An integrated IR light source device and its packaging method

Abstract

The present invention discloses an integrated IR light source device and its packaging method. The key points of the technical solution are that the integrated IR light source device includes a substrate, a metallized circuit layer is provided on the periphery of the substrate, a light window cover plate is provided on the metallized circuit layer, the light window cover plate includes a metal part, a light passing hole and a light window lens covering the light passing hole are respectively provided on the metal part, the light window cover plate is arranged above the substrate so that a cavity is formed between the light window cover plate and the substrate, and a chip set is arranged in the cavity and the chip set is fixed on the substrate. In the present invention, the substrate, the metal part and the light window lens all adopt inorganic materials, and the solder, the metallized circuit layer and all the plating layers also adopt inorganic materials. The light window lens and the metal part are sealed and integrated into a light window cover plate by using a sintering process or a fusion welding process, and the light window cover plate and the substrate are combined into an LED device by using a resistance welding process or a fusion welding process, so as to achieve high airtightness and inorganic packaging.

Description

Technical Field

[0001] The present invention relates to the field of light source device packaging, and particularly to an integrated IR light source device and its packaging method.

Background Art

[0002] With the increasing maturity of LED technology, LEDs have been widely used in various industries. In recent years, the development of 5G technology has driven the interconnection of all things and smart homes, endowing light with different meanings. Among them, infrared LEDs play an important role in security, face recognition, machine vision, intelligent control, food detection, and medical treatment. Traditional infrared LED lamp beads are encapsulated in the form of epoxy resin or silica gel, and the wavelength band is concentrated in the near-infrared range of 660 - 940 nm. In applications that require lighting or supplementary lighting, infrared LED lamp beads and white LED lamp beads are usually mounted on the same PCB circuit board respectively and controlled by corresponding circuits to realize their respective functions. This makes the size miniaturization and integration of such application products greatly affected by the number and arrangement of LED lamp beads. Therefore, integrating white light and infrared chips into one package can well meet the application requirements. At the same time, the integrated IR light source device has better cost performance and reliability compared with single white light and infrared separated devices. Especially for high-power IR light source devices in outdoor or public places, the physical and chemical properties of the light source and environmental factors are likely to cause the aging and yellowing of organic materials such as silica gel or epoxy resin, and changes in oxygen permeability, moisture permeability, and light transmission characteristics lead to device failure or dead lights. The traditional silica gel or epoxy resin packaging form cannot well meet the reliability requirements and specific applications of such products. Therefore, it is urgent to seek an integrated and airtight packaging IR light source device.

Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an integrated IR light source device and its packaging method. Compared with traditional IR light sources, white light and infrared LEDs are integrated into one body, realizing an infrared LED light source device that combines lighting and supplementary lighting, with functional integration and high-airtight packaging.

[0004] The present invention is realized through the following technical solutions:

[0005] An integrated IR light source device, characterized in that: it includes a substrate 2, a metallized circuit layer 4 is provided on the periphery of the substrate 2, a light window cover plate 1 is provided on the metallized circuit layer 4, the light window cover plate 1 includes a metal part 101, a light passing hole and a light window lens 102 covering the light passing hole are respectively provided on the metal part 101, the light window cover plate 1 has a cavity structure, the light window cover plate 1 is arranged above the substrate 2 so that a cavity 6 is formed between the light window cover plate 1 and the substrate 2, a chip group 3 is provided in the cavity 6, the chip group 3 is fixed on the substrate 2, and the substrate 2 is a planar structure.

[0006] The integrated IR light source device as described above is characterized in that: the chipset 3 is a combination of a white light chip 301 and an infrared chip 302.

[0007] The integrated IR light source device as described above is characterized in that: the chipset 3 is a combination of an ultraviolet chip and an infrared chip, or a combination of a white light chip, an infrared chip, and an ultraviolet chip.

[0008] The integrated IR light source device as described above is characterized in that: there is a solder 5 for welding and connecting the optical window lens 102 and the metal part 101 between the optical window lens 102 and the metal part 101, and the solder 5 is made of an inorganic material.

[0009] The integrated IR light source device as described above is characterized in that: the substrate 2 is made of one of ceramic, aluminum, copper, and aluminum silicon carbide substrate.

[0010] The integrated IR light source device as described above is characterized in that: the optical window lens 102 is made of quartz glass, and the shape of the optical window lens 102 is one of square, circular, ellipsoidal, and hemispherical.

[0011] The integrated IR light source device as described above is characterized in that: the metal part 101 is made of Kovar alloy, copper, or aluminum. There is an extended metal solder edge at the bottom edge of the metal part 101, and the metal solder edge is welded and connected to the metallized circuit layer 4. The width H1 of the metal solder edge is ≥ 0.3 mm, the thickness H2 of the metallized circuit layer 4 is ≥ 60 μm, there is a plating layer on the surface of the metallized circuit layer 4, and the plating layer is made of gold or nickel-gold; there is a nickel plating layer on the surface of the metal part 101, and the depth H3 of the cavity 6 is ≥ 0.5 mm.

[0012] A packaging method for the integrated IR light source device as described above is characterized by including:

[0013] The chipset 3 is bonded to the substrate 2 through a die bonding process using solder paste, silver glue, or eutectic process;

[0014] There is a circular metallized circuit layer 4 provided at the edge of the substrate 2, the thickness of the circuit layer of the metallized circuit layer 4 is not less than 60 μm, and the surface of the metallized circuit layer 4 is subjected to gold plating or nickel-gold plating treatment;

[0015] The metal part 101 is fabricated by die stamping, and the surface of the metal part 101 is nickel-plated;

[0016] Cut a quartz glass sheet matching the size of the light-transmitting hole to make the optical window lens 102. Treat the annular area within 0.5 mm from the edge of the optical window lens 102 with a coating. The coating thickness is ≥10 μm. Install the optical window lens 102 into the metal part 101 through a tooling fixture, and use a fusion welding process to weld the coating area at the edge of the optical window lens 102 and the mating contact part of the metal part 101 to make the optical window cover 1, or add solder 5 to sinter the optical window lens 102 and the metal part 101 into the optical window cover 1;

[0017] The optical window cover 1 is assembled onto the metallized circuit layer 4 of the substrate 2 through a fixture, and the optical window cover 1 and the substrate 2 are sealed together through a resistance welding process or a fusion welding process to make an integrated IR light source device.

[0018] The packaging method of the integrated IR light source device as described above is characterized in that: the resistance welding process is parallel seam welding, and the fusion welding process is laser welding.

[0019] The packaging method of the integrated IR light source device as described above is characterized in that: the components of the solder 5 are TiCuBiZnMn, where Ti accounts for 6.8%-25%, Cu accounts for 19.6%-34%, Bi accounts for 4.2%-7.3%, Zn accounts for 21%-37%, and Mn accounts for 0.56%-1.2%; the coating components at the edge of the optical window lens 102 are nickel-gold or copper.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. In the present invention, the substrate, the metal part, and the optical window lens all adopt inorganic materials, and the solder, the metallized circuit layer, and all the coatings also adopt inorganic materials. The optical window lens and the metal part are sealed together to make the optical window cover by a sintering process or a fusion welding process, and the optical window cover and the substrate are combined into an LED device by a resistance welding or a fusion welding process, realizing high airtightness and inorganic packaging.

[0022] 2. Compared with the traditional IR light source device, in the present invention, because multiple chips share a set of optical window cover and substrate and are integrated by an inorganic packaging technology, the volume is greatly reduced, and the reliability and cost performance are greatly improved.

Description of the Drawings

[0023] Figure 1 It is a schematic diagram of the substrate of the integrated IR light source device of the present invention;

[0024] Figure 2 It is a schematic cross-sectional view of the overall structure of the first embodiment of the present invention. In the figure, the shape of the optical window lens is square or circular, the substrate is a planar structure, and the optical window lens is sintered and connected to the metal part;

[0025] Figure 3It is a schematic cross-sectional view of the overall structure of the second embodiment of the present invention. In the figure, the shape of the optical window lens is hemispherical or ellipsoidal, the substrate is a planar structure, and the optical window lens is sintered and connected to the metal part;

[0026] Figure 4 It is a schematic cross-sectional view of the overall structure of the third embodiment of the present invention. In the figure, the shape of the optical window lens is square or circular, the substrate is a cavity structure, and the optical window lens is fusion-welded to the metal part;

[0027] Figure 5 It is a schematic cross-sectional view of the overall structure of the fourth embodiment of the present invention. In the figure, the shape of the optical window lens is hemispherical or ellipsoidal, the substrate is a cavity structure, and the optical window lens is fusion-welded to the metal part;

[0028] In the figure: 1 is the optical window cover plate; 101 is the metal part; 102 is the optical window lens; 2 is the substrate; 3 is the chip set; 301 is the white light chip; 302 is the infrared chip; 4 is the metallization line layer; 5 is the solder; 6 is the cavity; 7 is the pad.

Specific Embodiments

[0029] The technical features of the present invention will be further described in detail below with reference to the accompanying drawings so that those skilled in the art can understand.

[0030] An LED device includes a substrate 2. A metallization line layer 4 is provided on the periphery of the substrate 2. An optical window cover plate 1 is provided on the metallization line layer 4. The optical window cover plate 1 includes a metal part 101. An optical through-hole and an optical window lens 102 covering the optical through-hole are respectively provided on the metal part 101. The size of the optical window cover plate 1 matches the size of the substrate 2. The optical window cover plate 1 has a cavity structure. The optical window cover plate 1 is provided above the substrate 2 so that a cavity 6 is formed between the optical window cover plate 1 and the substrate 2. A chip set 3 is provided in the cavity 6, and the chip set 3 is fixed on the substrate 2.

[0031] The chip set 3 in this patent is preferably a combination of a white light chip 301 and an infrared chip 302, such as Figure 1 shown; Figure 1 There are a total of four pads 7. Among them, two pads 7 are provided with white light chips 301, and the infrared chip 302 is provided on the third pad 7 and is connected to the fourth pad 7 through a metal lead.

[0032] The difference between this patent and the patent of "An LED Device and Its Packaging Method" applied by the applicant on the same day lies in its application. This patent applies the structure and method of inorganic packaging to an IR light source device integrated with multiple chips, solving problems such as large volume, small power, poor reliability, and short lifespan of traditional IR light source devices.

[0033] Of course, the chipset 3 can also be a combination of ultraviolet chips and infrared chips, or a combination of white light chips, infrared chips, and ultraviolet chips, etc.

[0034] The shape of the optical window cover plate 1 is not limited to square, circular, etc. The depth H3 of the cavity 6 formed between the optical window cover plate 1 and the substrate 2 is H3≥0.5 mm. The substrate 2 can be a planar structure or a cavity structure with steps. When the substrate 2 is a planar structure, the corresponding optical window cover plate 1 is a cavity structure; when the substrate 2 is a cavity structure with steps, the corresponding optical window cover plate 1 is a planar structure, and the step height H4≥0.35 mm, which is convenient for preventing damage to the gold wires during matching assembly and sealing.

[0035] A circuit pattern is provided on the substrate 2. The material of the substrate 2 can be a ceramic substrate, or a metal substrate such as aluminum or copper, or other composite materials with high thermal conductivity and light reflection characteristics, such as aluminum silicon carbide substrate, metal substrate coated with graphene, etc.

[0036] Furthermore, aluminum is plated on the surface of the ceramic substrate or a high-reflection coating material such as PTFE is used to further improve the overall light output performance of the device in the invisible light band, especially in the UVC band.

[0037] When the optical window lens 102 is sintered and connected to the metal part 101, a solder 5 for welding and connecting the optical window lens 102 and the metal part 101 is provided between the optical window lens 102 and the metal part 101. The solder 5 is annular and is made of inorganic materials. The components of the solder 5 are TiCuBiZnMn, where Ti accounts for 6.8%-25%, Cu accounts for 19.6%-34%, Bi accounts for 4.2%-7.3%, Zn accounts for 21%-37%, and Mn accounts for 0.56%-1.2%.

[0038] The optical window lens 102 and the metal part 101 can also be connected by fusion welding, in which case the solder 5 is not required.

[0039] For the LED device as described above, the material of the optical window lens 102 is quartz glass. The shape of the optical window lens 102 is preferably one of square, circular, ellipsoidal, and hemispherical. When the shape of the optical window lens 102 is different, the shape of the metal part 101 will also change adaptively for convenient welding, as shown in Embodiment 1 and Embodiment 2 in the figure.

[0040] For the LED device as described above, the material of the metal part 101 is Kovar alloy, copper or aluminum, and the surface of the metal part 101 needs to be nickel-plated. There is an extended metal solder edge at the bottom edge of the metal part 101. The width H1 of the metal solder edge is ≥ 0.3 mm. The metal solder edge is welded to the metallized circuit layer 4. The function of the metallized circuit layer 4 is to seal the optical window cover plate 1 and the substrate 2 into one body by resistance welding or fusion welding process; the metallized circuit layer 4 is also annular, and its thickness H2 is ≥ 60 μm. There is a coating on the surface of the metallized circuit layer 4, and the material of the coating is gold or nickel-gold.

[0041] This patent also claims to protect a packaging method for the LED device as described above, specifically as follows:

[0042] An annular metallized circuit layer 4 is provided at the edge of the substrate 2. The thickness H2 of the metallized circuit layer 4 is ≥ 60 μm, and the surface of the metallized circuit layer 4 is treated by gold plating or nickel-gold plating.

[0043] The chipset 3 is bonded to the substrate 2 by solder paste, silver glue die bonding or eutectic process.

[0044] The metal part 101 is manufactured by precision die stamping, and the surface of the metal part 101 is nickel-plated.

[0045] A quartz glass sheet matching the size of the light passing hole is cut to make the optical window lens 102. The annular area within ≤ 0.5 mm from the edge of the optical window lens 102 is coated. The coating composition is nickel-gold or copper, and the coating thickness is ≥ 10 μm. The optical window lens 102 is installed into the metal part 101 through a tooling fixture, and the edge coating area of the quartz glass and the matching contact part of the metal part are fusion welded to make the optical window cover plate 1. This fusion welding process needs to be carried out in a specific atmosphere environment (such as high-purity nitrogen or a mixed atmosphere of nitrogen and helium) to achieve a better airtightness effect.

[0046] Or solder 5 is added and the optical window lens 102 and the metal part 101 are sealed into the optical window cover plate 1 by sintering process.

[0047] The optical window cover plate 1 is assembled to the metallized circuit layer 4 of the substrate 2 through a fixture, and the optical window cover plate 1 and the substrate 2 are sealed into one body by resistance welding process or fusion welding process to make an LED device.

[0048] Further, the resistance welding process is parallel seam welding, and the fusion welding process is laser welding.

[0049] In the present invention, the substrate 2, the metal part 101, and the optical window lens 102 are all made of inorganic materials, and the solder, the metallization circuit layer, and all the plating layers are also made of inorganic materials. The optical window lens 102 and the metal part 101 are sealed together by a sintering process or a fusion welding process to form an optical window cover plate, and the optical window cover plate and the substrate 2 are combined into one body by a resistance welding process or a fusion welding process to form an LED device, realizing high airtightness and inorganic encapsulation.

[0050] Compared with the traditional LED light source, the present invention has good airtightness, inorganic encapsulation, and a simple structure, and is mainly applied to light source devices with high requirements for airtightness and reliability and unsuitable for organic material encapsulation. Especially in UVC and high-power IR LED light source devices, it can better solve the problems of easy lens dropping, serious light decay of the device, and insufficient airtightness in the existing glue encapsulation and the same type of inorganic encapsulation solutions with glass or quartz optical windows.

[0051] The embodiments described in the present invention are only descriptions of the preferred embodiments of the present invention, and do not limit the inventive concept and scope. Without departing from the design idea of the present invention, various modifications and improvements made by those skilled in the art to the technical solutions of the present invention should fall within the protection scope of the present invention.

Claims

1. An integrated IR light source device, characterized in that: It includes a substrate (2), a metallized circuit layer (4) is provided on the periphery of the substrate (2), a light window cover plate (1) is provided on the metallized circuit layer (4), the light window cover plate (1) includes a metal part (101), a light passing hole and a light window lens (102) covering the light passing hole are respectively provided on the metal part (101), the light window cover plate (1) has a cavity structure, the light window cover plate (1) is arranged above the substrate (2) so that a cavity (6) is formed between the light window cover plate (1) and the substrate (2), a chip set (3) is provided in the cavity (6), the chip set (3) is fixed on the substrate (2), and the substrate (2) is a planar structure; A solder (5) for welding and connecting the light window lens (102) and the metal part (101) is provided between the light window lens (102) and the metal part (101), and the solder (5) is made of an inorganic material; The material of the substrate (2) is one of ceramic, aluminum, copper, and aluminum silicon carbide substrate; The material of the light window lens (102) is quartz glass, and the shape of the light window lens (102) is one of square, circular, ellipsoidal, and hemispherical; The material of the metal part (101) is Kovar alloy, copper or aluminum. An extended metal solder edge is provided at the bottom edge part of the metal part (101), and the metal solder edge is welded and connected to the metallized circuit layer (4). The width H1 of the metal solder edge is ≥0.3 mm, the thickness H2 of the metallized circuit layer (4) is ≥60 μm, a plating layer is provided on the surface of the metallized circuit layer (4), and the material of the plating layer is gold or nickel gold; a nickel plating layer is provided on the surface of the metal part (101), and the depth H3 of the cavity (6) is ≥0.5 mm.

2. The integrated IR light source device according to claim 1, characterized in that: The chip set (3) is a combination of a white light chip (301) and an infrared chip (302).

3. The integrated IR light source device according to claim 1, characterized in that: The chip set (3) is a combination of an ultraviolet chip and an infrared chip or a combination of a white light chip, an infrared chip, and an ultraviolet chip.

4. A packaging method for the integrated IR light source device according to any one of claims 1 to 3, characterized in that It includes: The chip set (3) is bonded to the substrate (2) by a die bonding process using solder paste, silver glue or eutectic process; An annular metallized circuit layer (4) is provided on the edge of the substrate (2), the thickness of the circuit layer of the metallized circuit layer (4) is not less than 60 μm, and the surface of the metallized circuit layer (4) is treated by gold plating or nickel gold plating; The metal part (101) is manufactured by die stamping, and the surface of the metal part (101) is treated by nickel plating; A quartz glass sheet matching the size of the light passing hole is cut to form the light window lens (102). A plating layer treatment is performed on an annular area with a width of ≤0.5 mm at the edge of the light window lens (102), and the thickness of the plating layer is ≥10 μm. The light window lens (102) is loaded into the metal part (101) through a tooling fixture, and the light window cover plate (1) is formed by fusion welding the matching contact parts of the edge plating layer area of the light window lens (102) and the metal part (101), or the light window lens (102) and the metal part (101) are sintered into the light window cover plate (1) by adding solder (5); The optical window cover plate (1) is assembled onto the metallized circuit layer (4) of the substrate (2) through a jig, and the optical window cover plate (1) and the substrate (2) are sealed together by a resistance welding process or a fusion welding process to form an integrated IR light source device.

5. The encapsulation method of the integrated IR light source device according to claim 4, characterized in that: The resistance welding process is parallel seam welding, and the fusion welding process is laser welding.

6. The encapsulation method of the integrated IR light source device according to claim 4, characterized in that: The components of the solder (5) are TiCuBiZnMn, where Ti accounts for 6.8% - 25%, Cu accounts for 19.6% - 34%, Bi accounts for 4.2% - 7.3%, Zn accounts for 21% - 37%, and Mn accounts for 0.56% - 1.2%; the coating components on the edge of the optical window lens (102) are nickel-gold or copper.

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