Computer chip cooling device

Abstract

The present invention relates to the field of electronic chip heat dissipation technology. In view of the technical problems of large volume of existing air-cooled radiators and leakage of water-cooled heat dissipation technology, the present invention provides a computer chip heat dissipation device, including: a fan control circuit interface, a fan control circuit, a fan group, a heat input interface, a heat pipe array, a heat sink and a single-slot card-type exhaust port. The present invention transfers the heat of a computer processor to the heat sink through the heat pipe array, and the airflow generated by the fan group is discharged outside the chassis through the single-slot card-type exhaust port.

Description

Technical Field

[0001] The invention relates to a computer chip heat dissipation device, in particular to a single-slot card-type air-cooling heat dissipation device for dissipating the heat of a computer chip through a radial fan group and a heat pipe array. Background Art

[0002] Modern computer chips integrate billions of transistors in an area of ​​hundreds of square millimeters, with a main frequency of more than 5GHz and a thermal design power consumption of hundreds of watts. If the heat generated by the computer chip during operation cannot be quickly dissipated, the computer chip will overheat and reduce its frequency or burn out.

[0003] In recent years, active cooling technologies used for computer chip cooling include air cooling and water cooling. Water cooling uses a water pump to circulate the liquid in the pipe and blows the fan through the radiator to dissipate heat. Although water cooling has the ability to withstand high heat loads, after long-term use, the water cooling pipe is prone to leakage and short circuit, so the reliability is low. Air cooling does not have this risk. Air cooling devices usually absorb the heat of computer chips by heat sinks, and the airflow generated by the fan flows through the heat sink and takes away the heat to cool the computer chip. In order to withstand high heat loads, air cooling often uses large tower heat sinks, including up to hundreds of metal heat sinks. Such large-volume air cooling devices are often difficult to install and will block memory slots or motherboard mounting holes in microcomputer applications. The airflow generated by the axial fan of the air cooling device passes through the large tower heat sink, and the heated hot air will fill the computer case, causing the temperature inside the computer case to rise, affecting the heat dissipation effect. Air cooling devices can quickly discharge hot air by forming an air duct with the front and rear or upper and lower fans of the computer case. However, many computer cases cannot form air ducts.

[0004] Therefore, the present invention proposes a computer chip heat dissipation device, which uses a radial fan group and a heat pipe array to dissipate heat from the computer chip. Compared with the air-cooled heat dissipation devices currently on the market, it has the advantages of strong compatibility, compact size, no obstruction of the memory slot or the motherboard installation hole, easy installation, and no need to form an air duct. Summary of the invention

[0005] The purpose of the present invention is to provide a computer chip heat dissipation device, which uses a radial fan group and a heat pipe array to dissipate heat from the computer chip. Compared with the air-cooled heat dissipation devices currently on the market, it has the advantages of strong compatibility, compact size, no obstruction of the memory slot or the motherboard mounting hole, easy installation, and no need to form an air duct.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present invention is: it includes a fan control circuit interface, a fan control circuit, a fan group, a heat input interface, a heat pipe array, a heat sink and a single-slot card-type exhaust port, the output end of the fan control circuit interface is connected to the input end of the fan control circuit, the output end of the fan control circuit is connected to the input end of the fan group, the output end of the fan group is connected to one input end of the heat sink, the output end of the heat input interface is connected to the input end of the heat pipe array, the output end of the heat pipe array is connected to another input end of the heat sink, the output end of the heat sink is connected to the input end of the single-slot card-type exhaust port, the fan control circuit receives processor temperature information provided by a temperature sensor in a computer chip through the fan control circuit interface, and controls the rotation speed of the fan group, the heat pipe array is connected to the computer chip through the heat input interface, receives its heat and conducts it to the heat sink, the airflow of the fan group passes through the heat sink, and the heated airflow is directly discharged from the computer case through the single-slot card-type exhaust port for heat dissipation.

[0007] The fan control circuit interface is used to establish an electrical connection between the temperature sensor in the computer chip and the fan control circuit of the computer chip heat sink, and provide the processor temperature information provided by the temperature sensor in the computer chip to the fan control circuit of the computer chip heat sink;

[0008] The fan control circuit is a digital pulse width modulation control chip, which is used to control the speed of the fan group of the computer chip cooling device according to the processor temperature information provided by the temperature sensor in the computer chip. Since there are many digital pulse width modulation control chips on the market, the working principle is not described here.

[0009] The fan group is composed of a single radial fan or a plurality of radial fans connected in parallel, and the single radial fan or the plurality of radial fans connected in parallel absorb air in the computer case to form an airflow that blows through the heat sink to dissipate heat;

[0010] The heat input interface is used to connect the computer chip and the heat pipe array of the computer chip cooling device. It is a block of metal or a heat spreader. The surface in contact with the computer chip is coated with high thermal conductivity thermal grease or liquid metal. The surface is in close contact with the heat pipe array by welding technology to establish an efficient thermal connection.

[0011] The heat pipe array is used to efficiently conduct the heat introduced from the heat input interface to the heat sink;

[0012] The heat sink and the heat pipe array are tightly connected by using a fin-piercing process or a reflow soldering process;

[0013] The single-slot card exhaust port is located at the opening of the first expansion card slot closest to the computer processor and is used to directly exhaust the hot air passing through the heat sink out of the computer case. The material of the single-slot card exhaust port can be a polymer or metal.

[0014] The working principle of the present invention is as follows: when in use, the computer chip is closely connected to the electronic chip air-cooling heat sink, including electrical connection and thermal connection. The temperature sensor in the computer chip is connected to the fan control circuit of the computer chip heat sink through the fan control circuit interface of the computer chip heat sink, and the fan control circuit controls the speed of the fan group of the computer chip heat sink according to the processor temperature information provided by the temperature sensor in the computer chip; the computer chip is connected to the heat pipe array of the computer chip heat sink through the heat input interface of the computer chip heat sink, and the heat pipe array is used to efficiently conduct the heat introduced from the heat input interface to the heat sink, and the fan group performs forced convection heat dissipation on the heat conducted from the heat pipe array to the heat sink, and the single-slot card exhaust port is used to directly discharge the hot air passing through the heat sink out of the computer case, which greatly enhances the heat dissipation capacity of the computer chip, thereby effectively reducing the working temperature of the computer chip.

[0015] The present invention has the following advantages due to the adoption of the above technical solution:

[0016] 1. A new type of air-cooled radiator with strong compatibility, compact size, will not block the memory slot or motherboard mounting hole, is easy to install, and does not require the formation of an air duct;

[0017] 2. It enhances the heat dissipation capacity of computer chips and indirectly improves the computing performance of computer chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural block diagram of the present invention;

[0019] Figure 2 It is a working schematic diagram of the present invention;

[0020] Figure 3 It is a structural schematic diagram of the present invention. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1-2As shown, it includes a fan control circuit interface 1, a fan control circuit 2, a fan group 3, a heat input interface 4, a heat pipe array 5, a heat sink 6 and a single-slot card-type exhaust port 7. The output end of the fan control circuit interface 1 is connected to the input end of the fan control circuit 2, the output end of the fan control circuit 2 is connected to the input end of the fan group 3, the output end of the fan group 3 is connected to one input end of the heat sink 6, the output end of the heat input interface 4 is connected to the input end of the heat pipe array 5, the output end of the heat pipe array 5 is connected to the other input end of the heat sink 6, and the output end of the heat sink 6 is connected to the input end of the single-slot card-type exhaust port 7. The fan control circuit 2 receives processor temperature information provided by a temperature sensor in a computer chip through the fan control circuit interface 1 to control the rotation speed of the fan group 3. The heat pipe array 5 is connected to the computer chip through the heat input interface 4 to receive its heat and conduct it to the heat sink 6. The airflow of the fan group 3 passes through the heat sink 6, and the heated airflow is directly discharged from the computer case through the single-slot card-type exhaust port 7 for heat dissipation.

[0022] The fan control circuit interface 1 is used to establish an electrical connection between the temperature sensor in the computer chip and the fan control circuit 2 of the computer chip heat sink, and provide the processor temperature information provided by the temperature sensor in the computer chip to the fan control circuit 2 of the computer chip heat sink;

[0023] The fan control circuit 2 is a digital pulse width modulation control chip, which is used to control the speed of the fan group 3 of the computer chip cooling device according to the processor temperature information provided by the temperature sensor in the computer chip. Since there are many digital pulse width modulation control chips on the market, the working principle is not described here.

[0024] The fan group 3 is composed of a single radial fan or a plurality of radial fans connected in parallel, and the single radial fan or the plurality of radial fans connected in parallel absorb the air in the computer case to form an airflow that blows through the heat sink 6 for heat dissipation;

[0025] The heat input interface 4 is used to connect the computer chip and the heat pipe array 5. It is a block of metal or a heat sink. The surface in contact with the computer chip is coated with thermal grease or liquid metal with high thermal conductivity. The heat input interface 4 is in close contact with the heat pipe array 5 by welding technology to establish an efficient thermal connection.

[0026] The heat pipe array 5 is used to efficiently conduct the heat introduced from the heat transfer interface 4 to the heat sink 6;

[0027] The heat sink 6 and the heat pipe array 5 are tightly connected by using a finning process or a reflow soldering process. The material is metal or carbon fiber;

[0028] The single-slot card-type exhaust port 7 is used to directly exhaust the hot air that passes through the heat sink 6 out of the computer case, and its material can be a polymer or metal.

[0029] The working principle of the present invention is as follows: when in use, the computer chip is closely connected to the computer chip heat sink, including electrical connection and thermal connection. The temperature sensor in the computer chip is connected to the fan control circuit 2 of the computer chip heat sink through the fan control circuit interface 1 of the computer chip heat sink, and the fan control circuit 2 controls the speed of the fan group 3 of the computer chip heat sink according to the processor temperature information provided by the temperature sensor in the computer chip; the computer chip is connected to the heat pipe array 5 of the computer chip heat sink through the heat input interface 4 of the computer chip heat sink, and the heat pipe array 5 is used to efficiently conduct the heat introduced from the heat input interface 4 to the heat sink 6, and the fan group 3 performs forced convection heat dissipation on the heat conducted from the heat pipe array 5 to the heat sink 6, and the single-slot card exhaust port 7 is used to directly discharge the hot air passing through the heat sink 6 out of the computer case, which greatly enhances the heat dissipation capacity of the computer chip, thereby effectively reducing the working temperature of the computer chip.

[0030] like Figure 3 As shown, the single-slot card-type exhaust port 7 occupies the position of the first expansion card slot closest to the processor on the computer motherboard, so that hot air is exhausted to the outside of the chassis. According to statistics, taking the motherboard manufacturers with the highest market share, ASUS, GIGABYTE, MSI, ASRock, Biostar, and Colorful as examples, among their ATX motherboards for the personal DIY market (referring to those based on Intel's Z390, Z370, H370, B365, B360, H310 chipsets and AMD's X570, X470, X370, B350, A320 chipsets), the proportion of the first expansion card slot closest to the processor being a PCI Express x1 slot or an NVME M.2 solid-state drive installation position rather than a PCI Express x16 graphics card slot is as high as over 70%; among their motherboards for the high-end personal DIY market (referring to those based on Intel's X299 chipset and AMD's X399 chipset), only ASRock provides motherboard products in which the first expansion card slot closest to the processor is a PCI Express x1 slot or an NVME M.2 solid-state drive installation position rather than a PCI Express x16 graphics card slot. The length of the heat pipe array 5 in the present invention is within 14 cm, which is basically similar to the length of the heat pipes of mid-to-high-end air-cooled radiators currently on the market.

[0031] The heat pipe array 5 described in the present invention is a normal temperature heat pipe, and the operating temperature is 0-250 degrees Celsius.

[0032] The material of the heat pipe array 5 described in the present invention is copper, copper alloy, aluminum or aluminum alloy.

[0033] The fan group 3 described in the present invention is a single radial fan or a plurality of radial fans connected in parallel, and the thickness of the fan is 5-100 mm.

[0034] The exhaust direction of the fan group 3 described in the present invention forms an angle of 60-120 degrees with the rotation axis of the fan.

[0035] The material of the heat input interface 4 of the present invention is copper, copper alloy, aluminum or aluminum alloy.

[0036] The heat input interface 4 of the present invention is coated on both sides with thermal grease or liquid metal with high thermal conductivity.

[0037] The heat input interface 4 described in the present invention is a block of metal or a heat sink.

[0038] The heat input interface 4 of the present invention is fixed to the computer chip by a metal clamp.

[0039] The heat sink 6 and the heat pipe array 5 of the present invention are tightly connected by using a fin penetration process or a reflow soldering process.

[0040] The material of the single-slot card-type air outlet 7 of the present invention is a high molecular polymer or metal.

Claims

1. A computer chip heat dissipation device, characterized in that: The invention comprises a fan control circuit interface, a fan control circuit, a fan group, a heat input interface, a heat pipe array, a heat sink and a single-slot card-type exhaust port, wherein the output end of the fan control circuit interface is connected to the input end of the fan control circuit, the output end of the fan control circuit is connected to the input end of the fan group, the output end of the fan group is connected to one input end of the heat sink, the output end of the heat input interface is connected to the input end of the heat pipe array, the output end of the heat pipe array is connected to another input end of the heat sink, the output end of the heat sink is connected to the input end of the single-slot card-type exhaust port, the fan control circuit receives processor temperature information provided by a temperature sensor in a computer chip through the fan control circuit interface, and controls the rotation speed of the fan group, the heat pipe array is connected to the computer chip through the heat input interface, receives its heat and conducts it to the heat sink, the airflow of the fan group passes through the heat sink, and the heated airflow is directly discharged from the computer case through the single-slot card-type exhaust port for heat dissipation; The fan control circuit interface is used to establish an electrical connection between the temperature sensor in the computer chip and the fan control circuit of the computer chip heat sink, and provide the processor temperature information provided by the temperature sensor in the computer chip to the fan control circuit of the computer chip heat sink; The fan group is composed of a single radial fan or a plurality of radial fans connected in parallel, and the single radial fan or the plurality of radial fans connected in parallel absorb air in the computer case to form an airflow that blows through the heat sink to dissipate heat; The heat input interface is used to connect the computer chip and the heat pipe array of the computer chip cooling device. The surface in contact with the computer chip is coated with high thermal conductivity thermal grease or liquid metal, and is in close contact with the heat pipe array by welding. The heat pipe array is used to efficiently conduct the heat introduced from the heat input interface to the heat sink; The heat sink and the heat pipe array are tightly connected by using a fin-piercing process or a reflow soldering process; The single-slot card-type exhaust port is used to directly discharge the hot air passing through the heat sink out of the computer case. The material of the single-slot card-type exhaust port can be a polymer or a metal. The heat input interface is a block of metal or a soaking plate. The heat pipe array is a normal temperature heat pipe with an operating temperature of 0-250 degrees Celsius. The material of the heat pipe array is copper, copper alloy, aluminum or aluminum alloy. The fan group is a single radial fan or multiple radial fans connected in parallel, and the thickness of the fan is 5-100 mm. The exhaust direction of the fan group is at an angle of 60-120 degrees to the rotation axis of the fan. The material of the heat input interface is copper, copper alloy, aluminum or aluminum alloy.

Images