Leveling device and method for three-dimensional surface compensation processing

Abstract

The present invention discloses a leveler for three-dimensional surface compensation processing, and based on the leveler, provides a method for three-dimensional surface compensation processing, which solves the problem of collecting a large number of points in the existing traditional method. By testing a small number of points on the surface, the surface is fitted according to the point cloud to generate a three-dimensional surface, reconstruct the three-dimensional surface data of the surface to be measured, and compensate the CNC processing code so that the required pattern or text can be processed on the surface.

Description

Technical Field

[0001] The invention belongs to the technical field of engraving, and in particular relates to a leveling device and a method for three-dimensional curved surface compensation processing. Background Art

[0002] The working principle of the engraving machine is to design and layout through the dedicated engraving software configured in the computer, and the computer automatically transmits the design and layout information to the engraving machine controller, and then the controller converts this information into a power signal (pulse train) that can drive the stepper motor or servo motor, and controls the engraving machine host to generate the engraving tool path base of the X, Y, and Z axes. The high-speed rotating engraving head on the engraving machine cuts the processing material fixed on the host workbench through the tool configured according to the processing material, and can engrave various flat or three-dimensional relief graphics and text designed in the computer, realizing the engraving automation operation. When engraving large stone materials, the engraving surface cannot reach a completely horizontal level. There are several reasons for this:

[0003] Due to the inherent characteristics of the material, when the carving surface is large, even if the carving surface is smooth, it is impossible for the carving surface to be completely flat, and there will be ups and downs inside the carving surface.

[0004] Due to the inconsistent thickness of the engraving machine processing platform or the material itself, the material placed on the processing platform is not level. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides a leveling device and method for three-dimensional curved surface compensation processing, which solve the problems existing in the prior art.

[0006] In order to achieve the above-mentioned purpose of the invention, the technical solution adopted by the present invention is: a leveler for three-dimensional surface compensation processing, comprising a shell composed of a first cylinder and a second cylinder with different diameters; the diameter of the first cylinder is larger than that of the second cylinder, and one side of the first cylinder is provided with a display screen, a one-button power button, a compatible mode and signal confirmation button and a one-button pairing key, and the other side is connected to one side of the second cylinder, and a charging interface is provided on the side thereof; a mounting ear is provided on the other side of the second cylinder, and a first fixed column and a second fixed column are respectively provided on the side of the second cylinder, and the axes of the first fixed column and the second fixed column coincide with the axis of the display screen, and a retractable measuring axis is also provided on the second fixed column, and the measuring axis includes an outer tube fixed to the second fixed column and an inner shaft connected to the outer tube.

[0007] Furthermore, the housing is provided with a power circuit and a Bluetooth circuit, a USB circuit, an indication circuit and a display circuit connected to the power circuit;

[0008] The Bluetooth circuit includes a Bluetooth chip U4 of model nRF52832, the DEC1 pin of the Bluetooth chip U4 is connected to the ground capacitor C10, the P0.00 pin of the Bluetooth chip U4 is respectively connected to one end of the crystal oscillator X2 and the ground capacitor C9, the P0.01 pin of the Bluetooth chip U4 is respectively connected to the other end of the crystal oscillator X2 and the ground capacitor C13, the first VDD pin of the Bluetooth chip U4 is respectively connected to the ground capacitor C21 and the Vo pin of the power supply chip VR1 of model XC6206P302MR in the power supply circuit The ut pin is connected, the P0.16 pin of the Bluetooth chip U4 is connected to the positive electrode of the diode D6, the negative electrode of the diode D6 is connected to the grounding capacitor C33 and one end of the resistor R19 respectively through the resistor R20, the other end of the resistor R19 is connected to the grounding resistor R18 and the base of the transistor Q2 respectively, the emitter of the transistor Q2 is grounded, the collector of the transistor Q2 is connected to one end of the resistor R17, the other end of the resistor R17 is connected to one end of the resistor R16, the gate of the field effect transistor Q1 and the model BAV70 The first pin of the diode D5 of A4 is connected, the source of the field effect transistor Q1 is respectively connected to the other end of the resistor R16 and the BAT pin of the battery charging chip U5 in the power circuit, the drain of the field effect transistor Q1 is respectively connected to the Vin pin of the power chip VR1 and the grounding capacitor C32, the GND pin of the power chip VR1 is grounded, the second pin of the diode D5 is connected to the P0.31 pin of the Bluetooth chip U4 through the resistor R15, and the third pin of the diode D5 is connected to the ground through the resistor R7 and the button S2;

[0009] The P0.20 pin of the Bluetooth chip U4 is connected to one end of the resistor R6, and the other end of the resistor R6 is grounded through the button S1. The P0.21 pin of the Bluetooth chip U4 is connected to one end of the resistor R8, and the other end of the resistor R8 is grounded through the button S3. The ANT pin of the Bluetooth chip U4 is respectively connected to the grounded capacitor C18 and one end of the inductor L3, one end of the inductor L3 is respectively connected to the antenna and the grounded capacitor C19 and is grounded. The two VSS pins of the Bluetooth chip U4 are grounded. The DEC2 pin of the Bluetooth chip U4 is connected to the grounded capacitor C16, the DEC3 pin of the Bluetooth chip U4 is connected to the grounded capacitor C15, the XC1 pin of the Bluetooth chip U4 is respectively connected to one end of the crystal oscillator X1 and the grounded capacitor C12, the XC2 pin of the Bluetooth chip U4 is respectively connected to the other end of the crystal oscillator X1 and the ground The Bluetooth chip U4 is connected to capacitor C8. The VDD pin of the Bluetooth chip U4 is connected to the Vout pin of the power chip VR1 and the grounded capacitor C14. The P0.28 pin of the Bluetooth chip U4 is connected to one end of the resistor R4, one end of the resistor R5, and one end of the capacitor C20. The other end of the resistor R4 is connected to the BAT pin of the battery charging chip U5. The P0.27 pin of the Bluetooth chip U4 is connected to the other end of the resistor R5 and the other end of the capacitor C20. The DEC4 pin of the Bluetooth chip U4 is connected to the grounded capacitor C7 and one end of the inductor L1. The DCC pin of the Bluetooth chip U4 is connected to one end of the inductor L2. The other end of the inductor L1 is connected to the other end of the inductor L2. The second VDD pin of the Bluetooth chip U4 is connected to the grounded capacitor C11 and the Vout pin of the power chip VR1.

[0010] Furthermore, the USB circuit includes a USB control chip U2 of model CP2014-F03-GM, the GND pin of the USB control chip U2 is grounded, the D+ pin of the USB control chip U2 is connected to the 3rd pin of the USB interface J1, the D- pin of the USB control chip U2 is connected to the 2nd pin of the USB interface J1, the VIO pin of the USB control chip U2 is respectively connected to its VDD pin, the grounding capacitor C3 and the grounding capacitor C2, the REGIN pin of the USB control chip U2 is connected to its VUSB pin, the grounding capacitor C5, the grounding capacitor C6 and the 1st pin of the USB interface J1, and the Connected to the grounding capacitor C4, the VPP pin of the USB control chip U2 is connected to the grounding capacitor C1, the RXD pin of the USB control chip U2 is connected to the P0.14 pin of the Bluetooth chip U4, the TXD pin of the USB control chip U2 is connected to the P0.13 pin of the Bluetooth chip U4, and the 2nd to 4th pins of the USB interface J1 are all grounded.

[0011] Furthermore, the power supply circuit includes a battery charging chip U5 of model TP4057, a power supply chip VR1 of model XC6206P302MR, and a power supply chip VR2 of model XC6206P152MR;

[0012] The VCC pin of the battery charging chip U5 is connected to the 1st pin of the USB interface J1, one end of the resistor R9 and the grounding capacitor C22 respectively. The other end of the resistor R9 is connected to the P0.12 pin of the Bluetooth chip and the grounding resistor R11 respectively. The pin is connected to the cathode of the green light emitting diode D4, the anode of the green light emitting diode D4 is connected to one end of the resistor R14, the other end of the resistor R14 is connected to one end of the resistor R12 and the first pin of the USB interface J1, the other end of the resistor R12 is connected to the anode of the red light emitting diode D3, the cathode of the red light emitting diode D3 is connected to the cathode of the battery charging chip U5, and the cathode of the red light emitting diode D3 is connected to the cathode of the battery charging chip U5. The pin is connected to the P0.02 pin of the Bluetooth chip U4, the GND pin of the battery charging chip U5 is grounded, the BAT pin of the battery charging chip U5 is respectively connected to the grounding capacitor C27, the 1st pin of the battery socket P4 and the grounding capacitor C27, the 2nd pin of the battery socket P4 is grounded, the Vout pin of the power supply chip VR1 is respectively connected to the grounding capacitor C23, the grounding capacitor C24, the grounding capacitor C25, the grounding capacitor C29 and the Vin pin of the power supply chip VR2, the GND pin of the power supply chip VR2 is grounded, the Vout pin of the power supply chip VR2 is respectively connected to one end of the resistor R13 and the grounding capacitor C30, and the other end of the resistor R13 is respectively connected to the grounding capacitor C28 and the grounding capacitor C31;

[0013] The battery socket P4 is used to connect to a lithium battery and provide power for other circuits.

[0014] Furthermore, the indication circuit includes a terminal P2 and a terminal P3, wherein the first pin of the terminal P3 is connected to the SWDIO pin of the Bluetooth chip U4, the second pin of the terminal P3 is connected to the SWDCLK pin of the Bluetooth chip U4, the GND pin of the terminal P3 is grounded, and the fourth pin of the terminal P3 is respectively connected to the Vout pin of the power chip VR1, the positive electrode of the green light-emitting diode D1 and the positive electrode of the green light-emitting diode D2, the negative electrode of the green light-emitting diode D1 is connected to the ground resistor R2, and the negative electrode of the green light-emitting diode D2 is connected to the Bluetooth chip U4 through the resistor R3. The first pin of the wiring terminal P2 is connected to the P0.23 pin of the Bluetooth chip U4, the first pin of the wiring terminal P2 is grounded, the second pin of the wiring terminal P2 is respectively connected to the Vout pin of the power chip VR1 and the grounding capacitor C17, the third pin of the wiring terminal P2 is connected to the P0.06 pin of the Bluetooth chip U4, the fourth pin of the wiring terminal P2 is connected to the P0.05 pin of the Bluetooth chip U4, the fifth pin of the wiring terminal P2 is connected to the P0.04 pin of the Bluetooth chip U4, the sixth pin of the wiring terminal P2 is connected to the P0.03 pin of the Bluetooth chip U4, and the seventh pin of the wiring terminal P2 is connected to the other end of the resistor R13;

[0015] The wiring terminal P2 is a sensor interface, and the wiring terminal P3 is a debugging interface.

[0016] Furthermore, the display circuit includes a driver chip U1 of model HT1621B, a driver chip U3 of model TM1620 and a connection terminal P1;

[0017] The driver chip U1 The pins are connected to the P0.10 pin of the Bluetooth chip U4 and the STB pin of the driver chip U3 respectively. The pin is connected to the P0.09 pin of the Bluetooth chip U4, and the driver chip U1 The pins are respectively connected to the P0.08 pin of the Bluetooth chip U4 and the CLK pin of the driver chip U3, the DATA pin of the driver chip U1 is respectively connected to the P0.07 pin of the Bluetooth chip U4 and the DIN pin of the driver chip U3, the CSS pin of the driver chip U1 is grounded, the VLSD pin of the driver chip U1 is connected to the Vout pin of the power chip VR1 through the resistor R1, the VDD pin of the driver chip U1 is connected to the Vout pin of the power chip VR1, the SEG0 pin to the SEG10 pin of the driver chip U1 are respectively connected to the 12th pin to the 2nd pin of the terminal P1 in a one-to-one correspondence, and the SEG1 of the driver chip U1 is connected to the 12th pin to the 2nd pin of the terminal P1 in a one-to-one correspondence. Pin 2 is connected to pin 1 of the wiring terminal P1, pins COM0 to COM3 of the driver chip U1 are connected one-to-one with pins 16 to 13 of the wiring terminal P1, pins 16 to 13 of the wiring terminal P1 are connected one-to-one with pins GRID1, GRID2, GRID3 and GRID4 of the driver chip U3, pins 12 to 5 of the wiring terminal P1 are connected one-to-one with pins SEG1 to SEG8 of the driver chip U3, pin 4 of the wiring terminal P1 is connected to pin GRID6 of the driver chip U3, and the two GND pins of the driver chip U3 are grounded;

[0018] The connection terminal P1 is used to connect to the display screen.

[0019] Furthermore, a grating sensor is provided in the housing, and the grating sensor is used to measure the displacement of the inner shaft in the measuring shaft, and the connection terminal P2 is connected to the grating sensor.

[0020] Furthermore, the green LED D1, green LED D2, red LED D3 and green LED D4 serve as the power display light, charging display light, charging completion display light and program heartbeat display light of the level meter respectively, the button S1 serves as a compatible mode and signal confirmation button, the button S2 serves as a one-button power button, the button S3 serves as a one-button pairing button, and the USB interface J1 serves as a charging interface.

[0021] The beneficial effects of the present invention are:

[0022] (1) The present invention provides a leveler for three-dimensional surface compensation processing, which can accurately measure the height of the three-dimensional surface relative to the Z-axis 0 point, thereby being used to measure whether the surface to be processed is a plane.

[0023] (2) The circuit structure provided by the present invention is simple, easy to implement, and has low cost, and has good application prospects.

[0024] (3) The present invention provides a Bluetooth circuit and connects multiple fixed components, which expands the application scenarios of the level meter.

[0025] (4) The present invention can realize charging of the device through a USB interface, which solves the problem that the existing sensor device is powered by button batteries and needs to be replaced frequently.

[0026] (5) The present invention can realize one-button power on / off and automatic power off functions, and will automatically shut down if there is no change in the reading within 5-10 minutes of detection.

[0027] (6) The present invention can realize long-distance data transmission, and the transmission distance in open areas exceeds 100 meters.

[0028] A compensation processing method using a leveler for three-dimensional curved surface compensation processing comprises the following steps:

[0029] S1. Set a grid on the machining surface, use G code to obtain the tool machining trajectory, find the endpoints of all machining trajectories, and use the N grid points with the shortest distance around each endpoint as test points. Remove duplicate test points to obtain the test point set A.

[0030] S2. Install the level meter next to the tool, power on the level meter to automatically reset its readings to zero, and connect it to the receiving device;

[0031] S3. Set the reference point, set the coordinates of the reference point to (x0, y0, z0) and the pressing range to (a, b);

[0032] S4. Select the standard pressure value h in the pressure range (a, b), press the level gauge until its reading is within plus or minus c mm of the standard pressure value h, and record the actual pressure value h0 at the reference point;

[0033] S5. Lift the leveler through the tool controller and move it to the i-th test point. Press the leveler until its reading is within the range of plus or minus c mm of the standard pressure value h. According to the Z-axis displacement value recorded by the controller and the XY-axis coordinate value of the test point in the machining code, the coordinates of the i-th test point are obtained as (x i ,y i ,z i ), and record the actual pressure value of the i-th test point h i ;

[0034] S6, according to the reference point coordinates (x0, y0, z0), the actual pressure value h0 of the reference point, the test point coordinates (x i ,y i ,z i ) and the actual pressure value h at the test point i , get the height difference of the i-th test point relative to the reference point as Δh=hi -h0+z i -z0, where i = 1, 2, ..., P, and P represents the total number of test points in the test point set;

[0035] S7, reconstructing the surface according to the height difference between the test point and the reference point to obtain a reconstructed processing surface;

[0036] S8, reading the trajectory endpoint located in the code to be processed and using it as the point to be compensated;

[0037] S9. Compensate the points to be compensated according to the coordinates of the test points on the reconstructed surface and the coordinates of the points to be compensated, and perform three-dimensional surface compensation processing.

[0038] Furthermore, the surface reconstruction method in step S7 is an inverse distance weighted method, a polynomial interpolation method, a trend surface method or a Kriging method;

[0039] The compensation processing according to the Z-axis coordinates of the corresponding test points in step S9 includes three methods;

[0040] Method 1: Based on the X-axis and Y-axis coordinates of the point to be compensated, search for all adjacent test points to obtain a test point set B. Based on the distance between the test points in test point set B and the point to be compensated in the XY plane, take a weighted average of the Z-axis coordinates of all points in set B to obtain a value d. This value is then added to the Z-axis coordinate of the point to be compensated.

[0041] The specific d is:

[0042]

[0043] Among them, k j represents the distance from the jth test point to the point to be compensated, j = 1, 2, ..., L, L represents the total number of test points in the test point set B, z j Represents the Z-axis coordinate of the j-th test point in the test point set B;

[0044] Method 2: According to the X-axis and Y-axis coordinates of the point to be compensated, obtain the Z-axis coordinate d1 of the point on the reconstructed machining surface corresponding to the point to be compensated, and increase the Z-axis coordinate of the point to be compensated by d1;

[0045] Method 3: With the compensation point as the center, obtain all test points within a circle with a radius of R, calculate the compensation value d2 of the point to be compensated by the least squares method, and increase the Z-axis coordinate of the point to be compensated by d2;

[0046] If the length of the track to be processed in the code to be processed is greater than the threshold L, the track to be processed is divided into N segments, and the length of each segment is less than the threshold L.

[0047] The beneficial effects of the present invention are:

[0048] (1) The present invention is based on a leveler and solves the problem of collecting a large number of points in the existing traditional method. By testing a small number of points on the surface, the surface is fitted according to the point cloud to generate a three-dimensional surface, and the three-dimensional surface data of the surface to be tested is reconstructed. The CNC machining code is compensated so that the required pattern or text can be machined on the surface.

[0049] (2) The present invention can perform high-precision curved surface detection, providing a good foundation for processing patterns or engraving on curved surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 This is a schematic structural diagram of the leveling device proposed in the present invention.

[0051] Figure 2 It is a circuit diagram of the Bluetooth circuit in the present invention.

[0052] Figure 3 This is a battery charging circuit diagram of the present invention.

[0053] Figure 4 4 is a circuit diagram of the USB circuit in the present invention.

[0054] Figure 5 2 is a circuit diagram of the power supply circuit of the present invention.

[0055] Figure 6 2 is a circuit diagram of the indicator circuit in the present invention.

[0056] Figure 7 FIG. 2 is a circuit diagram showing a circuit in the present invention.

[0057] Figure 8 This is a flow chart of a compensation processing method using a leveler for three-dimensional surface compensation processing proposed by the present invention.

[0058] Among them: 1-housing, 2-first fixing column, 3-display screen, 4-power button, 5-preset value button, 6-metric-inch conversion button, 7-second fixing column, 8-outer tube, 9-inner shaft, 10-charging port, 11-mounting ear. DETAILED DESCRIPTION

[0059] The specific embodiments of the present invention are described below to facilitate understanding of the present invention by those skilled in the art. However, it should be clear that the present invention is not limited to the scope of the specific embodiments. For those skilled in the art, as long as various changes are within the spirit and scope of the present invention as defined and determined by the appended claims, these changes are obvious, and all inventions and creations utilizing the concepts of the present invention are protected.

[0060] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0061] Example 1

[0062] like Figure 1 As shown, a leveler for three-dimensional surface compensation processing is characterized in that it includes a shell 1 composed of a first cylinder and a second cylinder with different diameters; the diameter of the first cylinder is larger than that of the second cylinder, and one side of the first cylinder is provided with a display screen 3, a one-button power button 4, a compatible mode and signal confirmation button 5 and a one-button pairing button 6, and the other side is connected to one side of the second cylinder, and the side surface is provided with a charging interface 10; the other side of the second cylinder is provided with a mounting ear 11, and the side surfaces of the second cylinder are respectively provided with a first fixing column 2 and a second fixing column 7, the axes of the first fixing column 2 and the second fixing column 7 coincide with the axis of the display screen 3, and the second fixing column 7 is also provided with a retractable measuring axis, and the measuring axis includes an outer tube 8 fixed to the second fixing column 7 and an inner shaft 9 connected to the outer tube 8.

[0063] The housing 1 is provided with a power circuit and a Bluetooth circuit, a USB circuit, an indicator circuit and a display circuit connected to the power circuit;

[0064] like Figure 2-Figure 3As shown, the Bluetooth circuit includes a Bluetooth chip U4 of model nRF52832, the DEC1 pin of the Bluetooth chip U4 is connected to the ground capacitor C10, the P0.00 pin of the Bluetooth chip U4 is respectively connected to one end of the crystal oscillator X2 and the ground capacitor C9, the P0.01 pin of the Bluetooth chip U4 is respectively connected to the other end of the crystal oscillator X2 and the ground capacitor C13, the first VDD pin of the Bluetooth chip U4 is respectively connected to the ground capacitor C21 and the Vout pin of the power supply chip VR1 of model XC6206P302MR in the power supply circuit, the P0.16 pin of the Bluetooth chip U4 is connected to the positive electrode of the diode D6, the cathode of the diode D6 is respectively connected to the ground capacitor C33 and one end of the resistor R19 through the resistor R20, and the other end of the resistor R19 is respectively connected to the ground capacitor C33 and one end of the resistor R19. Resistor R18 is connected to the base of transistor Q2, the emitter of transistor Q2 is grounded, the collector of transistor Q2 is connected to one end of resistor R17, the other end of resistor R17 is respectively connected to one end of resistor R16, the gate of field effect transistor Q1 and the first pin of diode D5 model BAV70A4, the source of field effect transistor Q1 is respectively connected to the other end of resistor R16 and the BAT pin of battery charging chip U5 in the power supply circuit, the drain of field effect transistor Q1 is respectively connected to the Vin pin of power chip VR1 and grounding capacitor C32, the GND pin of power chip VR1 is grounded, the second pin of diode D5 is connected to P0.31 pin of Bluetooth chip U4 through resistor R15, and the third pin of diode D5 is connected to ground through resistor R7 and button S2 in sequence;

[0065] The P0.20 pin of the Bluetooth chip U4 is connected to one end of the resistor R6, and the other end of the resistor R6 is grounded through the button S1. The P0.21 pin of the Bluetooth chip U4 is connected to one end of the resistor R8, and the other end of the resistor R8 is grounded through the button S3. The ANT pin of the Bluetooth chip U4 is respectively connected to the grounded capacitor C18 and one end of the inductor L3, one end of the inductor L3 is respectively connected to the antenna and the grounded capacitor C19 and is grounded. The two VSS pins of the Bluetooth chip U4 are grounded. The DEC2 pin of the Bluetooth chip U4 is connected to the grounded capacitor C16, the DEC3 pin of the Bluetooth chip U4 is connected to the grounded capacitor C15, the XC1 pin of the Bluetooth chip U4 is respectively connected to one end of the crystal oscillator X1 and the grounded capacitor C12, the XC2 pin of the Bluetooth chip U4 is respectively connected to the other end of the crystal oscillator X1 and the ground The Bluetooth chip U4 is connected to capacitor C8. The VDD pin of the Bluetooth chip U4 is connected to the Vout pin of the power chip VR1 and the grounded capacitor C14. The P0.28 pin of the Bluetooth chip U4 is connected to one end of the resistor R4, one end of the resistor R5, and one end of the capacitor C20. The other end of the resistor R4 is connected to the BAT pin of the battery charging chip U5. The P0.27 pin of the Bluetooth chip U4 is connected to the other end of the resistor R5 and the other end of the capacitor C20. The DEC4 pin of the Bluetooth chip U4 is connected to the grounded capacitor C7 and one end of the inductor L1. The DCC pin of the Bluetooth chip U4 is connected to one end of the inductor L2. The other end of the inductor L1 is connected to the other end of the inductor L2. The second VDD pin of the Bluetooth chip U4 is connected to the grounded capacitor C11 and the Vout pin of the power chip VR1.

[0066] like Figure 4 As shown, the USB circuit includes a USB control chip U2 of model CP2014-F03-GM, the GND pin of the USB control chip U2 is grounded, the D+ pin of the USB control chip U2 is connected to the 3rd pin of the USB interface J1, the D- pin of the USB control chip U2 is connected to the 2nd pin of the USB interface J1, the VIO pin of the USB control chip U2 is respectively connected to its VDD pin, the grounding capacitor C3 and the grounding capacitor C2, the REGIN pin of the USB control chip U2 is connected to its VUSB pin, the grounding capacitor C5, the grounding capacitor C6 and the 1st pin of the USB interface J1, and the Connected to the grounding capacitor C4, the VPP pin of the USB control chip U2 is connected to the grounding capacitor C1, the RXD pin of the USB control chip U2 is connected to the P0.14 pin of the Bluetooth chip U4, the TXD pin of the USB control chip U2 is connected to the P0.13 pin of the Bluetooth chip U4, and the 2nd to 4th pins of the USB interface J1 are all grounded.

[0067] like Figure 5 As shown, the power supply circuit includes a battery charging chip U5 of model TP4057, a power supply chip VR1 of model XC6206P302MR, and a power supply chip VR2 of model XC6206P152MR;

[0068] The VCC pin of the battery charging chip U5 is connected to the 1st pin of the USB interface J1, one end of the resistor R9 and the grounding capacitor C22 respectively. The other end of the resistor R9 is connected to the P0.12 pin of the Bluetooth chip and the grounding resistor R11 respectively. The pin is connected to the cathode of the green light emitting diode D4, the anode of the green light emitting diode D4 is connected to one end of the resistor R14, the other end of the resistor R14 is connected to one end of the resistor R12 and the first pin of the USB interface J1, the other end of the resistor R12 is connected to the anode of the red light emitting diode D3, the cathode of the red light emitting diode D3 is connected to the cathode of the battery charging chip U5, and the cathode of the red light emitting diode D3 is connected to the cathode of the battery charging chip U5. The pin is connected to the P0.02 pin of the Bluetooth chip U4, the GND pin of the battery charging chip U5 is grounded, the BAT pin of the battery charging chip U5 is respectively connected to the grounding capacitor C27, the 1st pin of the battery socket P4 and the grounding capacitor C27, the 2nd pin of the battery socket P4 is grounded, the Vout pin of the power supply chip VR1 is respectively connected to the grounding capacitor C23, the grounding capacitor C24, the grounding capacitor C25, the grounding capacitor C29 and the Vin pin of the power supply chip VR2, the GND pin of the power supply chip VR2 is grounded, the Vout pin of the power supply chip VR2 is respectively connected to one end of the resistor R13 and the grounding capacitor C30, and the other end of the resistor R13 is respectively connected to the grounding capacitor C28 and the grounding capacitor C31;

[0069] The battery socket P4 is used to connect to a lithium battery and provide power for other circuits.

[0070] like Figure 6As shown, the indication circuit includes a wiring terminal P2 and a wiring terminal P3, the first pin of the wiring terminal P3 is connected to the SWDIO pin of the Bluetooth chip U4, the second pin of the wiring terminal P3 is connected to the SWDCLK pin of the Bluetooth chip U4, the GND pin of the wiring terminal P3 is grounded, the fourth pin of the wiring terminal P3 is respectively connected to the Vout pin of the power chip VR1, the positive electrode of the green light-emitting diode D1 and the positive electrode of the green light-emitting diode D2, the cathode of the green light-emitting diode D1 is connected to the ground resistor R2, and the cathode of the green light-emitting diode D2 is connected to the ground resistor R3. The first pin of the wiring terminal P2 is connected to the P0.23 pin, the first pin of the wiring terminal P2 is grounded, the second pin of the wiring terminal P2 is respectively connected to the Vout pin of the power chip VR1 and the grounding capacitor C17, the third pin of the wiring terminal P2 is connected to the P0.06 pin of the Bluetooth chip U4, the fourth pin of the wiring terminal P2 is connected to the P0.05 pin of the Bluetooth chip U4, the fifth pin of the wiring terminal P2 is connected to the P0.04 pin of the Bluetooth chip U4, the sixth pin of the wiring terminal P2 is connected to the P0.03 pin of the Bluetooth chip U4, and the seventh pin of the wiring terminal P2 is connected to the other end of the resistor R13;

[0071] The wiring terminal P2 is a sensor interface, and the wiring terminal P3 is a debugging interface.

[0072] like Figure 7 As shown, the display circuit includes a driver chip U1 of model HT1621B, a driver chip U3 of model TM1620 and a connection terminal P1;

[0073] The driver chip U1 The pins are connected to the P0.10 pin of the Bluetooth chip U4 and the STB pin of the driver chip U3 respectively. The pin is connected to the P0.09 pin of the Bluetooth chip U4, and the driver chip U1 The pins are respectively connected to the P0.08 pin of the Bluetooth chip U4 and the CLK pin of the driver chip U3, the DATA pin of the driver chip U1 is respectively connected to the P0.07 pin of the Bluetooth chip U4 and the DIN pin of the driver chip U3, the CSS pin of the driver chip U1 is grounded, the VLSD pin of the driver chip U1 is connected to the Vout pin of the power chip VR1 through the resistor R1, the VDD pin of the driver chip U1 is connected to the Vout pin of the power chip VR1, the SEG0 pin to the SEG10 pin of the driver chip U1 are respectively connected to the 12th pin to the 2nd pin of the terminal P1 in a one-to-one correspondence, and the SEG1 of the driver chip U1 is connected to the 12th pin to the 2nd pin of the terminal P1 in a one-to-one correspondence. Pin 2 is connected to pin 1 of the wiring terminal P1, pins COM0 to COM3 of the driver chip U1 are connected one-to-one with pins 16 to 13 of the wiring terminal P1, pins 16 to 13 of the wiring terminal P1 are connected one-to-one with pins GRID1, GRID2, GRID3 and GRID4 of the driver chip U3, pins 12 to 5 of the wiring terminal P1 are connected one-to-one with pins SEG1 to SEG8 of the driver chip U3, pin 4 of the wiring terminal P1 is connected to pin GRID6 of the driver chip U3, and the two GND pins of the driver chip U3 are grounded;

[0074] The connection terminal P1 is used to connect to the display screen 3 .

[0075] A grating sensor is further provided in the housing 1 , and the grating sensor is used to measure the displacement of the inner shaft 9 in the measuring shaft. The connection terminal P2 is connected to the grating sensor.

[0076] The green LED D1, green LED D2, red LED D3 and green LED D4 serve as the power display light, charging display light, charging completion display light and program heartbeat display light of the level meter respectively; the button S1 serves as the compatible mode and signal confirmation button 5; the button S2 serves as the one-button power button 4; the button S3 serves as the one-button pairing button 6; and the USB interface J1 serves as the charging interface 10.

[0077] In this embodiment, the level meter is first turned on by the one-button power button 4, the compatible mode and signal confirmation button 5 and the one-button pairing button 6, and data connection and charging are performed through the USB circuit. The rechargeable battery is charged through the chip TP4057. The relevant indication signal of TP4057 has been connected to NRF52832, so it can be known whether it is currently charging and whether the charging is completed. The power circuit is connected to the USB circuit to charge the battery and power the level meter. The displacement of the inner shaft 9 in the measuring axis is measured by the grating sensor, and the measured displacement data is transmitted to the embedded device through the Bluetooth module. Finally, the data is displayed through the display circuit part and the display screen 3.

[0078] Compatibility Mode and Signal Confirmation Button 5 is used to switch between various signal modes, such as Bluetooth serial port compatibility and direct 2.4G dedicated protocol. A short press in measurement mode adds a confirmation signal to the transmitted measurement data frame, confirming the accuracy and validity of the frame data to the receiving end. This signal is not required in the current application scenario.

[0079] Confirmation is a valid application scenario: For example, in a factory, when automatically inspecting and recording dimensional errors of multiple parts, the receiver does not know when the next workpiece has been switched to. At this point, the worker presses the confirmation button, and the receiver records the data frame as the measurement value of the part. When the next part is switched to, the worker presses the confirmation button again, and the receiver records the value again.

[0080] One-touch pairing button 6 is used when using the automatic 2.4G communication mode and is not used in Bluetooth mode. Put the receiver in pairing mode and press button 6 on the level meter. The level meter sends a pairing signal. The receiver modifies its internal receiving address based on the address in the pairing data and sends a signal to notify the level meter that pairing is complete. After pairing is complete, the receiver and level meter are paired one by one. The receiver will not receive measurement signals from level meters with other addresses, but it can receive pairing signals from any level meter while in pairing mode.

[0081] Example 2

[0082] like Figure 8 As shown, a compensation processing method using a leveler for three-dimensional surface compensation processing includes the following steps:

[0083] S1. Set a grid on the machining surface, use G code to obtain the tool machining trajectory, find the endpoints of all machining trajectories, and use the N grid points with the shortest distance around each endpoint as test points. Remove duplicate test points to obtain the test point set A.

[0084] S2. Install the level meter next to the tool, power on the level meter to automatically reset its readings to zero, and connect it to the receiving device;

[0085] S3. Set the reference point, set the coordinates of the reference point to (x0, y0, z0) and the pressing range to (a, b);

[0086] S4. Select the standard pressure value h in the pressure range (a, b), press the level gauge until its reading is within plus or minus c mm of the standard pressure value h, and record the actual pressure value h0 at the reference point;

[0087] S5. Lift the leveler through the tool controller and move it to the i-th test point. Press the leveler until its reading is within the range of plus or minus c mm of the standard pressure value h. According to the Z-axis displacement value recorded by the controller and the XY-axis coordinate value of the test point in the machining code, the coordinates of the i-th test point are obtained as (x i ,y i ,z i ), and record the actual pressure value of the i-th test point h i ;

[0088] S6, according to the reference point coordinates (x0, y0, z0), the actual pressure value h0 of the reference point, the test point coordinates (x i ,y i ,z i ) and the actual pressure value h at the test point i , get the height difference of the i-th test point relative to the reference point as Δh=h i -h0+z i -z0, where i = 1, 2, ..., P, and P represents the total number of test points in the test point set;

[0089] S7, reconstructing the surface according to the height difference between the test point and the reference point to obtain a reconstructed processing surface;

[0090] S8, reading the trajectory endpoint located in the code to be processed and using it as the point to be compensated;

[0091] S9. Compensate the points to be compensated according to the coordinates of the test points on the reconstructed surface and the coordinates of the points to be compensated, and perform three-dimensional surface compensation processing.

[0092] The surface reconstruction method in step S7 is an inverse distance weighted method, a polynomial interpolation method, a trend surface method or a kriging method;

[0093] The compensation processing according to the Z-axis coordinates of the corresponding test points in step S9 includes three methods;

[0094] Method 1: Based on the X-axis and Y-axis coordinates of the point to be compensated, search for all adjacent test points to obtain a test point set B. Based on the distance between the test points in test point set B and the point to be compensated in the XY plane, take a weighted average of the Z-axis coordinates of all points in set B to obtain a value d. This value is then added to the Z-axis coordinate of the point to be compensated.

[0095] The specific d is:

[0096]

[0097] Among them, k j represents the distance from the jth test point to the point to be compensated, j = 1, 2, ..., L, L represents the total number of test points in the test point set B, z j Represents the Z-axis coordinate of the j-th test point in the test point set B;

[0098] Method 2: According to the X-axis and Y-axis coordinates of the point to be compensated, obtain the Z-axis coordinate d1 of the point on the reconstructed machining surface corresponding to the point to be compensated, and increase the Z-axis coordinate of the point to be compensated by d1;

[0099] Method 3: With the compensation point as the center, obtain all test points within a circle with a radius of R, calculate the compensation value d2 of the point to be compensated by the least squares method, and increase the Z-axis coordinate of the point to be compensated by d2;

[0100] If the length of the track to be processed in the code to be processed is greater than the threshold L, the track to be processed is divided into N segments, and the length of each segment is less than the threshold L.

[0101] In this embodiment, the level meter may be preferably a laser level meter, and continuous sampling and compensation may be performed.

Claims

1. A compensation processing method for a leveler, characterized in that: The following steps are involved: S1. Set a grid on the machining surface, use G code to obtain the tool machining trajectory, find the endpoints of all machining trajectories, and use the N grid points with the shortest distance around each endpoint as test points. Remove duplicate test points to obtain the test point set A. S2. Install the level meter next to the tool, power on the level meter to automatically reset its readings to zero, and connect it to the receiving device; S3. Set the reference point and set the coordinates of the reference point to and the pressure range is (a,b); S4. Select the standard pressure value h in the pressure range (a, b), press the leveler until its reading is within plus or minus c mm of the standard pressure value h, and record the actual pressure value of the reference point. ; S5. Lift the leveler through the tool controller and move it to the i-th test point. Press the leveler until its reading is within the range of plus or minus c mm of the standard pressure value h. According to the Z-axis displacement value recorded by the controller and the XY-axis coordinate value of the test point in the machining code, the coordinates of the i-th test point are obtained as , and record the actual pressure value of the i-th test point ; S6. According to the reference point coordinates , actual pressure value of reference point , test point coordinates And the actual pressure value of the test point , get the height difference of the i-th test point relative to the reference point , where i=1,2,...,P, P represents the total number of test points in the test point set; S7, reconstructing a surface according to the height difference between the test point and the reference point to obtain a reconstructed processed surface; the surface reconstruction method is an inverse distance weighted method, a polynomial interpolation method, a trend surface method or a kriging method; S8, reading the trajectory endpoint located in the code to be processed and using it as the point to be compensated; S9, compensating the points to be compensated according to the coordinates of the test points on the reconstructed surface and the coordinates of the points to be compensated, and performing three-dimensional surface compensation processing; the compensation processing according to the Z-axis coordinates of the corresponding test points includes three methods; Method 1: Based on the X-axis and Y-axis coordinates of the point to be compensated, search for all adjacent test points to obtain a test point set B. Based on the distance between the test points in test point set B and the point to be compensated in the XY plane, take a weighted average of the Z-axis coordinates of all points in set B to obtain a value d. This value is then added to the Z-axis coordinate of the point to be compensated. The specific d is: in, represents the distance from the jth test point to the point to be compensated, j=1,2,...,L, L represents the total number of test points in the test point set B, Represents the Z-axis coordinate of the j-th test point in the test point set B; Method 2: According to the X-axis and Y-axis coordinates of the point to be compensated, obtain the Z-axis coordinate d1 of the point on the reconstructed machining surface corresponding to the point to be compensated, and increase the Z-axis coordinate of the point to be compensated by d1; Method 3: With the compensation point as the center, obtain all test points within a circle with a radius of R, calculate the compensation value d2 of the point to be compensated by the least squares method, and increase the Z-axis coordinate of the point to be compensated by d2; If the length of the track to be processed in the code to be processed is greater than the threshold L, the track to be processed is divided into N segments, and the length of each segment is less than the threshold L.

2. A leveling device for performing three-dimensional curved surface compensation processing of the leveling device compensation processing method according to claim 1, characterized in that: The invention comprises a housing (1) consisting of a first cylinder and a second cylinder of different diameters; the diameter of the first cylinder is larger than that of the second cylinder, one side of which is provided with a display screen (3), a one-button power-on button (4), a compatible mode and signal confirmation button (5) and a one-button pairing button (6), and the other side of the first cylinder is connected to one side of the second cylinder, and a charging interface (10) is provided on the side of the first cylinder; the other side of the second cylinder is provided with a mounting ear (11), and the side of the second cylinder is provided with a first fixing column (2) and a second fixing column (7), respectively, the axes of the first fixing column (2) and the second fixing column (7) both coincide with the axis of the display screen (3), and the second fixing column (7) is also provided with a retractable measuring axis, the measuring axis comprising an outer tube (8) fixed to the second fixing column (7) and an inner shaft (9) connected to the outer tube (8).

3. The leveling device for three-dimensional curved surface compensation processing according to claim 2, characterized in that: The housing (1) is provided with a power supply circuit and a Bluetooth circuit, a USB circuit, an indication circuit and a display circuit connected to the power supply circuit; The Bluetooth circuit includes a Bluetooth chip U4 with a model number of nRF52832, a DEC1 pin of the Bluetooth chip U4 is connected to a grounding capacitor C10, a P0.00 pin of the Bluetooth chip U4 is respectively connected to one end of the crystal oscillator X2 and a grounding capacitor C9, a P0.01 pin of the Bluetooth chip U4 is respectively connected to the other end of the crystal oscillator X2 and a grounding capacitor C13, a first VDD pin of the Bluetooth chip U4 is respectively connected to a grounding capacitor C21 and a Vout pin of a power supply chip VR1 with a model number of XC6206P302MR in the power supply circuit, a P0.16 pin of the Bluetooth chip U4 is connected to the positive electrode of the diode D6, and the negative electrode of the diode D6 is respectively connected to the grounding capacitor C33 and one end of the resistor R19 through a resistor R20, and the other end of the resistor R19 is respectively connected to the grounding resistor R 18 is connected to the base of the transistor Q2, the emitter of the transistor Q2 is grounded, the collector of the transistor Q2 is connected to one end of the resistor R17, the other end of the resistor R17 is respectively connected to one end of the resistor R16, the gate of the field effect transistor Q1 and the first pin of the diode D5 with a model number of BAV70A4, the source of the field effect transistor Q1 is respectively connected to the other end of the resistor R16 and the BAT pin of the battery charging chip U5 in the power supply circuit, the drain of the field effect transistor Q1 is respectively connected to the Vin pin of the power supply chip VR1 and the grounding capacitor C32, the GND pin of the power supply chip VR1 is grounded, the second pin of the diode D5 is connected to the P0.31 pin of the Bluetooth chip U4 through the resistor R15, and the third pin of the diode D5 is connected to the ground through the resistor R7 and the button S2 in sequence; The P0.20 pin of the Bluetooth chip U4 is connected to one end of the resistor R6, and the other end of the resistor R6 is grounded through the button S1. The P0.21 pin of the Bluetooth chip U4 is connected to one end of the resistor R8, and the other end of the resistor R8 is grounded through the button S3. The ANT pin of the Bluetooth chip U4 is respectively connected to the grounded capacitor C18 and one end of the inductor L3, one end of the inductor L3 is respectively connected to the antenna and the grounded capacitor C19 and is grounded. The two VSS pins of the Bluetooth chip U4 are grounded. The DEC2 pin of the Bluetooth chip U4 is connected to the grounded capacitor C16, the DEC3 pin of the Bluetooth chip U4 is connected to the grounded capacitor C15, the XC1 pin of the Bluetooth chip U4 is respectively connected to one end of the crystal oscillator X1 and the grounded capacitor C12, the XC2 pin of the Bluetooth chip U4 is respectively connected to the other end of the crystal oscillator X1 and the ground The Bluetooth chip U4 is connected to the capacitor C8, the VDD pin of the Bluetooth chip U4 is respectively connected to the Vout pin of the power chip VR1 and the grounding capacitor C14, the P0.28 pin of the Bluetooth chip U4 is respectively connected to one end of the resistor R4, one end of the resistor R5 and one end of the capacitor C20, the other end of the resistor R4 is connected to the BAT pin of the battery charging chip U5, the P0.27 pin of the Bluetooth chip U4 is respectively connected to the other end of the resistor R5 and the other end of the capacitor C20, the DEC4 pin of the Bluetooth chip U4 is respectively connected to the grounding capacitor C7 and one end of the inductor L1, the DCC pin of the Bluetooth chip U4 is connected to one end of the inductor L2, the other end of the inductor L1 is connected to the other end of the inductor L2, and the second VDD pin of the Bluetooth chip U4 is respectively connected to the grounding capacitor C11 and the Vout pin of the power chip VR1.

4. The leveling device for three-dimensional curved surface compensation processing according to claim 3, characterized in that: The USB circuit includes a USB control chip U2 of model CP2014-F03-GM, the GND pin of the USB control chip U2 is grounded, the D+ pin of the USB control chip U2 is connected to the 3rd pin of the USB interface J1, the D- pin of the USB control chip U2 is connected to the 2nd pin of the USB interface J1, the VIO pin of the USB control chip U2 is respectively connected to its VDD pin, the grounding capacitor C3 and the grounding capacitor C2, the REGIN pin of the USB control chip U2 is connected to its VUSB pin, the grounding capacitor C5, the grounding capacitor C6 and the 1st pin of the USB interface J1, and the Connected to the grounding capacitor C4, the VPP pin of the USB control chip U2 is connected to the grounding capacitor C1, the RXD pin of the USB control chip U2 is connected to the P0.14 pin of the Bluetooth chip U4, the TXD pin of the USB control chip U2 is connected to the P0.13 pin of the Bluetooth chip U4, and the 2nd to 4th pins of the USB interface J1 are all grounded.

5. The leveling device for three-dimensional curved surface compensation processing according to claim 4, characterized in that: The power supply circuit includes a battery charging chip U5 of model TP4057, a power supply chip VR1 of model XC6206P302MR, and a power supply chip VR2 of model XC6206P152MR; The VCC pin of the battery charging chip U5 is connected to the 1st pin of the USB interface J1, one end of the resistor R9 and the grounding capacitor C22 respectively. The other end of the resistor R9 is connected to the P0.12 pin of the Bluetooth chip and the grounding resistor R11 respectively. The pin is connected to the cathode of the green light emitting diode D4, the anode of the green light emitting diode D4 is connected to one end of the resistor R14, the other end of the resistor R14 is connected to one end of the resistor R12 and the first pin of the USB interface J1, the other end of the resistor R12 is connected to the anode of the red light emitting diode D3, the cathode of the red light emitting diode D3 is connected to the cathode of the battery charging chip U5, and the cathode of the red light emitting diode D3 is connected to the cathode of the battery charging chip U5. The pin is connected to the P0.02 pin of the Bluetooth chip U4, the GND pin of the battery charging chip U5 is grounded, the BAT pin of the battery charging chip U5 is respectively connected to the grounding capacitor C27, the 1st pin of the battery socket P4 and the grounding capacitor C27, the 2nd pin of the battery socket P4 is grounded, the Vout pin of the power supply chip VR1 is respectively connected to the grounding capacitor C23, the grounding capacitor C24, the grounding capacitor C25, the grounding capacitor C29 and the Vin pin of the power supply chip VR2, the GND pin of the power supply chip VR2 is grounded, the Vout pin of the power supply chip VR2 is respectively connected to one end of the resistor R13 and the grounding capacitor C30, and the other end of the resistor R13 is respectively connected to the grounding capacitor C28 and the grounding capacitor C31; The battery socket P4 is used to connect to a lithium battery and provide power for other circuits.

6. The leveling device for three-dimensional curved surface compensation processing according to claim 5, characterized in that: The indication circuit includes a wiring terminal P2 and a wiring terminal P3, wherein the first pin of the wiring terminal P3 is connected to the SWDIO pin of the Bluetooth chip U4, the second pin of the wiring terminal P3 is connected to the SWDCLK pin of the Bluetooth chip U4, the GND pin of the wiring terminal P3 is grounded, and the fourth pin of the wiring terminal P3 is respectively connected to the Vout pin of the power chip VR1, the positive electrode of the green light-emitting diode D1 and the positive electrode of the green light-emitting diode D2, the cathode of the green light-emitting diode D1 is connected to the grounding resistor R2, and the cathode of the green light-emitting diode D2 is connected to the P0 pin of the Bluetooth chip U4 through the resistor R3. .23 pins, the 1st pin of the wiring terminal P2 is grounded, the 2nd pin of the wiring terminal P2 is respectively connected to the Vout pin of the power chip VR1 and the grounding capacitor C17, the 3rd pin of the wiring terminal P2 is connected to the P0.06 pin of the Bluetooth chip U4, the 4th pin of the wiring terminal P2 is connected to the P0.05 pin of the Bluetooth chip U4, the 5th pin of the wiring terminal P2 is connected to the P0.04 pin of the Bluetooth chip U4, the 6th pin of the wiring terminal P2 is connected to the P0.03 pin of the Bluetooth chip U4, and the 7th pin of the wiring terminal P2 is connected to the other end of the resistor R13; The wiring terminal P2 is a sensor interface, and the wiring terminal P3 is a debugging interface.

7. The leveling device for three-dimensional curved surface compensation processing according to claim 6, characterized in that: The display circuit includes a driver chip U1 of model HT1621B, a driver chip U3 of model TM1620 and a connection terminal P1; The driver chip U1 The pins are connected to the P0.10 pin of the Bluetooth chip U4 and the STB pin of the driver chip U3 respectively. The pin is connected to the P0.09 pin of the Bluetooth chip U4, and the driver chip U1 The pins are respectively connected to the P0.08 pin of the Bluetooth chip U4 and the CLK pin of the driver chip U3, the DATA pin of the driver chip U1 is respectively connected to the P0.07 pin of the Bluetooth chip U4 and the DIN pin of the driver chip U3, the CSS pin of the driver chip U1 is grounded, the VLSD pin of the driver chip U1 is connected to the Vout pin of the power chip VR1 through the resistor R1, the VDD pin of the driver chip U1 is connected to the Vout pin of the power chip VR1, the SEG0 pin to the SEG10 pin of the driver chip U1 are respectively connected to the 12th pin to the 2nd pin of the terminal P1 in a one-to-one correspondence, and the SEG1 of the driver chip U1 is connected to the 12th pin to the 2nd pin of the terminal P1 in a one-to-one correspondence. Pin 2 is connected to pin 1 of the wiring terminal P1, pins COM0 to COM3 of the driver chip U1 are connected one-to-one with pins 16 to 13 of the wiring terminal P1, pins 16 to 13 of the wiring terminal P1 are connected one-to-one with pins GRID1, GRID2, GRID3 and GRID4 of the driver chip U3, pins 12 to 5 of the wiring terminal P1 are connected one-to-one with pins SEG1 to SEG8 of the driver chip U3, pin 4 of the wiring terminal P1 is connected to pin GRID6 of the driver chip U3, and the two GND pins of the driver chip U3 are grounded; The connection terminal P1 is used for connecting to the display screen (3).

8. The leveling device for three-dimensional curved surface compensation processing according to claim 7, characterized in that: A grating sensor is also provided in the housing (1), and the grating sensor is used to measure the displacement of the inner shaft (9) in the measuring shaft, and the connection terminal P2 is connected to the grating sensor.

9. The leveling device for three-dimensional curved surface compensation processing according to claim 7, characterized in that: The green light-emitting diode D1, the green light-emitting diode D2, the red light-emitting diode D3 and the green light-emitting diode D4 respectively serve as a power indicator light, a charging indicator light, a charging completion indicator light and a program heartbeat indicator light of the level meter; the button S1 serves as a compatible mode and signal confirmation button (5); the button S2 serves as a one-button power-on button (4); the button S3 serves as a one-button pairing button (6); and the USB interface J1 serves as a charging interface (10).

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