Ultrasonic Synchronous Electrode, Stereo Electrode, Ultrasonic Sensor and Their Usage Methods
By designing an ultrasonic sensor including a matching layer, a piezoelectric layer and a backing layer, the problem of large monitoring electrodes in the prior art, inability to monitor the brain and low signal quality is solved, and high-quality brain depth monitoring is achieved in the skull.
Patent Information
- Application Number
- CN202011135114.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-10-21
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2040-10-21
AI Technical Summary
Due to its large size, existing monitoring electrodes cannot be monitored intraskull, cannot be monitored deep brain, and the monitoring signal quality is low.
An ultrasonic sensor including a matching layer, a piezoelectric layer and a backing layer is designed to convert the electrical signal into an ultrasonic vibration signal through the piezoelectric layer. The matching layer is used to send and receive ultrasonic vibration signals, and the backing layer is used to prevent ultrasonic vibration signals, thereby achieving intraskull monitoring and high-quality deep brain monitoring.
The volume reduction of the ultrasonic sensor is achieved, and the intraskull monitoring can be performed, deep into the brain is monitored, and the quality of the monitoring signal is improved.
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Figure CN112155597B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of medical devices, and in particular, to an ultrasonic sensor, an ultrasonic synchronization electrode, a three-dimensional electrode, and a method for using an ultrasonic sensor. Background Art
[0002] Under normal circumstances, weak bioelectric signals will be generated on the surface of the cerebral cortex of the human brain and have a certain regularity. When pathological lesions occur in the brain, the discharge pattern of the brain electrical signals will change significantly, and certain lesions will cause special changes in the discharge pattern of the brain electrical signals. Clinically, by observing these special changes in the discharge pattern, diseases of the human brain can be diagnosed and treated. Currently, the most common case of diagnosing and treating brain diseases through electroencephalogram examination is epilepsy. Epilepsy refers to the abnormal seizure of the limbs or consciousness and behavior caused by abnormal discharge of the cerebral cortex. Whether the patient has an attack or not, the electroencephalogram is different from that of normal people and shows special changes. Therefore, electroencephalogram examination plays a crucial role in the clinical treatment of epilepsy. At the same time, during intracranial tumor resection, real-time electroencephalogram monitoring has an important auxiliary role in completely removing the lesion, better protecting the functional area, and improving the prognosis of the patient. For clinical research, through the electrical signal activities at different positions of the brain, it can better help humans understand and interpret the laws of the brain's operation.
[0003] Intracranial cortical electrodes are placed on the surface of the cerebral cortex and can directly receive the electrical signals in situ in the cerebral cortex. The electroencephalogram signals collected in this way are almost without attenuation and artifact, and can accurately locate the scope of epileptic foci. Therefore, intracranial cortical electrodes are essential tools for accurate electroencephalogram monitoring.
[0004] Intracranial cortical electrodes are placed under the dura mater in the skull through surgery. The electrical signals in the brain are transmitted into the electroencephalogram signal receiving device through the electrodes, so as to achieve the goal of accurately detecting electroencephalogram signals and accurately judging the location of intracranial lesions. Intracranial cortical electrodes are mainly divided into strip cortical electrodes and sheet cortical electrodes. Strip cortical electrodes can be placed on the cortical surface for recording. They can be implanted into the subdural space through drilling and can be placed under the edge of the craniotomy window. Sheet cortical electrodes are generally placed on the cortical surface after large craniotomy surgery. In addition to the cortical surface recording function, it can also be used for cortical electrical stimulation research.
[0005] In the field of ultrasound, in recent years, the functional ultrasound method proposed by some people can realize the real-time detection of cerebral blood flow changes within a certain depth. However, the existing monitoring electrodes include a pulse emission and reception system, a transducer, and a probe. Their overall volume is relatively large, and they can only be monitored outside the skull. Moreover, due to the large volume, the placement density is low, so it is impossible to monitor the deep brain, and the quality of the monitored signals is low. Summary of the Invention
[0006] The object of the present invention is to provide an ultrasonic sensor, an ultrasonic synchronous electrode and a three-dimensional electrode, which are small in size, capable of performing intracranial monitoring, capable of monitoring deep in the brain, and improving the quality of monitoring signals.
[0007] Another object of the present invention is to provide a method for using an ultrasonic sensor, which can improve the quality of monitoring signals.
[0008] The technical solution of the present invention is as follows:
[0009] In a first aspect, the present invention provides an ultrasonic sensor, which includes:
[0010] a matching layer, a piezoelectric layer and a backing layer;
[0011] The matching layer, the piezoelectric layer and the backing layer are sequentially stacked;
[0012] The piezoelectric layer is used to convert an electrical signal into an ultrasonic vibration signal, the matching layer is used to transmit and receive the ultrasonic vibration signal, and the backing layer is used to block the ultrasonic vibration signal.
[0013] Preferably, the matching layer is a conductive material, and the matching layer is used to endow the ultrasonic sensor with the function of collecting bioelectrical signals.
[0014] Preferably, the conductive material includes at least one of graphite, silver paste, stainless steel, platinum, platinum-iridium alloy, nickel-chromium alloy, gold or polyethylenedioxythiophene.
[0015] In a second aspect, the present invention provides an ultrasonic synchronous electrode, which includes at least one ultrasonic sensor as described in any one of the above.
[0016] Preferably, the ultrasonic synchronous electrode further includes a flexible substrate, and the ultrasonic sensor is disposed in the flexible substrate.
[0017] In a third aspect, the present invention further provides a three-dimensional electrode, which includes a rod-shaped main body and at least one ultrasonic sensor as described in any one of the above;
[0018] The ultrasonic sensor is disposed in the rod-shaped main body.
[0019] Preferably, a macroelectrode is further disposed on the rod-shaped main body.
[0020] Preferably, a microelectrode is further disposed on the rod-shaped main body.
[0021] In a fourth aspect, the present invention further provides a method for using an ultrasonic sensor, which monitors the cerebral blood flow change value of a human body through ultrasonic signals.
[0022] Preferably, the matching layer of the ultrasonic sensor is a conductive material, enabling the ultrasonic sensor to simultaneously have the function of collecting bioelectric signals.
[0023] The beneficial effects of the present invention are as follows:
[0024] In the ultrasonic sensor, the piezoelectric layer is used as a transducer for ultrasonic waves, converting electrical energy into ultrasonic vibration signals. The ultrasonic vibration signals are emitted from the matching layer with a lower acoustic impedance, and the emitted signals are feedback received through the matching layer to achieve the monitoring function of ultrasonic waves. Furthermore, the overall volume is reduced, enabling intracranial monitoring and monitoring of deep brain areas, improving the quality of the monitoring signals. Description of the Drawings
[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0026] Figure 1 It is a schematic structural diagram of the ultrasonic sensor provided by the embodiment of the present invention;
[0027] Figure 2 It is a schematic structural diagram of the ultrasonic synchronous electrode provided by the embodiment of the present invention;
[0028] Figure 3 It is a schematic cross-sectional structural diagram of the ultrasonic synchronous electrode provided by the embodiment of the present invention;
[0029] Figure 4 It is a schematic structural diagram of the ultrasonic synchronous electrode with another arrangement provided by the embodiment of the present invention;
[0030] Figure 5 It is a schematic structural diagram of the three-dimensional electrode provided by the embodiment of the present invention.
[0031] Main Element Symbol Description:
[0032] 1 - Matching layer; 2 - Piezoelectric layer; 3 - Backing layer; 4 - Positive wire; 5 - Negative wire; 6 - Flexible substrate; 7 - Ultrasonic sensor; 8 - Rod-shaped main body; 9 - Macro electrode; 10 - Micro electrode. Detailed Embodiments
[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention usually described and illustrated in the drawings here can be arranged and designed in various different configurations.
[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.
[0035] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0036] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.
[0037] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.
[0038] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0039] The following combination of attached Figure 1 To attached Figure 5, some embodiments of the present invention will be described in detail. In the case of no conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0040] The present invention provides an ultrasonic sensor, which includes:
[0041] A matching layer 1, a piezoelectric layer 2, and a backing layer 3;
[0042] The matching layer 1, the piezoelectric layer 2, and the backing layer 3 are sequentially stacked;
[0043] The piezoelectric layer 2 is used to convert an electrical signal into an ultrasonic vibration signal, the matching layer 1 is used to transmit and receive the ultrasonic vibration signal, and the backing layer 3 is used to block the ultrasonic vibration signal.
[0044] In this embodiment, the positive electrode of the pulse power supply is connected to the matching layer 1, and the negative electrode of the pulse power supply is connected to the backing layer 3. When the ultrasonic sensor monitors the brain, the pulse power supply can apply a voltage to the ultrasonic sensor in the form of a pulse. Since the time of a single pulse is very short, there is no voltage on the matching layer 1 and its connected positive wire 4 for most of the time. This time window leaves time for electroencephalogram (EEG) monitoring.
[0045] Therefore, when the matching layer 1 is used as an EEG electrode, the effects of simultaneously monitoring EEG activities and ultrasonic signal release and monitoring can be achieved.
[0046] Specifically, after the matching layer 1, the piezoelectric layer 2, and the backing layer 3 are sequentially stacked, by respectively connecting the matching layer 1 and the backing layer 3 to the positive wire 4 and the negative wire 5 of the power supply, under the action of the pulse power supply, the middle piezoelectric layer 2 has the effect of an ultrasonic transducer.
[0047] An ultrasonic transducer is an energy conversion device. Its function is to convert the input electrical power into mechanical power (i.e., ultrasonic waves) and then transmit them. In addition, it can also convert the received ultrasonic waves into electrical power, and it only consumes a very small amount of power itself.
[0048] An alternating voltage with a resonant frequency is applied to the piezoelectric layer 2 in the ultrasonic transducer, and the piezoelectric material resonates to generate ultrasonic waves. However, piezoelectric materials such as PZT5, PZT4, PZT8, etc. have relatively large acoustic impedance values, about 35×10^6 N·S / m³, while that in water is 1.5×10^6 N·S / m. This difference in acoustic impedance makes it difficult to transmit ultrasonic waves. Therefore, using an acoustic impedance material between the piezoelectric material and the water acoustic impedance as the matching layer 1 can effectively emit the sound waves at the emission surface. And for the other surface, it is required that as few sound waves as possible are transmitted, so a material with a relatively large sound attenuation is used as the backing layer 3.
[0049] The positive wire 4 or the negative wire 5 of the transducer provides the transducer with the transmitting voltage and receives the echo voltage. The positive and negative wires also serve as the lead-out wires for the electrodes. Since the frequency of ultrasound is definitely greater than 20 kHz and the general imaging is around 5 - 20 MHz, while the frequency of the electroencephalogram signal is below 100 Hz, the two signals can be easily separated by filtering, or a separate wire can be led out for the output of the electrode signal.
[0050] Preferably, in this embodiment, the pulse frequency of the pulse power supply is 8 MHz - 50 MHz.
[0051] In this embodiment, the matching layer is a conductive material, and the matching layer 1 is used to enable the ultrasonic sensor to have the function of collecting bioelectric signals.
[0052] The matching layer is made of a conductive material, so that in addition to having the function of transmitting and receiving ultrasonic vibration signals, the matching layer 1 also has the function of receiving the electrophysiological activity signals of the brain tissue. The electrophysiological activity signals are transmitted to the electroencephalogram monitoring device through the positive wire of the pulse power supply connected to the matching layer 1.
[0053] Such a setting realizes the synchronous progress of ultrasonic monitoring and electroencephalogram monitoring, improves the overall monitoring accuracy and the quality of the monitoring signals, and combines the two monitoring sensors on one structure, making the overall structure smaller and capable of performing high-density electrode point monitoring, further improving the quality of the monitoring signals.
[0054] When used specifically, it is also possible to only use the ultrasonic function of the matching layer 1 or only use the function of receiving the electrophysiological activity signals of the matching layer 1. The specific usage requirements can be specifically set according to the specific usage scenarios.
[0055] Preferably, in this embodiment, the material of the matching layer 1 includes at least one of graphite, silver paste, stainless steel, platinum, platinum-iridium alloy, nickel-chromium alloy, gold, or polyethylenedioxythiophene; the material of the piezoelectric layer 2 is a piezoelectric material.
[0056] Specifically, materials such as graphite, silver paste, stainless steel, platinum, platinum-iridium alloy, nickel-chromium alloy, gold, or polyethylenedioxythiophene all have a relatively low acoustic impedance, and they can better transmit the vibration sound emitted by the piezoelectric layer 2 into the body.
[0057] In this embodiment, except for metal materials, other materials such as graphite and silver paste can be used alone or in combination.
[0058] It should be noted that the material of the matching layer 1 can be the above several, but it is not limited to the above several. As long as the acoustic impedance of the matching layer 1 is lower than that of the piezoelectric layer 2.
[0059] Piezoelectric materials are crystalline materials that exhibit a voltage across their two end faces when subjected to pressure.
[0060] Existing piezoelectric materials are mainly divided into two types: inorganic piezoelectric materials and organic piezoelectric materials. Among them, inorganic piezoelectric materials mainly include piezoelectric crystals and piezoelectric ceramics, and organic piezoelectric materials are mainly piezoelectric polymers such as polyvinylidene fluoride.
[0061] In this embodiment, the connection method between the matching layer 1 and the piezoelectric layer 2 is: bonding, welding, curing after the fluid matching layer 1 is coated on the piezoelectric layer 2, vapor deposition, electroplating, or curing after painting.
[0062] In this embodiment, the matching layer 1 can be connected to the piezoelectric layer 2 by bonding or welding. It can also be that the matching layer 1 is liquefied and then the liquefied fluid matching layer 1 is coated on the upper surface of the piezoelectric layer 2, and then cooled and cured. It can also be through vapor deposition, electroplating, painting, etc., or other connection methods, as long as the matching layer 1 can be connected to the piezoelectric layer 2.
[0063] The ultrasonic sensor 7 is columnar in shape, and the positive and negative electrodes of the pulsed power supply are respectively connected to both ends of the column.
[0064] Specifically, in this embodiment, the ultrasonic sensor 7 is square-columnar, and more specifically, the size ranges from 0.5×0.5×0.5 mm to 3×2×1 mm.
[0065] It should be noted that the columnar ultrasonic sensor 7 can also be cylindrical or other columnar structures.
[0066] In a second aspect, the present invention provides an ultrasonic synchronization electrode, which includes at least one ultrasonic sensor as described in any one of the above.
[0067] By using the above ultrasonic sensor, the ultrasonic synchronization electrode can simultaneously have ultrasonic monitoring function and electroencephalogram monitoring function, improving the practicality of the ultrasonic synchronization electrode.
[0068] Specifically, in this embodiment, as Figure 2 and Figure 4 shown, the ultrasonic synchronization electrode further includes a flexible substrate; the ultrasonic sensor 7 is disposed in the flexible substrate 6.
[0069] Specifically, in this embodiment, the above ultrasonic sensor 7 is disposed in the flexible substrate 6. When there are multiple ultrasonic sensors 7, they are connected into a whole through the flexible substrate 6.
[0070] More specifically, the flexible substrate 6 has good flexibility, and it can reduce the damage to human tissues when entering the human body tissues, improving the safety of the operation.
[0071] More specifically, in this embodiment, the flexible substrate 6 is made of a porous material, which can be polyurethane, polytetrafluoroethylene, hydrogel, silica gel, etc.
[0072] Preferably, the ultrasonic sensors 7 are arranged in an array according to a certain rule. For example, the arrangement of multiple ultrasonic sensors 7 on the flexible substrate 6 is a rectangular array arrangement.
[0073] Specifically, in this embodiment, the ultrasonic sensors 7 are arranged on the flexible substrate 6 in a single-row linear arrangement. More specifically, it can be a straight line type, as Figure 2 shown, or it can also be an arc type.
[0074] Specifically, in this embodiment, the array arrangement can be a rectangular array, as Figure 4 shown, or it can also be a circular array, a triangular array, etc. As long as the ultrasonic sensors 7 can be arranged on the flexible substrate 6.
[0075] Preferably, the ultrasonic sensors 7 are embedded in the flexible substrate 6.
[0076] In this embodiment, an embedding groove is provided on the flexible substrate 6, and the ultrasonic sensors 7 are arranged in the embedding groove and fixed by the embedding groove.
[0077] Specifically, after the ultrasonic sensors 7 are embedded in the flexible substrate 6, the surface of the ultrasonic sensors 7 is flush with the surface of the flexible substrate 6, so that there is no discomfort during use, and at the same time, the overall volume is reduced.
[0078] In this embodiment, the embedding method can also be to provide through holes on the flexible substrate 6, embed the ultrasonic sensors 7 in the through holes, and the two end faces of the ultrasonic sensors 7 are flush with the upper and lower sides of the flexible substrate 6, which can not only ensure the connection stability of multiple ultrasonic sensors 7, but also further reduce the volume of the entire ultrasonic synchronous electrode.
[0079] It should be noted that the ultrasonic sensors 7 can be arranged on the flexible substrate 6 by embedding, but it is not limited to this case only. It can also be arranged on the flexible substrate 6 by other methods.
[0080] Specifically, in this embodiment, after the ultrasonic sensors 7 are embedded in the flexible substrate 6, they are fixed by bonding or clamping.
[0081] When the ultrasonic sensors 7 are embedded in the flexible substrate 6, it is necessary to fix the ultrasonic sensors 7 to prevent the ultrasonic sensors 7 from detaching from the embedding groove or through holes of the flexible substrate 6.
[0082] Specifically, after the ultrasonic sensor 7 is embedded in the flexible substrate 6, the ultrasonic sensor 7 can be fixedly connected to the flexible substrate 6 by bonding. When bonding, the adhesive can be first coated around the ultrasonic sensor 7, and then the ultrasonic sensor 7 is embedded into the flexible substrate 6 to achieve the bonding effect; alternatively, the adhesive can be first coated on the inner wall of the embedding groove or through hole of the flexible substrate 6, and then the ultrasonic sensor 7 is embedded into the flexible substrate 6.
[0083] Specifically, the ultrasonic sensor 7 can also be fixed on the flexible substrate 6 by snap connection. For example, the area of the backing layer 3 can be made larger than that of the piezoelectric layer 2, so that the backing layer 3 in the ultrasonic sensor 7 protrudes from the side wall. The embedding groove on the flexible substrate 6 is set as a T-shaped groove matching the ultrasonic sensor 7, so that the ultrasonic sensor 7 is snapped into the embedding groove to achieve the fixation of the ultrasonic sensor 7.
[0084] It should be noted that the fixing method of the ultrasonic sensor 7 on the flexible substrate 6 can be bonding or snap connection, but it is not limited to bonding or snap connection. It can also be other fixed connection methods, as long as the ultrasonic sensor 7 can be fixedly arranged on the flexible substrate 6.
[0085] Specifically, in this embodiment, the flexible substrate 6 is injection molded.
[0086] More specifically, the ultrasonic sensor 7 can be first placed at a specified position in the mold according to the required array shape, then the flexible material is poured into the mold, and finally the flexible material is cured to obtain the solid flexible substrate 6, and at the same time, the ultrasonic sensor 7 is fixed on the flexible substrate 6.
[0087] In a third aspect, the present invention also provides a three-dimensional electrode, which includes a rod-shaped main body 8 and at least one ultrasonic sensor 7 as described in any one of the above; the ultrasonic sensor 7 is arranged in the rod-shaped main body 8.
[0088] By arranging the ultrasonic sensor 7 in the rod-shaped main body 8, the depth of the ultrasonic sensor 7 entering the human tissue can be increased, and thus parts such as deep brain can be monitored.
[0089] Preferably, in this embodiment, a macroelectrode 9 is further arranged on the rod-shaped main body 8.
[0090] Specifically, in this embodiment, the macroelectrode 9 is arranged on the side wall of the rod-shaped main body 8, and the macroelectrode is used to collect the electroencephalogram signals of brain cell clusters.
[0091] More specifically, the three-dimensional electrode provided in this embodiment is a composite electrode, which not only includes the ultrasonic sensor 7, but also includes the macro electrode 9. The external shape of the macro electrode 9 is annular, and it is sleeved on the outer wall of the rod-shaped main body 8. Through the setting of the macro electrode 9, it is possible to detect the clustered discharge of the cell area in contact.
[0092] In this embodiment, the number of the macro electrodes 9 can be one or more.
[0093] Preferably, in this embodiment, a microelectrode 10 is further provided on the rod-shaped main body 8.
[0094] Specifically, in this embodiment, the microelectrode 10 can be arranged at any position of the rod-shaped main body 8, such as the side wall or the end, and it is mainly used to collect the discharge of a single neuron.
[0095] More specifically, in this embodiment, the microelectrode 10 is formed by the electrode wire protruding from the outer wall of the rod-shaped main body 8, and multiple electrode wires together form a wire bundle located in the hollow channel of the rod-shaped main body 8. One end of the wire bundle is connected and arranged at the proximal end of the rod-shaped main body 8, and the distal end protrudes from the micropores on the side wall or the end of the rod-shaped main body, and can detect the electrical activity of a single cell.
[0096] In this embodiment, the three-dimensional electrode integrating the ultrasonic sensor 7, the macro electrode 9 and the microelectrode 10 can effectively alleviate the technical problems existing in the prior art, such as the difficulty in simultaneously detecting the clustered discharge activity and the discharge activity of a single cell in the cell area, and it is difficult to accurately correspond the detected electrical signal to the position of a single cell.
[0097] Fourthly, the present invention also provides a method for using an ultrasonic sensor, which detects the cerebral blood flow signal of the human body through ultrasonic signals.
[0098] By monitoring the cerebral blood flow signal of the human brain through ultrasonic signals, it is possible to reflect the change of brain activity according to the change of cerebral blood flow, and then it is possible to judge whether a lesion occurs, such as judging whether epilepsy occurs.
[0099] Preferably, the matching layer 1 of the ultrasonic sensor 7 is made of a conductive material, so that the ultrasonic sensor 7 also has the function of collecting bioelectric signals.
[0100] Through dual monitoring, the accuracy of monitoring can be improved.
[0101] The beneficial effects of the present invention are:
[0102] In the ultrasonic sensor 7, the piezoelectric layer 2 is used as a transducer for ultrasonic waves. Through the intermittent voltage provided by the pulsed power supply, the piezoelectric layer 2 generates vibrations, and the vibrating sound waves are emitted from the matching layer 1 with a lower acoustic impedance, realizing the monitoring function of ultrasonic waves. Furthermore, the overall volume is reduced, enabling the ultrasonic synchronous electrode to perform intracranial monitoring and being able to monitor deep in the brain. The density of the ultrasonic synchronous electrode increases, improving the quality of the monitoring signal.
[0103] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. An ultrasonic sensor, characterized in that, Comprising: A matching layer, a piezoelectric layer, a backing layer, and a pulsed power supply; The matching layer, the piezoelectric layer, and the backing layer are sequentially stacked; The piezoelectric layer is used to convert an electrical signal into an ultrasonic vibration signal, The matching layer is used to transmit and receive ultrasonic vibration signals, and when used as an electroencephalogram electrode, it monitors electroencephalogram activities; The backing layer is used to block ultrasonic vibration signals; The positive electrode of the pulsed power supply is connected to the matching layer, and the negative electrode of the pulsed power supply is connected to the backing layer.
2. The ultrasonic sensor according to claim 1, characterized in that, The matching layer is made of a conductive material, and the matching layer is used to enable the ultrasonic sensor to have the function of collecting bioelectrical signals.
3. The ultrasonic sensor according to claim 2, characterized in that, The conductive material includes at least one of graphite, silver paste, stainless steel, platinum, platinum-iridium alloy, nickel-chromium alloy, gold, or polyethylenedioxythiophene.
4. An ultrasonic synchronization electrode, characterized in that, Comprising at least one ultrasonic sensor according to any one of claims 1-3.
5. The ultrasonic synchronization electrode according to claim 4, characterized in that, Further comprising a flexible substrate, and the ultrasonic sensor is disposed in the flexible substrate.
6. A three-dimensional electrode, characterized in that, Comprising a rod-shaped body and at least one ultrasonic sensor according to any one of claims 1-3; the ultrasonic sensor is disposed in the rod-shaped body.
7. The three-dimensional electrode according to claim 6, characterized in that, A macroelectrode is further disposed on the rod-shaped body.
8. The three-dimensional electrode according to claim 6, characterized in that, A microelectrode is further disposed on the rod-shaped body.
9. A method for using the ultrasonic sensor according to any one of claims 1-3, characterized in that, Monitoring the cerebral blood flow change value of the human body through ultrasonic signals; The matching layer of the ultrasonic sensor that transmits the ultrasonic signals is made of a conductive material, so that the ultrasonic sensor simultaneously has the function of collecting bioelectrical signals.
Citation Information
Patent Citations
System for positioning brain lesion area
CN106037804A
Ultrasonic sensor and electronic device
CN108731716A
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CN212281410U