An electroplating device and electroplating method for a crystallizer copper plate

Abstract

The present invention discloses a plating method for a mold copper plate, comprising: obtaining a first plating solution, wherein the cobalt ion content in the first plating solution is controlled at 0-1 g / L, and the nickel ion content is controlled at 80 g / L-90 g / L; obtaining a second plating solution, wherein the cobalt ion content in the second plating solution is controlled at 8 g / L-60 g / L, and the nickel ion content is controlled at 0-70 g / L; using the first plating solution to perform first plating on the mold copper plate to be plated to obtain a first mold copper plate; moving the upper 0-200 mm of the first mold copper plate out of the plating liquid surface, and then using the second plating solution to perform second plating on the first mold copper plate. The present invention also provides a plating device for a mold copper plate, comprising: a first storage container, a second storage container, a first conveying pipeline, a second conveying pipeline and a plating tank; the first storage container is communicated with the plating tank through the first conveying pipeline; the second storage container is communicated with the plating tank through the second conveying pipeline; the present invention enables the coating thickness and cobalt content of the upper and lower ends of the mold to be different, and the operation steps are simple.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and particularly to an electroplating device and an electroplating method for a crystallizer copper plate. Background Art

[0002] At present, the crystallizer is the core component of continuous casting. As an important heat-conducting component for continuous casting from liquid steel to solidified billet shell, the quality of the crystallizer copper plate directly affects indexes such as the surface quality of the cast billet and the drawing speed of the continuous casting machine. In order to avoid serious cracking and wear at the upper opening of the crystallizer copper plate and frequent replacement, those skilled in the art usually electroplate a metal or alloy layer on the crystallizer copper plate, so as to achieve the purpose of crack resistance, wear reduction and service life extension. In recent years, the coatings of the crystallizer copper plate have developed from pure Cr coatings and Ni-Fe coatings to Ni-Co coatings and Co-Ni coatings with better crack resistance and wear resistance. At present, domestic and foreign manufacturers mainly use this technology for the production and repair of crystallizer copper plates. The on-line use performance and effect of the copper plates are excellent, and the cost performance is high.

[0003] During actual use, the special on-line use requirements for the upper and lower openings of the crystallizer copper plate are as follows: the upper opening of the crystallizer copper plate requires a low cobalt content and a low coating hardness, because this position is the molten steel surface area where the temperature is very high. If the coating stress is large, it is easy to fall off due to heat; the lower opening of the crystallizer copper plate requires a high cobalt content and a high coating hardness, because the lower opening of the crystallizer copper plate requires the coating wear resistance and high temperature resistance to prevent the problems of coating opening out-of-tolerance and copper leakage caused by the decrease in high temperature performance and wear of the formed billet shell on the coating. This requires a high cobalt content in the lower opening coating to ensure the high temperature resistance and wear resistance of the coating.

[0004] In the prior art, the commonly used tank immersion electroplating is difficult to achieve a low cobalt content at the upper end and a high cobalt content at the lower end of the copper plate coating; the tank immersion electroplating easily obtains an electroplated layer with the same coating thickness and cobalt content at the upper and lower ends, resulting in great waste, and the coating structure is unreasonable and the coating at the upper opening is easy to fall off.

[0005] The patent with the authorization announcement number "CN107254697A" and the name "Process for Gradient Distribution of Cobalt in Nickel-Cobalt Alloy Coating on Mould Copper Plate and Electroplating Device" discloses a process for gradient distribution of cobalt in nickel-cobalt alloy coating on mould copper plate, including analyzing the cobalt content and other plating solution components before plating, preparing the plating solution in the letter groove, starting electroplating, performing the third liquid reduction after 10 hours of electroplating, the fourth liquid reduction after 20 hours of electroplating, the third liquid reduction after 30 hours of electroplating, the fourth liquid reduction after 40 hours of electroplating. When the electroplating time to reach the coating thickness is still 24 hours, stop cobalt addition. After 10 hours of liquid reduction, the cobalt content in the electroplating solution at this time is maintained above 6 g / L, the cobalt content in the coating is 30%-35%, and cobalt is continuously consumed in the last 24 hours. After 24 hours of electroplating, the cobalt content in the machined layer is 15%. After electroplating, turn off the inlet pump and pull out the return pipe to make all the plating solution flow back to the mother tank, obtaining a mould copper plate with a gradient distribution of cobalt content coating. It solves the problem that the traditional processing amount of the cobalt content coating is very large, wasting a large amount of materials and increasing the product cost. This patent installs a return pipe that can adjust the liquid level height in the sub-tank and performs liquid reduction on the sub-tank during electroplating, realizing the supplementary addition design of cobalt salt at different times during liquid reduction, and can achieve the gradient distribution of cobalt in the coating. However, this method requires a return pipe and other operations, and the operation steps are relatively cumbersome.

[0006] Therefore, how to develop an electroplating method with simple operation steps, different coating thicknesses and cobalt contents at the upper and lower ends of the mould is an urgent technical problem to be solved. Summary of the Invention

[0007] The object of the present invention is to provide an electroplating device and an electroplating method for a mould copper plate, so that the coating thicknesses and cobalt contents at the upper and lower ends of the mould are different and the operation steps are simple.

[0008] To achieve the above object, the present invention provides an electroplating solution for a mould copper plate, including: a first plating solution and a second plating solution;

[0009] The cobalt ion content in the first plating solution is controlled at 0-1 g / L, and the nickel ion content is controlled at 80-90 g / L;

[0010] The cobalt ion content in the second plating solution is controlled at 8-60 g / L, and the nickel ion content is controlled at 0-70 g / L.

[0011] The present invention also provides an electroplating device for a mould copper plate, including: a first storage container, a second storage container, a first conveying pipeline, a second conveying pipeline and an electroplating tank;

[0012] The first storage container contains a first plating solution, in which the cobalt ion content is controlled at 0 - 1 g / L and the nickel ion content is controlled at 80 - 90 g / L; the first storage container is connected to the electroplating bath through the first delivery pipeline;

[0013] The second storage container contains a second plating solution, in which the cobalt ion content is controlled at 8 - 60 g / L and the nickel ion content is controlled at 0 - 70 g / L; the second storage container is connected to the electroplating bath through the second delivery pipeline;

[0014] The electroplating bath is used for electroplating a coating on the copper plate of the crystallizer to be electroplated.

[0015] Further, there are multiple electroplating baths, and the multiple second plating solution storage containers are connected to the multiple electroplating baths in one-to-one correspondence, and the multiple electroplating baths are all connected to the first storage container.

[0016] Further, both the first delivery pipeline and the second delivery pipeline are circulating pipelines, and a first circulation pump is provided on the first delivery pipeline; a second circulation pump is provided on the second delivery pipeline.

[0017] The present invention also provides a method for electroplating a copper plate of a crystallizer, which is characterized in that the method includes:

[0018] Obtaining a copper plate of the crystallizer to be electroplated;

[0019] Obtaining a first plating solution, in which the cobalt ion content is controlled at 0 - 1 g / L and the nickel ion content is controlled at 80 - 90 g / L;

[0020] Obtaining a second plating solution, in which the cobalt ion content is controlled at 8 - 60 g / L and the nickel ion content is controlled at 0 - 70 g / L;

[0021] Using the first plating solution to perform first electroplating on the copper plate of the crystallizer to be electroplated to obtain a first copper plate of the crystallizer;

[0022] Moving the upper 0 - 200 mm position of the first copper plate of the crystallizer out of the electroplating liquid surface, and then using the second plating solution to perform second electroplating on the first copper plate of the crystallizer to obtain a copper plate of the crystallizer with a gradient coating.

[0023] Further, the time of the first electroplating is 10 h - 15 h.

[0024] Further, the time of the second electroplating is 40 h - 80 h.

[0025] Further, the cobalt salt is cobalt aminosulfonate.

[0026] Further, the cobalt salt for the cobalt ions is cobalt sulfamate.

[0027] Further, the nickel salt for the nickel ions is nickel sulfamate.

[0028] Further, both the first plating solution and the second plating solution further include nickel chloride, boric acid and additives.

[0029] One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0030] An electroplating device and an electroplating method for a crystallizer copper plate provided by the present invention use two plating solutions with different compositions, namely the first plating solution and the second plating solution, for electroplating. The cobalt ion content in the first plating solution is controlled at 0 - 1 g / L, and the nickel ion content is controlled at 80 - 90 g / L; the cobalt ion content in the second plating solution is controlled at 8 - 60 g / L, and the nickel ion content is controlled at 0 - 70 g / L, so as to improve the repair quality of the copper plate and save the electroplating cost. Finally, the coating composition at the position of 0 - 200 mm from the upper part of the gradient coating crystallizer copper plate is a pure nickel coating or a low-cobalt content coating, and the cobalt content is controlled within the range of 0 - 10%; the lower part of the copper plate is a high-cobalt coating, and generally the cobalt content is controlled at 30% - 100%. This method is simple to operate and suitable for industrial production. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0032] Figure 1 is a flowchart of an electroplating method for a crystallizer copper plate provided by an embodiment of the present invention;

[0033] Figure 2 is a structural diagram of an electroplating device for a crystallizer copper plate provided by an embodiment of the present invention;

[0034] 1. First storage container; 11. Heating device; 2. Second storage container; 3. First conveying pipeline; 31. First circulation pump; 32. Filter; 4. Second conveying pipeline; 41. Second circulation pump; 5. Electroplating tank; 51. Stirring device; 6. Crystallizer copper plate to be electroplated. Detailed Embodiments

[0035] The present invention will be specifically described below in conjunction with specific embodiments and examples, and the advantages and various effects of the present invention will be presented more clearly thereby. Those skilled in the art should understand that these specific embodiments and examples are used to illustrate the present invention, rather than limiting the present invention.

[0036] Throughout the specification, unless otherwise specifically stated, the terms used herein should be understood to have the meanings as commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as the general understanding of those skilled in the art to which the present invention pertains. In case of any contradiction, this specification shall prevail.

[0037] Unless otherwise specifically stated, various raw materials, reagents, instruments, devices, etc. used in the present invention can be obtained through market purchase or can be prepared by existing methods. The terms "first", "second", etc. in the present invention do not represent an order and can be understood as nouns.

[0038] The technical solutions provided by the embodiments of the present invention to solve the above technical problems are generally as follows:

[0039] According to a typical embodiment of the present invention, there is provided an electroplating device for a mold copper plate, as Figure 2 shown, comprising: a first storage container 1, a second storage container 2, a first conveying pipeline 3, a second conveying pipeline 4, and an electroplating tank 5;

[0040] The first storage container 1 contains a first plating solution, and the cobalt ion content in the first plating solution is controlled at 0 - 1 g / L, and the nickel ion content is controlled at 80 - 90 g / L; the first storage container 1 is connected to the electroplating tank 5 through the first conveying pipeline 3;

[0041] The second storage container 2 contains a second plating solution, and the cobalt ion content in the second plating solution is controlled at 8 - 60 g / L, and the nickel ion content is controlled at 0 - 70 g / L; the second storage container 2 is connected to the electroplating tank 5 through the second conveying pipeline 4;

[0042] The electroplating tank 5 is used for electroplating a coating on the mold copper plate to be electroplated.

[0043] An electroplating device for a crystallizer copper plate provided by an embodiment of the present invention. The first plating solution stored in the first storage container 1 is transported to the electroplating tank 5 through the first delivery pipeline 3 and used to electroplate the crystallizer copper plate to be electroplated, obtaining a first crystallizer copper plate. The coating composition at the upper position of 0 - 200 mm is a pure nickel coating or a low cobalt content coating, and the cobalt content is controlled within the range of 0 to 10%. The upper position of 0 - 200 mm of the first crystallizer copper plate is removed from the electroplating liquid surface. Then, the second plating solution stored in the second storage container 2 is transported to the electroplating tank 5 through the first delivery pipeline 3, and the second electroplating is performed on the first crystallizer copper plate using the second plating solution, obtaining a gradient coating crystallizer copper plate, with the lower part being a high cobalt coating and the cobalt content being controlled within the range of 30% - 100%.

[0044] Both the first delivery pipeline 3 and the second delivery pipeline 4 are circulation pipelines; that is, the first storage container 1 is connected to the electroplating tank 5 through the first delivery pipeline 3, and the liquid can flow forward or backward.

[0045] Preferably, there are multiple second plating solution storage containers, and there are multiple electroplating tanks. The multiple second plating solution storage containers are connected to the multiple electroplating tanks in a one-to-one correspondence, and all the multiple electroplating tanks are connected to the first storage container.

[0046] As one of the above embodiments, there are 2 second plating solution storage containers and 2 electroplating tanks. The 2 second plating solution storage containers are connected to the 2 electroplating tanks in a one-to-one correspondence, and the 2 electroplating tanks are both connected to the first storage container. Since more second plating solution is used, such a setting can electroplate 2 at the same time.

[0047] Preferably, both the first delivery pipeline and the second delivery pipeline are circulation pipelines. A first circulation pump 31 is provided on the first delivery pipeline 3; a second circulation pump 41 is provided on the second delivery pipeline 4.

[0048] Preferably, a filter 32 is provided on the first delivery pipeline 3 for filtering out impurities.

[0049] Preferably, a stirring device 51 is provided in the electroplating tank 5; it is convenient to mix the electroplating solution.

[0050] Preferably, a heating device 11 is provided in the first storage container 1 for preheating.

[0051] According to another typical embodiment of the present invention, an electroplating method for a crystallizer copper plate is provided, as Figure 1 shown, including the following steps:

[0052] S1. Obtain a crystallizer copper plate to be electroplated;

[0053] S2. Obtain a first plating solution, with the cobalt ion content in the first plating solution controlled at 0 - 1 g / L and the nickel ion content controlled at 80 - 90 g / L;

[0054] S3. Obtain a second plating solution, with the cobalt ion content in the second plating solution controlled at 8 - 60 g / L and the nickel ion content controlled at 0 - 70 g / L;

[0055] S4. Use the first plating solution to perform first electroplating on the copper plate of the crystallizer to be electroplated, obtaining a first crystallizer copper plate;

[0056] S5. Move the upper 0 - 200 mm position of the first crystallizer copper plate out of the electroplating liquid surface, and then use the second plating solution to perform second electroplating on the first crystallizer copper plate, obtaining a gradient - plated crystallizer copper plate.

[0057] As can be seen from the above, the present invention uses two plating solutions with different compositions, namely the first plating solution and the second plating solution, for electroplating, so as to improve the repair quality of the copper plate and save electroplating costs at the same time; the coating composition at the upper 0 - 200 mm position of the finally obtained gradient - plated crystallizer copper plate is a pure nickel coating or a low - cobalt - content coating, with the cobalt content controlled within the range of 0 - 10%; the lower part of the copper plate is a high - cobalt coating, with the cobalt content controlled within the range of 30% - 100%. This method is simple to operate and suitable for industrial production.

[0058] If the cobalt ion content in the first plating solution is greater than 1 g / L, it will cause too high cobalt ions in the upper - mouth coating. During on - line use, the coating is prone to cracking or peeling problems; if the nickel ion content in the first plating solution is less than 80 g / L, the nickel ion concentration in the plating solution is too small, which mainly affects the deposition efficiency and the electroplating time is too long; if the nickel ion content in the first plating solution is greater than 90 g / L, the nickel ion concentration is too high, which affects the cobalt ion content in the coating.

[0059] If the cobalt ion content in the second plating solution is less than 8 g / L, it will cause too low cobalt content in the lower - mouth coating, and it is prone to wear and copper leakage problems during on - line use; if the cobalt ion content in the second plating solution is greater than 60 g / L, although it can meet the electroplating ratio requirements, adding too much will cause material waste; if the nickel ion content in the second plating solution is greater than 70 g / L, the nickel ion concentration is too high, which affects the cobalt ion content in the coating.

[0060] For other electroplating methods in the prior art, in order to achieve a high cobalt content at the lower mouth, the problem is that the cobalt content at the upper mouth is also high. Unless some methods such as extending the electroplating time and consuming the cobalt in the plating solution are adopted, but this will increase a large cost. Moreover, in order to achieve a low cobalt content at the upper mouth, the cobalt content at the lower mouth cannot be increased either.

[0061] And this application is to solve the problem of too high cobalt content at the upper mouth, which is prone to coating cracking or peeling during on - line use, and save costs at the same time.

[0062] Preferably, the time of the first electroplating is 10 h to 15 h. By controlling the time of the first electroplating within 10 h to 15 h, the coating thickness at the position of 0 to 200 mm above the finally obtained gradient coating crystallizer copper plate can be controlled within a suitable range.

[0063] Preferably, the time of the second electroplating is 40 h to 80 h. The time of the second electroplating can be controlled according to the requirement of the coating thickness at the lower part of the finally obtained gradient coating crystallizer copper plate. If a thicker coating is required at the lower part of the copper plate, the time of the second electroplating is lengthened.

[0064] Preferably, the cobalt salt used for the cobalt ions is cobalt sulfamate. The nickel salt used for the nickel ions is nickel sulfamate.

[0065] After conversion, it can be known that the concentration of cobalt sulfamate in the first plating solution is 0 to 4.5 g / L, and the concentration of nickel sulfamate is 440 g / L to 495 g / L; the concentration of cobalt sulfamate in the second plating solution is 34 g / to 256 g / L, and the concentration of nickel sulfamate is 0 to 385 g / L.

[0066] Both the first plating solution and the second plating solution further include nickel chloride, boric acid and additives. The main function of nickel chloride is that chloride ions play a role in activating the anode. If the content is too high, the nickel anode dissolves too fast, easily generating particles and causing the plating solution to be rough. If it is too low, the anode dissolution becomes slower, increasing the dosage of the main salt and the electroplating cost.

[0067] Furthermore, the concentration of nickel chloride is 18 g / L to 20 g / L; the concentration of boric acid is 28 g / L to 32 g / L; the additive can be one of sodium gluconate and pore prevention agent; the concentration of the pore prevention agent is 0.2 g / L to 0.5 g / L.

[0068] The surface of the electroplated copper plate obtained according to the present invention has no quality defects such as pinholes and pockmarks, the surface is flat, the thickness dimension of the processed copper plate is qualified, and it meets the processing requirements. And using the simulated on-site working conditions for flame bonding force detection, there are no problems such as coating discoloration, blistering and burning, the online use of the copper plate is good, and there are no problems such as coating peeling and wear and copper leakage. In addition, the original electroplating process uses one tank of plating solution for electroplating, and the cobalt content of the plating solution at the start of plating is reduced by the pre-plating electrolysis method, with a relatively high cost. After electroplating according to the method of the present invention, about 15 kg of nickel anodes can be saved, about 5 kg of cobalt anodes can be saved, and the material cost can be saved by about 20%.

[0069] Hereinafter, an electroplating device and an electroplating method for a crystallizer copper plate of the present application will be described in detail with reference to examples, comparative examples and experimental data.

[0070] Example 1

[0071] AsFigure 1-2 As shown in the figure, the electroplating method of the crystallizer copper plate in this embodiment is as follows:

[0072] S1. Obtain the crystallizer copper plate to be electroplated: It is a thick slab crystallizer copper plate with a size of 1860 * 900 mm.

[0073] S2. Obtain the first plating solution. The components of the first plating solution are: nickel sulfamate 450 g / L, cobalt sulfamate 3 g / L, boric acid 30 g / L, nickel chloride 20 g / L; additive 0.4 g / L. Load the first plating solution into the first storage container.

[0074] S3. Obtain the second plating solution. The components of the second plating solution are: nickel sulfamate 385 g / L, cobalt sulfamate 40 g / L, boric acid 30 g / L, nickel chloride 20 g / L, additive 0.4 g / L. Load the second plating solution into the second storage container.

[0075] S4. The first plating solution stored in the first storage container 1 is transported to the electroplating tank 5 through the first delivery pipeline 3. The electroplating tank 5 uses the first plating solution to conduct the first electroplating on the crystallizer copper plate to be electroplated for 12 h to obtain the first crystallizer copper plate.

[0076] S5. Move the upper 100 - mm position of the first crystallizer copper plate out of the electroplating liquid surface. Then, transport the second plating solution stored in the second storage container 2 to the electroplating tank 5 through the second delivery pipeline 4. The electroplating tank 5 uses the second plating solution to conduct the second electroplating on the first crystallizer copper plate for 50 h to obtain the gradient - coated crystallizer copper plate.

[0077] For the finally obtained gradient - coated crystallizer copper plate, the nickel - ion content in the coating composition at the upper opening is 95%, and the cobalt - ion content is 5%; the nickel - ion content in the coating composition at the lower opening is 70%, and the cobalt - ion content is 30%.

[0078] Example 2

[0079] As Figure 1-2 shown in the figure, the electroplating method of the crystallizer copper plate in this embodiment is as follows:

[0080] S1. Obtain the crystallizer copper plate to be electroplated: It is a thick slab crystallizer copper plate with a size of 1950 * 900 mm.

[0081] S2. Obtain the first plating solution. The components of the first plating solution are: nickel sulfamate 450 g / L, boric acid 30 g / L, nickel chloride 20 g / L; additive 0.4 g / L. Load the first plating solution into the first storage container.

[0082] S3. Obtain a second plating solution, the composition of the second plating solution being: nickel sulfamate 360 g / L, cobalt sulfamate 35 g / L, boric acid 30 g / L, nickel chloride 20 g / L, additive 0.4 g / L; fill the second plating solution into the second storage container; S4. The first plating solution stored in the first storage container 1 is conveyed to the electroplating bath 5 through the first conveying pipeline 3, and the electroplating bath 5 uses the first plating solution to perform first electroplating on the copper plate of the crystallizer to be electroplated for 12 h to obtain a first crystallizer copper plate;

[0083] S5. Move the upper 100 mm position of the first crystallizer copper plate out of the electroplating liquid surface, and then convey the second plating solution stored in the second storage container 2 to the electroplating bath 5 through the second conveying pipeline 4. The electroplating bath 5 uses the second plating solution to perform second electroplating on the first crystallizer copper plate for 70 h to obtain a gradient coating crystallizer copper plate.

[0084] For the finally obtained gradient coating crystallizer copper plate, the nickel ion content in the coating composition at the upper opening is 100%; the nickel ion content in the coating composition at the lower opening is 60%, and the cobalt ion content is 40%.

[0085] Example 3

[0086] S1. Obtain a copper plate of the crystallizer to be electroplated: it is a thick slab crystallizer copper plate with a copper plate size of 2690×800 mm;

[0087] S2. Obtain a first plating solution, the composition of the first plating solution being: nickel sulfamate 450 g / L, cobalt sulfamate 4.5 g / L, boric acid 30 g / L, nickel chloride 20 g / L; additive 0.4 g / L; fill the first plating solution into the first storage container;

[0088] S3. Obtain a second plating solution, the composition of the second plating solution being: cobalt sulfamate 256 g / L, boric acid 30 g / L, nickel chloride 20 g / L, additive 0.4 g / L; fill the second plating solution into the second storage container;

[0089] S4. The first plating solution stored in the first storage container 1 is conveyed to the electroplating bath 5 through the first conveying pipeline 3, and the electroplating bath 5 uses the first plating solution to perform first electroplating on the copper plate of the crystallizer to be electroplated for 15 h to obtain a first crystallizer copper plate;

[0090] S5. Move the upper 200 mm position of the first crystallizer copper plate out of the electroplating liquid surface, and then convey the second plating solution stored in the second storage container 2 to the electroplating bath 5 through the second conveying pipeline 4. The electroplating bath 5 uses the second plating solution to perform second electroplating on the first crystallizer copper plate for 60 h to obtain a gradient coating crystallizer copper plate.

[0091] The nickel ion content in the coating composition at the upper opening of the finally obtained gradient coating mold copper plate is 90%, and the cobalt ion content is 10%; the nickel ion content in the coating composition at the lower opening is 0%, and the cobalt ion content is 100%.

[0092] Comparative Example 1

[0093] In this comparative example, the cobalt ion content in the first plating solution is greater than 1 g / L, and the nickel ion content is less than 80 g / L. Specifically:

[0094] The composition of the first plating solution is: nickel sulfamate 400 g / L, cobalt sulfamate 5 g / L, boric acid 30 g / L, nickel chloride 20 g / L; additive 0.4 g / L; the composition of the second plating solution is the same as that in Example 1.

[0095] The nickel ion content in the coating composition at the upper opening of the finally obtained gradient coating mold copper plate is 80%, and the cobalt ion content is 20%; the nickel ion content in the coating composition at the lower opening is 70%, and the cobalt ion content is 30%. In this comparative example, the cobalt ion content in the upper opening coating is too high, and during on-line use, problems such as cracking or peeling of the coating occur.

[0096] Comparative Example 2

[0097] In this comparative example, the cobalt ion content in the second plating solution is less than 8 g / L, and the nickel ion content is greater than 70 g / L. Specifically:

[0098] The composition of the second plating solution is: nickel sulfamate 450 g / L, cobalt sulfamate 20 g / L, boric acid 30 g / L, nickel chloride 20 g / L, additive 0.4 g / L; the composition of the first plating solution is the same as that in Example 1.

[0099] The nickel ion content in the coating composition at the upper opening of the finally obtained gradient coating mold copper plate is 95%, and the cobalt ion content is 5%; the nickel ion content in the coating composition at the lower opening is 80%, and the cobalt ion content is 20%. Finally, the cobalt content in the lower opening coating of the obtained copper plate is too low, and for the lower opening working conditions, the lower opening coating is prone to wear and copper leakage problems.

[0100] Finally, it should also be noted that the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0101] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0102] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A plating method for a mold copper plate, characterized in that, the plating device used in the plating method includes a first storage container, a second storage container, a first delivery pipeline, a second delivery pipeline and a plating tank, and both the first delivery pipeline and the second delivery pipeline are circulating pipelines; there are multiple second storage containers, there are multiple plating tanks, the multiple second storage containers are connected and communicated with the multiple plating tanks one by one, the multiple plating tanks are all connected and communicated with the first storage container, and the plating method includes: Obtaining a mold copper plate to be plated; Obtaining a first plating solution, the first plating solution is contained in the first storage container, the cobalt ion content in the first plating solution is controlled at 0 - 1 g / L, the nickel ion content is controlled at 80 g / L - 90 g / L, the first storage container is connected and communicated with the plating tank through the first delivery pipeline, and a first circulation pump is provided on the first delivery pipeline; Obtaining a second plating solution, the second plating solution is contained in the second storage container, the cobalt ion content in the second plating solution is controlled at 8 g / L - 60 g / L, the nickel ion content is controlled at 0 - 70 g / L, the second storage container is connected and communicated with the plating tank through the second delivery pipeline, and a second circulation pump is provided on the second delivery pipeline; Performing first plating on the mold copper plate to be plated with the first plating solution to obtain a first mold copper plate; Moving the position of 0 - 200 mm at the upper part of the first mold copper plate out of the plating liquid surface, and then performing second plating on the first mold copper plate with the second plating solution to obtain a gradient coating mold copper plate; Both the first plating solution and the second plating solution further include nickel chloride, boric acid and an additive, and the additive is one of sodium gluconate and a pore prevention agent; the concentration of the pore prevention agent is 0.2 g / L - 0.5 g / L; The coating composition at the position of 0 - 200 mm at the upper part of the gradient coating mold copper plate is a pure nickel coating or a low cobalt content coating, and the cobalt content ranges from 0 - 10%; the lower part of the copper plate is a high cobalt coating, and the cobalt content ranges from 30% - 100%.

2. The plating method for a mold copper plate according to claim 1, characterized in that, the time of the first plating is 10 h - 15 h.

3. The plating method for a mold copper plate according to claim 1, characterized in that, the time of the second plating is 40 h - 80 h.

4. The plating method for a mold copper plate according to claim 1, characterized in that, the cobalt salt used for the cobalt ions is cobalt sulfamate.

5. The plating method for a mold copper plate according to claim 1, characterized in that, the nickel salt used for the nickel ions is nickel sulfamate.

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