example, as shown in Figure 2A and Figure 2B , the connecting portion 210 of each structural solder strip 200 has a hollow structure LK for releasing stress. In addition to the hollow structure, the other areas of the connecting portion 210 are solid structures. At this time, the stress generated due to the welding process, the laminating process and the difference between high and low temperatures outdoors can be released by using the hollow structure LK, thereby reducing the degree of bending deformation of the back contact battery and improving the welding stability and long-term reliability.

[0107] As shown in Figure 2A and Figure 2B , the hollow structure LK can include at least one through hole. The pattern of each through hole is a closed pattern. At this time, the closed pattern here refers to the closed outline pattern of the hollow structure. In this case, the edge outline of the connecting portion 210 is complete, which can ensure that the structural solder strip 200 has good strength. The pattern of each through hole is a polygonal pattern, a circular pattern, an elliptical pattern or a special-shaped pattern. The polygonal pattern can be a triangle, a rectangle, a square, etc. For example, the shape of the through hole is a rectangle, and the length can be 1mm-10mm.

[0108] Figures 3A to 5A Three distribution schematic diagrams of the plurality of rows of through holes distributed along the first direction in the embodiment of the present application are shown. Figures 3B to 5B Three distribution schematic diagrams of the plurality of rows of through holes distributed along the second direction in the embodiment of the present application are shown. As shown in Figures 3A to 5A and Figures 3B to 5B , when Figure 2A and Figure 2BThe hollow structure LK shown includes m rows of through holes, where m is an integer greater than or equal to 1. Each row of through holes includes at least one through hole T. The first row of through holes and the mth row of through holes are formed in the connecting portion 210 along any direction parallel to the connecting portion 210. For example, when m is an integer greater than or equal to 2, the first row of through holes to the mth row of through holes are distributed along the first welding portion 221 and the second welding portion 222 (e.g., Figures 3A to 5A For another example, when m is an integer greater than or equal to 2, the through holes in the first row to the mth row are arranged along a distribution direction perpendicular to the first welding portion 221 and the second welding portion 222 (e.g. Figures 3B to 5B The second direction B) is shown.

[0109] When the first row of through holes to the mth row of through holes are arranged along the Figures 3A to 5A When distributed in the first direction A shown, the through hole T is a slit-type through hole or a rectangular through hole. The distribution of the through holes in two adjacent rows can be appropriately adjusted to ensure that there is a shorter circuit path between the first welding portion 221 and the second welding portion 222 while ensuring appropriate strength and stress relief capabilities.

[0110] When the first row of through holes to the mth row of through holes are arranged along the Figures 3B to 5B When distributed in the second direction B shown, the through hole T is a slit-type through hole or a rectangular through hole. If the length direction of the through hole T is distributed perpendicular to the distribution direction of the first welding portion 221 and the second welding portion 222, then the spacing between the two rows of through holes can be adjusted so that the current of the first welding portion 221 and the second welding portion 222 is transmitted to the other welding portion through the connecting portion 210 in a straight line as much as possible, thereby reducing current loss.

[0111] For example, two adjacent rows of through holes are staggered. In this case, the m rows of through holes in the connection portion can release the stress generated by the structural welding strip more evenly, thereby further reducing the degree of deformation of the back contact battery. Of course, the distribution of each row of through holes can also be adjusted to balance the structural strength and stress release capacity of the connection portion. For example, Figure 3A and Figure 3B As shown, the connecting portion 210 of the structural welding strip 200 has two staggered slit-type through holes, which can be arranged along Figure 3A The first direction A shown can also be distributed along Figure 3B The second direction B is shown.

[0112] like Figure 3A As shown, when two rows of through holes are Figure 3A When distributed in the first direction A shown in FIG, the ends of the first row of through holes and the ends of the second row of through holes are staggered, so that the current conducted by the first welding portion 221 and the second welding portion 222 can flow along the connecting portion 210. Figure 3AConductivity occurs in the direction of the dotted line shown.

[0113] like Figure 3B As shown, when two rows of through holes are Figure 3B When the through holes are distributed in the second direction B shown in FIG. 1 , each row of through holes is a slit-type through hole. The length direction of the slit-type through holes is the same as the first direction A. At this time, the distance between two adjacent rows of slit-type through holes can be adjusted so that the first welding portion 221 and the second welding portion 222 are aligned with each other. Figure 3B The current is conducted in the direction of the dashed line shown.

[0114] For example, Figure 4A and Figure 4B As shown, when m is an integer greater than or equal to 3. The number of through holes T included in the first row of through holes and the mth row of through holes is greater than or equal to 2. At this time, along the distribution direction from the first row of through holes to the mth row of through holes, the number of through holes T included in each row of through holes first decreases and then increases. At this time, along the distribution direction from the first row of through holes to the mth row of through holes, the structural strength of the connecting portion 210 first increases and then decreases, and the stress of the connecting portion 210 first gradually decreases and then gradually increases. Based on this, the distribution mode of the through holes T in the connecting portion 210 can be used to adjust the strength and stress release capacity of each area of ​​the connecting portion 210, so that the strength and stress release capacity of the connecting portion 210 are coordinated.

[0115] like Figure 4A and Figure 4B As shown, when the first row of through holes and the mth row of through holes are formed in the connecting portion 210 along the distribution direction of the two welding portions, along the distribution direction from the first row of through holes to the mth row of through holes, if the number of through holes T included in each row of through holes first decreases and then increases, and the distances between the first and tail ends of each row of through holes and the edge of the connecting portion 210 first decrease and then increase, then the current path of the current conducted between the first welding portion 221 and the second welding portion 222 in the connecting portion 210 is as short as possible.

[0116] For example, Figure 4A and 4BAs shown, the connection portion 210 of the structural welding strip 200 has three rows of slit-type through holes. The first and third rows of through holes each include two slit-type through holes, and the second row of through holes includes one slit-type through hole. Furthermore, the length of one slit-type through hole in the second row of through holes is longer than the length of the slit-type through hole in the first row of through holes, but does not exceed the ends of the first and third rows of through holes. In this case, the first and third rows of through holes contain a relatively large number of slit-type through holes at the ends, while the second row of through holes contains a relatively small number of slit-type through holes. This can result in a relatively high strain relief capability at the ends of the connection portion 210, but relatively weak strength, while the middle portion has poor strain relief capability but relatively high strength. Therefore, the distribution of m rows of through holes can balance the strain relief capability and strength of each region of the connection portion 210, allowing the structural welding strip 200 to have a high strain relief capability while ensuring strength.

[0117] like Figure 4A As shown, when the three rows of through holes are Figure 4A When the through holes are distributed in the first direction A shown in FIG. 1 , the end of the second row of through holes does not exceed the end of the first row of through holes and the third row of through holes, so that the current conducted by the first welding portion 221 and the second welding portion 222 in the current path of the connecting portion 210 is as follows: Figure 4A The dotted lines shown are conducting.

[0118] like Figure 4B As shown, when the three rows of through holes are Figure 4B When the through holes are distributed in the second direction B as shown, each row of through holes is a slit-type through hole, and the length of the slit-type through holes is distributed along the first direction. At this time, the distance between two adjacent rows of slit-type through holes can be adjusted so that the current path of the current conducted by the first welding portion 221 and the second welding portion 222 in the connecting portion 210 is arranged in accordance with Figure 4B The dotted lines shown are conducting.

[0119] For example, Figure 5A and Figure 5B As shown, when m is an integer greater than or equal to 3, the number of through holes included in the first row of through holes and the mth row of through holes is greater than or equal to 1. Along the distribution direction from the first row of through holes to the mth row of through holes, the number of through holes included in each row of through holes first increases and then decreases.

[0120] like Figure 5A and Figure 5BAs shown, along the distribution direction of through-holes from the first row to the mth row, if the length of each row of through-holes first increases and then decreases, then along the distribution direction of through-holes from the first row to the mth row, the structural strength of the connection portion 210 first decreases and then increases, and the stress in the connection portion 210 first gradually increases and then gradually decreases. Based on this, the distribution of through-holes in the connection portion 210 can be used to adjust the strength and stress release capacity of each area of ​​the connection portion 210, so that the strength and stress release capacity of the connection portion 210 are coordinated.

[0121] For example, Figure 5A and Figure 5B As shown, the connection portion 210 of the structural welding strip 200 has three rows of slit-type through holes. The first and third rows of through holes each include one slit-type through hole, and the second row of through holes includes two slit-type through holes. Furthermore, the length of the slit-type through hole in the first row of through holes is longer than the length of the slit-type through hole in the second row of through holes, but the ends of the first row of through holes and the third row of through holes do not exceed the ends of the second row of through holes. In this case, the number of slit-type through holes in the first and third rows of through holes is relatively small, while the number of slit-type through holes in the second row of through holes is relatively large. This can result in higher strength at both ends of the connection portion 210, but lower stress relief capability, while the middle portion has higher strain relief capability but lower strength. Therefore, the distribution of m rows of through holes T can balance the strain relief capability and strength of each region of the connection portion 210, allowing the structural welding strip 200 to have higher strain relief capability while ensuring strength.

[0122] like Figure 5A As shown, when the three rows of through holes are Figure 5A When the through holes are distributed in the first direction A shown in FIG. 1 , the ends of the first row of through holes and the third row of through holes do not exceed the second row of through holes, so that the current conducted by the first welding portion 221 and the second welding portion 222 can flow along the connecting portion 210. Figure 5A Flow is shown in the dashed direction.

[0123] like Figure 5B As shown, when the three rows of through holes are Figure 5B When the through holes are distributed in the second direction as shown, each row of through holes is a slit-type through hole, and the length of the slit-type through holes is distributed along the first direction. At this time, the distance between two adjacent rows of slit-type through holes can be adjusted so that the current conducted by the first welding portion 221 and the second welding portion 222 can be distributed along the connecting portion 210. Figure 5B Flow is shown in the dashed direction.

[0124] From the perspective of electrical isolation, when the interconnect is welded to the corresponding polarity pads, the flexible insulating substrate 300 can secure the multiple structural welding ribbons 200 during the welding process, preventing the relative position of the structural welding ribbons 200 and the pads from shifting during welding, thereby improving welding accuracy and avoiding electrical short circuits caused by misalignment between the structural welding ribbons 200 and the pads. In addition, when the interconnect is located in the gap between two adjacent battery cells or on one side of a battery cell, the flexible insulating substrate 300 can be partially or completely located on one side of the gap or battery cell. If the flexible insulating substrate 300 is partially located on one side of the gap or battery cell, the area of ​​the flexible insulating substrate 300 not located on the side of the gap or battery cell can be attached to the edge of the battery cell.

[0125] Figure 6 The back side structure diagram of the battery cell to which the interconnection member manufactured according to the embodiment of the present invention is applicable is shown as an example. Figure 6 As shown, the back of the battery cell 400 has 9 positive electrode pads 410 and 9 negative electrode pads 420. Figures 1A to 1C 、 Figure 2A and Figure 2B As shown, the interconnect manufactured by the embodiment of the present invention includes a flexible insulating substrate 300 on which 9 structural welding strips 200 are spaced apart. Among them, 9 positive electrode pads 410 are distributed on the first side edge C1 of the battery cell 400, and 9 negative electrode pads 420 are distributed on the second side edge C2 of the battery cell 400. And the first side edge C1 and the second side edge C2 are in two opposite directions. For example: when the battery cell 400 is rectangular, the first side edge C1 is close to one long side of the rectangular battery cell, and the second side edge C2 is close to the other long side of the rectangular battery cell. For the convenience of the following description, the two welding parts of the structural welding strip 200 are respectively defined as the first welding part 221 and the second welding part 222.

[0126] Figures 7A to 7C The interconnection device manufactured by the embodiment of the present invention is illustrated Figure 6 Schematic diagram of three application scenarios of battery cells shown.

[0127] like Figure 7A As shown, both the first side edge C1 and the second side edge C2 of the battery cell 400 have interconnects, namely a first interconnect JD1 near the first side edge C1 and a second interconnect JD2 near the second side edge C2. The first welding portion 221 of each structural welding ribbon 200 included in the first interconnect JD1 is welded to each positive electrode pad 410 of the battery cell 400 in a one-to-one correspondence, and the second welding portion 222 of each structural welding ribbon 200 included in the second interconnect JD2 is welded to each negative electrode pad 420 in a one-to-one correspondence.

[0128] In one example, Figure 7BAs shown, for the adjacent first battery cell 400A and the second battery cell 400B, the nine negative electrode pads 420 of the first battery cell 400A and the nine positive electrode pads 410 of the second battery cell 400B are close to the same gap. There is an interconnect JD in the gap. Figures 1A to 1C 、 Figure 2A and Figure 2B As shown, the first welding portion 221 of each structural welding ribbon 200 included in the interconnection member JD is welded to each negative electrode pad 420 of the first battery cell 400A, and the second welding portion 222 of each structural welding ribbon 200 included in the interconnection member is welded to each positive electrode pad 410 of the second battery cell 400B. In this case, the first battery cell 400A and the second battery cell 400B can be interconnected using a single interconnection member.

[0129] In another example, Figure 7C As shown, for the adjacent first cell 400A and second cell 400B, the nine negative electrode pads 420 of the first cell 400A and the nine positive electrode pads 410 of the second cell 400B are close to the same gap. The gap contains the first interconnect JD1, the second interconnect JD2 and the bus bar 500. Figures 1A to 1C 、 Figure 2A and Figure 2B As shown, the first welding portion 221 of each structural welding ribbon 200 included in the first interconnect member JD1 is welded to each negative electrode pad 420 of the first battery cell 400A, and the second welding portion 222 of each structural welding ribbon 200 included in the first interconnect member JD1 is welded to the bus bar 500. The first welding portion 221 of each structural welding ribbon 200 included in the second interconnect member JD2 is welded to the bus bar 500. The second welding portion 222 of each structural welding ribbon 200 included in the second interconnect member JD2 is welded to each negative electrode pad 420 of the first battery cell 400A. The second welding portion 222 of each structural welding ribbon 200 included in the first interconnect member JD1 and the first welding portion 221 of each structural welding ribbon 200 included in the second interconnect member JD2 are welded to the bus bar 500 at the same position as much as possible to reduce the possibility of lateral current conduction (along the strip extension direction of the flexible insulating substrate 300).

[0130] In practical applications, such as Figure 7CAs shown, the bus bar 500 can be welded to the second welding portion 222 of each structural welding ribbon 200 included in the first interconnect JD1, and then the first welding portion 221 of each structural welding ribbon 200 included in the first interconnect JD1 can be welded to the negative electrode pad 420 of the first battery cell 400A. Alternatively, the first welding portion 221 of each structural welding ribbon 200 included in the first interconnect JD1 can be welded to the positive electrode pad 410 of the first battery cell 400A first, and then the bus bar 500 can be welded to the second welding portion 222 of each structural welding ribbon 200 included in the first interconnect JD1.

[0131] Depend on Figures 7A to 7C As shown, in the interconnection part manufactured by the manufacturing method of the interconnection part provided by the embodiment of the present invention, one of the first welding part 221 and the second welding part 222 can be used as a current input terminal, and the other welding part can be used as a current output terminal. In order to shorten the current conduction path as much as possible, the central axes of the two welding parts of each structural welding strip 200 included in the interconnection part manufactured by the embodiment of the present invention are collinear. In this case, the current flowing from one welding part to another welding part can be conducted as close to a straight line as possible. In the case where the first welding part 221 and the second welding part 222 are defined as rectangles here, the axis of the first welding part 221 and the second welding part 222 along their length direction is the central axis. In this case, the current flowing from the first welding part 221 to the second welding part 222 can be conducted as close to a straight line as possible.

[0132] Figure 8 A schematic structural diagram of a flexible insulating substrate provided by an embodiment of the present invention is illustrated. As shown in FIG5 , the flexible insulating substrate 300 has a conductive layer 320 therein. Figure 2A and Figure 2B The connection portions 210 of the various structural welding strips 200 shown are electrically connected via the conductive layer 320. It should be understood that Figure 8 The conductive layer 320 in the embodiment is partially exposed, but in actual situations, Figure 8 The exposed conductive layer 320 is generally embedded in the flexible insulating substrate 300 to reduce unnecessary contamination and loss.

[0133] like Figure 8As shown, the conductive layer 320 can be a conductive strip or a conductive particle layer composed of contacting metal particles. The conductive strip can be one or more of copper strips, silver strips, and aluminum strips, and the conductive particle layer can include one or more of contacting copper particles, silver particles, and aluminum particles. In practical applications, a conductive particle slurry can be formed on one side of the flexible insulating layer, and the solvent contained therein can be removed (e.g., by low-temperature drying) without damaging the flexible insulating substrate 300, to form the conductive particle layer. The surface of the flexible insulating layer with the conductive particle layer formed is then covered with another flexible insulating substrate 300, thereby forming a conductive particle layer within the flexible insulating substrate 300.

[0134] Based on the above structure, the conductive layer electrically connects the connection portions of the various structural welding ribbons, allowing the conductive layer to function as a transverse conductive path. If a poor weld occurs between the first welding portion of one of the multiple structural welding ribbons and the positive electrode pad, the structural welding ribbon will partially fail as a vertical conductive path. However, the structural welding ribbon can still use the conductive layer to conduct current to other structural welding ribbons that have been properly welded, thus avoiding the problem of reduced battery efficiency caused by a partial failure of the vertical conductive path and thus improving the connection reliability of the interconnect.

[0135] Figure 9A An example schematic diagram of the interconnection structure in an embodiment of the present invention is illustrated. Figure 9B FIG. 1 is a schematic diagram of another example of an interconnection structure in an embodiment of the present invention. Figure 9A and Figure 9B As shown, the connection portion 210 of each structural welding ribbon 200 is exposed away from the surface of the flexible insulating substrate 300. At this time, multiple structural welding ribbons 200 can be placed on the surface of the flexible insulating substrate 300 and pressed onto the flexible insulating substrate 300 under pressure.

[0136] like Figure 9A and Figure 9B As shown, when the flexible insulating substrate 300 includes a conductive layer 320, the flexible insulating substrate 300 includes two flexible insulating layers 310 and a conductive layer 320 located between the two flexible insulating layers 310. When a plurality of structural welding ribbons 200 are pressed onto one side of the flexible insulating substrate 300 using a hot pressing process, the pressure can be controlled so that the bottom of the connecting portion 210 of the structural welding ribbon 200 contacts the conductive layer 320.

[0137] Figure 10A A schematic diagram of the interconnection structure of another example in an embodiment of the present invention is illustrated. Figure 10B Example Figure 10A A cross-sectional view of the interconnection shown in the AA direction. Figure 10A and Figure 10BAs shown, when the connection portion 210 of each structural welding ribbon 200 is embedded in the flexible insulating substrate 300. The connection portion 210 of each structural welding ribbon 200 is at least partially wrapped in the flexible insulating substrate 300. The first welding portion 221 and the second welding portion 222 extend from two opposite directions of the flexible insulating substrate 300. At this time, Figure 10A The interconnection member shown is a sandwich structure, and the flexible insulating substrate 300 can be used to further fix the structural welding ribbon 200. This not only further reduces or eliminates the possible displacement of the structural welding ribbon 200 during the welding process, but also eliminates the possibility of failure of the connection between the structural welding ribbon 200 and the flexible insulating substrate 300 when a welding portion of the structural welding ribbon 200 is warped under force, thereby ensuring the stability of the connection between the structural welding ribbon 200 and the flexible insulating substrate 300.

[0138] Figure 10C Example Figure 10A Another cross-sectional view of the interconnection member in the AA direction is shown. Figure 10C As shown, the flexible insulating substrate includes two flexible insulating layers 310 and a conductive layer 320 located between the two flexible insulating layers 310, so that the conductive layer 320 is embedded in the flexible insulating substrate. When a plurality of structural welding strips are pressed between the two flexible insulating layers 320 by a hot pressing process, after the conductive layer 320 is formed on one flexible insulating layer, a conductive layer 320 is formed on the surface of the conductive layer 320 formed on the flexible insulating layer. Figure 2A or Figure 2B The structural welding ribbon 200 is shown. On this basis, another flexible insulating layer is laminated onto the surface of the conductive layer 320 formed on the flexible insulating layer 320. At this point, at least a portion of the connecting portion 210 of each structural welding ribbon is wrapped between the two flexible insulating layers 320, ensuring that the connecting portion 210 of each structural welding ribbon 200 is in direct contact with the conductive layer 320.

[0139] From the perspective of solar cell module appearance and battery packaging operation, Figures 7A to 7C As shown, when the interconnect is located in the gap between two adjacent cells 400 or on one side of a cell 400, the flexible insulating substrate 300 can block the gap at the edge of the cell 400, reducing the possibility of particulate matter generated during the welding process migrating through the edge of the cell 400 to the front of the cell 400, thereby reducing particulate matter contamination of the front of the cell 400 during the welding process, subsequent processes, or use. In addition, the flexible insulating substrate 300 can also serve as a spacing mark for the back contact cell, achieving assembly symmetry and aesthetics of the solar cell module.

[0140] In one example, the material of the flexible insulating substrate included in the above interconnection element can be an insulating polymer material, and the insulating polymer material includes a polymer material such as polyvinyl butyral (PVB), polyolefin (POE) or ethylene-vinyl acetate copolymer (EVA). Figure 7B and Figure 7C As shown, when there is a gap between the first battery cell 400A and the second battery cell 400B, and as long as the gap contains an interconnection component, if the selected flexible insulating substrate 300 is thermoplastic, during the lamination process, the flexible insulating substrate 300 can be stretched to a certain extent under the lamination thermal field environment, so that the flexible insulating substrate 300 can be filled between the first battery cell 400A and the second battery cell 400B, thereby completely covering the gap between the first battery cell 400A and the second battery cell 400B, but will not extend to the back area of ​​the battery cell, affecting the power generation of the battery cell.

[0141] In one example, the flexible insulating substrate included in the interconnect may be a light-shielding flexible insulating substrate or a transparent flexible insulating substrate. Whether the flexible insulating substrate is light-shielding or colored can be achieved by adding a light-shielding material or pigment to the insulating polymer material.

[0142] If the flexible insulating substrate contained in the interconnect is a light-shielding flexible insulating substrate, since the flexible insulating substrate is partially or completely located in the gap between two adjacent back-contact cells, the flexible insulating substrate can be used as a visual shielding structure, so that when the solar cell module is observed from the front, the structural welding strip on the back of the solar cell module cannot be seen, thereby improving the aesthetics of the solar cell module.

[0143] When the flexible insulating substrate is a light-shielding flexible insulating substrate, especially a transparent flexible insulating substrate, in order to improve the visual effect, on the one hand, the aforementioned visual blocking layer can be attached to the surface of the flexible insulating substrate that needs to face the front of the battery cell to block the structural welding strip; on the other hand, the flexible insulating substrate can be improved.

[0144] The surface of the flexible insulating substrate is partially or entirely provided with a shielding coating. The shielding coating can be located on one side or on both sides of the flexible insulating substrate, so that the flexible insulating substrate has a good light-shielding effect, thereby achieving the purpose of shielding the interconnection and ensuring the good appearance of the solar cell module. For example, the material of the shielding coating can be a light-shielding material, and its color can be close to or the same as the color of the backplane of the solar cell module. For example, when a white backplane is used, the color of the shielding coating used is white, and when a black backplane is used, the color of the shielding coating used is black.

[0145] exist Figures 7A to 7CIn the application scenario shown, when sunlight is incident on the interconnection, the shielding coating formed by the flexible insulating substrate included in the interconnection can scatter the sunlight to the surrounding cell pieces, thereby improving the light utilization rate of the cell pieces. In addition, the material used in the bonding layer used in the solar cell module is a polymeric material that is prone to aging and discoloration. For example, EVA is prone to turning brown when in long-term contact with Cu material or other materials. The shielding coating can effectively reduce the influence of discoloration of the bonding layer close to the back plate on the appearance of the solar cell module.

[0146] For example, the flexible insulating substrate has a release layer. Figures 7A to 7C In the application scenario shown, the release layer can reduce the pollution of the surface of the tape by the environment or operation table during the processing of the solar cell module. The color of the release layer can refer to the color of the shielding coating described above, and the effect can also refer to the related description of the shielding coating described above. Meanwhile, the flexible insulating substrate can also form a release layer in the area between the adjacent two structure solder strips on the surface of the flexible insulating substrate facing the back surface of the cell piece (i.e., the surface on which the plurality of structure solder strips are formed), so as to prevent particulate pollution (from module processing or subsequent use).

[0147] In actual application, as shown in Figure 7B and Figure 7C , the adhesive side of the single-sided tape can be attached to the edges of the first cell piece 400A and the second cell piece 400B close to the same gap, so that the adhesive side of the single-sided tape faces the front surface of the cell piece, and then the structure solder strip is welded to the corresponding polarity pad. At this time, the single-sided tape as the flexible insulating substrate plays a positioning role before welding, so that the position of the structure solder strip is not prone to deviation when the structure solder strip is welded. Of course, for the double-sided tape, as long as any one side is attached to the edges of the first cell piece 400A and the second cell piece 400B close to the same gap. Details are not described herein.

[0148] Figure 11 An example of the structure of the manufacturing equipment of the interconnection provided by the embodiment of the present application is shown. As shown in Figure 11 , the manufacturing equipment of the interconnection provided by the embodiment of the present application comprises a solder strip unwinding device WF, a stamping forming device 610, a material compounding device 620, and a winding device HS.

[0149] As shown in Figure 11 , the stamping forming device 610 is used for forming processing on the solder strip 100A shown in Figure 1A , to obtain a plurality of structure solder strips 200 shown in Figure 1B . The material compounding device 620 is used for spacing and compounding the plurality of structure solder strips 200 shown in Figure 1B in the structure solder strip 200. Figure 1CThe interconnection part is obtained on the flexible insulating substrate 300 shown in FIG. It should be understood that whether it is a soldering tape or Figure 1C The specific structure of the flexible insulating substrate 300 shown in FIG can be referred to the related description of the manufacturing equipment of the interconnection component above, and will not be repeated here.

[0150] Specifically, in order to realize the automatic feeding of welding strips, such as Figure 11 As shown, the above-mentioned solder ribbon unwinding device WF is used to provide the solder ribbon 100A to the stamping and forming device 610, so that the solder ribbon unwinding device WF can provide the solder ribbon to the stamping and forming device 610, realize the automatic feeding of the stamping and forming device 610, and enable the stamping and forming device WF to continuously stamp the solder ribbon. For example: the solder ribbon unwinding device WF includes a first unwinding roller WF1 and a conveying roller WF2. The conveying roller WF2 is located between the first unwinding roller WF1 and the stamping and forming device 610. At this time, since the conveying roller WF2 is located between the first unwinding roller WF1 and the stamping and forming device 610, the conveying roller WF2 can continuously convey the solder ribbon 100A released by the first unwinding roller WF1, making mass production of interconnected parts possible.

[0151] In order to stamp the solder strip into Figure 2A or Figure 2B The structural welding strip 200 shown (may not include the hollow structure LK), Figure 11 The stamping and forming device 610 shown includes a forming die, which includes an upper die 611A and a lower die 611B. Figure 12A and Figure 12B The following is a schematic structural diagram of a stamping die in an embodiment of the present invention. Figure 13A and Figure 13B FIG. 1 is a schematic diagram of the structure of another stamping die in an embodiment of the present invention. Figure 12A and Figure 12B As well as Figure 13 and Figure 13B As shown, the upper punch 611A and the lower punch 611B each have a Figure 2A and Figure 2B The first forming part CX1 of the connecting part 210 and two second forming parts CX2 for forming the welding part are shown. The first forming part CX1 is located between the two second forming parts CX2, and the first forming part CX1 is connected to the second forming part CX2 respectively. Based on the structure of the upper punch 611A and the lower punch 611B, when the structural welding strip 200 is stamped and formed by the stamping forming device 610, each structural welding strip 200 obtained has a corresponding first forming part CX1. Figure 2A and Figure 2B shown Figure 2A and Figure 2B The connecting portion 210 shown, and the two second forming portions CX2 corresponding to Figure 2A and Figure 2BThe two welds shown, Figure 2A and Figure 2B shown Figure 2A and Figure 2B The connecting portion 210 shown is located between two welding portions. Figure 2A and Figure 2B The connecting portion 210 shown is connected to the two welding portions respectively. Figure 1C As shown, each structural welding ribbon 200 included in the interconnection element has Figure 2A and Figure 2B The connecting portion 210 shown is at least partially located Figure 1C On the flexible insulating substrate 300 shown in FIG, two welding portions extend out Figure 1C The flexible insulating substrate 300 is shown in FIG.

[0152] It is understandable that if Figure 12A and Figure 12B As well as Figure 13 and Figure 13B As shown, the structures of the upper punch 611A and the lower punch 611B complement each other, so that Figure 1A When the solder strip 100A shown in the figure is formed, the upper punch 611A and the lower punch 611B can Figure 1A The solder strip 100A shown is punched into a structural solder strip 200. For example, when the first forming portion CX1 and the second forming portion CX2 of the upper punch 611A are convex structures or hollow structures, the first forming portion CX1 and the second forming portion CX2 of the lower punch 611B are concave structures. The convex structure (or hollow structure) and the concave structure work together. Figure 1A The soldering strip 100A shown in FIG. Figure 1A The welding strip 100A shown is formed into the structural welding strip 200. In order to simplify the description, the structural description of the upper punch 611A and the lower punch 611B, as long as the description of each forming part related to the specific structure of the structural welding strip 200 is related to the specific structure of the structural welding strip 200, will be described in the following by citing the previous text, and the implementation method and effect will not be repeated.

[0153] In one example, Figure 12A and Figure 12B As well as Figure 13 and Figure 13B As shown, the central axes of the two second forming parts CX2 are collinear. Figure 1A When the solder strip 100A shown is stamped, the Figure 2A and Figure 2B The central axes of the two welding portions of the structural welding strip 200 are collinear, and the effects thereof are described above.

[0154] In one example, Figure 12A and Figure 12B As well as Figure 13 and Figure 13B As shown, the width of each second forming portion CX2 is smaller than the width of the first forming portion CX1, and each second forming portion CX2 is connected to the first forming portion CX1 in an arc transition manner. Figure 1A When the solder strip 100A shown is stamped, the Figure 2A and Figure 2B The first welding portion 221 and the second welding portion 222 of the structural welding strip 200 shown are both Figure 2A and Figure 2B The connecting portion 210 shown is connected in an arc transition manner, and its effect can be referred to the corresponding description above.

[0155] like Figure 11 As shown, in order to achieve Figure 1C The flexible insulating substrate 300 is automatically fed as shown in FIG. , and the substrate unwinding device RF is used to provide the material composite device 620 with the flexible insulating substrate 300. Figure 1C The flexible insulating substrate 300 shown in FIG. At this time, the material composite device 620 can be used to continuously composite multiple structural welding strips at intervals. Figure 1C , and then obtain the interconnection part. Figure 1C When the flexible insulating substrate 300 shown in FIG has a transverse conductive path, Figure 1C The flexible insulating substrate 300 shown in FIG. 1 includes a conductive layer 320 embedded therein.

[0156] like Figure 11 As shown, the substrate unwinding device RF includes at least one second unwinding roller. When the number of the second unwinding roller is one, multiple Figure 2A and Figure 2B The structured welding strips 200 shown are spaced apart and provided by the second unwinding roller. Figure 1C On the flexible insulating substrate 300 shown in FIG, under the action of the material composite device 620, multiple Figure 2A and Figure 2B The structural welding strip 200 is shown facing Figure 1C One side of the flexible insulating substrate 300 shown in FIG. Figure 1C The flexible insulating substrate 300 shown in FIG is tightly combined together. At this time, Figure 2A and Figure 2B The structural welding ribbon 200 is shown away from Figure 1C The surface of the flexible insulating substrate 300 shown in FIG is exposed. Figure 8 The flexible insulating substrate 300 shown in FIG. 1 is embedded with a conductive layer 320, and the second unwinding roller provides Figure 8 The flexible insulating substrate 300 shown in FIG is embedded with a conductive layer 320, and a plurality of conductive layers are formed by a material composite device. Figure 2A and Figure 2BThe structure shown is a composite of welding strips 200 spaced apart. Figure 8 On the flexible insulating substrate 300 shown in FIG. And, under the composite action, the material composite device 620 can combine multiple Figure 2A and Figure 2B The structural welding ribbon 200 shown includes a connecting portion 210 that can be pressed into Figure 8 The flexible insulating substrate 300 shown in FIG. 1 is in contact with the conductive layer 320 so that multiple Figure 2A and Figure 2B The structure shown in FIG20 is connected to the conductive layer 320, forming a Figure 9A and Figure 9B The interconnects shown.

[0157] like Figure 11 As shown, when the number of the second unwinding rollers is two, multiple Figure 2A and Figure 2B The structural welding ribbon 200 is placed between the first insulating substrate and the second flexible insulating substrate so that the plurality of Figure 2A and Figure 2B The structural welding strip 200 shown has a connecting portion 210 that can be Figure 8 The flexible insulating substrate 300 shown (which can be considered as two flexible insulating layers 310) is wrapped. Figure 8 The conductive layer 320 is embedded in the flexible insulating substrate 300 shown, and the conductive layer 320 provided by the two second unwinding rollers together constitutes a new flexible insulating substrate. At this time, the conductive layer 320 can be formed between the flexible insulating substrates provided by one or two second unwinding rollers. And the material compounding device 620 is used to compound the two second unwinding rollers and the multiple Figure 2A and Figure 2B The structure of the welding strip 200 shown is multiple Figure 2A and Figure 2B The structured welding strips 200 shown can be distributed between two flexible insulating substrates at intervals and directly contact the conductive layer 320 to form a Figure 10C The interconnects shown.

[0158] If multiple Figure 2A and Figure 2B The structural welding strip 200 shown is bonded to the Figure 1C On the flexible insulating substrate 300 shown in FIG, the above Figure 1C The flexible insulating substrate 300 shown in FIG can be subjected to a dipping process, and the adhesive used in the dipping process can be a synthetic polymer adhesive. The polymer adhesive can be referred to above. Figure 11 As shown, the substrate unwinding device RF further includes: a dipping machine RJ. In practical applications, each second unwinding roller can be equipped with a set of dipping machines RJ, so that the substrate unwinding roller can provide Figure 1CThe flexible insulating substrate 300 shown in FIG can be dipped in glue by a dipping machine RJ and then compounded by a material compounding device.

[0159] like Figure 11 As shown, the material compounding device 620 may be a hot pressing compounding device, and the hot pressing temperature may be 50° C. to 120° C. The hot pressing compounding device may be a roller hot press or a plate hot press or other equipment with a pressing function.

[0160] like Figure 11 As shown, in order to realize automatic packaging, the winding device HS is used to wind the interconnection parts, thereby realizing Figure 2A and Figure 2B The structure of the welding strip 200 is continuously stamped. Figure 2A and Figure 2B The connection portion of each structural welding ribbon 200 shown can be at least partially located on the flexible insulating substrate 300, so that the obtained interconnection component has good flexibility. Therefore, the material composite device 620 can continuously composite multiple structural welding ribbons 200 on the flexible insulating substrate 300 at intervals, and the winding device HS can wind up the interconnection component to realize roll packaging of the interconnection component.

[0161] like Figure 11 As shown, in the manufacturing equipment of the interconnection part provided by the embodiment of the present invention, the welding ribbon unwinding device WF can be used to provide the welding ribbon to the stamping and forming device 610, so as to realize the automatic feeding of the stamping and forming device 610, so that the stamping and forming device 610 can continuously stamp the welding ribbon. Since the upper punch 611A and the lower punch 611B included in the forming mold both have a first forming part CX1 for forming the connecting part and two second forming parts CX2 for forming the welding part. Since the first forming part CX1 is located between the two second forming parts CX2, the first forming part CX1 is connected to the two second forming parts CX1 respectively. Therefore, the stamping and forming device 610 is used to Figure 1A When the solder strip 100A is stamped, multiple Figure 2A and Figure 2B The structural welding strip 200 shown. At this time, each Figure 2A and Figure 2B The structural welding strip 200 shown includes a connecting portion corresponding to the first shaped portion CX1 and two welding portions corresponding to the two second shaped portions CX2 , and the connecting portion is located between the two welding portions and connected to the two welding portions.

[0162] On this basis, if Figure 2A 、 Figure 2B and Figure 11As shown, the substrate unwinding device RF can provide a flexible insulating substrate to the material compounding device 620. Therefore, when the stamping and forming device 610 can continuously stamp the structural welding strips, the material compounding device 620 can realize the automatic feeding of the flexible insulating substrate, so that the material compounding device 620 can continuously compound multiple structural welding strips on the flexible insulating substrate at intervals, thereby obtaining an interconnection component. In addition, since the connection portion of each structural welding strip 200 can be at least partially located on the flexible insulating substrate, the obtained interconnection component has good flexibility. Therefore, when the material compounding device 620 can continuously compound multiple structural welding strips on the flexible insulating substrate at intervals, the winding device HS can wind up the interconnection component to realize the roll packaging of the interconnection component. It can be seen that the manufacturing equipment of the interconnection component provided by the embodiment of the present invention can realize the continuous batch production of the interconnection component, which is conducive to the mass production of the interconnection component.

[0163] like Figure 11 As shown, when multiple Figure 2A and Figure 2B The structural welding strips 200 shown are spaced apart Figure 1C The flexible insulating substrate 300 shown in FIG can reduce the amount of soldering material used, which not only reduces the manufacturing cost but also makes the interconnection part contain Figure 2A and Figure 2B The contact area between the welding ribbon 200 and the back of the cell is reduced, which reduces the influence of thermal stress during interconnection and improves the reliability of the solar cell module. Figure 2A and Figure 2B The structures of the structural welding strips 200 shown correspond to each other, so that the multiple structural welding strips 200 are formed at intervals. Figure 1C After the flexible insulating substrate 300 shown in FIG is formed, the obtained interconnection element has the beneficial effects of the interconnection element manufactured by the above-mentioned method for manufacturing the interconnection element, which will not be described in detail here.

[0164] In an optional manner, in order to further improve the stress release function of the interconnection manufactured by the interconnection manufacturing equipment, such as Figure 11 、 Figure 12A and Figure 13A ,as well as Figure 13A and Figure 13B As shown, the upper punch 611A and the lower punch 611B also have a third forming portion CX3 located inside the first forming portion CX1. The third forming portion CX3 is used to Figure 2A and Figure 2B The connecting portion 210 shown forms a hollow structure LK for relieving stress. When the welding strip 100A is punched by the punching forming device 610, the formed Figure 2A and Figure 2BThe connecting portion 210 of the structural welding strip 200 shown has a hollow structure, and its beneficial effects are described above.

[0165] In practical applications, such as Figure 11 、 Figure 12A and Figure 13A ,as well as Figure 13A and Figure 13B As shown, when the first molding portion CX1 and the second molding portion CX2 are convex structures, the third molding portion CX3 is a concave structure or a hollow structure. When the first molding portion CX1 and the second molding portion CX2 are concave structures or hollow structures, the third molding portion CX3 is a convex structure.

[0166] like Figure 12A and Figure 13A ,as well as Figure 13A and Figure 13B As shown, the third forming portion CX3 includes at least one hole forming portion. The pattern of each hole forming portion is a closed pattern. For example, the pattern of each hole forming portion is a polygonal pattern, a circular pattern forming portion, an elliptical pattern forming portion, or a special-shaped pattern forming portion. The effect here refers to the description of the pattern of the hollow structure above.

[0167] like Figure 11 As shown, when the stamping forming device 610 is used to Figure 1A When the solder strip 100A is stamped, the Figure 2A and Figure 2B The structural welding strip shown has a connection portion 210 with a hollow structure having at least one through hole. The formation of the through hole should correspond to the pattern of the hole forming portion. As for the beneficial effects of the hole forming portion, please refer to the relevant description of the through hole above, and will not be repeated here.

[0168] In one example, Figures 14A to 16A Schematic diagrams of three distributions of multi-row hole forming portions distributed along a first direction in an embodiment of the present invention; Figures 14B to 16B Schematic diagrams of three distributions of the multi-row hole forming parts distributed along the second direction in the embodiment of the present invention. Figures 14A to 16A and Figures 14B to 16B The distribution of the hole forming parts of the upper punch is shown in the examples, but the lower punch is not shown in the examples. However, the structure of the lower punch can be undoubtedly derived based on the distribution of the hole forming parts of the upper punch.

[0169] like Figures 14A to 16A and Figures 14B to 16B As shown, Figure 12A and Figure 13A as well as Figure 12A and Figure 12BThe third forming portion CX3 shown includes m rows of hole forming portions, where m is an integer greater than or equal to 1. Each row of hole forming portions includes at least one hole forming portion CK.

[0170] like Figures 14A to 16A and Figures 14B to 16B As shown, when m is an integer greater than or equal to 2, the first row of hole forming parts and the mth row of hole forming parts are formed in the first forming part CX1 along any direction parallel to the first forming part. When the stamping forming device 610 is used to stamp the solder strip 100A, the formed Figure 2A and Figure 2B The hollow structure of the connecting portion 210 shown includes m rows of through holes, each row of through holes includes at least one through hole T. For example, when m is an integer greater than or equal to 2, the first row of hole forming portions to the mth row of hole forming portions are distributed along the direction of the two second forming portions CX2 (refer to Figures 14A to 16A For example, the first row of hole forming parts to the mth row of hole forming parts are distributed along the distribution direction perpendicular to the two second forming parts CX2 (refer to Figures 14B to 16B The second direction B) is shown.

[0171] When the first row of hole forming parts to the mth row of hole forming parts are along the Figures 14A to 16A When the hole forming portion CK is distributed in the first direction A shown in FIG, the hole forming portion CK is a narrow hole forming portion that can form a slit-type through hole or a rectangular hole forming portion that can form a rectangular through hole. The distribution of the two adjacent rows of hole forming portions can be appropriately adjusted so that the distribution of the two adjacent rows of through holes is Figures 3A to 5A , thereby ensuring that the strength and stress relief capability are appropriate, a shorter circuit path is provided between the two welding portions formed by the two second formed portions CX2.

[0172] When the first row of hole forming parts to the mth row of hole forming parts are along the Figures 14B to 16B When the hole forming portion CK is distributed in the second direction B as shown, it is a narrow and long hole forming portion that can form a slit-type through hole or a rectangular hole forming portion that can form a rectangular through hole. If the length direction of the hole forming portion CK is distributed perpendicular to the distribution direction of the two second forming portions CX2, then the spacing between the two rows of hole forming portions can be adjusted so that when the welding ribbon 100A is stamped using the stamping forming device 610, the distribution of the through holes formed by the first row of hole forming portions to the mth row of hole forming portions is as follows: Figures 3B to 5B shown.

[0173] For example, when m is an integer greater than or equal to 2, the hole forming portions of two adjacent rows are staggered. When the stamping forming device 610 is used to stamp the solder strip 100A, the formed Figure 2A and Figure 2BThe two rows of through holes in the connecting portion 210 are staggered, and the effect thereof can be seen from the above description of the through holes.

[0174] For example, Figure 14A and Figure 14B As shown, two rows of narrow hole forming parts are formed in the first forming part CX1. The two rows of narrow hole forming parts can be along Figure 14A The first direction A shown in FIG. 1 is distributed so that the formed through hole appears as follows Figure 3A Of course, the two rows of narrow hole forming parts can also be arranged along the Figure 14B The second direction B shown in FIG. 1 is distributed so that when the stamping forming device 610 is used to stamp the solder strip 100A, the distribution form and effect of the two through holes formed by the two rows of narrow and long hole forming parts are referred to as follows: Figure 3B Related description.

[0175] like Figure 14A As shown, when the 2-row hole forming part is in accordance with Figure 14A When the first direction A is distributed, the ends of the first row of hole forming parts and the ends of the second row of hole forming parts are staggered, so that when the welding strip 100A is punched by the punching forming device 610, the distribution mode and effect of the two rows of through holes formed by the ends of the first row of hole forming parts and the second row of hole forming parts can be referred to. Figure 3A Related description.

[0176] like Figure 14B As shown, when the 2-row hole forming part is in accordance with Figure 14B When the second direction B is shown, each row of hole forming portions is a narrow and long hole forming portion. The length direction of the narrow and long hole forming portion is the same as that of the Figure 14B The first direction A shown is the same. At this time, the distance between the two adjacent rows of narrow and long hole forming parts can be adjusted so that when the stamping forming device 610 is used to stamp the welding strip 100A, the distribution mode and effect of the two rows of through holes formed by the end of the first row of hole forming parts and the second row of hole forming parts can refer to Figure 3B Related description.

[0177] For example, Figure 15A and Figure 15B As shown, when m is an integer greater than or equal to 3. The number of hole forming parts CK included in the first row of hole forming parts and the mth row of hole forming parts is greater than or equal to 2. At this time, along the distribution direction from the first row of hole forming parts to the mth row of hole forming parts, the number of hole forming parts CK included in each row of hole forming parts first decreases and then increases. When the stamping forming device 610 is used to stamp the solder strip 100A, the distribution method and effect of the m rows of through holes formed by the first row of hole forming parts and the mth row of hole forming parts can refer to the above. Figure 4A and Figure 4B Related description.

[0178] like Figure 15A and Figure 15B As shown, when the first row of hole forming parts and the mth row of hole forming parts are formed in the first forming part CX1 along the distribution direction of the two second forming parts CX2, along the distribution direction from the first row of hole forming parts to the mth row of hole forming parts, if the number of hole forming parts CK included in each row of hole forming parts first decreases and then increases, and the distances between the head and tail ends of each row of hole forming parts and the edge of the first forming part CX1 first decrease and then increase, then when the stamping forming device 610 is used to stamp the solder strip 100A, the distribution mode and effect of the m rows of through holes formed by the first row of hole forming parts and the mth row of hole forming parts can refer to the above Figure 4A and Figure 4B Related description.

[0179] For example, Figure 15A and 15B As shown, three rows of slit hole forming parts are formed in the above-mentioned first forming part CX1. The first row of slit hole forming parts and the third row of slit hole forming parts each include two slit hole forming parts, and the second row of slit hole forming parts includes one slit hole forming part. And a slit hole forming part included in the second row of slit hole forming parts is longer than the length of the slit hole forming part included in the first row of slit hole forming parts, but does not exceed the end portions of the first row of slit hole forming parts and the third row of slit hole forming parts. At this time, when the stamping forming device 610 is used to stamp the welding strip 100A, the distribution method and effect of the three rows of through holes formed by the two rows of slit hole forming parts can refer to the previous text. Figure 4A and Figure 4B Related description.

[0180] like Figure 15A As shown, when the 3 rows of slotted hole forming parts are formed according to Figure 15A When the first direction A is shown, the end of the second row of slit hole forming parts does not exceed the slit hole forming parts of the first row and the slit hole forming parts of the third row of through holes, so that when the stamping forming device 610 is used to stamp the solder strip 100A, the distribution mode and effect of the three rows of through holes formed by the three rows of slit hole forming parts can refer to the above. Figure 4A Related description.

[0181] like Figure 15B As shown, when the 3 rows of slotted hole forming parts are formed according to Figure 15B When the second direction B is distributed, the ends of the second row of slit hole forming parts do not exceed the ends of the first row of slit hole forming parts and the third row of slit hole forming parts, so that when the stamping forming device 610 is used to stamp the solder strip 100A, the distribution mode and effect of the three rows of through holes formed by the three rows of slit hole forming parts can refer to the above. Figure 4B Related description.

[0182] For example, Figure 16A and Figure 16BAs shown, when m is an integer greater than or equal to 3, the number of hole forming parts included in the first row of hole forming parts and the mth row of hole forming parts is greater than or equal to 1. Along the distribution direction from the first row of hole forming parts to the mth row of hole forming parts, the number of hole forming parts CK included in each row of hole forming parts first increases and then decreases. At this time, when the stamping forming device 610 is used to stamp the solder strip 100A, the distribution method and effect of the m rows of through holes formed by the m rows of hole forming parts can refer to the above Figure 5A and Figure 5B Related description.

[0183] like Figure 16A and Figure 16B As shown, along the distribution direction of the first row of hole forming parts to the mth row of hole forming parts, if the length of each row of hole forming parts along the row direction first increases and then decreases, then when the stamping forming device 610 is used to stamp the solder ribbon 100A, the distribution mode and effect of the m rows of through holes formed by the m rows of hole forming parts can be referred to the above. Figure 5A and Figure 5B Related description.

[0184] For example, Figure 16A and Figure 16B As shown, three rows of slit hole forming parts are formed in the above-mentioned first forming part CX1. The first row of slit hole forming parts and the third row of slit hole forming parts each include one slit hole forming part, and the second row of slit hole forming parts include two slit hole forming parts. And the length of one slit hole forming part included in the first row of slit hole forming parts is longer than the length of the slit hole forming part included in the second row of slit hole forming parts, but the end of the first row of slit hole forming parts and the third row of slit hole forming parts do not exceed the end of the second row of slit hole forming parts. At this time, the number of slit hole forming parts contained in the first row of slit hole forming parts and the third row of slit hole forming parts is relatively small, while the number of slit hole forming parts contained in the second row of slit hole forming parts is relatively large. Based on this, when the stamping forming device 610 is used to stamp the welding strip 100A, the distribution method and effect of the three rows of slit-type through holes formed by the three rows of slit hole forming parts refer to the previous text. Figure 5A and Figure 5B Related description.

[0185] like Figure 16A As shown, when the 3-row hole forming part is in accordance with Figure 16A When the first direction A is distributed, the end of the first row of hole forming parts and the third row of hole forming parts do not exceed the end of the second row of hole forming parts, so that when the stamping forming device 610 is used to stamp the solder strip 100A, the distribution mode and effect of the three rows of through holes formed by the three rows of hole forming parts refer to the above. Figure 5A Related description.

[0186] like Figure 16B As shown, when the 3-row hole forming part is in accordance with Figure 16BThe second direction B distribution shown, each row of hole forming part is long hole forming part, long hole forming part length mode along Figure 16B The first direction A distribution shown. At this time, the distance between the two adjacent rows of long hole forming part can be adjusted, so that the distribution mode and effect of the three rows of through holes formed by the three rows of hole forming parts when the welding strip 100A is punched by the punching forming device 610 are described in the foregoing Figure 5B .

[0187] In an alternative way, as Figure 11 shown, the above-mentioned punching forming device 610 further comprises a punch 612. The upper punch 611A is arranged on the punch 612. The punch 612 is used to control the closing and opening of the upper punch 611A and the lower punch 611B. When the punch 612 is in the process of punching the welding strip 100A, the punch 612 can drive the upper punch 611A to approach the lower punch 611B until the upper punch 611A and the lower punch 611B are closed, realizing the punching of the welding strip 100A once. Figure 2A And Figure 2B After the structure welding strip 200 shown in the figure is formed on the welding strip 100A, the punch 612 can drive the upper punch 611A to move away from the lower punch 611B, so as to realize the opening of the upper punch 611A and the lower punch 611B.

[0188] In order to ensure the accuracy of the welding strip punching, as Figure 11 shown, the above-mentioned punching forming device 610 further comprises a welding strip straightening roller 613 and a welding strip pulling roller 614. The forming die is located between the welding strip straightening roller 613 and the welding strip pulling roller 614. When the punch 612 controls the upper punch 611A to open, the welding strip straightening roller 613 is used to correct the position of the welding strip, and the welding strip pulling roller 614 is used to pull the welding strip, so that the part of the welding strip to be punched falls accurately between the upper punch 611A and the lower punch 611B, thereby ensuring that the punching forming device 610 normally punches the welding strip 100A.

[0189] In an alternative way, as Figure 11 shown, if the multiple Figure 2A and Figure 2B structure welding strips 200 punched by the above-mentioned punching forming device 610 are connected together, the multiple Figure 2A and Figure 2B structure welding strips 200 can be connected together in the connection mode shown in Figure 1B . As Figure 1B shown, the welding part contained in the two adjacent Figure 2A and Figure 2B structure welding strips 200 is connected together.

[0190] When multiple Figure 2A and Figure 2B The structural welding strips 200 shown are connected together, as shown Figure 11 As shown, the manufacturing equipment of the above-mentioned interconnected parts also includes: a first industrial robot R1, and a cutting mechanism 630 located between the stamping and forming device 610 and the material compounding device 620.

[0191] like Figure 11 As shown, the first industrial robot R1 can be a six-degree-of-freedom robot arm, etc. The first industrial robot R1 is used to pull the connected multiple structural welding strips 100B to the cutting station of the cutting mechanism 630 when the upper punch 611A and the lower punch 611B are opened, so that the cutting Figure 2A and Figure 2B The process of the structural welding ribbon 200 shown is automated. Here, the cutting station of the cutting mechanism 630 refers to the position where the multiple structural welding ribbons 100 connected together are cut.

[0192] like Figure 11 As shown, the cutting mechanism 630 can be a mechanism that can cut the welding strips, such as a welding strip cutting machine. The cutting mechanism 630 is used to separate the multiple structural welding strips 100B connected together at the cutting station of the cutting mechanism 630 to form multiple Figure 2A and Figure 2B The structural welding ribbon 200 is shown.

[0193] In one alternative, Figure 17 This is an example diagram of the automation principle of the manufacturing equipment of the interconnected parts provided by the embodiment of the present invention. Figure 17 As shown, the interconnected component manufacturing equipment further includes an image sensor 640 and a controller 650 that communicates with the image sensor 640 and the cutting mechanism 630. The communication method can be wireless or wired. Wireless communication can be based on networking technologies such as WiFi and Zigbee. Wired communication can be achieved via data lines or power line carriers. The communication interface can be a standard communication interface, which can be either a serial interface or a parallel interface.

[0194] like Figure 17 As shown, the image sensor 640 may be a charge coupled device (CCD) camera, etc., and the image it captures may be a color image, a black and white image, or an infrared image. The image sensor 640 may be used to capture images of the connected plurality of structural welding ribbons 100B at the cutting station of the cutting mechanism 630. The controller 650 is used to control the cutting mechanism 630 to separate the connected plurality of structural welding ribbons 100B based on the images of the connected plurality of structural welding ribbons 100B.

[0195] In practical applications, such as Figure 17 As shown, the controller 650 is integrated with existing image recognition software, such as: Cognex image recognition software, Graph Intelligence image recognition software, Haishen Technology image recognition software, etc. These image recognition software can generally recognize images based on machine learning. For example: first pre-process the image of the multiple structural welding strips 100B connected together at the cutting station of the cutting mechanism 630. The pre-processing method may include edge detection, filtering operation, binarization, image scaling, normalization and other processing. Then, feature extraction is performed on the pre-processed image (for example, extracting the welding strip image); image recognition is performed on the extracted features, and the adjacent two images can be determined based on the recognized image. Figure 2A and Figure 2B The joint position of the structural welding strip 200 shown in FIG. Based on this, the controller 650 can be configured to Figure 2A and Figure 2B The joint position of the structure welding strip 200 shown in the figure controls the cutting head of the cutting mechanism 630, between two adjacent Figure 2A and Figure 2B The bonding position of the structural welding strip 200 shown is to separate two adjacent Figure 2A and Figure 2B The structure of the welding strip 200 shown in FIG. Figure 2A and Figure 2B The structural welding ribbon 200 shown is separated from the multiple structural welding ribbons 100B connected together. It can be seen that the manufacturing equipment of the interconnection member provided by the embodiment of the present invention can control the cutting head of the cutting mechanism 630 to accurately cut the continuous structural welding ribbon with the assistance of the image sensor 640 and the controller 650, thereby avoiding inaccurate cutting. Figure 2A and Figure 2B The damage caused by the structural welding ribbon 200 is shown, thereby improving the cutting yield.

[0196] like Figure 17 As shown, to support intelligent feeding of structural welding ribbons, the interconnected component manufacturing equipment may further include a second industrial robot R2 and a speed sensor 660, each communicating with a controller 650. The controller 650 and the controller 650 described above may be different controllers or the same controller. The communication method may be wireless or wired. Wireless communication may be based on networking technologies such as Wi-Fi and ZigBee. Wired communication may be based on data lines or power line carriers. The communication interface may be a standard communication interface. This standard communication interface may be a serial interface or a parallel interface.

[0197] like Figure 17As shown, the second industrial robot R2 can be a six-degree-of-freedom robotic arm, etc. The second industrial robot R2 and the first industrial robot R1 can be shared. Of course, the second industrial robot R2 and the first industrial robot R1 can also be independent of each other. The second industrial robot R2 is used to Figure 1C The flexible insulating substrate 300 shown in FIG. Figure 2A and Figure 2B The structural welding strip 200 shown. At the same time, the second industrial robot R2 can also adjust Figure 2A and Figure 2B The structural welding strip 200 shown is Figure 1C The flexible insulating substrate 300 is arranged in such a manner that multiple Figure 2A and Figure 2B The structural welding strip 200 shown includes a portion of the connection layer located at Figure 1C On the flexible insulating substrate 300 shown in FIG, two welding portions extend out Figure 1C The flexible insulating substrate 300 is shown in FIG.

[0198] like Figure 17 As shown, the speed sensor 660 can be any common angular speed sensor, linear speed sensor 660, or a laser speed meter, etc., which can be installed on Figure 1C The speed sensor 660 is mounted on the substrate unwinding device RF of the flexible insulating substrate 300 shown in FIG. 1 or other feasible locations. When the substrate unwinding device RF includes a second unwinding roller, the speed sensor 660 can be mounted on the driving motor of the second unwinding roller. The speed sensor 660 is used to collect Figure 1C The feeding speed of the flexible insulating substrate 300 is shown in FIG.

[0199] like Figure 17 As shown, the controller 650 is also used according to Figure 1C The feed rate of the flexible insulating substrate 300 and the structure of the welding strip are shown in FIG. Figure 1C The distribution interval of the flexible insulating substrate 300 shown in FIG controls the time interval for the second industrial robot R2 to place the structural welding ribbon.

[0200] In practical applications, such as Figure 17 As shown, the controller 650 can Figure 1C The feeding speed V of the flexible insulating substrate 300 and the adjacent two structural welding strips are shown in FIG. Figure 1C The distribution interval D of the flexible insulating substrate 300 shown in FIG determines the time interval t for the second industrial robot R2 to release the structural welding tape. Figure 1C The feeding speed of the flexible insulating substrate 300 shown in FIG. 3 may be a linear speed, an angular speed or other speeds related to the feeding speed. Figure 1CThe speed signal expression related to the feeding speed of the flexible insulating substrate 300 shown in . In practical applications, these speed signals can be preprocessed according to actual conditions to meet the calculation needs of the controller 650. Of course, the time interval t for the second industrial robot R2 to release the structural welding tape can also be determined by selecting the type of speed sensor 660. On this basis, the controller 650 controls the time interval t for the second industrial robot R2 to release the structural welding tape. It should be understood here that when the second industrial robot R2 determines the time interval t for the second industrial robot R2 to release the structural welding tape, it can be determined by a simple logic operation circuit or existing software that can realize data preprocessing and division operations. For example: when Figure 1C As shown in FIG, the feeding speed V of the flexible insulating substrate 300 is 0.5 m / min, and the distribution interval D between two adjacent structural welding strips is 2 cm. Then, the time interval t = D / V = 4 s for the second industrial robot R2 to feed the structural welding strips. Thus, when the speed sensor 660 and the second industrial robot R2 communicate with the controller 650 respectively, the controller 650 can receive the data collected by the speed sensor 660. Figure 1C The feeding speed of the flexible insulating substrate 300 shown in FIG is used to control the time interval of the second industrial robot R2 in feeding the structural welding strip, thereby improving the structural welding strip in the Figure 1C The degree of composite automation on the flexible insulating substrate 300 is shown in FIG.

[0201] As can be seen from the above, the manufacturing method and manufacturing equipment of the interconnection component provided by the embodiments of the present invention are convenient, fast and intelligent in the process of manufacturing the interconnection component, and can realize the production of the interconnection component in an automated and batch manner.

[0202] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0203] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for manufacturing an interconnection component, characterized in that: include: Providing a welding ribbon, and performing a forming process on the welding ribbon to obtain a plurality of structural welding ribbons; Each of the structural welding strips has two welding portions and a connecting portion located between the two welding portions, wherein the connecting portion is respectively connected to the two welding portions; A flexible insulating substrate is provided, and a plurality of the structural welding ribbons are laminated on the flexible insulating substrate at intervals to obtain an interconnection component; wherein the material of the flexible insulating substrate includes polyvinyl butyral, polyolefin, or ethylene-vinyl acetate copolymer; each of the structural welding ribbons has a connection portion at least partially located on the flexible insulating substrate, and two of the welding portions extend out of the flexible insulating substrate; The flexible insulating substrate includes two flexible insulating layers and a conductive layer located between the flexible insulating layers, wherein the connection portions of the structural welding strips are electrically connected via the conductive layer, and the conductive layer is a conductive particle layer composed of metal particles in contact with each other; Wherein, the step of laminating the plurality of structural welding strips at intervals on the flexible insulating substrate comprises: placing the plurality of structural welding strips on the surface of the flexible insulating substrate, and pressing the plurality of structural welding strips onto the flexible insulating substrate under pressure, so that the bottom of the connecting portion contained in the structural welding strip is in contact with the conductive layer, and the connecting portion of each structural welding strip is exposed away from the surface of the flexible insulating substrate; or, the connecting portion of each structural welding strip is embedded in the flexible insulating substrate, so that the connecting portion of each structural welding strip is at least partially wrapped in the flexible insulating layer, and the thickness of the structural welding strip is less than or equal to 1 / 3 of the thickness of the flexible insulating substrate.

2. The method for manufacturing an interconnection member according to claim 1, wherein: The connecting portion has a hollow structure for relieving stress, and the hollow structure includes at least one through hole; wherein, The pattern of each through hole is a closed pattern; and / or, The pattern of each through hole is a polygonal pattern, a circular pattern, an elliptical pattern or a special-shaped pattern.

3. The method for manufacturing an interconnection member according to claim 2, wherein: The hollow structure includes m rows of through holes, where m is an integer greater than or equal to 1; each row of through holes includes at least one through hole, and the first row of through holes and the mth row of through holes are formed on the connecting portion along any direction parallel to the connecting portion; When m is an integer greater than or equal to 2, the through holes in two adjacent rows are staggered.

4. The method for manufacturing an interconnection member according to claim 3, wherein: The m is an integer greater than or equal to 2, and the central axes of the two welding portions are collinear; and / or, The width of each welding portion is smaller than the maximum width of the connecting portion, and each welding portion is connected to the connecting portion in an arc transition manner.

5. The method for manufacturing an interconnection member according to claim 1, wherein: The flexible insulating substrate is a light-shielding flexible insulating substrate; or At least one surface of the flexible insulating substrate is partially or entirely coated with a shielding coating; or The flexible insulating substrate is a single-sided tape or a double-sided tape; or The connection portion of each structural welding strip is exposed away from the surface of the flexible insulating substrate; or At least a portion of the connection portion of each structural welding strip is wrapped in the flexible insulating substrate.

6. The method for manufacturing an interconnection element according to any one of claims 1 to 5, characterized in that: The forming process is performed by mechanical stamping, chemical etching or laser cutting; or The composite method is bonding; or The composite method is a hot pressing method, the hot pressing temperature of the hot pressing method is 50° C. to 120° C., and the hot pressing time is 5 seconds to 30 seconds.

7. The method for manufacturing an interconnection element according to any one of claims 1 to 5, characterized in that: The forming process of the welding strip to obtain a plurality of structural welding strips includes: Mechanically punching the welding strip along its length to form a plurality of connected structural welding strips; separating the connected plurality of structural welding strips by cutting; and / or, The step of laminating a plurality of the structural welding strips on the flexible insulating substrate at intervals to obtain an interconnection component comprises: The plurality of structural welding ribbons are transferred to a flexible insulating substrate, and the plurality of structural welding ribbons are pressed onto the flexible insulating substrate to obtain an interconnection component.

8. A manufacturing device for interconnecting parts, characterized in that: Including welding ribbon unwinding device, substrate unwinding device, stamping and forming device, material compounding device and winding device: The welding ribbon unwinding device is used to provide welding ribbon to the stamping and forming device; The substrate unwinding device is used to provide a flexible insulating substrate to the material composite device; The stamping and forming device is used to form the welding strip to obtain a plurality of structural welding strips, wherein the structural welding strip has two welding parts and a connecting part located between the two welding parts, and the connecting part is respectively connected to the two welding parts; The material composite device is used to composite a plurality of the structural welding ribbons onto the flexible insulating substrate at intervals to obtain an interconnection member, wherein the connection portion of each of the structural welding ribbons included in the interconnection member is at least partially located on the flexible insulating substrate, and two of the welding portions extend out of the flexible insulating substrate; the flexible insulating substrate includes two flexible insulating layers and a conductive layer located between the two flexible insulating layers, the connection portions of each of the structural welding ribbons being electrically connected via the conductive layer, and the conductive layer is a conductive particle layer composed of mutually contacting metal particles; the bottom of the connection portion contained in the structural welding ribbon is in contact with the conductive layer, and the connection portion of each of the structural welding ribbons is exposed away from the surface of the flexible insulating substrate; or, the connection portion of each of the structural welding ribbons is embedded in the flexible insulating substrate, so that the connection portion of each of the structural welding ribbons is at least partially wrapped in the flexible insulating layer, and the thickness of the structural welding ribbon is less than or equal to 1 / 3 of the thickness of the flexible insulating substrate; The winding device is used to wind up the interconnection member; wherein, The stamping forming device includes a forming mold, which includes an upper die and a lower die; the upper die and the lower die each have a first forming part for forming a connecting part and two second forming parts for forming a welding part; the first forming part is located between the two second forming parts, and the first forming part is connected to the second forming parts respectively.

9. The manufacturing equipment of the interconnection member according to claim 8, characterized in that: The central axes of the two second shaped parts are collinear; and / or, The width of each second forming portion is smaller than the width of the first forming portion, and each second forming portion is connected to the first forming portion in an arc transition manner.

10. The manufacturing equipment of the interconnection element according to claim 8, characterized in that: The upper punch and the lower punch also have a third forming part located inside the first forming part, and the third forming part is used to form a hollow structure for releasing stress at the connecting part; wherein, The third forming portion includes at least one hole forming portion; the pattern of each hole forming portion is a closed pattern; and / or, The third forming part includes m rows of hole forming parts, where m is an integer greater than or equal to 1; each row of the hole forming parts includes at least one hole forming part, and the first row of hole forming parts and the mth row of hole forming parts are formed in the first forming part along any direction parallel to the first forming part.

11. The interconnection device manufacturing equipment according to any one of claims 8 to 10, characterized in that: The stamping forming device further comprises: a stamping machine, the upper die is provided on the stamping machine, and the stamping machine is used to control the upper die and the lower die to close and open the die; and / or, The manufacturing equipment of the interconnection component further includes a welding ribbon straightening roller and a welding ribbon pulling roller, and the forming mold is located between the welding ribbon straightening roller and the welding ribbon pulling roller.

12. The interconnection device manufacturing equipment according to any one of claims 8 to 10, characterized in that: When the plurality of structural welding strips are connected together, the manufacturing equipment of the interconnected part further comprises a first industrial robot, configured to pull the plurality of structural welding strips connected together to a cutting station of a cutting mechanism when the upper punch and the lower punch are opened; The manufacturing equipment of the interconnection part also includes a cutting mechanism located between the stamping and forming device and the material composite device, which is used to separate the multiple structural welding strips connected together at the cutting station of the cutting mechanism to form multiple structural welding strips.

13. The manufacturing equipment of the interconnection element according to claim 12, characterized in that: The manufacturing equipment of the interconnection element further includes: An image sensor is used to capture images of the multiple structural welding ribbons connected together at the cutting station of the cutting mechanism; and a controller in communication with the image sensor and the cutting mechanism, for controlling the cutting mechanism to separate the plurality of structural welding ribbons connected together based on the image of the plurality of structural welding ribbons connected together; The manufacturing equipment of the interconnection element further includes: The second industrial robot is used to intermittently deliver structural welding ribbons to flexible insulating substrates; A speed sensor, used to collect the feeding speed of the flexible insulating substrate; The controller communicates with the speed sensor and the second industrial robot respectively, and is used to control the time interval for the second industrial robot to release the structural welding tape according to the feeding speed of the flexible insulating substrate and the distribution interval of the structural welding tape on the flexible insulating substrate.

14. The interconnection device manufacturing equipment according to any one of claims 8 to 10, characterized in that: The welding ribbon unwinding device comprises a first unwinding roller and a conveying roller, wherein the conveying roller is located between the unwinding roller and the stamping and forming device; and / or, The substrate unwinding device comprises at least one second unwinding roller; and / or, The material compounding device is a roller hot press or a plate hot press.

Images