Optical device and method of manufacturing the same

Abstract

An optical device includes a substrate, a light receiving component, an encapsulant, a coupling layer, and a light shielding layer. The light receiving component is disposed on the substrate. The encapsulant covers the light receiving component. The coupling layer is disposed on at least a portion of the encapsulant. The light shielding layer is disposed on the coupling layer.

Description

Technical Field

[0001] This invention relates to an optical device and a manufacturing method, and specifically to an optical device comprising a light shielding layer, and a method for manufacturing the optical device. Background Technology

[0002] An optical device may include an emitter, a detector, and a clear molding compound covering the emitter and detector. The emitter emits a light beam, which is reflected by an object and then detected by the detector. However, a portion of the light beam from the emitter may directly enter the detector, causing crosstalk between the emitter and detector. This crosstalk reduces the detector's sensitivity. Summary of the Invention

[0003] In some embodiments, an optical device includes a substrate, a light receiving component, an encapsulant, a coupling layer, and a light shielding layer. The light receiving component is disposed on the substrate. The encapsulant covers the light receiving component. The coupling layer is disposed on at least a portion of the encapsulant. The light shielding layer is disposed on the coupling layer.

[0004] In some embodiments, an optical device includes a substrate, a light-receiving component, a first encapsulation, a light-shielding layer, and an outer encapsulation. The light-receiving component is disposed on the substrate. The first encapsulation covers the light-receiving component. The light-shielding layer is disposed on the first encapsulation. The outer encapsulation covers the light-shielding layer.

[0005] In some embodiments, a method for manufacturing an optical device includes: (a) providing a substrate; (b) disposing a light-receiving component on the substrate; (c) forming an encapsulation to cover the light-receiving component; (d) applying a coupling agent to the surface of the encapsulation to form a coupling layer; and (e) forming a light-shielding layer on the coupling layer.

[0006] In some embodiments, an optical device includes a substrate, a light-receiving component, an encapsulation, and a light-shielding layer. The light-receiving component is disposed on the substrate. The encapsulation covers the light-receiving component. The light-shielding layer is disposed on the encapsulation. According to ASTM D3359 Test Method B, the adhesion of the light-shielding layer to the encapsulation is rated as 5B. Attached Figure Description

[0007] Some aspects of embodiments of the invention are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that various structures may not be drawn to scale, and the dimensions of various structures may be arbitrarily increased or decreased for clarity of explanation.

[0008] Figure 1 A cross-sectional view illustrating an example of an optical device according to some embodiments of the present invention is shown.

[0009] Figure 2 A cross-sectional view illustrating an example of an optical device according to some embodiments of the present invention is shown.

[0010] Figure 3 A cross-sectional view illustrating an example of an optical device according to some embodiments of the present invention is shown.

[0011] Figure 4 A cross-sectional view illustrating an example of an optical device according to some embodiments of the present invention is shown.

[0012] Figure 5 A cross-sectional view illustrating an example of an optical device according to some embodiments of the present invention is shown.

[0013] Figure 6 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0014] Figure 7 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0015] Figure 8 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0016] Figure 9 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0017] Figure 10 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0018] Figure 11 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0019] Figure 12 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0020] Figure 13The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0021] Figure 14 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0022] Figure 15 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0023] Figure 16 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0024] Figure 17 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0025] Figure 18 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0026] Figure 19 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0027] Figure 20 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0028] Figure 21 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0029] Figure 22 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0030] Figure 23 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention.

[0031] Figure 24 The illustration depicts one or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present invention. Detailed Implementation

[0032] Common reference numerals are used throughout the accompanying drawings and detailed descriptions to indicate the same or similar components. Embodiments of the invention will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0033] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below. Of course, these components, values, operations, materials, and arrangements are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include embodiments where the first and second features are formed or disposed in direct contact, and may also include embodiments where additional features may be formed or disposed between the first and second features such that the first and second features are not in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the invention. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0034] In comparative optical devices, a light-emitting component and a light-receiving component are mounted on a substrate. To prevent crosstalk between the light-emitting and light-receiving components, a shielding structure can be mounted on the substrate to cover both components and prevent unwanted light from reaching the light-receiving component. For example, the shielding structure may have a first cavity for accommodating the light-emitting component and a second cavity for accommodating the light-receiving component. The shielding structure can be manufactured by injection molding. However, when the size of the shielding structure is reduced due to the need for miniaturization of optical devices, the yield rate of the shielding structure decreases significantly.

[0035] In comparative optical devices, opaque molding materials are used to replace shielding structures. For example, two transparent molding materials can be formed on a substrate to cover the light-emitting component and the light-receiving component, respectively. Then, an opaque molding material can be formed to cover the transparent molding material. The light-emitting component and the light-receiving component can thus be shielded by the opaque molding material. However, the optical density (OD) passing through the opaque molding material can only reach about 3 (OD 3) or less, which does not meet industrial requirements.

[0036] Therefore, at least some embodiments of the present invention provide an optical device comprising a light-shielding layer firmly adhered to an encapsulation. At least some embodiments of the present invention further provide a method for manufacturing the optical device.

[0037] Figure 1 A cross-sectional view of an optical device 1 according to some embodiments of the present invention is shown. The optical device 1 may include a substrate 2, a light receiving component 14, a light emitting component 15, a package 6 (e.g., including a first package 3 and a second package 4), a coupling layer 16, a light shielding layer 17, a first optical lens 18, and a second optical lens 19.

[0038] Substrate 2 has a first surface 21, a second surface 22 opposite to the first surface 21, and a side surface 23 extending between the first surface 21 and the second surface 22. Substrate 2 may be an embedded trace substrate. For example, substrate 2 may include a first circuit layer 24 exposed from the first surface 21, a second circuit layer 26 exposed from the second surface 22, and a conductive via 25 electrically connecting the first circuit layer 24 and the second circuit layer 26. In some embodiments, substrate 2 may further include a semiconductor chip (not shown) disposed between the first surface 21 and the second surface 22 (i.e., the semiconductor chip may be embedded in substrate 2) and electrically connected to the first circuit layer 24 and / or the second circuit layer 26.

[0039] The light receiving component 14 has a first surface 141 and a second surface 142 opposite to the first surface 141. The light receiving component 14 is disposed on and attached to the substrate 12. For example, the second surface 142 of the light receiving component 14 is attached to the first surface 21 of the substrate 2 via an adhesive 144. The light receiving component 14 may be electrically connected to a first circuit layer 24 of the substrate 2 via a bonding wire 145. The light receiving component 14 has a light receiving region, which may include at least a portion of the first surface 141. The light receiving component 14 may be a component capable of receiving and / or detecting light arriving at the light receiving region, such as a photodiode.

[0040] The light-emitting component 15 has a first surface 151 and a second surface 152 opposite to the first surface 151. The light-emitting component 15 is disposed on and attached to the substrate 2. For example, the second surface 152 of the light-emitting component 15 is attached to the first surface 21 of the substrate 2 via an adhesive 154. The light-emitting component 15 can be electrically connected to a first circuit layer 24 of the substrate 2 via a wiring 155. The light-emitting component 15 has a light-emitting region, which may include at least a portion of the first surface 151. The light-emitting component 15 can be a component capable of emitting light having a single wavelength or a series of wavelengths, such as a laser diode or a vertical cavity surface-emitting laser (VCSEL). A vertical cavity surface-emitting laser (VCSEL) is a laser diode with single-chip laser resonant function, which emits light primarily in a direction perpendicular to the first surface 151. Compared to conventional edge-emitting lasers (EELs), VCSELs have advantages in terms of compatibility with circuits and testing instruments, reliability, scalability, cost-effectiveness, and packaging capabilities. As facial recognition technology powered by VCSELs has been incorporated into smartphones, the demand for VCSELs continues to grow in the industry.

[0041] like Figure 1 As shown, the encapsulation 6 in the optical device 1 includes a first encapsulation 3 covering the light-receiving component 14 and a second encapsulation 4 covering the light-emitting component 15. For example, the first encapsulation 3 may be disposed on a first surface 21 of the substrate 2 and encapsulate the light-receiving component 14. The first encapsulation 3 has a first surface 31, a second surface 32 opposite to the first surface 31, and a side surface 33 extending between the first surface 31 and the second surface 32. The second surface 32 is disposed on and in contact with the first surface 21 of the substrate 2. The first encapsulation 3 may be an encapsulation that allows light to pass through. That is, the first encapsulation 3 may be transparent or translucent. For example, the first encapsulation 3 may be made of a transparent epoxy resin molding material without fillers.

[0042] The second encapsulation 4 can be disposed on the first surface 21 of the substrate 2 and encapsulate the light-emitting component 15. The second encapsulation 4 has a first surface 41, a second surface 42 opposite to the first surface 41, and a side surface 43 extending between the first surface 41 and the second surface 42. The second surface 42 is disposed on and in contact with the first surface 21 of the substrate 2. The second encapsulation 4 can be an encapsulation that allows light to pass through. That is, the second encapsulation 4 can be transparent or translucent. For example, the second encapsulation 4 can be made of a transparent epoxy resin molding material without fillers. The material of the first encapsulation 3 can be the same as or different from the material of the second encapsulation 4.

[0043] The coupling layer 16 is disposed on at least a portion of the package 6, for example, on the first package 3 and the second package 4. Figure 1 As shown, coupling layer 16 includes a first portion 161, a second portion 162, and a third portion 163. The first portion 161 is disposed on and in contact with the first package 3, for example, disposed on and in contact with the top surface (e.g., first surface 31) and side surface 33 of the first package 3. The second portion 162 is disposed on and in contact with the second package 4, for example, disposed on and in contact with the top surface (e.g., first surface 41) and side surface 43 of the second package 4. The third portion 163 is disposed on and in contact with the first surface 21 of the substrate 2, and connects the first portion 161 and the second portion 162. Coupling layer 16, for example, its first portion 161, may define a first via 164 corresponding to the light-receiving area of ​​the light-receiving component 14. Similarly, coupling layer 16, for example, its second portion 162, may define a second via 165 corresponding to the light-emitting area of ​​the light-emitting component 15. However, in some embodiments, if the coupling layer 16 is transparent or translucent, the first through-hole 164 and the second through-hole 165 can be omitted, and thus the coupling layer 16 can completely cover the first surface 31 of the first package 3 and / or the first surface 41 of the second package 4.

[0044] An optical shielding layer 17 is disposed on and in contact with the coupling layer 16. In some embodiments, the optical shielding layer 17 may be conformal to the coupling layer 16. Figure 1 As shown, the light shielding layer 17 further includes a first portion 171, a second portion 172, and a third portion 173 respectively disposed on a first portion 161, a second portion 162, and a third portion 163 of the coupling layer 16. The light shielding layer 17, for example, its first portion 171, defines a first via 174 corresponding to the light-receiving area of ​​the light-receiving component 14. Similarly, the light shielding layer 17, for example, its second portion 172, defines a second via 175 corresponding to the light-emitting area of ​​the light-emitting component 15. The first via 174 of the light shielding layer 17 can be aligned with the first via 164 of the coupling layer 16, and the second via 175 of the light shielding layer 17 can be aligned with the second via 165 of the coupling layer 16. The side surface 166 of the coupling layer 16, the side surface 176 of the light shielding layer 17, and the side surface 23 of the substrate 2 can be substantially coplanar. In some embodiments, the third portion 163 of the coupling layer 16 and the third portion 173 of the light shielding layer 17 can be omitted.

[0045] The light shielding layer 17 may be made of a light-insensitive material. For example, the optical density passing through the light shielding layer 17 at a given wavelength may be greater than 4 (OD 4), and preferably about 5 (OD 5) or greater. That is, the transmittance of the light shielding layer 17 at a given wavelength may be less than 10. -4 And preferably about 10 -5 Or even lower. In some embodiments, the transmittance of light through the light shielding layer 17, the coupling layer 16, and the encapsulation 6 may be less than 10. -4 Alternatively, the transmittance of light through the light shielding layer 17 and the encapsulation 6 may be less than 10. -4 In some embodiments, the transmittance of the light beam from the self-emissive component 15 to the light-receiving component 14 may be less than 10. -4 In some embodiments, the light shielding layer 17 may have a thickness of less than 2 μm. The light shielding layer 17 may be a metallic shielding layer, such as a metallic layer comprising stainless steel and / or copper. The stainless steel may be of any grade, such as grade 306, grade 316, grade 314, etc. For example, the light shielding layer 17 may be a single layer of stainless steel with a thickness of 1 μm (SUS 1 μm), a single layer of stainless steel with a thickness of 2 μm (SUS 2 μm), a three-layer stainless steel / copper / stainless steel layer with a total thickness of 1 μm (SUS / Cu / SUS 1 μm), or a three-layer stainless steel / copper / stainless steel layer with a total thickness of 2 μm (SUS / Cu / SUS 2 μm). The aforementioned materials are respectively (by sputtering) coated on a layer having a thickness of 150 μm. The optical density (OD) values ​​were measured at a given wavelength and recorded in Table 1 below on the EME-G311L compound (150 μm G311L).

[0046] Table 1: Optical density (OD) values ​​measured at a given wavelength through different shielding layers

[0047]

[0048] According to Table 1 above, the optical shielding layer 17 made of metal has an optical density value of approximately OD 5 at wavelengths from 300 nm to 1100 nm. That is, the optical shielding layer 17 provides effective optical shielding to the optical receiving component 14 and / or the light emitting component 15.

[0049] The coupling layer 16 may be made of a coupling agent that enhances the adhesion between two objects in contact with opposite sides of the coupling agent. The coupling agent may be selected based on the materials of the two objects. In some embodiments, the coupling agent of the coupling layer 16 may be a silane coupling agent, titanate coupling agent, aluminate coupling agent, phosphate coupling agent, borate coupling agent, chromium zirconia salt coupling agent, bimetallic coupling agent, aliphatic acid coupling agent, aliphatic alcohol coupling agent, ester coupling agent, etc. For example, the first encapsulation 3 may be made of epoxy resin, the light shielding layer 17 may be made of stainless steel and / or copper, and the coupling agent of the coupling layer 16 may correspondingly be made of a silane coupling agent.

[0050] Silane coupling agents can act as bonding or bridging agents to improve the adhesion between organic materials (e.g., the first encapsulation 3 and / or the second encapsulation 4) and inorganic materials (e.g., the light shielding layer 17). For example, a silane coupling agent can have the following formula:

[0051] YR-Si(OX)3

[0052] The “Y” group is a reactive group capable of reacting with the encapsulation 6 (e.g., the first encapsulation 3 and / or the second encapsulation 4). For example, the “Y” group may be a reactive group capable of reacting with the “COOH” or “NH2” group of the molding material of the first encapsulation 3 and / or the second encapsulation 4. The “R” group may be an alkyl chain connecting the “Y” group and the “Si(OX)3” group. The “Si(OX)3” group may be hydrolyzed to form a “Si(OH)3” group. Subsequently, its “OH” group may undergo a hydration condensation reaction to form a chemical bond with the light shielding layer 17, for example, with the stainless steel and / or copper of the light shielding layer 17. In some embodiments, by using a silane coupling agent as the coupling layer 16, the adhesion of the light shielding layer 17 to the encapsulation 6 can be improved. In some embodiments, the adhesion of the light shielding layer 17 to the encapsulation 6 is rated as 5B according to ASTM D3359 Test Method B. Additionally, one or more layers may be sandwiched between the optical shielding layer 17 and the encapsulation 6. For example, such as Figure 1 As shown, a coupling layer 16 is sandwiched between the encapsulation 6 and the light shielding layer 17, and therefore, the "adhesion of the light shielding layer 17 to the encapsulation 6" can be defined as the adhesion of the light shielding layer 17 and the coupling layer 16 to the encapsulation 6. According to ASTM D3359 Test Method B, the light shielding layer 17 (and the coupling layer 16, if feasible) can be cross-cut to form a 10×10 grid of 1mm×1mm squares, and tape can be placed to contact the light shielding layer 17. The tape can be any tape conforming to CID AA-113, Type 1, Class B, such as 3M tape. TM Transparent film tape 600 or 610. After the tape is removed, the adhesion can be assessed based on the state in which the light shielding layer 17 has been removed from the encapsulation 6.

[0053] A first optical lens 18 is disposed on the first package 3 and within the first through-hole 164 of the coupling layer 16 and the first through-hole 174 of the light shielding layer 17. The first optical lens 18 may be a lens for focusing light or an optical filter for selectively transmitting light of different wavelengths. The first optical lens 18 may be in the form of a solid or a gel with high viscosity. In some embodiments, the first optical lens 18 may be an infrared radiation (IR) filter.

[0054] The second optical lens 19 is disposed on the second package 4 and on the second through-hole 165 of the coupling layer 16 and the second through-hole 175 of the light shielding layer 17. The second optical lens 19 may be a lens for focusing light or an optical filter for selectively transmitting light of different wavelengths. The second optical lens 19 may be in the form of a solid or a gel with high viscosity. In some embodiments, the second optical lens 19 may be an infrared radiation (IR) filter.

[0055] In the optical device 1, the arrangement of the coupling layer 16 improves the adhesion between the package 6 (e.g., the first package 3 and / or the second package 4) and the light shielding layer 17 (e.g., the first portion 171 and the second portion 172). Therefore, the light shielding layer 17 can be prevented from peeling off from the package 6. Furthermore, when the material of the light shielding layer 17 is metal, the light shielding effect of the light shielding layer 17 is excellent. Additionally, the light shielding layer 17 can be formed by coating, for example, by sputtering, so that the light shielding layer 17 can smoothly and continuously cover the corner formed by the package 6 (e.g., the first package 3 and / or the second package 4) and the substrate 2. Therefore, light cannot pass through such corners.

[0056] Figure 2 A cross-sectional view illustrating an example of an optical device 1a according to some embodiments of the present invention is shown. The optical device 1a is similar to... Figure 1 The optical device 1 shown in the figure differs in that it includes a package 6a (e.g., including a first package 3, a second package 4 and an outer package 5), a coupling layer 16a and a light shielding layer 17a.

[0057] like Figure 2 As shown, the package 6a of the optical device 1a includes a first package 3, a second package 4, and an outer package 5. The first package 3 and the second package 4 are similar to... Figure 1The encapsulation shown in the diagram will not be described in detail here. The outer encapsulation 5 covers the first encapsulation 3 and the second encapsulation 4. For example, the outer encapsulation 5 is disposed on and in contact with the top surface (e.g., first surface 31) and side surface 33 of the first encapsulation 3, and is disposed on and in contact with the top surface (e.g., first surface 41) and side surface 43 of the second encapsulation 4. The outer encapsulation 5 has a first surface 51, a second surface 52 opposite to the first surface 51, and a side surface 53 extending between the first surface 51 and the second surface 52. The second surface 52 is disposed on and in contact with the first surface 21 of the substrate 2. The side surface 53 is substantially coplanar with the side surface 23 of the substrate 2. The outer encapsulation 5 defines a first via 54 corresponding to the light-receiving area of ​​the light-receiving component 14 and a second via 55 corresponding to the light-emitting area of ​​the light-emitting component 15. A trench 10 is provided between the first encapsulation 3 and the second encapsulation 4, and the outer encapsulation 5 is further disposed in the trench 10 between the first encapsulation 3 and the second encapsulation 4. For example, the inner portion 33a of the side surface 33 of the first package 3 faces the inner portion 43a of the side surface 43 of the second package 4. A trench 10 is disposed between the inner portion 33a of the side surface 33 of the first package 3 and the inner portion 43a of the side surface 43 of the second package 4. The outer package 5 disposed in the trench 10 prevents light from directly transmitting from the light-emitting component 15 to the light-receiving component 14.

[0058] The outer encapsulation 5 may be made of a light-blocking material and may therefore be opaque. In some embodiments, the outer encapsulation 5 may be made of an epoxy molding compound (with or without fillers) containing a black pigment such as carbon black. For example, the material of the outer encapsulation 5 may be... EME-G311L. At a given wavelength, the optical density of the outer package 5 with a thickness of approximately 150 μm can be greater than 2 (OD2), and preferably greater than 3 (OD3).

[0059] The coupling layer 16a is disposed on and in contact with the top surface 51 of the outer package 5. The coupling layer 16a defines a first via 164 corresponding to the light receiving area of ​​the light receiving component 14 and a second via 165 corresponding to the light emitting area of ​​the light emitting component 15.

[0060] An optical shielding layer 17a is disposed on and in contact with the coupling layer 16a. The side surface 166 of the coupling layer 16a, the side surface 176 of the optical shielding layer 17a, the side surface 53 of the outer package 5, and the side surface 23 of the substrate 2 are substantially coplanar. Similar to the coupling layer 16a, the optical shielding layer 17a defines a first via 174 corresponding to the light-receiving area of ​​the light-receiving component 14 and a second via 175 corresponding to the light-emitting area of ​​the light-emitting component 15. The first via 54 of the outer package 5 can be aligned with the first via 174 of the optical shielding layer 17a and the first via 164 of the coupling layer 16a, and the second via 55 of the outer package 5 can be aligned with the second via 175 of the optical shielding layer 17a and the second via 165 of the coupling layer 16a.

[0061] The first optical lens 18 is mounted on the first package 3 and is disposed in the first through-hole 54 of the outer package 5, the first through-hole 164 of the coupling layer 16a, and the first through-hole 174 of the light shielding layer 17a. The second optical lens 19 is mounted on the second package 4 and is disposed in the second through-hole 55 of the outer package 5, the second through-hole 165 of the coupling layer 16a, and the second through-hole 175 of the light shielding layer 17a.

[0062] Figure 3 A cross-sectional view illustrating an example of an optical device 1b according to some embodiments of the present invention is shown. The optical device 1b is similar to... Figure 2 The optical device 1a shown in the figure differs from the coupling layer 16b and the light shielding layer 17b.

[0063] A coupling layer 16b is disposed on and covers at least a portion of the package 6b. For example, the package 6b includes a first package 3, a second package 4, and an outer package 5b, and the coupling layer 16b covers the first package 3 and the second package 4. Figure 3 As shown, the coupling layer 16b includes a first portion 161b disposed on and in contact with the top surface (e.g., the first surface 31) of the first package 3, and a second portion 162b disposed on and in contact with the top surface (e.g., the first surface 41) of the second package 4. The first portion 161b and the second portion 162b of the coupling layer 16b may be separated from each other.

[0064] The optical shielding layer 17b is disposed on and in contact with the coupling layer 16b. For example... Figure 3 As shown, the optical shielding layer 17b includes a first portion 171b disposed on and in contact with a first portion 161b of the coupling layer 16b, and a second portion 172b disposed on and in contact with a second portion 162b of the coupling layer 16b. The first portion 171b and the second portion 172b of the optical shielding layer 17b are separable from each other.

[0065] The side surfaces of the first portion 161b of the coupling layer 16b and the first portion 171b of the optical shielding layer 17b are substantially coplanar with the side surface 33 of the first package 3. Similarly, the side surfaces of the second portion 162b of the coupling layer 16b and the second portion 171b of the optical shielding layer 17b are substantially coplanar with the side surface 43 of the second package 4. That is, the coupling layer 16b and the optical shielding layer 17b are not placed on the side surface 33 of the first package 3 or the side surface 43 of the second package 4.

[0066] An external package 5b is placed on and covers the first package 3, the second package 4, the coupling layer 16b, and the optical shielding layer 17b. For example... Figure 3 As shown, the outer package 5b is placed on and in contact with the light shielding layer 17b, the side surface 33 of the first package 3 and the side surface 43 of the second package 4.

[0067] Figure 4 A cross-sectional view illustrating an example of an optical device 1c according to some embodiments of the present invention is shown. The optical device 1c is similar to... Figure 3 The optical device 1b shown in the figure differs from the coupling layer 16c and the light shielding layer 17c.

[0068] like Figure 4 As shown, the first portion 161c of the coupling layer 16c is further disposed on and in contact with the side surface 33 of the first package 3, except for the inner portion 33a of the side surface 33. The first portion 171c of the light shielding layer 17c is disposed on the first portion 161c of the coupling layer 16c. Therefore, the first portion 171c of the light shielding layer 17c is further disposed on the side surface 33 of the first package 3, except for the inner portion 33a of the side surface 33.

[0069] Similarly, the second portion 162c of the coupling layer 16c is further disposed on and in contact with the side surface 43 of the second package 4, except for the inner portion 43a of the side surface 43. The second portion 172c of the light shielding layer 17c is disposed on the second portion 162c of the coupling layer 16c. Therefore, the second portion 172c of the light shielding layer 17c is further disposed on the side surface 43 of the second package 4, except for the inner portion 43a of the side surface 43.

[0070] The coupling layer 16c further includes a third portion 163c disposed on the first surface 21 of the substrate 2, and connects the first portion 161c and the second portion 162c. Similarly, the optical shielding layer 17c further includes a third portion 173c disposed on the third portion 163c of the coupling layer 16c, and connects the first portion 171c and the second portion 172c.

[0071] Figure 5A cross-sectional view illustrating an example of an optical device 1d according to some embodiments of the present invention is shown. The optical device 1d is similar to... Figure 3 The optical device 1b shown in the figure differs in that the coupling layer 16b is omitted. That is, the light shielding layer 17b (comprising a first portion 171b and a second portion 172b) is disposed on and in contact with the top surface (e.g., the first surface 31) of the first package 3 and the top surface (e.g., the first surface 41) of the second package 4.

[0072] Because the outer package 5b is placed on and covers the optical shielding layer 17b, the position of the optical shielding layer 17b can be fixed. Furthermore, the outer package 5b protects the optical shielding layer 17b and thus prevents it from peeling off. Additionally, since the optical shielding layer 17b is inserted into or sandwiched between two packages (e.g., between the outer package 5b and the first package 3, or between the outer package 5b and the second package 4), the coupling layer 16b may not be necessary.

[0073] Figures 6 to 12 Methods for manufacturing optical devices according to some embodiments of the present invention are illustrated. In some embodiments, the method is used to manufacture... Figure 1 The optical device 1 shown in the figure.

[0074] refer to Figure 6 A substrate 2 is provided. The substrate 2 has a first surface 21 and a second surface 22 opposite to the first surface 21. The substrate 2 may be an embedded trace substrate. For example, the substrate 2 may include a first circuit layer 24 exposed from the first surface 21, a second circuit layer 26 exposed from the second surface 22, and a conductive via 25 electrically connecting the first circuit layer 24 and the second circuit layer 26.

[0075] Next, the light-receiving component 14 and the light-emitting component 15 are disposed on the substrate 2 and attached side-by-side to the substrate 2. The light-emitting component 15 is adjacent to the light-receiving component 14. The light-receiving component 14 has a first surface 141 and a second surface 142 opposite to the first surface 141. For example, the second surface 142 of the light-receiving component 14 is attached to the first surface 21 of the substrate 2 via an adhesive 144. The light-receiving component 14 has a light-receiving region, which may include at least a portion of the first surface 141. The light-emitting component 15 has a first surface 151 and a second surface 152 opposite to the first surface 151. For example, the second surface 152 of the light-emitting component 15 is attached to the first surface 21 of the substrate 2 via an adhesive 154. The light-emitting component 15 has a light-emitting region, which may include at least a portion of the first surface 151.

[0076] refer to Figure 7Electrical connections are made between the light receiving component 14 and the light emitting component 15 and the substrate 2. For example, wiring 145 is formed to electrically connect the light receiving component 14 to the first circuit layer 24 of the substrate 2. Similarly, wiring 155 is formed to electrically connect the light emitting component 15 to the first circuit layer 24 of the substrate 2.

[0077] refer to Figure 8 An encapsulation 72 is formed on the substrate 2 to cover the light receiving component 14 and the light emitting component 15. The encapsulation 72 may be made of a transparent epoxy resin molding material without fillers.

[0078] refer to Figure 9 The encapsulation 72 is cut and separated to form encapsulation 6. Encapsulation 6 includes a first encapsulation 3 for covering the light receiving component 14 and a second encapsulation 4 for covering the light emitting component 15. The first encapsulation 3 is disposed on a first surface 21 of the substrate 2 and encapsulates the light receiving component 14. The first encapsulation 3 has a first surface 31, a second surface 32 opposite to the first surface 31, and a side surface 33 extending between the first surface 31 and the second surface 32. The second surface 32 is disposed on and in contact with the first surface 21 of the substrate 2. The second encapsulation 4 is disposed on the first surface 21 of the substrate 2 and encapsulates the light emitting component 15. The second encapsulation 4 has a first surface 41, a second surface 42 opposite to the first surface 41, and a side surface 43 extending between the first surface 41 and the second surface 42. The second surface 42 is disposed on and in contact with the first surface 21 of the substrate 2. The first encapsulation 3 and the second encapsulation 4 are separated from each other.

[0079] refer to Figure 10 The first spacer 74 is placed on the first package 3 and corresponds to the light-receiving area of ​​the light-receiving component 14. Similarly, the second spacer 75 is placed on the second package 4 and corresponds to the light-emitting area of ​​the light-emitting component 15. The first spacer 74 and / or the second spacer 75 may be tape attached to the package 6.

[0080] refer to Figure 11 A coupling agent is applied to the surface of the package 6, such as the top surface (e.g., first surface 31) and side surface 33 of the first package 3 and the top surface (e.g., first surface 41) and side surface 43 of the second package 4, to form a coupling layer 16. Figure 11As shown, a coupling agent is applied to a first package 3, a first spacer 74, a second package 4, a second spacer 75, and a substrate 2 to form a coupling layer 16. The coupling layer 16 includes a first portion 161, a second portion 162, and a third portion 163. The first portion 161 is disposed on and in contact with the first package 3, for example, disposed on and in contact with the top surface (e.g., first surface 31) and side surface 33 of the first package 3. The second portion 162 is disposed on and in contact with the second package 4, for example, disposed on and in contact with the top surface (e.g., first surface 41) and side surface 43 of the second package 4. The third portion 163 is disposed on and in contact with the first surface 21 of the substrate 2 and connects the first portion 161 and the second portion 162. In some embodiments, after coating, the coupling agent may be further heated to form a coupling layer 16 bonded to the package 6. In some embodiments, the coupling agent of the coupling layer 16 may be a silane coupling agent, titanate coupling agent, aluminate coupling agent, phosphate coupling agent, borate coupling agent, chromium zirconia salt coupling agent, bimetallic coupling agent, aliphatic acid coupling agent, aliphatic alcohol coupling agent, ester coupling agent, etc.

[0081] Next, an optical shielding layer 17 is formed on the coupling layer 16, for example, by sputtering, and the optical shielding layer 17 is in contact with the coupling layer 16. Figure 11 As shown, the light shielding layer 17 further includes a first portion 171, a second portion 172, and a third portion 173 respectively disposed on a first portion 161, a second portion 162, and a third portion 163 of the coupling layer 16. In some embodiments, after sputtering, the light shielding layer 17 may be further heated to form a bond with the coupling layer 16. In some embodiments, the light shielding layer 17 may be a metal layer, for example, comprising stainless steel and / or copper.

[0082] refer to Figure 12 The first spacer 74 is removed, such that a portion of the coupling layer 16 and a portion of the light shielding layer 17 on the first spacer 74 are correspondingly removed to form a first through-hole 164 of the coupling layer 16 and a first through-hole 174 of the light shielding layer 17. Similarly, the second spacer 75 is removed, such that a portion of the coupling layer 16 and a portion of the light shielding layer 17 on the second spacer 75 are correspondingly removed to form a second through-hole 165 of the coupling layer 16 and a second through-hole 175 of the light shielding layer 17. That is, the coupling layer 16 defines a first through-hole 164 corresponding to the light receiving area of ​​the light receiving component 14 and a second through-hole 165 corresponding to the light emitting area of ​​the light emitting component 15. Similarly, the light shielding layer 17 defines a first through-hole 174 corresponding to the light receiving area of ​​the light receiving component 14 and a second through-hole 175 corresponding to the light emitting area of ​​the light emitting component 15. The first through hole 174 of the optical shielding layer 17 can be aligned with the first through hole 164 of the coupling layer 16, and the second through hole 175 of the optical shielding layer 17 can be aligned with the second through hole 165 of the coupling layer 16.

[0083] Next, a first optical lens 18 is placed on the first package 3 and in the first through-hole 164 of the coupling layer 16 and the first through-hole 174 of the light shielding layer 17. Similarly, a second optical lens 19 is placed on the second package 4 and in the second through-hole 165 of the coupling layer 16 and the second through-hole 175 of the light shielding layer 17. Then, a singulation process is performed, thus forming... Figure 1 The optical device 1 shown in the figure. Therefore, the side surface 166 of the coupling layer 16, the side surface 176 of the light shielding layer 17 and the side surface 23 of the substrate 2 can be substantially coplanar.

[0084] Figures 13 to 15 Methods for manufacturing optical devices according to some embodiments of the present invention are illustrated. In some embodiments, the methods are used to manufacture, for example... Figure 2 The optical device of optical device 1a shown in the figure. The initial stage of the process is illustrated. Figures 6 to 10 The stages depicted are the same or similar. Figure 13 Depicting Figure 10 The stage following the stage described in the text.

[0085] refer to Figure 13 An outer package 5 is formed to cover the first package 3 and the second package 4. For example, the outer package 5 is disposed on and in contact with the top surface (e.g., first surface 31) and side surface 33 of the first package 3, and is disposed on and in contact with the top surface (e.g., first surface 41) and side surface 43 of the second package 4. The outer package 5 has a first surface 51 and a second surface 52 opposite to the first surface 51. The second surface 52 is disposed on and in contact with the first surface 21 of the substrate 2. A trench 10 is provided between the first package 3 and the second package 4, and the outer package 5 is further disposed in the trench 10 between the first package 3 and the second package 4. For example, the inner portion 33a of the side surface 33 of the first package 3 faces the inner portion 43a of the side surface 43 of the second package 4. The trench 10 is disposed between the inner portion 33a of the side surface 33 of the first package 3 and the inner portion 43a of the side surface 43 of the second package 4. The outer package 5 has a first through-hole 54 for accommodating the first spacer 74 and a second through-hole 55 for accommodating the second spacer 75. The first through-hole 54 corresponds to the light-receiving area of ​​the light-receiving component 14, and the second through-hole 55 corresponds to the light-emitting area of ​​the light-emitting component 15. Thus, a package 6a is formed, which includes the first package 3, the second package 4, and the outer package 5.

[0086] refer to Figure 14A coupling agent is applied to the surface of the package 6a, such as the top surface (e.g., the first surface 51) of the outer package 5, to form a coupling layer 16a. Next, a shielding layer 17a is formed on and in contact with the coupling layer 16a.

[0087] refer to Figure 15 The first spacer 74 is removed. A portion of the coupling layer 16a and a portion of the light shielding layer 17a on the first spacer 74 are correspondingly removed to form a first through-hole 164 of the coupling layer 16a and a first through-hole 174 of the light shielding layer 17a. Similarly, the second spacer 75 is removed, and a portion of the coupling layer 16a and a portion of the light shielding layer 17a on the second spacer 75 are correspondingly removed to form a second through-hole 165 of the coupling layer 16a and a second through-hole 175 of the light shielding layer 17a. That is, the coupling layer 16a defines a first through-hole 164 corresponding to the light receiving area of ​​the light receiving component 14 and a second through-hole 165 corresponding to the light emitting area of ​​the light emitting component 15. Similarly, the light shielding layer 17a defines a first through-hole 174 corresponding to the light receiving area of ​​the light receiving component 14 and a second through-hole 175 corresponding to the light emitting area of ​​the light emitting component 15. The first through hole 54 of the external package 5 can be aligned with the first through hole 174 of the optical shielding layer 17a and the first through hole 164 of the coupling layer 16a, and the second through hole 55 of the external package 5 can be aligned with the second through hole 175 of the optical shielding layer 17a and the second through hole 165 of the coupling layer 16a.

[0088] Next, the first optical lens 18 is placed on the first package 3 and in the first through-hole 54 of the outer package 5. Similarly, the second optical lens 19 is placed on the second package 4 and in the second through-hole 55 of the outer package 5. Then, a single-cutting process is performed, thus forming as shown... Figure 2 The optical device 1a shown in the figure. Therefore, the side surface 53 of the outer package 5 is substantially coplanar with the side surface 23 of the substrate 2.

[0089] Figures 16 to 21 Methods for manufacturing optical devices according to some embodiments of the present invention are illustrated. In some embodiments, the methods are used to manufacture, for example... Figure 3 The optical device 1b shown is an optical device. The initial stage of the process is illustrated. Figures 6 to 7 The stages depicted are the same or similar. Figure 16 Depicting Figure 7 The stage following the stage described in the text.

[0090] refer to Figure 16 An encapsulation 72b is formed on the substrate 2 to cover the light receiving component 14 and the light emitting component 15. The encapsulation 72b can cover the entire first surface 21 of the substrate 2.

[0091] refer to Figure 17 The first spacer 74 is disposed on the package 72b and corresponds to the light receiving area of ​​the light receiving component 14. Similarly, the second spacer 75 is disposed on the package 72b and corresponds to the light emitting area of ​​the light emitting component 15.

[0092] refer to Figure 18 A coupling layer 16b is formed to contact and cover the top surface of the package 72b, the first spacer 74, and the second spacer 75. Next, a shielding layer 17b is formed on and in contact with the coupling layer 16b.

[0093] refer to Figure 19 The encapsulation 72b is cut and separated, thus forming a first encapsulation 3 for covering the light-receiving component 14 and a second encapsulation 4 for covering the light-emitting component 15. The first encapsulation 3 is disposed on the first surface 21 of the substrate 2 and encapsulates the light-receiving component 14. The first encapsulation 3 has a first surface 31, a second surface 32 opposite to the first surface 31, and a side surface 33 extending between the first surface 31 and the second surface 32. The second surface 32 is disposed on and in contact with the first surface 21 of the substrate 2. The second encapsulation 4 is disposed on the first surface 21 of the substrate 2 and encapsulates the light-emitting component 15. The second encapsulation 4 has a first surface 41, a second surface 42 opposite to the first surface 41, and a side surface 43 extending between the first surface 41 and the second surface 42. The second surface 42 is disposed on and in contact with the first surface 21 of the substrate 2.

[0094] A groove 10 is provided between the first package 3 and the second package 4. For example, the inner portion 33a of the side surface 33 of the first package 3 faces the inner portion 43a of the side surface 43 of the second package 4. The groove 10 is disposed between the inner portion 33a of the side surface 33 of the first package 3 and the inner portion 43a of the side surface 43 of the second package 4.

[0095] Correspondingly, the coupling layer 16b is also cut and separated to form a first portion 161b disposed on and in contact with the top surface (e.g., the first surface 31) of the first package 3, and a second portion 162b disposed on and in contact with the top surface (e.g., the first surface 41) of the second package 4. The light shielding layer 17b is cut and separated to form a first portion 171b disposed on and in contact with the first portion 161b of the coupling layer 16b, and a second portion 172b disposed on and in contact with the second portion 162b of the coupling layer 16b.

[0096] refer to Figure 20 An external encapsulation 5b is formed to cover the coupling layer 16b, the optical shielding layer 17b, the first encapsulation 3, and the second encapsulation 4. For example... Figure 20As shown, the outer package 5b is disposed on and in contact with the light shielding layer 17b, the side surface 33 of the first package 3, and the side surface 43 of the second package 4. The outer package 5b is further disposed in a trench 10, which is located between the inner portion 33a of the side surface 33 of the first package 3 and the inner portion 43a of the side surface 43 of the second package 4. The outer package 5b has a first through-hole 54 for receiving a first spacer 74 and a second through-hole 55 for receiving a second spacer 75. The first through-hole 54 corresponds to the light receiving area of ​​the light receiving component 14, and the second through-hole 55 corresponds to the light emitting area of ​​the light emitting component 15. Therefore, a package 6b is formed, comprising the first package 3, the second package 4, and the outer package 5b.

[0097] refer to Figure 21 The first spacer 74 is removed. A portion of the coupling layer 16b and a portion of the light shielding layer 17b on the first spacer 74 are correspondingly removed to form a first through-hole 164 of the coupling layer 16b and a first through-hole 174 of the light shielding layer 17b. Similarly, the second spacer 75 is removed, and a portion of the coupling layer 16b and a portion of the light shielding layer 17b on the second spacer 75 are correspondingly removed to form a second through-hole 165 of the coupling layer 16b and a second through-hole 175 of the light shielding layer 17b. That is, the coupling layer 16b defines a first through-hole 164 corresponding to the light receiving area of ​​the light receiving component 14 and a second through-hole 165 corresponding to the light emitting area of ​​the light emitting component 15. Similarly, the light shielding layer 17b defines a first through-hole 174 corresponding to the light receiving area of ​​the light receiving component 14 and a second through-hole 175 corresponding to the light emitting area of ​​the light emitting component 15. The first through hole 54 of the outer package 5b can be aligned with the first through hole 174 of the optical shielding layer 17b and the first through hole 164 of the coupling layer 16b, and the second through hole 55 of the outer package 5b can be aligned with the second through hole 175 of the optical shielding layer 17b and the second through hole 165 of the coupling layer 16b.

[0098] Next, the first optical lens 18 is mounted on the first package 3 and is disposed in the first through-hole 164 of the coupling layer 16b, the first through-hole 174 of the light shielding layer 17b, and the first through-hole 54 of the outer package 5b. Similarly, the second optical lens 19 is mounted on the second package 4 and is disposed in the second through-hole 165 of the coupling layer 16b, the second through-hole 175 of the light shielding layer 17b, and the second through-hole 55 of the outer package 5b. Then, a single-cutting process is performed, thus forming as shown... Figure 3 The optical device 1b shown in the figure. Therefore, the side surface 53 of the outer package 5b is substantially coplanar with the side surface 23 of the substrate 2.

[0099] Figures 22 to 24Methods for manufacturing optical devices according to some embodiments of the present invention are illustrated. In some embodiments, the methods are used to manufacture, for example... Figure 4 The optical device 1c shown in the figure has an optical device. The initial stage of the process is illustrated. Figures 6 to 8 The stages depicted are the same or similar. Figure 22 Depicting Figure 8 The stage following the stage described in the text.

[0100] refer to Figure 22 The first spacer 74 is disposed on the package 72 and corresponds to the light receiving area of ​​the light receiving component 14. Similarly, the second spacer 75 is disposed on the package 72 and corresponds to the light emitting area of ​​the light emitting component 15.

[0101] refer to Figure 23 A coupling layer 16c is formed to cover the top and side surfaces of the package 72, the first spacer 74 and the second spacer 75, and a portion of the first surface 21 of the substrate 2. Next, a shielding layer 17b is formed on and in contact with the coupling layer 16b.

[0102] refer to Figure 24 The encapsulation 72 is cut and separated, thus forming a first encapsulation 3 for covering the light receiving component 14, a second encapsulation 4 for covering the light emitting component 15, and a trench 10 disposed between the first encapsulation 3 and the second encapsulation 4. The first encapsulation 3 is disposed on the first surface 21 of the substrate 2 and encapsulates the light receiving component 14. The first encapsulation 3 has a first surface 31, a second surface 32 opposite to the first surface 31, and a side surface 33 extending between the first surface 31 and the second surface 32. The second surface 32 is disposed on and in contact with the first surface 21 of the substrate 2. The second encapsulation 4 is disposed on the first surface 21 of the substrate 2 and encapsulates the light emitting component 15. The second encapsulation 4 has a first surface 41, a second surface 42 opposite to the first surface 41, and a side surface 43 extending between the first surface 41 and the second surface 42. The second surface 42 is disposed on and in contact with the first surface 21 of the substrate 2.

[0103] Correspondingly, the coupling layer 16c is also cut and separated to form a first portion 161c disposed on and in contact with the top surface (e.g., the first surface 31) of the first package 3, and a second portion 162c disposed on and in contact with the top surface (e.g., the first surface 41) of the second package 4. The first portion 161c of the coupling layer 16c is further disposed on and in contact with the side surface 33 of the first package 3, except for the inner portion 33a of the side surface 33. Similarly, the second portion 162c of the coupling layer 16c is further disposed on and in contact with the side surface 43 of the second package 4, except for the inner portion 43a of the side surface 43. The light shielding layer 17c is cut and separated to form a first portion 171c disposed on and in contact with the first portion 161c of the coupling layer 16c, and a second portion 172c disposed on and in contact with the second portion 162c of the coupling layer 16c. Therefore, the first portion 171c of the light shielding layer 17c is further disposed on the side surface 33 of the first package 3, except for the inner portion 33a of the side surface 33. Similarly, the second portion 172c of the light shielding layer 17c is further disposed on the side surface 43 of the second package 4, except for the inner portion 43a of the side surface 43.

[0104] The coupling layer 16c further includes a third portion 163c disposed on the first surface 21 of the substrate 2, and connects the first portion 161c and the second portion 162c. Similarly, the optical shielding layer 17c further includes a third portion 173c disposed on the third portion 163c of the coupling layer 16c, and connects the first portion 171c and the second portion 172c.

[0105] The process shown Figure 24 The stages shown in the text are similar to the stages that follow. Figures 20 to 21 The stages depicted in the diagram thus form Figure 4 The optical device 1c shown in the figure.

[0106] Unless otherwise specified, spatial descriptions such as "above," "below," "upward," "left," "right," "downward," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper," "above," "below," etc., are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of the invention are not deviated from by such arrangement.

[0107] As used herein, the terms “approximately,” “generally,” “roughly,” and “about” are used to describe and account for minor variations. When used in conjunction with an event or situation, the terms may refer to a situation where the event or situation has clearly occurred or is very close to occurring. For example, when used in conjunction with numerical values, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "approximately" the same.

[0108] If the displacement between two surfaces is no greater than 5 μm, 2 μm, 1 μm, or 0.5 μm, then the two surfaces can be considered coplanar or approximately coplanar.

[0109] Unless the context clearly specifies otherwise, as used herein, the singular terms “a” and “the” may include multiple indicators.

[0110] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials typically indicate those that exhibit minimal or zero resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, conductive materials have a conductivity greater than about 10. 4 S / m (e.g., at least 10) 5 S / m or at least 10 6 A material is defined as having an electrical conductivity (S / m). The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

[0111] Additionally, quantities, ratios, and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted to include not only values ​​explicitly specified as range limits, but also all individual values ​​or subranges covered within the range, as if each value and subrange were explicitly specified.

[0112] Although the invention has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and substitutions can be made without departing from the true spirit and scope of the invention as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and limitations, there may be differences between the process reproduction in the invention and actual equipment. Other embodiments of the invention may exist that are not specifically described. This specification and the accompanying drawings should be considered illustrative rather than limiting. Modifications may be made to adapt particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are intended to fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention.

Claims

1. An optical device comprising: Substrate; A light receiving component, which is disposed on the substrate; A light-emitting component, which is disposed on the substrate and adjacent to the light-receiving component; A first package covers the light receiving component; A second encapsulation covering the light-emitting component; A coupling layer comprising a first part, a second part, and a third part, wherein the first part is disposed on and in contact with the top and side surfaces of the first package, the second part is disposed on and in contact with the top and side surfaces of the second package, and the third part is disposed on and in contact with the substrate, and connects the first part and the second part. and A light-shielding layer is disposed on and in contact with the coupling layer, and is conformally fitted to the coupling layer. The optical shielding layer is a metal layer formed by sputtering, and has a thickness of less than 2 μm. In the wavelength range of 300 nm to 1100 nm, the optical density of the optical shielding layer is greater than 4.

2. The optical device of claim 1, wherein the coupling layer is disposed in a trench between the first package and the second package, wherein the light receiving component is attached to the substrate via a first adhesive and electrically connected to the substrate via wiring, wherein the light emitting component is attached to the substrate via a second adhesive and electrically connected to the substrate via wiring, wherein the third portion of the coupling layer horizontally overlaps the first adhesive and the second adhesive.

3. The optical device according to claim 2, wherein the optical shielding layer comprises a first portion, a second portion, and a third portion respectively disposed on the first portion, the second portion, and the third portion of the coupling layer, wherein the third portion of the optical shielding layer horizontally overlaps the first adhesive and the second adhesive.

4. The optical device of claim 3, wherein the first portion and the third portion of the light shielding layer continuously cover the corner formed by the inner portion of the side surface of the first package and the top surface of the substrate.

5. The optical device of claim 4, wherein the second portion and the third portion of the light shielding layer continuously cover the corner formed by the inner portion of the side surface of the second package and the top surface of the substrate.

6. The optical device of claim 1, wherein the first portion and the third portion of the light shielding layer continuously cover the corner formed by the inner portion of the side surface of the first package and the top surface of the substrate.

7. The optical device of claim 6, wherein the second portion and the third portion of the light shielding layer continuously cover the corner formed by the inner portion of the side surface of the second package and the top surface of the substrate.

8. The optical device according to claim 7, wherein the first portion, the second portion, and the third portion of the light shielding layer together define a groove.

9. The optical device of claim 8, wherein the first encapsulation is made of epoxy resin molding material without filler, and the second encapsulation is made of epoxy resin molding material without filler, wherein the first encapsulation and the second encapsulation are transparent.

10. The optical device according to claim 9, wherein the side surface of the coupling layer, the side surface of the light shielding layer, and the side surface of the substrate are coplanar.

11. The optical device of claim 10, wherein the coupling layer is formed of a coupling agent, and the coupling agent is selected from the group consisting of: silane coupling agents, titanate coupling agents, aluminate coupling agents, phosphate coupling agents, borate coupling agents, chromium zirconia salt coupling agents, bimetallic coupling agents, aliphatic acid coupling agents, aliphatic alcohol coupling agents, and ester coupling agents.

12. The optical device of claim 11, wherein the light shielding layer defines a through-hole corresponding to the light receiving area of ​​the light receiving component.

13. The optical device according to claim 12, wherein the light shielding layer comprises three layers: a stainless steel layer, a copper layer, and a stainless steel layer.

14. The optical device according to claim 13, further comprising: A first optical lens is mounted on the first package, and the coupling layer and the light shielding layer are in contact with the side of the first optical lens; and A second optical lens is mounted on the second package, and the coupling layer and the light shielding layer are in contact with the side of the second optical lens.

15. The optical device of claim 14, wherein the transmittance of the light beam from the light-emitting component to the light-receiving component is less than 10. -4 .

16. The optical device of claim 15, wherein the adhesion of the optical shielding layer to the first encapsulation is rated as 5B according to ASTM D3359 test method B.

17. The optical device of claim 16, wherein the entire optical shielding layer is conformally fitted to the entire coupling layer.

18. An optical device comprising: Substrate; A light receiving component, which is disposed on the substrate; A light-emitting component, which is disposed on the substrate and adjacent to the light-receiving component; A first package covers the light receiving component; A second encapsulation covering the light-emitting component; An external package is disposed on and in contact with the top and side surfaces of the first package, and disposed on and in contact with the top and side surfaces of the second package, wherein the external package contacts the substrate, and the external package is further disposed in a trench between the first package and the second package, and the external package is opaque. The coupling layer is disposed only on and in contact with the top surface of the external package; and A metal shielding layer is disposed only on and in contact with the coupling layer and is conformal to the coupling layer, wherein the side surface of the coupling layer, the side surface of the optical shielding layer, the side surface of the external package are coplanar with the side surface of the substrate, wherein the metal shielding layer is a metal layer formed by a sputtering process, the metal shielding layer has a thickness of less than 2 μm, and the optical density of the metal shielding layer is greater than 4 in the wavelength range of 300 nm to 1100 nm.

19. The optical device of claim 18, wherein the light receiving component is attached to the substrate via a first adhesive and electrically connected to the substrate via wiring, wherein the light emitting component is attached to the substrate via a second adhesive and electrically connected to the substrate via wiring, wherein the bottom of the outer package horizontally overlaps the first adhesive and the second adhesive.

20. The optical device of claim 19, wherein the bottom surface of the outer package is coplanar with the bottom surface of the first adhesive and the bottom surface of the second adhesive.

21. The optical device of claim 20, wherein the first encapsulation is made of epoxy resin molding material without filler, the second encapsulation is made of epoxy resin molding material without filler, and the outer encapsulation is made of epoxy resin molding material containing black pigment.

22. The optical device of claim 21, wherein the external encapsulation defines a first through-hole and a second through-hole, the first through-hole corresponding to a light-receiving area of ​​the light-receiving component and the second through-hole corresponding to a light-emitting area of ​​the light-emitting component, the coupling layer defining a first through-hole corresponding to a light-receiving area of ​​the light-receiving component and a second through-hole corresponding to a light-emitting area of ​​the light-emitting component, the light shielding layer defining a first through-hole corresponding to a light-receiving area of ​​the light-receiving component and a second through-hole corresponding to a light-emitting area of ​​the light-emitting component, the first through-hole of the external encapsulation being aligned with the first through-hole of the light shielding layer and the first through-hole of the coupling layer, and the second through-hole of the external encapsulation being aligned with the second through-hole of the light shielding layer and the second through-hole of the coupling layer.

23. The optical device according to claim 22, further comprising: A first optical lens is disposed in the first through-hole of the external package, the first through-hole of the coupling layer, and the first through-hole of the light shielding layer; and The second optical lens is disposed in the second through-hole of the external package, the second through-hole of the coupling layer, and the second through-hole of the optical shielding layer.

24. An optical device comprising: Substrate; A light receiving component, which is disposed on the substrate; A light-emitting component, which is disposed on the substrate and adjacent to the light-receiving component; A first package covers the light receiving component; A second encapsulation covering the light-emitting component; A coupling layer covering the first package and the second package; A light shielding layer is disposed on the top surface of the first package and the top surface of the second package, wherein the light shielding layer defines a first through-hole corresponding to the light receiving area of ​​the light receiving component and a second through-hole corresponding to the light emitting area of ​​the light emitting component; and An outer package that covers and contacts the light-shielding layer, and is further disposed in a trench between the first package and the second package, and contacts the inner portions of the side surfaces of the first package and the second package, as well as the top surface of the substrate, wherein the outer package is opaque, and wherein the outer package defines: The first through hole corresponds to the light receiving area of ​​the light receiving component and is aligned with the first through hole of the light shielding layer; and The second through-hole corresponds to the light-emitting area of ​​the light-emitting component and is aligned with the second through-hole of the light-shielding layer. The optical shielding layer is a metal layer formed by sputtering, and has a thickness of less than 2 μm. In the wavelength range of 300 nm to 1100 nm, the optical density of the optical shielding layer is greater than 4.

25. The optical device of claim 24, wherein a first portion of the coupling layer is disposed on and in contact with the top surface of the first package, a second portion of the coupling layer is disposed on and in contact with the top surface of the second package, wherein the first portion and the second portion of the coupling layer are separated from each other; a first portion of the light shielding layer is disposed on and in contact with the first portion of the coupling layer, and a second portion of the light shielding layer is disposed on and in contact with the second portion of the coupling layer, wherein the first portion and the second portion of the light shielding layer are separated from each other, wherein the outer package covers and contacts the first portion and the second portion of the light shielding layer.

26. The optical device of claim 25, wherein the side surface of the first portion of the coupling layer, the side surface of the first portion of the light shielding layer, and the side surface of the first package are coplanar, wherein the side surface of the second portion of the coupling layer, the side surface of the second portion of the light shielding layer, and the side surface of the second package are coplanar.

27. The optical device of claim 25, wherein the first portion of the coupling layer is further disposed on and in contact with an outer portion of the side surface of the first package, wherein the first portion of the light shielding layer completely covers the first portion of the coupling layer, wherein the second portion of the coupling layer is further disposed on and in contact with an outer portion of the side surface of the second package, wherein the second portion of the light shielding layer completely covers the second portion of the coupling layer.

28. A method for manufacturing an optical device, comprising: (a) Providing a substrate; (b) Mounting the light receiving component on the substrate; (c) Forming an encapsulation to cover the light receiving component; (c1) A spacer is disposed on the encapsulation and corresponding to the light receiving area of ​​the light receiving component; (d) Apply a coupling agent to the surface of the package and the spacer to form a coupling layer; (e) A light shielding layer is formed on the coupling layer by a sputtering process; and (f) Remove the spacer such that a portion of the coupling layer and a portion of the optical shielding layer on the spacer are correspondingly removed, and such that the optical shielding layer defines a via corresponding to the optical receiving area of ​​the optical receiving component. The optical shielding layer formed in step (e) has a thickness of less than 2 μm and a wavelength range of 300 nm to 1100 nm, and the optical density of the optical shielding layer is greater than 4.

29. The method of claim 28, wherein step (b) further comprises disposing a light-emitting component on the substrate and adjacent to the light-receiving component; step (c) comprises forming a first encapsulation to cover the light-receiving component, forming a second encapsulation to cover the light-emitting component, and forming an outer encapsulation to cover the first encapsulation and the second encapsulation; and step (d) comprises applying the coupling agent to the top surface of the outer encapsulation to form the coupling layer.

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