Test system for infrared sensors

Abstract

The application discloses a test system for infrared sensors, which comprises input components, identification components, feeding components, test components and output components arranged in sequence, infrared sensors enter the identification components after passing through the input components, the identification components identify the pin positions of the infrared sensors and then send the infrared sensors into the feeding components, in the feeding components, the infrared sensors are separated by pins and then enter jigs, the infrared sensors in the jigs are tested by the test components and then output through the output components. In the above process, no manual intervention is needed, automatic testing is realized, the testing efficiency is improved, and the probability of missed detection and wrong detection in the testing process is greatly reduced.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of infrared sensor, and particularly relates to a test system for infrared sensor. BACKGROUND

[0002] The infrared thermocouple sensor utilizes the Seebeck thermoelectric effect, and is composed of a plurality of pairs of polycrystalline silicon and aluminum thermocouples in series, the hot end of the thermocouple is placed on the thin film structure at the top of the silicon substrate cavity to absorb the infrared radiation energy emitted by the object to be measured to heat up, and the cold end of the thermocouple is placed on the heat-conducting side wall of the silicon substrate to keep consistent with the ambient temperature; when there is a temperature difference between the cold and hot ends of the thermocouple, a thermoelectric electromotive force Vn is generated between the positive and negative electrodes of the thermocouple, and the sum of the thermoelectric electromotive forces of the plurality of thermocouples is obtained between the positive and negative electrodes of the thermoelectric pile.

[0003] The prior art test of the infrared thermocouple sensor generally uses a PCB fixture, the fixture is integrated with a signal amplification circuit and a signal processing circuit, can simultaneously collect and process multiple signals, and is connected with a computer for convenient data saving; the sensor is electrically connected with a copper needle welded on the test fixture in a plug-in manner, the test fixture with the inserted sensor is placed on a 25℃ constant temperature water-cooled plate for 5 minutes (the environment temperature of the sensor is controlled), after the temperature of the sensor is stabilized, the test fixture is tested against a 150℃ black body, and the software is used to pick out defective sensors and output sensors with close output voltage to the same grade, and the sensors are packaged by an anti-static IC tube manually. As can be seen from the above, the existing test of the infrared sensor is manually operated, the test efficiency is low, and the accuracy of the test result is low due to the instability of manual test. SUMMARY

[0004] In order to solve the above problems, the present application provides a test system for infrared sensor, which realizes the automation of the test, and further improves the test efficiency and accuracy.

[0005] The technical scheme adopted by the present application is as follows:

[0006] A test system for infrared sensor, comprising input assembly, identification assembly, feeding assembly, test assembly and output assembly arranged in sequence, the infrared sensor enters the identification assembly after passing through the input assembly, the identification assembly identifies the pin position of the infrared sensor and sends it to the feeding assembly, in the feeding assembly, the infrared sensor is separated by pins and then enters the fixture, and the infrared sensor in the fixture is tested by the test assembly and then output by the output assembly.

[0007] Preferably, the input assembly comprises a vibrating disc, a vibrating arm and a material clamping jaw, the vibrating disc and the vibrating arm are connected, and the material clamping jaw is fixed at the end of the vibrating arm.

[0008] Preferably, the vibration disc comprises an inner vibration ring and an outer vibration ring, the inner vibration ring is arranged obliquely and is higher near the center than near the edge to prevent the infrared sensor from falling during vibration; the outer vibration ring is arranged obliquely and is lower near the center than near the edge.

[0009] Preferably, the input assembly further comprises a full material sensor arranged on both sides of the vibration arm and a limit sensor arranged on both sides of the material clamping jaw.

[0010] Preferably, the identification assembly comprises a transfer mechanical arm and a camera, the transfer mechanical arm is connected to the camera, the lower end of the transfer mechanical arm is provided with a first suction nozzle, the first suction nozzle sucks the infrared sensor from the end of the input assembly to the top of the camera, and the camera determines the position between the pins of the infrared sensor.

[0011] Preferably, the input assembly comprises an input mechanical arm, a pedicure clamping jaw and an input large turntable, the pedicure clamping jaw is located at the bottom of the input mechanical arm for separating the pins, and the input large turntable is located below one side of the pedicure clamping jaw.

[0012] Preferably, the test system further comprises a transfer small turntable, the transfer small turntable is located below the other side of the pedicure clamping jaw; after the infrared sensor is separated from the pins by the pedicure clamping jaw, the transfer mechanical arm sends the infrared sensor into the hole position of the transfer small turntable, and after the sensor is inserted into the hole position, the transfer small turntable rotates clockwise to send the infrared sensor to the side close to the input large turntable.

[0013] Preferably, the test assembly comprises an infrared radiation blackbody, a baffle, an extension shaft, a water-cooled plate, a probe, a fixed plate, a PCB board and a chopper, the infrared sensor is close to the water-cooled plate, the infrared radiation blackbody is located above the infrared sensor, the baffle is located between the infrared radiation blackbody and the infrared sensor to block the direct radiation of the infrared radiation blackbody to the infrared sensor, the extension shaft is fixed at one end of the baffle, the PCB board is located below the infrared sensor for testing the infrared sensor, and the probe is located on the fixed plate for connecting the infrared sensor and the PCB board.

[0014] Preferably, the output assembly comprises an output mechanical arm, the output mechanical arm.

[0015] Preferably, a rotatable second suction nozzle is arranged below the output mechanical arm.

[0016] Compared with the prior art, when the application is used, the infrared sensor enters the identification assembly after passing through the input assembly, the identification assembly identifies the pin position of the infrared sensor and sends it to the feeding assembly, in the feeding assembly, the infrared sensor is separated by the pins and enters the jig, the infrared sensor in the jig is tested by the testing assembly and is output through the output assembly.

[0017] The above process basically does not involve manual intervention, realizes automatic testing, improves the testing efficiency, and greatly reduces the probability of missed detection and wrong detection in the testing process. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a structural schematic diagram of a testing system for an infrared sensor provided by an embodiment of the application;

[0019] Figure 2 is a cooperation diagram of a feeding mechanical arm, a pin separating clamp and an infrared sensor in the testing system for the infrared sensor provided by the embodiment of the application;

[0020] Figure 3 is a structural schematic diagram of a testing assembly in the testing system for the infrared sensor provided by the embodiment of the application;

[0021] Figure 4 is a principle diagram of the testing assembly in the testing system for the infrared sensor provided by the embodiment of the application.

[0022] 1. input assembly, 2. identification assembly, 3. feeding assembly, 4. testing assembly, 5. output assembly, 6. transfer small turntable, 7. receiving area, 8. counting inductor 11. vibration disc, 12. vibration arm, 13. receiving clamp, 14. full material inductor, 15. limit sensor, 21. transfer mechanical arm, 22. camera, 31. feeding mechanical arm, 32. pin separating clamp, 33. feeding large turntable, 34. positioning clamp, 41. infrared radiation black body, 42. baffle, 43. telescopic shaft, 44. water-cooled plate, 45. probe, 46. fixed plate, 47. PCB board, 48. chopper, 61. hole position. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the application more clear, the application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the application and do not limit the application.

[0024] In the description of the present application, it is necessary to make it clear that the terms "vertical", "transverse", "longitudinal", "front", "back", "left", "right", "up", "down", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application, and do not mean that the devices or elements referred to must have a particular orientation or position, and therefore cannot be understood as a limitation on the present application.

[0025] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] The embodiment of the present application provides a test system for an infrared sensor, as shown in Figure 1 It comprises an input assembly 1, an identification assembly 2, a feeding assembly 3, a test assembly 4 and an output assembly 5;

[0027] Specifically, the input assembly 1, the identification assembly 2, the feeding assembly 3, the test assembly 4 and the output assembly 5 are sequentially arranged in the horizontal direction;

[0028] In this way, by adopting the above structure, the infrared sensor enters the identification assembly 2 after passing through the input assembly 1, the identification assembly 2 identifies the pin position of the infrared sensor and then sends it into the feeding assembly 3, in the feeding assembly 4, the infrared sensor is separated by pins and then enters the jig, the infrared sensor in the jig is tested by the test assembly 4 and then output through the output assembly 5;

[0029] In the above process, no manual intervention is involved, automatic testing is realized, the testing efficiency is improved, and the probability of missed detection and wrong detection in the testing process is greatly reduced.

[0030] In specific embodiments:

[0031] The input assembly 1 comprises a vibrating disc 11, a vibrating arm 12 and a receiving clamp jaw 13, the vibrating disc 11 and the vibrating arm 12 are connected, and the receiving clamp jaw 13 is fixed at the end of the vibrating arm 12;

[0032] In this way, the vibrating disc 11 sends the infrared sensor to be tested into the vibrating arm 12 one circle by one circle in the direction of "head up, foot down" through vibration, and the vibrating arm 12 sends the infrared sensor into the receiving clamp jaw 13 through vibration.

[0033] Specifically, in order to realize the "head-up, foot-down" of the infrared sensor, the specific structure of the vibration disc 11 is as follows:

[0034] The vibration disc 11 comprises an inner vibration ring and an outer vibration ring, the inner vibration ring is arranged obliquely and is higher at the central position than at the edge position to prevent the infrared sensor from falling during vibration; the outer vibration ring is arranged obliquely and is lower at the central position than at the edge position;

[0035] In this way, when the infrared sensor reaches the outer vibration ring, it will fall down due to gravity, but there is a groove near the wall of the outer vibration ring, which can block the position of the infrared sensor cap, so that the infrared sensor with the head-up and foot-down is left on the outer vibration ring, and the end of the outer vibration ring is without the outer vibration wall, so that the infrared sensors at other positions will fall into the vibration disc.

[0036] In specific embodiments,

[0037] The input assembly 1 further comprises a full-load sensor 14 arranged on both sides of the vibration arm 12 and a limit sensor 15 arranged on both sides of the receiving clamp jaw 13.

[0038] In this way, the full-load sensor 14 can avoid too many infrared sensors in the vibration arm 12 from affecting the vibration effect and even causing damage to the infrared sensors.

[0039] The limit sensor 15 is arranged to avoid the receiving clamp jaw 13 from moving away.

[0040] The vibration arm 12 is provided with a plurality of gas blowing ports for assisting the movement of the infrared sensor on the vibration arm 12.

[0041] In specific embodiments,

[0042] The identification assembly 2 comprises a transfer mechanical arm 21 and a camera 22, the transfer mechanical arm 21 and the camera 22 are connected, the lower end of the transfer mechanical arm 21 is provided with a first suction nozzle, the first suction nozzle sucks the infrared sensor from the end of the input assembly 1 to the top of the camera 22, and the camera 22 determines the position relationship between the pins of the infrared sensor.

[0043] In this way, the first suction nozzle below the transfer mechanical arm 21 sucks the infrared sensor at the receiving clamp jaw 13 to take a photo at the camera 22, and after the image recognition determines the position relationship between the pins of the infrared sensor, the infrared sensor is sent to the next station.

[0044] The infrared thermocouple sensor has a thermocouple chip and an NTC chip inside, and the two chips are connected to four pin columns of the sensor respectively, and different pin columns have different pin definitions; after the sensor passes through the vibration arm, the positional relationship is not uniform, and only after the positional relationship is determined through positioning, the pin definition of the sensor can be known, and subsequent inspection can be performed.

[0045] As shown in Figure 1 and 2 , the feeding assembly 3 includes a feeding mechanical arm 31, a pedicle clamp 32 at the bottom of the feeding mechanical arm 31 for separating the pedicle, and a feeding large turntable 33 below one side of the pedicle clamp 32;

[0046] The test system further includes a transfer small turntable 6 below the other side of the pedicle clamp 32;

[0047] In this way, after the infrared sensor is separated by the pedicle clamp 32, the transfer mechanical arm 21 sends the infrared sensor into the hole position 61 of the transfer small turntable 6, and after the sensor is inserted into the hole position 61, the transfer small turntable 6 rotates clockwise by 180° to send the infrared sensor to the side close to the feeding large turntable 33;

[0048] The transfer mechanical arm 21 obtains the positional relationship of the infrared sensor pins through the computer, and after rotating by a certain angle, the infrared sensor is placed into the hole position 61 on the transfer small turntable 6.

[0049] In specific implementation, the transfer small turntable 6 has a transitional effect. If the transfer small turntable 6 is not provided, the feeding mechanical arm 31 needs to perform a small-amplitude rotating action after image recognition, an infrared sensor pin combing action, and an infrared sensor plugging action in the process of placing the infrared sensor into the feeding large turntable 33. These process actions are completed in one feeding mechanical arm 31, which causes low efficiency, complicated actions, and high error rate. Therefore, the transfer small turntable 6 decomposes the actions to reduce the error probability.

[0050] More specifically, the pedicle clamp 32 has an E-shaped structure; when the suction nozzle at the bottom of the feeding mechanical arm 31 sucks up the infrared sensor, the positioning clamp 34 is fixed to the bottom of the infrared sensor to prevent the infrared sensor from falling off; the two pedicle clamps 32 are inserted into the four pins of the infrared sensor in a staggered manner, and then move downward by a small amplitude to separate the four pins of the infrared sensor; when the feeding mechanical arm 31 just inserts the infrared sensor into the hole position 61, the pedicle clamp 32 is separated from the infrared sensor, and the feeding mechanical arm 31 moves downward to completely insert the infrared sensor into the hole position.

[0051] In specific embodiments:

[0052] AsFigure 3 and 4 As shown in the figure, the test assembly 4 includes an infrared radiation blackbody 41, a baffle 42, an extension shaft 43, a water-cooled plate 44, a probe 45, a fixed plate 46, a PCB plate 47, and a chopper 48. The infrared sensor is close to the water-cooled plate 44, the infrared radiation blackbody 41 is above the infrared sensor, the baffle 42 is between the infrared radiation blackbody 41 and the infrared sensor to block the infrared radiation blackbody 41 from directly irradiating the infrared sensor, the extension shaft 43 is fixed at one end of the baffle 42, the PCB plate 47 is below the infrared sensor for testing the infrared sensor, and the probe 45 is on the fixed plate 46 for connecting the infrared sensor and the PCB plate 47.

[0053] In this way, after the infrared sensor enters the test assembly 4, it is close to the water-cooled plate 44 for temperature control, and then moves the baffle 42 back and forth through the extension shaft 43 to block the infrared radiation blackbody 41 from directly irradiating the infrared sensor during non-testing.

[0054] The infrared sensor is connected to the PCB plate 47 through the probe 45, and then the test of the infrared sensor is realized through the PCB plate.

[0055] In addition, under the influence of the chopper 48, the infrared sensor periodically receives the infrared radiation signal emitted by the infrared radiation blackbody 41, and generates a voltage signal. The voltage square wave signal collected by the data acquisition instrument is the voltage signal size of the infrared sensor when testing the current blackbody temperature at the current environmental temperature.

[0056] The chopper 48 can eliminate noise.

[0057] The output assembly 5 includes a discharging mechanical arm.

[0058] A rotatable second suction nozzle is arranged below the discharging mechanical arm.

[0059] In this way, the second suction nozzle below the discharging mechanical arm can rotate by a certain angle while taking materials, which facilitates better placement in the IC tube and avoids material jamming.

[0060] In one embodiment, the test system further includes a material receiving area 7.

[0061] An anti-static IC tube is placed on the material receiving area 7 at an inclination angle of 45° for infrared sensor packaging. In addition, a counting sensor 8 is also arranged on the material receiving area, which will automatically alarm when the number reaches the set upper limit.

[0062] In order to ensure the stability of the output voltage of the infrared sensor, the temperature of the infrared sensor and the temperature of the measured object are controlled. In this embodiment, the temperature of the sensor is controlled by using a water-cooled fixture, and the temperature of the measured object is controlled by using an infrared radiation black body.

[0063] In addition, a fluorine oil can be used instead of the above-mentioned ring temperature control scheme, specifically:

[0064] The fixture with the infrared sensor is directly immersed in the fluorine oil with constant temperature. After the temperature of the infrared sensor stabilizes, the fixture moves upward, the infrared sensor window floats out of the fluorine oil liquid level, and the metal baffle blocking the infrared radiation black body retracts, exposing the black body radiation surface. The infrared sensor enters the test state, and the output voltage of each sensor is recorded through software and hardware cooperation, which is convenient for subsequent grading operation.

[0065] The fluorine oil has good thermal stability and viscosity, and can keep the temperature of the sensor constant without leaving marks on the sensor window.

[0066] The fluorine oil has high cost, the test system should be sealed, and fluorine oil recovery device should be set to avoid fluorine oil evaporation and facilitate secondary use.

[0067] Test process:

[0068] The infrared thermocouple sensor to be tested is poured into the vibrating disc 11, which sends the sensor one circle after another in the direction of "head up, feet down" through vibration to the straight vibrating arm 12, which sends the infrared sensor to the receiving clamp jaw 13 through vibration. The first suction nozzle under the transfer mechanical arm 21 sucks the infrared sensor at the receiving clamp jaw 13 and takes a photo at the camera 22. After the image recognition determines the positional relationship between the pins of the infrared sensor, the transfer mechanical arm 21 sends the infrared sensor to the hole position 61 on the transfer small turntable 6. After the infrared sensor is inserted into the hole position 61, the transfer small turntable 6 rotates clockwise by 180°, sending the infrared sensor to the side close to the feeding large turntable 33. The feeding mechanical arm 31 sucks the infrared sensor through the suction nozzle, and the foot trimming clamp jaw 32 under the feeding mechanical arm 31 clamps the four pins of the infrared sensor. The foot trimming clamp jaw 32 separates the pins of the infrared sensor through movement, and the feeding mechanical arm 31 sends the infrared sensor to the fixture on the feeding large turntable 33. After the infrared sensors are inserted into the fixture, the feeding large turntable 33 rotates clockwise by 90°, sending the fixture with the infrared sensors to the test area for testing. After the temperature of the infrared sensor reaches the set constant temperature, the test can be performed. After the test is completed, the feeding large turntable 33 waits for the next batch of sensor feeding to be completed. Then, the feeding large turntable 33 rotates clockwise, sending the tested sensors to the discharge mechanical arm, and the discharge mechanical arm sends the sensors to the receiving area 7 in turn.

[0069] The embodiment has the following advantages:

[0070] The automation of the infrared sensor testing and the tube packaging is realized, manual intervention is only needed for the feeding and taking of the sensor, other functions are completely realized in an automatic mode, and the testing and tube packaging efficiency is improved as a whole.

[0071] The infrared sensor can be subjected to a trimming process, so that the infrared sensor will not have the pin crossing problem in the tube packaging process, and the appearance of the finished product is improved.

[0072] The whole testing process is controlled by the machine, and the missing and wrong detection problems are avoided, and the finished product delivery yield is improved.

[0073] The above is only the preferred embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A test system for an infrared sensor, characterized by, It includes an input component (1), an identification component (2), a feeding component (3), a testing component (4), and an output component (5) arranged in sequence. The input component (1), identification component (2), feeding component (3), testing component (4), and output component (5) are arranged in sequence along the horizontal direction. After passing through the input component (1), the infrared sensor enters the identification component (2). The identification component (2) identifies the pin position of the infrared sensor and sends it to the feeding component (3). In the feeding component (3), the infrared sensor is separated from its pin and enters the fixture. The infrared sensor in the fixture is tested by the testing component (4) and then output through the output component (5). The feeding assembly (3) includes a feeding robotic arm (31), an E-shaped foot trimming gripper (32), and a feeding turntable (33). The foot trimming gripper (32) is located at the bottom of the feeding robotic arm (31) for pin separation, and the feeding turntable (33) is located below one side of the foot trimming gripper (32). When the suction nozzle at the bottom of the feeding robot arm (31) picks up the infrared sensor, the positioning gripper (34) is fixed to the bottom of the infrared sensor; the two foot trimming grippers (32) are inserted into the four pins of the infrared sensor in a staggered manner and then move downward slightly to separate the four pins of the infrared sensor; when the feeding robot arm (31) just inserts the infrared sensor into the hole (61), the foot trimming gripper (32) disengages from the infrared sensor, the feeding robot arm (31) moves downward and fully inserts the infrared sensor into the hole.

2. The testing system for infrared sensors according to claim 1, characterized in that, The input component (1) includes a vibratory plate (11), a vibratory arm (12) and a receiving claw (13). The vibratory plate (11) and the vibratory arm (12) are connected, and the receiving claw (13) is fixed to the end of the vibratory arm (12).

3. The testing system for infrared sensors according to claim 2, characterized in that, The vibratory plate (11) includes an inner vibrating ring and an outer vibrating ring. The inner vibrating ring is inclined and positioned closer to the center than the edge to prevent the infrared sensor from falling off during vibration. The outer vibrating ring is inclined and positioned closer to the center than the edge.

4. The testing system for infrared sensors according to claim 2 or 3, characterized in that, The input component (1) further includes a full material sensor (14) disposed on both sides of the vibrating arm (12) and a limit sensor (15) disposed on both sides of the receiving gripper (13).

5. The testing system for infrared sensors according to claim 1, characterized in that, The identification component (2) includes a transfer robotic arm (21) and a camera (22). The transfer robotic arm (21) and the camera (22) are connected. The lower end of the transfer robotic arm (21) is provided with a first suction nozzle. The first suction nozzle picks up the infrared sensor from the end of the input component (1) to the top of the camera (22). The camera (22) determines the position between the pins of the infrared sensor.

6. The testing system for infrared sensors according to claim 5, characterized in that, The feeding assembly (3) includes a feeding robotic arm (31), a foot trimming gripper (32), and a feeding turntable (33). The foot trimming gripper (32) is located at the bottom of the feeding robotic arm (31) for pin separation, and the feeding turntable (33) is located below one side of the foot trimming gripper (32).

7. The testing system for infrared sensors according to claim 6, characterized in that, The testing system further includes a small transfer turntable (6), which is located below the other side of the foot trimming gripper (32). After the infrared sensor is separated from the pin by the foot trimming gripper (32), the transfer robotic arm (21) sends the infrared sensor into the hole (61) of the small transfer turntable (6). After the sensor is inserted into the hole (61), the small transfer turntable (6) will rotate clockwise and send the infrared sensor to the side close to the feed turntable (33).

8. The testing system for infrared sensors according to claim 1, characterized in that, The test assembly (4) includes an infrared blackbody (41), a baffle (42), a telescopic shaft (43), a water-cooled plate (44), a probe (45), a fixing plate (46), a PCB board (47), and a chopper (48). The infrared sensor is attached to the water-cooled plate (44). The infrared blackbody (41) is located above the infrared sensor. The baffle (42) is located between the infrared blackbody (41) and the infrared sensor to block the infrared blackbody (41) from directly shining on the infrared sensor. The telescopic shaft (43) is fixed to one end of the baffle (42). The PCB board (47) is located below the infrared sensor for testing the infrared sensor. The probe (45) is located on the fixing plate (46) for connecting the infrared sensor and the PCB board (47).

9. The testing system for infrared sensors according to claim 1, characterized in that, The output component (5) includes a discharge robotic arm.

10. The testing system for infrared sensors according to claim 9, characterized in that, A rotatable second suction nozzle is provided below the discharge robotic arm.

Images