Interposer for display driver integrated circuit chips

Abstract

Semiconductor components for a display device include a display driver integrated circuit (DDIC) chip and an inserter coupled to the DDIC chip. The DDIC chip includes multiple output solder points and multiple input solder points. Furthermore, the DDIC chip is configured to drive multiple data lines of the display device to update the active area of ​​the display device. The inserter includes multiple output solder points coupled to the DDIC chip and is configured to couple to multiple output solder points of multiple data lines of the display device. The inserter also includes multiple input solder points coupled to the multiple input solder points of the DDIC chip. Furthermore, the width of the inserter is at least as large as the distance between the outermost data lines of the multiple data lines.

Description

Technical Field

[0001] The disclosure herein generally relates to electronic devices, and more specifically, to the installation of a display driver integrated circuit chip in a display device. Background Technology

[0002] Input devices, including proximity sensor devices, can be used in a variety of electronic systems. A proximity sensor device may include a sensing area defined by a surface, within which the proximity sensor device determines the presence, position, force, and / or motion of one or more input objects. Proximity sensor devices can be used to provide interfaces for electronic systems. For example, a display-integrated proximity sensor device can be used as an input device for larger computing systems, such as touchscreens integrated into or surrounding laptop or desktop computers. Display-integrated proximity sensor devices can also typically be used in smaller computing systems, such as touchscreens integrated into cellular phones. Additionally, proximity sensor devices can be implemented as part of a car's multimedia entertainment touchscreen system. Summary of the Invention

[0003] In one embodiment, the display device includes a display panel and a semiconductor component. The display panel includes a plurality of sub-pixels defining an active area of ​​the display panel, a substrate, and a plurality of data lines. The plurality of data lines are disposed within one or more layers of the substrate and coupled to the plurality of sub-pixels. The semiconductor component includes a display driver integrated circuit (DDIC) chip, which includes a plurality of output solder points and a plurality of input solder points. The semiconductor component also includes an inserter coupled to the DDIC and mounted to the substrate. The inserter includes a plurality of output solder points and a plurality of input solder points. The plurality of output solder points are coupled to the plurality of output solder points of the DDIC and coupled to the plurality of data lines. The plurality of input solder points are coupled to the plurality of input solder points of the DDIC. Furthermore, the width of the inserter is at least as large as the distance between the outermost of the plurality of data lines.

[0004] In one embodiment, the semiconductor component includes a display driver integrated circuit (DDIC) chip and an inserter coupled to the DDIC chip. The DDIC chip includes a plurality of output solder points and a plurality of input solder points, and is configured to drive a plurality of data lines of a display device to update the active area of ​​the display device. The inserter includes a plurality of output solder points coupled to the plurality of output solder points of the DDIC, and is configured to be coupled to the plurality of data lines of the display device. The inserter also includes a plurality of input solder points coupled to the plurality of input solder points of the DDIC. Furthermore, the width of the inserter is at least as large as the distance between the outermost data lines of the plurality of data lines.

[0005] In one embodiment, an inserter for a display device includes a plurality of output pins and a plurality of input solder points. The plurality of output pins are configured to couple to a plurality of output solder points of a display driver integrated circuit (DDIC) chip configured to drive a plurality of data lines to update the active area of ​​the display device. The plurality of output pins are also configured to couple to a plurality of data lines of the display device. The plurality of input solder points are configured to couple to a plurality of input pins of the DDIC. Furthermore, the width of the inserter is at least as large as the distance between the outermost of the plurality of data lines. Attached Figure Description

[0006] To enable a detailed understanding of the foregoing features of this disclosure, the more particular description of the disclosure briefly outlined above can be obtained by referring to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate exemplary embodiments only and are therefore not intended to limit the scope of the invention, as other equally effective embodiments are permissible with respect to this disclosure.

[0007] Figure 1 An example input device according to one or more embodiments is illustrated.

[0008] Figure 2 This is a schematic block diagram of an example display device according to one or more embodiments.

[0009] Figure 3 This is a schematic block diagram of an example semiconductor component according to one or more embodiments.

[0010] Figure 4 It is a schematic block diagram of an integrated circuit chip according to one or more embodiments.

[0011] Figure 5 This is a schematic block diagram of an inserter according to one or more embodiments.

[0012] Figure 6 This is a schematic block diagram of an example semiconductor component according to one or more embodiments.

[0013] Figure 7 and 8 It is a schematic block diagram of a part of a display device according to one or more embodiments.

[0014] Figure 9 , 10 11 and 12 are schematic block diagrams of a display device according to one or more embodiments.

[0015] Figure 13 It is a schematic block diagram of an input device according to one or more embodiments.

[0016] To facilitate understanding, the same reference numerals have been used where possible to denote common elements in the figures. It is contemplated that elements disclosed in one embodiment may be advantageously used in other embodiments without specific description. Unless specifically indicated, the drawings referenced herein should not be construed as being drawn to scale. Furthermore, for clarity of presentation and explanation, the drawings are often simplified and details or parts are omitted. The drawings and discussion are used to explain the principles of the following discussion, wherein the same reference numerals denote the same elements. Detailed Implementation

[0017] The following detailed descriptions are merely exemplary in nature and are not intended to limit this disclosure or its application and use. Furthermore, there is no intention to be bound by any express or implied theory presented in the foregoing background, summary of the invention, or the following detailed descriptions.

[0018] According to embodiments of this disclosure, as follows Figure 1 The example input device 100 shown can be configured to provide input to an electronic system. As used in this document, the term "electronic system" broadly refers to any system capable of processing information electronically. Some non-limiting examples of electronic systems include personal computers of all sizes and shapes, such as desktop computers, laptop computers, netbook computers, tablet computers, web browsers, e-book readers, personal digital assistants (PDAs), and automotive multimedia entertainment systems. Additional example electronic systems include composite input devices, such as a physical keyboard that includes input device 100 and separate joysticks or push-button switches. Other example electronic systems include peripheral devices, such as data input devices (e.g., remote controls and mice) and data output devices (e.g., displays and printers). Other examples include remote terminals, kiosks, video game consoles (e.g., video game consoles, portable gaming devices), automotive multimedia entertainment systems, etc. Other examples include communication devices (e.g., cellular phones, such as smartphones) and media devices (e.g., recorders, editors, and players, such as televisions, set-top boxes, music players, digital photo frames, and digital cameras). Additionally, an electronic system can be a master or slave device of an input device. An electronic system can also be referred to as an electronic device.

[0019] Input device 100 can be implemented as a physical part of an electronic system, or it can be physically separated from the electronic system. In one embodiment, the electronic system may be referred to as a host device. Depending on the situation, input device 100 may communicate with parts of the electronic system using any one or more of the following: buses, networks, and other wired or wireless interconnects. Examples include I 2 C, SPI, PS / 2, Universal Serial Bus (USB), Bluetooth, RF, and IRDA.

[0020] exist Figure 1 In this diagram, input device 100 is shown as a proximity sensor device configured to sense input provided by one or more input objects 140 in sensing area 120. Example input objects 140 include fingers and styluses, such as... Figure 1 As shown in the diagram. An exemplary proximity sensor device may be a touchpad, a touchscreen, a touch sensor device, etc. In one or more embodiments, the proximity sensor may be integrated as part of the display of the input device 100. For example, in an embodiment where the proximity sensor device is a touchscreen, the proximity sensor may be integrated as part of the display of the input device 100.

[0021] Sensing area 120 encompasses any space above, around, within, and / or near input device 100, in which input device 100 is capable of detecting user input, such as user input provided by one or more input objects 140. The size, shape, and location of a particular sensing area can vary widely depending on the embodiment. In some embodiments, sensing area 120 extends from the surface of input device 100 into space in one or more directions until the signal-to-noise ratio prevents sufficiently accurate object detection. In various embodiments, the distance that sensing area 120 extends in a particular direction can be approximately less than one millimeter, several millimeters, several centimeters, or more, and can vary significantly depending on the type of sensing technology used and the desired accuracy. Thus, sensing input in some embodiments includes: no contact with any surface of input device 100; contact with an input surface of input device 100 (e.g., a touch surface); contact with an input surface of input device 100 coupled with an amount of applied force or pressure; and / or combinations thereof. In various embodiments, the input surface can be provided by the surface of a housing in which sensor electrodes (also referred to herein as sensing electrodes) are located, by a panel applied to the sensor electrodes, or any housing, etc. In some embodiments, the sensing area 120 has a rectangular shape when projected onto the input surface of the input device 100. An input object that does not contact any surface of the input device 100 may be referred to as a hover input object.

[0022] Input device 100 can utilize any combination of sensor components and sensing technologies to detect user input in sensing area 120. Input device 100 includes one or more sensing elements for detecting user input. As several non-limiting examples, input device 100 may use capacitive, elastive, resistive, inductive, magnetic, acoustic, ultrasonic, and / or optical technologies.

[0023] Some implementations are configured to provide images spanning one-dimensional, two-dimensional, three-dimensional, or higher-dimensional spaces (e.g., capacitive signals). Some implementations are configured to provide projections of inputs along a specific axis or plane.

[0024] In some capacitive implementations of input device 100, a voltage or current is applied to create an electric field. A nearby input object causes a change in the electric field, resulting in a detectable change in capacitive coupling that can be detected as a change in voltage, current, etc.

[0025] Some capacitive implementations utilize arrays or other regular or irregular patterns of capacitive sensing elements to create an electric field. In some capacitive implementations, separate sensing elements can be ohmically shorted together to form a larger sensor electrode. Some capacitive implementations utilize resistive sheets, which can be uniformly resistive.

[0026] Some capacitive implementations utilize a "self-capacitance" (often also called "absolute capacitance") sensing method based on changes in capacitive coupling between sensor electrodes and an input object. In various embodiments, the input object near the sensor electrode alters the electric field near the sensor electrode, thus changing the measured capacitive coupling. In one embodiment, the absolute capacitance sensing method operates by modulating the sensor electrode relative to a reference voltage (e.g., system ground) and by detecting the capacitive coupling between the sensor electrode and the input object. In some embodiments, the sensing element may be formed from a substantially transparent metal mesh (e.g., a reflective or absorptive metal film patterned to minimize visible transmission loss from display sub-pixels). Furthermore, the sensor electrodes may be positioned above the display of the display device. The sensing electrodes may be formed on a common substrate of the display device (e.g., on the encapsulation layer of a rigid or flexible organic light-emitting diode (OLED) display). An additional dielectric layer with vias for a jumper layer may also be formed from a substantially transparent metal mesh material (e.g., between the user input and the OLED cathode). Jumpers in the jumper layer may be coupled to a first group of electrodes and across a second group of sensor electrodes.

[0027] Some capacitive implementations utilize a “mutual capacitance” (often also referred to as “transcapacitance”) sensing method based on changes in capacitive coupling between sensor electrodes. In various embodiments, an input object near the sensor electrodes alters the electric field between the sensor electrodes, thus changing the measured capacitive coupling. In one implementation, the transcapacitance sensing method operates by detecting the capacitive coupling between one or more transmitter sensor electrodes (also referred to herein as “transmitter electrodes” or “transmitters”) and one or more receiver sensor electrodes (also referred to herein as “receiver electrodes” or “receivers”). Coupling can be reduced when an input object coupled to system ground approaches the sensor electrodes. The transmitter sensor electrodes may be modulated relative to a reference voltage (e.g., system ground) to transmit a transcapacitance sensing signal. The receiver sensor electrodes may be kept substantially constant relative to a reference voltage or modulated relative to the transmitter sensor electrodes to facilitate receiving a result signal. The result signal may include one or more effects corresponding to one or more transcapacitance sensing signals and / or corresponding to one or more sources of environmental interference (e.g., other electromagnetic signals). The sensor electrodes may be dedicated transmitters or receivers, or may be configured to both transmit and receive.

[0028] exist Figure 1In this diagram, processing system 110 is shown as part of input device 100. Processing system 110 is configured to operate the hardware of input device 100 to detect input in sensing area 120. Processing system 110 includes part or all of one or more integrated circuit (IC) chips and / or other circuit components. For example, a processing system for a mutual capacitance sensor device may include: transmitter circuitry configured to transmit signals using transmitter sensor electrodes; and / or receiver circuitry configured to receive signals using receiver sensor electrodes. In some embodiments, processing system 110 also includes electronically readable instructions, such as firmware code, software code, and / or the like. In some embodiments, components of processing system 110 are located together, such as near one or more sensing elements of input device 100. In other embodiments, components of processing system 110 are physically separated, with one or more components proximate to one or more sensing elements of input device 100, and one or more components located elsewhere. For example, input device 100 may be a peripheral device coupled to a desktop computer, and processing system 110 may include software configured to run on the central processing unit (CPU) of the desktop computer and one or more ICs (with associated firmware in another embodiment) separate from the CPU. As another example, input device 100 may be physically integrated into a telephone, and processing system 110 may include circuitry and firmware that are part of the telephone's main processor (e.g., a mobile device application processor or any other CPU). In some embodiments, processing system 110 is dedicated to implementing input device 100. In other embodiments, processing system 110 also performs other functions, such as operating a display screen, driving haptic actuators, etc. For example, in one or more embodiments, processing system 110 may be configured to act as a display driver for the display screen.

[0029] The processing system 110 can be implemented as a collection of modules that operate different functions of the processing system 110. Each module may include circuitry, firmware, software, or a combination thereof that are part of the processing system 110. In various embodiments, different combinations of modules may be used.

[0030] In some embodiments, the processing system 110 responds directly to user input (or the absence of user input) in the sensing area 120 by inducing one or more actions. Example actions include changing operating modes and GUI actions such as cursor movement, selection, menu navigation, and other functions. In some embodiments, the processing system 110 provides information about the input (or the absence of input) to a portion of the electronic system, for example, to a central processing unit of the electronic system separate from the processing system 110 (if such a separate central processing unit exists). In some embodiments, a portion of the electronic system processes the information received from the processing system 110 to act on the user input, such as to facilitate a full range of actions including mode-changing actions and GUI actions.

[0031] For example, in some embodiments, processing system 110 operates one or more sensing elements of input device 100 to generate an electrical signal (e.g., a sensor data line) indicating input (or the absence of input) in sensing area 120. Processing system 110 may perform any appropriate amount of processing on the electrical signal as it generates information for the electronic system. For example, processing system 110 may digitize an analog electrical signal obtained from sensor electrodes. As another example, processing system 110 may perform filtering or other signal conditioning. Filtering may include one or more of demodulation, sampling, weighting, and accumulation of the analog or digital converted signal at an appropriate sensing time (e.g., for FIR digital or IIR switched capacitor filtering). The sensing time may be relative to a display output period (e.g., a display line update period or a blanking period). As yet another example, processing system 110 may subtract or otherwise account for a baseline such that the information reflects the difference between the electrical signal from the user input and the baseline signal. The baseline can take into account display update signals (e.g., subpixel data signals, gate select and deselect signals, or transmit control signals), which are spatially filtered (e.g., demodulated and accumulated) and removed from the baseline sensed at lower spatial frequencies. Furthermore, the baseline can compensate for capacitive coupling between sensor electrodes and one or more nearby electrodes. Nearby electrodes can be display electrodes, dummy sensor electrodes, and other conductive objects that can be capacitively coupled to the sensor electrodes. Additionally, the baseline can be compensated using digital or analog methods. As other examples, the processing system 110 can determine location information, identify input as commands, recognize handwriting, etc.

[0032] As used herein, “position information” broadly encompasses absolute position, relative position, velocity, acceleration, and other types of spatial information. Exemplary “zero-dimensional” position information includes near / far or contact / non-contact information. Exemplary “one-dimensional” position information includes position along an axis. Exemplary “two-dimensional” position information includes motion in a plane. Exemplary “three-dimensional” position information includes instantaneous or average velocity in space. Other examples include other representations of spatial information. Historical data regarding one or more types of position information may also be determined and / or stored, including, for example, historical data tracking position, motion, or instantaneous velocity over time.

[0033] In some embodiments, the input device 100 is implemented using additional input components operated by the processing system 110 or some other processing system. These additional input components can provide redundant functionality or some other functionality for input in the sensing area 120. Figure 1 A button 130 is shown near the sensing area 120, which can be used to facilitate selection of items using the input device 100. Other types of additional input components include sliders, balls, wheels, switches, etc. Conversely, in some embodiments, the input device 100 may be implemented without utilizing additional input components.

[0034] In some embodiments, input device 100 includes a touchscreen interface, and sensing area 120 overlaps at least partially with a display screen. For example, sensing area 120 may overlap at least a portion of an active area of ​​the display screen (or display panel). The active area of ​​the display panel may correspond to a portion of the display panel where an image is updated. In one or more embodiments, input device 100 may include substantially transparent sensor electrodes covering the display screen and providing a touchscreen interface to associated electronic systems. The display panel may be any type of dynamic display capable of displaying a visual interface to a user and may include any type of light-emitting diode (LED), OLED, cathode ray tube (CRT), liquid crystal display (LCD), plasma, electroluminescent (EL), or other display technologies. Input device 100 and display panel may share physical components. For example, some embodiments may utilize some of the same electrical components for display and sensing. As another example, the display panel may be partially or wholly operated by processing system 110.

[0035] It should be understood that although many embodiments of this disclosure have been described in the context of a fully functional apparatus, the mechanisms of this disclosure can be distributed in various forms as program products (e.g., software). For example, the mechanisms of this disclosure can be implemented and distributed as software programs on information-bearing media readable by an electronic processor, such as a non-transitory computer-readable and / or recordable / writable information-bearing medium readable by processing system 110. Furthermore, embodiments of this disclosure are equally applicable regardless of the specific type of medium used to perform the distribution. Examples of non-transitory electronically readable media include various disks, memory sticks, memory cards, storage modules, etc. Electronically readable media can be based on flash, optical, magnetic, holographic, or any other storage technology.

[0036] Figure 2 A display device 200 according to one or more embodiments is illustrated. The display device 200 includes a display panel 210 and a semiconductor component 220. In one embodiment, the display device 200 is part of an input device 100.

[0037] In various embodiments, display panel 210 is an organic light-emitting diode (OLED) display. In other embodiments, display panel 210 may be other types of displays. For example, display panel 210 may be one of light-emitting diodes (LEDs), cathode ray tubes (CRTs), liquid crystal displays (LCDs), plasma displays, electroluminescent displays (ELs), micro OLEDs, or other display technologies.

[0038] Display panel 210 includes sub-pixels 215, gate lines 217, data lines 216, and substrate 214. Furthermore, display panel 210 includes an active region 212. The active region 212 corresponds to an area of ​​display panel 210 where an image is updated. In one or more embodiments, the active region 212 corresponds to an area of ​​display panel 210 where sub-pixels 215 are disposed. Additionally, the active region 212 has a width 218. The width 218 may correspond to the distance between the outermost sub-pixels 215 of display panel 210. For example, the width 218 may be defined as the distance between a column of sub-pixels 215 adjacent to the edge 244 of the active region 212 or between a column of sub-pixels 215 adjacent to the edge 242 of the active region 212 or between sub-pixels 215 adjacent to the edge 242 of the active region 212.

[0039] Subpixel 215 may include different types of subpixels. For example, subpixel 215 may include red subpixels, green subpixels, and blue subpixels. Additionally, subpixel 215 may include subpixels of other colors. In one or more embodiments, where an optical proximity sensor is included in the display, the data line may include a connection via a thin-film transistor (TFT) switch to a photoelectric sensor (e.g., a photodiode or phototransistor) that responds to local illumination and / or utilizes the reflection of voltage, charge, or current. The voltage, charge, or current of the photoelectric sensor may be sensed by sensing circuitry within the processing system 110.

[0040] Subpixels 215 are grouped to form pixels. Subpixels 215 can be arranged in various orders (e.g., layouts) to form pixels. For example, subpixels 215 can be configured such that each pixel includes a red subpixel, a green subpixel, and a blue subpixel in a subpixel layout. A subpixel layout consisting of red, green, and blue subpixels can be referred to as an RGB subpixel layout. Alternatively, subpixels 215 can be configured such that each pixel includes a red subpixel, a first green subpixel, a blue subpixel, and a second green subpixel in a subpixel layout. Furthermore, subpixels 215 can be configured such that each pixel includes a red subpixel, a first green subpixel, a second green subpixel, and a blue subpixel in a subpixel layout. In other embodiments, other subpixel layouts can be utilized.

[0041] Each subpixel 215 is coupled to a gate line 217 and a data line (e.g., a data or source electrode) 216. In one embodiment, the gate line 217 is coupled to one or more subpixels 215 arranged in a common row. In one or more embodiments, at least two gate lines 217 are coupled to subpixels in a common row. In various embodiments, the subpixels 215 forming a display row may be referred to as a display line. In one or more embodiments, the display rows and columns may form a “Z” pattern to ensure that the fill density of the subpixels is uniform.

[0042] Each subpixel 215 includes subpixel circuitry. The subpixel circuitry may include one or more transistors configured to control the activation and deactivation of each subpixel 215. Furthermore, the subpixel circuitry may control the current through each subpixel 215 to update the subpixel 215. The subpixel circuitry of each subpixel 215 is coupled to a corresponding gate line 217, data line 216, and pixel electrode (not shown).

[0043] Each data line 216 is coupled to a column of sub-pixels 215. In one embodiment, each data line 216 is coupled to each sub-pixel 215 of a common column of sub-pixels 215. In various embodiments, the data lines 216 may be set with a pitch of 219. In one or more embodiments, the pitch 219 may be the same between each data line 216, or the pitch 219 between a first pair of data lines 216 may be different from the pitch of a second pair of data lines 216. Additionally, the data lines 216 may have a width 228. The width 228 may be the distance between the outermost data lines 216. For example, the width 228 may be the distance between data lines 216 adjacent to the edge 251 of the display device 200 and data lines 216 adjacent to the edge 250 of the display device 200. Furthermore, the width 228 can be the distance between the data line 216 associated with the column of sub-pixels or sub-pixels 215 of the edge 244 of the adjacent active region 212 and the data line 216 associated with the column of sub-pixels or sub-pixels 215 of the edge 242 of the adjacent active region 212. The width 228 of the data line 216 can be less than, greater than or equal to the width 218 of the active region 212.

[0044] In many embodiments, corresponding plurality of gate lines 217 and corresponding plurality of data lines 216 intersect each other in the vicinity of each sub-pixel 215. Furthermore, the connections between each sub-pixel 215 and its corresponding gate line 217 and / or corresponding data line 216 may alternate on either side of a common column or display row. In one or more embodiments, the connections between one or more sub-pixels 215 and gate lines 217 may intersect with one or more other gate lines 217.

[0045] The substrate 214 can be rigid or flexible. For example, among other things, the substrate 214 can be a glass substrate or a plastic substrate. In other embodiments, the substrate 214 is flexible, and at least a portion of the substrate 214 is attached to a rigid support. Furthermore, a portion of the substrate 214 can be folded and positioned beneath a portion of the display device 200. Additionally, gate lines 217 and data lines 216 can be disposed on or within one or more layers of the substrate 214.

[0046] The display panel 210 may additionally include a common voltage electrode (Vcom electrode) or a cathode electrode. The Vcom electrode may be formed by a single electrode or multiple electrodes. Furthermore, the Vcom electrode acts as a reference relative to which sub-pixels 215 are driven for updating. For example, the voltage difference between the sub-pixel electrode and the Vcom electrode of each sub-pixel 215 determines the brightness of each sub-pixel 215. The cathode electrode may be a solid sheet of resistive material overlapping one or more sub-pixels 215. The cathode electrode may be coupled to and driven by the processing system 110. In one embodiment, the voltage difference between the cathode and anode electrodes of each sub-pixel 215 corresponds to the amount of light emitted by each sub-pixel 215.

[0047] In various embodiments, the display panel 210 may include additional electrodes, such as power electrodes and / or emission control electrodes. The power electrodes may supply one or more power voltages to the display panel 210. Furthermore, each emission control electrode may be coupled to a corresponding one of the sub-pixels 215 and configured to control an emission period (e.g., the period during which each sub-pixel 215 emits light). In one embodiment, the emission control electrodes may be disposed parallel to the gate line 217. Additionally, the emission control electrodes may be controlled by emission control circuitry.

[0048] Semiconductor component 220 includes processing system 110 and inserter 230. Processing system 110 includes display driver integrated circuit (DDIC) chip 222. In one embodiment, DDIC chip 222 may be referred to as a DDIC chip. Processing system 110 may additionally include optional IC chip 224. In other embodiments, processing system 110 includes additional IC chips such that the total number of IC chips within processing system 110 is greater than two. In one embodiment, DDIC chip 222 may be TDDI (Touch Display Driver IC Chip), wherein input sensing circuitry and display driver circuitry are integrated onto the same IC chip.

[0049] DDIC chip 222 is configured to drive data line 216 to update the active area 212 of display panel 210, and can be configured to sense data from a portion of the data line. In one embodiment, DDIC chip 222 drives a data signal onto data line 216 to update sub-pixels 215. The data signal can be a voltage signal. For example, the data signal can be between approximately -2V and approximately 10V. In other embodiments, other voltages can be utilized. DDIC chip 222 can also provide instructions and / or gate selection signals to gate control circuitry (not shown) to activate and / or deactivate the sub-pixels 215 for updating the image displayed by display device 200. DDIC chip 222 can also receive image data from an external process. DDIC chip 222 can process the image data to generate a data signal driven on the data line.

[0050] DDIC chip 222 may include circuitry configured to drive data line 216 using data signals. For example, DDIC chip 222 may include one or more source drivers configured to couple to data line 216. In one or more embodiments, each source driver may be coupled to a different data line 216. In one or more embodiments, DDIC chip 222 includes sensing circuitry coupled to the sensing data line to receive (e.g., optical or capacitive) sensing signals. DDIC chip 222 may additionally include a receiver interface configured to receive display data. For example, the receiver interface may be a Mobile Industrial Processor Interface (MIPI). In other embodiments, other interfaces may be utilized. Furthermore, among other things, DDIC chip 222 may include one or more of power supply circuitry, gate driver circuitry, transmit control driver circuitry, image processing circuitry, and a memory buffer.

[0051] The DDIC chip 222 can use data signals to drive data line 216 during each display frame to update the corresponding displayed image within sub-pixels 215 and active areas 212. In one embodiment, the display frame can be updated or refreshed approximately every 16 ms, thereby generating a display refresh rate of 60 Hz. In other embodiments, other display refresh rates can be used. For example, the display refresh rate can be 90, 210 Hz, 240 Hz, or utilized.

[0052] In one or more embodiments, the DDIC chip 222 may generate timing signals such as a vertical sync (VSYNC) signal to start and / or end a display frame. The VSYNC signal may indicate the selection of gate lines 217 and sub-pixels 215 for display updates. In one embodiment, the VSYNC signal may additionally or alternatively identify one or more vertical blanking periods within a display frame.

[0053] In various embodiments, the DDIC chip 222 can be configured to generate timing signals such as a horizontal sync (HSYNC) signal that correspond to the start and / or end of a display line update period. In one embodiment, the horizontal sync signal may additionally or alternatively identify one or more blanking periods corresponding to a display line update period.

[0054] In one embodiment, the DDIC chip 222 utilizes a timing signal such as a display enable signal, which may be a composite signal of both HSYNC and VSYNC signals.

[0055] In one embodiment, gate line 217 is driven using gate select and gate deselect signals to select (activate) and deselect (deactivate) sub-pixels 215 for updating. The gate select signal may be referred to as the gate high signal or V. GH And the gate deselect signal can be referred to as the gate low signal or V. GL In addition, V GH and V GL This corresponds to the on and off voltages of the transistors configured to control the activation and deactivation of sub-pixels. In one embodiment, V GH It is a positive voltage, and V GL It is a negative voltage. For example, V GH It could be approximately 15V, while V GL It can be approximately -10V. However, in other embodiments, other voltages can be used.

[0056] In one embodiment, the display driver circuitry of the DDIC chip 222 is configured to process display data to generate a data signal driven by the source driver on the sub-pixel 215 to update the active area 212 of the display panel 210. For example, the DDIC chip 222 may be configured to receive display data, decompress the display data, and process the decompressed display data to generate a data signal. In various embodiments, processing the display data includes one or more of scaling the display data, performing image processing on the display data, and adjusting the gamma level of the display data.

[0057] In one embodiment, IC chip 224 may be a storage device. For example, IC chip 224 may be flash memory. In other embodiments, IC chip 224 may be other types of storage devices. In one or more embodiments, IC chip 224 is a digital IC chip, while DDIC chip 222 is a source driver IC chip. In such an embodiment, IC chip 224 may generate data signals and provide them to DDIC chip 222, and DDIC chip 222 may use the data signals to drive sub-pixels 215 to update the active area 212 of display panel 210. In various embodiments, IC chip 224 may be a display driver IC chip configured to be similar to DDIC chip 222. In other embodiments, IC chip 224 may be configured for capacitive or optical sensing, as described later. For example, in one embodiment, IC chip 224 may be a discrete touch (or input sensing) controller. Furthermore, in one or more embodiments, although processing system 110 is depicted as including DDIC chip 222 and IC chip 224, processing system 110 may include additional IC chips. For example, the processing system 110 may include three or more IC chips.

[0058] In various embodiments, one or more of the DDIC chip 222 and IC chip 224 of the processing system 110 are mounted to an inserter 230 forming a semiconductor assembly 220. The inserter 230 may be formed of an organic material or a silicon material. The inserter 230 is mounted to a substrate 214 and communicatively couples the DDIC chip 222 and / or the IC chip 224 to a data line 216 and other display elements of the display device 200. Additionally, the inserter 230 may communicatively couple the DDIC chip 222 to the IC chip 224. In one embodiment, the inserter 230 is mounted to the substrate 214 such that the edge 245 of the inserter 230 is adjacent to the edge 243 of the active region 212. Furthermore, the edge 245 of the inserter 230 may be approximately 500 μm away from the edge 243 of the active region 212. In other embodiments, the edge 245 of the inserter may be less than or greater than 500 μm away from the edge 243 of the active region 212.

[0059] Insertor 230 has a width 226. In one embodiment, the width 226 of insertor 230 is the same as the width 218 of active region 212. In other embodiments, the width 226 of insertor 230 is greater than the width 218 of active region 212. In one embodiment, the width 226 of insertor 230 is less than the width 218 of active region 212. In one or more embodiments, the width 226 of insertor 230 is greater than the width 228 of data line 216. For example, edge 246 of insertor 230 extends outside the first outermost one of data lines 216, while edge 247 of insertor 230 extends outside the second outermost one of data lines 216. In one embodiment, edge 246 of insertor 230 extends outside the data line 216 adjacent to edge 242 of active region 212, while edge 247 of insertor 230 extends outside the data line 216 adjacent to edge 244 of active region 212. In one embodiment, the width 226 of the inserter 230 is smaller than the width 218 of the active region 212 and larger than the width 228 of the data line 216. In one or more embodiments, the width 226 of the inserter 230 is larger than the width of a typical integrated circuit and up to the width of the movable display interface film. For example, the width 226 of the inserter 230 is in the range of approximately 33 mm to approximately 70 mm. However, the width 226 of the inserter 230 may be greater than approximately 70 mm.

[0060] In various embodiments, the width 226 of the inserter 230 is at least 30 mm. Furthermore, the width 226 of the inserter 230 is wider than the combined width of the data cables 216. In one or more embodiments, the width 226 of the inserter 230 is at least 32 mm. In one or more embodiments, the aspect ratio of the width 226 to the length 227 of the inserter 230 is at least about 30 to about 1. Alternatively, the aspect ratio of the inserter 230 may be greater than about 30 to about 1 or less than about 30 to about 1.

[0061] In various embodiments, since the width 226 of the inserter 230 is at least as large as the width 218 of the active region 212 and / or the width 228 of the data line 216, a connection can be formed between the inserter 230 and the data line 216 without using a fan-out region. That is, there is no fan-out of the wiring coupling the data line 216 to the inserter 230. Therefore, the length of each data line 216 is substantially similar. For example, the length of each data line 216 is within the manufacturing tolerance of each other's lengths. Furthermore, the substantially similar length of each data line 216 makes the resistance of each data line 216 within the manufacturing tolerance of each other's resistances. Therefore, since all data lines 216 are substantially the same length, any difference in resistance between the data lines 216 is mitigated and / or eliminated. Additionally, the pitch 219 between each data line 216 can be consistent along the length of each data line 216. Therefore, the need to add expensive resistor balancing components to the data lines 216 of the DDIC chip 222 is eliminated, thereby reducing the cost of the display device 200 and simplifying and reducing manufacturing costs.

[0062] In one or more embodiments, the DDIC chip 222 and / or IC chip 224 may be tested for appropriate functionality before being mounted into the inserter 230. Furthermore, in one embodiment, the semiconductor component 220 may be tested for appropriate functionality after the DDIC chip 222 and / or IC chip 224 has been mounted into the inserter 230.

[0063] In one embodiment, the inserter 230 is mounted to the substrate 214 using a bonding head including one or more notches sized and positioned according to the size and location of at least one of the DDIC chip 222 and IC chip 224. Furthermore, when the bonding head contacts the inserter 230 to mount the inserter to the substrate 214, the DDIC chip 222 and / or IC chip 224 are substantially not contacted by the bonding head. In various embodiments, because the pads of the inserter 230 are positioned along the periphery of the inserter 230, the use of a bonding head including notches ensures that at least a majority of the pressure applied to bond the inserter 230 to the substrate 214 is applied to the pads of the inserter 230. For example... Figure 5One embodiment is illustrated, in which pads 510 and 512 are arranged around the periphery of inserter 230. In one embodiment, substrate 214 is glass, and mounting the inserter to substrate 214 can be referred to as chip-on-glass (COG) mounting. In another embodiment, substrate 214 is plastic, and mounting the inserter to substrate 214 can be referred to as chip-on-plastic (COP) mounting. In still other embodiments, substrate 214 is a film, and mounting the inserter to substrate 214 can be referred to as chip-on-film (COF) mounting.

[0064] Figure 3 The illustration shows a schematic cross-sectional view of a semiconductor component 220 according to one or more embodiments. The semiconductor component 220 includes a DDIC chip 222 and an inserter 230. In various embodiments, the semiconductor component 220 includes an additional IC chip, such as an IC chip 224. The DDIC chip 222 is coupled to the inserter 230 via connections 310 and 312. Furthermore, the inserter 230 is coupled to a substrate 214 via connections 318 and 316.

[0065] Connection 310 can be connected to the receiver interface of DDIC chip 222. Furthermore, connection 312 can be coupled to one or more of the source driver and other output circuits of DDIC chip 222. Connection 318 can be coupled to the host processor via traces disposed on substrate 214. Furthermore, connection 316 can be coupled to data lines 216 and / or other components of display panel 210 disposed on or within one or more layers of substrate 214 via traces disposed on or within one or more layers of substrate 214.

[0066] Each connection 310 and 312 can be coupled to the pads of the DDIC chip 222 and the inserter 230. Furthermore, each connection 310 and 312 can be formed using reflow solder balls. In various embodiments, each connection 316 and 318 can be coupled to the pads of the inserter 230 and the substrate 214. Furthermore, each connection 316 and 318 can be formed using reflow solder balls. In one or more embodiments, each connection 316 includes one or more bumps of one or more conductive materials. The conductive material may include, among other things, gold, tin, or copper. In other embodiments, the connection 316 includes one or more conductive adhesives. In one embodiment, the DDIC chip 222 is coupled to the inserter 230 via connections 310 and 312 before the inserter 230 is coupled to the substrate 214 via connections 316 and 318. In another embodiment, after inserter 230 is coupled to substrate 214 via connections 316 and 318, DDIC chip 222 is coupled to inserter 230 via connections 310 and 312.

[0067] Insertor 230 includes a connection 320 that couples the DDIC chip 222 to the substrate 214. For example, connection 320a couples connection 310 to connection 318. Additionally, connection 320b couples connection 312 to connection 316.

[0068] In one embodiment, one or more of the connections 320 include one or more vias (e.g., vias 321, 323) coupled vias 310 or 312 and 318 or 316 to one or more traces (e.g., trace 322) formed within one or more metal layers (e.g., intermediate distributed conductive layers) of the inserter 230. For example, connection 320a1 may include via 321a. l Trace 322a1 and through hole 323a l Through hole 321a1 connects trace 322a1 to one of the connections 310, while through hole 323a1 connects trace 322a1 to one of the connections 318. Furthermore, connection 320a2 may include through hole 321a2, trace 322a2, and through hole 323a2. Through hole 321a2 connects trace 322a2 to one of the connections 310, while through hole 323a2 connects trace 322a2 to one of the connections 318. Connection 320a3 may include through hole 321a3, trace 322a3, and through hole 323a3. Through hole 321a3 connects trace 322a3 to one of the connections 310, while through hole 323a3 connects trace 322a3 to one of the connections 318.

[0069] In one embodiment, connection 320b l It may include through hole 321b l Trajectory 322b l and through hole 323b l Through hole 321b l trace 322b l Connected to one of the connections 312, while through hole 323b l trace 322b l A connection is connected to one of the connections 316. Furthermore, connection 320b2 may include a through-hole 321b2, a trace 322b2, and a through-hole 323b2. Through-hole 321b2 connects trace 322b2 to one of the connections 312, while through-hole 323b2 connects trace 322b2 to one of the connections 316. Connection 320b3 may include a through-hole 321b3, a trace 322b3, and a through-hole 323b3. Through-hole 321b3 connects trace 322b3 to one of the connections 312, while through-hole 323b3 connects trace 322b3 to one of the connections 316.

[0070] In one embodiment, one or more connections 320 may include through-holes forming a direct connection between one of connections 310 and one of connections 318, thereby omitting traces formed within one or more metal layers of the inserter 230. Furthermore, in one or more embodiments, one or more connections 320 may include through-holes forming a direct connection between one of connections 312 and one of connections 316, thereby omitting traces formed within one or more metal layers of the inserter 230. In one or more embodiments, at least one of the connections 320 includes more than two through-holes and more than one trace in more than one metal layer of the inserter 230.

[0071] In one embodiment, the DDIC 340 has a height of approximately 100 μm or less. Furthermore, the inserter 220 has a height of approximately 200 μm or less. In various embodiments, the combined height of the DDIC chip 222 and the inserter 230 is approximately 250 μm or less.

[0072] Figure 4 This is a schematic bottom view of a portion of a DDIC chip 222 according to one or more embodiments. The DDIC chip 222 includes pads 410 and 412. Pad 410 can be coupled to the output circuitry of the DDIC chip 222. For example, pad 410 can be coupled to the source driver of the DDIC chip 222. Furthermore, the DDIC chip 222 can have any number of pads 410. For example, the number of pads 410 can be hundreds or thousands. Figure 4 As depicted, pads 410 are arranged in a common row. However, in other embodiments, pads 410 can be arranged in any number of rows. Furthermore, one or more rows can be offset from each other such that the center of the pads 410 in the first row is not aligned with the center of the pads 410 in another row.

[0073] In one or more embodiments, pad 410 may be configured such that pads in a common row have a common pitch. For example, pad 410 may have a pitch of 420 in the range of about 10 μm to about 60 μm.

[0074] Pad 412 can be coupled to the receiver interface of DDIC chip 222. Furthermore, DDIC chip 222 can have any number of pads 412. In various embodiments, the number of pads 412 is less than the number of pads 410. For example... Figure 4 As depicted, pads 412 are arranged in a common row. However, in other embodiments, pads 412 can be arranged in any number of rows. Furthermore, one or more rows can be offset from each other such that the center of the pads 412 in the first row is not aligned with the center of the pads 412 in another row.

[0075] Pad 412 can be configured such that pads in a common row have a common pitch. For example, pad 412 may have a pitch of 422 in the range of 40µm to 250µm. Furthermore, in one or more embodiments, pitch 422 is greater than pitch 420.

[0076] In various embodiments, Figure 3 Each connection 310 corresponds to the coupling between one of the pads 410 and the corresponding pad of the inserter 230. Furthermore, Figure 3 Each connection 312 corresponds to the coupling between one of the pads 412 and the corresponding pad of the inserter 230.

[0077] Figure 5 This is a schematic bottom view of a portion of the bottom of an inserter 230 according to one or more embodiments. The inserter 230 includes pads 510 and 512. The inserter 230 may have any number of pads 510. In one embodiment, the number of pads 510 is at least as large as the number of pads 410 of the DDIC chip 222. Furthermore, the pads 510 may be arranged in one or more rows. In various embodiments, the number of rows of pads 510 may be greater than, less than, or equal to the number of rows of pads 410.

[0078] In various embodiments, pad 510 has a pitch 520. Pitch 520 is at least as large as pitch 420. In other embodiments, pitch 520 is larger than pitch 420. For example, pitch 520 may be greater than 15 μm or greater than 20 μm. In one or more embodiments, pitch 520 is... Figure 2 The data lines 216 have the same pitch 219. Therefore, each pad 510 can be aligned with one or more data lines 216. Thus, the data lines 216 can be coupled to the pads 510 via the connection 316 without utilizing a fan-out area, in which the pitch of the data lines 216 is reduced. Furthermore, using the inserter 230 with pads 510 (with a pitch 520) reduces the possibility of manufacturing defects when manufacturing the display device 200, because the larger pitch allows for increased tolerances and greater flexibility when the inserter 230 is mounted to the substrate 214. Therefore, the corresponding cost of manufacturing the display device 200 is reduced.

[0079] The position, pitch, and / or orientation of pad 510 can vary depending on the position, pitch, and / or orientation of data line 216. For example, because pad 510 can be configured such that pitch 520 is similar to... Figure 2 The pitch is 219. Furthermore, the pads 510 can be configured such that at least one pad 510 corresponds to a position... Figure 2 The location of one of the data lines 216. Additionally, the inserter 230 may include a corresponding... Figure 4The location, size, and / or orientation of the pads 410 of the DDIC chip 222 (not shown). For example, two or more pads on top of the inserter 230 may have an orientation similar to that of the pads 410 and a pitch similar to that of the pitch 420.

[0080] The inserter 230 also includes pads 512. In various embodiments, the inserter 230 may have any number of pads 512. In one embodiment, the number of pads 512 is at least as large as the number of pads 412 of the DDIC chip 222. Furthermore, the pads 512 may be arranged in one or more rows. In various embodiments, the number of rows of pads 512 may be greater than, less than, or equal to the number of rows of pads 412.

[0081] In various embodiments, pad 512 has a pitch 522. Pitch 522 is at least as large as pitch 422. In other embodiments, pitch 522 is larger than pitch 422. Furthermore, pitch 522 may be larger than pitch 520.

[0082] The position, pitch, and / or orientation of pad 512 may vary depending on the position, pitch, and / or orientation of the traces on connector or substrate 214. Additionally, inserter 230 may include two or more pads (not shown) having corresponding... Figure 4 The location, size, and / or orientation of the pads 412 of the DDIC chip 222. For example, two or more pads on top of the inserter 230 may have an orientation similar to the orientation of the pads 412 and a pitch similar to the pitch of the pitch 422.

[0083] In one embodiment, Figure 3 Each connection 318 corresponds to the coupling between one of the pads 512 and the corresponding pad on the top of the substrate 214. Furthermore, Figure 3 Each connection 316 corresponds to the coupling between one of the pads 510 and the corresponding pad on the top of the substrate 214. Furthermore, connections 316 and 318 can be formed similarly to the connections 312 and 310.

[0084] Figure 6 An alternative embodiment of the semiconductor component 620 is illustrated. Figure 6 In this embodiment, DDIC chip 222 and IC chip 224 are mounted to inserter 230. Furthermore, a connection 310 is formed between DDIC chip 222 and inserter 230. Additionally, a connection 312 is formed between DDIC chip 222 and inserter 230. Connection 310 is coupled to connection 318 via connection 320a, and connection 312 is coupled to connection 316 via connection 320b.

[0085] In one or more embodiments, the DDIC chip 222 is communicatively coupled to the IC chip 224 via connections 610, 612, and 630, wherein connections 610, 612, and 630 include one or more vias and one or more traces formed within one or more metal layers of the inserter 230. For example, connection 630a may include vias 631a and 633a and trace 632a. Furthermore, connection 630b may include vias 631b and 633b and trace 632b. Additionally, the IC chip 224 may be coupled to one or more traces disposed on the substrate 214. For example, the IC chip 224 may be coupled to the inserter via connection 614, and the inserter 230 may be coupled to the substrate 214 via connection 618. Furthermore, connection 614 is coupled to connection 618 via connection 621. Connection 621 may include vias 622 and 624 and trace 623. In one or more embodiments, connections 614, 618, and 621 may be omitted. In other embodiments, one or more of connections 610, 612, and 630 may be omitted. Furthermore, although two connections 610, two connections 612, and two connections 630 are depicted, in other embodiments, more than two connections 610, more than two connections 612, and more than two connections 630 may be used. Additionally, in one or more embodiments, although a single connection 614, a single connection 618, and a single connection 621 are illustrated, more than a single connection 614, a single connection 618, and a single connection 621 may be used. In one embodiment, connection 621 may be formed by a single via and the trace may be omitted.

[0086] In one or more embodiments, more than two IC chips (e.g., DDIC chip 222 and IC chip 224) may be mounted to the inserter 230. In one or more embodiments, a first IC chip may be mounted on the inserter 230 and coupled to traces on the substrate 214 via corresponding connections. Furthermore, a second IC chip may be mounted to the inserter 230 and coupled to the first IC chip via corresponding connections, vias, and metal layers of the inserter 230. The second IC chip may or may not be coupled to traces on the substrate 214 via corresponding connections. Additionally, a third IC chip may be mounted to the inserter 230. The third chip may be communicatively coupled to the first IC chip via corresponding connections and metal traces within the inserter 230. Furthermore, the third chip may be communicatively coupled to the second IC chip via corresponding connections, vias, and metal traces within the inserter 230. Additionally, the third chip may be communicatively coupled to traces on the substrate 214 via corresponding connections. Furthermore, as described above, additional IC chips may be coupled to other IC chips and / or traces on the substrate 214.

[0087] Figure 7The illustration shows a top view of a display device 200 according to one or more embodiments. Figure 7 In one embodiment, the DDIC chip 222 is mounted to the inserter 230, and the inserter 230 is mounted to the substrate 214. In various embodiments, one or more additional IC chips 224 are also mounted to the inserter 230. Furthermore, a connector 710 is mounted to the substrate 214. The connector 710 may be a flexible connector. For example, the connector 710 may be a flexible printed circuit board (FPC). Additionally, the connector 710 may include one or more layers. For example, the connector 710 may include two or more layers. In one embodiment, the connector 710 includes one or more traces coupled to a processor of the input device 100.

[0088] Connector 710 is coupled to trace 720 disposed in one or more layers of substrate 214. Trace 720 is coupled to inserter 230 via one or more connections. For example, trace 720 is coupled to inserter 230 via connection 318.

[0089] Insertor 230 is coupled to trace 722 via one or more connections. For example, inserter 230 is coupled to trace 722 via connection 316. Trace 722 may be disposed on or within one or more layers of substrate 214. Furthermore, trace 722 may be coupled to data line 216. In one embodiment, trace 722 is data line 216.

[0090] Figure 8 The illustration shows a top view of a display device 200 according to one or more embodiments. Figure 8 In one embodiment, the DDIC chip 222 is mounted to the inserter 230, and the inserter 230 is mounted to the substrate 214. In various embodiments, one or more additional IC chips 224 are also mounted to the inserter 230. Furthermore, a connector 710 is mounted to the inserter 230.

[0091] Connector 710 is coupled to one or more of the traces 722 of DDIC chip 222, IC chip 224 and substrate 214 via through-holes and / or metal layers within inserter 230. Connector 710 is coupled to at least one of DDIC 22 and IC chip 224 to a common surface of inserter 230.

[0092] In one embodiment, Figure 8 The resistance of the connection between connector 710 and inserter 230 is less than Figure 7 The resistance of the connection between connector 710 and inserter 230.

[0093] Figure 9 A portion of a display device 200 according to one or more embodiments is illustrated. Figure 9In one embodiment, the DDIC chip 222 is mounted to the inserter 230 forming the semiconductor component 220, and the inserter 230 is mounted to the substrate 214. Furthermore, a processor 910 is mounted to the substrate 214. The processor 910 can be any processor of the input device 100. In various embodiments, the processor 910 may be omitted. Additionally, the substrate 214 is flexible, and the portion of the substrate 214 to which the inserter 230 and the DDIC chip 222 are mounted is folded under at least a portion of the display panel 210.

[0094] Figure 10 A portion of a display device 200 according to one or more embodiments is illustrated. Figure 10 In one embodiment, the DDIC chip 222 is mounted to the inserter 230 forming the semiconductor component 220, and the inserter 230 is mounted to the substrate 214. Furthermore, a processor 910 is mounted to the substrate 214. In various embodiments, the processor 910 may be omitted. Additionally, the substrate 214 is flexible, and the portion of the substrate 214 to which the inserter 230 and DDIC chip 222 are mounted is not folded, while the portion of the substrate to which the processor 910 is mounted is folded under at least a portion of the display panel 210. In one embodiment, a reinforcement may be positioned under the substrate 214 in at least the area where the inserter 230 and DDIC chip 222 are mounted to the substrate.

[0095] Figure 11 A portion of a display device 200 according to one or more embodiments is illustrated. Figure 11 In one embodiment, the DDIC chip 222 is mounted to the inserter 230 forming the semiconductor component 220, and the inserter 230 is mounted to the substrate 214. Furthermore, the substrate 214 is flexible, and the portion of the substrate 214 to which the inserter 230 and the DDIC chip 222 are mounted is folded under at least a portion of the display panel 210. Additionally, as per [the relevant information]... Figure 7 As described, inserter 230 is coupled to connector 710. A processor (e.g., processor 910) may be mounted to connector 710.

[0096] Figure 12 A portion of a display device 200 according to one or more embodiments is illustrated. Figure 12 In this embodiment, the DDIC chip 222 is mounted to the inserter 230 forming the semiconductor component 220, and the inserter 230 is mounted to the substrate 214 in a substantially rigid region of the display panel 210. Furthermore, the processor 910 is mounted to the substrate 214. Additionally, as per [the relevant information]... Figure 7As described, inserter 230 is coupled to connector 710. Flexible connector 710 can be folded under at least a portion of display panel 210, wherein it can be coupled to one or more elements of input device (e.g., input device 100).

[0097] Figure 13 An embodiment of an input device 100 according to one or more embodiments is illustrated. Figure 13 As depicted, input device 100 includes display device 1302. Display device 1302 includes display panel 1310. Compared to display panel 210, the common electrode 1311 of display panel 1310 is configured for both display updates and capacitive sensing (e.g., it may be connected to a subset of data lines for sensing). For example, the common electrode 1311 may be segmented to form sensor electrodes 1311a, 1311b, 1311c, 1311d, 1311e, and 1311f for proximity or input sensing. In another embodiment, the sensor electrodes (e.g., patterned and aligned to sub-pixels 215 of display panel 210) may be patterned and segmented for capacitive proximity sensing similar to capacitive proximity sensing of sensor electrodes 1311a-1311f. In such an embodiment, the sensor electrodes may be formed of a metal mesh. Furthermore, the sensor electrodes can be disposed on a common substrate of the display panel 210 in the display integrated input sensing device (e.g., a lens of the display panel 210 or an encapsulation layer of the display panel 210). Alternatively, the sensor electrodes can be disposed on a substrate adhered to the display panel 210. Additionally, a single-layer wiring (e.g., data line 216) can be used to connect to the sensor electrodes in the active region 212 of the display device 200.

[0098] In one or more embodiments, a display device (e.g., display device 1302) including sensor electrodes (e.g., sensor electrode 1311) may be referred to as a display-integrated proximity or input sensing device, the sensor electrodes being configured for display updates or disposed on a common substrate (e.g., a lens or encapsulation layer) of the display panel of the display device. Furthermore, in addition to the capacitive sensor electrode 1311, display device 1302 may include optical sensing elements. In one or more embodiments, the sensing electrodes may be parallel to the data line wiring, and the output solder joint for sensing may be placed on the display panel having the data line 216 for display-integrated proximity sensing.

[0099] In various embodiments, semiconductor component 1320 includes an inserter 230 and one or more of IC chips 1322, 1324. In one embodiment, semiconductor component 1320 includes IC chip 1322, which may be configured as a display driver IC chip similar to DDIC chip 222. Furthermore, semiconductor component 1320 includes IC chip 1324. IC chip 1324 may be configured to operate sensor electrodes 1311a-1311f for capacitive sensing. For example, IC chip 1324 may be a capacitive sensing IC chip.

[0100] In another embodiment, semiconductor component 1320 includes an IC chip 1322, which can be configured for display updates and capacitive sensing. For example, IC chip 1322 can be configured similarly to an IC chip DDIC chip 222 for display updates and can also be configured to operate sensor electrodes 1311a-1311f for input sensing. In such an embodiment, IC chip 1322 can be referred to as a Touch and Display Driver Integration (TDDI) IC chip. Furthermore, semiconductor component 1320 may include an IC chip 1324, which may be a storage device. Alternatively, IC chip 1322 can be configured to receive, transmit, and process data for at least one of display updates and input sensing, and IC chip 1324 can be configured to drive and receive signals for at least one of display updates and input sensing. In various embodiments, semiconductor component 1320 may include... Figure 13 Additional IC chips not depicted in the text.

[0101] In one or more embodiments, IC chip 1322 and / or IC chip 1324 can be mounted to inserter 230 in a manner similar to the mounting of DDIC chip 222 and IC chip 224. Furthermore, sensor electrodes 1311a-1311f can be coupled to semiconductor component 1320 via trace 1312.

[0102] In one or more embodiments, sensor electrodes 1311a-1311f can be driven for capacitive sensing. In such embodiments, IC chip 1322 may include sensor circuitry configured to drive sensor electrodes 1311a-1311f for capacitive sensing. In one embodiment, the sensor circuitry is configured to drive a transmitter signal to a first plurality of sensor electrodes 1311a-1311f and receive a result signal from another of sensor electrodes 1311a-1311f. In another embodiment, IC chip 1322 is configured to drive an absolute capacitive sensing signal to sensor electrodes 1311a-1311f and receive a result signal from sensor electrodes 1311a-1311f for absolute capacitive sensing.

[0103] In other embodiments, in addition to using sensor electrodes 1311a-1311f for capacitive sensing, or alternatively using sensor electrodes 1311a-1311f for capacitive sensing, capacitive sensing can be performed using sensor electrodes that are separate from the electrodes of the display panel 1310. In such embodiments, the additional sensor electrodes can be disposed on or adhered to one or more substrates of the display device 1302.

[0104] In various embodiments, sensor electrodes 1311a-1311f may be disposed on a common layer with the electrodes of sub-pixel 215. In such embodiments, among others, display panel 1310 may be one of an in-plane switching (IPS) display grid and an edge field switching (FFS) display panel. Alternatively, sensor electrodes 1311a-1311f may be disposed on a layer separate from the electrodes of sub-pixel 215. In such embodiments, display panel 1310 may be a vertically aligned (VA) display panel.

[0105] Sensor electrodes 1311a-1311f can be of any shape and size. For example, sensor electrodes 1311a-1311f can have a substantially square shape as shown. Alternatively, among other things, sensor electrodes 1311a-1311f can have a substantially rectangular or elliptical shape. Furthermore, sensor electrodes 1311a-1311f may include one or more protrusions and / or one or more recesses. Additionally or alternatively, sensor electrodes 1311a-1311f can be interdigitated with each other. Moreover, although sensor electrodes 1311a-1311f are illustrated as having a size corresponding to two sub-pixels by four sub-pixels, in other embodiments, sensor electrodes 1311a-1311f can have a size of N x M, where N and M are any integers greater than 1. In one embodiment, input device 100 includes hundreds of sensor electrodes 1311a-1311f.

[0106] In one or more embodiments, the "mutual capacitance" (also commonly referred to as "cross-capacitance") sensing method is based on changes in capacitive coupling between sensor electrodes. For example, the mutual capacitance sensing method may be based on the relationship between sensor electrodes 1311a-1311f or one or more sensor electrodes 1311a-1311f and one or more other sensor electrodes ( Figure 13The change in capacitive coupling between the sensor electrodes (not shown in the figure) alters the electric field between them. In various embodiments, an input object near the sensor electrodes (e.g., input object 140) changes the electric field between the sensor electrodes, thus altering the measured capacitive coupling. In one embodiment, the transcapacitive sensing method operates by detecting the capacitive coupling between one or more sensor electrodes 1311a-1311f (also referred to herein as “transmitter sensor electrodes” or “transmitter electrodes”) and one or more other sensor electrodes 1311a-1311f or other sensor electrodes not shown (also referred to herein as “receiver sensor electrodes” or “receiver electrodes”). The transmitter electrodes may be modulated relative to a reference voltage (e.g., system ground) and / or the receiver electrodes to transmit a transmitter signal. The receiver electrodes may be kept substantially constant relative to the reference voltage or modulated differently from the transmitter electrodes to facilitate the reception of the resulting signal. The resulting signal may include one or more effects corresponding to one or more transmitter signals and / or corresponding to one or more sources of environmental interference (e.g., other electromagnetic signals). The sensor electrodes may be dedicated transmitter electrodes or receiver electrodes, or may be configured to both transmit and receive. In one or more embodiments, the transmitter signal is modulated and contained in one or more bursts within a time period allocated for input sensing. The transmitter signal may have amplitude, frequency, and voltage, which can be varied to obtain robust positional information of the input object within the sensing area.

[0107] In one embodiment, the "self-capacitance" (often also referred to as "absolute capacitance") sensing method is based on a change in the capacitive coupling between sensor electrodes 1311a–1311f and an input object. In various embodiments, an input object near sensor electrodes 1311a–1311f alters the electric field near the sensor electrodes, thus changing the measured capacitive coupling. In one implementation, the absolute capacitance sensing method operates by modulating sensor electrodes 1311a–1311f relative to a reference voltage (e.g., system ground) and by detecting the capacitive coupling between the sensor electrodes and the input object. In one embodiment, IC chip 1322 drives an absolute capacitance sensing signal to sensor electrodes 1311a–1311f to perform absolute capacitance sensing. In one embodiment, the absolute capacitance sensing signal may be the same as or different from the transmitter signal used in transcapacitance sensing.

[0108] In one or more embodiments, the sensor circuitry of IC chip 1322 includes transmitter circuitry and / or receiver circuitry. The transmitter and / or receiver circuitry may include multiple analog front-ends (AFEs) and / or one or more drivers. Each AFE may include elements to report sensed signals and provide digital results, such as amplifiers (e.g., charge amplifiers with integrating capacitors) having high-pass mechanisms (e.g., reset switches or feedback resistors) along with one or more demodulators (e.g., analog sampling or digital mixing) and / or low-pass filters (e.g., FIR or IIR) before or integrated with the ADC converter.

[0109] In one or more embodiments, capacitive sensing and display updates occur during at least partially overlapping time periods. As previously described, display updates can occur during display frames. During each display frame, each display line of the display device can be updated. In one embodiment, the display frame can be updated once every 16 ms or at a display frame rate of 60 Hz. In other embodiments, other display frame rates can be utilized. For example, display frame rates of 48 Hz, 120 Hz, 180 Hz, 220 Hz, and 240 Hz can be utilized, among others. Furthermore, in some embodiments, one or more sensor electrodes (sensor electrodes 1311a-1311f) can also be driven for capacitive sensing when driving one or more sensor electrodes 1311a-1311f for display updates. Overlapping capacitive sensing and display updates can include: modulating one or more reference voltages of the display device and / or modulating at least one of the sensor electrodes 1311a-1311f for the display during a time period that at least partially overlaps with the time when the sensor electrodes are configured for capacitive sensing. In another embodiment, capacitive sensing and display updates can occur during a non-overlapping period (also referred to as a non-display update period). In various embodiments, the non-display update period can occur between display line update periods for two display lines used for a display frame, and can be at least as long as the display line update periods in time. In such embodiments, the non-display update period can be referred to as a long horizontal blanking period, a long h-blanking period, or a distributed blanking period. In other embodiments, the non-display update period can include a horizontal blanking period and a vertical blanking period. The IC chip 1322 can be configured to drive the sensor electrodes for capacitive sensing during any one or more or any combination of different non-display update times.

[0110] Therefore, the embodiments and examples set forth herein are presented in order to best explain embodiments according to the present technology and its particular applications, and thereby enable those skilled in the art to make and use this disclosure. However, those skilled in the art will recognize that the foregoing descriptions and examples have been presented for illustrative and exemplary purposes only. The descriptions set forth are not intended to be exhaustive or to limit this disclosure to the precise forms disclosed.

[0111] In view of the foregoing, the scope of this disclosure is defined by the following claims.

[0112] Reference number

[0113] 100 input devices

[0114] 110 processing system

[0115] 120 sensing area

[0116] 130 buttons

[0117] 140 Input Objects

[0118] 200 display devices

[0119] 210 display panel

[0120] 212 active area

[0121] 214 substrate

[0122] 215 subpixels

[0123] 216 data cable

[0124] 217 gate line

[0125] 218 width

[0126] 219 pitch

[0127] 220 semiconductor components

[0128] 222 chip

[0129] 224 optional IC chips

[0130] 226 width

[0131] 227 length

[0132] 228 width

[0133] 230 inserter

[0134] 242 edge

[0135] 243 edge

[0136] 244 edge

[0137] 245 edge

[0138] 246 edge

[0139] 247 Edge

[0140] 250 edge

[0141] 251 edge

[0142] 310 connection

[0143] 312 connection

[0144] 316 connection

[0145] 318 connection

[0146] 320 connection

[0147] 320A connection

[0148] 320A1 connection

[0149] 320A2 connection

[0150] 320A3 connection

[0151] 320B connection

[0152] 320B1 connection

[0153] 320B2 connection

[0154] 320B3 connection

[0155] 321 Through Hole

[0156] 321A1 Through Hole

[0157] 321A2 Through Hole

[0158] 321A3 Through Hole

[0159] 321B1 Through Hole

[0160] 321B2 Through Hole

[0161] 321B3 Through Hole

[0162] 322 traces

[0163] 322A1 trace

[0164] 322A2 trace

[0165] 322A3 trace

[0166] 322B1 trace

[0167] 322B2 trace

[0168] 322B3 trace

[0169] 323 Through Hole

[0170] 323A1 Through Hole

[0171] 323A2 Through Hole

[0172] 323A3 Through Hole

[0173] 323B1 Through Hole

[0174] 323B2 Through Hole

[0175] 323B3 Through Hole

[0176] 340 DDIC

[0177] 342 meters high

[0178] 410 pad

[0179] 412 pad

[0180] 420 pitch

[0181] 422 pitch

[0182] 510 pad

[0183] 512 pads

[0184] 520 pitch

[0185] 522 pitch

[0186] 610 connection

[0187] 612 connection

[0188] 614 connection

[0189] 618 connection

[0190] 620 semiconductor components

[0191] 621 connection

[0192] 622 Through Hole

[0193] 623 trace

[0194] 624 through hole

[0195] 630 connection

[0196] 630A connection

[0197] 630B connection

[0198] 631A Through Hole

[0199] 631B Through Hole

[0200] 632A trace

[0201] 632B trace

[0202] 633A Through Hole

[0203] 633B Through Hole

[0204] 710 connector

[0205] 720 traces

[0206] 722 trace

[0207] 910 processor

[0208] 1302 Display Device

[0209] 1310 display panel

[0210] 1311 common electrode

[0211] 1311A sensor electrode

[0212] 1311B sensor electrode

[0213] 1311C sensor electrode

[0214] 1311D sensor electrode

[0215] 1312 trace

[0216] 1320 semiconductor components

[0217] 1322 IC chip

[0218] 1324 IC chip

Claims

1. A display device, comprising: The display panel includes: Multiple sub-pixels that define the active area of ​​the display panel; Substrate; and Multiple data lines disposed within one or more layers of the substrate and coupled to the multiple sub-pixels; and Semiconductor components, including: A display driver integrated circuit chip, comprising multiple output solder points and multiple input solder points; and An inserter, coupled to the display driver integrated circuit chip, mounted to the substrate, and comprising: Multiple output solder points coupled to the multiple output solder points of the display driver integrated circuit chip and coupled to the multiple data lines; and Multiple input solder points coupled to the multiple input solder points of the display driver integrated circuit chip, wherein the width of the inserter is at least as large as the distance between the outermost data lines of the multiple data lines.

2. The display device according to claim 1, wherein the display driver integrated circuit chip is a touch display driver integrated circuit chip.

3. The display device of claim 1, wherein the width of the inserter is at least approximately 32 mm.

4. The display device of claim 1, wherein the aspect ratio of the inserter is at least about 30 to about 1.

5. The display device of claim 1, wherein the width of the inserter is at least as large as the width of the active region.

6. The display device according to claim 1, further comprising: A connector that is coupled to the substrate and communicatively coupled to the inserter.

7. The display device according to claim 1, further comprising: A connector is mounted to the inserter, wherein the display driver integrated circuit chip and the connector are mounted to a common surface of the inserter.

8. The display device according to claim 1, wherein the pitch of the plurality of output solder points of the display driver integrated circuit chip is different from the pitch of the plurality of output solder points of the inserter.

9. The display device of claim 8, wherein the pitch of the plurality of output solder points of the display driver integrated circuit chip is smaller than the pitch of the plurality of output solder points of the inserter.

10. The display device of claim 8, wherein the pitch of the plurality of output solder points of the inserter is similar to the pitch of the plurality of data lines.

11. The display device of claim 10, wherein the pitch of the plurality of data lines is substantially constant.

12. The display device of claim 1, wherein the display driver integrated circuit chip further comprises a sensing circuit configured to acquire a result signal from one or more sensor electrodes.

13. The display device of claim 12, wherein the sensing circuit is coupled to the one or more sensor electrodes via one or more of the plurality of data lines.

14. The display device according to claim 1, further comprising sensor electrodes disposed on the substrate of the display panel.

15. A semiconductor component, comprising: A display driver integrated circuit chip includes multiple output solder points and multiple input solder points, and the display driver integrated circuit chip is configured to drive multiple data lines of a display device to update the active area of ​​the display device; as well as An inserter, coupled to the display driver integrated circuit chip, includes: Multiple output solder points are coupled to the multiple output solder points of the display driver integrated circuit chip and configured to be coupled to the multiple data lines of the display device; as well as Multiple input solder points coupled to the multiple input solder points of the display driver integrated circuit chip solder points, wherein the width of the inserter is at least as large as the distance between the outermost data lines of the multiple data lines.

16. The semiconductor component of claim 15, wherein the display driver integrated circuit chip is a touch display driver integrated circuit chip.

17. The semiconductor assembly of claim 15, wherein the width of the inserter is at least one of the following: approximately 32 mm and at least as large as the width of the active region.

18. The semiconductor assembly of claim 15, wherein the aspect ratio of the inserter is at least about 30 to about 1.

19. The semiconductor assembly of claim 15, wherein the pitch of the plurality of output solder points of the display driver integrated circuit chip is smaller than the pitch of the plurality of output solder points of the inserter, and wherein the pitch of the plurality of output solder points of the inserter is similar to the pitch of the plurality of data lines.

20. An inserter for a display device, the inserter comprising: Multiple output pins, configured as follows: Multiple output solder points coupled to a display driver integrated circuit chip, wherein the display driver integrated circuit chip is configured to drive multiple data lines to update the active area of ​​a display device; as well as The plurality of data lines coupled to the display device; as well as Multiple input solder points are configured to couple to multiple input pins of the display driver integrated circuit chip, wherein the width of the inserter is at least as large as the distance between the outermost data lines of the plurality of data lines.

21. The inserter of claim 20, wherein the display driver integrated circuit chip is a touch display driver integrated circuit chip.

22. The inserter of claim 20, further comprising a width of at least about 32 mm and an aspect ratio of at least about 30 to about 1.

23. The inserter of claim 20, wherein the pitch of the plurality of output solder points of the inserter is greater than the pitch of the plurality of output solder points of the display driver integrated circuit chip, and the pitch of the plurality of output solder points of the inserter is similar to the pitch of the plurality of data lines.

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