LED bracket and its preparation method

Abstract

The present invention provides an LED bracket and a preparation method thereof. The LED bracket includes: a substrate prepared from a ceramic material; a first metal layer disposed on one surface of the substrate, and spaced apart to form a plurality of first conductive regions; a second metal layer disposed on the other surface of the substrate, opposite to the first metal layer and spaced apart to form a plurality of second conductive regions; through holes communicating the first conductive regions and the second conductive regions, and conductive materials are provided in the through holes; an LED chip connected to two adjacent first conductive regions; a dam surrounding the first metal layer and bonded to the substrate, and a reflecting cup is provided on the dam to surround the LED chip. By the above method, for the micro-sized products after encapsulation of the LED bracket of the present invention, good airtightness, firmness and strength can still be maintained, the prepared products have strong stability, and the service life is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of LED brackets, and particularly to an LED bracket and a preparation method thereof. Background Art

[0002] As the bottom base of an LED lamp bead, a traditional LED bracket includes a plastic reflection cup and a metal conductive pin. A coating is covered on the metal conductive pin, and the positive and negative electrodes inside the LED lamp bead are connected through the conductive pin. The conductive pin and the plastic reflection cup are integrally formed.

[0003] With the increasing maturity of LED technology, the market has higher and higher requirements for the size of LED brackets, with smaller size, thinner volume, and higher power at the same time. When the product size is smaller, the production difficulty will be higher, accompanied by poor airtightness of the LED bracket, difficult filling of plastic, and looseness or even cracking of the product after the metal conductive pin is bent. These problems have seriously affected the performance and quality of the LED bracket. Therefore, the traditional manufacturing method can no longer meet the development trend.

[0004] In view of this, a new LED bracket and a preparation method thereof are provided to solve the existing defects. Summary of the Invention

[0005] Based on this, the present invention provides an LED bracket and a preparation method thereof, which solve the defects such as poor airtightness of the bracket under small size, difficult filling of plastic, and unstable performance caused by looseness or cracking of the product after the metal conductive pin is bent.

[0006] An LED bracket, the LED bracket includes:

[0007] A substrate, prepared from a ceramic material;

[0008] A first metal layer, provided on one surface of the substrate, and spaced apart to form a plurality of first conductive regions;

[0009] A second metal layer, provided on the other surface of the substrate, opposite to the first metal layer and spaced apart to form a plurality of second conductive regions;

[0010] Through holes, connecting the first conductive regions and the second conductive regions, and conductive materials are provided in the through holes;

[0011] An LED chip, connecting two adjacent first conductive regions;

[0012] A dike, surrounding the first metal layer and bonded to the substrate, and a reflection cup is provided on the dike to surround the LED chip.

[0013] Preferably, the first conductive region includes a first welding portion welded to the LED chip.

[0014] Preferably, adjacent LED chips are commonly connected to the same first conductive region.

[0015] Preferably, the first conductive region connecting adjacent LED chips includes second welding portions provided at both ends and welded to the LED chips, and an intermediate portion connecting the second welding portions, and the through hole is disposed opposite to the intermediate portion.

[0016] Preferably, an avoidance groove is further provided on a side of the dam bonded to the substrate, and the connecting portion is received in the avoidance groove.

[0017] Preferably, the second conductive region is recessed toward the first conductive region to form a receiving groove, the conductive material is solder paste, and the solder paste fills into the through hole from the receiving groove.

[0018] Preferably, the first metal layer and the second metal layer are coated on the substrate by at least one of magnetron sputtering, sintering or electroless plating.

[0019] Preferably, the dam is made of ceramic material, and the reflecting cup is prepared by laser cutting.

[0020] Preferably, a plurality of the first conductive regions are uniformly distributed on the substrate in a rectangular array.

[0021] The present invention also provides a method for manufacturing an LED bracket, and the manufacturing method includes:

[0022] Obtaining a substrate made of ceramic material, and forming a plurality of spaced through holes on the substrate by a laser cutting method;

[0023] Forming a first metal layer and a second metal layer on two opposite surfaces of the substrate by at least one of magnetron sputtering, sintering or electroless plating, wherein the first metal layer includes a plurality of first conductive regions corresponding to and spaced from the through holes, the second metal layer includes a plurality of second conductive regions corresponding to and spaced from the through holes, and the through holes communicate the first conductive regions and the second conductive regions;

[0024] Welding a plurality of LED chips on two adjacent first conductive regions;

[0025] Obtaining a dam made of ceramic material, and forming a plurality of through reflecting cups on the dam by a laser cutting method;

[0026] Bonding the cut dam to the substrate so that the reflecting cups correspondingly surround the LED chips;

[0027] Encapsulate and bond the dam and the substrate, and use a laser or a resin knife to cut to form LED bracket monomers.

[0028] The beneficial effects of the present invention are to provide an LED bracket and a preparation method thereof. The LED bracket includes: a substrate prepared from a ceramic material; a first metal layer provided on one surface of the substrate, and a plurality of first conductive regions are formed by spaced arrangement; a second metal layer provided on the other surface of the substrate, opposite to the first metal layer and a plurality of second conductive regions are formed by spaced arrangement of the second metal layer; through holes communicating the first conductive region and the second conductive region, and conductive materials are provided in the through holes; an LED chip connected to two adjacent first conductive regions; a dam surrounding the first metal layer and bonded to the substrate, and a reflecting cup is provided on the dam to surround the LED chip. By the above method, the LED bracket of the present invention is small in size and ultra-thin, and at the same time can maintain good airtightness, firmness and strength, and the prepared product has strong stability and long service life. Description of the Drawings

[0029] Figure 1 Schematic diagram of the LED bracket according to the first embodiment of the present invention;

[0030] Figure 2 is Figure 1 Partial exploded view of the shown LED bracket;

[0031] Figure 3 is Figure 1 Schematic diagram of the structure of the shown LED bracket after removing the dam;

[0032] Figure 4 is Figure 1 Schematic diagram of the structure of the dam of the shown LED bracket after perspective;

[0033] Figure 5 Schematic diagram of the LED bracket according to the second embodiment of the present invention;

[0034] Figure 6 is Figure 5 Partial exploded view of the shown LED bracket;

[0035] Figure 7 is Figure 5 Schematic diagram of the structure of the shown LED bracket after removing the dam;

[0036] Figure 8 is Figure 5 Schematic diagram of the structure of the dam of the shown LED bracket after perspective;

[0037] Figure 9 is Figure 5 Schematic diagram of the structure of the side where the dam of the shown LED bracket is bonded to the substrate;

[0038] Figure 10 For Figure 5 the overall structure schematic diagram of the LED bracket;

[0039] Description of the drawings: 1, 2 - LED brackets; 11, 21 - substrates; 12, 22 - first metal layers; 121, 221a, 221b - first metal regions; first welding part -; c1 - second welding part; c2 - middle part; 13, 23 - second metal layers; 131, 231 - second metal regions; 14, 24 - through - holes; 15, 25 - LED chips; 16, 26 - dams; 261 - avoidance grooves; 17, 27 - reflecting cups; 18, 28 - accommodating grooves; 19, 29 - solder pastes. Specific embodiments

[0040] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0041] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0043] Please refer to Figures 1 - 4 , for the LED bracket 1 provided in the first embodiment of the present invention. The LED bracket 1 includes: a substrate 11, a first metal layer 12 provided on the upper surface of the substrate 11, a second metal layer 13 provided on the lower surface of the substrate 11, at least two through - holes 14 penetrating the upper and lower surfaces of the substrate 11, at least one LED chip 15 welded to adjacent two first conductive regions 131; a dam 16 provided around the first metal layer 12 and bonded to the substrate 11, and a reflecting cup 17 penetrating the dam 16.

[0044] Both the substrate 11 and the dam 16 are made of ceramic materials, having high heat resistance and thermal conductivity. The substrate 11 and the dam 16 have the same specifications, generally with the specifications of 100mm * 100mm or 120mm * 120mm. The first metal layer 12 is spaced apart into at least two first conductive regions 121, the second metal layer 13 is spaced apart into at least two second conductive regions 131, and the second conductive regions 131 and the first conductive regions 121 are arranged corresponding to the through holes 14. The through holes 14 connect the oppositely arranged first conductive regions 121 and second conductive regions 131. The diameter of the through holes 14 is set to be ≥0.05mm, and the inside is filled with a conductive material for conducting the first conductive regions 121 and the second conductive regions 131. The number of the through holes 14 is the same as that of the first conductive regions 131 or the second conductive regions 132. The reflector cup 17 is correspondingly arranged around the LED chip 15.

[0045] In the first embodiment of the present invention, each LED chip 15 is connected to two adjacent first conductive regions 121, and each first conductive region 121 is only welded to one LED chip 15. Each first conductive region 121 has the same setting and size, including a first welding part connected to the LED chip 15. Preferably, for the convenience of mass production, the first conductive region 121 can be set to a regular shape, including but not limited to the illustrated rectangle for the convenience of mass production, and the first conductive regions 121 are uniformly spaced in a rectangular array form and can be set to an M * N array. The reflector cup 17 is arranged corresponding to the LED chip 15 and covers the outside of the LED chip 15.

[0046] The covered first metal layer 12 and second metal layer 13 include but are not limited to conductive media such as gold, silver, and copper, which can improve the conductivity. The first metal layer 12 and the second metal layer 13 can be covered on the substrate 11 by at least one of magnetron sputtering, sintering, or electroplating, which can make the first metal layer 12 and the second metal layer 13 more tightly combined with the substrate 11 to form a dense connection and avoid the circuit breakage caused by the detachment of the metal layer during use.

[0047] The second conductive region 131 is recessed toward the first conductive region 121 to form a receiving groove 18. The conductive material is preferably solder paste 19. The solder paste 19 enters and fills the through hole 14 from within the receiving groove 18, thereby conducting the first conductive region 121 and the second conductive region 131. After the second conductive region 131 is recessed to form the receiving groove 18, it can prevent the solder paste 19 from overflowing to the surrounding second conductive region when the solder paste 19 is poured, causing a short circuit in the circuit. Optionally, the formation of the receiving groove 18 can be achieved by using a laser cutting method to form a through hole 14 on the substrate 11. During this process, a groove communicating with 14 is directly formed around the through hole 14 on the lower surface of the substrate 11 by laser cutting. Then, at least one of magnetron sputtering, sintering, or electroplating is used to form the recessed second conductive region 131 around the groove and the groove, thereby forming the receiving groove 18. This method is simple and easy to implement. In the original operation steps, only the cutting path of laser cutting needs to be set and the formation of the metal layer needs to be controlled. At the same time of forming the receiving groove 18, the process and time will not be increased.

[0048] The dam 16 uses a ceramic material with excellent thermal conductivity and heat resistance as the main body. The main body specifications generally use a size of 100mm * 100mm or 120mm * 120mm. The main body is laser cut to form a through reflection cup 17 on the dam 16. The shape of the reflection cup 17 can be a reflection cup shape, a cylindrical shape, or a cuboid shape, and is not limited to the shape shown in this embodiment. The reflection cup 17 of the present invention is prepared by laser cutting a ceramic material for the dam 16. Compared with a reflection cup formed by traditional injection molding, it can effectively improve the heat resistance and thermal conductivity of the reflection cup, and can avoid phenomena such as poor glue shortage and incomplete molding caused by the size limitation of the reflection cup 17 formed by traditional injection molding.

[0049] The LED bracket 1 is made as a whole board. The reflection cup 17 is filled with epoxy resin for encapsulation. After encapsulation is completed, a high-speed resin cutting knife or laser cutting is used to cut and separate to obtain LED bracket monomers. The wall thickness of the reflection cup after final cutting is more than 0.05mm. Since the substrate of the present invention is made of ceramic material, after the reflection cup is filled with epoxy resin, cutting with a laser or a resin cutting knife will not cause the ultra-thin reflection cup to break.

[0050] The LED bracket 1 provided in the first embodiment of the present invention has pads for the entire LED bracket formed by double-sided coating of a metal layer on a ceramic substrate 11. The metal layers (the first metal layer 11 and the second metal layer 12) are coated on the surface of the ceramic substrate 11 by magnetron sputtering, sintering, and immersion plating methods to form a metal circuit layer; the reflector cup 17 is obtained by laser cutting a ceramic dam 16, and the size of the reflector cup solves the problems of difficulty in preparing a small-sized reflector cup 17 by the traditional injection molding method and poor strength; the dam 16 and the substrate 17 are bonded together, which can integrate the dam 16 and the substrate 17, improve the integrity of the LED bracket 1, and improve the airtightness, firmness, and strength of the bracket; the LED bracket 1 adopts a one-piece manufacturing process with high production efficiency, enabling more pieces per sheet for ultra-small and ultra-thin sized brackets; finally, a high-speed resin cutting knife or laser cutting is used to complete the separation of individual LED bracket monomers, avoiding the rupture of the reflector cup of the bracket. The present invention can effectively solve the problem of poor airtightness of small-sized and ultra-thin LED brackets, avoid the difficulty of plastic filling caused by small size, and problems such as looseness or even product rupture after the metal conductive pins are bent. Moreover, the obtained single LED bracket has better heat resistance and thermal conductivity, making the life of a single lamp bead longer, and it can be widely used in mobile phone backlights and screen backlights.

[0051] Please refer to Figures 5 - 10 , which is the LED bracket 2 provided in the second embodiment of the present invention. The LED bracket 2 includes: a substrate 21, a first metal layer 22 coated on the upper surface of the substrate 21, a second metal layer 23 coated on the lower surface of the substrate 21, at least two through holes 24 penetrating the upper and lower surfaces of the substrate 21, and at least one LED chip 25 welded on adjacent two first conductive regions 221; a dam 26 disposed around the first metal layer 22 and bonded to the substrate 21, and a reflector cup 27 penetrating through the dam 26.

[0052] Both the substrate 21 and the dam 26 are made of ceramic materials, having high heat resistance and thermal conductivity, and the substrate 21 and the dam 26 have the same specification size, generally with a specification of 100mm * 100mm or 120mm * 120mm; the first metal layer 22 is spaced apart into at least two first conductive regions 221, the second metal layer 23 is spaced apart into at least two second conductive regions 231, and the second conductive region 231 and the first conductive region 221 are arranged corresponding to the through holes 24; the through holes 24 communicate the oppositely arranged first conductive region 221 and second conductive region 231, the diameter of the through holes 24 is set to ≥0.05mm, and the inside is filled with a conductive material for conducting the first conductive region 221 and the second conductive region 231. The number of the through holes 24 is the same as that of the first conductive region 231 or the second conductive region 232; the reflector cup 27 is disposed corresponding to the periphery of the LED chip 25.

[0053] Different from the first embodiment, in the second embodiment of the present invention, a first conductive region can be connected to two LED chips 25. The two LED chips 25 are commonly connected to the same first conductive region to share the same electrode (the through hole 24 and the conductive material accommodated in the through hole 24 form the electrode). The first conductive region 221 includes a first conductive region 221a that is only connected to one LED chip 25 and a first conductive region 221b that is connected to two adjacent LED chips 25. The shape and setting of the first conductive region 221a are the same as those of the first conductive region 121 in the first embodiment, and it includes a first welding portion d that is welded to the LED chip 25. The first conductive region 221b includes two welding portions c1 provided at both ends and an intermediate portion c2 that connects the two second welding portions c1. The second welding portions c1 at both ends are respectively welded to different LED chips 25 so that the first conductive region 221b is welded to the two LED chips 25. Preferably, the through hole 14 is correspondingly arranged with the intermediate portion c2.

[0054] Since the reflecting cup on the dam should correspondingly cover an LED chip after the dam is bonded to the substrate, in the first embodiment, one first conductive region 121 is only connected to one LED chip 15, and each reflecting cup 17 covers one LED chip 15 and two first conductive regions 121. However, in the second embodiment of the present invention, the first conductive region 221b is connected to two adjacent LED chips. In order to prevent the dam 26 from pressing and damaging the first conductive region 221b, an avoidance groove 261 is further provided on the side of the dam 26 bonded to the substrate 21. The avoidance groove 261 connects two adjacent reflecting cups 27, and the intermediate portion c2 is accommodated in the middle avoidance groove 261 so that the reflecting cup 27 correspondingly covers one LED chip 25, the first conductive region 221a welded thereto, and one of the welding portions c1 of the first conductive region 221b.

[0055] The first metal layer 22, the second metal layer 23, the dam 26, and the reflecting cup 27 in the second embodiment of the present invention are the same as the relevant contents in the first embodiment and will not be elaborated here.

[0056] Similar to the first embodiment, the second conductive region 231 is recessed toward the first conductive region 221 to form a receiving groove 28, and the conductive material is preferably solder paste 29. The formation method and setting of the receiving groove 28 are the same as the relevant contents in the first embodiment and will not be elaborated here.

[0057] Based on the first embodiment, in the second embodiment of the present invention, two LED chips are commonly welded to a first conductive region 221b, arranged symmetrically and sharing a through hole 24. The metal layers between the reflecting cups 27 are connected by conductive through holes 24, so that the reflecting cups 27 can be common cathode or common anode. In addition, the cutting route of the laser cutting solder paste device groove is also saved, achieving the effect of reducing costs.

[0058] Both of the above LED brackets 1 or 2 can be made as a whole board (please refer to Figure 10 ), fill the epoxy resin in the reflecting cup 17 or 27 for encapsulation. After the encapsulation is completed, use a high-speed resin cutting knife or laser cutting to cut and separate to obtain the LED bracket monomer. Finally, the wall thickness of the reflecting cup 17 or 27 after cutting is more than 0.05 mm. Since the substrate and the dam of the present invention are prepared by using ceramic materials, after the epoxy resin is filled in the reflecting cup 17 or 27, cutting with a laser or a resin cutting knife will not cause the rupture of the ultra-thin reflecting cup 17 or 27.

[0059] Based on the LED brackets 1 and 2 of the above embodiments, the present invention also provides a method for preparing an LED bracket, including the following steps:

[0060] Step S1, obtain a substrate prepared by using ceramic materials, and use a laser cutting method to form a plurality of spaced through holes on the substrate;

[0061] Step S2, use at least one of magnetron sputtering, sintering or plating to form a first metal layer and a second metal layer on two opposite surfaces of the substrate. The first metal layer includes a plurality of first conductive regions corresponding to and spaced from the through holes, and the second metal layer includes a plurality of second conductive regions corresponding to and spaced from the through holes. The through holes communicate the first conductive regions and the second conductive regions;

[0062] Step S3, weld a plurality of LED chips on two adjacent first conductive regions;

[0063] Step S4, obtain a dam prepared by using ceramic materials, and use a laser cutting method to form a plurality of through reflecting cups on the dam;

[0064] Step S5, bond the cut dam to the substrate so that the reflecting cup correspondingly surrounds the LED chip;

[0065] Step S6, encapsulate the bonded dam and substrate, and use a laser or a resin knife to cut to form the LED bracket monomer.

[0066] Among them, the sizes of the substrate and the dam can be ceramic bodies of 100 mm * 100 mm or 120 mm * 120 mm. The first conductive regions, the second conductive regions and the through holes are evenly distributed on the substrate and are evenly distributed in an array form. The second metal region can be set as a regular figure, such as a rectangle shown in the figure. The through holes are filled with a conductive material such as solder paste. The second metal region is recessed toward the first metal region side during the formation process to form a receiving groove for receiving the solder paste. The first metal layer and the second metal layer respectively form a metal circuit layer. The through holes and the conductive material together conduct the first conductive region and the second conductive region as electrodes. The LED chip straddles two adjacent first conductive regions so that the LED chip is connected to the two electrodes.

[0067] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0068] The above embodiments only express the preferred embodiments of the present invention, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent shall be subject to the appended claims.

Claims

1. An LED bracket, characterized in that, The LED bracket includes: a substrate made of ceramic material; a first metal layer disposed on one surface of the substrate, and a plurality of first conductive regions are formed at intervals; a second metal layer disposed on the other surface of the substrate, opposite to the first metal layer, and a plurality of second conductive regions are formed at intervals in the second metal layer; a through hole communicating the first conductive region and the second conductive region, and a conductive material is provided in the through hole; The first conductive region includes a first conductive region connected to only one LED chip and a first conductive region connected to two adjacent LED chips. The first conductive region includes two welding portions provided at both ends and an intermediate portion connecting the two second welding portions. The second welding portions at both ends are respectively welded to different LED chips, so that the first conductive region is welded to two LED chips; The second conductive region is recessed toward the first conductive region to form a receiving groove; the formation of the receiving groove is as follows: during the process of forming a through hole on the substrate by laser cutting, a connected groove is directly formed around the through hole on the lower surface of the substrate by laser cutting, and then at least one of magnetron sputtering, sintering or electroplating is used to form a recessed second conductive region in the groove and around the groove, thereby forming the receiving groove; LED chips connected to two adjacent first conductive regions; a dam surrounding the first metal layer and bonded to the substrate, and a reflecting cup is provided on the dam to surround the LED chips; A relief groove is further provided on the side where the dam is bonded to the substrate. The relief groove connects two adjacent reflecting cups, and the intermediate portion is received in the middle relief groove, so that the reflecting cup correspondingly covers one LED chip, the first conductive region welded thereto, and one of the welding portions of the first conductive region.

2. The LED bracket according to claim 1, characterized in that, The first conductive region includes a first welding portion welded to the LED chip.

3. The LED bracket according to claim 1, wherein, The conductive material is solder paste, and the solder paste is filled into the through hole from the receiving groove.

4. The LED bracket according to claim 1, characterized in that, The first metal layer and the second metal layer are coated on the substrate by at least one of magnetron sputtering, sintering or electroplating.

5. The LED bracket according to claim 1, wherein, The dam is made of ceramic material, and the reflecting cup is prepared by laser cutting.

6. The LED bracket according to claim 1, characterized in that, A plurality of the first conductive regions are uniformly distributed on the substrate in a rectangular array.

7. A method for preparing an LED bracket, characterized in that, For preparing the LED bracket according to any one of claims 1-6, the preparation method includes: Obtaining a substrate made of ceramic material, and forming a plurality of spaced through holes on the substrate by laser cutting; Using at least one of magnetron sputtering, sintering or electroplating to form a first metal layer and a second metal layer on two opposite surfaces of the substrate, wherein the first metal layer includes a plurality of first conductive regions corresponding to and spaced from the through holes, the second metal layer includes a plurality of second conductive regions corresponding to and spaced from the through holes, and the through holes communicate the first conductive regions and the second conductive regions; The first conductive region includes a first conductive region connected to only one LED chip and a first conductive region connected to two adjacent LED chips. The first conductive region includes two welding portions provided at both ends and an intermediate portion connecting the two second welding portions. The second welding portions at both ends are respectively welded to different LED chips, so that the first conductive region is welded to two LED chips; The second conductive region is recessed toward the first conductive region to form a receiving groove; the formation of the receiving groove is as follows: during the process of forming a through hole on a substrate by laser cutting, a connected groove is directly formed around the through hole on the lower surface of the substrate by laser cutting, and then at least one of magnetron sputtering, sintering or electroplating is used to form a recessed second conductive region around the groove and the groove, thereby forming the receiving groove; A plurality of LED chips are welded on two adjacent first conductive regions; A dam made of ceramic material is obtained, and a plurality of through reflection cups are formed on the dam by laser cutting; The cut dam is bonded to the substrate so that the reflection cups correspondingly surround the LED chips; A relief groove is further provided on one side of the dam bonded to the substrate. The relief groove connects two adjacent reflection cups, and the middle part is received in the middle relief groove, so that the reflection cups correspondingly cover an LED chip, the first conductive region welded thereto, and one of the welding parts of the first conductive region; The bonded dam and substrate are encapsulated, and an LED bracket monomer is formed by laser or resin knife cutting.

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