A buffering table device suitable for bonding 12-inch semiconductor crystal rods

By designing a 12-inch semiconductor crystal rod bonding cache table device, the precuring time is automatically recorded using the RFID reading device and the working indicator light, the problem of difficulty in controlling the precuring time in the manufacturing of semiconductor silicon polishing sheets is solved, and the risk of human error is reduced. Improves productivity and safety.

CN112440192BActive Publication Date: 2025-01-17ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202011466324.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-12-14
Publication Date
2025-01-17
Estimated Expiration
2040-12-14

AI Technical Summary

Technical Problem

During the manufacturing process of semiconductor silicon polishing sheet, it is difficult to control the precuring time in the adhesive rod process, which leads to the crystal rod being easily disengaged or affects the production efficiency, and manual recording of the curing time is prone to errors, which poses high material and safety risks.

Method used

A 12-inch semiconductor crystal rod bonding buffer table device is designed, including a workbench, support legs, universal wheel, RFID reading device, spacer and working indicator light, automatically recording the precuring time and reducing manual intervention. , ensure accurate timing of materials.

Benefits of technology

It effectively reduces the risk of human error, improves the accuracy and safety of the pre-curing process, reduces manual intervention, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a caching table device suitable for bonding 12-inch semiconductor crystal rods, comprising a workbench, four supporting legs are fixedly installed at the four corners of the bottom of the workbench, universal wheels are rotatably installed at the bottom of the supporting legs, side panels and a rear panel are respectively fixedly installed between the supporting legs, hinges are respectively fixedly installed on the same sides of the two supporting legs, two door panels are rotatably installed on the ends of the hinges away from the supporting legs, and handles are respectively fixedly installed on one side of the door panels; a rear baffle is fixedly installed on one side of the top of the workbench, a plurality of antenna brackets are fixedly installed on one side of the rear baffle, a plurality of crystal rod bonding cache components are arranged on the side of the antenna bracket away from the rear baffle, an RFID reading device is fixedly installed on the top of the side of the crystal rod bonding cache component close to the antenna bracket, a material separator is fixedly installed between the crystal rod bonding cache components, and a working indicator light is fixedly installed on the side of the material separator away from the rear baffle.
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Description

Technical Field

[0001] The invention relates to the technical field of semiconductor polishing sheet manufacturing, in particular to a buffer table device suitable for bonding 12-inch semiconductor crystal rods. Background Art

[0002] In the field of semiconductor silicon polishing wafer manufacturing, the stick bonding process (bonding the wire cutting material holder and the crystal rod together) is a very important part of the entire processing process. In this process, the most important part is the control of the pre-curing time. If the curing time is insufficient, the crystal rod is easy to separate from the material holder during the wire cutting process, causing quality and machine accidents. If the curing time is too long, it will affect production efficiency. At present, operators of the stick bonding process use conventional tables for pre-curing buffering, and manually carry materials in and out of the table. The entire process is manually carried out, which poses extremely high material and safety risks. The curing time is also recorded manually, which is prone to human errors. For this reason, we propose a 12-inch semiconductor crystal rod bonding buffer table device to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide a buffer table device suitable for bonding 12-inch semiconductor crystal rods to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a 12-inch semiconductor crystal rod bonding buffer table device, comprising a workbench, four support legs are fixedly installed at the four corners of the bottom of the workbench, universal wheels are rotatably installed at the bottom of the support legs, side panels and a rear panel are respectively fixedly installed between the support legs, hinges are respectively fixedly installed on the same sides of the two support legs, two door panels are rotatably installed at the ends of the hinges away from the support legs, and handles are respectively fixedly installed on one side of the door panels;

[0005] A rear baffle is fixedly installed on one side of the top of the workbench, a plurality of antenna brackets are fixedly installed on one side of the rear baffle, a plurality of crystal rod bonding cache components are provided on the side of the antenna bracket away from the rear baffle, an RFID reading device is fixedly installed on the top of the side of the crystal rod bonding cache component close to the antenna bracket, a material separator is fixedly installed between the crystal rod bonding cache components, and a working indicator light is fixedly provided on the side of the material separator away from the rear baffle.

[0006] Preferably, four bottom fixing frames are fixedly installed on the lower section of the supporting leg, and a bottom plate is fixedly installed between the bottom fixing frames.

[0007] Preferably, the spacer rack is a U-shaped structure and is fixedly installed between two adjacent crystal rod bonding cache assemblies.

[0008] Preferably, the crystal rod bonding cache assembly includes a material seat, which is fixedly mounted on the top of the workbench, and a plurality of rubber-coated rollers are rotatably mounted between the material seats. A storage groove is recessed at one end of the rubber-coated roller, and a material baffle plate is rotatably mounted at the other end, and the material baffle plate is rotatably mounted on one side of the top of the material seat.

[0009] Preferably, a material holder ID is separately provided in the material holder and each material holder has a different material holder ID, the material holder ID of the material holder is electrically connected to the RFID reading device, and the end of the material holder away from the rear baffle coincides with the end of the workbench in vertical position.

[0010] Compared with the prior art, the beneficial effects of the present invention are: ensuring accurate timing of materials during the pre-curing process and facilitating manual handling, without manual intervention in the entire process, and effectively reducing the risk of human intervention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the structure of the present invention;

[0012] Figure 2 It is a schematic diagram of the bottom structure of the present invention;

[0013] Figure 3 It is a schematic diagram of the structure of the crystal rod bonding cache assembly of the present invention.

[0014] In the figure: workbench 1, bottom fixing frame 2, supporting legs 3, universal wheels 4, side panels 5, RFID reading device 6, rear panel 7, bottom panel 8, door panel 9, handle 10, rear baffle 11, crystal rod bonding cache assembly 12, material holder 121, rubber-coated roller 122, storage slot 123, material baffle plate 124, antenna bracket 13, material spacing rack 14, hinge 15, work indicator light 16. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] See also Figure 1-3The present invention provides a technical solution: a caching table device suitable for bonding 12-inch semiconductor crystal rods, comprising a workbench 1, four supporting legs 3 are fixedly installed at the four corners of the bottom of the workbench 1, universal wheels 4 are rotatably installed at the bottom of the supporting legs 3, side panels 5 and rear panels 7 are respectively fixedly installed between the supporting legs 3, hinges 15 are respectively fixedly installed on the same sides of the two supporting legs 3, two door panels 9 are rotatably installed at the ends of the hinges 15 away from the supporting legs 3, and handles 10 are respectively fixedly installed on one side of the door panels 9;

[0017] like Figure 1 As shown, a rear baffle 11 is fixedly installed on one side of the top of the workbench 1, a plurality of antenna brackets 13 are fixedly installed on one side of the rear baffle 11, a plurality of crystal rod bonding cache components 12 are provided on the side of the antenna bracket 13 away from the rear baffle 11, an RFID reading device 6 is fixedly installed on the top of the side of the crystal rod bonding cache component 12 close to the antenna bracket 13, a material spacing rack 14 is fixedly installed between the crystal rod bonding cache components 12, a working indicator light 16 is fixedly provided on the side of the material spacing rack 14 away from the rear baffle 11, and the working indicator light 16 is used to display the pre-curing status of the material holder 121 and the single crystal;.

[0018] like Figure 2 As shown, four bottom fixing frames 2 are fixedly installed on the lower section of the supporting leg 3 , and a bottom plate 8 is fixedly installed between the bottom fixing frames 2 .

[0019] like Figure 1 As shown, the material spacer 14 is a U-shaped structure and is fixedly installed between two adjacent crystal rod bonding buffer assemblies 12. The material spacer 14 can prevent adjacent materials from tilting and colliding.

[0020] like Figure 1 and Figure 3 As shown, the crystal rod bonding buffer assembly 12 includes a material seat 121, which is fixedly mounted on the top of the workbench 1, and a plurality of rubber-coated rollers 122 are rotatably mounted between the material seats 121. A storage groove 123 is recessed at one end of the rubber-coated roller 122, and a material baffle plate 124 is rotatably mounted at the other end. The material baffle plate 124 is rotatably mounted on one side of the top of the material seat 121.

[0021] A material holder ID is separately provided in the material holder 121 and the material holder ID of each material holder 121 is different. The material holder ID of the material holder 121 is electrically connected to the RFID reading device 6. The RFID reading device 6 is mainly used to read the material holder ID and record material information to facilitate the upper system to perform pre-curing timing; the end of the material holder 121 away from the rear baffle 11 coincides with the vertical position of the end of the workbench 1, which is convenient for the crystal rod bonding cache assembly 12 to dock with the loading trolley.

[0022] Working principle: when the present invention is used, the present invention is manually docked with the loading trolley, and the material seat 121 of the crystal rod bonding cache component 12 is docked with the inlet and outlet of the loading trolley, so that the crystal rod can be put in and out of the warehouse. After the semiconductor crystal rod is bonded, it enters the material seat 121, and is driven by the rubber-coated roller 122 to enter the storage tank 123 for temporary storage. The operator flips the material baffle plate 124 to prevent the bonded semiconductor crystal rod from sliding back out from the entrance. After the bonded semiconductor crystal rod enters the storage tank 123, the RFID reading device 6 automatically reads the material seat ID, the working indicator light 16 is always on, and the relevant data is uploaded to the upper system through the antenna bracket 13. When the bonding rod is cured, the upper system sends an instruction to drive the working indicator light 16 corresponding to the position of the crystal rod bonding cache component 12 to flash, prompting the operator to take the material for the next process, thereby ensuring the accurate timing of the material during the pre-curing process and facilitating manual handling. There is no human intervention in the whole process, which effectively reduces the risk of human intervention.

[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A buffering table device suitable for bonding 12-inch semiconductor crystal rods, comprising a workbench (1), characterized in that: Four support legs (3) are fixedly installed at the four corners of the bottom of the workbench (1). A universal wheel (4) is rotatably installed at the bottom of the support leg (3). A side plate (5) and a rear plate (7) are respectively and fixedly installed between the support legs (3). Hinges (15) are fixedly installed on the same sides of two support legs (3). Two door panels (9) are rotatably installed at the ends of the hinges (15) away from the support legs (3). Handles (10) are respectively fixedly installed on one side of the door panels (9). A rear baffle (11) is fixedly installed on one side of the top of the workbench (1). A plurality of antenna brackets (13) are fixedly installed on one side of the rear baffle (11). A plurality of crystal bar bonding buffer components (12) are arranged on the side of the antenna bracket (13) away from the rear baffle (11). An RFID reading device (6) is fixedly installed at the top of one side of the crystal bar bonding buffer component (12) close to the antenna bracket (13). A material separation rack (14) is fixedly installed between the crystal bar bonding buffer components (12). A working indicator light (16) is fixedly arranged on the side of the material separation rack (14) away from the rear baffle (11). Four bottom fixing frames (2) are fixedly installed on the lower section of the support leg (3). A bottom plate (8) is fixedly installed between the bottom fixing frames (2); the material separation rack (14) is of a U-shaped structure and is fixedly installed between two adjacent crystal bar bonding buffer components (12); the crystal bar bonding buffer component (12) includes a material seat (121), the material seat (121) is fixedly installed on the top of the workbench (1), a plurality of rubber-coated rollers (122) are rotatably installed between the material seats (121), a storage groove (123) is concavely arranged at one end of the rubber-coated roller (122), a baffle (124) is rotatably installed at the other end, and the baffle (124) is rotatably installed on one side of the top of the material seat (121); a material seat ID is separately arranged in the material seat (121), and the material seat IDs of each material seat (121) are different. The material seat ID of the material seat (121) is electrically connected to the RFID reading device (6). The end of the material seat (121) away from the rear baffle (11) coincides with the vertical position of the end of the workbench (1).

Citation Information

Patent Citations

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    CN106995140A

  • Debubbling, pressurizing and curing equipment for stick gluing and use method thereof

    CN110873103A

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    CN203449296U

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