Semiconductor device and method

Abstract

A semiconductor device and a method of manufacturing the same. The device includes an encapsulation. The device further includes a semiconductor die in the encapsulation. The device additionally includes electromagnetic radiation transmitting and receiving components in the encapsulation. The device also includes an intermediate portion having a first surface and a second surface. The first surface is attached to the encapsulation. The device further includes an antenna portion attached to the second surface of the intermediate portion. The antenna portion includes one or more openings for transmitting electromagnetic radiation. The intermediate portion includes one or more corresponding openings aligned with the openings of the antenna portion. Each opening of the antenna portion and each corresponding opening of the intermediate portion form an electrically adjacent channel for transmitting the electromagnetic radiation to the electromagnetic radiation transmitting and receiving components in the encapsulation.

Description

Technical Field

[0001] This specification relates to a semiconductor device and method. Background Art

[0002] Today, the integration level of millimeter-wave transceivers in small form factor integrated circuits (ICs) is increasing. Typical applications of such devices include automotive RADAR and 5G communication systems. For example, a RADAR IC with an integrated transmitter and receiver can be used for automotive radar applications at 77 GHz. In addition, multiple-input multiple-output (MIMO) operation is achieved using large array antennas. This technology is widely used in modern radar and communication systems.

[0003] Millimeter-wave packaged transceiver ICs are typically soldered onto a printed circuit board (PCB). Figure 1 And 2 Examples of such devices are shown in

[0004] Figure 1 The example device 11 in includes a semiconductor die 30 located within an encapsulation 20. The device 11 also includes radiation transmitting and receiving components 24. For example, the radiation transmitting and receiving components 24 may include a metal portion (e.g., see the connection 25 in Figure 1 located within the encapsulation 20 and electrically connected to the semiconductor die 30).

[0005] The encapsulation 20 is mounted on a substrate 40 such as a printed circuit board (PCB) using solder balls 42. The solder balls 42 provide mechanical attachment of the encapsulation 20 to the substrate 40 and also provide an electrical connection between the encapsulation 20 containing the die 30 and the substrate 40.

[0006] The semiconductor device 11 also includes an antenna portion 2 which, in this example, includes a slot antenna array having a plurality of slots 4. The antenna portion 2 is at least partially metallic. The antenna portion 2 is located on the side of the encapsulation 20 opposite the substrate 40.

[0007] As shown in Figure 1 the slots 4 form openings aligned with the radiation transmitting and receiving components 24 such that electromagnetic radiation propagating along the slots 4 impinges on the radiation transmitting and receiving components 24.

[0008] Figure 2 The example device 11 in also includes a semiconductor die 30 located within an encapsulation 20. The device 11 also includes radiation transmitting and receiving components 24. For example, the radiation transmitting and receiving components 24 may include a metal portion (e.g., see the connection 25 in Figure 2 located within the encapsulation 20 and electrically connected to the semiconductor die 30).

[0009] Similarly, the encapsulant 20 is mounted on a substrate 40, such as a printed circuit board (PCB), using solder balls 42. The solder balls 42 provide mechanical attachment of the encapsulant 20 to the substrate 40 and also provide electrical connection between components within the encapsulant 20 and the substrate 40.

[0010] The semiconductor device 11 also includes an antenna portion 2 which, in this example, also includes a slot antenna array having a plurality of slots 4. Also, the antenna portion 2 is at least partially metallic.

[0011] As Figure 1 shown, the slots 4 form openings aligned with the radiation transmitting and receiving component 24. It should be noted that, in this example, the antenna portion 2 is mounted on the side of the substrate 40 opposite to the side of the substrate 40 on which the encapsulant 20 is mounted. In this example, the substrate 40 includes an opening 44 which is lined with metal 46. The opening 44 is aligned with the slots 4 and the radiation transmitting and receiving component 24 such that electromagnetic radiation propagating along the slots 4 is incident on the radiation transmitting and receiving component 24 via the opening.

[0012] It will be appreciated that Figure 1 and Figure 2 the examples in

[0013] allow transmission and reception of radiation from "above" or "below" the encapsulant 20. Figure 1 and 2 In both examples in Figure 1 ), there is an air gap 50 between the radiation transmitting and receiving component 24 of the device and the antenna portion 2 ( Figure 2 ). This air gap 50 causes a discontinuity in the surface current flowing between the radiation transmitting and receiving component 24 and the antenna portion 2, resulting in mismatch, higher insertion loss, and radiation, thus reducing the isolation between the radiation transmitting and receiving components 24 in the device 11. In communication and radar systems, high isolation (>30 dB) is typically required between millimeter wave channels. SUMMARY OF THE INVENTION

[0014] According to aspects of the present disclosure, there is provided a semiconductor device including:

[0015] an encapsulant;

[0016] a semiconductor die within the encapsulant;

[0017] an electromagnetic radiation transmitting and receiving component within the encapsulant;

[0018] an intermediate portion having a first surface and a second surface, wherein the first surface is attached to the encapsulant; and

[0019] An antenna portion, the antenna portion being attached to the second surface of the intermediate portion,

[0020] wherein the antenna portion includes one or more openings for transmitting electromagnetic radiation,

[0021] wherein the intermediate portion includes one or more corresponding openings aligned with the openings of the antenna portion, and

[0022] wherein each opening of the antenna portion and each corresponding opening of the intermediate portion form an electrically adjacent channel for transmitting the electromagnetic radiation to the electromagnetic radiation transmitting and receiving components in the encapsulation.

[0023] According to another aspect of the present disclosure, a method of manufacturing a semiconductor device is provided, the method comprising:

[0024] Encapsulating a semiconductor die and electromagnetic radiation transmitting and receiving components in an encapsulation;

[0025] Providing an intermediate portion having a first surface and a second surface;

[0026] Attaching the first surface of the intermediate portion to the encapsulation;

[0027] Providing an antenna portion; and

[0028] Attaching the antenna portion to the second surface of the intermediate portion,

[0029] wherein the antenna portion includes one or more openings for transmitting electromagnetic radiation,

[0030] wherein the intermediate portion includes one or more corresponding openings aligned with the openings of the antenna portion, and

[0031] wherein each opening of the antenna portion and each corresponding opening of the intermediate portion form an electrically adjacent channel for transmitting the electromagnetic radiation to the electromagnetic radiation transmitting and receiving components in the encapsulation.

[0032] Providing an electrically adjacent channel for transmitting electromagnetic radiation from the antenna portion to the electromagnetic radiation transmitting and receiving components in the encapsulation can avoid mismatches, insertion losses, and radiation associated with the presence of an air gap located between the encapsulation and the antenna portion in the semiconductor device.

[0033] The intermediate portion may include a conductive elastomer. This may allow the antenna portion and the encapsulation to be attached together in such a way that the intermediate portion can absorb mechanical stress between the antenna portion and the encapsulation. Using the conductive elastomer in this way can also improve the flatness tolerance of the surfaces of the antenna portion and the encapsulation facing each other. The conductive elastomer can also act as a heat sink, transferring heat from the encapsulation and components located therein to the antenna portion. In addition, the conductive elastomer can act as a shielding layer to prevent EMC / EMI radiation.

[0034] The intermediate portion may include a layer of the conductive elastomer. This can simplify the manufacturing process.

[0035] The electromagnetic radiation transmitting and receiving components may include one or more conductive portions aligned with the opening of the antenna portion and the corresponding opening of the intermediate portion for transmitting and receiving the electromagnetic radiation.

[0036] The encapsulation may include one or more openings lined with a conductive material. The opening or each opening may be aligned with a corresponding one of the electrically adjacent channels for transmitting the electromagnetic radiation within the encapsulation. Again, this can allow the electromagnetic radiation to be transmitted without experiencing losses associated with gaps in the path through which the radiation passes.

[0037] Each of the conductive portions for receiving the electromagnetic radiation is at least partially located in a corresponding one of the openings in the encapsulation.

[0038] The encapsulation may be additionally attached to a substrate.

[0039] The intermediate portion may include a lead frame. This can enable a flip-chip arrangement in the encapsulation.

[0040] The intermediate portion may additionally include a printed circuit board (PCB). The lead frame may be located between the encapsulation and the printed circuit board. The printed circuit board may be located between the lead frame and the antenna portion. The lead frame and the printed circuit board may each include one or more openings that form the corresponding openings of the intermediate portion aligned with the one or more openings of the antenna portion.

[0041] The encapsulation may include one or more electrical connections for electrically connecting the semiconductor die to corresponding connections on the lead frame.

[0042] When viewed in a direction parallel to the surface normal of the first surface of the middle portion, the opening of the antenna portion and the corresponding opening of the middle portion have substantially the same cross-sectional shape and size. Matching the shapes of the various openings prevents discontinuities in the path through which electromagnetic radiation passes, thereby reducing losses. For example, the cross-sectional shape may be square, rectangular, circular, or oval.

[0043] The device may include at least one loop, the at least one loop including a conductive material that surrounds the electrically adjacent channel to prevent leakage of the electromagnetic radiation from the electrically adjacent channel. In some embodiments, the loop may be located in the dielectric portion of the lead frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Hereinafter, embodiments of the present disclosure will be described by way of example only, with reference to the accompanying drawings, in which like reference numerals refer to like elements, and in which:

[0045] Figure 1 An example of a semiconductor device is shown;

[0046] Figure 2 Another example of a semiconductor device is shown;

[0047] Figure 3 A semiconductor device according to an embodiment of the present disclosure is shown;

[0048] Figure 4 A semiconductor device according to an embodiment of the present disclosure is shown;

[0049] Figure 5 An arrangement of openings in an elastomeric layer according to an embodiment of the present disclosure is shown;

[0050] Figure 6 A semiconductor device according to another embodiment of the present disclosure is shown;

[0051] Figure 7 A semiconductor device according to another embodiment of the present disclosure is shown;

[0052] Figure 8 A semiconductor device according to another embodiment of the present disclosure is shown;

[0053] Figures 9A to 9D Each shows an arrangement of openings in a semiconductor device according to another embodiment of the present disclosure;

[0054] Figure 10 An arrangement of openings in a semiconductor device according to another embodiment of the present disclosure is shown; and

[0055] Figure 11Shows the arrangement of solder balls around an opening in a semiconductor device according to another embodiment of the present disclosure. Detailed Description

[0056] Embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0057] Figure 3 Shows a semiconductor device 10 according to an embodiment of the present disclosure.

[0058] Figure 3 The device 10 in includes a semiconductor die 30 located in an encapsulation 20. The device 10 also includes one or more radiation transmitting and receiving components 24. For example, the radiation transmitting and receiving components 24 may include metal portions located in the encapsulation 20 and electrically connected to the semiconductor die 30 (these connections are not shown in Figure 3 .

[0059] In this embodiment, the encapsulation 20 is mounted on a substrate 40 such as a printed circuit board (PCB) using solder balls 42. The solder balls 42 provide mechanical attachment of the encapsulation 20 to the substrate 40 and also provide electrical connection between components located in the encapsulation 20 and the substrate 40. It should be noted that the encapsulation 20 may have pads on its bottom side (i.e., the side facing the substrate 40) that are electrically connected to the solder balls. The semiconductor die 30 can be electrically connected to the pads using redistribution layers, bond wires, etc.

[0060] The semiconductor device 10 also includes an antenna portion 2 which, in this example, includes a slot antenna array having a plurality of slots 4. The antenna portion 2 is conductive (e.g., at least partially metallic). In this embodiment, the antenna portion 2 is located on the side of the encapsulation 20 opposite to the substrate 40.

[0061] As Figure 3 shown, the slots 4 form openings aligned with the radiation transmitting and receiving components 24 such that electromagnetic radiation transmitted along the slots 4 is incident on the radiation transmitting and receiving components 24.

[0062] The semiconductor device 10 also includes an intermediate portion 60. The intermediate portion is located between the encapsulation 20 and the antenna portion 2. Specifically, the intermediate portion 60 has a first surface attached to the encapsulation 20 (the "top side" of the encapsulation 20 in this embodiment), and a second surface (on the opposite side of the intermediate portion 60) attached to the antenna portion 2 (the "bottom side" of the antenna portion 2).

[0063] The intermediate portion 60 includes one or more openings 62. The openings 62 are aligned with the openings formed by the slots 4 of the antenna portion 2. It should be noted that in this embodiment, the openings 62 are also aligned with the radiation transmitting and receiving components 24 in the encapsulation 20, whereby the openings formed by the slots 4, the openings 62, and the radiation transmitting and receiving components 24 are all aligned. This allows electromagnetic radiation to be transmitted to / from the radiation transmitting and receiving components 24 in the encapsulation 20 through the antenna portion 2 and the intermediate portion 60.

[0064] As can be seen from Figure 3 , in this embodiment, the intermediate portion 60 completely fills the space between the encapsulation 20 and the antenna portion 2. Because of this, there is no air gap between the encapsulation 20 and the antenna portion 2. Each opening formed by the slot 4 of the antenna portion 2 and each corresponding opening 62 in the intermediate portion can thus form an electrically adjacent channel for transmitting electromagnetic radiation to the radiation transmitting and receiving components 24 in the encapsulation 20. In this way, mismatches, insertion losses, and radiation associated with the example shown in Figure 1 and Figure 2 can be prevented.

[0065] In this embodiment, the intermediate portion 60 is provided in the form of a layer. The layer can be thinner than the width of the encapsulation 20 and / or the antenna portion 2. The intermediate portion 60 can also perform the function of providing a method for attaching the antenna portion 2 to the encapsulation 20.

[0066] In some embodiments, it is contemplated that the intermediate portion 60 can be provided in the form of a ring (e.g., in the form of a gasket) around the opening. This can allow less material to be used and can reduce the mechanical stress between the antenna portion 2 and the encapsulation 20.

[0067] In this embodiment, the intermediate portion includes an elastomer. The elastomer is conductive to allow the implementation of the electrically adjacent channel for electromagnetic radiation mentioned above. For example, the conductive elastomer can include silicone, fluorosilicone, or polyurethane filled with conductive particles, and the conductive particles can include, for example, Ag, Cu, Al, Ni carbon fibers, etc. The use of the conductive elastomer can also mount the antenna portion 2 on the encapsulation 20 in such a way that the mechanical stress between the encapsulation 20 and the antenna portion 2 can be absorbed by the intermediate portion 60.

[0068] Figure 4 A semiconductor device 10 according to another embodiment of the present disclosure is shown. In some aspects, the semiconductor device 10 in this embodiment is similar to the embodiment shown in Figure 3 .

[0069] Figure 4The device 10 therein includes a semiconductor die 30 located in an encapsulant 20. The device includes one or more radiation emitting and receiving components 24. The radiation emitting and receiving components 24 in this embodiment include an opening in the encapsulant 20. The opening may be lined with a conductive material (e.g., metal or alloy). The radiation emitting and receiving components 24 in this embodiment further include a millimeter wave interface 70 (e.g., dipole or anti-shorted). The interface 70 may extend laterally within the encapsulant 20, as Figure 4 shown. The antenna is electrically connected to the semiconductor die 30. In this way, electromagnetic radiation can be transmitted through the antenna portion 102 and the intermediate portion 60, and the electromagnetic radiation is provided to the antenna for signal transmission and reception in the semiconductor die 30.

[0070] In this embodiment, the encapsulant 20 is mounted on a substrate 40 such as a printed circuit board (PCB) using solder balls 42. For example, the substrate may include FR4. The solder balls 42 provide mechanical attachment of the encapsulant 20 to the substrate 40 and may also provide an electrical connection between the components within the encapsulant 20 and the substrate 40. Similarly, the encapsulant 20 may include pads on its bottom side (i.e., the side facing the substrate 40) that are electrically connected to the solder balls. The semiconductor die 30 may be electrically connected to the pads using redistribution layers, bond wires, etc.

[0071] The semiconductor device 10 further includes an antenna portion 102 which, in this example, includes a three-dimensional (3D) antenna. The antenna portion 102 includes an opening 104 for transmitting electromagnetic radiation into the radiation emitting and receiving components 24 in the encapsulant 20. The antenna portion 102 is conductive (e.g., at least partially metallic). In this embodiment, the portion of the antenna portion 102 having the opening 104 is located on the side of the radiation emitting and receiving components 24 opposite to the substrate 40. The antenna portion 102 may further include a peripheral portion that is attached to the substrate 40 for additional mechanical stability.

[0072] As Figure 4 shown, the opening 104 is aligned with the radiation emitting and receiving components 24 such that the electromagnetic radiation transmitted along the opening 104 is incident on the radiation emitting and receiving components 24.

[0073] Similarly, the semiconductor device 10 includes an intermediate portion 60 that is located between the encapsulant 20 and the portion of the antenna portion 102 having the opening 104. Specifically, the intermediate portion 60 has a first surface attached to the encapsulant 20 (the "top side" of the encapsulant 20 in this embodiment), and a second surface (on the opposite side of the intermediate portion 60) attached to the portion of the antenna portion 102 having the opening 104 (the "bottom side").

[0074] Similarly, the intermediate portion 60 includes one or more openings 62. The openings 62 are aligned with the openings 104 of the antenna portion 102. It should be noted that, in this embodiment, the openings 62 are also aligned with the radiation transmitting and receiving components 24 in the encapsulation 20, whereby the openings 104, the openings 62, and the radiation transmitting and receiving components 24 are all aligned. This allows electromagnetic radiation to be transmitted to / from the radiation transmitting and receiving components 24 in the encapsulation 20 through the antenna portion 102 and the intermediate portion 60.

[0075] As can be seen from Figure 4 it, the intermediate portion 60 in this embodiment also completely fills the space between the encapsulation 20 and the antenna portion 102. Similarly, because of this, there is no air gap between the encapsulation 20 and the antenna portion 102. Each opening 104 and each corresponding opening 62 in the intermediate portion can thus form an electrically adjacent channel for transmitting electromagnetic radiation to the radiation transmitting and receiving components 24 in the encapsulation 20. In this way, mismatches, insertion losses, and radiation associated with the example shown in Figure 1 and Figure 2 can also be prevented. As mentioned above with respect to the embodiment of Figure 3 , it is contemplated that the intermediate portion can be in the form of a ring around the opening (e.g., similar to a gasket).

[0076] In the present embodiment, the intermediate portion 60 is also provided in the form of a layer. The layer can be thinner than the width of the encapsulation 20 and / or the antenna portion. The intermediate portion 60 can also perform the function of providing a method for attaching the antenna portion 102 to the encapsulation 20, noting that the antenna portion can also be attached to the substrate 40 at its periphery.

[0077] In this embodiment, the intermediate portion also includes an elastomer. The elastomer is conductive to allow the implementation of the electrically adjacent channel for electromagnetic radiation mentioned above. The use of the elastomer can also mount the antenna portion 102 on the encapsulation 20 in such a way that the mechanical stress between the encapsulation 20 and the antenna portion 102 can be absorbed by the intermediate portion 60.

[0078] Figure 5 is a view of the semiconductor device 10 observed along the direction of the surface normal parallel to the above-mentioned first surface of the intermediate portion 60, Figure 5 showing the openings 62 in the intermediate portion 60 and Figure 3 and 4Alignment of the radiation transmitting and receiving component 24 in the encapsulant 20 in the embodiment. It should be noted that the radiation transmitting and receiving component 24 may have a size and shape similar to or the same as the opening 62 in the intermediate portion 60. The size and shape of the radiation transmitting and receiving component 24 and the opening 62 in the intermediate portion 60 may also match the size and shape of the opening 4 / 104 in the antenna portion 2 / 102.

[0079] Figure 6 FIG. shows a semiconductor device 10 according to another embodiment of the present disclosure. Although in Figures 3 to 5 the embodiment, the antenna portion 2 / 102 is located on the side of the encapsulant 20 opposite to the substrate 40 (“top side”), in Figure 6 the embodiment, the antenna portion 2 and the substrate 40 are located on the same side of the encapsulant 20. Therefore, the embodiments of the present disclosure may allow the antenna portion 2 / 102 to be mounted on either side (“top side” or “bottom side”) of the encapsulant 20.

[0080] Figure 6 The device 10 in includes a semiconductor die 30 located in the encapsulant 20. In this embodiment, the device 10 further includes a ball grid array substrate 28 located in the encapsulant 20. The semiconductor die 30 is mounted on the ball grid array substrate 28 in a flip-chip manner using solder or copper pillar bumps 32.

[0081] The device 10 further includes one or more radiation receiving components, and in this embodiment, each of the radiation receiving components includes an opening 124 in the encapsulant 20. The opening 124 may be lined with a conductive material 126 (e.g., metal or alloy). Each of the openings 124 may terminate at the ball grid array substrate 28, and the ball grid array substrate 28 may have conductive features (e.g., an antenna) for capturing electromagnetic radiation and transferring the associated signal to the semiconductor substrate 30 through an electrical connection.

[0082] In this embodiment, the semiconductor device 10 includes a substrate 40 such as a printed circuit board (PCB). In this embodiment, the semiconductor device 10 further includes an antenna portion 2, and in this example, the antenna portion 2 includes a slot antenna array having a plurality of slots. The antenna portion 2 is conductive (e.g., at least partially metallic). As Figure 6 shown, the slot 4 forms an opening aligned with the opening 124 of the radiation transmitting and receiving component such that the electromagnetic radiation transmitted along the slot 4 is incident on the radiation transmitting and receiving component.

[0083] In this embodiment, the antenna portion 2 is located on the side of the substrate 40 opposite to the encapsulant 20. The substrate 40 is provided with an opening so that electromagnetic radiation from the slot 4 in the antenna portion 2 is transmitted to the encapsulant 20. The opening in the substrate 40 may be lined with a conductive material 246 (e.g., metal or alloy). In this embodiment, the antenna portion 2 is mounted on the surface ("bottom side") of the substrate 40. It should be noted that the lining 246 of the opening in the substrate may extend laterally along the surface ("bottom side") of the substrate 40 to prevent the occurrence of an air gap at the interface between the slot 4 and the opening in the substrate 40.

[0084] The semiconductor device 10 further includes an intermediate portion. It should be noted that in this embodiment, the intermediate portion includes two components. The first component of the intermediate portion includes a lead frame 200. The second component of the intermediate portion includes a substrate 40. Thus, in this embodiment, the intermediate portion is located between the encapsulant 20 and the antenna portion 2. Specifically, the intermediate portion has a surface ("top side" of the lead frame 200) attached to the encapsulant 20 ("bottom side" of the encapsulant 20), and a surface ("bottom side" of the substrate 40) attached to the antenna portion 2 ("top side"). As can also be seen from Figure 6 the surface ("bottom side") of the lead frame 200 is attached to the surface ("top side") of the substrate 40.

[0085] The lead frame 200 may include a dielectric layer 206 having metallized surface layers 202, 204 provided thereon. Layers 202, 204 may be patterned to form electrical connections between components in the substrate 40 and the encapsulant 20. It should be noted that the device 10 may include solder balls 42, or other components for forming an electrical connection between the ball grid array substrate 28 and the layer 202 of the lead frame 200.

[0086] The intermediate portion includes one or more openings. These openings are formed by the aforementioned opening in the substrate and corresponding openings provided in the lead frame 200. The opening in the substrate 40 and the corresponding opening in the lead frame 200 are aligned to allow electromagnetic radiation to pass through the intermediate portion.

[0087] The opening in the intermediate portion is aligned with the opening formed by the slot 4 of the antenna portion 2. Thus, in this embodiment, the opening formed by the slot 4 in the antenna portion 2, the opening in the intermediate portion, and the radiation transmitting and receiving component 24 in the encapsulant 20 are all aligned to form a channel 208, thereby allowing electromagnetic radiation to be transmitted to / from the radiation transmitting and receiving component 24 in the encapsulant 20 through the antenna portion 2, the substrate, and the intermediate portion 60, and thus transmitting and receiving electromagnetic radiation through the radiation transmitting and receiving component 124.

[0088] As in Figure 6As can be seen, the intermediate portion 60 in this embodiment fills the space between the encapsulation 20 and the antenna portion 2. Because of this, there is no air gap between the encapsulation 20 and the antenna portion 2. Specifically, each channel 208 is an electrically adjacent channel for transmitting electromagnetic radiation to the radiation transmitting and receiving component 124 in the encapsulation 20. In this way, mismatches, insertion losses, and radiation associated with the example shown in Figure 1 and Figure 2 can be prevented.

[0089] Figure 7 FIG. shows a semiconductor device 10 according to another embodiment of the present disclosure. Figure 7 The semiconductor device 10 in Figure 6 is similar to the semiconductor device 10 in Figure 7 and only the obvious differences will be described here. Specifically, in the embodiment of Figure 6 , the device 10 does not include the type of ball grid array substrate used in the embodiment of

[0090] . In fact, the device 10 includes a pin grid array substrate 34. The pin grid array substrate 34 can be incorporated into the encapsulation 20. This simplifies the device 10 and its electrical connection to the intermediate portion. The semiconductor die 30 is mounted on the pin grid array substrate 34 (on the "top side") in a flip-chip manner using solder or copper pillar bumps 33.

[0091] From Figure 7 As can be seen, the intermediate portion 60 in this embodiment also fills the space between the encapsulation 20 and the antenna portion 2. Because of this, there is no air gap between the encapsulation 20 and the antenna portion 2. Specifically, each channel 208 is an electrically adjacent channel for transmitting electromagnetic radiation to the encapsulation 20. In this way, mismatches, insertion losses, and radiation associated with the example shown in Figure 1 and Figure 2 can be prevented.

[0092] Figure 8 FIG. shows a semiconductor device 10 according to another embodiment of the present disclosure. In this embodiment, the device is in some aspects similar to that described above with respect to Figure 4The described device is similar and includes a millimeter-wave interface 70 that extends laterally within the encapsulation 20 as previously described. However, in this embodiment, the encapsulation 20 is mounted on an intermediate portion that includes a lead frame 200 (no separate substrate is provided).

[0093] The lead frame 200 itself can be substantially as described above with respect to Figure 6 and 7 and can include the aforementioned dielectric layer 206 having metallized surface layers 202, 204 disposed thereon. In this embodiment, the electrical interconnection between the components in the encapsulation 20 and the lead frame 200 can be implemented in a variety of ways. For example, it is envisioned that wire bonding can be provided between pads on the top side of the redistribution layer in the encapsulation 20 and the lead frame 200.

[0094] In this embodiment, the semiconductor device 10 includes an antenna portion 2, and the antenna portion 2 includes a three-dimensional (3D) antenna. The antenna portion 2 includes an opening 204 for transmitting electromagnetic radiation to a radiation transmitting and receiving component in the encapsulation 20. The antenna portion 2 is conductive (e.g., at least partially metallic). In this embodiment, the antenna portion 2 is located on the side of the lead frame 200 opposite to the encapsulation 20. As previously described, the lead frame 200 includes an opening that is aligned with the opening 204 in the antenna portion 2 to allow electromagnetic radiation to be transmitted to the radiation transmitting and receiving component 24 (e.g., the millimeter-wave interface 70) in the encapsulation 20. In this embodiment, using the lead frame 200 as the intermediate portion also allows for the formation of a gapless electrically adjacent channel for transmitting electromagnetic radiation from the antenna portion 2 to the radiation transmitting and receiving component 24 in the encapsulation 20. In this way, mismatches, insertion losses, and radiation associated with the Figure 1 and Figure 2 examples shown in can be prevented.

[0095] Figures 9A to 9D and Figure 10 each show the arrangement of the openings in the semiconductor device 10 according to an embodiment of the present disclosure. As can be seen from these figures, when viewed in a direction parallel to the surface normal of the main surface of the intermediate portion, the opening of the antenna portion and the corresponding opening of the intermediate portion can have substantially the same cross-sectional shape and size. Matching the shapes of the various openings can prevent discontinuities in the path through which electromagnetic radiation passes, thereby reducing losses. For example, the cross-sectional shape can be circular ( Figure 9A ), square ( Figure 9B ), rectangular ( Figure 9C and 10 ) or oval ( Figure 9D ). Similar considerations apply to each embodiment described herein. As Figures 9A to 9DAs shown in each of the figures, the opening 204 may be integrated into the ground plane of the lead frame 200 in some embodiments, or may be integrated as a pad as shown in Figure 10 shown.

[0096] Figure 11 The arrangement of the rings 44 around the opening 204 in the semiconductor device 10 according to another embodiment of the present disclosure is shown. Each ring 44 may be located in the dielectric 206 of the lead frame 200 and may extend between the metallization surface layers 202, 204. For example, each ring may include a plurality of through-holes 42 filled with a conductive material. For example, the through-holes may be plated through-holes (PTHs), or may include metal (e.g., Cu) through-hole bars. An example arrangement of the through-holes 42 is shown in detail on the right side of Figure 11 .

[0097] Providing these rings 44 may act as an additional barrier to prevent radiation from leaking from the opening 204, thereby preventing electromagnetic radiation in one opening 204 from reaching another opening 204 in the device (e.g., through the dielectric 206).

[0098] Thus, a semiconductor device and a method of manufacturing the same have been described. The device includes an encapsulation. The device further includes a semiconductor die in the encapsulation. The device additionally includes electromagnetic radiation transmitting and receiving components in the encapsulation. The device further includes an intermediate portion having a first surface and a second surface. The first surface is attached to the encapsulation. The device further includes an antenna portion attached to the second surface of the intermediate portion. The antenna portion includes one or more openings for transmitting electromagnetic radiation. The intermediate portion includes one or more corresponding openings aligned with the openings of the antenna portion. Each opening of the antenna portion and each corresponding opening of the intermediate portion form an electrically adjacent channel for transmitting the electromagnetic radiation to the electromagnetic radiation transmitting and receiving components in the encapsulation.

[0099] Although specific embodiments of the present disclosure have been described, it should be understood that many modifications / additions and / or substitutions may be made within the scope of the claims.

Claims

1. A semiconductor device, characterized in that, Comprising: An encapsulation; A semiconductor die within the encapsulation; Electromagnetic radiation transmitting and receiving components within the encapsulation; An intermediate portion having a first surface and a second surface, wherein the first surface is attached to the encapsulation; And An antenna portion attached to the second surface of the intermediate portion, Wherein the antenna portion includes one or more openings for transmitting electromagnetic radiation, Wherein the intermediate portion includes one or more corresponding openings aligned with the openings of the antenna portion, and Wherein each opening of the antenna portion and each corresponding opening of the intermediate portion form an electrically adjacent channel for transmitting the electromagnetic radiation to the electromagnetic radiation transmitting and receiving components within the encapsulation.

2. The device according to claim 1, characterized in that, The intermediate portion includes a conductive elastomer.

3. The device according to claim 2, characterized in that, The intermediate portion includes a layer of the conductive elastomer.

4. The device according to any one of claims 1 - 3, characterized in that, The electromagnetic radiation transmitting and receiving components include one or more conductive portions aligned with the openings of the antenna portion and the corresponding openings of the intermediate portion for transmitting and receiving the electromagnetic radiation.

5. The device according to claim 4, characterized in that, The encapsulation includes one or more openings lined with a conductive material, wherein the opening or each opening is aligned with a corresponding one of the electrically adjacent channels for transmitting the electromagnetic radiation within the encapsulation.

6. The device according to claim 5, characterized in that, Each of the conductive portions for receiving the electromagnetic radiation is at least partially located within a corresponding one of the openings in the encapsulation.

7. The device according to any one of claims 1 - 3, characterized in that, The encapsulation is additionally attached to a substrate.

8. The device according to claim 1, characterized in that, The intermediate portion includes a lead frame.

9. The device according to claim 8, characterized in that: The intermediate portion additionally includes a printed circuit board (PCB), The lead frame is located between the encapsulation and the printed circuit board, The printed circuit board is located between the lead frame and the antenna portion, and The lead frame and the printed circuit board each include one or more openings that form the corresponding openings of the intermediate portion aligned with the one or more openings of the antenna portion.

10. A method for manufacturing a semiconductor device, characterized in that, The method includes: Encapsulating a semiconductor die and radiation transmitting and receiving components in an encapsulation; Providing an intermediate portion having a first surface and a second surface; Attaching the first surface of the intermediate portion to the encapsulation; Providing an antenna portion; and Attaching the antenna portion to the second surface of the intermediate portion, Wherein the antenna portion includes one or more openings for transmitting electromagnetic radiation, Wherein the intermediate portion includes one or more corresponding openings aligned with the openings of the antenna portion, and Wherein each opening of the antenna portion and each corresponding opening of the intermediate portion form an electrically adjacent channel for transmitting the electromagnetic radiation to the electromagnetic radiation transmitting and receiving components within the encapsulation.

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