Preheating methods for detectors and probe cards

Abstract

The present invention provides a preheating method for a detector and a probe card, which can keep the interval between the probe card and the top of the suction cup fixed to preheat the probe card. The detector includes a plurality of inspection chambers, and each of the plurality of inspection chambers includes a probe card, a suction cup top, and a temperature adjustment unit. The probe card has a plurality of probes. The suction cup top can carry a wafer. The temperature adjustment unit adjusts the temperature of the suction cup top. In addition, at least one of the probe card and the suction cup top includes a spacing adjustment component, which keeps the interval between the probe card and the suction cup top fixed. In a state where no wafer is placed on the suction cup top, and in a state where the probe card and the suction cup top are in contact with each other via the spacing adjustment component, the detector preheats the probe card by means of the heat of the suction cup top whose temperature has been adjusted by the temperature adjustment unit.

Description

Technical Field

[0001] The present disclosure relates to a preheating method for a prober and a probe card. Background Art

[0002] As an example of an inspection device for inspecting a wafer having a plurality of semiconductor devices formed thereon, a probe can be cited. The probe includes a probe card having a plurality of probes as columnar contact terminals. The probe abuts the wafer against the probe card so that each probe contacts an electrode pad or a solder bump of the semiconductor device. The probe allows current to flow from each probe to a circuit of the semiconductor device connected to each electrode pad or each solder bump, thereby inspecting the conduction state of the circuit, etc.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-069428 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure provides a method for preheating a prober and a probe card, which can maintain a fixed interval between the probe card and the top of a suction cup to preheat the probe card.

[0008] Solutions for solving problems

[0009] A detector of a technical solution of the present disclosure includes a plurality of inspection chambers, wherein each of the plurality of inspection chambers includes a probe card, a suction cup top, and a temperature adjustment unit. The probe card has a plurality of probes. The suction cup top can hold a wafer. The temperature adjustment unit adjusts the temperature of the suction cup top. In addition, at least one of the probe card and the suction cup top includes a spacing adjustment component that keeps the spacing between the probe card and the suction cup top fixed. In a state where no wafer is placed on the suction cup top and in a state where the probe card and the suction cup top are in contact with each other via the spacing adjustment component, the detector preheats the probe card using the heat of the suction cup top whose temperature has been adjusted by the temperature adjustment unit.

[0010] Effects of the Invention

[0011] According to the present disclosure, the probe card can be preheated while maintaining a constant interval between the probe card and the top of the chuck. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a diagram showing an example of a probe according to the first embodiment of the present disclosure.

[0013] Figure 2 It is along Figure 1 Cross-sectional view along line Ⅱ-Ⅱ.

[0014] Figure 3 This is a diagram showing an example of the structure of the probe in a state where no wafer is placed on the chuck top according to the first embodiment.

[0015] Figure 4 This is a diagram showing an example of the structure of the probe in a state where a wafer is placed on the top of the chuck according to the first embodiment.

[0016] Figure 5 This is a flowchart showing an example of the preheating method of the probe card according to the first embodiment.

[0017] Figure 6 It is a diagram showing an example of the structure of the interval adjusting member.

[0018] Figure 7 It is a diagram showing an example of the structure of the interval adjusting member.

[0019] Figure 8 It is a diagram showing an example of the structure of the interval adjusting member.

[0020] Fig. 9 It is a diagram showing an example of a cross section of the structure of the interval adjusting member.

[0021] Fig.10 It is a diagram showing an example of a cross section of the structure of the interval adjusting member.

[0022] Fig.11 This is a diagram showing an example of the structure of the probe in a state where no wafer is placed on the chuck top according to the second embodiment.

[0023] Fig.12 This is a diagram showing an example of the structure of the probe in a state where a wafer is placed on the top of the chuck according to the second embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the disclosed prober and probe card preheating method will be described in detail based on the drawings. However, the following embodiments are not intended to limit the disclosed technology.

[0025] In recent years, in order to improve the inspection efficiency of wafers, a detector has been developed. The detector includes multiple inspection chambers, which can inspect the semiconductor devices of the wafer in other inspection chambers while the wafer is being transported to one inspection chamber by means of a conveying device. In the case of this detector, when the wafer is brought into contact with the probe card, the wafer is placed on the top of the suction cup, and the space between the probe card and the top of the suction cup is sucked into a vacuum, so that the wafer and the probe card are in contact. Here, when the wafer is brought into contact with the probe card, the top of the suction cup is placed on the stage, and the stage moves the top of the suction cup toward the probe card. After that, the top of the suction cup is sucked toward the probe card and separated from the stage.

[0026] However, in recent years, the inspection conditions for wafer inspection have become more complicated, and in particular, inspections are often performed in high-temperature environments and low-temperature environments. In this case, before the wafer is inspected, it is desirable to preheat the probe card, and the preheating sets the probe card to the temperature for inspection. The probe card is preheated, for example, using radiant heat from the top of the suction cup, so the positional relationship between the probe card and the top of the suction cup becomes important. Therefore, it is desirable to preheat the probe card while keeping the interval between the probe card and the top of the suction cup fixed.

[0027] [Detector structure]

[0028] Figure 1 : is a diagram showing an example of a detector according to the first embodiment of the present disclosure. Figure 2 It is along Figure 1 Cross-sectional view along line Ⅱ-Ⅱ. Figure 1 and Figure 2 The prober 10 shown includes an inspection area 12 for inspecting the electrical characteristics of each semiconductor device of the wafer W, a storage area 13 for storing the wafer W, and a transport area 14 provided between the inspection area 12 and the storage area 13 .

[0029] A plurality of testers 15 serving as interfaces for wafer inspection are arranged in the inspection area 12, and a plurality of inspection rooms 12a corresponding to the testers 15 are provided in the inspection area 12. Specifically, the inspection area 12 has a three-layer structure of a tester row composed of a plurality of testers arranged horizontally, and a tester-side camera 16 is arranged corresponding to each tester row. Each tester-side camera 16 can move horizontally along the corresponding tester row, is located in front of each tester 15, and confirms the position of the wafer W and the like, and the degree of inclination of the chuck top 29.

[0030] The storage area 13 is divided into a plurality of storage spaces 17. An entrance 17a, an aligner 17b, a loader 17c, and a controller 17d are provided in each storage space 17. The entrance 17a receives a FOUP (front opening wafer transport box) as a container for accommodating a plurality of wafers. The aligner 17b performs wafer alignment. The loader 17c carries out the insertion and removal of a probe card 19. The controller 17d controls the operation of each component.

[0031] The transport area 14 is provided with a transport device 18 that is movable to both the inspection area 12 and the storage area 13. The transport device 18 takes out wafers W from the entrance 17a and transports them to the inspection chambers 12a, and transports wafers W after the electrical characteristics of semiconductor devices have been inspected from the inspection chambers 12a to the entrance 17a.

[0032] When the transport device 18 transports a wafer W between one inspection chamber 12 a and the entrance 17 a , other inspection chambers 12 a can inspect the electrical characteristics of semiconductor devices on other wafers W, so that the inspection efficiency of the wafers can be improved.

[0033] Figure 3 1 is a diagram showing an example of the structure of the probe in the state where no wafer is placed on the top of the chuck according to the first embodiment. Figure 3 1 shows a state where the wafer W is not placed to preheat the probe card 19. That is, Figure 3 FIG. 2 shows a state in which the suction cup top 29 is in contact with the interval adjustment member 70 provided on the probe card 19 . Figure 3 The structure of the inspection room 12a is mainly shown in the cross-sectional view. Figure 4 FIG. 1 is a diagram showing an example of the structure of the probe in the state where a wafer is placed on the top of the chuck according to the first embodiment. Figure 4 The wafer W is in contact with the probe card 19. Figure 4 The structure of the inspection room 12a is mainly shown in the cross-sectional view.

[0034] exist Figure 3 and Figure 4 In the embodiment, the tester 15 is disposed on a spring frame 20, and the spring frame 20 is fixed to a device frame (not shown). A probe card 19 is mounted on the lower portion of the spring frame 20. The flange 22 is configured to surround the probe card 19.

[0035] The probe card 19 includes: a disk-shaped body 24; a plurality of electrodes (not shown) arranged on a substantially flat surface of the upper surface of the body 24; and a plurality of probes 25 arranged to protrude downward from the lower surface of the body 24. Each electrode is connected to a corresponding probe 25. When the wafer W abuts against the probe card 19, each probe 25 contacts the electrode pads and solder bumps of each semiconductor device formed on the wafer W.

[0036] In addition, the probe card 19 has a spacing adjustment member 70, which keeps the spacing between the probe card 19 and the suction cup top 29 fixed when the wafer W is not placed on the suction cup top 29. The spacing adjustment member 70 is, for example, in the form of a pin, and is made of stainless steel, aluminum or copper, and three or more of them are provided on the lower surface of the probe card 19. The spacing adjustment member 70 may also be, for example, a resin called PEEK (Poly Ether Ether Ketone), other materials, alloys, etc. The length of the spacing adjustment member 70 is longer than the probe 25, and shorter than the spacing from the lower surface of the main body 24 of the probe card 19 to the upper surface of the suction cup top 29 when the probe 25 is in contact with the wafer W when the wafer W is placed on the suction cup top 29.

[0037] That is, Figure 3 As shown in FIG. 1 , when no wafer W is placed, the interval adjustment member 70 abuts against the suction cup top 29. Figure 4 As shown in FIG. 1 , when the wafer W is placed on the suction cup top 29, the interval adjustment member 70 is in a state where a gap is left between the interval adjustment member 70 and the suction cup top 29. In other words, when the wafer W is not placed on the suction cup top 29, the probe 25 is not in contact with the suction cup top 29, and when the wafer W is placed on the suction cup top 29, the probe 25 is in contact with the wafer W.

[0038] The spring holder 20 has a main body 26 which is substantially in the shape of a plate, and a plurality of spring pin holder insertion holes 27 which are a plurality of through holes provided near the center of the main body 26, and a spring pin holder 28 formed by arranging a plurality of spring pins is inserted and fitted into each spring pin holder insertion hole 27. The spring pin holder 28 is connected to an inspection circuit (not shown) provided in the tester 15, and contacts a plurality of electrodes on the upper surface of the main body 24 of the probe card 19 mounted on the spring holder 20. The spring pin holder 28 allows current to flow to each probe 25 of the probe card 19 connected to the electrode, and allows current flowing from the circuit of each semiconductor device of the wafer W through each probe 25 to flow toward the inspection circuit.

[0039] The flange 22 has an upper flange 22a and a lower flange 22b. In addition, the flange 22 has a cylindrical bellows 23 between the upper flange 22a and the lower flange 22b. The upper flange 22a is engaged with the spring holder 20 and sealed using a seal or the like. The lower flange 22b is movable in the vertical direction relative to the spring holder 20.

[0040] Before the lower flange 22b contacts the suction cup top 29, the lower flange 22b moves downward under its own weight so that the lower surface of the lower flange 22b is located below the top of each probe 25 of the probe card 19. The bellows 23 is a metal corrugated structure that is flexible in the vertical direction. The lower end of the bellows 23 is in close contact with the upper surface of the lower flange 22b, and the upper end of the bellows 23 is in close contact with the lower surface of the upper flange 22a.

[0041] The space between the spring holder 20 and the base 21 of the tester 15 is sealed by the sealing member 30, and the space is evacuated to a vacuum, so that the base 21 is mounted on the spring holder 20. The space between the spring holder 20 and the probe card 19 is also sealed by the sealing member 31, and the space is evacuated to a vacuum, so that the probe card 19 is mounted on the spring holder 20.

[0042] The conveying device 18 includes an aligner 32. The suction cup top 29 is placed on the aligner 32, and the wafer W is placed on the upper surface of the suction cup top 29. Figure 3 In the figure, no wafer W is placed, and the placement position is indicated by a dotted line. The suction cup top 29 is vacuum-adsorbed to the aligner 32, and the wafer W is vacuum-adsorbed to the suction cup top 29. Therefore, it is possible to prevent the wafer W from moving relative to the conveying device 18 when the conveying device 18 moves. The method for holding the suction cup top 29 and the wafer W is not limited to vacuum adsorption, and any method that can prevent the suction cup top 29 and the wafer W from moving relative to the aligner 32 may be used, for example, electromagnetic adsorption or holding with a clamp. A step 29a is formed on the peripheral portion of the upper surface of the suction cup top 29, and a sealing member 33 is arranged on the step 29a.

[0043] In addition, the suction cup top 29 is provided with a flow path 50 and a heater 51 inside. A refrigerant is supplied to the flow path 50 from a cooling unit (not shown). The refrigerant supplied to the flow path 50 flows in the flow path 50 and then returns to the cooling unit. The heater 51 is connected to a heater power source (not shown), which supplies power to the heater 51, thereby heating the suction cup top 29. The temperature of the suction cup top 29 is adjusted by cooling by the refrigerant circulating in the flow path 50 and heating by the heater 51.

[0044] The conveying device 18 can move to the bottom of the probe card 19 in the inspection chamber 12a, so that the wafer W placed on the suction cup top 29 faces the probe card 19, and can move the wafer W toward the probe card 19. The space S is when the spacing adjustment member 70 contacts the placement surface of the suction cup top 29 ( Figure 3 ), or when the suction cup top 29 abuts against the lower flange 22b and the wafer W abuts against the probe card 19 ( Figure 4) formed. The space S is sealed by the bellows 23 and the sealing member 33. In the space S, the space S is sucked into a vacuum by means of the vacuum pipe 26a, so that the top of the suction cup 29 is held on the probe card 19 side. The method of holding the top of the suction cup 29 is not limited to vacuum adsorption, as long as it can form the space S, for example, it can also be electromagnetic adsorption or holding with a clamp. The movement of the conveying device 18 is controlled by the controller 17d, and the controller 17d grasps the position and movement amount of the conveying device 18.

[0045] The aligner 32 adjusts the relative position and inclination of the chuck top 29 with respect to the probe card 19. The temperature adjustment parts such as the flow path 50 and the heater 51 are used to realize the inspection in the high temperature environment and the low temperature environment. Therefore, the aligner 32 adjusts the position and inclination accompanied by the deformation of the probe card 19 and the chuck top 29 caused by the heat release from the heater 51 and the heat absorption to the flow path 50 during the inspection in the high temperature environment and the low temperature environment. Among them, the temperature range of the chuck top 29 can be listed as 130°C to -30°C, for example.

[0046] The aligner 32 has a base and a guide rail corresponding to each direction of X, Y, and Z. Each base can move along each guide. A substantially circular plate-shaped suction cup base is provided on the Z slider provided on the Z base. The suction cup base has a suction cup top adsorption surface on the upper surface, and the suction cup top 29 is vacuum adsorbed on the suction cup top adsorption surface. Thus, the suction cup top 29 is placed and assembled on the aligner 32. At this time, positioning pins, positioning blocks, etc. are used to define the position of the suction cup top 29 relative to the suction cup base.

[0047] Furthermore, the aligner 32 has an upward confirmation camera for confirming the degree of inclination of the probe card 19 and the spring holder 20. Furthermore, the aligner 32 can adjust the inclination of the mounted chuck top 29 by raising and lowering the chuck base using an actuator.

[0048] [Probe card preheating method]

[0049] Next, a preheating method of the probe card according to the first embodiment will be described. Figure 5 This is a flowchart showing an example of the preheating method of the probe card according to the first embodiment.

[0050] The probe card 19 is transported from the loader 17c to the inspection chamber 12a where the probe card is to be preheated using the transport device 18. The probe card 19 is vacuum-adsorbed onto the spring holder 20 from the transport device 18 (step S1).

[0051] Next, the suction cup top 29 is conveyed to the probe card 19 to be preheated by using the conveying device 18. At this time, the suction cup top 29 is in a state where no wafer is placed. The suction cup top 29 is conveyed to the lower part of the probe card 19 by using the conveying device 18. The suction cup top 29 is raised so that it abuts against the spacing adjustment member 70 of the probe card 19. Then, the suction cup top 29 is vacuum-adsorbed on the probe card 19 side (step S2). At this time, the spacing between the suction cup top 29 and the probe card 19 is kept fixed by the spacing adjustment member 70.

[0052] The transport device 18 is withdrawn from the inspection room 12a, and a cooling unit and a heater power supply (not shown) connected to the flow path 50 and the heater 51 are controlled to start preheating the probe card (step S3).

[0053] When the preheating of the probe card is completed, the suction cup top 29 is transported from the inspection chamber 12a using the transport device 18, and the wafer W is placed on the suction cup top 29. The suction cup top 29 with the wafer W placed thereon is transported to the inspection chamber 12a, and the wafer W and the suction cup top 29 are vacuum-adsorbed on the spring holder 20 (step S4). The wafer W is inspected (step S5), and after the inspection is completed, the wafer W is transported to, for example, the entrance 17a using the transport device 18.

[0054] Thus, the probe card 19 can be preheated while keeping the distance between the probe card 19 and the chuck top 29 constant. In addition, since the distance between the probe card 19 and the chuck top 29 is kept constant, the probe card can be preheated with a stable preheating time in any inspection room 12a.

[0055] [Variation of the interval adjustment member]

[0056] Next, a modification of the interval adjusting member 70 will be described. Figures 6 to 8 It is a diagram showing an example of the structure of the interval adjusting member. Fig. 9 and Fig.10 FIG. 1 is a diagram showing an example of a cross section of the structure of the interval adjustment member. Figures 6 to 8 As shown in FIG. 1 , the interval adjustment members 70a to 70c are arranged from the lower surface of the main body 24 of the probe card 19 toward the front side in the figure. Fig. 9 and Fig.10 In the case of the cross section of the probe card 19 shown, the interval adjusting members 70 a to 70 c are arranged from the lower surface of the main body 24 toward the downward direction in the figure. Figure 6 The illustrated interval adjustment member 70 a is an example of a case where it is arranged in an annular shape on the outer peripheral side of the probe card 19 . Figure 7 The illustrated interval adjustment members 70 b are an example in which three arc-shaped interval adjustment members 70 b are arranged on the outer peripheral side of the probe card 19 . Figure 8The illustrated interval adjustment member 70 c is an example in which two linear interval adjustment members 70 c are arranged at positions symmetrical with respect to the central axis of the probe card 19 .

[0057] Fig. 9 The cross section of the spacing adjustment member has a straight line shape. Fig.10 The cross section of the interval adjusting member is shown to have an inverted T-shape. However, the modified example of the interval adjusting member 70 is not limited to the interval adjusting members 70a to 70c, and other shapes and arrangements are also possible.

[0058] [Second Embodiment of the Structure of the Detector]

[0059] In the case of the first embodiment, the interval between the suction cup top 29 and the probe card 19 is kept fixed by the interval adjustment member 70 provided on the probe card 19, but the interval adjustment member may be provided on the spring frame, and the implementation form of this case is described as the second embodiment. The same reference numerals are given to the same structures as those in the first embodiment, and the description of the repeated structures and operations is omitted.

[0060] Compared with the first embodiment, the second embodiment includes a spring holder 80 and a suction cup top 89 instead of the spring holder 20 and the suction cup top 29 . Fig.11 1 is a diagram showing an example of the structure of the probe in the second embodiment when no wafer is placed on the top of the chuck. Fig.11 1 shows a state where the wafer W is not placed to preheat the probe card 19. Fig.12 This is a diagram showing an example of the structure of the probe in a state where a wafer is placed on the top of the chuck according to the second embodiment.

[0061] like Fig.11 and Fig.12 As shown, the spring holder 80 has a main body 86 which is substantially in the shape of a plate, and a plurality of spring pin holder insertion holes 87 which are a plurality of through holes provided near the center of the main body 86, and a spring pin holder 28 formed by arranging a plurality of spring pins is inserted and fitted into each of the spring pin holder insertion holes 87. In addition, the spring holder 80 has a spacing adjustment member 82 for maintaining a fixed spacing between the suction cup top 89 and the probe card 19. In addition, the spring holder 80 has a vacuum duct 86a for evacuating the space S to a vacuum, and an air duct 86b for fixing the spacing adjustment member 82.

[0062] The interval adjustment member 82 can be freely moved up and down, and can be fixed at any position by the pressure of the air duct 86b. In addition, the interval adjustment unit 81 has a distance sensor 83 in addition to the interval adjustment member 82, and the distance sensor 83 is used to measure the distance between the spring frame 80 and the suction cup top 89. The distance sensor 83 is a non-contact sensor such as an eddy current type.

[0063] When the suction cup top 89 is vacuum-adsorbed on the spring frame 80, the interval adjustment member 82 is fixed at a predetermined distance based on the distance measured by the distance sensor 83. In particular, for the interval adjustment member 82, a plurality of interval adjustment members 82 can be fixed one by one using respective distance sensors 83. In addition, the interval adjustment member 82 is fixed in a state where no wafer W is placed on the suction cup top 89 ( Fig.11 ) The distance (position) at which the probe 25 does not contact the upper surface of the suction cup top 89 is fixed. On the other hand, the interval adjustment member 82 is set so that the wafer W is placed on the suction cup top 89 ( Fig.12 ) The distance (position) between the lower wafer W and the probe 25 in contact is fixed.

[0064] The suction cup top 89 is vacuum-adsorbed to the aligner 32, and the wafer W is vacuum-adsorbed to the suction cup top 89. A groove 89a is formed at the peripheral edge of the upper surface of the suction cup top 89, and the sealing member 33 is arranged in the groove 89a. In addition, the height of the outermost peripheral portion 89b of the suction cup top 89 is the same as the height of the adsorption surface that adsorbs the wafer W, and the outermost peripheral portion 89b abuts against the interval adjustment member 82.

[0065] The space S is when the interval adjustment member 82 abuts against the outermost peripheral portion 89b of the suction cup top 89 to form a set distance ( Fig.11 ), or when the suction cup top 89 abuts against the lower flange 22b and the wafer W abuts against the probe card 19 ( Fig.12 ) The space S is sealed by the bellows 23 and the sealing member 33. The space S is evacuated to a vacuum, thereby holding the chuck top 89 on the probe card 19 side.

[0066] As described above, in the second embodiment, the probe card 19 can be preheated while the probe card 19 and the chuck top 89 are held in parallel. In addition, the position of the chuck top 89 when preheating the probe card 19 can be specified.

[0067] As described above, according to the first embodiment, the prober 10 includes a plurality of inspection chambers 12a, wherein each of the plurality of inspection chambers includes a probe card 19, a suction cup top 29, and a temperature adjustment unit. The probe card 19 includes a plurality of probes 25. The suction cup top 29 can carry a wafer W. The temperature adjustment unit adjusts the temperature of the suction cup top 29. In addition, at least one of the probe card 19 and the suction cup top 29 includes a spacing adjustment member 70 that keeps the spacing between the probe card 19 and the suction cup top 29 fixed. In a state where the suction cup top 29 does not carry a wafer W, and in a state where the probe card 19 and the suction cup top 29 are in contact with each other via the spacing adjustment member 70, the prober 10 preheats the probe card 19 by means of the heat of the suction cup top 29 whose temperature has been adjusted by the temperature adjustment unit. As a result, the probe card 19 can be preheated.

[0068] According to the second embodiment, the prober 10 includes a plurality of inspection chambers 12a, wherein each of the plurality of inspection chambers 12a includes a probe card 19, a suction cup top 89, a spring holder 80, and a temperature adjustment unit. The probe card 19 includes a plurality of probes 25. The suction cup top 89 can be loaded with a wafer W. The spring holder 80 supports the probe card 19. The temperature adjustment unit adjusts the temperature of the suction cup top 89. In addition, the spring holder 80 includes a spacing adjustment member 82 that keeps the spacing between the probe card 19 and the suction cup top 89 fixed. In a state where the suction cup top 89 does not load the wafer W, and in a state where the spring holder 80 and the suction cup top 89 are in contact with each other via the spacing adjustment member 82, the prober 10 preheats the probe card 19 by means of the heat of the suction cup top 89 whose temperature has been adjusted by the temperature adjustment unit. As a result, the probe card 19 can be preheated while the probe card 19 and the suction cup top 89 are kept parallel.

[0069] It should be noted that all aspects of the embodiments disclosed herein are examples and are not intended to limit the present invention. The embodiments described above may be omitted, replaced, or modified in various forms without departing from the claims and the gist thereof.

Claims

1. A detector comprising a plurality of inspection chambers, wherein: Each of the plurality of inspection rooms comprises: a probe card having a plurality of probes; a chuck top capable of holding a wafer; and A temperature adjustment unit is used to adjust the temperature of the top of the suction cup. At least one of the probe card and the chuck top includes a spacing adjustment member that keeps the spacing between the probe card and the chuck top fixed, In a state where no wafer is placed on the suction cup top and the probe card and the suction cup top are in contact with each other via the interval adjustment member, the probe card is preheated by using the heat of the suction cup top whose temperature is adjusted by the temperature adjustment unit. When the interval between the probe card and the top of the suction cup when no wafer is placed thereon is kept fixed by means of the interval adjustment member, the interval between the probe card and the top of the suction cup when no wafer is placed thereon is narrower than the interval between the probe card and the top of the suction cup when a wafer is placed thereon.

2. The detector according to claim 1, wherein: The length of the interval adjustment member is longer than the probe and shorter than the interval between the probe card and the chuck top when the wafer is placed on the chuck top and the probe is in contact with the wafer.

3. The detector according to claim 1 or 2, wherein: The interval adjustment member is pin-shaped, ring-shaped, arc-shaped or straight-line-shaped.

4. A detector comprising a plurality of inspection chambers, wherein: Each of the plurality of inspection rooms comprises: a probe card having a plurality of probes; The top of the chuck can hold the wafer; a spring frame supporting the probe card; and A temperature adjustment unit is used to adjust the temperature of the top of the suction cup. The spring frame includes a spacing adjustment member that keeps the spacing between the probe card and the top of the suction cup fixed. In a state where no wafer is placed on the suction cup top and the spring frame and the suction cup top are in contact with each other via the interval adjustment member, the probe card is preheated by the heat of the suction cup top whose temperature is adjusted by the temperature adjustment unit. When the interval between the probe card and the top of the suction cup when no wafer is placed thereon is kept fixed by means of the interval adjustment member, the interval between the probe card and the top of the suction cup when no wafer is placed thereon is narrower than the interval between the probe card and the top of the suction cup when a wafer is placed thereon.

5. A method for preheating a probe card, the probe card being a probe card of a detector for inspecting a wafer, wherein: The probe card preheating method comprises the following steps: transporting a top portion of a suction cup for holding a wafer and not placing the wafer to a lower portion of a probe card formed with a probe for contacting the wafer; Attaching the top of the suction cup to the side of the probe card; and The probe card is preheated using heat from the chuck top while the interval between the probe card and the chuck top without a wafer mounted thereon is held fixed by an interval adjustment member in a manner narrower than the interval between the probe card and the chuck top with a wafer mounted thereon.

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