Display module and display device comprising the same

Abstract

A display module is provided. The display module includes a display panel, a touch sensor, and a pressure sensor. A base member of the display panel includes a first portion, a second portion extending from the first portion, and a third portion extending from the second portion. The touch sensor is disposed on the first portion of the base member. The pressure sensor is disposed on the third portion of the base member. The pressure sensor is superposed with the first portion of the base member when the second portion of the base member is bent.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2019-0070887, filed on June 14, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a display module capable of detecting a user's touch and pressure applied by the user, and a display device including the display module. Background Technology

[0003] Various display devices have been developed for multimedia devices such as televisions, mobile phones, tablet computers, navigation units, and game consoles. These display devices can all include a keyboard and / or mouse as input units.

[0004] In recent years, display devices have included input sensing circuits as input units capable of detecting user touch and / or pressure applied by the user.

[0005] The display device can identify the presence of a person's finger or similar object touching the screen via an input sensing circuit. The input sensing circuit can employ various suitable touch detection methods, including resistive film methods, optical methods, capacitive methods, and / or ultrasonic methods. The capacitive method described above detects whether a touch has occurred by using the capacitance that changes when a touch generating unit touches the screen of the display device.

[0006] In addition, the display device can detect the pressure applied to the screen. Summary of the Invention

[0007] An embodiment of this disclosure provides a display module capable of detecting a user's touch and pressure applied by the user, and a display device including the display module.

[0008] Embodiments of this disclosure provide a display module, which includes a substrate component, a circuit layer, a light-emitting element layer, an encapsulation layer, a first sensor, and a second sensor.

[0009] The base component includes a first part, a second part extending from the first part, and a third part extending from the second part.

[0010] The circuit layer is disposed on the first part of the substrate component and includes multiple transistors.

[0011] The light-emitting element layer is disposed on the circuit layer and includes multiple light-emitting elements electrically connected to multiple transistors.

[0012] The encapsulation layer seals the light-emitting element layer.

[0013] The first sensor is mounted on the encapsulation layer.

[0014] The second sensor is mounted on the third part of the base component to detect pressure applied from the outside.

[0015] When the second part of the base component bends, the second sensor overlaps with the first part of the base component.

[0016] In an embodiment, the display module may further include multiple pads, a printed circuit board, and an input sensing drive circuit.

[0017] The multiple pads may include a plurality of first pads configured to transmit electrical signals to a plurality of transistors, a plurality of second pads electrically connected to a first sensor, and a plurality of third pads electrically connected to a second sensor, and are stacked with a third portion of the substrate member.

[0018] Printed circuit boards can be electrically connected to multiple pads.

[0019] The input sensing drive circuit can be mounted on a printed circuit board and electrically connected to multiple second pads and multiple third pads.

[0020] In one embodiment, the display module may further include a data driving circuit. The data driving circuit may be disposed between the plurality of pads and the second sensor, and electrically connected to the plurality of first pads.

[0021] In one embodiment, the second sensor may include multiple electrodes, and the capacitance provided by the multiple electrodes may change when pressure is applied from the outside.

[0022] In one embodiment, the second sensor may include a strain gauge.

[0023] In an embodiment, the material contained in the first sensor may be the same as the material contained in the second sensor.

[0024] In an embodiment, the first, second, and third portions may be integral with each other to provide a matrix component, and each of the first, second, and third portions may include polyimide (PI).

[0025] In one embodiment, the display module may further include a buffer (e.g., a buffer member) that contacts a portion of the second sensor.

[0026] In embodiments of this disclosure, a display device includes: a display module configured to display an image; and a placement member configured to accommodate the display module.

[0027] The display module includes a substrate component, a circuit layer, a light-emitting element layer, a packaging layer, a first sensor, and a second sensor.

[0028] The base component includes a first part, a second part extending from the first part, and a third part extending from the second part.

[0029] The circuit layer is disposed on the first part of the substrate component and includes multiple transistors.

[0030] The light-emitting element layer is disposed on the circuit layer and includes multiple light-emitting elements electrically connected to multiple transistors.

[0031] The encapsulation layer seals the light-emitting element layer.

[0032] The first sensor is mounted on the encapsulation layer.

[0033] The second sensor is mounted on the third part of the base component to detect pressure applied from the outside.

[0034] When the second part of the base component bends, the second sensor overlaps with the first part of the base component.

[0035] In an embodiment, the display module may further include multiple pads, a printed circuit board, and an input sensing drive circuit.

[0036] The multiple pads may include a plurality of first pads configured to transmit electrical signals to a plurality of transistors, a plurality of second pads electrically connected to a first sensor, and a plurality of third pads electrically connected to a second sensor, and are stacked with a third portion of the substrate member.

[0037] Printed circuit boards can be electrically connected to multiple pads.

[0038] The input sensing drive circuit can be mounted on a printed circuit board and electrically connected to multiple second pads and multiple third pads.

[0039] In an embodiment, the mounting member may include: a bottom portion including a protrusion that overlaps with the second sensor; and a side portion extending from the side of the bottom portion.

[0040] In an embodiment, the display device may further include a buffer (e.g., a buffer member) disposed between the protrusion at the bottom and the second sensor.

[0041] In an embodiment, the second sensor may include: a first sensor portion, which is stacked on top of the protrusion and disposed adjacent to the surface of the base member; and a second sensor portion, which is stacked on top of the protrusion and disposed adjacent to the surface of the protrusion.

[0042] In embodiments of this disclosure, the display device may further include a buffer (e.g., a buffer member) disposed between the first sensor portion and the second sensor portion.

[0043] In an embodiment, the display module may further include a data driving circuit disposed between the plurality of pads and the second sensor, and the data driving circuit may be electrically connected to the plurality of first pads.

[0044] In one embodiment, the second sensor may include multiple electrodes, and the capacitance provided by the multiple electrodes may change when pressure is applied from the outside.

[0045] In one embodiment, the second sensor may include a strain gauge.

[0046] In one embodiment, the image may include a home button image located at a fixed position on the display device (e.g., the home button is always displayed at a fixed position), and the second sensor may be overlaid with the home button image.

[0047] In embodiments of this disclosure, the display module includes a substrate component, a barrier layer, a circuit layer, and a light-emitting element layer.

[0048] The base component includes a first part, a second part extending from the first part, and a third part extending from the second part.

[0049] The barrier layer comprises multiple metal patterns disposed on the substrate component.

[0050] The circuit layer is disposed on the barrier layer and includes a plurality of transistors superimposed on a first portion of the substrate component, and the plurality of transistors include a plurality of active components.

[0051] The light-emitting element layer is disposed on the circuit layer and includes multiple light-emitting elements electrically connected to multiple transistors.

[0052] The barrier layer includes a plurality of metal patterns: a first metal pattern superimposed on a plurality of active components; a second metal pattern superimposed on a first portion of a substrate component; and a third metal pattern superimposed on a third portion of a substrate component and electrically connected to the second metal pattern.

[0053] In one embodiment, the display module may further include a printed circuit board electrically connected to a third metal pattern; and an input sensing drive circuit that can be mounted on the printed circuit board and electrically connected to the third metal pattern.

[0054] In an embodiment, the input sensing drive circuit can detect changes in the capacitance of the second metal pattern or changes in the resistance value of the second metal pattern. Attached Figure Description

[0055] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure. In the drawings:

[0056] Figure 1A This is a perspective view showing a display device according to an embodiment of the present disclosure;

[0057] Figure 1BThis is an exploded perspective view illustrating a display device according to an embodiment of the present disclosure;

[0058] Figure 2 This is a plan view illustrating a display module according to an embodiment of the present disclosure;

[0059] Figure 3 It shows along Figure 1A A view of the cross section intercepted by line I-I' in the middle;

[0060] Figure 4 This is an equivalent circuit diagram showing pixels according to embodiments of the present disclosure;

[0061] Figure 5A and Figure 5B This is a cross-sectional view showing a display module according to an embodiment of the present disclosure;

[0062] Figure 6A This is a plan view illustrating a display module according to an embodiment of the present disclosure;

[0063] Figure 6B This is a cross-sectional view showing a display module according to an embodiment of the present disclosure;

[0064] Figure 7 This is a plan view illustrating a display module according to an embodiment of the present disclosure;

[0065] Figure 8 It shows along Figure 1A A view of a portion of the cross section cut by line I-I' in the middle;

[0066] Figure 9 This is a plan view illustrating a display module according to an embodiment of the present disclosure;

[0067] Figure 10 It shows along Figure 1A A view of a portion of the cross section intercepted by line I-I'; and

[0068] Figure 11 and Figure 12 The diagram shows a plan view of a display module according to an embodiment of the present disclosure. Detailed Implementation

[0069] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0070] Furthermore, for clarity, the thickness, ratios, and dimensions of the components are exaggerated in the accompanying drawings. The term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0071] The terms “comprising” or “including” describe a nature, a fixed quantity, a step, an operation, an element, a component, or a combination thereof, but do not exclude other natures, fixed quantities, steps, operations, elements, components, or combinations thereof.

[0072] Figure 1A This is a perspective view showing a display device DD according to an embodiment of the present disclosure. Figure 1B This is an exploded perspective view showing a display device DD according to an embodiment of the present disclosure.

[0073] exist Figure 1A In the illustration, a smartphone is shown as an example of a display device DD. However, embodiments of this disclosure are not limited thereto. For example, the display device DD may be located in or be part of a large-sized electronic device (such as a television or monitor) or a small-to-medium-sized electronic device (such as a mobile phone, tablet PC, navigation unit for a vehicle, game console, or smartwatch).

[0074] For the display device DD, a display area DA and a non-display area NDA can be defined. The display area DA may include the pressure sensing area FSA.

[0075] The display area DA can display the image IM and detect user touch. Additionally, the pressure sensing area FSA can detect externally applied pressure. The home button image HM can be displayed within the pressure sensing area FSA. During operation of the display device DD, the home button image HM can always be displayed at a set or predetermined position on the display device DD. The user can then determine which area of ​​the display area DA is the pressure sensing area FSA through the home button image HM.

[0076] The display area DA can be parallel to the plane defined by the first directional axis DR1 and the second directional axis DR2.

[0077] The normal direction of the display area DA (i.e., the thickness direction of the display device DD) indicates the third directional axis DR3. The front (or top) and rear (or bottom) surfaces of each of the components are distinguished by the third directional axis DR3. However, the directions indicated by the first directional axis to the third directional axes DR1, DR2, and DR3 can be relative concepts and can therefore be converted relative to each other. In the following, the first direction to the third direction can be indicated by the first directional axis to the third directional axes DR1, DR2, and DR3 respectively, and are designated by the same reference numerals respectively.

[0078] Although Figure 1A The shape of the display area DA is shown, but the shape of the display area DA can be changed as needed.

[0079] The non-display area NDA is adjacent to the display area DA, and the image IM is not displayed on the non-display area NDA. The non-display area NDA can define the border area of ​​the display device DD.

[0080] The non-display area NDA may surround or be located around the display area DA. However, embodiments of this disclosure are not limited thereto. For example, the display area DA and the non-display area NDA may be suitably modified in shape (e.g., based on their design).

[0081] Reference Figure 1B The display device DD may include a window component WM, a display module DM, and a setting component ST.

[0082] For window component WM, the transmission area TA and the border area BZA can be defined.

[0083] The transmission region TA can transmit incident light. Specifically, the image IM generated by the display module DM can be transmitted through the transmission region TA and seen by the user. The transmission region TA can be superimposed on the display region DA.

[0084] The border region BZA may be adjacent to the transmissive region TA. Specifically, the border region BZA may surround or be located around the transmissive region TA. In embodiments of this disclosure, the border region BZA may have a set color or a predetermined color. The border region BZA may be superimposed on the non-display region NDA.

[0085] The display module DM can be positioned below the window component WM. The display module DM can be protected by the window component WM from external impacts, etc.

[0086] For the display module DM, the effective area ACA and the ineffective area NACA can be defined.

[0087] The effective region ACA can correspond to Figure 1A The display area DA is defined within the active area ACA. The active area ACA can display the image IM, detect user touches, and detect externally applied pressure. Figure 1A The pressure sensing area FSA in the display module DM can also be defined by a portion of the effective area ACA.

[0088] The non-active region NACA can correspond to the non-display region NDA. Lines used to provide electrical signals to and / or receive electrical signals from the active region ACA can be set (positioned) in the non-active region NACA.

[0089] The component ST can have at least a portion positioned below the display module DM. The component ST can accommodate the window component WM and the display module DM.

[0090] Figure 2 This is a plan view showing a display module DM according to an embodiment of the present disclosure. Figure 3 It shows along Figure 1A The view of the cross section cut by line I-I' in the middle.

[0091] The display module DM may include a display panel DP, a first sensor SP1, a second sensor SP2, a data drive circuit DIC, multiple pads (or "soldering pads") PD, a printed circuit board PCB, an input sensing drive circuit TIC, and a control drive circuit CIC.

[0092] The display panel DP may include a substrate component BL, a circuit layer CL, a light-emitting element layer ELL, and a packaging layer TFE. In embodiments of this disclosure, the display panel DP may further include a barrier layer CPL and a BRL (see reference 1) disposed between the substrate component BL and the circuit layer CL. Figure 5A ).

[0093] The matrix component BL may include a first portion PT1, a second portion PT2 extending from the first portion PT1, and a third portion PT3 extending from the second portion PT2. In embodiments of this disclosure, the first portion PT1, the second portion PT2, and the third portion PT3 may be integrally formed with each other to provide the matrix component BL.

[0094] The second part PT2 of the matrix member BL may have at least a portion defined as the bending region BA.

[0095] The second portion PT2 of the substrate member BL may have a length that can be appropriately changed as needed, as measured in the second direction DR2. When a portion of the second portion PT2 (e.g., a curved area) bends, as the length of the second portion PT2 of the substrate member BL changes as measured in the second direction DR2, the second sensor SP2 can be adjusted to overlap with a portion of the effective area ACA (e.g., in a planar view or in the thickness direction or third-party upward).

[0096] Although the matrix component BL may include polyimide (PI), the embodiments disclosed herein are not limited thereto.

[0097] The circuit layer CL can be disposed on the first part PT1 of the substrate component BL, and includes multiple transistors T1 to T7 (see reference). Figure 4 ) and capacitor CPT (refer to Figure 4 ).

[0098] The light-emitting element layer ELL can be disposed on the circuit layer CL and stacked with the first portion PT1 of the substrate component BL. The light-emitting element layer ELL may include transistors T1 to T7 electrically connected to a plurality of transistors (see reference). Figure 4 Multiple light-emitting elements LD (refer to) Figure 4 ).

[0099] The encapsulation layer TFE can be placed on the light-emitting element layer ELL to seal the light-emitting element layer ELL.

[0100] The first sensor SP1 can be disposed on the encapsulation layer TFE and stacked with the first portion PT1 of the substrate component BL. The first sensor SP1 can be configured to detect user touch. Figure 3 The diagram shows a first sensor SP1 disposed on the circuit layer CL. However, embodiments of this disclosure are not limited thereto. For example, the first sensor SP1 may be disposed on the substrate member BL to form part of the circuit layer CL, or disposed on the encapsulation layer TFE as a portion of the encapsulation layer TFE extends.

[0101] The first sensor SP1 may include a plurality of first sensor units IE1 and a plurality of second sensor units IE2. Each of the first sensor units IE1 and the second sensor units IE2 may include an electrode comprising metal.

[0102] The first sensor unit IE1 and the second sensor unit IE2 can provide capacitance. When a user touches the active area ACA, the capacitance between the first sensor unit IE1 and the second sensor unit IE2 can change. The input sensing drive circuit TIC can detect the change in capacitance of the first sensor SP1 to determine which point in the active area ACA was touched by the user.

[0103] The second sensor SP2 can be stacked on the third part PT3 of the base component BL. Specifically, the second sensor SP2 can be disposed on the third part PT3 of the base component BL in the state before the second part PT2 of the base component BL is bent.

[0104] In embodiments of this disclosure, the second sensor SP2 can be fabricated in the same process as the first sensor SP1. Therefore, the metal material contained in the first sensor SP1 can be the same as the metal material contained in the second sensor SP2.

[0105] In embodiments of this disclosure, the second sensor SP2 may include a third sensor section IE3 and a fourth sensor section IE4. Each of the third sensor section IE3 and the fourth sensor section IE4 may include an electrode comprising metal.

[0106] In embodiments of this disclosure, the third sensor unit IE3 and the fourth sensor unit IE4 can provide capacitance. When external pressure is applied, the capacitance between the third sensor unit IE3 and the fourth sensor unit IE4 can change. The input sensing drive circuit TIC can determine whether external pressure has been applied by detecting the change in capacitance of the second sensor SP2.

[0107] In embodiments of this disclosure, the capacitance provided by the second sensor SP2 and another component can change when external pressure is applied. The input sensing drive circuit TIC can determine whether external pressure has been applied by detecting the change in capacitance between the second sensor SP2 and the other component.

[0108] When the display module DM is not bent, the separation distance between the second sensor SP2 and the effective area ACA can be adjusted as needed. When the display module DM is bent, as the separation distance between the second sensor SP2 and the effective area ACA changes, the sensor can be adjusted to engage or contact a specific part of the second sensor SP2 and the effective area ACA.

[0109] In embodiments of this disclosure, the data driving circuit DIC may be stacked with the third portion PT3 of the substrate component BL. In a plan view defined by the first direction DR1 and the second direction DR2, the data driving circuit DIC may be disposed between the second sensor SP2 and the pad PD.

[0110] The data drive circuit DIC can be electrically connected to the pixel PX in the effective area ACA and provide data signals to the pixel PX.

[0111] The pad PD may include multiple first pads PD1, multiple second pads PD2, and multiple third pads PD3.

[0112] The first pad PD1 can transmit electrical signals to the pixel PX via the data drive circuit DIC. In embodiments of this disclosure, the first pad PD1 can be electrically connected to transistors T1 to T7 of the pixel PX (see reference). Figure 4 At least one of them.

[0113] The second pad PD2 can be electrically connected to the first sensor SP1. Each of the second pads PD2 can be electrically connected to one of the first sensor section IE1 and the second sensor section IE2.

[0114] The third pad PD3 can be electrically connected to the second sensor SP2. Although in Figure 2 One of the third pads PD3 is electrically connected to the third sensor section IE3, and the other is electrically connected to the fourth sensor section IE4, but the embodiments of this disclosure are not limited thereto. In another embodiment of this disclosure, as the number of electrodes included in the second sensor SP2 increases, the number of third pads PD3 may also increase accordingly.

[0115] The printed circuit board (PCB) can be electrically connected to the pad PD. The input sensing drive circuit (TIC) and the control drive circuit (CIC) can be mounted on the PCB.

[0116] The input sensing drive circuit TIC can detect changes in the capacitance of the first sensor SP1 using the second pad PD2, and changes in the capacitance of the second sensor SP2 using the third pad PD3. Therefore, the input sensing drive circuit TIC can detect user touches and externally applied pressure applied to the effective area ACA.

[0117] The control drive circuit CIC can control at least one of the data drive circuit DIC and the input sensing drive circuit TIC.

[0118] As the portion corresponding to the second part PT2 (or the bent area) of the substrate component BL of the display module DM is bent, the second sensor SP2 can be configured to overlap with the effective area ACA. The area of ​​the effective area ACA overlapping with the second sensor SP2 can be defined as the pressure sensing area FSA.

[0119] An anti-reflective component RPM can be disposed between the display module DM and the window component WM. In embodiments of this disclosure, the anti-reflective component RPM can be a polarizing film or a polarizing sheet.

[0120] The window component WM may include a transparent component TM and a black matrix BM. The transparent component TM may include a transparent material. For example, the transparent component TM may include glass or synthetic resin.

[0121] A black matrix BM with a set or predetermined color can be set on the bottom surface of the transparent component TM. The border area BZA of the window component WM can be defined by the black matrix BM.

[0122] The component ST may include a bottom ST-B and a side ST-S. The side ST-S may extend from one side of the bottom ST-B toward the window component WM. The side ST-S and the window component WM may be joined together by a side adhesive AD-S.

[0123] In embodiments of this disclosure, the bottom ST-B may include a protrusion ST-P projecting toward the display module DM. A buffer (e.g., a buffer member) CSH may be disposed between the top surface SF of the protrusion ST-P and the second sensor SP2. In embodiments of this disclosure, at least a portion of the top surface SF and at least a portion of the second sensor SP2 may not overlap with the buffer CSH.

[0124] When pressure is applied to the pressure sensing area FSA, the separation distance LL between the top surface SF of the protrusion ST-P and the second sensor SP2 can change. Therefore, the capacitance formed between the third sensor portion IE3 and the fourth sensor portion IE4 of the second sensor SP2 can change. Optionally, the capacitance formed between the top surface SF of the protrusion ST-P and each of the third sensor portion IE3 and the fourth sensor portion IE4 of the second sensor SP2 can change.

[0125] The first protective film PF1 and the second protective film PF2 can support the base component BL. The adhesive component AD is disposed between the first protective film PF1 and the second protective film PF2. The adhesive component AD bonds the first protective film PF1 and the second protective film PF2 together.

[0126] Figure 4 This is an equivalent circuit diagram illustrating a pixel PX according to an embodiment of the present disclosure. Figure 5A and Figure 5B This is a cross-sectional view showing a display module DM according to an embodiment of the present disclosure. Figure 5A For ease of description, the following are shown together: Figure 2 The cross sections taken from lines II-II' and III-III' in the middle, and Figure 5B In the middle, the corresponding Figure 5A The area.

[0127] A pixel PX may include a light-emitting element (LD) and a pixel circuit CC. The pixel circuit CC may include multiple transistors T1 to T7 and a capacitor CPT. The pixel circuit CC responds to a data signal to control the amount of current flowing through the light-emitting element LD.

[0128] In embodiments of this disclosure, the pixel circuit CC can receive data signals from data line DL, scan signals from scan lines SLi-1, SLi, and SLi+1, light emission control signals from light emission signal control line ECLi, and a first power ELVDD from power line PL. Furthermore, the pixel circuit CC can receive a second power ELVSS and an initialization voltage Vint.

[0129] A light-emitting element (LD) can emit light to a set or predetermined brightness in response to the amount of current supplied from the pixel circuit CC. The LD can be an organic light-emitting element (OLED) or a micro-LED. In the following text, the LD is described as an organic light-emitting element (OLED).

[0130] Although Figure 4 The equivalent circuit of pixel PX is shown, but in another embodiment of this disclosure, the type of signal applied to the transistor, the number of transistors, the connection relationship between the transistors, or the number of capacitors can be changed.

[0131] Although Figure 4 A PMOS is shown, but embodiments of this disclosure are not limited thereto. In another embodiment of this disclosure, a pixel PX may include an NMOS. In yet another embodiment of this disclosure, a pixel PX may include a combination of NMOS and PMOS.

[0132] exist Figure 5A and Figure 5B In each of these, a cross-sectional view of a portion of the display area DA and a cross-sectional view of a portion of the area in which the second sensor SP2 is disposed are shown together. Although in Figure 5A The first transistor T1 and the second transistor T2 are shown, but embodiments of this disclosure do not limit the structure of each of the first transistor T1 and the second transistor T2.

[0133] Each of transistors T1 and T2 may include a first electrode ED1, a second electrode ED2, a first control electrode GE1, and an active component ACL.

[0134] The second electrode ED2 of the first transistor T1 may not directly contact the anode electrode AE ​​of the pixel PX, and the first transistor T1 may be connected to the anode electrode AE ​​of the pixel PX via the sixth transistor T6. However, embodiments of this disclosure are not limited thereto. For example, in another embodiment of this disclosure, the second electrode ED2 of the first transistor T1 may directly contact the anode electrode AE ​​of the pixel PX.

[0135] Display panel DP (reference) Figure 3 It may include a substrate component BL, a barrier layer CPL and a BRL, a circuit layer CL, a light-emitting element layer ELL, and a packaging layer TFE.

[0136] The circuit layer CL may include a buffer layer BFL, gate insulating layers GI1 and GI2, interlayer insulating layer ILD, circuit insulating layer VIA, and transistors T1 and T2.

[0137] The light-emitting element layer ELL may include light-emitting elements LD and pixel-defining layers PDL.

[0138] The encapsulation layer TFE can seal the light-emitting element layer ELL to protect it from external oxygen and / or moisture.

[0139] The blocking layer CPL and BRL may include multiple first metal pattern CPLs and a cover layer BRL covering the first metal pattern CPLs.

[0140] The first metallic pattern CPL can be disposed on the substrate component BL. The electrodes of the first metallic pattern CPL can be stacked with the active component ACL respectively.

[0141] The cover layer BRL may comprise organic or inorganic materials. In embodiments of this disclosure, the cover layer BRL may provide a flat surface.

[0142] A buffer layer BFL can be disposed on the overlay layer BRL. In embodiments of this disclosure, the buffer layer BFL can suppress or prevent foreign matter present in the substrate member BL from being introduced into the pixel PX.

[0143] The active components ACL of transistors T1 and T2 are disposed on the buffer layer BFL. Each of the active components ACL may comprise polycrystalline silicon or amorphous silicon. Furthermore, the active components ACL may comprise metal-oxide-semiconductor.

[0144] The active component ACL may include a channel region and a first ion-doped region and a second ion-doped region. The channel region serves as a channel through which electrons or holes can move, and the first ion-doped region and the second ion-doped region are configured such that the channel region is located between them.

[0145] A first gate insulating layer GI1 covering the active component ACL is disposed on the buffer layer BFL. The first gate insulating layer GI1 includes an organic layer and / or an inorganic layer. The first gate insulating layer GI1 may include a plurality of inorganic thin films. Each of the plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0146] The first control electrode GE1 of transistors T1 and T2 is disposed on the first gate insulating layer GI1. The first control electrode GE1 of the first transistor T1 can be one of the two electrodes of capacitor CPT.

[0147] A second gate insulating layer GI2 covering the first control electrode GE1 is disposed on the first gate insulating layer GI1. The second gate insulating layer GI2 includes an organic layer and / or an inorganic layer. The second gate insulating layer GI2 may include a plurality of inorganic thin films. Each of the plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0148] Capacitor CPT (reference) Figure 4 The other electrode GE2 (hereinafter referred to as the second control electrode) of the two electrodes can be disposed on the second gate insulating layer GI2. That is, the first control electrode GE1 disposed on the first gate insulating layer GI1 and the second control electrode GE2 disposed on the second gate insulating layer GI2 can be stacked on top of each other to provide (form) Figure 4 The capacitor CPT is used in this process. However, the embodiments of this disclosure do not limit the arrangement of the electrodes of the capacitor CPT.

[0149] The second control electrode GE2 may be stacked with the first control electrode GE1 of the first transistor T1 in a planar view, and may not be stacked with the second control electrode GE2 of the second transistor T2 in a planar view (in the thickness direction). The second control electrode GE2 is stacked with the channel region of the active component ACL of the first transistor T1. According to an embodiment, the capacitor CPT disposed by the first control electrode GE1 and the second control electrode GE2 may be stacked with the first transistor T1 and separated from the second transistor T2. However, the embodiments of this disclosure are not limited thereto. For example, the capacitor CPT may be stacked with the second transistor T2 or multiple capacitors may be disposed to be stacked with the first transistor T1 and the second transistor T2 respectively.

[0150] An interlayer insulating layer (ILD) covering the second control electrode GE2 is disposed on the second gate insulating layer GI2. The ILD includes an organic layer and / or an inorganic layer. The ILD may include multiple inorganic thin films. Each of the multiple inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0151] The first electrode ED1 and the second electrode ED2 of each of transistors T1 and T2 can be disposed on the interlayer insulating layer ILD.

[0152] The first electrode ED1 and the second electrode ED2 can be connected to the corresponding active components ACL through contact holes passing through the gate insulating layers GI1 and GI2 and the interlayer insulating layer ILD, respectively.

[0153] A circuit insulating layer VIA covering the first electrode ED1 and the second electrode ED2 is disposed on the interlayer insulating layer ILD. The circuit insulating layer VIA comprises an organic layer and / or an inorganic layer. The circuit insulating layer VIA can provide a flat surface.

[0154] The pixel limiting layer (PDL) and the light-emitting element (LD) are disposed on the circuit insulating layer (VIA).

[0155] A light-emitting element (LD) may include an anode electrode AE, a hole control layer HL, a light-emitting layer EML, an electronic control layer EL, and a cathode electrode CE.

[0156] An encapsulation layer TFE is disposed on the light-emitting element layer ELL to cover the light-emitting element LD. A first sensor SP1 is disposed on the encapsulation layer TFE. In an embodiment, the first sensor portion IE1 and the second sensor portion IE2 are disposed in different layers. Specifically, the first sensor portion IE1 may be disposed between the encapsulation layer TFE and the first sensing insulating layer ISL1, while the second sensor portion IE2 may be disposed between the first sensing insulating layer ISL1 and the second sensing insulating layer ISL2. However, the embodiments disclosed herein are not limited to this. For example, the first sensor portion IE1 and the second sensor portion IE2 may be disposed on the same layer, or partially disposed on different layers to intersect each other insulatedly in a plan view (to intersect and be insulated from each other in a plan view).

[0157] like Figure 5A As shown, the second sensor SP2 can be disposed on the same layer as the first metal pattern CPL. The second sensor SP2 (or a portion thereof) can be superimposed on a pre-defined or predetermined signal line SSL. Figure 5A In this embodiment, the second sensor SP2 is shown as a portion of the third sensor unit IE3. Although in this embodiment the third sensor unit IE3 and the fourth sensor unit IE4 are disposed on the same layer, the embodiments disclosed herein are not limited thereto. For example, the third sensor unit IE3 and the fourth sensor unit IE4 may be disposed on different layers from each other.

[0158] The signal line SSL may include a first line L1 and a second line L2 disposed on different layers. The first line L1 is disposed between gate insulating layers GI1 and GI2, and the second line L2 is disposed between the second gate insulating layer GI2 and the interlayer insulating layer ILD. However, embodiments of this disclosure are not limited thereto. For example, the signal line SSL according to embodiments of this disclosure may include lines disposed on the same layer.

[0159] The signal line SSL may include a data fan-out line connecting the pixel PX and the data driving circuitry. The data fan-out line may be configured such that a portion of the data line DL extends or that the data line DL contacts a data line DL disposed on another layer. In an embodiment, the signal line SSL is disposed on the same layer as the first control electrode GE1. However, embodiments of this disclosure are not limited thereto. For example, the signal line SSL may include a line connected to a power line PL that provides power voltage or a line connected to a gate line GL that provides a gate signal.

[0160] Since the second sensor SP2 is disposed on the same layer as the first metal pattern CPL, the second sensor SP2 can be superimposed on the signal line SSL without being electrically short-circuited to the signal line SSL. Therefore, because the previously existing (disposed) area can be used to dispose of the second sensor SP2, the process (e.g., manufacturing process) can be simplified, and process costs can be reduced or saved.

[0161] Optionally, such as Figure 5B As shown, the second sensor SP2 can be disposed on the same layer as the first sensor SP1. The second sensor SP2 is disposed on the encapsulation layer TFE. The second sensor SP2 is separated from the first sensor SP1 in the plan view. In one or more embodiments, since the second sensor SP2 is separated from the signal line connecting the first sensor SP1 to the second pad PD2 in the plan view, electrical short circuits between the first sensor SP1 and the second sensor SP2 can be prevented. In an exemplary embodiment, some or all of the sensing insulating layers ISL1 and ISL2, the encapsulation layer TFE, the light-emitting element layer ELL, and the circuit layer CL may not be disposed on the third portion PT3; in this case, the second sensor SP2 can still be formed in the same process as the first sensor SP1 and formed on the third portion PT3.

[0162] Figure 6A This is a plan view showing a display module DM-0 according to an embodiment of the present disclosure. Figure 6B This is a cross-sectional view showing a display module DM-0 according to an embodiment of the present disclosure.

[0163] like Figure 6A and Figure 6B As shown, the display module DM-0 according to an embodiment of this disclosure may further include a sealing pattern BLP. The sealing pattern BLP may be superimposed on the second sensor SP2 in a plan view. The sealing pattern BLP may be completely superimposed on the second sensor SP2.

[0164] The sealing pattern BLP can be conductive and includes a conductive material. The sealing pattern BLP can be connected to the sealing conductive line BLL and receive electrical signals from the outside via the fourth pad PD4. The sealing pattern BLP can receive electrical voltages. For example, the sealing pattern BLP can receive VSS voltage. However, embodiments of this disclosure are not limited thereto. For example, the sealing pattern BLP can receive various voltages as long as it is a DC power source.

[0165] The sealing pattern BLP can be disposed in cross-section between the second sensor SP2 and the signal line SSL. In an embodiment, the sealing pattern BLP is disposed on the same layer as the first electrode ED1 and the second electrode ED2 of transistors T1 and T2. However, the embodiments of this disclosure are not limited thereto. For example, the sealing pattern BLP can be disposed on various suitable layers as long as it is disposed between the signal line SSL and the second sensor SP2.

[0166] The sealing pattern BLP prevents electrical interference between the second sensor SP2 and the signal line SSL. Because the sealing pattern BLP prevents the formation of capacitance (such as parasitic capacitance) between the second sensor SP2 and the signal line SSL, the second sensor SP2 can reliably detect external input regardless of the signal line SSL.

[0167] Figure 7 This is a plan view showing a display module DM-1 according to an embodiment of the present disclosure. Figure 8 It shows along Figure 1A A view of a portion of the cross section cut by line I-I'.

[0168] The second sensor SP2-1 may be stacked with the third part PT3 of the substrate component BL. In embodiments of this disclosure, the second sensor SP2-1 may include a strain gauge.

[0169] When pressure is applied from the outside to the pressure sensing area FSA, the resistance value of the second sensor SP2-1 can change. The pressure sensing drive circuit (i.e., the input sensing drive circuit) TIC-1, mounted on the printed circuit board PCB, can detect the change in resistance value of the second sensor SP2-1 and determine whether pressure has been applied from the outside.

[0170] Because the change in the resistance value of the second sensor SP2-1 is caused by the change in the length of the second sensor SP2-1, therefore... Figure 3 The difference shown is not the same. Figure 8 The bottom ST-B may not include the protrusion ST-P (see reference). Figure 3 ).

[0171] also, Figure 7 and Figure 8 Descriptions of other components in Figures 2 to 5B The descriptions of the other components are essentially the same, so they are omitted.

[0172] Figure 9 This is a plan view showing a display module DM-2 according to an embodiment of the present disclosure. Figure 10 It shows along Figure 1A A view of a portion of the cross section cut by line I-I'.

[0173] The second sensor SP2-2 can be stacked with the third part PT3 of the base member BL. In embodiments of this disclosure, the second sensor SP2-2 may include a third sensor part IE3-1 and a fourth sensor part IE4-1. The third sensor part IE3-1 and the fourth sensor part IE4-1 can be stacked on each other on the third-direction DR3. The third sensor part IE3-1 and the fourth sensor part IE4-1 can be stacked with the protrusion ST-P.

[0174] The third sensor unit IE3-1 can be disposed near (relatively closer to) the surface of the base member BL, and the fourth sensor unit IE4-1 can be disposed near (relatively closer to) the surface of the protrusion ST-P.

[0175] The third sensor unit IE3-1 can be electrically connected to one of the third pads PD3, and the fourth sensor unit IE4-1 can be electrically connected to the other of the third pads PD3.

[0176] When pressure is applied externally to the pressure sensing area FSA, the separation distance LL-1 between the third sensor unit IE3-1 and the fourth sensor unit IE4-1 can change. When the separation distance LL-1 changes, the capacitance provided between the third sensor unit IE3-1 and the fourth sensor unit IE4-1 can change. The input sensing drive circuit TIC mounted on the printed circuit board PCB can detect this change in capacitance to determine whether external pressure has been applied.

[0177] Figure 11 and Figure 12 This is a plan view showing display modules DM-3 and DM-4 according to embodiments of the present disclosure.

[0178] Reference Figure 11 The display module DM-3 may include a second sensor SP2-3 disposed in the effective area ACA.

[0179] The second sensor SP2-3 may include a third sensor section IE3-2 and a fourth sensor section IE4-2. The third sensor section IE3-2 and the fourth sensor section IE4-2 may be arranged adjacent to each other. In this specification, the third sensor section IE3-2 and the fourth sensor section IE4-2 of the second sensor SP2-3 may be referred to as the second metal pattern.

[0180] The third sensor unit IE3-2 and the fourth sensor unit IE4-2 can be electrically connected to the third pad PD3 via signal line SL. In this specification, the third pad PD3 may be referred to as the third metal pattern.

[0181] Reference Figure 5A and Figure 11 Each of the third sensor unit IE3-2 and the fourth sensor unit IE4-2 can be disposed on the same layer as the first metal pattern CPL, and at least a portion of the signal line SL can be disposed on the same layer as the first metal pattern CPL. That is, at least a portion of the third sensor unit IE3-2, the fourth sensor unit IE4-2, and the signal line SL can be disposed on the same layer as the first metal pattern CPL using the same process.

[0182] When pressure is applied to the area of ​​the effective region ACA that overlaps with the second sensor SP2-3, the capacitance located between the third sensor section IE3-2 and the fourth sensor section IE4-2 can change. The input sensing drive circuit TIC mounted on the printed circuit board PCB can detect this change in capacitance to determine whether pressure has been applied externally.

[0183] Reference Figure 12 The display module DM-4 may include a second sensor SP2-4 disposed in the effective area ACA. The second sensor SP2-4 may include a strain gauge.

[0184] The second sensor SP2-4 can be electrically connected to the third pad PD3 via signal line SL.

[0185] Reference Figure 5A and Figure 12 The second sensor SP2-4 can be disposed on the same layer as the first metal pattern CPL, and at least a portion of the signal line SL can be disposed on the same layer as the first metal pattern CPL. That is, the second sensor SP2-4 and at least a portion of the signal line SL can be disposed on the same layer as the first metal pattern CPL using the same process.

[0186] When pressure is applied to the pressure sensing area FSA, the resistance value of the second sensor SP2-4 can change. The pressure sensing drive circuit TIC-1, mounted on the printed circuit board PCB, can detect the change in resistance value of the second sensor SP2-4 and determine whether pressure has been applied from the outside.

[0187] According to one or more embodiments of the present disclosure, a display module capable of detecting a user's touch and pressure applied by the user, and a display device including the display module, may be provided.

[0188] While exemplary embodiments of the invention have been described, it is understood that the invention should not be limited to these exemplary embodiments, and various changes and modifications can be made by those skilled in the art within the spirit and scope of the claimed invention. Therefore, to the fullest extent permitted by law, the scope of the invention will be determined by the widest permissible interpretation of the claims and their equivalents, and should not be constrained or limited by the foregoing detailed description.

Claims

1. A display module, the display module comprising: The base component includes a first portion, a second portion extending from the first portion, and a third portion extending from the second portion; A circuit layer, located on the first portion of the substrate component, includes a plurality of transistors; A light-emitting element layer, located on the circuit layer, includes a plurality of light-emitting elements electrically connected to the plurality of transistors; An encapsulation layer is configured to seal the light-emitting element layer; The first sensor is located on the encapsulation layer; as well as A second sensor, located on the third portion of the base component, is used to detect pressure applied from the outside. When the second part of the base component bends, the second sensor overlaps with the first part of the base component.

2. The display module according to claim 1, further comprising: Multiple pads, including multiple first pads configured to transmit electrical signals to the multiple transistors, multiple second pads electrically connected to the first sensor, and multiple third pads electrically connected to the second sensor, are stacked with the third portion of the substrate member; A printed circuit board electrically connected to the plurality of pads; as well as An input sensing drive circuit is mounted to the printed circuit board and electrically connected to the plurality of second pads and the plurality of third pads.

3. The display module according to claim 2, the display module further comprising a data driving circuit, the data driving circuit being located between the plurality of pads and the second sensor, and electrically connected to the plurality of first pads.

4. The display module according to claim 1, wherein, The second sensor includes multiple electrodes, and When pressure is applied from the outside, the capacitance provided by the plurality of electrodes changes.

5. The display module according to claim 1, wherein, The second sensor includes a strain gauge.

6. The display module according to claim 1, wherein, The first sensor and the second sensor contain the same material.

7. The display module according to claim 1, wherein, The first part, the second part, and the third part are integrally formed to provide the base component, and Each of the first part, the second part, and the third part comprises polyimide.

8. The display module according to claim 1, the display module further comprising a buffer that contacts a portion of the second sensor.

9. A display device, the display device comprising: The display module is configured to display images; as well as A component is provided, configured to accommodate the display module. The display module includes: The base component includes a first portion, a second portion extending from the first portion, and a third portion extending from the second portion; A circuit layer, located on the first portion of the substrate component, includes a plurality of transistors; A light-emitting element layer, located on the circuit layer, includes a plurality of light-emitting elements electrically connected to the plurality of transistors; An encapsulation layer is configured to seal the light-emitting element layer; The first sensor is located on the encapsulation layer; and A second sensor, located on the third portion of the base component, is used to detect pressure applied from the outside. When the second part of the base component bends, the second sensor overlaps with the first part of the base component.

10. The display device according to claim 9, wherein, The display module further includes: Multiple pads, including multiple first pads configured to transmit electrical signals to the multiple transistors, multiple second pads electrically connected to the first sensor, and multiple third pads electrically connected to the second sensor, are stacked with the third portion of the substrate member; Printed circuit board, electrically connected to the plurality of pads; and An input sensing drive circuit is mounted to the printed circuit board and electrically connected to the plurality of second pads and the plurality of third pads.

11. The display device according to claim 10, wherein, The setting component includes: The bottom includes a protrusion overlapping the second sensor; and Side portion, extending from the side of the bottom.

12. The display device according to claim 11, further comprising a buffer located between the protrusion at the bottom and the second sensor.

13. The display device according to claim 11, wherein, The second sensor includes: A first sensor portion, stacked with the protrusion and adjacent to the surface of the base member; and The second sensor portion overlaps with the protrusion and is adjacent to the surface of the protrusion, and The display device further includes a buffer located between the first sensor section and the second sensor section.

14. The display device according to claim 10, wherein, The display module further includes a data driving circuit located between the plurality of pads and the second sensor, and the data driving circuit is electrically connected to the plurality of first pads.

15. The display device according to claim 9, wherein, The second sensor includes multiple electrodes, and When pressure is applied from the outside, the capacitance provided by the plurality of electrodes changes.

16. The display device according to claim 9, wherein, The second sensor includes a strain gauge.

17. The display device according to claim 9, wherein, The image includes a home button image located at a fixed position on the display device, and The second sensor is overlaid with the home button image.

18. A display module, the display module comprising: The base component includes a first portion, a second portion extending from the first portion, and a third portion extending from the second portion; A barrier layer comprising a plurality of metal patterns located on the substrate component; A circuit layer, located on the barrier layer, and including a plurality of transistors stacked with the first portion of the substrate member, wherein the plurality of transistors include a plurality of active components; and A light-emitting element layer, located on the circuit layer, includes a plurality of light-emitting elements electrically connected to the plurality of transistors. The plurality of metal patterns in the barrier layer include: A first metal pattern is superimposed on the plurality of active components; A second metal pattern is superimposed on the first portion of the base component; and The third metal pattern is superimposed on the third portion of the substrate member and electrically connected to the second metal pattern.

19. The display module according to claim 18, further comprising: A printed circuit board electrically connected to the third metal pattern; as well as An input sensing drive circuit is mounted on the printed circuit board and electrically connected to the third metal pattern.

20. The display module according to claim 19, wherein, The input sensing drive circuit is used to detect changes in the capacitance of the second metal pattern or changes in the resistance value of the second metal pattern.

Images