A heat dissipation device for strengthening VPX sealed chassis

Abstract

The invention discloses a heat dissipation device for reinforcing a VPX sealed chassis, comprising a VPX plug-in board, a guide rail heat dissipation structure, and a sealed chassis; the VPX plug-in board comprises a PCB board, a cold plate substrate is arranged on the PCB board, a heat pipe substrate and a heat pipe radiator are arranged on the cold plate substrate; a plurality of grooves are arranged on one side of the heat pipe substrate, and more than one first heat pipe is embedded in the plurality of grooves; the heat pipe radiator is connected and fixed to one end of the first heat pipe; the guide rail heat dissipation structure comprises two pieces of heat dissipation fins which are assembled together, and the heat dissipation fins comprise an integrally formed guide rail base and heat dissipation teeth, a long groove is arranged on the sealed chassis for the guide rail base to extend into the interior of the sealed chassis, the guide rail base part is located in the sealed chassis, and the heat dissipation tooth part is located outside the sealed chassis; through two-stage heat pipe conduction and air-cooled heat dissipation mode, the heat in the sealed chassis is conducted to the outside of the sealed chassis, the structural design requirements for the sealed chassis are reduced, the structure is simplified, the processing design is convenient, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the fields of computer reinforcement technology and information processing technology reinforcement, and in particular to a heat dissipation device for reinforcing a VPX sealed chassis. Background Art

[0002] As the performance of components such as the CPU and various functional chips in the VPX plug-in board has been greatly improved, its heat generation has also increased significantly. In the fields of industrial control and defense, the VPX bus chassis is reinforced to meet special environmental and electromagnetic compatibility requirements. Due to the closed working environment of the reinforced VPX sealed chassis, heat can only be dissipated by heat conduction. VPX boards are usually inserted into the backplane connector along the guide rail. The metal heat dissipation cold plate of the board has a small contact area with the guide rail, and the contact thermal resistance is large. In addition, the thermal resistance of the heat dissipation cold plate itself is large, which restricts the rapid conduction of the chip heat of each board to the outside of the chassis, becoming a bottleneck in the heat dissipation solution. Summary of the invention

[0003] The object of the present invention is to provide a heat dissipation device for a reinforced VPX sealed chassis to overcome the problems of high heat generation and excessive thermal conduction resistance of the reinforced VPX sealed chassis.

[0004] To achieve the above object, the present invention provides the following technical solutions: a heat dissipation device for reinforcing a VPX sealed chassis, comprising a VPX plug-in board, a guide rail heat dissipation structure, and a sealed chassis;

[0005] The VPX plug-in board includes a PCB board, a cold plate substrate is arranged on the PCB board, a heat pipe substrate and a heat pipe radiator are arranged on the cold plate substrate; a plurality of grooves are arranged on one side of the heat pipe substrate, and at least one first heat pipe is embedded in the plurality of grooves; the heat pipe radiator is connected and fixed to one end of the first heat pipe;

[0006] The guide rail heat dissipation structure includes two pieces of assembled heat sinks, and the heat sink includes an integrally formed guide rail base and heat dissipation teeth. A long groove is provided on the sealed chassis for the guide rail base to extend into the sealed chassis. The guide rail base portion is located inside the sealed chassis, and the heat dissipation tooth portion is located outside the sealed chassis. A hollow cavity is provided in the guide rail heat dissipation structure, and one or more second heat pipes or a liquid-filled and capillary structure are provided in the hollow cavity. The surface of the heat pipe radiator portion on the VPX plug-in board is in contact with the surface of the guide rail base portion located inside the sealed chassis.

[0007] Furthermore, a chip contact surface is provided on the other side of the heat pipe substrate; an opening structure is provided on the cold plate substrate at a position corresponding to the heating chip, and the chip contact surface of the heat pipe substrate is fitted with the heating chip on the VPX plug-in board passing through the opening structure.

[0008] Furthermore, thermal grease is applied on the chip contact surface.

[0009] Furthermore, thermal conductive silicone grease is applied on the contact surface between the heat pipe radiator and the guide rail substrate.

[0010] Furthermore, a chassis flange is arranged around the long groove, and the chassis flange is fixedly connected to the guide rail flange by bolts.

[0011] Furthermore, a conductive sealing strip is provided at the connection between the guide rail flange and the chassis flange.

[0012] Furthermore, a waterproof fan group and an air duct cover are arranged on the sealed chassis behind the heat dissipation teeth. The heat dissipation teeth are located in the air duct formed by the waterproof fan group and the air duct cover. The direction of the guided airflow formed by the waterproof fan group in the air duct cover is parallel to the tooth blades of the heat dissipation teeth.

[0013] Furthermore, every two adjacent guide rail substrates located inside the sealed chassis constitute a plug-in guide rail on the upper end of the VPX plug-in board, and the VPX plug-in board portion is fixedly clamped between the two adjacent guide rail substrates.

[0014] Furthermore, a locking strip is fixedly arranged on the VPX plug-in board, and the locking strip and the heat pipe radiator are respectively located on opposite sides of the upper portion of the VPX plug-in board; the locking strip and the heat pipe radiator are respectively in contact with and fit against corresponding inner surfaces of two adjacent guide rail substrates.

[0015] Furthermore, the hot end of the first heat pipe is adjacent to the heating element on the VPX plug-in board, the cold end of the first heat pipe is connected to the heat pipe radiator, the hot end of the second heat pipe is located in the guide rail base inside the sealed chassis, the cold end of the second heat pipe is located in the heat dissipation teeth outside the sealed chassis, and the cold end of the first heat pipe is adjacent to the hot end of the second heat pipe.

[0016] Furthermore, a mounting rail for positioning the lower part of the VPX plug-in board is provided on a wall surface opposite to the plug-in rail in the sealed chassis.

[0017] The technical effects of the present invention are as follows: by setting a guide rail heat dissipation structure passing through the sealed chassis and a heat dissipation method of a plug-in integrated track device composed of a two-stage heat pipe phase change heat dissipation method and an air-cooled heat dissipation method, the heat generated by the heating element on the VPX plug-in board in the sealed chassis is quickly dissipated to the outside of the sealed chassis, solving the heat dissipation efficiency problem of the VPX sealed chassis, improving the heat dissipation speed, and significantly improving the thermal conductivity efficiency. The structural design is simple, and the design and manufacturing cost of the heat dissipation structure of the sealed chassis is reduced. At the same time, the two adjacent guide rail substrates inside the sealed chassis constitute a plug-in guide rail for fixing the upper part of the VPX plug-in board. The plug-in guide rail cooperates with the installation guide rail in the sealed chassis to realize the installation and positioning of the opposite ends of the VPX plug-in board. The structure is simple, the functions are diverse, and the installation stability of the VPX plug-in board is good.

[0018] The device first conducts the heat generated by the heating element on the VPX plug-in board to the heat pipe radiator through the phase change heat conduction principle of the first heat pipe; the heat pipe radiator fits the guide rail base, and conducts the heat of the heat pipe radiator to the guide rail base through heat conduction; then the heat of the guide rail base is transferred to the heat dissipation teeth outside the sealed chassis through the heat conduction effect of the guide rail base and the second heat pipe in the hollow cavity and other phase change heat conduction principles; then the heat dissipation teeth are air-cooled and dissipated through the air-cooled convection heat dissipation method of the waterproof fan group and the air duct cover, so that the heat on the heat dissipation teeth is quickly dissipated. By widening the width of the VPX plug-in board, the contact area between the heat pipe radiator and the guide rail base can be increased, thereby increasing the heat transfer area and improving the heat conduction efficiency. The thermal resistance of the heat conduction path from the heating element of the VPX plug-in board to the air duct of the sealed chassis is greatly reduced, and the entire heat dissipation device is fast and efficient. The structure is simple, the structural requirements for the sealed chassis are small, the processing difficulty is small, and it is conducive to practical application.

[0019] In the prior art, both upper and lower rails are fixed inside the sealed chassis, and can only transfer heat to the sealed chassis for heat dissipation, causing the sealed chassis to be very hot and having poor heat dissipation effect. The rail heat dissipation structure in the present device is not only used to fix the VPX plug-in board, but also can transfer the heat of the heat pipe radiator to the heat dissipation teeth outside the sealed chassis through the principles of heat conduction and phase change heat transfer, and then use air cooling to dissipate heat, with high heat dissipation efficiency, avoiding the problem of overheating of the sealed chassis and poor heat dissipation effect, simple structure, diverse functions, and convenient disassembly and assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 An exploded view of the heat dissipation device in the embodiment;

[0021] Figure 2 An exploded view of the sealed chassis and guide rail heat dissipation structure in the embodiment;

[0022] Figure 3 An exploded view of the plug-in board heat dissipation device in the embodiment;

[0023] Figure 4 A schematic diagram of the inner side of a heat pipe substrate in an embodiment;

[0024] Figure 5 It is a structural schematic diagram of the VPX plug board in the embodiment;

[0025] Figure 6 An exploded view of the guide rail heat dissipation structure in the embodiment;

[0026] Figure 7 It is a simplified diagram of the connection structure between the VPX plug board and the guide rail base in the embodiment.

[0027] Figure numerals: 1. VPX plug-in board; 2. cold plate substrate; 3. heat pipe radiator; 4. locking strip; 5. chassis flange; 6. guide rail base; 7. guide rail flange; 8. heat dissipation teeth; 9. sealed chassis; 10. waterproof fan assembly; 11. air duct cover; 13. long groove; 14. mounting rail; 15. extraction aid; 16. heat pipe substrate; 17. first heat pipe; 18. heat generating chip; 19. chip contact surface; 20. second heat pipe; 21. hollow cavity. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0029] like Figure 1-7 As shown, a heat dissipation device for reinforcing a VPX sealed chassis includes a VPX plug-in board 1, a guide rail heat dissipation structure, and a sealed chassis 9;

[0030] The VPX plug-in board 1 includes a PCB board, a cold plate substrate 2 is arranged on the PCB board, a heat pipe substrate 16 and a heat pipe radiator 3 are arranged on the cold plate substrate 2; a plurality of grooves are arranged on one side of the heat pipe substrate 16, and at least one first heat pipe 17 is embedded in the plurality of grooves; the heat pipe radiator 3 is connected and fixed to one end of the first heat pipe 17.

[0031] The guide rail heat dissipation structure includes a heat sink composed of two pieces, and the heat sink includes an integrally formed guide rail base 6 and heat dissipation teeth 8. A long groove 13 is provided on the sealed chassis 9 for the guide rail base 6 to extend into the sealed chassis 9. The guide rail base 6 is partially located in the sealed chassis 9, and the heat dissipation teeth 8 are partially located outside the sealed chassis 9; a hollow cavity 21 is provided in the guide rail heat dissipation structure, and one or more second heat pipes 20 are provided in the hollow cavity 21 or filled with liquid and a capillary structure; a partial surface of the heat pipe radiator 3 on the VPX plug-in board 1 is connected to a partial surface of the guide rail base 6 located inside the sealed chassis 9.

[0032] A two-stage heat pipe heat dissipation method consisting of a heat pipe radiator 3 and a guide rail heat dissipation structure is adopted. The heat from the heat source such as the heat-generating chip 18 and heat dissipation components on the VPX plug-in board 1 is transferred to the guide rail base 6 through the heat pipe radiator 3 fixed on the cold plate substrate 2. The heat on the guide rail base 6 is transferred to the heat dissipation teeth 8 outside the sealed chassis 9, and the heat is dissipated through the heat dissipation teeth 8. The width of the VPX plug-in board 1 is increased, which increases the contact area with the guide rail base 6, reduces the contact thermal resistance, and improves the heat dissipation efficiency. A heat pipe is set in the hollow cavity 21 or filled with liquid and a capillary structure, which are brazed into one, and heat conduction is performed by phase change. The structure is simple, the structural requirements for the sealed chassis 9 are small, the processing difficulty is small, and it is conducive to practical application.

[0033] A chip contact surface 19 is provided on the other side of the heat pipe substrate 16; an opening structure is provided on the cold plate substrate 2 at a position corresponding to the heating chip 18, and the chip contact surface 19 of the heat pipe substrate 16 fits with the heating chip 18 on the VPX plug-in board 1 passing through the opening structure. Heat dissipation is achieved through heat conduction.

[0034] Apply thermal conductive silicone grease on the chip contact surface 19 to improve the heat conduction efficiency.

[0035] Thermal conductive silicone grease is applied on the contact surface between the heat pipe radiator 3 and the guide rail base 6 to improve the heat conduction efficiency.

[0036] The chassis flange 5 is arranged around the long groove 13, and the chassis flange 5 is fixedly connected with the guide rail flange 7 by bolts. The structure is simple, the installation is convenient, the structural requirements for the sealed chassis 9 are reduced, and the processing design is convenient.

[0037] A conductive sealing strip is provided at the connection between the guide rail flange 7 and the chassis flange 5 to improve the waterproof performance and electromagnetic shielding performance of the sealed chassis 9.

[0038] A waterproof fan group 10 and an air duct cover 11 are arranged on the sealed chassis 9 at the rear of the heat dissipation teeth 8. The heat dissipation teeth 8 are located in the air duct formed by the waterproof fan group 10 and the air duct cover 11. The direction of the guided airflow formed by the waterproof fan group 10 in the air duct cover 11 is parallel to the tooth blades of the heat dissipation teeth 8, thereby improving the heat dissipation efficiency. The heat dissipation teeth 8 are distributed in the part outside the sealed chassis 9, thereby increasing the heat dissipation area. The effect is equivalent to extending the first heat pipe 17 directly to the outside of the sealed chassis 9. The heat dissipation of the heat dissipation teeth 8 is accelerated by the waterproof fan group 10 and the air duct cover 11, thereby accelerating the heat dissipation of the heat dissipation teeth 8 and improving the heat dissipation efficiency. For axial flow fans and turbo fans with similar structures, the same is applicable regardless of the installation part at the front end, middle end, upper end, or other forms and installation positions of the heat dissipation teeth 8.

[0039] Every two adjacent guide rail bases 6 located inside the sealed chassis 9 constitute the plug-in guide rails at the upper end of the VPX plug-in board 1 , and a portion of the VPX plug-in board 1 is fixedly clamped between the two adjacent guide rail bases 6 .

[0040] The locking strip 4 is fixedly arranged on the VPX board 1 , and the locking strip 4 and the heat pipe radiator 3 are respectively located on opposite sides of the upper part of the VPX board 1 ; the locking strip 4 and the heat pipe radiator 3 are respectively in contact with the corresponding inner surfaces of two adjacent guide rail bases 6 .

[0041] The hot end of the first heat pipe 17 is adjacent to the heating element on the VPX board 1, the cold end of the first heat pipe 17 is connected to the heat pipe radiator 3, the hot end of the second heat pipe 20 is located in the guide rail base 6 in the sealed chassis 9, the cold end of the second heat pipe 20 is located in the heat dissipation tooth 8 outside the sealed chassis 9, and the cold end of the first heat pipe 17 is adjacent to the hot end of the second heat pipe 20. The heat dissipation efficiency is improved from the heating element to the heat pipe radiator 3, the heat pipe radiator 3 to the guide rail base 6 in the sealed chassis 9, and the guide rail base 6 to the heat dissipation tooth 8 outside the sealed chassis 9.

[0042] A mounting guide rail 14 for positioning the lower portion of the VPX board 1 is provided on a wall surface opposite to the plug-in guide rail in the sealed chassis 9 .

[0043] The sealed chassis 9 is designed with a guide rail base 6 of the same spacing according to the number of VPX plug-in boards 1 and the spacing between the VPX plug-in boards 1. The VPX plug-in boards 1 are inserted into the VPX backplane of the sealed chassis 9 through the guide rail base 6. The surface of the heat pipe radiator 3 on the VPX plug-in board 1 directly contacts the guide rail base 6, and thermal grease is applied between the two. The locking strip 4 and the pull-out aid 15 on the VPX plug-in board 1 are used to lock the VPX plug-in board 1. The locking structure of the locking strip 4 and the pull-out aid 15 is a prior art and will not be described in detail.

[0044] This device is not only suitable for 6U or 3U size VPX plug-in board 1 reinforced chassis rails, but also applies to CPCI, CPCI-E, LRM and other forms of rails with similar structures based on the heat pipe and other phase change heat dissipation methods of the plug-in integrated rail device. This device is not only suitable for vertical plug-in VPX module structures, but also for horizontal plug-in VPX module structure chassis with similar structures and other forms of rails.

[0045] According to the space conditions of the VPX module board in the sealed chassis 9, the contact area between the heat pipe radiator 3 of the VPX board 1 and the guide rail base 6 is increased as much as possible to improve the heat dissipation efficiency.

[0046] The working principle is as follows: This device adopts a two-stage heat pipe heat transfer plus a one-stage air cooling method for heat dissipation, wherein the first-stage heat pipe heat transfer method is to install a heat pipe radiator 3 on the VPX plug-in board 1, and the heat of the components on the VPX plug-in board 1 is transferred to the guide rail substrate in contact with the heat pipe radiator 3 through the heat pipe radiator 3.

[0047] The second-stage heat pipe heat transfer method is to design a rail heat dissipation structure, which adopts a structural form in which the rail base 6 and the heat dissipation teeth 8 are welded together with the second heat pipe 20. A plurality of strip-shaped hollow cavities 21 are designed inside the rail heat dissipation structure, and the second heat pipe 20 is arranged in the hollow cavity 21 or filled with liquid and capillary structure, and the heat of the rail base 6 in the sealed chassis 9 is quickly transferred to the heat dissipation teeth 8 outside the sealed chassis 9 by using the phase change heat transfer method. Then, the heat on the heat dissipation teeth is quickly dissipated by the wind cooling and heat dissipation effect of the heat dissipation teeth 8 by the waterproof fan group 10 and the air duct cover 11 outside the chassis.

[0048] The guide rail base 6 serves as a heat-conducting component between the inside and outside of the sealed chassis 9. The guide rail base 6 also serves as a plug-in guide to cooperate with the installation guide 14 in the sealed chassis 9 to position and fix the opposite ends of the VPX board 1.

[0049] Only the preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention, and various changes should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device for reinforcing a VPX sealed chassis, characterized in that: Including VPX plug-in board, guide rail heat dissipation structure, and sealed chassis; The VPX plug-in board includes a PCB board, a cold plate substrate is arranged on the PCB board, a heat pipe substrate and a heat pipe radiator are arranged on the cold plate substrate; a plurality of grooves are arranged on one side of the heat pipe substrate, and at least one first heat pipe is embedded in the plurality of grooves; the heat pipe radiator is connected and fixed to one end of the first heat pipe; The guide rail heat dissipation structure includes two pieces of heat sinks that are assembled together. The heat sink includes an integrally formed guide rail base and heat dissipation teeth. A long groove is provided on the sealed chassis for the guide rail base to extend into the sealed chassis. The guide rail base is partially located in the sealed chassis, and the heat dissipation teeth are partially located outside the sealed chassis. A hollow cavity is provided in the guide rail heat dissipation structure, and one or more second heat pipes are provided in the hollow cavity. The surface of the heat pipe radiator portion on the VPX plug-in board is in contact with the surface of the guide rail base portion located inside the sealed chassis. Every two adjacent guide rail bases located inside the sealed chassis constitute the plug-in guide rails on the upper part of the VPX plug-in board, and the upper fixing clip of the VPX plug-in board is arranged between the two adjacent guide rail bases; The hot end of the first heat pipe is adjacent to the heating element on the VPX plug-in board, the cold end of the first heat pipe is connected to the heat pipe radiator, the hot end of the second heat pipe is located in the guide rail base in the sealed chassis, the cold end of the second heat pipe is located in the heat dissipation teeth outside the sealed chassis, and the cold end of the first heat pipe is adjacent to the hot end of the second heat pipe.

2. A heat dissipation device for reinforcing a VPX sealed chassis according to claim 1, characterized in that: A chip contact surface is arranged on the other side of the heat pipe substrate; an opening structure is arranged on the cold plate substrate at a position corresponding to the heating chip, and the chip contact surface of the heat pipe substrate is fitted with the heating chip on the VPX plug-in board passing through the opening structure.

3. The heat dissipation device for reinforcing a VPX sealed chassis according to claim 1, characterized in that: A chassis flange is arranged around the long groove, and the chassis flange is fixedly connected with the guide rail flange by bolts.

4. The heat dissipation device for reinforcing a VPX sealed chassis according to claim 3, characterized in that: A conductive sealing strip is provided at the connection between the guide rail flange and the chassis flange.

5. The heat dissipation device for reinforcing a VPX sealed chassis according to claim 1, characterized in that: A waterproof fan group and an air duct cover are arranged on the sealed chassis behind the heat dissipation teeth. The heat dissipation teeth are located in the air duct formed by the waterproof fan group and the air duct cover. The direction of the guided airflow formed by the waterproof fan group in the air duct cover is parallel to the tooth blades of the heat dissipation teeth.

6. The heat dissipation device for reinforcing a VPX sealed chassis according to claim 5, characterized in that: A locking strip is fixedly arranged on the VPX plug-in board, and the locking strip and the heat pipe radiator are respectively located on opposite sides of the upper part of the VPX plug-in board; the locking strip and the heat pipe radiator are respectively in contact with and fit with corresponding inner surfaces of two adjacent guide rail substrates.

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