Corrosion-resistant ultrasonic atomization mechanism, atomizer and disinfection atomization equipment

Abstract

Corrosion-resistant ultrasonic atomization mechanism, atomizer and disinfection atomization equipment, including a base body and an atomization component. An installation hole is provided on the base body. It is characterized in that the atomization component includes an inner support body and a gland made of the same non-metallic corrosion-resistant material, so that they have basically the same thermal collision coefficient, thus being able to adapt to the changes in different temperature environments without easily causing connection looseness and without easily aging and deforming. The inner support body is arranged inside the base body. The gland has a central hole of the gland and is arranged on the inner support body. The base body is clamped between the gland and the cavity side wall of the inner support body. The base body realizes sealed connection with the gland and the inner support body through a compression sealing ring. An atomization wafer is arranged in the inner cavity. It also includes a heat dissipation aluminum part. The outer side of the inner support body is adaptively fitted with the heat dissipation aluminum part. The combined use of the inner support body and the heat dissipation aluminum part solves the problems of reduced heat dissipation characteristics of the inner support body and various adaptability of the use environment.

Description

Technical Field

[0001] The present invention relates to a corrosion-resistant ultrasonic atomization mechanism, an atomizer, and a disinfection atomization device for generating atomized gas. Background Art

[0002] In the prior art, for example, the ultrasonic atomizer with a detachable gland, with the application number 201721092726.8 and the name "ultrasonic atomizer with a detachable gland", discloses an ultrasonic atomizer with a detachable gland, which includes a metal housing having a receiving cavity, a heat dissipation base, an atomization sheet, and a control circuit board disposed in the receiving cavity; an installation hole is provided on the top wall of the receiving cavity, an installation cavity corresponding to the installation hole is provided on the heat dissipation base, the installation cavity has a cavity bottom wall, and the atomization sheet is disposed in the installation cavity; it further includes a gland having an annular wall portion and a skirt portion, the annular wall portion passes through the installation hole and is screwed to the inner side wall of the installation cavity, the skirt portion presses against the outer side surface of the metal housing to tighten the heat dissipation base to the inner side surface of the metal housing, a first sealing ring for preventing liquid from entering the receiving cavity is provided between the skirt portion and the metal housing, a second sealing ring for preventing liquid from entering the receiving cavity is provided between the annular wall portion and the upper end surface of the atomization sheet, and an elastic gasket is provided between the lower end surface of the atomization sheet and the cavity bottom wall of the installation cavity of the heat dissipation base. In this way, the gland is screwed to connect the heat dissipation base to position the heat dissipation base on the metal housing. In use, the gland and the heat dissipation base of the above atomizer are prone to looseness, and corrosion is likely to occur when it is used in a corrosive environment, and its applicability is not strong. Summary of the Invention

[0003] Based on the prior art, the first problem that the present invention attempts to solve is how to improve its scope of application, especially a corrosion-resistant ultrasonic atomization mechanism that can be particularly applicable to a corrosive environment. It includes a base body and an atomization component, and an installation hole is provided on the base body; characterized in that the atomization component includes an inner support body and a gland made of the same non-metallic corrosion-resistant material, the inner support body is arranged inside the base body, the inner support body includes a content cavity with an open upper part, thus having a cavity side wall and a cavity bottom wall, the upper open part of the content cavity faces the installation hole; the gland has a central hole of the gland, the gland is arranged on the inner support body, the base body is clamped between the gland and the cavity side wall of the inner support body, and the base body realizes sealed connection with the gland and the inner support body through a compression sealing ring. An atomization wafer is provided in the content cavity, and the central area of the front surface of the atomization wafer is located below the central hole of the gland. It further includes a heat dissipation aluminum part, and the heat dissipation aluminum part has a concave cavity, and the heat dissipation aluminum part fits against the outer side of the inner support body through the concave cavity.

[0004] Among them, the base body is a basic component for installing and positioning the atomization component, and in a specific application, it can be the wall body or the outer shell body of the atomizer device or a part thereof.

[0005] Among them, the heat dissipation aluminum part can be connected to the base body by means such as screws, so that the heat of the atomizing wafer can be further diffused to the base body.

[0006] Among them, the pressing sealing ring is annular and elastic, which not only seals and connects the gland and the cavity side wall, but also seals and connects the base body. Therefore, one pressing sealing ring can simultaneously seal and connect the gland, the base body and the cavity side wall, or two pressing sealing rings can be respectively arranged between the gland and the base body and between the base body and the cavity side wall.

[0007] Among them, the heat dissipation aluminum part can be an integral device or composed of several separated parts. Secondly, heat dissipation ribs can be arranged on the outer surface of the heat dissipation aluminum part to further enhance the heat dissipation effect.

[0008] Among them, the atomizing wafer can generate high-frequency vibration under the drive of the high-frequency electric energy provided by the control circuit board, so as to atomize the liquid above it and realize the atomization function.

[0009] According to the above technical solution, compared with the prior art, its beneficial technical effects are as follows. First, since the gland and the cavity side wall are parts made of the same non-metallic corrosion-resistant material, they can have basically the same thermal collision coefficient, so that they can adapt to the changes in different temperature environments and are not prone to connection loosening. Second, the gland and the cavity side wall can be applied to corrosive environments and are not prone to aging and deformation, thus greatly improving their application in media environments with different chemical properties. In addition, since the outer side of the inner support body fits the heat dissipation aluminum part, the heat dissipation performance can be improved, and the problem of the reduced heat dissipation characteristics of the inner support body can be compensated by the heat dissipation aluminum part. Therefore, the combined use of the inner support body and the heat dissipation aluminum part not only solves the problem of the reduced heat dissipation characteristics of the inner support body, but also effectively solves the problem of various adaptabilities of the use environment.

[0010] A further solution can also be that spaced positive and negative electrodes, namely a first electrode and a second electrode, are arranged on the back of the atomizing wafer. The first electrode surrounds the second electrode and is electrically isolated from each other; two elastic electrical contacts are arranged side by side below the atomizing wafer and are respectively electrically connected to the positive and negative electrodes on the back of the atomizing wafer, and the two electrical contacts are electrically isolated from each other.

[0011] A further solution can also be that the electrical contacts are elastic and elastically abut against the positive and negative electrodes on the back of the atomizing wafer. The electrical contacts are electrically connected to electrical leads, and the two electrical leads respectively extend out through the bottom wall of the cavity of the inner support body and the heat dissipation aluminum part.

[0012] A further solution may also be that a wafer support frame is further provided below the atomizing wafer. Two extension legs corresponding to the two electrical contacts are provided at the lower part of the wafer support frame. Bottom wall holes corresponding to the extension legs are provided on the bottom wall of the cavity. Two aluminum part avoidance holes corresponding to the extension legs are provided on the heat dissipation aluminum part. The extension legs pass through and are in interference fit connection with the bottom wall holes and the aluminum part avoidance holes. The two electrical leads respectively pass through the extension legs of the wafer support frame and then pass through the bottom wall of the cavity and the aluminum part avoidance holes by means of the extension legs and extend out.

[0013] A further solution may also be that the atomizing assembly further includes an annular wafer sealing ring. The wafer sealing ring is sleeved on the outer periphery of the atomizing wafer and is clamped between the gland and the wafer support frame to realize the sealing of the atomizing wafer. The gland, the wafer sealing ring, the wafer support frame, and the bottom wall of the cavity are arranged in sequence from top to bottom and are pressed together.

[0014] A further solution may also be that the wafer sealing ring includes an upper lip wall body that fits around the periphery of the front surface of the atomizing wafer. The area on the front surface of the atomizing wafer that is not fitted by the upper lip wall body forms the central area. At least no electrodes are provided in the central area. According to this solution, the electrodes are only provided in the peripheral area where the wafer sealing ring of the atomizing wafer fits and the back surface area of the atomizing wafer, or even only in the back surface area of the atomizing wafer. In this way, since no electrodes are provided in the central area on the front surface of the atomizing wafer, there is no need to worry about the corrosion or mechanical damage of the electrodes of the atomizing wafer, thus further greatly improving the ability to solve various adaptability problems in the use environment.

[0015] A further solution may also be that the outer side of the top of the wafer support frame is stepped. The wafer sealing ring falls onto the lower step surface of the step, and the upper step surface of the step contacts the lower surface of the atomizing wafer. This not only directly contacts the top of the wafer support frame and the lower surface of the atomizing wafer to form a sealed connection, but also can position the wafer sealing ring through the step.

[0016] A further solution may also be that the gland includes an annular wall portion and a skirt portion. The central hole of the gland is provided through the annular wall portion. The annular wall portion of the gland passes through the mounting hole and is screwed and connected with the side wall of the cavity. The skirt portion of the gland presses against the outer side surface of the base body, so that when the inner support body is tightened, the base body and the compression sealing ring are clamped between the skirt portion of the gland and the side wall of the cavity of the inner support body. Since the gland and the inner support body are made of the same non-metallic corrosion-resistant material, the problem of loosening that may easily occur in the threaded connection due to inconsistent thermal expansion coefficients can be effectively solved.

[0017] A further solution may also be that a top groove is provided at the top of the cavity side wall. The top groove is annular. The outer annular diameter of the outer side wall of the top groove is larger than the inner diameter of the mounting hole, and the inner annular diameter of the inner side wall of the top groove is smaller than the inner diameter of the mounting hole. The pressing sealing ring is embedded in the top groove. In this way, not only can the sealing between the pressing sealing ring, the gland and the cavity side wall be realized, but also the direct contact and sealed connection between the pressing sealing ring and the base body can be realized.

[0018] A further solution may also be that a coupling groove is provided on the upper surface of the gland. The axis of the coupling groove is perpendicular to and intersects with the axis of the central hole of the gland. In this way, an operating tool can be inserted into the coupling groove to rotate the gland, which is convenient for installation and maintenance.

[0019] The present invention also provides an atomizer applying the corrosion-resistant ultrasonic atomization mechanism. The atomizer includes the corrosion-resistant ultrasonic atomization mechanism described above. The atomizer further includes an outer housing. The base body forms at least part of the upper housing of the outer housing. A control circuit board is provided in the outer housing, and the control circuit board is signal-connected to the electrodes of the atomization wafer.

[0020] A further solution may also be that a sealing resin is further provided in the outer housing, and the sealing resin fills the remaining space in the outer housing.

[0021] The present invention also provides a disinfection atomization device applying the atomizer, including the atomizer described above, and further including an electrolysis device for ionizing a solution to obtain a liquid containing active ions for disinfection. The atomizer and the electrolysis device may be separately provided or integrated into one body.

[0022] Due to the above characteristics and advantages of the present invention, it can be applied to the corrosion-resistant ultrasonic atomization mechanism, atomizer and disinfection atomization device for generating atomized gas. Description of the Drawings

[0023] Figure 1 is a schematic diagram of the external structure of an atomizer for generating atomized gas applied to a disinfection atomization device of the present invention;

[0024] Figure 2 is a schematic diagram of the exploded structure of the ultrasonic atomization mechanism applied to the atomizer of the present invention;

[0025] Figure 3 is Figure 2 the schematic diagram of the assembled structure of;

[0026] Figure 4It is a schematic plan view of the distribution structure of the back electrode of the atomization wafer in the ultrasonic atomization mechanism. Detailed implementation manners

[0027] The following combines with the attached Figure 1 to the attached Figure 4 , and makes a further specific description of the structure, function and use of the ultrasonic atomization mechanism, atomizer and disinfection atomization equipment applicable to generating atomized gas. This kind of atomizer not only has a corrosion-resistant structure but also has an electrode isolation structure.

[0028] The present invention relates to atomization equipment, especially a disinfection atomization equipment (not shown in the figure) with a disinfection function, an atomizer 100 installed in the atomization equipment and an ultrasonic atomization mechanism 200 applied to the atomizer 100. As an application embodiment, the disinfection equipment includes a machine body, and a liquid storage space for containing a disinfection solution is arranged in the machine body. The disinfection solution can be an aqueous solution with a neutral pH value, or a liquid with an acidic or alkaline pH value. In the aqueous solution with a neutral pH value, the solution can be ionized by setting an electrolysis device to obtain a liquid containing active ions for disinfection.

[0029] In a further application, the atomizer 100 is installed on the machine body of the disinfection equipment, and the liquid with a sterilization and disinfection function is atomized through the atomizer 100.

[0030] In a further application, the atomizer 100 can be directly combined with the bottom wall of the liquid storage space, and the base 1 mentioned below constitutes at least part of the bottom wall of the liquid storage space.

[0031] In a further application, the atomizer 100 can also be an independent component placed in the liquid storage space, such as Figure 1As shown, the atomizer 100 includes a housing 101 made of stainless steel material. The base 1 mentioned below constitutes at least a part of the upper housing of the housing 101. In this structure, a liquid level sensor 102 is also provided on the upper housing of the housing 101 of the atomizer 100. A control circuit board (not shown in the figure) is also provided inside the housing 101. The liquid level sensor 102 is signal-connected to the control circuit board and feeds back a water level signal to the control circuit board. The atomizer 100 is electrically connected to the outside through electrical signal lines. When it is detected that the liquid level in the liquid storage space is lower than the set threshold, the control circuit board controls the atomizer 100 to stop working and can simultaneously emit a prompt signal, such as lighting an indicator light. In order to make the atomizer 100 have better waterproof and corrosion protection performance, resin can also be filled in the peripheral space of the heat dissipation aluminum part 9 inside the housing 101. In order to adapt to the use in an acid-base environment, the housing 101 is preferably made of a corrosion-resistant material such as stainless steel.

[0032] The atomizer 100 further includes an ultrasonic atomization mechanism 200. The ultrasonic atomization mechanism 200 includes the base 1 and an atomization component. An installation hole 11 is provided on the base 1.

[0033] As Figure 2 , Figure 3 shown, the atomization component includes an inner support body 2 arranged inside the base 1. The inner support body 2 includes a cavity side wall 21 and a cavity bottom wall 22. The cavity side wall 21 and the cavity bottom wall 22 form (i.e., define) an inner cavity 20 with an open upper part; a top groove 211 with an upward open is provided at the top of the cavity side wall 21. The top groove 211 is annular. The annular diameter of the outer side wall 212 of the top groove 211 is larger than the inner diameter of the installation hole 11, and the annular diameter of the inner side wall 213 of the top groove 211 is smaller than the inner diameter of the installation hole 11. The inner support body 2 is installed below the installation hole 11. The outer side wall 212 of the top groove 211 in the cavity side wall 21 abuts against the inner side of the hole wall around the installation hole 11, that is, the inner side of the base 1. The upper open part of the inner cavity 20 faces the installation hole 11 and is located below the installation hole 11. From the projection in the up-down direction, the hole perimeter of the installation hole 11 falls within the range of the top groove 211.

[0034] As Figure 2 , Figure 3As shown, the atomization component further includes an annular gland 3 and an annular pressing sealing ring 4. The gland 3 has a central hole 31 in the gland, so it is annular. The liquid above the gland 3 enters above the atomization wafer 5 mentioned below through the central hole 31 in the gland. The central hole 31 in the gland also allows the atomized bubbles generated in the central area 50 on the front surface of the atomization wafer 5 to overflow upward into the space above the gland 3. The gland 3 is located on the upper surface of the inner support body 2 and is combined with the upper open end of the inner support body 2. The base body 1 and the pressing sealing ring 4 are clamped between the gland 3 and the cavity side wall 21 of the inner support body 2, and the pressing sealing ring 4 also directly contacts the base body 1 to form a sealed connection. Further, the gland 3 includes an annular wall portion 32 and a skirt portion 33. The annular wall portion 32 extends in the vertical direction, and the central hole 31 in the gland penetrates through the annular wall portion 32 in the vertical direction. The skirt portion 33 extends in the left-right direction. An external thread 34 is provided on the annular wall portion 32, and an internal thread 23 is provided on the cavity side wall 21. The annular wall portion 32 passes through the mounting hole 11 and is threadedly engaged with the cavity side wall 21, and the lower end surface of the annular wall portion 32 presses against the wafer sealing ring 6 mentioned below, so as to not only achieve a sealed connection but also minimize interference with the vibration of the atomization wafer 5. The skirt portion 33 presses against the hole wall around the mounting hole 11, that is, the outer side surface of the base body 1. Secondly, the lower surface of the skirt portion 33 of the gland 3 is flat. Of course, a cover groove facing the base body 1 can also be provided. The cover groove is located above the top groove 211. The pressing sealing ring 4 is integrally provided and embedded in the top groove 211, so that when the inner support body 2 and the gland 3 are tightened, the base body 1 and the pressing sealing ring 4 can be clamped between the skirt portion 33 and the cavity side wall 21. Also, since the diameter of the mounting hole 11 is between the annular diameters of the inner side wall 213 and the outer side wall 212 of the top groove 211, part of the wall body of the pressing sealing ring 4 can contact the peripheral wall body of the mounting hole 11, that is, the base body 1, so as to achieve the seal between the skirt portion 33, the cavity side wall 21, and the base body 1 through the pressing sealing ring 4, that is, to completely seal the mounting hole 1, and the pressing sealing ring 4 realizes the sealing function, that is, the liquid outside the outer shell 101 of the atomizer 100 will not penetrate into the outer shell 101 from the position of the mounting hole 11. Of course, as an equivalent implementation, as in the solution already disclosed in the prior art, the pressing sealing ring 4 can also be separately provided between the skirt portion 33 and the base body 1 and between the cavity side wall 21 and the base body 1, and these are all solutions that can achieve the same function. In order to improve the acid and alkali corrosion resistance of the gland 3, the gland 3 is made of a non-metallic corrosion-resistant material, such as corrosion-resistant plastics, resins, and other materials.In order to enable the gland 3 and the inner support body 1 to have the same coefficient of thermal expansion, thereby reducing the adverse effect on the sealing effect of the compression sealing ring 4, the gland 3 and the cavity side wall 21 are parts made of the same non-metallic corrosion-resistant material. This improvement in the solution greatly enhances the applicability of the atomizer in an acid-base environment.

[0035] As Figure 2 , Figure 3 shown, a combined groove 35 in the shape of a straight line or a cross is further provided on the upper surface of the gland 3. The axis of the combined groove 35 is perpendicularly intersected with the axis of the central hole 31 of the gland. In this way, an operating tool can be inserted into the combined groove 35 to rotate the gland 3, which is convenient for installation and maintenance.

[0036] As Figure 2 , Figure 3 shown, an atomization wafer 5, a wafer sealing ring 6, a wafer support frame 7, and two elastic electrical contacts, namely a left electrical contact 81 and a right electrical contact 82, are arranged in the inner cavity 20 of the inner support body 2. The wafer sealing ring 6 and the wafer support frame 7 are made of a soft material with certain elasticity and heat conduction functions, such as silicone rubber. They have an elastic function to better seal the atomization wafer 5, and can also assist in eliminating the thread loosening gap between the gland 3 and the inner support body 2, making it not easy for them to loosen and having an anti-loosening function. The heat conduction function can timely dissipate the heat generated by the atomization wafer 5. The atomization wafer 5 can generate high-frequency vibrations under the drive of the high-frequency electrical energy provided by the control circuit board, so as to atomize the liquid above it and realize the atomization function. The wafer sealing ring 6 is annular, and a radial groove 60 is provided on its inner side. The wafer sealing ring 6 is sleeved on the outer periphery of the atomization wafer 5 through the radial groove 60 and is clamped between the annular wall portion 32 of the gland 3 and the wafer support frame 7 to realize the sealing of the atomization wafer 5. The central area 50 on the front surface of the atomization wafer 5 is located below the central hole 31 of the gland. The gland 3, the wafer sealing ring 6 (including the atomization wafer 5), the wafer support frame 7, and the bottom wall 22 of the cavity of the inner support body 2 are arranged in sequence from top to bottom and are tightened and squeezed together. The outer side of the top of the wafer support frame 7 is stepped. The wafer sealing ring 6 falls onto the lower step surface of the step, and the upper step surface 71 contacts the lower surface of the atomization wafer 5. In this way, the wafer support frame 7 can not only be used to support the atomization wafer 5 and the wafer sealing ring 6, but also assist in sealing. In this way, through the wafer sealing ring 6 and the wafer support frame 7, the liquid above the atomization wafer 5 cannot penetrate in to achieve sealing.

[0037] In the above solution where the wafer sealing ring 6 and the wafer support frame 7 are both made of a soft material with certain elasticity and heat conduction function, such as silicone rubber, the combination of the wafer sealing ring 6 and the wafer support frame 7 can not only strengthen the sealing effect on the atomization wafer 5, but also, compared with the solution where only the wafer sealing ring 6 is made of an elastic material, better accommodate the thermal deformation caused by the heat generated by the atomization wafer 5.

[0038] From the perspectives of achieving sealing, heat conduction, and eliminating the influence of thermal changes, etc., the wafer sealing ring 6 and the wafer support frame 7 can also be integrally provided, which can have the same sealing function and support function. However, from the perspective of maintenance convenience, separating the wafer sealing ring 6 and the wafer support frame 7 enables directly removing the atomization wafer 5 and the wafer sealing ring 6 when the atomization wafer 5 is damaged or aged and needs to be replaced, and then putting them into the content cavity 20 after reassembling a new atomization wafer 5 or wafer sealing ring 6. Therefore, it is a better solution that the outer diameter of the assembly formed by the atomization wafer 5 and the wafer sealing ring 6 is smaller than the inner diameter of the content cavity 20.

[0039] As Figure 4 shown, two spaced positive and negative electrodes, namely the first electrode 51 and the second electrode 52, are provided on the back surface of the atomization wafer 5. The first electrode 51 surrounds the second electrode 52 and is electrically isolated from each other to form the two positive and negative plates of the oscillating capacitor. No electrode is provided in the central region 50 on the front surface of the atomization wafer 5, that is, the region for contacting the liquid. The central region 50 is located below the central hole 31 of the gland. Specifically, the wafer sealing ring 6 includes an upper lip wall body 61 (i.e., the upper groove wall of the radial groove 60) that fits around the periphery of the front surface of the atomization wafer 5. The region on the front surface of the atomization wafer 5 that is not covered by the upper lip wall body 61 constitutes the central region 50, and at least no electrode is provided in the central region 50. According to this solution, the electrodes are only provided in the peripheral region where the wafer sealing ring 6 of the atomization wafer 5 fits and the back surface region of the atomization wafer 5, or even only in the back surface region of the atomization wafer 5. In this way, since no electrode is provided in the central region 50 on the front surface of the atomization wafer 5, there is no need to worry about the corrosion of the electrodes of the atomization wafer 5, and it can also avoid possible mechanical damage to the electrodes during the cleaning of the atomization wafer 5, thereby further improving the applicability of the atomizer in an acidic or alkaline environment and also increasing the service life.

[0040] As Figure 2 、 Figure 3As shown, the two electrical contacts, namely the left electrical contact 81 and the right electrical contact 82, are such that the helical spring is elastic and elastically abuts against the first electrode 51 and the second electrode 52 on the back surface of the atomizing wafer 5, thereby achieving electrical signal connection. In other equivalent embodiments, the electrical contact may also adopt a solution where a columnar electrode is inserted into the spring and the columnar electrode abuts against the electrode on the back surface of the atomizing wafer 5, or it may also be a solution where a conductive carbon brush or brush is provided on the upper surface of the columnar electrode to improve the stability of electrical contact. The left electrical contact 81 and the right electrical contact 82 are arranged left and right below the atomizing wafer 5 and are respectively and correspondingly electrically connected to the positive and negative electrodes of the atomizing wafer 5, namely the first electrode 51 and the second electrode 52. The bottom end of the left electrical contact 81 is welded to the left PCB board (the PCB board is not shown in the figure), and the left PCB board is welded with an electrical lead 811, so that the left electrical contact 81 is electrically connected to the electrical lead 811. The bottom end of the right electrical contact 82 is welded to the right PCB board, and the right PCB board is welded with an electrical lead 812, so that the right electrical contact 82 is electrically connected to the electrical lead 812. The two electrical leads 811 and 812 respectively pass through the wafer support frame 7 and the bottom wall 22 of the cavity and extend out to be signal-connected to the control circuit board.

[0041] As Figure 2 , Figure 3 shown, two pits, namely the left pit 72 and the right pit 73, which are adapted to the first electrode 51 and the second electrode 52, or rather adapted to the two left electrical contact 81 and the right electrical contact 82 and have openings facing upwards, are further provided on the upper part of the wafer support frame 7. The left pit 72 and the right pit 73 are arranged left and right and are electrically separated from each other by a partition wall 74 and each accommodate one of the electrical contacts. Further, the inner diameter of the pit and the outer diameter of the electrical contact have an interference tolerance fit (+1 mm to +5 mm), so that the pit positions the electrical contact and the electrical contact cannot shake significantly left and right, but it does not prevent it from floating with the atomizing wafer 5. In this way, the left electrical contact 81 and the right electrical contact 82 can be reliably electrically insulated from each other and positioned through the left pit 72 and the right pit 73, or rather through the partition wall 74, greatly improving the stability of use and operation.

[0042] Further, two left extension legs 74 and right extension legs 75 corresponding to the left electrical contact 81 and the right electrical contact 82, or corresponding to the left pit 72 and the right pit 73, are provided at the lower part of the wafer support frame 7. Left bottom wall holes 241 and right bottom wall holes 251 corresponding to the left extension legs 74 and the right extension legs 75 are provided on the cavity bottom wall 22. The left extension legs 74 and the right extension legs 75 respectively pass through the left bottom wall holes 241 and the right bottom wall holes 251. An interference fit (i.e., a tight fit connection) and a sealed connection are formed between the left extension legs 74 and the right extension legs 75 and the left bottom wall holes 241 and the right bottom wall holes 251 respectively. The electrical leads 811 and 812 respectively pass through the left extension legs 74 and the right extension legs 75 and extend out through the cavity bottom wall 22 by means of the left extension legs 74 and the right extension legs 75. The left extension legs 74 and the right extension legs 75 can, by virtue of the interference fit relationship with the left bottom wall holes 241 and the right bottom wall holes 251, in turn clamp and seal the electrical leads 811 and 812. Therefore, the left extension legs 74 and the right extension legs 75 not only play a role in positioning the wafer support frame 7, but also play a role in sealing and insulating the two electrical leads 811 and 812, and can also conduct and dissipate the heat of the atomizing wafer 5 to the cavity bottom wall 22.

[0043] In the above solution, since the cavity side wall 21 uses the same non-metallic corrosion-resistant material as the gland 3, it is likely to cause a reduction in the heat dissipation performance of the atomizing wafer 5. To solve this problem, a further solution can be, for example Figure 2 , Figure 3As shown, it further includes a heat dissipation aluminum part 9. The heat dissipation aluminum part 9 has a concave cavity 90 adapted to the outer shape of the inner support body 2. The heat dissipation aluminum part 9 is attached to the outside of the inner support body 2 through its concave cavity 90 and is connected to the base body 1 by means such as screws. The heat dissipation aluminum part 9 can timely dissipate the heat in the inner support body 2 to the base body 1. Two left aluminum part avoidance holes 91 and right aluminum part avoidance holes 92 corresponding to the left extension leg 74 and the right extension leg 75 are provided on the heat dissipation aluminum part 9. The left extension leg 74 and the right extension leg 75 pass through the left aluminum part avoidance hole 91 and the right aluminum part avoidance hole 92 and are in interference fit and sealed connection. The electrical leads of the two electrical contacts respectively extend out through the heat dissipation aluminum part 9 by means of the left extension leg 74 and the right extension leg 75. The left extension leg 74 and the right extension leg 75 are in interference fit and sealed connection with the cavity bottom wall 22 and the heat dissipation aluminum part 9 respectively and hold the electrical leads tightly, which can not only conduct the heat of the atomization wafer 5 to the heat dissipation aluminum part 9, but also prevent the water vapor outside the heat dissipation aluminum part 9 from penetrating into the cavity bottom wall 22 or the heat dissipation aluminum part 9. Therefore, the improvement of this scheme greatly improves the applicability of the atomizer 100 in an acid-base environment. Secondly, the outer space of the heat dissipation aluminum part 9 is filled with resin for protection. In this way, it is a better choice that the heat on the heat dissipation aluminum part 9 is dissipated through the base body 1.

Claims

1. Corrosion-resistant ultrasonic atomization mechanism, including a base body and an atomization component, wherein an installation hole is provided on the base body; Characterized in that, The atomization component includes an inner support body and a gland made of the same non-metallic corrosion-resistant material. The inner support body is arranged inside the base body. The inner support body includes a content cavity with an open upper part, thus having a cavity side wall and a cavity bottom wall. The upper opening of the content cavity faces the installation hole. The gland has a central hole of the gland. The gland is arranged on the upper surface of the inner support body. The base body is clamped between the gland and the cavity side wall of the inner support body. The base body realizes sealed connection with the gland and the inner support body through a compression sealing ring. An atomization wafer is arranged in the content cavity. The central area on the front surface of the atomization wafer is located below the central hole of the gland. It further includes a heat dissipation aluminum part. The heat dissipation aluminum part has a concave cavity. The heat dissipation aluminum part fits against the outer side of the inner support body through the concave cavity; A first electrode and a second electrode, which are spaced apart, are arranged on the back surface of the atomization wafer. The first electrode surrounds the second electrode and is electrically isolated from each other; Two elastic electrical contacts are arranged on the lower side of the atomization wafer left and right and are respectively electrically connected to the positive and negative electrodes on the back surface of the atomization wafer. The two electrical contacts are electrically isolated from each other; The electrical contacts are elastic and elastically abut against the positive and negative electrodes on the back surface of the atomization wafer. The electrical contacts are electrically connected to electrical leads. The two electrical leads respectively pass through the cavity bottom wall of the inner support body and the heat dissipation aluminum part and extend out; A wafer support frame is further arranged below the atomization wafer. Two extension legs corresponding to the two electrical contacts are arranged at the lower part of the wafer support frame. Bottom wall holes corresponding to the extension legs are arranged on the cavity bottom wall. Two aluminum part avoidance holes corresponding to the extension legs are arranged on the heat dissipation aluminum part. The extension legs pass through and are in interference fit connection with the bottom wall holes and the aluminum part avoidance holes. The two electrical leads respectively pass through the extension legs of the wafer support frame and then pass through the cavity bottom wall and the aluminum part avoidance holes through the extension legs and extend out; The atomization component further includes an annular wafer sealing ring. The wafer sealing ring is sleeved on the outer periphery of the atomization wafer and is clamped between the gland and the wafer support frame to realize sealing of the atomization wafer. The gland, the wafer sealing ring, the wafer support frame, and the cavity bottom wall are arranged in sequence from top to bottom and are pressed together; The outer side of the top of the wafer support frame is stepped. The wafer sealing ring falls onto the lower step surface of the step. The upper step surface contacts the lower surface of the atomization wafer; The wafer sealing ring includes an upper lip wall body that fits around the periphery of the front surface of the atomization wafer. The area on the front surface of the atomization wafer that is not fitted by the upper lip wall body constitutes the central area. At least no electrode is provided in the central area.

2. The corrosion-resistant ultrasonic atomization mechanism according to claim 1, Characterized in that, The gland comprises an annular wall portion and a skirt portion. The central hole of the gland is penetratingly provided on the annular wall portion. The annular wall portion of the gland passes through the mounting hole and is screwed and connected with the side wall of the cavity. The skirt portion of the gland presses against the outer side surface of the base body, so that when the inner support body is tightened, the base body and the compression sealing ring are clamped between the skirt portion of the gland and the side wall of the cavity of the inner support body.

3. The corrosion-resistant ultrasonic atomization mechanism according to claim 2, characterized in that, a top groove is provided at the top of the side wall of the cavity. The top groove is annular. The annular diameter of the outer side wall of the top groove is larger than the inner diameter of the mounting hole. The annular diameter of the inner side wall of the top groove is smaller than the inner diameter of the mounting hole. The compression sealing ring is embedded into the top groove.

4. The corrosion-resistant ultrasonic atomization mechanism according to claim 2, characterized in that, a bonding groove is further provided on the upper surface of the gland. The axis of the bonding groove is vertically intersected with the axis of the central hole of the gland.

5. An atomizer applying the corrosion-resistant ultrasonic atomization mechanism, characterized in that, the atomizer comprises the corrosion-resistant ultrasonic atomization mechanism according to any one of claims 1 to 4. The atomizer further comprises an outer shell. The base body forms at least part of the upper shell of the outer shell. A control circuit board is provided in the outer shell. The control circuit board is signal-connected to the electrodes of the atomization wafer.

6. The atomizer according to claim 5, characterized in that, a sealing resin is further provided in the outer shell. The sealing resin fills the remaining space in the outer shell.

7. A disinfection atomization device, characterized in that, comprises the atomizer according to claim 5 or 6, and further comprises an electrolysis device for ionizing a solution to obtain a liquid containing active ions for disinfection.

Images