Taping Machine

Abstract

Provided is a tape applicator that can paste a tape while confirming whether the center of the tape coincides with the center of the annular frame. The tape applicator includes: an annular frame holding workbench that holds the annular frame; a wafer holding workbench that holds a wafer within the opening of the annular frame; a unit that pastes a circular tape onto the upper surface of the annular frame and the upper surface of the wafer; a sensor that has a light projecting unit that projects measurement light to a measurement point in a region on the upper surface of the annular frame where the tape should be pasted and a light receiving unit that receives the reflected light reflected at the measurement point; a setting unit that sets a reference value for the amount of light received by the light receiving unit; and a determination unit that determines that a tape is pasted at the measurement point when the amount of light received by the light receiving unit is less than the reference value, and determines that no tape is pasted at the measurement point when the amount of light received by the light receiving unit is equal to or greater than the reference value.

Description

Technical Field

[0001] The present invention relates to a taping machine. Background Art

[0002] The taping machine integrates a circular dicing tape onto a ring-shaped frame having an opening with a diameter larger than the diameter of a wafer and a wafer positioned in the opening of the ring-shaped frame, and makes the wafer in an operable state by means of the ring-shaped frame.

[0003] The ring-shaped frame holding unit of the taping machine sucks and holds the lower surface of the ring-shaped frame. Further, the wafer holding unit of the taping machine sucks and holds the lower surface of the wafer within the opening of the ring-shaped frame. Further, a pasting unit such as a rotating roller pastes the circular dicing tape onto the upper surface of the ring-shaped frame and the upper surface of the wafer.

[0004] Further, on the ring-shaped frame, two first flat surfaces parallel to each other are formed on the outer peripheral side surface, and two second flat surfaces parallel to each other in a direction perpendicular to the first flat surfaces are formed. And, as disclosed in Patent Document 1 or Patent Document 2, in order to align the center of the wafer with the center of the opening of the ring-shaped frame, the ring-shaped frame holding unit clamps a pair of first flat surfaces and a pair of second flat surfaces of the ring-shaped frame from the outer peripheral side of the ring-shaped frame, thereby positioning (centering) the ring-shaped frame at a target position.

[0005] The diameter of the dicing tape pasted on the wafer and the ring-shaped frame positioned as described above is larger than the inner diameter (diameter of the opening) of the ring-shaped frame and equal to or less than the outer diameter of the ring-shaped frame. And, the dicing tape is pasted on the ring-shaped frame such that the center of the dicing tape coincides with the center of the opening of the ring-shaped frame, and the center of the dicing tape also coincides with the center of the wafer within the opening of the ring-shaped frame (for example, refer to Patent Document 3).

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013-082045

[0007] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2011-036968

[0008] Patent Document 3: Japanese Unexamined Patent Application Publication No. 2016-008104

[0009] A cutting device that cuts a wafer with a cutting tool holds the ring-shaped frame by pulling it down such that the upper surface of the ring-shaped frame is lower than the holding surface of a chuck table that holds the wafer, so that the cutting tool does not contact the ring-shaped frame. Here, when the dicing tape and the ring-shaped frame are pasted in a state where their centers are offset from each other, there is a problem that the dicing tape peels off from the ring-shaped frame when the ring-shaped frame is pulled down and held.

[0010] Therefore, in a tape applicator, there is the following problem: after pasting a dicing tape on a ring-shaped frame, it is necessary to confirm whether the center of the dicing tape is pasted in alignment with the center of the ring-shaped frame. Summary of the Invention

[0011] An object of the present invention is to provide a tape applicator that can confirm whether the center of a dicing tape is pasted in alignment with the center of a ring-shaped frame.

[0012] According to one aspect of the present invention, there is provided a tape applicator including: a ring-shaped frame holding table that holds a ring-shaped frame; a wafer holding table that holds a wafer within an opening of the ring-shaped frame; a pasting unit that pastes a circular tape on an upper surface of the ring-shaped frame held by the ring-shaped frame holding table and an upper surface of the wafer held by the wafer holding table; a sensor that has a light projecting unit that projects measurement light to a measurement point in a region on the upper surface of the ring-shaped frame where the tape should be pasted, and a light receiving unit that receives reflected light reflected at the measurement point; a setting unit that sets a reference value for the amount of light received by the light receiving unit; and a determination unit that determines that the tape is pasted at the measurement point when the amount of light received by the light receiving unit is less than the reference value, and determines that the tape is not pasted at the measurement point when the amount of light received by the light receiving unit is equal to or greater than the reference value.

[0013] Sometimes it further has a storage unit that stores the amount of light received when the light receiving unit receives reflected light that reflects the measurement light on the upper surface of the ring-shaped frame, and the setting unit sets the value stored in the storage unit as the reference value.

[0014] Sometimes the sensor has: the light projecting unit that projects the measurement light from an obliquely upper direction toward the measurement point with respect to the upper surface of the ring-shaped frame; a retroreflective plate that is arranged at a position symmetrical to the light projecting unit with respect to the measurement point and reflects the measurement light reflected at the measurement point back toward the measurement point; and the light receiving unit that receives, near the light projecting unit, the reflected light that is further reflected at the measurement point by the retroreflective plate.

[0015] Sometimes the sensor has: the light projecting unit that projects the measurement light from an obliquely upper direction toward the measurement point with respect to the upper surface of the ring-shaped frame; and the light receiving unit that is arranged at a position symmetrical to the light projecting unit with respect to the measurement point and receives the reflected light reflected at the measurement point.

[0016] One embodiment of the taping machine of the present invention includes: a sensor having a light projecting unit that projects measurement light onto a measurement point in an area where a tape should be pasted on the upper surface of a ring-shaped frame, and a light receiving unit that receives the reflected light reflected at the measurement point; a setting unit that sets a reference value for the amount of received light received by the light receiving unit; and a determination unit that, when the amount of received light received by the light receiving unit is less than the reference value, determines that a tape (e.g., a dicing tape) is pasted at the measurement point, and when the amount of received light received by the light receiving unit is equal to or greater than the reference value, determines that no tape is pasted at the measurement point, so that it is possible to confirm whether the center of the tape is pasted in alignment with the center of the ring-shaped frame. Conventionally, a transmissive sensor has been used to confirm the portion of the ring-shaped frame where no tape is pasted, but it has been impossible to confirm whether the center of the tape is pasted in alignment with the center of the ring-shaped frame. In other words, it has been impossible to confirm whether there is a position where the pasted area of the tape is partially narrowed around the opening of the ring-shaped frame. However, in one embodiment of the taping machine of the present invention, for example, the measurement point measured by the sensor is set in an area slightly outside the opening of the ring-shaped frame (the area where the tape should be pasted). Thus, if there is a portion where the pasted area of the tape with respect to the ring-shaped frame is narrowed (the portion where no tape is pasted at the measurement point), the amount of received light of the reflected light from the ring-shaped frame received by the light receiving unit is equal to or greater than the reference value. Therefore, the determination unit can determine that there is a position where the pasted area of the tape is partially narrowed and that there is a portion where the tape is likely to peel off from the ring-shaped frame.

[0017] It further includes a storage unit that stores the amount of received light when the light receiving unit receives the reflected light that reflects the measurement light on the upper surface of the ring-shaped frame. When the setting unit sets the value stored in the storage unit as the reference value, it is possible to appropriately set in the taping machine a reference value for the determination unit to determine whether the center of the dicing tape is pasted in alignment with the center of the ring-shaped frame.

[0018] The sensor has: a light projecting unit that projects the measurement light obliquely downward from above onto the upper surface of the ring-shaped frame toward the measurement point; a retroreflective plate that is arranged at a position symmetrical to the light projecting unit with respect to the measurement point and reflects the measurement light reflected at the measurement point back toward the measurement point; and a light receiving unit that receives, near the light projecting unit, the reflected light that is further reflected at the measurement point after being reflected by the retroreflective plate. In this case, regardless of whether the dicing tape is a transparent tape or an opaque tape, the determination unit can determine that a tape is pasted at the measurement point when the amount of received light received by the light receiving unit is less than the reference value, and determine that no tape is pasted at the measurement point when the amount of received light received by the light receiving unit is equal to or greater than the reference value, so that it is possible to determine whether the center of the dicing tape is pasted in alignment with the center of the ring-shaped frame.

[0019] The sensor has: a light projecting unit that projects the measurement light obliquely downward from above the upper surface of the annular frame toward the measurement point; and a light receiving unit that is disposed at a position symmetric to the light projecting unit with respect to the measurement point and receives the reflected light reflected at the measurement point. In this case, even if the dicing tape is an opaque tape, the determination unit can determine that the tape is pasted at the measurement point when the amount of received light received by the light receiving unit is less than the reference value, and can determine that the tape is not pasted at the measurement point when the amount of received light received by the light receiving unit is equal to or greater than the reference value, so that it is possible to determine whether the center of the dicing tape is pasted in coincidence with the center of the annular frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a perspective view showing an example of a taping machine.

[0021] Figure 2 is a perspective view showing an example of an annular frame holding table and a wafer holding table.

[0022] Figure 3 is a side view for explaining a state where the tape starts to be pasted on the annular frame and the wafer in the taping machine.

[0023] Figure 4 is a side view for explaining a state where the tape starts to be pasted on the annular frame and the wafer in the taping machine.

[0024] Figure 5 is a side view for explaining a state where the tape is pasted on the annular frame and the wafer to form a wafer group in the taping machine.

[0025] Figure 6 is a top view for explaining a case where the center of the tape coincides with the center of the annular frame and the tape is pasted on the annular frame in the annular frame holding table located below the sensor of the first embodiment.

[0026] Figure 7 is a top view for explaining a case where the center of the tape is offset from the center of the annular frame and the tape is pasted on the annular frame in the annular frame holding table located below the sensor of the first embodiment.

[0027] Figure 8 is an explanatory diagram for explaining a state where, when the center of the tape coincides with the center of the annular frame, in the sensor of the first embodiment, the light projecting unit irradiates the first measurement point with the measurement light and the light receiving unit receives the reflected light.

[0028] Figure 9 is a diagram showing the amount of received light of the light receiving unit of the sensor of the first embodiment.

[0029] Figure 10An explanatory diagram for explaining the following state: When the center of the belt is offset from the center of the annular frame, in the sensor of the first embodiment, the light projecting unit irradiates measurement light toward the first measurement point, and the light receiving unit receives the reflected light.

[0030] Figure 11 An explanatory diagram for explaining the following state: When the center of the belt is offset from the center of the annular frame, in the sensor of the first embodiment, the light projecting unit irradiates measurement light toward the second measurement point, and the light receiving unit receives the reflected light.

[0031] Figure 12 A top view for explaining the following situation: In the annular frame holding workbench located below the sensor of the second embodiment, the center of the belt coincides with the center of the annular frame and the belt is adhered to the annular frame.

[0032] Figure 13 An explanatory diagram for explaining the following state: When the center of the belt coincides with the center of the annular frame, in the sensor of the second embodiment, the light projecting unit irradiates measurement light toward the first measurement point, and the light receiving unit hardly receives the reflected light.

[0033] Figure 14 A diagram showing the amount of light received by the light receiving unit of the sensor of the second embodiment.

[0034] Figure 15 A top view for explaining the following situation: In the annular frame holding workbench located below the sensor of the second embodiment, the center of the belt is offset from the center of the annular frame and the belt is adhered to the annular frame.

[0035] Figure 16 An explanatory diagram for explaining the following state: When the center of the belt is offset from the center of the annular frame, in the sensor of the second embodiment, the light projecting unit irradiates measurement light toward the first measurement point, and the light receiving unit receives the reflected light.

[0036] Figure 17 An explanatory diagram for explaining the following state: When the center of the belt is offset from the center of the annular frame, in the sensor of the second embodiment, the light projecting unit irradiates measurement light toward the second measurement point, and the light receiving unit hardly receives the reflected light.

[0037] Reference numeral description

[0038] 1: Tape applicator; 10: Base; TR: Tape roll; T1: Sheet; T2: Tape; 19: Reel; F: Annular frame; Fc: Opening of the annular frame; Fd: First flat surface; Fe: Second flat surface; W: Wafer; Wa: Lower surface of the wafer; Wb: Upper surface of the wafer; 15: Release plate; 16: Take-up roller; 160: Sheet support roller; 20: Annular frame holding table; 20a: Upper surface; 200: Recess; 201: Suction cup storage part; 25: Suction cup; 21: Wafer holding table; 210: Adsorption part; 210a: Holding surface; 211: Frame; 22: Adhesive unit; 23: First fixed positioning part; 24: First movable positioning part; 26: Second fixed positioning part; 27: Second movable positioning part; 13: Table moving unit; 130: Ball screw; 131: Guide rail; 132: Motor; 6: Sensor of the first embodiment; 60: Light projecting part; 61: Light receiving part; 62: Retroreflector; 9: Control unit; 90: Setting part; 92: Judgment part; 95: Storage part; 6A: Sensor of the second embodiment; 66: Light projecting part; 67: Light receiving part. Detailed implementation mode

[0039] Figure 1 The tape applicator 1 of one mode of the present invention shown has a base 10 with the length direction being the X-axis direction. The base 10 is provided with each constituent element of the present invention described later, and the upper surface of the base 10 is a horizontal plane. A tape roll TR is provided above the rear side (+X direction side) of the base 10.

[0040] The tape roll TR has a structure in which a strip-shaped adhesive tape and a strip-shaped sheet T1 are adhered. The adhesive tape includes, for example, a base material made of a polyolefin-based resin or the like and an adhesive layer of the base material, and the sheet T1 is adhered to the adhesive layer side. The adhesive tape is pre-cut into a plurality of circular shapes corresponding to the diameter of the annular frame F as the pasting object, and is in a state where a plurality of tapes T2 (dicing tapes T2) formed by pre-cutting the adhesive tape are adhered to the sheet T1 at equal intervals in the length direction of the sheet T1. In addition, there is no particular limitation on the materials of the tape T2 and the sheet T1. For example, in the present embodiment, the tape T2 is a tape transparent to visible light, but it may also be a tape that is colored and opaque to visible light.

[0041] As Figure 1 shown, the tape roll TR is in a state where the tape T2 is on the inner side and is wound around the reel 19 in a roll shape. The tape T2 has a larger diameter than the inner diameter of the circular opening Fc (refer to Figure 2 ) of the annular frame F and a smaller diameter than the outer diameter of the annular frame F.

[0042] As Figure 2As shown, the annular frame F is made of a specified metal (such as SUS, etc.), has an annular flat plate shape, and has a circular opening Fc with an inner diameter larger than the outer diameter of the wafer W. In addition, for the annular frame F, for example, a part of its outer periphery is cut into a plane, so as to form two first flat surfaces Fd that are parallel to each other and two second flat surfaces Fe that are parallel to each other in a direction perpendicular to the first flat surface Fd. The first flat surface Fd and the second flat surface Fe are used for positioning the annular frame F.

[0043] The wafer W is, for example, a circular semiconductor wafer made of a silicon base material, etc. On the front surface Wa (lower surface Wa) of the wafer W facing downward in Figure 1 a plurality of devices are formed in the regions divided in a grid pattern, and a protective tape (not shown) is pasted for protection. The back surface Wb (upper surface Wb) of the wafer W is the surface to which the tape T2 is to be pasted. In addition, in addition to silicon, the wafer W can be made of gallium arsenide, sapphire, gallium nitride, ceramic, resin, silicon carbide, etc., or can be a rectangular package substrate, etc.

[0044] In Figure 1 a peeling plate 15 is disposed at a position obliquely below the tape reel TR shown. The peeling plate 15 bends the drawn sheet T1 to peel the tape T2 from the sheet T1. The peeling plate 15 is, for example, an inclined plate with a side view triangular shape when viewed from the Y-axis direction, and extends along the Y-axis direction with a length equal to or greater than the width (length in the Y-axis direction) of the sheet T1. As Figure 3 and Figure 4 shown, the peeling plate 15 presses the sheet T1 with its front end side to bend the sheet T1 into an acute angle, so that the tape T2 can be peeled from the sheet T1.

[0045] As Figure 1 and Figure 3 shown, the sheet T1 from which the tape T2 has been peeled by means of the peeling plate 15 is conveyed to the rear (+X direction) of the peeling plate 15. And the sheet winding roller 16 that rotates about a rotation axis in the Y-axis direction by using a rotation drive source such as a motor winds the sheet T1 in a roll shape. This rotation drive source of the sheet winding roller 16 controls the pulling speed of the sheet T1 from the tape reel TR by using torque control, for example.

[0046] A sheet support roller 160 is disposed between the sheet winding roller 16 and the peeling plate 15 to prevent the sheet T1 from which the tape T2 has been peeled from becoming slack.

[0047] The tape pasting machine 1 has: an annular frame holding table 20 that holds the annular frame F; a wafer holding table 21 that holds the wafer W in the opening Fc of the annular frame F; and a pasting unit 22 that pastes the circular tape T2 on the upper surface Fa of the annular frame F held by the annular frame holding table 20 and the upper surface Wb of the wafer W held by the wafer holding table 21.

[0048] Figure 2 The shown annular frame holding table 20 is formed, for example, in a square shape when viewed from above, and a wafer holding table 21 is accommodated in a recess 200 formed at the center of the annular frame holding table 20. The upper surface 20a of the annular frame holding table 20 serves as an annular frame holding surface which is a flat surface. On the upper surface 20a of the annular frame holding table 20, there are provided, for example, four suction cup accommodating portions 201 which are concave and have openings. In each of these four suction cup accommodating portions 201, a suction cup 25 capable of adsorbing the annular frame F is disposed. The suction cup 25 is, for example, formed by shaping an elastic material such as deformable rubber into a circular shape when viewed from above. Each suction cup 25 communicates with a suction source (not shown) such as a vacuum generating device.

[0049] In addition, the outer shape, structure, etc. of the annular frame holding table 20 are not limited to this embodiment.

[0050] On the upper surface 20a of the annular frame holding table 20, a first fixed positioning portion 23 for positioning (centering) the annular frame F on the upper surface 20a and a first movable positioning portion 24 opposite to the first fixed positioning portion 23 are disposed. In addition, a second fixed positioning portion 26 and a second movable positioning portion 27 opposite to the second fixed positioning portion 26 are disposed on the upper surface 20a.

[0051] For example, the facing directions of the first fixed positioning portion 23 and the first movable positioning portion 24 are substantially perpendicular to the facing directions of the second fixed positioning portion 26 and the second movable positioning portion 27.

[0052] The first fixed positioning portion 23 is composed of, for example, two cylindrical first fixed pins 23a and 23b, and the first fixed pin 23a and the first fixed pin 23b are symmetrically disposed with respect to the center line parallel to the X-axis direction of the annular frame holding table 20 when viewed from above.

[0053] The first movable positioning portion 24 has, for example: a cylindrical first movable pin 24a; a first movable block 24b that supports the first movable pin 24a; and a cylinder (not shown) that moves the first movable block 24b in the X-axis direction.

[0054] The second fixed positioning portion 26 is composed of, for example, two cylindrical second fixed pins 26a and 26b, and the second fixed pin 26a and the second fixed pin 26b are symmetrically disposed with respect to the center line parallel to the Y-axis direction of the annular frame holding table 20 when viewed from above.

[0055] The second movable positioning portion 27 has, for example: a columnar second movable pin 27a; a second movable block 27b that supports the second movable pin 27a; and a cylinder (not shown) that moves the second movable block 27b in the Y-axis direction.

[0056] In the present embodiment, at least one of the first fixed positioning portion 23 and the first movable positioning portion 24, and at least one of the second fixed positioning portion 26 and the second movable positioning portion 27 clamps at least one of the two first flat surfaces Fd and the two second flat surfaces Fe of the annular frame F, and positions (centers) the annular frame F at a target position on the upper surface 20a of the annular frame holding table 20. The center of the opening Fc of the annular frame F centered on the annular frame holding table 20 substantially coincides with the center of the holding surface 210a of the wafer holding table 21. Then, the annular frame F is attracted and held by each suction cup 25.

[0057] The wafer holding table 21 has a circular outer shape, for example, and the wafer holding table 21 has: a suction portion 210 formed of a porous member or the like that sucks the wafer W; and a frame body 211 having a concave longitudinal section that supports the suction portion 210. The suction portion 210 in a state of being embedded in the concave portion of the frame body 211 communicates with a suction source (not shown). The suction force generated by the suction source is transmitted to the upper surface of the suction portion 210, that is, the holding surface 210a that is a flat surface, so that the wafer holding table 21 sucks and holds the wafer W on the holding surface 210a.

[0058] For example, the height of the upper surface 20a of the annular frame holding table 20 is set such that when the wafer W is held by the holding surface 210a of the wafer holding table 21 and the annular frame F is held by the upper surface 20a of the annular frame holding table 20, the upper surface Fa of the annular frame F and the upper surface Wb of the wafer W are substantially at the same height.

[0059] As Figure 1 shown, a table moving unit 13 for reciprocally moving the wafer holding table 21 and the annular frame holding table 20 in the X-axis direction is provided on the base 10. The table moving unit 13 has: a ball screw 130 having an axis in the X-axis direction; a guide rail 131 disposed in parallel with the ball screw 130; and a motor 132 connected to the ball screw 130 to rotate the ball screw 130. A nut (not shown) provided on the lower surface side of the annular frame holding table 20 is screwed onto the ball screw 130. When the motor 132 rotates the ball screw 130, the wafer holding table 21 and the annular frame holding table 20 are guided by the guide rail 131 and reciprocally move in the X-axis direction accordingly.

[0060] The pasting unit 22 is disposed at a position above the moving path of the annular frame holding table 20 and near the front end of the peeling plate 15. The pasting unit 22 is, for example, a rotatable pasting roller, and the pasting unit 22 has a length greater than the width of the annular frame holding table 20 in the Y-axis direction. The pasting unit 22 is, for example, disposed to traverse the annular frame holding table 20 in the Y-axis direction and can be moved in the vertical direction by a moving unit (not shown). Alternatively, the pasting unit 22 may not be movable in the vertical direction.

[0061] The annular frame F is attracted and held in a centered state on the annular frame holding table 20, and the wafer W is attracted and held on the wafer holding table 21 such that the center of the wafer W substantially coincides with the center of the holding surface 210a. And, as Figure 4 and Figure 5 shown, the annular frame holding table 20 is moved in the -X direction by the table moving unit 13 to pass under the pasting unit 22. As a result, the tape T2 peeled from the sheet T1 by the peeling plate 15 is pressed by the pasting unit 22 from the upper side, which is the substrate surface side, onto the upper surface Fa of the annular frame F held by the annular frame holding table 20 and the upper surface Wb of the wafer W held by the wafer holding table 21, so that the tape T2 is pasted on the annular frame F and the wafer W positioned within the opening Fc of the annular frame F. And, a wafer set composed of the wafer W, the tape T2, and the annular frame F is fabricated such that the wafer W can be manipulated by the annular frame F. Figure 5 shown wafer set.

[0062] In order to confirm whether the center of the tape T2 is pasted in coincidence with the center of the annular frame F (the center of the opening Fc) after forming the wafer set as described above, as Figure 1 , Figure 5 and Figure 6 shown, the tape pasting machine 1 has: a sensor 6 including a light projecting unit 60 (only Figure 6 illustrated) that projects measurement light to a measurement point in the region on the upper surface Fa of the annular frame F where the tape T2 should be pasted and a light receiving unit 61 (only Figure 6 illustrated) that receives the reflected light at the measurement point; a setting unit 90 that sets a reference value for the amount of received light received by the light receiving unit 61; and a determination unit 92 that determines whether the center of the tape T2 is pasted in coincidence with the center of the annular frame F (the center of the opening Fc).

[0063] Hereinafter, the sensor 6 will be the sensor 6 of the first embodiment.

[0064] Figure 6 shows the case where the center of the tape T2 is pasted in coincidence with the center of the annular frame F (the center of the opening Fc). And, Figure 7The case where the center of the tape T2 is not pasted in alignment with the center of the annular frame F is shown. That is, in the illustrated example, the center of the tape T2 is shown to be offset toward the +X direction side with respect to the center of the annular frame F.

[0065] As Figure 6 shown, the measurement points where the measurement light is projected by the sensor 6 onto the upper surface Fa of the annular frame F are, for example, the first measurement point P1 and the second measurement point P2 set within the area where the tape T2 should be pasted, around the opening Fc. The area where the tape T2 should be pasted is set experimentally, empirically, or theoretically, and corresponds to the annular area where the tape T2 is pasted on the annular frame F when the center of the tape T2 is in alignment with the center of the annular frame F (the center of the opening Fc). For example, it is preferable that the first measurement point P1 and the second measurement point P2 are set at the positions of the midpoints of the width of the annular area where the tape T2 is pasted on the annular frame F.

[0066] The measurement points are at least Figure 1 the two first measurement point P1 and second measurement point P2 symmetrically set about the center of the opening Fc of the annular frame F in the X-axis direction, which is the feeding direction of the sheet T1 as shown.

[0067] In addition, regarding the measurement points, in addition to the above first measurement point P1 and second measurement point P2, Figure 6 it is also possible to set the third measurement point P3 and the fourth measurement point P4 symmetrically set about the center of the opening Fc in the Y-axis direction perpendicular to the X-axis direction, which is the feeding direction D1 of the sheet T1, within the horizontal plane as shown. Figure 6 As shown, the sensor 6 is arranged, for example, to face the upper surface 20a of the annular frame holding table 20 in the Z-axis direction above the annular frame holding table 20 in the state where it has moved to the position passing through the pasting unit 22 in the -X direction.

[0068] Figure 1 、 Figure 5 and Figure 6 shown.

[0069] The sensor 6 of the first embodiment is, for example, a retroreflective photoelectric sensor. The sensor 6 includes: a light projecting unit 60 that projects measurement light obliquely downward from above the upper surface Fa of the annular frame F toward the measurement point; a retroreflective plate 62 that is disposed at a position symmetric to the light projecting unit 60 with respect to the measurement point and reflects the measurement light reflected at the measurement point back toward the measurement point (retroreflection); and a light receiving unit 61 that receives, near the light projecting unit 60, the reflected light that is further reflected at the measurement point after being reflected by the retroreflective plate 62.

[0070] In addition, regarding the measurement light, when a dot-shaped laser beam is used, a thin-line-shaped measurement light is irradiated onto the measurement point, and it is easy to determine whether the tape T2 is pasted at the measurement point.

[0071] As Figure 6 and Figure 8 shown, the sensor 6 has, for example, a housing 63 that can shield external light and is provided with an opening 630 through which the measurement light L1 can pass on the lower side. The housing 63 extends, for example, in the Y-axis direction perpendicular to the X-axis direction, which is the moving direction of the annular frame holding the workbench 20 by the workbench moving unit 13.

[0072] The light projecting unit 60 and the light receiving unit 61 are, for example, arranged side by side at a position on the +Y direction side of the housing 63 in Figure 6 and Figure 8 . The light projecting unit 60 includes, for example, a laser oscillator or a lens, etc., and can irradiate a low-output thin-line-shaped laser beam linearly obliquely downward. The laser beam irradiated by the light projecting unit 60 enters the annular frame F located below the sensor 6 at a prescribed incident angle. In addition, for example, the incident angle of the laser beam and the height position of the focus point of the laser beam can be adjusted by an adjustment unit (not shown). The light receiving unit 61 is composed of a light receiving element such as a CCD, etc.

[0073] For example, the first measurement point P1 and the second measurement point P2 set on the annular frame F in a state where centering has been performed on the upper surface 20a of the annular frame holding the workbench 20 are positioned on the center line parallel to the X-axis direction of the annular frame holding the workbench 20. And a retroreflective plate 62 such as a mirror is arranged, for example, at a position on the -Y direction side of the housing 63 with the center line parallel to the X-axis direction of the annular frame holding the workbench 20 as the axis of symmetry. When the annular frame holding the workbench 20 is moved in the -X direction by the workbench moving unit 13 shown in Figure 1 so that the first measurement point P1 is positioned on the optical axis of the light projecting unit 60, the retroreflective plate 62 such as a mirror becomes a state where it is arranged at a position symmetric to the first measurement point P1 with respect to the light projecting unit 60 in the Y-axis direction.

[0074] For example, as Figure 1As shown, the taping machine 1 has a control unit 9 composed of a CPU or the like. The control unit 9 controls the entire device, that is, it controls the operations of the various components such as the table moving unit 13, the first movable positioning unit 24, the second movable positioning unit 27, the film winding roller 16, and the sensor 6 described above. Further, in the present embodiment, a setting unit 90 and a determination unit 92 are included in the control unit 9. The setting unit 90 sets a reference value regarding the amount of received light received by the light receiving unit 61, and the determination unit 92 determines whether a tape is pasted at the measurement point.

[0075] The taping machine 1 in the present embodiment has a storage unit 95 that stores the amount of received light when the light receiving unit 61 receives the reflected light L2 obtained by reflecting the measurement light L1 on the upper surface Fa of the annular frame F, that is, for example, the reflected light L2 reflected on the upper surface Fa of the annular frame F in a state where the tape T2 is not pasted. The storage unit 95 is included in the control unit 9, for example, and is composed of a ROM that stores a control program or pre-set processing information, etc., and a RAM that stores the measurement structure of the sensor 6, etc.

[0076] Hereinafter, a case will be described in which it is determined in the taping machine 1 whether the center of the tape T2 of the wafer group composed of the wafer W, the annular frame F, and the tape T2 is pasted in alignment with the center of the annular frame F (the center of the opening Fc).

[0077] Figure 1 The control unit 9 shown controls the table moving unit 13 to always grasp the X-axis coordinate position of the annular frame holding table 20 on the taping machine 1. And the Figure 1 The annular frame holding table 20 fed in the -X direction by the table moving unit 13 shown passes through the pasting unit 22, and as Figure 5 shown, pastes the tape T2 on the annular frame F, and then further moves the annular frame holding table 20 in the -X direction to a specified coordinate position in the X-axis direction.

[0078] Since the annular frame F is centered on the annular frame holding table 20, by moving the annular frame holding table 20 to a specified coordinate position in the X-axis direction, the control unit 9 determines that the first measurement point P1 has been positioned at a coordinate position previously grasped in the X-axis direction, that is, as Figure 6 and Figure 8 shown, positioned on the optical axis of the light projecting unit 60 of the sensor 6. And an operation signal is sent from the control unit 9 to the sensor 6 electrically connected to the control unit 9, and the light projecting unit 60 of the sensor 6 projects a thin-line-shaped measurement light L1 from obliquely above onto the upper surface Fa of the annular frame F toward the first measurement point P1.

[0079] As Figure 6As shown, when the center of the belt T2 is adhered to coincide with the center of the annular frame F, as Figure 8 shown, the measurement light L1 passes through the belt T2 and is reflected at the first measurement point P1 on the upper surface Fa of the annular frame F. The measurement light L1 reflected at the first measurement point P1 on the upper surface Fa of the annular frame F is reflected by the retroreflector 62 (the retroreflector 62 is arranged at a position symmetric to the light projecting part 60 in the Y-axis direction with respect to the first measurement point P1), is reflected again at the first measurement point P1, and is received by the light receiving part 61 near the light projecting part 60. By projecting light to the first measurement point P1, the Figure 9 received light quantity V2 shown as Figure 8 shown is stored in, for example, the RAM of the storage part 95 of the control unit 9 shown as

[0080] Make Figure 6 and Figure 8 shown annular frame holding table 20 further move in the -X direction, so that the control unit 9 determines that the second measurement point P2 has been positioned at the pre-determined coordinate position in the X-axis direction, that is, positioned on the optical axis of the light projecting part 60 of the sensor 6. And the light projecting part 60 of the sensor 6 projects a thin linear measurement light L1 from an oblique upper direction toward the second measurement point P2 with respect to the upper surface Fa of the annular frame F.

[0081] As Figure 6 shown, when the center of the belt T2 is adhered to coincide with the center of the annular frame F, the measurement light L1 passes through the belt T2 and is reflected at the second measurement point P2 on the upper surface Fa of the annular frame F. The measurement light L1 reflected on the upper surface Fa of the annular frame F is reflected by the retroreflector 62 (the retroreflector 62 is arranged at a position symmetric to the second measurement point P2 in the Y-axis direction with respect to the light projecting part 60), is reflected again at the second measurement point P2, and is received by the light receiving part 61 near the light projecting part 60. By projecting light to the second measurement point P2, the received light quantity received by the light receiving part 61 is the Figure 9 received light quantity V2 shown as

[0082] Regarding the received light quantity when the light receiving part 61 receives the reflected light L2 reflected on the upper surface Fa of the annular frame F obtained through past experiments and stored in the ROM of the storage part 95, that is, in the present embodiment, the measurement light L1 projected from the light projecting part 60 to the upper surface Fa of the annular frame F and reflected on the upper surface Fa of the annular frame F is reflected by the retroreflector 62 and the received light quantity when the light receiving part 61 receives the reflected light L2 reflected by the retroreflector 62, for example, is the Figure 9 received light quantity V1 shown as

[0083] And, in the present embodiment Figure 8The setting unit 90 shown sets the received light amount V1 stored in the storage unit 95 as the reference value V1 in the determination unit 92. This reference value V1 is a reference value regarding the received light amount received by the light receiving unit 61 that the determination unit 92 uses to determine whether the center of the tape T2 is pasted in alignment with the center of the annular frame F.

[0084] The determination unit 92 compares the received light amount V2 received by the light receiving unit 61 through the light projection to the first measurement point P1 and the received light amount V2 received by the light receiving unit 61 through the light projection to the second measurement point P2, which were previously obtained and stored in the RAM of the storage unit 95, with the received light amount V1 (reference value V1) stored in the storage unit 95 respectively. Here, the received light amount V2 is the amount of the reflected light L2 that the measurement light L1 irradiated by the light projection unit 60 is received by the light receiving unit 61 after being attenuated by passing through the tape T2, and thus is a value smaller than the received light amount V1.

[0085] Therefore, the determination unit 92 determines that Figure 6 the received light amount V2 received by the light receiving unit 61 through the light projection to the first measurement point P1 shown and the received light amount V2 received by the light receiving unit 61 through the light projection to the second measurement point P2 are respectively smaller than the received light amount V1 as the reference value, and determines that the tape T2 is pasted at the first measurement point P1 and the second measurement point P2 on the upper surface Fa of the annular frame F, and thus determines that the center of the tape T2 is pasted in alignment with the center of the annular frame F.

[0086] In addition, in the present embodiment, the above determination is made by irradiating the measurement light L1 to the first measurement point P1 and the second measurement point P2, but it is also possible to consider making the above determination by the determination unit 92 based on the data obtained by irradiating the measurement light L1 to the third measurement point P3 and the fourth measurement point P4 by the sensor 6.

[0087] In the present embodiment, the tape T2 is a transparent tape. In the case where the tape T2 is an opaque tape (colored tape), the received light amount received by the light receiving unit 61 through the light projection to Figure 6 the first measurement point P1 shown becomes Figure 9 the received light amount V3 shown. In addition, the received light amount received by the light receiving unit 61 through the light projection to the second measurement point P2 is Figure 9The received light amount V3 shown. The received light amount V3 is the amount of the reflected light L2 that the measurement light L1 irradiated by the light projecting unit 60 is received by the light receiving unit 61 due to absorption or scattering caused by the opaque tape, and thus is a value smaller than the received light amounts V1 and V2. Therefore, the determination unit 92 determines that the received light amount V3 received by the light receiving unit 61 through the light projection to the first measurement point P1 and the received light amount V3 received by the light receiving unit 61 through the light projection to the second measurement point P2 are respectively smaller than the received light amount V1 as a reference value, and determines that the tape T2 is pasted at the first measurement point P1 and the second measurement point P2, so that it can be determined that the tape T2 is pasted with its center coinciding with the center of the annular frame F.

[0088] For example, after the above determination by the determination unit 92 shown in Figure 8 is performed, the wafer group is stored in a wafer cassette by a transfer unit (not shown). The wafer cassette has a plurality of shelves, and one wafer group is stored on each shelf.

[0089] For example, the determination of the determination unit 92 in the case where the center of the tape T2 of the wafer group is not pasted coinciding with the center (center of the opening Fc) of the annular frame F as shown in Figure 7 will be described.

[0090] As shown in Figure 7 , by moving the annular frame holding table 20 to a specified coordinate position in the X-axis direction, the control unit 9 determines that the first measurement point P1 is located at a previously grasped coordinate position in the X-axis direction, that is, as shown in Figure 7 and Figure 10 , it is located on the optical axis of the light projecting unit 60 of the sensor 6. And an operation signal is sent from the control unit 9 to the sensor 6, and the light projecting unit 60 projects a thin-line-shaped measurement light L1 from obliquely above onto the first measurement point P1 with respect to the upper surface Fa of the annular frame F.

[0091] As shown in Figure 10 , when the light projecting unit 60 projects a thin-line-shaped measurement light L1 from obliquely above onto the first measurement point P1 with respect to the upper surface Fa of the annular frame F, there is no tape T2 at the first measurement point P1, so the measurement light L1 is directly reflected at the first measurement point P1 on the upper surface Fa of the annular frame F. The measurement light L1 reflected on the upper surface Fa of the annular frame F is reflected by the retroreflector 62, reflected again at the first measurement point P1, and received by the light receiving unit 61 near the light projecting unit 60. The received light amount received by the light receiving unit 61 is, for example, the received light amount V1 shown in Figure 9 . This is because there is no attenuation of the measurement light L1 accompanying transmission through the tape T2. The received light amount V1 is stored in the RAM of the storage unit 95 of the control unit 9.

[0092] Make Figure 7The shown annular frame holding table 20 further moves in the -X direction and moves to a specified coordinate position in the X-axis direction, so that the control unit 9 determines that as Figure 11 shown, the second measurement point P2 is positioned on the optical axis of the light projecting portion 60 of the sensor 6. And, the light projecting portion 60 of the sensor 6 projects a thin-line-shaped measurement light L1 from obliquely above toward the second measurement point P2 with respect to the upper surface Fa of the annular frame F.

[0093] As Figure 7 shown, the center of the tape T2 is offset toward the +X direction side with respect to the center of the annular frame F, so as Figure 11 shown, the measurement light L1 passes through the tape T2 and is reflected at the second measurement point P2 on the upper surface Fa of the annular frame F. The measurement light L1 reflected on the upper surface Fa of the annular frame F is reflected by the retroreflective plate 62, is reflected again at the second measurement point P2, and is received by the light receiving portion 61 near the light projecting portion 60. The amount of received light received by the light receiving portion 61 by projecting light onto the second measurement point P2 is the amount of the reflected light L2 received by the light receiving portion 61 due to the attenuation caused by the transmission of the measurement light L1 projected by the light projecting portion 60 through the tape T2, so it is Figure 9 the shown amount of received light V2.

[0094] The determination unit 92 compares the amount of received light V1 received by the light receiving portion 61 by projecting light onto the first measurement point P1 and the amount of received light V2 received by the light receiving portion 61 by projecting light onto the second measurement point P2, which are stored in the RAM of the storage unit 95, with the amount of received light V1 as a reference value stored in the ROM of the storage unit 95 respectively. And, the determination unit 92 determines that the amount of received light V1 received by the light receiving portion 61 by projecting light onto the first measurement point P1 is equal to or more than (i.e., the same as) the amount of received light V1 as the reference value, and determines that the tape T2 is not pasted at the first measurement point P1, so it is determined that the center of the tape T2 is not pasted in agreement with the center of the annular frame F.

[0095] In addition, in the present embodiment, the above determination is made by irradiating the measurement light L1 to the first measurement point P1 and the second measurement point P2, but data obtained by irradiating the measurement light L1 to the third measurement point P3 and the fourth measurement point P4 can also be considered, and the above determination is made by the determination unit 92.

[0096] When the determination unit 92 determines that the center of the tape T2 is not pasted in agreement with the center of the annular frame F, an alarm sound is emitted or an error is displayed, etc., to notify the operator of this determination. After the above determination is implemented by the determination unit 92, the determined defective wafer group is stored in a wafer cassette by a transfer unit (not shown), and the operator can grasp the position of the shelf of the wafer cassette storing the defective wafer group, so the defective wafer group can be removed from the wafer cassette later.

[0097] For example, the control unit 9 can also store the number of shelves of the cassette that houses the defective wafer group.

[0098] In addition, there may be a extraction workbench for placing the defective wafer group, and the defective wafer group is transported to the extraction workbench by a transport unit (not shown).

[0099] As described above, the taping machine 1 of the present embodiment includes: a sensor 6 having a light projecting portion 60 that projects measurement light L1 to a measurement point in a region on the upper surface Fa of the annular frame F where the tape T2 should be pasted, and a light receiving portion 61 that receives the reflected light L2 reflected at the measurement point; a setting portion 90 that sets a reference value for the amount of received light received by the light receiving portion 61; and a determination portion 92. When the amount of received light received by the light receiving portion 61 is less than the reference value, the determination portion 92 determines that the tape T2 is pasted at the measurement point. When the amount of received light received by the light receiving portion 61 is equal to or greater than the reference value, the determination portion 92 determines that the tape T2 is not pasted at the measurement point. Therefore, it is possible to confirm whether the center of the tape T2 is pasted in alignment with the center of the annular frame F. Conventionally, a transmissive sensor has been used to confirm the portion of the annular frame F where the tape T2 is not pasted, but it has been impossible to confirm whether the center of the tape T2 is pasted in alignment with the center of the annular frame F. In other words, it has been impossible to confirm whether there is a position where the pasting area of the tape T2 is partially narrowed around the opening Fc of the annular frame F. However, in the taping machine 1 of the present embodiment, for example, the measurement point measured by the sensor 6 is set in a region slightly outside the opening Fc of the annular frame F (the region where the tape T2 should be pasted). Thus, if there is a portion where the pasting area of the tape T2 with respect to the annular frame F is narrowed (the portion where the tape T2 is not pasted at the measurement point), the amount of received light of the reflected light L2 from the annular frame F received by the light receiving portion 61 is equal to or greater than the reference value. Therefore, the determination portion 92 can determine that there is a position where the pasting area of the tape T2 is partially narrowed, and there is a portion where the tape T2 is likely to peel off from the annular frame F.

[0100] The taping machine 1 of the present embodiment further includes a storage portion 95 that stores the amount of received light when the light receiving portion 61 receives the reflected light L2 that reflects the measurement light L1 on the upper surface Fa of the annular frame F. The setting portion 90 sets the value stored in the storage portion 95 as the reference value. Therefore, it is possible to appropriately set the reference value used by the determination portion 92 to determine whether the center of the tape T2 is pasted in alignment with the center of the annular frame F.

[0101] In the tape applicator 1 of the present embodiment, the sensor 6 includes: a light projecting unit 60 that projects measurement light L1 obliquely downward from above the upper surface Fa of the annular frame F toward the measurement point; a retroreflective plate 62 that is disposed at a position symmetric to the light projecting unit 60 with respect to the measurement point and reflects the measurement light L1 reflected at the measurement point back toward the measurement point (retroreflection); and a light receiving unit 61 that receives, near the light projecting unit 60, the reflected light L2 that is further reflected at the measurement point after being reflected by the retroreflective plate 62. Thus, regardless of whether the tape T2 is a transparent tape or an opaque tape, the determination unit 92 can determine that the tape T2 is pasted at the measurement point when the amount of received light received by the light receiving unit 61 is less than the reference value, and can determine that the tape T2 is not pasted at the measurement point when the amount of received light received by the light receiving unit 61 is equal to or greater than the reference value, thereby being able to determine whether the center of the tape T2 is pasted in alignment with the center of the annular frame F.

[0102] Figure 1 The tape applicator 1 shown, for example, when the tape pasted on the annular frame F is not the transparent tape T2 but a colored tape T3 that is opaque to visible light (refer to Figure 12 ), may include the sensor 6A of the second embodiment described below instead of the sensor 6 of the first embodiment. Figure 12 and Figure 13 shown.

[0103] The sensor 6A of the second embodiment is, for example, a limited reflection type photoelectric sensor. The sensor 6A includes: a light projecting unit 66 that projects measurement light L3 obliquely downward from above the upper surface Fa of the annular frame F toward the measurement point; and a light receiving unit 67 that is disposed at a position symmetric to the light projecting unit 66 with respect to the measurement point and receives the reflected light L4 reflected at the measurement point.

[0104] The sensor 6A is, for example, arranged above the annular frame holding table 20 in a state where it has moved in the -X direction to pass through the position of the pasting unit 22 shown in Figure 1 and is opposed to the upper surface 20a of the annular frame holding table 20 in the Z-axis direction. The light projecting unit 66 is, for example, arranged at a portion on the +Y direction side of the housing 63 as shown in Figure 12 . For example, the light projecting unit 66 causes the light emitted from the built-in light source to pass through a rectangular slit, and converts the transmitted light of the slit into parallel light (measurement light L3) through a collimating lens, and can irradiate the measurement light L3 obliquely downward while ensuring a predetermined width. In addition, for example, the incident angle of the measurement light L3 with a predetermined width can be adjusted by an adjustment unit (not shown). In addition, the measurement light L3 can form a cylindrical shape with a predetermined width as the diameter.

[0105] For example, the first measurement point P1 and the second measurement point P2 of the annular frame F set in a centered state on the upper surface 20a of the annular frame holding table 20 are positioned on the center line of the annular frame holding table 20 parallel to the X-axis direction. And, the light receiving part 67 is disposed, for example, on the -Y direction side part of the housing 63 with the center line of the annular frame holding table 20 parallel to the X-axis direction as the axis of symmetry. When the annular frame holding table 20 is moved in the -X direction by the worktable moving unit 13 shown in Figure 1 to position the first measurement point P1 on the optical axis of the light projecting part 66, the light receiving part 67 becomes a state of being disposed at a position symmetric with the light projecting part 66 in the Y-axis direction with respect to the first measurement point P1.

[0106] Hereinafter, a case where the determination unit 92 in the taping machine 1 having the sensor 6A of the second embodiment determines whether the center of the tape T3 shown in Figure 12 coincides with the center of the annular frame F (the center of the opening Fc) when pasting will be described.

[0107] Under the control of the control unit 9 shown in Figure 1 , the annular frame holding table 20 fed in the -X direction by the worktable moving unit 13 pastes the tape T3 shown in Figure 12 on the annular frame F through the pasting unit 22, and then further moves the annular frame holding table 20 in the -X direction to a predetermined coordinate position in the X-axis direction.

[0108] Since the annular frame F is centered on the annular frame holding table 20, by moving the annular frame holding table 20 to a predetermined coordinate position in the X-axis direction, the control unit 9 determines that the first measurement point P1 is positioned at a previously grasped coordinate position in the X-axis direction, that is, as shown in Figure 12 and Figure 13 , positioned on the optical axis of the light projecting part 66 of the sensor 6A. And, an operation signal is sent from the control unit 9 to the sensor 6A electrically connected to the control unit 9, and the light projecting part 66 projects the measurement light L3 with a predetermined width from obliquely above onto the upper surface Fa of the annular frame F toward the first measurement point P1.

[0109] Regarding the limited reflection type sensor 6A, the light projecting part 66 and the light receiving part 67 cross at the same inclination angle, and the light receiving part 67 receives only the regular reflection light in a limited area where their optical axes cross, that is, at a certain limited distance. And, the height positions and the like of the light projecting part 66 and the light receiving part 67 are set in advance, for example, in such a manner that the light receiving part 67 receives the reflection light L4 directly reflected on the upper surface Fa of the annular frame F.

[0110] Therefore, as shown in Figure 12As shown, when the center of the tape T3 is adhered so as to coincide with the center of the annular frame F (the center of the opening Fc), as Figure 13 shown, the measurement light L3 is reflected from the upper surface of the tape T3 adhered to the upper surface Fa of the annular frame F at the first measurement point P1. Therefore, the light receiving portion 67 hardly receives the reflected light L4 of the measurement light L3. Thus, the amount of received light received by the light receiving portion 67 by projecting light onto the first measurement point P1 is, for example, Figure 14 the small amount of received light V4 shown. The measured amount of received light V4 is stored in the RAM of the storage unit 95 of the control unit 9.

[0111] Make Figure 12 shown annular frame holding table 20 further move in the -X direction and move to a predetermined coordinate position in the X-axis direction, so that the control unit 9 determines that the second measurement point P2 is located on the optical axis of the light projecting portion 66 of the sensor 6A. And the light projecting portion 66 of the sensor 6A projects a measurement light L3 with a predetermined width onto the second measurement point P2 from obliquely above with respect to the upper surface Fa of the annular frame F.

[0112] As Figure 12 shown, when the center of the tape T3 is adhered so as to coincide with the center of the annular frame F, the measurement light L3 is reflected from the upper surface of the tape T3 adhered to the upper surface Fa of the annular frame F at the second measurement point P2. Therefore, the light receiving portion 67 hardly receives the reflected light L4 of the measurement light L3. Thus, the amount of received light received by the light receiving portion 67 by projecting light onto the second measurement point P2 is, for example, Figure 14 the received light amount V4 shown.

[0113] The amount of received light when the light receiving portion 67 receives the reflected light L4 projected by the light projecting portion 66 and reflected on the upper surface Fa of the annular frame F, which is obtained through past experiments etc. and stored in the ROM of the storage unit 95, is, for example, Figure 14 the received light amount V5 shown.

[0114] And, in the present embodiment, Figure 13 shown setting unit 90 sets the received light amount V5 stored in the storage unit 95 as the reference value V5 regarding the amount of received light received by the light receiving portion 67 for the determination unit 92 to determine whether the center of the tape T3 is adhered so as to coincide with the center of the annular frame F, and sets it in the determination unit 92.

[0115] The determination unit 92 compares the amount of received light V4 received by the light receiving portion 67 by projecting light onto the first measurement point P1 and the amount of received light V4 received by the light receiving portion 67 by projecting light onto the second measurement point P2, which are previously obtained and stored in the RAM of the storage unit 95, with the received light amount V5 (reference value V5) stored in the storage unit 95 respectively. And the determination unit 92 determines that by projecting light onto Figure 12 and Figure 13The amount of received light V4 received by the light-receiving unit 67 from the projected light on the first measurement point P1 shown and the amount of received light V4 received by the light-receiving unit 67 from the projected light on the second measurement point P2 are each less than the amount of received light V5 as a reference value. It is determined that the tape T3 is pasted on the first measurement point P1 and the second measurement point P2 on the upper surface Fa of the annular frame F, and thus it is determined that the center of the tape T3 is pasted in coincidence with the center of the annular frame F.

[0116] In addition, in the present embodiment, the above determination is made by irradiating the measurement light L3 on the first measurement point P1 and the second measurement point P2. However, it is also possible to consider the data obtained by irradiating the measurement light L3 on the third measurement point P3 and the fourth measurement point P4 based on the sensor 6A, and the determination unit 92 makes the above determination.

[0117] For example, after Figure 13 the above determination is made by the determination unit 92 shown, the wafer group is stored in a wafer cassette by a transfer unit (not shown). The wafer cassette has a plurality of shelves, and one wafer group is stored on each shelf.

[0118] For example, for the case where Figure 15 as shown, the center of the tape T3 of the wafer group is not pasted in coincidence with the center of the annular frame F will be described.

[0119] As Figure 15 and Figure 16 shown, by moving the annular frame holding table 20 to a specified coordinate position in the X-axis direction, the control unit 9 determines that the first measurement point P1 is located on the optical axis of the light-projecting unit 66 of the sensor 6A. And, as Figure 16 shown, an operation signal is sent from the control unit 9 to the sensor 6A, and the light-projecting unit 66 of the sensor 6A projects a measurement light L3 with a specified width from obliquely above onto the upper surface Fa of the annular frame F toward the first measurement point P1.

[0120] As Figure 16 shown, when the light-projecting unit 66 projects a measurement light L3 with a specified width from obliquely above onto the upper surface Fa of the annular frame F toward the first measurement point P1, there is no tape T3 at the first measurement point P1, so the measurement light L3 is reflected on the upper surface Fa of the annular frame F at the first measurement point P1. The measurement light L3 reflected on the upper surface Fa of the annular frame F is received by the light-receiving unit 67. The amount of received light received by the light-receiving unit 61 is, for example, Figure 14 the amount of received light V5 shown. The amount of received light V5 is stored in the RAM of the storage unit 95 of the control unit 9.

[0121] Make Figure 15 the annular frame holding table 20 shown further move in the -X direction and move to a specified coordinate position in the X-axis direction, so that the control unit 9 determines that asFigure 17 As shown, the second measurement point P2 is positioned on the optical axis of the light projecting section 66 of the sensor 6A. Further, the light projecting section 66 of the sensor 6A projects measurement light L3 of a prescribed width obliquely upward from the upper surface Fa of the annular frame F toward the second measurement point P2.

[0122] As Figure 17 shown, the measurement light L3 is reflected by the upper surface of the tape T3 adhered to the upper surface Fa of the annular frame F at the second measurement point P2. Thus, the light receiving section 67 hardly receives the reflected light L4 of the measurement light L3. Accordingly, the amount of received light received by the light receiving section 67 by projecting light onto the second measurement point P2 is, for example, Figure 14 the small amount of received light V4 shown.

[0123] Figure 15 The determination section 92 shown compares the amount of received light V5 received by the light receiving section 67 by projecting light onto the first measurement point P1 and the amount of received light V4 received by the light receiving section 67 by projecting light onto the second measurement point P2, which are stored in the RAM of the storage section 95, with the amount of received light V5 as a reference value stored in the ROM of the storage section 95, respectively. Further, the determination section 92 determines that the amount of received light V5 received by the light receiving section 67 by projecting light onto the first measurement point P1 is equal to or greater than (i.e., the same as) the amount of received light V5 as the reference value, and determines that the tape T3 is not adhered to the first measurement point P1, and thus determines that the center of the tape T3 is not adhered to coincide with the center of the annular frame F.

[0124] In addition, in the present embodiment, the above determination is made by irradiating the measurement light L3 onto the first measurement point P1 and the second measurement point P2. However, it is also possible to consider obtaining data by irradiating the measurement light L3 onto the third measurement point P3 and the fourth measurement point P4, and the determination section 92 makes the above determination.

[0125] When the determination section 92 determines that the center of the tape T3 is not adhered to coincide with the center of the annular frame F, an alarm sound is emitted or an error is displayed to notify the operator of the determination. After the above determination is performed by the determination section 92, the determined defective wafer group is stored in a wafer cassette by a transfer unit (not shown). However, since the operator can identify the position of the shelf of the wafer cassette storing the defective wafer group, the defective wafer group can be removed from the wafer cassette thereafter.

[0126] For example, the control unit 9 may also store the layer number of the shelf of the wafer cassette storing the defective wafer group.

[0127] In addition, an extraction worktable for placing the defective wafer group may be provided, and the defective wafer group is transferred to the extraction worktable by a transfer unit (not shown).

[0128] In addition, the tape applicator 1 of the present invention is not limited to the above-described embodiments, and the structures and the like illustrated in the accompanying drawings are also not limited thereto, and can be appropriately changed within the range in which the effects of the present invention can be exhibited.

Claims

1. A taping machine, wherein, the taping machine includes: a ring frame holding workbench for holding a ring frame; a wafer holding workbench for holding a wafer within the opening of the ring frame; a pasting unit for pasting a circular tape onto the upper surface of the ring frame held by the ring frame holding workbench and the upper surface of the wafer held by the wafer holding workbench; a sensor having a light projecting portion for projecting measuring light onto a measuring point in the area on the upper surface of the ring frame where the tape should be pasted, and a light receiving portion for receiving the reflected light reflected at the measuring point; a setting unit for setting a reference value regarding the amount of received light received by the light receiving portion; and a judging unit for judging that the tape is pasted at the measuring point when the amount of received light received by the light receiving portion is less than the reference value, and judging that the tape is not pasted at the measuring point when the amount of received light received by the light receiving portion is equal to or greater than the reference value. The area where the tape should be pasted is a circular area where the tape is pasted on the ring frame when the center of the tape coincides with the center of the ring frame. At least two measuring points are set, and the measuring points are symmetrically set around the center of the opening of the ring frame in the feeding direction of the tape.

2. The taping machine according to claim 1, wherein, two additional measuring points are symmetrically set around the center of the ring frame in a direction perpendicular to the feeding direction of the tape.

3. The taping machine according to claim 1 or 2, wherein, the taping machine further has a storage unit for storing the amount of received light when the light receiving portion receives the reflected light that reflects the measuring light on the upper surface of the ring frame, and the setting unit sets the value stored in the storage unit as the reference value.

4. The taping machine according to claim 1 or 2, wherein, the sensor has: the light projecting portion for projecting the measuring light onto the measuring point from obliquely above the upper surface of the ring frame; a retroreflective plate disposed symmetrically with respect to the measuring point to the light projecting portion, for reflecting the measuring light reflected at the measuring point back toward the measuring point; and the light receiving portion for receiving, near the light projecting portion, the reflected light that is further reflected at the measuring point by the retroreflective plate.

5. The taping machine according to claim 1 or 2, wherein, the sensor has: the light projecting portion for projecting the measuring light onto the measuring point from obliquely above the upper surface of the ring frame; and the light receiving portion disposed symmetrically with respect to the measuring point to the light projecting portion, for receiving the reflected light reflected at the measuring point.

Images