Thermal interface material and electronic device including the same

Abstract

The present invention relates to a thermal interface material and an electronic device including the thermal interface material. A thermal interface material (TIM) including a memory foam core includes a memory foam core having a plurality of sides defining a perimeter. A heat sink is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

Description

Technical Field

[0001] The present disclosure relates to a thermal interface material (TIM) comprising a memory foam core. Background Art

[0002] This paragraph provides background information related to the present disclosure but is not necessarily prior art.

[0003] Electrical components (such as semiconductors, integrated circuit packages, transistors, etc.) typically have a pre-designed temperature at which they operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. However, the operation of electrical components generates heat. If heat is not removed, the electrical components may operate at temperatures significantly higher than their normal or desired operating temperature. This overheating can adversely affect the operating characteristics of the electrical components and the operation of associated equipment.

[0004] To avoid or at least reduce adverse operating characteristics caused by heat generation, heat should be removed, for example, by directing the heat from the operating electrical components to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation techniques. During this conduction period, heat is conducted from the operating electrical components to the heat sink through direct surface contact between the electrical components and the heat sink and / or through contact between the electrical components and the heat sink surfaces via an intermediate medium or thermal interface material (TIM). The thermal interface material can be used to fill gaps between heat transfer surfaces to increase heat transfer efficiency compared to filling the gaps with air, which is a relatively poor conductor of heat. Summary of the Invention

[0005] This section provides a general summary of the disclosure, but is not a comprehensive disclosure of its full scope or all of its features.

[0006] Disclosed herein is a thermal interface material (TIM) comprising a memory foam core. In an exemplary embodiment, the TIM comprises a memory foam core comprising a plurality of sides defining a perimeter. A heat sink is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

[0007] In an exemplary embodiment, a thermal interface material comprises: an elastic core including a plurality of sides defining a perimeter; and graphite disposed at least partially around the perimeter defined by the plurality of sides of the elastic core. A portion of the elastic core is disposed between an upper portion and a lower portion of the graphite along a front edge of the thermal interface material. The portion of the elastic core prevents direct abutting contact between the upper portion and the lower portion of the graphite along the front edge of the thermal interface material.

[0008] In an exemplary embodiment, a method for providing a thermal management solution between a heat source and a heat removal / dissipation structure includes: compressing a memory foam core of a thermal interface material piece disposed along the heat source, the thermal interface material piece further comprising a heat sink disposed at least partially around a perimeter defined by multiple sides of the memory foam core; aligning a portion of the heat sink into thermal contact with a corresponding portion of the heat removal / dissipation structure while the memory foam core remains at least partially compressed, thereby avoiding sliding contact between the thermal interface material piece and the heat removal / dissipation structure; and allowing the memory foam core to expand such that the expansion of the compressed memory foam core causes the aligned portion of the heat sink to thermally contact the corresponding portion of the heat removal / dissipation structure, whereby the heat sink defines at least a portion of a heat-conducting thermal path that at least partially surrounds the perimeter defined by the multiple sides of the memory foam core and leads to the heat removal / dissipation structure.

[0009] In an exemplary embodiment, a method of manufacturing a piece of thermal interface material includes wrapping a heat sink at least partially around a perimeter defined by a plurality of sides of a memory foam core.

[0010] Further areas of applicability will become apparent from the description provided herein.In this summary, the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

[0012] Figure 1 and Figure 2 is a perspective view of an exemplary embodiment of a thermal interface material (TIM) comprising a memory foam core, graphite wrapped around the memory foam core, and a pressure sensitive adhesive (PSA) along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0013] Figure 3 yes Figure 1 and Figure 2 A top view of a TIM is shown, illustrating an exemplary length dimension of 10 millimeters (mm) according to an exemplary embodiment.

[0014] Figure 4 yes Figure 1 and Figure 2 A front view of a TIM is shown, illustrating an exemplary width of 10.08 mm and an exemplary uncompressed thickness or height of 3.08 mm, according to an exemplary embodiment.

[0015] Figure 5 and Figure 6 is a perspective view of an exemplary embodiment of a thermal interface material (TIM) comprising a memory foam core, graphite wrapped around the memory foam core, and a pressure sensitive adhesive (PSA) along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0016] Figure 7 yes Figure 5 and Figure 6 A top view of a TIM is shown, illustrating an exemplary length dimension of 10 millimeters (mm) according to an exemplary embodiment.

[0017] Figure 8 yes Figure 5 and Figure 6 A front view of a TIM is shown showing an exemplary width of 10.08 mm and an exemplary uncompressed thickness or height of 3 mm for the rectangular portion and an exemplary width of 10.08 mm and an exemplary uncompressed thickness or height of 0.7 mm for the triangular portion according to an exemplary embodiment.

[0018] Figure 9 and Figure 10 is a perspective view of an exemplary embodiment of a thermal interface material (TIM) comprising an elastic (e.g., foam, etc.) core, graphite wrapped around the elastic core, and a pressure sensitive adhesive (PSA) along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0019] Figure 11 yes Figure 9 and Figure 10 A top view of a TIM is shown, illustrating an exemplary length dimension of 10 millimeters (mm) according to an exemplary embodiment.

[0020] Figure 12 yes Figure 9 and Figure 10 A front view of a TIM is shown showing an exemplary width of 10.08 mm and an exemplary uncompressed thickness or height of 3 mm for the rectangular portion and an exemplary width of 10.08 mm and an exemplary uncompressed thickness or height of 0.7 mm for the triangular portion according to an exemplary embodiment.

[0021] Figure 13 is a perspective view of an exemplary embodiment of a thermal interface material (TIM) comprising a memory foam core and graphite wrapped around the memory foam core. The TIM is disposed (e.g., adhesively attached via a PSA or the like) along a PCB-mounted component (broadly speaking, a heat source) aligned to be positioned within an opening or cavity defined by a housing or case.

[0022] Figures 14 to 16The TIM and PCB mounted components are positioned in the Figure 13 The housing or shell is shown within an opening or cavity defined by the housing.

[0023] Figure 17 shows the TIM and PCB mounted components before they are positioned within the opening or cavity defined by the housing or casing. Figure 14 The TIM is shown in an uncompressed state. Figure 17 Also shown is a TIM having an exemplary uncompressed thickness or height of 5 mm (uncompressed state, nominally 5 mm) according to an exemplary embodiment.

[0024] Figure 18 Shown Figure 15 The TIM is shown in a compressed state, wherein the TIM and PCB mounted components are slidably positioned within an opening or cavity defined by a housing or casing. Figure 18 According to an exemplary embodiment, the TIM has been Figure 17 Its initial uncompressed thickness or height of 5 mm is shown compressed to an exemplary thickness or height of 1.8 mm (compression is maintained for at least two minutes to allow assembly).

[0025] Figure 19 The diagram shows the TIM after it has been slidably positioned within the opening or cavity defined by the housing or shell and rebounded from the compressed state (e.g., after maintaining compression for at least about 2 minutes to allow insertion into the housing, etc.). Figure 16 TIM shown. Figure 19 According to an exemplary embodiment, the TIM has been Figure 18 The compressed thickness or height shown of 1.8 mm rebounds to an exemplary thickness or height of 4.5 mm (rebounds to nominally 4.5 mm).

[0026] Corresponding reference characters indicate corresponding parts throughout the several views of the drawings. DETAILED DESCRIPTION

[0027] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0028] Disclosed herein are exemplary embodiments of thermal interface materials comprising a memory foam core. In exemplary embodiments, graphite can be disposed at least partially around the memory foam core. For example, one or more flexible sheets of synthetic and / or natural graphite can be wrapped around (e.g., completely around, only partially around, etc.) an outer perimeter defined by sides of the memory foam core.

[0029] Also disclosed are exemplary methods of using a TIM including a memory foam core to provide a thermal management solution between a heat source (e.g., a heat generating component along a printed circuit board (PCB), etc.) and a heat removal / dissipation structure or component (e.g., a heat sink, heat spreader, housing, enclosure, etc.).

[0030] In an exemplary embodiment, a TIM including a memory foam core can be positioned or mounted (e.g., adhesively attached to the mounting surface via a PSA, etc.) along a mounting surface (e.g., a heat source, etc.), for example, while the TIM and its memory foam core are uncompressed. The memory foam core of the TIM can then be compressed (e.g., from an initial uncompressed height or thickness of approximately 3 mm to a compressed height or thickness of no more than approximately 1 mm, etc.). The memory foam can preferably be compressed with a relatively low compression force that is sufficiently low to avoid biasing and / or damaging the PCB and / or heat source.

[0031] Due to the properties of memory foam, the memory foam core will very slowly rebound, recover, expand, or return to its original uncompressed state, height, or thickness. The memory foam core can preferably maintain its at least partially compressed shape and reduced thickness for a predetermined minimum amount of time (e.g., less than 20% rebound for at least 2 minutes, etc.), which is long enough to allow the heat source and the at least partially compressed TIM to be positioned (e.g., slidably inserted, etc.) within an opening or cavity defined by a housing, shell, etc.

[0032] The heat source and the TIM with its at least partially compressed memory foam core can be slidably inserted (e.g., slid under a downwardly protruding portion or lip of the housing, shell, etc.) into a housing, shell, etc. such that the TIM is positioned within the housing, shell, etc. and aligned for eventual thermal contact with a portion of the housing, shell, etc. Due to the at least partially compressed state of the memory foam, the TIM can slide into the housing, shell, etc. without making sliding contact with the housing, shell, etc., which could otherwise damage the TIM.

[0033] The memory foam core will slowly rebound and expand to fill the gap between the top graphite portion of the TIM and the shell, housing, etc. For example, the memory foam core may slowly rebound and expand to a predetermined minimum percentage (e.g., at least about 90%, about 100%, greater than about 80%, etc.) of its original uncompressed height or thickness to account for tolerances.

[0034] The expansion of the memory foam will reposition and force the graphite (or other thermally conductive and / or heat dissipating material) wrapped around the memory foam core into thermal contact with the housing, casing, etc. With the graphite in thermal contact with the heat source and the housing, casing, etc., the graphite can then define at least a portion of a thermally conductive heat path from the heat source generally surrounding the memory foam core to the housing, casing, etc. Thus, the memory foam body can operate as a switch that switches on the thermal interface material piece when the memory foam rebounds or expands, forcing the graphite into contact with the housing, casing, etc., thereby completing (closing) the thermally conductive path defined by the graphite from the heat source generally surrounding the memory foam core to the housing, casing, etc.

[0035] Thus, exemplary embodiments disclosed herein include graphite on top of memory foam that is compressed, and then the graphite on the compressed memory foam is assembled (e.g., slidably inserted, etc.) into a gap (e.g., approximately a 2 mm gap, etc.) generally defined between two surfaces, such as between the top surface of a heat source and the surface of a heat removal / dissipation structure (e.g., a heat sink, heat dissipation element, housing, enclosure, etc.). An adhesive (e.g., a pressure sensitive adhesive (PSA), etc.) can be provided along the bottom of the graphite to adhere the graphite on the memory foam to a mounting surface, such as a heat source along a PCB, etc. Preferably, the top side of the graphite is not sticky, tacky, or adhesive to avoid catching on the surface of the heat removal / dissipation structure (e.g., a heat sink, heat dissipation element, housing, enclosure, etc.) during installation.

[0036] In exemplary embodiments where the graphite is wrapped at least partially or completely around the memory foam core, the TIM may also be referred to herein as graphite on a memory foam pad.

[0037] In exemplary embodiments, the TIM may have a rectangular cross-sectional shape or profile, a non-rectangular cross-sectional shape or profile, a combination thereof, or the like. For example, exemplary embodiments may include a TIM having a first portion and an opposing second portion, each of the first portion and the opposing second portion having different cross-sectional shapes or profiles. In exemplary embodiments, the TIM has a first portion having a generally rectangular cross-sectional shape or profile and an opposing second portion having a generally triangular cross-sectional shape or profile. The downwardly sloping top surface of the generally triangular second portion may provide the TIM with a thinned or tapered leading edge and / or a sheared profile along the leading edge of the TIM, which may allow for less initial compression during assembly.

[0038] Referring now to the accompanying drawings, Figure 1 and Figure 2A thermal interface material (TIM) 100 (broadly, a component, device, or pad) including a memory foam core 104 is shown according to an exemplary embodiment embodying one or more aspects of the present disclosure. As shown, graphite 108 is wrapped around the memory foam core 104. A pressure-sensitive adhesive (PSA) 112 is along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0039] The graphite 108 may include a flexible sheet of natural and / or synthetic graphite. For example, the graphite 108 may include a graphite sheet (e.g., Tgon) from Laird Technologies. TM 9000 series graphite sheets, etc.), such as Tgon TM 9017, Tgon TM 9025、Tgon TM 9040、Tgon TM 9070 and / or Tgon TM 9100 synthetic graphite sheet. Table 1 below contains information on Tgon from Laird Technologies, Inc. TM Additional details for 9000 Series Synthetic Graphite.

[0040] also, Figure 1 and Figure 2 The graphite 108 is shown wrapped completely around the outer perimeter defined by the sides of the memory foam core 104. In alternative embodiments, the graphite 108 can be disposed or wrapped around less than the entire outer perimeter of the memory foam core 104. For example, an alternative embodiment includes the graphite 108 disposed along the entire top and sidewalls of the memory foam core 104. However, in this alternative embodiment, the graphite 108 does not extend completely across the bottom of the memory foam core 104, such that the graphite 108 includes spaced-apart end portions along the bottom of the memory foam core 104. For example, the spaced-apart end portions of the graphite can be adjacent to and / or below the PSA 112, between the PSA 112 and the memory foam core 104, and so on.

[0041] exist Figure 1 and Figure 2 In the exemplary embodiment shown, the TIM 100 has a generally rectangular cross-sectional shape or profile with rounded corners when the memory foam core 104 is uncompressed. Alternative embodiments may include TIMs having different cross-sectional shapes or profiles, such as non-rectangular, etc.

[0042] In this exemplary embodiment, the TIM 100 includes graphite 108 wrapped around a memory foam core 104. In alternative exemplary embodiments, other heat dissipating and / or thermally conductive materials may alternatively or additionally be disposed at least partially around the memory foam core 104. Examples of other heat dissipating and / or thermally conductive materials include thermally conductive foils (e.g., aluminum foil, copper foil, other metal foils, etc.), thermally conductive and / or heat dissipating fabrics or films, such as metalized and / or plated fabrics (e.g., nickel-copper plated nylon, etc.), metal plated or metalized polyimide fabrics, multilayer foils (e.g., metal foil laminated to polyester or PET, (PP), polyethylene (PE), other polymers, etc.), Polyester film, etc.

[0043] Figure 3 and Figure 4 Example dimensions that may be used for a TIM 100 according to an example embodiment are provided. For example, a TIM 100 may have dimensions such as Figure 3 The length of 10 mm shown, Figure 4 8 mm and an uncompressed thickness or height of 3.08 mm. Also by way of example, the graphite may have a thickness of approximately 25 micrometers (μm). These dimensions are provided for illustrative purposes only, and other exemplary embodiments may include TIMs having one or more different dimensions, for example, a length greater than or less than 10 mm, a width greater than or less than 10.08 mm, an uncompressed thickness or height greater than or less than 3.08 mm, and / or a graphite thickness greater than or less than 25 μm.

[0044] The TIM 100 can be used to provide a thermal management solution generally between a heat source (e.g., a heat-generating component on a PCB, etc.) and an enclosure (broadly speaking, a heat removal / dissipation structure or component). For example, the TIM 100 can be adhesively attached to the heat source via the PSA 112, e.g., when the TIM 100 and its memory foam core 104 are uncompressed. The memory foam core 104 can then be compressed (e.g., from an initial uncompressed height or thickness of approximately 3 mm to a compressed height or thickness of no more than approximately 1 mm, etc.). The memory foam core 104 can preferably be compressed with a relatively low compressive force that is sufficiently low to avoid biasing and / or damaging the PCB and / or the heat source.

[0045] Due to the characteristics of memory foam, the memory foam core 104 will rebound, expand, or return to its original uncompressed height or thickness very slowly. The memory foam core 104 can preferably maintain the at least partially compressed shape and reduced thickness for a predetermined minimum amount of time that is long enough to allow the heat source and the at least partially compressed TIM 100 to be inserted into the housing. For example, the memory foam core 104 can have a rebound of less than 20% for approximately 2 minutes or more.

[0046] The heat source and the TIM 100 having the at least partially compressed memory foam core 104 can be slidably inserted into the housing such that the TIM 100 is aligned to make thermal contact with a portion of the housing. Due to the at least partially compressed state of the memory foam core 104, the TIM 100 can be slid into the housing without sliding contact with the housing, which could otherwise damage the TIM 100.

[0047] The memory foam core 104 will slowly rebound and expand to fill the gap between the top surface of the graphite 108 and the outer shell. For example, the memory foam core 104 may slowly rebound and expand to a predetermined minimum percentage (e.g., at least about 90%, about 100%, greater than about 80%, etc.) of its original uncompressed height or thickness to account for tolerances.

[0048] The expansion of the memory foam will reposition and force the graphite 108 into thermal contact with the housing. With the graphite 108 in thermal contact with the heat source and the housing, the graphite 108 can then define at least a portion of a thermally conductive heat path from the heat source generally surrounding the memory foam core 104 to the housing.

[0049] Figure 5 and Figure 6 A thermal interface material (TIM) 200 is shown that includes a memory foam core 204, according to an exemplary embodiment embodying one or more aspects of the present disclosure. As shown, graphite 208 is wrapped around the memory foam core 204. A pressure sensitive adhesive (PSA) 212 is along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0050] Graphite 208 may include a flexible sheet of natural and / or synthetic graphite. For example, graphite 208 may include graphite sheets from Laird Technologies Inc. (e.g., Tgon TM 9000 series graphite sheets, etc.), such as Tgon TM 9017, Tgon TM 9025、Tgon TM 9040、Tgon TM 9070 and / or Tgon TM 9100 synthetic graphite sheet. Table 1 below includes Tgon from Laird Technologies TM Additional details for 9000 Series synthetic graphite.

[0051] also, Figure 5 and Figure 6The graphite 208 is shown wrapped completely around the outer perimeter defined by the sides of the memory foam core 204. In alternative embodiments, the graphite 208 can be disposed or wrapped around less than the entire outer perimeter of the memory foam core 204. For example, an alternative embodiment includes the graphite 208 disposed along the entire top and sidewalls of the memory foam core 204. However, in this alternative embodiment, the graphite 208 does not extend completely across the bottom of the memory foam core 204, such that the graphite 208 includes spaced-apart end portions along the bottom of the memory foam core 204. For example, the spaced-apart end portions of the graphite can be adjacent to and / or below the PSA 212, between the PSA 212 and the memory foam core 204, and so on.

[0052] exist Figure 5 and Figure 6 In the exemplary embodiment shown, the TIM 200 has opposing first and second portions 216 and 220 (or Figure 5 The left and right parts of the Figure 5 As shown, the first portion 216 has a generally rectangular cross-sectional shape or profile, and the second portion 220 has a generally triangular cross-sectional shape or profile. The downwardly inclined top surface 224 of the generally triangular shaped profile can provide the TIM 200 with a thinned or tapered front edge 228 that allows for less initial compression during assembly and / or a shear profile along the front edge 228 of the TIM. Figure 5 As shown, a portion 232 of the memory foam core 204 can be disposed or interposed between the upper and lower graphite portions along the leading edge 228 of the TIM, which inhibits or prevents direct abutting contact between the upper and lower graphite portions along the leading edge 228 of the TIM. Alternative embodiments may include TIMs having different cross-sectional shapes or profiles.

[0053] In this exemplary embodiment, the TIM 200 includes graphite 208 wrapped around a memory foam core 204. In alternative exemplary embodiments, other heat dissipating and / or thermally conductive materials may alternatively or additionally be disposed at least partially around the memory foam core 204. Examples of other heat dissipating and / or thermally conductive materials include thermally conductive foils (e.g., aluminum foil, copper foil, other metal foils, etc.), thermally conductive and / or heat dissipating fabrics or films, such as metalized and / or plated fabrics (e.g., nickel-copper plated nylon, etc.), metal plated or metalized polyimide fabrics, multilayer foils (e.g., metal foil laminated to polyester or PET, polypropylene (PP), polyethylene (PE), other polymers, etc.), Polyester film, etc.

[0054] Figure 7 and Figure 8Exemplary dimensions that may be used for a TIM 200 according to an exemplary embodiment are provided. For example, a TIM 200 may have a length of 10 millimeters (mm), such as Figure 7 As shown, the width of 10.08 mm, the uncompressed thickness or height of the rectangular portion of 3 mm, the uncompressed thickness or height of the triangular portion of 0.7 mm, as shown Figure 8 As shown. Also by way of example, the graphite can have a thickness of approximately 25 micrometers (μm). These dimensions are provided for exemplary purposes only, as other exemplary embodiments may include TIMs having one or more different dimensions, for example, a length greater than or less than 10 mm, a width greater than or less than 10.08 mm, an uncompressed thickness or height of a rectangular portion greater than or less than 3 mm, an uncompressed thickness or height of a triangular portion greater than or less than 0.7 mm, and / or a graphite thickness greater than or less than 25 μm.

[0055] The TIM 200 can be used to provide a thermal management solution generally between a heat source (e.g., a heat-generating component on a PCB, etc.) and an enclosure (broadly speaking, a heat removal / dissipation structure or component). For example, the TIM 200 can be adhesively attached to the heat source via the PSA 212, e.g., when the TIM 200 and its memory foam core 204 are uncompressed. The memory foam core 204 can then be compressed (e.g., from an initial uncompressed height or thickness of approximately 3 mm to a compressed height or thickness of no more than approximately 1 mm, etc.). The memory foam core 204 can preferably be compressed with a relatively low compressive force that is sufficiently low to avoid biasing and / or damaging the PCB and / or the heat source.

[0056] Due to the properties of memory foam, the memory foam core 204 will very slowly rebound, expand, or return to its original uncompressed height or thickness. The memory foam core 204 may preferably maintain the at least partially compressed shape and reduced thickness for a predetermined minimum amount of time that is long enough to allow the heat source and the at least partially compressed TIM 200 to be inserted into the housing. For example, the memory foam core 204 may have a rebound of less than 20% for approximately 2 minutes or more.

[0057] The heat source and the TIM 200 having the at least partially compressed memory foam core 204 can be slidably inserted into the housing such that the TIM 200 is aligned in thermal contact with a portion of the housing. Due to the at least partially compressed state of the memory foam core 204, the TIM 200 can be slid into the housing without sliding contact with the housing, which could otherwise damage the TIM 200.

[0058] The memory foam core 204 will slowly rebound and expand to fill the gap between the top surface of the graphite 208 and the outer shell. For example, the memory foam core 204 can slowly rebound and expand to a predetermined minimum percentage (e.g., at least about 90%, about 100%, greater than about 80%, etc.) of its original uncompressed height or thickness to account for tolerances.

[0059] The expansion of the memory foam will reposition and force the graphite 208 into thermal contact with the housing. With the graphite 208 in thermal contact with the heat source and the housing, the graphite 208 can then define at least a portion of a thermally conductive heat path from the heat source generally surrounding the memory foam core 204 to the housing.

[0060] Figure 9 and Figure 10 A thermal interface material (TIM) 300 is shown, according to an exemplary embodiment embodying one or more aspects of the present invention, including a resilient core 304 (e.g., polyurethane foam, memory foam, etc.). As shown, graphite 308 is wrapped around the resilient core 304. A pressure-sensitive adhesive (PSA) 312 is provided along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0061] Graphite 308 may include flexible sheets of natural and / or synthetic graphite. For example, graphite 308 may include graphite sheets from Laird Technologies (e.g., Tgon TM 9000 series graphite sheets, etc.), such as Tgon TM 9017, Tgon TM 9025、Tgon TM 9040、Tgon TM 9070 and / or Tgon TM 9100 synthetic graphite sheet. Table 1 below includes Tgon from Laird Technologies TM Additional details for 9000 Series Synthetic Graphite.

[0062] also, Figure 9 and Figure 10 Graphite 308 is shown wrapped completely around the outer perimeter defined by the sides of the elastic core 304. In alternative embodiments, the graphite 308 can be disposed or wrapped around less than the entire outer perimeter of the elastic core 304. For example, an alternative embodiment includes graphite 308 disposed along the entire top and sidewalls of the elastic core 304. However, in this alternative embodiment, the graphite 308 does not extend completely across the bottom of the elastic core 304, such that the graphite 308 includes spaced-apart end portions along the bottom of the elastic core 304. For example, the spaced-apart end portions of the graphite can be adjacent to and / or below the PSA 312, between the PSA 312 and the elastic core 304, etc.

[0063] In this exemplary embodiment, the TIM 300 has opposing first and second portions 316 and 320 (or Figure 9 The left and right parts of the Figure 9 As shown, the first portion 316 has a generally rectangular cross-sectional shape or profile, and the second portion 320 has a generally triangular cross-sectional shape or profile. The downwardly inclined top surface 324 of the generally triangular shaped profile can provide the TIM 300 with a thinned or tapered front edge 328 that allows for less initial compression during assembly and / or a shear profile along the front edge 328 of the TIM. Figure 9 As shown, a portion 332 of the resilient core 304 can be disposed or interposed between the upper and lower graphite portions along the leading edge 328 of the TIM, which inhibits or prevents direct abutting contact between the upper and lower graphite portions along the leading edge 328 of the TIM. Alternative embodiments may include TIMs having different cross-sectional shapes or profiles.

[0064] In this exemplary embodiment, TIM 300 includes graphite 308 wrapped around an elastic core 304. In alternative exemplary embodiments, other heat dissipating and / or thermally conductive materials may alternatively or additionally be disposed at least partially around elastic core 304. Examples of other heat dissipating and / or thermally conductive materials include thermally conductive foils (e.g., aluminum foil, copper foil, other metal foils, etc.), thermally conductive and / or heat dissipating fabrics or films, such as metalized and / or plated fabrics (e.g., nickel-copper plated nylon, etc.), metal plated or metalized polyimide fabrics, multilayer foils (e.g., metal foil laminated to polyester or PET, polypropylene (PP), polyethylene (PE), other polymers, etc.), Polyester film, etc.

[0065] Elastic core 304 can comprise any suitable elastic material.For example, elastic core 304 can be formed by foam material, such as polyurethane foam, memory foam, silicone foam material, polymer elastomer material, porous polymer foam, open-cell foam, closed-cell foam, chloroprene rubber foam, polyurethane foam, polyester foam, polyether foam, silicone rubber material, their combination etc.In some exemplary embodiments, elastic core 304 can be extruded.Elastic core 304 can be electrically conductive and / or thermally conductive.For example, elastic core 304 can comprise thermally conductive and / or conductive filler dispersed therein.

[0066] Figure 11 and Figure 12 Example dimensions that may be used for a TIM 300 according to an example embodiment are provided. For example, a TIM 300 may have dimensions such as Figure 11 The length is 10 millimeters (mm), the width is 10.08 mm, and the Figure 12As shown, the uncompressed thickness or height of the rectangular portion is 3 mm and the uncompressed thickness or height of the triangular portion is 0.7 mm. Also as an example, the graphite can have a thickness of approximately 25 micrometers (μm). These dimensions are provided for illustrative purposes only, as other exemplary embodiments may include TIMs having one or more different dimensions, such as a length greater than or less than 10 mm, a width greater than or less than 10.08 mm, an uncompressed thickness or height of the rectangular portion greater than or less than 3 mm, an uncompressed thickness or height of the triangular portion greater than or less than 0.7 mm, and / or a graphite thickness greater than or less than 25 μm.

[0067] TIM 300 can be used to provide a thermal management solution generally between a heat source (e.g., a heat-generating component on a PCB, etc.) and an enclosure (broadly speaking, a heat removal / dissipation structure or component). For example, TIM 300 can be adhesively attached to the heat source via PSA 312 and positioned within the enclosure such that graphite 308 is in thermal contact with both the heat source and the enclosure. Graphite 308 can then define at least a portion of a thermally conductive heat path from the heat source generally surrounding elastic core 304 to the enclosure.

[0068] Figure 13 and Figures 17 to 19 A thermal interface material (TIM) 400 is shown including a memory foam core 404 and graphite 408 wrapped around the memory foam core 404, according to an exemplary embodiment embodying one or more aspects of the present disclosure. A pressure sensitive adhesive (PSA) 412 is along the bottom side for good adhesion to a mounting surface (e.g., a heat source, etc.).

[0069] like Figure 13 As shown, TIM 400 is positioned along (e.g., adhesively attached via PSA 412, etc.) component 440 (broadly, a heat source), which in turn is positioned or mounted along printed circuit board (PCB) 444 (broadly, a substrate). TIM 400, component 440, and PCB 444 are aligned to be positioned within an opening or cavity defined by a housing or case 448.

[0070] The TIM 400 can be used to provide a thermal management solution generally between a heat source (e.g., a heat generating component 440 on a PCB 444, etc.) and a housing 448 (broadly speaking, a heat removal / dissipation structure or component). For example, the TIM 400 can be adhesively attached to the heat source via the PSA 412, e.g., when the TIM 400 and its memory foam core 404 are connected as shown in FIG. Figure 14 and Figure 17 When compressed as shown. The memory foam core 404 can then be as Figure 15 and Figure 18 shown compressed, for example, from an initial uncompressed height or thickness of about 5 mm ( Figure 17) is compressed to a compressed height or thickness of approximately 1.8 mm, etc. The memory foam core 404 is preferably compressible with a relatively low compressive force that is low enough to avoid biasing and / or damaging the PCB 444 and / or heat source 440.

[0071] The TIM 400 with its at least partially compressed memory foam core 404, component 444, and PCB 448 may be slidably inserted into the housing 448 such that the TIM 400 is aligned in thermal contact with a portion of the housing 448, such as Figure 15 and Figure 16 Due to the at least partially compressed state of the memory foam core 404, the TIM 400 can be slid into the housing 448 without sliding contact with the housing 448, which could otherwise damage the TIM 400.

[0072] The memory foam core 404 will slowly rebound and expand to fill the gap between the top surface of the graphite 408 and the shell 448. For example, the memory foam core 404 can remain compressed for at least about two minutes for assembly and insertion into the shell 448. Thereafter, the memory foam core 404 can be expanded from a compressed thickness or height of about 1.8 mm ( Figure 18 ) rebounds to a thickness or height of approximately 4.5 mm ( Figure 19 ). Figures 17 to 19 The dimensions provided in FIG. 5 are provided for example purposes only, and other exemplary embodiments may include TIMs having one or more different dimensions.

[0073] The expansion of the memory foam will reposition and force the graphite 408 into thermal contact with the housing 448. With the graphite 408 in thermal contact with both the heat source 440 and the housing 448, the graphite 408 can define at least a portion of a thermally conductive heat path from the heat source 440 generally surrounding the memory foam core 404 to the housing 408. Thus, the memory foam can operate as a switch that turns on the thermal interface material 400 when the memory foam rebounds or expands, forcing the graphite 408 into contact with the housing 448, thereby completing (turning on) the thermally conductive heat path defined by the graphite 408 from the heat source 440 generally surrounding the memory core 404 to the housing 448.

[0074] Graphite 408 may include flexible sheets of natural and / or synthetic graphite. For example, graphite 408 may include graphite sheets from Laird Technologies Inc. (e.g., Tgon TM 9000 series graphite sheets, etc.), such as Tgon TM 9017, Tgon TM 9025、Tgon TM 9040、Tgon TM 9070 and / or Tgon TM9100 synthetic graphite sheet. Table 1 below includes Tgon from Laird Technologies TM Additional details for 9000 Series synthetic graphite.

[0075] also, Figures 17 to 19 Graphite 408 is shown wrapped completely around the outer perimeter defined by the sides of the memory foam core 404. In alternative embodiments, the graphite 408 can be disposed or wrapped around less than the entire outer perimeter of the memory foam core 404. For example, an alternative embodiment includes graphite 408 disposed along the entire top and sidewalls of the memory foam core 404. However, in this alternative embodiment, the graphite 408 does not extend completely across the bottom of the memory foam core 404, such that the graphite 408 includes spaced-apart end portions along the bottom of the memory foam core 404. For example, the spaced-apart end portions of the graphite can be adjacent to and / or below the PSA 412, between the PSA 412 and the memory foam core 404, and so on.

[0076] exist Figures 17 to 19 In the exemplary embodiment shown, the TIM 400 has a generally rectangular cross-sectional shape or profile with rounded corners when the memory foam core 404 is uncompressed. Alternative embodiments may include TIMs having different cross-sectional shapes or profiles, such as non-rectangular, etc.

[0077] In this exemplary embodiment, the TIM 400 includes graphite 408 wrapped around a memory foam core 404. In alternative exemplary embodiments, other heat dissipating and / or thermally conductive materials may alternatively or additionally be disposed at least partially around the memory foam core 104. Examples of other heat dissipating and / or thermally conductive materials include thermally conductive foils (e.g., aluminum foil, copper foil, other metal foils, etc.), thermally conductive and / or heat dissipating fabrics or films, such as metalized and / or plated fabrics (e.g., nickel-copper plated nylon, etc.), metal plated or metalized polyimide fabrics, multilayer foils (e.g., metal foil laminated to polyester or PET, (PP), polyethylene (PE), other polymers, etc.), Polyester film, etc.

[0078] In some embodiments, the graphite wrapped around the memory foam may include synthetic graphite sheets. The graphite sheets may include a polyethylene terephthalate (PET) layer for increasing mechanical and / or wear resistance and / or an adhesive material (e.g., a pressure sensitive adhesive (PSA), etc.) for adhering the graphite sheet to the surface(s), for connecting the graphite sheet to the surface(s). In an exemplary embodiment, the graphite may include one or more graphite sheets from Laird Technologies, Inc., such as one or more Tgon® graphite sheets. TM 800 series natural graphite sheets (e.g., Tgon TM805, 810, 820, etc.), Tgon TM 8000 series graphite sheets, Tgon TM 9000 series synthetic graphite sheets (e.g., Tgon TM 9017, 9025, 9040, 9070, 9100, etc.), other graphite sheet materials, etc. The following table 1 includes Tgon from Laird Technology Co., Ltd. TM Additional details for 9000 Series Synthetic Graphite.

[0079] The graphene sheet(s) may include one or more Tgon TM 9000 series graphite sheets, the Tgon TM The 9000 series graphite sheets include synthetic graphite thermal interface materials with a carbon in-plane single crystal structure that are ultra-thin, lightweight, flexible, and provide excellent in-plane thermal conductivity. TM 9000 Series graphite sheets are used in a variety of heat dissipation applications where in-plane thermal conductivity dominates and where space is limited. TM The 9000 series graphite sheets can have a thermal conductivity of about 500 W / mK to about 1900 W / mK, can help reduce hot spots and protect sensitive areas, can enable slim device designs due to ultra-thin sheet thicknesses of about 17 microns to about 100 microns, and can be lightweight (e.g., a density of about 2.05 to 2.25 g / cm for a thickness of 17 or 25 microns). 3 ), can be flexible and able to withstand more than 10,000 bends with a radius of 5 mm.

[0080] Table 1

[0081]

[0082] In some exemplary embodiments, it may be desirable for the TIM to exhibit good thermal and electrical conductivity properties. In such exemplary embodiments, a conductive film (broadly speaking, a conductive layer or material) may be provided along part (or all) of the memory foam core. A heat sink (e.g., graphite, etc.) may be provided along part (or all) of the conductive film. In this embodiment, the heat sink may exhibit excellent in-plane thermal conductivity (e.g., in the XY direction). This allows heat to move from one side of the TIM or pad through the heat sink to the other side of the TIM or pad. The heat sink may have a defined pattern formed by one continuous layer or multiple discontinuous layers to move heat. The heat sink layer(s) may define exposed areas of the conductive film where no heat sink is present. The exposed areas may contact adjacent conductive components in the device and create conductive paths that can be used in various applications such as electrical grounding, shielding, etc. Continuing with this embodiment, the conductive film or layer may be provided along some sides of the memory foam core, and the heat sink may cover at least a portion of the conductive film so that the portion of the conductive film is located between the memory foam core and the heat sink. The heat sink may cover some portion of the TIM, but not the entire perimeter.

[0083] The exemplary embodiments disclosed herein can be used with a variety of devices, including electronic devices having one or more heat sources, heat removal / dissipation structures or components, shielding structures or components, and / or other suitable features. The heat removal / dissipation structures or components can include, for example, heat sinks, heat pipes, device housings, enclosures, or casings, etc. The shielding structures or components can include, for example, board-level EMI shielding structures or components, etc. Generally, a heat source can include any component or device that has a temperature higher than that of a TIM, or that provides or transfers heat to a TIM, regardless of whether the heat is generated by the heat source or is merely transferred by or via the heat source. For example, a heat source can include one or more heat-generating components or devices (e.g., a CPU, a die with underfill, a semiconductor device, a flip-chip device, a graphics processing unit (GPU), a digital signal processor (DSP), a multi-processor system, an integrated circuit, a multi-core processor, etc.), a substrate (e.g., a circuit board such as a printed circuit board, etc.), etc. Therefore, aspects of the present disclosure should not be limited to any specific use with any single type of heat source, electronic device, heat removal / dissipation structure, etc.

[0084] In embodiments where graphite is disposed at least partially around the memory foam core, the graphite may optionally include a layer / coating, such as polyethylene terephthalate (PET) or other plastic for increased mechanical strength and / or wear resistance. The layer / coating may be adhered (e.g., via a silicone pressure sensitive adhesive (PSA), etc.) to one or both sides of the graphite. In some embodiments, the layer / coating is adhered only to the outward-facing side of the graphite.

[0085] In some exemplary embodiments, the graphite can be surrounded or encapsulated by a coating (e.g., polyethylene terephthalate (PET), etc.) that can replace and / or allow for the elimination of banding as a means of enclosing the graphite. For example, a coating can be provided along the top and bottom primary graphite surfaces such that the graphite is encapsulated within a package or coating. The coating can be operable to provide electrical insulation and conductivity where needed and / or seal the graphite so that loose graphite particles or flakes cannot escape.

[0086] As an example, some exemplary embodiments may include graphite that is offset from the edge(s) of a mounting surface (e.g., edge(s) of an elastic core, memory foam, polyurethane foam, double-sided PSA between graphite and a stamped metal shield, other mounting surface, etc.), which may thereby allow a coating (e.g., a PET coating, etc.) to cover the graphite. After the graphite is applied to the mounting surface, a PET coating (or other suitable coating) may be applied along the top surface of the graphite (e.g., along the entire top surface, etc.), and the PET coating may be offset past the edge(s) of the graphite to the initial mounting surface to which the graphite was applied. Advantageously, this may allow for the use of more graphite because the coating may allow for the graphite to be closer to the edge(s) of the coating due to the coating's higher adhesion capabilities and tighter assembly tolerances. Using more graphite may allow for improved heat dissipation. The coating may be applied very thinly, thereby allowing for thinner stack heights.

[0087] As background, room temperature vulcanizing (RTV) silicone can be dispensed through a nozzle to provide a traditional thermal management solution between a heat generating component on a PCB and an enclosure. However, disadvantages of this traditional method of providing a thermal management solution include dispensing and mess. By contrast, exemplary embodiments including memory foam as disclosed herein (e.g., TIM 100 ( Figure 1 and Figure 3 )、TIM 200( Figure 5 and Figure 6 ), etc.) can provide a thermal management solution that is less messy and / or has better thermal conductivity than that provided by dispensing RTV silicone through a nozzle. Exemplary embodiments including memory foam as disclosed herein (e.g., TIM 100 ( Figure 1 and Figure 3 )、TIM 200( Figure 5 and Figure 6 ), etc.) may allow for assembly into tight gaps by over-compressing the memory foam and allowing it to rebound, and / or may allow more time to install or apply the TIM due to the slow rebound of the memory foam after compression.

[0088] Typically, memory foam is primarily composed of polyurethane and additional chemicals that increase its viscosity and density. Memory foam may be referred to as viscoelastic polyurethane foam or low resilience polyurethane foam (LRPu). Memory foam includes foam bubbles or open pores, effectively creating a matrix through which air can move. Memory foam can be produced by supplying gas into a polymer matrix. Memory foam has an open-cell solid structure that matches the pressure against it but slowly rebounds to its original shape. In some exemplary embodiments, the memory foam may include gel-infused memory foam and / or one or more additives (e.g., heat-conductive particles added to the memory foam, etc.).

[0089] In some exemplary embodiments, one or more additives or fillers may be added to the memory foam and / or other elastic materials used for the elastic core. Various additives or fillers may be incorporated into memory foam or other elastic core materials (e.g., polyurethane foam, etc.) to customize, modify, and / or functionally adjust the properties of the memory foam core or other elastic core. For example, the filler may include one or more latent heat storage materials, such as wax or other phase change materials. As a further example, the filler may include functional nanoparticles, conductive fillers, thermally conductive fillers, EMI or microwave absorbing fillers, magnetic fillers, dielectric fillers, coated fillers, combinations thereof, and the like. Example fillers include carbon black, boron nitride, nickel cobalt, carbonyl iron, iron silicide, iron particles, iron-chromium compounds, silver, alloys comprising 85% iron, 9.5% silicon, and 5.5% aluminum, alloys comprising approximately 20% iron and 80% nickel, ferrites, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, aluminum oxide, copper, zinc oxide, aluminum oxide, graphite, ceramics, silicon carbide, manganese zinc, glass fiber, combinations thereof, and the like. The filler may comprise one or more of particles, spheres, microspheres, ellipsoids, irregular spheres, strands, flakes, powders and / or any or all of these shapes in combination. In addition, exemplary embodiments may also include different grades (e.g., different sizes, different purities, different shapes, etc.) of the same (or different) filler.

[0090] In some exemplary embodiments, the TIM is electrically and thermally conductive. For example, the TIM disclosed herein may have a resistance of less than 1 ohm per inch of length (e.g., in the Z direction or the XY direction) and a resistance of less than 1.5°C-in per millimeter of height (e.g., in the Z direction). 2 / W thermal resistance (at 20% compression ratio).

[0091] In an exemplary embodiment, the thermal interface material comprises a memory foam core including a plurality of sides defining a perimeter. The heat sink is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

[0092] In this exemplary embodiment, the memory foam core may include viscoelastic polyurethane foam, low resilience polyurethane foam, gel infused memory foam, and the heat sink may include natural graphite and / or synthetic graphite.

[0093] The memory foam core can be configured to be compressible into a compressed shape having a reduced thickness and thereafter maintain the compressed shape having a reduced thickness for a predetermined minimum amount of time and / or with a rebound of less than twenty percent for at least two minutes.

[0094] The memory foam core is capable of compressing so that a portion of the heat sink can be aligned with a corresponding portion of the heat removal / dissipation structure while the memory foam core remains compressed, thereby avoiding sliding contact between the heat sink and the heat removal / dissipation structure. Expansion of the compressed memory foam core forces the aligned portion of the heat sink into thermal contact with the corresponding portion of the heat removal / dissipation structure, whereby the heat sink defines at least a portion of a thermally conductive heat path at least partially surrounding the perimeter defined by the plurality of sides of the memory foam core and leading to the heat removal / dissipation structure.

[0095] The memory foam core can be configured to compress so that the thermal interface material can be slidably positioned within the housing to align the heat sink in thermal contact with the housing while the memory foam core remains compressed, thereby avoiding sliding contact between the heat sink and the housing. Expansion of the compressed memory foam core within the housing forces the heat sink into thermal contact with the housing, whereby the heat sink defines at least a portion of a thermally conductive heat path at least partially surrounding the perimeter defined by the plurality of sides of the memory foam core and leading to the housing.

[0096] The heat sink may include a graphite sheet wrapped completely around a perimeter defined by the sides of the memory foam core.

[0097] The thermal interface material piece may include a first portion having a generally rectangular cross-section or profile and an opposing second portion having a generally triangular cross-section or profile including a downwardly sloping top surface providing a tapered leading edge to the thermal interface material piece.

[0098] A portion of the memory foam core may be disposed between the upper and lower portions of the heat sink along a front edge of the thermal interface material, the portion of the memory foam core preventing direct abutting contact between the upper and lower portions of the heat sink along the front edge of the thermal interface material.

[0099] The heat sink may include graphite, such that the thermal interface material piece is graphite on a memory foam pad.

[0100] The heat sink may include one or more of a graphite sheet, an aluminum foil, and / or a copper foil.

[0101] In an exemplary embodiment, an apparatus includes a heat source, a piece of thermal interface material disposed along the heat source, and a housing. The heat source and the piece of thermal interface material are slidably positioned within the housing while a memory foam core is at least partially compressed to prevent sliding contact between a heat sink and the housing. Within the housing, expansion of the compressed memory foam core forces the heat sink into thermal contact with the housing, whereby the heat sink defines at least a portion of a thermally conductive heat path from the heat source to the housing at least partially around the perimeter defined by the plurality of sides of the memory foam core.

[0102] In an exemplary embodiment, a thermal interface material comprises: an elastic core including a plurality of sides defining a perimeter; and graphite disposed at least partially around the perimeter defined by the plurality of sides of the elastic core. A portion of the elastic core is disposed between an upper portion and a lower portion of the graphite along a front edge of the thermal interface material. The portion of the elastic core prevents direct abutting contact between the upper portion and the lower portion of the graphite along the front edge of the thermal interface material.

[0103] In this exemplary embodiment, the thermal interface material piece may include: a first portion having a generally rectangular cross-section or profile; and an opposing second portion having a generally triangular cross-section or profile, the generally triangular cross-section or profile including a downwardly sloping top surface, the downwardly sloping top surface providing the thermal interface material piece with a tapered leading edge portion that decreases in height in a direction from the first portion to the leading edge. The resilient core may include a memory foam core. The graphite may include natural graphite and / or synthetic graphite. The memory foam core may be configured to be compressible into a compressed shape having a reduced thickness and thereafter maintain the compressed shape having the reduced thickness for a predetermined minimum amount of time.

[0104] The memory foam core can be compressible such that a portion of the graphite can be aligned with a corresponding portion of the heat removal / dissipation structure while the memory foam core remains compressed, thereby avoiding sliding contact between the graphite and the heat removal / dissipation structure. Expansion of the compressed memory foam core will force the aligned portion of the graphite into thermal contact with the corresponding portion of the heat removal / dissipation structure, whereupon the graphite will define at least a portion of a thermally conductive heat path that at least partially surrounds a perimeter defined by the plurality of sides of the memory foam core and leads to the heat removal / dissipation structure.

[0105] In an exemplary embodiment, an apparatus includes a heat source, a thermal interface material disposed along the heat source, and a housing. The heat source and the thermal interface material are slidably positionable within the housing while the elastic core is at least partially compressed to prevent sliding contact between the graphite and the housing. Within the housing, expansion of the elastic core forces the graphite into thermal contact with the housing, whereupon the graphite defines at least a portion of a thermally conductive heat path from the heat source to the housing, at least partially around the perimeter defined by the plurality of sides of the elastic core.

[0106] In an exemplary embodiment, a method for providing a thermal management solution between a heat source and a heat removal / dissipation structure includes: compressing a memory foam core of a thermal interface material piece disposed along the heat source, the thermal interface material piece further comprising a heat sink disposed at least partially around a perimeter defined by multiple sides of the memory foam core; aligning a portion of the heat sink to thermally contact a corresponding portion of the heat removal / dissipation structure while the memory foam core remains at least partially compressed, thereby avoiding sliding contact between the thermal interface material piece and the heat removal / dissipation structure; and allowing the memory foam core to expand, such that the expansion of the compressed memory foam core causes the aligned portion of the heat sink to thermally contact the corresponding portion of the heat removal / dissipation structure, whereby the heat sink defines at least a portion of a thermally conductive heat path, the thermally conductive heat path at least partially surrounding the perimeter defined by the multiple sides of the memory foam core and leading to the heat removal / dissipation structure.

[0107] In this exemplary method, the heat sink may include graphite. The memory foam core may be configured to maintain a compressed shape and reduced thickness for a predetermined minimum amount of time and / or have a rebound of less than twenty percent for at least two minutes. The memory foam core may include viscoelastic polyurethane foam, low-resilience polyurethane foam, or gel-infused memory foam. The heat source may include a component mounted on a printed circuit board. The heat removal / dissipation structure may include a housing. The step of aligning a portion of the heat sink for thermal contact with a corresponding portion of the heat removal / dissipation structure may include slidably positioning the component and the thermal interface material within the housing while the memory foam core remains at least partially compressed, thereby aligning a portion of the graphite with a corresponding portion of the housing while avoiding sliding contact between the graphite and the housing. The step of allowing the memory foam core to expand may include allowing the memory foam core to expand such that the expansion of the compressed memory foam core brings the aligned portion of the graphite into thermal contact with the corresponding portion of the housing, whereby the graphite defines at least a portion of a thermally conductive heat path that at least partially surrounds the perimeter defined by the plurality of sides of the memory foam core and leads to the housing. The method may further include adhesively attaching the piece of thermal interface material to the heat source.

[0108] In an exemplary embodiment, a method of manufacturing a thermal interface material includes wrapping a heat sink at least partially around a perimeter defined by a plurality of sides of a memory foam core. The heat sink may include graphite. The memory foam core may include viscoelastic polyurethane foam, low-resilience polyurethane foam, or gel-infused memory foam. The memory foam core may be configured to maintain a compressed shape and reduced thickness for a predetermined minimum amount of time and / or have a rebound of less than 20 percent for at least two minutes.

[0109] The exemplary embodiments are provided so that this disclosure will be exhaustive and will fully convey the scope to those skilled in the art. Many specific details, such as embodiments of specific components, devices, and methods, are listed to provide a thorough understanding of the embodiments of the present application. It should be understood by those skilled in the art that specific details need not be employed, that the exemplary embodiments may be embodied in many different forms, and that the exemplary embodiments should not be construed as limiting the scope of the present application. In several exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. In addition, advantages and improvements that may be achieved with the aid of one or more embodiments of the present application are provided for illustrative purposes only and do not limit the scope of the present application, as the exemplary embodiments disclosed herein may provide all or none of the advantages and improvements described above and still fall within the scope of the present application.

[0110] The specific dimensions and values, specific materials, and / or specific shapes disclosed herein are essentially embodiments and do not limit the scope of this application. The specific values and ranges of specific values disclosed herein for a given parameter do not exclude other values and ranges of values that may be useful in one or more embodiments disclosed herein. Moreover, it is contemplated that any two specific values for a specific parameter described herein may define the endpoints of a range of values suitable for the given parameter (e.g., the disclosure of a first value and a second value for a given parameter may be interpreted as meaning that any value between the first value and the second value may also be used for the given parameter). For example, if a parameter X is illustrated herein as having a value A and is also illustrated as having a value Z, it is contemplated that the parameter X may have a range of values from about A to about Z. Similarly, it is contemplated that the disclosure of two or more ranges of values for a parameter (regardless of whether these ranges are nested, overlapping, or different) includes all possible combinations of ranges, which may require that the combination of ranges use the endpoints of the disclosed ranges. For example, if parameter X is illustrated herein as having a value in the range of 1 to 10, or 2 to 9, or 3 to 8, it is also contemplated that parameter X may have other value ranges including 1 to 9, 1 to 8, 1 to 3, 1 to 2, 2 to 10, 2 to 8, 2 to 3, 3 to 10, and 3 to 9.

[0111] The terms used herein are only for describing detailed exemplary embodiments and are not intended to be limiting. As used herein, the singular forms "one" and "this / that" may also be intended to include plural forms, unless the context clearly indicates otherwise. The terms "comprise," "include," and "have" are inclusive and thus specify the presence of the features, wholes, steps, operations, elements, and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts, and / or combinations thereof. The steps, processes, and operations of the methods described herein are not intended to be constructed so as to require them to be performed in the detailed order described or shown, unless the detailed order is specifically determined as an execution order. It should also be understood that additional or alternative steps may be adopted.

[0112] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.) should be interpreted in the same manner. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0113] The term "approximately" when used with numerical values indicates that the calculated or measured results allow for some imprecision in the value (close to the exact value; approximately or reasonably close to the value; by a hair). If, for some reason, the imprecision otherwise provided by "approximately" is not understood in this customary sense in the art, then "approximately" as used herein indicates at least the variation that may result from customary methods of measuring or using such parameters. For example, the terms "substantially," "approximately," and "substantially" may be used herein to refer to within manufacturing tolerances.

[0114] Although the terms first, second, third, etc. may be used herein to describe a variety of elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer or part from other regions, layers or parts. When terms such as "first", "second" and many other terms are used herein, no order or sequence is implied unless the context clearly indicates otherwise. Therefore, the first element, component, region, layer or part discussed below may be referred to as the second element, component, region, layer arc portion without departing from the teachings of the exemplary embodiments.

[0115] Spatially relative terms such as "inside," "outside," "below," "beneath," "lower," "above," "upper," etc., may be used herein for ease of description to describe the relationship of one element or feature to another element or feature shown in the drawings. Spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is operated, then elements described as below or below other elements or features would then be oriented above the other elements or features. Thus, the embodiment term "below" may include both the orientations of "above" and "below." The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0116] The foregoing description of the embodiments is provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present application. Individual elements, intended or described uses, or features of a specific embodiment are generally not limited to that specific embodiment, but are interchangeable and can be used in selected embodiments where appropriate, even if not explicitly shown or described. The same embodiment can also be modified in many ways. Such modifications are not to be considered as departing from the present application, and all such variations are intended to be included within the scope of this application.

Claims

1. A method of providing a thermal management solution between a heat source and a heat removal / dissipation structure, the method comprising: compressing a memory foam core of a piece of thermal interface material disposed along the heat source, the piece of thermal interface material further comprising: a conductive layer disposed at least partially around a perimeter defined by a plurality of sides of the memory foam core; and a heat sink disposed at least partially around a perimeter defined by a plurality of sides of the memory foam core, wherein the heat sink covers at least a portion of the conductive layer and defines an exposed region of the conductive layer in which the heat sink is absent; aligning a portion of the heat dissipation member into thermal contact with a corresponding portion of the heat removal / dissipation structure while the memory foam core remains at least partially compressed into a compressed shape having a reduced thickness and thereafter maintains the compressed shape having the reduced thickness for a predetermined minimum amount of time, thereby avoiding sliding contact between the thermal interface material and the heat removal / dissipation structure; and The memory foam core is permitted to expand such that the expansion of the compressed memory foam core brings the aligned portions of the heat sink into thermal contact with the corresponding portions of the heat removal / dissipation structure, whereby the heat sink defines at least a portion of a thermally conductive heat path at least partially surrounding the perimeter defined by the multiple sides of the memory foam core and leading to the heat removal / dissipation structure.

2. The method according to claim 1, wherein The heat sink comprises graphite; The heat source includes a component mounted on a printed circuit board; The heat removal / dissipation structure includes a housing; aligning the portion of the heat sink into thermal contact with the corresponding portion of the heat removal / dissipation structure includes slidably positioning the component and the piece of thermal interface material within the housing while the memory foam core remains at least partially compressed to thereby align a portion of the graphite with the corresponding portion of the housing while avoiding sliding contact of the graphite with the housing; as well as Allowing the memory foam core to expand includes allowing the memory foam core to expand such that the expansion of the compressed memory foam core brings the aligned portions of the graphite into thermal contact with the corresponding portions of the outer shell, whereby the graphite defines at least a portion of a thermally conductive heat path at least partially surrounding the perimeter defined by the plurality of sides of the memory foam core and leading to the outer shell.

3. The method according to claim 1 or 2, wherein: The method further includes adhesively attaching the piece of thermal interface material to the heat source; and / or The memory foam core is configured to maintain a compressed shape and reduced thickness for a predetermined minimum amount of time and / or have a rebound of less than twenty percent for at least two minutes; and / or The heat sink comprises graphite; and / or The memory foam core includes viscoelastic polyurethane foam, low resilience polyurethane foam, and gel infusion memory foam.

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