Electrode Isolation Type Ultrasonic Atomization Mechanism, Atomizer and Disinfection Atomization Equipment

Abstract

Electrode-isolated ultrasonic atomization mechanism, atomizer and disinfection atomization device, comprising a base body and an atomization component, wherein the base body is provided with an installation hole; characterized in that the atomization component includes an inner support body arranged inside the base body, the inner support body includes an inner cavity with an open upper part, thus having a cavity bottom wall, and the upper open part of the inner cavity faces the installation hole; an atomization wafer and a wafer support frame located below the atomization wafer are arranged in the inner cavity; two spaced positive and negative electrodes, namely a first electrode and a second electrode, are arranged on the back of the atomization wafer, the first electrode surrounds the second electrode and is electrically isolated from each other; two elastic electrical contacts are arranged left and right below the atomization wafer and are respectively electrically connected to the positive and negative electrodes on the back of the atomization wafer, and two pits adapted to the positive and negative electrodes and with an open upper part are arranged on the upper part of the wafer support frame, and the electrical contacts are arranged in the pits, so that the problem of electrical signal short circuit is not likely to occur between the left and right electrical contacts, thus greatly improving the operation stability.

Description

Technical Field

[0001] The present invention relates to an electrode-isolated ultrasonic atomization mechanism, an atomizer and a disinfection atomization device for generating atomized gas. Background Art

[0002] In the prior art, for example, the ultrasonic atomizer with a detachable gland disclosed in the patent application No. 201721092726.8, titled "Ultrasonic Atomizer with Detachable Gland", includes a metal housing with a receiving cavity, a heat dissipation base, an atomization sheet and a control circuit board are arranged in the receiving cavity; an installation hole is arranged on the top wall of the receiving cavity, an installation cavity corresponding to the installation hole is arranged on the heat dissipation base, the installation cavity has a cavity bottom wall, and the atomization sheet is arranged in the installation cavity; it also includes a gland with an annular wall portion and a skirt portion, the annular wall portion passes through the installation hole and is screwed and connected with the inner side wall of the installation cavity, the skirt portion presses against the outer side surface of the metal housing to tighten the heat dissipation base to the inner side surface of the metal housing, a first sealing ring for preventing liquid from entering the receiving cavity is arranged between the skirt portion and the metal housing, a second sealing ring for preventing liquid from entering the receiving cavity is arranged between the annular wall portion and the upper end surface of the atomization sheet, and an elastic gasket is arranged between the lower end surface of the atomization sheet and the cavity bottom wall of the installation cavity of the heat dissipation base. In this way, the gland is screwed and connected to the heat dissipation base to position the heat dissipation base on the metal housing. The electrodes on the atomization sheet in this solution are distributed on the front and back, which is easy to be damaged and the applicability is limited; secondly, in the use of the above-mentioned atomizer, not only is it easy for the gland and the heat dissipation base to become loose, but also it is easy to be corroded when it is used in a corrosive environment, which also results in poor applicability. Therefore, it is necessary to improve these prior arts to enhance the multi-applicability of the product. Summary of the Invention

[0003] Based on the prior art, the first problem that the present invention attempts to solve is how to improve its operating stability, and the second problem is the applicable range, especially being applicable to corrosive environments. For this purpose, the present invention first proposes an electrode isolation type ultrasonic atomization mechanism, including a base body and an atomization component. The base body is provided with mounting holes; it is characterized in that the atomization component includes an inner support body arranged inside the base body. The inner support body includes an inner cavity with an open upper part, thus having a cavity bottom wall. The upper opening of the inner cavity faces the mounting hole; an atomization wafer and a wafer support frame located below the atomization wafer are arranged in the inner cavity. The wafer support frame is placed above the cavity bottom wall; two spaced positive and negative electrodes, namely a first electrode and a second electrode, are arranged on the back of the atomization wafer. The first electrode surrounds the second electrode and is electrically isolated from each other; two elastic electrical contacts are arranged left and right below the atomization wafer and are respectively electrically connected to the positive and negative electrodes on the back of the atomization wafer. Two pits adapted to the positive and negative electrodes and with an upward opening are arranged on the upper part of the wafer support frame. The two pits are spaced apart from each other by a partition wall body and each accommodate one of the electrical contacts to electrically isolate the two electrical contacts from each other.

[0004] Among them, the base body is a basic component for mounting and positioning the atomization component. In specific applications, it can be the wall body or the outer shell body of the atomizer device or a part thereof.

[0005] Among them, the atomization wafer can generate high-frequency vibrations under the drive of the high-frequency electrical energy provided by the control circuit board, so as to atomize the liquid above it and realize the atomization function.

[0006] According to the above technical solution, compared with the prior art, its beneficial technical effects are as follows: First, since two pits adapted to the positive and negative electrodes and with an upward opening are arranged on the upper part of the wafer support frame and the electrical contacts are arranged in the pits, it is not easy for the electrical signals between the left and right electrical contacts to short-circuit, thus greatly improving the operating stability; Second, the two pits are spaced apart from each other by a partition wall body and each accommodate one of the electrical contacts, thereby further improving the reliability of electrical isolation between the two electrical contacts.

[0007] A further solution can be that the electrical contacts are elastic and elastically abut against the positive and negative electrodes on the back of the atomization wafer. The electrical contacts are electrically connected to electrical leads, and the two electrical leads respectively extend out through the cavity bottom wall and the heat dissipation aluminum part of the inner support body.

[0008] A further solution may also be that two extension legs corresponding to the two electrical contacts are provided at the lower part of the wafer support frame, bottom wall holes corresponding to the extension legs are provided on the bottom wall of the cavity, the extension legs pass through and are connected to the bottom wall holes in an interference fit, and the electrical leads of the two electrical contacts respectively pass through the extension legs and then pass through the bottom wall of the cavity by means of the extension legs and extend out. Wherein the extension legs can not only position the wafer support frame and clamp the electrical leads, but also hermetically connect the bottom wall of the cavity, thus preventing water ingress and conducting heat to the bottom wall of the cavity.

[0009] A further solution may also be that a heat dissipation aluminum part is further included. The heat dissipation aluminum part has a concave cavity adapted to the outer shape of the inner support body. The heat dissipation aluminum part is attached to the outside of the inner support body through the concave cavity and connected to the base body. Wherein, the heat dissipation aluminum part can be an integral device or a combination of several separate parts; secondly, heat dissipation ribs can be provided on the outer surface of the heat dissipation aluminum part to further enhance the heat dissipation effect. In addition, since the outside of the inner support body is adapted to the heat dissipation aluminum part, the problem of reduced heat dissipation characteristics of the inner support body can be compensated by the heat dissipation aluminum part. Therefore, the combined use of the inner support body and the heat dissipation aluminum part not only solves the heat dissipation problem, but also further effectively solves the problem of multi-adaptability of the use environment. The heat dissipation aluminum part can be connected to the base body by means of screws or other methods, so as to dissipate heat to the base body.

[0010] A further solution may also be that two aluminum part avoidance holes corresponding to the extension legs are provided on the heat dissipation aluminum part. The extension legs pass through and are connected to the aluminum part avoidance holes in an interference fit, and the electrical leads of the two electrical contacts respectively pass through the heat dissipation aluminum part by means of the extension legs and extend out. Since the extension legs pass through and are connected to the aluminum part avoidance holes in an interference fit, not only a seal is formed between them to prevent water vapor outside the heat dissipation aluminum part from entering the inner support body, but also heat can be transferred to the heat dissipation aluminum part through the extension legs.

[0011] A further solution may also be that the inner diameter of the pit is in a positive tolerance fit with the outer diameter of the electrical contact, so that the pit positions the electrical contact and prevents it from shaking significantly left and right.

[0012] A further solution may also be that the atomization component includes an annular gland and a compression sealing ring. The inner support body further has a cavity side wall provided on the bottom wall of the cavity, and the bottom wall and the side wall of the cavity form the inner cavity. The gland has a central hole of the gland. The gland is arranged on the upper surface of the inner support body. The base body is clamped between the gland and the cavity side wall of the inner support body. The base body realizes a sealed connection with the gland and the inner support body through the compression sealing ring. The central area on the front surface of the atomization wafer is located below the central hole of the gland. The central hole of the gland is used to allow the liquid above the gland to enter the space above the front surface of the atomization wafer, so as to perform atomization. Among them, the central area on the front surface of the atomization wafer is located below the central hole of the gland, so that the liquid atomized in the central area on the front surface of the atomization wafer can overflow through the central hole of the gland.

[0013] A further solution may also be that the gland includes an annular wall portion and a skirt portion. The annular wall portion of the gland passes through the mounting hole and is screwed to the cavity side wall. The skirt portion of the gland presses against the outer side surface of the base body. When the inner support body is tightened, the base body and the compression sealing ring are clamped between the skirt portion of the gland and the cavity side wall of the inner support body. The central hole of the gland is provided through the annular wall portion.

[0014] A further solution may also be that a wafer sealing ring is sleeved on the outer periphery of the atomization wafer. The lower end surface of the annular wall portion of the gland presses against the wafer sealing ring. The wafer sealing ring is clamped between the annular wall portion of the gland and the wafer support frame to realize the sealing of the atomization wafer. The gland, the wafer sealing ring, the wafer support frame, and the bottom wall of the cavity are arranged vertically and pressed together in sequence.

[0015] A further solution may also be that the wafer sealing ring includes an upper lip wall body that fits around the periphery of the front surface of the atomization wafer. The area on the front surface of the atomization wafer that is not covered by the upper lip wall body forms the central area. At least the central area is not provided with electrodes. According to this solution, the electrodes are only provided in the peripheral area where the wafer sealing ring of the atomization wafer fits and the back area of the atomization wafer, or even only in the back area of the atomization wafer. In this way, since no electrodes are provided in the central area on the front surface of the atomization wafer, there is no need to worry about the corrosion or mechanical damage of the electrodes of the atomization wafer, thereby further greatly improving the ability to solve various adaptability problems in the use environment.

[0016] A further solution may also be that a top groove is provided at the top of the cavity side wall. The top groove is annular. The outer ring diameter of the outer side wall of the top groove is larger than the inner diameter of the mounting hole, and the inner ring diameter of the inner side wall of the top groove is smaller than the inner diameter of the mounting hole. The compression sealing ring is embedded in the top groove. In this way, not only can the compression sealing ring be sealed between the gland and the cavity side wall, but also the direct contact and sealed connection between the compression sealing ring and the base body can be achieved.

[0017] The present invention also provides an atomizer using the electrode-isolated ultrasonic atomization mechanism. The atomizer includes the above-mentioned electrode-isolated ultrasonic atomization mechanism. The atomizer further includes a housing. The base body forms at least part of the upper housing of the housing. A control circuit board is provided in the housing, and the control circuit board is signal-connected to the electrode of the atomization wafer.

[0018] A further solution may also be that a sealing resin is further provided in the housing, and the sealing resin fills the remaining space in the housing.

[0019] The present invention also provides a disinfection atomization device using the atomizer, including the above-mentioned atomizer, and further including an electrolysis device for ionizing a solution to obtain a liquid containing active ions for disinfection.

[0020] Due to the above characteristics and advantages of the present invention, it can be applied to the electrode-isolated ultrasonic atomization mechanism, atomizer and disinfection atomization device for generating atomized gas. Description of the Drawings

[0021] Figure 1 is a schematic external structure diagram of an atomizer capable of generating atomized gas for a disinfection atomization device applying the present invention;

[0022] Figure 2 is a schematic exploded structure diagram of an ultrasonic atomization mechanism for an atomizer applying the present invention;

[0023] Figure 3 is Figure 2 the assembled structure diagram of;

[0024] Figure 4 is a schematic plan view of the distribution structure of the back electrode of the atomization wafer in the ultrasonic atomization mechanism. Detailed Embodiments

[0025] Below, in conjunction with the attached Figure 1 to the attached Figure 4, a further specific description is made of the structure, function, and application of an ultrasonic atomization mechanism, an atomizer, and a disinfection atomization device suitable for generating atomized gas. This type of atomizer not only has a corrosion-resistant structure but also has an electrode isolation structure.

[0026] The present invention relates to an atomization device, particularly an atomization disinfection device with a disinfection function (not shown in the figure), an atomizer 100 installed in the atomization device, and an ultrasonic atomization mechanism 200 applied to the atomizer 100. As an application embodiment, the disinfection device includes a machine body, and a liquid storage space for containing a disinfection solution is provided inside the machine body. The disinfection solution can be an aqueous solution with a neutral pH value, or a liquid with an acidic or alkaline pH value. In an aqueous solution with a neutral pH value, the solution can be ionized by setting an electrolysis device to obtain a liquid containing active ions for disinfection.

[0027] In a further application, the atomizer 100 is installed on the machine body of the disinfection device, and the liquid with a sterilization and disinfection function is atomized through the atomizer 100.

[0028] In a further application, the atomizer 100 can be directly combined with the bottom wall of the liquid storage space, and the base 1 mentioned below constitutes at least part of the bottom wall of the liquid storage space.

[0029] In a further application, the atomizer 100 can also be an independent component placed in the liquid storage space. As Figure 1 shown, the atomizer 100 includes a housing 101 made of stainless steel material. The base 1 mentioned below constitutes at least part of the upper housing of the housing 101. In this structure, a liquid level sensor 102 is also provided on the upper housing of the housing 101 of the atomizer 100. A control circuit board (not shown in the figure) is also provided inside the housing 101. The liquid level sensor 102 is signal-connected to the control circuit board and feeds back a water level signal to the control circuit board. The atomizer 100 is electrically connected to the outside through electrical signal lines. When it is detected that the liquid level in the liquid storage space is lower than a set threshold, the control circuit board controls the atomizer 100 to stop working and can simultaneously emit a prompt signal, such as lighting an indicator light. In order to make the atomizer 100 have better waterproof and corrosion-resistant properties, resin can also be filled in the peripheral space of the heat dissipation aluminum part 9 inside the housing 101. In order to adapt to the use in an acid-base environment, the housing 101 is preferably made of a corrosion-resistant material such as stainless steel.

[0030] The atomizer 100 further includes an ultrasonic atomization mechanism 200. The ultrasonic atomization mechanism 200 includes the base 1 and an atomization component. An installation hole 11 is provided on the base 1.

[0031] As Figure 2 , Figure 3 shown, the atomization component includes an inner support body 2 arranged inside the base body 1. The inner support body 2 includes a cavity side wall 21 and a cavity bottom wall 22. The cavity side wall 21 and the cavity bottom wall 22 form (i.e., define) an inner cavity 20 and are open at the upper part. A top groove 211 with an upward opening is provided at the top of the cavity side wall 21. The top groove 211 is annular. The annular diameter of the outer side wall 212 of the top groove 211 is larger than the inner diameter of the mounting hole 11, and the annular diameter of the inner side wall 213 of the top groove 211 is smaller than the inner diameter of the mounting hole 11. The inner support body 2 is installed below the mounting hole 11. The outer side wall 212 of the top groove 211 in the cavity side wall 21 abuts against the inner side of the hole wall around the mounting hole 11, that is, the inner side of the base body 1. The upper open part of the inner cavity 20 faces the mounting hole 11 and is located below the mounting hole 11. From the projection in the up-down direction, the hole perimeter of the mounting hole 11 falls within the range of the top groove 211.

[0032] As Figure 2 , Figure 3As shown, the atomization component further includes an annular gland 3 and an annular compression sealing ring 4. The gland 3 has a central hole 31 in the gland, so it is annular. The liquid above the gland 3 enters above the atomization wafer 5 mentioned below through the central hole 31 in the gland. The central hole 31 in the gland also allows the atomized bubbles generated in the central area 50 on the front surface of the atomization wafer 5 to overflow upward into the space above the gland 3. The gland 3 is located on the upper surface of the inner support body 2 and is combined with the upper open end of the inner support body 2. The base body 1 and the compression sealing ring 4 are clamped between the gland 3 and the cavity side wall 21 of the inner support body 2, and the compression sealing ring 4 also directly contacts the base body 1 to form a sealed connection. Further, the gland 3 includes an annular wall portion 32 and a skirt portion 33. The annular wall portion 32 extends in the up and down direction, and the central hole 31 in the gland penetrates through the annular wall portion 32 in the up and down direction. The skirt portion 33 extends in the left and right direction. An external thread 34 is provided on the annular wall portion 32, and an internal thread 23 is provided on the cavity side wall 21. The annular wall portion 32 passes through the mounting hole 11 and is threadedly engaged with the cavity side wall 21, and the lower end surface of the annular wall portion 32 presses against the wafer sealing ring 6 mentioned below, so as to not only achieve a sealed connection but also minimally interfere with the vibration operation of the atomization wafer 5. The skirt portion 33 presses against the hole wall around the mounting hole 11, that is, the outer side surface of the base body 1. Secondly, the lower surface of the skirt portion 33 of the gland 3 is flat. Of course, a cover groove facing the base body 1 can also be provided. The cover groove is located above the top groove 211. The compression sealing ring 4 is integrally provided and embedded in the top groove 211, so that when the inner support body 2 and the gland 3 are tightened, the base body 1 and the compression sealing ring 4 can be clamped between the skirt portion 33 and the cavity side wall 21. Also, since the diameter of the mounting hole 11 is between the annular diameters of the inner side wall 213 and the outer side wall 212 of the top groove 211, part of the wall body of the compression sealing ring 4 can contact the peripheral wall body of the mounting hole 11, that is, the base body 1, so as to achieve the seal between the skirt portion 33, the cavity side wall 21, and the base body 1 through the compression sealing ring 4, that is, to completely seal the mounting hole 1, and let the compression sealing ring 4 achieve the sealing function, that is, the liquid outside the outer shell 101 of the atomizer 100 will not seep into the outer shell 101 from the position of the mounting hole 11. Of course, as an equivalent implementation, like the solution already disclosed in the prior art, the compression sealing ring 4 can also be separately provided between the skirt portion 33 and the base body 1 and between the cavity side wall 21 and the base body 1, and these are all solutions that can achieve the same function. In order to improve the acid and alkali corrosion resistance of the gland 3, the gland 3 is made of a non-metallic corrosion-resistant material, such as corrosion-resistant plastics, resins, etc.In order to make the gland 3 and the inner support body 1 have the same coefficient of thermal expansion, thereby reducing the adverse effect on the sealing effect of the compression sealing ring 4, the gland 3 and the cavity side wall 21 are parts made of the same non-metallic corrosion-resistant material. The improvement of this solution greatly improves the applicability of the atomizer in an acid-base environment.

[0033] As Figure 2 , Figure 3 shown, a combined groove 35 in the shape of a straight line or a cross is further provided on the upper surface of the gland 3, and the axis of the combined groove 35 is perpendicular to and intersects with the axis of the central hole 31 of the gland. In this way, an operating tool can be inserted into the combined groove 35 to screw and rotate the gland 3, which is convenient for installation and maintenance.

[0034] As Figure 2 , Figure 3 shown, an atomization wafer 5, a wafer sealing ring 6, a wafer support frame 7, and two elastic electrical contacts, namely a left electrical contact 81 and a right electrical contact 82, are arranged in the inner cavity 20 of the inner support body 2. The wafer sealing ring 6 and the wafer support frame 7 are made of a soft material with certain elasticity and heat conduction functions, such as silicone rubber. They have elastic functions to better seal the atomization wafer 5, and can also assist in eliminating the thread loosening gap between the gland 3 and the inner support body 2, making it not easy for them to loosen and having an anti-loosening function. The heat conduction function can timely dissipate the heat generated by the atomization wafer 5. The atomization wafer 5 can generate high-frequency vibrations under the drive of the high-frequency electrical energy provided by the control circuit board, so as to atomize the liquid above it and achieve the atomization function. The wafer sealing ring 6 is annular, and a radial groove 60 is provided on its inner side. The wafer sealing ring 6 is sleeved on the outer periphery of the atomization wafer 5 through the radial groove 60 and is clamped between the annular wall portion 32 of the gland 3 and the wafer support frame 7 to achieve the sealing of the atomization wafer 5. The central area 50 on the front surface of the atomization wafer 5 is located below the central hole 31 of the gland. The gland 3, the wafer sealing ring 6 (including the atomization wafer 5), the wafer support frame 7, and the bottom wall 22 of the cavity of the inner support body 2 are arranged in sequence from top to bottom and are tightened and squeezed together. The outer side of the top of the wafer support frame 7 is stepped, the wafer sealing ring 6 falls onto the lower step surface of the step, and the upper step surface 71 contacts the lower surface of the atomization wafer 5. In this way, the wafer support frame 7 can not only be used to support the atomization wafer 5 and the wafer sealing ring 6, but also assist in sealing. In this way, through the wafer sealing ring 6 and the wafer support frame 7, the liquid above the atomization wafer 5 cannot penetrate in to achieve sealing.

[0035] In the above solution where the wafer sealing ring 6 and the wafer support frame 7 are both made of a soft material with certain elasticity and heat conduction function, such as silicone rubber, the combination of the wafer sealing ring 6 and the wafer support frame 7 can not only strengthen the sealing effect on the atomizing wafer 5, but also, compared with the solution where only the wafer sealing ring 6 is made of an elastic material, better accommodate the thermal deformation caused by the heat generated by the atomizing wafer 5.

[0036] From the perspectives of achieving sealing, heat conduction, and eliminating the influence of thermal changes, etc., the wafer sealing ring 6 and the wafer support frame 7 can also be integrally provided, which can have the same sealing function and support function. However, from the perspective of maintenance convenience, separating the wafer sealing ring 6 and the wafer support frame 7 enables directly removing the atomizing wafer 5 and the wafer sealing ring 6 when the atomizing wafer 5 is damaged or aged and needs to be replaced, and then putting them back into the content cavity 20 after reassembling a new atomizing wafer 5 or wafer sealing ring 6. Therefore, it is a better solution that the outer diameter of the assembly formed by the atomizing wafer 5 and the wafer sealing ring 6 is smaller than the inner diameter of the content cavity 20.

[0037] As Figure 4 shown, two spaced positive and negative electrodes, namely the first electrode 51 and the second electrode 52, are provided on the back surface of the atomizing wafer 5. The first electrode 51 surrounds the second electrode 52 and is electrically isolated from each other to form the two positive and negative plates of the oscillating capacitor. No electrode is provided in the central region 50 on the front surface of the atomizing wafer 5, that is, the region for contacting the liquid. The central region 50 is located below the central hole 31 of the gland. Specifically, the wafer sealing ring 6 includes an upper lip wall body 61 (i.e., the upper groove wall of the radial groove 60) that fits around the periphery of the front surface of the atomizing wafer 5. The region on the front surface of the atomizing wafer 5 that is not covered by the upper lip wall body 61 constitutes the central region 50, and at least no electrode is provided in the central region 50. According to this solution, the electrodes are only provided in the peripheral region where the wafer sealing ring 6 of the atomizing wafer 5 fits and the back surface region of the atomizing wafer 5, or even only in the back surface region of the atomizing wafer 5. In this way, since no electrode is provided in the central region 50 on the front surface of the atomizing wafer 5, there is no need to worry about the corrosion of the electrodes of the atomizing wafer 5, and it can also avoid possible mechanical damage to the electrodes during the cleaning of the atomizing wafer 5. Thus, the applicability of the atomizer in an acidic or alkaline environment is further improved, and the service life is also extended.

[0038] As Figure 2 、 Figure 3As shown, the two electrical contacts, namely the left electrical contact 81 and the right electrical contact 82, are helical springs with elasticity that elastically abut against the first electrode 51 and the second electrode 52 on the back of the atomizing wafer 5, thereby achieving electrical signal connection. In other equivalent embodiments, the electrical contacts can also adopt a scheme where a columnar electrode is inserted on the spring and the columnar electrode abuts against the electrode on the back of the atomizing wafer 5, or it can also be a scheme where a conductive carbon brush or brush is provided on the upper surface of the columnar electrode to improve the stability of electrical contact. The left electrical contact 81 and the right electrical contact 82 are arranged left and right below the atomizing wafer 5 and are respectively and correspondingly electrically connected to the positive and negative electrodes of the atomizing wafer 5, namely the first electrode 51 and the second electrode 52. The bottom end of the left electrical contact 81 is welded to the left PCB board (the PCB board is not shown in the figure), and the left PCB board is welded with an electrical lead 811, so that the left electrical contact 81 is electrically connected to the electrical lead 811. The bottom end of the right electrical contact 82 is welded to the right PCB board, and the right PCB board is welded with an electrical lead 812, so that the right electrical contact 82 is electrically connected to the electrical lead 812. The two electrical leads 811 and 812 respectively pass through the wafer support frame 7 and the bottom wall 22 of the cavity and extend out to be signal-connected to the control circuit board.

[0039] As Figure 2 , Figure 3 shown, two pits, namely the left pit 72 and the right pit 73, which are adapted to the first electrode 51 and the second electrode 52, or rather adapted to the two left electrical contacts 81 and the right electrical contacts 82 and have openings facing upwards, are further provided on the upper part of the wafer support frame 7. The left pit 72 and the right pit 73 are arranged left and right and are electrically separated from each other by a partition wall 74 and each accommodate one of the electrical contacts. Further, the inner diameter of the pit and the outer diameter of the electrical contact have a clearance tolerance fit (+1 mm to +5 mm), so that the pit positions the electrical contact and it cannot shake significantly left and right, but it does not prevent it from floating with the atomizing wafer 5. In this way, the left electrical contact 81 and the right electrical contact 82 can be reliably electrically insulated from each other and positioned through the left pit 72 and the right pit 73, or rather through the partition wall 74, greatly improving the stability of use and operation.

[0040] Further, two left extension legs 74 and right extension legs 75 corresponding to the left electrical contact 81 and the right electrical contact 82, or rather corresponding to the left pit 72 and the right pit 73, are provided at the lower part of the wafer support frame 7. Left bottom wall holes 241 and right bottom wall holes 251 corresponding to the left extension legs 74 and the right extension legs 75 are provided on the cavity bottom wall 22. The left extension legs 74 and the right extension legs 75 respectively pass through the left bottom wall holes 241 and the right bottom wall holes 251. An interference fit (i.e., a tight fit connection) and a sealing connection are formed between the left extension legs 74 and the right extension legs 75 and the left bottom wall holes 241 and the right bottom wall holes 251 respectively. The electrical leads 811 and 812 respectively pass through the left extension legs 74 and the right extension legs 75 and extend out through the cavity bottom wall 22 by means of the left extension legs 74 and the right extension legs 75. The left extension legs 74 and the right extension legs 75 can, by virtue of the interference fit relationship with the left bottom wall holes 241 and the right bottom wall holes 251, in turn clamp and seal the electrical leads 811 and 812. Therefore, the left extension legs 74 and the right extension legs 75 not only play a role in positioning the wafer support frame 7, but also play a role in sealing and insulating the two electrical leads 811 and 812, and can also conduct and dissipate the heat of the atomizing wafer 5 to the cavity bottom wall 22.

[0041] In the above solution, since the cavity side wall 21 uses the same non-metallic corrosion-resistant material as the gland 3, it is likely to cause a reduction in the heat dissipation performance of the atomizing wafer 5. To solve this problem, a further solution can be, for example Figure 2 , Figure 3As shown, it further includes a heat dissipation aluminum part 9. The heat dissipation aluminum part 9 has a concave cavity 90 adapted to the outer shape of the inner support body 2. The heat dissipation aluminum part 9 is attached to the outside of the inner support body 2 through its concave cavity 90 and is connected to the base body 1 by means of screws or other methods. The heat dissipation aluminum part 9 can timely dissipate the heat in the inner support body 2 to the base body 1. Two left aluminum part avoidance holes 91 and right aluminum part avoidance holes 92 corresponding to the left extension leg 74 and the right extension leg 75 are provided on the heat dissipation aluminum part 9. The left extension leg 74 and the right extension leg 75 pass through the left aluminum part avoidance hole 91 and the right aluminum part avoidance hole 92 and are in interference fit and sealed connection. The electrical leads of the two electrical contacts respectively extend out through the heat dissipation aluminum part 9 by means of the left extension leg 74 and the right extension leg 75. The left extension leg 74 and the right extension leg 75 are in interference fit and sealed connection with the cavity bottom wall 22 and the heat dissipation aluminum part 9 respectively and hold the electrical leads tightly. It can not only conduct the heat of the atomization wafer 5 to the heat dissipation aluminum part 9, but also prevent the water vapor outside the heat dissipation aluminum part 9 from penetrating into the cavity bottom wall 22 or the heat dissipation aluminum part 9. Therefore, the improvement of this scheme greatly improves the applicability of the atomizer 100 in an acid-base environment. Secondly, the outer space of the heat dissipation aluminum part 9 is filled with resin for protection. In this way, it is a better choice that the heat on the heat dissipation aluminum part 9 is dissipated through the base body 1.

Claims

1. Electrode isolation type ultrasonic atomization mechanism, including a base body and an atomization component, wherein an installation hole is provided on the base body; It is characterized in that, The atomization component includes an inner support body arranged inside the base body. The inner support body has an inner cavity with an open upper part, thus having a cavity bottom wall. The upper open part of the inner cavity faces the installation hole; an atomization wafer and a wafer support frame located below the atomization wafer are arranged in the inner cavity. The wafer support frame is placed above the cavity bottom wall; two spaced positive and negative electrodes, namely a first electrode and a second electrode, are arranged on the back of the atomization wafer. The first electrode surrounds the second electrode and is electrically isolated from each other; two elastic electrical contacts are arranged left and right below the atomization wafer and are respectively electrically connected to the positive and negative electrodes on the back of the atomization wafer. Two pits adapted to the positive and negative electrodes and with an open upper part are provided on the upper part of the wafer support frame. The two pits are separated from each other by a partition wall body and each accommodate one of the electrical contacts to electrically isolate the two electrical contacts from each other.

2. The electrode isolation type ultrasonic atomization mechanism according to claim 1, It is characterized in that, The electrical contact has elasticity and elastically abuts against the positive and negative electrodes on the back of the atomization wafer. The electrical contact is electrically connected to an electrical lead wire. The two electrical lead wires respectively pass through the cavity bottom wall and the heat dissipation aluminum part of the inner support body and extend out.

3. The electrode isolation type ultrasonic atomization mechanism according to claim 2, It is characterized in that, Two extension legs corresponding to the two electrical contacts are provided at the lower part of the wafer support frame. Bottom wall holes corresponding to the extension legs are provided on the cavity bottom wall. The extension legs pass through and are in interference fit connection with the bottom wall holes. The electrical lead wires of the two electrical contacts respectively pass through the extension legs and then pass through the cavity bottom wall by means of the extension legs and extend out.

4. The electrode isolation type ultrasonic atomization mechanism according to claim 3, It is characterized in that, It further includes a heat dissipation aluminum part. The heat dissipation aluminum part has an inner concave cavity adapted to the outer shape of the inner support body. The heat dissipation aluminum part is attached to the outside of the inner support body through the inner concave cavity and is connected to the base body.

5. The electrode isolation type ultrasonic atomization mechanism according to claim 4, It is characterized in that, Two aluminum part avoidance holes corresponding to the extension legs are provided on the heat dissipation aluminum part. The extension legs pass through and are in interference fit connection with the aluminum part avoidance holes. The electrical lead wires of the two electrical contacts respectively pass through the heat dissipation aluminum part by means of the extension legs and extend out.

6. The electrode isolation type ultrasonic atomization mechanism according to claim 1, It is characterized in that, The inner diameter of the pit and the outer diameter of the electrical contact are in positive tolerance fit so that the pit positions the electrical contact and the electrical contact cannot significantly sway left and right.

7. The electrode isolation type ultrasonic atomization mechanism according to any one of claims 1 to 6, It is characterized in that, The atomization component includes an annular gland and a pressing sealing ring. The inner support body further has a cavity side wall provided on the cavity bottom wall. The cavity bottom wall and the cavity side wall form the inner cavity; The gland has a central hole of the gland. The gland is arranged on the upper surface of the inner support body. The base body is clamped between the gland and the cavity side wall of the inner support body. The base body realizes a sealed connection with the gland and the inner support body through the compression sealing ring. The central area of the front surface of the atomizing wafer is located below the central hole of the gland.

8. The electrode-isolated ultrasonic atomization mechanism according to claim 7, wherein, the gland includes an annular wall portion and a skirt portion. The central hole of the gland is penetratingly arranged on the annular wall portion. The annular wall portion of the gland passes through the mounting hole and is screwed and connected with the cavity side wall. The skirt portion of the gland presses against the outer side surface of the base body. Thus, when the inner support body is tightened, the base body and the compression sealing ring are clamped between the skirt portion of the gland and the cavity side wall of the inner support body.

9. The electrode-isolated ultrasonic atomization mechanism according to claim 8, wherein, a wafer sealing ring is sleeved on the outer periphery of the atomizing wafer. The lower end surface of the annular wall portion of the gland presses against the wafer sealing ring. The wafer sealing ring is clamped between the annular wall portion of the gland and the wafer support frame to realize the sealing of the atomizing wafer. The gland, the wafer sealing ring, the wafer support frame, and the cavity bottom wall are arranged in sequence from top to bottom and are pressed together.

10. The electrode-isolated ultrasonic atomization mechanism according to claim 8, wherein, a top groove is arranged at the top of the cavity side wall. The top groove is annular. The annular diameter of the outer side wall of the top groove is larger than the inner diameter of the mounting hole. The annular diameter of the inner side wall of the top groove is smaller than the inner diameter of the mounting hole. The compression sealing ring is embedded into the top groove.

11. An atomizer applying the electrode-isolated ultrasonic atomization mechanism. The atomizer includes the electrode-isolated ultrasonic atomization mechanism according to any one of claims 1 to 10. The atomizer further includes an outer housing. The base body forms the upper housing of the outer housing. A control circuit board is arranged in the outer housing. The control circuit board is signal-connected to the electrode of the atomizing wafer.

12. The atomizer according to claim 11, wherein, sealing resin is further arranged in the outer housing. The sealing resin fills the remaining space in the outer housing.

13. A disinfection atomization device applying the atomizer, including the atomizer according to claim 11 or 12, and further including an electrolysis device for ionizing a solution to obtain a liquid containing active ions for disinfection.

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