Chip burning method, system and electronic equipment

Abstract

The embodiments of the present invention disclose a chip burning method, system and electronic device, which relate to the field of chip manufacturing technology and solve the problem that the current burning method cannot realize dynamic value burning and multi-station information superposition. The chip burning method is used for a chip burning terminal connected to a server database server through a C-S architecture, including: reading the identification information of the current chip to be burned; sending a request to obtain chip burning parameters to the server database server; and burning the current chip to be burned according to the chip burning parameters returned by the server database server. The present invention adopts the Internet technology CS architecture to realize the transmission of burning information between different stations.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a chip burning method, system and electronic equipment. Background Art

[0002] With the development of design and manufacturing technology, integrated circuit design has evolved from transistor integration to logic gate integration, and now to IP integration, namely SoC (System-on-a-Chip) design technology. SoC can effectively reduce the development cost of electronic / information system products, shorten the development cycle, and improve the competitiveness of products. It is the main product development method that the industry will adopt in the future.

[0003] SOC chips require programs to work, and the process of storing programs (including key chip information) in the chip is chip burning. Currently, information burning of large SOC chips has the characteristics of complex and changeable parameters and rapid information iteration. Most existing solutions on the market use local static data to burn the chip, making large SOC chip burning a difficult problem in the engineering field. Summary of the invention

[0004] In view of this, the embodiments of the present invention provide a chip burning method, system and electronic device, which adopt the Internet technology CS architecture to realize the transmission of burning information between different stations, solving the problem that the current burning method cannot realize dynamic value burning and multi-station information superposition.

[0005] In a first aspect, an embodiment of the present invention provides a chip programming method for a chip programming terminal connected to a server database server via a CS architecture, comprising:

[0006] Read the identification information of the chip to be burned;

[0007] Sending a request to obtain chip programming parameters to a server-side database server; wherein the server-side database server pre-stores chip identifiers and their corresponding chip programming parameters, and the request to obtain chip programming parameters includes the identifier of the chip to be programmed;

[0008] The chip to be programmed is programmed according to the chip programming parameters returned by the server-side database server.

[0009] In combination with the first aspect, in a first possible implementation manner of the first aspect, the chip burning parameters at least include: chip wafer test WS data and final test FT results.

[0010] In combination with the first aspect, in a second possible implementation manner of the first aspect, the server-side database server and the chip burning terminal transmit data via a socket.

[0011] In a second aspect, an embodiment of the present invention provides a chip burning method, which is used for a server-side database server connected to a chip burning terminal through a CS architecture, comprising:

[0012] Receiving a request for obtaining chip programming parameters from a chip programming terminal; the request for obtaining chip programming parameters includes an identifier of a chip to be programmed;

[0013] Obtaining chip burning parameters corresponding to the chip identifier in the request for obtaining chip burning parameters from the local storage space;

[0014] The obtained chip burning parameters are sent to a chip burning terminal, so that the chip burning terminal burns the current chip to be burned.

[0015] In combination with the second aspect, in a first possible implementation manner of the second aspect, the chip programming method further includes:

[0016] The log file uploaded by the chip testing terminal is received and stored; the log file includes the key test parameters of the local chip burning terminal.

[0017] In combination with the second aspect, in a second possible implementation manner of the second aspect, the server-side database server and the chip burning terminal transmit data via a socket.

[0018] In combination with the first possible implementation of the second aspect, in a third possible implementation of the second aspect, the server-side database server and the chip test terminal transmit data via a socket.

[0019] In a third aspect, an embodiment of the present invention provides a chip burning system, which is used for a chip burning terminal connected to a server database server through a CS architecture, comprising:

[0020] An identification information acquisition module is used to read the identification information of the chip to be burned;

[0021] A parameter request sending module is used to send a request to obtain chip burning parameters to a server-side database server; wherein the server-side database server pre-stores chip identifiers and their corresponding chip burning parameters, and the request to obtain chip burning parameters includes the current chip identifier to be burned;

[0022] The burning module is used to burn the chip to be burned according to the chip burning parameters returned by the server-side database server.

[0023] In combination with the third aspect, in a first possible implementation mode of the third aspect, the chip burning parameters at least include: chip wafer test WS data and final test FT results.

[0024] In combination with the third aspect, in a second possible implementation manner of the third aspect, the server-side database server and the chip burning terminal transmit data via a socket.

[0025] In a fourth aspect, an embodiment of the present invention provides a chip burning system, which is used for a server-side database server connected to a chip burning terminal through a CS architecture, comprising:

[0026] A parameter request receiving module, used for receiving a request for obtaining chip burning parameters from a chip burning terminal; the request for obtaining chip burning parameters includes an identifier of a chip to be burned currently;

[0027] A parameter retrieval module, used for obtaining the chip burning parameters corresponding to the chip identifier in the request for obtaining chip burning parameters from the local storage space;

[0028] The parameter sending module is used to send the acquired chip burning parameters to the chip burning terminal, so that the chip burning terminal burns the chip to be burned currently.

[0029] In combination with the fourth aspect, in a first possible implementation of the fourth aspect, the chip burning system further includes:

[0030] The test parameter storage module is used to receive and store the log file uploaded by the chip test terminal; the log file includes the key test parameters of the local chip burning terminal.

[0031] In combination with the fourth aspect, in a second possible implementation manner of the fourth aspect, the server-side database server and the chip burning terminal transmit data via a socket.

[0032] In combination with the first possible implementation of the fourth aspect, in a third possible implementation of the fourth aspect, the server-side database server and the chip test terminal transmit data via a socket.

[0033] In a fifth aspect, an embodiment of the present invention provides an electronic device, comprising: a shell, a processor, a memory, a circuit board and a power supply circuit, wherein the circuit board is placed inside the space enclosed by the shell, and the processor and the memory are arranged on the circuit board; the power supply circuit is used to supply power to various circuits or devices of the above-mentioned electronic device; the memory is used to store executable program code; the processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, so as to execute the chip burning method described in any of the aforementioned embodiments.

[0034] The chip burning method, system and electronic device provided in the embodiment of the present invention use the CS software architecture. The test data stores dynamic parameters such as key parameters into the database through the test software. Then, when burning the chip, the chip burning terminal obtains the chip burning parameters from the database to burn the chip to be burned, thereby realizing the transmission of burning information between different stations, achieving dynamic value burning and multi-station information superposition, and solving the problem that the current chip burning method cannot achieve dynamic value burning and multi-station information superposition. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 This is a schematic diagram of the process of the first embodiment of the chip programming method of the present invention;

[0037] Figure 2 This is a flow chart of a second embodiment of a chip programming method of the present invention;

[0038] Figure 3 This is a schematic diagram of the process of the third embodiment of the chip programming method of the present invention;

[0039] Figure 4 This is a schematic diagram of the structure of a chip programming system according to a first embodiment of the present invention;

[0040] Figure 5 This is a schematic diagram of the structure of the second embodiment of the chip burning system of the present invention;

[0041] Figure 6 This is a schematic diagram of the structure of the third embodiment of the chip programming system of the present invention;

[0042] Figure 7 The figure is a schematic structural diagram of an embodiment of an electronic device of the present invention. DETAILED DESCRIPTION

[0043] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0044] It should be clear that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Figure 1 This is a schematic diagram of the process of the first embodiment of the chip programming method of the present invention. Figure 1 The chip burning method of the present invention is used for a chip burning terminal connected to a server database server through a CS architecture, comprising:

[0046] S101, reading the identification information of the chip to be programmed;

[0047] In this embodiment, as a chip burning terminal of the client of the CS architecture, when there is a chip to be burned, it is necessary to identify the chip and obtain its identification information, so as to obtain the corresponding burning parameters through the identification information later.

[0048] S102, sending a request for obtaining chip burning parameters to a server-side database server; wherein the server-side database server pre-stores chip identifiers and their corresponding chip burning parameters, and the request for obtaining chip burning parameters includes the identifier of the chip to be burned;

[0049] In this embodiment, the chip burning parameters at least include: chip wafer sorting test WS (Wafer Sorting) data and final test FT (Final Test) results. Among them, WS refers to the chip in the wafer stage, which tests the basic device parameters of the chip by piercing the chip pins with probes, such as Vt (threshold voltage), Rdson (on-resistance), BVdss (source-drain breakdown voltage), Igss (gate-source leakage current), Idss (drain-source leakage current), etc. The bad chips are picked out and marked with ink dots (Ink), which can reduce the cost of packaging and testing. Only chips that pass the test will be packaged. WS is a reflection of chip quality. FT testing is mainly to test the application of chips.

[0050] S103, programming the chip to be programmed according to the chip programming parameters returned by the server-side database server.

[0051] In this embodiment, the server-side database server and the chip burning terminal transmit data through a socket, where Socket is an intermediate software abstraction layer for communication between the application layer and the TCP / IP protocol family, and it is a set of interfaces. In the design mode, Socket is actually a facade mode, which hides the complex TCP / IP protocol family behind the Socket interface. For users, a set of simple interfaces is all, allowing Socket to organize data to comply with the specified protocol, which is easy to implement for users.

[0052] A chip burning method provided in this embodiment uses the CS software architecture. When burning the chip, the chip burning terminal obtains the chip burning parameters from the database server to burn the chip to be burned. Since the database server pre-stores the chip burning parameters, such as WS and FT test data, the burning information is transmitted between different stations, achieving dynamic value burning and multi-station information superposition, which solves the problem that the current chip burning method cannot achieve dynamic value burning and multi-station information superposition.

[0053] Figure 2 This is a flow chart of the second embodiment of the chip programming method of the present invention. Figure 2 The chip burning method of the present invention is used for a server-side database server connected to a chip burning terminal through a CS architecture, comprising:

[0054] S201, receiving a request for obtaining chip programming parameters from a chip programming terminal; the request for obtaining chip programming parameters includes an identifier of a chip to be programmed;

[0055] In this embodiment, the server-side database server and the chip burning terminal transmit data via a socket, and the communication implementation method is simple.

[0056] S202, obtaining chip burning parameters corresponding to the chip identifier in the request for obtaining chip burning parameters from the local storage space;

[0057] In this embodiment, as an optional implementation, before step S202, the following steps are further included:

[0058] The log file uploaded by the chip testing terminal is received and stored; the log file includes the key test parameters of the local chip burning terminal.

[0059] In this step, the server-side database server and the chip test terminal transmit data via a socket. Since the socket method is used to transmit data, the implementation method is simple and convenient. The key test parameters and other dynamic parameters of the station (current test terminal) will be stored in the log file and finally uploaded to the database server for storage, wherein the test data stores the key parameters and other dynamic parameters in the database through the test software of the test terminal, which is finally convenient for burning and inspection.

[0060] S203: Send the acquired chip programming parameters to a chip programming terminal, so that the chip programming terminal programs the chip to be programmed.

[0061] In this embodiment, the database server sends the chip burning parameters to the chip burning terminal through local retrieval. After the burning program in the chip burning terminal obtains the chip burning parameters, it burns the chip.

[0062] A chip burning method provided in this embodiment uses the CS software architecture. First, each test site encapsulates the test results (i.e., dynamic parameters such as key parameters) into a log file and sends it to the database server for storage. Subsequently, when burning the chip, the chip burning terminal obtains the chip burning parameters from the database and burns the chip to be burned, thereby realizing the transmission of burning information between different sites, achieving dynamic value burning and multi-site information superposition, and solving the problem that the current chip burning method cannot achieve dynamic value burning and multi-site information superposition.

[0063] Figure 3 This is a flow chart of the third embodiment of the chip programming method of the present invention. Figure 3 The chip burning method of the present invention is used for a server database server and a chip burning terminal of a CS architecture, comprising:

[0064] S301, the chip burning terminal reads the identification information of the chip to be burned;

[0065] In this embodiment, this step is similar to step S101 in the above method embodiment and will not be described again here.

[0066] S302, the chip burning terminal sends a request to the server database server to obtain chip burning parameters; wherein the server database server pre-stores chip identifiers and their corresponding chip burning parameters, and the request to obtain chip burning parameters includes the current chip identifier to be burned;

[0067] In this embodiment, this step is similar to step S102 in the above method embodiment and will not be described again here.

[0068] S303, the server-side database server receives a request for obtaining chip programming parameters from the chip programming terminal; the request for obtaining chip programming parameters includes an identifier of the current chip to be programmed;

[0069] In this embodiment, this step is similar to step S201 in the above method embodiment and will not be described again here.

[0070] S304, the server-side database server obtains the chip burning parameters corresponding to the chip identifier in the request for obtaining chip burning parameters from the local storage space;

[0071] In this embodiment, this step is similar to step S202 in the above method embodiment and will not be described again here.

[0072] S305, the server-side database server sends the acquired chip burning parameters to the chip burning terminal;

[0073] In this embodiment, this step is similar to step S203 in the above method embodiment and will not be described again here.

[0074] S306, the chip burning terminal burns the current chip to be burned according to the chip burning parameters returned by the server-side database server.

[0075] In this embodiment, this step is similar to step S103 in the above method embodiment and will not be described again here.

[0076] A chip burning method provided in this embodiment uses the CS software architecture. The test data stores dynamic parameters such as key parameters into a database through the test software. Then, when burning the chip, the chip burning terminal obtains the chip burning parameters from the database to burn the chip to be burned, thereby realizing the transmission of burning information between different stations, achieving dynamic value burning and multi-station information superposition, and solving the problem that the current chip burning method cannot achieve dynamic value burning and multi-station information superposition.

[0077] Figure 4 This is a schematic diagram of the structure of the chip burning system embodiment 1 of the present invention. Figure 4 The chip burning system of the present invention is used for a chip burning terminal 1 connected to a server database server through a CS architecture, comprising:

[0078] The identification information acquisition module 11 is used to read the identification information of the chip to be burned;

[0079] The parameter request sending module 12 is used to send a request for obtaining chip burning parameters to the service-side database server 2; wherein the service-side database server 2 pre-stores chip identifiers and their corresponding chip burning parameters, and the request for obtaining chip burning parameters includes the current chip identifier to be burned;

[0080] The chip burning parameters include at least: chip wafer test WS data and final test FT results.

[0081] The burning module 13 is used to burn the chip to be burned according to the chip burning parameters returned by the service-side database server 2.

[0082] The server database server 2 and the chip burning terminal 1 transmit data via a socket.

[0083] Figure 5 This is a schematic diagram of the structure of the second embodiment of the chip burning system of the present invention. Figure 5 The chip burning system of the present invention is used for a server-side database server connected to a chip burning terminal through a CS architecture, comprising:

[0084] The parameter request receiving module 21 is used to receive a request for obtaining chip programming parameters from the chip programming terminal 1; the request for obtaining chip programming parameters includes an identifier of the chip to be programmed.

[0085] The parameter retrieval module 22 is used to obtain the chip burning parameters corresponding to the chip identifier in the chip burning parameter acquisition request from the local storage space;

[0086] The parameter sending module 23 is used to send the acquired chip burning parameters to the chip burning terminal 1, so that the chip burning terminal burns the chip to be burned.

[0087] Figure 6 This is a schematic diagram of the structure of the third embodiment of the chip burning system of the present invention. Figure 6 This embodiment is based on the structure of the second embodiment of the device for screening chips by grade in the aforementioned invention, and the chip burning system further includes:

[0088] The test parameter storage module 24 is used to receive and store the log file uploaded by the chip test terminal; the log file includes the key test parameters of the local chip burning terminal.

[0089] An embodiment of the present invention further provides an electronic device. Figure 7 This is a schematic diagram of the structure of an embodiment of the electronic device of the present invention, which can implement the present invention Figure 1 , 2 and the process of the embodiment shown in 3, as Figure 7 As shown, the above-mentioned electronic device may include: a shell 41, a processor 42, a memory 43, a circuit board 44 and a power supply circuit 45, wherein the circuit board 44 is arranged inside the space enclosed by the shell 41, and the processor 42 and the memory 43 are arranged on the circuit board 44; the power supply circuit 45 is used to supply power to various circuits or devices of the above-mentioned electronic device; the memory 43 is used to store executable program codes; the processor 42 runs the program corresponding to the executable program code by reading the executable program code stored in the memory 43, so as to execute the chip burning method described in any of the above-mentioned embodiments.

[0090] This electronic device exists in many forms, including but not limited to:

[0091] (1) Mobile communication devices: These devices are characterized by their mobile communication functions and their main purpose is to provide voice and data communications. These terminals include: smart phones (such as iPhone), multimedia phones, functional phones, and low-end phones.

[0092] (2) Ultra-mobile personal computer devices: These devices fall into the category of personal computers, have computing and processing capabilities, and generally also have mobile Internet access features. These terminals include: PDA, MID and UMPC devices, such as iPad.

[0093] (3) Portable entertainment devices: These devices can display and play multimedia content. They include audio and video playback modules (such as iPods), handheld game consoles, e-books, smart toys, and portable car navigation devices.

[0094] (4) Server: A device that provides computing services. The server consists of a processor, hard disk, memory, system bus, etc. The server is similar to a general computer architecture, but because it needs to provide highly reliable services, it has higher requirements in terms of processing power, stability, reliability, security, scalability, and manageability.

[0095] (5) Other electronic devices with data interaction functions.

[0096] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0097] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0098] For the convenience of description, the above device is described by dividing the functions into various units / modules. Of course, when implementing the present invention, the functions of each unit / module can be implemented in the same or multiple software and / or hardware.

[0099] A person skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the embodiments of the above-mentioned methods. The storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc.

[0100] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A chip burning method, used for a chip burning terminal connected to a server database server through a CS architecture, characterized in that: include: Read the identification information of the chip to be burned; Sending a request to obtain chip programming parameters to a server-side database server; wherein the server-side database server pre-stores chip identifiers and their corresponding chip programming parameters, and the request to obtain chip programming parameters includes the identifier of the chip to be programmed; Programming the chip to be programmed according to the chip programming parameters returned by the server-side database server; The chip burning method is also used for a server-side database server connected to a chip burning terminal through a CS architecture, comprising: receiving a request for obtaining chip burning parameters from a chip burning terminal; the request for obtaining chip burning parameters includes an identifier of a chip to be burned currently; obtaining chip burning parameters corresponding to the chip identifier in the request for obtaining chip burning parameters from a local storage space; sending the obtained chip burning parameters to the chip burning terminal, so that the chip burning terminal burns the chip to be burned currently; Before obtaining the chip burning parameters corresponding to the chip identifier in the chip burning parameter obtaining request from the local storage space, the method further includes: receiving and storing a log file uploaded by a chip testing terminal; the log file includes the key test parameters of the local chip testing terminal; The chip burning parameters at least include: chip wafer test WS data and final test FT results; the WS data includes threshold voltage, on-resistance, source-drain breakdown voltage, gate-source leakage current, and drain-source leakage current, so as to pick out bad chips, mark them with ink dots, and only package the chips that pass the test.

2. The chip programming method according to claim 1, characterized in that: The server-side database server and the chip burning terminal transmit data via a socket.

3. The chip programming method according to claim 1, characterized in that: The server-side database server and the chip test terminal transmit data via a socket.

4. A chip burning system, used for a chip burning terminal connected to a server database server via a CS architecture, characterized in that: include: An identification information acquisition module is used to read the identification information of the chip to be burned; A parameter request sending module is used to send a request to obtain chip burning parameters to a server-side database server; wherein the server-side database server pre-stores chip identifiers and their corresponding chip burning parameters, and the request to obtain chip burning parameters includes the current chip identifier to be burned; A burning module, used for burning the chip to be burned according to the chip burning parameters returned by the server-side database server; The chip burning system is also used for a server-side database server connected to a chip burning terminal through a CS architecture, including: a parameter request receiving module, used for receiving a request for obtaining chip burning parameters from a chip burning terminal; the request for obtaining chip burning parameters includes a current chip identification to be burned; a parameter retrieval module, used for obtaining chip burning parameters corresponding to the chip identification in the request for obtaining chip burning parameters from a local storage space; a parameter sending module, used for sending the obtained chip burning parameters to a chip burning terminal, so that the chip burning terminal burns the current chip to be burned; a test parameter storage module, used for receiving and storing a log file uploaded by a chip test terminal; the log file includes the local key test parameters of the chip test terminal; The chip burning parameters at least include: chip wafer test WS data and final test FT results; the WS data includes threshold voltage, on-resistance, source-drain breakdown voltage, gate-source leakage current, and drain-source leakage current, so as to pick out bad chips, mark them with ink dots, and only package the chips that pass the test.

5. The chip burning system according to claim 4, characterized in that: The server-side database server and the chip burning terminal transmit data via a socket.

6. The chip burning system according to claim 4, characterized in that: The server-side database server and the chip test terminal transmit data via a socket.

7. An electronic device, characterized in that: The electronic device comprises: a housing, a processor, a memory, a circuit board and a power supply circuit, wherein the circuit board is placed inside the space enclosed by the housing, and the processor and the memory are arranged on the circuit board; the power supply circuit is used to supply power to various circuits or devices of the above-mentioned electronic device; the memory is used to store executable program codes; the processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, so as to execute the chip burning method described in any one of the preceding claims 1-3.

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