Display device

Abstract

The display device includes a panel portion and a protective window portion coupled to the panel portion. The panel portion includes: a substrate; a support film disposed on the lower portion of the substrate; a driving element disposed on the substrate and including an active pattern; and a UV blocking member disposed on the lower portion of the driving element.

Description

Technical Field

[0001] This invention relates to display devices, and more specifically, to display devices having UV blocking components and a method for manufacturing display devices having curved portions. Background Technology

[0002] Recently, in order to improve the design and usability of display devices, display devices with partially bent or flexed shapes have been developed.

[0003] Therefore, there is a need to develop an effective method for forming curved areas in display devices. Summary of the Invention

[0004] The purpose of this invention is to provide a display device with a UV blocking layer.

[0005] Another object of the present invention is to provide a method for manufacturing a display device having a curved portion.

[0006] However, the present invention is not limited to the above-described objectives, and various extensions can be made without departing from the spirit and scope of the present invention.

[0007] To achieve the aforementioned objectives of the present invention, the exemplary embodiments of the present invention relate to a display device including a panel portion and a protective window portion coupled to the panel portion. The panel portion includes: a substrate; a support film disposed on the lower portion of the substrate; a driving element disposed on the substrate and including an active pattern; and a UV blocking member disposed on the lower portion of the driving element.

[0008] According to one embodiment, the UV blocking component includes at least one selected from the group consisting of metal oxides, dyes, pigments, and carbon-based light-blocking materials.

[0009] According to one embodiment, the UV blocking component includes a UV blocking layer bonded to at least one side of the support film.

[0010] According to one embodiment, the UV blocking component includes UV blocking particles dispersed within the support film.

[0011] According to one embodiment, the UV blocking component includes a UV blocking layer bonded to the lower surface of the substrate.

[0012] According to one embodiment, the UV blocking component includes UV blocking particles dispersed within the substrate.

[0013] According to one embodiment, the panel portion includes a buffer layer disposed between the substrate and the active pattern, and the UV blocking component includes a UV shielding layer disposed between the buffer layer and the substrate.

[0014] According to one embodiment, the panel portion includes a buffer layer disposed between the substrate and the active pattern, the buffer layer including an upper buffer layer and a lower buffer layer, and the UV blocking component including a UV blocking layer disposed between the upper buffer layer and the lower buffer layer.

[0015] According to one embodiment, the UV blocking component includes at least one selected from the group consisting of zinc oxide and titanium oxide.

[0016] According to one embodiment, the display device further includes: a front surface region having a flat shape; and a side region having at least a portion of curvature.

[0017] An embodiment of the present invention relates to a method for manufacturing a display device, comprising: a step of bonding a panel portion and a guide film by means of a guide adhesive member, wherein the panel portion includes a substrate, a support film disposed on the lower part of the substrate, a driving element disposed above the substrate and including an active pattern, and a UV blocking member disposed on the lower part of the driving element; a step of contacting the lower surface of the guide film with a mounting pad; a step of bonding the guide film tightly to the upper and lower surfaces of the mounting pad to form a curved region of the panel portion bonded to the guide film; a step of bonding the panel portion and a protective window portion; a step of separating the mounting pad from the guide film; a step of irradiating the guide adhesive member with UV light through the lower surface of the guide film; and a step of separating the guide film from the panel portion.

[0018] (Invention Effects)

[0019] According to an exemplary embodiment of the present invention, by providing a UV blocking member at the lower part of the active pattern of the display device, it is possible to prevent the driving element including the active pattern from being degraded by UV. Attached Figure Description

[0020] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present invention.

[0021] Figure 2 as well as Figure 3 This is a side view showing a display device according to various embodiments of the present invention.

[0022] Figure 4 This is a cross-sectional view of the display area of ​​a display device according to an embodiment of the present invention.

[0023] Figures 5 to 10 This is a partially enlarged cross-sectional view showing the display device involved in various embodiments of the present invention.

[0024] Figures 11 to 14This is a cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention. Detailed Implementation

[0025] Hereinafter, with reference to the accompanying drawings, exemplary embodiments of the display device and a method for manufacturing the display device according to the present invention will be described in detail. In the drawings, the same or similar constituent elements are given the same or similar reference numerals.

[0026] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present invention. Figure 2 as well as Figure 3 This is a side view illustrating a display device according to various embodiments of the present invention. Specifically, Figure 2 as well as Figure 3 It is an enlarged representation Figure 1 Side view of region A.

[0027] Reference Figure 1 as well as Figure 2 An embodiment of the present invention relates to a display device 10 including a front surface region FA and a side region SA. The display device 10 can be partially bent or flexed to have the side region SA. However, for ease of explanation, Figure 1 The display device 10 is shown in its flat, unbent state.

[0028] The front surface region FA can have a flat shape. For example, the front surface region FA can extend in a horizontal direction. An array of pixels PX is configured in the front surface region FA, so that light can be emitted according to a driving signal.

[0029] According to one embodiment, the side region SA may include a curved region BA with curvature and a vertical region VA extending from the curved region BA in a vertical direction. For example, the curved region BA may have curvature relative to an axis extending in a first direction D1.

[0030] Pixel arrays can be configured in the curved region BA and the vertical region VA to serve as display areas. However, the embodiments of the present invention are not limited thereto, and at least one of the curved region BA and the vertical region VA may be a non-display area that does not include a pixel array.

[0031] In addition, refer to Figure 3 The side region SA of the display device 20 may have an overall curvature. The side region SA may or may not include a pixel array.

[0032] Figure 4 This is a cross-sectional view of the display area of ​​a display device according to an embodiment of the present invention. Figure 4This represents the display area DA, which includes pixels PX.

[0033] Reference Figure 4 The pixel unit configured in the display area DA may include a driving element configured on the substrate 110 and a light-emitting element electrically connected to the driving element. According to one embodiment, the light-emitting element may be an organic light-emitting diode.

[0034] A support film 400 supporting the substrate 110 may be disposed on the lower surface of the substrate 110. The support film 400 may be bonded to the substrate 110 by a lower adhesive member AD1. The lower adhesive member AD1 may be an adhesive or adhesive film including acrylic resin. According to one embodiment, the support film 400 may be patterned to reduce pressure caused by folding in bending areas. For example, the support film 400 may include polymers such as polymethyl methacrylate (PMMA), polycarbonate (PC), and polyethylene terephthalate (PET).

[0035] A buffer layer 120 may be disposed on the substrate 110. An active pattern AP may be disposed on the buffer layer 120.

[0036] For example, the substrate 110 may be formed of a highly flexible polymer material. For example, the substrate 110 may include polyethylene terephthalate, polyethylene naphthalate, polyetheretherketone, polycarbonate, polyarylate, polyethersulfone, polyimide, or combinations thereof. In other embodiments, the substrate 110 may also include a hard material such as glass, quartz, or sapphire.

[0037] The buffer layer 120 can reduce or block the penetration of foreign matter, moisture, or external air from the lower part of the substrate 110, and can planarize the upper surface of the substrate 110. For example, the buffer layer 120 may include silicon oxide, silicon nitride, silicon carbide, or a combination thereof.

[0038] A gate electrode GE may be configured on the active pattern AP, and a first insulating layer 130 may be configured between the active pattern AP and the gate electrode GE.

[0039] A gate wiring pattern GP may be configured on the gate electrode GE. The gate wiring pattern GP may include capacitor electrodes for forming capacitors, wiring for transmitting various signals, etc.

[0040] A second insulating layer 140 may be disposed between the gate electrode GE and the gate wiring pattern GP. A third insulating layer 150 may be disposed on the gate wiring pattern GP.

[0041] For example, the active patterned AP may include silicon or a metal-oxide-semiconductor. According to one embodiment, the active patterned AP may include polysilicon, which may be doped with N-type or P-type impurities.

[0042] In other embodiments, or in other transistors not shown, the active pattern may include a metal-oxide-semiconductor (MODS). For example, the active pattern may include a two-component compound (AB) containing indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. x ), three-component compound (AB) x C y ), tetra-component compound (AB) x C y D z For example, the second active pattern may include zinc oxide (ZnO). x Gallium oxide (GaO) x Titanium oxide (TiO) x ), Tin oxide (SnO) x Indium oxide (InO) x Indium gallium oxide (IGO), indium zinc oxide (IZO), indium tin oxide (ITO), gallium zinc oxide (GZO), zinc magnesium oxide (ZMO), zinc tin oxide (ZTO), zinc zirconium oxide (ZnZr) x Indium gallium zinc oxide (IGZO), indium zinc tin oxide (IZTO), indium gallium hafnium oxide (IGHO), tin aluminum zinc oxide (TAZO), and indium gallium tin oxide (IGTO), etc.

[0043] The first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 may include silicon oxide (SiO2). x ), silicon nitride (SiN) x The insulating layer may include silicon carbide or combinations thereof, or insulating metal oxides such as aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and titanium oxide. For example, the first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 may each have a single layer or multiple layers of silicon nitride or silicon oxide, and may have different structures.

[0044] The gate electrode GE and the gate wiring pattern GP can include metals, metal alloys, metal nitrides, conductive metal oxides, etc. For example, the gate electrode GE can include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and can have a multilayer structure including a single layer or different metal layers. According to one embodiment, the gate electrode GE and the gate wiring pattern GP can have a multilayer structure including molybdenum.

[0045] A first source metal pattern may be disposed on the third insulating layer 150. The first source metal pattern may include a source electrode SE and a drain electrode DE that are in contact with the active pattern AP. The source electrode SE and the drain electrode DE may respectively penetrate the lower insulating layer to contact the active pattern AP.

[0046] A fourth insulating layer 160 may be disposed on the first source metal pattern. A second source metal pattern may be disposed on the fourth insulating layer 160. The second source metal pattern may include a connection electrode CE for electrically connecting the drain electrode DE to the organic light-emitting diode 210. According to one embodiment, the second source metal pattern may further include a mesh power wiring, etc., for preventing voltage drop of the power supplied to the organic light-emitting diode 210. A fifth insulating layer 170 may be disposed on the second source metal pattern.

[0047] The first and second source metal patterns may include metals, metal alloys, metal nitrides, conductive metal oxides, etc. For example, the first and second source metal patterns may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and may have a multilayer structure including a single layer or different metal layers. According to one embodiment, the first and second source metal patterns may have a multilayer structure including aluminum. For example, the first and second source metal patterns may have a stacked structure of aluminum and titanium layers.

[0048] The fourth insulating layer 160 and the fifth insulating layer 170 may include organic materials. For example, the fourth insulating layer 160 and the fifth insulating layer 170 may include organic insulating materials such as phenolic resin, acrylic resin, polyimide resin, polyamide resin, silicone resin, epoxy resin, etc.

[0049] An organic light-emitting diode (OLED) 210 may be disposed on the fifth insulating layer 170. The OLED 210 may include a first electrode 212 in contact with the connection electrode CE, a light-emitting layer 214 disposed on the first electrode 212, and a second electrode 216 disposed on the light-emitting layer 214. The light-emitting layer 214 of the OLED 210 may be disposed within an opening of a pixel definition layer 180 disposed on the fifth insulating layer 170. The first electrode 212 may be the lower electrode of the OLED 210, and the second electrode 216 may be the upper electrode.

[0050] The first electrode 212 can function as an anode. For example, the first electrode 212 can be formed by a transmitting electrode or a reflecting electrode, depending on the type of light emission. When the first electrode 212 is formed by a transmitting electrode, it may include indium tin oxide, indium zinc oxide, zinc tin oxide, indium oxide, zinc oxide, tin oxide, etc. When the first electrode 212 is formed by a reflecting electrode, it may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), etc., and may also have a layered structure with the material used in the transmitting electrode.

[0051] The pixel definition layer 180 has an opening that exposes at least a portion of the first electrode 212. For example, the pixel definition layer 180 may include an organic insulating material.

[0052] The light-emitting layer 214 may have a single-layer or multi-layer structure, including at least one of the functional layers such as a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer. The light-emitting layer 214 may include low-molecular-weight organic compounds or high-molecular-weight organic compounds.

[0053] In one embodiment, the light-emitting layer 214 may emit red, green, or blue light. In other embodiments, when the light-emitting layer 214 emits white light, the light-emitting layer 214 may include a multilayer structure comprising a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, or may include a single-layer structure comprising red, green, and blue light-emitting materials.

[0054] The second electrode 216 may be formed by a transmissive electrode or a reflective electrode, depending on the light emission type of the display device including the thin-film transistor substrate. For example, the second electrode 216 may include a metal, an alloy, a metal nitride, a metal fluoride, a conductive metal oxide, or a combination thereof.

[0055] For example, the second electrode 216 may extend continuously over multiple pixels in the display area. According to one embodiment, a capping layer and a blocking layer may also be formed on the second electrode 216.

[0056] The display device may further include an encapsulation layer 220 covering the organic light-emitting diode 210. The encapsulation layer 220 may extend continuously to cover the entire display area DA.

[0057] For example, the encapsulation layer 220 may include a stacked structure of organic and inorganic thin films. For example, such as Figure 4 As shown, the encapsulation layer 220 may include a first inorganic film 222, an organic film 224 disposed on the first inorganic film 222, and a second inorganic film 226 disposed on the organic film 224. However, the embodiments of the present invention are not limited thereto, and the encapsulation layer 220 may also have a structure comprising two or more organic films and three or more inorganic films.

[0058] For example, the organic film 224 may include a polymeric cured material such as polyacrylate. For example, the polymeric cured material may be formed through a cross-linking reaction of monomers. For example, the inorganic films (222, 226) may include silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0059] According to one embodiment, a touch sensing unit may be disposed on the encapsulation layer 220. The touch sensing unit can sense the input position based on contact. The touch sensing unit may be directly formed on the encapsulation layer 220, or a screen panel may be separately fabricated and combined with the encapsulation layer 220.

[0060] For example, a touch sensing electrode TSE and a touch insulating layer 230 covering it may be disposed on the encapsulation layer 220. For example, the touch sensing electrode TSE may include a transparent conductive material such as indium tin oxide or indium zinc oxide.

[0061] A polarizing layer 240 and a protective window 300 may be disposed on the touch sensing part. An adhesive or a transparent adhesive film may be provided between the polarizing layer 240 and the touch sensing part, and between the polarizing layer 240 and the protective window 300. For example, a window adhesive component AD2 may be disposed between the protective window 300 and the polarizing layer 240.

[0062] Hereinafter, the configuration of the support film 400 to the polarizing layer 240 may be referred to as the panel portion PN.

[0063] According to one embodiment, the display device further includes a UV blocking component to prevent the active pattern AP from being degraded by ultraviolet (UV) light incident from below. Various embodiments including the UV blocking component are described below.

[0064] Figures 5 to 10 This is a partially enlarged cross-sectional view of the display device according to various embodiments of the present invention. Specifically, Figure 5 as well as Figure 6 This indicates the substrate and the supporting film. Figures 7 to 10 This refers to the buffer layer, the substrate, and the support film.

[0065] Reference Figure 5 The support film 400 includes a support layer 402 and a UV-blocking layer bonded to at least one side of the support layer 402. According to one embodiment, the support film 400 may include a first UV-blocking layer 404 disposed between the support layer 402 and the lower adhesive member AD1, and a second UV-blocking layer 406 bonded to the lower surface of the support layer 402.

[0066] The UV blocking layer (404, 406) may include a metal oxide capable of absorbing UV radiation. For example, the UV blocking layer (404, 406) may include zinc oxide, titanium oxide, etc. Considering manufacturing processes and efficiency, zinc oxide may be preferred as the material of the UV blocking layer (404, 406).

[0067] For example, the UV blocking layers (404, 406) can be formed by depositing the metal oxide or coating a paste comprising the metal oxide on the support layer 402.

[0068] In other embodiments, the UV blocking layer (404, 406) may also include other inorganic or organic carbon-based light-blocking materials such as pigments, dyes, and carbon black that can absorb UV.

[0069] Reference Figure 6 The support film 410 may include UV-blocking particles 412 dispersed within the support film 410. The UV-blocking particles 412 may include the UV-blocking material already described.

[0070] Reference Figure 7 The substrate 110 may include UV blocking particles 112 dispersed within the substrate 110. The UV blocking particles 112 may include the UV blocking material already described.

[0071] Reference Figure 8The substrate 114 may include a base layer 114a and a UV blocking layer 114b bonded to the lower surface of the base layer 114a. The UV blocking layer 114b may include the UV blocking material already described.

[0072] Reference Figure 9 The buffer layer 120 may include an upper buffer layer 120a and a UV blocking layer 120b disposed between the upper buffer layer 120a and the substrate 110. The upper buffer layer 120a may include silicon oxide, silicon nitride, silicon carbide, or a combination thereof. The UV blocking layer 120b may include the UV blocking materials already described.

[0073] Reference Figure 10 The buffer layer 122 may include an upper buffer layer 122a, a lower buffer layer 122c, and a UV blocking layer 122b disposed between the upper buffer layer 122a and the lower buffer layer 122c. According to one embodiment, the upper buffer layer 122a may include silicon oxide, and the lower buffer layer 122c may include silicon nitride.

[0074] When the UV blocking layers (120b, 122b) comprise metal oxides such as zinc oxide, the relatively high conductivity of the metal oxides may affect the operation of the driving element. Therefore, it is preferable that the UV blocking layers (120b, 122b) included in the buffer layers (120, 122) are located away from the active pattern.

[0075] According to various embodiments of the present invention, by providing a UV blocking component at the lower part of the active pattern of the display device, it is possible to prevent the driving element including the active pattern from being degraded by UV.

[0076] Figures 11 to 14 This is a cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0077] Reference Figure 11 A panel portion PN of a display device is disposed on a guide film 500. The guide film 500 and the display device can be bonded together by a guide adhesive member AD3. The upper surface of the panel portion PN is bonded to a window adhesive member AD2.

[0078] Alternatively, one end of the guide film 500 may be fixed by a first fixing device 622, and the other end may be fixed by a second fixing device 624.

[0079] A mounting pad 612 is disposed below the guide film 500. According to one embodiment, the upper surface and side surfaces of the mounting pad 612 may have a flat upper surface and curved side surfaces to correspond to the lower surface of the protective window portion 300. The mounting pad 612 may be disposed on a support plate 614.

[0080] A protective window 300 is disposed on the panel portion PN that is coupled with the guide film 500. The protective window 300 may have a shape in which the edges are bent.

[0081] The protective window 300 can be fixed by an adsorption device 632. The adsorption device 632 may have a shape corresponding to the curved surface of the protective window 300, and may include a contact portion 636 whose upper surface contacts the protective window 300 and an attachment portion 634 that provides negative pressure.

[0082] Reference Figure 12 This allows the first fixing device 622 and the second fixing device 624 to be lowered or the placement pad 612 to be raised, thereby bringing the upper surface of the placement pad 612 into contact with the lower surface of the guide film 500.

[0083] Then, the two ends of the guide film 500 are moved to bring the guide film 500 into close contact with the upper surface and side surface of the placement pad 612. For example, the first contact member 626, which is coupled to the first fixing device 622, and the second contact member 628, which is coupled to the second fixing device 624, are moved to bring them into close contact with the side surface of the placement pad 612. The placement pad 612 may have grooves formed on the side surface to guide the position of the contact members (626, 628).

[0084] As a result, the guide film 500, the panel portion PN bonded to the guide film 500, and the window adhesive member AD2 bonded to the panel portion PN are deformed to have a curved area along the surface of the mounting pad 612.

[0085] Reference Figure 13 The adsorption device 632 or the mounting pad 612 is moved vertically, thereby adhering the protective window 300 to the window adhesive member AD2. Therefore, the protective window 300 and the panel PN can be combined.

[0086] Reference Figure 14 The placement pad 612 is separated from the guide film 500, and UV light is irradiated from the lower part of the guide film 500. Therefore, UV light is irradiated onto the guide adhesive component AD3 through the lower surface of the guide film 500.

[0087] The guide adhesive component AD3 includes a UV-separable adhesive. The adhesive strength decreases due to UV exposure. Therefore, the guide film 500 can be easily separated from the panel portion PN.

[0088] The lower bonding component of the panel portion PN, which bonds the substrate and the support film, includes a conventional acrylic adhesive of the non-UV separation type. Therefore, the reliability of the panel portion PN does not decrease during the exposure process.

[0089] According to various embodiments of the present invention, the panel portion PN includes a UV blocking component. Therefore, during the separation process of the guide film 500 as described above, the degradation of the driving element due to high-energy UV radiation can be prevented.

[0090] As described above, the invention has been illustrated with reference to exemplary embodiments. However, those skilled in the art should understand that various modifications and alterations can be made to the invention without departing from the spirit and scope of the invention as set forth in the claims.

[0091] (Industry availability)

[0092] This invention is applicable to various display devices. For example, it can be applied to display devices for vehicles, ships, and aircraft, mobile communication devices, display devices for exhibition or information transmission, medical display devices, and other display equipment.

Claims

1. A display device comprising: a panel portion including: a base substrate; a support film disposed at a lower portion of the base substrate, the support film including a support layer and at least one UV blocking layer, the support layer including a polymer substance; a drive element disposed on the base substrate and including an active pattern; and a UV blocking member disposed at a lower portion of the drive element; and a protective window portion coupled to the panel portion, the UV blocking member includes the UV blocking layer coupled to at least one surface of the support layer, the UV blocking member includes at least one selected from the group consisting of zinc oxide, titanium oxide, a dye, a pigment, and a carbon-based light-blocking substance.

2. The display device according to claim 1, further comprising: a front surface region having a flat shape; and a side surface region having at least a portion with a curvature.

3. A display device comprising: a panel portion including: a base substrate; a support film disposed at a lower portion of the base substrate; a drive element disposed on the base substrate and including an active pattern; and a UV blocking member disposed at a lower portion of the drive element; and a protective window portion coupled to the panel portion, the UV blocking member includes UV blocking particles dispersed within the support film, the UV blocking particles including at least one selected from the group consisting of zinc oxide, titanium oxide, a dye, a pigment, and a carbon-based light-blocking substance.

4. A display device comprising: a panel portion including: a base substrate including a base layer and a UV blocking layer; a support film disposed at a lower portion of the base substrate; a drive element disposed on the base substrate and including an active pattern; and a UV blocking member disposed at a lower portion of the drive element; and a protective window portion coupled to the panel portion, the UV blocking member includes the UV blocking layer coupled to a lower surface of the base layer, the UV blocking layer including at least one selected from the group consisting of zinc oxide, titanium oxide, a dye, a pigment, and a carbon-based light-blocking substance.

5. A display device comprising: a panel portion including: a base substrate; a support film disposed at a lower portion of the base substrate; a drive element disposed on the base substrate and including an active pattern; and a UV blocking member disposed at a lower portion of the drive element; and a protective window portion coupled to the panel portion, the UV blocking member includes UV blocking particles dispersed within the base substrate, the UV blocking particles including at least one selected from the group consisting of zinc oxide, titanium oxide, a dye, a pigment, and a carbon-based light-blocking substance. ​

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